TWI818319B - Polishing device, method, auxiliary polishing device, system and method - Google Patents

Abstract

The present disclosure provides a polishing system for polishing a workpiece. The polishing system includes a sensor module and a processor. The sensor module is used to sense the force of the workpiece to form a pressure sequence. The processor is coupled to the sensor module. The processor is configured to receive the pressure sequence; form guide information, the guide information is used to guide the grinding head to polish the workpiece with a preset trajectory; and the deviation of the pressure sequence is formed according to the pressure sequence and the guide information Sequence; According to the deviation sequence, an adjustment instruction is formed to adjust the position of the polishing head. This application also provides a polishing method, an auxiliary polishing device, an auxiliary polishing system, and an auxiliary polishing method.

Description

Grinding device, method, auxiliary grinding device, system and method

The present application relates to the field of grinding technology, in particular to a grinding device, method, auxiliary grinding device, system and method.

With the advancement of technology, users have higher and higher requirements for the quality of workpieces, especially the feel, smoothness and other properties of the workpieces. Among them, the grinding process is an important part of improving this performance. The traditional grinding process cannot quantify the stress information of the workpiece during the grinding process, and cannot accurately control the grinding trajectory and position of the grinding head, resulting in the polished workpiece showing characteristics such as whitishness, uneven texture, and different depths, and the workpiece is inverted during grinding. When using corners (such as the R-angle of 3C workpieces such as mobile phones), it is easy for the grinding device to get stuck or damage the workpiece, thereby affecting the use experience of the workpiece.

In view of the above situation, it is necessary to provide a grinding device, method, auxiliary grinding device, system and method to solve the above problems.

A first aspect of this application provides a polishing system for polishing workpieces, including: a sensing module for sensing the stress of the workpiece to form a pressure sequence; a processor coupled to the sensing module for : Receive the pressure sequence; form guidance information, which is used to guide the grinding head to grind in a preset trajectory The workpiece; based on the pressure sequence and the guidance information, a deviation sequence of the pressure sequence is formed; based on the deviation sequence, an adjustment instruction is formed to adjust the position of the grinding head.

Further, the guidance information includes a preset position and a conversion relationship. The preset position is the calculated position of the grinding head for grinding the workpiece. The conversion relationship is a conversion formula between the pressure of the grinding head and the deformation information of the grinding material on the grinding head. , the processor is further configured to: determine the conversion relationship according to the rigid parameters of the grinding material on the grinding head; form the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relationship; and according to the deformation information and the conversion relationship The preset position forms the deviation sequence.

Further, the processor is further configured to: form an adjusted pressure sequence through a filter based on the pressure sequence; and determine the deviation sequence based on the adjusted pressure sequence and the guidance information.

Further, wherein the guidance information includes a first running trajectory, the processor is further configured to: form the guidance information, including: determining that the device combination for polishing the workpiece includes machine components and the polishing head; based on the device combination for polishing the workpiece The machine component and the grinding head are included to form the first operating trajectory, and the first operating trajectory is the operating trajectory of the grinding head; the processor is further configured to form the deviation according to the pressure sequence and the first operating trajectory. sequence.

Further, the processor is further configured to: form a basic trajectory and a first adjustment amount based on a device combination for polishing the workpiece including the machine element and the polishing head, the basic trajectory being composed in the first direction and the third direction. The operating trajectory of the grinding head is formed on a plane, the first adjustment amount is an adjustment sequence loaded on the basic trajectory on the plane formed by the second direction and the third direction, the first direction, the The second direction and the third direction are two perpendicular to each other, and the first direction is the direction of the grinding head toward the workpiece; the first operating trajectory is formed according to the basic trajectory and the first adjustment amount.

Further, the processor is further configured to: form a basic trajectory and a second adjustment amount based on the device combination for polishing the workpiece including the machine element and the grinding head, the basic trajectory being composed in the first direction and the third direction. movement trajectory formed on the plane, the second adjustment amount is in the second direction On the carrier signal superimposed on the basic trajectory, the first direction, the second direction and the third direction are two perpendicular, and the first direction is the direction of the grinding head towards the workpiece; according to the basic trajectory and the third direction Two adjustment amounts form the first operating trajectory.

Further, the processor is further configured to: form a basic trajectory and a third adjustment amount based on the device combination for polishing the workpiece including the machine element and the grinding head, the basic trajectory is formed in the first direction and the third direction. The movement trajectory formed on the plane, the third adjustment amount is a fixed value superimposed on the basic trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is the direction of the grinding head. The direction of the workpiece; the first operating trajectory is formed based on the basic trajectory and the third adjustment amount.

Further, the processor is further configured to: form a basic trajectory and a fourth adjustment amount based on the device combination for polishing the workpiece including the machine element and the polishing head, the basic trajectory is formed in the first direction and the third direction. The movement trajectory formed on the plane, the fourth adjustment amount is the change value superimposed on the basic trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is the direction of the grinding head. The direction of the workpiece; the first operating trajectory is formed based on the basic trajectory and the fourth adjustment amount.

Further, the guidance information also includes a second running trajectory, and the processor is further configured to: form the guidance information, further including: determining that the device combination also includes a load-bearing module, and the load-bearing module is used to load the workpiece and The workpiece can be rotated or moved; the device combination also includes a load-bearing module to form the second running trajectory, and the second running trajectory is the running trajectory of the workpiece; the processor is further configured to according to the pressure sequence, the The first operating trajectory and the second operating trajectory form the deviation sequence.

Further, the guidance information also includes chamfering information, and the processor is further configured to: determine the chamfering information based on the device combination also including a carrying module; and calculate the chamfering information based on the chamfering information. The first operating trajectory corresponds to the chamfering trajectory of the chamfering information; the second operating trajectory is formed based on the chamfering trajectory.

Further, the processor is further configured to: adjust the first operating trajectory to a third operating trajectory according to the second operating trajectory and the chamfering trajectory; and adjust the first operating trajectory to a third operating trajectory according to the pressure sequence, the third operating trajectory and the second operating trajectory. Run the trajectory to form the deviation sequence.

The second aspect of this application provides a grinding method for controlling a grinding head on a machine component to grind a workpiece, including: receiving a pressure sequence formed when a sensing module senses the stress of the workpiece; forming guidance information, The guidance information is used to guide the grinding head to grind the workpiece in a preset trajectory; according to the pressure sequence and the guidance information, a deviation sequence of the pressure sequence is formed; according to the deviation sequence, an adjustment instruction is formed to adjust the position of the grinding head .

Further, the guidance information includes a preset position and a conversion relationship. The preset position is the calculated position of the grinding head for grinding the workpiece. The conversion relationship is a conversion formula between the pressure of the grinding head and the deformation information of the grinding material on the grinding head. , further comprising: determining the conversion relationship according to the rigid parameters of the grinding material on the grinding head; forming the deformation information corresponding to the pressure sequence according to the pressure sequence and the conversion relationship; forming the deformation information and the preset position according to the deformation information and the preset position This deviation sequence.

Further, the step of forming a deviation sequence of the pressure sequence includes: forming an adjusted pressure sequence through a filter based on the pressure sequence; and determining the deviation sequence based on the adjusted pressure sequence and the guidance information.

Further, the guidance information includes a first operating trajectory, and the step of forming the guidance information includes: determining that the device combination for polishing the workpiece includes the machine component and the grinding head; and that the device combination for polishing the workpiece includes the machine component and the grinding head. The grinding head forms the first operating trajectory, and the first operating trajectory is the operating trajectory of the grinding head; the step of forming the deviation sequence of the pressure sequence includes forming the deviation according to the first operating trajectory and the pressure sequence. sequence.

Further, the step of forming the first running trajectory includes: forming a basic trajectory and a first adjustment amount based on a device combination for polishing the workpiece including the machine element and the grinding head, and the basic trajectory is in the first direction and The running trajectory of the grinding head is formed on the plane formed in the third direction. The first adjustment amount is the adjustment sequence loaded on the basic trajectory on the plane formed in the second direction and the third direction. The third One direction, the second direction and the third direction are two perpendicular to each other, and the first direction is the direction of the grinding head toward the workpiece; the first operating trajectory is formed according to the basic trajectory and the first adjustment amount.

Further, the step of forming the first running trajectory includes: forming a basic trajectory and a second adjustment amount based on a device combination for polishing the workpiece including the machine element and the grinding head, the basic trajectory is in the first direction and A moving trajectory formed on a plane constituted by a third direction. The second adjustment amount is the carrier signal superimposed on the basic trajectory in the second direction. The first direction, the second direction and the third direction are two perpendicular to each other. , the first direction is the direction of the grinding head toward the workpiece; the first operating trajectory is formed according to the basic trajectory and the second adjustment amount.

Further, the step of forming the first running trajectory includes: forming a basic trajectory and a third adjustment amount based on a device combination for polishing the workpiece including the machine element and the grinding head, the basic trajectory is in the first direction and A movement trajectory formed on a plane constituted by a third direction. The third adjustment amount is a fixed value superimposed on the basic trajectory in the first direction. The first direction is perpendicular to the third direction. The first direction is The grinding head faces the direction of the workpiece; the first operating trajectory is formed according to the basic trajectory and the third adjustment amount.

Further, the step of forming the first running trajectory includes: forming a basic trajectory and a fourth adjustment amount based on a device combination for grinding the workpiece including the machine element and the grinding head, the basic trajectory is in the first direction and A movement trajectory formed on a plane formed in a third direction. The fourth adjustment amount is the change value superimposed on the basic trajectory in the first direction. The first direction is perpendicular to the third direction. Straight, the first direction is the direction of the grinding head toward the workpiece; the first operating trajectory is formed according to the basic trajectory and the fourth adjustment amount.

Further, the guidance information also includes a second operating trajectory, and the second operating trajectory is the operating trajectory of the workpiece. The step of forming the deviation sequence further includes: determining that the device combination also includes a load-bearing module, and the load-bearing module The set is used to carry the workpiece and can rotate or move the workpiece; based on the device combination, it also includes a carrying module to form the second operating trajectory; according to the pressure sequence, the first operating trajectory and the second operating trajectory, a This deviation sequence.

Further, the guidance information also includes chamfering information, and the step of forming the second running trajectory includes: determining the chamfering information based on the device combination also including a bearing module; and calculating the third chamfering information based on the chamfering information. A running track is a chamfering track corresponding to the chamfering information; the second running track is formed based on the chamfering track.

Further, the step of forming the deviation sequence further includes: adjusting the first operating trajectory to a third operating trajectory according to the second operating trajectory and the chamfering trajectory; according to the pressure sequence, the third operating trajectory and The second operating trajectory forms the deviation sequence.

A third aspect of the present application provides an auxiliary grinding device for carrying and sensing the workpiece being polished, including: a carrying portion for carrying the workpiece and withstanding at least one of force and torque from the workpiece; and a sensing module , connected to the bearing part; the connecting part is provided between the bearing part and the sensing module; the base is connected to the mounting part and includes a first hollow part, the first hollow part is in conduction with the first channel; the mounting part , located between the sensing module and the base, the mounting part is a hollow structure, and the hollow part is set as the first channel; the sensing module is also connected to a cable, and the cable is used to pass through the first hollow and the first channel, coupled with the sensing module; the sensing module is used to sense at least one of the force and torque, form a pressure value, and transmit the pressure value to the cable through the cable. Grinding device.

