[go: up one dir, main page]

TWI800708B - 疊對計量系統及方法 - Google Patents

疊對計量系統及方法 Download PDF

Info

Publication number
TWI800708B
TWI800708B TW109102368A TW109102368A TWI800708B TW I800708 B TWI800708 B TW I800708B TW 109102368 A TW109102368 A TW 109102368A TW 109102368 A TW109102368 A TW 109102368A TW I800708 B TWI800708 B TW I800708B
Authority
TW
Taiwan
Prior art keywords
metrology system
overlay metrology
overlay
metrology
Prior art date
Application number
TW109102368A
Other languages
English (en)
Other versions
TW202043930A (zh
Inventor
托爾 馬西安諾
諾亞 阿蒙
丹那 克林
Original Assignee
美商科磊股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商科磊股份有限公司 filed Critical 美商科磊股份有限公司
Publication of TW202043930A publication Critical patent/TW202043930A/zh
Application granted granted Critical
Publication of TWI800708B publication Critical patent/TWI800708B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70633Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/706843Metrology apparatus
    • G03F7/706849Irradiation branch, e.g. optical system details, illumination mode or polarisation control
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10Complex mathematical operations
    • G06F17/18Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Pure & Applied Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Databases & Information Systems (AREA)
  • Analytical Chemistry (AREA)
  • Operations Research (AREA)
  • Algebra (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Probability & Statistics with Applications (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
TW109102368A 2019-01-28 2020-01-22 疊對計量系統及方法 TWI800708B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962797557P 2019-01-28 2019-01-28
US62/797,557 2019-01-28
US16/741,574 US11333982B2 (en) 2019-01-28 2020-01-13 Scaling metric for quantifying metrology sensitivity to process variation
US16/741,574 2020-01-13

Publications (2)

Publication Number Publication Date
TW202043930A TW202043930A (zh) 2020-12-01
TWI800708B true TWI800708B (zh) 2023-05-01

Family

ID=71731223

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109102368A TWI800708B (zh) 2019-01-28 2020-01-22 疊對計量系統及方法

Country Status (6)

Country Link
US (1) US11333982B2 (zh)
JP (1) JP7303887B2 (zh)
KR (1) KR102513718B1 (zh)
CN (1) CN113330550B (zh)
TW (1) TWI800708B (zh)
WO (1) WO2020159737A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4049307A4 (en) * 2019-11-28 2023-12-27 KLA Corporation SYSTEMS AND METHODS FOR METROLOGY OPTIMIZATION BASED ON METROLOGY LANDSCAPES
US12406891B2 (en) * 2021-09-30 2025-09-02 International Business Machines Corporation Characterization of asymmetric material deposition for metrology
CN117546090B (zh) * 2021-10-21 2025-05-13 科磊股份有限公司 用于改进叠加误差计量的感应位移
US11861824B1 (en) * 2022-02-03 2024-01-02 Kla Corporation Reference image grouping in overlay metrology
US12455509B2 (en) * 2022-02-24 2025-10-28 Nanya Technology Corporation Semiconductor structure and system for manufacturing the same
KR102519813B1 (ko) 2022-10-17 2023-04-11 (주)오로스테크놀로지 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램
KR102662778B1 (ko) * 2023-08-16 2024-04-30 (주)오로스 테크놀로지 오버레이 계측 장치의 타겟 선정 방법 및 오버레이 계측 장치의 타겟 선정 시스템
US12423803B2 (en) * 2024-01-23 2025-09-23 KLA Con Predicting tool induced shift using Moiré overlay targets

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150185625A1 (en) * 2013-12-30 2015-07-02 Asml Netherlands B.V. Method and apparatus for design of a metrology target
US20180088470A1 (en) * 2016-09-27 2018-03-29 Asml Netherlands B.V. Metrology recipe selection
TW201832020A (zh) * 2016-02-22 2018-09-01 荷蘭商Asml荷蘭公司 對度量衡資料之貢獻之分離
TW201843534A (zh) * 2017-05-03 2018-12-16 荷蘭商Asml荷蘭公司 度量衡參數判定及度量衡配方選擇

