[go: up one dir, main page]

TWI813503B - Display apparatus - Google Patents

Display apparatus Download PDF

Info

Publication number
TWI813503B
TWI813503B TW111142968A TW111142968A TWI813503B TW I813503 B TWI813503 B TW I813503B TW 111142968 A TW111142968 A TW 111142968A TW 111142968 A TW111142968 A TW 111142968A TW I813503 B TWI813503 B TW I813503B
Authority
TW
Taiwan
Prior art keywords
oxidation conductive
island
layer
test pad
conductive layer
Prior art date
Application number
TW111142968A
Other languages
Chinese (zh)
Other versions
TW202420583A (en
Inventor
廖啟昇
簡伯儒
林彬成
廖達文
Original Assignee
友達光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to TW111142968A priority Critical patent/TWI813503B/en
Priority to CN202310059388.1A priority patent/CN115911080B/en
Application granted granted Critical
Publication of TWI813503B publication Critical patent/TWI813503B/en
Publication of TW202420583A publication Critical patent/TW202420583A/en

Links

Images

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Preparation Of Compounds By Using Micro-Organisms (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Compounds Of Unknown Constitution (AREA)

Abstract

A display apparatus includes a substrate, a pixel structure, a metal layer, a first anti-oxidation conductive layer and an insulating layer. The substrate has a display surfaces and a back surface opposite to each other. The pixel structure is disposed on the display surface of the substrate. The metal layer is disposed on the back surface of the substrate, and includes an island-shaped test pad, a first segment of a trace and a second segment of the trace. The first segment and the second segment of the trace are respectively located on both sides of the island-shaped test pad and are structurally separated with the island-shaped test pad. The first anti-oxidation conductive layer is disposed on the back surface and includes a first bridge pattern and a second bridge pattern. The first bridge pattern is connected between the first segment of the trace and the island-shaped test pad. The second bridge pattern is connected between the second segment of the trace and the island-shaped test pad. The insulating layer is disposed on the first anti-oxidation conductive layer and has an opening. The opening of the insulating layer overlaps the island-shaped test pad.

Description

顯示裝置display device

本發明是有關於一種光電裝置,且特別是有關於一種顯示裝置。The present invention relates to an optoelectronic device, and in particular to a display device.

發光二極體顯示面板包括背板及轉置於背板上的多個發光二極體元件。繼承發光二極體的特性,發光二極體顯示面板具有省電、高效率、高亮度及反應時間快等優點。此外,相較於有機發光二極體顯示面板,發光二極體顯示面板還具有色彩易調校、發光壽命長、無影像烙印等優勢。因此,發光二極體顯示面板被視為下一世代的顯示技術。The light-emitting diode display panel includes a backplane and a plurality of light-emitting diode elements transferred on the backplane. Inheriting the characteristics of light-emitting diodes, light-emitting diode display panels have the advantages of power saving, high efficiency, high brightness and fast response time. In addition, compared with organic light-emitting diode display panels, light-emitting diode display panels also have the advantages of easy color adjustment, long luminous life, and no image imprinting. Therefore, light-emitting diode display panels are regarded as the next generation of display technology.

一般而言,為實現超窄邊框甚至無邊框的發光二極體顯示面板,會將周邊線路(例如:扇出走線、測試墊等)製作於背板的背面上,然後,再以可剝膠層覆蓋及保護之。可剝膠層具有重疊於測試墊的開口,以方便測試機台的探針插入,進行電性測試。在電性測試時,測試墊容易被探針破壞,導致後續進行信賴性測試後發光二極體顯示面板於測試墊處出現腐蝕(corrosion)現象並沿著蔓延至扇出走線內部。Generally speaking, in order to realize an ultra-narrow bezel or even a bezel-less LED display panel, peripheral circuits (such as fan-out traces, test pads, etc.) are made on the back of the backplane, and then peelable glue is used. Cover and protect it. The peelable adhesive layer has an opening that overlaps the test pad to facilitate the insertion of the probe of the test machine for electrical testing. During electrical testing, the test pads are easily damaged by probes, causing corrosion of the LED display panel at the test pads and spreading to the inside of the fan-out traces after subsequent reliability testing.

本發明提供一種顯示裝置,品質佳、良率高。The present invention provides a display device with good quality and high yield.

本發明的顯示裝置包括基板、畫素結構、金屬層、第一抗氧化導電層及絕緣層。基板具有相對的顯示面及背面。畫素結構設置於基板的顯示面。金屬層設置於基板的背面,且包括島狀測試墊、走線的第一段及走線的第二段,其中走線的第一段及第二段分別位於島狀測試墊的兩側且與島狀測試墊於結構上分離。第一抗氧化導電層設置於背面,且包括第一橋接圖案及第二橋接圖案,其中第一橋接圖案連接於走線的第一段與島狀測試墊之間,且第二橋接圖案連接於走線的第二段與島狀測試墊之間。絕緣層設置於第一抗氧化導電層上,且具有一開口,其中絕緣層的開口重疊於島狀測試墊。The display device of the present invention includes a substrate, a pixel structure, a metal layer, a first anti-oxidation conductive layer and an insulating layer. The substrate has an opposite display surface and a back surface. The pixel structure is arranged on the display surface of the substrate. The metal layer is disposed on the back side of the substrate and includes an island-shaped test pad, a first section of the trace, and a second section of the trace. The first section and the second section of the trace are respectively located on both sides of the island-shaped test pad. Structurally separated from the island test pad. The first anti-oxidation conductive layer is disposed on the back and includes a first bridge pattern and a second bridge pattern, wherein the first bridge pattern is connected between the first section of the trace and the island test pad, and the second bridge pattern is connected between Between the second segment of the trace and the island test pad. The insulating layer is disposed on the first anti-oxidation conductive layer and has an opening, wherein the opening of the insulating layer overlaps the island-shaped test pad.

