TWI817919B - Fine adjustment high frequency detection module - Google Patents
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Abstract
本發明提供一種檢測模組,其包含有一個載體、一個微調整組件以及一個高頻電性檢測組件,倘若欲讓檢測機構與待測機構二者構件之間順利機構接設或電性連通時,係得藉由該檢測模組之微調整組件可微滑運動的技術特徵,如此一來,將能讓檢測機構與待測機構二者構件之間有效地達到微調整運動之功效。The present invention provides a detection module, which includes a carrier, a fine adjustment component and a high-frequency electrical detection component. If it is desired to ensure smooth mechanical connection or electrical connection between the components of the detection mechanism and the mechanism to be tested, , it is a technical feature that the fine adjustment component of the detection module can move slightly. In this way, the effect of fine adjustment movement can be effectively achieved between the two components of the detection mechanism and the mechanism to be tested.
Description
本發明係與電子產品測試技術相關,特別是指一種適用檢測高頻電子產品之微調整高頻檢測模組。 The present invention relates to electronic product testing technology, and in particular refers to a finely adjusted high-frequency detection module suitable for detecting high-frequency electronic products.
目前所使用的電子產品檢測模組種類繁多,為了能夠在製造完成後進一步地確保產品可以正常且完整的運作,所以,在電子產品出貨之前都需要先經過一定程序性的電性檢測;然而,有時一些特殊規格的電子產品,例如:具高頻(HF,High Frequency)或具特高頻(VHF,Very High Frequency)等電子產品,由於前述特殊規格之電子產品的電性檢測過程中,對於機構的微調整甚為敏感,故而常間接影響到該電子產品經電性檢測過程後之良率。因此,要如何適配於特殊規格之具高頻(HF,High Frequency)或特高頻(VHF,Very High Frequency)等電子產品且能有效地進行其電性檢測,實則本發明亟欲改善之目的。 There are many types of electronic product testing modules currently in use. In order to further ensure that the product can operate normally and completely after manufacturing is completed, electronic products need to undergo certain procedural electrical testing before being shipped; however, , sometimes some electronic products with special specifications, such as: electronic products with high frequency (HF, High Frequency) or very high frequency (VHF, Very High Frequency), due to the electrical testing process of the aforementioned electronic products with special specifications , is very sensitive to fine adjustments of the mechanism, so it often indirectly affects the yield rate of the electronic product after the electrical testing process. Therefore, how to adapt to electronic products with special specifications such as high frequency (HF, High Frequency) or ultra-high frequency (VHF, Very High Frequency) and effectively conduct their electrical properties detection is actually an issue that the present invention urgently seeks to improve. Purpose.
而為了要解決先前技術所述之問題,本發明係提供一種檢測模組,係適配於電性檢測特殊規格電子產品,例如:具高頻(HF,High Frequency)或具特高頻(VHF,Very High Frequency)等電子產品,藉由該檢測組件所揭露的一個微調整組件及其子構件的技術特徵, 將能有效地改善因檢測機構與待測機構二者構件之間的接觸敏感度的顯著效果。 In order to solve the problems described in the prior art, the present invention provides a detection module that is adapted to electrically detect electronic products with special specifications, such as high frequency (HF, High Frequency) or ultra high frequency (VHF). , Very High Frequency) and other electronic products, through the technical characteristics of a fine-tuning component and its sub-components disclosed by the detection component, It will be able to effectively improve the contact sensitivity between the components of the detection mechanism and the mechanism to be tested.
