TWI819631B - Image sensing device - Google Patents
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Abstract
Description
本案涉及一種感測裝置。詳細而言,本案涉及一種影像感測裝置。This case involves a sensing device. Specifically, this case involves an image sensing device.
現有光感測器中之PIN型二極體所感測之亮度為7勒克斯(lux)以上。PIN型二極體之特點在於感測靈敏度高。但處於低亮度的光源下,PIN型二極體感測所產生的光電流較小,較難用以讀取暗態成像。The brightness sensed by the PIN diode in the existing light sensor is above 7 lux. PIN type diodes are characterized by high sensing sensitivity. However, under low-brightness light sources, the photocurrent generated by PIN-type diode sensing is small, making it difficult to read dark-state imaging.
因此,上述技術尚存諸多缺陷,而有待本領域從業人員研發出其餘適合的電路設計。Therefore, the above technology still has many shortcomings, and practitioners in the field need to develop other suitable circuit designs.
本案的一面向涉及一種影像感測裝置。影像感測裝置包含第一感測電路、第二感測電路、讀取電路及影像處理電路。第一感測電路用以於第一階段進行光感測,以獲得第一影像訊號。第二感測電路用以於第二階段進行光感測,以獲得第二影像訊號。第一階段之曝光時間大於第二階段之曝光時間。讀取電路耦接於第一感測電路及第二感測電路。讀取電路用以於第一階段之子階段讀取第一影像訊號,且用以於第二階段之子階段讀取第二影像訊號。影像處理電路耦接於讀取電路,並用以根據第一影像訊號及第二影像訊號產生第三影像訊號。One aspect of this case involves an image sensing device. The image sensing device includes a first sensing circuit, a second sensing circuit, a reading circuit and an image processing circuit. The first sensing circuit is used for light sensing in the first stage to obtain the first image signal. The second sensing circuit is used for light sensing in the second stage to obtain the second image signal. The exposure time of the first stage is longer than the exposure time of the second stage. The reading circuit is coupled to the first sensing circuit and the second sensing circuit. The reading circuit is used to read the first image signal in a sub-stage of the first stage, and is used to read the second image signal in a sub-stage of the second stage. The image processing circuit is coupled to the reading circuit and used to generate a third image signal based on the first image signal and the second image signal.
本案的另一面向涉及一種影像感測裝置。影像感測裝置包含第一感測器、第二感測器及影像處理電路。第一感測器用以於進行光感測,以獲得第一影像訊號。第二感測器用以於進行光感測,以獲得第二影像訊號。影像處理電路耦接於第一感測器及第二感測器,並用以同時讀取第一影像訊號及第二影像訊號,藉以產生第三影像訊號。Another aspect of this case involves an image sensing device. The image sensing device includes a first sensor, a second sensor and an image processing circuit. The first sensor is used for light sensing to obtain a first image signal. The second sensor is used for light sensing to obtain a second image signal. The image processing circuit is coupled to the first sensor and the second sensor, and is used to simultaneously read the first image signal and the second image signal to generate a third image signal.
以下將以圖式及詳細敘述清楚說明本案之精神,任何所屬技術領域中具有通常知識者在瞭解本案之實施例後,當可由本案所教示之技術,加以改變及修飾,其並不脫離本案之精神與範圍。The following will clearly illustrate the spirit of this application with drawings and detailed descriptions. Anyone with ordinary knowledge in the technical field, after understanding the embodiments of this application, can make changes and modifications based on the techniques taught in this application without departing from the spirit of this application. Spirit and scope.
本文之用語只為描述特定實施例,而無意為本案之限制。單數形式如“一”、“這”、“此”、“本”以及“該”,如本文所用,同樣也包含複數形式。The terms used herein are only used to describe specific embodiments and are not intended to be limiting. Singular forms such as "a", "this", "this", "this" and "the", as used herein, also include the plural forms.
關於本文中所使用之『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意指包含但不限於。The words "includes", "includes", "has", "contains", etc. used in this article are all open terms, which mean including but not limited to.
關於本文中所使用之用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在本案之內容中與特殊內容中的平常意義。某些用以描述本案之用詞將於下或在此說明書的別處討論,以提供本領域技術人員在有關本案之描述上額外的引導。Regarding the terms used in this article, unless otherwise noted, they generally have the ordinary meanings of each term used in this field, the content of this case, and the special content. Certain terms used to describe the present invention are discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance in describing the present invention.
在一些實施例中,為使本案影像感測裝置100之操作易於理解,請一併參閱第1圖及第2圖,影像感測裝置100包含第一感測電路110、第二感測電路120、讀取電路130及影像處理電路140。In some embodiments, in order to make the operation of the image sensing device 100 in this case easy to understand, please refer to Figure 1 and Figure 2 together. The image sensing device 100 includes a first sensing circuit 110 and a second sensing circuit 120 , reading circuit 130 and image processing circuit 140.