Further, the bearing part includes a first hole; the sensing module includes a second hollow part; the connecting part is a hollow structure, and the hollow part is configured as a second channel; the air extraction module includes a trachea, The air pipe is coupled to the first hole and used to penetrate at least one of the first hollow part, the first channel, the second hollow part and the second channel, so as to form a position on the bearing through the first hole. The bonding force between the workpiece on the part and the bearing part.

Further, the base includes: a sealing cover connected to the mounting part and including a second hole; an inner cavity including the first hollow part; the second hole is provided between the first hollow part and the first channel; The moving part is connected to the inner cavity; the inner cavity further includes a sealing part, and the sealing part is provided between the moving part and the first hollow part.

A fourth aspect of this application provides an auxiliary grinding system for assisting a grinding device in grinding workpieces, including: a communicator, used to obtain the first trajectory and the second trajectory; a processor, coupled to the communicator, used to: control the bearing The module performs at least one of pausing, moving and rotating along the first trajectory, and the carrying module is used to carry the workpiece; obtain a trigger signal and determine that the trigger signal reaches the trigger condition; based on the trigger signal reaching the trigger condition, control the load The module changes to perform at least one of pausing, moving and rotating along the second trajectory.

Further, where the trigger signal is the time when the workpiece has been polished along the first trajectory, the system further includes: a timer, coupled to the processor, for obtaining the time; the processor, further for: determining the The time is equal to the preset time; based on the time being equal to the preset time, the carrying module is controlled to change to perform at least one of pausing, moving and rotating along the second trajectory.

Further, wherein the trigger signal is the speed of polishing the workpiece along the first trajectory, the system further includes: a detector coupled to the processor, used to detect the speed; the processor, further used to: determine the speed Less than or equal to the preset speed; based on the speed being less than or equal to the preset speed, the carrying module is controlled to change to at least one of pausing, moving and rotating along the second trajectory.

The fifth aspect of this application provides an auxiliary grinding method for controlling the auxiliary grinding system to cooperate with the grinding device to grind the workpiece, including: obtaining the first trajectory and the second trajectory; controlling the load-bearing module to perform pause, move and At least one of the rotating parts is used to carry the workpiece; Get the trigger signal and determine that the trigger signal reaches the trigger condition; based on the trigger signal reaching the trigger condition, control the carrying module to change to at least one of pause, move and rotate along the second trajectory.

Further, where the trigger signal is the time when the workpiece has been polished along the first trajectory, the step of obtaining the trigger signal and determining that the trigger signal reaches the trigger condition includes: obtaining the time; determining that the time is equal to a preset time; based on The time is equal to a preset time, and the carrying module is controlled to change to perform at least one of pausing, moving and rotating along the second trajectory.

Further, wherein the trigger signal is the speed of polishing the workpiece along the first trajectory, the steps of obtaining the trigger signal and determining that the trigger signal reaches the trigger condition include: detecting the speed; determining that the speed is less than or equal to a preset speed; Based on the speed being less than or equal to the preset speed, the carrying module is controlled to change to perform at least one of pausing, moving and rotating along the second trajectory.

The grinding system and grinding method provided by this application sense the force information of the workpiece and adjust the operating trajectory of the grinding head based on the force information. By controlling the operating trajectory of the grinding head, quantitative control of each grinding process of the workpiece is achieved. The stress situation of the points to improve the quality of the polished workpiece.

700:Grinding system

12:Workpiece

30: Sensing module

720: First processor

80: Carrying module

10:Grinding head

800: Auxiliary grinding device

810: Bearing Department

830:Base

840:Installation Department

850:Cable

831:First hollow part

841: First channel

820:Connection Department

860: Air extraction module

821: Second channel

31:Second hollow part

831:Block

832:Inner cavity

833:Mobile Department

8311:Second hole

8322:Sealing part

870:Motor

880: Timing belt

890:Reducer

90: Protective device

900: Sanding-assisted system

910:Communicator

920: Second processor

940:Detector

930: timer

Figure 1 shows a schematic diagram of a sanding system according to one or more embodiments of the present application.

Figure 2 shows a state schematic diagram of a grinding system according to one or more embodiments of the present application.

Figure 3 shows a schematic diagram of a running trajectory according to one or more embodiments of the present application.

Figure 4 shows a schematic diagram of a grinding method according to one or more embodiments of the present application.

Figure 5 shows a schematic diagram of a grinding method according to one or more embodiments of the present application.

Figure 6 shows a schematic diagram of a grinding method according to one or more embodiments of the present application.

Figure 7 shows a perspective view of a device for assisting grinding according to one or more embodiments of the present application.

Figure 8 shows a cross-sectional view of a device for assisting grinding according to one or more embodiments of the present application.

Figure 9 shows a schematic diagram of a system for assisting grinding according to one or more embodiments of the present application.

Figure 10 shows a schematic diagram of a method of assisted grinding according to one or more embodiments of the present application.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

It should be noted that when an element or element is referred to as being "connected to" another element or element, it can be directly connected to the other element or elements or intervening elements or elements may be present at the same time. When an element or element is referred to as being "disposed on" another element or element, it can be directly on the other element or element or intervening elements or elements may be present at the same time.

Unless otherwise defined, all technical and scientific terms used in this application have the same meanings as commonly understood by those skilled in the technical field of this application. The terms used in the description of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Various implementations of the present application may take the form of fully or partially hardware implementations, fully or partially software implementations, or a combination of software and hardware (eg, firmware implementations). Additionally, as described herein, various embodiments of the present application (e.g., systems and methods) may take the form of a computer program product containing computer-accessible instructions (e.g., electronic software) having, for example, computer software. A computer-readable non-transitory storage medium containing brain-readable and/or computer-executable instructions) in which the computer-accessible instructions are encoded or implemented.

These instructions may be read or accessed and executed by one or more processors to perform or allow performance of the operations described herein. Instructions may be provided in any suitable form, such as original code, compiled code, interpreted code, executable code, static code, dynamic code, assembly code, combinations of the foregoing, etc. The computer program product may be formed using any suitable computer-readable non-transitory storage medium. For example, computer-readable media may include any tangible, non-transitory medium for storing information in a form that can be read or otherwise accessed by one or more computers or processors to which it is functionally coupled. Non-transitory storage media may be implemented as or may include ROM; RAM; magnetic disk storage media; optical storage media; flash memory, etc.

At least some implementations of operating environments and techniques are described herein with reference to block diagrams and flowcharts of methods, systems, devices and computer program products. It will be understood that each block of the block diagrams and flowchart illustrations, and combinations of blocks in the block diagrams and flowchart illustrations, respectively, can be implemented by computer-accessible instructions. In some implementations, computer-accessible instructions may be loaded or incorporated into a general-purpose computer, special-purpose computer, or other programmable information processing device to produce a particular machine that may respond to execution at the computer or processing device. Implements the operations or functions specified in one or more flowchart blocks.

Unless expressly stated otherwise, any scheme, procedure, process or technique set forth in this application shall in no way be construed as requiring that its actions or steps be performed in a specific order. Therefore, when a process or method claim does not actually recite the order in which its actions or steps are to be followed, or when there is no other specific recitation in the claim or description of the subject disclosure that the steps will be limited to a particular order, it in no way means that in any Aspect inference order. This applies to any possible non-explicit basis for the explanation, including: logical matters regarding the arrangement of steps or operating procedures; ordinary meanings arising from grammatical organization or punctuation; the number of embodiments described in the description or drawings, etc., or type.

As used in this application, the terms "environment", "system", "engine", "module", "component", "architecture", "interface", "unit" and the like refer to a computer-related entity or entity having a Or multiple operating device-related entities with limited functionality. The terms "environment", "system", "engine", "module", "component", "architecture", "interface" and "unit" are used interchangeably and always Generally can refer to functional components. Such an entity may be hardware, a combination of hardware and software, software, or software in execution. For example, a module may be implemented as a process running on a processor, a processor, an object, an executable portion of software, an execution thread, a program, and/or a computing device. As another example, both a software application executing on a computing device and the computing device may be implemented as a module. As another example, one or more modules may reside within a process and/or thread of execution. A module can be localized on one computing device or distributed between two or more computing devices. As disclosed herein, modules may execute from a variety of computer-readable non-transitory storage media having various data structures stored thereon. Modules may have one or more packages of data (e.g., data from a component that interacts with another component in a local system, a distributed system, and/or from a component that interacts with another component in a local system, a distributed system, and/or via local and/or remote processes, for example). Another component on a wide area network with other systems communicates via signals (analog or digital) of the component's data) that the signal interacts with.

As another example, a module may be implemented as or may contain a device with defined functionality provided by mechanical components operated by electrical or electronic circuits controlled by software applications or firmware applications executed by a processor. Such a processor may be internal or external to the device and may execute at least part of a software or firmware application. As another example, a module may be implemented as, or may include, a device that provides defined functionality through electronic components without mechanical components. The electronic component may include a processor to execute software or firmware that allows or at least partially facilitates the functionality of the electronic component.

In some embodiments, a module may have one or more data packages (e.g., data from a component that interacts with another component in a local system, a distributed system, and /or communicate via signals (analog or digital) from a component that interacts via signals with another component on, for example, a wide area network with other systems. Additionally, or in other embodiments, modules may communicate or otherwise be coupled via thermal, mechanical, electrical and/or electromechanical coupling mechanisms (eg, conduits, connectors, combinations thereof, etc.). The interface may include input/output (I/O) components and associated processors, applications, and/or other programming components.

As used in this application, the term "communicator" may refer to any type of communications circuit or device. A communicator may be implemented as or may contain several types of network elements, including base stations; router equipment; switching equipment; server equipment; aggregator equipment; bus architecture; combinations of the foregoing; or Analogues. One or more bus architectures may contain industrial bus racks structures, such as Ethernet-based industrial buses, Controller Area Network (CAN) buses, Modbus, other types of field bus architectures, etc.

As used in this application, the term "processor" may refer to any type of processing circuit or device. A processor may be implemented as a combination of processing circuitry or computational processing units (eg, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), or a combination of both). Therefore, for descriptive purposes, a processor may refer to a single-core processor; a single processor with software multi-thread execution capability; a multi-core processor; a multi-core processor with software multi-thread execution capability; a hardware multi-thread technology Multi-core processors; parallel processing (or computing) platforms; and parallel computing platforms with distributed shared memory. In addition, or for another example, the processor may refer to an integrated circuit (IC), an application specific integrated circuit (ASIC), a digital signal processor (Digital Signal Processor, DSP), or a field programmable gate. Array (Field Programmable Gate Array, FPGA), Programmable Logic Controller (PLC), Complex Programmable Logic Device (CPLD), discrete gate circuit or transistor logic, discrete hardware Components, or any combination thereof designed or configured (eg, manufactured) to perform the functions described herein. In some embodiments, the processor may use nanoscale architecture in order to optimize space usage or enhance performance of systems, devices, or other electronic devices in accordance with the present application. For example, a processor may include molecular transistors and/or quantum dot-based transistors, switches, and gates.

