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TWI813442B - Server - Google Patents

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TWI813442B
TWI813442B TW111134612A TW111134612A TWI813442B TW I813442 B TWI813442 B TW I813442B TW 111134612 A TW111134612 A TW 111134612A TW 111134612 A TW111134612 A TW 111134612A TW I813442 B TWI813442 B TW I813442B
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area
module
expansion
sub
expansion module
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TW111134612A
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TW202411811A (en
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王瑋
田光召
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英業達股份有限公司
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Abstract

A server includes a casing, a motherboard module, a first expansion module, a second expansion module, and a third expansion module. The casing has a bottom plate and a front window area. The front window area is located at one side of the bottom plate and includes a first area, a second area and a third area arranged along a widthwise direction of the casing. Different portions of the motherboard module are respectively located at the first area and the second area. The first expansion module is accommodated in the first area and located farther away from the bottom plate than the motherboard module. The second expansion module is accommodated in the second area and located farther away from the bottom plate than the motherboard module. A total width of the first expansion module and the second module is substantially equal to a width of the motherboard module. The third expansion module is accommodated in the third area. The server is a 1U server, and at least two of the first expansion module, the second expansion module and the third expansion module are different from each other.

Description

伺服器server

本發明係關於一種伺服器，特別是一種1U伺服器。The present invention relates to a server, particularly a 1U server.

隨著科技的發展，伺服器的性能不斷地提升，故伺服器常運用於企業及銀行等機構，以幫助其處理各項不同的業務。然，目前伺服器的架構是固定的，也就是說，伺服器機殼內的硬體規格並無法更動，否則難以適配於機殼內，故在這樣的情況下使用者難以藉由調整伺服器之硬體的配置來使伺服器的性能符合需求。因此，目前此領域的研發人員正致力於解決這樣的問題。With the development of technology, the performance of servers continues to improve, so servers are often used in enterprises, banks and other institutions to help them handle various businesses. However, the current architecture of the server is fixed, which means that the hardware specifications inside the server case cannot be changed, otherwise it will be difficult to adapt to the case. Therefore, in this case, it is difficult for the user to adjust the servo Configure the server hardware to ensure that the server performance meets the requirements. Therefore, researchers in this field are currently working to solve such problems.

本發明在於提供一種伺服器，能讓其性能符合使用者之需求。The present invention provides a server whose performance can meet the needs of users.

本發明之一實施例所揭露之一種伺服器，包含一機殼、一主機板模組、一第一擴充模組、一第二擴充模組及一第三擴充模組。機殼具有一底板及一前窗區域，前窗區域位於底板的一側並包含沿機殼之寬度方向依序排列的一第一區域、一第二區域及一第三區域。主機板模組的不同部分分別容置於第一區域及第二區域。第一擴充模組容置於第一區域，並較主機板模組遠離底板。第二擴充模組容置於第二區域，並較主機板模組遠離底板，第一擴充模組及第二擴充模組的總寬度實質上等於主機板模組的寬度。第三擴充模組容置於第三區域。伺服器為1U伺服器，第一擴充模組、第二擴充模組及第三擴充模組中至少二者相異。A server disclosed in one embodiment of the present invention includes a chassis, a motherboard module, a first expansion module, a second expansion module and a third expansion module. The casing has a bottom panel and a front window area. The front window area is located on one side of the bottom panel and includes a first area, a second area and a third area sequentially arranged along the width direction of the casing. Different parts of the motherboard module are accommodated in the first area and the second area respectively. The first expansion module is accommodated in the first area and is farther away from the base plate than the motherboard module. The second expansion module is accommodated in the second area and is further away from the motherboard module. The total width of the first expansion module and the second expansion module is substantially equal to the width of the motherboard module. The third expansion module is accommodated in the third area. The server is a 1U server, and at least two of the first expansion module, the second expansion module and the third expansion module are different.

本發明之另一實施例所揭露之一種伺服器，包含一機殼、一主機板模組、一第一擴充模組、一第二擴充模組、一第三擴充模組及一第四擴充模組。機殼具有一底板及一前窗區域，前窗區域位於底板的一側並包含沿機殼之寬度方向依序排列的一第一區域、一第二區域、一第三區域及一第四區域。主機板模組的不同部分分別位於第一區域、第二區域及第三區域。第一擴充模組容置於第一區域，並較主機板模組遠離底板。第二擴充模組容置於第二區域，並較主機板模組遠離底板，第一擴充模組及第二擴充模組的總寬度小於主機板模組的寬度。第三擴充模組容置於第三區域，並較主機板模組遠離底板。第四擴充模組容置於第四區域，並較主機板模組遠離底板。伺服器為1U伺服器。Another embodiment of the present invention discloses a server, including a chassis, a motherboard module, a first expansion module, a second expansion module, a third expansion module and a fourth expansion module. Mods. The casing has a bottom panel and a front window area. The front window area is located on one side of the bottom panel and includes a first area, a second area, a third area and a fourth area sequentially arranged along the width direction of the casing. . Different parts of the motherboard module are located in the first area, the second area and the third area respectively. The first expansion module is accommodated in the first area and is farther away from the base plate than the motherboard module. The second expansion module is accommodated in the second area and is further away from the motherboard module. The total width of the first expansion module and the second expansion module is smaller than the width of the motherboard module. The third expansion module is accommodated in the third area and is farther away from the base plate than the motherboard module. The fourth expansion module is accommodated in the fourth area and is farther away from the base plate than the motherboard module. The server is a 1U server.

根據上述實施例所揭露的伺服器，藉由機殼之前窗區域之第一區域至第三區域中的第一擴充模組至第三擴充模組中至少二者相異的配置，或是藉由機殼之前窗區域之第一區域至第四區域分別容納第一擴充模組至第四擴充模組的配置，可讓使用者依據需求選配擴充模組的類型，來讓伺服器的性能能滿足其使用上的需求。According to the server disclosed in the above embodiment, at least two of the first to third expansion modules in the first to third areas of the front window area of the chassis are configured differently, or by The first to fourth areas of the front window area of the chassis accommodate the configuration of the first to fourth expansion modules respectively, allowing users to select the type of expansion module according to their needs to maximize the performance of the server. can meet the needs of its use.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理，並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the patent application scope of the present invention.

