TWI815644B - Display device - Google Patents
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- 239000000565 sealant Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims description 90
- 239000004973 liquid crystal related substance Substances 0.000 description 13
- 125000006850 spacer group Chemical group 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 230000036961 partial effect Effects 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 240000004050 Pentaglottis sempervirens Species 0.000 description 1
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
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Abstract
Description
本揭露是有關於一種顯示裝置。The present disclosure relates to a display device.
隨著顯示技術的發展,液晶顯示裝置被應用於各種顯示設備,例如,手機、電視、計算機等。液晶顯示裝置包含相對的彩膜基板、陣列基板以及介於兩種基板之間的液晶層,其中液晶顯示裝置可以透過陣列基板控制液晶層中的液晶分子的排列方向。在陣列基板中具有顯示區域以及環繞顯示區域的非顯示區域。在非顯示區域中包含具有多個導線的導線區域以及封裝液晶顯示設備的封框區域。With the development of display technology, liquid crystal display devices are used in various display devices, such as mobile phones, televisions, computers, etc. The liquid crystal display device includes an opposing color filter substrate, an array substrate, and a liquid crystal layer between the two substrates. The liquid crystal display device can control the alignment direction of the liquid crystal molecules in the liquid crystal layer through the array substrate. The array substrate has a display area and a non-display area surrounding the display area. The non-display area includes a conductor area having a plurality of conductors and a sealing frame area for packaging the liquid crystal display device.
然而,用於封裝液晶顯示裝置的封框材料因為與液晶層接觸,導致空氣以及水蒸氣進入顯示區域,進而影響了液晶顯示裝置的顯示效果。However, the sealing material used to encapsulate the liquid crystal display device contacts the liquid crystal layer, causing air and water vapor to enter the display area, thereby affecting the display effect of the liquid crystal display device.
因此,如何提出一種可解決上述問題的顯示裝置,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to propose a display device that can solve the above problems is one of the problems that the industry is currently eager to invest in research and development resources to solve.
有鑑於此,本揭露之一目的在於提出一種可有效解決上述問題的顯示裝置。In view of this, one purpose of the present disclosure is to provide a display device that can effectively solve the above problems.
本揭露是有關於一種顯示裝置包含基板、第一導線層、第二導線層、配向膜以及封框膠。基板包含顯示區域與導線區域。顯示區域位於基材的中央區域。導線區域鄰近顯示區域並位於基材的邊緣區域。第一導線層位於導線區域上並且包含第一導線。第二導線層位於第一導線層上並且包含第二導線。每一第二導線中包含開口。位於第二導線中的相鄰兩者中的開口彼此錯位排列。配向膜覆蓋顯示區域。封框膠鄰近設置於導線區域遠離顯示區域的一側。The present disclosure relates to a display device including a substrate, a first conductor layer, a second conductor layer, an alignment film and a frame sealant. The substrate includes a display area and a wire area. The display area is located in the central area of the substrate. The wire area is adjacent to the display area and located at the edge area of the substrate. The first conductive layer is located on the conductive area and contains the first conductive line. The second conductive layer is located on the first conductive layer and contains the second conductive line. Each second conductor contains an opening. The openings in two adjacent ones of the second conductive lines are offset from each other. The alignment film covers the display area. The frame sealant is disposed adjacent to the side of the wire area away from the display area.
在目前一些實施方式中,第二導線沿著第一方向延伸。第二導線中的開口的數量為複數個。第二導線的一者中的兩相鄰的開口在第一方向上具有第一間距,並且第二導線的相鄰兩者中的另兩相鄰的開口在第一方向上具有一第二間距。第一間距大於第二間距。In some current implementations, the second wire extends along the first direction. The number of openings in the second conductor is plural. Two adjacent openings in one of the second conductors have a first spacing in the first direction, and the other two adjacent openings in the two adjacent second conductors have a second spacing in the first direction. . The first spacing is greater than the second spacing.
在目前一些實施方式中,第二間距大於每一開口的開口長度。In some current implementations, the second spacing is greater than the opening length of each opening.
在目前一些實施方式中,第一導線連接形成網格狀結構。In some current implementations, the first wire connections form a grid-like structure.
在目前一些實施方式中,在俯視角中,至少一部分的第一導線與第二導線彼此對齊。In some current implementations, at least a portion of the first conductive line and the second conductive line are aligned with each other in a top view.
在目前一些實施方式中,第二導線沿著第一方向延伸。第二導線中的不相鄰兩者的開口沿著垂直第一方向的第二方向排列。In some current implementations, the second wire extends along the first direction. Non-adjacent openings in the second conductor are arranged along a second direction perpendicular to the first direction.