在一些實施例中,第一感測電路110用以於第一階段I1進行光感測,以獲得第一影像訊號Vo1。第二感測電路120用以於第二階段I2進行光感測,以獲得第二影像訊號Vo2。第一階段I1之第一曝光時間(例如:第一子階段I11)大於第二階段I2之第二曝光時間(例如:第三子階段I21)。讀取電路130耦接於第一感測電路110及第二感測電路120。In some embodiments, the first sensing circuit 110 is used to perform light sensing in the first stage I1 to obtain the first image signal Vo1. The second sensing circuit 120 is used for light sensing in the second stage I2 to obtain the second image signal Vo2. The first exposure time of the first stage I1 (for example: the first sub-stage I11) is greater than the second exposure time of the second stage I2 (for example: the third sub-stage I21). The reading circuit 130 is coupled to the first sensing circuit 110 and the second sensing circuit 120 .
接著,讀取電路130用以於第一階段I1之子階段(例如:第二子階段I12)讀取第一影像訊號Vo1,且用以於第二階段I2之子階段(例如:第四子階段I22)讀取第二影像訊號Vo2。影像處理電路140耦接於讀取電路130,並用以於根據第一影像訊號Vo1及第二影像訊號Vo2產生第三影像訊號。須說明的是,第一階段I1之第一子階段I11及第二階段I2之第三子階段I13為感測階段(或稱曝光階段)。第一階段I1之第二子階段I12及第二階段I2之第四子階段I22為讀取階段。Then, the reading circuit 130 is used to read the first image signal Vo1 in a sub-stage of the first stage I1 (for example: the second sub-stage I12), and is used to read the first image signal Vo1 in a sub-stage of the second stage I2 (for example: the fourth sub-stage I22 ) reads the second image signal Vo2. The image processing circuit 140 is coupled to the reading circuit 130 and used to generate a third image signal according to the first image signal Vo1 and the second image signal Vo2. It should be noted that the first sub-stage I11 of the first stage I1 and the third sub-stage I13 of the second stage I2 are sensing stages (or exposure stages). The second sub-phase I12 of the first phase I1 and the fourth sub-phase I22 of the second phase I2 are read phases.
在一些實施例中,請參閱第1圖及第2圖,影像感測裝置100更包含資料線D1、傳輸第一閘極訊號G1之第一閘極線、傳輸第二閘極訊號G2的第二閘極線、傳輸第一共訊號COM1之第一共訊號線及傳輸第二共訊號COM2之第二共訊號線。In some embodiments, please refer to Figures 1 and 2, the image sensing device 100 further includes a data line D1, a first gate line transmitting the first gate signal G1, and a third gate line transmitting the second gate signal G2. Two gate lines, a first common signal line transmitting the first common signal COM1 and a second common signal line transmitting the second common signal COM2.
在一些實施例中,資料線D1耦接於第一感測電路110、第二感測電路120及讀取電路130,並用以傳送第一影像訊號Vo1及第二影像訊號Vo2至讀取電路130。In some embodiments, the data line D1 is coupled to the first sensing circuit 110 , the second sensing circuit 120 and the reading circuit 130 , and is used to transmit the first image signal Vo1 and the second image signal Vo2 to the reading circuit 130 .
在一些實施例中,傳輸第一閘極訊號G1之第一閘極線及傳輸第一共訊號COM1之第一共訊號線耦接於第一感測電路110。In some embodiments, the first gate line transmitting the first gate signal G1 and the first common signal line transmitting the first common signal COM1 are coupled to the first sensing circuit 110 .
在一些實施例中,傳輸第二閘極訊號G2的第二閘極線及傳輸第二共訊號COM2之第二共訊號線耦接於第二感測電路120。In some embodiments, the second gate line transmitting the second gate signal G2 and the second common signal line transmitting the second common signal COM2 are coupled to the second sensing circuit 120 .
在一些實施例中,第一感測裝置110包含感光二極體PIN1、第一電容Cdiode及第一讀取電晶體R1。In some embodiments, the first sensing device 110 includes a photosensitive diode PIN1, a first capacitor Cdiode and a first reading transistor R1.
在一些實施例中,請參閱第1圖及第2圖,感光二極體PIN1用以於第一階段I1進行光感測,以產生第一影像訊號Vo1。第一電容Cdiode耦接於感光二極體PIN1,並用以儲存第一影像訊號Vo1。第一讀取電晶體R1耦接於感光二極體PIN1及第一電容Cdiode,並用以讀取第一影像訊號至資料線D1。In some embodiments, please refer to Figures 1 and 2, the photodiode PIN1 is used for light sensing in the first stage I1 to generate the first image signal Vo1. The first capacitor Cdiode is coupled to the photosensitive diode PIN1 and used to store the first image signal Vo1. The first reading transistor R1 is coupled to the photosensitive diode PIN1 and the first capacitor Cdiode, and is used to read the first image signal to the data line D1.
