TWI820659B - Printed circuit structure - Google Patents

Abstract

A printed circuit structure includes a printed circuit layer and a printed conductive adhesive layer. The printed circuit layer includes a first printed circuit layer and a second printed circuit layer. One of a first basic circuit wiring section of the first printed circuit layer and a first basic adhesive conductive section of the first printed conductive adhesive layer extends along a first direction, and the other is along a second direction perpendicular to the first direction. Wherein, due to the difference in length between the first basic circuit wiring section and the first basic adhesive conductive section in the first direction, the first printed circuit layer and the first printed conductive adhesive layer have a tolerance space in the first direction. A second basic circuit wiring section of the second printed circuit layer and a second basic adhesive conductive section of the second printed conductive adhesive layer also generate the tolerance space in the first direction in the same manner.

Description

Printed circuit structure

The present invention relates to a circuit structure, and in particular, to a printed circuit structure that utilizes the connection design of a printed circuit layer and a printed conductive adhesive layer to achieve fault tolerance in printing.

In recent years, there has been an increasing demand for placing light-emitting diodes on circuit boards, such as placing light-emitting diodes on the circuit board of a keyboard, and turning on the light-emitting diodes when the keys are pressed, thereby making them glow.

Among them, since most existing printed circuit boards use an etching process to form metal circuits on an insulating substrate, if the light-emitting diodes are to be disposed on the printed circuit board, solder paste is usually used to weld the light-emitting diodes. The electrode pins of the pole body can be welded to the metal lines on the circuit board, but the welding process requires the use of a high-temperature furnace, which will increase the manufacturing cost.

In order to solve the high cost caused by solder paste welding of light-emitting diodes using high-temperature furnaces, the existing technology has also been improved to use conductive adhesive to bond light-emitting diodes and metal circuits. Please refer to the first figure. The first figure is a schematic plan view showing a prior art printed circuit structure using conductive adhesive to bond light-emitting diodes. As shown in the first figure, a printed circuit structure PA100 includes a printed circuit layer PA1 and a conductive adhesive layer PA2. The printed circuit layer PA1 includes a first printed circuit PA11 and a second printed circuit PA12. The conductive adhesive layer PA2 includes a first conductive adhesive PA21 and a second conductive adhesive PA22.

The first conductive adhesive PA21 is bonded to the first printed circuit PA11, and the second conductive adhesive PA22 is connected to the second printed circuit PA12. Through this, the user can connect the first electrode pin PA201 of a light-emitting diode PA200 with A second electrode pin PA202 is bonded to the first conductive adhesive PA21 and the second conductive adhesive PA22 respectively, so that the printed circuit layer PA1 can conduct the light emitting diode PA200 through the conductive adhesive layer PA2.

Please continue to refer to the second figure. The second figure is a schematic diagram showing that the conductive adhesive in the prior art deviates from the printed circuit layer due to errors in printing and coating. As shown in the first figure, although the conductive adhesive layer PA2 can be used to connect the light-emitting diode PA200 and the printed circuit layer PA1, since the conductive adhesive layer PA2 is coated and formed on the printed circuit layer PA1 through screen printing, therefore In practice, the conductive adhesive layer PA2 can easily deviate from the original position of contacting the printed circuit layer PA1 due to printing and coating errors. Even if the light-emitting diode PA200 can be accurately connected to the conductive adhesive layer PA2, it will still be affected by the conductivity. Due to the printing error of the adhesive layer PA2, the conductive adhesive layer PA2 cannot be electrically connected to the printed circuit layer PA1.

In view of the fact that in the prior art, the existing printed circuit structure can use a conductive adhesive layer to electrically connect the light-emitting diodes to the printed circuit layer, but the conductive adhesive layer is coated on the printed circuit layer through screen printing. Therefore, in practice, it is easy to deviate from the printed circuit layer due to errors, and thus cannot be bonded to the printed circuit layer. Therefore, the main purpose of the present invention is to provide a printed circuit structure that can prevent the conductive adhesive layer from being prevented by structural improvements. The problem of not being able to adhere to the printed circuit layer due to errors.

In order to solve the problems of the prior art, the necessary technical means adopted by the present invention is to provide a printed circuit structure. The printed circuit structure is formed on a substrate and used to electrically connect a light-emitting diode. The light-emitting diode includes A first electrode pin and a second electrode pin are arranged along one direction, and the printed circuit structure includes a printed circuit layer and a printed conductive adhesive layer.

The printed circuit layer includes a first printed circuit layer and a second printed circuit layer. The first printed circuit layer includes a first basic circuit wiring segment extending along the first direction, and the first basic circuit wiring segment has a first length in the first direction. The second printed circuit layer includes a second basic circuit wiring segment extending along the first direction, and the second basic circuit wiring segment has a second length in the first direction.

The printed conductive adhesive layer includes a first printed conductive adhesive layer and a second printed conductive adhesive layer. Layer. The first printed conductive adhesive layer includes a first basic adhesive conductive segment, the first basic adhesive conductive segment extends along a second direction perpendicular to the first direction, and has a shape in the first direction that is smaller than the first The third length of the length, and the first basic adhesive conductive segment is adhered to the first basic circuit wiring segment. The second printed conductive adhesive layer includes a second base adhesive conductive segment extending along the second direction and having a fourth length in the first direction that is less than the second length, and The second basic adhesive conductive segment is adhered to the second basic circuit wiring segment.

Wherein, the first printed conductive adhesive layer and the second printed conductive adhesive layer are respectively used to adhere the first electrode pin and the second electrode pin. The overlapping position of the first basic adhesive conductive segment and the first basic circuit wiring segment does not overlap with the orthographic projection of the light-emitting diode. Wherein, the first basic circuit wiring segment has a fifth length in the second direction, and the first length of the first basic circuit wiring segment in the first direction is greater than the fifth length in the second direction. .

In an ancillary technical means derived from the above necessary technical means, the first printed circuit layer further includes a first extended circuit wiring section, and the first extended circuit wiring section is integrally formed along the first basic circuit wiring section. The second direction extends. Preferably, the first extended circuit wiring section is integrally connected to the middle or end of the first basic circuit wiring section.

In an ancillary technical means derived from the above necessary technical means, the first printed conductive adhesive layer further includes a first extended adhesive conductive section, the first extended adhesive conductive section extends along the first direction and is integrally formed Connected to the first basic adhesive conductive section, the first electrode pin of the light emitting diode is adhered to the first extended adhesive conductive section. Preferably, the first extended adhesive conductive section is integrally connected to the middle or end of the first basic adhesive conductive section.

In an ancillary technical means derived from the above necessary technical means, the first basic circuit wiring section has a fifth length in the second direction, and the first basic adhesive conductive section has a length in the second direction that is greater than the The sixth length of the fifth length.

Among the subsidiary technical means derived from the above necessary technical means, the first basic circuit The wiring section has an edge, and the first basic adhesive conductive section is bonded to the first basic circuit wiring section at a distance from the edge. In one embodiment, the light-emitting diode corresponds to one of the keycaps of a keyboard module. In one embodiment, the second basic circuit wiring segment has a second length in the first direction and a seventh length in the second direction, and the second length is greater than the seventh length.

Another necessary technical means adopted by the present invention is to provide a printed circuit structure, which is formed on a substrate. The printed circuit structure is used to electrically connect a light-emitting diode, and the light-emitting diode includes a first electrode. The pin and a second electrode pin are arranged along a second direction, and the printed circuit structure includes a printed circuit layer and a printed conductive adhesive layer.

The printed circuit layer includes a first printed circuit layer and a second printed circuit layer. The first printed circuit layer includes a first basic circuit wiring segment extending along a first direction, the first basic circuit wiring segment having a first length in a second direction perpendicular to the first direction. The second printed circuit layer includes a second basic circuit wiring segment extending along the first direction, and the second basic circuit wiring segment has a second length in the second direction.

