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TWI801309B - transfer device - Google Patents

transfer device Download PDF

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Publication number
TWI801309B
TWI801309B TW111131169A TW111131169A TWI801309B TW I801309 B TWI801309 B TW I801309B TW 111131169 A TW111131169 A TW 111131169A TW 111131169 A TW111131169 A TW 111131169A TW I801309 B TWI801309 B TW I801309B
Authority
TW
Taiwan
Prior art keywords
transfer device
transfer
Prior art date
Application number
TW111131169A
Other languages
Chinese (zh)
Other versions
TW202301723A (en
Inventor
山岡裕
仲田悟基
小澤周作
Original Assignee
日商信越化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司
Publication of TW202301723A publication Critical patent/TW202301723A/en
Application granted granted Critical
Publication of TWI801309B publication Critical patent/TWI801309B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H10P72/04—
    • H10P72/0436—
    • H10P72/06—
    • H10P72/0606—
    • H10P95/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Microwave Amplifiers (AREA)
  • Paper (AREA)
  • Massaging Devices (AREA)
  • Seal Device For Vehicle (AREA)
TW111131169A 2018-06-20 2018-06-27 transfer device TWI801309B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-116692 2018-06-20
JP2018116692 2018-06-20

Publications (2)

Publication Number Publication Date
TW202301723A TW202301723A (en) 2023-01-01
TWI801309B true TWI801309B (en) 2023-05-01

Family

ID=68983359

Family Applications (7)

Application Number Title Priority Date Filing Date
TW112145274A TWI852843B (en) 2018-06-20 2018-06-27 Transfer method, mask and display manufacturing method
TW113119359A TWI863871B (en) 2018-06-20 2018-06-27 Laser processing method, reduced projection optical system, substrate manufacturing method and laser processing device
TW112111310A TWI827492B (en) 2018-06-20 2018-06-27 Transfer method and photomask
TW111119187A TWI784911B (en) 2018-06-20 2018-06-27 transfer device
TW111131169A TWI801309B (en) 2018-06-20 2018-06-27 transfer device
TW107122157A TWI768072B (en) 2018-06-20 2018-06-27 Transfer device, method of use and method of adjustment
TW113140447A TWI889581B (en) 2018-06-20 2018-06-27 Transfer method, method for manufacturing other substrate to which object is transferred, and transfer device

Family Applications Before (4)

Application Number Title Priority Date Filing Date
TW112145274A TWI852843B (en) 2018-06-20 2018-06-27 Transfer method, mask and display manufacturing method
TW113119359A TWI863871B (en) 2018-06-20 2018-06-27 Laser processing method, reduced projection optical system, substrate manufacturing method and laser processing device
TW112111310A TWI827492B (en) 2018-06-20 2018-06-27 Transfer method and photomask
TW111119187A TWI784911B (en) 2018-06-20 2018-06-27 transfer device

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW107122157A TWI768072B (en) 2018-06-20 2018-06-27 Transfer device, method of use and method of adjustment
TW113140447A TWI889581B (en) 2018-06-20 2018-06-27 Transfer method, method for manufacturing other substrate to which object is transferred, and transfer device

Country Status (3)

Country Link
CN (2) CN117715492A (en)
TW (7) TWI852843B (en)
WO (1) WO2019244362A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7255000B2 (en) * 2021-07-20 2023-04-10 信越化学工業株式会社 Defect removal method, lift method, photomask and lift system
JP7111916B1 (en) * 2021-07-20 2022-08-02 信越化学工業株式会社 Retransfer method and lift method
CN113782650B (en) * 2021-09-07 2024-11-22 苏州奕格飞半导体技术有限公司 Wafer laser lift-off device and method
JP7490848B2 (en) * 2022-06-15 2024-05-27 信越化学工業株式会社 Laser processing method, photomask and laser processing system
JP2024043357A (en) * 2022-09-16 2024-03-29 株式会社Ｓｃｒｅｅｎホールディングス Drawing device and drawing method
TWI876526B (en) 2023-09-11 2025-03-11 均華精密工業股份有限公司 Multi-axis operation apparatus in opposite arrangement
CN118665034A (en) * 2024-06-03 2024-09-20 南方科技大学 Laser-induced transfer printing equipment and laser-induced transfer printing method thereof