在一些實施例中,感光二極體PIN1可為PIN型二極體(或稱移相開關二極體)。在一些實施例中,感光二極體PIN1之感測時間(或稱曝光時間)通常為10ms。感光二極體PIN1所感測之亮度為7勒克斯(lux)以上。感光二極體PIN1之特點在於感測靈敏度高。但處於低亮度的光源下,感光二極體PIN1感測所產生的光電流較小,較難用以讀取暗態成像。In some embodiments, the photosensitive diode PIN1 may be a PIN-type diode (or phase-shifted switching diode). In some embodiments, the sensing time (or exposure time) of the photodiode PIN1 is generally 10 ms. The brightness sensed by the photodiode PIN1 is above 7 lux. The photodiode PIN1 is characterized by high sensing sensitivity. However, under a low-brightness light source, the photocurrent generated by the photosensitive diode PIN1 is small, making it difficult to read dark-state imaging.
須說明的是,感光二極體PIN1可讀取暗態成像,但須要將感光二極體PIN1之感測時間(或稱曝光時間)拉長至1秒(s),才能讀取低亮度之暗態成像。 It should be noted that the photosensitive diode PIN1 can read dark-state imaging, but the sensing time (or exposure time) of the photosensitive diode PIN1 needs to be extended to 1 second (s) to read low-brightness images. Dark state imaging.
在一些實施例中,請參閱第1圖及第2圖,第二感測電路120包含感光電晶體T1、第二電容Cst及第二讀取電晶體R2。感光電晶體T1用以於第二階段I2進行光感測,以產生第二影像訊號Vo2。第二電容Cst耦接於感光電晶體T1,並用以儲存第二影像訊號Vo2。第二讀取電晶體R2耦接於感光電晶體T1及第二電容Cst,並用以讀取第二影像訊號Vo2至資料線D1。 In some embodiments, please refer to FIGS. 1 and 2 , the second sensing circuit 120 includes a phototransistor T1 , a second capacitor Cst and a second reading transistor R2 . The photosensitive transistor T1 is used for light sensing in the second stage I2 to generate the second image signal Vo2. The second capacitor Cst is coupled to the photosensitive transistor T1 and used to store the second image signal Vo2. The second reading transistor R2 is coupled to the photosensitive transistor T1 and the second capacitor Cst, and is used to read the second image signal Vo2 to the data line D1.
在一些實施例中,請參閱第1圖及第2圖,感光電晶體T1可為間隙型薄膜電晶體(Gap type TFT)。在一些實施例中,感光電晶體T1之感測時間(或稱曝光時間)通常為10ms以內。感光電晶體T1所感測之亮度可為7勒克斯(lux)以下。感光電晶體T1之特點在於感測之光電流數值較高,且感光電晶體T1之結構面積小。處於低亮度的光源下,感光電晶體T1之感測時間(或稱曝光時間)可相較於PIN型二極體(或稱移相開關二極體)之感測時間(或稱曝光時間)短。 In some embodiments, please refer to FIGS. 1 and 2 , the photosensitive transistor T1 may be a gap type thin film transistor (Gap type TFT). In some embodiments, the sensing time (or exposure time) of the photosensitive transistor T1 is usually within 10 ms. The brightness sensed by the photosensitive transistor T1 can be below 7 lux. The photosensitive transistor T1 is characterized by a high photocurrent value sensed and a small structural area of the photosensitive transistor T1. Under a low-brightness light source, the sensing time (or exposure time) of the photosensitive transistor T1 can be compared to the sensing time (or exposure time) of a PIN diode (or phase-shift switching diode) short.
須說明的是,藉由感光二極體PIN1所獲得的第一影像訊號Vo1為低曝光影像。藉由感光電晶體T1所獲得的第二影像訊號Vo2為高曝光影像。 It should be noted that the first image signal Vo1 obtained by the photosensitive diode PIN1 is a low-exposure image. The second image signal Vo2 obtained by the photosensitive transistor T1 is a high-exposure image.
在一些實施例中,讀取電路130可為積分電路。讀取電路130根據控制訊號CLR及參考電壓Vref用以讀取第一影像訊號Vo1及第二影像訊號Vo2後,藉以對第一影像訊號Vo1及第二影像訊號Vo2作波形轉換或積 分補償。 In some embodiments, read circuit 130 may be an integrating circuit. The reading circuit 130 reads the first image signal Vo1 and the second image signal Vo2 according to the control signal CLR and the reference voltage Vref, and then performs waveform conversion or product integration on the first image signal Vo1 and the second image signal Vo2. points compensation.
