TWI801542B - Electronic device sealing body, sheet adhesive, adhesive film for electronic device sealing, and method for manufacturing electronic device sealing body - Google Patents

Abstract

The present invention is an electronic device sealing body including an electronic device and an adhesive cured layer sealing between an ultraviolet-ray impermeable functional film and the electronic device, and a sheet-shaped sheet that can be used for forming the adhesive cured layer. Adhesive, an adhesive film for sealing electronic devices having an adhesive layer composed of the aforementioned functional film and a sheet-like adhesive, and a method for producing a sealed body of electronic devices.

Description

Electronic device sealing body, sheet-like adhesive, adhesive film for electronic device sealing, and manufacturing method of electronic device sealing body

The present invention relates to an electronic device sealing body including an electronic device and an adhesive hardened layer sealing between an ultraviolet-ray impermeable functional film and the electronic device, and a sheet-like adhesive used for forming the aforementioned adhesive hardened layer. An adhesive, an adhesive film for sealing an electronic device having an adhesive layer composed of the aforementioned functional film and a sheet-like adhesive, and a method for manufacturing a sealed body of an electronic device.

As a sealing adhesive for sealing electronic devices such as organic EL elements, there are thermosetting adhesives. However, when a thermosetting adhesive is cured after sealing the device, there is a possibility of damage to the device due to heat. On the other hand, there is a problem that the so-called initial pressure-sensitive adhesiveness will be lost when it is hardened before being bonded to an electronic device. On the other hand, if it is an active energy ray-curable adhesive such as ultraviolet rays, even when it is bonded to an electronic device and then cured, it will cause little damage to electronic devices such as organic EL elements.

Patent Document 1 describes an adhesive agent for sealing an electronic device containing a compound having a cyclic ether group and a photocationic polymerization initiator. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese National Publication No. 2014-534309 (International Publication No. 2013/057265)

In Patent Document 1, it is described that "the pressure-sensitive adhesive is preferably partially or finally cross-linked for the first time after application to electronic devices" [paragraph (0066)]. Furthermore, the cationic UV curing used for such crosslinking, for example, is carried out on the premise that an adhesive for sealing is mounted on a material through which UV light can pass, such as a PET liner or glass. By.

The object of the present invention is to provide an adhesive hardened layer that seals between the functional film and an electronic device on the premise that the member to which the sealing adhesive is attached is a functional film that does not transmit ultraviolet rays. Sealed electronic device, sheet adhesive that is a material for forming the cured adhesive layer, adhesive film for electronic device sealing having an adhesive layer composed of the aforementioned functional film and sheet adhesive, and sealed electronic device manufacturing method.

Adhesives containing a compound having a cyclic ether group and a photocationic polymerization initiator will remain tacky on the surface of the adhesive even after being irradiated with ultraviolet rays. Therefore, a sheet-like adhesive composed of such an adhesive can be attached to an electronic device even after being irradiated with ultraviolet rays. Moreover, this kind of sheet-like adhesive agent, after ultraviolet irradiation, the adhesive agent layer is cured over time, and finally it is possible to efficiently obtain )/(electronic device) layer structure excellent in durability of the electronic device sealing body.

Thus, according to the present invention, there are provided electronic device sealing bodies of the following [1] to [4], sheet adhesives of [5], adhesive films for electronic device sealing of [6] and [7], [8], The method of manufacturing the electronic device sealing body of [9].

[1] A sealed body of an electronic device, comprising: a functional film having a transmittance of 60% or less of ultraviolet light having a wavelength of 365 nm, an electronic device, and an adhesive curing agent for sealing between the functional film and the electronic device As for the material layer, the aforementioned hardened adhesive layer is a cured product of a sheet-like adhesive including the following (A) component and (B) component. (A) A compound having a cyclic ether group (B) Photocationic polymerization initiator [2] A sheet-like adhesive comprising the following (A) component and (B) component, and capable of It is used in the manufacture of the sealing body of the electronic device as described in item 1 of the scope of the patent application. (A) Compound having a cyclic ether group (B) Photocationic polymerization initiator [3] The sheet-shaped adhesive described in [2], wherein the sheet-shaped adhesive has a release film on at least one surface , the adhesive force to the soda-lime glass plate measured by the following condition (i) is 3N/25mm or more. (i) Fabricate a laminate in which a polyethylene terephthalate film with a thickness of 23 μm on which aluminum has been vapor-deposited is attached to the surface of the sheet-like adhesive opposite to the side to which the release film is attached. In the state where the release film is pasted, ultraviolet rays with a wavelength of 365 nm are irradiated to the laminate from the release film side under the conditions of illuminance: 50 mW/cm ² and light intensity: 200 mJ/cm ² , and after 3 minutes, the Peel off the above-mentioned release film from the laminate, and make the layer of the exposed sheet-like adhesive face the soda-lime glass plate. On the above-mentioned laminated body, make a 2 kg roller go back and forth once, thereby sticking to the soda-lime glass plate. ℃ and 50% relative humidity environment for 24 hours, the implementation of 180 ° pull peel test. [4] The sheet-like adhesive according to [2] or [3], further comprising one or more species selected from the group consisting of modified polyolefin resins and phenoxy resins.

[5] An adhesive film for sealing electronic devices, comprising a functional film having a transmittance of 60% or less of ultraviolet rays having a wavelength of 365 nm, and a sheet-like adhesive comprising the following components (A) and (B) adhesive layer. (A) Compounds having a cyclic ether group (B) Photocationic polymerization initiator

[6] The adhesive film for sealing electronic devices according to [5], wherein the adhesive film for sealing electronic devices has a release film on the surface of the adhesive layer on the side where the functional film is not bonded, and the following conditions are used: (ii) The measured adhesive force to the soda-lime glass plate is 3N/25mm or more.

(ii) In the state where the release film is attached to the adhesive film for sealing electronic devices, irradiate ultraviolet rays with a wavelength of 365 nm from the side of the release film under the conditions of illuminance: 50 mW/cm ² and light intensity: 200 mJ/cm ² , After 3 minutes, the aforementioned release film was peeled off from the aforementioned adhesive film for sealing electronic devices, so that the exposed adhesive layer faced the soda-lime glass plate, and a roller of 2 kg was placed on the adhesive film for sealing electronic devices. Back-and-forth, it is attached to a soda-lime glass plate, and after storage for 24 hours in an environment of 23°C and 50% relative humidity, a 180° pull peel test is performed.

[7] The adhesive film for sealing an electronic device according to [5] or [6], wherein the sheet-shaped adhesive further contains one or more species selected from the group consisting of modified polyolefin resins and phenoxy resins.

[8] A method of manufacturing a sealed body of an electronic device, comprising (α1) an adhesive film for sealing an electronic device in any one of the above-mentioned [5] to [7], from a surface closer to the adhesive layer than to the functional film The step of side irradiating ultraviolet rays; and (β1) the step of attaching the aforementioned adhesive film to the electronic device, compared with the step (β1), the step (α1) is performed first.

[9] A method of manufacturing a sealed body of an electronic device, comprising (α2) a step of irradiating ultraviolet rays to a sheet-shaped adhesive comprising the following (A) component and (B) component; In the step of attaching the agent to the functional film or electronic device whose transmittance of ultraviolet light with a wavelength of 365nm is 60% or less, the step (α2) is performed before the step (β2).

(A) Compounds having a cyclic ether group

(B) Photocationic polymerization initiator

According to the present invention, it is possible to obtain a sealed body of a device that adheres strongly to a functional film that is non-permeable to ultraviolet rays or an electronic device that is an adherend without causing sticking or sticking even after ultraviolet rays are irradiated. After peeling, and the adhesive layer will harden over time, the ultimate durability is excellent.

[Mode for Carrying Out the Invention]

Hereinafter, the present invention will be described in detail by dividing the present invention into 1) electronic device sealing body, 2) sheet adhesive, 3) electronic device sealing adhesive film, and 4) manufacturing method of electronic device sealing body.

1) Electronic device sealing body

The electronic device sealing body of the present invention includes a functional film having a transmittance of 60% or less of ultraviolet light having a wavelength of 365 nm, an electronic device, and an adhesive cured layer for sealing between the functional film and the electronic device, the adhesive The cured product layer is characterized by being a cured product of a sheet-like adhesive (hereinafter, sometimes referred to as "the sheet-like adhesive of the present invention") containing the following (A) component and (B) component.

(A) Compounds having a cyclic ether group

(B) Photocationic polymerization initiator

An example of the layer configuration of the electronic device sealing body of the present invention is shown in FIG. 1 . The electronic device sealing body 10 shown in FIG. 1 has the surface covering the electronic device 3, the electronic device 3 and the hardened adhesive layer 2 are stacked in a manner facing each other, and the transmittance of ultraviolet rays with a wavelength of 365 nm is 60. % or less of the functional film 1 is arranged in the outermost layer structure.

In the electronic device sealing body of the present invention, as the electronic device to be sealed, for example, organic EL elements such as organic EL displays and organic EL lighting; liquid crystal elements such as liquid crystal displays; electronic paper; solar cell elements such as organic thin film solar cells ; Light-emitting diodes, etc.

〔Functional film〕 The functional film 1 constituting the sealing body of the electronic device of the present invention is a film having a transmittance of 60% or less for ultraviolet rays with a wavelength of 365 nm. From the standpoint of obtaining the effect of the present invention more remarkably, the transmittance of ultraviolet light having a wavelength of 365 nm of the functional film is preferably 55% or less, more preferably 50% or less.

