TWI819534B - Display device - Google Patents

Abstract

A display device is provided. The display device inlcudes a first panel structure and a second panel structure. The first panel structure includes a first substrate and a second substrate, and the area of the second substrate is larger than that of the first substrate, and the second substrate has a first outer lead bonding area. The second panel structure includes a third substrate and a fourth substrate, and one of the third substrate and the fourth substrate and the first substrate are disposed on opposite sides of the second substrate. In addition, the one of the third substrate and the fourth substrate at least partially overlaps the first outer lead bonding area of the second substrate.

Description

display device

The present disclosure relates to a display device, and in particular to a display device having a plurality of panel structures.

Electronic devices including display panels, such as tablets, laptops, smartphones, monitors and televisions, have become indispensable necessities in modern society. With this boom in portable electronics, consumers have high expectations regarding the quality, functionality or price of these products.

Multifunctional display panels are gradually receiving more attention. For example, the panel may have display functions, anti-peep functions, rearview mirror functions, and other optical adjustment functions at the same time. However, existing display devices still do not meet expectations in all aspects, and developing structural designs that can further improve the performance of display devices is still one of the current research topics in the industry.

According to some embodiments of the present disclosure, a display device is provided, including a first panel structure and a second panel structure. The first panel structure includes a first substrate and a second substrate, the area of the second substrate is larger than the area of the first substrate, and the second substrate has a first outer lead bonding area (OLB); the second panel structure includes a third substrate and a fourth substrate, wherein One of the third substrate and the fourth substrate and the first substrate are respectively disposed on opposite sides of the second substrate and at least partially overlap with the first external lead bonding area of the second substrate.

In order to make the features or advantages of the present disclosure more obvious and understandable, some embodiments are listed below and described in detail with reference to the accompanying drawings.

10A, 10B, 10C, 10D, 10E, 10F: display device

12:Backlight module

14:Frame

14s: medial surface

16: Fixing materials

18:Buffer material

100: First panel structure

100a: first substrate

100b: Second substrate

200: Second panel structure

200a: Third substrate

200b: Fourth substrate

300:Third panel structure

300a: Fifth substrate

300b:Sixth substrate

D1, D2: distance

OLB-1: First outer lead bonding area

OLB-2: Second outer lead bond area

OLB-3: Third outer lead bonding area

PL: polarizing plate

Figure 1 shows a schematic side view of a display device according to some embodiments of the present disclosure.

Figure 2 shows a schematic side view of a display device according to some embodiments of the present disclosure.

Figures 3A and 3B show schematic top structural views of some components of a display device according to some embodiments of the present disclosure.

FIG. 4 shows a schematic side structural view of a display device according to some embodiments of the present disclosure.

Figures 5A, 5B and 5C show schematic top structural views of some components of a display device according to some embodiments of the present disclosure.

FIG. 6 shows a schematic side view of a display device according to some embodiments of the present disclosure.

FIG. 7 shows a schematic side view of a display device according to some embodiments of the present disclosure.

FIG. 8 shows a schematic side view of a display device according to some embodiments of the present disclosure.

The display device according to the embodiment of the present disclosure will be described in detail below. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present disclosure. The specific components and arrangements described below are only used to briefly and clearly describe some embodiments of the present disclosure. Of course, these are only examples and not limitations of the present disclosure. In addition, similar and/or corresponding reference numerals may be used to identify similar and/or corresponding elements in different embodiments to clearly describe the present disclosure. However, the use of these similar and/or corresponding reference numerals is only for the purpose of simply and clearly describing some embodiments of the present disclosure, and does not imply any correlation between the different embodiments and/or structures discussed.

It should be understood that relative terms, such as "lower" or "bottom" or "higher" or "top" may be used in the embodiments to describe the relative relationship of one element to another element in the drawings. It will be understood that if the device in the figures is turned upside down, elements described as being on the "lower" side would then be elements described as being on the "higher" side. The embodiments of the present disclosure can be understood together with the drawings, and the drawings of the present disclosure are also Considered part of the disclosure instructions. It should be understood that the drawings of the present disclosure are not drawn to scale and, in fact, the dimensions of elements may be arbitrarily enlarged or reduced in order to clearly illustrate features of the present disclosure.

Furthermore, when it is said that a first material layer is located on or above a second material layer, it may include the situation of direct contact between the first material layer and the second material layer or the situation between the first material layer and the second material layer. There may not be direct contact, that is, there may be one or more other material layers separated between the first material layer and the second material layer. However, if the first material layer is directly located on the second material layer, it means that the first material layer and the second material layer are in direct contact.

In addition, it should be understood that ordinal numbers such as "first", "second", etc. used in the specification and patent application are used to modify elements and do not themselves imply or represent the element(s). There are no previous ordinal numbers, nor does it represent the order of one component with another component, or the order of the manufacturing method. The use of these ordinal numbers is only used to make a component with a certain name and another component with the same name Can make clear distinctions. The same words may not be used in the patent scope and the description. For example, the first element in the description may be the second element in the patent scope.

