TWI801949B - Carrier detecting device - Google Patents

Abstract

A carrier detecting device, the carrier detection device includes an image capture unit and a carrier fixing unit. The carrier fixing unit includes: a carrier clamping unit, a stepping motor and a spinner; the carrier the board clamping unit is used to clamp the carrier, wherein a strain gauge is provided on both sides of the contact surface between the carrier clamping unit and the carrier, and the strain gauge is electrically connected to the carrier to obtain the carrier one of the warpage value; the stepping motor is arranged at the round angle of the carrier clamping unit; the screwing device is electrically connected to the strain gauges and the stepping motor, and the screwing device controls the screwing device down according to the warpage value the rate of displacement.

Description

Carrier detection device

The present invention relates to a carrier inspection device, and in particular to a carrier inspection device which utilizes a stepping motor and a screw-in device to finely adjust carrier warpage.

Semiconductor (IC substrate) and printed circuit board (Printed Circuit Board, PCB-substrate without IC) will warp due to the manufacturing process on the material.

In addition to the warpage of the component itself, when it is bonded to the circuit board through surface mount technology (SMT), the warpage will be exacerbated due to the difference in the coefficient of thermal expansion (CTE) between the chip and the circuit board. And when the warpage exceeds a certain range, it will cause poor soldering quality when the SMT is bonded to the circuit board, which will also affect the subsequent reliability test results.

More and more manufacturers are developing advanced processes, and these advanced processes are stacked with layers of many different materials and functions, such as multi-chip modules (Multi-Chip Modules, MCM), system-in-package, fan-in Type-level packaging (FIWLP: Fan-in Level Package) and fan-out level packaging (FOWLP: Fan-Out Level Package), etc. The materials used in such components are quite complex and diverse. When stacked together, due to the material of each layer Different coefficients of thermal expansion (CTE) will produce warpage (warpage).

The printed circuit board (PCB) also has warpage, and the warpage of the printed circuit board (PCB) will also affect the abnormality of the adhesion technology (SMT).

The invention provides a carrier inspection device, which uses a stepping motor and a screw-in device to fine-tune the warping of the carrier caused by sequentially stacking materials with different temperature characteristics.

The present invention proposes a carrier inspection device, which includes an image capture unit and a carrier fixing unit, the carrier fixing unit includes: a carrier clamping unit, including an upper glass piece and a lower glass piece, the The lower glass sheet carries a carrier board, and the upper glass sheet is used to cover the carrier board, wherein, a sensing unit is respectively arranged on both sides of the contact surface between the upper glass sheet and the carrier board, and the sensing unit is electrically Connecting the carrier board to obtain a warpage value of the carrier board; a stepping motor is arranged at the corner of the carrier board clamping unit; and a screw-in device is electrically connected to the sensing units, the rotary The inner circumference of the inserter has a helical guide rail and is electrically connected to the stepping motor, and the screwer is arranged on the upper surface of the upper glass sheet; wherein, the screwer and the stepping motor clamp the load up and down The board clamping unit controls the downward displacement rate of the screw-in device according to the warpage value.

In an embodiment of the present invention, the above-mentioned image capture unit further includes a first image capture unit and a second image capture unit.

In one embodiment of the present invention, the above-mentioned first image capture unit obtains the first azimuth image of the carrier plate through the upper glass plate, and the first image capture unit is further provided with a first slide rail for Move to obtain images of the carrier board at different angles.

In one embodiment of the present invention, the above-mentioned second image capture unit obtains the second azimuth image of the carrier plate through the lower glass plate, and the second image capture unit is further provided with a second slide rail for Move to obtain images of the carrier board at different angles.

In one embodiment of the present invention, the above-mentioned stepping motor is a micro stepping motor.

In one embodiment of the present invention, the above-mentioned stepping motors are disposed at least at four peripheral corners of the carrier clamping unit.

The present invention proposes a substrate inspection device, comprising: a first image capture unit, a first slide rail is provided for the displacement of the first image capture unit, so as to obtain the first image of a carrier through an upper glass plate. The image of the carrier board with different orientations and angles; a second image capture unit is provided with a second slide rail for the displacement of the second image capture unit, so as to obtain the second orientation phase of the carrier board through the lower glass plate The image of the carrier plate at different angles; a carrier plate clamping unit, including the upper glass piece and the lower glass piece, the lower glass piece carries a carrier plate, and the upper glass piece is used to cover the carrier plate, wherein the A strain gauge is arranged on both sides of the contact surface between the upper glass sheet and the carrier board, and the strain gauge is electrically connected to the carrier board to obtain a warpage value of the carrier board; at least a stepping motor is arranged on the carrier board The peripheral angle of the plate clamping unit; and at least one screw-in device, which is electrically connected to the strain gauges, the inner circumference of the screw-in device has a helical guide rail and is electrically connected to the stepping motor, and the screw-in device is arranged on The upper surface of the upper glass sheet; wherein, the screw-in device and the stepping motor clamp the carrier clamping unit up and down, and the rate of downward displacement of the screw-in device is controlled according to the warpage value.