在本發明的一實施例中,上述的顯示裝置更包括可剝膠層,設置於絕緣層上,且具有一開口,其中可剝膠層的開口重疊於島狀測試墊。In an embodiment of the present invention, the above-mentioned display device further includes a peelable adhesive layer disposed on the insulating layer and having an opening, wherein the opening of the peelable adhesive layer overlaps the island-shaped test pad.

在本發明的一實施例中,上述的可剝膠層的開口更重疊於第一抗氧化導電層的第一橋接圖案及第二橋接圖案。In an embodiment of the present invention, the openings of the peelable adhesive layer further overlap the first bridge pattern and the second bridge pattern of the first anti-oxidation conductive layer.

在本發明的一實施例中,上述的金屬層位於第一抗氧化導電層與基板的背面之間。第一抗氧化導電層更包括抗氧化導電圖案,設置於金屬層的島狀測試墊上,其中可剝膠層的開口、絕緣層的開口與抗氧化導電圖案重疊。In an embodiment of the present invention, the above-mentioned metal layer is located between the first anti-oxidation conductive layer and the back surface of the substrate. The first anti-oxidation conductive layer further includes an anti-oxidation conductive pattern, which is disposed on the island-shaped test pad of the metal layer, wherein the openings of the peelable adhesive layer, the openings of the insulating layer overlap with the anti-oxidation conductive pattern.

在本發明的一實施例中,上述的第一橋接圖案及第二橋接圖案分別設置於抗氧化導電圖案的兩側且與抗氧化導電圖案於結構上分離。In an embodiment of the present invention, the above-mentioned first bridge pattern and the second bridge pattern are respectively disposed on both sides of the anti-oxidation conductive pattern and are structurally separated from the anti-oxidation conductive pattern.

在本發明的一實施例中,上述的金屬層位於第一抗氧化導電層與基板的背面之間。顯示裝置更包括第二抗氧化導電層,設置於金屬層與基板的背面之間,其中金屬層的走線的第一段與金屬層的島狀測試墊具有第一間隙,金屬層的走線的第二段與金屬層的島狀測試墊具有第二間隙,第二抗氧化導電層具有分別重疊於第一間隙及第二間隙的第一區及第二區,第一抗氧化導電層的第一橋接圖案及第二橋接圖案分別設置於第一間隙及第二間隙且分別電性連接至第二抗氧化導電層的第一區及第二區。In an embodiment of the present invention, the above-mentioned metal layer is located between the first anti-oxidation conductive layer and the back surface of the substrate. The display device further includes a second anti-oxidation conductive layer disposed between the metal layer and the back side of the substrate, wherein the first section of the trace of the metal layer has a first gap with the island-shaped test pad of the metal layer, and the trace of the metal layer The second section and the island-shaped test pad of the metal layer have a second gap, the second anti-oxidation conductive layer has a first area and a second area respectively overlapping the first gap and the second gap, the first anti-oxidation conductive layer The first bridge pattern and the second bridge pattern are respectively disposed in the first gap and the second gap and are electrically connected to the first region and the second region of the second anti-oxidation conductive layer respectively.

在本發明的一實施例中,上述的第二抗氧化導電層更具有第三區,重疊於金屬層的島狀測試墊;第三區的兩端分別與第一區及第二區連接。In one embodiment of the present invention, the above-mentioned second anti-oxidation conductive layer further has a third region, which overlaps the island-shaped test pad of the metal layer; both ends of the third region are connected to the first region and the second region respectively.

在本發明的一實施例中,上述的第一抗氧化導電層位於金屬層與基板的背面之間。In an embodiment of the present invention, the above-mentioned first anti-oxidation conductive layer is located between the metal layer and the back surface of the substrate.

在本發明的一實施例中,上述的第一抗氧化導電層更包括抗氧化導電圖案,其中金屬層的島狀測試墊設置於第一抗氧化導電層的抗氧化導電圖案上,且抗氧化導電圖案的兩端分別與第一橋接圖案及第二橋接圖案連接。In one embodiment of the present invention, the above-mentioned first anti-oxidation conductive layer further includes an anti-oxidation conductive pattern, wherein the island-shaped test pads of the metal layer are disposed on the anti-oxidation conductive pattern of the first anti-oxidation conductive layer, and the anti-oxidation conductive pattern Both ends of the conductive pattern are connected to the first bridge pattern and the second bridge pattern respectively.

現將詳細地參考本發明的示範性實施例,示範性實施例的實例說明於附圖中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or similar parts.

應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件“上”或“連接到”另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為“直接在另一元件上”或“直接連接到”另一元件時,不存在中間元件。如本文所使用的,“連接”可以指物理及/或電性連接。再者,“電性連接”或“耦合”可以是二元件間存在其它元件。It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrical connection" or "coupling" may mean the presence of other components between two components.

本文使用的“約”、“近似”、或“實質上”包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,“約”可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的“約”、“近似”或“實質上”可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about," "approximately," or "substantially" includes the stated value and the average within an acceptable range of deviations from the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the A specific amount of error associated with a measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the terms "about", "approximately" or "substantially" used herein may be used to select a more acceptable deviation range or standard deviation based on optical properties, etching properties or other properties, and one standard deviation may not apply to all properties. .

除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed to have meanings consistent with their meanings in the context of the relevant technology and the present invention, and are not to be construed as idealistic or excessive Formal meaning, unless expressly defined as such herein.