In addition, in this specification and the drawings, terms such as "storage", "memory", "data storage", "data memory", "memory", "repository" and the operation of components of the present application Basically any other information storage component with respect to functionality refers to a memory component, an entity implemented in one or more memory devices, or a component forming a memory device. It should be noted that the memory components or memory devices described herein implement or include non-transitory computer storage media that can be read or accessed by a computing device. Such media may be implemented in any method or technology for storage of information, such as machine-accessible instructions (e.g., computer-readable instructions), information structures, program modules, or other information objects.

In addition, in this specification and the drawings, terms such as "storage", "memory", "data storage", "data memory", "memory", "repository" and other terms related to the components of this application The operation and functionality of essentially any other information storage component is a memory component, an entity implemented in one or more memory devices, or a component forming a memory device. A memory component or memory device may be implemented as volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. Furthermore, a memory component or memory device may be removable or non-removable, and/or be internal or external to the computing device or component. Examples of various types of non-transitory storage media may include hard drives, zip drives, CD-ROMs, Digital Video Discs (DVDs) or other optical storage, tape cassettes, tapes, disk storage or other magnetic storage device, flash memory card or other type of memory card, tape cartridge, or any other non-transitory medium suitable for retaining the required information and accessible by the computing device. For example, non-volatile memory may include read-only memory (ROM), programmable ROM (Programmable Read-Only Memory, PROM), electrically programmable ROM (Erasable Programmable Read-Only Memory, EPROM), electrically erasable programmable ROM (Electrically Erasable Programmable Read-Only Memory, EEPROM) or flash memory. Volatile memory may include random access memory (Random Access Memory, RAM) used as external buffer memory. By way of illustration and not limitation, RAM has many forms, such as synchronous RAM (Static Random Access Memory, SRAM), dynamic RAM (Dynamic Random Access Memory, DRAM), synchronous DRAM (Synchronous Dynamic Random Access Memory, SDRAM), double data rate SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory, DDR SDRAM), enhanced SDRAM (Enhanced Synchronous DRAM, ESDRAM), synchronous link DRAM (Sync Link DRAM, SLDRAM) and direct Rambus RAM (Direct Rambus RAM, DRRAM). The disclosed memory devices or memories of the operating or computing environments described herein are intended to include one or more of these and/or any other suitable types of memory.

Unless specifically stated otherwise or understood otherwise in the context in which it is used, conditional language such as "may," "could," "might," or "could" is generally intended to convey that certain implementations may include certain features, elements, and/or operations that other implementations do not. Accordingly, such conditional language is generally not intended to imply that features, elements, and/or operations are in any way required for one or more implementations, or that a The implementation or implementations must include logic for determining whether these features, components, and/or operations are included or will be performed in any particular implementation, with or without user input or prompts.

The computer-readable program instructions of the present application can be downloaded from a computer-readable storage medium or an external computer or external storage device to the corresponding calculation/processing via a network (such as the Internet, a local area network, a wide area network and/or a wireless network) equipment. The network may include copper transmission cables, optical fiber transmission, wireless transmission, routers, firewalls, switches, gateway computers and/or edge servers. A network interface card or network interface in each computing/processing device receives computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable non-transitory file within the corresponding computing/processing device. storage medium. What has been described in this specification and in the drawings includes examples of systems, devices, techniques, and computer program products that individually and in combination allow the tracking and tracing of products manufactured in industrial equipment. part. Of course, it is not possible to describe every possible combination of components and/or methods for the purpose of describing the various elements of the present application, but many other combinations and permutations of the disclosed elements are possible. Therefore, it will be apparent that various modifications can be made without departing from the scope or spirit of the application. Additionally, or alternatively, other embodiments of the present application may be apparent from consideration of the specification and drawings, and practice of the application as presented herein.

The examples set forth in the specification and drawings are to be considered in all respects as illustrative and not restrictive. Although qualified terms are employed herein, they are used in a general and descriptive sense only and not for purposes of limitation.

Referring to FIG. 1 , one or more embodiments of the present application provide a grinding system 700 . The grinding system 700 is used for grinding the workpiece 12 . The grinding system 700 includes a sensing module 30 and a first processor 720 .

The sensing module 30 is used to sense the force on the workpiece 12 to form a pressure sequence.

The first processor 720 is coupled to the sensing module 30 . The first processor 720 is used to receive the pressure sequence and form guidance information, where the guidance information is used to guide the grinding head 10 to grind the workpiece 12 along a preset trajectory. According to the pressure sequence and the guidance information, a deviation sequence of the pressure sequence is formed; according to the deviation sequence, an adjustment instruction is formed to adjust the position of the grinding head 10 .

It can be understood that in other embodiments, the sensing module 30 may include a 6-axis force sensor or a single-axis force sensor, as long as the force on the workpiece 12 can be directly sensed. The sensing module 30 can also be a force sensor with a protection level of IP65 or above to meet the safety requirements for grinding the workpiece 12 .

In this way, please refer to FIG. 2 , the sensing module 30 can be disposed on the carrying module 80 that carries the workpiece 12 to sense the force condition of the workpiece 12 , where the force condition includes multiple points of the grinding portion 410 of the workpiece 12 The force conditions at multiple points form a pressure sequence.

The sensing module 30 sends the pressure sequence to the first processor 720. The first processor 720 receives the pressure sequence and forms guidance information, where the guidance information is used to guide the operation trajectory of the grinding head 10 for grinding the workpiece 12, such as The trajectory is consistent with the shape of the part to be polished of the workpiece 12, such as a circle, a square, or an annular shape, or the operating trajectory is a compound motion trajectory in which the grinding head 10 moves along a circular, square, or annular motion process and simultaneously moves in a direction perpendicular to the annular motion.

The first processor 720 timely adjusts or pre-configures the force exerted by the grinding head 10 on the workpiece 12 during operation based on the movement trajectory and the force on the workpiece 12 in the movement trajectory, that is, the received pressure sequence, that is, the deviation is formed. sequence.

The first processor 720 forms an adjustment instruction based on the deviation sequence to adjust the grinding head 10 to correspond to different positions on different parts of the workpiece 12 to be polished when the grinding head 10 is grinding the workpiece 12, so that each of the grinding parts of the workpiece 12 can be adjusted. The force conditions of the points conform to the preset pressure sequence to achieve quantitative control of the force application of the grinding head 10 on different parts of the workpiece 12 .

For example, the adjustment amount of the operating trajectory can be formed through the deviation sequence, and the adjustment amount is superimposed or otherwise adjusted to the preset operating trajectory to form an adjusted operating trajectory. The adjusted operating trajectory is based on the conversion relationship. Converting to the force application control sequence when grinding the workpiece 12, the force application control sequence is the adjustment instruction. According to the adjustment instruction, the process of grinding the workpiece 12 with the grinding head 10 that meets the requirements of grinding accuracy and is adapted to the current scene and working conditions can be realized. , to obtain the workpiece 12 that meets the grinding accuracy requirements.

Furthermore, the guidance information includes a preset position and a conversion relationship. The preset position is the calculated position of the grinding head 10 when grinding the workpiece 12 , that is, the position information of the grinding head 10 when grinding different grinding points on the workpiece 12 . The conversion relationship is a conversion formula between the pressure of the grinding head 10 and the deformation information of the grinding material on the grinding head 10 . The first processor 720 is further used to: according to the rigidity parameter of the grinding material on the grinding head 10 number to determine the conversion relationship; based on the pressure sequence and conversion relationship, deformation information corresponding to the pressure sequence is formed; based on the deformation information and the preset position, a deviation sequence is formed.

In this way, the first processor 720 determines the conversion relationship based on the rigidity parameters of the grinding material on the grinding head 10 , where the rigidity parameters mainly determine the softness and hardness of the pressed object material (such as sandpaper) (similar to the concept of elastic coefficient) to provide control. Calculate the force/position conversion relationship. The first processor 720 forms deformation information corresponding to the pressure sequence based on the conversion relationship and the pressure sequence. The deformation information is based on a material coefficient s in the force control parameter (which determines the softness/rigidity of the force-bearing material, similar to the elastic coefficient, The unit is mm/N) to set.

For example, attach sandpaper to the grinding head 10, press 0.1mm into the workpiece 12, and then see how much N the force increases, and you can get the material coefficient s of the sandpaper. Therefore, the deformation information is force*s. The first processor 720 forms a deviation sequence based on the deformation information and the preset position of the grinding head 10 , where the deviation sequence is the adjustment information of the grinding head 10 based on the deformation information and the preset position. For example, the grinding head 10 applies a preset pressure. 10N, the deformation amount is 0.2mm, then the grinding head 10 needs to move 0.2mm based on the preset position and deformation direction.

Further, the first processor 720 is further configured to: form an adjusted pressure sequence through a filter according to the pressure sequence; and determine the deviation sequence according to the adjusted pressure sequence and the guidance information.

In this way, the pressure sequence is adjusted through the filter to eliminate high-frequency interference, such as interference caused by vibration of a wind mill. The filter can be a virtual filter or a physical filter. For example, a virtual filter that removes noise is designed and implemented based on LabVIEW Express programming.

Further, where the guidance information includes the first operating trajectory, the first processor 720 is further configured to: form the guidance information, including: determining that the device combination for polishing the workpiece 12 includes machine components and the polishing head 10; based on polishing the workpiece 12 The device combination includes the machine element and the grinding head 10, forming the first operating trajectory, and the first operating trajectory is the operating trajectory of the grinding head 10; The first processor 720 is further configured to form the deviation sequence according to the pressure sequence and the first operating trajectory.

For example, when forming the guidance information, it includes: first determining that the device combination for grinding the workpiece 12 includes a machine element and a grinding head 10 , where the machine element can be a mechanical arm connected to the grinding head 10 and used to control the grinding head according to the control instructions. 10 movement, of course the machine element can also be replaced with other driving elements, as long as it can drive the grinding head 10 to move.

The trajectory along which the machine component drives the grinding head 10 is a first operating trajectory. The first operating trajectory is, for example, a grinding trajectory preset according to the finished product requirements of the workpiece 12, so that after grinding the workpiece 12 through the first operating trajectory, the satisfaction is obtained. Workpieces with precision requirements 12.

The first processor 720 forms the deviation sequence according to the pressure sequence and the first operating trajectory. For example, when the grinding head 10 grinds the straight edge of the frame-type workpiece 12, the workpiece 12 is fixed by the carrying module 80, and the machine component drives the grinding head. 10 movements to polish the workpiece 12.

Specifically, as shown in Figure 2, it includes two coordinate systems, the work coordinate system and the tool coordinate system, where the work coordinate system is a three-dimensional coordinate system established based on the sensing module 30 or based on the workpiece 12 on the load-bearing module 80. The tool coordinate system is a three-dimensional coordinate system established based on the grinding head 10 .

The first direction is schematically the X-axis direction of the work coordinate system, the second direction is the Z-axis direction of the work coordinate system, and the third direction is the Y-axis direction of the work coordinate system (Figure 2 is a two-dimensional view, not shown, but The Y-axis direction can be understood as the vertical direction of the paper).