110: Lower glass sheet

120: upper glass sheet

121: Strain gauge

130A, 130B, 130C, 130D: screw-in device

140A, 140B, 140C, 140D: stepping motor

150A, 150B, 150C, 150D: screw

160A: The first CCD imaging lens

160B: Second CCD image lens

170A: The first bracket

180A: The first slide rail

180B: Second slide rail

200: carrier board

FIG. 1 is a schematic diagram of an embodiment of a substrate inspection device of the present invention.

Fig. 2 is a schematic diagram of an embodiment of the carrier plate fixing unit of the present invention.

FIG. 3 is a partially enlarged schematic diagram of the stepping motor and the screw-in device in FIG. 2 .

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the specific embodiments below are described in detail in conjunction with the attached drawings. The attached drawings are mainly simplified schematic diagrams, which are only schematically illustrated The basic structure of the invention, therefore, only the components related to the present invention are marked in these drawings, and the displayed components are not drawn with the number, shape, size ratio, etc. at the time of implementation, and the specification size at the time of actual implementation is actually An optional design, and its component layout may be more complicated.

The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention may be practiced. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. Also, in the specification, unless it is clearly described to the contrary, the word "comprising" will be understood as meaning including the stated elements, but not excluding any other elements.

Fig. 1 is a schematic diagram of an embodiment of a carrier plate fixing unit of the present invention. In FIG. 1 , the carrier inspection device at least includes: a carrier fixing unit and an image capturing unit.

The carrier plate fixing unit includes a lower glass sheet 110 and an upper glass sheet 120, and a carrier plate 200 is clamped between the lower glass sheet 110 and the upper glass sheet 120. It is known that there are many Layers of different materials and different functions are stacked, such as multi-chip modules (Multi-Chip Modules, MCM), system-in-package, fan-in level package (FIWLP: Fan-in Level Package) and fan-out level package ( FOWLP: Fan-Out Level Package) and so on, the materials used in such components are quite complex and diverse. When stacked together, warpage will occur due to the different coefficients of thermal expansion (CTE) of the materials of each layer. Therefore, when testing During the process, the surface of the carrier board 200 must be as flat as possible.

Therefore, in order to effectively solve the above-mentioned problems, a strain gauge 121 (please refer to FIG. 2 ) is arranged on the lower surface of the upper glass sheet 120 and the two sides where the carrier plate 200 is warped. Connect the carrier board 200 to obtain a warpage value of the carrier board. Wherein, the strain gauge 121 is mainly made of metal wires, and the strain gauge 121 is like a resistor. When in use, stick the strain gauge 121 on the object under test, and the strain gauge 121 will elongate or shorten along with the object under test, and its resistance value will change accordingly when the strain gauge 121 elongates or shortens, and utilizes the Wheatstone bridge (Wheatstone bridge) to measure the change of the resistance value, the strain can be inversely deduced, and then the warpage value of the carrier board 200 can be deduced.

The principle of warpage measurement is to use the geometric interference between the reference grating on the sample and its shadow to generate a moiré distribution map, and then calculate the relative vertical displacement in the position of each graphic element, which can be applied to Simulate SMT reflow temperature and operating environment conditions while capturing a complete history of warpage displacement behavior.

Stepping motor 140A, stepping motor 140B, stepping motor 140C and stepping motor 140D are arranged respectively at the four corners below the lower glass sheet 110, and four corners above the upper glass sheet 120 are respectively provided with corresponding stepping motors. Screw-in device 130A, screw-in device 130B, screw-in device 130C and screw-in device 130D, screw-in device 130A, screw-in device 130B, screw-in device 130C and screw-in device 130D pass through screw rod 150A, screw rod 150B, screw rod 150C and The screw 150D is displaced downward.

Among them, the screw-in device 130A, the screw-in device 130B, the screw-in device 130C and the screw-in device 130D are electrically connected to the strain gauge 121 to obtain the corresponding warpage value of the carrier plate 200 respectively, and the screw-in device and the stepping motor are vertically aligned. Clamp the upper glass sheet 120 and the lower glass sheet 110, and control the downward displacement rate of the screw-in device according to the warpage value, that is, if the warpage of the corresponding corner of the carrier plate 200 is higher, the screw-in device will The speed of the downward displacement will be faster, otherwise the lower the warpage of the corresponding carrier plate 200 corners, the slower the downward displacement speed of the screw-in device. The main reason is that the upper glass sheet 120 Downward at a horizontal angle, so that the board surface of the carrier board 200 can become gentle (smooth) after adjustment.

In this embodiment, the stepping motor 140A, the stepping motor 140B, the stepping motor 140C and the stepping motor 140D are preferably miniature stepping motors.