在目前一些實施方式中,第二導線中的至少一者沿著第二方向介於第二導線中的不相鄰兩者的開口之間。In some current implementations, at least one of the second conductive lines is interposed between openings of two non-adjacent ones of the second conductive lines along the second direction.
在目前一些實施方式中,第二導線被開口分隔成彼此斷開的多個線段。In some current implementations, the second conductor is divided by the opening into a plurality of line segments that are disconnected from each other.
在目前一些實施方式中,配向膜以及封框膠分別覆蓋導線區域的一部分但彼此隔開。In some current implementations, the alignment film and the frame sealant respectively cover a part of the conductor area but are separated from each other.
在目前一些實施方式中,配向膜覆蓋第一導線層的一部分但不覆蓋第二導線層。配向膜穿過部分的開口。In some current implementations, the alignment film covers a portion of the first conductive layer but does not cover the second conductive layer. The alignment film passes through the opening of the portion.
綜上所述,於本揭露的顯示裝置中,透過在位於顯示區域周圍的導線區域中適當的設置阻擋障礙物(例如,第二導線與其中的開口)以避免配向膜與導線區域另一側的封框膠接觸。具體來說,導線區域中的第一導線層以及第二導線層構成的雙層導線結構配合週期性設置的開口,將可以以平均分布配向膜的流動路徑,使配向膜能平均的分佈在導線區域中,並且分流至位於導線區域中的多個開口,以降低配向膜集中匯流並接觸封框膠的可能性。再者,第二導線層中的開口呈現錯位排列,如此一來,將有助於延長配向膜在導線區域中的流動路徑距離,亦可以幫助降低配向膜接觸封框膠的可能性。此外,開口在第二導線層中適當地以第一間距、第二間距、第三間距劃定開口的排列週期,將可以降低第二導線層的表面積,以避免第二導線層所累積的靜電荷影響第一導線層的電訊號傳遞。To sum up, in the display device of the present disclosure, blocking obstacles (for example, second conductive lines and openings therein) are appropriately provided in the conductive line area around the display area to prevent the alignment film from interfering with the other side of the conductive line area. of frame sealant contact. Specifically, the double-layer conductor structure composed of the first conductor layer and the second conductor layer in the conductor area, combined with the periodically arranged openings, can evenly distribute the flow path of the alignment film, so that the alignment film can be evenly distributed on the conductor lines. area, and divert the flow to multiple openings located in the wire area to reduce the possibility of the alignment film converging and contacting the frame sealant. Furthermore, the openings in the second conductor layer are arranged in a staggered manner, which will help extend the flow path distance of the alignment film in the conductor area and also help reduce the possibility of the alignment film contacting the frame sealant. In addition, the arrangement period of the openings in the second conductive layer is appropriately defined by the first pitch, the second pitch, and the third pitch, which can reduce the surface area of the second conductive layer and avoid static electricity accumulated in the second conductive layer. The charge affects the electrical signal transmission on the first conductor layer.
以下揭露內容提供用於實施所提供標的之不同特徵的許多不同實施例或實例。以下描述部件及佈置之特定實例以簡化本揭露。當然,此些僅為實例,且並不意欲為限制性的。舉例而言,在如下描述中第一特徵在第二特徵之上或在第二特徵上形成可包括其中第一特徵與第二特徵形成為直接接觸之實施例,且亦可包括其中額外特徵可在第一特徵與第二特徵之間形成而使得第一特徵與第二特徵可不直接接觸的實施例。另外,本揭露可在各種實例中重複元件符號及/或字母。此重複係出於簡化及清楚目的,且其自身並不表示所論述之各種實施例及/或配置之間的關係。The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, the following description where a first feature is formed on or on a second feature may include embodiments in which the first feature and the second feature are formed in direct contact, and may also include embodiments in which additional features may be Embodiments are formed between a first feature and a second feature such that the first feature and the second feature may not be in direct contact. Additionally, the present disclosure may repeat reference symbols and/or letters in various instances. This repetition is for simplicity and clarity and does not in itself represent a relationship between the various embodiments and/or configurations discussed.
另外,為了描述簡單,可在本文中使用諸如「在……下面」、「在……下方」、「下部」、「在……上方」、「上部」及其類似術語之空間相對術語,以描述如諸圖中所示的一個元件或特徵與另一(另外)元件或特徵的關係。除了諸圖中所描繪之定向以外,此些空間相對術語意欲涵蓋元件在使用中或操作中之不同定向。裝置可以其他方式定向(旋轉90度或以其他定向),且可同樣相應地解釋本文中所使用之空間相對描述詞。In addition, for simplicity of description, spatially relative terms such as "below", "below", "lower", "above", "upper" and similar terms may be used herein. Describe the relationship of one element or feature to another (additional) element or feature as illustrated in the figures. These spatially relative terms are intended to encompass different orientations of elements in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
本文中使用的「大約」、「約」、「近似」或者「實質上」一般表示落在給定值或範圍的百分之二十之中,或在百分之十之中,或在百分之五之中。本文中所給予的數字量值為近似值,表示使用的術語如「大約」、「約」、「近似」或者「實質上」在未明確說明時可以被推斷。As used herein, "about," "approximately," "approximately" or "substantially" generally means falling within twenty percent, within ten percent, or within one hundred percent of a given value or range. Out of five. Numerical quantities given herein are approximations, meaning that terms such as "about," "approximately," "approximately" or "substantially" may be inferred when not expressly stated otherwise.
