TWI802220B - Mold die, resin molding apparatus, and method for producing resin molded product - Google Patents

Abstract

The molding die comprises a molding die body holding the molded object Sa and having: a cavity MCa to which the resin material T is supplied with; a pot block 71 having a pot 71a to which the resin material T is supplied; a scrap block UM that forms the resin flow paths 71b, 71d, 81, 82 between the pot block 71 for flowing the resin material T from the pot 71a toward the cavity MCa. The pot block 71 has a protruding portion 71A that protrudes when pressing the object Sa. An insertion member 71Aa is formed on the protruding portion 71A inserted into a hole H formed in the molded object Sa.

Description

Mold, resin molding device, and manufacturing method of resin molded product

The present invention relates to a molding die, a resin molding device and a method for manufacturing resin moldings.

A substrate to which electronic components such as a semiconductor chip (hereinafter also simply referred to as a "chip") is connected is generally used as an electronic component by sealing it with a resin. Conventionally, as a resin molding device for transfer molding, it is known to include: a molding die having an upper die and a lower die to be supplied to a substrate; a release film supply mechanism for supplying a release film to the mold surface of the upper die; and a mold clamping mechanism. , Clamping mold (for example, refer to Patent Document 1).

In the resin molding device described in Patent Document 1 (resin molding device in the document), the barrel spacer provided on the lower mold is provided with a bridging portion. It is held between the parts. In addition, positioning pins are formed protruding upward on the lower mold, and when the substrate is supplied to the lower mold, the positioning of the substrate is performed by making the V-shaped notches provided on the substrate correspond to the positioning pins.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2020-29045

However, in the resin molding apparatus described in Patent Document 1, if positioning pins are provided on the lower mold, when it is desired to supply a release film to the mold surface of the lower mold for reasons such as preventing contamination of the lower mold, the positioning pins will become Obstructed and unable to respond.

Therefore, a molding die, a resin molding device, and a method of manufacturing a resin molded product that can position a substrate with a high degree of freedom are desired.

The molding die of the present invention is characterized in that it has: a molding die body that holds a molding object and has a cavity to which a resin material is supplied; and a waste material block, forming a resin flow path for the resin material to flow from the barrel to the mold cavity between the block and the block of the barrel; the block of the barrel can have A protruding portion that protrudes when the object to be molded is pressed; an insertion member that is inserted into a hole formed in the object to be molded is formed on the protruded portion.

The resin molding device of the present invention is characterized by comprising: the molding die; a release film supply mechanism for supplying a release film to the mold surface of the molding die body supplied with the molding object; and a mold clamping mechanism, Clamp the forming mold.

The manufacturing method of the resin molded article of the present invention is characterized by comprising: a release film supplying step of supplying the release film to the molding die body; and a molding object supplying step of supplying the molded product on the release film. object; a step of positioning such that the cartridge block is aligned with the forming mold The object is relatively moved closer, and the insertion member is inserted into the hole to perform positioning of the molding object; The cavity supplies the resin material to perform resin molding of the object to be molded.

3: Forming module

30: Resin molding device

31: Upper mold support part

32: Upper deck

33: upper mold bottom plate

34: Lower mold support part

35: movable platen

36: Bottom plate of lower mold

4: supply module

41:Loader

42: Uninstaller

43: Substrate supply mechanism

44:Substrate alignment mechanism

45: Resin supply mechanism

46:Substrate housing

5: Clamping mechanism

6: Control Department

7: Resin injection mechanism

71: barrel block

71A: Protrusion (protruding part)

71Aa: guide pin (insert member)

71a: Barrel

71b: waste part (resin flow path)

71c: Runner (resin flow path)

71d: gate (resin flow path)

72:Transfer organization

72a: plunger

72b: Fixed block

72c: Plunger drive mechanism

73: Cylindrical member

74: Elastic member

75: Linear part

76: flat surface

8: Release film supply mechanism

81: Concave space (resin flow path)

82: Gate (resin flow path)

83:Ejector pin

84: Ejection board

85: Elastic member

86: Return pin

9: Slot

13: Wafer

F: release film

H: hole

M: Forming mold body

MCa: upper cavity (mold cavity)

MCb: lower cavity (mold cavity)

Sa: Substrate before molding (object to be molded)

Sb: Formed substrate (resin molded product)

T: resin sheet (resin material)

UM: upper mold (waste block)

LM: lower mold

Fig. 1 is a schematic plan view showing a resin molding apparatus.

Fig. 2 is a schematic front view showing the molding die.

Fig. 3 is a perspective view showing a cartridge block and a waste block.

Fig. 4 is a perspective view of a barrel block and a lower mold.

Fig. 5 is an enlarged perspective view showing a lower mold on which a cartridge block and a substrate are placed.

Fig. 6A is a diagram showing the first stage of the positioning step.

Figure 6B is a diagram showing the second stage of the positioning step.

Figure 6C is a diagram showing the third stage of the positioning step.

Figure 6D is a diagram showing the fourth stage of the positioning step.

Figure 6E is a diagram representing the fifth stage of the positioning step.

