TWI817486B - Slicing apparatus and slicing method - Google Patents

Abstract

The present invention provides a slicing apparatus and a slicing method. The slicing apparatus includes an adjustment platform and a slicing mechanism. The adjustment platform defines an accommodating space corresponding in position to a carrying surface thereof. The slicing mechanism corresponds in position to and is relatively rotatable to the adjustment platform. The slicing mechanism includes at least one winding seat and a slicing wire. The at least one winding seat includes a base being movable to the adjustment platform and a first guiding roller that is assembled to the base. The slicing wire is arranged along the first guiding roller of the at least one winding seat so as to form a first slicing segment. The slicing mechanism and the adjustment platform are configured to be movable relative to each other along a direction non-perpendicular to the carrying surface, so that the first slicing segment is allowed to pass through the accommodating space.

Description

Cutting equipment and cutting methods

The present invention relates to a cutting equipment, and in particular to a cutting equipment and a cutting method using a relatively movable adjustment stage and a cutting mechanism.

In existing cutting operations (such as ingot slicing operations), the error of the object to be cut is mostly inferred based on the cut product, and the next cutting operation is adjusted accordingly. However, it is difficult to control the accuracy of each cutting operation in existing cutting operations. Therefore, the inventor believed that the above-mentioned defects could be improved, so he devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects.

Embodiments of the present invention provide a cutting equipment and a cutting method that can effectively improve defects that may occur in existing cutting operations.

An embodiment of the present invention discloses a cutting equipment, which includes: an adjustment stage having a bearing surface, and the adjustment stage defines an accommodation space on the bearing surface; and a cutting mechanism corresponding to the The adjustment stage is arranged and can rotate relatively, and the cutting mechanism includes at least one winding seat and a cutting wire; wherein, at least one of the winding seats includes: a body that can rotate relative to the adjustment stage. Move; and a first guide wheel installed on the base; wherein the cutting wire passes through at least one of the first guide wheels of the winding base to form a first cutting section, and the cutting wire The mechanism and the adjustment stage are configured to move relatively along a first direction that is not perpendicular to the bearing surface, so that the first cutting section passes through the accommodation space.

Embodiments of the present invention also disclose a cutting method, which includes: a pre-step; fixing an object to be cut on a cutting equipment; wherein the cutting equipment includes: an adjustment stage with a bearing surface, and The object to be cut is fixed on the bearing surface; and a cutting mechanism is provided corresponding to the adjustment stage and can rotate relatively, and the cutting mechanism includes two winding seats and is wound around two A cutting line for each of the winding seats; wherein each of the winding seats includes a base body that can move relative to the adjustment stage, and a first guide wheel installed on the base body; wherein , the cutting wire winds around the two first guide wheels to form a first cutting section between the two first guide wheels; the slicing step: the cutting mechanism and the adjustment stage are along the non-linear Move relatively in a first direction perpendicular to the bearing surface, so that the first cutting section moves through the top of the object to be cut, and cuts a wafer to be inspected from the object to be cut; and a Chip inspection step: Use a crystal orientation detector to inspect the wafer to be inspected to learn the crystal orientation angle of the wafer to be inspected.

In summary, the cutting equipment and cutting method disclosed in the embodiments of the present invention are configured through the cutting mechanism and the adjustment stage to be able to move relatively along the first direction that is not perpendicular to the bearing surface. Move so that the first cutting section passes through the object to be cut (or the accommodation space), so as to facilitate the implementation of the slicing step and the inspection step, so that the object to be cut can be Carry out cutting operations after confirming the crystal orientation angle.

In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not make any reference to the protection scope of the present invention. limit.

The following is a specific example to illustrate the implementation of the "cutting equipment and cutting method" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.

It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

Please refer to FIG. 1 to FIG. 12 , which is an embodiment of the present invention. This embodiment discloses a cutting equipment 100 and a cutting method S100. In the following description, cutting of a crystal ingot G is introduced, and the cutting method S100 is implemented using the cutting equipment 100 of this embodiment. However, the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the cutting equipment 100 may be used to cut objects other than the ingot G, and the cutting equipment used in the cutting method S100 may also be different. Contained in this example.