第1圖為根據本揭露之一些實施例的顯示裝置100之局部示意圖。請參照第1圖,本揭露的實施例是有關於一種顯示裝置100包含基板110、第一導線層132、第二導線層134、配向膜140以及封框膠150。基板110包含顯示區域120與導線區域130。顯示區域120位於基板110的中央區域。導線區域130鄰近顯示區域120並位於基板110的邊緣區域。第一導線層132位於導線區域130上並且包含第一導線132a、132b。第二導線層134位於第一導線層132上並且包含第二導線134a。每一第二導線134a中包含開口134b。位於第二導線134a中的相鄰兩者中的開口134b彼此錯位排列。配向膜140覆蓋顯示區域120。封框膠150鄰近設置於導線區域130遠離顯示區域120的一側。在一些實施例中,配向膜140以及封框膠150分別覆蓋導線區域130的一部分但彼此隔開。換句話說,導線區域130位在顯示區域120以及封框膠150之間,並且用以結構上地隔開配向膜140以及封框膠150。 FIG. 1 is a partial schematic diagram of a display device 100 according to some embodiments of the present disclosure. Referring to FIG. 1 , an embodiment of the present disclosure relates to a display device 100 including a substrate 110 , a first conductor layer 132 , a second conductor layer 134 , an alignment film 140 and a frame sealant 150 . The substrate 110 includes a display area 120 and a conductor area 130 . The display area 120 is located in the central area of the substrate 110 . The wire area 130 is adjacent to the display area 120 and located at the edge area of the substrate 110 . The first conductor layer 132 is located on the conductor area 130 and includes the first conductors 132a, 132b. The second conductive wire layer 134 is located on the first conductive wire layer 132 and includes the second conductive wire 134a. Each second wire 134a includes an opening 134b. The openings 134b located in adjacent two of the second conductive lines 134a are offset from each other. The alignment film 140 covers the display area 120. The sealant 150 is disposed adjacent to the side of the wire area 130 away from the display area 120 . In some embodiments, the alignment film 140 and the sealant 150 respectively cover a part of the conductor area 130 but are separated from each other. In other words, the conductor area 130 is located between the display area 120 and the frame sealant 150, and is used to structurally separate the alignment film 140 and the frame sealant 150.
第2A圖為導線區域130的局部放大示意圖。第2B圖為第一導線層132的局部放大示意圖。第2C圖為第一導線層132以及第二導線層134的局部放大示意圖。請參照第1圖、第2A圖、第2B圖以及第2C圖,第一導線層132以及第二導線層134位於基板110的導線區域130上。第一導線層132包含第一導線132a、132b。在一些實施例中,第一導線132a沿著第一方向A1延伸,第一導線132b沿著與第一方向A1不平行的第二方向A2延伸,並連接第一導線132a。在一些實施例中,第一導線132a、132b連接形成網格狀結構。舉例來說,在俯視角中,有彼此垂直的第一方向A1以及第二方向A2。多個第一導線132a沿著第一方向A1延伸,多個第一導線132b沿著第二方向A2延伸,並與第一導線132a連接,形成網格狀結構(參照第2B圖)。第二導線層134位於第一導線層132上並且包含第二導線134a。第二導線134a中具有開口134b。每一第二導線134a中均包含開口134b,並且位於第二導線134a中的相鄰兩者中的開口134b彼此錯位排列。在一些實施例中,第二導線134a被開口134b分隔成彼此斷開的多個線段。更進一步來說,在第1圖、第2A圖、第2B圖以及第2C圖所示的實施例中,在俯視角中,至少一部分的第一導線132a與第二導線134a彼此對齊,並且沿著第二方向A2延伸的第一導線132b的一部分沒有被第二導線134a覆蓋。如此一來,第一導線層132以及第二導線層134在導線區域130中形成一種雙層導線結構。Figure 2A is a partially enlarged schematic diagram of the conductor area 130. FIG. 2B is a partially enlarged schematic diagram of the first conductive layer 132 . FIG. 2C is a partially enlarged schematic diagram of the first conductor layer 132 and the second conductor layer 134 . Please refer to Figure 1, Figure 2A, Figure 2B and Figure 2C. The first conductor layer 132 and the second conductor layer 134 are located on the conductor area 130 of the substrate 110. The first conductive wire layer 132 includes first conductive wires 132a and 132b. In some embodiments, the first conductor 132a extends along the first direction A1, and the first conductor 132b extends along the second direction A2 that is not parallel to the first direction A1 and is connected to the first conductor 132a. In some embodiments, the first wires 132a and 