TWI813932B - Optoelectronic packages and keypads - Google Patents
Optoelectronic packages and keypads Download PDFInfo
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- TWI813932B TWI813932B TW110101866A TW110101866A TWI813932B TW I813932 B TWI813932 B TW I813932B TW 110101866 A TW110101866 A TW 110101866A TW 110101866 A TW110101866 A TW 110101866A TW I813932 B TWI813932 B TW I813932B
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/10—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/18—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices and the electric light source share a common body having dual-functionality of light emission and light detection
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Push-Button Switches (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
Abstract
本發明適用於鍵盤技術領域,尤其涉及一種光電封裝體和鍵盤,其中,光電封裝體包括光源模組、感應模組和驅動模組,感應模組根據觸控輸出觸發訊號至控制器,控制器根據觸發訊號確定包含感應模組的光電封裝體的物理位址並執行對應的操作,同時輸出光源驅動訊號至設定的光電封裝體的驅動模組,從而驅動對應的光源模組點亮,光電封裝體實現光源和按鍵的同步驅動,無需單獨設置驅動電路,簡化了線路結構和降低了設計成本。 The invention is applicable to the technical field of keyboards, and in particular relates to an optoelectronic package and a keyboard. The optoelectronic package includes a light source module, a sensing module and a driving module. The sensing module outputs a trigger signal to a controller according to touch control. The controller According to the trigger signal, the physical address of the optoelectronic package containing the sensing module is determined and the corresponding operation is performed. At the same time, the light source driving signal is output to the driving module of the set optoelectronic package, thereby driving the corresponding light source module to light up. The optoelectronic package The integrated circuit realizes synchronous driving of light sources and buttons without setting up separate driving circuits, simplifying the circuit structure and reducing design costs.
Description
本發明屬於鍵盤的技術領域,尤其涉及一種光電封裝體和鍵盤。 The invention belongs to the technical field of keyboards, and in particular relates to a photoelectric package and a keyboard.
現有鍵盤按鍵和RGB炫彩控制均是採用矩陣掃描方式控制,從驅動IC(Integrated circuit)引腳到按鍵底部光軸控制電路需要佈線,另驅動IC引腳到各個RGB LED(Light Emitting Diode)的控制線路需要佈線,複數個光電封裝體和複數個RGB驅動電路,線路佈局較多。 Existing keyboard keys and RGB color controls are controlled by matrix scanning. Wiring is required from the driver IC (Integrated circuit) pins to the optical axis control circuit at the bottom of the keys, and from the driver IC pins to each RGB LED (Light Emitting Diode). The control circuit requires wiring, multiple photoelectric packages and multiple RGB drive circuits, and there are many circuit layouts.
同時,鍵盤光電封裝體和RGB炫彩需要單獨控制,需要複數個驅動IC成本高。 At the same time, the keyboard optoelectronic package and RGB colors need to be controlled separately, which requires multiple driver ICs and is costly.
同時,現有鍵盤如果要達到防鬼的按鍵功能(防鬼指的是同時按下複數個按鍵時,防止被按下的鍵盤按鍵錯亂的輸出按鍵訊號),需要在電路中設計高阻抗的線路以辨識各個按鍵的差異值,或者在每條矩陣控制的線路上串接複數個電阻,實現防鬼功能,線路結構複雜。 At the same time, if existing keyboards want to achieve anti-ghosting key functions (anti-ghosting refers to preventing the pressed keyboard keys from outputting erroneous key signals when multiple keys are pressed at the same time), it is necessary to design high-impedance lines in the circuit to Identify the difference value of each button, or connect multiple resistors in series to each matrix control line to achieve anti-ghosting function, the circuit structure is complex.
因此,現有鍵盤存在成本高以及線路複雜的問題。 Therefore, existing keyboards have problems such as high cost and complicated wiring.
本發明的目的在於提供一種光電封裝體和鍵盤,旨在解決傳統的光電封裝體因鍵盤按鍵和RGB燈需要單獨控制導致線路複雜和成本高的問題。 The purpose of the present invention is to provide an optoelectronic package and a keyboard, aiming to solve the problems of complex circuits and high cost in traditional optoelectronic packages due to the need for separate control of keyboard keys and RGB lights.
本發明實施例的第一方面提了一種光電封裝體,所述光電封裝體用於與前一級的光電封裝體或者控制器電性連接以及與後一級的光電封裝體電性連接,所述光電封裝體包括集成設置的光源模組、感應模組和驅動模組; 所述驅動模組分別與所述光源模組和所述感應模組電性連接,所述感應模組用於感應觸控並通過訊號匯流排與所述控制器電性連接,所述驅動模組還用於與前一級的光電封裝體的驅動模組或者控制器電性連接以及與後一級的光電封裝體的驅動模組電性連接;所述驅動模組,用於:輸出控制訊號至所述感應模組;接收所述控制器輸出的光源驅動訊號,並根據所述光源驅動訊號驅動所電性連接的所述光源模組點亮;所述感應模組,用於:在感應到被觸控時輸出觸發訊號至所述控制器,以使所述控制器根據所述觸發訊號以及所述觸發訊號的傳輸時間確定包含所述感應模組的所述光電封裝體的物理位址以及執行對應的操作,以及使得所述控制器根據所述觸發訊號輸出所述光源驅動訊號至設定的光電封裝體的驅動模組。 A first aspect of the embodiment of the present invention provides an optoelectronic package. The optoelectronic package is used to electrically connect with the optoelectronic package or controller of the previous stage and to the optoelectronic package of the subsequent stage. The optoelectronic package The package includes an integrated light source module, sensing module and driving module; The driving module is electrically connected to the light source module and the sensing module respectively. The sensing module is used for sensing touch and is electrically connected to the controller through a signal bus. The driving module The group is also used to be electrically connected to the drive module or controller of the previous stage of the optoelectronic package and to be electrically connected to the drive module of the subsequent stage of the optoelectronic package; the drive module is used to: output the control signal to The induction module; receives the light source drive signal output by the controller, and drives the electrically connected light source module to light according to the light source drive signal; the induction module is used to: when sensing When being touched, a trigger signal is output to the controller, so that the controller determines the physical address of the optoelectronic package including the sensing module according to the trigger signal and the transmission time of the trigger signal. Perform corresponding operations, and cause the controller to output the light source driving signal to the driving module of the set optoelectronic package according to the trigger signal.