而為達成上述目的,本發明係提供一種檢測模組,其包含有一個載體、一個微調整組件以及一個高頻電性檢測組件;而該載體係具有一個第一組設部、一個相對應於該第一組設部的第二組設部以及一個圍繞並各別連接該第一組設部與該第二組設部的第三組設部;而該微調整組件係包含有一個微調件以及一個作動件,該微調件係設有一微調滾珠,該作動件係具有一個組設頂部以及一個相對應於該組設頂部的作動底部,自該作動底部朝該組設頂部的方向係凹設形成一個作動凹部,該微調件之微調滾珠的末端係得對應並限位於該作動件之作動底部的該作動凹部的位置,其中,該微調整組件之作動件的該組設頂部係對應並組設於該載體之第一組設部;而該高頻電性檢測組件係包含有一個高頻針座、一個電性檢測電路板以及一個電性檢測座,該高頻針座係具有一個扎針頂部以及一個相對應於該扎針頂部的組設底部,該電性檢測座包括有一個扎針部以及一個對應於該扎針部的組設部,其中,該高頻電性檢測組件之高頻針座與該電性檢測座係可選擇地各別組設於該載體之第二組設部或該第三組設部的位置。 In order to achieve the above object, the present invention provides a detection module, which includes a carrier, a fine adjustment component and a high-frequency electrical detection component; and the carrier system has a first assembly part, a corresponding The first assembly part has a second assembly part and a third assembly part surrounding and respectively connecting the first assembly part and the second assembly part; and the fine adjustment component includes a fine adjustment member And an actuating part, the fine-tuning part is provided with a fine-tuning ball, the actuating part has an assembly top and an actuating bottom corresponding to the assembly top, and is recessed from the actuating bottom toward the direction of the assembly top. An actuating recess is formed, and the end of the fine-tuning ball of the fine-tuning component is corresponding to and limited to the position of the actuating recess of the actuating bottom of the actuating component, wherein the assembly top of the actuating component of the fine-tuning component is corresponding and assembled. The first assembly part is provided on the carrier; and the high-frequency electrical detection component includes a high-frequency pin holder, an electrical detection circuit board and an electrical detection holder, and the high-frequency pin holder has a pin The top and an assembly bottom corresponding to the top of the needle. The electrical detection seat includes a needle part and an assembly part corresponding to the needle part, wherein the high-frequency needle seat of the high-frequency electrical detection component The electrical detection base can be selectively assembled at the position of the second assembly part or the third assembly part of the carrier.
倘若藉由本發明所揭露的該檢測模組之高頻電性檢測組件的高頻針座的該扎針頂部與待檢測電子產品之檢測部二者構件之間在進行電性接設的過程中發生機構對接的微偏移現象時,進而導致該微調整組件之微調件的該微調滾珠與該作動件之作動凹部二者構件亦產生微偏移現象時,此時,係得藉由該檢測模組之微調整組件的該微調件 之該微調滾珠可微滑運動的技術特徵,如此一來,將能讓該微調件之微調滾珠的末端係得對應並經微滑運動後而復歸限位至原本所匹配對應的該作動件之作動凹部中,並透過組設在該作動件之組設頂部的該載體,間接地微推移該高頻電性檢測組件之高頻針座的該扎針頂部朝該電子產品之檢測部的方向逐步地完成機構性組接以及完成電性接設為止,緣此,將能讓檢測機構與待測機構二者構件之間有效地達到微調整運動之功效。 If an electrical connection occurs between the top of the high-frequency needle holder of the high-frequency electrical detection component of the detection module disclosed in the present invention and the detection part of the electronic product to be detected, When there is a slight deviation in the docking of the mechanism, which in turn leads to a slight deviation in the fine-tuning ball of the fine-tuning part of the fine-tuning component and the actuating recess of the actuating part, at this time, the detection mode can be used The fine-tuning part of the fine-tuning component The technical feature of the fine-tuning ball is that it can move slightly, so that the end of the fine-tuning ball of the fine-tuning part can be matched and return to the original matching position of the actuator after a slight sliding movement. In the actuating recess, and through the carrier arranged on the top of the actuating member, the top of the high-frequency needle holder of the high-frequency electrical detection component is indirectly pushed slightly toward the direction of the detection part of the electronic product. Until the mechanical assembly is completed and the electrical connection is completed, the fine adjustment movement between the two components of the testing mechanism and the mechanism to be tested will be effectively achieved.
1、1A:檢測模組 1. 1A: Detection module
10、10A:載體 10, 10A: Carrier
11、11A:第一組設部 11, 11A: The first organization department
13、13A:第二組設部 13, 13A: Second Organization Department
15、15A:第三組設部 15, 15A: The third organization department
20、20A:微調整組件 20, 20A: Fine adjustment components
21、21A:微調件 21, 21A: Fine adjustment parts
211、211A:微調頂部 211, 211A: Fine-tuning the top
212、212A:組設孔 212, 212A: Assembly holes
213、213A:組設底部 213, 213A: Assembly bottom
