TWI821055B - Integrated liquid cooling heat dissipation system - Google Patents

Abstract

An integrated liquid cooling heat dissipation system is used to solve the problem of poor heat dissipation efficiency of a conventional heat dissipation device. The integrated liquid cooling heat dissipation system includes a liquid cooling radiator for thermally connecting an electronic component, a liquid driving component connected to the liquid cooling radiator, a cooling module located on one side of the liquid driving component, and a fan component located on one side of the liquid driving component. The liquid cooling radiator has a working liquid in it, and the working liquid circulates along the liquid cooling radiator, the liquid driving component and the cooling module. The fan component directs airflow to carry away thermal energy transferred from the liquid cooling radiator to the cooling module. The liquid cooling radiator, the liquid driving component, the cooling module and the fan component are combined to have a total width and a total length. The total width is less than or equal to an electronic component width of the electronic component, and the total length is less than or equal to an electronic component length of the electronic component.

Description

Integrated liquid cooling system

The present invention relates to a heat dissipation system, in particular to an integrated liquid cooling heat dissipation system for electronic components.

With the advancement of technology, computer hardware is increasingly developing towards high speed and high frequency to improve execution efficiency. Compared with the past, the heat energy generated by the electronic components in today's computer hardware is more considerable; for example, solid-state hard drives (Solid State Drive) As an access device in a computer host, in addition to its miniaturized design, its operating speed has also been greatly increased. The heat generated during its operation is also considerable. Therefore, a heat dissipation device is needed to reduce the operating temperature. . However, due to the rapid development of solid-state drives in recent years, they have satisfied the access speed that e-sports consumers care about. As solid-state drives develop towards high speed and high frequency, at the same time, the heat energy generated by the operation of solid-state drives also increases rapidly. , the continuously rising operating temperature will inevitably affect the operating performance of the solid-state drive, making it difficult for conventional heat dissipation devices to dissipate heat generated by the solid-state drive with poor heat dissipation efficiency.

In view of this, there is still a need to improve the conventional heat dissipation device.

In order to solve the above problems, the purpose of the present invention is to provide an integrated liquid cooling system that can provide good heat dissipation performance.

A secondary object of the present invention is to provide an integrated liquid cooling system that can The integrated liquid cooling system can be easily configured in the appropriate location during installation.

Another object of the present invention is to provide an integrated liquid cooling system that can make the working fluid flow smoothly.

Another object of the present invention is to provide an integrated liquid cooling system that is convenient for the assembler.

Directionality or similar terms are used throughout the present invention, such as "front", "back", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer" , "side", etc. mainly refer to the directions of the attached drawings. Each directionality or its approximate terms are only used to assist in explaining and understanding the various embodiments of the present invention, and are not intended to limit the present invention.

The use of the quantifier "a" or "an" in the elements and components described throughout the present invention is only for convenience of use and to provide a common sense of the scope of the present invention; in the present invention, it should be interpreted as including one or at least one, and single The concept of also includes the plural unless it is obvious that something else is meant.

Approximate terms such as "combination", "combination" or "assembly" used throughout the present invention mainly include forms that can be separated without damaging the components after being connected, or components that are inseparable after being connected, and are based on common knowledge in this field. You can choose according to the material of the components to be connected or the assembly requirements.

The integrated liquid-cooling heat dissipation system of the present invention includes: a liquid-cooling radiator for thermally connecting an electronic component. The liquid-cooling radiator has a working liquid; a liquid driving component is connected to the liquid-cooling radiator; A cooling module is located on one side of the liquid driving assembly, and the working fluid circulates along the liquid cooling radiator, the liquid driving assembly and the cooling module; and a fan assembly is located on one side of the liquid driving assembly, the The fan assembly directs airflow to remove heat energy transferred from the liquid cooling radiator to the cooling module, and the liquid cooling radiator, the liquid drive assembly, the cooling module and the fan assembly have an overall width and An overall length that is less than or equal to the overall width of the electronic component an electronic component width, the total length is less than or equal to an electronic component length of the electronic component, and an axis of the fan component is parallel to an axis of the liquid driving component.