132b are connected to form a grid-like structure. For example, in a bird's-eye view, there are a first direction A1 and a second direction A2 that are perpendicular to each other. The plurality of first conductive wires 132a extend along the first direction A1, and the plurality of first conductive wires 132b extend along the second direction A2 and are connected with the first conductive wires 132a to form a mesh structure (see Figure 2B). The second conductive wire layer 134 is located on the first conductive wire layer 132 and includes the second conductive wire 134a. The second conductor 134a has an opening 134b therein. Each second conductive line 134a includes an opening 134b, and the openings 134b located in two adjacent second conductive lines 134a are staggered with each other. In some embodiments, the second wire 134a is separated into a plurality of line segments that are disconnected from each other by the opening 134b. Furthermore, in the embodiments shown in FIGS. 1 , 2A, 2B and 2C, in a top view, at least a portion of the first conductor 132a and the second conductor 134a are aligned with each other and along the A part of the first conductor 132b extending in the second direction A2 is not covered by the second conductor 134a. In this way, the first conductor layer 132 and the second conductor layer 134 form a double-layer conductor structure in the conductor area 130 .
第3A圖為根據第2C圖中的剖面指示線3-3繪示的局部剖面側視圖。第3B圖為根據第2C圖中的剖面指示線3-3繪示的另一實施例的局部剖面側視圖。請參照第2C圖、第3A圖以及第3B圖,在一些實施例中(如第3A圖所繪示),在第一導線層132以及第二導線層134之間具有間隔層160隔開兩者。在一些實施例中,間隔層160可以是非晶矽層,但本揭露並不以此為限。在其他一些實施例中(如第3B圖所繪示),第一導線層132以及第二導線層134之間不具有間隔層160。具體來說,是否形成間隔層160取決於製程過程中對於遮罩的選擇。第3A圖中的實施例結構,可以使用同一個遮罩形成間隔層160以及第二導線層134,如此一來將有助於減少製程步驟。另一方面,在第3B圖中的實施例結構因為不具有間隔層160,使得由第一導線層132以及第二導線層134所構成的雙層導線結構具有更佳的品質因子(Q因子)。第一導線層132將用於傳輸電訊號(例如,計數訊號),並且第二導線層134用於形成具有開口134b的阻擋結構抑制配向膜140朝向封框膠150流動(請參照第1圖)。Figure 3A is a partial cross-sectional side view drawn along the section indicator line 3-3 in Figure 2C. FIG. 3B is a partial cross-sectional side view of another embodiment shown along the cross-section indicator line 3-3 in FIG. 2C. Please refer to Figures 2C, 3A and 3B. In some embodiments (as shown in Figure 3A), there is a spacer layer 160 between the first conductive layer 132 and the second conductive layer 134 to separate them. By. In some embodiments, the spacer layer 160 may be an amorphous silicon layer, but the disclosure is not limited thereto. In some other embodiments (as shown in FIG. 3B ), there is no spacer layer 160 between the first conductive layer 132 and the second conductive layer 134 . Specifically, whether to form the spacer layer 160 depends on the selection of the mask during the process. In the structure of the embodiment shown in FIG. 3A , the same mask can be used to form the spacer layer 160 and the second conductive layer 134 , which will help reduce process steps. On the other hand, the structure of the embodiment in Figure 3B does not have the spacer layer 160, so that the double-layer wire structure composed of the first wire layer 132 and the second wire layer 134 has a better quality factor (Q factor). . The first conductive layer 132 will be used to transmit electrical signals (for example, counting signals), and the second conductive layer 134 will be used to form a barrier structure with openings 134b to inhibit the alignment film 140 from flowing toward the sealant 150 (please refer to Figure 1) .