The printed conductive adhesive layer includes a first printed conductive adhesive layer and a second printed conductive adhesive layer. The first printed conductive adhesive layer includes a first base adhesive conductive segment extending along the second direction and having a third length in the second direction that is greater than the first length, and The first basic adhesive conductive segment is adhered to the first basic circuit wiring segment. The second printed conductive adhesive layer includes a second basic adhesive conductive segment, the second basic adhesive conductive segment extends along the second direction and has a fourth length in the second direction that is greater than the second length, and The second basic adhesive conductive segment is adhered to the second basic circuit wiring segment.

Wherein, the first printed conductive adhesive layer and the second printed conductive adhesive layer are respectively used to adhere the first electrode pin and the second electrode pin. The overlapping position of the first basic adhesive conductive segment and the first basic circuit wiring segment does not overlap with the orthographic projection of the light emitting diode; wherein, the third length of the first basic adhesive conductive segment along the second direction , greater than the first basic circuit wiring segment in the The first length in two directions.

In an ancillary technical means derived from the above necessary technical means, the first printed conductive adhesive layer further includes a first extended adhesive conductive section, the first extended adhesive conductive section extends along the first direction and is integrally formed Connected to the first basic adhesive conductive section, the first electrode pin of the light emitting diode is adhered to the first extended adhesive conductive section. Preferably, the first extended adhesive conductive segment is integrally connected to the middle or end of the first basic adhesive conductive segment.

In an additional technical means derived from the above necessary technical means, the first basic circuit wiring section has an edge, and the first basic adhesive conductive section is bonded to the first basic circuit wiring section at a distance from the edge.

Another necessary technical means adopted by the present invention is to provide a printed circuit structure formed on a substrate. The printed circuit structure is used to electrically connect a light-emitting diode. The light-emitting diode includes a plurality of first The electrode pin and a plurality of second electrode pins, the printed circuit structure includes a printed circuit layer and a printed conductive adhesive layer.

The printed circuit layer includes a plurality of first printed circuit layers and a plurality of second printed circuit layers. Each first printed circuit layer includes a first basic circuit wiring segment extending along a first direction, the first basic circuit wiring segment having a first length in the first direction.

Each second printed circuit layer includes a second basic circuit wiring segment extending along the first direction, and the second basic circuit wiring segment has a second length in the first direction.

The printed conductive adhesive layer includes a plurality of first printed conductive adhesive layers and a plurality of second printed conductive adhesive layers. Each first printed conductive adhesive layer includes a first base adhesive conductive segment extending along a second direction perpendicular to the first direction, the first base adhesive conductive segment having a shape in the first direction smaller than the first base conductive segment. The third length of the length, and the first basic adhesive conductive sections of the first printed conductive adhesive layers are respectively adhered to the first basic circuit wiring sections of the first printed circuit layers.

Each second printed conductive adhesive layer includes a second base adhesive extending along the second direction. Conductive segment, the second basic adhesive conductive segment has a fourth length less than the second length in the first direction, and the second basic adhesive conductive segments of the second printed conductive adhesive layers are respectively adhered to the A second basic circuit wiring segment of the second printed circuit layer.

Wherein, the first printed conductive adhesive layers and the second printed conductive adhesive layers are respectively used to adhere the first electrode pins and the second electrode pins. The overlapping position of each first basic adhesive conductive segment and each first basic circuit wiring segment does not overlap with the orthographic projection of the light-emitting diode; wherein the first basic circuit wiring segment has a first basic circuit wiring segment in the second direction. Five lengths, the first length of at least one of the first basic circuit wiring segments in the first direction is greater than the fifth length in the second direction.

In an ancillary technical means derived from the above necessary technical means, each first printed circuit layer further includes a first extended circuit wiring section, the first extended circuit wiring section extends along the second direction and is integrally formed Connected to the first basic circuit wiring segment. Preferably, the first extended circuit wiring section is integrally connected to the middle of the first basic circuit wiring section.

In an ancillary technical means derived from the above necessary technical means, at least one of the plurality of first printed conductive adhesive layers further includes a first extended adhesive conductive section, and the first extended adhesive conductive section extends along the first direction. , and is integrally connected to the first basic adhesive conductive section, and at least one of the first electrode pins of the light-emitting diode is adhered to the first extended adhesive conductive section. Preferably, the first extended adhesive conductive section is integrally connected to the end of the first basic adhesive conductive section.

Another necessary technical means adopted by the present invention is to provide a printed circuit structure, which is formed on a substrate and used to electrically connect a light-emitting diode. The light-emitting diode includes a plurality of first electrode pins and A plurality of second electrode pins, the printed circuit structure includes a printed circuit layer and a printed conductive adhesive layer.

The printed circuit layer includes a plurality of first printed circuit layers and a plurality of second printed circuit layers. layer. Each first printed circuit layer includes a first basic circuit wiring segment extending along a first direction, the first basic circuit wiring segment having a first length in the first direction. Each second printed circuit layer includes a second base circuit wiring segment extending in a second direction perpendicular to the first direction.

The printed conductive adhesive layer includes a plurality of first printed conductive adhesive layers and a second printed conductive adhesive layer. Each first printed conductive adhesive layer includes a first base adhesive conductive segment extending along the second direction, the first base adhesive conductive segment having a third length in the second direction that is less than the first length, and The first basic adhesive conductive sections of the first printed conductive adhesive layers are respectively adhered to the first basic circuit wiring sections of the first printed circuit layers. The second printed conductive adhesive layer extends along the first direction and is respectively adhered to the second basic circuit wiring segments of the second printed circuit layers.

Wherein, the first printed conductive adhesive layers are respectively used to adhere to the first electrode pins, and the second printed conductive adhesive layers are used to adhere to the second electrode pins.

In an ancillary technical means derived from the above necessary technical means, each first printed circuit layer further includes a first extended circuit wiring section, the first extended circuit wiring section extends along the second direction and is integrally formed Connected to the first basic circuit wiring segment. Preferably, the first extended circuit wiring section is integrally connected to the middle of the first basic circuit wiring section.

As mentioned above, since the present invention utilizes the length of any one of the first basic circuit wiring segment and the first basic adhesive conductive segment in the first direction to be greater than the length of the other in the first direction, and the second basic circuit The length of any one of the wiring segment and the second basic adhesive conductive segment in the first direction is greater than the length of the other in the first direction, so that when the first basic adhesive conductive segment is formed using a coating process, it will An error-tolerant space is generated in the first direction, thereby effectively preventing the printed conductive adhesive layer from being in contact with the printed circuit layer due to errors, and relatively improving the manufacturing yield of the printed circuit structure.

Specific embodiments used in the present invention will be further described through the following examples and drawings.

PA100: Printed circuit structure

PA1: Printed circuit layer

PA11: First printed circuit

PA12: Second printed circuit

PA2: conductive adhesive layer

PA21: The first conductive adhesive

PA22: Second conductive adhesive

PA200: Light emitting diode

PA201: first electrode pin

PA202: Second electrode pin

100,100a~100h: printed circuit structure

1,1a~1h:Printed circuit layer

11,11a~11g,12g,13g,11h,12h,13h: first printed circuit layer

111,111a~111g,121g,131g,111h,121h,131h: first basic circuit wiring section

1111d,1211d,1111e,1211e: edge

112,112a,112g,122g,132g,112h,122h,132h: first extended circuit wiring section

12,12a~12f,14g,15g,16g,14h,15h,16h: second printed circuit layer

121,121a~121f,141g,151g,161g,141h,151h,161h: second basic circuit wiring section

122, 122a, 142g, 152g, 162g: second extension circuit wiring section

2,2a~2h: Printing conductive adhesive layer

21,21a~21g,22g,23g,21h,22h,23h: first printed conductive adhesive layer

211, 211a~211g, 221g, 231g, 211h, 221h, 231h: first basic adhesive conductive section

212b, 212c, 212e, 212g, 232g, 212h, 232h: first extended adhesive conductive section