在一些實施例中,影像處理電路140採用高動態範圍影像技術(High Dynamic Range Imaging,HDR)將不同影像曝光度的第一影像訊號Vo1及第二影像訊號Vo2疊合成對比度較高的第三影像訊號(圖中未示)。 In some embodiments, the image processing circuit 140 uses high dynamic range imaging technology (High Dynamic Range Imaging, HDR) to superimpose the first image signal Vo1 and the second image signal Vo2 with different image exposures into a third image with higher contrast. signal (not shown in the picture).
第3圖為根據本案一些實施例繪示的影像感測裝置100之結構示意圖。在一些實施例中,請參閱第3圖,由於本案整合感光二極體PIN1及感光電晶體T1於一個感測畫素上,以進行影像感測(或稱為曝光)。因此,感光電晶體T1需耦接第二電容Cst,進而造成結構設計上壓縮感光二極體PIN1之空間。R1對應到影像感測裝置100之第一感測電路110之第一讀取電晶體。R2對應到影像感測裝置100之第二感測電路120之第二讀取電晶體。M1、M2及M3分別為不同金屬層。B為影像感測裝置100之玻璃基板。 Figure 3 is a schematic structural diagram of the image sensing device 100 according to some embodiments of the present invention. In some embodiments, please refer to Figure 3, because this case integrates the photosensitive diode PIN1 and the photosensitive transistor T1 on one sensing pixel to perform image sensing (or exposure). Therefore, the photosensitive transistor T1 needs to be coupled to the second capacitor Cst, which results in compressed space for the photosensitive diode PIN1 in structural design. R1 corresponds to the first reading transistor of the first sensing circuit 110 of the image sensing device 100 . R2 corresponds to the second reading transistor of the second sensing circuit 120 of the image sensing device 100 . M1, M2 and M3 are different metal layers respectively. B is the glass substrate of the image sensing device 100 .
第4圖為根據本案一些實施例繪示的影像感測裝置100A之電路方塊示意圖。第5圖為根據本案一些實施例繪示的影像感測裝置100A之訊號時序示意圖。在一些實施例中,第1圖之影像感測裝置100與第4圖之影像感測裝置100A之間的差異在於第一感測電路110A與第二感測電路120A共用一個電容Cdiode2。 Figure 4 is a circuit block diagram of the image sensing device 100A according to some embodiments of the present invention. Figure 5 is a signal timing diagram of the image sensing device 100A according to some embodiments of the present invention. In some embodiments, the difference between the image sensing device 100 in Figure 1 and the image sensing device 100A in Figure 4 is that the first sensing circuit 110A and the second sensing circuit 120A share a capacitor Cdiode2.
影像感測裝置100A包含第一感測電路110A、第二感測電路120A、讀取電路130A及影像處理電路140A。 The image sensing device 100A includes a first sensing circuit 110A, a second sensing circuit 120A, a reading circuit 130A, and an image processing circuit 140A.
在一些實施例中,第一感測電路110A用以於第一階段I1進行光感測,以獲得第一影像訊號Vo1。第二感測電路120A用以於第二階段I2進行光感測,以獲得第二影像訊號Vo2。第一階段I1之曝光時間(例如:第一子階段I11)大於第二階段I2之曝光時間(例如:第三子階段I21)。讀取電路130A耦接於第一感測電路110A及第二感測電路120A。 In some embodiments, the first sensing circuit 110A is used to perform light sensing in the first stage I1 to obtain the first image signal Vo1. The second sensing circuit 120A is used for light sensing in the second stage I2 to obtain the second image signal Vo2. The exposure time of the first stage I1 (for example: the first sub-stage I11) is greater than the exposure time of the second stage I2 (for example: the third sub-stage I21). The reading circuit 130A is coupled to the first sensing circuit 110A and the second sensing circuit 120A.
接著,讀取電路130A用以於第一階段I1之子階段(例如:第二子階段I12)讀取第一影像訊號Vo1,且用以於第二階段I2之子階段(例如:第四子階段I22)讀取第二影像訊號Vo2。影像處理電路140A耦接於讀取電路130,並用以於根據第一影像訊號Vo1及第二影像訊號Vo2產生第三影像訊號。 Then, the reading circuit 130A is used to read the first image signal Vo1 in a sub-stage of the first stage I1 (for example, the second sub-stage I12), and is used to read the first image signal Vo1 in a sub-stage of the second stage I2 (for example, the fourth sub-stage I22 ) reads the second image signal Vo2. The image processing circuit 140A is coupled to the reading circuit 130 and used to generate a third image signal according to the first image signal Vo1 and the second image signal Vo2.
