TWI800708B - 疊對計量系統及方法 - Google Patents
疊對計量系統及方法 Download PDFInfo
- Publication number
- TWI800708B TWI800708B TW109102368A TW109102368A TWI800708B TW I800708 B TWI800708 B TW I800708B TW 109102368 A TW109102368 A TW 109102368A TW 109102368 A TW109102368 A TW 109102368A TW I800708 B TWI800708 B TW I800708B
- Authority
- TW
- Taiwan
- Prior art keywords
- metrology system
- overlay metrology
- overlay
- metrology
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706843—Metrology apparatus
- G03F7/706849—Irradiation branch, e.g. optical system details, illumination mode or polarisation control
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
- G06F17/18—Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Data Mining & Analysis (AREA)
- Pure & Applied Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computational Mathematics (AREA)
- Mathematical Physics (AREA)
- Mathematical Analysis (AREA)
- Mathematical Optimization (AREA)
- Databases & Information Systems (AREA)
- Analytical Chemistry (AREA)
- Operations Research (AREA)
- Algebra (AREA)
- Evolutionary Biology (AREA)
- Bioinformatics & Computational Biology (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Probability & Statistics with Applications (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962797557P | 2019-01-28 | 2019-01-28 | |
| US62/797,557 | 2019-01-28 | ||
| US16/741,574 US11333982B2 (en) | 2019-01-28 | 2020-01-13 | Scaling metric for quantifying metrology sensitivity to process variation |
| US16/741,574 | 2020-01-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202043930A TW202043930A (zh) | 2020-12-01 |
| TWI800708B true TWI800708B (zh) | 2023-05-01 |
Family
ID=71731223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109102368A TWI800708B (zh) | 2019-01-28 | 2020-01-22 | 疊對計量系統及方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11333982B2 (zh) |
| JP (1) | JP7303887B2 (zh) |
| KR (1) | KR102513718B1 (zh) |
| CN (1) | CN113330550B (zh) |
| TW (1) | TWI800708B (zh) |
| WO (1) | WO2020159737A1 (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4049307A4 (en) * | 2019-11-28 | 2023-12-27 | KLA Corporation | SYSTEMS AND METHODS FOR METROLOGY OPTIMIZATION BASED ON METROLOGY LANDSCAPES |
| US12406891B2 (en) * | 2021-09-30 | 2025-09-02 | International Business Machines Corporation | Characterization of asymmetric material deposition for metrology |
| CN117546090B (zh) * | 2021-10-21 | 2025-05-13 | 科磊股份有限公司 | 用于改进叠加误差计量的感应位移 |
| US11861824B1 (en) * | 2022-02-03 | 2024-01-02 | Kla Corporation | Reference image grouping in overlay metrology |
| US12455509B2 (en) * | 2022-02-24 | 2025-10-28 | Nanya Technology Corporation | Semiconductor structure and system for manufacturing the same |
| KR102519813B1 (ko) | 2022-10-17 | 2023-04-11 | (주)오로스테크놀로지 | 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램 |
| KR102662778B1 (ko) * | 2023-08-16 | 2024-04-30 | (주)오로스 테크놀로지 | 오버레이 계측 장치의 타겟 선정 방법 및 오버레이 계측 장치의 타겟 선정 시스템 |
| US12423803B2 (en) * | 2024-01-23 | 2025-09-23 | KLA Con | Predicting tool induced shift using Moiré overlay targets |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150185625A1 (en) * | 2013-12-30 | 2015-07-02 | Asml Netherlands B.V. | Method and apparatus for design of a metrology target |
| US20180088470A1 (en) * | 2016-09-27 | 2018-03-29 | Asml Netherlands B.V. | Metrology recipe selection |