在一些實施例中,第一導線層132與間隔層160之間還具有介電質層170。介電質層170完全覆蓋第一導線層132,使得第一導線132a與間隔層160彼此不接觸。具體來說,介電質層170可以與位於顯示區域120上的主動元件的閘介電層同層,間隔層160可以與位於顯示區域120上的主動元件的通道層同層。在形成絕緣層162後,介電質層170以及第二導線層134將共同被絕緣層162所覆蓋。具體來說,絕緣層162毯覆式的覆蓋介電質層170、間隔層160以及第二導線層134。如此一來,每個第二導線134a將獨立的被絕緣層162相互隔開。另一方面,在第二導線層134開口134b處,絕緣層162將直接接觸介電質層170。In some embodiments, there is a dielectric layer 170 between the first conductive layer 132 and the spacer layer 160 . The dielectric layer 170 completely covers the first conductive line layer 132 so that the first conductive line 132a and the spacer layer 160 do not contact each other. Specifically, the dielectric layer 170 may be in the same layer as the gate dielectric layer of the active element located on the display area 120 , and the spacer layer 160 may be in the same layer as the channel layer of the active element located in the display area 120 . After the insulating layer 162 is formed, the dielectric layer 170 and the second conductive layer 134 will be covered by the insulating layer 162 together. Specifically, the insulating layer 162 blanket covers the dielectric layer 170 , the spacer layer 160 and the second conductive layer 134 . In this way, each second conductor 134a is independently separated from each other by the insulating layer 162 . On the other hand, at the opening 134b of the second conductive layer 134, the insulating layer 162 will directly contact the dielectric layer 170.
請繼續參照第1圖、第2C圖、第3A圖以及第3B圖,在一些實施例中,配向膜140覆蓋第一導線層132的一部分但不覆蓋第二導線層134。配向膜140穿過部分的開口134b。配向膜140流入開口134b時(如第3A圖以及第3B圖右側區域所示),將會覆蓋第一導線層132以及部分的絕緣層162。隨後配向膜140流動至相鄰的第二導線層134時將被第二導線134a所阻擋,引導配向膜140沿著如第2C圖中所示的第一方向A1流動,以拉長配向膜140的流動距離避免配向膜140接觸封框膠150。Please continue to refer to FIG. 1 , FIG. 2C , FIG. 3A and FIG. 3B . In some embodiments, the alignment film 140 covers a part of the first conductive layer 132 but does not cover the second conductive layer 134 . The alignment film 140 passes through part of the opening 134b. When the alignment film 140 flows into the opening 134b (as shown in the right area of FIG. 3A and FIG. 3B ), it will cover the first conductive layer 132 and part of the insulating layer 162 . Subsequently, when the alignment film 140 flows to the adjacent second conductive line layer 134, it will be blocked by the second conductive line 134a, guiding the alignment film 140 to flow along the first direction A1 as shown in FIG. 2C to elongate the alignment film 140. The flow distance prevents the alignment film 140 from contacting the frame sealant 150 .
如第1圖至第2C圖所示的實施例,第一導線層132以及第二導線層134在導線區域130上構成雙層導線結構。同時,開口134b在第二導線層134中依據規則週期性的被設置(隨後段落將細節說明)以平均分布配向膜140的流動路徑。如此一來,將可以進一步減少因在導線區域130上集中設置開口134b而導致配向膜140沿著特定路徑匯流的情況,亦可以降低配向膜140通過導線區域130與封框膠150接觸的可能。此外,如前述段落所述,位於雙層導線結構的第二導線層134中的第二導線134a以及開口134b在配向膜140的流動路徑中形成障礙,使得配向膜140只能沿著第二導線134a中的多個開口134b流動,能進一步避免配向膜140與位於導線區域130另一側的封框膠150接觸。倘若配向膜140與封框膠150接觸,將會降低封框膠150密封液晶顯示裝置100的效果。封框膠150將會產生孔洞使得空氣或水蒸氣進入液晶層,並在顯示裝置100中形成多個泡泡狀空孔影響顯示裝置100的成像並降低液晶顯示裝置100的可靠度。As shown in the embodiments shown in FIGS. 1 to 2C , the first conductor layer 132 and the second conductor layer 134 form a double-layer conductor structure on the conductor region 130 . At the same time, openings 134b are periodically disposed in the second conductor layer 134 according to rules (details will be described in subsequent paragraphs) to evenly distribute the flow path of the alignment film 140. In this way, the concentration of openings 134b in the conductor area 130 causing the alignment film 140 to flow along a specific path can be further reduced, and the possibility of the alignment film 140 coming into contact with the frame sealant 150 through the conductor area 130 can also be reduced. In addition, as mentioned in the previous paragraph, the second conductive line 134a and the opening 134b located in the second conductive line layer 134 of the double-layer conductive structure form obstacles in the flow path of the alignment film 140, so that the alignment film 140 can only follow the second conductive line. The flow of multiple openings 134b in 134a can further prevent the alignment film 140 from contacting the sealant 150 located on the other side of the conductor area 130. If the alignment film 140 comes into contact with the frame sealant 150 , the effect of the frame sealant 150 in sealing the liquid crystal display device 100 will be reduced. The frame sealant 150 will generate holes, allowing air or water vapor to enter the liquid crystal layer, and form multiple bubble-shaped holes in the display device 100 , affecting the imaging of the display device 100 and reducing the reliability of the liquid crystal display device 100 .