214、214A:凹孔 214, 214A: concave hole
215、215A:微調滾珠 215, 215A: fine adjustment ball
22、22A:間隔空間 22, 22A: Interval space
23、23A:作動件 23, 23A: Actuator
231、231A:組設頂部 231, 231A: top of assembly
232、232A:組設孔 232, 232A: Assembly holes
233、233A:作動底部 233, 233A: Action bottom
234、234A:鎖固件 234, 234A: Locking hardware
235、235A:作動凹部 235, 235A: Actuating recess
30:高頻電性檢測組件 30: High frequency electrical detection components
31:高頻針座 31: High frequency needle seat
311:扎針頂部 311: Top of needle
313:組設底部 313:Assembly bottom
32:高頻金屬探針 32: High frequency metal probe
321:高頻絕緣件 321: High frequency insulation parts
323:高頻金屬導線 323: High frequency metal wire
33:電性檢測電路板 33: Electrical detection circuit board
35:電性檢測座 35: Electrical test socket
351:扎針部 351:Acupuncture Department
352:開口 352:Open your mouth
353:電性檢測金屬探針 353: Electrical detection metal probe
355:組設部 355: Organization Department
30A:高頻電性檢測組件 30A: High frequency electrical detection component
31A:高頻針座 31A: High frequency needle seat
311A:扎針頂部 311A: Top of needle
312A:開口 312A: Opening
313A:組設底部 313A: Assembly bottom
314A:開口 314A: Opening
315A:容置空間 315A: Accommodation space
33A:電性檢測電路板 33A: Electrical detection circuit board
331A:高頻金屬探針部 331A: High frequency metal probe part
335A:電性檢測金屬探針部 335A: Electrical detection metal probe part
35A:電性檢測座 35A: Electrical test socket
351A:扎針部 351A: Needle insertion part
353A:金屬導針組 353A: Metal guide pin set
355A:組設部 355A: Organization Department
900、900A:電子產品 900, 900A: Electronic products
901、901A:檢測部 901, 901A: Inspection Department
圖1係為本發明第一較佳實施例之立體示意圖,主要係揭露一種檢測模組。 Figure 1 is a schematic three-dimensional view of the first preferred embodiment of the present invention, which mainly discloses a detection module.
圖2係為圖1之部分構件分解暨立體示意圖,主要係揭露該檢測模組各子構件之間的對應狀態。 FIG. 2 is an exploded and three-dimensional schematic diagram of some components of FIG. 1 , mainly revealing the corresponding states between the sub-components of the detection module.
圖3係為圖1之部分構件組合暨立體示意圖,主要係揭露該檢測模組之高頻金屬探針的組合狀態。 Figure 3 is a partial component assembly and a three-dimensional schematic diagram of Figure 1, which mainly discloses the assembly state of the high-frequency metal probe of the detection module.
圖4係為圖1之部分構件剖視暨立體示意圖。 Figure 4 is a cross-sectional and three-dimensional schematic view of some components of Figure 1.
圖5係為類似圖4之部分構件剖視示意圖,主要係揭露該檢測模組之一高頻針座已對應於一電子產品之檢測部的狀態。 FIG. 5 is a schematic cross-sectional view of some components similar to FIG. 4 , mainly revealing a state in which a high-frequency pin base of the detection module has corresponded to the detection part of an electronic product.
圖6係為類似圖5之部分構件剖視示意圖,主要係揭露該檢測模組之高頻針座對應接設於該電子產品之檢測部且尚未電性連通的狀態。 FIG. 6 is a schematic cross-sectional view of some components similar to FIG. 5 , mainly revealing the state in which the high-frequency pin base of the detection module is correspondingly connected to the detection part of the electronic product and is not yet electrically connected.
圖7係為圖6之部分構件放大暨剖視示意圖。 FIG. 7 is an enlarged and cross-sectional schematic view of some components of FIG. 6 .
圖8係為類似圖6之部分構件剖視示意圖,主要係揭露該檢測模組之高頻針座對應接設於該電子產品之檢測部且已完成電性連通的狀態。 FIG. 8 is a schematic cross-sectional view of some components similar to FIG. 6 , mainly revealing the state in which the high-frequency pin holder of the detection module is correspondingly connected to the detection part of the electronic product and has completed electrical connection.
圖9係為圖8之部分構件放大暨剖視示意圖。 FIG. 9 is an enlarged and cross-sectional schematic view of some components of FIG. 8 .
圖10係為本發明第二較佳實施例之立體示意圖,主要係揭露另一種檢測模組。 Figure 10 is a schematic three-dimensional view of the second preferred embodiment of the present invention, mainly disclosing another detection module.
圖11係為圖10之部分構件分解暨立體示意圖,主要係揭露該檢測模組各子構件之間的對應狀態。 FIG. 11 is an exploded and three-dimensional schematic view of some components of FIG. 10 , mainly revealing the corresponding states between the sub-components of the detection module.
圖12係為圖10之部分構件剖視暨立體示意圖。 Figure 12 is a cross-sectional and three-dimensional schematic view of some components of Figure 10.
圖13係為類似圖10之部分構件剖視示意圖,主要係揭露另一該檢測模組之一高頻針座已對應於一電子產品之檢測部的狀態。 FIG. 13 is a schematic cross-sectional view of some components similar to FIG. 10 , mainly revealing a state in which one of the high-frequency pin bases of another detection module has corresponded to the detection part of an electronic product.