Fig. 7 is an enlarged perspective view showing a guide pin of another embodiment.

Hereinafter, embodiments of the molding die, resin molding apparatus, and method for manufacturing resin molded articles of the present invention will be described based on the drawings. However, it is not limited to the following embodiment, Various changes are possible in the range which does not deviate from the summary.

A substrate (molding object) to which a semiconductor chip or the like is connected is used as an electronic component by sealing it with a resin. As a technique for resin sealing an object to be molded, transfer molding (Transfer) method etc. are mentioned. As one of the transfer molding methods, it is possible to place the object to be molded on the release film that is adsorbed to the lower mold of the molding mold, and supply a resin sheet ( Resin material) is heated and melted, and then the molten resin is supplied to the cavity, and the resin is molded into the molding object.

Powder resin includes not only powder resin, but also resin sheets formed by compacting and solidifying powder resin, either of which is melted into a liquid state by heating of molten resin. The powdery resin may be a thermoplastic resin or a thermosetting resin. When a thermosetting resin is heated, its viscosity decreases, and when further heated, it polymerizes and hardens to become a cured resin. As will be described below, it is desirable to use a thermosetting resin when resin-molding and sealing a pre-molding substrate to which a semiconductor chip is connected.

〔Overall composition〕

Hereinafter, the resin molding apparatus 30 of the transfer molding method will be described as an example. FIG. 1 is a schematic plan view showing a resin molding device 30 in this embodiment. The resin molding device 30 includes a molding module 3 , a supply module 4 , a control unit 6 , and a conveying mechanism. The molding die set 3 is a part of the resin-sealed molding object, and has a molding die that holds the pre-molded substrate Sa (molding object) and includes a molding die body M. The control part 6 includes a program stored in hard disk drive (HDD) or memory, and the program is software for controlling at least the operation of the resin molding device 30, which is controlled by ASIC, FPGA, CPU or other hardware processor to execute.

The resin molding device 30 of this embodiment is a device for resin molding the unmolded substrate Sa to which a semiconductor chip or the like is connected.

The molding die set 3 resin-seals the pre-molded substrate Sa (molding object) with the molding die, and molds the molded substrate Sb (resin molded product). There are a plurality of molding die sets 3 (two in this embodiment), and each molding die set 3 can be installed or removed independently.

Details of the resin molding device 30 will be described later. In addition, the number of molding die sets 3 may be one, or three or more.

The supply module 4 is used to supply the pre-molded substrate Sa and the resin sheet T to the molding module 3, and accommodate the molded substrate Sb from the molding module 3, including a substrate supply mechanism 43, a substrate arrangement mechanism 44, a resin supply mechanism 45 and a substrate Containment 46. The loader 41 and the unloader 42 contained in the conveying mechanism are on standby in the supply module 4 . The substrate supply mechanism 43 delivers the stored pre-molding substrate Sa to the substrate alignment mechanism 44 . On the pre-molding substrate Sa, a plurality of semiconductor chips are arranged and connected in the vertical direction and/or the horizontal direction. The substrate alignment mechanism 44 makes the unmolded substrate Sa delivered from the substrate supply mechanism 43 into a state suitable for conveyance. The resin supply mechanism 45 stores the resin sheet T, and arranges the resin sheet T in a state suitable for conveyance. In addition, one semiconductor wafer may be connected to the pre-molding substrate Sa.

The transport mechanism includes: a loader 41 for transporting pre-molded substrate Sa or resin sheet T connected with semiconductor wafers before resin sealing; and an unloader 42 for transporting molded substrate Sb after resin sealing. The loader 41 can receive the pre-molding substrate Sa from the substrate arrangement mechanism 44, and receive the resin sheet T from the resin supply mechanism 45, and move from the supply module 4 to each molding module 3 via rails, and place the pre-molding substrate Sa and The resin sheet T is delivered to the molding mold body M (lower mold LM) of each molding module 3 . The unloader 42 can take out the formed substrate Sb from the forming die set 3 , and move from each forming die set 3 to the substrate accommodating portion 46 via rails, and store the formed substrate Sb in the substrate accommodating portion 46 . In the molded substrate Sb, semiconductor chips and the like are sealed with hardened resin obtained by solidifying molten resin. In addition, the substrate receives The container portion 46 can also be arranged on the opposite side to the supply module 4 across the molding module 3 , and the arrangement of each mechanism constituting the supply module 4 is not particularly limited.

Hereinafter, the resin molding device 30 of the molding module 3 will be described in detail.

As shown in FIG. 2 , the resin molding device 30 has an upper mold UM (an example of a waste block), and a molten resin (hereinafter referred to as "molten resin") formed with a resin sheet T and heated and melted is poured into the upper mold. The cavity MCa; the lower mold LM is provided with a resin injection mechanism 7 opposite to the upper mold UM to inject molten resin into the upper mold cavity MCa; a mold clamping mechanism 5, which clamps the upper mold UM and the lower mold LM; and a release film The supply mechanism 8 supplies the release film F. In the lower mold LM of this embodiment, a lower cavity MCb is formed in which molten resin is injected from the upper cavity MCa through a resin flow hole (not shown) provided in the substrate Sa before molding. The action of the mold clamping mechanism 5 is controlled by the control unit 6 .