圖1為本發明第一實施例之顯示裝置的仰視示意圖。圖2為本發明第一實施例之顯示裝置的剖面示意圖。圖2對應圖1的剖線A-A’。方向Z從基板110的背面114指向顯示面112。圖1示出沿著平行於方向Z的一方向所看到的顯示裝置10。FIG. 1 is a schematic bottom view of the display device according to the first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the display device according to the first embodiment of the present invention. Figure 2 corresponds to the cross-section line A-A’ of Figure 1. The direction Z points from the back surface 114 of the substrate 110 to the display surface 112 . FIG. 1 shows the display device 10 as viewed along a direction parallel to the direction Z. As shown in FIG.

請參照圖1及圖2,顯示裝置10包括基板110,具有相對的顯示面112及背面114。在本實施例中,基板110的材質可為玻璃、石英、有機聚合物、或是不透光/反射材料(例如:晶圓、陶瓷、或其它可適用的材料)、或是其它可適用的材料。Referring to FIGS. 1 and 2 , the display device 10 includes a substrate 110 with an opposite display surface 112 and a back surface 114 . In this embodiment, the material of the substrate 110 may be glass, quartz, organic polymer, or opaque/reflective material (such as wafer, ceramic, or other applicable materials), or other applicable materials. Material.

顯示裝置10還包括畫素結構120,設置於基板110的顯示面112。舉例而言,在本實施例中,畫素結構120可包括畫素驅動電路(未繪示)、電性連接於畫素驅動電路的接墊(未繪示)以及與接墊接合的發光二極體元件(未繪示),但本發明不以此為限。The display device 10 further includes a pixel structure 120 disposed on the display surface 112 of the substrate 110 . For example, in this embodiment, the pixel structure 120 may include a pixel driving circuit (not shown), a pad (not shown) electrically connected to the pixel driving circuit, and a light-emitting diode connected to the pad. Polar body element (not shown), but the invention is not limited thereto.

顯示裝置10還包括金屬層140。金屬層140設置於基板110的背面114。在本實施例中,顯示裝置10還可選擇性地包括屏障保護層130,其中屏障保護層130設置於基板110的背面114上,而金屬層140設置於屏障保護層130上,但本發明不以此為限。在本實施例中,屏障保護層130的材料可為無機材料(例如:氧化矽、氮化矽、氮氧化矽、或上述至少二種材料的堆疊層)、有機材料或上述的組合。Display device 10 also includes metal layer 140 . The metal layer 140 is disposed on the back surface 114 of the substrate 110 . In this embodiment, the display device 10 may also optionally include a barrier protection layer 130, where the barrier protection layer 130 is disposed on the backside 114 of the substrate 110, and the metal layer 140 is disposed on the barrier protection layer 130. However, the present invention does not This is the limit. In this embodiment, the material of the barrier protective layer 130 may be an inorganic material (for example, silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of the above materials), an organic material, or a combination thereof.

金屬層140包括島狀測試墊142、走線L的第一段144及走線L的第二段146。走線L的第一段144及第二段146分別位於島狀測試墊142的兩側且與島狀測試墊142於結構上分離。走線L的第一段144與島狀測試墊142具有第一間隙g1。走線L的第二段146與金屬層140的島狀測試墊142具有第二間隙g2。在本實施例中,金屬層140還可選擇性包括測試墊148,其中走線L之第二段146的一端146a與島狀測試墊142具有第二間隙g2,而走線L之第二段146的另一端146b連接至測試墊148。The metal layer 140 includes an island-shaped test pad 142, a first section 144 of the trace L, and a second section 146 of the trace L. The first section 144 and the second section 146 of the trace L are respectively located on both sides of the island-shaped test pad 142 and are structurally separated from the island-shaped test pad 142 . The first section 144 of the trace L and the island test pad 142 have a first gap g1. The second section 146 of the trace L and the island-shaped test pad 142 of the metal layer 140 have a second gap g2. In this embodiment, the metal layer 140 may also optionally include a test pad 148, in which one end 146a of the second section 146 of the trace L has a second gap g2 with the island-shaped test pad 142, and the second section 146 of the trace L has a second gap g2. The other end 146b of 146 is connected to test pad 148.

設置於基板110之背面114的走線L電性連接至設置於基板110之顯示面112的畫素結構120。在本實施例中,設置於基板110之背面114的走線L可透過設置於基板110之側壁(未繪示)的側邊導線(未繪示)或貫穿基板110的導電物(未繪示)電性連接至設置於基板110之顯示面112的畫素結構120,但本發明不以此為限。在本實施例中,金屬層140的材料可為鋁、銅或其它金屬,但本發明不以此為限。The trace L provided on the back surface 114 of the substrate 110 is electrically connected to the pixel structure 120 provided on the display surface 112 of the substrate 110 . In this embodiment, the traces L provided on the back surface 114 of the substrate 110 can pass through side wires (not shown) provided on the side walls (not shown) of the substrate 110 or conductive objects (not shown) penetrating the substrate 110 ) is electrically connected to the pixel structure 120 provided on the display surface 112 of the substrate 110, but the invention is not limited thereto. In this embodiment, the material of the metal layer 140 may be aluminum, copper or other metals, but the invention is not limited thereto.

顯示裝置10還包括第一抗氧化導電層150,設置於基板110的背面114。在本實施例中,第一抗氧化導電層150可選擇性地設置於金屬層140上,其中金屬層140位於第一抗氧化導電層150與基板110的背面114之間,但本發明不以此為限。The display device 10 further includes a first anti-oxidation conductive layer 150 disposed on the back surface 114 of the substrate 110 . In this embodiment, the first anti-oxidation conductive layer 150 can be selectively disposed on the metal layer 140, where the metal layer 140 is located between the first anti-oxidation conductive layer 150 and the back surface 114 of the substrate 110. However, the present invention does not use This is the limit.