在一個實施例中,所述驅動模組的第一時鐘訊號端用於與前一級的光電封裝體的驅動模組的第二時鐘訊號端或者所述控制器的時鐘訊號端電性連接,所述驅動模組的第二時鐘訊號端用於與後一級的光電封裝體的驅動模組的第一時鐘訊號端電性連接,所述驅動模組的第一資料訊號端用於與前一級的光電封裝體的驅動模組的第二資料訊號端或者所述控制器的資料訊號端電性連接,所述驅動模組的第二資料訊號端用於與後一級的光電封裝體的驅動模組的第一資料訊號端電性連接。 In one embodiment, the first clock signal terminal of the driving module is used to be electrically connected to the second clock signal terminal of the driving module of the previous stage optoelectronic package or the clock signal terminal of the controller, so The second clock signal terminal of the driving module is used to be electrically connected to the first clock signal terminal of the driving module of the subsequent stage of the optoelectronic package, and the first data signal terminal of the driving module is used to be electrically connected to the previous stage of the driving module. The second data signal terminal of the driving module of the optoelectronic package or the data signal terminal of the controller is electrically connected. The second data signal terminal of the driving module is used to communicate with the driving module of the subsequent stage of the optoelectronic package. The first data signal terminal is electrically connected.
在一個實施例中,所述光電封裝體的電源端用於通過電源匯流排輸入供電電源,所述光電封裝體的接地端用於通過接地匯流排電性連接公共地。 In one embodiment, the power end of the optoelectronic package is used to input power supply through a power bus, and the ground end of the optoelectronic package is used to electrically connect to a common ground through a ground bus.
在一個實施例中,所述光源模組包括至少一個發光單元; 所述發光單元的陽極端與所述光電封裝體的電源端電性連接,所述發光單元的陰極端與所述驅動模組的訊號端電性連接。 In one embodiment, the light source module includes at least one light-emitting unit; The anode terminal of the light-emitting unit is electrically connected to the power terminal of the optoelectronic package, and the cathode terminal of the light-emitting unit is electrically connected to the signal terminal of the driving module.
在一個實施例中,所述光電封裝體的回饋訊號端用於通過所述訊號匯流排與所述控制器電性連接,所述感應模組包括光發射單元和光接收單元;所述光發射單元的陽極端與所述光電封裝體的電源端電性連接,所述光發射單元的陰極端與所述驅動模組的訊號端電性連接,所述光接收單元分別與所述光電封裝體的回饋訊號端、電源端和接地端電性連接;所述光發射單元,用於根據所述驅動模組輸出的所述控制訊號發出光線;所述光接收單元,用於在所述光電封裝體被觸控時接收反射的所述光線,並發出所述觸發訊號至所述控制器。 In one embodiment, the feedback signal end of the optoelectronic package is used to be electrically connected to the controller through the signal bus, and the sensing module includes a light emitting unit and a light receiving unit; the light emitting unit The anode end of the light emitting unit is electrically connected to the power end of the optoelectronic package, the cathode end of the light emitting unit is electrically connected to the signal end of the driving module, and the light receiving unit is respectively connected to the optoelectronic package. The feedback signal end, the power end and the ground end are electrically connected; the light emitting unit is used to emit light according to the control signal output by the driving module; the light receiving unit is used to generate light in the optoelectronic package When being touched, the reflected light is received and the trigger signal is sent to the controller.
在一個實施例中,所述光接收單元包括受光晶片和電阻,所述受光晶片的陽極端與所述光電封裝體的電源端電性連接,所述受光晶片的陰極端與所述電阻的第一端電性連接且連接節點與所述光電封裝體的回饋訊號端電性連接,所述電阻的第二端與所述光電封裝體的接地端電性連接。 In one embodiment, the light-receiving unit includes a light-receiving chip and a resistor. The anode end of the light-receiving chip is electrically connected to the power end of the optoelectronic package. The cathode end of the light-receiving chip is electrically connected to the third end of the resistor. One end is electrically connected and the connecting node is electrically connected to the feedback signal end of the optoelectronic package. The second end of the resistor is electrically connected to the ground end of the optoelectronic package.
在一個實施例中,所述光電封裝體的接地端延伸至所述光電封裝體的內部,所述驅動模組及所述電阻固定於所述接地端上,所述光電封裝體的電源端延伸至所述光電封裝體的內部,所述光源模組及所述受光晶片固定於所述電源端上。 In one embodiment, the ground end of the optoelectronic package extends to the inside of the optoelectronic package, the driving module and the resistor are fixed on the ground end, and the power end of the optoelectronic package extends Inside the optoelectronic package, the light source module and the light-receiving chip are fixed on the power end.
在一個實施例中,所述光電封裝體的回饋訊號端延伸至所述光電封裝體的內部,且延伸至所述光電封裝體內部的所述回饋訊號端位於所述電阻及所述受光晶片之間。 In one embodiment, the feedback signal end of the optoelectronic package extends to the inside of the optoelectronic package, and the feedback signal end extending to the inside of the optoelectronic package is located between the resistor and the light-receiving chip. between.
在一個實施例中,所述光發射單元和所述光接收單元並排設置,所述光接收單元和所述光發射單元之間設置有不透光隔板,所述光接收單元和所述光發射單元周邊還設置有用於隔離環境光的不透光圍板。 In one embodiment, the light-emitting unit and the light-receiving unit are arranged side by side, an opaque partition is provided between the light-receiving unit and the light-emitting unit, and the light-receiving unit and the light-receiving unit are arranged side by side. An opaque enclosure for isolating ambient light is also provided around the emission unit.
本發明實施例的第二方面提了一種鍵盤,鍵盤包括複數個按鍵鍵帽、控制器和複數個如上所述的光電封裝體;所述光電封裝體設置於所述按鍵鍵帽的下方,同一列的各所述光電封裝體依次級聯並與所述控制器電性連接。 A second aspect of the embodiment of the present invention provides a keyboard. The keyboard includes a plurality of key caps, a controller and a plurality of photoelectric packages as described above; the photoelectric package is disposed below the key caps, and the same Each of the optoelectronic packages in the column is cascaded in sequence and electrically connected to the controller.