22, 22a~22f, 24g, 25g, 26g, 24h: second printed conductive adhesive layer

221, 221a~221f, 241g, 251g, 261g: second basic adhesive conductive section

222b, 222c, 222e, 242g, 262g: second extended adhesive conductive segment

200,200a~200h: light emitting diode

201,201b~201g,202g,203g,201h,202h,203h: first electrode pin

202,202b~202f,204g,205g,206g,204h,205h,206h: second electrode pin

300,300a:Keyboard module

301,301a:Substrate

3011:First circuit

3012: Second circuit

302:Keyboard bottom frame

302a:Button component

303a:Keycap

D1, D1a~D1h: first direction

D2, D2a~D2h: second direction

d1,d1a~d1f: first length

d2,d2a~d2f: second length

d3,d3a~d3f: third length

d4,d4a~d4f: fourth length

d5,d5a: fifth length

d6,d6a: sixth length

d7,d7a: seventh length

d8,d8a: eighth length

dah: wiring area length

The first figure is a schematic plan view showing a prior art printed circuit structure using conductive adhesive to bond light-emitting diodes; the second figure is a schematic plan view showing the prior art conductive adhesive deviating from the printed circuit layer due to errors in printing and coating; The third figure is a schematic plan view showing the printed circuit structure provided by the first preferred embodiment of the present invention; the fourth figure is a schematic diagram showing the printed circuit structure provided by the first preferred embodiment of the present invention by extending along the first direction. A schematic plan view of a basic circuit wiring section and a second basic circuit wiring section to increase the allowable printing range when printing the conductive adhesive layer; the fifth figure shows the printed circuit structure provided by the first preferred embodiment of the present invention applied to a keyboard The plan view of the module; the sixth figure is a cross-sectional schematic view showing the printed circuit structure provided by the first preferred embodiment of the present invention applied to another keyboard module; the seventh figure is an enlarged schematic view of circle A in the sixth figure; The eighth figure is a schematic plan view showing the printed circuit structure provided by the second preferred embodiment of the present invention; the ninth figure is a schematic plan view showing the printed circuit structure provided by the third preferred embodiment of the present invention; and the tenth figure is a schematic plan view showing a printed circuit structure provided by the third preferred embodiment of the present invention. Figure 11 is a schematic plan view showing the printed circuit structure provided by the fourth preferred embodiment of the present invention; Figure 11 is a schematic plan view showing the structure of the printed circuit provided by the fifth preferred embodiment of the present invention; Figure 12 is a schematic plan view showing the printed circuit structure provided by the fifth preferred embodiment of the present invention. The schematic plan view of the printed circuit structure provided by the sixth preferred embodiment of the present invention; the thirteenth figure is a schematic plan view of the printed circuit structure provided by the seventh preferred embodiment of the present invention; the fourteenth figure shows the schematic plan view of the printed circuit structure provided by the seventh preferred embodiment of the present invention. Figure 15 is a schematic plan view of the printed circuit structure provided by the eighth preferred embodiment; and Figure 15 is a schematic plan view showing the printed circuit structure provided by the ninth preferred embodiment of the present invention.

Please refer to the third figure. The third figure is a schematic plan view showing the printed circuit structure provided by the first preferred embodiment of the present invention. As shown in the third figure, a printed circuit structure 100 includes a printed circuit layer 1 and a printed conductive adhesive layer 2 .

The printed circuit layer 1 includes a first printed circuit layer 11 and a second printed circuit layer 12 . The first printed circuit layer 11 includes a first basic circuit wiring section 111 and a first extended circuit wiring section 112. The first basic circuit wiring section 111 extends along a first direction D1, and the first extended circuit wiring section 112 extends along a first direction D1. A second direction D2 extends perpendicular to the first direction D1 and is integrally connected to the middle of the first basic circuit wiring section 111; wherein the first basic circuit wiring section 111 has a first length in the first direction D1 d1, and has a fifth length d5 in the second direction D2.

The second printed circuit layer 12 includes a second basic circuit wiring section 121 and a second extended circuit wiring section 122. The second basic circuit wiring section 121 extends along the first direction D1, and the second extended circuit wiring section 122 extends along the first direction D1. It extends in two directions D2 and is integrally connected to the middle of the second basic circuit wiring section 121; wherein, the second basic circuit wiring section 121 has a second length d2 in the first direction D1, and has a second length d2 in the second direction D2. has a seventh length d7.

The printed conductive adhesive layer 2 includes a first printed conductive adhesive layer 21 and a second printed conductive adhesive layer 22 . The first printed conductive adhesive layer 21 includes a first basic adhesive conductive segment 211. The first basic adhesive conductive segment 211 extends along the second direction D2 and overlaps and adheres to the middle of the first basic circuit wiring segment 111, and the first basic adhesive conductive segment 211 extends along the second direction D2. The basic adhesive conductive segment 211 has a third length d3 less than the first length d1 in the first direction D1, and a sixth length d6 greater than the fifth length d5 in the second direction D2.

The second printed conductive adhesive layer 22 includes a second basic adhesive conductive segment 221. The second basic adhesive conductive segment 221 extends along the second direction D2 and overlaps and adheres to the middle of the second basic circuit wiring segment 121, and the second basic adhesive conductive segment 221 extends along the second direction D2. The basic adhesive conductive segment 221 has a fourth length d4 in the first direction D1 that is less than the second length d2, and has an eighth length d8 in the second direction D2 that is greater than the seventh length d7.

Based on the above, the first basic adhesive conductive section 211 of the first printed conductive adhesive layer 21 is used for adhesion. Attached to a first electrode pin (not shown in the figure) of a light-emitting diode 200, and the second basic adhesive conductive segment 221 of the second printed conductive adhesive layer 22 is used to adhere to a second electrode pin of the light-emitting diode 200. The electrode pins (not shown in the figure) enable the circuit connected between the first printed circuit layer 11 and the second printed circuit layer 12 to conduct the light-emitting diode 200 .

Please continue to refer to the fourth figure. The fourth figure shows that the printed circuit structure provided by the first preferred embodiment of the present invention increases the number of printed circuits by using the first basic circuit wiring segment and the second basic circuit wiring segment extending along the first direction. A schematic plan view of the allowable printing range when printing a conductive adhesive layer.

As shown in the third and fourth figures, since both the first basic circuit wiring section 111 and the second basic circuit wiring section 121 extend along the first direction D1, and each has a third length greater than the first basic adhesive conductive section 211, The first length d1 of d3 and the second length d2 are greater than the fourth length d4 of the second basic adhesive conductive segment 221. Therefore, when the first basic adhesive conductive segment 211 and the second basic adhesive conductive segment 221 are respectively constructed with the first basic circuit layout, When the middle of the line segment 111 and the second basic circuit wiring segment 121 is targeted for printing and coating, even if it deviates from the middle of the first basic circuit wiring segment 111 and the second basic circuit wiring segment 121 due to process errors, the first base is adhered The conductive section 211 and the second basic adhesive conductive section 221 can also be formed on the first basic circuit wiring section 111 and the second basic circuit wiring section 121 respectively within the range of the first length d1 and the second length d2, that is, the first The design of the basic circuit wiring section 111 and the second basic circuit wiring section 121 extending along the first direction D1 can effectively increase the allowable error range of the printed conductive adhesive layer 2 in the printing process, thereby effectively preventing the printed conductive adhesive layer 2 from errors. The printed circuit layer 1 cannot be contacted, which relatively improves the manufacturing yield of the printed circuit structure 100 .

In addition, since the first basic adhesive conductive section 211 and the second basic adhesive conductive section 221 respectively have a sixth length d6 greater than the fifth length d5 of the first basic circuit wiring section 111 and a length greater than the second basic circuit wiring section 111 in the second direction D2, The seventh length d7 of the wiring section 121 is the eighth length d8. Therefore, the first basic adhesive conductive section 211 and the second basic adhesive conductive section 221 can effectively serve as the first basic circuit wiring section 111 and the second basic circuit wiring section 121 respectively. It is extended for the light-emitting diode 200 to be bonded and arranged.