In some embodiments of the present disclosure, terms related to joining and connecting, such as "connection", "interconnection", etc., unless otherwise defined, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact. There are other structures located between these two structures. And this term about joining and connecting can also include both structures. Movable, or both structures are fixed. In addition, the terms "electrical connection" or "electrical coupling" include any direct and indirect means of electrical connection.

In this context, the terms "about", "substantially", "equal to" and "the same" usually mean within 10%, or within 5%, or within 3%, or within 2% of a given value or range. Within, or within 1%, or within 0.5%. The quantities given here are approximate quantities, that is, even if "approximately" and "substantially" are not specifically stated, the meaning of "approximately" and "substantially" can still be implied. The term "range between a first value and a second value" means that the range includes the first value, the second value and other values therebetween.

It should be understood that the following embodiments can be replaced, reorganized, and mixed with features in several different embodiments without departing from the spirit of the present disclosure to complete other embodiments. Features in various embodiments may be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant technology and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner. Unless otherwise defined in the embodiments of this disclosure.

According to some embodiments of the present disclosure, a display device is provided. The display device includes a plurality of panel structures, and the panel structures are configured in a specific manner, thereby improving the basic Structural strength in board edge areas (e.g., external wire bonding areas) reduces the risk of substrate edge damage during subsequent processes. According to some embodiments of the present disclosure, a plurality of panel structures may have different functions, that is, they may be multifunctional panels.

It should be understood that in addition to display devices, embodiments of the present disclosure can be applied to various electronic devices, such as light-emitting devices, touch devices, sensing devices, antenna devices, splicing devices or combinations of the foregoing, but not in this way. is limited. The electronic device may include a bendable or flexible electronic device, but is not limited thereto. According to some embodiments, the electronic device may include light-emitting diodes (LEDs), liquid crystals (liquid crystals), fluorescence, phosphorescence (phosphorescence), quantum dots (QDs), and other suitable media, or a combination of the foregoing, but not limited to this. The light-emitting diode may include, for example, an organic light-emitting diode (OLED), an inorganic light-emitting diode (inorganic light-emitting diode), a sub-millimeter light-emitting diode (mini LED), or a micro-light emitting diode. Micro LED or quantum dot light emitting diode (QD, for example, QLED, QDLED), other suitable materials, or any permutation and combination of the above, but is not limited thereto. The aforementioned antenna device may include, for example, a liquid crystal antenna device, but is not limited thereto. According to the embodiments of the present disclosure, the electronic device can be any of the above-mentioned permutations and combinations, but is not limited thereto. In addition, the shape of the electronic device can be rectangular, circular, polygonal, irregular, with curved edges or other suitable shapes. The electronic device can have peripheral systems such as a driving system, a control system, a light source system or a shelf system. To support display devices or antenna devices.

Based on the foregoing, the following uses a display device as an example to illustrate the implementation manner of the present disclosure. Please refer to FIG. 1 , which shows a schematic side structural view of a display device 10A according to some embodiments of the present disclosure. It should be understood that, for clarity of explanation, some components of the display device 10A are omitted in the figures, and only some components are schematically illustrated. According to some embodiments, additional features may be added to the display device 10A described below. According to other embodiments, some features of the display device 10A described below may be replaced or omitted.

As shown in FIG. 1 , according to some embodiments, the display device 10A may include a first panel structure 100 and a second panel structure 200 , and the first panel structure 100 may be disposed on the second panel structure 200 .

The first panel structure 100 may include a first substrate 100a and a second substrate 100b, and the first substrate 100a may be opposite to the second substrate 100b. According to some embodiments, the area of the second substrate 100b is larger than that of the first substrate 100a, and the second substrate 100b may have a first external wire bonding area OLB-1.

According to the embodiment of the present disclosure, the area of the aforementioned substrate (the first substrate 100a or the second substrate 100b) refers to the area of the upper surface or lower surface of the substrate in a direction perpendicular to the normal direction of the substrate.

Specifically, according to some embodiments, in the normal direction of the first substrate 100a (such as the Z direction in the figure), most of the area of the second substrate 100b overlaps the first substrate 100a, but the second substrate 100b overlaps the first substrate 100a. Some areas do not overlap with the first substrate 100a. In other words, the second substrate 100b has an area that protrudes from the first substrate 100a. The area of the second substrate 100b is larger than the area of the first substrate 100a. According to some implementations For example, the area of the second substrate 100b that does not overlap the first substrate 100a includes (or substantially corresponds to) the first external wire bonding area OLB-1 of the second substrate 100b, but is not limited thereto.

Furthermore, the second panel structure 200 may include a third substrate 200a and a fourth substrate 200b, and the third substrate 200a may be disposed opposite to the fourth substrate 200b. Furthermore, as shown in FIG. 1 , one of the third substrate 200 a and the fourth substrate 200 b and the first substrate 100 a are respectively disposed on opposite sides of the second substrate 100 b and are connected to the first external lead bonding area of the second substrate 100 b OLB-1 overlaps at least partially. According to some embodiments, the fourth substrate 200b at least partially overlaps the first external wire bonding area OLB-1 in the normal direction of the first substrate 100a (eg, the Z direction in the figure), but is not limited thereto.