The transmittance of ultraviolet rays with a wavelength of 365 nm of the functional film can be measured by the method described in the examples.

The functional film 1 used in the present invention is not particularly limited as long as it is a film having a transmittance of 60% or less of ultraviolet rays with a wavelength of 365 nm and having a certain function. Examples include conductive layers, gas barrier films, antireflection films, retardation films, viewing angle enhancement films, brightness enhancement films, etc., which have a UV transmittance of 60% or less at a wavelength of 365 nm. Among these, for example, a gas barrier film includes a film having a metal or an inorganic compound film, and a film having a metal film is preferable. Usable metals include aluminum, zinc, copper, and the like, and among these, aluminum is preferable. The thickness of the functional film used in the present invention is not particularly limited, but is usually 5-200 μm, preferably 10-100 μm.

In the case of a functional film having a UV transmittance of 60% or less at a wavelength of 365nm, even if ultraviolet rays are irradiated from the functional film side after the sheet adhesive is bonded to the electronic device, the ultraviolet rays reach the sheet adhesive The amount is also small, and the sheet adhesive cannot be hardened. As will be described later, the sheet adhesive of the present invention is cured by photocationic polymerization. Compared with free radical polymerization, etc., the reaction speed of photocationic polymerization is relatively slow. Therefore, even if the sheet-like adhesive is irradiated with ultraviolet rays, the hardening reaction is still in progress. The sheet-like adhesive has sufficient adhesiveness, so it can be strongly adhered to the electronic device that is the adherend, and sticking can be prevented. Peel off during or after attachment. In addition, the adhesive layer hardens over time, and finally a sealed body of an electronic device having excellent durability can be obtained.

[Adhesive hardened layer]

The cured adhesive layer 2 of the electronic device sealing body of the present invention is composed of the cured sheet adhesive of the present invention, and plays a role of sealing the electronic device and bonding the electronic device and the functional film.

(sheet adhesive)

The sheet-like adhesive agent of this invention is an adhesive sheet-like thing containing the following (A) component and (B) component.

(A) Compounds having a cyclic ether group

(B) Photocationic polymerization initiator

The so-called sheet adhesive refers to an adhesive formed into a sheet that exhibits no fluidity at room temperature (around 25°C). In the present invention, the sheet-shaped adhesive may be book-shaped or strip-shaped (tape-shaped).

[(A) component: compound having a cyclic ether group]

The sheet-like adhesive agent of this invention contains the compound which has a cyclic ether group as (A) component.

By using a compound having a cyclic ether group, it is possible to obtain a cured product of the sheet adhesive having excellent curability and water vapor barrier properties of the sheet adhesive.

Examples of the cyclic ether group include an oxiranyl group (epoxy group), an oxetane group (oxetanyl group), a tetrahydrofuryl group, and a tetrahydropyranyl group.

The compound having a cyclic ether group refers to a compound having at least one cyclic ether group in the molecule. Among them, compounds having an oxirane group or a propylene oxide group are preferable, and compounds having two or more rings in the molecule are particularly preferable from the viewpoint of obtaining a cured product of an adhesive having superior adhesive strength. Compounds of oxyethylene or propylene oxide.

Examples of the compound having an oxiranyl group in the molecule include aliphatic epoxides (excluding alicyclic epoxides), aromatic epoxides, and alicyclic epoxides. Examples of aliphatic epoxides include monofunctional epoxides such as glycidyl ethers of aliphatic alcohols and glycidyl esters of alkyl carboxylic acids; Aliphatic polyalcohols, polyglycidyl ether compounds of adducts of aliphatic polyalcohols or alkylene oxides, polyglycidyl esters of aliphatic long-chain polybasic acids, and epoxides with a three-skeleton skeleton, etc. oxide.

Representative compounds of such aliphatic epoxides include allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C12-13 mixed alkyl Glycidyl Ether, 1,4-Butanediol Diglycidyl Ether, Neopentyl Glycol Diglycidyl Ether, Triglycidyl Ether of Glycerin, Triglycidyl Ether of Trimethylolpropane Diglycidyl ether, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipenteopentylthritol, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, bicyclic Glycidyl ethers of polyhydric alcohols such as pentadiene dimethanol diglycidyl ether, and alkylene oxides by adding one or more than two kinds of aliphatic polyhydric alcohols such as propylene glycol, trimethylolpropane, and glycerin The obtained polyglycidyl ether compound of polyether polyol, the diglycidyl ester of aliphatic long-chain dibasic acid; Monoglycidyl ether of aliphatic higher alcohol or glycidyl ester of higher fatty acid, epoxidized soybean oil, epoxy octyl stearate, epoxy butyl stearate, epoxidized polybutadiene; 2,4,6-tris(glycidyloxy)-1,3,5-trisalpine, etc.

Moreover, a commercial item can also be used as an aliphatic epoxy oxide. Examples of commercially available products include Denacol EX-121, Denacol EX-171, Denacol EX-192, Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX -411, Denacol EX-421, Denacol EX-512, Denacol EX-521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX -850, Denacol EX-851, Denacol EX-821, Denacol EX-830, Denacol EX-832, Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX -931 (above, manufactured by Nagase ChemteX); Epolight M-1230, Epolight 40E, Epolight 100E, Epolight 200E, Epolight 400E, Epolight 70P, Epolight 200P, Epolight 400P, Epolight 1500NP, Epolight 1600, Epolight 80MF, Epolight 100MF (manufactured by Gongrong Chemical Co., Ltd.); ADEKA GLYCIROL ED-503, ADEKA GLYCIROL ED-503G, ADEKA GLYCIROL ED-506, ADEKA GLYCIROL ED-523T, ADEKA RESIN EP-4088S, ADEKA RESIN EP-4088L, ADEKA RESIN EP-4080E (Above, ADEKA RESIN EP-4080E KA company system); TEPIC-FL, TEPIC-PAS, TEPIC-UC (above, manufactured by Nissan Chemical Co., Ltd.), etc.

Examples of aromatic epoxides include polyphenols having at least one aromatic ring such as phenol, cresol, and butylphenol, and mono/polyglycidyl etherified products of alkylene oxide adducts thereof. As representative compounds of these aromatic epoxides, bisphenol A, bisphenol F, or glycidyl ether compounds of these compounds further added with alkylene oxide, epoxy novolac resin, etc.; Mono/polyglycidyl ether compounds of aromatic compounds having two or more phenolic hydroxyl groups, such as resorcinol, hydroquinone, catechol, etc.; Glycidyl ethers of aromatic compounds having two or more alcoholic hydroxyl groups such as benzenedimethanol or benzenediethyl alcohol or benzenedibutanol; Glycidyl ester of phthalic acid, terephthalic acid, trimellitic acid and other polyacid aromatic compounds with two or more carboxylic acids, glycidyl ester of benzoic acid, styrene oxide or di Epoxides of vinylbenzene, etc.

Moreover, a commercial item can also be used as an aromatic epoxide. Examples of commercially available products include Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, On Court EX-1020, On Court EX-1030, on Court EX-1040, on Court EX-1050, on Court EX-1051, on Court EX-1010, on Court EX-1011, on Court 1012 (above, manufactured by Nagase ChemteX); OGSOL PG-100, OGSOL EG-200, OGSOL EG-210, OGSOL EG-250 (above, manufactured by Osaka Gas Chemicals); HP4032, HP4032D, HP4700 (above, manufactured by DIC); ESN-475V (above, manufactured by Nippon Steel & Sumikin Chemical Co.); JER (formerly known as Epikote) YX8800 (manufactured by Mitsubishi Chemical Corporation); Marr proof G-0105SA, Marr proof G-0130SP (above, manufactured by NOF Corporation); EPICLON N-665, EPICLON HP-7200 (above, manufactured by DIC); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (manufactured by Nippon Kayaku Corporation); ADEKA RESIN EP-4000, ADEKA RESIN EP-4005, ADEKA RESIN EP-4100, ADEKA RESIN EP-4901 (above, made by ADEKA); TECHMORE VG-3101L (above, manufactured by Printec), etc.

Examples of cycloaliphatic epoxides include polyglycidyl ether compounds of polyhydric alcohols having at least one alicyclic structure, or compounds containing cyclohexene and cyclopentene rings by epoxidizing them with an oxidizing agent. Cycloalkylene oxide compounds such as compounds containing cyclohexene oxide and cyclopentene oxide are obtained. Representative compounds of such cycloaliphatic epoxides include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane Carboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclo Hexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methyl Cyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, bis(3,4- Epoxycyclohexylmethyl) adipic acid, 3,4-epoxy-6-methylcyclohexanecarboxylate, methylenebis(3,4-epoxycyclohexane), propane- 2,2-diyl-bis(3,4-epoxycyclohexane), 2,2-bis(3,4-epoxycyclohexyl)propane, dicyclopentadiene diepoxide, Ethyl bis(3,4-epoxycyclohexanecarboxylate), Dioctyl epoxy hexahydrophthalate, Di-2-ethylhexyl epoxy hexahydrophthalate, 1- Epoxyethyl-3,4-epoxyethylcyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, α-pinene oxide, limonene dioxide substances (limonene dioxide) and so on.