The upper mold UM is held by an upper mold support portion 31 , and the upper mold support portion 31 is fixed to an upper platen 32 . Furthermore, the upper mold UM is attached to the upper mold support part 31 via the upper mold bottom plate 33 . The lower mold LM is held by a lower mold support portion 34 , and the lower mold support portion 34 is fixed to a movable platen 35 raised and lowered by the mold clamping mechanism 5 . Furthermore, the lower mold LM is attached to the lower mold support portion 34 via the lower mold base plate 36 . For the mold clamping mechanism 5 of this embodiment, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or hydraulic cylinder and a rod can be used.

The release film supply mechanism 8 supplies the release film F between the upper mold UM and the lower mold LM.

As the material of the release film F, resin materials with properties such as heat resistance, mold release, flexibility, and stretchability can be used, such as: PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, etc.

The release film supply mechanism 8 includes: a delivery mechanism (not shown in the figure), which sends out the release film F; and a recovery mechanism (not shown in the figure), which recycles the release film F. The sending mechanism can send the release film F before use to between the upper mold UM and the lower mold LM, and the recycling mechanism can recover the used release film F for resin molding. In addition, the lower mold LM is provided with an adsorption mechanism (not shown) for adsorbing the release film F to the mold surface by a vacuum pump or the like. The operation of the release film supply mechanism 8 is controlled by the control unit 6 .

The resin injection mechanism 7 is provided with: a cylinder block 71, which is formed with a cylinder 71a for accommodating the resin sheet T; and an injection mechanism 72, which has a plunger 72a disposed in the cylinder 71a. Moreover, the cartridge 71a is formed by the cylindrical member 73, for example. The cylindrical member 73 is fitted into a through hole formed in the cartridge block 71 .

The cylinder block 71 is elastically supported by an elastic member 74 so as to be movable up and down with respect to the lower mold LM. That is, the cylinder block 71 is configured to be movable up and down with respect to the lower mold LM via the elastic member 74 . The elastic member 74 is provided on the lower side of the cylinder block 71, and presses the cylinder block 71 in a direction away from the lower mold LM.

In addition, at the upper end of the cylinder block 71, a protruding portion 71A (an example of a protruding portion) protruding from the upper surface of the lower mold LM, that is, the mold surface, is formed. The protruding portion 71A protrudes in a state capable of pressing the cylinder-side end portion of the opposing pre-molding substrate Sa, and a guide pin 71Aa (an example of an insertion member) to be described later is formed on the lower surface. Furthermore, on the upper surface of the cylinder block 71, a waste portion 71b, a runner 71c, and a gate 71d serving as a resin flow path for introducing molten resin injected from the cylinder 71a into the upper cavity MCa are formed. In addition, when the upper mold UM and the lower mold LM are clamped, the upper surface of the protruding part 71A contacts the upper mold UM (waste block), and the lower surface thereof is sandwiched between the mold surface of the lower mold LM. Substrate Sa before molding.

The transfer mechanism 72 moves the plunger 72a in a state where the upper mold UM and the lower mold LM are clamped, and injects molten resin from the cylinder 71a into the upper mold cavity MCa. The transfusion mechanism 72 includes: a plunger 72a, which is arranged inside the barrel 71a, and is used to pressure-feed the molten resin; a fixed block 72b, which fixes the plunger 72a; and a plunger driving mechanism 72c, which moves the plunger 72a through the fixed block 72b . The operation of the plunger driving mechanism 72c is controlled by the control unit 6 .

The fixing block 72b has a substantially rectangular parallelepiped shape, and a plurality of plungers 72a are fixed in a row in a straight line on one surface (upper surface) of the rectangular parallelepiped. The arrangement of the plurality of plungers 72a corresponds to the arrangement of the plurality of cartridges 71a described later. In addition, the plurality of plungers 72a are fixed to the fixing block 72b, for example, by fixing screws.

In addition, an equal pressure mechanism may be provided in the fixed block 72b, and an elastic member may be used to uniformly inject the pressure of the molten resin into the respective plungers 72a.

The plunger driving mechanism 72c moves up and down the fixed block 72b relative to the lower mold LM, and moves the plurality of plungers 72a up and down with the same movement amount relative to the plurality of cylinders 71a at once. The plunger driving mechanism 72c of this embodiment is arranged on the lower side of the fixing block 72b. As the plunger driving mechanism 72c, for example, a combination of a servo motor and a ball screw mechanism, or a combination of an air cylinder or hydraulic cylinder and a rod can be used.