Please continue to refer to the fifth figure. The fifth figure is a schematic plan view showing the printed circuit structure provided by the first preferred embodiment of the present invention applied to a keyboard module. As shown in the third and fifth figures, the printed circuit structure 100 of the present invention can be applied to a keyboard module 300 in practice. The keyboard module 300 includes a base material 301, a keyboard bottom frame 302 and a keycap ( (not shown), the keyboard bottom frame 302 is disposed on the base material 301, and the keycaps are assembled to the keyboard bottom frame 302; the base material 301 is actually a circuit board, and the printed circuit structure 100 is, for example, etched The circuit of the printed circuit layer 1 is formed on the circuit board by using a method of screen printing, and then the printed conductive adhesive layer 2 partially formed on the printed circuit layer 1 is coated on the substrate 301 by screen printing.

In addition, the base material 301 is also provided with a first circuit 3011 and a second circuit 3012. The first circuit 3011 is turned on when the button is pressed. The first extended circuit wiring section 112 and the second extended circuit wiring section of the printed circuit structure 100 122 is electrically connected to the first circuit 3011 and the second circuit 3012 respectively, whereby when the button is pressed, the first circuit 3011 can be turned on, thereby allowing the current to pass through the printed circuit structure 100 and the light-emitting diode 200, so that The light emitting diode 200 emits light.

Please continue to refer to the sixth and seventh figures. The sixth figure is a schematic cross-sectional view showing the printed circuit structure provided by the first preferred embodiment of the present invention applied to another keyboard module; the seventh figure is a cross-sectional view of the sixth figure. Circle A enlarges the diagram.

As shown in the third, sixth and seventh figures, the printed circuit structure 100 of the present invention can also be applied to another keyboard module 300a. The keyboard module 300a includes a base material 301a, a key assembly 302a and One keycap 303a, the base material 301a is actually a circuit board, the key assembly 302a is disposed on the base material 301a, and the keycap 303a is assembled to the key assembly 302a. Among them, the printed circuit structure 100 of the present invention is disposed on the base material 301a, and as can be seen from the sixth and seventh figures, the first electrode pin 201 and the second electrode pin 202 of the light-emitting diode 200 are respectively adhered to The first basic adhesive conductive segment 211 and the second basic adhesive conductive segment 221.

Please refer to Figure 8. Figure 8 is a schematic plan view showing the printed circuit structure provided by the second preferred embodiment of the present invention. As shown in Figure 8, a printed circuit structure 100a includes a printed circuit circuit layer 1a and a printed conductive adhesive layer 2a.

The printed circuit layer 1a includes a first printed circuit layer 11a and a second printed circuit layer 12a. The first printed circuit layer 11a includes a first basic circuit wiring section 111a and a first extended circuit wiring section 112a. The first basic circuit wiring section 111a extends along a first direction D1a, and the first extended circuit wiring section 112a extends along a first direction D1a. A second direction D2a perpendicular to the first direction D1a extends and is integrally connected to the end of the first basic circuit wiring section 111a; wherein the first basic circuit wiring section 111a has a first basic circuit wiring section 111a in the first direction D1a. length d1a, and has a fifth length d5a in the second direction D2a.

The second printed circuit layer 12a includes a second basic circuit wiring section 121a and a second extended circuit wiring section 122a. The second basic circuit wiring section 121a extends along the first direction D1a, and the second extended circuit wiring section 122a extends along the first direction D1a. It extends in two directions D2a and is integrally connected to the end of the second basic circuit wiring section 121a; wherein, the second basic circuit wiring section 121a has a second length d2a in the first direction D1a, and has a second length d2a in the second direction D2a. has a seventh length d7a.

The printed conductive adhesive layer 2a includes a first printed conductive adhesive layer 21a and a second printed conductive adhesive layer 22a. The first printed conductive adhesive layer 21a includes a first basic adhesive conductive segment 211a. The first basic adhesive conductive segment 211a is overlaid and adhered to the middle of the first basic circuit wiring segment 111a, and has a diameter smaller than the first basic circuit wiring segment 111a in the first direction D1a. a third length d3a of a length d1a, and a sixth length d6a in the second direction D2a that is greater than the fifth length d5a. The second printed conductive adhesive layer 22a includes a second basic adhesive conductive segment 221a. The second basic adhesive conductive segment 221a is overlapped and adhered to the second basic circuit wiring segment 121a, and has a length less than the second length in the first direction D1a. a fourth length d4a of d2a, and an eighth length d8a in the second direction D2a that is greater than the seventh length d7a.

Based on the above, the first basic adhesive conductive segment 211a is used to adhere to a first electrode pin (not shown in the figure) of a light-emitting diode 200a, and the second basic adhesive conductive segment 221a is used to adhere to the light-emitting diode 200a. A second electrode pin (not shown in the figure) of the pole body 200a enables the circuit connected between the first printed circuit layer 11a and the second printed circuit layer 12a to conduct the light-emitting diode 200a.

Please refer to Figure 9. Figure 9 is a schematic plan view showing the printed circuit structure provided by the third preferred embodiment of the present invention. As shown in Figure 9, a printed circuit structure 100b includes a printed circuit layer 1b and a printed conductive adhesive layer 2b.

The printed circuit layer 1b includes a first printed circuit layer 11b and a second printed circuit layer 12b. The first printed circuit layer 11b includes a first basic circuit wiring segment 111b, the first basic circuit wiring segment 111b extends along a first direction D1b, and the first basic circuit wiring segment 111b is in a third direction perpendicular to the first direction D1b. There is a first length d1b in the two directions D2b.

The second printed circuit layer 12b includes a second basic circuit wiring section 121b. The second basic circuit wiring section 121b extends along the first direction D1b, and the second basic circuit wiring section 121b has a second length d2b in the second direction D2b. .

The printed conductive adhesive layer 2b includes a first printed conductive adhesive layer 21b and a second printed conductive adhesive layer 22b. The first printed conductive adhesive layer 21b includes a first basic adhesive conductive segment 211b and a first extended adhesive conductive segment 212b. The first basic adhesive conductive segment 211b extends along the second direction D2b and has a first adhesive conductive segment 212b in the second direction D2b. The third length d3b is greater than the first length d1b, and the first basic adhesive conductive segment 211b overlaps and adheres to the end of the first basic circuit wiring segment 111b in the middle. The first extended adhesive conductive section 212b extends along the first direction D1b and is integrally connected to the end of the first basic adhesive conductive section 211b.

The second printed conductive adhesive layer 22b includes a second basic adhesive conductive segment 221b and a second extended adhesive conductive segment 222b. The second basic adhesive conductive segment 221b extends along the second direction D2b and has a second adhesive conductive segment 221b in the second direction D2b. The fourth length d4b is greater than the second length d2b, and the second basic adhesive conductive section 221b overlaps and adheres to the end of the second basic circuit wiring section 121b in the middle. The second extended adhesive conductive section 222b extends along the first direction D1b and is integrally connected to the end of the second basic adhesive conductive section 221b.

Based on the above, the first extended adhesive conductive segment 212b is used to adhere to a light emitting diode. A first electrode pin 201b of the light emitting diode 200b, and the second extended adhesive conductive segment 222b is used to adhere to a second electrode pin 202b of the light emitting diode 200b, so that the first printed circuit layer 11b and the second printed circuit The circuit connected to layer 12b can conduct light emitting diode 200b. In addition, the printed circuit structure 100b of this embodiment is mainly composed of the first basic adhesive conductive segment 211b having a third length d3b greater than the first length d1b in the second direction D2b, and the second basic adhesive conductive segment 221b in the second direction D2b. The fourth length d4b in the direction D2b is greater than the second length d2b, so that when the printed conductive adhesive layer 2b is formed using a printing and coating process, there is room for error in the second direction D2b, effectively preventing the printing of the conductive adhesive layer. 2b cannot contact the printed circuit layer 1b due to the error, which relatively improves the manufacturing yield of the printed circuit structure 100b.

Please refer to Figure 10. Figure 10 is a schematic plan view showing a printed circuit structure provided by the fourth preferred embodiment of the present invention. As shown in Figure 10, a printed circuit structure 100c includes a printed circuit layer 1c and a printed conductive adhesive layer 2c.