圖14係為類似圖13之部分構件剖視示意圖,主要係揭露該檢測模組之高頻針座對應接設於該電子產品之檢測部且尚未電性連通的狀態。 FIG. 14 is a schematic cross-sectional view of some components similar to FIG. 13 , mainly revealing the state in which the high-frequency pin base of the detection module is correspondingly connected to the detection part of the electronic product and is not yet electrically connected.
圖15係為類似圖14之部分構件剖視示意圖,主要揭露該檢測模組之高頻針座對應接設於該電子產品之檢測部且已完成電性連通的狀態。 FIG. 15 is a schematic cross-sectional view of some components similar to FIG. 14 , mainly revealing the state in which the high-frequency pin base of the detection module is correspondingly connected to the detection part of the electronic product and has completed electrical connection.
圖16係為圖15之部分構件放大暨剖視示意圖。 Figure 16 is an enlarged and cross-sectional schematic view of some components of Figure 15.
申請人首先在此說明,於整篇說明書中,包括以下介紹的實施例以及申請專利範圍的各請求項中,有關方向性的名詞皆以本案〔圖示簡單說明〕中所列各圖式的方向為基準。其次,在以下將要介紹之實施例及圖式中,相同之元件標號,代表相同或近似之元件或其結構特徵。而且,有關本發明的詳細構造、特點、組裝或使用、製造等方式, 將於後續的實施方式詳細說明中予以描述,然,在本發明領域中具有通常知識者應能瞭解,該等詳細說明及本發明所列舉的實施例,係僅用於支持說明本發明實能據以實現,並非用以限制本發明之申請專利範圍。 The applicant would like to first explain that throughout the entire description, including the embodiments introduced below and the claims within the scope of the patent application, all terms related to directionality refer to the diagrams listed in this case [Brief Description of Illustrations]. direction as the base. Secondly, in the embodiments and drawings to be introduced below, the same component numbers represent the same or similar components or structural features. Moreover, regarding the detailed structure, characteristics, assembly or use, manufacturing, etc. of the present invention, The following detailed description of the embodiments will be described. However, those with ordinary knowledge in the field of the present invention should understand that these detailed descriptions and the examples listed in the present invention are only used to support the explanation of the practical capabilities of the present invention. This implementation is not intended to limit the patentable scope of the present invention.
請先參閱圖1及圖2,為本發明第一較佳實施例所揭露之一種檢測模組1,係適用於檢測一些特殊規格的電子產品,例如:具高頻(HF,High Frequency)或具特高頻(VHF,Very High Frequency)等電子產品,而該檢測模組1係包含有一個載體10、一個微調整組件20以及一個高頻電性檢測組件30;而該載體10係具有一個第一組設部11、一個相對應於該第一組設部11的第二組設部13以及一個圍繞並各別連接該第一組設部11與該第二組設部13的第三組設部15;而該微調整組件20係組設在該載體10之第一組設部11的位置,而該高頻電性檢測組件30其相關子構件係可選擇地對應並組設在該載體10之第二組設部13或者該第三組設部15的位置。