The basic trajectory is schematically formed as the running trajectory of the grinding head 10 in the XY plane of the work coordinate system (exemplarily a translation trajectory). For the convenience of description, the compound motion of the grinding head 10 in the tool coordinate system is decomposed into the XY plane, ZY The movement of rubbing the workpiece 12 on the plane and XZ plane. As shown in Figure 2, the tool coordinate system follows the movement of the grinding head 10. The figure shows that when the grinding head 10 moves to different positions (such as the first state and the second state), the tool coordinate system will be converted to match the first state. The first state or the second state becomes the tool 1 coordinate system or the tool 2 coordinate system.

Further, the first processor 720 is further configured to form a basic trajectory and a first adjustment amount based on the device combination for grinding the workpiece 12 including the machine element and the grinding head 10 , the basic trajectory is in the first direction and the third The first adjustment amount is the adjustment sequence loaded on the basic trajectory on the plane formed by the second direction and the third direction. The first adjustment amount is direction, the second direction and the third direction are two perpendicular to each other, and the first direction is the grinding The head 10 faces the direction of the workpiece 12; the first running trajectory is formed according to the basic trajectory and the first adjustment amount.

Among them, the first adjustment amount of the grinding head 10 according to the XY plane under the tool coordinate system can be at least one of a straight line, a circle, an ellipse, a diamond, or other plane rubbing settings according to the grinding surface requirements of the grinding head 10 In this way, the running trajectory of the grinding head 10 can be adjusted according to the first adjustment amount to grind the workpiece 12 into different shapes.

Further, the first processor 720 is also configured to form a basic trajectory and a second adjustment amount based on the device combination for polishing the workpiece 12 including the machine element and the polishing head 10 , the basic trajectory is in the first direction and the second adjustment amount. A moving trajectory formed on a plane composed of three directions, the second adjustment amount is the carrier signal superimposed on the basic trajectory in the second direction, the first direction, the second direction and the third direction are vertical in pairs, The first direction is the direction in which the grinding head 10 faces the workpiece 12; the first operating trajectory is formed according to the basic trajectory and the second adjustment amount.

Specifically, please refer to Figure 2 again. The second adjustment amount is to apply a carrier signal with frequency and amplitude along the Y-axis direction of the tool coordinate system, which can be a sine wave, a square wave, etc., or other grinding surfaces according to the grinding head 10 Other axial swing operating trajectories need to be set to enable the grinding head 10 to realize axial swing. In this way, by adjusting the second adjustment amount, the polishing head 10 can customize the polishing of the workpiece 12 , for example, the shape, smoothness, etc. of the polished workpiece 12 can be controlled to enhance the generalization of the workpiece 12 .

Further, the first processor 720 is also configured to form a basic trajectory and a third adjustment amount based on the device combination for polishing the workpiece 12 including the machine element and the polishing head 10 , the basic trajectory is in the first direction and the third adjustment amount. A movement trajectory formed on a plane composed of three directions. The third adjustment amount is a fixed value superimposed on the basic trajectory in the first direction. The first direction is perpendicular to the third direction. The first direction is The grinding head 10 faces the direction of the workpiece 12; the first operating trajectory is formed according to the basic trajectory and the third adjustment amount. Specifically, please refer to Figure 2 again. The third adjustment amount is the increment by which the grinding head 10 is pressed into the workpiece 12 along the Z-axis direction of the tool coordinate system. In this way, the third increment makes the grinding head 10 move along the grinding direction. , that is, the Z-axis direction of the tool coordinate system is close to the workpiece 12 to control the quality of the workpiece 12 polished by the grinding head 10 .

Further, the first processor 720 is further configured to form a basic trajectory and a fourth adjustment amount based on the device combination for polishing the workpiece 12 including the machine element and the polishing head 10 , the basic trajectory is in the first direction and the third The movement trajectory formed on the plane formed by the direction, the fourth adjustment amount is the change value superimposed on the basic trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is the polishing The head 10 faces the direction of the workpiece 12; based on the basic trajectory and the fourth adjustment amount, the first running trajectory is formed.

Specifically, please refer to Figure 2 again. The fourth adjustment amount is to apply a change value along the Z-axis direction of the tool coordinate system. It can be understood that in the actual grinding process, there are two grinding methods. One is that the grinding head 10 overpressures the workpiece 12 The overpressure amount is a fixed value (such as the third adjustment amount). For example, the polishing surface of the grinding head 10 is covered with sandpaper. When the workpiece 12 is polished with sandpaper, the sandpaper is divided into two areas, one is the area that has not been polished, and the other is the area that has not been polished. One is the polished area, and the overpressure amount is a fixed value. This means that the overpressure amount of the two areas is fixed, such as 0.1mm, which facilitates the control of the polishing relationship. The other polishing method is that the overpressure amount is changed. value (such as the fourth adjustment amount), when shifting from the polished area of the sandpaper to the unpolished area, the overpressure amount gradually becomes larger, for example from 0.05mm to 0.1mm, so as to make the sandpaper wear more uniform and increase The service life of sandpaper can better control the accuracy of sandpaper grinding. It can be understood that the workpiece 12 can also be directly polished through the polishing surface of the polishing head 10 .

Further, the guidance information also includes a second running trajectory, and the first processor 720 is further configured to: form the guidance information, further including: determining that the device combination also includes a bearing module 80, and the bearing module 80 is used to carry The workpiece 12 can rotate or move the workpiece 12; the device combination also includes a carrying module 80 to form the second running trajectory, which is the running trajectory of the workpiece 12; the first processor 720 It is further used to form the deviation sequence according to the pressure sequence, the first operating trajectory and the second operating trajectory.

Specifically, please refer to FIG. 2 again. The load-bearing module 80 is a rotatable fixture that can carry the workpiece 12 and drive the workpiece 12 to rotate. Of course, the load-bearing module 80 can also be other mechanisms as long as it can rotate or The movable workpiece 12 is sufficient.

Further, the guidance information also includes chamfering information, and the first processor 720 is further configured to: determine the chamfering information based on the device combination also including the carrying module 80; based on the chamfering information, Calculate a chamfering trajectory corresponding to the first operating trajectory and the chamfering information; form the second operating trajectory based on the chamfering trajectory.

Further, the first processor 720 is further configured to: adjust the first operating trajectory to a third operating trajectory according to the second operating trajectory and the chamfering trajectory; and adjust the first operating trajectory to a third operating trajectory according to the pressure sequence, the third operating trajectory and the third operating trajectory. Two running trajectories form the deviation sequence.

For example, when the grinding head 10 grinds the corner of the workpiece 12, both the grinding head 10 and the carrying module 80 carrying the workpiece 12 move, and the carrying module 80 carries the workpiece 12 to move. The grinding head 10 cooperates with the carrying module 80. , so that the Z direction of the grinding head 10 based on the tool coordinate system remains unchanged, so that the grinding quality of the workpiece 12 is controllable.

Specifically, when the grinding head 10 grinds the corner of the workpiece 12 and the grinding head 10 runs along the first running track, the load-bearing module 80 drives the workpiece 12 to run along the second running track. In order to make the grinding head 10 move along the Z direction of the tool coordinate system Remain unchanged and adjust the first movement trajectory again. The set of adjustment amounts during the operation is the deviation sequence. The deviation sequence is used to adjust the first movement trajectory (trajectory A in Figure 3) to the third movement trajectory (such as B track in Figure 3 ), so that the Z direction of the grinding head 10 based on the tool coordinate system remains unchanged, so that the grinding quality of the polished workpiece 12 is controllable.

For example, please refer to Figure 3. Figure 3 is a schematic diagram of the operating trajectory in one embodiment or multiple embodiments, in which trajectory A is the first trajectory, trajectory B is the third trajectory, and both trajectory A and trajectory B are the grinding head 10. The second running trajectory is the trajectory in which the load-bearing module 80 drives the workpiece 12 to move. The second running trajectory is opposite to the movement direction of the trajectory A and trajectory B. According to the trajectory in which the load-bearing module 80 drives the workpiece 12 to move, According to the chamfering trajectory of the workpiece 12, adjust the running trajectory of the grinding head 10 so that when the grinding head 10 grinds the chamfering of the workpiece 12, the grinding head 10 remains unchanged relative to the load-bearing module 80 along the Z-axis direction of the tool coordinate system to ensure that The quality of the chamfer of the workpiece 12 polished by the grinding head 10.

Specifically, the chamfering (such as the R-angle of 3C products such as mobile phones) is any one of the four corners of the frame-shaped workpiece 12, and the chamfering information is the arc length of the R-angle. Divide the R angle into 5 arc length combinations, and calculate to obtain the angle of rotation along the Z axis of the tool coordinate system when the machine component moves along the 5 equal arcs. It can be an equal or unequal arc length combination, for example 0-10-30-55-80-90 degrees, and then use the negative values of these angles, such as 0, -10, -30, -55, -80, -90, as the trajectory interpolation points of the load module 80, to Control load bearing module 80 rotates along the Z axis of the work coordinate system. In this way, the load-bearing module 80 cooperates with the grinding head 10, and the load-bearing module 80 and the grinding head 10 move along different trajectories respectively, so that the grinding head 10 is at the Z axis of the tool coordinate system during grinding. The axis remains stationary and only translates in the XY axis plane of the tool coordinate system, thereby effectively preventing the occurrence of dead corners when the grinding head 10 grinds the workpiece 12, preventing machine components from getting stuck, and simplifying the control process.

Please refer to Figure 4, which is a grinding method provided in one or more embodiments of the present application. This grinding method is used to control the grinding head 10 on the machine element to grind the workpiece 12. It can be used in the above-mentioned grinding system, and this grinding system is taken as an example. . This polishing method includes the following steps:

Step 1002: Receive a pressure sequence.

The pressure sequence is formed when the sensing module senses the stress of the workpiece 12 .

Step 1004: Form guidance information.

The guidance information is used to guide the grinding head 10 to grind the workpiece 12 along a preset trajectory.

Step 1006: Form a deviation sequence of the pressure sequence based on the pressure sequence and the guidance information.

Step 1008: According to the deviation sequence, an adjustment instruction is formed to adjust the position of the grinding head 10.

Please refer to FIG. 4 again. The sensing module 30 senses the force condition of the workpiece 12 , where the force condition includes the stress condition of multiple points of the part to be polished of the workpiece 12 , and the force conditions of the multiple points form a pressure sequence. According to the received pressure sequence, guidance information is formed, where the guidance information is used to guide the running trajectory of the grinding head 10 for grinding the workpiece 12 , for example, the running trajectory is consistent with the shape of the grinding part of the workpiece 12 , circular or square, or the grinding head 10 A composite motion trajectory that moves along a circular, square, or circular motion process and also moves perpendicular to the circular motion direction.

Based on the motion trajectory and the force on the workpiece 12 in the motion trajectory, that is, the pressure sequence, the force applied to the workpiece 12 during the operation of the grinding head 10 is adjusted or preconfigured in time, that is, a deviation sequence is formed.