Moreover, a commercial item can be used as an alicyclic epoxy oxide. As a commercial item, YX 8000 (made by Mitsubishi Chemical Corporation), CELLOXIDE 2021 P, CELLOXIDE 2081, CELLOXIDE 2000, CELLOXIDE 3000 (made by Daicel Corporation), etc. are mentioned.

Examples of compounds having a propylene oxide group in the molecule include 3,7-bis(3-epoxypropylene)-5-oxo-nonane, 1,4-bis[(3-ethyl-3 -Oxypropylenemethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-epoxypropylenemethoxy)methyl]ethane, 1,3-bis[(3 -Ethyl-3-epoxypropylenemethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-epoxypropylenemethyl)ether, triethylene glycol bis(3-ethyl -3-epoxypropylene methyl) ether, tetraethylene glycol bis (3-ethyl-3-epoxypropylene methyl) ether, 1,4-bis (3-ethyl-3-epoxypropylene Difunctional aliphatic propylene oxide compounds such as methoxy)butane, 1,6-bis(3-ethyl-3-epoxypropylenemethoxy)hexane, 3-ethyl-3-[( phenoxy)methyl]propylene oxide, 3-ethyl-3-(hexyloxymethyl)propylene oxide, 3-ethyl-3-(2-ethylhexyloxymethyl)propylene oxide , 3-ethyl-3-(hydroxymethyl)propylene oxide, 3-ethyl-3-(chloromethyl)propylene oxide and other monofunctional propylene oxide compounds, etc.

A commercial item can also be used as a compound which has a propylene oxide group in a molecule|numerator. Examples of commercially available products include 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, and 4-hydroxybutyl vinyl ether (manufactured by Maruzen Petrochemical Co., Ltd. above); ARON OXETANE OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (above, manufactured by Toagosei Co.); ETERNACOLL OXBP, OXTP (above, manufactured by Ube Industries, Ltd.), etc.

Among these, compounds that are liquid at 25°C are preferable from the viewpoint of obtaining a cured product of an adhesive agent with superior sheet processability (film-forming property) and an adhesive agent with superior adhesive strength. . Furthermore, it is preferable that the cyclic ether group is an oxirane group. Among the compounds (epoxides) whose cyclic ether group is an oxiranyl group, alicyclic epoxides are preferred from the viewpoint of adjusting the characteristics of the cured product of the adhesive and preventing coloring. From the viewpoint of improving the reactivity of cationic polymerization, cycloalkylene oxide compounds are preferred.

Also, from the viewpoint of improving the hardening properties of the sheet adhesive, those having two or more cyclic ether groups in the molecule, such as polyfunctional epoxy compounds and difunctional aliphatic propylene oxide compounds, are preferred. compound.

The molecular weight of the compound having a cyclic ether group is usually 100 to 5,000, preferably 200 to 4,000. The cyclic ether equivalent of the compound having a cyclic ether group is preferably from 100 g/eq to 500 g/eq, more preferably from 115 g/eq to 300 g/eq. When the cyclic ether equivalent of the compound having a cyclic ether group contained in the sheet-shaped adhesive agent is within the above-mentioned range, a sealing material having strong adhesive strength and excellent curability can be efficiently obtained. The compound which has these cyclic ether groups can be used individually by 1 type or in combination of 2 or more types. The cyclic ether equivalent in the present invention means the value obtained by dividing the molecular weight by the number of cyclic ether groups.

When the sheet adhesive of the present invention contains the binder resin described later, the content of the compound having a cyclic ether group is preferably 20 to 180 parts by mass, more preferably 40 to 140 parts by mass, based on 100 parts by mass of the binder resin. . By making content of the compound which has a cyclic ether group into the said range, it becomes easy to obtain the hardened|cured material of the adhesive agent layer which is more excellent in adhesive strength.

The content of the above-mentioned (A) component in the sheet adhesive of the present invention is preferably 20 to 80% by mass as a solid content (non-volatile components, including liquid ones. The same applies below.) with respect to the entire adhesive, More preferably, it is 25-70 mass %, and it is especially preferable that it is 30-65 mass %. When content of the said (A) component of the sheet-shaped adhesive agent of this invention exists in the said range, it becomes easy to adjust the adhesive force of the sheet-shaped adhesive agent after ultraviolet irradiation.

[(B) Component: Photocationic polymerization initiator] The sheet-like adhesive agent of this invention contains a photocationic polymerization initiator as (B) component. Thereby, it becomes easy to adjust the adhesive force of the sheet|seat adhesive agent after ultraviolet-ray irradiation. The photocationic polymerization initiator is a compound that generates cationic species by irradiating active energy rays to start the hardening reaction of the cation-curable compound, and consists of a cationic part that absorbs active energy rays and an anionic part that becomes a source of acid generation.

鹽(oxonium)系化合物、溴鹽系化合物等。此等之中，由所謂與（A）成分的相容性優異、所得之接著劑的儲存穩定性優異之觀點而言，較佳為鋶鹽系化合物，更佳為具有芳香族基的芳香族鋶鹽系化合物。As the photocationic polymerization initiator, for example, a perulium salt-based compound, an iodonium salt-based compound, a phosphonium salt-based compound, an ammonium salt-based compound, an antimonate-based compound, a diazonium salt-based compound, a selenium salt-based compound,

Salt (oxonium)-based compounds, bromide-based compounds, etc. Among these, from the standpoint of excellent compatibility with component (A) and excellent storage stability of the resulting adhesive, preferred are cobalt salt-based compounds, and more preferred are aromatic compounds having an aromatic group. Calcite salt compounds.

六氟磷酸鹽、7-[二（p-甲苯甲醯基）二氫硫基]-2-異丙基9-氧硫𠮿

六氟銻酸鹽、7-[二（p-甲苯甲醯基）二氫硫基]-2-異丙基肆（五氟苯基）硼酸鹽、苯基羰基-4’-二苯基二氫硫基-二苯基硫醚-六氟磷酸鹽、苯基羰基-4’-二苯基二氫硫基-二苯基硫醚-六氟銻酸鹽、4-三級丁基苯基羰基-4’-二苯基二氫硫基-二苯基硫醚-六氟磷酸鹽、4-三級丁基苯基羰基-4’-二苯基二氫硫基-二苯基硫醚-六氟銻酸鹽、4-三級丁基苯基羰基-4’-二苯基二氫硫基-二苯基硫醚-肆（五氟苯基）硼酸鹽、硫代苯基二苯基鋶六氟銻酸鹽、硫代苯基二苯基鋶六氟磷酸鹽、4-[4-（2-氯苯甲醯基）苯硫基]苯基雙（4-氟苯基）鋶六氟銻酸鹽、硫代苯基二苯基鋶六氟銻酸鹽的鹵化物、4,4’,4’’-三（β-羥基乙氧基苯基）鋶六氟銻酸鹽、4,4’-雙[二苯基二氫硫基]二苯基硫醚-雙六氟銻酸鹽、二苯基[4-（苯硫基）苯基]鋶三氟參五氟乙基磷酸鹽、參[4-（4-乙醯基苯基氫硫基）苯基]鋶參[（三氟甲基）磺醯基]甲烷化物等。Examples of columium salt-based compounds include triphenylcolumbitium hexafluorophosphate, triphenylcolumbitium hexafluoroantimonate, triphenylcolumbita (pentafluorophenyl) borate, 4,4'-bis[bis Phenyldiphenylsulfonio]diphenylsulfide-bishexafluorophosphate, 4,4'-bis[bis(β-hydroxyethoxy)phenyldiphenylsulfonio]diphenylsulfide -Bishexafluoroantimonate, 7-[bis(p-tolylyl)dihydromercapto]-2-isopropyl 9-oxothiol

Hexafluorophosphate, 7-[di(p-cresyl)dihydromercapto]-2-isopropyl 9-oxothiol

Hexafluoroantimonate, 7-[bis(p-toluyl)dihydromercapto]-2-isopropylsi(pentafluorophenyl)borate, phenylcarbonyl-4'-diphenylbis Mercapto-diphenylsulfide-hexafluorophosphate, phenylcarbonyl-4'-diphenyldihydromercapto-diphenylsulfide-hexafluoroantimonate, 4-tertiary butylphenyl Carbonyl-4'-diphenylthiol-diphenylsulfide-hexafluorophosphate, 4-tertiary butylphenylcarbonyl-4'-diphenylsulfhydryl-diphenylsulfide - Hexafluoroantimonate, 4-tertiary butylphenylcarbonyl-4'-diphenyldihydrogenthio-diphenylsulfide-tetra(pentafluorophenyl) borate, thiophenyldiphenyl Alkyl hexafluoroantimonate, Thiophenyl diphenyl perfluorophosphate, 4-[4-(2-Chlorobenzoyl)phenylthio]phenyl bis(4-fluorophenyl) abalone Hexafluoroantimonate, halides of thiophenyldiphenyl percite hexafluoroantimonate, 4,4',4''-tris(β-hydroxyethoxyphenyl) percite hexafluoroantimonate, 4,4'-Bis[diphenyldihydrosulfenyl]diphenylsulfide-bishexafluoroantimonate, diphenyl[4-(phenylthio)phenyl]permetrifluoropentafluoroethyl Phosphate, ginseng[4-(4-acetylphenylsulfanyl)phenyl]acyl[(trifluoromethyl)sulfonyl]methanate, etc.