請參閱圖1至4。圖1為根據本發明之第一實施例所揭露之伺服器的前視示意圖。圖2為圖1之第一擴充模組的立體示意圖。圖3為圖1之第二擴充模組的立體示意圖。圖4為圖1之第三擴充模組的立體示意圖。See Figures 1 to 4. FIG. 1 is a schematic front view of a server disclosed according to a first embodiment of the present invention. FIG. 2 is a perspective view of the first expansion module of FIG. 1 . FIG. 3 is a perspective view of the second expansion module of FIG. 1 . FIG. 4 is a perspective view of the third expansion module of FIG. 1 .

在本實施例中，伺服器1a為1U的伺服器，伺服器1a包含一機殼10a、一主機板模組20a、一第一擴充模組30a、一第二擴充模組40a及一第三擴充模組50a。In this embodiment, the server 1a is a 1U server. The server 1a includes a chassis 10a, a motherboard module 20a, a first expansion module 30a, a second expansion module 40a and a third expansion module. Expansion module 50a.

機殼10a具有一底板11a、二側板12a及一前窗區域13a。二側板12a連接於底板11a的相對二側，且底板11a及二側板12a共同形成前窗區域13a。前窗區域13a包含沿機殼10a之寬度方向W依序排列的一第一區域131a、一第二區域132a及一第三區域133a。所謂之機殼10a的寬度方向W指的是從其中一側板12a至另一側板12a的方向。The casing 10a has a bottom panel 11a, two side panels 12a and a front window area 13a. The two side panels 12a are connected to two opposite sides of the bottom panel 11a, and the bottom panel 11a and the two side panels 12a together form a front window area 13a. The front window area 13a includes a first area 131a, a second area 132a and a third area 133a sequentially arranged along the width direction W of the casing 10a. The so-called width direction W of the casing 10a refers to the direction from one side plate 12a to the other side plate 12a.

主機板模組20a的不同部分分別容置於第一區域131a及第二區域132a。第一擴充模組30a容置於第一區域131a，並較主機板模組20a遠離底板11a。第二擴充模組40a容置於第二區域132a，並較主機板模組20a遠離底板11a，第一擴充模組30a及第二擴充模組40a的總寬度W1實質上等於主機板模組20a的寬度W2。第三擴充模組50a容置於第三區域133a。第一擴充模組30a、第二擴充模組40a及第三擴充模組50a中至少二者相異。Different parts of the motherboard module 20a are respectively accommodated in the first area 131a and the second area 132a. The first expansion module 30a is accommodated in the first area 131a and is further away from the base plate 11a than the mainboard module 20a. The second expansion module 40a is accommodated in the second area 132a and is further away from the base plate 11a than the motherboard module 20a. The total width W1 of the first expansion module 30a and the second expansion module 40a is substantially equal to the motherboard module 20a. The width W2. The third expansion module 50a is accommodated in the third area 133a. At least two of the first expansion module 30a, the second expansion module 40a and the third expansion module 50a are different.

詳細來說，第一擴充模組30a例如透過螺絲固定於機殼10a的底板11a。第一擴充模組30a包含一擴充卡模組31a，擴充卡模組31a例如為全高半長(FHHL)的PCIE卡模組，其例如包含一顯示卡311a。第二擴充模組40a例如透過螺絲固定於機殼10a的底板11a。第二擴充模組40a包含沿機殼10a之寬度方向W排列的二硬碟模組41a，第二擴充模組40a的二硬碟模組41a各包含一硬碟411a，硬碟411a例如為2.5吋的硬碟。第三擴充模組50a例如透過卡固的方式固定於機殼10a的底板11a，並透過螺絲固定於機殼10a的其中一側板12a。第三擴充模組50a包含一硬碟模組51a，第三擴充模組50a的硬碟模組51a包含二硬碟511a，硬碟511a例如為3.5吋的硬碟。也就是說，第三擴充模組50a的硬碟模組51a之硬碟511a的尺寸大於第二擴充模組40a之各硬碟模組41a之硬碟411a的尺寸。Specifically, the first expansion module 30a is fixed to the bottom plate 11a of the chassis 10a through screws, for example. The first expansion module 30a includes an expansion card module 31a. The expansion card module 31a is, for example, a full-height, half-length (FHHL) PCIE card module, which includes, for example, a display card 311a. The second expansion module 40a is fixed to the bottom plate 11a of the chassis 10a through screws, for example. The second expansion module 40a includes two hard disk modules 41a arranged along the width direction W of the chassis 10a. Each of the two hard disk modules 41a of the second expansion module 40a includes a hard disk 411a. The hard disk 411a is, for example, 2.5 mm. inch hard drive. The third expansion module 50a is fixed to the bottom plate 11a of the case 10a by, for example, clamping, and is fixed to one of the side plates 12a of the case 10a through screws. The third expansion module 50a includes a hard disk module 51a. The hard disk module 51a of the third expansion module 50a includes two hard disks 511a. The hard disks 511a are, for example, 3.5-inch hard disks. That is to say, the size of the hard disk 511a of the hard disk module 51a of the third expansion module 50a is larger than the size of the hard disk 411a of each hard disk module 41a of the second expansion module 40a.

請參閱圖5及圖6。圖5為根據本發明之第二實施例所揭露之伺服器的前視示意圖。圖6為圖5之第三擴充模組的立體示意圖。Please refer to Figure 5 and Figure 6. FIG. 5 is a schematic front view of a server disclosed according to a second embodiment of the present invention. FIG. 6 is a perspective view of the third expansion module of FIG. 5 .