According to the deviation sequence, an adjustment instruction is formed to adjust the grinding head 10 when grinding the workpiece 12 so that the grinding head 10 corresponds to different positions on different parts of the workpiece 12 to be grinded, so that the grinding part of the workpiece 12 The force conditions at each point conform to the preset pressure sequence, so as to realize quantitative control of the force application condition of the grinding head 10 for grinding different parts of the workpiece 12 .

For example, the adjustment amount of the operating trajectory can be formed through the deviation sequence, and the adjustment amount is superimposed or otherwise adjusted to the preset operating trajectory to form an adjusted operating trajectory. The adjusted operating trajectory is based on the conversion relationship. Converting to the force application control sequence when grinding the workpiece 12, the force application control sequence is the adjustment instruction. According to the adjustment instruction, the process of grinding the workpiece 12 with the grinding head 10 that meets the requirements of grinding accuracy and is adapted to the current scene and working conditions can be realized. , to obtain the workpiece 12 that meets the grinding accuracy requirements.

Furthermore, the guidance information includes a preset position and a conversion relationship. The preset position is the calculated position of the grinding head 10 when grinding the workpiece 12 , that is, the position information of the grinding head 10 when grinding different grinding points on the workpiece 12 . The conversion relationship is a conversion formula between the pressure of the grinding head 10 and the deformation information of the grinding material on the grinding head 10 . Referring to Figure 5, the polishing method further includes the following steps.

Step 1010: Determine the conversion relationship based on the rigid parameters of the grinding material on the grinding head 10; Step 1012: Form the deformation information corresponding to the pressure sequence based on the pressure sequence and the conversion relationship; Step 1014: Based on the deformation information and the preset position to form the deviation sequence.

In this way, the conversion relationship is determined based on the rigidity parameters of the grinding material on the grinding head 10, where the rigidity parameters mainly determine the softness and hardness of the pressed object material (such as sandpaper) (similar to the concept of elastic coefficient) to provide control of the force/position in the calculation. conversion relationship. Based on the conversion relationship and pressure sequence, the deformation information corresponding to the pressure sequence is formed. The deformation information is based on a material coefficient s in the force control parameter (which determines the softness/rigidity of the force-bearing material, similar to the elastic coefficient, and the unit is mm/N ) to set.

For example, attach sandpaper to the grinding head 10, press 0.1mm into the workpiece 12, and then see how much N the force increases, and you can get the material coefficient s of the sandpaper. Therefore, the deformation information is force*s. The first processor 720 forms a deviation sequence based on the deformation information and the preset position of the grinding head 10 , where the deviation sequence is the adjustment information of the grinding head 10 based on the deformation information and the preset position. For example, the grinding head 10 applies a preset pressure. 10N, the deformation amount is 0.2mm, then the grinding head 10 needs to move 0.2mm based on the preset position and deformation direction.

Further, the step of forming the deviation sequence of the pressure sequence in step 1006 specifically includes: forming an adjusted pressure sequence through a filter according to the pressure sequence; determining the adjusted pressure sequence according to the adjusted pressure sequence and the guidance information. Deviation sequence.

In this way, the pressure sequence is adjusted through the filter to eliminate high-frequency interference, such as interference caused by vibration of a wind mill. The filter can be a virtual filter or a physical filter. For example, a virtual filter that removes noise is designed and implemented based on LabVIEW Express programming.

Further, where the guidance information includes the first operating trajectory, the step of forming the guidance information, as shown in Figure 6, specifically includes: step 1020, determining that the device combination for grinding the workpiece 12 includes the machine component and the grinding head 10; Step 1022. The device combination for grinding the workpiece 12 includes the machine element and the grinding head 10 to form the first operating trajectory. The first operating trajectory is the operating trajectory of the grinding head 10; Step 1024. Form the pressure sequence. The step of the deviation sequence includes forming the deviation sequence according to the first operating trajectory and the pressure sequence.

For example, the device combination for determining the grinding workpiece 12 includes a machine component and a grinding head 10. The machine component can be a mechanical arm, connected to the grinding head 10, and used to control the movement of the grinding head 10 according to the control instructions. Of course, the machine component can also be It can be other driving elements, as long as they can drive the grinding head 10 to move. The trajectory along which the machine component drives the grinding head 10 is a first operating trajectory. The first operating trajectory is, for example, a grinding trajectory preset according to the finished product requirements of the workpiece 12, so that after grinding the workpiece 12 through the first operating trajectory, the satisfaction is obtained. Workpieces with precision requirements 12. The deviation sequence is formed based on the pressure sequence and the first operating trajectory. For example, when the grinding head 10 is grinding the straight edge of the frame-type workpiece 12, the workpiece 12 is fixed by the carrying module 80, and the machine component drives the grinding head 10 to move to grind the workpiece. 12.

Please refer to Figure 2 again, which includes two coordinate systems, the work coordinate system and the tool coordinate system. The work coordinate system is a three-dimensional coordinate system established based on the sensing module 30 or the workpiece 12 on the load-bearing module 80. The tool coordinate system The system is a three-dimensional coordinate system established based on the grinding head 10 .

The first direction is schematically the X-axis direction of the work coordinate system, the second direction is the Z-axis direction of the work coordinate system, and the third direction is the Y-axis direction of the work coordinate system (Figure 2 is a two-dimensional view, not shown, but The Y-axis direction can be understood as the vertical direction of the paper).

The basic trajectory is schematically formed as the running trajectory of the grinding head 10 in the XY plane of the work coordinate system (exemplarily a translation trajectory). For the convenience of description, the compound motion of the grinding head 10 in the tool coordinate system is decomposed into the XY plane, ZY The movement of rubbing the workpiece 12 on the plane and XZ plane. As shown in Figure 2, the tool coordinate system follows the movement of the grinding head 10. The figure shows that when the grinding head 10 moves to different positions (such as the first state and the second state), the tool coordinate system will be converted to match the first state. The first state or the second state becomes the tool 1 coordinate system or the tool 2 coordinate system.

Further, in step 1022, the step of forming the first operating trajectory includes: forming a basic trajectory and a first adjustment amount based on a device combination for polishing the workpiece 12 including the machine element and the grinding head 10. The basic trajectory is It is the running trajectory of the grinding head 10 formed on the plane formed by the first direction and the third direction, and the first adjustment amount is loaded into the basic trajectory on the plane formed by the second direction and the third direction. In the adjustment sequence on, the first direction, the second direction and the third direction are two perpendicular to each other, and the first direction is the direction of the grinding head 10 towards the workpiece 12; according to the basic trajectory and the first adjustment amount, The first running trajectory is formed. Among them, the first adjustment amount of the grinding head 10 according to the XY plane under the tool coordinate system can be at least one of a straight line, a circle, an ellipse, a diamond, or other plane rubbing settings according to the grinding surface requirements of the grinding head 10 In this way, the running trajectory of the grinding head 10 can be adjusted according to the first adjustment amount to grind the workpiece 12 into different shapes.

Further, in step 1022, the step of forming the first operating trajectory includes: forming a basic trajectory and a second adjustment amount based on the device combination for polishing the workpiece 12, including the machine element and the grinding head 10. The trajectory is a movement trajectory formed on a plane formed by the first direction and the third direction. The second adjustment amount is the carrier signal superimposed on the basic trajectory in the second direction. The first direction, the second direction and The third directions are vertical in pairs, and the first direction is the direction in which the grinding head 10 faces the workpiece 12; the first operating trajectory is formed according to the basic trajectory and the second adjustment amount.

Specifically, please refer to Figure 2 again. The second adjustment amount is to apply a carrier signal with frequency and amplitude along the Y-axis direction of the tool coordinate system, which can be a sine wave, a square wave, etc., or other grinding surfaces according to the grinding head 10 Other axial swing operating trajectories need to be set to enable the grinding head 10 to realize axial swing. In this way, by adjusting the second adjustment amount, the polishing head 10 can customize the polishing of the workpiece 12 , for example, the shape, smoothness, etc. of the polished workpiece 12 can be controlled to enhance the generalization of the workpiece 12 .

Further, in step 1022, the step of forming the first operating trajectory includes: forming a basic trajectory and a third adjustment amount based on the device combination for polishing the workpiece 12, including the machine element and the grinding head 10. The trajectory is a movement trajectory formed on a plane formed by the first direction and the third direction. The third adjustment amount is a fixed value superimposed on the basic trajectory in the first direction. The first direction and the third direction Vertically, the first direction is the direction in which the grinding head 10 faces the workpiece 12; the first operating trajectory is formed according to the basic trajectory and the third adjustment amount.

Specifically, please refer to Figure 2 again. The YZ plane of the Z axis and the Y axis of the tool coordinate system forms the running trajectory of the grinding head 10. The grinding head 10 rubs the workpiece 12 on the YZ plane. The third adjustment amount is along the tool coordinate system. In the Z-axis direction, an increment is applied for the grinding head 10 to press into the workpiece 12. In this way, the third increment makes the grinding head 10 close to the workpiece 12 along the grinding direction, that is, the Z-axis direction of the tool coordinate system, so as to control the grinding head 10. The quality of the polished workpiece 12.

Further, in step 1022, the step of forming the first operating trajectory includes: forming a basic trajectory and a fourth adjustment amount based on the device combination for polishing the workpiece 12, including the machine element and the grinding head 10. The trajectory is a movement trajectory formed on a plane formed by the first direction and the third direction. The fourth adjustment amount is the change value superimposed on the basic trajectory in the first direction. The first direction and the third direction Vertically, the first direction is the direction in which the grinding head 10 faces the workpiece 12; the first operating trajectory is formed according to the basic trajectory and the fourth adjustment amount.

Specifically, please refer to Figure 2 again. The fourth adjustment amount is to apply a change value along the Z-axis direction of the tool coordinate system. It can be understood that in the actual grinding process, there are two grinding methods. One is that the grinding head 10 overpressures the workpiece 12 The overpressure amount is a fixed value (such as the third adjustment amount). For example, the polishing surface of the grinding head 10 is covered with sandpaper. When the workpiece 12 is polished with sandpaper, the sandpaper is divided into two areas, one is the area that has not been polished, and the other is the area that has not been polished. One is the polished area, and the overpressure amount is a fixed value, which means that the polished overpressure amount in both areas is A fixed value, such as 0.1mm, is convenient for controlling the polishing relationship; another polishing method is that the overpressure amount is a changing value (such as the fourth adjustment amount). When the polished area of the sandpaper is shifted to the unpolished area, the overpressure is changed. The amount of pressure gradually increases, for example from 0.05mm to 0.1mm, to make the sandpaper wear more even, increase the service life of the sandpaper, and better control the accuracy of the sandpaper. It can be understood that the workpiece 12 can also be directly polished through the polishing surface of the polishing head 10 .

Further, the guidance information also includes a second operating trajectory, and the second operating trajectory is the operating trajectory of the workpiece 12. The step of forming the deviation sequence further includes: determining that the device combination also includes the carrying module 80, the The carrying module 80 is used to carry the workpiece 12 and can rotate or move the workpiece 12; based on the device combination, the carrying module 80 is also included to form the second running trajectory; according to the pressure sequence, the first running trajectory and the The second running trajectory forms the deviation sequence.

Specifically, please refer to FIG. 2 again. The load-bearing module 80 is a rotatable fixture that can carry the workpiece 12 and drive the workpiece 12 to rotate. Of course, the load-bearing module 80 can also be other mechanisms as long as it can rotate or The movable workpiece 12 is sufficient.