It should be understood that according to the embodiments of the present disclosure, the terms "overlapping", "partially overlapping" or "at least partially overlapping" refer to two elements having overlapping portions with each other, that is, a portion of the first element and Parts of the second elements overlap each other, or, in the normal direction of the substrate (eg, the Z direction in the drawing), the projection of the first element on the substrate overlaps with the projection of the second element on the substrate. In addition, "overlapping at least partially" may include "overlapping partially" and "overlapping completely".

According to some embodiments, the area of the third substrate 200a is smaller than the area of the fourth substrate 200b, and the fourth substrate 200b may have a second external wire bonding area OLB-2. The definitions of the areas of the third substrate 200a and the fourth substrate 200b are the same as the definitions of the aforementioned substrates (the first substrate 100a or the second substrate 100b), and will not be repeated here.

According to some embodiments, in the normal direction of the third substrate 200a (such as the Z direction in the figure), most of the area of the fourth substrate 200b is in contact with the third substrate. 200a overlaps, but a partial area of the fourth substrate 200b does not overlap the third substrate 200a. In other words, the fourth substrate 200b has an area that protrudes from the third substrate 200a. According to some embodiments, the area of the fourth substrate 200b that does not overlap the third substrate 200a includes (or substantially corresponds to) the second outer wire bonding area OLB-2 of the fourth substrate 200b, but is not limited thereto. According to some embodiments, the area of the second outer wire bonding area OLB-2 may be equal to or smaller than the area of the first outer wire bonding area OLB-1.

According to the embodiment of the present disclosure, the area of the aforementioned external lead bonding area (the first external lead bonding area OLB-1 or the second external lead bonding area OLB-2) refers to the direction perpendicular to the normal direction of the substrate on which it is located ( For example, the area of the external wire bonding area in the X or Y direction in the drawing).

According to some embodiments, the materials of the first substrate 100a, the second substrate 100b, the third substrate 200a, and the fourth substrate 200b may include glass, quartz, sapphire (sapphire), semiconductor, polyimide (PI), Polyethylene terephthalate (PET), polycarbonate (PC), polypropylene (PP), rubber, fiberglass, ceramics, other suitable materials or combinations of the above, but are not limited thereto.

Furthermore, according to some embodiments, the display device 10A may further include a display element layer, such as a luminescent material, a liquid crystal layer or other suitable materials (not shown). Taking the liquid crystal layer as an example, it may be disposed on the first panel structure 100 between the first substrate 100a and the second substrate 100b, and/or between the third substrate 200a and the fourth substrate 200b of the second panel structure 200. The liquid crystal layer may include liquid crystal molecules (not shown). In some implementations For example, different electric fields can be applied to the liquid crystal layer to change the alignment direction of the liquid crystal molecules, thereby adjusting the displayed image.

According to some embodiments, the material of the liquid crystal layer may include nematic liquid crystal, smectic liquid crystal, dye liquid crystal, polymer dispersed liquid crystal (PDLC), polymer Polymer network liquid crystal (PNLC), cholesteric liquid crystal, blue-phase liquid crystal, and other suitable liquid crystal materials, but are not limited to these. However, according to other embodiments, the liquid crystal layer may be replaced with a modulating material having different properties (eg, dielectric coefficient) that can be adjusted by applying an electric field or other means.

Furthermore, according to some embodiments, the display device 10A may further include a driving layer (not shown), and the driving layer may be disposed on the second substrate 100b of the first panel structure 100 and/or the fourth substrate 200b of the second panel structure 200 above, but not limited to this. For example, the driving layer may be used to provide an electric field applied to the liquid crystal layer (not shown), but is not limited thereto. The driving layer may be, for example, an active driving circuit or a passive driving circuit. According to some embodiments, the driving layer may include transistors (for example, switching transistors, driving transistors, reset transistors, etc.), data lines, scan lines, dielectric layers or other lines, etc. , but not limited to this. In some embodiments, the transistor may include low-temperature polysilicon (LTPS), indium gallium zinc oxide (IGZO), amorphous silicon (a-S), or a combination of the foregoing, but not Limited to this. in some In embodiments, different transistors may include different semiconductor materials, but are not limited thereto. In some embodiments, the driving layer can control the first panel structure 100 and the second panel structure 200 through external integrated circuits (ICs) or microchips.

According to some embodiments, the driving layer of the first panel structure 100 may be electrically connected to the first external wire bonding area OLB-1, and the driving layer of the second panel structure 200 may be electrically connected to the second external wire bonding area OLB-2. . According to some embodiments, the driving elements of the driving layer (eg, integrated circuits or microchips, etc.) may be disposed on the first external wire bonding region OLB-1 or the second external wire bonding region OLB-2.