| TW201832020A (zh) * | 2016-02-22 | 2018-09-01 | 荷蘭商Asml荷蘭公司 | 對度量衡資料之貢獻之分離 |
| TW201843534A (zh) * | 2017-05-03 | 2018-12-16 | 荷蘭商Asml荷蘭公司 | 度量衡參數判定及度量衡配方選擇 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3391328B2 (ja) * | 1993-02-08 | 2003-03-31 | 株式会社ニコン | 位置合わせ方法、その位置合わせ方法を用いた露光方法、その露光方法を用いたデバイス製造方法、そのデバイス製造方法で製造されたデバイス、並びに位置合わせ装置、その位置合わせ装置を備えた露光装置 |
| US7791727B2 (en) | 2004-08-16 | 2010-09-07 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
| JP2006216796A (ja) * | 2005-02-03 | 2006-08-17 | Nikon Corp | 基準パターン情報の作成方法、位置計測方法、位置計測装置、露光方法、及び露光装置 |
| US8045786B2 (en) | 2006-10-24 | 2011-10-25 | Kla-Tencor Technologies Corp. | Waferless recipe optimization |
| US7873504B1 (en) | 2007-05-07 | 2011-01-18 | Kla-Tencor Technologies Corp. | Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout |
| KR101429629B1 (ko) | 2009-07-31 | 2014-08-12 | 에이에스엠엘 네델란즈 비.브이. | 계측 방법 및 장치, 리소그래피 시스템, 및 리소그래피 처리 셀 |
| CN102483582B (zh) | 2009-08-24 | 2016-01-20 | Asml荷兰有限公司 | 量测方法和设备、光刻设备、光刻处理单元和包括量测目标的衬底 |
| JP5377595B2 (ja) | 2011-03-25 | 2013-12-25 | 富士フイルム株式会社 | 着色感放射線性組成物、カラーフィルタ、着色パターンの製造方法、カラーフィルタの製造方法、固体撮像素子、及び液晶表示装置 |
| CN103582819B (zh) | 2011-04-06 | 2016-09-14 | 科磊股份有限公司 | 用于提供经改进过程控制的质量度量的方法及系统 |
| US10267746B2 (en) * | 2014-10-22 | 2019-04-23 | Kla-Tencor Corp. | Automated pattern fidelity measurement plan generation |
| JP6770958B2 (ja) * | 2014-11-25 | 2020-10-21 | ケーエルエー コーポレイション | ランドスケープの解析および利用 |
| US9903711B2 (en) | 2015-04-06 | 2018-02-27 | KLA—Tencor Corporation | Feed forward of metrology data in a metrology system |
| CN109917622B (zh) * | 2015-04-10 | 2021-08-06 | Asml荷兰有限公司 | 用于检查和量测的方法和设备 |
| CN108369381B (zh) | 2015-12-04 | 2021-09-21 | Asml荷兰有限公司 | 由量测数据的统计分层重建 |
| WO2018106685A1 (en) | 2016-12-05 | 2018-06-14 | Lutron Electronics Co., Inc. | User interface for controlling intensity and color of a lighting load |
| SG11201907074RA (en) | 2017-02-28 | 2019-09-27 | Kla Tencor Corp | Determining the impacts of stochastic behavior on overlay metrology data |
-
2020
- 2020-01-13 US US16/741,574 patent/US11333982B2/en active Active
- 2020-01-21 WO PCT/US2020/014308 patent/WO2020159737A1/en not_active Ceased
- 2020-01-21 KR KR1020217027493A patent/KR102513718B1/ko active Active
- 2020-01-21 JP JP2021543396A patent/JP7303887B2/ja active Active
- 2020-01-21 CN CN202080009804.1A patent/CN113330550B/zh active Active
- 2020-01-22 TW TW109102368A patent/TWI800708B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150185625A1 (en) * | 2013-12-30 | 2015-07-02 | Asml Netherlands B.V. | Method and apparatus for design of a metrology target |
| TW201832020A (zh) * | 2016-02-22 | 2018-09-01 | 荷蘭商Asml荷蘭公司 | 對度量衡資料之貢獻之分離 |
| US20180088470A1 (en) * | 2016-09-27 | 2018-03-29 | Asml Netherlands B.V. | Metrology recipe selection |
| TW201843534A (zh) * | 2017-05-03 | 2018-12-16 | 荷蘭商Asml荷蘭公司 | 度量衡參數判定及度量衡配方選擇 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202043930A (zh) | 2020-12-01 |
| CN113330550A (zh) | 2021-08-31 |
| US11333982B2 (en) | 2022-05-17 |
| CN113330550B (zh) | 2024-08-06 |
| WO2020159737A1 (en) | 2020-08-06 |
| KR20210110897A (ko) | 2021-09-09 |
| JP7303887B2 (ja) | 2023-07-05 |
| US20200241428A1 (en) | 2020-07-30 |
| JP2022523692A (ja) | 2022-04-26 |
| KR102513718B1 (ko) | 2023-03-23 |
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