本實施例的伺服器1b包含一機殼10b、一主機板模組20b、一第一擴充模組30b、一第二擴充模組40b及一第三擴充模組50b。本實施例的伺服器1b類似於上述參閱圖1所述的伺服器1a，以下主要針對二者之間的差異之處進行說明。The server 1b of this embodiment includes a chassis 10b, a motherboard module 20b, a first expansion module 30b, a second expansion module 40b and a third expansion module 50b. The server 1 b in this embodiment is similar to the server 1 a described above with reference to FIG. 1 , and the following mainly describes the differences between the two.

機殼10b之前窗區域13b的第三區域133b具有沿機殼10b之寬度方向W排列的一第一子區域1331b、一第二子區域1332b及一第三子區域1333b。第二子區域1332b位於第一子區域1331b及第三子區域1333b之間，且第一子區域1331b較第二子區域1332b靠近第二區域132b。第三擴充模組50b包含六個硬碟模組51b。第三區域133b的第一子區域1331b、第二子區域1332b及第三子區域1333b各容納沿垂直底板11b之方向排列的二個硬碟模組51b。第三擴充模組50b的這些硬碟模組51b與第二擴充模組40b的這些硬碟模組41b相同，第三擴充模組50b的這些硬碟模組51b各包含一個2.5吋硬碟511b。The third area 133b of the front window area 13b of the casing 10b has a first sub-area 1331b, a second sub-area 1332b and a third sub-area 1333b arranged along the width direction W of the casing 10b. The second sub-region 1332b is located between the first sub-region 1331b and the third sub-region 1333b, and the first sub-region 1331b is closer to the second region 132b than the second sub-region 1332b. The third expansion module 50b includes six hard disk modules 51b. The first sub-area 1331b, the second sub-area 1332b and the third sub-area 1333b of the third area 133b each accommodate two hard disk modules 51b arranged in a direction perpendicular to the base plate 11b. The hard disk modules 51b of the third expansion module 50b are the same as the hard disk modules 41b of the second expansion module 40b. Each of the hard disk modules 51b of the third expansion module 50b includes a 2.5-inch hard disk 511b. .

請參閱圖7及圖8。圖7為根據本發明之第三實施例所揭露之伺服器的前視示意圖。圖8為圖7之第三擴充模組的擴充卡模組的立體示意圖。Please refer to Figure 7 and Figure 8. FIG. 7 is a schematic front view of a server disclosed according to a third embodiment of the present invention. FIG. 8 is a perspective view of the expansion card module of the third expansion module of FIG. 7 .

本實施例的伺服器1c包含一機殼10c、一主機板模組20c、一第一擴充模組30c、一第二擴充模組40c及一第三擴充模組50c。本實施例的伺服器1c類似於上述參閱圖1所述的伺服器1a，以下主要針對二者之間的差異之處進行說明。The server 1c of this embodiment includes a chassis 10c, a motherboard module 20c, a first expansion module 30c, a second expansion module 40c and a third expansion module 50c. The server 1 c in this embodiment is similar to the server 1 a described above with reference to FIG. 1 , and the following mainly describes the differences between the two.

第二擴充模組40c類似於第一擴充模組30c。第二擴充模組40c包含一擴充卡模組41c，擴充卡模組41c例如為全高半長(FHHL)的PCIE卡模組，其例如包含一顯示卡411c。在本實施例中，機殼10c之前窗區域13c的第三區域133c具有沿機殼10c之寬度方向W排列的一第一子區域1331c、一第二子區域1332c及一第三子區域1333c。第二子區域1332c位於第一子區域1331c及第三子區域1333c之間，且第一子區域1331c較第二子區域1332c靠近第二區域132c。第三擴充模組50c包含四個硬碟模組51c及一擴充卡模組52c。第三區域133c的第一子區域1331c及第二子區域1332c各容納沿垂直底板11c之方向排列的二個硬碟模組51c。此四個硬碟模組51c各包含一個2.5吋硬碟511c。第三擴充模組50c的擴充卡模組52c例如為半高半長(HHHL)的PCIE卡模組，其容置於第三子區域1333c。The second expansion module 40c is similar to the first expansion module 30c. The second expansion module 40c includes an expansion card module 41c. The expansion card module 41c is, for example, a full-height, half-length (FHHL) PCIE card module, which includes, for example, a display card 411c. In this embodiment, the third area 133c of the front window area 13c of the casing 10c has a first sub-area 1331c, a second sub-area 1332c and a third sub-area 1333c arranged along the width direction W of the casing 10c. The second sub-region 1332c is located between the first sub-region 1331c and the third sub-region 1333c, and the first sub-region 1331c is closer to the second region 132c than the second sub-region 1332c. The third expansion module 50c includes four hard disk modules 51c and an expansion card module 52c. The first sub-area 1331c and the second sub-area 1332c of the third area 133c each accommodate two hard disk modules 51c arranged in a direction perpendicular to the base plate 11c. Each of the four hard disk modules 51c includes a 2.5-inch hard disk 511c. The expansion card module 52c of the third expansion module 50c is, for example, a half-height, half-length (HHHL) PCIE card module, which is accommodated in the third sub-region 1333c.

請參閱圖9及圖10。圖9為根據本發明之第四實施例所揭露之伺服器的前視示意圖。圖10為圖9之第三擴充模組的智能網卡模組的立體示意圖。Please refer to Figure 9 and Figure 10. FIG. 9 is a schematic front view of a server disclosed according to a fourth embodiment of the present invention. FIG. 10 is a three-dimensional schematic diagram of the smart network card module of the third expansion module of FIG. 9 .

本實施例的伺服器1d包含一機殼10d、一主機板模組20d、一第一擴充模組30d、一第二擴充模組40d及一第三擴充模組50d。本實施例的伺服器1d類似於上述參閱圖1所述的伺服器1a，以下主要針對二者之間的差異之處進行說明。The server 1d in this embodiment includes a chassis 10d, a motherboard module 20d, a first expansion module 30d, a second expansion module 40d and a third expansion module 50d. The server 1d in this embodiment is similar to the server 1a described above with reference to FIG. 1, and the following mainly describes the differences between the two.