Please refer to Figure 1 and Figure 2 first, which shows a
請再一併參閱圖1、圖2、圖4及圖5,而該微調整組件20係包含有一個微調件21以及一個作動件23。而該微調件21係具有一個微調頂部211以及一個相對應於該微調頂部211的組設底部213,該組設底部213係可選擇性地組裝在外部所適配的設備或裝置上,其中,自該微調件21之微調頂部211朝該組設底部213的方向係穿設有四個組設孔212以及凹設形成有四個凹孔214,該等組設孔212與該等凹孔214之間係呈交錯排列且彼此之間亦為間隔設置,此外,任一該凹孔214中係設有一個微調滾珠215且顯露於該微調頂部211的位置,當然,該微調整組件20之微調件21的該微調滾珠215係亦可為一滾柱,其末端係呈現弧狀
滾珠並顯露於該微調頂部211的位置。而該作動件23係具有一個組設頂部231以及一個相對應於該組設頂部231的作動底部233,其中,該微調整組件20之作動件23的該組設頂部231係對應並組設於該載體10之第一組設部11的位置,且該作動件23之作動底部233係對應於該微調件21之微調頂部211的位置,自該作動件23之組設頂部231朝該作動底部233的方向係穿設有四個間隔設置的組設孔232,使得該作動件23之該等組設孔232係各別對應於該微調件21之該等組設孔212的位置,並藉由四個鋅棒螺絲234各別經穿設該作動件23之該等組設孔232後,進而鎖固在各自對應的該微調件21之組設孔212中,用以避免該微調件21與該作動件23二者構件在進行檢測時不慎發生脫離的現象,較佳地,該微調件21之微調頂部211與該作動件23之作動底部233二者之間係形成一預定間隔空間22,此外,自該作動件23之作動底部233朝該組設頂部231的方向係凹設形成四個間隔設置的作動凹部235,使得該微調件21之微調頂部211的該等四個微調滾珠215的末端係各別對應並限位於該作動件23之作動底部233的該等四個作動凹部235的位置。而值得一提的是,當然,亦可在該微調整組件20之微調件21的該微調頂部211僅設置一個該微調滾珠215,且用以對應並限位於該作動件23之作動底部233的任一該作動凹部235的位置,而前述所提之微調整組件20及其子構件該等技術特徵係皆為凡所屬技術領域中具有通常知識者得經參酌本發明第一較佳實施例後即能易於思及,或僅屬數量上之簡易變化,因此,皆非用以作為限定本發明所欲主張之技術特徵,合先敘明。
Please refer to FIGS. 1 , 2 , 4 and 5 together. The
請再一併參閱圖1至圖5,而該高頻電性檢測組件30係包含有一個高頻針座31、複數高頻金屬探針32、一個電性檢測電路板33以及一個電性檢測座35。而該高頻針座31係具有一個扎針頂部311以及一個相對應於該扎針頂部311的組設底部313,其中,該高頻電性檢測組件30之高頻針座31的該組設底部313係對應並組設於該載體10之第二組設部13的位置,該電性檢測電路板33係組設在該載體10之第一組設部11與該微調整組件20之作動件23的該組設頂部231二者構件之間的位置,使該等複數高頻金屬探針32的一端係皆自該高頻針座31之扎針頂部311朝該組設底部313的方向貫穿該高頻針座31本體並同時穿設該電性檢測電路板33之後,進而組設在該微調整組件20之作動件23的該組設頂部231的位置,且該等複數高頻金屬探針32的另一端係皆位在該高頻針座31之扎針頂部311中,此外,該等複數高頻金屬探針32彼此之間係呈現一預定距離的間隔設置。而該電性檢測座35係包含有一個扎針部351、複數電性檢測金屬探針353以及一個對應於該扎針部351的組設部355;其中,該高頻電性檢測組件30之電性檢測座35的該組設部355係對應並組設於該載體10之第三組設部15的位置,較佳地,由於該電性檢測座35之扎針部351係對應於該組設部355且二者皆位在同一軸線方向上,故使該扎針部351係朝遠離該載體10之第三組設部15的方向垂直向上延伸並形成一個開口352;其中,該高頻電性檢測組件30之電性檢測座35的任一該電性檢測金屬探針353其一端係電性連接於該電性檢測電路板33,且任一該電性檢測金屬探針353的另一端係位在該扎針部351中。而值得一提的是,該高頻電性檢測組件30之任一該高頻金屬探針32基本上係由
一個高頻絕緣件321環覆一個高頻金屬導線323所組成,而當任一該高頻金屬探針32的一端經貫穿該高頻針座31本體、穿設該電性檢測電路板33以及組設在該微調整組件20之作動件23的該組設頂部231時,皆是藉由該高頻絕緣件321進行組設,僅僅在經穿設該電性檢測電路板33的板厚時裸露該高頻金屬導線323並用以電性連接該電性檢測電路板33所對應的內部金屬導電線路;此外,任一該高頻金屬探針32係適用於檢測一些特殊規格的電子產品,例如:具高頻(HF,High Frequency)或具特高頻(VHF,Very High Frequency)等電子產品。
Please refer to Figures 1 to 5 again, and the high-frequency electrical
以上為本發明第一較佳實施例所揭露之檢測模組1及其各子構件的技術特徵,其後將繼續揭露若藉由本發明第一較佳實施例所揭露之檢測模組1進行該特殊規格之電子產品900,例如:具高頻(HF,High Frequency)或具特高頻(VHF,Very High Frequency)等電子產品900的電性檢測,而其主要作動及其所欲達成之功效在於:
The above are the technical features of the
其一,請一併參閱圖1至圖6,首先,將欲進行電性檢測之電子產品900之檢測部901對應於該檢測模組1之高頻電性檢測組件30的該高頻針座31的位置,接著,讓該高頻電性檢測組件30之高頻針座31的該扎針頂部311逐漸地朝著該電子產品900之檢測部901的方向推進,直至讓位在該高頻針座31之扎針頂部311中的該等複數高頻金屬探針32各別與該電子產品900之檢測部901之間完成電性接設為止,如此一來,藉由該等複數高頻金屬探針32係位在該高頻電性檢測組件30之高頻針座31的該扎針頂部311中的技術特徵,相較於先前技術中所提在進行特殊規格之電子產品900的電性檢測時,將能有效改善因檢測機構與待測
機構二者構件之間的接觸敏感度,進而間接提升該電子產品900的檢測良率功效。
First, please refer to FIGS. 1 to 6 together. First, the
其二,請一併參閱圖1至圖9,接著,當該高頻電性檢測組件30之高頻針座31的該扎針頂部311與該電子產品900之檢測部901二者構件之間在進行電性接設的過程中發生機構對接的微偏移現象時,進而導致該微調整組件20之微調件21的該等微調滾珠215各別或單一與該作動件23之該等作動凹部235二者構件亦產生微偏移現象時,此時,係得藉由該檢測模組1之微調整組件20的該微調件21之任一該微調滾珠215略呈球形狀且可微滑運動的技術特徵,如此一來,將能讓該微調件21之任一該微調滾珠215微滑運動並復歸至原本所匹配對應的該作動件23之作動凹部235中,並透過組設在該作動件23之組設頂部231的該載體10,間接地微推移該高頻電性檢測組件30之高頻針座31的該扎針頂部311朝該電子產品900之檢測部901的方向完成機構性組接,進而讓位在該扎針頂部311中的該等複數高頻金屬探針32各別與該電子產品900之檢測部901之間完成電性接設為止,緣此,將能讓檢測機構與待測機構二者構件之間有效地達到微調整運動之功效。
Second, please refer to Figures 1 to 9 together. Then, when the
其三,請一併參閱圖1至圖4,而當該高頻電性檢測組件30之高頻針座31的該扎針頂部311中的該等複數高頻金屬探針32與該電子產品900之檢測部901二者構件之間已確定完成機構性組接以及電性接設後,此時,係得藉由該高頻電性檢測組件30之電性檢測座35的該扎針部351係基於該載體10之第三組設部15的方向垂直向上延伸並形成該開口352的技術特徵,如此一來,將能讓透過外部所匹配對應的電性
檢測儀器、機台或設備等,便於電性接設於該電性檢測座35之扎針部351中的該等複數電性檢測金屬探針353的位置,並透過該等複數電性檢測金屬探針353電性連通於該電性檢測電路板33與位於該高頻針座31中的該等複數高頻金屬探針32,此時,讓外部所匹配對應的電性檢測儀器、機台或設備即可透過本發明第一較佳實施例中所揭露的該檢測模組1之高頻電性檢測組件30中的該等複數高頻金屬探針32各別與該電子產品900之檢測部901之間進行電性檢測,進而達到適配於特殊規格之具高頻(HF,High Frequency)或特高頻(VHF,Very High Frequency)等電子產品且能顯著提升電性檢測良率。
Third, please refer to Figures 1 to 4 together. When the plurality of high-frequency metal probes 32 in the
請先參閱圖10及圖11,為本發明第二較佳實施例所揭露之一種檢測模組1A,係適用於檢測一些特殊規格的電子產品900A,例如:具高頻(HF,High Frequency)或具特高頻(VHF,Very High Frequency)等電子產品,其主要結構及其技術特徵與組裝時所欲達成之功效係皆概同於前揭第一較佳實施例,亦即該檢測模組1A係包含有一個載體10A、一個微調整組件20A以及一個高頻電性檢測組件30A。
Please refer to Figure 10 and Figure 11 first, which is a
承前所述,請再參閱圖11,同樣地,而該載體10A係具有一個第一組設部11A、一個相對應於該第一組設部11A的第二組設部13A以及一個圍繞並各別連接該第一組設部11A與該第二組設部13A的第三組設部15A;而該微調整組件20A係組設在該載體10A之第一組設部11A的位置,而該高頻電性檢測組件30A其相關子構件係可選擇地對應組設在該載體10A之第二組設部13A或該第三組設部15A的位置。
Following the above, please refer to Figure 11 again. Similarly, the