In the upper mold UM, a wafer 13 for accommodating the substrate Sa before molding is formed, and the molten resin is injected into the upper cavity MCa. Further, in the upper mold UM, the concave space 81 and the gate 82 connecting the waste portion 71b, the runner 71c, and the gate 71d of the cylinder block 71 and the upper cavity MCa are formed. That is, between the upper mold UM and the cylinder block 71, a waste portion 71b, a runner 71c, a gate 71d, and a recessed resin flow path for molten resin to flow from the cylinder 71a to the upper cavity MCa are formed. Space 81 and gate 82. In addition, an exhaust port (not shown) is formed on the side opposite to the cylinder block 71 in the upper mold UM. In addition, it is also possible to omit The runner 71c directly connects the waste part 71b and the upper cavity MCa via gates 71d and 82 . In addition, although the concave space 81 in this embodiment is formed as a space for resin accumulation before being connected to the upper cavity MCa from the gate 71d, and is connected to the upper cavity MCa through the gate 82 from the resin accumulation space, it is also This resin accumulation space may be omitted.

Furthermore, the upper mold UM is provided with a plurality of ejector pins 83 for releasing the molded substrate Sb from the upper mold UM. The ejector pins 83 pass through the required places of the upper mold UM, are set to be movable relative to the upper mold UM, and are fixed to the ejector plate 84 provided on the upper side of the upper mold UM. The ejector plate 84 is provided on the top plate 32 and the like via an elastic member 85 and has a return pin 86 . When closing the mold, the ejector plate 84 rises relative to the upper mold UM because the return pin 86 is in contact with the outside of the mounting area of the substrate Sa before molding of the lower mold LM. Thereby, at the time of mold closing, the ejector pin 83 will be in the state retracted to the mold surface of the upper mold UM. On the other hand, when the mold is opened, as the lower mold LM descends, the ejector plate 84 descends relative to the upper mold UM by the elastic force of the elastic member 85, and the ejector pins 83 release the molded substrate Sb from the upper mold UM.

If the upper mold UM and the lower mold LM are clamped by the mold clamping mechanism 5, the resin flow path formed by the waste part 71b, the runner 71c, the gate 71d, the concave space 81 and the gate 82 makes the plurality of barrels 71a It communicates with the upper mold cavity MCa, and the upper mold cavity MCa communicates with the lower mold cavity MCb through the resin flow hole provided on the substrate Sa before molding. Furthermore, when the upper mold UM and the lower mold LM are clamped, the cylinder-side end portion of the substrate Sa before molding is sandwiched between the lower surface of the protruding portion 71A of the cylinder block 71 and the mold surface of the lower mold LM. . In this state, the plunger driving mechanism 72c raises the plunger 72a to inject molten resin into the upper cavity MCa and the lower cavity MCb, and the wafer 13 and the like of the substrate Sa before molding are sealed with the resin.

Next, the molding die will be described in detail using FIGS. 3 to 5 . Fig. 3 is a perspective view showing the cylinder block 71 and the upper mold UM (waste block) included in the molding die as viewed from above. FIG. 4 is a perspective view of the barrel block 71 and the lower mold LM viewed from the side, and FIG. 5 is a lower mold on which the barrel block 71 and the substrate Sa before molding are placed. An enlarged perspective view of LM. The forming mold has a forming mold body M, and the forming mold body M includes: a barrel block 71, a lower mold LM with a liftable barrel block 71, and an upper mold UM with a waste block.

In the cylinder block 71 of this embodiment, as shown in FIG. 3( b ), a plurality of cylinders 71 a are formed in a straight line. In addition, in FIG.3(b), although the example which formed 8 cartridges 71a in the 1 cartridge block 71 was shown, it is not limited to this, It can change suitably.

Also, on the upper surface of the barrel block 71, a plurality of waste parts 71b corresponding to the plurality of barrels 71a are formed, and a plurality of runners 71c and gates 71d are formed respectively corresponding to the plurality of waste parts 71b.

The cylinder block 71 has the some cylinder 71a which supplies the resin sheet T. As shown in FIG. Each barrel 71a communicates with a waste portion 71b including a portion surrounding the barrel 71a, a plurality of (four in the figure) branch passages 71c extending from the waste portion 71b, and a flow path 71c that becomes the flow path 71c in plan view. Gate 71d at the front end. After the resin of the pre-molding substrate Sa is molded, excess resin remains in the waste portion 71b, runner 71c, and gate 71d of the cylinder block 71 . The excess resin is the resin that remains and hardens between the upper mold UM and the resin injection mechanism 7 after resin molding, and is the resin that remains and hardens on the cylinder block 71 in this embodiment.

As shown in Figure 3(a), the upper mold UM forms a part of a concave space 81 at the part facing the waste part 71b and the flow channel 71c of the barrel block 71, and the resin in the concave space 81 is accumulated. A gate 82 is formed at the front end of the space. As described above, the scrap portion 71b, the runner 71c, the gate 71d, the concave space 81, and the gate 82 constitute a resin flow path through which molten resin flows from the cylinder 71a to the cavity MCa.

As shown in FIG. 4 , the cylinder block 71 has a protruding portion 71A protruding in a state where the cylinder-side end portion of the front substrate Sa can be press-molded. The protruding portion 71A of this embodiment exists continuously throughout the existing region of the substrate Sa before molding. A plurality of guide pins 71Aa are formed on the lower surface of the protruding portion 71A, which are respectively inserted into a plurality of (three in the figure) holes H formed in the end portion of the cylinder side of the substrate Sa before molding when the mold is closed. In addition, the extension part 71A may be divided and formed only at the place where the guide pin 71Aa is provided.