Furthermore, in order to facilitate the description of this embodiment, each component of the cutting device 100 and its connection relationship will be introduced first, and then the cutting method S100 using the cutting device 100 will be described. The cutting device 100 includes an adjustment stage 1 and a cutting mechanism 2 arranged corresponding to the adjustment stage 1 and capable of relatively rotating. The adjustment stage 1 and the cutting equipment 100 can move or rotate correspondingly to each other, and the specific operations of the adjustment stage 1 and the cutting equipment 100 can be controlled through a control panel (not shown in the figure). Control by inputting corresponding parameters into a computer (not shown) or a computer (not shown in the figure), but the present invention is not limited thereto.

Specifically, as shown in FIGS. 1 to 3 , the adjustment stage 1 has a bearing surface 11 and at least one vacuum suction cup 12 corresponding to the bearing surface 11 . Among them, the adjustment stage 1 defines a receiving space 13 on the bearing surface 11 for setting an object to be cut (ingot G as shown in Figure 7); at least one of the vacuum suction cups 12 is One end is located on the bearing surface 11 and connected to the accommodation space 13, and is used to absorb and position the object to be cut provided on the bearing surface 11, so that the object to be cut can be quickly positioned and the object to be cut can also be positioned. No waste is produced, but the invention is not limited to this. For example, in other embodiments not shown in the present invention, at least one of the vacuum suction cups 12 may be omitted or replaced by other components (such as adhesive and sacrificial materials) according to design requirements.

Furthermore, the adjustment stage 1 and the cutting mechanism 2 are configured to move relatively along a first direction D1 that is not perpendicular to the bearing surface 11, and are configured to move relatively along a second direction D2. The first direction D1 and the second direction D2 intersect with each other at an angle between 75 degrees and 105 degrees.

It should be noted that "relatively moving" in the above description of this embodiment means that at least one of the adjustment stage 1 and the cutting mechanism 2 moves. Furthermore, for the convenience of explanation, the first direction D1 is parallel to the bearing surface 11 and is a horizontal direction in this embodiment, while the second direction D2 is perpendicular to the bearing surface 11 . The bearing surface 11 is illustrated in a vertical direction. That is to say, the angle between the first direction D1 and the second direction D2 is 90 degrees in this embodiment, but in this embodiment The invention is not limited thereto.

Furthermore, as shown in FIG. 12 , the adjustment stage 1 in this embodiment is configured to rotate relative to the cutting mechanism 2 so that the bearing surface 11 forms an angle with the first direction D1 There is an adjustment angle σ11 according to which the orientation of the object to be cut relative to the cutting mechanism 2 is synchronously adjusted, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the cutting device 100 can rotate relative to the adjustment stage 1 to thereby adjust the object to be cut relative to the cutting platform. Orientation of mechanism 2.

More specifically, as shown in FIGS. 1 to 3 , the cutting mechanism 2 includes two winding seats 21 and a cutting wire 22 wound around the two winding seats 21 , and the two In this embodiment, the winding base 21 has substantially the same structure and is arranged substantially in mirror symmetry, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the two winding seats 21 may be slightly different or not arranged in mirror symmetry; or, the number of the winding seats 21 may be At least one.

Among them, each of the winding seats 21 in this embodiment includes a base body 213 that can move relative to the adjustment stage 1, and a first guide wheel installed on the base body 213 and spaced apart from each other. 211 and a second guide wheel 212. In any of the winding bases 21 of this embodiment, the base body 213 is generally L-shaped, and the first guide wheel 211 and the second guide wheel 212 can respectively move along their central axes C211 and C212. Rotationally installed at both ends of the base 213, and the central axis C211 of the first guide wheel 211 is not parallel to the central axis C212 of the second guide wheel 212 (for example: perpendicular to the two The two planes of the central axes C211 and C212 are perpendicular to each other), and the first guide wheel 211 is preferably detachably installed on the base 213, but is not limited thereto.