Citations (2)

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TW200400630A (en) * 2002-04-25 2004-01-01 Seiko Epson Corp Manufacturing method and manufacturing apparatus of electronic device
TW201528338A (en) * 2013-11-19 2015-07-16 柔芬新拿科技公司 Method and apparatus for forward deposition on a substrate by ultra-fast laser pulse energy transfer

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TW448487B (en) * 1997-11-22 2001-08-01 Nippon Kogaku Kk Exposure apparatus, exposure method and manufacturing method of device
JP3511359B2 (en) * 1998-02-27 2004-03-29 三菱電機株式会社 Laser processing equipment
US20030162108A1 (en) * 2002-01-30 2003-08-28 Eastman Kodak Company Using spacer elements to make electroluminscent display devices
KR101741343B1 (en) * 2004-02-04 2017-05-29 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device producing method
KR100635579B1 (en) * 2004-12-20 2006-10-17 삼성에스디아이 주식회사 Laser thermal transfer apparatus, laser thermal transfer method using the above device and organic electroluminescent display device manufacturing method using the above device
KR100793359B1 (en) * 2006-05-03 2008-01-11 삼성에스디아이 주식회사 Laser Irradiation Apparatus, Laser Thermal Transfer Apparatus, and Method of Manufacturing OLD Array Substrate Using the Same
JP2009199856A (en) * 2008-02-21 2009-09-03 Sony Corp Organic thin film manufacturing apparatus and organic thin film manufacturing method
JP5505871B2 (en) * 2008-03-07 2014-05-28 株式会社ニコン Mobile device and exposure apparatus
KR20100062595A (en) * 2008-12-02 2010-06-10 엘지디스플레이 주식회사 Laser induced thermal imaging apparatus and fabricating method of oled
JP2013020768A (en) * 2011-07-08 2013-01-31 Ulvac Japan Ltd Laser transfer device
KR101340617B1 (en) * 2011-12-30 2013-12-11 엘아이지에이디피 주식회사 Donor film tray
KR102001226B1 (en) * 2012-11-12 2019-07-25 삼성디스플레이 주식회사 Laser induced thermal imaging apparatus and laser induced thermal imaging method
KR20140133741A (en) * 2013-05-10 2014-11-20 삼성디스플레이 주식회사 Liti mask and laser irradiation device including thereof
US10162265B2 (en) * 2015-12-09 2018-12-25 Rohm And Haas Electronic Materials Llc Pattern treatment methods
KR102129745B1 (en) * 2016-02-12 2020-07-03 후지필름 가부시키가이샤 Pattern formation method and manufacturing method of electronic device
CN108781505B (en) * 2016-03-17 2021-08-06 东洋纺株式会社 Conductive film and conductive paste for laser etching
US10730783B2 (en) * 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
TW200400630A (en) * 2002-04-25 2004-01-01 Seiko Epson Corp Manufacturing method and manufacturing apparatus of electronic device
TW201528338A (en) * 2013-11-19 2015-07-16 柔芬新拿科技公司 Method and apparatus for forward deposition on a substrate by ultra-fast laser pulse energy transfer

Also Published As

Publication number Publication date
TW202329505A (en) 2023-07-16
TW202437896A (en) 2024-09-16
CN117715492A (en) 2024-03-15
TW202539492A (en) 2025-10-01
TW202412360A (en) 2024-03-16
WO2019244362A1 (en) 2019-12-26
TWI889581B (en) 2025-07-01
CN112272966B (en) 2024-02-02
TWI863871B (en) 2024-11-21
TWI768072B (en) 2022-06-21
CN112272966A (en) 2021-01-26
TW202234729A (en) 2022-09-01
TWI784911B (en) 2022-11-21
TW202002358A (en) 2020-01-01
TWI827492B (en) 2023-12-21
TW202301723A (en) 2023-01-01
TWI852843B (en) 2024-08-11
TW202508437A (en) 2025-02-16

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