The plurality of guide pins 71Aa in this embodiment are formed by a total of three cylinders at positions corresponding to the central hole H formed on the barrel-side end of the substrate Sa before molding, and the holes H respectively provided at both ends. form. The guide pins 71Aa are formed of tapered truncated cones, and all of them have the same shape. In addition, the guide pins 71Aa may be provided corresponding to the number and position of the holes H of the substrate Sa before molding, and the number and arrangement are not particularly limited. In addition, all the guide pins 71Aa do not have to have the same shape, and different shapes may be mixed.

As shown in FIG. 5 , the guide pin 71Aa is formed by the size of the hole H penetrating the substrate Sa before molding, and the lower mold LM has a groove 9 for inserting the guide pin 71Aa. The guide pin 71Aa has a linear portion 75 on the bottom end side and a flat surface 76 on the front end in a cross-sectional view. The angle between the linear portion 75 and the flat surface 76 is preferably chamfered at an R angle or a C angle so as to facilitate insertion into the hole H. When the guide pin 71Aa is inserted into the hole H, the pre-molding substrate Sa can be moved in any direction in the horizontal direction such as front, rear, left, and right through the tapered portion 77, and the straight line with the same diameter and the same thickness as the hole H can be formed. The portion 75 fits into the hole H to fix the pre-molding substrate Sa. At this time, due to the flat surface 76, the substrate Sa before molding is not damaged. The grooves 9 of this embodiment are arranged corresponding to the number and position of the guide pin 71Aa and the holes H of the substrate Sa before molding, and form three bottomed holes. The groove 9 is provided with a tapered shape whose diameter decreases toward the bottom wall on the side wall. In addition, the plurality of grooves 9 provided in the lower mold LM may be formed in a cylindrical shape without a taper, may be formed in a single elongated hole shape that is all connected, or may be formed in a plurality of connected elongated holes shape.

〔Manufacturing method of resin molding〕

A method of manufacturing a resin molded product (molded substrate Sb) will be described mainly using FIG. 1 and FIG. 6 . The manufacturing method of the resin molded product (molded substrate Sb) includes: a release film supply step of supplying the release film F to the lower mold LM; a molding object supply step of supplying the unmolded substrate Sa on the release film F; and a positioning step , so that the barrel block 71 moves relatively close to the lower mold LM, and the guide pin 71Aa is inserted into the hole H of the pre-molding substrate Sa to position the pre-molding substrate Sa; the molding step is to supply the molten resin to the upper cavity MCa in the state where the molding mold is clamped by the mold clamping mechanism 5, and perform the pre-molding substrate Sa Sa resin molding. This molding step is a step in which the resin molding device 30 resin-moldes the pre-molding substrate Sa between the loading from the molding die set 3 of the un-molding substrate Sa and the unloading from the molding die set 3 of the molded substrate Sb. In the molding step of this embodiment, by supplying molten resin to upper cavity MCa and lower cavity MCb, molten resin is supplied to both surfaces of substrate Sa before molding, and double-sided molding is performed.

As shown in FIG. 1 , the loader 41 is heated in a state of heat insulation from the housing space of the resin sheet T, and the mold body M is also thermoformed in advance. Then, the unmolded substrate Sa taken out from the substrate supply mechanism 43 is placed on the loader 41 . And the resin sheet T arranged by the resin supply mechanism 45 is accommodated in the accommodation space of the resin sheet T of the loader 41. As shown in FIG. Then, the loader 41 transports the pre-molded substrate Sa and the resin sheet T to the molding module 3, and stores the resin sheet T in the cylinder 71a of the lower mold LM. By accommodating the resin sheet T in the barrel 71a, the heater built in the lower mold LM heats the resin sheet T to become a molten resin.

And the release film supply mechanism 8 supplies the release film F before use between the upper mold UM and the lower mold LM (refer FIG. 2). Then, the lower mold LM is moved toward the upper mold UM by the mold clamping mechanism 5 with the driving force controlled by the control unit 6, and the release film F before use is closely bonded to the lower mold LM. Then, the mold release film F is adsorbed on the mold surface of the lower mold LM by the suction mechanism, and the pre-molding substrate Sa is supplied on the mold release film F. As a mechanism for supplying the unmolded substrate Sa on the release film F, for example, a loader (not shown) described in Japanese Patent No. 6655148 can be used. When the pre-molding substrate Sa is supplied on the release film F, the pre-molding substrate Sa is positioned to some extent by pushing the end face of the pre-molding substrate Sa to the side surface of the cylinder block 71, but based on the pre-molding substrate Sa Due to the surface roughness of the end face, etc., it is difficult to perform high-precision positioning.