基）錪鎓肆（五氟苯基）硼酸鹽等。Examples of iodonium salt-based compounds include diphenyliodonium tetrakis(pentafluorophenyl)borate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluoroantimonate, 4-nonylphenyl)iodonium hexafluorophosphate, (three

base) oxonium tetra(pentafluorophenyl) borate, etc.

Examples of the phosphonium salt-based compound include tri-n-butyl(2,5-dihydroxyphenyl)phosphonium bromide, hexadecyltributylphosphonium chloride, and the like.

Examples of the ammonium salt-based compound include benzyltrimethylammonium chloride, phenyltributylammonium chloride, benzyltrimethylammonium bromide, and the like.

Examples of the antimonate-based compounds include triphenylpercited hexafluoroantimonate, p-(phenylthio)phenyldiphenylcuredium hexafluoroantimonate, 4-chlorophenyldiphenylcuredium hexafluoroantimonate, Fluoroantimonate, bis[4-(diphenyldihydrothio)phenyl]sulfide bishexafluoroantimonate and diallyliumium hexafluoroantimonate, etc.

These photocationic polymerization initiators can be used individually by 1 type or in combination of 2 or more types.

Moreover, a commercial item can be used as a photocationic polymerization initiator. Commercially available products include Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, Cyracure UVI-950 (the above, manufactured by Union Carbide), Irgacure 250, Irgacure 261, Irgacure 264 (the above, Ciba Specialty Chemicals Company), SP-150, SP-151, SP-170, OPTMER SP-171 (above, ADEKA), CG-24-61 (Ciba Specialty Chemicals), DAICAT II (Daicel), UVAC1590 , UVAC1591 (above, manufactured by DAICEL-CYTEC), CI-2064, CI-2639, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, CIT-1682 (above, Nippon Soda Corporation), PI-2074 (Rodia Corporation), FFC509 (3M Corporation), BBI-102, BBI-101, BBI-103, MPI-103, TPS-103, MDS-103, DTS-103, NAT-103, NDS-103 (above, manufactured by Midori Kagaku Co., Ltd.), CD-1010, CD-1011, CD-1012 (made by Sartomer), CPI-100P, CPI-101A, CPI-200K, CPI -310B (above, manufactured by San-Apro), etc.

Content of a photocationic polymerization initiator is 0.1-10 mass parts normally with respect to 100 mass parts of said (A) components, Preferably it is 0.3-8 mass parts, More preferably, it is 0.5-4.5 mass parts.

By making content of a photocationic polymerization initiator into the said range, it becomes easy to adjust the adhesive force of the sheet-shaped adhesive agent after ultraviolet-ray irradiation.

The sheet adhesive of the present invention may contain components other than the aforementioned (A) component and (B) component. As components other than said (A) component and (B) component, a binder resin, a tackifier, a silane coupling agent, etc. are mentioned.

〔Binder resin〕

When the sheet adhesive of the present invention contains a binder resin, excellent sheet processability (film-forming properties) is imparted to the composition for forming the sheet adhesive, and a sheet of desired thickness can be formed efficiently Adhesive.

The binder resin is preferably one or two or more selected from modified polyolefin resins and phenoxy resins from the viewpoint of excellent compatibility with the (A) component.

In the case of using a modified polyolefin-based resin, the polyolefin as the main ingredient becomes able to enter a hardened structure, but maintains low moisture permeability. In addition, when a phenoxy resin is used, it is preferable because the elastic modulus of the cured product of the sheet-like adhesive can be kept high, and the reliability of the electronic device sealing body in a high-temperature environment is improved.

When the sheet adhesive of the present invention contains a binder resin, the content thereof is preferably 30 to 80% by mass, more preferably 40 to 70% by mass, based on the entire sheet adhesive.

By containing the binder resin in such a range, excellent sheet processability (film-forming properties) can be imparted to the composition for forming a sheet-like adhesive, and a sheet-like adhesive with a desired thickness can be efficiently formed.

(modified polyolefin resin) The modified polyolefin resin is a functional group-introduced polyolefin resin obtained by subjecting a polyolefin resin as a precursor to a modification treatment using a modification agent.

The term "polyolefin resin" refers to a polymer comprising repeating units derived from olefin-based monomers. Polyolefin resins can be polymers composed of only one or more repeating units derived from olefinic monomers, or can be composed of repeating units derived from olefinic monomers, and polymers derived from energy and olefinic monomers A polymer composed of repeating units of other monomers that have been copolymerized.

The olefin-based monomer is preferably an α-olefin having 2 to 8 carbon atoms, more preferably ethylene, propylene, 1-butene, isobutene, or 1-hexene, and still more preferably ethylene or propylene. Vinyl acetate, (meth)acrylate, styrene, etc. are mentioned as another monomer copolymerizable with an olefin type monomer. Here, "(meth)acrylic acid" means acrylic acid or methacrylic acid (the same applies hereinafter).

Examples of polyolefin resins include ultra-low-density polyethylene (VLDPE), low-density polyethylene (LDPE), medium-density polyethylene (MDPE), high-density polyethylene (HDPE), and linear low-density polyethylene (LLDPE). ), polypropylene (PP), ethylene-propylene copolymer, olefin-based elastomer (TPO), ethylene-vinyl acetate copolymer (EVA), ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylate Copolymer etc.

The modifying agent used in the modifying treatment of polyolefin resin is a compound having a functional group in the molecule. Examples of functional groups include carboxyl group, carboxylic acid anhydride group, carboxylate group, hydroxyl group, epoxy group, amide group, ammonium group, nitrile group, amine group, imide group, isocyanate group, acetyl group, mercapto group , ether group, thioether group, pylori group, phosphonoyl group, nitro group, carbamate group, alkoxy silicon group, silanol group, halogen atom, etc. Among them, carboxyl group, carboxylic anhydride group, carboxylate group, hydroxyl group, ammonium group, amine group, imide group, isocyanate group, alkoxysilyl group are preferred, and carboxylic anhydride group and alkoxy group are more preferred. Silicon group, particularly preferably carboxylic acid anhydride group. A compound having a functional group may have two or more kinds of functional groups in the molecule.

Examples of modified polyolefin resins include acid-modified polyolefin resins and silane-modified polyolefin resins, and acid-modified polyolefin resins are preferred from the viewpoint of obtaining the more excellent effects of the present invention. resin.

The so-called acid-modified polyolefin-based resins refer to polyolefin resins that have been modified by grafting with acids or acid anhydrides. For example, a polyolefin resin is reacted with an unsaturated carboxylic acid or an unsaturated carboxylic acid anhydride to introduce a carboxyl group or an acid anhydride group (graft modification).

Examples of unsaturated carboxylic acids that react polyolefin resins include maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaconic acid, and tetrahydrophthalic acid. Formic acid, aconitic acid, etc., as unsaturated carboxylic acid anhydrides, maleic anhydride, itaconic anhydride, glutaconic anhydride, citraconic anhydride, aconitic anhydride, norbornene dicarboxylic anhydride, tetrahydrophthalic anhydride, anhydride, etc. These can be used individually by 1 type or in combination of 2 or more types. Among them, maleic anhydride is preferable because it is easy to obtain an adhesive agent having better sheet processability (film forming property) and a cured product of the sheet-shaped adhesive agent having better adhesive strength.

The amount of the unsaturated carboxylic acid or unsaturated carboxylic acid anhydride that reacts the polyolefin resin is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 3 parts by mass, and even more preferably 0.2 to 3 parts by mass relative to 100 parts by mass of the polyolefin resin. 1 part by mass. The thus-obtained sheet-like adhesive containing the acid-modified polyolefin-based resin can easily obtain a cured product with better adhesive strength.

As the acid-modified polyolefin-based resin, a commercially available item can be used. Examples of commercially available products include ADMER (registered trademark) (manufactured by Mitsui Chemicals), UNISTOLE (registered trademark) (manufactured by Mitsui Chemicals), Bondy Ram (manufactured by Polyram), and orevac (registered trademark) (manufactured by ARKEMA). , MODIC (registered trademark) (manufactured by Mitsubishi Chemical Corporation), etc.

The so-called silane-modified polyolefin-based resins refer to polyolefin resins that have been grafted and modified with unsaturated silane compounds. The silane-modified polyolefin resin has the structure of unsaturated silane compounds grafted and copolymerized into the main chain polyolefin resin as side chains. Examples include silane-modified polyethylene resins and silane-modified ethylene-vinyl acetate copolymers, preferably silane-modified low-density polyethylene, silane-modified ultra-low-density polyethylene, and silane-modified linear low-density polyethylene. Silane modified polyethylene resin such as ethylene.

As an unsaturated silane compound which reacts the said polyolefin resin, a vinyl silane compound is preferable. Examples of vinylsilane compounds include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, vinyltributoxysilane, vinyl Vinyltripentoxysilane, Vinyltriphenoxysilane, Vinyltribenzyloxysilane, Vinyltrimethylenedioxysilane, Vinyltriethylenedioxysilane, Vinylacryloxysilane , Vinyltriacetyloxysilane, vinyltricarboxysilane, etc. These can be used individually by 1 type or in combination of 2 or more types. In addition, the conditions in the case of graft-polymerizing the unsaturated silane compound and the polyolefin resin of the main chain may be a known general method for graft polymerization.