承前所述,請再一併參閱圖11至圖13,同樣地,而該微調整組件20A係包含有一個微調件21A以及一個作動件23A。而該微調件21A係具有一個微調頂部211A以及一個相對應於該微調頂部211A的組設底部213A,該組設底部213A係可選擇性地組裝在外部所適配的設備或裝置上,其中,自該微調件21A之微調頂部211A朝該組設底部213A的方向係穿設有四個組設孔212A以及凹設有四個凹孔214A,該等組設孔212A與該等凹孔214A之間係呈交錯排列且彼此之間亦為間隔設置,此外,任一該凹孔214A中係設有一個微調滾珠215A且顯露於該微調頂部211A的位置,當然,該微調整組件20A之微調件21A的該微調滾珠215A係亦可為一滾柱,其末端係呈現弧狀滾珠並顯露於該微調頂部211A的位置。而該作動件23A係具有一個組設頂部231A以及一個相對應於該組設頂部231A的作動底部233A,其中,該微調整組件20A之作動件23A的該組設頂部231A係對應並組設於該載體10A之第一組設部11A的位置,且該作動件23A之作動底部233A係對應於該微調件21A之微調頂部211A的位置,自該作動件23A之組設頂部231A朝該作動底部233A的方向係穿設有四個間隔設置的組設孔232A,使得該作動件23A之該等組設孔232A係各別對應於該微調件21A之該等組設孔212A的位置,並藉由四個鎖定件234A(例如:鋅棒螺絲等)各別經穿設該作動件23A之該等組設孔232A後,進而鎖固在各自對應的該微調件21A之組設孔212A中,用以避免該微調件21A與該作動件23A二者構件在進行檢測時不慎發生脫離的現象,較佳地,該微調件21A之微調頂部211A與該作動件23A之作動底部233A二者之間係形成一預定間隔空間22A,此外,
自該作動件23A之作動底部233A朝該組設頂部231A的方向係凹設形成四個間隔設置的作動凹部235A,使得該微調件21A之微調頂部211A的該等四個微調滾珠215A的末端係各別對應並限位於該作動件23A之作動底部233A的該等四個作動凹部235A的位置。而值得一提的是,同樣地,亦可在該微調整組件20A之微調件21A的該微調頂部211A僅設置一個該微調滾珠215A,且用以對應並限位於該作動件23A之作動底部233A的任一該作動凹部235A的位置。
Following the above, please refer to FIGS. 11 to 13 again. Similarly, the
以上為本發明第二較佳實施例所揭露之檢測模組1A及其各子構件的技術特徵與組裝時所欲達成之功效係皆概同於前揭第一較佳實施例,而相較於前揭第一較佳實施例時,其不同之處乃在於:請再一併參閱圖10至圖13,該高頻電性檢測組件30A係包含有一個高頻針座31A、一個電性檢測電路板33A以及一個電性檢測座35A。而該高頻針座31A係具有一個扎針頂部311A以及一個相對應於該扎針頂部311A的組設底部313A,且自該扎針頂部311A朝該組設底部313A的方向貫穿形成一個容置空間315A,此外,該高頻電性檢測組件30A之高頻針座31A係藉由該組設底部313A與其外周壁組設於該載體10A之第三組設部15A的位置。而該電性檢測電路板33A係透過若干鎖固件被固定組設於該高頻針座31A之扎針頂部311A的該容置空間315A中的內周壁的位置,此外,該電性檢測電路板33A係具有一個高頻金屬探針部331A以及一個電性檢測金屬探針部335A,且該高頻金屬探針部331A係電性連通於該電性檢測金屬探針部335A,其中,該電性檢測電路板33A之高頻金屬探針部331A係對應並朝向該高頻針座31A之扎針
頂部311A的一個連通於該容置空間315A之開口312A的方向凸伸顯露,該電性檢測電路板33A之電性檢測金屬探針部335A係對應並朝向該高頻針座31A之組設底部313A的一個連通於該容置空間315A之開口314A的方向延伸顯露。而該電性檢測座35A係具有一扎針部351A以及一對應於該扎針部351A的組設部355A,該電性檢測座35A係藉由該組設部355A組設於該電性檢測電路板33A上,且該電性檢測座35A係對應於該電性檢測電路板33A之電性檢測金屬探針部335A的位置,使得設置於該電性檢測座35A中的複數金屬導針組353A得以各別電性連通於該電性檢測電路板33A之電性檢測金屬探針部335A,進而間接電性導接連通於該電性檢測電路板33A之高頻金屬探針部331A。其中,該電性檢測電路板33A之高頻金屬探針部331A與該電性檢測座35A二者構件之間係基於該電性檢測電路板33A而朝不同方向延伸設置,如此一來,將能讓透過外部所匹配對應的電性檢測儀器、機台或設備等,便於電性接設於該電性檢測座35A之扎針部351A中的該等複數金屬導針組353A的位置。而值得一提的是,該電性檢測電路板33A之高頻金屬探針部331A主要係由具有高頻導電效益的複數高頻探針所組成,且適用於檢測一些特殊規格的電子產品,例如:具高頻(HF,High Frequency)或具特高頻(VHF,Very High Frequency)等電子產品;此外,該等複數高頻金屬探針彼此之間係以間隔設置的方式嵌設於該電性檢測電路板33A中,當然,亦可嵌設具有高頻導電效益之FFC探針組(Flexible Flat Cable,軟體扁平排線)或FPC探針組(Flex Printed Circuit,軟性印刷電路板)等高頻金屬探針構件。又值得一提的是,該電性檢測電路板33A之電性檢測金屬
探針部335A與該電性檢測座35A中的複數金屬導針組353A二者構件係皆為一般的金屬探針構件所組成。
The above is the technical characteristics of the
以上為本發明第二較佳實施例所揭露之檢測模組1A及其各子構件的技術特徵,其後將繼續揭露若藉由本發明第二較佳實施例所揭露之檢測模組1A進行該特殊規格之電子產品900A的電性檢測,而其主要作動及其所欲達成之功效在於:
The above are the technical features of the