In more detail, the first guide wheel 211 and the second guide wheel 212 are both disk-shaped, the radius of the first guide wheel 211 is smaller than the radius of the second guide wheel 212, and the two so The first guide wheel 211 is located inside the two second guide wheels 212 . The central axis C211 of the first guide wheel 211 is preferably parallel to the second direction D2, and the central axis C212 of the second guide wheel 212 is preferably parallel to the first direction D2. Direction D1.

Furthermore, in a top view plane (such as FIG. 4 ) perpendicular to the central axis C211 of the first guide wheel 211 , the second guide wheel 212 is approximately located on the tangent line of the first guide wheel 211 direction; and in a front view plane (such as FIG. 5 ) perpendicular to the central axis C212 of the second guide wheel 212 , the first guide wheel 211 is approximately located on the second guide wheel 212 in the tangential direction, but the present invention is not limited to this.

As shown in FIGS. 1 to 3 , the cutting wire 22 is wound around the first guide wheel 211 and the second guide wheel 212 of each winding base 21 . For example, the cutting wire 22 is The second guide wheel 212 and the first guide wheel 211 are wound sequentially on one of the winding seats 21, and then the first guide wheel 211 is wound on the other of the winding seats 21. and the second guide wheel 212. Wherein, the central angle of any of the first guide wheel 211 or the second guide wheel 212 against the cutting line 22 corresponding to the corresponding central axes C211 and C212 is not greater than 90 degrees, However, the present invention is not limited to this.

The cutting line 22 winds around the two first guide wheels 211 to form a first cutting section 221 between the two first guide wheels 211, and the cutting mechanism 2 and the adjustment stage 1 It is configured to move relatively along the first direction D1 so that the first cutting section 221 passes through the accommodation space 13 . Furthermore, when the first guide wheel 211 of each winding base 21 is removed from the base body 213, the cutting wire 22 passes through the two second guide wheels 212 and ends at the two second guide wheels 212. A second cutting section 222 is formed between the second guide wheels 212, and the cutting mechanism 2 and the adjustment stage 1 are configured to relatively move closer along the second direction D2, so that the second The cutting section 222 enters the accommodation space 13 .

In addition, although each of the winding bases 21 is described as including the base body 213, the first guide wheel 211, and the second guide wheel 212 in this embodiment, it is not limited to the present invention. In other illustrated embodiments, the second guide wheel 212 may be omitted according to design requirements; or, when the number of the winding seats 21 is at least one, the cutting wire 22 winds through at least one of the winding seats 21 . The first guide wheel 211 of the bobbin base 21 constitutes the first cutting section 221 .

The above is a structural description of the cutting device 100 of this embodiment; as shown in FIGS. 6 to 12 , the cutting method S100 using the cutting device 100 will be introduced below. In this embodiment, the cutting method S100 sequentially includes a pre-step S110, a slicing step S130, an inspection step S150, an adjustment step S170, and a cutting step S190, but is not limited thereto.

For example, in other embodiments not shown in the present invention, the number and schedule of steps S110 to S190 of the cutting method S100 can be adjusted and changed according to design requirements, and the adjustment steps At least one of S170 and the cutting step S190 may be selectively omitted. Each of the steps S110 to S190 will be introduced in sequence below, and please refer to the above for technical content related to the cutting device 100 .

The pre-step S110: As shown in Figures 6 and 7, a crystal ingot G is fixed on the cutting device 100 (the bearing surface 11), and the crystal ingot G in this embodiment is The adjustment stage 1 is adsorbed and fixed on the carrying surface 11 by at least one of the vacuum suction cups 12 (for example, the ingot G is fixed in the accommodating space 13 ). In addition, in other embodiments not shown in the present invention, the ingot G can also be fixed on the bearing surface 11 of the adjustment stage 1 through adhesive and sacrificial materials, so that it is positioned on the Within the accommodation space 13.