According to some embodiments, the display device 10A may further include a polarizing plate PL. Specifically, the polarizing plate PL of the first panel structure 100 may be disposed on one of the third substrate 200a and the fourth substrate 200b of the second panel structure 200 and the second substrate 100b of the first panel structure 100. As shown in Figure 1, the polarizing plate PL can be disposed between the third substrate 200a and the second substrate 100b, for example, on the surface of the second substrate 100b, and another polarizing plate PL of the first panel structure 100 can be disposed. on the surface of the first substrate 100a. Furthermore, according to some embodiments, the second panel structure 200 also includes a polarizing plate PL, and the polarizing plate PL can be disposed on the surface of the fourth substrate 200b.

According to some embodiments, the material of the polarizing plate PL may include polyvinyl alcohol (PVA), or other suitable materials, but is not limited thereto. For example, according to some embodiments, the polarizing plate PL may include two protective layers and a polyvinyl alcohol film sandwiched between the protective layers. The protective layer may include, for example, a triacetyl cellulose (TAC) film, but Not limited to this. According to other embodiments, The aforementioned polarizing plate PL can be replaced by a metal wire grid polarizer (WGP).

In addition, please refer to FIG. 1 . According to some embodiments, the display device 10A may further include a backlight module 12 and a frame 14 . The first panel structure 100 , the second panel structure 200 and the backlight module 12 may be disposed in the frame 14 . The backlight module 12 may be disposed between the second panel structure 200 and the frame 14 . The backlight module 12 can provide the light source required by the display device 10A.

According to some embodiments, the backlight module 12 may include an inorganic light emitting diode (LED), such as a micro light emitting diode (micro LED, mini LED), an organic light emitting diode (organic light emitting diode, OLED), electroluminescence elements, other suitable light-emitting elements, or combinations of the foregoing, but the disclosure is not limited thereto.

According to some embodiments, the material of the frame 14 may include metal, plastic, ceramics, other suitable materials, or combinations thereof, but is not limited thereto.

In addition, it is worth noting that in the embodiment shown in Figure 1, the first substrate 100a is disposed above the second substrate 100b, the third substrate 200a is disposed above the fourth substrate 200b, and the third substrate 200a is disposed above the second substrate 100b. between the substrate 100b and the fourth substrate 200b. Since the second substrate 100b and the fourth substrate 200b respectively have the first external wire bonding area OLB-1 and the second external wire bonding area OLB-2, they have portions that protrude from the first substrate 100a and the third substrate 200a. According to some embodiments, the display device 10A may further include a fixing material 16, and the fixing material 16 may be disposed on the second Between the portion of the substrate 100b protruding from the first substrate 100a and the portion of the fourth substrate 200b protruding from the third substrate 200a, or between the first external wire bonding area OLB-1 and the second external lead bonding area OLB-2. According to some embodiments, there is a distance D1 between the second substrate 100b of the first panel structure 100 and the fourth substrate 200b of the second panel structure 200.

The aforementioned fixing material 16 can fix the second substrate 100b and the fourth substrate 200b and fill the space between the first external lead bonding area OLB-1 and the second external lead bonding area OLB-2, thereby improving the first panel structure 100 and the overall structural strength of the second panel structure 200, for example, reducing the risk of damage or cracking if they collide with the frame 14. Furthermore, according to some embodiments, the fixing material 16 may also be disposed between the backlight module 12 and the second external wire bonding area OLB-2 of the fourth substrate 200b. According to some embodiments, the fixing material 16 may be disposed simultaneously between the backlight module 12 and the second external lead bonding area OLB-2 of the fourth substrate 200b and between the portion of the second substrate 100b protruding from the first substrate 100a and the fourth substrate. 200b protrudes between portions of the third substrate 200a. According to some embodiments, a gap may exist between the fixing material 16 and the fourth substrate 200b, and a gap may exist between the fixing material 16 and the polarizing plate PL.

According to some embodiments, the fixing material 16 may include adhesive materials, such as light-curing glue, heat-curing glue, light-heat curing glue, moisture-curing glue, adhesive tape, AB glue (acrylic acid, epoxy resin, polyurethane, etc.), other suitable Materials or combinations of the foregoing, but not limited to this. According to some embodiments, the fixing material 16 may include optical clear adhesive (OCA), optical clear resin (optical clear resin). resin, OCR), other suitable materials, or a combination of the foregoing. According to some embodiments, the fixing material 16 may include cushioning foam with adhesive material, but is not limited thereto. In addition, according to different embodiments, the first panel structure 100 and the second panel structure 200 may further include an alignment layer, a light shielding layer, a color filter layer, a functional optical film layer, a spacer element, or a combination of the above, but are not limited to this. Furthermore, according to some embodiments, the functional optical film layer may include, for example, a reflective film, a diffusion film, a light intensity enhancement film, an inverted prism film, or a dual brightness enhancement film. film, DBEF), other suitable optical films or combinations of the foregoing, but are not limited thereto.