另一方面,第二導線層134中設置多個開口134b的另一個目的在於降低第二導線層134的表面積。若在第二導線層134上形成過少的開口134b或者每個開口134b的間距過大,都會使第二導線層134的表面積過大,導致過多靜電荷累積在第二導線層134上進而影響第一導線層132所傳輸的電訊號。因此,在第二導線層134中設置多個開口134b將可以有效控制在第二導線層134的電荷累積量,進一步降低第二導線層134對第一導線層132在傳遞電訊號時的影響。On the other hand, another purpose of providing the plurality of openings 134b in the second conductive layer 134 is to reduce the surface area of the second conductive layer 134. If too few openings 134b are formed on the second conductive line layer 134 or the spacing between each opening 134b is too large, the surface area of the second conductive line layer 134 will be too large, causing excessive static charges to accumulate on the second conductive line layer 134 and thereby affecting the first conductive line. Electrical signals transmitted by layer 132. Therefore, providing a plurality of openings 134b in the second conductive layer 134 can effectively control the amount of charge accumulation in the second conductive layer 134, further reducing the impact of the second conductive layer 134 on the first conductive layer 132 when transmitting electrical signals.
請參照第2A圖至第2C圖,第二導線134a沿著第一方向A1延伸。第二導線134a中具有多個開口134b,每一個開口134b的開口長度L1為50 μm。根據本揭露的一些示例性實施例,這些開口134b依照三種不同的間距彼此錯位設置。首先,在一些實施例中,第二導線134a沿著第一方向A1延伸。第二導線134a中的開口134b的數量為複數個。第二導線134a的一者中的兩相鄰的開口134b在第一方向A1上具有第一間距D1,並且第二導線134a的相鄰兩者中的另兩相鄰的開口134b在第二方向A2上具有一第二間距D2。第一間距D1大於第二間距D2。在一些實施例中,第一間距D1的長度為9900μm。在一些實施例中,第二間距D2的長度為1100μm。在一些實施例中,第二間距D2大於每一開口134b的開口長度L1。換句話說,第一間距D1將大於第二間距D2以及開口134b的開口長度L1。另一方面,在一些實施例中,第二導線134a沿著第一方向A1延伸。第二導線134a中的不相鄰兩者的開口134b沿著垂直第一方向A1的第二方向A2排列。此外,在一些實施例中,第二導線134a中的至少一者沿著第二方向A2介於第二導線134a中的不相鄰兩者的開口134b之間。具體來說,第二導線134a中的開口134b沿著第二方向A2依據特定間距(例如,第三間距D3)呈現周期排列(如第2C圖所示)。此外,在第二方向A2上間隔第三間距D3的開口134b之間將會被一或多個第二導線134a所隔開。在一些實施例中,第三間距D3的長度為250μm。要特別說明的是,第三間距也可以根據兩開口134b之間所間隔的第二導線134a的數目所定義。舉例來說,參照第2C圖的實施例,沿著第二方向A2排列的開口134b之間間隔9個第二導線134a。換句話說,開口134b在第二方向A2上以10個第二導線134a為一個週期的方式被設置。然而,本揭露並不以此為限,其他合適的週期排列亦可以被使用。Referring to Figures 2A to 2C, the second wire 134a extends along the first direction A1. The second wire 134a has a plurality of openings 134b, and the opening length L1 of each opening 134b is 50 μm. According to some exemplary embodiments of the present disclosure, the openings 134b are offset from each other according to three different spacings. First, in some embodiments, the second wire 134a extends along the first direction A1. The number of openings 134b in the second conductor 134a is a plurality. Two adjacent openings 134b in one of the second conductive lines 134a have a first distance D1 in the first direction A1, and the other two adjacent openings 134b in the second conductive line 134a are in the second direction A1. A2 has a second distance D2. The first distance D1 is greater than the second distance D2. In some embodiments, the length of the first distance D1 is 9900 μm. In some embodiments, the length of the second distance D2 is 1100 μm. In some embodiments, the second distance D2 is greater than the opening length L1 of each opening 134b. In other words, the first distance D1 will be greater than the second distance D2 and the opening length L1 of the opening 134b. On the other hand, in some embodiments, the second conductive line 134a extends along the first direction A1. The non-adjacent openings 134b in the second conductive lines 134a are arranged along the second direction A2 perpendicular to the first direction A1. Furthermore, in some embodiments, at least one of the second conductive lines 134a is between the openings 134b of two non-adjacent ones of the second conductive lines 134a along the second direction A2. Specifically, the openings 134b in the second conductive line 134a are periodically arranged according to a specific pitch (for example, the third pitch D3) along the second direction A2 (as shown in FIG. 2C). In addition, the openings 134b spaced apart by the third distance D3 in the second direction A2 will be separated by one or more second conductive lines 134a. In some embodiments, the length of the third distance D3 is 250 μm. It should be noted that the third spacing can also be defined according to the number of second conductive lines 134a spaced between the two openings 134b. For example, referring to the embodiment of FIG. 2C , nine second wires 134a are spaced between the openings 134b arranged along the second direction A2. In other words, the openings 134b are disposed in the second direction A2 in such a manner that ten second conductive lines 134a constitute one cycle. However, the present disclosure is not limited to this, and other suitable periodic arrangements can also be used.