The printed circuit layer 1c includes a first printed circuit layer 11c and a second printed circuit layer 12c. The first printed circuit layer 11c includes a first basic circuit wiring segment 111c, the first basic circuit wiring segment 111c extends along a first direction D1c, and the first basic circuit wiring segment 111c is in a third direction perpendicular to the first direction D1c. There is a first length d1c in the two directions D2c.

The second printed circuit layer 12c includes a second basic circuit wiring section 121c. The second basic circuit wiring section 121c extends along the first direction D1c, and the second basic circuit wiring section 121c has a second length d2c in the second direction D2c. .

The printed conductive adhesive layer 2c includes a first printed conductive adhesive layer 21c and a second printed conductive adhesive layer 22c. The first printed conductive adhesive layer 21c includes a first basic adhesive conductive segment 211c and a first extended adhesive conductive segment 212c. The first basic adhesive conductive segment 211c extends along the second direction D2c and has a first adhesive conductive segment 212c in the second direction D2c. The third length d3c is greater than the first length d1c, and the first basic adhesive conductive section 211c overlaps and adheres to the end of the first basic circuit wiring section 111c in the middle. The first extended adhesive conductive section 212c extends along the first direction D1c and is integrally connected to the first basic adhesive conductive section 211c. middle part.

The second printed conductive adhesive layer 22c includes a second basic adhesive conductive segment 221c and a second extended adhesive conductive segment 222c. The second basic adhesive conductive segment 221c extends along the second direction D2c and has a second adhesive conductive segment 221c in the second direction D2c. The fourth length d4c is greater than the second length d2c, and the second basic adhesive conductive segment 221c is overlapped and adhered to the end of the second basic circuit wiring segment 121c in the middle. The second extended adhesive conductive section 222c extends along the first direction D1c and is integrally connected to the middle of the second basic adhesive conductive section 221c.

Based on the above, the first extended adhesive conductive section 212c is used to adhere to the first electrode pin 201c of a light-emitting diode 200c, and the second extended adhesive conductive section 222c is used to adhere to the light-emitting diode 200c. A second electrode pin 202c is provided so that the circuit connected between the first printed circuit layer 11c and the second printed circuit layer 12c can conduct the light-emitting diode 200c.

In addition, the printed circuit structure 100c of this embodiment mainly has a third length d3c greater than the first length d1c in the second direction D2c through the first basic adhesive conductive segment 211c, and the second basic adhesive conductive segment 221c has a third length d3c in the second direction D2c. The fourth length d4c in the direction D2c is greater than the second length d2c, so that when the printed conductive adhesive layer 2c is formed using a printing and coating process, there is room for error in the second direction D2c, effectively preventing the printing of the conductive adhesive layer. 2c cannot contact the printed circuit layer 1c due to the error, which relatively improves the manufacturing yield of the printed circuit structure 100c.

Please refer to Figure 11. Figure 11 is a schematic plan view showing the printed circuit structure provided by the fifth preferred embodiment of the present invention. As shown in Figure 11, a printed circuit structure 100d includes a printed circuit layer 1d and a printed conductive adhesive layer 2d.

The printed circuit layer 1d includes a first printed circuit layer 11d and a second printed circuit layer 12d. The first printed circuit layer 11d includes a first basic circuit wiring segment 111d, the first basic circuit wiring segment 111d extends along a first direction D1d, and the first basic circuit wiring segment 111d is in a third direction perpendicular to the first direction D1d. There is a first length d1d in the two directions D2d. Among them, the first basic circuit wiring section 111d also has There is an edge 1111d.

The second printed circuit layer 12d includes a second basic circuit wiring section 121d, the second basic circuit wiring section 121d extends along the first direction D1d, and the second basic circuit wiring section 121d has a second length d2d in the second direction D2d. . Among them, the second basic circuit wiring segment 121d also has an edge 1211d.

The printed conductive adhesive layer 2d includes a first printed conductive adhesive layer 21d and a second printed conductive adhesive layer 22d. The first printed conductive adhesive layer 21d includes a first basic adhesive conductive segment 211d. The first basic adhesive conductive segment 211d extends along the second direction D2d and has a third length in the second direction D2d that is greater than the first length d1d. d3d, and the first basic adhesive conductive segment 211d is overlapped and adhered to the first basic circuit wiring segment 111d at a distance from the edge 1111d.

The second printed conductive adhesive layer 22d includes a second basic adhesive conductive segment 221d. The second basic adhesive conductive segment 221d extends along the second direction D2d and has a fourth length in the second direction D2d that is greater than the second length d2d. d4d, and the second basic adhesive conductive segment 221d is overlapped and adhered to the second basic circuit wiring segment 121d at a distance from the edge 1211d.

Based on the above, the first basic adhesive conductive segment 211d is used to adhere to the first electrode pin 201d of a light-emitting diode 200d, and the second basic adhesive conductive segment 221d is used to adhere to the light-emitting diode 200d. A second electrode pin 202d is provided so that the circuit connecting the first printed circuit layer 11d and the second printed circuit layer 12d can conduct the light-emitting diode 200d.

In addition, the printed circuit structure 100d of this embodiment is mainly composed of the first basic adhesive conductive segment 211d having a third length d3d greater than the first length d1d in the second direction D2d, and the second basic adhesive conductive segment 221d in the second direction D2d. The fourth length d4d in the direction D2d is greater than the second length d2d, so that when the printed conductive adhesive layer 2d is formed using a printing and coating process, there is room for error in the second direction D2d, effectively preventing the printed conductive adhesive layer from being printed. 2d cannot contact the printed circuit layer 1d due to the error, which relatively improves the manufacturing yield of the printed circuit structure 100d.

Please refer to Figure 12. Figure 12 shows the sixth preferred embodiment of the present invention. Schematic plan view of printed circuit structure. As shown in Figure 12, a printed circuit structure 100e includes a printed circuit layer 1e and a printed conductive adhesive layer 2e.

The printed circuit layer 1e includes a first printed circuit layer 11e and a second printed circuit layer 12e. The first printed circuit layer 11e includes a first basic circuit wiring segment 111e, the first basic circuit wiring segment 111e extends along a first direction D1e, and the first basic circuit wiring segment 111e has a first length in the second direction D2e. d1e. Among them, the first basic circuit wiring segment 111e also has an edge 1111e.

The second printed circuit layer 12e includes a second basic circuit wiring section 121e, the second basic circuit wiring section 121e extends along the first direction D1e, and the second basic circuit wiring section 121e has a second length d2e in the second direction D2e. . Among them, the second basic circuit wiring segment 121e also has an edge 1211e.

The printed conductive adhesive layer 2e includes a first printed conductive adhesive layer 21e and a second printed conductive adhesive layer 22e. The first printed conductive adhesive layer 21e includes a first basic adhesive conductive segment 211e and a first extended adhesive conductive segment 212e. The first basic adhesive conductive segment 211e extends along the second direction D2e and has a first adhesive conductive segment 212e in the second direction D2e. The third length d3e is greater than the first length d1e, and the first basic adhesive conductive segment 211e is overlapped and adhered to the first basic circuit wiring segment 111e at a distance from the edge 1111e. The first extended adhesive conductive section 212e extends along the first direction D1e and is integrally connected to the end of the first basic adhesive conductive section 211e.

The second printed conductive adhesive layer 22e includes a second basic adhesive conductive segment 221e and a second extended adhesive conductive segment 222e. The second basic adhesive conductive segment 221e extends along the second direction D2e, and has a second basic adhesive conductive segment 221e in the second direction D2e. The fourth length d4e is greater than the second length d2e, and the second basic adhesive conductive segment 221e is overlapped and adhered to the second basic circuit wiring segment 121e at a distance from the edge 1211e. The second extended adhesive conductive section 222e extends along the first direction D1e and is integrally connected to the end of the second basic adhesive conductive section 221e.

Based on the above, the first extended adhesive conductive section 212e is used to adhere to the first electrode pin 201e of a light-emitting diode 200e, and the second extended adhesive conductive section 222e is used to adhere to the light-emitting diode. A second electrode pin 202e of the body 200e is provided, so that the circuit connected between the first printed circuit layer 11e and the second printed circuit layer 12e can conduct the light-emitting diode 200e.