The slicing step S130: As shown in Figures 6 and 8, the cutting mechanism 2 and the adjustment stage 1 move relatively along the first direction D1, so that the first cutting section 221 moves through The top of the crystal ingot G, and a wafer G1 to be inspected is cut from the crystal ingot G. Wherein, the wafer to be inspected G1 is obtained by the first cutting section 221 passing through the circumferential side surface of the ingot G along the first direction D1, and the thickness of the wafer to be inspected G1 is preferably greater than The smaller the better.

In this embodiment, the ingot G is located on one side of the first cutting section 221, and the two first guide wheels 211 are located on the other side of the first cutting section 221, and the cutting section The equipment 100 uses the adjustment stage 1 to move along the first direction D1 relative to the cutting mechanism 2, so that the ingot G is cut by the first cutting section 221 along the first direction D1, The two first guide wheels 211 can effectively withstand the reaction force generated during the cutting process.

The chip inspection step S150: As shown in FIGS. 6 and 9 , a crystal orientation detector 200 is used to inspect the wafer G1 to be inspected, so as to obtain the crystal orientation angle of the wafer G1 to be inspected. In this embodiment, the surface of the wafer to be inspected G1 can be defined with mutually perpendicular X-axis and Y-axis, and the crystal orientation detector 200 adopts an X-ray detector that can test the wafer to be inspected G1. Accordingly, a crystal orientation angle value is measured on each of the X-axis and the Y-axis of the wafer to be inspected G1. That is to say, the crystal orientation angle in this embodiment includes two crystal orientation angle values corresponding to the X-axis and the Y-axis of the wafer to be inspected G1, but the present invention is not limited thereto. Describe how to measure and define the crystal orientation angle.

When the difference between the crystal orientation angle in the inspection step S150 and a preset crystal orientation angle meets a preset allowable error, the cutting method S100 further implements the cutting step S190: as follows: As shown in FIG. 6 , FIG. 10 , and FIG. 11 , the crystal ingot G is cut to form a plurality of seed crystals G2 (that is, a plurality of predetermined cutting products). The method of cutting the ingot G into a plurality of seed crystals G2 can be adjusted and changed according to design requirements and is not limited to the diagram of this embodiment.

It should be noted that the preset crystal orientation angle in this embodiment includes a preset crystal orientation angle value corresponding to the X-axis and the Y-axis, and the preset allowable error is relatively small. Preferably, on any one of the X-axis and the Y-axis, the difference between the crystal orientation angle value of the wafer to be inspected G1 and the preset crystal orientation angle value is not greater than 0.01 degrees. , but the present invention is not limited thereto.

Furthermore, in this embodiment, the cutting step S190 sequentially includes a longitudinal cutting step S191 and a transverse cutting step S192. The longitudinal cutting step S191: As shown in Figure 10, the cutting mechanism 2 removes each of the first guide wheels 211, and then moves the cutting mechanism 2 relative to the adjustment stage 1, so that The second cutting section 222 may cut the ingot G along the second direction D2 multiple times at different positions. Wherein, every time the second cutting section 222 cuts the crystal ingot G along the second direction D2, the second cutting section 222 cuts to the preset boundary line of the crystal ingot G, but does not penetrate through it. The ingot G.

The transverse cutting step S192: As shown in Figure 11, the cutting mechanism 2 reinstalls each of the first guide wheels 211, and then moves the adjustment stage 1 relative to the cutting mechanism 2, so that the The first cutting section 221 may cut the preset boundary line of the crystal ingot G along the first direction D1, so that the crystal ingot G forms a plurality of seed crystals G2 that are separated from each other.

However, when the difference between the crystal orientation angle in the inspection step S150 and the preset crystal orientation angle does not meet the preset allowable error, the cutting method S100 further implements the Adjustment step S170: As shown in Figures 6 and 12, rotate the adjustment stage 1 in a direction that eliminates the difference (for example, the adjustment angle σ11 is formed). Furthermore, after the adjustment step S170, the slicing step S130 and the slice inspection step S150 are then implemented.