本發明實施例通過採用光源模組、感應模組和驅動模組組成光電封裝體,感應模組根據觸控輸出觸發訊號至控制器,控制器根據觸發訊號確定包含感應模組的光電封裝體的物理位址並執行對應的操作,同時輸出光源驅動訊號至設定的光電封裝體的驅動模組,從而驅動對應的光源模組點亮,光電封裝體實現光源和按鍵的同步驅動,無需單獨設置驅動電路,簡化了線路結構和降低了設計成本。 In the embodiment of the present invention, a light source module, a sensing module and a driving module are used to form an optoelectronic package. The sensing module outputs a trigger signal to the controller based on the touch control. The controller determines the location of the optoelectronic package including the sensing module based on the trigger signal. Physical address and perform corresponding operations, and at the same time output the light source drive signal to the driver module of the set optoelectronic package, thereby driving the corresponding light source module to light up. The optoelectronic package realizes synchronous driving of the light source and the button, without the need to set a separate driver circuit, simplifying the circuit structure and reducing design costs.
100:控制器 100:Controller
200:第一光電封裝體 200:The first optoelectronic package
210:第一驅動模組 210: First drive module
220:第一光源模組 220: First light source module
230:第一感應模組 230: The first induction module
231:第一光發射單元 231: First light emitting unit
232:第一光接收單元 232: First light receiving unit
233:按鍵鍵帽 233:Key cap
234:第一不透光隔板 234: The first opaque partition
235:第一不透光圍板 235: The first opaque hoarding
300:第二光電封裝體 300: Second optoelectronic package
310:第二驅動模組 310: Second drive module
320:第二光源模組 320: Second light source module
330:第二感應模組 330: Second induction module
C:回饋訊號端 C: Feedback signal terminal
CLOCK,CLOCK-IN,CLOCK-OUT:時鐘訊號端 CLOCK, CLOCK-IN, CLOCK-OUT: clock signal terminal
DATA,DATA-IN,DATA-OUT:資料訊號端 DATA, DATA-IN, DATA-OUT: data signal terminal
F1:第一紅外光發射器 F1: The first infrared light emitter
GND:接地端 GND: ground terminal
J1:第一受光晶片 J1: The first light-receiving chip
P:備用訊號端 P: backup signal terminal
R1:第一電阻 R1: first resistor
VDD:電源端 VDD: power supply terminal
圖1為本發明實施例提供的光電封裝體的第一種結構示意圖;圖2為本發明實施例提供的光電封裝體的第二種結構示意圖;圖3為本發明實施例提供的光電封裝體的第三種結構示意圖;圖4為圖3所示的感應模組的結構示意圖;圖5為本發明實施例提供的光電封裝體的結構示意圖;以及圖6為本發明實施例提供的光電封裝體的封裝結構示意圖。 Figure 1 is a first structural schematic diagram of an optoelectronic package provided by an embodiment of the present invention; Figure 2 is a second structural schematic diagram of an optoelectronic package provided by an embodiment of the present invention; Figure 3 is a schematic diagram of the optoelectronic package provided by an embodiment of the present invention. The third structural schematic diagram; Figure 4 is a schematic structural diagram of the induction module shown in Figure 3; Figure 5 is a schematic structural diagram of the optoelectronic package provided by the embodiment of the present invention; and Figure 6 is the optoelectronic package provided by the embodiment of the present invention. Schematic diagram of the body’s packaging structure.
為了使本發明所要解決的技術問題、技術方案及有益效果更加清楚明白,以下結合附圖及實施例,對本發明進行進一步詳細說明。應當理解,此處所描述的具體實施例僅僅用以解釋本發明,並不用於限定本發明。 In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention and are not intended to limit the present invention.
需要說明的是,當元件被稱為“固定於”或“設置於”另一個元件,它可以直接在另一個元件上或者間接在該另一個元件上。當一個元件被稱為是“連接於”另一個元件,它可以是直接連接到另一個元件或間接連接至該另一個元件上。 It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
需要理解的是,術語“長度”、“寬度”、“上”、“下”、“前”、“後”、“左”、“右”、“垂直”、“水平”、“頂”、“底”“內”、“外”等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅是為了便於描述本發明和簡化描述,而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。 It should be understood that the terms "length", "width", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top", The orientations or positional relationships indicated by "bottom", "inside", "outside", etc. are based on the orientations or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply the device or device referred to. Elements must have a specific orientation, be constructed and operate in a specific orientation and therefore are not to be construed as limitations of the invention.
此外,術語“第一”、“第二”僅用於描述目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有“第一”、“第二”的特徵可以明示或者隱含地包括一個或者更複數個該特徵。在本發明的描述中,“複數個”的含義是兩個或兩個以上,除非另有明確具體的限定。 In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present invention, "plural" means two or more than two, unless otherwise expressly and specifically limited.
本發明實施例的第一方面提了一種光電封裝體。 A first aspect of embodiments of the present invention provides an optoelectronic package.
如圖1所示,圖1為本發明實施例提供的光電封裝體的第一種結構示意圖,本實施例中,光電封裝體用於與前一級的光電封裝體或者控制器100電性連接以及與後一級的光電封裝體電性連接,光電封裝體包括集成設置的光源模組、感應模組和驅動模組;驅動模組分別與光源模組和感應模組電性連接,感應模組用於感應觸控並通過訊號匯流排與控制器100電性連接,驅動模組還用於與前一級的光電封裝體的驅動模組或者控制器100電性連接以及與後一級的光電封裝體的驅動模組電性連接;驅動模組,用於:輸出控制訊號至感應模組; 接收控制器100輸出的光源驅動訊號,並根據光源驅動訊號驅動所電性連接的光源模組點亮;感應模組,用於:在感應到被觸控時輸出觸發訊號至控制器100,以使控制器100根據觸發訊號以及觸發訊號的傳輸時間確定包含感應模組的光電封裝體的物理位址以及執行對應的操作,以及使得控制器100根據觸發訊號輸出光源驅動訊號至設定的光電封裝體的驅動模組。 As shown in Figure 1, Figure 1 is a first structural schematic diagram of an optoelectronic package provided by an embodiment of the present invention. In this embodiment, the optoelectronic package is used to electrically connect with the previous stage optoelectronic package or the controller 100 and It is electrically connected to the next-level optoelectronic package. The optoelectronic package includes an integrated light source module, a sensing module and a driving module; the driving module is electrically connected to the light source module and the sensing module respectively. The sensing module is In order to sense touch and be electrically connected to the controller 100 through the signal bus, the drive module is also used to be electrically connected to the drive module or controller 100 of the previous-level optoelectronic package and to be electrically connected to the subsequent-level optoelectronic package. The drive module is electrically connected; the drive module is used to: output control signals to the induction module; Receive the light source driving signal output by the controller 100, and drive the electrically connected light source module to light according to the light source driving signal; the sensing module is used to: output a trigger signal to the controller 100 when it senses a touch, so as to The controller 100 is caused to determine the physical address of the optoelectronic package including the sensing module and perform corresponding operations according to the trigger signal and the transmission time of the trigger signal, and the controller 100 is caused to output the light source driving signal to the set optoelectronic package according to the trigger signal. driver module.