The image capture unit includes at least a first image capture device and a second image capture device. The first image capture device is arranged above the upper glass plate 120 and photographs the surface of the carrier plate 200 from top to bottom through the upper glass plate 120. image, the second image capturing device is arranged under the lower glass plate 110 and shoots the image of the carrier plate 200 from bottom to top through the lower glass plate 110,

The first image capture device includes a first CCD image lens 160A, a first bracket 170A and a first slide rail 180A, the first bracket 170A and the first slide rail 180A are vertically arranged, and the first slide rail 180A is for The first CCD imaging lens 160A is displaced in parallel above the upper glass plate 120 to obtain images of the carrier plate 200 at different angles from top to bottom through the upper glass plate 120 .

The second image capture device includes a second CCD image lens 160B, the first bracket 170A and a second slide rail 180B, the first bracket 170A and the second slide rail 180B are vertically arranged, and the second slide rail 180B is for The second CCD imaging lens 160B is placed on the bottom of the lower glass plate 110 Line shifting is performed to obtain images of the carrier 200 at different angles from the bottom-up viewing angle through the lower glass sheet 110 .

To sum up, the present invention utilizes the stepping motor and the screw-in device to fine-tune the warping of the carrier board due to the sequential stacking of materials with different temperature characteristics, so that the board surface of the carrier board can be flattened after adjustment. , when the warpage tends to be flat (flat), thereby effectively avoiding poor soldering quality when bonding to the circuit board through the adhesive technology (SMT), and at the same time reducing the impact on the subsequent reliability test.

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Anyone who is familiar with the similar art, without departing from the spirit and scope of the present invention, the equivalent replacement of changes and modifications is still the scope of the present invention. Scope of patent protection.

110: Lower glass sheet

120: upper glass sheet

121: Strain gauge

130B, 130D: screw-in device

140B, 140D: stepping motor

150B, 150D: screw

200: carrier board

Claims (9)

A carrier inspection device, the carrier inspection device includes an image capture unit and a carrier fixing unit, the carrier fixing unit includes: a carrier clamping unit, including an upper glass sheet and a lower glass sheet, the lower The glass sheet carries a carrier plate, and the upper glass sheet is used to cover the carrier plate, wherein a sensing unit is respectively arranged on both sides of the contact surface between the upper glass sheet and the carrier plate, and the sensing unit is electrically connected The carrier board is used to obtain a warpage value of the carrier board; the stepping motor is arranged at the corner of the carrier board clamping unit; and a screw-in device is electrically connected to the sensing units, and the screw-in device The inner circumference of the device has a helical guide rail and is electrically connected to the stepping motor, and the screw-in device is arranged on the upper surface of the upper glass sheet; wherein, the screw-in device and the stepping motor clamp the carrier up and down clamping unit, and control the rate of downward displacement of the screw-in device according to the warpage value. The substrate inspection device as described in claim 1, wherein the image capture unit further includes a first image capture unit and a second image capture unit. The substrate inspection device according to claim 2, wherein the first image capture unit obtains a first azimuth image of the substrate through the upper glass plate. The substrate inspection device according to claim 2, wherein the first image capture unit is provided with a first sliding rail for moving to obtain images of the substrate from different angles. The substrate inspection device according to claim 2, wherein the second image capture unit obtains a second azimuth image of the substrate through the lower glass plate. The substrate inspection device according to claim 2, wherein the second image capture unit is provided with a second sliding rail for moving to obtain images of the substrate from different angles. The carrier inspection device as claimed in claim 1, wherein the stepping motor is a micro stepping motor. The carrier inspection device according to claim 1, wherein the stepping motors are arranged at least at four peripheral corners of the carrier clamping unit. A carrier plate detection device, comprising: a first image capture unit, a first sliding rail is provided for the displacement of the first image capture unit, so as to obtain a difference in the first orientation of a carrier plate through an upper glass sheet The image of the carrier board at an angle; a second image capture unit is provided with a second slide rail for the displacement of the second image capture unit, so as to obtain the second orientation of the carrier board at a different angle through a glass sheet The carrier plate image; a carrier plate clamping unit, including the upper glass piece and the lower glass piece, the lower glass piece carries the carrier plate, and the upper glass piece is used to cover the carrier plate, wherein the upper glass piece A strain gauge is arranged on both sides of the contact surface with the carrier board, and the strain gauge is electrically connected to the carrier board to obtain a warpage value of the carrier board; at least a stepping motor is arranged on the carrier board to clamp The peripheral angle of the unit; and at least one screw-in device, which is electrically connected to the strain gauges, the inner circumference of the screw-in device has a helical guide rail and is electrically connected to the stepping motor, and the screw-in device is arranged on the upper glass The upper surface of the sheet; wherein, the screw-in device and the stepping motor clamp the carrier board clamping unit up and down, and the rate of downward displacement of the screw-in device is controlled according to the warpage value.

Images