Accordingly, in the integrated liquid cooling system of the present invention, the working liquid in the liquid cooling radiator can absorb the thermal energy of at least one heat source of the electronic component, forming a higher temperature working liquid that can flow to the cooling module, and The fan assembly blows or sucks the hot air in the cooling module, so that the hot air can be discharged outside the cooling module, thereby lowering the temperature of the working fluid in the cooling module, and the cooled working fluid can By flowing back to the liquid cooling radiator, the heat source can be effectively cooled, which can provide good heat dissipation performance. In addition, the overall volume of the combination can be reduced, which has the effect of reducing the occupied space.

The integrated liquid-cooling heat dissipation system of the present invention includes: a liquid-cooling radiator for thermally connecting an electronic component. The liquid-cooling radiator has a working liquid; a liquid driving component is connected to the liquid-cooling radiator; A cooling module is located on one side of the liquid driving assembly, and the working fluid circulates along the liquid cooling radiator, the liquid driving assembly and the cooling module; a fan assembly is located on one side of the liquid driving assembly, and the fan The assembly directs airflow to remove heat energy transferred from the liquid cooling radiator to the cooling module, and the liquid cooling radiator, the liquid drive assembly, the cooling module and the fan assembly have an overall width and an a total length, the total width is less than or equal to an electronic component width of the electronic component, the total length is less than or equal to an electronic component length of the electronic component; and a clip fastener, the clip fastener clamps the electronic component and the electronic component Liquid cooling radiator.

Accordingly, in the integrated liquid cooling system of the present invention, the working liquid in the liquid cooling radiator can absorb the thermal energy of at least one heat source of the electronic component, forming a higher temperature working liquid that can flow to the cooling module, and The fan assembly blows or sucks the hot air in the cooling module, so that the hot air can be discharged outside the cooling module, thereby lowering the temperature of the working fluid in the cooling module, and the cooled working fluid can By flowing back to the liquid cooling radiator, the heat source can be effectively cooled, which can provide good heat dissipation performance. In addition, the electronic components and the liquid cooling radiator can be Being positioned on the clip fastener has the effect of preventing the liquid cooling radiator from being separated from the electronic component.

Furthermore, since the combined total width of the liquid cooling radiator, the liquid driving assembly, the cooling module and the fan assembly is less than or equal to the width of the electronic assembly, and the liquid cooling radiator, the liquid driving assembly , the combined total length of the cooling module and the fan assembly is less than or equal to the electronic component length of the electronic component, so as to integrate the liquid cooling radiator, the liquid drive component, the cooling module and the fan component into one module The combination allows the overall volume of the integrated liquid cooling system of the present invention to be smaller, so that the integrated liquid cooling system can be easily configured in an appropriate position during installation, and has the effect of being able to meet the configuration requirements of various installation spaces.

The liquid cooling radiator may have a base and a cover. The cover is combined with the base and jointly forms a working chamber, and the working liquid may be filled in the working chamber. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing costs.

Wherein, the liquid driving assembly may have a housing base and a pump, the housing base is connected to the liquid cooling radiator, and the pump is located in the housing base. In this way, the system has a simple structure and is easy to assemble.

Wherein, the shell base and a cover of the liquid cooling radiator may be integrally connected. In this way, the system has the effect of increasing structural strength, reducing the joint height, and eliminating the need for connecting pipe fittings, thereby achieving cost savings.

The pump may have a body and an impeller, the impeller may be connected to the body, and the working fluid may be driven by the impeller to circulate between the liquid cooling radiator, the liquid driving component and the cooling module. In this way, the pump can increase the circulation speed of the working liquid, and also relatively increase the speed of taking away heat energy, which has a better heat dissipation effect.

Wherein, the shell base may have an inflow part and an outflow part, the inflow part may be connected to the cooling module, and the outflow part may be connected to the liquid cooling radiator. In this way, the pump can draw the working fluid from the inflow part and pump the working fluid out from the outflow part, and has the function of making the working fluid Smooth body flow.

Wherein, the liquid cooling radiator may have a heat dissipation fin group, and the heat dissipation fin group may contact the working liquid. In this way, the heat energy transferred to the liquid cooling radiator can have a larger contact area with the working liquid, which has a better heat dissipation effect.