在一些實施例中,請參閱第4圖及第5圖,影像感測裝置100A更包含資料線D1、傳輸第一閘極訊號G1之第一閘極線、傳輸第二閘極訊號G2的第二閘極線、傳輸第一共訊號COM1之第一共訊號線、傳輸第二共訊號COM2之第二共訊號線及電容Cdiode2。資料線D1耦接於第一感測電路110A及讀取電路130A。第二感測電路120A透過第一感測電路110A及電容Cdiode2耦接於該資料線D1。 In some embodiments, please refer to Figures 4 and 5. The image sensing device 100A further includes a data line D1, a first gate line transmitting the first gate signal G1, and a third gate line transmitting the second gate signal G2. Two gate lines, a first common signal line transmitting the first common signal COM1, a second common signal line transmitting the second common signal COM2 and the capacitor Cdiode2. The data line D1 is coupled to the first sensing circuit 110A and the reading circuit 130A. The second sensing circuit 120A is coupled to the data line D1 through the first sensing circuit 110A and the capacitor Cdiode2.
在一些實施例中,傳輸第一閘極訊號G1之第一閘極線及傳輸第一共訊號COM1之第一共訊號線耦接於第一感測電路110A。 In some embodiments, the first gate line transmitting the first gate signal G1 and the first common signal line transmitting the first common signal COM1 are coupled to the first sensing circuit 110A.
在一些實施例中,傳輸第二閘極訊號G2的第二閘極線及傳輸第二共訊號COM2之第二共訊號線耦接於第二感測電路120A。須說明的是,傳輸第二閘極訊號G2的第二閘極線與傳輸第一閘極訊號G1之第一閘極線不相交。 In some embodiments, the second gate line transmitting the second gate signal G2 and the second common signal line transmitting the second common signal COM2 are coupled to the second sensing circuit 120A. It should be noted that the second gate line transmitting the second gate signal G2 does not intersect with the first gate line transmitting the first gate signal G1.
在一些實施例中,第一感測電路110A包含感光二極體PIN1及第一讀取電晶體R1。感光二極體PIN1用以於第一階段I1進行光感測,以產生第一影像訊號Vo1,藉以儲存至電容Cdiode2。第一讀取電晶體R1耦接於該感光二極體PIN1及電容Cdiode2,並用以讀取第一影像訊號Vo1至資料線D1。 In some embodiments, the first sensing circuit 110A includes a photodiode PIN1 and a first read transistor R1. The photodiode PIN1 is used for light sensing in the first stage I1 to generate the first image signal Vo1, which is stored in the capacitor Cdiode2. The first reading transistor R1 is coupled to the photosensitive diode PIN1 and the capacitor Cdiode2, and is used to read the first image signal Vo1 to the data line D1.
在一些實施例中,請參閱第4圖及第5圖,第二感測電路120A包含感光電晶體T1及第二讀取電晶體R2。感光電晶體T1用以於第二階段I2進行光感測,以產生第二影像訊號Vo2。第二讀取電晶體R2耦接於感光電晶體T1以及電容Cdiode2,並用以讀取第二影像訊號Vo2,並藉由第一讀取電晶體R1傳送至資料線D1。 In some embodiments, please refer to FIGS. 4 and 5 , the second sensing circuit 120A includes a photosensitive transistor T1 and a second reading transistor R2. The photosensitive transistor T1 is used for light sensing in the second stage I2 to generate the second image signal Vo2. The second reading transistor R2 is coupled to the photosensitive transistor T1 and the capacitor Cdiode2, and is used to read the second image signal Vo2 and transmit it to the data line D1 through the first reading transistor R1.
須說明的是,於第二階段I2之第三子階段I21中,感光電晶體T1所產生的光電流大於感光二極體PIN1所產生的光電流。在一些實施例中,感光電晶體T1所產生的光電流約為感光二極體PIN1所產生的光電流之一千倍。因此,感光電晶體T1所產生的光電流不受感光二極體PIN1所產生的光電流影響。 It should be noted that in the third sub-phase I21 of the second phase I2, the photocurrent generated by the photosensitive transistor T1 is greater than the photocurrent generated by the photodiode PIN1. In some embodiments, the photocurrent generated by the phototransistor T1 is approximately one thousand times the photocurrent generated by the photodiode PIN1. Therefore, the photocurrent generated by the photosensitive transistor T1 is not affected by the photocurrent generated by the photodiode PIN1.
在一些實施例中,讀取電路130A可為積分電路。讀取電路130A根據控制訊號CLR及參考電壓Vref用以 讀取第一影像訊號Vo1及第二影像訊號Vo2後,藉以對第一影像訊號Vo1及第二影像訊號Vo2作波形轉換或積分補償。 In some embodiments, read circuit 130A may be an integrating circuit. The reading circuit 130A uses the control signal CLR and the reference voltage Vref to After reading the first image signal Vo1 and the second image signal Vo2, waveform conversion or integral compensation is performed on the first image signal Vo1 and the second image signal Vo2.