Further, the guidance information also includes chamfering information, and the step of forming the second running trajectory includes: determining the chamfering information based on the device combination also including the carrying module 80; calculating the chamfering information based on the chamfering information. The first operating trajectory corresponds to the chamfering trajectory of the chamfering information; the second operating trajectory is formed based on the chamfering trajectory.

When the grinding head 10 grinds the corner of the workpiece 12 and the grinding head 10 runs along the first running track, the load-bearing module 80 drives the workpiece 12 to run along the second running track. In order to keep the Z direction of the grinding head 10 based on the tool coordinate system unchanged , adjust the first movement trajectory of the grinding head 10. The set of adjustment amounts during the operation is the deviation sequence. The deviation sequence is used to keep the Z direction of the grinding head 10 based on the tool coordinate system unchanged, so that the polished workpiece 12 The polishing quality is controllable.

Further, the step of forming the deviation sequence further includes: adjusting the first operating trajectory to a third operating trajectory according to the second operating trajectory and the chamfering trajectory; according to the pressure sequence, the third operating trajectory and The second operating trajectory forms the deviation sequence.

For example, when the grinding head 10 grinds the corner of the workpiece 12, both the grinding head 10 and the bearing module 80 carrying the workpiece 12 move, and the bearing module 80 carries the workpiece 12 to move. By the grinding head 10 and the bearing The module 80 cooperates to keep the Z direction of the grinding head 10 based on the tool coordinate system unchanged, so that the grinding quality of the workpiece 12 can be controlled.

Specifically, when the grinding head 10 grinds the corner of the workpiece 12 and the grinding head 10 runs along the first running track, the load-bearing module 80 drives the workpiece 12 to run along the second running track. In order to make the grinding head 10 move along the Z direction of the tool coordinate system Remain unchanged and adjust the first movement trajectory again. The set of adjustment amounts during the operation is the deviation sequence. The deviation sequence is used to adjust the first movement trajectory (trajectory A in Figure 3) to the third movement trajectory (such as B track in Figure 3 ), so that the Z direction of the grinding head 10 based on the tool coordinate system remains unchanged, so that the grinding quality of the polished workpiece 12 is controllable.

For example, please refer to Figure 3. Figure 3 is a schematic diagram of the operating trajectory in one embodiment or multiple embodiments, in which trajectory A is the first trajectory, trajectory B is the third trajectory, and both trajectory A and trajectory B are the grinding head 10. The second running trajectory is the trajectory in which the load-bearing module 80 drives the workpiece 12 to move. The second running trajectory is opposite to the movement direction of the trajectory A and trajectory B. According to the trajectory in which the load-bearing module 80 drives the workpiece 12 to move, According to the chamfering trajectory of the workpiece 12, adjust the running trajectory of the grinding head 10 so that when the grinding head 10 grinds the chamfering of the workpiece 12, the grinding head 10 remains unchanged relative to the load-bearing module 80 along the Z-axis direction of the tool coordinate system to ensure that The quality of the chamfer of the workpiece 12 polished by the grinding head 10.

Specifically, the chamfering (such as the R-angle of 3C products such as mobile phones) is any one of the four corners of the frame-shaped workpiece 12, and the chamfering information is the arc length of the R-angle. Divide the R angle into 5 arc length combinations, and calculate to obtain the angle of rotation along the Z axis of the tool coordinate system when the machine component moves along the 5 equal arcs. It can be an equal or unequal arc length combination, for example 0-10-30-55-80-90 degrees, and then use the negative values of these angles, such as 0, -10, -30, -55, -80, -90, as the trajectory interpolation points of the load module 80, to Control the rotation of the load-bearing module 80 along the Z-axis of the work coordinate system. In this way, the load-bearing module 80 cooperates with the grinding head 10, and the load-bearing module 80 and the grinding head 10 move along different trajectories respectively, so that the grinding head 10 moves in the tool during grinding. The Z-axis of the coordinate system remains stationary and only translates in the XY-axis plane of the tool coordinate system, thereby effectively preventing the occurrence of dead corners when the grinding head 10 grinds the workpiece 12, preventing machine components from getting stuck, and simplifying the control process.

Please refer to FIG. 7 , which is an auxiliary grinding device provided by one or more embodiments of the present application, and is used for carrying and sensing the workpiece 12 to be polished. The auxiliary grinding device is exemplified by the above-mentioned bearing module 80 . Specifically, the device 800 for auxiliary grinding includes a bearing part 810, a sensing module 30 and a base 830. The bearing part 810 is used to carry the workpiece 12 and withstand at least one of the force and torque from the workpiece 12; the sensing module 30 Connected to the bearing part 810, the sensing module 30 is coupled with a polishing device. The sensing module 30 is used to sense force and torque, form a pressure value and output the pressure value to the polishing device. The base 830 is connected to the sensing module 30 , and the base 830 is used to fix the sensing module 30 .

In this way, by carrying the workpiece 12 on the bearing part 810 , the sensing module 30 senses at least one of the force and the moment on the bearing part 810 , where the force is the interaction between the workpiece 12 and the grinding device when the grinding device grinds the workpiece 12 . The force is transmitted to the bearing part 810 through the workpiece 12 and sensed by the sensing module 30. The sensing module 30 sends the pressure value to the grinding device so that the grinding device can adjust according to the force and torque exerted on the workpiece 12. The grinding intensity and angle are used to realize the auxiliary grinding device to grind the workpiece 12.

It can be understood that the sensing module 30 can transmit the pressure value to the polishing device through wired or wireless means, such as Bluetooth transmission, wireless communication transmission or cable transmission. However, such transmission needs to solve the problem of signal masking by the metal surface of the sensing module and the connecting part. Using a wireless transmission method with higher penetration capability can avoid signal transmission defects, which will not be described again here.

Further, the sensing module 30 includes at least one of a force sensor and a torsion meter, as long as it can sense force and torque. The force sensor and the torque meter can respectively sense the force and torque from the bearing part. According to the force curve formed by the force information, it can be judged whether the grinding is carried out according to the preset trajectory. According to the torque situation formed by the torque information, it can be judged whether the grinding is performed according to the preset trajectory. Whether there is inappropriate deflection in a certain direction, in scenes with lower grinding accuracy requirements, only a force sensor is needed, but in scenes with higher grinding accuracy requirements, precise sensing of force and torque is required. Therefore, a combination of a force sensor and a torque meter is required to complete the sensing process and feed it back to the robotic arm to control the current or next grinding accuracy through instant feedback or subsequent adjustment, forming a positive loop of benign repeated calculations.

Alternatively, the sensing module 30 includes a 6-axis force sensor. The 6-axis force sensor can sense the components of the force on the X-axis, Y-axis and Z-axis of the work coordinate system, and the torque on the X-axis, Y-axis and Z-axis of the work coordinate system respectively. Compared with the combination of a force sensor and a torque meter, the deflection angle of the shaft is simpler to install and more accurate. This application uses a 6-axis force sensor to illustrate the technical solution, but it is not limited to this.

Further, the sensing module 30 is a force sensor with a protection level of IP65 or above. Choosing this level of force sensor can effectively prevent cutting fluid or wear debris from intruding into the sensing module, causing inaccurate sensing or damaging the sensing module.

Further, the force range of the bearing part 810 is between 0 and 100N. After calculation, the force on the bearing part 810 during the calibration process is the force corresponding to 1kg, which is about 9.8N. However, during the actual polishing process, the highest peak value can reach the force corresponding to 10kg, which is about 98N, and some safety margin is added. The force range of the bearing part 810 can be determined, which is approximately between 0 and 100N, but it can also be adjusted according to the actual situation. This force range is used to limit the force between the grinding head 10 and the bearing part 810 to prevent excessive force from damaging the grinding head 10 or the bearing part 810 or damaging the workpiece 12 during the grinding process.

Please refer to FIG. 8 , which is a cross-sectional view of an auxiliary polishing device 800 provided by one or more embodiments of the present application. The auxiliary polishing device 800 further includes a mounting part 840 and a cable 850 . The mounting part 840 is provided on the sensing module 30 and the cable 850 . Between the bases 830, the mounting part 840 is a hollow structure, and the hollow part is set as a first channel 841; the base 830 includes a first hollow part 831, and the first hollow part 831 is connected with the first channel 841. The cable 850 is connected to the sensing module 30 and is used to transmit the pressure value from the sensing module 30 through the first hollow part 831 and the first channel 841 .

In this way, the first hollow portion 831 and the first channel 841 accommodate the cable 850, and the pressure value sensed by the sensing module 30 is transmitted to the polishing device through the cable 850, thereby enhancing the overall device 800 for assisting polishing. The structure is compact and the cable 850 is sealed to extend the service life of the cable 850 and reduce the external influence on the pressure value transmitted by the cable 850.

Furthermore, the auxiliary grinding device 800 further includes a connecting part 820 and an air extraction module 860. The connecting part 820 is provided between the bearing part 810 and the sensing module 30. The connecting part 820 is a hollow structure, and the hollow part of the connecting part 820 is set to the second channel 821.

The bearing part 810 includes a first hole 811, and the sensing module 30 includes a second hollow part 31; the air extraction module 860 includes an air pipe 861, which is coupled to the first hole 811 and used to penetrate the first hollow part 831 and the first hollow part 831. At least one of the channel 841 , the second hollow part 31 and the second channel 821 forms a bonding force between the workpiece 12 placed on the bearing part 810 and the bearing part 810 through the first hole 811 . in this way, The air extraction module 860 extracts the air between the workpiece 12 and the carrying part 810 through the air pipe 861 to improve the binding force between the carrying part 810 and the workpiece 12 on the carrying part 810, that is, the carrying part 810 is assisted by vacuum adsorption or The workpiece 12 on the bearing part 810 is directly fixed.

Further, the base 830 includes a sealing cover 831, an inner cavity 832 and a moving part 833. The sealing cover 831 is connected to the mounting part 840, and the sealing cover 831 includes a second hole 8311 (not shown). The inner cavity 832 includes a first hollow portion 831 . The second hole 8311 is provided between the first hollow portion 831 and the first channel 841 . The moving part 833 is connected to the inner cavity 832. The inner cavity 832 further includes a sealing portion 8322 provided between the moving portion 833 and the first hollow portion 831 . In this way, the sealing cover 831 and the moving part 833 cooperate to prevent external dust or leaking polishing fluid from entering the first hollow part 831 from the bottom up of the moving part 833 .

Further, the auxiliary grinding device 800 further includes a motor 870, a synchronous belt 880 and a reducer 890. The synchronous belt 880 is connected to the motor 870. The moving part 833 includes a pulley 8311 (not shown), and the pulley 8311 is connected to the synchronous belt 880 . The reducer 890 is connected to the pulley 8311, and the reducer 890 is used to transmit the torque from the motor 870 to control the rotation of the base 830. In this way, the motor 870 drives the synchronous belt 880 to move, the synchronous belt 880 drives the pulley 8311 to rotate, and the pulley 8311 drives the reducer 890 to rotate, thereby realizing the rotation of the control base 830.