Wherein, the cooling module may have a heat dissipation pipe body, and the heat dissipation pipe body may have a first port and a second port opposite each other. The first port may be connected to a liquid outlet hole of the liquid cooling radiator, and the heat dissipation pipe body may have a first port and a second port. The second port may be connected to an inflow portion of the liquid driving assembly. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing costs.

Wherein, the cooling module may have a fin unit, and the heat dissipation pipe body may be combined with the fin unit. In this way, the fin unit can take away the heat energy transferred from the working fluid to the heat dissipation pipe body, which has the effect that the temperature of the working fluid can be lowered.

Wherein, the cooling module may have a fin unit, the fin unit may have a ventilation part, a first ventilation side of the ventilation part is in communication with an air outlet of the fan assembly, and the fan assembly may face the cooling Airflow is blown into the module. In this way, the airflow can flow into the cooling module through the air outlet and the first ventilation side of the ventilation part in sequence, so that the hot air in the cooling module can be discharged from the second ventilation side of the ventilation part, so that the airflow can be discharged from the cooling module. The heat energy transferred from the liquid cooling radiator to the cooling module is taken away.

Wherein, the cooling module may have a fin unit, the fin unit may have a ventilation part, a second ventilation side of the ventilation part is in communication with an air inlet of the fan assembly, and the fan assembly may suck the Cool the hot air in the module. In this way, the hot air can sequentially flow into the fan frame through the second ventilation side of the ventilation part and the air inlet, and flow to the outside through the air outlet, which has the effect of lowering the temperature of the working liquid in the heat dissipation tube. .

Wherein, the liquid cooling radiator may have a base and a cover. The base may have a first surface and a second surface opposite to each other. The first surface may face the cover, and the liquid drive The moving component, the cooling module and the fan component can be disposed on the cover, and the liquid cooling radiator can be thermally connected to at least one heat source of the electronic component through the second surface. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing costs.

Wherein, the cooling module may have a fin unit, and the fin unit may not contact the cover. In this way, the heat energy transferred to the cooling module can be prevented from being transferred back to the liquid cooling radiator, which has a better heat dissipation effect.

The liquid cooling radiator, the liquid driving component, the cooling module and the fan component may all be located directly above the same side of the heat source of the electronic component. In this way, the overall volume of the integrated liquid cooling system of the present invention can be smaller, and the heat energy of the heat source can be easily dissipated by the integrated liquid cooling system of the present invention, which has a better heat dissipation effect.

Wherein, the vertical projection of the liquid cooling radiator, the liquid driving component, the cooling module and the fan component on the electronic component may not exceed the area range of the electronic component. In this way, it is ensured that the overall volume of the liquid cooling radiator, the liquid driving component, the cooling module and the fan component can be smaller, and the system is easy to install and configure.

[Invention]

1: Liquid cooling radiator

11: Base

11a: First surface

11b: Second surface

12: Cover

121: Liquid inlet hole

122: Liquid outlet

13: Cooling fin set

2: Liquid driven components

21: Shell base

211:Inflow department

212:Outflow department

22:Pump

221:Body

222: Impeller

3: Cooling module

31: Fin unit

31a:Ventilation department

31b: closed part

32:Heat dissipation pipe body

32a: first port

32b: Second port

4:Fan assembly

41: fan frame

41a:Air inlet

41b:Air outlet

42:Fan wheel

5: clip fastener

F1: First ventilation side

F2: Second ventilation side

H: Heat source

K1:Total width

K2:Total length

L: Working liquid

M: Electronic components

M1: Electronic component width

M2: Electronic component length

Q: Clamping space

S: working chamber

X1: Axis of liquid drive assembly

X2: Axis of fan assembly

[Figure 1] An exploded perspective view of the first embodiment of the present invention.

[Figure 2] A perspective view of the combination of a liquid cooling radiator, a liquid drive assembly, a cooling module, a fan assembly and an electronic assembly according to the first embodiment of the present invention.

[Figure 3] An assembled front view of the first embodiment of the present invention.

[Figure 4] Cross-sectional view along line A-A in Figure 3.

[Figure 5] Cross-sectional view along line B-B in Figure 3.

[Figure 6] An exploded perspective view of the second embodiment of the present invention.

[Figure 7] A combined side view of the second embodiment of the present invention.

[Figure 8] Cross-sectional view along line C-C in Figure 7.