第一抗氧化導電層150包括第一橋接圖案154及第二橋接圖案156。第一橋接圖案154連接於走線L的第一段144與島狀測試墊142之間,以電性連接走線L的第一段144與島狀測試墊142。第二橋接圖案156連接於走線L的第二段146與島狀測試墊142之間,以電性連接走線L的第二段146與島狀測試墊142。相較於金屬層140,第一抗氧化導電層150較不易起氧化反應。舉例而言,在本實施例中,第一抗氧化導電層150的材質可為金屬氧化物,例如但不限於:銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物、銦鍺鋅氧化物、其它合適的氧化物、或者是上述至少二者的堆疊層。The first anti-oxidation conductive layer 150 includes first bridge patterns 154 and second bridge patterns 156 . The first bridge pattern 154 is connected between the first section 144 of the trace L and the island test pad 142 to electrically connect the first section 144 of the trace L and the island test pad 142 . The second bridge pattern 156 is connected between the second section 146 of the trace L and the island test pad 142 to electrically connect the second section 146 of the trace L and the island test pad 142 . Compared with the metal layer 140 , the first anti-oxidation conductive layer 150 is less susceptible to oxidation reactions. For example, in this embodiment, the material of the first anti-oxidation conductive layer 150 can be metal oxide, such as but not limited to: indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, Indium germanium zinc oxide, other suitable oxides, or a stack of at least two of the above.

在本實施例中,第一抗氧化導電層150還可選擇性地包括抗氧化導電圖案152,設置於金屬層140的島狀測試墊142上。第一橋接圖案154及第二橋接圖案156分別設置於抗氧化導電圖案152的兩側。在本實施例中,抗氧化導電圖案152可選擇性地與第一橋接圖案154及第二橋接圖案156於結構上分離,但本發明不以此為限。In this embodiment, the first anti-oxidation conductive layer 150 may also optionally include an anti-oxidation conductive pattern 152 disposed on the island-shaped test pad 142 of the metal layer 140 . The first bridge pattern 154 and the second bridge pattern 156 are respectively disposed on both sides of the anti-oxidation conductive pattern 152 . In this embodiment, the anti-oxidation conductive pattern 152 can be selectively structurally separated from the first bridge pattern 154 and the second bridge pattern 156, but the invention is not limited thereto.

在本實施例中,第一抗氧化導電層150還可選擇性地包括另一抗氧化導電圖案158,設置於金屬層140的測試墊148上,其中第二橋接圖案156位於抗氧化導電圖案152與另一抗氧化導電圖案158之間。在本實施例中,第二橋接圖案156與抗氧化導電圖案152及另一抗氧化導電圖案158可選擇性地於結構上分離,但本發明不以此為限。In this embodiment, the first anti-oxidation conductive layer 150 may also optionally include another anti-oxidation conductive pattern 158 disposed on the test pad 148 of the metal layer 140 , wherein the second bridge pattern 156 is located on the anti-oxidation conductive pattern 152 and another anti-oxidation conductive pattern 158 . In this embodiment, the second bridge pattern 156 and the anti-oxidation conductive pattern 152 and the other anti-oxidation conductive pattern 158 can be selectively separated structurally, but the invention is not limited thereto.

顯示裝置10還包括絕緣層160,設置於第一抗氧化導電層150上,且具有一開口160a,其中絕緣層160的開口160a重疊於島狀測試墊142。在本實施例中,絕緣層160的開口160a更重疊於抗氧化導電圖案152。抗氧化導電圖案152覆蓋島狀測試墊142之與開口160a重疊的區域。在本實施例中,絕緣層160的開口160a可暴露抗氧化導電圖案152,但本發明不以此為限。The display device 10 further includes an insulating layer 160 disposed on the first anti-oxidation conductive layer 150 and having an opening 160 a , wherein the opening 160 a of the insulating layer 160 overlaps the island-shaped test pad 142 . In this embodiment, the opening 160a of the insulating layer 160 further overlaps the anti-oxidation conductive pattern 152. The anti-oxidation conductive pattern 152 covers the area of the island test pad 142 that overlaps the opening 160a. In this embodiment, the opening 160a of the insulating layer 160 can expose the anti-oxidation conductive pattern 152, but the invention is not limited thereto.

在本實施例中,絕緣層160還可具有另一開口160b,其中絕緣層160的開口160a重疊於測試墊148。在本實施例中,絕緣層160的另一開口160b更重疊於另一抗氧化導電圖案158。另一抗氧化導電圖案158覆蓋測試墊148之與另一開口160b重疊的區域。在本實施例中,絕緣層160的材料可為無機材料(例如:氧化矽、氮化矽、氮氧化矽、或上述至少二種材料的堆疊層)、有機材料或上述的組合。在本實施例中,絕緣層160可包括多個絕緣子層,但本發明不以此為限。In this embodiment, the insulating layer 160 may also have another opening 160b, wherein the opening 160a of the insulating layer 160 overlaps the test pad 148. In this embodiment, another opening 160b of the insulating layer 160 further overlaps another anti-oxidation conductive pattern 158. Another anti-oxidation conductive pattern 158 covers the area of the test pad 148 that overlaps the other opening 160b. In this embodiment, the material of the insulating layer 160 may be an inorganic material (for example, silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of the above materials), an organic material, or a combination thereof. In this embodiment, the insulating layer 160 may include multiple insulating sub-layers, but the invention is not limited thereto.

