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TWI805704B - 保護膜形成用複合片及附有保護膜的半導體晶片的製造方法 - Google Patents

保護膜形成用複合片及附有保護膜的半導體晶片的製造方法 Download PDF

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Publication number
TWI805704B
TWI805704B TW108107788A TW108107788A TWI805704B TW I805704 B TWI805704 B TW I805704B TW 108107788 A TW108107788 A TW 108107788A TW 108107788 A TW108107788 A TW 108107788A TW I805704 B TWI805704 B TW I805704B
Authority
TW
Taiwan
Prior art keywords
protective film
forming
film
thermosetting
aforementioned
Prior art date
Application number
TW108107788A
Other languages
English (en)
Chinese (zh)
Other versions
TW201938365A (zh
Inventor
古野健太
米山裕之
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201938365A publication Critical patent/TW201938365A/zh
Application granted granted Critical
Publication of TWI805704B publication Critical patent/TWI805704B/zh

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Classifications

    • H10P72/7402—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H10P54/00—
    • H10W99/00—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H10P72/742—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Dicing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
TW108107788A 2018-03-09 2019-03-08 保護膜形成用複合片及附有保護膜的半導體晶片的製造方法 TWI805704B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018043567 2018-03-09
JP2018-043567 2018-03-09

Publications (2)

Publication Number Publication Date
TW201938365A TW201938365A (zh) 2019-10-01
TWI805704B true TWI805704B (zh) 2023-06-21

Family

ID=67847394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108107788A TWI805704B (zh) 2018-03-09 2019-03-08 保護膜形成用複合片及附有保護膜的半導體晶片的製造方法

Country Status (5)

Country Link
JP (1) JP7330166B2 (ja)
KR (1) KR102758207B1 (ja)
CN (1) CN111417513B (ja)
TW (1) TWI805704B (ja)
WO (1) WO2019172439A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7345328B2 (ja) 2019-09-13 2023-09-15 株式会社ディスコ 被加工物の加工方法
JP7236366B2 (ja) * 2019-09-25 2023-03-09 日東電工株式会社 表面保護フィルム
JP7664023B2 (ja) * 2020-01-30 2025-04-17 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法
CN118043415A (zh) * 2022-03-09 2024-05-14 琳得科株式会社 工件加工用片及经加工的工件的制造方法
JP2023141696A (ja) * 2022-03-24 2023-10-05 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シート、保護膜付き半導体チップ及び半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI238182B (en) * 1998-11-20 2005-08-21 Lintec Corp Pressure sensitive adhesive sheet and method of use thereof
TW201406544A (zh) * 2012-05-14 2014-02-16 琳得科股份有限公司 附有接著性樹脂層之板片以及半導體裝置之製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003138228A (ja) 2001-11-02 2003-05-14 Nitto Denko Corp 半導体ウエハ保護用粘着シート
JP4519409B2 (ja) 2003-02-24 2010-08-04 リンテック株式会社 粘着シートおよびその使用方法
JP2004338289A (ja) 2003-05-16 2004-12-02 Sekisui Film Kk 粘着テープ用基材および粘着シート
JP2005272724A (ja) * 2004-03-25 2005-10-06 Furukawa Electric Co Ltd:The 半導体用粘着テープ
JP2012222002A (ja) 2011-04-04 2012-11-12 Nitto Denko Corp ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
US20170036431A1 (en) 2014-03-28 2017-02-09 Lintec Corporation Base film for dicing sheet, dicing sheet compresing base film, and method of manufacturing base film
JP6068386B2 (ja) * 2014-03-31 2017-01-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2017008255A (ja) * 2015-06-25 2017-01-12 リンテック株式会社 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法
JP5814487B1 (ja) 2014-07-04 2015-11-17 リンテック株式会社 保護膜形成用フィルム
KR102376017B1 (ko) * 2014-08-22 2022-03-17 린텍 가부시키가이샤 보호막 형성용 시트 및 보호막이 형성된 반도체 칩의 제조 방법
SG11201706108UA (en) * 2015-01-30 2017-08-30 Lintec Corp Adhesive sheet for semiconductor processing
SG11201707264VA (en) 2015-03-12 2017-10-30 Lintec Corp Film for forming protection film
JP2017183705A (ja) 2016-03-24 2017-10-05 日東電工株式会社 ダイシングダイボンドフィルム、及び、半導体装置の製造方法
WO2019172438A1 (ja) 2018-03-09 2019-09-12 リンテック株式会社 保護膜形成用複合シート及び保護膜付き半導体チップの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI238182B (en) * 1998-11-20 2005-08-21 Lintec Corp Pressure sensitive adhesive sheet and method of use thereof
TW201406544A (zh) * 2012-05-14 2014-02-16 琳得科股份有限公司 附有接著性樹脂層之板片以及半導體裝置之製造方法

Also Published As

Publication number Publication date
KR102758207B1 (ko) 2025-01-21
KR20200130235A (ko) 2020-11-18
CN111417513A (zh) 2020-07-14
TW201938365A (zh) 2019-10-01
CN111417513B (zh) 2022-06-03
JPWO2019172439A1 (ja) 2021-03-18
JP7330166B2 (ja) 2023-08-21
WO2019172439A1 (ja) 2019-09-12

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