[Figure 9] Cross-sectional view along line D-D in Figure 8.

In order to make the above and other objects, features and advantages of the present invention more obvious and understandable, preferred embodiments of the present invention are illustrated below and described in detail with reference to the accompanying drawings; in addition, the same symbols are used in different drawings. are considered to be the same and their description will be omitted.

Please refer to Figures 1 and 4, which is a preferred embodiment of the integrated liquid cooling system of the present invention, which includes a liquid cooling radiator 1, a liquid driving component 2, a cooling module 3 and a fan Assembly 4, the liquid cooling radiator 1 has a working liquid L, the liquid driving assembly 2 is connected to the liquid cooling radiator 1, the cooling module 3 is located on one side of the liquid driving assembly 2, and the fan assembly 4 is located on the liquid On the side of the driving assembly 2 , the working liquid L circulates along the liquid cooling radiator 1 , the liquid driving assembly 2 and the cooling module 3 .

Please refer to Figure 1. The liquid cooling radiator 1 is used to thermally connect an electronic component M. The electronic component M can be a component installed in an electronic device. For example, the electronic component M can be installed on a motherboard (not shown in the figure). (shown in the figure), the motherboard may be a server or a personal computer module, and the electronic component M may be, for example, a hard drive, a central processing unit, a memory, a graphics card, etc. In this embodiment, the electronic component M The explanation is based on taking Solid State Drive (SSD) as an example.

Please refer to Figures 1 and 4. The liquid cooling radiator 1 can have a base 11. The form of the base 11 is not limited by the present invention. For example, the base 11 can be generally in the shape of a sheet. The base 11 can be For example, it is made of a metal material with high thermal conductivity such as copper or aluminum. The base 11 can be stamped, which simplifies the manufacturing process. The base 11 may have an opposite first surface 11a and a second surface 11b. The first surface 11a may face the liquid driving component 2, the cooling The module 3 and the fan assembly 4, the liquid cooling radiator 1 can be thermally connected to at least one heat source H of the electronic component M through the second surface 11b of the base 11, so that the thermal energy of the heat source H can be transferred to the liquid Cool the working liquid L in the radiator 1 (as shown in Figure 4).

The liquid cooling radiator 1 may have a cover 12. The first surface 11a of the base 11 faces the cover 12. The cover 12 is combined with the base 11 and together forms a working chamber S. The working liquid L It is filled in the working chamber S, and the cover 12 can be used for disposing the liquid driving component 2 , the cooling module 3 and the fan component 4 . The cover 12 can be bonded to the base 11 by pasting or locking to enhance the bonding strength between the cover 12 and the base 11 . In addition, the cover 12 can have a liquid inlet 121 and a liquid outlet 122. The liquid inlet 121 can be used for the working liquid L to flow into the liquid cooling radiator 1. The liquid outlet 122 The system can be used for the working liquid L to flow out in a direction away from the liquid cooling radiator 1 .

In addition, the liquid cooling radiator 1 may also have a heat dissipation fin set 13 , and the heat dissipation fin set 13 may be located in the working chamber S. Specifically, the heat dissipation fin set 13 is preferably made of a metal material with high thermal conductivity. The heat dissipation fin set 13 can be formed by bending a single fin, or multiple fins are stacked on top of each other. The present invention is not limited to the snap-on combination. In this embodiment, the heat dissipation fin group 13 and the base 11 can be connected in one piece. The heat dissipation fin set 13 can be combined with the first surface 11a of the base 11, and the heat dissipation fin set 13 can contact the working liquid L; through the arrangement of the heat dissipation fin set 13, the heat dissipation fin set 13 can be transmitted to the liquid. The thermal energy in the cold radiator 1 has a larger contact area with the working liquid L, which can have a better heat dissipation effect.