在本實施例中,顯示裝置10還包括可剝膠層170,設置於絕緣層160上,且具有一開口170a,其中可剝膠層170的開口170a重疊於島狀測試墊142。在本實施例中,可剝膠層170的開口170a、絕緣層160的開口160a與抗氧化導電圖案152重疊。在本實施例中,可剝膠層170的開口170a更重疊於第一抗氧化導電層150的第一橋接圖案154及第二橋接圖案156,而絕緣層160的開口160a位於第一橋接圖案154與第二橋接圖案156之間。在本實施例中,絕緣層160的開口160a位於可剝膠層170的開口170a內,且與可剝膠層170的開口170a相通。在本實施例中,可剝膠層170可填入絕緣層160的另一開口160b。在本實施例中,填入絕緣層160之另一開口160b的可剝膠層170可與另一抗氧化導電圖案158接觸,但本發明不以此為限。In this embodiment, the display device 10 further includes a peelable adhesive layer 170 , which is disposed on the insulating layer 160 and has an opening 170 a , where the opening 170 a of the peelable adhesive layer 170 overlaps the island-shaped test pad 142 . In this embodiment, the opening 170a of the peelable adhesive layer 170, the opening 160a of the insulating layer 160 overlap with the anti-oxidation conductive pattern 152. In this embodiment, the opening 170a of the peelable adhesive layer 170 further overlaps the first bridge pattern 154 and the second bridge pattern 156 of the first anti-oxidation conductive layer 150, and the opening 160a of the insulating layer 160 is located on the first bridge pattern 154 and the second bridge pattern 156 . In this embodiment, the opening 160a of the insulating layer 160 is located within the opening 170a of the peelable adhesive layer 170 and communicates with the opening 170a of the peelable adhesive layer 170. In this embodiment, the peelable adhesive layer 170 can be filled into the other opening 160b of the insulating layer 160 . In this embodiment, the peelable adhesive layer 170 filled in the other opening 160b of the insulating layer 160 can be in contact with another anti-oxidation conductive pattern 158, but the invention is not limited thereto.

值得注意的是,第一抗氧化導電層150的第一橋接圖案154和第二橋接圖案156除了用以橋接島狀測試墊142與走線L的第一段144及第二段146,第一抗氧化導電層150的第一橋接圖案154和第二橋接圖案156還用以分隔金屬層140的島狀測試墊142與金屬層140的走線L。如此一來,即便,水氣從未被可剝膠層170覆蓋的島狀測試墊142進入金屬層140,但第一抗氧化導電層150的第一橋接圖案154和第二橋接圖案156可阻斷水氣進入被可剝膠層170覆蓋的走線L內部。即使,金屬層140的島狀測試墊142因氧化而發生腐蝕現象,但所述腐蝕現象不易穿過第一抗氧化導電層150的第一橋接圖案154和第二橋接圖案156而蔓延至金屬曾40的走線L內部。藉此,顯示裝置10的品質及良率可提升。It is worth noting that, in addition to the first bridge pattern 154 and the second bridge pattern 156 of the first anti-oxidation conductive layer 150, which are used to bridge the island test pad 142 and the first section 144 and the second section 146 of the trace L, the first The first bridge pattern 154 and the second bridge pattern 156 of the anti-oxidation conductive layer 150 are also used to separate the island-shaped test pads 142 of the metal layer 140 and the traces L of the metal layer 140 . In this way, even if water vapor enters the metal layer 140 from the island-shaped test pad 142 that is not covered by the peelable adhesive layer 170, the first bridge pattern 154 and the second bridge pattern 156 of the first anti-oxidation conductive layer 150 can prevent water vapor from entering the metal layer 140. The water vapor is prevented from entering the interior of the trace L covered by the peelable adhesive layer 170 . Even if the island-shaped test pad 142 of the metal layer 140 is corroded due to oxidation, the corrosion phenomenon will not easily pass through the first bridge pattern 154 and the second bridge pattern 156 of the first anti-oxidation conductive layer 150 and spread to the metal. 40 trace L internal. Thereby, the quality and yield of the display device 10 can be improved.

在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重述。It must be noted here that the following embodiments follow the component numbers and part of the content of the previous embodiments, where the same numbers are used to represent the same or similar elements, and descriptions of the same technical content are omitted. For descriptions of omitted parts, reference may be made to the foregoing embodiments and will not be repeated in the following embodiments.

圖3為本發明第二實施例之顯示裝置的剖面示意圖。圖3的顯示裝置10A與前述的顯示裝置10類似,兩者的差異在於:圖3的顯示裝置10A更包括第二抗氧化導電層180。FIG. 3 is a schematic cross-sectional view of a display device according to a second embodiment of the present invention. The display device 10A of FIG. 3 is similar to the aforementioned display device 10 . The difference between the two is that the display device 10A of FIG. 3 further includes a second anti-oxidation conductive layer 180 .

請參照圖3,第二抗氧化導電層180設置於金屬層140與基板110的背面114之間。詳細而言,在本實施例中,第二抗氧化導電層180可設置於屏障保護層130上,但本發明不以此為限。金屬層140的走線L的第一段144與金屬層140的島狀測試墊142具有第一間隙g1。金屬層140的走線L的第二段146與金屬層140的島狀測試墊142具有第二間隙g2。第二抗氧化導電層180具有分別重疊於第一間隙g1及第二間隙g2的第一區184及第二區186。第一抗氧化導電層150的第一橋接圖案154及第二橋接圖案156分別設置於第一間隙g1及第二間隙g2且分別電性連接至第二抗氧化導電層180的第一區184及第二區186。Referring to FIG. 3 , the second anti-oxidation conductive layer 180 is disposed between the metal layer 140 and the back surface 114 of the substrate 110 . Specifically, in this embodiment, the second anti-oxidation conductive layer 180 can be disposed on the barrier protective layer 130, but the invention is not limited thereto. The first section 144 of the trace L of the metal layer 140 and the island-shaped test pad 142 of the metal layer 140 have a first gap g1. The second section 146 of the trace L of the metal layer 140 and the island-shaped test pad 142 of the metal layer 140 have a second gap g2. The second anti-oxidation conductive layer 180 has a first region 184 and a second region 186 respectively overlapping the first gap g1 and the second gap g2. The first bridge pattern 154 and the second bridge pattern 156 of the first anti-oxidation conductive layer 150 are respectively disposed in the first gap g1 and the second gap g2 and are electrically connected to the first region 184 and the second region 184 of the second anti-oxidation conductive layer 180 respectively. District 2 186.