That is to say, the adjustment step S170, the slicing step S130, and the test step S150 are performed in turn N times (N is a positive integer), and when the Nth test step S150 When the difference between the crystal orientation angle and the preset crystal orientation angle meets the preset allowable error, the cutting method S100 then implements the cutting step S190 as shown in Figures 10 and 11 .

[Technical effects of the embodiments of the present invention]

In summary, the cutting equipment and cutting method disclosed in the embodiments of the present invention are configured through the cutting mechanism and the adjustment stage to be able to move relatively along the first direction that is not perpendicular to the bearing surface. Move so that the first cutting section passes through the crystal ingot (or the accommodation space) to facilitate the implementation of the slicing step and the chip inspection step, so that the crystal ingot can be confirmed before Carry out cutting operations under the condition of crystal orientation angle.

Furthermore, the cutting method disclosed in the embodiment of the present invention can also use the adjustment step to match the slicing step and the inspection step, so as to effectively control the placement position of the crystal ingot, thereby improving Accuracy of crystal orientation angle.

In addition, the cutting equipment and cutting method disclosed in the embodiments of the present invention are provided with at least one vacuum suction cup to fix the ingot (or the object to be cut), thereby reducing the use of glue and sacrificial materials. material cost, and can effectively save the time required to remove adhesive (for example: about 10 hours).

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. within.

100:Cutting equipment 1:Adjust the carrier 11: Bearing surface 12: Vacuum suction cup 13: Accommodation space 2: Cutting mechanism 21: Winding seat 211:First guide wheel 212:Second guide wheel 213: base body 22: Cutting line 221: First cutting section 222: Second cutting section D1: first direction D2: second direction σ11:Adjustment angle C211: Central axis C212: Central axis 200: Crystal orientation detector G:crystal ingot G1: Chip to be inspected G2: seed crystal S100: Cutting method S110: Preliminary steps S130: Slicing step S150: Film inspection steps S170: Adjustment steps S190: Cutting steps S191: Longitudinal cutting steps S192: Transverse cutting steps

Figure 1 is a schematic three-dimensional view of a cutting device according to an embodiment of the present invention.

FIG. 2 is a perspective view of the cutting device of FIG. 1 operating in a first direction.

FIG. 3 is a perspective view of the cutting device in FIG. 1 operating in a second direction.

FIG. 4 is a schematic top view of the cutting mechanism of the cutting equipment of FIG. 1 .

FIG. 5 is a schematic front view of the cutting mechanism of the cutting equipment of FIG. 1 .

Figure 6 is a schematic flow chart of a cutting method according to an embodiment of the present invention.

FIG. 7 is a schematic diagram of the preliminary steps of the cutting method in FIG. 6 .

Figure 8 is a schematic diagram of the slicing steps of the cutting method in Figure 6.

Figure 9 is a schematic diagram of the chip inspection steps of the cutting method in Figure 6.

Figure 10 is a schematic diagram (1) of the cutting steps of the cutting method in Figure 6.

Figure 11 is a schematic diagram (2) of the cutting steps of the cutting method in Figure 6.

FIG. 12 is a schematic diagram of the adjustment steps of the cutting method in FIG. 6 .

100:Cutting equipment

1:Adjust the carrier

11: Bearing surface

12: Vacuum suction cup

13: Accommodation space

2: Cutting mechanism

21: Winding seat

211:First guide wheel

212:Second guide wheel

213: base body

22: Cutting line

221: First cutting section

D1: first direction

D2: second direction

C211: Central axis

C212: Central axis

Claims (11)