第二擴充模組40d類似於第一擴充模組30d。第二擴充模組40d包含一擴充卡模組41d，擴充卡模組41d例如為全高半長(FHHL)的PCIE卡模組，其例如包含一顯示卡411d。在本實施例中，機殼10d之前窗區域13d的第三區域133d具有沿機殼10d之寬度方向W排列的一第一子區域1331d及一第二子區域1332d，第一子區域1331d較第二子區域1332d靠近第二區域132d。第三擴充模組50d包含二硬碟模組51d及一智能網卡模組52d。二硬碟模組51d沿垂直底板11d之方向排列並容置於第一子區域1331d，且此二個硬碟模組51d各包含一個2.5吋硬碟511d。智能網卡模組52d容置於第二子區域1332d。The second expansion module 40d is similar to the first expansion module 30d. The second expansion module 40d includes an expansion card module 41d. The expansion card module 41d is, for example, a full-height, half-length (FHHL) PCIE card module, which includes, for example, a display card 411d. In this embodiment, the third area 133d of the front window area 13d of the casing 10d has a first sub-area 1331d and a second sub-area 1332d arranged along the width direction W of the casing 10d. The first sub-area 1331d is smaller than the second sub-area 1331d. The second sub-area 1332d is close to the second area 132d. The third expansion module 50d includes two hard disk modules 51d and an intelligent network card module 52d. Two hard disk modules 51d are arranged in the direction vertical to the bottom plate 11d and are accommodated in the first sub-area 1331d, and each of the two hard disk modules 51d includes a 2.5-inch hard disk 511d. The smart network card module 52d is accommodated in the second sub-area 1332d.

請參閱圖11及圖12。圖11為根據本發明之第五實施例所揭露之伺服器的前視示意圖。圖12為圖11之第三擴充模組的第二硬碟模組的立體示意圖。Please refer to Figure 11 and Figure 12. FIG. 11 is a schematic front view of a server disclosed according to the fifth embodiment of the present invention. FIG. 12 is a perspective view of the second hard disk module of the third expansion module of FIG. 11 .

本實施例的伺服器1e包含一機殼10e、一主機板模組20e、一第一擴充模組30e、一第二擴充模組40e及一第三擴充模組50e。本實施例的伺服器1e類似於上述參閱圖1所述的伺服器1a，以下主要針對二者之間的差異之處進行說明。The server 1e of this embodiment includes a chassis 10e, a motherboard module 20e, a first expansion module 30e, a second expansion module 40e and a third expansion module 50e. The server 1e of this embodiment is similar to the server 1a described above with reference to FIG. 1, and the following mainly describes the differences between the two.

在本實施例中，機殼10e之前窗區域13e的第三區域133e具有沿機殼10e之寬度方向W排列的一第一子區域1331e及一第二子區域1332e，且第一子區域1331e較第二子區域1332e靠近第二區域132e。第三擴充模組50e包含二第一硬碟模組51e及一第二硬碟模組52e。二第一硬碟模組51e沿垂直底板11e之方向排列並容置於第一子區域1331e，且二第一硬碟模組51e例如各包含一個2.5吋硬碟511e。第二硬碟模組52e容置於第二子區域1332e，且第二硬碟模組52e包含一個3.5吋硬碟521e。第三擴充模組50e的第二硬碟模組52e的硬碟521e的尺寸大於第二擴充模組40e的二硬碟模組41e的硬碟411e的尺寸及第三擴充模組50e的二第一硬碟模組51e的硬碟511e的尺寸。In this embodiment, the third area 133e of the front window area 13e of the casing 10e has a first sub-area 1331e and a second sub-area 1332e arranged along the width direction W of the casing 10e, and the first sub-area 1331e is relatively The second sub-area 1332e is close to the second area 132e. The third expansion module 50e includes two first hard disk modules 51e and a second hard disk module 52e. The two first hard disk modules 51e are arranged along the direction perpendicular to the bottom plate 11e and are accommodated in the first sub-area 1331e, and the two first hard disk modules 51e each include, for example, a 2.5-inch hard disk 511e. The second hard disk module 52e is accommodated in the second sub-area 1332e, and the second hard disk module 52e includes a 3.5-inch hard disk 521e. The size of the hard disk 521e of the second hard disk module 52e of the third expansion module 50e is larger than the size of the hard disk 411e of the second hard disk module 41e of the second expansion module 40e and the second hard disk 521e of the third expansion module 50e. The size of the hard disk 511e of a hard disk module 51e.

請參閱圖13及圖14。圖13為根據本發明之第六實施例所揭露之伺服器的前視示意圖。圖14為圖13之第二擴充模組的立體示意圖。Please refer to Figure 13 and Figure 14. FIG. 13 is a schematic front view of a server disclosed according to the sixth embodiment of the present invention. FIG. 14 is a perspective view of the second expansion module of FIG. 13 .

本實施例的伺服器1f包含一機殼10f、一主機板模組20f、一第一擴充模組30f、一第二擴充模組40f及一第三擴充模組50f。本實施例的伺服器1f類似於上述參閱圖1所述的伺服器1a，以下主要針對二者之間的差異之處進行說明。The server 1f in this embodiment includes a chassis 10f, a motherboard module 20f, a first expansion module 30f, a second expansion module 40f and a third expansion module 50f. The server 1f in this embodiment is similar to the server 1a described above with reference to FIG. 1, and the following mainly describes the differences between the two.