在本實施例中,第二抗氧化導電層180還可具有第三區182,重疊於金屬層140的島狀測試墊142;第三區182的兩端分別與第一區184及第二區186連接。相較於金屬層140,第二抗氧化導電層180較不易起氧化反應。舉例而言,在本實施例中,第二抗氧化導電層180的材質可為金屬氧化物,例如但不限於:銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物、銦鍺鋅氧化物、其它合適的氧化物、或者是上述至少二者的堆疊層。In this embodiment, the second anti-oxidation conductive layer 180 may also have a third region 182 that overlaps the island-shaped test pad 142 of the metal layer 140; both ends of the third region 182 are connected to the first region 184 and the second region respectively. 186 connections. Compared with the metal layer 140, the second anti-oxidation conductive layer 180 is less susceptible to oxidation reactions. For example, in this embodiment, the material of the second anti-oxidation conductive layer 180 can be metal oxide, such as but not limited to: indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, Indium germanium zinc oxide, other suitable oxides, or a stack of at least two of the above.

值得一提的是,在本實施例中,使用雙層的第一抗氧化導電層150及第二抗氧化導電層180橋接島狀測試墊142與走線L的第一段144及第二段146可降低阻值,進而提升顯示裝置10A的性能。It is worth mentioning that in this embodiment, a double-layered first anti-oxidation conductive layer 150 and a second anti-oxidation conductive layer 180 are used to bridge the island test pad 142 and the first section 144 and the second section of the trace L 146 can reduce the resistance, thereby improving the performance of the display device 10A.

圖4為本發明第三實施例之顯示裝置的剖面示意圖。圖4的顯示裝置10B與前述的顯示裝置10類似,兩者的差異在於:圖4之顯示裝置10B的第一抗氧化導電層150B的位置與前述之顯示裝置10的第一抗氧化導電層150的位置不同。FIG. 4 is a schematic cross-sectional view of a display device according to a third embodiment of the present invention. The display device 10B of FIG. 4 is similar to the aforementioned display device 10. The difference between the two lies in the position of the first anti-oxidation conductive layer 150B of the display device 10B of FIG. 4 and the first anti-oxidation conductive layer 150 of the aforementioned display device 10. The location is different.

請參照圖4,具體而言,在本實施例中,第一抗氧化導電層150B位於金屬層140與基板110的背面114之間。在本實施例中,金屬層140的島狀測試墊142設置於第一抗氧化導電層150B的抗氧化導電圖案152B上,且抗氧化導電圖案152B的兩端分別與第一橋接圖案154B及第二橋接圖案156B連接。在本實施例中,是先形成第一抗氧化導電層150B,再形成金屬層140,其中金屬層140的島狀測試墊142與走線L的第一段144及第二段146是利用先形成的第一抗氧化導電層150B電性連接。Please refer to FIG. 4 . Specifically, in this embodiment, the first anti-oxidation conductive layer 150B is located between the metal layer 140 and the back surface 114 of the substrate 110 . In this embodiment, the island-shaped test pads 142 of the metal layer 140 are disposed on the anti-oxidation conductive pattern 152B of the first anti-oxidation conductive layer 150B, and the two ends of the anti-oxidation conductive pattern 152B are respectively connected to the first bridge pattern 154B and the second bridge pattern 154B. Two bridge patterns 156B are connected. In this embodiment, the first anti-oxidation conductive layer 150B is formed first, and then the metal layer 140 is formed. The island-shaped test pad 142 of the metal layer 140 and the first section 144 and the second section 146 of the trace L are formed using the first The formed first anti-oxidation conductive layer 150B is electrically connected.

10、10A、10B:顯示裝置 110:基板 112:顯示面 114:背面 120:畫素結構 130:屏障保護層 140:金屬層 142:島狀測試墊 144:第一段 146:第二段 146a、146b:端 148:測試墊 150、150B:第一抗氧化導電層 152、152B:抗氧化導電圖案 154、154B:第一橋接圖案 156、156B:第二橋接圖案 158:另一抗氧化導電圖案 160:絕緣層 160a、170a:開口 160b:另一開口 170:可剝膠層 180:第二抗氧化導電層 182:第三區 184:第一區 186:第二區 A-A’:剖線 L:走線 g1:第一間隙 g2:第二間隙 Z:方向10, 10A, 10B: display device 110:Substrate 112:Display surface 114:Back 120: Pixel structure 130: Barrier protection layer 140:Metal layer 142:Island test pad 144: First paragraph 146:Second paragraph 146a, 146b: end 148:Test pad 150, 150B: First anti-oxidation conductive layer 152, 152B: Anti-oxidation conductive pattern 154, 154B: first bridge pattern 156, 156B: Second bridge pattern 158:Another antioxidant conductive pattern 160: Insulation layer 160a, 170a: opening 160b:Another opening 170: Peelable adhesive layer 180: Second anti-oxidation conductive layer 182:The third area 184: District 1 186:Second District A-A’: section line L: routing g1: first gap g2: second gap Z: direction

圖1為本發明第一實施例之顯示裝置的仰視示意圖。 圖2為本發明第一實施例之顯示裝置的剖面示意圖。 圖3為本發明第二實施例之顯示裝置的剖面示意圖。 圖4為本發明第三實施例之顯示裝置的剖面示意圖。 FIG. 1 is a schematic bottom view of the display device according to the first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the display device according to the first embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a display device according to a second embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a display device according to a third embodiment of the present invention.