在第2A圖至第2C圖所示的實施例中,使開口134b錯位排列的目的在於提升配向膜140跨過導線區域130的難度。具體來說,在上述實施例中,不論是第一間距D1或者第二間距D2都遠大於開口長度L1,這樣設計的目的在於增加配向膜140在第一方向A1上通過導線區域130的距離長度,以避免配向膜140與位於導線區域130另一側的封框膠150接觸。再者,沿著第二方向A2排列的開口134b之間間隔9個第二導線134a,使得鄰近開口134b在第二方向A2上也具有適當間距以拉長配向膜穿過導線區域130的路徑,亦可以避免配向膜140與導線區域130另一側的封框膠150接觸。In the embodiments shown in FIGS. 2A to 2C , the purpose of staggering the openings 134 b is to increase the difficulty of the alignment film 140 crossing the conductor area 130 . Specifically, in the above embodiment, both the first distance D1 and the second distance D2 are much larger than the opening length L1. The purpose of this design is to increase the distance length of the alignment film 140 through the conductor area 130 in the first direction A1. to prevent the alignment film 140 from contacting the frame sealant 150 located on the other side of the conductor area 130 . Furthermore, nine second wires 134a are spaced between the openings 134b arranged along the second direction A2, so that adjacent openings 134b also have appropriate spacing in the second direction A2 to elongate the path of the alignment film through the wire area 130, It can also prevent the alignment film 140 from contacting the frame sealant 150 on the other side of the conductive area 130.
以上對於本揭露之具體實施方式之詳述,可以明顯地看出,於本揭露的顯示裝置中,透過在位於顯示區域周圍的導線區域中適當的設置阻擋障礙物(例如,第二導線與其中的開口)以避免配向膜與導線區域另一側的封框膠接觸。具體來說,導線區域中的第一導線層以及第二導線層構成的雙層導線結構配合週期性設置的開口,將可以以平均分布配向膜的流動路徑,使配向膜能平均的分佈在導線區域中,並且分流至位於導線區域中的多個開口,以降低配向膜集中匯流並接觸封框膠的可能性。再者,第二導線層中的開口呈現錯位排列,如此一來,將有助於延長配向膜在導線區域中的流動路徑距離,亦可以幫助降低配向膜接觸封框膠的可能性。此外,開口在第二導線層中適當地以第一間距、第二間距、第三間距劃定開口的排列週期,將可以降低第二導線層的表面積,以避免第二導線層所累積的靜電荷影響第一導線層的電訊號傳遞。From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the display device of the present disclosure, by appropriately arranging blocking obstacles (for example, the second conductive line and the second conductive line) in the conductor area located around the display area opening) to avoid contact between the alignment film and the sealant on the other side of the conductor area. Specifically, the double-layer conductor structure composed of the first conductor layer and the second conductor layer in the conductor area, combined with the periodically arranged openings, can evenly distribute the flow path of the alignment film, so that the alignment film can be evenly distributed on the conductor lines. area, and divert the flow to multiple openings located in the wire area to reduce the possibility of the alignment film converging and contacting the frame sealant. Furthermore, the openings in the second conductor layer are arranged in a staggered manner, which will help extend the flow path distance of the alignment film in the conductor area and also help reduce the possibility of the alignment film contacting the frame sealant. In addition, the arrangement period of the openings in the second conductive layer is appropriately defined by the first pitch, the second pitch, and the third pitch, which can reduce the surface area of the second conductive layer and avoid static electricity accumulated in the second conductive layer. The charge affects the electrical signal transmission on the first conductor layer.
前文概述了若干實施例之特徵,使得熟習此項技術者可較佳地理解本揭露之態樣。熟習此項技術者應瞭解,他們可容易地使用本揭露作為設計或修改用於實現相同目的及/或達成本文中所介紹之實施例之相同優勢的其他製程及結構的基礎。熟習此項技術者亦應認識到,此些等效構造不脫離本揭露之精神及範疇,且他們可在不脫離本揭露之精神及範疇的情況下於本文作出各種改變、代替及替換。The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent structures do not depart from the spirit and scope of the disclosure, and they can make various changes, substitutions and substitutions herein without departing from the spirit and scope of the disclosure.