Please refer to Figures 1, 3, and 4. The liquid driving assembly 2 can be connected to the inside of the liquid cooling radiator 1. The liquid driving assembly 2 can have a housing 21 and a pump 22. The housing 21 is connected to the liquid cooling radiator 1. The cover 12 of the liquid cooling radiator 1, and the shell base 21 and the cover 12 are preferably integrally connected, which can increase the structural strength, reduce the joint height, and eliminate the need for connecting pipe fittings, thereby saving costs. The pump 22 is located in the housing 21 . The housing 21 has an inflow portion 211 and an outflow part 212. The inflow part 211 and the outflow part 212 can be located on the same side or different sides of the housing 21 according to the pipeline configuration requirements. The inflow part 211 can be connected to the cooling module 3, and the inflow part 211 can be connected to the cooling module 3. The outflow part 212 can be connected to the liquid inlet 121 of the liquid cooling radiator 1 , and the pump 22 can draw the working liquid L from the inflow part 211 and pump the working liquid L out of the outflow part 212 .

Specifically, the pump 22 may have a body 221 and an impeller 222. The impeller 222 is connected to the body 221. The body 221 may be connected to the outflow part 212 of the housing 21 and supply power to the stator group in the body 221. When the impeller 222 is rotated, the impeller 222 can be driven to rotate, and the rotating space of the impeller 222 can be connected to the outflow part 212 of the housing seat 21, so that the working liquid L can be driven by the impeller 222 and flow out to the outside of the housing seat 21 through the outflow part 212. . In this way, the pump 22 can increase the circulation speed of the working liquid L, and also relatively increase the speed of taking away heat energy, which has the effect of improving the heat dissipation efficiency.

Please refer to Figures 1, 3, and 5. The cooling module 3 can have a fin unit 31. The fin unit 31 can be formed by bending a single fin, or multiple fins are stacked. The fin unit 31 can be made of metal material with high thermal conductivity to improve thermal conductivity. The fin unit 31 may have a ventilation part 31a and a closing part 31b. The ventilation part 31a may be used for airflow to pass through, and the ventilation part 31a may have a first ventilation side F1 and a second ventilation side F2. The first ventilation side F1 can provide air flow into the cooling module 3, and the second ventilation side F2 can provide air flow out of the cooling module 3. The air flow of the second ventilation side F2 is preferably orthogonal to the first ventilation side. For the airflow F1, the closing portion 31b is used to block the airflow from passing through.

The cooling module 3 can have a heat dissipation pipe body 32 , and the heat dissipation pipe body 32 can be combined with the fin unit 31 so that the heat dissipation pipe body 32 can contact the fin unit 31 . In this embodiment, the heat dissipation pipe body 32 32 is illustrated by penetrating the fin unit 31; in this way, the heat energy transferred from the working liquid L to the heat dissipation tube 32 can be taken away by the fin unit 31, so that the temperature of the working liquid L can be increased. Can be lowered. Preferably, the fin unit 31 does not contact the cover 12 of the liquid cooling radiator 1 , so as to prevent the heat energy transferred to the cooling module 3 from being transferred back to the liquid cooling radiator 1 .

Specifically, the heat dissipation tube body 32 may have a first port 32a and a second port 32b opposite to each other. The first port 32a may be connected to the liquid outlet hole 122 of the liquid cooling radiator 1 , and the second port 32b The inflow portion 211 can be connected to the liquid driving component 2 so that the cooling module 3 can communicate with the liquid cooling radiator 1 and the liquid driving component 2 . The heat dissipation pipe body 32 can be formed into a straight shape or a curved shape. In this embodiment, the heat dissipation pipe body 32 is illustrated as a curved shape. The heat dissipation pipe body 32 can be formed into several U-shaped aspects. In this way, the system This allows the heat dissipation pipe body 32 to have a larger contact area with the surrounding cold air, thereby achieving a better heat dissipation effect.

Please refer to Figure 1. The fan assembly 4 is coupled to the outside of the cover 12 of the liquid cooling radiator 1. The axis X2 of the fan assembly 4 is parallel to the axis X1 of the liquid driving assembly 2. The fan assembly 4 can be used To blow or suck the hot air in the cooling module 3, the fan assembly 4 can be a centrifugal fan, a cross-flow fan, an axial flow fan, etc. In this embodiment, a centrifugal fan is used as an example for explanation. But it is not limited to this.

