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TWI800876B - 熱感測封裝 - Google Patents

熱感測封裝 Download PDF

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Publication number
TWI800876B
TWI800876B TW110127066A TW110127066A TWI800876B TW I800876 B TWI800876 B TW I800876B TW 110127066 A TW110127066 A TW 110127066A TW 110127066 A TW110127066 A TW 110127066A TW I800876 B TWI800876 B TW I800876B
Authority
TW
Taiwan
Prior art keywords
thermal sensor
sensor package
package
thermal
sensor
Prior art date
Application number
TW110127066A
Other languages
English (en)
Other versions
TW202306057A (zh
Inventor
劉育賢
蘇瑞巴舒 尼加古納
龐茜
簡伊辰
Original Assignee
新加坡商光寶科技新加坡私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新加坡商光寶科技新加坡私人有限公司 filed Critical 新加坡商光寶科技新加坡私人有限公司
Priority to TW110127066A priority Critical patent/TWI800876B/zh
Publication of TW202306057A publication Critical patent/TW202306057A/zh
Application granted granted Critical
Publication of TWI800876B publication Critical patent/TWI800876B/zh

Links

TW110127066A 2021-07-23 2021-07-23 熱感測封裝 TWI800876B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110127066A TWI800876B (zh) 2021-07-23 2021-07-23 熱感測封裝

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110127066A TWI800876B (zh) 2021-07-23 2021-07-23 熱感測封裝

Publications (2)

Publication Number Publication Date
TW202306057A TW202306057A (zh) 2023-02-01
TWI800876B true TWI800876B (zh) 2023-05-01

Family

ID=86661436

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110127066A TWI800876B (zh) 2021-07-23 2021-07-23 熱感測封裝

Country Status (1)

Country Link
TW (1) TWI800876B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI863679B (zh) * 2023-11-06 2024-11-21 矽品精密工業股份有限公司 基板結構、具有該基板結構之電子封裝件與製法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200824062A (en) * 2006-11-22 2008-06-01 Lu Wei Hua Anti-warpage structure of semiconductor device
TWI671872B (zh) * 2018-10-11 2019-09-11 Kingpak Technology Inc. 感測器封裝結構
TW202034474A (zh) * 2019-03-14 2020-09-16 力成科技股份有限公司 半導體封裝結構及其製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200824062A (en) * 2006-11-22 2008-06-01 Lu Wei Hua Anti-warpage structure of semiconductor device
TWI671872B (zh) * 2018-10-11 2019-09-11 Kingpak Technology Inc. 感測器封裝結構
TW202034474A (zh) * 2019-03-14 2020-09-16 力成科技股份有限公司 半導體封裝結構及其製造方法

Also Published As

Publication number Publication date
TW202306057A (zh) 2023-02-01

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