第二擴充模組40f包含一擴充卡模組41f，擴充卡模組41f例如為大尺寸(LFF)的OCP 3.0擴充卡模組。在本實施例中，機殼10f之前窗區域13f的第三區域133f具有沿機殼10f之寬度方向W排列的一第一子區域1331f、一第二子區域1332f及一第三子區域1333f，第二子區域1332f位於第一子區域1331f及第三子區域1333f之間。第三擴充模組50f包含六個硬碟模組51f，第三區域133f的第一子區域1331f、第二子區域1332f及第三子區域1333f各容納沿垂直底板11f之方向排列的二個硬碟模組51f。這些硬碟模組51f各包含一個2.5吋硬碟511f。The second expansion module 40f includes an expansion card module 41f. The expansion card module 41f is, for example, a large format (LFF) OCP 3.0 expansion card module. In this embodiment, the third area 133f of the front window area 13f of the casing 10f has a first sub-area 1331f, a second sub-area 1332f and a third sub-area 1333f arranged along the width direction W of the casing 10f. The second sub-region 1332f is located between the first sub-region 1331f and the third sub-region 1333f. The third expansion module 50f includes six hard drive modules 51f. The first sub-area 1331f, the second sub-area 1332f and the third sub-area 1333f of the third area 133f each accommodate two hard drive modules arranged along the direction of the vertical base plate 11f. Disc module 51f. Each of these hard drive modules 51f contains a 2.5-inch hard drive 511f.

請參閱圖15，圖15為根據本發明之第七實施例所揭露之伺服器的前視示意圖。Please refer to FIG. 15 . FIG. 15 is a schematic front view of a server disclosed according to a seventh embodiment of the present invention.

在本實施例中，伺服器1g為1U伺服器，伺服器1g包含一機殼10g、一主機板模組20g、一第一擴充模組30g、一第二擴充模組40g、一第三擴充模組50g及一第四擴充模組60g。In this embodiment, the server 1g is a 1U server. The server 1g includes a chassis 10g, a motherboard module 20g, a first expansion module 30g, a second expansion module 40g, and a third expansion module. Module 50g and a fourth expansion module 60g.

機殼10g具有一底板11g、二側板12g及一前窗區域13g。二側板12g連接於底板11g的相對二側，且底板11g及二側板12g共同形成前窗區域13g。前窗區域13g包含沿機殼10g之寬度方向W依序排列的一第一區域131g、一第二區域132g、一第三區域133g及一第四區域134g。所謂之機殼10g的寬度方向W指的是從其中一側板12g至另一側板12g的方向。The casing 10g has a bottom panel 11g, two side panels 12g and a front window area 13g. The two side panels 12g are connected to two opposite sides of the bottom panel 11g, and the bottom panel 11g and the two side panels 12g together form a front window area 13g. The front window area 13g includes a first area 131g, a second area 132g, a third area 133g and a fourth area 134g sequentially arranged along the width direction W of the casing 10g. The so-called width direction W of the casing 10g refers to the direction from one side plate 12g to the other side plate 12g.

主機板模組20g的不同部分分別位於第一區域131g、第二區域132g及第三區域133g。第一擴充模組30g容置於第一區域131g，並較主機板模組20g遠離底板11g。第二擴充模組40g容置於第二區域132g，並較主機板模組20g遠離底板11g，第一擴充模組30g及第二擴充模組40g的總寬度W3小於主機板模組20g的寬度W4。第三擴充模組50g容置於第三區域133g，並較主機板模組20g遠離底板11g。第四擴充模組60g容置於第四區域134g。第一擴充模組30g、第二擴充模組40g、第三擴充模組50g及第四擴充模組60g分別包含擴充卡模組31g、41g、51g、61g，這些擴充卡模組31g、41g、51g、61g分別包含擴充卡311g、411g、511g、611g，這些擴充卡311g、411g、511g、611g彼此相同且皆為顯示卡。Different parts of the motherboard module 20g are respectively located in the first area 131g, the second area 132g and the third area 133g. The first expansion module 30g is accommodated in the first area 131g and is further away from the base plate 11g than the motherboard module 20g. The second expansion module 40g is accommodated in the second area 132g and is further away from the base plate 11g than the motherboard module 20g. The total width W3 of the first expansion module 30g and the second expansion module 40g is smaller than the width of the motherboard module 20g. W4. The third expansion module 50g is accommodated in the third area 133g and is further away from the base plate 11g than the motherboard module 20g. The fourth expansion module 60g is accommodated in the fourth area 134g. The first expansion module 30g, the second expansion module 40g, the third expansion module 50g and the fourth expansion module 60g respectively include expansion card modules 31g, 41g, 51g and 61g. These expansion card modules 31g, 41g, 51g and 61g include expansion cards 311g, 411g, 511g, and 611g respectively. These expansion cards 311g, 411g, 511g, and 611g are identical to each other and are all graphics cards.

根據上述實施例所揭露的伺服器，藉由機殼之前窗區域之第一區域至第三區域中的第一擴充模組至第三擴充模組中至少二者相異的配置，或是藉由機殼之前窗區域之第一區域至第四區域分別容納第一擴充模組至第四擴充模組的配置，可讓使用者依據需求選配擴充模組的類型，來讓伺服器的性能能滿足其使用上的需求。According to the server disclosed in the above embodiment, at least two of the first to third expansion modules in the first to third areas of the front window area of the chassis are configured differently, or by The first to fourth areas of the front window area of the chassis accommodate the configuration of the first to fourth expansion modules respectively, allowing users to select the type of expansion module according to their needs to maximize the performance of the server. can meet the needs of its use.

雖然本發明以前述之較佳實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the foregoing preferred embodiments, they are not intended to limit the present invention. Anyone skilled in the similar art can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention is The scope of patent protection for an invention shall be determined by the scope of the patent application attached to this specification.