In addition, the printed circuit structure 100e of this embodiment is similar to the above-mentioned printed circuit structure 100d, mainly through the third length d3e greater than the first length d1e, and the fourth length d4e greater than the second length d2e, so that the printed circuit is conductive When the adhesive layer 2e is formed using a printing and coating process, it can have an allowable error space in the second direction D2e, effectively preventing the printed conductive adhesive layer 2e from being in contact with the printed circuit layer 1e due to errors, and relatively improving the printed circuit structure. Manufacturing yield of 100e.

Please refer to Figure 13. Figure 13 is a schematic plan view showing the printed circuit structure provided by the seventh preferred embodiment of the present invention. As shown in Figure 13, a printed circuit structure 100f includes a printed circuit layer 1f and a printed conductive adhesive layer 2f.

The printed circuit layer 1f includes a first printed circuit layer 11f and a second printed circuit layer 12f. The first printed circuit layer 11f includes a first basic circuit wiring segment 111f. The first basic circuit wiring segment 111f extends along a first direction D1f; wherein the first basic circuit wiring segment 111f extends in a direction perpendicular to the first direction D1f. The second direction D2f has a first length d1f.

The second printed circuit layer 12f includes a second basic circuit wiring section 121f. The second basic circuit wiring section 121f extends along the first direction D1f; wherein the second basic circuit wiring section 121f has a second length in the second direction D2f. d2f.

The printed conductive adhesive layer 2f includes a first printed conductive adhesive layer 21f and a second printed conductive adhesive layer 22f. The first printed conductive adhesive layer 21f includes a first basic adhesive conductive segment 211f, the first basic adhesive conductive segment 211f has a third length d3f greater than the first length d1f in the second direction D2f, and the first basic adhesive conductive segment 211f 211f is adhered to the first basic circuit wiring segment 111f.

The second printed conductive adhesive layer 22f includes a second basic adhesive conductive segment 221f, the second basic adhesive conductive segment 221f has a fourth length d4f greater than the second length d2f in the second direction D2f, and the second basic adhesive conductive segment 221f is adhered to the second basic circuit wiring segment 121f.

Based on the above, the first basic adhesive conductive segment 211f is used to adhere to one of the first electrode pins 201f of a light-emitting diode 200f, and the second basic adhesive conductive segment 221f is used to adhere to the light-emitting diode 200f. A second electrode pin 202f is provided so that the circuit connected between the first printed circuit layer 11f and the second printed circuit layer 12f can conduct the light-emitting diode 200f.

Among them, the printed circuit structure 100f of this embodiment is mainly formed by a third length d3f greater than the first length d1f, and a fourth length d4f greater than the second length d2f, so that the printed conductive adhesive layer 2f is formed using a printing coating process. When , there can be an error-tolerant space in the second direction D2f, effectively preventing the printed conductive adhesive layer 2f from being unable to contact the printed circuit layer 1f due to errors, and relatively improving the manufacturing yield of the printed circuit structure 100f.

Please refer to Figure 14. Figure 14 is a schematic plan view showing a printed circuit structure provided by the eighth preferred embodiment of the present invention. As shown in Figure 14, a printed circuit structure 100g includes a printed circuit layer 1g and a printed conductive adhesive layer 2g.

The printed circuit layer 1g includes three first printed circuit layers 11g, 12g and 13g and three second printed circuit layers 14g, 15g and 16g. The first printed circuit layer 11g includes a first basic circuit wiring section 111g and a first extended circuit wiring section 112g. The first basic circuit wiring section 111g extends along a first direction D1g, and the first extended circuit wiring section 112g extends along a first direction D1g. A second direction D2g that is perpendicular to the first direction D1g extends and is integrally connected to the middle of the first basic circuit wiring section 111g; wherein the first basic circuit wiring section 111g has a first length in the first direction D1g. (not shown in the figure), and has a fifth length (not shown in the figure) in the second direction D2g.

The first printed circuit layer 12g includes a first basic circuit wiring segment 121g and a first extended circuit wiring segment 122g, and the first printed circuit layer 13g includes a first basic circuit wiring segment 131g and a first extended circuit wiring segment 132g; Among them, since the structure of the first printed circuit layer 12g and 13g is similar to that of the first printed circuit layer 12g, no further description is given here.

The second printed circuit layer 14g includes a second basic circuit wiring segment 141g and a second extension The circuit wiring section 142g and the second basic circuit wiring section 141g extend along the first direction D1g, and the second extended circuit wiring section 142g extends along the second direction D2g; wherein, the second basic circuit wiring section 141g extends in the first direction D1g. It has a second length (not shown in the figure), and has a seventh length (not shown in the figure) in the second direction D2g.

The second printed circuit layer 15g includes a second basic circuit wiring segment 151g and a second extended circuit wiring segment 152g, and the second printed circuit layer 16g includes a second basic circuit wiring segment 161g and a second extended circuit wiring segment 162g; Among them, since the structures of the second printed circuit layers 15g and 16g are similar to the second printed circuit layer 14g, no further description is given here.

The printed conductive adhesive layer 2g includes three first printed conductive adhesive layers 21g, 22g and 23g and three second printed conductive adhesive layers 24g, 25g and 26g. The first printed conductive adhesive layer 21g includes a first basic adhesive conductive segment 211g and a first extended adhesive conductive segment 212g. The first basic adhesive conductive segment 211g extends along the second direction D2g and overlaps and adheres to the first basic circuit. The end of the wiring segment 111g has a third length (not shown in the figure) that is smaller than the first length in the first direction D1g. The first extended adhesive conductive section 212g extends along the first direction D1g and is integrally connected to the end of the first basic adhesive conductive section 211g.

The first printed conductive adhesive layer 22g includes a first basic adhesive conductive segment 221g. The first basic adhesive conductive segment 221g extends along the second direction D2g and overlaps and adheres to the end of the first basic circuit wiring segment 121g. The first direction D1g has a third length (not shown in the figure) that is smaller than the first length of the first basic circuit wiring segment 121g.

The first printed conductive adhesive layer 23g includes a first basic adhesive conductive segment 231g and a first extended adhesive conductive segment 232g. The first basic adhesive conductive segment 231g extends along the second direction D2g and overlaps and adheres to the first basic circuit. The end of the wiring segment 131g has a third length (not shown in the figure) that is smaller than the first length of the first basic circuit wiring segment 131g in the first direction D1g. The first extended adhesive conductive section 232g extends along the first direction D1g and is integrally connected to the end of the first basic adhesive conductive section 231g. department. Among them, the first printed conductive adhesive layer 21g and the first printed conductive adhesive layer 23g have similar structures. The only difference is that the first extended adhesive conductive section 212g and the first extended adhesive conductive section 232g are respectively connected to the first basic adhesive conductive section 211g. The side opposite to the first basic adhesive conductive segment 231g allows the first extended adhesive conductive segment 212g and the first extended adhesive conductive segment 232g to respectively extend to both sides of the first basic adhesive conductive segment 221g.

The second printed conductive adhesive layer 24g includes a second basic adhesive conductive segment 241g and a second extended adhesive conductive segment 242g. The second basic adhesive conductive segment 241g extends along the second direction D2g and adheres to the second basic circuit wiring segment. 141g, and the second basic adhesive conductive segment 241g has a fourth length (not shown in the figure) that is less than the second length in the first direction D1g.

The second printed conductive adhesive layer 25g includes a second basic adhesive conductive segment 251g, and the second printed conductive adhesive layer 26g includes a second basic adhesive conductive segment 261g and a second extended adhesive conductive segment 262g; wherein, due to the second printed conductive segment The adhesive layers 24g, 25g and 26g in Figure 14 have similar structures that are vertically opposite to the first printed conductive adhesive layers 21g, 22g and 23g respectively. Therefore, those with ordinary knowledge in the technical field should refer to the first printed conductive adhesive layer. The description of layers 21g, 22g and 23g or the relevant description of the above embodiments can be easily understood, so no further description is given here.