10:顯示裝置 10:Display device

110:基板 110:Substrate

112:顯示面 112:Display surface

114:背面 114:Back

120:畫素結構 120: Pixel structure

130:屏障保護層 130: Barrier protection layer

140:金屬層 140:Metal layer

142:島狀測試墊 142:Island test pad

144:第一段 144: First paragraph

146:第二段 146:Second paragraph

146a、146b:端 146a, 146b: end

148:測試墊 148:Test pad

150:第一抗氧化導電層 150: First anti-oxidation conductive layer

152:抗氧化導電圖案 152: Anti-oxidation conductive pattern

154:第一橋接圖案 154: First bridge pattern

156:第二橋接圖案 156: Second bridge pattern

158:另一抗氧化導電圖案 158:Another antioxidant conductive pattern

160:絕緣層 160: Insulation layer

160a、170a:開口 160a, 170a: opening

160b:另一開口 160b:Another opening

170:可剝膠層 170: Peelable adhesive layer

A-A’:剖線 A-A’: section line

L:走線 L: routing

g1:第一間隙 g1: first gap

g2:第二間隙 g2: second gap

Z:方向 Z: direction

Claims (9)

一種顯示裝置,包括: 一基板,具有相對的一顯示面及一背面; 一畫素結構,設置於該基板的該顯示面; 一金屬層,設置於該基板的該背面,且包括一島狀測試墊、一走線的一第一段及該走線的一第二段,其中該走線的該第一段及該第二段分別位於該島狀測試墊的兩側且與該島狀測試墊於結構上分離; 一第一抗氧化導電層,設置於該背面,且包括一第一橋接圖案及一第二橋接圖案,其中該第一橋接圖案連接於該走線的該第一段與該島狀測試墊之間,且該第二橋接圖案連接於該走線的該第二段與該島狀測試墊之間;以及 一絕緣層,設置於該第一抗氧化導電層上,且具有一開口,其中該絕緣層的該開口重疊於該島狀測試墊。 A display device including: A substrate having an opposite display surface and a back surface; A pixel structure is provided on the display surface of the substrate; A metal layer is provided on the back side of the substrate and includes an island-shaped test pad, a first section of a trace and a second section of the trace, wherein the first section of the trace and the third section of the trace The two sections are respectively located on both sides of the island-shaped test pad and are structurally separated from the island-shaped test pad; A first anti-oxidation conductive layer is provided on the backside and includes a first bridge pattern and a second bridge pattern, wherein the first bridge pattern is connected between the first section of the trace and the island test pad. space, and the second bridge pattern is connected between the second section of the trace and the island test pad; and An insulating layer is disposed on the first anti-oxidation conductive layer and has an opening, wherein the opening of the insulating layer overlaps the island-shaped test pad. 如請求項1所述的顯示裝置,更包括: 一可剝膠層,設置於該絕緣層上,且具有一開口,其中該可剝膠層的該開口重疊於該島狀測試墊。 The display device as described in claim 1 further includes: A peelable adhesive layer is provided on the insulating layer and has an opening, wherein the opening of the peelable adhesive layer overlaps the island-shaped test pad. 如請求項2所述的顯示裝置,其中該可剝膠層的該開口更重疊於該第一抗氧化導電層的該第一橋接圖案及該第二橋接圖案。The display device of claim 2, wherein the opening of the peelable adhesive layer further overlaps the first bridge pattern and the second bridge pattern of the first anti-oxidation conductive layer. 如請求項2所述的顯示裝置,其中該金屬層位於該第一抗氧化導電層與該基板的該背面之間,該第一抗氧化導電層更包括: 一抗氧化導電圖案,設置於該金屬層的該島狀測試墊上,其中該可剝膠層的該開口、該絕緣層的該開口與該抗氧化導電圖案重疊。 The display device of claim 2, wherein the metal layer is located between the first anti-oxidation conductive layer and the back surface of the substrate, and the first anti-oxidation conductive layer further includes: An anti-oxidation conductive pattern is provided on the island-shaped test pad of the metal layer, wherein the opening of the peelable adhesive layer, the opening of the insulating layer overlap with the anti-oxidation conductive pattern. 如請求項4所述的顯示裝置,其中該第一橋接圖案及該第二橋接圖案分別設置於該抗氧化導電圖案的兩側且與該抗氧化導電圖案於結構上分離。The display device of claim 4, wherein the first bridge pattern and the second bridge pattern are respectively disposed on both sides of the anti-oxidation conductive pattern and are structurally separated from the anti-oxidation conductive pattern. 如請求項1所述的顯示裝置,其中該金屬層位於該第一抗氧化導電層與該基板的該背面之間,該顯示裝置更包括: 一第二抗氧化導電層,設置於該金屬層與該基板的該背面之間,其中該金屬層的該走線的該第一段與該金屬層的該島狀測試墊具有一第一間隙,該金屬層的該走線的該第二段與該金屬層的該島狀測試墊具有一第二間隙,該第二抗氧化導電層具有分別重疊於該第一間隙及該第二間隙的一第一區及一第二區,該第一抗氧化導電層的該第一橋接圖案及該第二橋接圖案分別設置於該第一間隙及該第二間隙且分別電性連接至該第二抗氧化導電層的該第一區及該第二區。 The display device of claim 1, wherein the metal layer is located between the first anti-oxidation conductive layer and the back surface of the substrate, the display device further includes: A second anti-oxidation conductive layer is disposed between the metal layer and the back side of the substrate, wherein the first section of the trace of the metal layer and the island-shaped test pad of the metal layer have a first gap , the second section of the trace of the metal layer and the island-shaped test pad of the metal layer have a second gap, and the second anti-oxidation conductive layer has respectively overlapping the first gap and the second gap. A first region and a second region, the first bridge pattern and the second bridge pattern of the first anti-oxidation conductive layer are respectively disposed in the first gap and the second gap and are electrically connected to the second gap respectively. The first region and the second region of the oxidation-resistant conductive layer. 如請求項6所述的顯示裝置,其中該第二抗氧化導電層更具有一第三區,重疊於該金屬層的該島狀測試墊;該第三區的兩端分別與該第一區及該第二區連接。The display device of claim 6, wherein the second anti-oxidation conductive layer further has a third area that overlaps the island-shaped test pad of the metal layer; two ends of the third area are respectively connected with the first area. and the second area connection. 如請求項1所述的顯示裝置,其中該第一抗氧化導電層位於該金屬層與該基板的該背面之間。The display device of claim 1, wherein the first anti-oxidation conductive layer is located between the metal layer and the back surface of the substrate. 如請求項8所述的顯示裝置,其中該第一抗氧化導電層更包括: 一抗氧化導電圖案,其中該金屬層的該島狀測試墊設置於該第一抗氧化導電層的該抗氧化導電圖案上,且該抗氧化導電圖案的兩端分別與該第一橋接圖案及該第二橋接圖案連接。 The display device of claim 8, wherein the first anti-oxidation conductive layer further includes: An anti-oxidation conductive pattern, wherein the island-shaped test pad of the metal layer is disposed on the anti-oxidation conductive pattern of the first anti-oxidation conductive layer, and both ends of the anti-oxidation conductive pattern are respectively connected to the first bridge pattern and The second bridge pattern is connected.
TW111142968A 2022-11-10 2022-11-10 Display apparatus TWI813503B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW111142968A TWI813503B (en) 2022-11-10 2022-11-10 Display apparatus
CN202310059388.1A CN115911080B (en) 2022-11-10 2023-01-17 Display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111142968A TWI813503B (en) 2022-11-10 2022-11-10 Display apparatus