1a,1b,1c,1d,1e,1f,1g:伺服器 10a,10b,10c,10d,10e,10f,10g:機殼 11a,11b,11c,11d,11e,11f,11g:底板 12a,12g:側板 13a,13b,13c,13d,13e,13f,13g:前窗區域 131a,131g:第一區域 132a,132b,132c,132d,132e,132g:第二區域 133a,133b,133c,133d,133e,133f,133g:第三區域 1331b,1331c,1331d,1331e,1331f:第一子區域 1332b,1332c,1332d,1332e,1332f:第二子區域 1333b,1333c,1333f:第三子區域 134g:第四區域 20a,20b,20c,20d,20e,20f,20g:主機板模組 30a,30b,30c,30d,30e,30f,30g:第一擴充模組 31a:擴充卡模組 311a:顯示卡 40a,40b,40c,40d,40e,40f,40g:第二擴充模組 41a,41b,41e:硬碟模組 41c,41d,41f:擴充卡模組 411a,411e:硬碟 411c,411d:顯示卡 50a,50b,50c,50d,50e,50f,50g:第三擴充模組 51a,51b,51c,51d,51f:硬碟模組 51e:第一硬碟模組 511a,511b,511c,511d,511e,521e,511f:硬碟 52c:擴充卡模組 52d:智能網卡模組 52e:第二硬碟模組 60g:第四擴充模組 31g,41g,51g,61g:擴充卡模組 311g,411g,511g,611g:擴充卡 W:寬度方向 W1,W2,W3,W4:寬度1a,1b,1c,1d,1e,1f,1g:server 10a, 10b, 10c, 10d, 10e, 10f, 10g: chassis 11a,11b,11c,11d,11e,11f,11g: base plate 12a,12g: side panel 13a,13b,13c,13d,13e,13f,13g: Front window area 131a,131g: first area 132a, 132b, 132c, 132d, 132e, 132g: second area 133a, 133b, 133c, 133d, 133e, 133f, 133g: third area 1331b, 1331c, 1331d, 1331e, 1331f: first sub-region 1332b, 1332c, 1332d, 1332e, 1332f: second sub-region 1333b, 1333c, 1333f: The third sub-area 134g:The fourth area 20a, 20b, 20c, 20d, 20e, 20f, 20g: motherboard module 30a, 30b, 30c, 30d, 30e, 30f, 30g: the first expansion module 31a: Expansion card module 311a: Graphics card 40a, 40b, 40c, 40d, 40e, 40f, 40g: second expansion module 41a, 41b, 41e: hard disk module 41c, 41d, 41f: Expansion card module 411a, 411e: hard disk 411c, 411d: graphics card 50a, 50b, 50c, 50d, 50e, 50f, 50g: third expansion module 51a, 51b, 51c, 51d, 51f: hard drive module 51e:The first hard drive module 511a, 511b, 511c, 511d, 511e, 521e, 511f: hard disk 52c: expansion card module 52d:Smart network card module 52e: Second hard drive module 60g: The fourth expansion module 31g, 41g, 51g, 61g: expansion card module 311g, 411g, 511g, 611g: expansion card W: Width direction W1,W2,W3,W4: Width

圖1為根據本發明之第一實施例所揭露之伺服器的前視示意圖。 圖2為圖1之第一擴充模組的立體示意圖。 圖3為圖1之第二擴充模組的立體示意圖。 圖4為圖1之第三擴充模組的立體示意圖。 圖5為根據本發明之第二實施例所揭露之伺服器的前視示意圖。 圖6為圖5之第三擴充模組的立體示意圖。 圖7為根據本發明之第三實施例所揭露之伺服器的前視示意圖。 圖8為圖7之第三擴充模組的擴充卡模組的立體示意圖。 圖9為根據本發明之第四實施例所揭露之伺服器的前視示意圖。 圖10為圖9之第三擴充模組的智能網卡模組的立體示意圖。 圖11為根據本發明之第五實施例所揭露之伺服器的前視示意圖。 圖12為圖11之第三擴充模組的第二硬碟模組的立體示意圖。 圖13為根據本發明之第六實施例所揭露之伺服器的前視示意圖。 圖14為圖13之第二擴充模組的立體示意圖。 圖15為根據本發明之第七實施例所揭露之伺服器的前視示意圖。 FIG. 1 is a schematic front view of a server disclosed according to a first embodiment of the present invention. FIG. 2 is a perspective view of the first expansion module of FIG. 1 . FIG. 3 is a perspective view of the second expansion module of FIG. 1 . FIG. 4 is a perspective view of the third expansion module of FIG. 1 . FIG. 5 is a schematic front view of a server disclosed according to a second embodiment of the present invention. FIG. 6 is a perspective view of the third expansion module of FIG. 5 . FIG. 7 is a schematic front view of a server disclosed according to a third embodiment of the present invention. FIG. 8 is a perspective view of the expansion card module of the third expansion module of FIG. 7 . FIG. 9 is a schematic front view of a server disclosed according to a fourth embodiment of the present invention. FIG. 10 is a three-dimensional schematic diagram of the smart network card module of the third expansion module of FIG. 9 . FIG. 11 is a schematic front view of a server disclosed according to the fifth embodiment of the present invention. FIG. 12 is a perspective view of the second hard disk module of the third expansion module of FIG. 11 . FIG. 13 is a schematic front view of a server disclosed according to the sixth embodiment of the present invention. FIG. 14 is a perspective view of the second expansion module of FIG. 13 . FIG. 15 is a schematic front view of a server disclosed according to a seventh embodiment of the present invention.