It should be understood that the first panel structure 100 and the second panel structure 200 can be appropriately adjusted according to the functions intended to be achieved by the first panel structure 100 and the second panel structure 200 (for example, anti-peep function, rearview mirror function or other optical adjustment functions, etc.). Components included in the second panel structure 200 and their configuration. For example, according to some embodiments, the first panel structure 100 may be a display panel structure, and the second panel structure 200 may be a privacy panel structure or a rearview mirror panel structure, but is not limited thereto.

Specifically, taking the privacy panel structure as an example, the panel structure may include an electrically controlled birefringence (ECB) mode panel, but is not limited thereto. Taking the rearview mirror panel structure as an example, the panel structure may further include a reflective brightness enhancement film (DBEF), but is not limited to this.

Next, please refer to Figure 2, Figure 3A and Figure 3B at the same time. Figure 2 shows a schematic side view structure of the display device 10B according to some embodiments of the present disclosure. Figures 3A and 3B respectively show the first substrate 100a and the second substrate 100b of the first panel structure 100 of the display device 10B and the third substrate 200a and 200 of the second panel structure 200 according to some embodiments of the present disclosure. Schematic top view of the fourth substrate 200b.

It should be understood that, for clarity of explanation, some components of the display device 10B are omitted in the figures, and only some components are schematically illustrated. According to some embodiments, additional features may be added to the display device 10B described below. According to other embodiments, some features of the display device 10B described below may be replaced or omitted. Furthermore, components or elements that are the same or similar to those mentioned above will be represented by the same or similar numbers in the following text. Their materials, manufacturing methods and functions are all the same or similar as those mentioned above, so these parts will not be described again in the following text.

As shown in FIG. 2, in the display device 10B, the fourth substrate 200b of the second panel structure 200 is disposed above the third substrate 200a, and the fourth substrate 200b is disposed between the second substrate 100b and the third substrate 200a. As shown in FIG. 3A, the first substrate 100a of the first panel structure 100 is disposed above the second substrate 100b. The second substrate 100b is not in contact with the first substrate 100a in its normal direction (for example, the Z direction in the figure). The overlapping area may serve as the first outer wire bonding area OLB-1. As shown in Figure 3B, the third substrate 200a of the second panel structure 200 is disposed below the fourth substrate 200b. The fourth substrate 200b is not in contact with the third substrate 200a in its normal direction (such as the Z direction in the figure). The overlapping area may serve as the second outer wire bonding area OLB-2.

Furthermore, it should be understood that in order to clearly show the positional relationship between the two substrates, the second substrate 100b shown in FIG. 3A protrudes from the first substrate 100a on four sides, but the disclosure is not limited thereto. According to some embodiments, one, two or three sides of the second substrate 100b may be aligned with the sides of the first substrate 100a. Similarly, the fourth substrate 200b shown in FIG. 3B protrudes from the third substrate 200a on four sides, but the disclosure is not limited thereto. According to some embodiments, one, two or three sides of the fourth substrate 200b may be aligned with the sides of the third substrate 200a.

As mentioned above, since the second substrate 100b and the fourth substrate 200b respectively have the first external wire bonding area OLB-1 and the second external wire bonding area OLB-2, they have portions that protrude from the first substrate 100a and the third substrate 200a. . In this embodiment, since the fourth substrate 200b is disposed above the third substrate 200a, the distance D2 between the second substrate 100b and the fourth substrate 200b is smaller. For example, the distance D2 is smaller than the display device 10A in FIG. 1 The distance D1 between the second substrate 100b and the fourth substrate 200b.

距離D1

0.9mm)，距離D2可介於0.2以及0.6毫米之間(即，0.2mm

距離D2

0.6mm)。 According to some embodiments of the present disclosure, the aforementioned distance D1 and distance D2 refer to the distance between the second substrate 100b and the fourth substrate 200b in the normal direction of the second substrate 100b (for example, the Z direction in the figure). , where the distance D1 can be between 0.3 millimeters (mm) and 0.9 mm (i.e., 0.3mm

Distance D1

0.9mm), the distance D2 can be between 0.2 and 0.6mm (ie, 0.2mm

Distance D2

0.6mm).

Furthermore, it should be understood that according to the embodiments of the present disclosure, optical microscopy (OM), scanning electron microscope can be used (scanning electron microscope, SEM), film thickness profile measuring instrument (α-step), ellipsometer, or other suitable methods to measure the area, width, thickness or height of each component, or the distance or spacing between components . Specifically, according to some embodiments, a scanning electron microscope can be used to obtain a cross-sectional structural image including the components to be measured, and measure the area, width, thickness or height of each component, or the distance or spacing between components.

In this embodiment, the second substrate 100b having the first external wire bonding area OLB-1 is adjacent to the fourth substrate 200b having the second external wire bonding area OLB-2, and the distance between them is very small, whereby The overall structural strength of the first panel structure 100 and the second panel structure 200 (especially the protruding portions of the substrate corresponding to the first external wire bonding area OLB-1 and the second external lead bonding area OLB-2) can be further improved, for example , reducing the risk of damage or cracking when they collide with the frame 14 .