Publications (2)

Publication Number Publication Date
TWI813503B true TWI813503B (en) 2023-08-21
TW202420583A TW202420583A (en) 2024-05-16

Family

ID=86489871

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111142968A TWI813503B (en) 2022-11-10 2022-11-10 Display apparatus

Country Status (2)

Country Link
CN (1) CN115911080B (en)
TW (1) TWI813503B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI230292B (en) * 2002-12-09 2005-04-01 Lg Philips Lcd Co Ltd Array substrate having color filter on thin film transistor structure for LCD device and method of fabricating the same
US20090061575A1 (en) * 2005-11-14 2009-03-05 Hitachi Displays, Ltd. Display device and fabrication method thereof
US20200212344A1 (en) * 2018-12-28 2020-07-02 Lg Display Co., Ltd. Narrow bezel electroluminance lighting device
TW202228316A (en) * 2021-01-14 2022-07-16 日商半導體能源研究所股份有限公司 Display device manufacturing method, display device, display module and electronic device characterized by having the advantages of high definition and high resolution

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104916242B (en) * 2014-03-14 2018-11-13 群创光电股份有限公司 Display device and test pad thereof
US10121843B2 (en) * 2015-09-30 2018-11-06 Apple Inc. Corrosion resistant test lines
CN112838106B (en) * 2019-11-22 2025-02-25 京东方科技集团股份有限公司 Display substrate and display device
CN114203890B (en) * 2021-12-10 2024-01-26 Tcl华星光电技术有限公司 Display panel and preparation method of display panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI230292B (en) * 2002-12-09 2005-04-01 Lg Philips Lcd Co Ltd Array substrate having color filter on thin film transistor structure for LCD device and method of fabricating the same
US20090061575A1 (en) * 2005-11-14 2009-03-05 Hitachi Displays, Ltd. Display device and fabrication method thereof
US20200212344A1 (en) * 2018-12-28 2020-07-02 Lg Display Co., Ltd. Narrow bezel electroluminance lighting device
TW202228316A (en) * 2021-01-14 2022-07-16 日商半導體能源研究所股份有限公司 Display device manufacturing method, display device, display module and electronic device characterized by having the advantages of high definition and high resolution

Also Published As

Publication number Publication date
CN115911080B (en) 2026-01-02
CN115911080A (en) 2023-04-04
TW202420583A (en) 2024-05-16

Similar Documents

Publication Publication Date Title
TWI668856B (en) Light emitting diode panel
US20230329031A1 (en) Organic light emitting display device
TWI653771B (en) Display device and test method thereof
KR101600306B1 (en) Array Substrate for Display Device and Manufacturing Method thereof
CN105047606B (en) The reworking method of the array base palte of display device and the array base palte by its formation
CN110942715A (en) flexible electronics
CN112689913A (en) Display device
KR20180060710A (en) Flexible display device
US20200259050A1 (en) Micro light emitting device display apparatus
CN110890400A (en) Display device
TWI709222B (en) Micro light emitting device display apparatus
KR20180061856A (en) Flexible display device
KR20180036283A (en) Flexible display device and method of manufacturing the same
CN101320148B (en) Display substrate, method of manufacturing the same and display device having the display substrate
US11728352B2 (en) Driving substrate and manufacturing method thereof and display device
WO2021056549A1 (en) Array substrate and method for manufacturing same, mother board, and display device
TWI813503B (en) Display apparatus
TW202320320A (en) Display apparatus
KR20180036286A (en) Flexible display device
TW202001360A (en) Electronic device
US20240313007A1 (en) Drive substrate and preparation method therefor, and light-emitting apparatus
US12417720B2 (en) Display device and multi-display
TWI907106B (en) Display apparatus
CN115347089A (en) Light emitting diode packaging structure, manufacturing method thereof and light emitting panel
US20240274614A1 (en) Display apparatus