1a:伺服器 1a:Server

10a:機殼 10a:Chassis

11a:底板 11a: Base plate

12a:側板 12a: Side panel

13a:前窗區域 13a: Front window area

131a:第一區域 131a:First area

132a:第二區域 132a:Second area

133a:第三區域 133a:The third area

20a:主機板模組 20a: Motherboard module

30a:第一擴充模組 30a: The first expansion module

31a:擴充卡模組 31a: Expansion card module

311a:顯示卡 311a: Graphics card

40a:第二擴充模組 40a: Second expansion module

41a:硬碟模組 41a:Hard disk module

411a:硬碟 411a:hard disk

50a:第三擴充模組 50a: The third expansion module

51a:硬碟模組 51a:Hard disk module

511a:硬碟 511a:hard disk

W:寬度方向 W: Width direction

W1,W2:寬度 W1, W2: Width

Claims (10)

一種伺服器，包含：一機殼，具有一底板及一前窗區域，該前窗區域位於該底板的一側並包含沿該機殼之寬度方向依序排列的一第一區域、一第二區域及一第三區域；一主機板模組，該主機板模組的不同部分分別容置於該第一區域及該第二區域；一第一擴充模組，容置於該第一區域，並較該主機板模組遠離該底板；一第二擴充模組，容置於該第二區域，並較該主機板模組遠離該底板，該第一擴充模組及該第二擴充模組的總寬度實質上等於該主機板模組的寬度；以及一第三擴充模組，容置於該第三區域；其中，該伺服器為1U伺服器，該第一擴充模組、該第二擴充模組及該第三擴充模組中至少二者相異。A server includes: a casing with a bottom plate and a front window area. The front window area is located on one side of the bottom plate and includes a first area and a second area arranged sequentially along the width direction of the casing. area and a third area; a motherboard module, with different parts of the motherboard module being accommodated in the first area and the second area respectively; a first expansion module being accommodated in the first area, and is further away from the motherboard module than the base plate; a second expansion module is accommodated in the second area and is farther away from the motherboard module than the base plate, the first expansion module and the second expansion module The total width is substantially equal to the width of the motherboard module; and a third expansion module is accommodated in the third area; wherein the server is a 1U server, the first expansion module, the second At least two of the expansion module and the third expansion module are different. 如請求項1所述之伺服器，其中該第一擴充模組包含一擴充卡模組，該第二擴充模組包含沿該機殼之寬度方向排列的二硬碟模組，該第二擴充模組的該二硬碟模組各包含一硬碟，該第三擴充模組包含一硬碟模組，該第三擴充模組的該硬碟模組包含二硬碟，該第三擴充模組的該硬碟模組之各該硬碟的尺寸大於該第二擴充模組之各該硬碟模組之該硬碟的尺寸。The server of claim 1, wherein the first expansion module includes an expansion card module, the second expansion module includes two hard disk modules arranged along the width direction of the chassis, and the second expansion module The two hard disk modules of the module each include one hard disk, the third expansion module includes one hard disk module, the hard disk module of the third expansion module includes two hard disks, and the third expansion module The size of each hard disk of the hard disk module of the set is larger than the size of the hard disk of each hard disk module of the second expansion module. 如請求項1所述之伺服器，其中該第一擴充模組包含一擴充卡模組，該第二擴充模組包含沿該機殼之寬度方向排列的二硬碟模組，該第三區域具有沿該機殼之寬度方向排列的一第一子區域、一第二子區域及一第三子區域，該第二子區域位於該第一子區域及該第三子區域之間，該第三擴充模組包含六個硬碟模組，該第三區域的該第一子區域、該第二子區域及該第三子區域各容納沿垂直該底板之方向排列的其中該二硬碟模組。The server of claim 1, wherein the first expansion module includes an expansion card module, the second expansion module includes two hard disk modules arranged along the width direction of the chassis, and the third area There is a first sub-area, a second sub-area and a third sub-area arranged along the width direction of the casing, the second sub-area is located between the first sub-area and the third sub-area, and the third sub-area is The three expansion modules include six hard disk modules, and the first sub-area, the second sub-area and the third sub-area of the third area each accommodate two of the hard drive modules arranged in a direction perpendicular to the base plate. group. 如請求項1所述之伺服器，其中該第一擴充模組包含一擴充卡模組，該第二擴充模組包含一擴充卡模組，該第三區域具有沿該機殼之寬度方向排列的一第一子區域、一第二子區域及一第三子區域，該第二子區域位於該第一子區域及該第三子區域之間，該第一子區域較該第二子區域靠近該第二區域，該第三擴充模組包含四個硬碟模組及一擴充卡模組，該第三區域的該第一子區域及該第二子區域各容納沿垂直該底板之方向排列的其中該二硬碟模組，該第三擴充模組的該擴充卡模組容置於該第三子區域。The server according to claim 1, wherein the first expansion module includes an expansion card module, the second expansion module includes an expansion card module, and the third area has a plurality of holes arranged along the width direction of the chassis. a first sub-region, a second sub-region and a third sub-region, the second sub-region is located between the first sub-region and the third sub-region, the first sub-region is smaller than the second sub-region Close to the second area, the third expansion module includes four hard disk modules and an expansion card module. The first sub-area and the second sub-area of the third area are each accommodated in a direction perpendicular to the base plate. Among the two hard disk modules arranged, the expansion card module of the third expansion module is accommodated in the third sub-region. 如請求項1所述之伺服器，其中該第一擴充模組包含一擴充卡模組，該第二擴充模組包含一擴充卡模組，該第三區域具有沿該機殼之寬度方向排列的一第一子區域及一第二子區域，該第一子區域較該第二子區域靠近該第二區域，該第三擴充模組包含二硬碟模組及一智能網卡模組，該二硬碟模組沿垂直該底板之方向排列並容置於該第一子區域，該智能網卡模組容置於該第二子區域。The server according to claim 1, wherein the first expansion module includes an expansion card module, the second expansion module includes an expansion card module, and the third area has a plurality of holes arranged along the width direction of the chassis. A first sub-area and a second sub-area, the first sub-area is closer to the second sub-area, the third expansion module includes two hard disk modules and an intelligent network card module, the Two hard disk modules are arranged in a direction perpendicular to the base plate and are accommodated in the first sub-area, and the smart network card module is accommodated in the second sub-area. 