Please refer to Figures 1, 4, and 5. Specifically, the fan assembly 4 may have a fan frame 41 and a fan wheel 42. The fan wheel 42 is rotatably located in the fan frame 41. The fan frame 41 There can be an air inlet 41a and an air outlet 41b. The air inlet 41a can be connected to the outside world. The air outlet 41b can be connected to the ventilation part 31a of the cooling module 3, and the air outlet 41b is aligned with the ventilation part 31a. On the first ventilation side F1, the air flow of the air inlet 41a and the air flow of the air outlet 41b can be orthogonal, and the air inlet 41a can be located at the center of the fan assembly 4, so that the air flow of the fan assembly 4 can be as follows As shown in Figure 5, the shaft enters and the side exits.

When the fan assembly 4 is in operation, the fan assembly 4 can suck external airflow, so that the airflow can flow into the interior of the fan assembly 4 through the air inlet 41a, and then flow out from the air outlet 41b to be blown into the cooling module 3 airflow, so that the airflow of the fan assembly 4 can be directed toward the fin unit The hot air in the cooling module 3 can be discharged from the second ventilation side F2 of the ventilation part 31a, so that the heat energy transferred from the liquid cooling radiator 1 to the cooling module 3 can be taken away.

Please refer to Figures 2, 3, and 4. Specifically, the liquid cooling radiator 1, the liquid driving assembly 2, the cooling module 3 and the fan assembly 4 have an overall width K1 and an overall length. degree K2, the total width K1 is less than or equal to the electronic component width M1 of the electronic component M, and the total length K2 is also less than or equal to the electronic component length M2 of the electronic component M, so that the liquid cooling radiator 1 and the liquid drive component 2. The vertical projection of the combined cooling module 3 and the fan assembly 4 on the electronic component M may not exceed the area range of the electronic component M, so that the liquid cooling radiator 1, the liquid driving component 2, and the After being combined, the cooling module 3 and the fan assembly 4 can be positioned directly above the same side of the heat source H of the electronic component M, so as to combine the liquid cooling radiator 1, the liquid driving component 2, the cooling module 3 and The fan assembly 4 is integrated into a module, so that the overall volume of the integrated liquid cooling system of the present invention can be smaller, so that the integrated liquid cooling system can be easily configured in an appropriate position during installation, and the system can be used with various The role of the configuration requirements of the installation space.

Please refer to Figures 1 and 2. In addition, the integrated liquid cooling system of the present invention can further include a clip fastener 5. The clip fastener 5 can be made of plastic or metal. The present invention is not limited thereto. . The clamping part 5 can preferably be U-shaped, and the clamping part 5 can have a clamping space Q, and the clamping space Q can be used to accommodate the electronic component M and the liquid cooling radiator 1. The clamping part 5 5 can clamp the electronic component M and the liquid-cooling radiator 1 so that the electronic component M and the liquid-cooling radiator 1 can be positioned on the clip 5 to prevent the liquid-cooling radiator 1 from being separated from the electronic component M.

Please refer to Figures 1 and 4. When the integrated liquid cooling system of the present invention is operating, the working liquid L in the liquid cooling radiator 1 can quickly absorb the heat energy of the heat source H of the electronic component M. This operation The liquid L can be formed from a lower temperature into a higher temperature working liquid L, which can dissipate heat from the heat source H connected to the liquid cooling radiator 1. The higher temperature working liquid L can flow into the cooling unit through the liquid outlet hole 122. Module 3, and the working liquid L in the heat dissipation pipe body 32 can face This liquid drives assembly 2 to flow.

At the same time, as the fan wheel 42 rotates, external cold air can flow into the fan frame 41 from the air inlet 41a, and sequentially flows into the cooling through the air outlet 41b and the first ventilation side F1 of the ventilation portion 31a. Module 3, the cold air can flow through the heat dissipation tube body 32 and the fin unit 31 to form hot air, and the fan assembly 4 can blow the hot air in the cooling module 3, so that the hot air can pass through the ventilation part 31a The second ventilation side F2 is discharged, thereby lowering the temperature of the working liquid L in the heat dissipation pipe body 32 . Then, the cooled working liquid L flows into the liquid driving assembly 2, and the working liquid L can be driven by the impeller 222 to flow into the working chamber S through the outflow part 212; such continuous circulation can allow the liquid to cool and dissipate heat. The heat source H received by the device 1 can effectively cool down, thereby maintaining the electronic component M at an appropriate operating temperature, thereby providing good heat dissipation performance.