Furthermore, the auxiliary grinding device 800 further includes a protective device 90 , which is disposed on the connecting portion 820 and surrounds the sensing module 30 . In this way, the protective device 90 prevents cutting fluid or wear debris from intruding into the sensing module 30 .

Please refer to FIG. 9 . An auxiliary grinding system 900 is provided for one or more embodiments of the present application. The auxiliary grinding system 900 is used to assist the grinding device in grinding the workpiece 12 . The auxiliary grinding system 900 includes a communicator 910 and a second processor. 920. When the auxiliary polishing system 900 is used in conjunction with the polishing system 700 , the second processor 920 can also be the same processor as the first processor 720 to jointly implement the first processor 720 and the second processor 920 function.

Among them, the communicator 910 is used to obtain the first trajectory and the second trajectory. The second processor 920 is coupled to the communicator, and the second processor 920 is used to: control the carrying module 80 to perform at least one of pausing, moving and rotating along the first trajectory. The carrying module 80 is used to carry the workpiece 12; Get the trigger signal and confirm The trigger signal reaches the trigger condition; based on the trigger signal reaching the trigger condition, the carrying module 80 is controlled to change to perform at least one of pause, movement and rotation along the second trajectory.

Please refer to FIG. 7 again. The carrying module 80 carries the workpiece 12 . The second processor 920 controls the carrying module 80 to perform at least one of pausing, moving and rotating along the first trajectory. That is, the second processor 920 is used to control the carrying module 80 to perform at least one of pausing, moving and rotating along the first trajectory. The group 80 moves, and the second processor 920 receives a trigger signal. The trigger signal refers to a signal that the grinding head 10 is about to switch from grinding the straight edge of the workpiece 12 to grinding the chamfer (or from grinding the chamfer to grinding the straight edge). When the head 10 is about to switch from grinding the straight edge of the workpiece 12 to grinding the chamfer (or from grinding the chamfer to grinding the straight edge), the time, speed or position of the grinding head 10 changes. For example, the grinding head 10 is grinding along the first trajectory. When the edge is straight, the speed is 20mm/s. When the machine component is about to switch from grinding the straight edge to grinding the chamfer, for example, the trigger signal is triggered when there is still 20mm from the actual start of grinding the chamfer. Since the speed of grinding the chamfer is different from the grinding speed, The speed of the straight edge is different. For example, the speed of grinding and chamfering is 15mm/s. When there is still 20mm before the actual start of grinding and chamfering, the speed is automatically adjusted, that is, it gradually decreases from 20mm/s to 15mm/s, and Switch the grinding track from grinding the straight edge along the first track to grinding the chamfer along the second track to achieve the purpose of smooth transition grinding, reduce the time to adjust the speed, and make the grinding effect better. In one embodiment, the trigger signal is the time when the workpiece 12 has been polished along the first trajectory, and the auxiliary polishing system 900 further includes a timer 930 .

The timer 930 is coupled to the second processor 920, and the timer 930 is used to obtain the time.

The second processor 920 is further configured to: determine that the time is equal to the preset time; based on the time being equal to the preset time, control the carrying module 80 to change to perform at least one of pausing, moving and rotating along the second trajectory.

For example, at this time, the grinding head 10 is grinding the straight edge of the workpiece 12 and is about to switch from grinding the straight edge to grinding the chamfer. When this time is equal to the preset time, for example, 15 seconds is the preset time, the carrying module 80 changes the grinding time. trajectory, since the speed of grinding chamfers is different from that of grinding straight edges, for example, the speed of grinding chamfers is 15mm/s, and the speed of grinding straight edges is 20mm/s, then there will be 15 seconds left before the actual start of grinding chamfers, or When the straight edge has been polished for 15 seconds, but not limited to this, by automatically adjusting the speed, gradually decreasing from 20mm/s to 15mm/s, and switching the grinding track from straight edge polishing to chamfering, a smooth transition of polishing can be achieved process, reducing the time for adjusting the speed and making the polishing effect better.

In another embodiment, where the trigger signal is the speed of polishing the workpiece 12 along the first trajectory, the system further includes a detector 940 .

The detector 940 is coupled to the second processor 920 and is used for detecting the speed.

The second processor 920 is further configured to: determine that the speed is less than or equal to the preset speed; based on the speed being less than or equal to the preset speed, control the carrying module 80 to change to perform pause, move and rotate along the second trajectory. At least one.

When the grinding head 10 grinds the straight edge and chamfers of the workpiece 12, the speed and position of the grinding head 10 change. For example, when grinding the straight edge along the first trajectory, the grinding head 10 moves along the grinding trajectory (exemplarily: The speed in the Y direction (under the tool coordinate system) gradually increases from 0 to 20mm/s. When the machine component is about to switch from grinding straight edges to grinding chamfers, the speed gradually decreases from 20mm/s to 15mm/s by automatically adjusting the speed. , the trigger signal is the moving speed of the grinding head 10. When the speed of the grinding head 10 is less than or equal to the preset speed, the grinding track is switched from grinding the straight edge along the first track to grinding the chamfer along the second track, achieving a smooth transition of the grinding process and reducing the Adjust the speed time to make the sanding effect better.

Referring to Figure 10, the present application also provides an auxiliary grinding method for controlling the auxiliary grinding system 700 to cooperate with the grinding device to grind the workpiece 12. The auxiliary grinding method includes the following steps.

Step 1030: Obtain the first trajectory and the second trajectory.

Step 1032: Control the carrying module 80 to perform at least one of pausing, moving and rotating along the first trajectory.

The carrying module 80 is used to carry the workpiece 12; step 1034, obtain a trigger signal, and determine that the trigger signal reaches the trigger condition; step 1036, based on the trigger signal reaching the trigger condition, control the load module 80 to change to a position along the second The trajectory performs at least one of pause, move, and rotate.

In this way, by setting the trigger conditions for the machine components to switch between grinding straight edges and grinding chamfers, and switching the grinding speed and grinding trajectory through the trigger conditions, changing from the first trajectory to the second trajectory, a smooth transition of the grinding process can be achieved, and adjustments can be reduced. The speed of time makes the sanding effect better.

Further, where the trigger signal is the time during which the workpiece 12 has been polished along the first trajectory, the step of obtaining the trigger signal and determining that the trigger signal reaches the trigger condition includes: obtaining the time; It is determined that the time is equal to the preset time; based on the time being equal to the preset time, the carrying module 80 is controlled to change to perform at least one of pausing, moving and rotating along the second trajectory.

For example, at this time, the grinding head 10 is grinding the straight edge of the workpiece 12 and is about to switch from grinding the straight edge to grinding the chamfer. When this time is equal to the preset time, for example, 15 seconds is the preset time, the carrying module 80 changes the grinding time. trajectory, since the speed of grinding chamfers is different from that of grinding straight edges, for example, the speed of grinding chamfers is 15mm/s, and the speed of grinding straight edges is 20mm/s, then there will be 15 seconds left before the actual start of grinding chamfers, or When the straight edge has been polished for 15 seconds, but not limited to this, by automatically adjusting the speed, gradually decreasing from 20mm/s to 15mm/s, and switching the grinding track from straight edge polishing to chamfering, a smooth transition of polishing can be achieved process, reducing the time for adjusting the speed and making the polishing effect better.

Further, where the trigger signal is the speed of polishing the workpiece 12 along the first trajectory, the steps of obtaining the trigger signal and determining that the trigger signal reaches the trigger condition include: detecting the speed; determining that the speed is less than or equal to the preset speed. ; Based on the speed being less than or equal to the preset speed, the carrying module 80 is controlled to change to perform at least one of pause, movement and rotation along the second trajectory.

Schematically, when the grinding head 10 grinds the straight edge and chamfers of the workpiece 12, the speed and position of the grinding head 10 change. For example, when the grinding head 10 grinds the straight edge along the first trajectory, it moves along the grinding trajectory (example (characterized as the Y direction in the tool coordinate system) speed gradually increases from 0 to 20mm/s. When the machine component is about to switch from grinding straight edges to grinding chamfers, the speed gradually decreases from 20mm/s to 15mm by automatically adjusting the speed. /s, the trigger signal is the moving speed of the grinding head 10. When the speed of the grinding head 10 is less than or equal to the preset speed, the grinding track is switched from grinding the straight edge along the first track to grinding the chamfer along the second track, achieving a smooth transition of the grinding process. , reduce the time to adjust the speed and make the polishing effect better.

In addition, those skilled in the art can also make other changes within the spirit of this application. Of course, these changes made based on the spirit of this application should be included in the scope of protection claimed by this application. For purposes of explanation, the foregoing description has been described with reference to specific embodiments. However, the above illustrative discussion is not intended to be exhaustive or to limit the application to the precise forms disclosed. Based on the above teachings, many modifications and variations are possible, for example, the sequence structure of the flow chart can be defaulted or adjusted. The embodiment was chosen and described in order to explain the principles of the application and its practical application and thereby enable the technical Others skilled in the art will be able to best utilize this application and the various described embodiments with various modifications as are suited to the particular use contemplated.

To sum up, this invention meets the requirements for an invention patent and a patent application should be filed in accordance with the law. However, the above are only preferred embodiments of the present invention. For those familiar with the art of this case, equivalent modifications or changes made in accordance with the spirit of the present invention should be covered by the following patent applications.

700:Grinding system

720: First processor

30: Sensing module

Claims (20)