A cutting device, which includes: an adjustment stage, which has a bearing surface, and the adjustment stage defines an accommodation space on the bearing surface; and a cutting mechanism, which is arranged corresponding to the adjustment stage and Can rotate relatively, and the cutting mechanism includes two winding seats and a cutting wire; wherein, each of the winding seats includes: a base body that can move relative to the adjustment stage; and a first A guide wheel and a second guide wheel are installed on the base body; wherein, the cutting wire is wound around the first guide wheel and the second guide wheel, and passes through the two winding seats. The first guide wheel forms a first cutting section therebetween, and the cutting mechanism and the adjustment stage are configured to move relatively along a first direction that is not perpendicular to the bearing surface, so as to The first cutting section is passed through the accommodation space; wherein, the first guide wheel of each winding base is detachably installed on the base body; when each first guide wheel When the wheel is removed from the base, the cutting wire winds around the two second guide wheels to form a second cutting section between the two second guide wheels. The cutting mechanism and the The adjustment stage is configured to relatively move closer along a second direction, so that the second cutting section enters the accommodation space. The cutting device of claim 1, wherein in each of the winding seats, the central axis of the first guide wheel is non-parallel to the central axis of the second guide wheel. The cutting device according to claim 1, wherein the first direction and the second direction have an included angle between 75 degrees and 105 degrees. The cutting equipment according to claim 1, wherein the adjustment stage includes at least one vacuum suction cup, and one end of the at least one vacuum suction cup is located on the bearing surface and connected to the accommodation space. The cutting equipment of claim 1, wherein the adjustment stage is configured to rotate relative to the cutting mechanism to form an adjustment angle between the bearing surface and the first direction. A cutting method, which includes: a pre-step; fixing an object to be cut on a cutting equipment; wherein the cutting equipment includes: an adjustment stage with a bearing surface, and the object to be cut is fixed on the bearing surface; and a cutting mechanism, which is arranged corresponding to the adjustment stage and can rotate relatively, and the cutting mechanism includes two winding seats and a cutting wire; wherein, each of the The winding base includes a base body that can move relative to the adjustment stage, and a first guide wheel and a second guide wheel installed on the base body; wherein the cutting wire is wound around the first guide wheel. A guide wheel, the second guide wheel, and the first guide wheel passing through the two winding seats form a first cutting section therebetween; the slicing step: the cutting mechanism and the adjustment The carrier moves relatively along a first direction that is not perpendicular to the bearing surface, so that the first cutting section moves through the top of the object to be cut, and a portion to be inspected is cut from the object to be cut. The wafer; and a chip inspection step: inspect the wafer to be inspected with a crystal orientation detector to learn the crystal orientation angle of the wafer to be inspected; Wherein, when the difference between the crystal orientation angle in the inspection step and a preset crystal orientation angle meets a preset allowable error, the cutting method further implements a cutting step: which includes a Longitudinal cutting step: remove each first guide wheel of the cutting mechanism, and wind the cutting line through two second guide wheels to form between the two second guide wheels A second cutting section is moved relative to the adjustment stage by the cutting mechanism, so that the second cutting section cuts the object to be cut along a second direction multiple times at different positions. The cutting method according to claim 6, wherein the cutting step: cuts the object to be cut so that it forms a plurality of predetermined cutting products. The cutting method according to claim 7, wherein each time the second cutting section cuts the object to be cut along the second direction, the second cutting section cuts to the edge of the object to be cut. The preset boundary line does not penetrate the object to be cut. The cutting method according to claim 8, wherein the cutting step further includes a transverse cutting step after the longitudinal cutting step: reinstalling each of the first guide wheels on the cutting mechanism, and then The adjustment stage moves relative to the cutting mechanism, so that the first cutting section cuts the preset boundary line of the object to be cut along the first direction, so that the objects to be cut are separated from each other. A plurality of the predetermined cutting products. The cutting method as described in claim 6, wherein when the difference between the crystal orientation angle in the inspection step and a preset crystal orientation angle does not meet a preset allowable error, the The cutting method further implements an adjustment step: rotating the adjustment stage in a direction to eliminate the difference; after the adjustment step, Then, the slicing step and the film inspection step are implemented; the adjustment step, the slicing step, and the film inspection step are implemented in sequence N times, where N is a positive integer, and the Nth film inspection step The difference between the crystal orientation angle in the step and the preset crystal orientation angle complies with the preset tolerance. The cutting method according to claim 6, wherein in the pre-step, the object to be cut is adsorbed and fixed on the bearing surface by at least one vacuum suction cup of the adjustment stage.

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