Please refer to Figures 6, 7, and 8, which are the second embodiment of the integrated liquid cooling system of the present invention. The second embodiment of the present invention is substantially the same as the above-mentioned first embodiment. In the second embodiment, In the embodiment, the integrated liquid cooling system of the present invention can be arranged side by side with the fan assembly 4 and the liquid driving assembly 2 according to space configuration requirements, and the air inlet 41a of the fan assembly 4 can be connected to the cooling module 3 The ventilation part 31a has a ventilation part 31a, and the air inlet 41a is aligned and connected to the second ventilation side F2 of the ventilation part 31a, and the air outlet 41b can communicate with the outside world. When the fan assembly 4 is operating, external cold air can flow into the cooling module 3 from the first ventilation side F1 of the ventilation portion 31a, and the cold air can flow through the heat dissipation tube body 32 and the fin unit 31. The fan assembly 4 can suck the hot air in the cooling module 3, so that the hot air can flow into the fan frame 41 through the second ventilation side F2 of the ventilation part 31a and the air inlet 41a, and pass through the outlet. The air outlet 41b flows to the outside, thereby causing the temperature of the working liquid L in the heat dissipation tube body 32 to drop.

Please refer to Figures 8 and 9. Then, the cooled working fluid L flows into the liquid driving assembly 2, and the working fluid L can be driven by the impeller 222 to pass through the outflow part 212. Flows into the working chamber S; such continuous circulation can effectively cool down the heat source H received by the liquid cooling radiator 1, so that the electronic component M can be maintained at an appropriate operating temperature, and the system can provide good heat dissipation. The role of effectiveness.

To sum up, in the integrated liquid cooling system of the present invention, the working liquid in the liquid cooling radiator can absorb the thermal energy of the heat source, and the higher temperature working liquid formed can flow to the cooling module, and through the The fan assembly blows or sucks the hot air in the cooling module so that the hot air can be discharged outside the cooling module, thereby lowering the temperature of the working liquid in the cooling module, and the cooled working liquid can flow back to the cooling module. The liquid cooling radiator enables the heat source to effectively cool down and can provide good heat dissipation performance.

Furthermore, since the combined total width of the liquid cooling radiator, the liquid driving assembly, the cooling module and the fan assembly is less than or equal to the width of the electronic assembly, and the liquid cooling radiator, the liquid driving assembly , the combined total length of the cooling module and the fan assembly is less than or equal to the electronic component length of the electronic component, so as to integrate the liquid cooling radiator, the liquid drive component, the cooling module and the fan component into one module The combination allows the overall volume of the integrated liquid cooling system of the present invention to be smaller, so that the integrated liquid cooling system can be easily configured in an appropriate position during installation, and has the effect of being able to meet the configuration requirements of various installation spaces.

Although the present invention has been disclosed using the above-mentioned preferred embodiments, they are not intended to limit the invention. Anyone skilled in the art can make various changes and modifications to the above-described embodiments without departing from the spirit and scope of the invention. The technical scope protected by the invention, therefore, the protection scope of the invention shall include all changes within the literal and equivalent scope described in the appended patent application scope. Furthermore, when several of the above-mentioned embodiments can be combined, the present invention includes any combination of implementations.

1: Liquid cooling radiator

11: Base

11a: First surface

11b: Second surface

12: Cover

121: Liquid inlet hole

122: Liquid outlet

13: Cooling fin set

2: Liquid driven components

21: Shell base

211:Inflow department

212:Outflow department

22:Pump

221:Body

222: Impeller

3: Cooling module

31: Fin unit

31a:Ventilation department

31b: closed part

32:Heat dissipation pipe body

32a: first port

32b: Second port

4:Fan assembly

41: fan frame

41a:Air inlet

41b:Air outlet

42:Fan wheel

5: clip fastener

F1: First ventilation side

F2: Second ventilation side

H: Heat source

M: Electronic components

Q: Clamping space

X1: Axis of liquid drive assembly

X2: Axis of fan assembly

Claims (16)