本實施例中,光電封裝體安裝在鍵盤內使用時,依次串接並連接控制器100,實現訊號的逐級傳遞,例如第一光電封裝體200分別連接控制器100和第二光電封裝體300,第二光電封裝體300還與第三光電封裝體連接等等,控制器100發出的光源驅動訊號通過光電封裝體依次傳遞至指定的至少一個光電封裝體,各光電封裝體內部均集成設置有驅動模組,感應模組和光源模組,驅動模組連接本級的感應模組和光源模組,同時,還用於連接前級的控制器100或者驅動模組以及連接後級的驅動模組,例如,第一光電封裝體200內的第一驅動模組210分別連接第一光源模組220和第一感應模組230,第二光電封裝體300內的第二驅動模組310分別連接第二光源模組320和第二感應模組330,第一驅動模組210分別連接前級的控制器100和後級的第二驅動模組310,各驅動模組為各自連接的感應模組提供控制訊號,以使對應的感應模組上電啟動,以第一光電封裝體200為例,第一驅動模組210為第一感應模組230提供控制訊號,第一感應模組230上電且被觸控時輸出觸發訊號至控制器100,控制器100通過偵測觸發訊號並結合器件之間傳輸的時間,判定被觸控的光電封裝體的物理位址,控制器100根據第一感應模組230的物理位址執行相應的操作,例如輸出對應的讀寫指令、返回指令、刪除指令等,並且,由於不同感應模組具有不同的觸發訊號和傳輸時間,因此,通過傳輸時間和接收的觸發訊號可判定哪個光電封裝體被 觸控,防止複數個感應模組同時觸控時出現誤判斷,達到防鬼的按鍵功能,並且無需設置額外的高阻抗線路或者串接電阻,簡化了鍵盤的線路結構。 In this embodiment, when the optoelectronic package is installed in the keyboard and used, it is connected in series and to the controller 100 to realize step-by-step transmission of signals. For example, the first optoelectronic package 200 is connected to the controller 100 and the second optoelectronic package 300 respectively. , the second optoelectronic package 300 is also connected to the third optoelectronic package, and so on. The light source driving signal sent by the controller 100 is sequentially transmitted to at least one designated optoelectronic package through the optoelectronic package. Each optoelectronic package is integrated with an internal The driver module, the induction module and the light source module. The driver module is connected to the induction module and light source module of this stage. At the same time, it is also used to connect the controller 100 or the driver module of the previous stage and the driver module of the subsequent stage. For example, the first driving module 210 in the first optoelectronic package 200 is connected to the first light source module 220 and the first sensing module 230 respectively, and the second driving module 310 in the second optoelectronic package 300 is connected to The second light source module 320 and the second sensing module 330, the first driving module 210 are respectively connected to the controller 100 of the previous stage and the second driving module 310 of the subsequent stage, and each driving module is a respective connected sensing module. Provide control signals to enable the corresponding sensing module to be powered on. Taking the first optoelectronic package 200 as an example, the first driving module 210 provides a control signal to the first sensing module 230. The first sensing module 230 is powered on. And when it is touched, a trigger signal is output to the controller 100. The controller 100 determines the physical address of the touched optoelectronic package by detecting the trigger signal and combining the transmission time between devices. The controller 100 determines the physical address of the touched optoelectronic package according to the first sensing The physical address of the module 230 performs corresponding operations, such as outputting corresponding read and write instructions, return instructions, deletion instructions, etc., and since different sensing modules have different trigger signals and transmission times, through the transmission time and reception The trigger signal can determine which optoelectronic package is Touch control prevents misjudgments when multiple sensing modules are touched at the same time, achieving an anti-ghost button function. There is no need to set up additional high-impedance lines or series resistors, simplifying the circuit structure of the keyboard.
同時,接收到觸發訊號的控制器100還輸出光源驅動訊號至設定的光電封裝體,設定的光電封裝體可為第一光電封裝體200、第二光電封裝體300等各光電封裝體中的任意一個或者複數個,具體根據點亮需求和規則對應設定,接收到光源驅動訊號的被設定的至少一個光電封裝體的驅動模組根據光源驅動訊號輸出對應大小的調光訊號至連接的光源模組,從而控制光源模組顯示對應顏色的光線,實現鍵盤對應位置炫彩效果,其他驅動模組、光源模組和感應模組相同工作原理,此處不再詳述,驅動模組同時連接驅動光源模組和感應模組並集成設置,無需分別設置驅動模組以單獨驅動光源模組和感應模組,簡化了鍵盤的線路結構,同時,降低了鍵盤的設計成本。 At the same time, the controller 100 that receives the trigger signal also outputs the light source driving signal to the set optoelectronic package. The set optoelectronic package can be any of the first optoelectronic package 200, the second optoelectronic package 300, and other optoelectronic packages. One or more, specifically set according to the lighting requirements and rules, the driving module of at least one optoelectronic package that receives the light source driving signal outputs a dimming signal of a corresponding size to the connected light source module according to the light source driving signal. , thereby controlling the light source module to display the corresponding color of light, achieving a colorful effect at the corresponding position of the keyboard. Other drive modules, light source modules and sensing modules work on the same principle and will not be described in detail here. The drive module is connected to the drive light source at the same time. The module and the sensor module are integrated and configured. There is no need to set up separate drive modules to drive the light source module and the sensor module separately. This simplifies the circuit structure of the keyboard and reduces the design cost of the keyboard.