The amount of the unsaturated silane compound to react the polyolefin resin is preferably 0.1 to 10 parts by mass, more preferably 0.3 to 7 parts by mass, and still more preferably 0.5 to 5 parts by mass relative to 100 parts by mass of the polyolefin resin. Sheet-like adhesives containing silane-modified polyolefin-based resins make it easier to obtain cured products with better adhesive strength.

As the silane-modified polyolefin-based resin, a commercially available item can be used. As a commercial item, Linklon (registered trademark) (made by Mitsubishi Chemical Corporation) etc. are mentioned, for example. Among them, Linklon of low-density polyethylene system, Linklon of linear low-density polyethylene system, Linklon of ultra-low-density polyethylene system, and Linklon of ethylene-vinyl acetate copolymer system can be preferably used.

Modified polyolefin resin can be used individually by 1 type or in combination of 2 or more types.

The weight average molecular weight (Mw) of the modified polyolefin resin is preferably from 10,000 to 300,000, more preferably from 20,000 to 150,000. When the weight-average molecular weight (Mw) of the modified polyolefin-based resin is within such a range, excellent film-forming properties are imparted to the composition for forming a sheet-like adhesive, and its characteristics are easily adjusted. The weight-average molecular weight (Mw) of the modified polyolefin-based resin can be obtained in terms of standard polystyrene by performing gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent.

(phenoxy resin) Phenoxy resin is a polymer whose main chain is the addition polymerization structure of aromatic diol and aromatic di-glycidyl ether. The phenoxy resins include bisphenol A phenoxy resin, bisphenol F phenoxy resin, bisphenol A-bisphenol F phenoxy resin, bisphenol E Type phenoxy resin, etc. Phenoxy resins can be obtained by reacting bisphenol or biphenol compounds with epihalohydrin such as epichlorohydrin, or by reacting bisphenol or biphenol compounds with liquid epoxy resins.

A commercial item can be used as a phenoxy resin. Examples of commercially available products include, trade names: PKHC, PKHH, and PKHJ (all manufactured by Pakistan Chemical Co., Ltd.), trade names: Epikote 4250, Epikote 1255HX30, and Epikote 5580BPX40 (all manufactured by Nippon Kayaku Co., Ltd.), trade names: YP-50, YP50S, YP-55, YP-70 (all manufactured by Tohto Kasei Corporation), trade names: JER 1256, 4250, YX6954BH30, YX7200B35, YL7290BH30 (all manufactured by Mitsubishi Chemical Corporation), etc.

The weight average molecular weight (Mw) of a phenoxy resin is normally 10,000-200,000, Preferably it is 20,000-100,000, More preferably, it is 30,000-80,000. If the weight average molecular weight of the phenoxy resin is too small, the support property of the sheet-like adhesive tends to be weakened and the fragility becomes strong, and if it is too large, the melt viscosity becomes high, and the handleability tends to be poor. In addition, in this specification, when a phenoxy resin has an epoxy group, the thing whose weight average molecular weight (Mw) is 10,000 or less is made into the said (A) component: the compound which has a cyclic ether group, and the weight average A molecular weight (Mw) larger than 10,000 was made into a phenoxy resin.

The weight-average molecular weight (Mw) of the phenoxy resin can be obtained in terms of standard polystyrene by performing gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent.

〔Adhesive agent〕

The sheet adhesive of the present invention may further contain a tackifier in addition to the aforementioned (A) component and (B) component, and depending on the desired binder resin. By containing the tackifier, it becomes easy to adjust the storage elastic modulus of the sheet adhesive.

Examples of tackifiers include rosin-based resins such as rosin resins, rosin ester resins, and rosin-modified phenol resins; hydrogenated rosin-based resins obtained by hydrogenating these rosin-based resins; terpene resins; aromatic modified terpene resins; Terpene-based resins such as resins and terpene-phenolic resins; hydrogenated terpene-based resins obtained by hydrogenating these terpene-based resins; α-methylstyrene monopolymeric resins, α-methylstyrene/styrene co- Polymerized resin, styrene-based monomer/aliphatic monomer copolymerized resin, styrene-based monomer/α-methylstyrene/aliphatic monomer copolymerized resin, styrene-based monomer monopolymerization Styrene-based resins, styrene-based monomer/aromatic monomer copolymerized resins and other styrene-based resins; hydrogenated styrene-based resins that hydrogenate these styrene-based resins; will be produced by thermal decomposition of naphtha C5-based petroleum resins obtained by copolymerizing C5 fractions of pentene, isoprene, piperine, 1,3-pentadiene, etc., and hydrogenated petroleum resins of this C5-based petroleum resins; C9-based petroleum resins obtained by copolymerizing C9 fractions such as indene and vinyltoluene produced by the thermal decomposition of indene, and hydrogenated petroleum resins of this C9-based petroleum resins; etc. Among them, a styrene-based resin is preferable, and a styrene-based monomer/aliphatic monomer copolymer-based resin is more preferable.

These tackifiers can be used alone or in combination of two or more.

As a tackifier, a commercially available item can be used. Examples of commercially available products include terpene-based resins such as YS RESIN P and A series, CLEARON (registered trademark) P series (manufactured by Yasuhara Chemical), and Picolite A and C series (manufactured by PINOVA); Aliphatic petroleum resins such as Quintone (registered trademark) A, B, R, CX series (manufactured by ZEON Corporation of Japan); Styrene-based resins such as FTR (registered trademark) series (manufactured by Mitsui Chemicals); Alcon P, M series (manufactured by Arakawa Chemical Co., Ltd.), ESCOREZ (registered trademark) series (manufactured by ExxonMobil Chemical Co., Ltd.), EASTOTAC (registered trademark) series (manufactured by Eastman Chemical Co., Ltd.), IMARV (registered trademark) series (manufactured by Idemitsu Kosan Co., Ltd. ) and other alicyclic petroleum resins; Ester-based resins such as Forall series (manufactured by PINOVA), Pensel (registered trademark) A series, Ester Gum, Super Ester, Pine Crystal (registered trademark) (manufactured by Arakawa Chemical Industry Co., Ltd.);

From the viewpoint of imparting excellent adhesiveness, the weight average molecular weight (Mw) of the tackifier is preferably from 100 to 10,000, more preferably from 500 to 5,000. From the viewpoint of imparting excellent adhesiveness, the softening point of the tackifier is preferably from 50 to 160°C, more preferably from 60 to 140°C, and still more preferably from 70 to 130°C.

When the sheet adhesive of the present invention contains a tackifier, the content thereof is preferably 1 to 200 parts by mass, more preferably 10 to 150 parts by mass, based on 100 parts by mass of the aforementioned component (A).

〔Silane coupling agent〕 The sheet adhesive of the present invention may further contain a silane coupling agent in addition to the above-mentioned (A) component and (B) component, and depending on desired binder resin and tackifier. By containing a silane coupling agent, it becomes easy to obtain a hardened product of a sheet-like adhesive having superior adhesive strength. Examples of silane coupling agents include 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyl Silane coupling agents with (meth)acryl groups, such as methyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, etc. ; Vinyltrimethoxysilane, vinyltriethoxysilane, dimethoxymethylvinylsilane, diethoxymethylvinylsilane, trichlorovinylsilane, vinylginseng (2-methoxy Ethoxy) silane and other silane coupling agents with vinyl groups; 2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane, 3-Glycidoxypropyltrimethoxysilane, 3-Glycidoxypropylmethyldiethoxysilane , 3-glycidoxypropyltriethoxysilane and other silane coupling agents with epoxy groups; Silane coupling agents with styryl groups such as p-styryltrimethoxysilane and p-styryltriethoxysilane; N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, N-( 2-aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilane N-(1,3-dimethylbutylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-(vinylbenzyl)-2-aminoethyl Silane coupling agents with amino groups such as hydrochloride of 3-aminopropyltrimethoxysilane; Silane coupling agents with ureido groups such as 3-ureidopropyltrimethoxysilane and 3-ureidopropyltriethoxysilane; Silane coupling agents with halogen atoms such as 3-chloropropyltrimethoxysilane and 3-chloropropyltriethoxysilane; 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane and other silane coupling agents with mercapto groups; Silane coupling agents with sulfide groups such as bis(trimethoxysilylpropyl) tetrasulfide and bis(triethoxysilylpropyl) tetrasulfide; Silane coupling agents with isocyanate groups such as 3-isocyanatepropyltrimethoxysilane and 3-isocyanatepropyltriethoxysilane; Allyl trichlorosilane, allyl triethoxy silane, allyl trimethoxy silane and other allyl silane coupling agents; 3-hydroxypropyl trimethoxysilane, 3-hydroxypropyl triethyl Silane coupling agents with hydroxyl groups such as oxysilane; etc.

These silane coupling agents may be used alone or in combination of two or more.

When the sheet adhesive of the present invention contains a silane coupling agent, the content is preferably 0.01 to 5 parts by mass, more preferably 0.02 to 3 parts by mass, based on 100 parts by mass of the aforementioned component (A).

By making content of a silane coupling agent into the said range, it becomes easy to obtain the hardened|cured product of the sheet-shaped adhesive agent which is more excellent in adhesive strength.

In addition, the sheet adhesive of the present invention may further contain components other than the aforementioned tackifier and silane coupling agent within the range that does not inhibit the effect of the present invention.

Examples of components other than the aforementioned tackifier and silane coupling agent include antistatic agents, stabilizers, antioxidants, plasticizers, lubricants, coloring pigments, and the like. These contents may be appropriately determined depending on the purpose.