其一、請再一併參閱圖10至圖14,當該電子產品900A之檢測部901A係位在底部時,首先,將該檢測模組1A之高頻電性檢測組件30A的該高頻針座31A對應於欲進行電性檢測的該電子產品900A之檢測部901A的位置,接著,讓該高頻電性檢測組件30A之高頻針座31A的該扎針頂部311A逐漸地朝著該電子產品900A之檢測部901A的方向推進,直至讓位在該高頻針座31A之扎針頂部311A中的該電性檢測電路板33A之高頻金屬探針部331A各別與該電子產品900A之檢測部901A之間完成電性接設為止,如此一來,藉由該高頻電性檢測組件30A之電性檢測電路板33A的該高頻金屬探針部331A係位在該高頻電性檢測組件30A之高頻針座31A的該扎針頂部311A中的技術特徵,相較於先前技術中所提在進行特殊規格之電子產品900A的電性檢測時,同樣地,其功效係概同於前揭第一較佳實施例,除了能有效改善因檢測機構與待測機構二者構件之間的接觸敏感度,進而間接提升該電子產品900A的檢測良率功效之外,更能有效達到初步概略性的對應於該電子產品900A位在底部的該檢測部901A的對應功效。
First, please refer to Figures 10 to 14 again. When the
其二、請再一併參閱圖10至圖16,同樣地,即如前揭第一較佳實施例所述之功效,當該高頻電性檢測組件30A之高頻針座31A的該扎針頂部311A與該電子產品900A之檢測部901A二者構件之間在進行電性接設的過程中發生機構對接的微偏移現象時,進而導致該微調整組件20A之微調件21A的該等微調滾珠215A各別或單一與該作動件23A之該等作動凹部235A二者構件亦產生微偏移現象時,此時,係得藉由該檢測模組1A之微調整組件20A的該微調件21A之任一該微調滾珠215A略呈球形狀且可微滑運動的技術特徵,如此一來,將能讓該微調件21A之任一該微調滾珠215A微滑運動並復歸至原本所匹配對應的該作動件23A之作動凹部235A中,並透過組設在該作動件23A之組設頂部231A的該載體10A,間接地微推移該高頻電性檢測組件30A之高頻針座31A的該扎針頂部311A朝該電子產品900A之檢測部901A的方向完成機構性組接,進而讓位在該扎針頂部311A中的該電性檢測電路板33A之高頻金屬探針部331A各別與該電子產品900A之檢測部901A之間完成電性接設為止,緣此,即如前揭第一較佳實施例所述,將能讓檢測機構與待測機構二者構件之間有效達到微調整運動之功效。
Second, please refer to Figures 10 to 16 again. Similarly, the effect is as described in the first preferred embodiment. When the needle of the high-
1:檢測模組 1: Detection module
10:載體 10: Carrier
20:微調整組件 20: Fine adjustment components
30:高頻電性檢測組件 30: High frequency electrical detection components
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040207424A1 (en) * | 1998-08-27 | 2004-10-21 | The Micromanipulator Company, Inc. | High resolution analytical probe station |
| TW201307871A (en) * | 2011-07-06 | 2013-02-16 | 色拉頓系統公司 | Test system and indexing mechanism with a probe device |
| TW201428300A (en) * | 2013-01-15 | 2014-07-16 | Mjc Probe Inc | High frequency probe card |
| CN112816853A (en) * | 2021-01-25 | 2021-05-18 | 苏州伊欧陆系统集成有限公司 | PCB double-sided test probe station |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040207424A1 (en) * | 1998-08-27 | 2004-10-21 | The Micromanipulator Company, Inc. | High resolution analytical probe station |
| TW201307871A (en) * | 2011-07-06 | 2013-02-16 | 色拉頓系統公司 | Test system and indexing mechanism with a probe device |
| TW201428300A (en) * | 2013-01-15 | 2014-07-16 | Mjc Probe Inc | High frequency probe card |
| CN112816853A (en) * | 2021-01-25 | 2021-05-18 | 苏州伊欧陆系统集成有限公司 | PCB double-sided test probe station |
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