如請求項1所述之伺服器，其中該第一擴充模組包含一擴充卡模組，該第二擴充模組包含沿該機殼之寬度方向排列的二硬碟模組，該第三區域具有沿該機殼之寬度方向排列的一第一子區域及一第二子區域，該第一子區域較該第二子區域靠近該第二區域，該第三擴充模組包含二第一硬碟模組及一第二硬碟模組，該二第一硬碟模組沿垂直該底板之方向排列並容置於該第一子區域，該第二硬碟模組容置於該第二子區域，該第二擴充模組的該二硬碟模組各包含一硬碟，該第三擴充模組的該二第一硬碟模組各包含一硬碟，該第三擴充模組的該第二硬碟模組包含一硬碟，該第三擴充模組的該第二硬碟模組的該硬碟的尺寸大於該第二擴充模組的該二硬碟模組的該些硬碟的尺寸及該第三擴充模組的該二第一硬碟模組的該些硬碟的尺寸。The server of claim 1, wherein the first expansion module includes an expansion card module, the second expansion module includes two hard disk modules arranged along the width direction of the chassis, and the third area It has a first sub-area and a second sub-area arranged along the width direction of the casing. The first sub-area is closer to the second area than the second sub-area. The third expansion module includes two first hard disks. disk module and a second hard disk module, the two first hard disk modules are arranged in a direction perpendicular to the base plate and are accommodated in the first sub-area, and the second hard disk module is accommodated in the second sub-region, the two hard disk modules of the second expansion module each include a hard disk, the two first hard disk modules of the third expansion module each include a hard disk, and the third expansion module The second hard disk module includes a hard disk, and the size of the hard disk of the second hard disk module of the third expansion module is larger than the hard disks of the two hard disk modules of the second expansion module. The size of the hard disk and the size of the hard disks of the two first hard disk modules of the third expansion module. 如請求項1所述之伺服器，其中該第一擴充模組包含一擴充卡模組，該第二擴充模組包含一擴充卡模組，該第三區域具有沿該機殼之寬度方向排列的一第一子區域、一第二子區域及一第三子區域，該第二子區域位於該第一子區域及該第三子區域之間，該第三擴充模組包含六個硬碟模組，該第三區域的該第一子區域、該第二子區域及該第三子區域各容納沿垂直該底板之方向排列的其中該二硬碟模組。The server according to claim 1, wherein the first expansion module includes an expansion card module, the second expansion module includes an expansion card module, and the third area has a plurality of holes arranged along the width direction of the chassis. A first sub-region, a second sub-region and a third sub-region, the second sub-region is located between the first sub-region and the third sub-region, the third expansion module includes six hard disks Modules, the first sub-area, the second sub-area and the third sub-area of the third area each accommodate the two hard disk modules arranged in a direction perpendicular to the base plate. 一種伺服器，包含：一機殼，具有一底板及一前窗區域，該前窗區域位於該底板的一側並包含沿該機殼之寬度方向依序排列的一第一區域、一第二區域、一第三區域及一第四區域；一主機板模組，該主機板模組的不同部分分別位於該第一區域、該第二區域及該第三區域；一第一擴充模組，容置於該第一區域，並較該主機板模組遠離該底板；一第二擴充模組，容置於該第二區域，並較該主機板模組遠離該底板，該第一擴充模組及該第二擴充模組的總寬度小於該主機板模組的寬度； 一第三擴充模組，容置於該第三區域，並較該主機板模組遠離該底板；以及一第四擴充模組，容置於該第四區域；其中，該伺服器為1U伺服器。A server includes: a casing with a bottom plate and a front window area. The front window area is located on one side of the bottom plate and includes a first area and a second area arranged sequentially along the width direction of the casing. area, a third area and a fourth area; a motherboard module, different parts of the motherboard module are respectively located in the first area, the second area and the third area; a first expansion module, A second expansion module is accommodated in the first area and is farther away from the motherboard module than the base plate; a second expansion module is accommodated in the second area and is far away from the motherboard module. The first expansion module is The total width of the set and the second expansion module is smaller than the width of the motherboard module; a third expansion module is accommodated in the third area and is further away from the base plate than the motherboard module; and a fourth The expansion module is accommodated in the fourth area; the server is a 1U server. 如請求項8所述之伺服器，其中該第一擴充模組、該第二擴充模組、該第三擴充模組及該第四擴充模組皆包含一擴充卡模組。The server of claim 8, wherein the first expansion module, the second expansion module, the third expansion module and the fourth expansion module all include an expansion card module. 如請求項9所述之伺服器，其中該第一擴充模組、該第二擴充模組、該第三擴充模組及該第四擴充模組的該些擴充卡模組各包含一擴充卡，該些擴充卡彼此相同且皆為顯示卡。The server of claim 9, wherein the expansion card modules of the first expansion module, the second expansion module, the third expansion module and the fourth expansion module each include an expansion card , these expansion cards are identical to each other and are all graphics cards.
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* Cited by examiner, † Cited by third party
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TWI517780B (en) * 2013-03-27 2016-01-11 廣達電腦股份有限公司 Server cabinet and its server device
TW202131133A (en) * 2020-02-14 2021-08-16 英業達股份有限公司 A graphic processing unit and host casing hardware configuration
CN114077290A (en) * 2020-08-21 2022-02-22 北京达佳互联信息技术有限公司 A frame and calculation type server for calculating type server
US20220159863A1 (en) * 2020-11-16 2022-05-19 Wistron Corporation Host casing of electronic device and disassembly and assembly module for dummy cover

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI517780B (en) * 2013-03-27 2016-01-11 廣達電腦股份有限公司 Server cabinet and its server device
TW202131133A (en) * 2020-02-14 2021-08-16 英業達股份有限公司 A graphic processing unit and host casing hardware configuration
CN114077290A (en) * 2020-08-21 2022-02-22 北京达佳互联信息技术有限公司 A frame and calculation type server for calculating type server
US20220159863A1 (en) * 2020-11-16 2022-05-19 Wistron Corporation Host casing of electronic device and disassembly and assembly module for dummy cover

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