The sheet-like adhesive of the present invention can be formed using an adhesive composition prepared by appropriately mixing and stirring prescribed components according to a usual method, as will be described later.

(sheet adhesive)

From the viewpoint of protecting the external environment, the sheet-shaped adhesive of the present invention preferably has a release film on at least one side, and may have a release film on both sides.

In addition, the sheet-like adhesive of the present invention having a release film on at least one side thereof shows the state before use, and when using the sheet-like adhesive of the present invention, the release film is usually peeled off. When the sheet adhesive has a release film on both sides, the release film with low release force is usually peeled off first.

As a release film, generally, a resin film can be utilized.

Examples of the resin component of the resin film include polyimide, polyamide, polyamide imide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polyamide Polymer, polyether resin, polyphenylene sulfide, polyarylate, acrylic resin, cycloolefin polymer, aromatic polymer, polyurethane polymer, etc. Among these, a polyester resin is preferable, and a polyester film is preferable as a resin film. As a polyester film, polyethylene terephthalate film with excellent heat resistance and ease of handling, and UV penetration at a wavelength of 365nm as high as about 80% is more preferable. Examples of release agents include rubber-based elastomers such as silicone-based resins, olefin-based resins, isoprene-based resins, and butadiene-based resins, long-chain alkyl-based resins, alkyd-based resins, and fluorine-based resins. . The thickness of the release film is preferably from 10 to 300 μm, and more preferably from 10 to 200 μm, from the viewpoint of improving heat resistance and from the viewpoint of not hindering ultraviolet rays from penetrating the release film and irradiating the sheet adhesive. , preferably 15-100 μm. From the point of view that it is easy to irradiate the sheet-like adhesive of the present invention with ultraviolet light with a wavelength of 365 nm that penetrates the release film to initiate photocationic polymerization, the transmittance of the ultraviolet light with a wavelength of 365 nm of the release film is preferably 65% or more. Preferably it is more than 70%. Moreover, when the peeling film uses a polyethylene terephthalate film as a base material, when the wavelength of an ultraviolet-ray is less than 330 nm, the transmittance will fall remarkably.

The thickness of the sheet adhesive is usually 1 to 50 μm, preferably 5 to 30 μm. A sheet-shaped adhesive having a thickness within the above-mentioned range can be preferably used as a sheet-shaped sealing material. The thickness of the sheet-like adhesive can be measured using a known thickness gauge in accordance with JIS K 7130 (1999). In addition, the thickness of the sheet adhesive is the thickness minus the thickness of the release film.

The sheet-like adhesive of the present invention has adhesive force even after being irradiated with ultraviolet rays, and is strongly adhered to electronic devices or functional films without peeling off during or after attachment. Therefore, it can be preferably used as a sealing material of an electronic device sealing body, especially an electronic device sealing body having an ultraviolet-ray impermeable functional film on the surface.

The sheet-like adhesive of the present invention has a peeling film on at least one surface, and on the opposite surface, a laminated body is produced by bonding a polyethylene terephthalate film with a thickness of 23 μm on which aluminum has been vapor-deposited. In the state where the release film is attached, ultraviolet rays with a wavelength of 365nm are irradiated to the laminate from the release film side under the conditions of illuminance: 50mW/cm ² and light intensity: 200mJ/cm ² , and after 3 minutes, the laminate will be peeled off. The film is peeled off so that the exposed layer of the sheet-like adhesive is facing the soda-lime glass plate. On the laminated body, a 2 kg roller is made to go back and forth once, thereby sticking to the soda-lime glass plate, at 23°C and 50 % relative humidity, after 24 hours of storage, the adhesion to the soda-lime glass plate is preferably 3N/25mm or more, more preferably 5N/25mm or more. Adhesion to glass is measured by the method described in the examples (180° pull peel test).

(Manufacturing method of sheet adhesive) The manufacturing method of the sheet-like adhesive agent of this invention is not specifically limited. For example, it can be manufactured using a casting method.

The method of manufacturing a sheet-like adhesive by a casting method is to use a known method to apply the adhesive composition on the peeled layer of the peeled film and dry the resulting coating to obtain a peeled film. sheet adhesives.

The adhesive composition can be prepared by mixing and stirring the aforementioned (A) component and (B) component, and other desired components by a known method. In the case of using a solvent in the preparation of the adhesive composition, the viscosity of the adhesive composition can be appropriately adjusted according to the usage amount of the solvent.

Examples of the solvent include aliphatic hydrocarbon solvents such as n-hexane and n-heptane; aromatic hydrocarbon solvents such as toluene and xylene; dichloromethane, ethylene chloride, chloroform, carbon tetrachloride, 1, Halogenated hydrocarbon solvents such as 2-dichloroethane and monochlorobenzene; alcohol solvents such as methanol, ethanol, propanol, butanol, and propylene glycol monomethyl ether; acetone, methyl ethyl ketone, 2-pentanone, Ketone solvents such as isophorone and cyclohexanone; ester solvents such as ethyl acetate and butyl acetate; dioxolane) and other ether solvents; etc. These solvents may be used alone or in combination of two or more. The content of the solvent can be appropriately determined in consideration of applicability, film thickness, and the like.

The release film used in the production of the sheet adhesive functions as a support in the production steps of the sheet adhesive and at the same time functions as a release film for the above-mentioned sheet adhesive until the sheet adhesive is used. function of the film.

Examples of methods for applying the adhesive composition include spin coating, spray coating, bar coating, knife coating, roll coating, knife coating, die coating, and gravure coating.

As a method of drying the coating film of an adhesive composition, conventionally well-known drying methods, such as hot-air drying, hot-roll drying, and infrared-ray irradiation, are mentioned. As conditions at the time of drying a coating film, it is 80-150 degreeC and 30 second - 5 minutes, for example.

〔Adhesive films for sealing electronic devices〕 The adhesive film for electronic device sealing of the present invention is a functional film having a transmittance of 60% or less of ultraviolet rays with a wavelength of 365nm, and an adhesive composed of a sheet-like adhesive containing the aforementioned (A) component and (B) component layers. The adhesive film for sealing an electronic device of the present invention can be used for sealing an electronic device via its sheet-like adhesive. "Functional film with a UV transmittance of 60% or less at a wavelength of 365nm" and "sheet adhesive" can use the same ones as above. The adhesive film for electronic device sealing of the present invention can be obtained, for example, by laminating a functional film and a sheet-like adhesive as described later.

The adhesive film for electronic device sealing of the present invention may be composed of only one layer of the aforementioned adhesive layer, or may be plural as long as it has at least the aforementioned functional film and an adhesive layer composed of a sheet-like adhesive. The laminate of the adhesive agent layer may have other layers besides the adhesive agent. Examples of other layers include a primer layer that improves the adhesiveness of the interface between the adhesive layer and the functional film, a functional coating layer that is provided on the surface of the functional film that does not have the adhesive layer, or a layer that can be applied on the protective film. , Antistatic layer or stress relaxation layer formed on both sides of functional film, etc.

Moreover, when the adhesive film for electronic device sealing of this invention uses several adhesive agent layers, each adhesive agent layer may consist of the same composition, and may consist of a different composition.

The adhesive film for electronic device sealing of the present invention preferably has a peeling film on the surface of the adhesive layer on the side where the functional film is not bonded, and the peeling film is preferably the same as that used for the above-mentioned sheet-like adhesive. .

The thickness of the adhesive film for electronic device sealing of the present invention is usually 6 to 270 μm. In addition, the thickness of the adhesive film for electronic device sealing is minus the thickness of the release film, protective film and other parts that are peeled off before use.

The adhesive film for electronic device sealing of the present invention has adhesive force even after being irradiated with ultraviolet rays, and is strongly adhered to the electronic device without peeling during or after attachment, and can be preferably used as a film with The sealing material of the electronic device sealing body of the ultraviolet non-penetrating functional film.

In the case where the adhesive film for electronic device sealing of the present invention has a release film on the surface of the adhesive layer on the side where the functional film is not attached, in the state where the adhesive film for device sealing is attached to the release film, from the side of the release film, Irradiate ultraviolet rays with a wavelength of 365nm under the conditions of illuminance: 50mW/cm ² and light intensity: 200mJ/cm ² . After 3 minutes, peel off the release film from the adhesive film for sealing electronic devices, and make the exposed adhesive layer and soda lime glass The plates are facing each other, on the adhesive film for device sealing, a 2kg roller is made to go back and forth once, thereby sticking to the soda-lime glass plate, and stored at 23°C and 50% relative humidity for 24 hours. For soda-lime The adhesive force of the glass plate is preferably at least 3N/25mm, more preferably at least 5N/25mm.

Adhesion to glass is measured by the method described in the examples (180° pull peel test).

[Manufacturing method of electronic device sealing body]

The electronic device sealing body of this invention can be manufactured as follows, for example.

Hereinafter, description will be made with reference to the drawings.

(manufacturing method 1)

The electronic device of the present invention can be produced by: (α1) a step of irradiating ultraviolet light from the surface side closer to the adhesive layer than the functional film to the adhesive film for electronic device sealing of the present invention; and (β1 ) a step of attaching the above-mentioned adhesive film to the electronic device, and performing (α1) step before (β1) step.

More specifically, it carried out as follows.

First, as shown in FIG. 2( a ), a sheet-shaped adhesive 2 a is prepared.