As shown in FIG. 2 , the fixing material 16 may be disposed between the second substrate 100 b and the fourth substrate 200 b and between the fourth substrate 200 b and the backlight module 12 . However, according to other embodiments, there may be no fixing material 16 between the second substrate 100b and the fourth substrate 200b and/or between the fourth substrate 200b and the backlight module 12 .

Next, please refer to Figures 4, 5A, 5B and 5C. Figure 4 shows a schematic side structural view of the display device 10C according to some embodiments of the present disclosure. Figures 5A, 5B and Figure 5C shows respectively the first substrate 100a and the second substrate 100b of the first panel structure 100 of the display device 10C, the third substrate 200a and the fourth substrate 200b of the second panel structure 200 according to some embodiments of the present disclosure. and a top structural schematic diagram of the fifth substrate 300a and the sixth substrate 300b of the third panel structure 300.

It should be understood that, for clarity of explanation, some components of the display device 10C are omitted in the figures, and only some components are schematically illustrated. According to some embodiments, additional features may be added to the display device 10C described below. According to other embodiments, some features of the display device 10C described below may be replaced or omitted.

As shown in Figure 4, according to some embodiments, the display device 10C includes a first panel structure 100 and a second panel structure 200, and may further include a third panel structure 300. The third panel structure 300 is also disposed in the frame 14. And the third panel structure 300 can be disposed below the first panel structure 100 . The third panel structure 300 may include a fifth substrate 300a and a sixth substrate 300b, and the fifth substrate 300a may be opposite to the sixth substrate 300b. In this embodiment, the third substrate 200a of the second panel structure 200 may be disposed on the fourth substrate 200b, and the fifth substrate 300a of the third panel structure 300 may be disposed on the sixth substrate 300b.

According to some embodiments, the area of the fifth substrate 300a may be smaller than the area of the sixth substrate 300b, and the fifth substrate 300a may have a third external wire bonding area OLB-3 (as shown in FIG. 5C). The definitions of the areas of the fifth substrate 300a and the sixth substrate 300b are the same as the definitions of the aforementioned substrates (the first substrate 100a or the second substrate 100b), and will not be repeated here.

In detail, please refer to Figure 5C. According to some embodiments, in the normal direction of the fifth substrate 300a (such as the Z direction in the figure), the sixth substrate 300b Most of the area overlaps the fifth substrate 300a, but a part of the sixth substrate 300b does not overlap the fifth substrate 300a. According to some embodiments, the area of the sixth substrate 300b that does not overlap the fifth substrate 300a includes (or substantially corresponds to) the third external wire bonding area OLB-3 of the sixth substrate 300b, but is not limited thereto. According to some embodiments, the area of the third outer wire bonding area OLB-3 may be equal to or smaller than the area of the first outer wire bonding area OLB-1.

Also, as shown in FIGS. 5A to 5C , according to some embodiments, the second outer wire bonding area OLB-2 of the second panel structure 200 may be different from the first outer wire bonding area OLB-1 of the first panel structure 100 , the third external wire bonding area OLB-3 of the third panel structure 300 may be different from the first external wire bonding area OLB-1 of the first panel structure 100. Specifically, the area of the second external lead bonding area OLB-2 of the second panel structure 200 may be smaller than the area of the first external lead bonding area OLB-1 of the first panel structure 100, and the third area of the third panel structure 300 The area of the outer wire bonding area OLB-3 may be smaller than the area of the first outer wire bonding area OLB-1 of the first panel structure 100. According to some embodiments, the area of the first outer wire bonding area OLB-1 of the first panel structure 100, the area of the second outer wire bonding area OLB-2 of the second panel structure 200, the third outer area of the third panel structure 300. The areas of the wire bonding areas OLB-3 can be the same among the three. According to some embodiments, the area of the first outer wire bonding area OLB-1 of the first panel structure 100, the area of the second outer wire bonding area OLB-2 of the second panel structure 200, the third outer area of the third panel structure 300. The areas of the wire bonding areas OLB-3 may be different among the three. According to some embodiments, the first external lead connection of the first panel structure 100 Any one of the area of the bonding area OLB-1, the area of the second external lead bonding area OLB-2 of the second panel structure 200, and the area of the third external lead bonding area OLB-3 of the third panel structure 300 is different from the other. The two are different. According to some embodiments, the area of the first outer wire bonding area OLB-1 of the first panel structure 100, the area of the second outer wire bonding area OLB-2 of the second panel structure 200, the third outer area of the third panel structure 300. The area of any one of the three wire bonding areas OLB-3 is the same as the other two.

Furthermore, according to some embodiments, the third substrate 200a of the second panel structure 200 may at least partially overlap the first external lead bonding area OLB-1 in its normal direction (such as the Z direction in the figure). . According to some embodiments, the fifth substrate 300a of the third panel structure 300 may at least partially overlap the first external wire bonding area OLB-1 in its normal direction (eg, the Z direction in the figure).