A grinding system for grinding workpieces, the improvement of which is that it includes: a sensing module for sensing the stress of the workpiece to form a pressure sequence; a processor coupled to the sensing module for : Receive the pressure sequence; form guidance information, the guidance information is used to guide the grinding head to polish the workpiece in a preset trajectory; form a deviation sequence of the pressure sequence according to the pressure sequence and the guidance information; according to The deviation sequence forms an adjustment instruction to adjust the position of the grinding head; forming the guidance information includes: determining that the device combination for grinding the workpiece includes machine components and the grinding head; based on grinding the workpiece The device combination includes the machine element and the grinding head, forming a first operating trajectory, and the first operating trajectory is the operating trajectory of the grinding head; the processor is further configured to: according to the pressure sequence and The first operating trajectory forms the deviation sequence; the processor is further configured for at least one of the following: a device combination based on grinding the workpiece including the machine element and the grinding head to form a basic trajectory and a first adjustment amount. The basic trajectory is the running trajectory of the grinding head formed on the plane formed by the first direction and the third direction. The first adjustment amount is the movement trajectory of the grinding head formed in the second direction and the third direction. The adjustment sequence is loaded on the basic track on a plane composed of directions, the first direction, the second direction and the third direction are perpendicular to each other, and the first direction is the direction of the grinding head. The direction of the workpiece; the first operating trajectory is formed based on the basic trajectory and the first adjustment amount; or the basic trajectory is formed based on a device combination for polishing the workpiece including the machine element and the grinding head. and a second adjustment amount. The basic trajectory is a movement trajectory formed on a plane formed by the first direction and the third direction. The second adjustment amount is a carrier signal superimposed on the basic trajectory in the second direction. , the first direction, the second direction and the third direction are two perpendicular to each other, and the first direction is the direction in which the grinding head faces the workpiece; The first operating trajectory is formed based on the basic trajectory and the second adjustment amount; or the basic trajectory and the third adjustment amount are formed based on a device combination for grinding the workpiece including the machine element and the grinding head, The basic trajectory is a movement trajectory formed on a plane formed by the first direction and the third direction, the third adjustment amount is a fixed value superimposed on the basic trajectory in the first direction, and the third adjustment amount is a fixed value superimposed on the basic trajectory in the first direction. One direction is perpendicular to the third direction, and the first direction is the direction of the grinding head toward the workpiece; the first operating trajectory is formed based on the basic trajectory and the third adjustment amount; or based on The device combination for grinding the workpiece includes the machine element and the grinding head, forming a basic trajectory and a fourth adjustment amount. The basic trajectory is a movement trajectory formed on a plane formed by the first direction and the third direction. The fourth adjustment amount is the change value superimposed on the basic trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is the direction of the grinding head toward the The direction of the workpiece; the first operating trajectory is formed based on the basic trajectory and the fourth adjustment amount. The grinding system of claim 1, wherein the guidance information includes a preset position and a conversion relationship, the preset position is the calculated position of the grinding head grinding the workpiece, and the conversion relationship is the pressure of the grinding head and the conversion formula of the deformation information of the grinding material on the grinding head, the processor is further configured to: determine the conversion relationship according to the rigid parameters of the grinding material on the grinding head; and determine the conversion relationship according to the pressure sequence and the conversion relationship , forming the deformation information corresponding to the pressure sequence; forming the deviation sequence according to the deformation information and the preset position. The polishing system of claim 1, wherein the processor is further configured to: form an adjusted pressure sequence through a filter according to the pressure sequence; and according to the adjusted pressure sequence and the guidance information , determine the deviation sequence. The polishing system of claim 1, wherein the guidance information also includes a second running trajectory, and the processor is further configured to: form the guidance information, further comprising: determining that the device combination also includes a carrying module , the carrying module is used to carry the workpiece and can rotate or move the workpiece; based on the device combination, it also includes a carrying module to form the second running trajectory, and the second running trajectory is the The running track of the workpiece; the processor is further configured to form the deviation sequence according to the pressure sequence, the first running track and the second running track. The grinding system of claim 4, wherein the guidance information also includes chamfering information, and the processor is further configured to: determine the chamfering information based on the device combination further including a carrying module; The chamfering information is used to calculate the chamfering trajectory corresponding to the first operating trajectory and the chamfering information; and the second operating trajectory is formed based on the chamfering trajectory. The grinding system according to claim 5, wherein the processor is further configured to: adjust the first operating trajectory to a third operating trajectory according to the second operating trajectory and the chamfering trajectory; according to the The pressure sequence, the third operating trajectory and the second operating trajectory form the deviation sequence. A grinding method for controlling a grinding head on a machine component to grind a workpiece, the improvement thereof includes: receiving a pressure sequence, the pressure sequence being formed when a sensing module senses the stress of the workpiece; Form guidance information, the guidance information is used to guide the grinding head to polish the workpiece in a preset trajectory; form a deviation sequence of the pressure sequence according to the pressure sequence and the guidance information; according to the deviation sequence, Form an adjustment instruction to adjust the position of the grinding head; wherein the guidance information includes a first operating trajectory, and the step of forming the guidance information includes: determining that the device combination for grinding the workpiece includes the machine element and the Grinding head; a device combination based on grinding the workpiece includes the machine element and the grinding head, forming the first operating trajectory, the first operating trajectory is the operating trajectory of the grinding head; the forming of the The step of deviating the pressure sequence includes forming the deviation sequence according to the first operating trajectory and the pressure sequence; wherein the step of forming the first operating trajectory includes at least one of the following: based on The device combination for grinding the workpiece includes the machine element and the grinding head, forming a basic trajectory and a first adjustment amount. The basic trajectory is formed on a plane formed by the first direction and the third direction. The running trajectory of the head, the first adjustment amount is an adjustment sequence loaded on the basic trajectory on the plane formed by the second direction and the third direction, the first direction, the second direction and the third directions are vertical in pairs, and the first direction is the direction of the grinding head toward the workpiece; the first operating trajectory is formed according to the basic trajectory and the first adjustment amount; or based on The device combination for grinding the workpiece includes the machine element and the grinding head, forming a basic trajectory and a second adjustment amount. The basic trajectory is a movement trajectory formed on a plane formed by the first direction and the third direction, so The second adjustment amount is a carrier signal superimposed on the basic trajectory in a second direction, the first direction, the second direction and the third direction are two perpendicular to each other, and the first direction is the The direction of the grinding head toward the workpiece; forming the first operating trajectory according to the basic trajectory and the second adjustment amount; or The device combination based on grinding the workpiece includes the machine element and the grinding head, forming a basic trajectory and a third adjustment amount. The basic trajectory is a movement trajectory formed on a plane formed by the first direction and the third direction, The third adjustment amount is a fixed value superimposed on the basic trajectory in the first direction, the first direction is perpendicular to the third direction, and the first direction is the direction of the grinding head toward the the direction of the workpiece; forming the first operating trajectory based on the basic trajectory and the third adjustment amount; or forming a basic trajectory based on a device combination for grinding the workpiece including the machine element and the grinding head The fourth adjustment amount, the basic trajectory is a movement trajectory formed on the plane formed by the first direction and the third direction, and the fourth adjustment amount is the change superimposed on the basic trajectory in the first direction. value, the first direction is perpendicular to the third direction, and the first direction is the direction of the grinding head toward the workpiece; according to the basic trajectory and the fourth adjustment amount, the first direction is formed Running track. The grinding method of claim 7, wherein the guidance information includes a preset position and a conversion relationship, the preset position is the calculated position of the grinding head grinding the workpiece, and the conversion relationship is the pressure of the grinding head The conversion formula with the deformation information of the polishing material on the polishing head further includes: determining the conversion relationship according to the rigid parameters of the polishing material on the polishing head; forming a conversion relationship with the pressure according to the pressure sequence and the conversion relationship. The deformation information corresponding to the sequence; the deviation sequence is formed based on the deformation information and the preset position. The polishing method according to claim 7, wherein the step of forming a deviation sequence of the pressure sequence includes: forming an adjusted pressure sequence through a filter according to the pressure sequence; The sequence and the guidance information determine the deviation sequence. The polishing method according to claim 7, wherein the guidance information also includes a second running trajectory, the second running trajectory is the running trajectory of the workpiece, and the step of forming the deviation sequence further includes: determining The device combination also includes a load-bearing module, which is used to carry the workpiece and can rotate or move the workpiece; based on the device combination, it also includes a load-bearing module to form the second running trajectory; The deviation sequence is formed according to the pressure sequence, the first operating trajectory and the second operating trajectory. The polishing method according to claim 10, wherein the guidance information also includes chamfering information, and the step of forming the second running trajectory includes: based on the device combination further including a bearing module, determining the chamfering information. Angle information; according to the chamfering information, calculate the chamfering trajectory corresponding to the first operating trajectory and the chamfering information; and form the second operating trajectory based on the chamfering trajectory. The polishing method according to claim 11, wherein the step of forming the deviation sequence further includes: adjusting the first operating trajectory to a third operating trajectory according to the second operating trajectory and the chamfering trajectory. ; According to the pressure sequence, the third operating trajectory and the second operating trajectory, the deviation sequence is formed. An auxiliary grinding device for carrying and sensing the workpiece to be polished. The improvement is that it includes: a carrying part for carrying the workpiece and withstanding at least one of the force and moment from the workpiece, including a first hole; A sensing module is connected to the bearing part, and the sensing module includes a second hollow part; a connecting part is provided between the bearing part and the sensing module, and the connecting part is a hollow structure, The hollow part is set as the second channel; the base is connected to the mounting part and includes a first hollow part that is in communication with the first channel; the mounting part is provided on the sensing module and the Between the bases, the installation part is a hollow structure, and the hollow part is set as a first channel; the air extraction module includes an air pipe, the air pipe is coupled to the first hole, and is used to penetrate the first hollow part , at least one of the first channel, the second hollow part and the second channel, so as to form a connection between the workpiece placed on the load-bearing part and the load-bearing part through the first hole. Bonding force; the sensing module is also connected to a cable, and the cable is used to connect the sensing module through the first hollow part and the first channel; the sensing module, For sensing at least one of the force and torque, forming a pressure value, and transmitting the pressure value to the grinding device through the cable. The device according to claim 13, wherein the base includes: a sealing cover connected to the mounting part and including a second hole; an inner cavity including the first hollow part; the second hole is provided in the third between a hollow part and the first channel; a moving part connected to the inner cavity; the inner cavity further includes a sealing part, the sealing part is provided between the moving part and the first hollow part . An auxiliary grinding system is used to assist a grinding device in grinding workpieces. The improvement is that it includes: a communicator for acquiring the first trajectory and the second trajectory; A processor, coupled to the communicator, configured to: control a carrying module to perform at least one of pause, movement and rotation along the first trajectory, the carrying module being used to carry the workpiece; obtain a trigger signal and determine The trigger signal reaches a trigger condition; based on the trigger signal reaching a trigger condition, the carrying module is controlled to change to at least one of pausing, moving and rotating along the second trajectory. The system for assisting grinding according to claim 15, wherein the trigger signal is the time when the workpiece has been grinded along the first trajectory, and the system further includes: a timer coupled to the processor, for Obtain the time; the processor is further configured to: determine that the time is equal to the preset time; based on the time being equal to the preset time, control the carrying module to change to perform pause and move along the second trajectory and rotating at least one. The auxiliary grinding system of claim 15, wherein the trigger signal is the speed of grinding the workpiece along the first trajectory, and the system further includes: a detector coupled to the processor for detecting The speed; the processor is further configured to: determine that the speed is less than or equal to a preset speed; based on the speed being less than or equal to the preset speed, control the carrying module to change to execute along the second trajectory At least one of pause, move and rotate. An auxiliary grinding method for controlling an auxiliary grinding system to cooperate with a grinding device to grind a workpiece, including: obtaining a first trajectory and a second trajectory; Control the carrying module to perform at least one of pausing, moving and rotating along the first trajectory, and the carrying module is used to carry the workpiece; obtain a trigger signal and determine that the trigger signal reaches a trigger condition; based on the trigger signal When the trigger condition is reached, the carrying module is controlled to change to perform at least one of pausing, moving and rotating along the second trajectory. The method of assisting grinding as described in claim 18, wherein the trigger signal is the time during which the workpiece has been polished along the first trajectory, and the steps of obtaining the trigger signal and determining that the trigger signal reaches a trigger condition include : Obtain the time; determine that the time is equal to the preset time; based on the time being equal to the preset time, control the carrying module to change to perform at least one of pausing, moving and rotating along the second trajectory. The method of assisting grinding as described in claim 18, wherein the trigger signal is the speed of grinding the workpiece along the first trajectory, and the steps of obtaining the trigger signal and determining that the trigger signal reaches a trigger condition include: Detect the speed; determine that the speed is less than or equal to the preset speed; based on the speed being less than or equal to the preset speed, control the carrying module to change to at least one of pausing, moving and rotating along the second trajectory. .

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