在一些實施例中,影像處理電路140A採用高動態範圍影像技術(High Dynamic Range Imaging,HDR)將不同影像曝光度的第一影像訊號Vo1及第二影像訊號Vo2疊合成對比度較高的第三影像訊號(圖中未示)。 In some embodiments, the image processing circuit 140A uses high dynamic range imaging technology (High Dynamic Range Imaging, HDR) to superimpose the first image signal Vo1 and the second image signal Vo2 with different image exposures into a third image with higher contrast. signal (not shown in the picture).
在一些實施例中,第5圖之第二階段I2之第三子階段I21之時間相較於第2圖之第二階段I2之第三子階段I21之時間長。 In some embodiments, the time of the third sub-phase I21 of the second phase I2 of FIG. 5 is longer than the time of the third sub-phase I21 of the second phase I2 of FIG. 2 .
第6圖為根據本案一些實施例繪示的影像感測裝置100A之結構示意圖。在一些實施例中,請參閱第6圖,由於本案整合感光二極體PIN1及感光電晶體T1於一個感測畫素上,以進行影像感測(或稱為曝光)。因此,相較於第3圖實施例,第6圖之影像感測裝置100A少了第3圖之影像感測裝置100之第二電容Cst。因此,影像感測裝置100A於感測畫素中多了一些空間,以作其他電路規劃。R1對應到影像感測裝置100A之第一感測電路110A之第一讀取電晶體。R2對應到影像感測裝置100A之第二感測電路120A之第二讀取電晶體。M1、M2及M3分別為不同金屬層。B為影像感測裝置100之玻璃基板。 Figure 6 is a schematic structural diagram of an image sensing device 100A according to some embodiments of the present invention. In some embodiments, please refer to Figure 6, because this case integrates the photosensitive diode PIN1 and the photosensitive transistor T1 on one sensing pixel to perform image sensing (or exposure). Therefore, compared with the embodiment of FIG. 3 , the image sensing device 100A of FIG. 6 lacks the second capacitor Cst of the image sensing device 100 of FIG. 3 . Therefore, the image sensing device 100A has some extra space in the sensing pixels for other circuit planning. R1 corresponds to the first reading transistor of the first sensing circuit 110A of the image sensing device 100A. R2 corresponds to the second reading transistor of the second sensing circuit 120A of the image sensing device 100A. M1, M2 and M3 are different metal layers respectively. B is the glass substrate of the image sensing device 100 .
第7圖為根據本案一些實施例繪示的影像感測裝置200之電路方塊示意圖。第8圖為根據本案一些實施例繪示的影像感測裝置200之訊號時序示意圖。 Figure 7 is a circuit block diagram of the image sensing device 200 according to some embodiments of the present invention. Figure 8 is a signal timing diagram of the image sensing device 200 according to some embodiments of the present invention.
在一些實施例中,請參閱第7圖及第8圖,影像感測裝置200包含第一感測器210、第二感測器220及影像處理電路230。第一感測器210用以於進行光感測,以獲得第一影像訊號Vo1。第二感測器220用以於進行光感測,以獲得第二影像訊號Vo2。影像處理電路230耦接於第一感測器210及第二感測器220,並用以同時讀取第一影像訊號Vo1及第二影像訊號Vo2,藉以產生第三影像訊號。 In some embodiments, please refer to FIGS. 7 and 8 , the image sensing device 200 includes a first sensor 210 , a second sensor 220 and an image processing circuit 230 . The first sensor 210 is used for light sensing to obtain the first image signal Vo1. The second sensor 220 is used for light sensing to obtain the second image signal Vo2. The image processing circuit 230 is coupled to the first sensor 210 and the second sensor 220 and is used to simultaneously read the first image signal Vo1 and the second image signal Vo2 to generate a third image signal.
在一些實施例中,請參閱第7圖及第8圖,第一感測器210包含第一感測電路211及第一讀取電路212。 In some embodiments, please refer to FIGS. 7 and 8 , the first sensor 210 includes a first sensing circuit 211 and a first reading circuit 212 .
在一些實施例中,第一感測電路211包含第一資料線D1、感光二極體PIN1及第一讀取電晶體R1。第一資料線D1用以傳輸第一影像訊號Vo1至影像處理電路230。感光二極體PIN1用以於進行光感測,以產生第一影像訊號Vo1。第一讀取電晶體R1耦接於第一資料線D1及感光二極體PIN1,並用以讀取第一影像訊號Vo1。 In some embodiments, the first sensing circuit 211 includes a first data line D1, a photodiode PIN1 and a first reading transistor R1. The first data line D1 is used to transmit the first image signal Vo1 to the image processing circuit 230 . The photodiode PIN1 is used for light sensing to generate the first image signal Vo1. The first reading transistor R1 is coupled to the first data line D1 and the photosensitive diode PIN1, and is used to read the first image signal Vo1.