According to some embodiments, a patterning process may be used to remove a portion of the third substrate 200a of the second panel structure 200 that overlaps with an area on the fourth substrate 200b where wire bonding components are disposed (normal to the fourth substrate 200b direction). Similarly, according to some embodiments, a patterning process may be used to remove a portion of the fifth substrate 300a of the third panel structure 300 that overlaps with an area on the sixth substrate 300b where the wire bonding components are disposed (on the sixth substrate 300b in the normal direction).

It is worth noting that in this embodiment, since the third substrate 200a of the second panel structure 200 and the fifth substrate 300a of the third panel structure 300 are removed less (ie, the second external lead bonding area OLB-2 and the third external lead bonding area OLB-3 are smaller), therefore, the third substrate 200a and the fifth The structural strength of the base plate 300a can thereby improve the overall structural strength of the second structural panel 200 and the third panel structure 300, for example, reducing the risk of damage or cracking when they collide with the frame 14.

Furthermore, the area of the second outer wire bonding area OLB-2 may be the same as or different from the area of the third outer wire bonding area OLB-3. According to some embodiments, the second outer wire bonding area OLB-2 may at least partially overlap the third outer wire bonding area OLB-3 in the normal direction of the fourth substrate 200b (eg, the Z direction in the figure). According to some other embodiments, in the normal direction of the fourth substrate 200b (such as the Z direction in the figure), the second external wire bonding area OLB-2 and the third external wire bonding area OLB-3 do not overlap, that is, , the positions of the second external wire bonding area OLB-2 and the third external wire bonding area OLB-3 may be staggered. In the case where the positions of the second external wire bonding area OLB-2 and the third external wire bonding area OLB-3 are at least partially offset, since the hollowed-out areas of the third substrate 200a and the fifth substrate 300a are at least partially offset, Therefore, the overall structural strength of the second structural panel 200 and the third panel structure 300 can be further improved.

Furthermore, as shown in FIG. 4 , the fixing material 16 can be disposed between the second substrate 100b and the third substrate 200a , between the fourth substrate 200b and the fifth substrate 300a , and between the sixth substrate 300b and the backlight module 12 between. However, according to other embodiments, there may be no connection between the second substrate 100b and the third substrate 200a, and/or between the fourth substrate 200b and the fifth substrate 300a, and/or between the sixth substrate 300b and the backlight module 12. With fixing material 16.

According to some embodiments, the materials of the fifth substrate 300a and the sixth substrate 300b may be similar to the materials of the aforementioned first substrate 100a, second substrate 100b, third substrate 200a, and fourth substrate 200b, which will not be repeated here. Furthermore, according to some embodiments, a liquid crystal layer (not shown) may also be provided between the fifth substrate 300a and the sixth substrate 300b. Similarly, the components and their configurations included in the third panel structure 300 can be appropriately adjusted according to the functions that the third panel structure 300 is intended to achieve (for example, anti-peep function, rearview mirror function or other optical adjustment functions, etc.). For example, according to some embodiments, the third panel structure 300 may be a privacy panel structure or a rearview mirror panel structure, but is not limited thereto.

In addition, it should be understood that although the first substrate 100a, the second substrate 100b, the third substrate 200a, the fourth substrate 200b, the fifth substrate 300a and the sixth substrate 300b in the drawings are all rectangular, this disclosure does not take the form of a rectangular shape. This is the limit. According to different embodiments, the first substrate 100a, the second substrate 100b, the third substrate 200a, the fourth substrate 200b, the fifth substrate 300a and the sixth substrate 300b may have any suitable shape as required. Specifically, according to some embodiments, the aforementioned substrate may be a quadrilateral, circular, polygonal or free shape, and the quadrilateral may include a trapezoid, a square, a rectangle, a rhombus, etc., but the disclosure is not limited thereto. Furthermore, according to some embodiments, the shapes of the first substrate 100a, the second substrate 100b, the third substrate 200a, the fourth substrate 200b, the fifth substrate 300a and the sixth substrate 300b may be the same or different from each other, or may be partially the same and Parts are different.

Furthermore, although the display device in the foregoing embodiments has 2 or 3 panel structures, the present disclosure is not limited thereto. According to different embodiments, the display device may have other appropriate number of panel structures according to requirements.

Following the foregoing, as long as the spirit of the present disclosure is not departed, the features of the various embodiments of the present disclosure can be reorganized and matched. For example, please refer to FIG. 6 , which shows a schematic side structural view of a display device 10D according to some embodiments of the present disclosure. The display device 10D shown in FIG. 6 includes the first panel structure 100 and the second panel structure 200 in FIG. 2 and the third panel structure 300 in FIG. 4, which are explained in relation to the aforementioned FIG. 2 and FIG. 4. paragraph, no further details will be given here.