Next, the upper mold UM and the lower mold LM are brought close together by the mold clamping mechanism 5 with the driving force controlled by the control unit 6 to clamp the upper mold UM and the lower mold LM. At this time, by the mold clamping mechanism 5, the lower mold LM and the barrel block 71 are raised (refer to FIG. 6A ), and when the upper surface of the barrel block 71 contacts the upper mold UM, the rise of the barrel block 71 stops ( See Figure 6B). Then, the lower mold LM is further raised by the mold clamping mechanism 5, the elastic member 74 (see FIG. 2 ) shrinks, and the cylinder block 71 is relatively lowered with respect to the lower mold LM (see FIGS. 6C to 6D ), The lower surface of the protruding portion 71A is in contact with the cylinder-side end portion of the substrate Sa before molding (see FIG. 6E ). And, the end of the pre-molding substrate Sa that is not in contact with the end of the cylinder side contacts the lower surface of the upper mold UM.

When the cylinder block 71 is relatively lowered relative to the lower mold LM, when the lower surface of the protruding portion 71A contacts the cylinder-side end of the pre-molding substrate Sa, the guide pin 71Aa penetrates the hole H of the pre-molding substrate Sa and is drawn. Insert it into the groove 9 of the lower mold LM (refer to Fig. 6D ~ Fig. 6E). At this time, the release film F is deformed into a locally curved state by contacting the flat surface 76 of the guide pin 71Aa. In this embodiment, since the guide pin 71Aa is made of a tapered truncated cone shape, when the guide pin 71Aa is inserted into the hole H of the substrate Sa before molding, the tapered portion 77 of the truncated cone shape contacts the side surface of the hole H, The pre-molding substrate Sa is moved to an appropriate position, and the truncated circular portion 75 can be fixed in position by being fitted into the hole H of the pre-molding substrate Sa. In addition, since the guide pin 71Aa is formed according to the size of the through hole H, positioning can be performed even when the thickness of the substrate Sa before molding is thin. Furthermore, since the side wall of the groove 9 into which the guide pin 71Aa is inserted has a tapered shape whose diameter decreases toward the bottom wall, the guide pin 71Aa does not interfere with the groove 9 .

Next, the molten resin obtained by melting the resin sheet T accommodated in the lower mold LM is injected into the cavities MCa and MCb by the transfer mechanism 72 with a driving force controlled by the controller 6 . Thereby, the pre-molding substrate Sa is molded on both sides (see FIG. 2 ). After resin molding, the lower mold LM is moved downward to open the molding die. In this mold opening operation, the scrap part 71b and the runner 71c to be formed in the cylinder block 71 are performed. The operation of separating excess resin such as the gate 71d from the pre-molding substrate Sa molded on both sides (gate breaking operation) separates the molded substrate Sb and excess resin. Then, the molded substrate Sb is released from the lower mold LM and the upper mold UM, and is accommodated in the substrate accommodating portion 46 by the unloader 42 (see FIG. 1 ). After the package substrate (molded substrate Sb) is produced by the resin molding device 30, it is cut (individualized) so as to remove unnecessary parts of the package substrate including the hole H by the cutting device, so The formed cut-off products are inspected for quality and used as electronic parts.

In this way, the protruding portion 71A of the cylinder block 71 is provided with a guide pin 71Aa inserted into the hole H formed in the pre-molding substrate Sa, so that the pre-molding substrate Sa is guided to an appropriate position relative to the molding die body M. is positioned. As a result, when resin-molding the pre-substrate Sa, the filling position of the molten resin becomes correct, and the molding accuracy is improved. Also, the pre-molding substrate Sa that is correctly positioned is pressed by the protruding portion 71A, and is inserted into the hole H of the pre-molding substrate Sa through the guide pin 71Aa, so there is no inconvenience of moving the pre-molding substrate Sa due to resin pressure.

Then, molten resin is supplied to both sides of the substrate Sa before molding in the molding step, and both sides are molded. In this two-sided molding, the pre-molding substrate Sa is easily moved by resin pressure, but the pre-molding substrate Sa that is correctly positioned is pressed by the protruding portion 71A, and is inserted into the hole H of the pre-molding substrate Sa by the guide pin 71Aa. , so there is no inconvenience of moving the substrate Sa before molding due to resin pressure.

[Other Implementation Types]

Hereinafter, for easy understanding, the same terms and symbols will be used to describe the same components as those in the above-mentioned embodiment.

<1> In the above embodiment, although the release film F is adsorbed on the lower mold LM, the release film F can also be adsorbed on the upper mold UM, and the release film F can also be adsorbed on the upper mold UM and the lower mold. Lm. When the release film F is adsorbed to the upper mold UM, the ejector pin 83 of the above embodiment is not required, and it is preferable to separately provide a mechanism for supplying the release film F to the upper mold UM.

<2> In the above embodiment, although the lower mold cavity MCb is formed in the lower mold LM, it is not necessary to resin seal the lower surface of the substrate Sa before molding, and the lower mold cavity MCb can also be omitted. In this case, only one side facing the upper mold UM (the upper surface of the substrate Sa before molding) is molded with resin, but in order to prevent contamination of the lower mold LM, it is preferable to supply the mold release film F to the lower mold LM.

<3> In the above embodiment, although the example of supplying the unmolded substrate Sa to the lower mold LM is shown, it is also possible to supply the unmolded substrate Sa to the upper mold UM, on the upper surface of the protruding portion 71A of the cylinder block 71 The substrate Sa before molding is clamped between the mold surface of the upper mold UM. In this case, the guide pin 71Aa is provided on the upper surface of the overhang portion 71A, and the groove 9 is provided on the upper mold UM.