驅動模組可由外部電源模組提供工作電源。 The drive module can provide operating power from an external power module.
感應模組可為光感應模組,例如紅外光感應模組,感應模組的結構可根據需求對應設置。 The sensing module can be a light sensing module, such as an infrared light sensing module, and the structure of the sensing module can be set according to requirements.
光源模組可包含紅光LED晶片、綠光LED晶片及藍光LED晶片,具體結構根據鍵盤顯色要求對應選擇。 The light source module can include red LED chips, green LED chips and blue LED chips. The specific structure is selected according to the color rendering requirements of the keyboard.
驅動模組可為驅動晶片,具體結構不限。 The driving module can be a driving chip, and the specific structure is not limited.
通過採用光源模組、感應模組和驅動模組組成光電封裝體,感應模組根據觸控輸出觸發訊號至控制器100,控制器100根據觸發訊號確定包含感應模組的光電封裝體的物理位址並執行對應的操作,同時輸出光源驅動訊號至設定的光電封裝體的驅動模組,從而驅動對應的光源模組點亮,光電封裝體實現光源和按鍵的同步驅動,無需單獨設置驅動電路,簡化了線路結構和降低了設計成本。 By using a light source module, a sensing module and a driving module to form an optoelectronic package, the sensing module outputs a trigger signal to the controller 100 based on touch, and the controller 100 determines the physical position of the optoelectronic package including the sensing module based on the trigger signal. Address and perform the corresponding operation, and at the same time output the light source drive signal to the driver module of the set optoelectronic package, thereby driving the corresponding light source module to light up. The optoelectronic package realizes synchronous driving of the light source and the button, without the need to set up a separate drive circuit. The circuit structure is simplified and the design cost is reduced.
如圖2所示,在一個實施例中,驅動模組的第一時鐘訊號端用於與前一級的光電封裝體的驅動模組的第二時鐘訊號端或者控制器100的時鐘訊號端電性連接,驅動模組的第二時鐘訊號端用於與後一級的光電封裝體的驅動模組的第一時鐘訊號端電性連接,驅動模組的第一資料訊號端用於與前一級的光電封裝體的驅動模組的第二資料訊號端或者控制器100的資料訊號端電性連接,驅動模組的第二資料訊號端用於與後一級的光電封裝體的驅動模組的第一資料訊號端電性連接。 As shown in FIG. 2 , in one embodiment, the first clock signal terminal of the driving module is used to electrically communicate with the second clock signal terminal of the driving module of the previous-stage optoelectronic package or the clock signal terminal of the controller 100 . connection, the second clock signal terminal of the driving module is used to be electrically connected to the first clock signal terminal of the driving module of the subsequent stage of the optoelectronic package, and the first data signal terminal of the driving module is used to be electrically connected to the previous stage of the optoelectronic package. The second data signal terminal of the driver module of the package is electrically connected to the data signal terminal of the controller 100. The second data signal terminal of the driver module is used to communicate with the first data terminal of the driver module of the subsequent stage of the optoelectronic package. The signal terminal is electrically connected.
本實施例中,各光電封裝體的驅動模組依次通過級聯雙線傳輸模式實現資料訊號和時鐘訊號的傳輸,電氣連接簡單,減少線路佈局空間。 In this embodiment, the driving modules of each optoelectronic package sequentially realize the transmission of data signals and clock signals through a cascaded two-wire transmission mode. The electrical connection is simple and the circuit layout space is reduced.
如圖3所示,在一個實施例中,光電封裝體的電源端用於通過電源匯流排輸入供電電源,光電封裝體的接地端用於通過接地匯流排電性連接公共地。 As shown in FIG. 3 , in one embodiment, the power terminal of the optoelectronic package is used to input power supply through the power bus, and the ground terminal of the optoelectronic package is used to electrically connect to the public ground through the ground bus.
本實施例中,各光電封裝體通過連接電源匯流排以獲取對應的工作電源,同時,通過連接接地匯流排而連接公共地,從而保證可靠工作。 In this embodiment, each optoelectronic package obtains the corresponding operating power by connecting to the power bus, and at the same time, is connected to the common ground by connecting to the ground bus, thereby ensuring reliable operation.
請繼續參閱圖3,在一個實施例中,光源模組包括至少一個發光單元;發光單元的陽極端與光電封裝體的電源端電性連接,發光單元的陰極端與驅動模組的訊號端電性連接。 Please continue to refer to Figure 3. In one embodiment, the light source module includes at least one light-emitting unit; the anode end of the light-emitting unit is electrically connected to the power end of the optoelectronic package, and the cathode end of the light-emitting unit is electrically connected to the signal end of the driving module. sexual connection.
本實施例中,發光單元連接驅動模組以及光電封裝體的電源端,發光單元根據驅動模組輸出的調光訊號顯示對應顏色的光線,在一個實施例中,發光單元包括R/G/B LED晶片,R/G/B LED晶片根據接收到的調光訊號進行混色顯色,進而實現按鍵炫彩的功能。 In this embodiment, the light-emitting unit is connected to the driving module and the power end of the optoelectronic package. The light-emitting unit displays light of the corresponding color according to the dimming signal output by the driving module. In one embodiment, the light-emitting unit includes R/G/B LED chip, R/G/B LED chip mixes and develops colors according to the received dimming signal, thereby realizing the colorful function of the buttons.