In this case, the sheet-like adhesive 2a can be stored as an adhesive film with a double-sided release film in which a release film is double-layered on the front and back.

Next, on one side of the obtained sheet-like adhesive 2a, a functional film 1 having a UV transmittance of 60% or less at a wavelength of 365nm is laminated to obtain a laminate 4a as shown in FIG. 2(b).

Moreover, when the sheet-shaped adhesive agent 2a is an adhesive film with a double-sided peeling film, the peeling film of one surface side is peeled, and the functional film 1 is bonded together. In this case, a laminate having a layer constitution of functional film 1/sheet adhesive/peeling film can be obtained.

Next, as shown in FIG. 2( c ), the sheet-like adhesive is irradiated with ultraviolet light from the side of the laminate 4 a opposite to the side on which the functional film 1 is laminated, to start the photocuring reaction of the sheet-like adhesive 2 a. At this time, although the photohardening reaction begins in the sheet-like adhesive, but because the reaction rate of photocationic polymerization is relatively slow, the hardening reaction is not completed, and the sheet-like adhesive has sufficient adhesive force (in Fig. 2(c), following Agent 2b).

In addition, in the case of using a laminate having a layer configuration of functional film 1/sheet adhesive/release film and the release film is UV-transmissive, it is preferable not to place the sheet on the work surface. The release film on the adhesive is peeled off, and ultraviolet rays are irradiated from the release film side.

Here, the term "ultraviolet penetration" refers to the property of transmitting 65% or more, preferably 70% or more, of ultraviolet rays with a wavelength of 365nm (the same applies hereinafter).

Specific examples of the ultraviolet light source include light sources such as ultra-high pressure mercury lamps, high pressure mercury lamps, low pressure mercury lamps, carbon arc lamps, black light fluorescent lamps, and metal halide lamps. In addition, as the wavelength for irradiating ultraviolet rays, a wavelength region of 190 to 380 nm can be used. In the case of irradiating ultraviolet rays from the side of the release film without peeling the release film of the laminate having the layer structure of the functional film 1/sheet adhesive/ultraviolet-transmissive release film, if the release film is made of poly When an ethylene terephthalate film is used as the base material, the UV transmittance of the release film will be significantly reduced in the region where the wavelength of ultraviolet rays is less than 330 nm. Therefore, it is preferable to irradiate ultraviolet rays in a wavelength region of 330 to 380 nm. The type of ultraviolet rays, the irradiation amount, the irradiation time, and the like can be appropriately determined depending on the constituent components of the sheet-like adhesive to be irradiated, the content of each constituent component, and the like. The irradiation illuminance is preferably about 20 to 1000 mW/cm ² , and the light amount is about 50 to 1000 mJ/cm ² . In addition, the irradiation time is usually 0.1 to 1000 seconds, preferably about 1 to 500 seconds.

After that, as shown in FIG. 2( d ), by bonding the sheet-shaped adhesive 2 b in a state in which the curing reaction has not been completed to the electronic device, the desired electronic device sealing body 10 can be obtained. The time from irradiating ultraviolet rays to bonding to an electronic device may be any period as long as the sheet-like adhesive irradiated with ultraviolet rays is in a state in which the curing reaction has not been completed and has sufficient adhesive force. The time from irradiation of ultraviolet rays to bonding to an electronic device is not particularly limited, but is usually 1 minute to 5 hours, preferably 5 to 60 minutes.

The sheet-like adhesive 2b in the state where the hardening reaction has not been completed, even after being bonded to the electronic device, the light-hardening reaction will proceed in the sheet-like adhesive, and the sheet-like adhesive will become a completely cured state over time (sheet-like Adhesive hardened layer 2). In this way, the sheet-like adhesive of the present invention, even after being irradiated with ultraviolet rays, as long as the hardening reaction is not sufficiently carried out, has sufficient adhesiveness, so it is strongly adhered to the electronic device as the adherend, and the occurrence of sticking can be prevented. It can be peeled off during attachment or after attachment, and the sheet adhesive hardens over time, and finally an electronic device sealing body with excellent durability can be obtained.

(Manufacturing method 2) Moreover, the electronic device sealing body of the present invention can also be manufactured by the following: It has (α2) a step of irradiating ultraviolet rays to the sheet-like adhesive containing the following (A) component and (B) component; and (β2) A step of attaching the aforementioned sheet-like adhesive to a functional film or electronic device, And, the (α2) step is performed earlier than the (β2) step.

This method is specifically performed as follows. First, the sheet adhesive 2a is prepared. The sheet-like adhesive 2a can be stored as an adhesive film with a double-sided peeling film that is double-layered on the front and back. Next, as shown in FIG. 3( a ), the sheet-shaped adhesive 2 a is irradiated with ultraviolet rays to start the photocuring reaction of the sheet-shaped adhesive 2 a. In this case, it is preferable to irradiate ultraviolet rays through the release film.

When ultraviolet rays are irradiated, the photocuring reaction starts in the sheet-like adhesive, but since the reaction rate of photocationic polymerization is relatively slow, the hardening reaction is not completed, and the sheet-like adhesive has sufficient adhesive force. The type of ultraviolet rays, the irradiation conditions of ultraviolet rays, and the like are the same as those described in Production Method 1.

Next, the functional film 1 or the electronic device 3 is pasted on one side of the sheet-like adhesive 2b, whereby the state shown in FIG. 3(b) is obtained.

Thereafter, as shown in FIG. 3(c), the surface of the sheet-shaped adhesive 2b in the state where the hardening reaction has not been completed is the opposite side to the surface to which the functional film 1 or the electronic device 3 is attached, and the electronic device 3 or the functional film 1 is overlapped to obtain the target electronic device sealing body 10 . That is, in the case where the functional film 1 is bonded to one side of the sheet-like adhesive 2b, by bonding the electronic device 3 to the surface opposite to the surface to which the functional film 1 is bonded, it is possible to obtain Electronic device sealing body 10 . In addition, when the electronic device 3 is bonded to one side of the sheet-like adhesive 2b, the electronic device can be obtained by bonding the functional film 1 to the surface opposite to the surface to which the electronic device 3 is bonded. sealing body 10.

Even after the sheet-like adhesive 2b whose hardening reaction has not been completed is bonded to the functional film 1 or the electronic device 3, the photocuring reaction proceeds in the sheet-like adhesive layer, and the layer of the sheet-like adhesive will fade over time. It is in a completely cured state (the hardened product layer 2 of the sheet-like adhesive).

In this way, the sheet adhesive of the present invention, even after the adhesive layer is irradiated with ultraviolet rays, as long as the curing reaction is not sufficiently carried out, the adhesive layer has sufficient adhesiveness, so it is strongly bonded to the adherend. The electronic device can prevent peeling during or after attachment, and the adhesive layer will harden over time, and finally an electronic device sealing body with excellent durability can be obtained.

[Example]

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited in any way by the following examples.

Parts and % in each example are based on mass unless otherwise specified.

〔Transmittance of ultraviolet light with a wavelength of 365nm of a functional film〕

The transmittance of ultraviolet rays with a wavelength of 365 nm of the functional film was measured using an ultraviolet-visible light transmittance measuring device (manufactured by Shimadzu Corporation, UV-3600).

[Measurement of adhesion of adhesive layer after ultraviolet irradiation]

From the adhesive film for electronic device sealing with a peeling film obtained in the Example and the comparative example, the peeling film was not peeled off, it cut into width 25mm, and the sample was obtained. Under 23° C. and 50% environment, ultraviolet rays having a wavelength of 365 nm were irradiated from the release film side with an illuminance of 50 mW/cm ² and a cumulative light intensity of 200 mJ/cm ² . Ultraviolet irradiation was performed using a high-pressure mercury lamp manufactured by iGrafx. In addition, as the photometer, "UVPF-A1" manufactured by iGrafx Corporation was used.

After 3 minutes, the release film was peeled off, and the sheet-like adhesive surface of the exposed adhesive layer was overlapped with a soda-lime glass plate with a thickness of 1.1 mm. On the surface of the functional film, a 2 kg roller was made to go back and forth to Crimp. After pressure-bonding the adhesive film for electronic device sealing to the soda-lime glass plate, let it stand for 24 hours at a temperature of 23°C and a relative humidity of 50%, and then perform a 180° peeling test at a peeling speed of 300mm/min to measure Adhesion.

In the following examples and comparative examples, as the compound [(A) component] having a cyclic ether group, the photocationic polymerization initiator [(B) component], the binder resin [(C) component], the tackifier Agent and silane coupling agent, use the following.

<Compounds having a cyclic ether group [(A) component]>

(1) Compound (A-1) having a cyclic ether group

Hydrogenated bisphenol A epoxy resin [manufactured by Mitsubishi Chemical Corporation, trade name: YX8000, cyclic ether equivalent: 205 g/eq, liquid at 25° C.]