在一些實施例中,請參閱第7圖及第8圖,第二感測器220包含第二感測電路221及第二讀取電路222。在一些實施例中,第二感測電路221包含第二資料線D2、感光電晶體T1及第二讀取電晶體R2。第二資料線D2用以傳輸第二影像訊號Vo2至影像處理電路230。感光電晶體T1用以於進行光感測,以產生第二影像訊號Vo2。第二讀取電晶體R2耦接於第二資料線D2及感光電晶體T1,並用以讀取第二影像訊號Vo2。 In some embodiments, please refer to FIGS. 7 and 8 , the second sensor 220 includes a second sensing circuit 221 and a second reading circuit 222 . In some embodiments, the second sensing circuit 221 includes a second data line D2, a photosensitive transistor T1 and a second reading transistor R2. The second data line D2 is used to transmit the second image signal Vo2 to the image processing circuit 230 . The photosensitive transistor T1 is used for light sensing to generate the second image signal Vo2. The second reading transistor R2 is coupled to the second data line D2 and the photosensitive transistor T1, and is used to read the second image signal Vo2.
在一些實施例中,第一讀取電路212耦接於影像處理電路230,並用以讀取第一感測電路211之第一影像訊號Vo1。 In some embodiments, the first reading circuit 212 is coupled to the image processing circuit 230 and used to read the first image signal Vo1 of the first sensing circuit 211 .
在一些實施例中,第二讀取電路222耦接於影像處理電路230,並用以讀取第二感測電路221之第二影像訊號Vo2。 In some embodiments, the second reading circuit 222 is coupled to the image processing circuit 230 and used to read the second image signal Vo2 of the second sensing circuit 221 .
在一些實施例中,第一讀取電路212可為積分電路。讀取電路212根據控制訊號CLR1及參考電壓Vref用以讀取第一影像訊號Vo1後,藉以對第一影像訊號Vo1作波形轉換或積分補償。同時,第二讀取電路222可為積分電路。讀取電路222根據控制訊號CLR2及參考電壓Vref用以讀取第二影像訊號Vo2後,藉以對第二影像訊號Vo2作波形轉換或積分補償。 In some embodiments, the first reading circuit 212 may be an integrating circuit. The reading circuit 212 reads the first image signal Vo1 according to the control signal CLR1 and the reference voltage Vref, and then performs waveform conversion or integral compensation on the first image signal Vo1. Meanwhile, the second reading circuit 222 may be an integrating circuit. The reading circuit 222 reads the second image signal Vo2 according to the control signal CLR2 and the reference voltage Vref, and then performs waveform conversion or integral compensation on the second image signal Vo2.
在一些實施例中,影像處理電路230採用高動態範圍影像技術(High Dynamic Range Imaging,HDR)將不同影像曝光度的第一影像訊號Vo1及第二影像訊號Vo2疊合成對比度較高的第三影像訊號(圖中未示)。 In some embodiments, the image processing circuit 230 uses high dynamic range imaging technology (High Dynamic Range Imaging, HDR) to superimpose the first image signal Vo1 and the second image signal Vo2 with different image exposures into a third image with higher contrast. signal (not shown in the picture).
須說明的是,第1圖之實施例及第4圖之實施例為分階段進行曝光及分階段進行讀取。第7圖之實施例為同時進行曝光及讀取。第一感測器210及第二感測器220彼此獨立運作,且不會互相影響。 It should be noted that the embodiment in Figure 1 and the embodiment in Figure 4 perform exposure and reading in stages. The embodiment in Figure 7 performs exposure and reading at the same time. The first sensor 210 and the second sensor 220 operate independently of each other and do not affect each other.
依據前述實施例,本案提供一種影像感測裝置(例如:第1圖之影像感測裝置100、第4圖之影像感測裝置100A及第7圖之影像感測裝置200),以獲得不同影像曝 光度之影像訊號,藉以獲得對比度更高的影像。 According to the aforementioned embodiments, the present invention provides an image sensing device (for example: the image sensing device 100 in Figure 1, the image sensing device 100A in Figure 4, and the image sensing device 200 in Figure 7) to obtain different images. exposed Photometric image signals are used to obtain higher contrast images.
雖然本案以詳細之實施例揭露如上,然而本案並不排除其他可行之實施態樣。因此,本案之保護範圍當視後附之申請專利範圍所界定者為準,而非受於前述實施例之限制。 Although this case is disclosed above with detailed embodiments, this case does not exclude other feasible implementation forms. Therefore, the scope of protection in this case shall be determined by the scope of the appended patent application and shall not be limited by the foregoing embodiments.
對本領域技術人員而言,在不脫離本案之精神和範圍內,當可對本案作各種之更動與潤飾。基於前述實施例,所有對本案所作的更動與潤飾,亦涵蓋於本案之保護範圍內。 For those skilled in the art, various modifications and modifications can be made to the present application without departing from the spirit and scope of the present application. Based on the foregoing embodiments, all changes and modifications made to this case are also covered by the protection scope of this case.