An integrated liquid cooling system includes: a liquid cooling radiator for thermally connecting an electronic component, the liquid cooling radiator having a working liquid; a liquid driving component connected to the liquid cooling radiator; a cooling mold A group, located on one side of the liquid driven component, the working fluid circulates along the liquid cooling radiator, the liquid driven component and the cooling module; and a fan assembly, located on one side of the liquid driven component, the fan component Airflow is directed to remove heat energy transferred from the liquid cooling radiator to the cooling module, and the liquid cooling radiator, the liquid drive assembly, the cooling module and the fan assembly have an overall width and an overall length when combined degree, the total width is less than or equal to an electronic component width of the electronic component, the total length is less than or equal to an electronic component length of the electronic component, and an axis of the fan component is parallel to an axis of the liquid driving component. An integrated liquid cooling system includes: a liquid cooling radiator for thermally connecting an electronic component, the liquid cooling radiator having a working liquid; a liquid driving component connected to the liquid cooling radiator; a cooling mold A group is located on one side of the liquid driving assembly, and the working fluid circulates along the liquid cooling radiator, the liquid driving assembly and the cooling module; a fan assembly is located on one side of the liquid driving assembly, and the fan assembly guides The air flow is directed to take away the heat energy transferred from the liquid cooling radiator to the cooling module, and the liquid cooling radiator, the liquid drive assembly, the cooling module and the fan assembly have an overall width and an overall length when combined , the total width is less than or equal to an electronic component width of the electronic component, and the total length is less than or equal to an electronic component length of the electronic component; and a clip fastener that clamps the electronic component and the liquid cooling Radiator. For example, the integrated liquid cooling system of claim 1 or 2, wherein the liquid cooling radiator has a base and a cover, and the cover is combined with the base and together forms a working chamber. Fill the working chamber with liquid. The integrated liquid cooling system of claim 1 or 2, wherein the liquid driving component has a housing and a pump, the housing is connected to the liquid cooling radiator, and the pump is located in the housing. In the integrated liquid cooling system of claim 4, the shell base and a cover of the liquid cooling radiator are integrally connected. The integrated liquid cooling system of claim 4, wherein the pump has a body and an impeller, the impeller is connected to the body, and the working fluid is driven by the impeller to circulate in the liquid cooling radiator, the liquid driving component and The cooling module circulates between them. The integrated liquid cooling system of claim 4, wherein the housing has an inflow part and an outflow part, the inflow part is connected to the cooling module, and the outflow part is connected to the liquid cooling radiator. The integrated liquid cooling system of claim 1 or 2, wherein the liquid cooling radiator has a heat dissipation fin set, and the heat dissipation fin set contacts the working liquid. The integrated liquid cooling system of claim 1 or 2, wherein the cooling module has a heat dissipation pipe body, the heat dissipation pipe body has a first port and a second port opposite to each other, and the first port is connected to the A liquid outlet hole of the liquid cooling radiator, the second port is connected to an inflow part of the liquid driving component. In the integrated liquid cooling system of claim 9, the cooling module has a fin unit, and the heat dissipation pipe is combined with the fin unit. The integrated liquid cooling system of claim 1 or 2, wherein the cooling module has a fin unit, the fin unit has a ventilation part, and a first ventilation side of the ventilation part is aligned and communicated with the fan assembly An air outlet, the fan assembly blows air flow into the cooling module. The integrated liquid cooling system of claim 1 or 2, wherein the cooling module has a fin unit, the fin unit has a ventilation part, and a second ventilation side of the ventilation part is aligned and communicated with the fan assembly An air inlet, the fan assembly sucks the hot air in the cooling module. The integrated liquid cooling system of claim 1 or 2, wherein the liquid cooling radiator has a base and a cover, the base has a first surface and a second surface opposite to each other, and the first surface faces the cover The liquid driving component, the cooling module and the fan component are arranged on the cover body, and the liquid cooling radiator is thermally connected to at least one heat source of the electronic component through the second surface. The integrated liquid cooling system of claim 13, wherein the cooling module has a fin unit, and the fin unit does not contact the cover. The integrated liquid cooling system of claim 13, wherein the liquid cooling radiator, the liquid driving component, the cooling module and the fan component are all located directly above the same side of the heat source of the electronic component. The integrated liquid cooling system of claim 1 or 2, wherein the vertical projection of the liquid cooling radiator, the liquid driving component, the cooling module and the fan component on the electronic component does not exceed the area of the electronic component Scope.