請繼續參閱圖3,在一個實施例中,光電封裝體的回饋訊號端C用於通過訊號匯流排與控制器100電性連接,感應模組包括光發射單元和光接收單元; 光發射單元的陽極端與光電封裝體的電源端VDD電性連接,光發射單元的陰極端與驅動模組的訊號端電性連接,光接收單元分別與光電封裝體的回饋訊號端C、電源端VDD和接地端GND電性連接;光發射單元用於根據驅動模組輸出的控制訊號發出光線;光接收單元用於在光電封裝體被觸控時接收反射的光發射單元發出的光線,並發出觸發訊號至控制器100。 Please continue to refer to Figure 3. In one embodiment, the feedback signal terminal C of the optoelectronic package is used to be electrically connected to the controller 100 through a signal bus. The sensing module includes a light emitting unit and a light receiving unit; The anode terminal of the light-emitting unit is electrically connected to the power terminal VDD of the optoelectronic package, the cathode terminal of the light-emitting unit is electrically connected to the signal terminal of the drive module, and the light-receiving unit is respectively connected to the feedback signal terminal C and the power supply terminal of the optoelectronic package. The terminal VDD and the ground terminal GND are electrically connected; the light emitting unit is used to emit light according to the control signal output by the driving module; the light receiving unit is used to receive the reflected light emitted by the light emitting unit when the optoelectronic package is touched, and Send a trigger signal to the controller 100.
本實施例中,光電封裝體的回饋訊號端C電性連接訊號匯流排和連接感應模組的訊號輸出端,即與光接收單元電性連接,並將光接收單元輸出的觸發訊號通過訊號匯流排回饋至控制器100,以第一光電封裝體200的第一感應模組230為例,第一感應模組230包括第一光發射單元231和第一光接收單元232,第一光發射單元231一端連接電源端VDD,第一光發射單元231另一端連接第一驅動模組210,第一驅動模組210輸出控制訊號至第一光發射單元231,控制第一光發射單元231對應點亮並發出光線,第一光接收單元232分別連接電源端VDD、接地端GND以及回饋訊號端C,如圖5所示,當第一感應模組230被觸控時,第一光發射單元231發出的光線通過按鍵鍵帽233或者其他機械結構反射至第一光接收單元232,促使第一光接收單元232發出觸發訊號至控制器100,控制器100根據觸發訊號以及傳輸時間確定發出觸發訊號的第一光電封裝體200的物理位址,並對應輸出光源驅動訊號至設定的光電封裝體的驅動模組,從而驅動對應的發光單元發出對應顏色的光線。 In this embodiment, the feedback signal terminal C of the optoelectronic package is electrically connected to the signal bus and the signal output terminal of the sensing module, that is, it is electrically connected to the light receiving unit, and the trigger signal output by the light receiving unit is passed through the signal bus. The exhaust is fed back to the controller 100. Taking the first sensing module 230 of the first optoelectronic package 200 as an example, the first sensing module 230 includes a first light emitting unit 231 and a first light receiving unit 232. The first light emitting unit One end of 231 is connected to the power supply terminal VDD, and the other end of the first light emitting unit 231 is connected to the first driving module 210. The first driving module 210 outputs a control signal to the first light emitting unit 231 to control the first light emitting unit 231 to light accordingly. And emit light, the first light receiving unit 232 is connected to the power terminal VDD, the ground terminal GND and the feedback signal terminal C respectively. As shown in Figure 5, when the first sensing module 230 is touched, the first light emitting unit 231 emits The light is reflected to the first light receiving unit 232 through the key cap 233 or other mechanical structure, causing the first light receiving unit 232 to send a trigger signal to the controller 100. The controller 100 determines the third light source that sends the trigger signal based on the trigger signal and the transmission time. A physical address of an optoelectronic package 200 corresponds to a driving module that outputs a light source driving signal to the set optoelectronic package, thereby driving the corresponding light-emitting unit to emit light of a corresponding color.
綜上,光電封裝體上設置有時鐘訊號端CLOCK、資料訊號端DATA、回饋訊號端C、電源端VDD和接地端GND,光電封裝體的時鐘訊號端CLOCK、資料訊號端DATA分別與臨近的控制器100和/或臨近的光電封裝體的時鐘訊號端CLOCK、資料訊號端DATA對應連接,並進行資料訊號和控制訊號的傳輸,光電封裝體的回饋訊號端C、電源端VDD 和接地端GND通過對應匯流排與控制器100的回饋訊號端C、電源端VDD和接地端GND對應連接。 In summary, the optoelectronic package is equipped with a clock signal terminal CLOCK, a data signal terminal DATA, a feedback signal terminal C, a power terminal VDD and a ground terminal GND. The clock signal terminal CLOCK and the data signal terminal DATA of the optoelectronic package are respectively connected with the adjacent control The clock signal terminal CLOCK and the data signal terminal DATA of the device 100 and/or the adjacent optoelectronic package are connected correspondingly, and the data signal and the control signal are transmitted. The feedback signal terminal C and the power terminal VDD of the optoelectronic package are connected accordingly. and the ground terminal GND are connected correspondingly to the feedback signal terminal C, the power terminal VDD and the ground terminal GND of the controller 100 through corresponding bus bars.
其他光電封裝體連接方式相同,此處不再詳述。 The connection methods of other optoelectronic packages are the same and will not be described in detail here.
通過集成設置,外部電源模組只需引出電源線、接地線,控制器100和/或前級光電封裝體只需引出訊號線並設置回饋線,依次與各光電封裝體連接,線路結構簡單,降低了設計成本以及減少了制程工序。 Through the integrated setting, the external power module only needs to lead out power lines and ground wires, and the controller 100 and/or the front-stage optoelectronic package only needs to lead out signal lines and set feedback lines, which are connected to each optoelectronic package in turn. The circuit structure is simple. The design cost is reduced and the manufacturing process is reduced.
本實施例中,每一光電封裝體可對應設置在一按鍵鍵帽下方,並對按鍵鍵帽的位置狀態進行監測,當按鍵鍵帽被按下時,光電封裝體內的光接收單元發出觸發訊號,促使設定的光電封裝體的驅動模組根據接收到的光源驅動訊號驅動光源模組發出對應顏色的光線,實現背光炫彩的目的。 In this embodiment, each optoelectronic package can be disposed under a key cap, and the position status of the key cap is monitored. When the key cap is pressed, the light receiving unit in the optoelectronic package emits a trigger signal. , prompting the driving module of the set optoelectronic package to drive the light source module to emit light of the corresponding color according to the received light source driving signal, so as to achieve the purpose of colorful backlight.
其中,按鍵鍵帽可與光電封裝體機械連接,或者無連接關係,具體結構根據需求對應設置。 Among them, the keycaps can be mechanically connected to the optoelectronic package, or have no connection relationship, and the specific structure is set according to the needs.