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391328B2 (ja) * 1993-02-08 2003-03-31 株式会社ニコン 位置合わせ方法、その位置合わせ方法を用いた露光方法、その露光方法を用いたデバイス製造方法、そのデバイス製造方法で製造されたデバイス、並びに位置合わせ装置、その位置合わせ装置を備えた露光装置
US7791727B2 (en) 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
JP2006216796A (ja) * 2005-02-03 2006-08-17 Nikon Corp 基準パターン情報の作成方法、位置計測方法、位置計測装置、露光方法、及び露光装置
US8045786B2 (en) 2006-10-24 2011-10-25 Kla-Tencor Technologies Corp. Waferless recipe optimization
US7873504B1 (en) 2007-05-07 2011-01-18 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout
KR101429629B1 (ko) 2009-07-31 2014-08-12 에이에스엠엘 네델란즈 비.브이. 계측 방법 및 장치, 리소그래피 시스템, 및 리소그래피 처리 셀
CN102483582B (zh) 2009-08-24 2016-01-20 Asml荷兰有限公司 量测方法和设备、光刻设备、光刻处理单元和包括量测目标的衬底
JP5377595B2 (ja) 2011-03-25 2013-12-25 富士フイルム株式会社 着色感放射線性組成物、カラーフィルタ、着色パターンの製造方法、カラーフィルタの製造方法、固体撮像素子、及び液晶表示装置
CN103582819B (zh) 2011-04-06 2016-09-14 科磊股份有限公司 用于提供经改进过程控制的质量度量的方法及系统
US10267746B2 (en) * 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
JP6770958B2 (ja) * 2014-11-25 2020-10-21 ケーエルエー コーポレイション ランドスケープの解析および利用
US9903711B2 (en) 2015-04-06 2018-02-27 KLA—Tencor Corporation Feed forward of metrology data in a metrology system
CN109917622B (zh) * 2015-04-10 2021-08-06 Asml荷兰有限公司 用于检查和量测的方法和设备
CN108369381B (zh) 2015-12-04 2021-09-21 Asml荷兰有限公司 由量测数据的统计分层重建
WO2018106685A1 (en) 2016-12-05 2018-06-14 Lutron Electronics Co., Inc. User interface for controlling intensity and color of a lighting load
SG11201907074RA (en) 2017-02-28 2019-09-27 Kla Tencor Corp Determining the impacts of stochastic behavior on overlay metrology data

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150185625A1 (en) * 2013-12-30 2015-07-02 Asml Netherlands B.V. Method and apparatus for design of a metrology target
TW201832020A (zh) * 2016-02-22 2018-09-01 荷蘭商Asml荷蘭公司 對度量衡資料之貢獻之分離
US20180088470A1 (en) * 2016-09-27 2018-03-29 Asml Netherlands B.V. Metrology recipe selection
TW201843534A (zh) * 2017-05-03 2018-12-16 荷蘭商Asml荷蘭公司 度量衡參數判定及度量衡配方選擇

Also Published As

Publication number Publication date
TW202043930A (zh) 2020-12-01
CN113330550A (zh) 2021-08-31
US11333982B2 (en) 2022-05-17
CN113330550B (zh) 2024-08-06
WO2020159737A1 (en) 2020-08-06
KR20210110897A (ko) 2021-09-09
JP7303887B2 (ja) 2023-07-05
US20200241428A1 (en) 2020-07-30
JP2022523692A (ja) 2022-04-26
KR102513718B1 (ko) 2023-03-23

Similar Documents

Publication Publication Date Title
IL277821A (en) System and method for coverage metrology
TWI800708B (zh) 疊對計量系統及方法
EP4038374A4 (en) AI VISUAL INSPECTION SYSTEM AND METHOD
EP3853772A4 (en) MACHINE LEARNING ASSISTED SELF-IMPROVING SYSTEM AND METHOD FOR OBJECT IDENTIFICATION
EP3811316A4 (en) Blockchain system and method
EP4052195A4 (en) SYSTEM AND METHOD FOR OPERATING AN EVENT-DRIVEN ARCHITECTURE
EP3837599A4 (en) SYSTEM AND METHOD FOR LOCATION-RELATED PROCESSING
SG11202010736YA (en) System and method for blockchain-based decentralized application development
EP4072979A4 (en) SYSTEM AND METHOD FOR REALIGNING BOXES
EP3922949A4 (en) METHOD AND SYSTEM FOR PATHWAY PLANNING
EP4004580A4 (en) SYSTEM AND METHOD FOR INDOOR LOCATION
EP4085317A4 (en) SYSTEM AND METHOD FOR A LONG STATE OF SLEEPING
EP4042621A4 (en) ARQ-HYBRID SYSTEM AND METHOD
EP3956853A4 (en) SYSTEM AND PROCESS FOR BETTER FITTING BOOTS
EP3982453A4 (en) COMPONENT REPLACEMENT METHOD AND COMPONENT REPLACEMENT SYSTEM
EP3951311A4 (en) MEASURING SYSTEM AND METHOD
EP3874580A4 (en) Q-FACTOR DETERMINATION SYSTEM AND METHOD
EP4049009A4 (en) SYSTEM AND METHOD FOR CALCULATION OF INCLINATION USING SUPERPOSITION METROLOGY MEASUREMENTS
EP4004857A4 (en) METHOD AND SYSTEM FOR DELIVERING ADVERTISING
EP3939738A4 (en) PROCESSING SYSTEM AND PROCESSING PROCESSES
EP3846116A4 (en) DIGITAL DETERMINATION SYSTEM AND ASSOCIATED METHOD
IL290292B1 (en) Metrology system and method
EP3848207B8 (en) Engrave system and method for operating it
EP3888915A4 (en) MANAGEMENT SYSTEM AND MANAGEMENT PROCESS
AU2019901729A0 (en) System and method for conducting value engineering