圓錐形狀。即便是在該情況，圓錐形狀之錐形部位接觸於成型前基板Sa之孔H之側面，使成型前基板Sa移動至適當之位置，能夠以圓柱形狀之底端部位進行位置固定。此外，導銷71Aa形成角柱狀等，只要是可插入至成型前基板Sa之孔H之形狀，什麼樣的形狀皆可。 <4> As shown in FIG. 7, the guide pin 71Aa (another example of the insertion member) may also have a cylindrical shape at the bottom end side, and the front end side may be

conical shape. Even in this case, the conical tapered part contacts the side surface of the hole H of the pre-molding substrate Sa, and the pre-molding substrate Sa is moved to an appropriate position, and the position can be fixed by the cylindrical bottom end part. In addition, the guide pin 71Aa is formed in any shape, such as a prism shape, as long as it can be inserted into the hole H of the board|substrate Sa before molding.

<5> In the above embodiment, although the guide pin 71Aa is used as the height dimension of the hole H penetrating the substrate Sa before molding, the height dimension of the guide pin 71Aa can also be configured to be less than the thickness of the substrate Sa before molding.

<6> In the above embodiment, although the scrap block is integrally formed on the upper mold UM, the scrap block can also be provided separately from the upper mold UM.

<7> In the above embodiment, although the cylinder block 71 is elastically supported by the elastic member 74 in such a way that it can be raised and lowered relative to the lower mold LM, it is also possible to fix the cylinder block 71 and place it on the lower mold LM. A movable plate that supports the substrate Sa before molding is provided. In this case, when the upper mold UM and the lower mold LM are relatively moved to perform mold clamping, the cylinder block 71 and the lower mold LM are moved relatively closer by moving the movable block independently. , and insert the guide pin 71Aa into the hole H of the substrate Sa before molding.

<8> The pre-molding substrate Sa resin-molded by the resin molding device 30 in the above-mentioned embodiment is, for example, a semiconductor substrate (silicon wafer, etc.), a metal substrate (lead frame), a glass substrate, a ceramic substrate, Resin board or wiring board.

〔Overview of the above-mentioned implementation form〕

Hereinafter, the outline of the resin molding apparatus 30 and the manufacturing method of the resin molded article demonstrated in the said embodiment is demonstrated.

(1) The molding die is characterized in that it includes: a molding die body M, holds a molding object (substrate Sa before molding), and has a cavity ( Upper mold cavity MCa); Forming mold body M, comprising: barrel block 71, having a barrel 71a supplied with resin material (resin sheet T); Between 71, a resin flow path (waste part 71b, runner 71c, gate 71d, concave space 81 and gate 82) is formed to allow the resin material (molten resin) to flow from the barrel 71a to the cavity (upper cavity MCa). ); the barrel block 71 has a protruding portion (protruding portion 71A) that protrudes under the state of pressing the moldable object (substrate Sa before molding); a protruding portion (protruding portion 71A) is formed to be inserted into the molding The insertion member (guide pin 71Aa) of the hole H of the object (substrate Sa before molding).

In this configuration, a guide pin 71Aa inserted into the hole H formed in the pre-molding substrate Sa is provided on the protruding portion 71A of the cylinder block 71 . Thereby, the board|substrate Sa before molding is guided to an appropriate position with respect to the molding-mold main body M (lower mold LM), and is positioned. As a result, when resin-molding the pre-substrate Sa, the filling position of the molten resin becomes correct, and the molding accuracy is improved. And, correctly positioned molding The front substrate Sa is pressed by the protruding portion 71A, and is inserted into the hole H of the pre-molded substrate Sa by the guide pin 71Aa, so there is no inconvenience of moving the pre-molded substrate Sa due to resin pressure.

(2) The insertion member (guide pin 71Aa) may also be formed in a tapered truncated circular shape.

If the guide pin 71Aa is made of a tapered truncated cone shape as in this configuration, then when the guide pin 71Aa is inserted into the hole H of the substrate Sa before molding, the tapered portion 77 of the truncated cone shape contacts the side surface of the hole H, The substrate Sa before molding can be moved to an appropriate position.

(3) The insertion member (guide pin 71Aa) can also be formed according to the size of the through hole H, and a groove 9 into which the insertion member (guide pin 71Aa) is inserted is formed in the molding die body M (lower mold LM).

If the guide pin 71Aa is formed according to the size of the through hole H as in this configuration, positioning can be performed even if the thickness of the substrate Sa before molding is thin. Furthermore, if the groove 9 into which the guide pin 71Aa is inserted is provided in the lower mold LM, it is not necessary to make the guide pin 71Aa a movable member capable of advancing and retreating, and the manufacturing cost can be reduced.

(4) The resin molding device 30 is characterized in that it includes: a molding die according to any one of the above-mentioned (1) to (3); The mold surface of the forming mold body M (lower mold LM) is supplied with the release film F; and the mold clamping mechanism 5 is used for clamping the mold.