在一個實施例中,光接收單元包括受光晶片和電阻,受光晶片的陽極端與光電封裝體的電源端VDD電性連接,受光晶片的陰極端與電阻的第一端電性連接且連接節點與光電封裝體的回饋訊號端C電性連接,電阻的第二端與光電封裝體的接地端GND電性連接。 In one embodiment, the light-receiving unit includes a light-receiving chip and a resistor. The anode end of the light-receiving chip is electrically connected to the power terminal VDD of the optoelectronic package. The cathode end of the light-receiving chip is electrically connected to the first end of the resistor. The connection node is with The feedback signal terminal C of the optoelectronic package is electrically connected, and the second end of the resistor is electrically connected to the ground terminal GND of the optoelectronic package.
本實施例中,光發射單元包括紅外光發射器或者LED燈,光接收單元包括受光晶片和電阻,如圖3所示,在一個實施例中,以第一感應模組230為例,第一光發射單元231包括第一紅外光發射器F1,第一光接收單元232包括第一受光晶片J1和第一電阻R1,第一紅外光發射器F1在按鍵被按下時,其所發出的光線通過按鍵鍵帽233或者其他機械結構反射至第一受光晶片J1,第一受光晶片J1通過連接節點發出觸發訊號至控制器100,控制器100根據觸發訊號以及傳輸時間確定發出觸發訊號的光電封裝體的物理位址,並對應輸出光源驅動訊號至設定的光電封裝體內的驅動模組,從而驅動對應的發光單元發出對應顏色的光線。 In this embodiment, the light emitting unit includes an infrared light emitter or an LED lamp, and the light receiving unit includes a light receiving chip and a resistor. As shown in Figure 3, in one embodiment, taking the first sensing module 230 as an example, the first The light emitting unit 231 includes a first infrared light emitter F1. The first light receiving unit 232 includes a first light-receiving chip J1 and a first resistor R1. The first infrared light emitter F1 emits light when the button is pressed. The first light-receiving chip J1 is reflected by the key cap 233 or other mechanical structure. The first light-receiving chip J1 sends a trigger signal to the controller 100 through the connection node. The controller 100 determines the photoelectric package that sends the trigger signal based on the trigger signal and the transmission time. The physical address of the light source drive signal is correspondingly output to the drive module in the set optoelectronic package, thereby driving the corresponding light-emitting unit to emit light of the corresponding color.
如圖3和圖4所示,在一個實施例中,光電封裝體的接地端GND延伸至光電封裝體的內部,驅動模組及電阻固定於接地端GND上,光電封裝體的電源端VDD延伸至光電封裝體的內部並與延伸至光電封裝體內部的接地端GND相鄰,光源模組及受光晶片固定於電源端VDD上。光電封裝體的回饋訊號端C延伸至光電封裝體的內部並與延伸至光電封裝體內部的電源端VDD相鄰,延伸至光電封裝體內部的電源端VDD位於延伸至光電封裝體內部的接地端GND和回饋訊號端C之間,致使固定於電源端VDD上的光源模組可位於光電封裝體內部的中間位置,方便光源模組打線連接驅動模組並使四周出光均勻,且延伸至光電封裝體內部的回饋訊號端位於電阻及受光晶片之間,方便延伸至光電封裝體內部的回饋訊號端通過打線方式電性連接電阻及受光晶片。通過上述光電封裝體內部元件的位置配置,使光電封裝體的內部空間被充分利用,縮小了光電封裝體的體積。 As shown in Figures 3 and 4, in one embodiment, the ground terminal GND of the optoelectronic package extends to the inside of the optoelectronic package, the driving module and the resistor are fixed on the ground terminal GND, and the power terminal VDD of the optoelectronic package extends To the inside of the optoelectronic package and adjacent to the ground terminal GND extending to the inside of the optoelectronic package, the light source module and the light-receiving chip are fixed on the power supply terminal VDD. The feedback signal terminal C of the optoelectronic package extends to the inside of the optoelectronic package and is adjacent to the power terminal VDD extending to the inside of the optoelectronic package. The power terminal VDD extending to the inside of the optoelectronic package is located at the ground terminal extending to the inside of the optoelectronic package. Between GND and the feedback signal terminal C, the light source module fixed on the power supply terminal VDD can be located in the middle position inside the optoelectronic package. It is convenient for the light source module to be wired to connect to the driver module, and the light is emitted uniformly around it, and extends to the optoelectronic package. The feedback signal end inside the body is located between the resistor and the light-receiving chip, so that it can be extended to the feedback signal end inside the optoelectronic package to electrically connect the resistor and the light-receiving chip through wiring. Through the positional arrangement of the internal components of the optoelectronic package, the internal space of the optoelectronic package is fully utilized, and the volume of the optoelectronic package is reduced.
本實施例中,各光電封裝體包括時鐘訊號端CLOCK-IN/CLOCK-OUT、資料訊號端DATA-IN/DATA-OUT、回饋訊號端C、電源端VDD和接地端GND,以及還設置一備用訊號端P,時鐘訊號端CLOCK-IN用於輸入時鐘訊號,時鐘訊號端CLOCK-OUT用於輸出時鐘訊號,資料訊號端DATA-IN用於輸入資料訊號,資料訊號端DATA-OUT用於輸出資料訊號,回饋訊號端用於輸出觸發訊號。 In this embodiment, each optoelectronic package includes a clock signal terminal CLOCK-IN/CLOCK-OUT, a data signal terminal DATA-IN/DATA-OUT, a feedback signal terminal C, a power terminal VDD and a ground terminal GND, and is also provided with a backup Signal terminal P, clock signal terminal CLOCK-IN is used to input clock signals, clock signal terminal CLOCK-OUT is used to output clock signals, data signal terminal DATA-IN is used to input data signals, and data signal terminal DATA-OUT is used to output data signal, the feedback signal terminal is used to output the trigger signal.