100~100A,200:影像感測裝置 100~100A, 200: Image sensing device
110~110A:第一感測電路 110~110A: first sensing circuit
120~120A:第二感測電路 120~120A: Second sensing circuit
130~130A:讀取電路 130~130A: Reading circuit
140~130A:影像處理電路 140~130A: Image processing circuit
R1~R2:讀取電晶體 R1~R2: read transistor
PIN1:感光二極體 PIN1: Photosensitive diode
Cdiode:第一電容 Cdiode: the first capacitor
Cst:第二電容 Cst: second capacitor
D1~D2:資料線 D1~D2: data line
T1:感光電晶體 T1: Photosensitive transistor
VGG,CLR,CLR1,CLR2:控制訊號 VGG, CLR, CLR1, CLR2: control signal
Vx,Vz:電位 Vx, Vz: potential
COM1~COM2:共訊號 COM1~COM2: common signals
G1~G2:閘極訊號 G1~G2: Gate signal
Vout,Vout1,Vout2:輸出訊號 Vout, Vout1, Vout2: output signal
Vref:參考電壓 Vref: reference voltage
I1~I2:階段 I1~I2: stage
I11~I12,I21~I22:子階段 I11~I12, I21~I22: sub-stages
Vo1,Vo2:影像訊號 Vo1, Vo2: video signal
M1~M3:金屬層 M1~M3: metal layer
B:基板 B:Substrate
Cdiode2:電容 Cdiode2: capacitor
210:第一感測器 210: First sensor
220:第二感測器 220: Second sensor
211:第一感測電路 211: First sensing circuit
221:第二感測電路 221: Second sensing circuit
212,222:讀取電路 212,222:Reading circuit
230:影像處理電路 230:Image processing circuit
參照後續段落中的實施方式以及下列圖式,當可更佳地理解本案的內容: 第1圖為根據本案一些實施例繪示的影像感測裝置之電路方塊示意圖; 第2圖為根據本案一些實施例繪示的影像感測裝置之訊號時序示意圖; 第3圖為根據本案一些實施例繪示的影像感測裝置之結構示意圖; 第4圖為根據本案一些實施例繪示的影像感測裝置之電路方塊示意圖; 第5圖為根據本案一些實施例繪示的影像感測裝置之訊號時序示意圖; 第6圖為根據本案一些實施例繪示的影像感測裝置之結構示意圖; 第7圖為根據本案一些實施例繪示的影像感測裝置之電路方塊示意圖;以及 第8圖為根據本案一些實施例繪示的影像感測裝置之訊號時序示意圖。 The contents of this case can be better understood with reference to the implementation methods in the following paragraphs and the following diagrams: Figure 1 is a schematic circuit block diagram of an image sensing device according to some embodiments of the present invention; Figure 2 is a schematic diagram of signal timing of an image sensing device according to some embodiments of this case; Figure 3 is a schematic structural diagram of an image sensing device according to some embodiments of this case; Figure 4 is a schematic circuit block diagram of an image sensing device according to some embodiments of this case; Figure 5 is a signal timing diagram of an image sensing device according to some embodiments of this case; Figure 6 is a schematic structural diagram of an image sensing device according to some embodiments of this case; Figure 7 is a circuit block diagram of an image sensing device according to some embodiments of this case; and Figure 8 is a signal timing diagram of an image sensing device according to some embodiments of the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without
100:影像感測裝置 100:Image sensing device
110:第一感測電路 110: First sensing circuit
120:第二感測電路 120: Second sensing circuit
130:讀取電路 130:Reading circuit
140:影像處理電路 140:Image processing circuit
R1~R2:讀取電晶體 R1~R2: read transistor
PIN1:感光二極體 PIN1: Photosensitive diode
Cdiode:第一電容 Cdiode: the first capacitor
Cst:第二電容 Cst: second capacitor
D1:資料線 D1: data line
T1:感光電晶體 T1: Photosensitive transistor
VGG,CLR:控制訊號 VGG, CLR: control signal
Vx,Vz:電位 Vx, Vz: potential
COM1~COM2:共訊號 COM1~COM2: common signals
G1~G2:閘極訊號 G1~G2: gate signal
Vout:輸出訊號 Vout: output signal
Vref:參考電壓 Vref: reference voltage
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| TW202213979A (en) * | 2020-09-28 | 2022-04-01 | 大陸商廣州印芯半導體技術有限公司 | Image sensing device and image sensing method |
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| TW202029732A (en) * | 2018-11-28 | 2020-08-01 | 荷蘭商露明控股公司 | Method of obtaining a digital image |
| TW202213979A (en) * | 2020-09-28 | 2022-04-01 | 大陸商廣州印芯半導體技術有限公司 | Image sensing device and image sensing method |
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