100:顯示裝置 110:基板 120:顯示區域 130:導線區域 132:第一導線層 132a,132b:第一導線 134:第二導線層 134a:第二導線 134b:開口 140:配向膜 150:封框膠 160:間隔層 162:絕緣層 170:介電質層 A1:第一方向 A2:第二方向 D1:第一間距 D2:第二間距 D3:第三間距 L1:開口長度 100:Display device 110:Substrate 120:Display area 130: Wire area 132: First conductor layer 132a, 132b: first conductor 134: Second wire layer 134a: Second wire 134b:Open your mouth 140:Alignment film 150: Frame sealing glue 160: spacer layer 162:Insulation layer 170: Dielectric layer A1: first direction A2: Second direction D1: first distance D2: second distance D3: The third distance L1: opening length
當結合隨附諸圖閱讀時,得以自以下詳細描述最佳地理解本揭露之態樣。應注意,根據行業上之標準實務,各種特徵未按比例繪製。事實上,為了論述清楚,可任意地增大或減小各種特徵之尺寸。 第1圖為根據本揭露之一些實施例的顯示裝置之局部示意圖。 第2A圖為第1圖的顯示裝置之導線區域的局部放大示意圖。 第2B圖為第2A圖的顯示裝置之導線區域的第一導線層的局部放大示意圖。 第2C圖為第2A圖的顯示裝置之導線區域的第一導線層以及第二導線層的局部放大示意圖。 第3A圖為根據第2C圖中的剖面指示線3-3繪示的第2C圖的實施例的局部剖面側視圖。 第3B圖為根據第2C圖中的剖面指示線3-3繪示的第2C圖的另一實施例的局部剖面側視圖。 Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying figures. It should be noted that in accordance with standard industry practice, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. Figure 1 is a partial schematic diagram of a display device according to some embodiments of the present disclosure. FIG. 2A is a partially enlarged schematic diagram of the lead area of the display device in FIG. 1 . FIG. 2B is a partially enlarged schematic diagram of the first conductor layer in the conductor area of the display device in FIG. 2A. FIG. 2C is a partially enlarged schematic diagram of the first conductor layer and the second conductor layer in the conductor area of the display device in FIG. 2A. FIG. 3A is a partial cross-sectional side view of the embodiment of FIG. 2C shown along the cross-section indicator line 3-3 in FIG. 2C. Figure 3B is a partial cross-sectional side view of another embodiment of Figure 2C shown along the section indicator line 3-3 in Figure 2C.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without
100:顯示裝置 100:Display device
110:基板 110:Substrate
120:顯示區域 120:Display area
130:導線區域 130: Wire area
140:配向膜 140:Alignment film
150:封框膠 150: Frame sealing glue
Claims (9)
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| TW111133746A TWI815644B (en) | 2022-09-06 | 2022-09-06 | Display device |
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| TW111133746A TWI815644B (en) | 2022-09-06 | 2022-09-06 | Display device |
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| TWI815644B true TWI815644B (en) | 2023-09-11 |
| TW202411749A TW202411749A (en) | 2024-03-16 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200819834A (en) * | 2006-07-18 | 2008-05-01 | Ips Alpha Technology Ltd | Liquid crystal display device |
| KR20180025048A (en) * | 2016-08-31 | 2018-03-08 | 엘지디스플레이 주식회사 | Thin film transistor array substrate and liquid crystal display device comprising the same |
| CN107884994A (en) * | 2017-11-29 | 2018-04-06 | 武汉天马微电子有限公司 | Array substrate, display panel and display device |
| US20180149892A1 (en) * | 2015-07-29 | 2018-05-31 | Sakai Display Products Corporation | Liquid crystal display apparatus |
| CN109407427A (en) * | 2018-11-05 | 2019-03-01 | 惠科股份有限公司 | Display panel and display device |
-
2022
- 2022-09-06 TW TW111133746A patent/TWI815644B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200819834A (en) * | 2006-07-18 | 2008-05-01 | Ips Alpha Technology Ltd | Liquid crystal display device |
| US20180149892A1 (en) * | 2015-07-29 | 2018-05-31 | Sakai Display Products Corporation | Liquid crystal display apparatus |
| KR20180025048A (en) * | 2016-08-31 | 2018-03-08 | 엘지디스플레이 주식회사 | Thin film transistor array substrate and liquid crystal display device comprising the same |
| CN107884994A (en) * | 2017-11-29 | 2018-04-06 | 武汉天马微电子有限公司 | Array substrate, display panel and display device |
| CN109407427A (en) * | 2018-11-05 | 2019-03-01 | 惠科股份有限公司 | Display panel and display device |
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