以第一光電封裝體200為例,第一驅動模組210與第一電阻R1固定於接地端GND的延伸部上,第一驅動模組210通過打線分別連接時鐘訊號端CLOCK-IN/CLOCK-OUT、資料訊號端DATA-IN/DATA-OUT、電源端VDD、第一光發射單元231的第一紅外光發射器F1和光源模組220,光源模組220包括RGB三色燈,RGB三色燈固定於電源端的延伸部上,回饋訊號端C延伸至光電封裝體的內部,第一受光晶片J1固定於電源端VDD的延伸部上,且回饋訊號端C的延伸部位於第一受光晶片J1及第 一電阻R1之間,第一電阻R1與第一受光晶片J1通過打線與回饋訊號端C的延伸部電性連接。 Taking the first optoelectronic package 200 as an example, the first driving module 210 and the first resistor R1 are fixed on the extension of the ground terminal GND. The first driving module 210 is connected to the clock signal terminal CLOCK-IN/CLOCK- respectively through wires. OUT, data signal terminal DATA-IN/DATA-OUT, power terminal VDD, first infrared light emitter F1 of the first light emission unit 231 and light source module 220. The light source module 220 includes RGB three-color lamps, RGB three-color The lamp is fixed on the extension part of the power terminal, the feedback signal terminal C extends to the inside of the optoelectronic package, the first light-receiving chip J1 is fixed on the extension part of the power terminal VDD, and the extension part of the feedback signal terminal C is located on the first light-receiving chip J1 and grade Between a resistor R1, the first resistor R1 and the first light-receiving chip J1 are electrically connected to the extension of the feedback signal terminal C through wires.
如圖6所示,在一個實施例中,光發射單元和光接收單元並排設置,光接收單元和光發射單元之間設置有不透光隔板,光接收單元和光發射單元周邊還設置有用於隔離環境光的不透光圍板。 As shown in Figure 6, in one embodiment, the light-emitting unit and the light-receiving unit are arranged side by side, an opaque partition is provided between the light-receiving unit and the light-emitting unit, and there are also partitions around the light-receiving unit and the light-emitting unit for isolating the environment. Light opaque hoardings.
本實施例中,以第一光接收單元232和第一光發射單元231為例,第一光接收單元232和第一光發射單元231之間設置有第一不透光隔板234,第一光接收單元232和第一光發射單元231周圍設置有第一不透光圍板235,第一不透光隔板234和第一不透光圍板235對第一光接收單元232和第一光發射單元231進行擋牆設置,以避免第一光發射單元231發出的光線散射至第一光接收單元232以及外界環境光散射至第一光接收單元232,導致第一光接收單元232誤觸發。 In this embodiment, taking the first light receiving unit 232 and the first light emitting unit 231 as an example, a first opaque partition 234 is provided between the first light receiving unit 232 and the first light emitting unit 231. A first opaque enclosure 235 is provided around the light receiving unit 232 and the first light emitting unit 231. The first opaque partition 234 and the first opaque enclosure 235 protect the first light receiving unit 232 and the first opaque enclosure 235. The light emitting unit 231 is provided with a blocking wall to prevent the light emitted by the first light emitting unit 231 from scattering to the first light receiving unit 232 and the external ambient light from scattering to the first light receiving unit 232, resulting in false triggering of the first light receiving unit 232. .
其他光接收單元和光發射單元之間同樣設置有不透光隔板和不透光圍板,此處不再詳述。 Light-tight partitions and light-tight enclosures are also provided between other light-receiving units and light-emitting units, which will not be described in detail here.
本發明實施例的第二方面提了一種鍵盤,鍵盤包括複數個按鍵鍵帽、控制器100和複數個光電封裝體,光電封裝體的具體結構參照上述實施例,由於本鍵盤採用了上述所有實施例的全部技術方案,因此至少具有上述實施例的技術方案所帶來的所有有益效果,在此不再一一贅述。其中,光電封裝體設置於按鍵鍵帽的下方,同一列的各光電封裝體依次級聯並與控制器100電性連接。 The second aspect of the embodiment of the present invention provides a keyboard. The keyboard includes a plurality of key caps, a controller 100 and a plurality of photoelectric packages. The specific structure of the photoelectric package refers to the above embodiment. Since this keyboard adopts all the above implementations, All the technical solutions of the above embodiments have at least all the beneficial effects brought by the technical solutions of the above embodiments, and will not be repeated here. The optoelectronic packages are arranged under the key caps of the buttons, and the optoelectronic packages in the same column are cascaded in sequence and electrically connected to the controller 100 .
本實施例中,控制器100與複數個光電封裝體依次通過雙線傳輸模式實現訊號傳輸,電氣連接簡單,減少線路佈局空間。 In this embodiment, the controller 100 and the plurality of optoelectronic packages sequentially implement signal transmission through a two-wire transmission mode, which simplifies electrical connection and reduces circuit layout space.
進一步地,鍵盤還包括PCB板,控制器100和光電封裝體設置於PCB板上,控制器100、各光電封裝體通過PCB板上的綁線或者金屬線依次連接,從而實現訊號傳輸。 Further, the keyboard also includes a PCB board, on which the controller 100 and the optoelectronic package are disposed. The controller 100 and each optoelectronic package are connected in sequence through bonding wires or metal wires on the PCB board to achieve signal transmission.
以上所述實施例僅用以說明本發明的技術方案,而非對其限制;儘管參照前述實施例對本發明進行了詳細的說明,所屬技術領域中具有通常知識者應當理解:其依然可以對前述各實施例所記載的技術方案進行修改,或者對其中部分技術特徵進行等同替換;而這些修改或者替換,並不使相應技術方案的本質脫離本發明各實施例技術方案的精神和範圍,均應包含在本發明的保護範圍之內。 The above-described embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those with ordinary knowledge in the technical field should understand that they can still modify the foregoing. The technical solutions described in each embodiment may be modified, or some of the technical features thereof may be equivalently replaced; and these modifications or substitutions shall not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of each embodiment of the present invention. included within the protection scope of the present invention.
100:控制器 100:Controller
200:第一光電封裝體 200:The first optoelectronic package
210:第一驅動模組 210: First drive module
220:第一光源模組 220: First light source module
230:第一感應模組 230: The first induction module
300:第二光電封裝體 300: Second optoelectronic package
310:第二驅動模組 310: Second drive module
320:第二光源模組 320: Second light source module
330:第二感應模組 330: Second induction module
C:回饋訊號端 C: Feedback signal terminal
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| US8972214B2 (en) * | 2011-04-21 | 2015-03-03 | Microchip Technology Incorporated | Touch sense determined by characterizing impedance changes in a transmission line |
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