Next, please refer to Figures 7 and 8. Figures 7 and 8 respectively show schematic side structural views of the display device 10E and the display device 10F according to some embodiments of the present disclosure. As shown in FIGS. 7 and 8 , the display device 10E and the display device 10F further include a cushioning material 18 . The buffer material 18 can protect the first panel structure 100 and the second panel structure 200 (for example, the more protruding second substrate 100b and the fourth substrate 200b), and can reduce the stress generated when they collide with the frame 14, reducing damage or cracking. opportunity.

As shown in Figures 7 and 8, according to some embodiments, the cushioning material 18 may be disposed between the frame 14 and the first panel structure 100 and between the frame 14 and the second panel structure 200, and adjacent to the first exterior wire bonding area OLB-1 and a second outer wire bonding area OLB-2.

As shown in Figure 7, according to some embodiments, cushioning material 18 may be disposed on the inner surface 14s of the frame 14. In these embodiments, the cushioning material 18 may include, for example, rubber, foam polyimide (PI), polycarbonate (PC), other suitable cushioning materials, or combinations thereof, but is not limited thereto. .

As shown in FIG. 8 , according to some embodiments, the cushioning material 18 may fill the space between the frame 14 and the first panel structure 100 and the space between the frame 14 and the second panel structure 200 . According to some embodiments, cushioning material 18 may partially cover first panel structure 100 and second panel structure 200 . In these embodiments, the cushioning material 18 may include, for example, light-curing glue, heat-curing glue, light-heat curing glue, moisture-curing glue, tape, AB glue (acrylic acid, epoxy resin, polyurethane, etc.), other suitable materials, or Combinations of the above, but not limited to these.

In summary, according to some embodiments of the present disclosure, a display device includes a plurality of panel structures, and the panel structures are configured in a specific manner, thereby improving the structural strength of the edge area of the substrate (for example, the external wire bonding area) and reducing the subsequent damage to the edge of the substrate. Risk of damage during manufacturing. According to some embodiments of the present disclosure, a plurality of panel structures may have different functions, that is, they may be multifunctional panels. For example, in addition to a panel structure with a display function, it may further include an anti-peep function, a rearview mirror function, or a multifunctional panel. Panel structure for other optical adjustment functions, etc.

Although the embodiments and advantages of the present disclosure have been disclosed above, it should be understood that any person with ordinary skill in the art may not depart from this disclosure. Changes, substitutions and embellishments may be made within the spirit and scope of the text. Features of the embodiments of the present disclosure may be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other. In addition, the protection scope of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the relevant technical field can learn from the disclosure It is understood that processes, machines, manufacturing, material compositions, devices, methods and steps currently or developed in the future can be used according to the present disclosure as long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. The scope of protection of this disclosure shall be determined by the scope of the patent application attached. Any embodiment or claim of the disclosure does not need to achieve all the purposes, advantages, and features disclosed in the disclosure.

10B:Display device

12:Backlight module

14:Frame

16: Fixing materials

100: First panel structure

100a: first substrate

100b: Second substrate

200: Second panel structure

200a: Third substrate

200b: Fourth substrate

D2: distance

OLB-1: First outer lead bonding area

OLB-2: Second outer lead bond area

PL: polarizing plate

Claims (9)

A display device includes: a first panel structure, including a first substrate and a second substrate, the area of the second substrate is larger than the area of the first substrate, and the second substrate has a first external wire bonding area (outer lead bonding area); a second panel structure including a third substrate and a fourth substrate; a frame in which the first panel structure and the second panel structure are disposed; and a buffer material disposed between the frame and the first panel structure and between the frame and the second panel structure, and adjacent to the first external wire bonding area; wherein one of the third substrate and the fourth substrate is The first substrate is respectively disposed on opposite sides of the second substrate and at least partially overlaps the first external wire bonding area of the second substrate, and the buffer material covers the first panel structure and the second panel structure. The display device of claim 1, wherein the area of the third substrate is smaller than the area of the fourth substrate. The display device of claim 2, wherein the fourth substrate has a second external wire bonding area, and the area of the second external wire bonding area is equal to or smaller than the area of the first external wire bonding area. The display device as described in claim 1 further includes: A polarizing plate is disposed between one of the third substrate and the fourth substrate and the second substrate. The display device of claim 1, further comprising: a third panel structure disposed below the first panel structure, and the third panel structure includes a fifth substrate and a sixth substrate, wherein the fifth substrate The area is smaller than the area of the sixth substrate. The display device of claim 5, wherein the sixth substrate has a third external wire bonding area, and the area of the third external wire bonding area is equal to or smaller than the area of the first external wire bonding area. The display device of claim 5, wherein the fourth substrate has a second external wire bonding area, the sixth substrate has a third external wire bonding area, and the second external wire bonding area is connected to the third external wire bonding area. The wire bonding areas at least partially overlap. The display device of claim 5, wherein the fourth substrate has a second external wire bonding area, the sixth substrate has a third external wire bonding area, and the second external wire bonding area is connected to the third external wire bonding area. The wire bond areas do not overlap. The display device of claim 1, wherein the first panel structure is a display panel structure, and the second panel structure is a privacy panel structure or a rearview mirror panel structure.

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