Based on the above, in this embodiment, the first printed conductive adhesive layers 21g and 23g can be extended to both of the first base adhesive conductive segments 221g through the first extended adhesive conductive segments 212g and the first extended adhesive conductive segments 232g. side, and the second printed conductive adhesive layers 24g and 26g can also be extended to both sides of the second basic adhesive conductive segment 251g by the second extended adhesive conductive segment 242g and the second extended adhesive conductive segment 262g, so the first extended adhesive conductive segment The segment 212g, the first basic adhesive conductive segment 221g and the first extended adhesive conductive segment 232g can be respectively used to bond the three first electrode pins 201g, 202g and 203g of a light-emitting diode 200g. Similarly, the second extended adhesive The conductive section 242g, the second basic adhesive conductive section 251g and the second extended adhesive conductive section 262g can be respectively used to adhere the three second electrode pins 204g, 205g and 206g of the light-emitting diode 200g, thereby making the light-emitting diode 200g It can be achieved by the first printed conductive adhesive layer 21g, 22g and 23g are electrically connected to the first printed circuit layers 11g, 12g and 13g respectively, and are electrically connected to the second printed circuit layers 14g, 15g and 16g respectively through the second printed conductive adhesive layers 24g, 25g and 26g, and then Turn on LED 200g.

In addition, since the first lengths of the first basic circuit wiring sections 111g, 121g and 131g in the first direction D1g are all larger than the first basic adhesive conductive section 211g, the first basic adhesive conductive section 221g and the first basic adhesive conductive section 231g, The third length in one direction D1g and the second length of the second basic circuit wiring segments 141g, 151g and 161g in the first direction D1g are also larger than the second basic adhesive conductive segment 241g, the second basic adhesive conductive segment 251g and the second basic circuit wiring segment 141g, 151g and 161g. The basic adhesive conductive segment 261g is the fourth length in the first direction D1g, so that the entire printed conductive adhesive layer 2g can have an allowable error range in the printing process in the first direction D1g, thereby effectively preventing the printed conductive adhesive layer 2g from errors. The printed circuit layer 1g cannot be contacted, which relatively improves the manufacturing yield of the printed circuit structure 100g.

As shown in the third figure and the fourteenth figure, the gap between the first printed circuit layer 11g, the second printed circuit layer 14g, the first printed conductive adhesive layer 21g and the second printed conductive adhesive layer 24g in the printed circuit structure 100g The connection relationship is similar to the connection relationship between the first printed circuit layer 11, the second printed circuit layer 12, the first printed conductive adhesive layer 21 and the second printed conductive adhesive layer 22 in the printed circuit structure 100, which means that in other implementations For example, the first printed conductive adhesive layer 21 may further include a first extended adhesive conductive segment (not shown) corresponding to the first extended adhesive conductive segment 212g, so that the first extended adhesive conductive segment is formed from the first base adhesive conductive segment 211 The middle or end portion of the second printed conductive adhesive layer 22 may be integrally formed and extend along the first direction D1, and the second printed conductive adhesive layer 22 may further include a second extended adhesive conductive segment (not shown) equivalent to the second extended adhesive conductive segment 242g, so that the second extended adhesive conductive segment 242g The two extended adhesive conductive sections extend integrally from the middle or end of the second basic adhesive conductive section 221 along the first direction D1, and the first electrode pin of the light-emitting diode 200 can be adhered to the first extended adhesive conductive section, The second electrode pin of the light-emitting diode 200 can be adhered to the second extended adhesive conductive section.

Please refer to Figure 15. Figure 15 shows the ninth preferred embodiment of the present invention. Schematic plan view of printed circuit structure. As shown in Figure 15, a printed circuit structure 100h includes a printed circuit layer 1h and a printed conductive adhesive layer 2h.

The printed circuit layer 1h includes three first printed circuit layers 11h, 12h and 13h and three second printed circuit layers 14h, 15h and 16h. The first printed circuit layer 11h includes a first basic circuit wiring segment 111h and a first extended circuit wiring segment 112h, and the first printed circuit layer 12h includes a first basic circuit wiring segment 121h and a first extended circuit wiring segment 122h, The first printed circuit layer 13h includes a first basic circuit wiring section 131h and a first extended circuit wiring section 132h; wherein the first printed circuit layers 11h, 12h and 13h are the same as the first printed circuit layers 11g and 12g of the above embodiment. The structure is similar to that of 13g, so I won’t go into details here.

The second printed circuit layer 14h includes a second basic circuit wiring segment 141h extending along the second direction D2h. The second printed circuit layer 15h includes a second basic circuit wiring segment 151h extending along the second direction D2h. The second printed circuit layer 14h includes a second basic circuit wiring segment 141h extending along the second direction D2h. Layer 16h includes a second basic circuit wiring segment 161h extending along the second direction D2h. Among them, the second basic circuit wiring segments 141h, 151h and 161h have a wiring area length dah in the first direction D1h; more specifically, the wiring area length dah refers to the second basic circuit wiring segments 141h, 151h and 161h. The length enclosed by the edges of the two opposite sides means that the second basic circuit wiring segment 141h is relative to the other edge of the second basic circuit wiring segment 151h to the second basic circuit wiring segment 161h is relative to the second basic circuit. The other edge of the wiring segment 151h is equivalent to the sum of the lengths of the second basic circuit wiring segments 141h, 151h and 161h in the first direction D1h and the gaps between them.

The printed conductive adhesive layer 2h includes three first printed conductive adhesive layers 21h, 22h and 23h and a second printed conductive adhesive layer 24h.

The first printed conductive adhesive layer 21h includes a first basic adhesive conductive segment 211h and a first extended adhesive conductive segment 212h. The first printed conductive adhesive layer 22h includes a first basic adhesive conductive segment 221h. The first printed conductive adhesive layer 23h It includes a first basic adhesive conductive segment 231h and a first extended adhesive conductive segment 232h; among them, since the first printed conductive adhesive layers 21h, 22h and 23h have similar structures to the above-mentioned first printed conductive adhesive layers 21g, 22g and 23g , so the first printed conductive adhesive layer 21h, 22h For the description of the structure of the first printed conductive adhesive layer 21g, 23g and 23g, please refer to the above description of the structure of the first printed conductive adhesive layer 21g, 22g and 23g, and will not be repeated here.

The second printed conductive adhesive layer 24h extends along the first direction D1h, and has a second length (not shown in the figure) greater than the wiring area length dah in the first direction D1h, whereby the second printed conductive adhesive layer 24h The second basic circuit wiring segments 141h, 151h, and 161h may be adhered to the second basic circuit wiring segments 141h, 151h, and 161h respectively.

In this embodiment, the first extended adhesive conductive section 212h, the first basic adhesive conductive section 221h and the first extended adhesive conductive section 232h are respectively used to adhere the three first electrode pins 201h, 201h and 201h of a light-emitting diode 200h. 202h and 203h, and the second printed conductive adhesive layer 24h is used to adhere to the three second electrode pins 204h, 205h and 206h of the light-emitting diode 200h, so that the light-emitting diode 200h can be printed by the conductive adhesive layer 2h is electrically connected to the printed circuit layer 1h; among them, since the second printed conductive adhesive layer 24h is adhered to the second basic circuit wiring segments 141h, 151h and 161h respectively, the second printed conductive adhesive layer 24h is relative to the light emitting diode 200h. Can be used as a common cathode or common anode pin.

As mentioned above, since the first lengths of the first basic circuit wiring sections 111h, 121h and 131h in the first direction D1h are all larger than the first basic adhesive conductive section 211h, the first basic adhesive conductive section 221h and the first basic adhesive conductive section 231h At the third length in the first direction D1h, at the same time, the second printed conductive adhesive layer 24h spans the second basic circuit wiring segments 141h, 151h and 161h in the first direction D1h, so that the entire printed conductive adhesive layer 2h can be in the first direction D1h. The direction D1h has an allowable error range in the printing process, thereby effectively preventing the printed conductive adhesive layer 2h from being in contact with the printed circuit layer 1h due to errors, and relatively improving the manufacturing yield of the printed circuit structure 100h.