As described above, instead of providing the positioning pins on the lower mold LM, the guide pins 71Aa are provided on the protruding portion 71A of the cylinder block 71, so that the mold of the lower mold LM that is supplied with the substrate Sa before molding can be formed. The release film F is supplied side by side. As a result, it is possible to prevent contamination of the molding die body M accompanying resin molding.

(5) The method of manufacturing a resin molded product (molded substrate Sb) using the resin molding device 30 of the above (4) is characterized in that it includes a step of supplying a mold release film, and the molding mold body M (lower mold LM) supplies the release film F; the molding object supply step supplies the molding object (substrate Sa before molding) on the release film F; the positioning step makes the cylinder block 71 and the molding die body M ( The lower mold LM) moves relatively close, and inserts the insert member (guide pin 71Aa) into the hole H of the pre-molding substrate Sa to position the molding object (pre-molding substrate Sa); and in the molding step, by clamping the mold The mechanism 5 supplies the resin material (molten resin obtained by melting the resin sheet T) to the cavity (upper cavity MCa) in the state where the molding mold is closed, and performs resin molding of the object to be molded (substrate Sa before molding).

In this method, the cylinder block 71 and the lower mold LM are relatively moved closer, and the guide pin 71Aa is inserted into the hole H of the substrate Sa before molding to perform the positioning step of the substrate Sa before molding. Steps When performing resin molding on the pre-molding substrate Sa, the filling position of the molten resin becomes correct, and the molding accuracy is improved.

(6) In addition, in the molding step, a resin material (molten resin) may be supplied to both surfaces of the object to be molded (substrate Sa before molding), and both surfaces may be molded.

In this method, a resin material is supplied to both sides of the substrate Sa before molding in a molding step, and both sides are molded. In this two-sided molding, the pre-molding substrate Sa is easily moved by resin pressure, but the pre-molding substrate Sa that is correctly positioned is pressed by the protruding portion 71A, and is inserted into the hole H of the pre-molding substrate Sa by the guide pin 71Aa. , so there is no inconvenience of moving the substrate Sa before molding due to resin pressure.

In addition, as long as there is no conflict, the configurations disclosed in the above-mentioned implementation forms (including other implementation types, the same below) can be used in combination with the configurations disclosed in other implementation types. Moreover, the embodiment disclosed in this specification is an illustration, and the embodiment of this invention is not limited to this, It can change suitably in the range which does not deviate from the objective of this invention.

Industrial availability

The present invention can be utilized in a molding die, a resin molding device, and a method of manufacturing a resin molded product.

3: Forming module

5: Clamping mechanism

7: Resin injection mechanism

8: Release film supply mechanism

13: Wafer

31: Upper mold support part

32: Upper deck

33: upper mold bottom plate

34: Lower mold support part

35: movable platen

36: Bottom plate of lower mold

71: barrel block

71A: Protrusion (protruding part)

71Aa: guide pin (insert member)

71a: Barrel

71b: waste part (resin flow path)

71d: gate (resin flow path)

72:Transfer organization

72a: plunger

72b: Fixed block

72c: Plunger drive mechanism

73: Cylindrical member

74: Elastic member

81: Concave space (resin flow path)

82: Gate (resin flow path)

83:Ejector pin

84: Ejection board

85: Elastic member

86: Return pin

F: release film

H: hole

MCa: upper cavity (mold cavity)

MCb: lower cavity (mold cavity)

Sa: Substrate before molding (object to be molded)

T: resin sheet (resin material)

UM: upper mold (waste block)

LM: lower mold

Claims (6)

A molding die, which has: The molding die body holds the molding object and has a cavity to which the resin material is supplied; and The molding die body includes: a cylinder block having a cylinder supplied with the resin material; and a waste material block formed between the cylinder block and the resin material from the cylinder a resin flow path flowing to the mold cavity; The cylinder block has a protruding portion that protrudes in a state capable of pressing the object to be molded; An insertion member to be inserted into a hole formed in the object to be molded is formed at the protruding portion. The molding die as described in Claim 1, wherein: The insertion member consists of a tapered frustoconical shape. The molding die as described in Claim 1 or 2, wherein: the insertion member is formed by dimensions through the aperture; and A groove into which the insertion member is inserted is formed in the molding die body. A resin molding device comprising: The molding die described in any one of claims 1~3; a release film supply mechanism for supplying a release film to the mold surface of the molding die body supplied with the molding object; and The mold clamping mechanism clamps the forming mold. A method of manufacturing a resin molded product, which is a method of manufacturing a resin molded product using the resin molding device described in claim 4, comprising: a release film supplying step of supplying the release film to the molding die body; a forming object supplying step of supplying the forming object on the release film; a positioning step of moving the cylinder block relatively close to the molding die body, inserting the insertion member into the hole, and positioning the molding object; and In the molding step, the resin material is supplied to the cavity in a state where the molding mold is clamped by the mold clamping mechanism, and resin molding of the object to be molded is performed. The method of manufacturing a resin molded product as described in claim 5, wherein: In the molding step, the resin material is supplied to both sides of the object to be molded, and both sides are molded.

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