(2) Compound (A-2) having a cyclic ether group

3',4'-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate [manufactured by Daicel Co., Ltd., trade name: CELLOXIDE 2021P, cyclic ether equivalent: 128~145g/eq, Liquid at room temperature (23°C)]

<Photocationic polymerization initiator [(B) component]>

(1) Photocationic polymerization initiator (B-1)

Triaryl percolium salt [manufactured by San-Apro, trade name: CPI-200K, anion: anion having a hexafluorophosphate skeleton]

(2) Photocationic polymerization initiator (B-2)

Triaryl permeicium salt [manufactured by San-Apro, trade name: CPI-100P]

<Binder resin [(C component)]

(1) Binder resin (C-1)

Acid-modified α-olefin polymer [manufactured by Mitsui Chemicals, trade name: UNISTOLE H-200, weight average molecular weight: 52,000]

(2) Binder resin (C-2) Phenoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: YX7200B35)

[Example 1] 50 parts by mass of compound (A-1) with cyclic ether group, 20 parts by mass of compound (A-2) with cyclic ether group, 1 part by mass of photocationic polymerization initiator (B-1), photocation 1.5 parts of polymerization initiator (B-2), 100 parts by mass of acid-modified α-olefin polymer (A), and 0.1 part by mass of silane coupling agent were dissolved in methyl ethyl ketone to prepare an adhesive with a solid content concentration of 30%. combination. Apply this adhesive composition (1) on the release surface of a release film (manufactured by LINTEC, trade name: SP-PET752150, thickness 75 μm) which is a silicone release-treated polyethylene terephthalate film. The obtained coating film was dried at 100° C. for 2 minutes to form an adhesive layer with a thickness of 30 μm. On this adhesive layer, as a functional film, a polyethylene terephthalate film (manufactured by Mitsubishi Shindoh Co., Ltd., trade name: metallized film, thickness 23 μm) on which metal aluminum has been deposited The surface side of aluminum was bonded to obtain an adhesive film for electronic device sealing in a state with a peeling film. The transmittance of this functional film is 0% at a wavelength of 365nm. In addition, the adhesive force after ultraviolet irradiation was 12N/25mm.

[Example 2] Without using the photocationic polymerization initiator (B-1), except that the blending amount of the photocationic polymerization initiator (B-2) was changed to 3.0 parts by mass, it was carried out in the same manner as in Example 1, and electrons were obtained. Adhesive film for device sealing. The adhesive force after ultraviolet irradiation was 4N/25mm.

[Example 3] Without using the photocationic polymerization initiator (B-1), except that the blending amount of the photocationic polymerization initiator (B-2) was changed to 3.5 parts by mass, it was carried out in the same manner as in Example 1, and electrons were obtained. Adhesive film for device sealing. The adhesive force after ultraviolet irradiation is 1N/25mm.

[Example 4] Instead of the raw materials (solid content) of the adhesive composition used in Example 1, 120 parts by mass of the compound (A-2) having a cyclic ether group, (2) photocationic polymerization initiator (B-2) 2.5 Parts by mass, 100 parts by mass of binder resin (C-2), 0.2 parts by mass of silane coupling agent (manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name: KBM6803) to prepare an adhesive composition, except that, the same as in Example 1 This was carried out to obtain an adhesive film for electronic device sealing. The adhesive force after ultraviolet irradiation is 6N/25mm.

1: Functional film

2a: Sheet adhesive

2b: Sheet adhesive with incomplete hardening reaction

2: Adhesive hardened layer

3: Electronic device

4a:Laminate

10: Electronic device sealing body

[ Fig. 1 ] is a diagram showing an example of the electronic device sealing body of the present invention.

[FIG. 2] It is a schematic process diagram of the manufacturing method of the electronic device sealing body of this invention.

[FIG. 3] It is a schematic process diagram of the manufacturing method of the electronic device sealing body of this invention.

1‧‧‧Functional film

2‧‧‧adhesive hardened layer

3‧‧‧Electronic Devices

10‧‧‧Electronic device sealing body

Claims (11)

A sealed body of an electronic device, comprising: a functional film with a transmittance of 60% or less of ultraviolet rays with a wavelength of 365nm, an electronic device, and an adhesive cured layer that seals between the functional film and the electronic device, The above-mentioned cured adhesive layer is a hardened product of a sheet-like adhesive containing the following (A) component, (B) component, and (C) component. The content of the aforementioned (A) component relative to the entire sheet-like adhesive is as The solid content is 20 to 80% by mass, (A) a compound having a cyclic ether group, (B) a photocationic polymerization initiator, (C) a group selected from modified polyolefin resins and phenoxy resins A group of more than one binder resin. The sealing body of an electronic device according to Claim 1, wherein the cyclic ether equivalent of the aforementioned component (A) is not less than 115 g/eq and not more than 300 g/eq, relative to 100 parts by mass of the aforementioned component (A), Content of the (B) component contained in the said sheet-shaped adhesive agent is 0.1-10 mass parts. A sheet-like adhesive comprising the following (A) component, (B) component, and (C) component, wherein the content of the aforementioned (A) component is, as a solid content, relative to the entire sheet-like adhesive , is 20~80% by mass, and can be used for the manufacture of the sealing body of the electronic device as described in item 1 of the scope of the patent application, (A) a compound with a cyclic ether group, (B) a photocationic polymerization initiator and (C) one or more binder resins selected from the group consisting of modified polyolefin resins and phenoxy resins. The sheet-shaped adhesive agent as described in claim 3, wherein, the above-mentioned sheet-shaped adhesive agent has a peeling film on at least one side surface, and the adhesion to the soda-lime glass plate measured by the following condition (i) The force is 3N/25mm or more. (i) A polyethylene terephthalate film with a thickness of 23 μm that has been vapor-deposited aluminum is attached to the surface of the aforementioned sheet-like adhesive that is opposite to the side to which the aforementioned peeling film is attached. The resulting laminate was irradiated to the laminate from the side of the release film with ultraviolet light at a wavelength of 365 nm under the conditions of illuminance: 50 mW/cm ² and light intensity: 200 mJ/cm ² in the state where the aforementioned release film was bonded together. After 3 minutes, the release film was peeled off from the laminate, and the exposed sheet-like adhesive layer faced the soda-lime glass plate. On the laminate, a 2 kg roller was made to go back and forth, thereby affixing to The soda-lime glass plate was stored in an environment of 23°C and 50% relative humidity for 24 hours, and then a 180° pull peel test was performed. The sheet-like adhesive described in Claim 3 of the patent application, wherein the cyclic ether equivalent of the aforementioned component (A) is 115 g/eq or more and 300 g/eq or less, and the aforementioned (B) Content of a component is 0.1-10 mass parts. An adhesive film for electronic device sealing, which comprises a functional film with a transmittance of 60% or less of ultraviolet rays with a wavelength of 365nm, and a sheet-shaped adhesive film comprising the following components (A), (B) and (C) In the adhesive layer composed of an adhesive, the content of the aforementioned (A) component is 20 to 80% by mass as a solid content relative to the entire sheet adhesive, (A) a compound having a cyclic ether group, (B) a photocation A polymerization initiator, (C) one or more binder resins selected from the group consisting of modified polyolefin resins and phenoxy resins. The adhesive film for sealing an electronic device as described in claim 6, wherein the adhesive film for sealing an electronic device has a release film on the surface of the adhesive layer on the side where the functional film is not bonded, and the following conditions are used (ii) The measured adhesive force to the soda-lime glass plate is 3N/25mm or more, (ii) In the state where the aforementioned peeling film is bonded to the aforementioned adhesive film for sealing electronic devices, a wavelength of 365 nm is applied from the side of the aforementioned peeling film. The ultraviolet rays were irradiated under the conditions of illuminance: 50mW/cm ² and light intensity: 200mJ/cm ² , and after 3 minutes, the peeling film was peeled off from the aforementioned adhesive film for sealing electronic devices, so that the exposed adhesive layer and the soda-lime glass plate were formed. On the opposite side, on the above-mentioned electronic device sealing adhesive film, make a 2kg roller back and forth once, thereby attaching to the soda-lime glass plate, store it in an environment of 23°C and 50% relative humidity for 24 hours, and then implement 180° Pull peel test. The adhesive film for sealing an electronic device according to Claim 6 of the patent claims, wherein the cyclic ether equivalent of the component (A) is 115 g/eq or more and 300 g/eq or less, relative to 100 parts by mass of the component (A) , The content of the aforementioned (B) component is 0.1 to 10 parts by mass. A method for manufacturing a sealed body of an electronic device, which includes: (α1) For the adhesive film for sealing an electronic device described in any one of the 6th to 8th claims of the above patent application, the adhesive film is closer to the adhesive than the functional film The step of irradiating the surface side of the layer with ultraviolet rays; and (β1) the step of attaching the above-mentioned adhesive film to the electronic device, the step (α1) is performed before the step (β1). A method of manufacturing a sealed body of an electronic device, comprising: (α2) a step of irradiating ultraviolet rays to a sheet-like adhesive comprising the following components (A), (B) and (C), wherein the above-mentioned (A) The content of the component is 20 to 80% by mass as a solid content relative to the entire sheet adhesive; and (β2) the function of attaching the above sheet adhesive to ultraviolet rays with a wavelength of 365nm and a transmittance of 60% or less In the step of permanent thin film or electronic device, the (α2) step is carried out first than the (β2) step, (A) a compound with a cyclic ether group, (B) photocationic polymerization initiator, (C) selected from the modified One or more binder resins of the group consisting of polyolefin resins and phenoxy resins. The method for manufacturing a sealed body of an electronic device according to claim 10, wherein the cyclic ether equivalent of the aforementioned (A) component is 115 g/eq or more and 300 g/eq or less, relative to the aforementioned (A) component 100 parts by mass, the content of the component (B) contained in the aforementioned sheet-like adhesive is 0.1 to 10 parts by mass.

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