To sum up, compared with the previous technology that uses a conductive adhesive layer to conductively connect the light-emitting diode to the printed circuit layer, the conductive adhesive layer is often coated and formed on the printed circuit layer through screen printing. , which in turn causes the conductive adhesive layer to easily deviate from the printed circuit layer due to printing errors; the present invention mainly uses any one of the first basic circuit wiring section and the first basic adhesive conductive section to The length in one direction is greater than the length of the other in the first direction, and the length of any one of the second basic circuit wiring segment and the second basic adhesive conductive segment in the first direction is greater than the length of the other in the first direction. The length of the first basic adhesive conductive segment will create an allowable error space in the first direction when the first basic adhesive conductive segment is formed by the coating process, thereby effectively preventing the printed conductive adhesive layer from being unable to contact the printed circuit layer due to errors. Relatively Improve the manufacturing yield of printed circuit structures.

Through the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be more clearly described, but the scope of the present invention is not limited by the above disclosed preferred embodiments. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the patent for which the present invention is intended.

100:Printed circuit structure

1:Printed circuit layer

11: First printed circuit layer

111: First basic circuit wiring section

112: First extension circuit wiring segment

12: Second printed circuit layer

121: Second basic circuit wiring segment

122: Second extension circuit wiring segment

2: Print conductive adhesive layer

21: First printed conductive adhesive layer

211: First basic adhesive conductive segment

22: Second printed conductive adhesive layer

221: Second basic adhesive conductive segment

200:Light emitting diode

D1: first direction

D2: second direction

d1: first length

d2: second length

d3: third length

d4: fourth length

d5: fifth length

d6: sixth length

d7: seventh length

d8: the eighth length

Claims (16)

A printed circuit structure includes: a light-emitting diode having a pair of electrode pins arranged along a first direction; a first printed circuit layer including a first basic circuit wiring segment extending along the first direction, the A first basic circuit wiring segment has a first length in the first direction; a second printed circuit layer including a second basic circuit wiring segment extending along the first direction; a first printed conductive adhesive layer including a first basic adhesive conductive segment, the first basic adhesive conductive segment extends along a second direction perpendicular to the first direction, and the first basic adhesive conductive segment is adhered to the first basic circuit wiring segment; and a The second printed conductive adhesive layer includes a second basic adhesive conductive segment, and the second basic adhesive conductive segment is adhered to the second basic circuit wiring segment; wherein the first printed conductive adhesive layer and the second printed conductive adhesive The layers are respectively used to adhere the pair of electrode pins, and the overlapping position of the first basic adhesive conductive segment and the first basic circuit wiring segment does not overlap with the orthographic projection of the light-emitting diode; wherein, the first basic The circuit wiring segment has a fifth length in the second direction, and the first length of the first basic circuit wiring segment in the first direction is greater than the fifth length in the second direction. The printed circuit structure of claim 1, wherein the first printed circuit layer further includes a first extended circuit wiring section, the first extended circuit wiring section extends along the second direction, and the first extended circuit wiring section The wiring section is integrally connected to the first basic circuit wiring section. The printed circuit structure of claim 2, wherein the first extension circuit wiring section is integrally connected to the middle or end of the first basic circuit wiring section. The printed circuit structure of claim 1, wherein the light-emitting diode corresponds to one of the keycaps of a keyboard module. The printed circuit structure of claim 1, wherein the second basic circuit wiring segment is The first direction has a second length, and the second direction has a seventh length, and the second length is greater than the seventh length. The printed circuit structure of claim 1, wherein the first basic adhesive conductive segment has a sixth length in the second direction that is greater than the fifth length. The printed circuit structure of claim 1, wherein the first basic circuit wiring segment has an edge, and the first basic adhesive conductive segment is bonded to the first basic circuit wiring segment at a distance from the edge. A printed circuit structure includes: a light-emitting diode having a pair of electrode pins arranged along a second direction; a first printed circuit layer including a first basic circuit wiring segment extending along a first direction, the A first basic circuit wiring segment has a first length in the second direction, the second direction is perpendicular to the first direction; a second printed circuit layer includes a second basic circuit wiring segment extending along the first direction ; A first printed conductive adhesive layer, including a first basic adhesive conductive segment, the first basic adhesive conductive segment extends along the second direction, and has a third length in the second direction that is greater than the first length. length, and the first basic adhesive conductive segment is adhered to the first basic circuit wiring segment; and a second printed conductive adhesive layer includes a second basic adhesive conductive segment, and the second basic adhesive conductive segment is adhered to the first basic circuit wiring segment; Two basic circuit wiring sections; wherein the first printed conductive adhesive layer and the second printed conductive adhesive layer are respectively used to adhere to the pair of electrode pins, and the first basic adhesive conductive section and the first basic circuit cloth The overlapping position of the line segment does not overlap with the orthographic projection of the light-emitting diode; wherein the third length of the first basic adhesive conductive segment along the second direction is greater than the first basic circuit wiring segment in the second direction the first length on. The printed circuit structure of claim 8, wherein the first printed conductive adhesive layer further includes a first extended adhesive conductive segment, the first extended adhesive conductive segment extends along the first direction, and the first extension The adhesive conductive section is integrally connected to the first basic adhesive conductive section, and the first electrode pin of the light-emitting diode is adhered to the first extended adhesive conductive section. The printed circuit structure of claim 9, wherein the first extended adhesive conductive section is integrally connected to the middle or end of the first basic adhesive conductive section. The printed circuit structure of claim 8, wherein the first basic circuit wiring segment has an edge, and the first basic adhesive conductive segment is bonded to the first basic circuit wiring segment at a distance from the edge. A printed circuit structure includes: a light-emitting diode having a plurality of counter electrode pins arranged along a second direction; a plurality of first printed circuit layers, each of the first printed circuit layers including a pair of electrode pins arranged along a first direction. An extended first basic circuit wiring segment, the first basic circuit wiring segment has a first length in the first direction; a plurality of second printed circuit layers, each of the second printed circuit layers includes a strip along the first direction. A second basic circuit wiring segment extending in one direction; a plurality of first printed conductive adhesive layers, each of the first printed conductive adhesive layers including a first basic adhesive extending in a second direction perpendicular to the first direction conductive segments, and the first basic adhesive conductive segments of the first printed conductive adhesive layers are respectively adhered to the first basic circuit wiring segments of the first printed circuit layers; and a plurality of second printed conductive adhesive layers, Each of the second printed conductive adhesive layers includes a second basic adhesive conductive segment extending along the second direction, and the second basic adhesive conductive segments of the second printed conductive adhesive layers are respectively adhered to the plurality of second basic adhesive conductive segments. The second basic circuit wiring segment of the second printed circuit layer; Wherein, each of the first printed conductive adhesive layers and each of the second printed conductive adhesive layers are respectively used to adhere to each of the pair of electrode pins, and each of the first basic adhesive conductive segments and each of the first basic circuit wiring segments The overlapping position does not overlap with the orthographic projection of the light-emitting diode; wherein the first basic circuit wiring segment has a fifth length in the second direction, and at least one of the first basic circuit wiring segments is in the first The first length in the direction is greater than the fifth length in the second direction. The printed circuit structure of claim 12, wherein each of the first printed circuit layers further includes a first extended circuit wiring segment, the first extended circuit wiring segment extends along the second direction, and the third An extended circuit wiring section is integrally connected to the first basic circuit wiring section. The printed circuit structure of claim 13, wherein the first extension circuit wiring section is integrally connected to the middle of the first basic circuit wiring section. The printed circuit structure of claim 12, wherein at least one of the first printed conductive adhesive layers further includes a first extended adhesive conductive segment, and the first extended adhesive conductive segment extends along the first direction, And the first extended adhesive conductive section is integrally connected to the corresponding first basic adhesive conductive section, and at least one of the first electrode pins of the light-emitting diode is adhered to the first extended adhesive conductive section. part. The printed circuit structure of claim 15, wherein the first extended adhesive conductive section is integrally connected to the corresponding end of the first basic adhesive conductive section.