TWI800087B - 用於執行電源定序之設備 - Google Patents
用於執行電源定序之設備 Download PDFInfo
- Publication number
- TWI800087B TWI800087B TW110141976A TW110141976A TWI800087B TW I800087 B TWI800087 B TW I800087B TW 110141976 A TW110141976 A TW 110141976A TW 110141976 A TW110141976 A TW 110141976A TW I800087 B TWI800087 B TW I800087B
- Authority
- TW
- Taiwan
- Prior art keywords
- performing power
- power sequencing
- sequencing
- power
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
- H03K17/6871—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors the output circuit comprising more than one controlled field-effect transistor
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/263—Arrangements for using multiple switchable power supplies, e.g. battery and AC
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
- H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
- H02M3/06—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider
- H02M3/07—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Dc-Dc Converters (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electronic Switches (AREA)
- Power Sources (AREA)
- Logic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/527,569 US10742211B1 (en) | 2019-07-31 | 2019-07-31 | Power sequencing in an active silicon interposer |
| US16/527,569 | 2019-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202226758A TW202226758A (zh) | 2022-07-01 |
| TWI800087B true TWI800087B (zh) | 2023-04-21 |
Family
ID=71894686
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110141976A TWI800087B (zh) | 2019-07-31 | 2020-07-27 | 用於執行電源定序之設備 |
| TW109125275A TWI749666B (zh) | 2019-07-31 | 2020-07-27 | 用於執行電源定序之設備 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109125275A TWI749666B (zh) | 2019-07-31 | 2020-07-27 | 用於執行電源定序之設備 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10742211B1 (zh) |
| EP (2) | EP3771962B1 (zh) |
| CN (2) | CN112305985B (zh) |
| DK (1) | DK3771962T3 (zh) |
| FI (1) | FI3771962T3 (zh) |
| TW (2) | TWI800087B (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117083574A (zh) * | 2021-03-24 | 2023-11-17 | 发那科株式会社 | 电子设备 |
| US20230223402A1 (en) * | 2022-01-12 | 2023-07-13 | Kneron Inc. | Three-dimensional Integrated Circuit |
| US12389527B2 (en) | 2023-08-07 | 2025-08-12 | Ciena Corporation | ASIC busbar with remote power phases for telecommunications and networking shelf and circuit card assemblies |
| EP4558880B1 (en) * | 2023-08-07 | 2026-01-21 | Ciena Corporation | Asic busbar with remote power phases for telecommunications and networking shelf and circuit card assemblies |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130044554A1 (en) * | 2011-08-17 | 2013-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Dram repair architecture for wide i/o dram based 2.5d/3d system chips |
| US8751836B1 (en) * | 2011-12-28 | 2014-06-10 | Datadirect Networks, Inc. | Data storage system and method for monitoring and controlling the power budget in a drive enclosure housing data storage devices |
| US20140197409A1 (en) * | 2011-08-17 | 2014-07-17 | Rambus Inc. | Multi-chip package and interposer with signal line compression |
| US9059696B1 (en) * | 2013-08-01 | 2015-06-16 | Altera Corporation | Interposer with programmable power gating granularity |
| US20190227963A1 (en) * | 2019-03-28 | 2019-07-25 | Intel Corporation | Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06500655A (ja) * | 1990-10-03 | 1994-01-20 | スィンキング マシンズ コーポレーション | 並列コンピュータ・システム |
| CN2718635Y (zh) * | 2004-03-03 | 2005-08-17 | 中兴通讯股份有限公司 | 多电源上电顺序控制电路 |
| CN100492228C (zh) * | 2005-05-30 | 2009-05-27 | 杭州华三通信技术有限公司 | 控制多电压上电顺序的装置及方法 |
| US7574540B2 (en) * | 2006-01-03 | 2009-08-11 | Emc Corporation | Managing management controller communications |
| KR100806127B1 (ko) * | 2006-09-06 | 2008-02-22 | 삼성전자주식회사 | 피크 커런트를 감소시키는 파워 게이팅 회로 및 파워게이팅 방법 |
| US7977822B2 (en) | 2007-11-05 | 2011-07-12 | Arm Limited | Dynamically changing control of sequenced power gating |
| US7898072B2 (en) * | 2008-07-11 | 2011-03-01 | Stats Chippac Ltd. | Package stacking system with mold contamination prevention |
| US8907462B2 (en) * | 2009-02-05 | 2014-12-09 | Hewlett-Packard Development Company, L. P. | Integrated circuit package |
| US8680710B2 (en) * | 2010-12-17 | 2014-03-25 | Texas Instruments Incorporated | Analog power sequencer and method |
| US9633872B2 (en) * | 2013-01-29 | 2017-04-25 | Altera Corporation | Integrated circuit package with active interposer |
| US9106229B1 (en) * | 2013-03-14 | 2015-08-11 | Altera Corporation | Programmable interposer circuitry |
| US9298253B2 (en) * | 2013-09-13 | 2016-03-29 | Globalfoundries Inc. | Accelerating the microprocessor core wakeup by predictively executing a subset of the power-up sequence |
| US9389674B2 (en) | 2013-09-13 | 2016-07-12 | International Business Machines Corporation | Predictively turning off a charge pump supplying voltage for overdriving gates of the power switch header in a microprocessor with power gating |
| JP6495698B2 (ja) * | 2014-03-20 | 2019-04-03 | 株式会社半導体エネルギー研究所 | 半導体装置、電子部品、及び電子機器 |
| JP6417781B2 (ja) * | 2014-08-13 | 2018-11-07 | 株式会社ソシオネクスト | 半導体装置 |
| US9935052B1 (en) | 2014-11-26 | 2018-04-03 | Altera Corporation | Power line layout in integrated circuits |
| TW201643772A (zh) | 2015-06-08 | 2016-12-16 | 指紋卡公司 | 具有中介結構的指紋感測裝置 |
| CN105786144B (zh) * | 2016-02-02 | 2019-03-15 | 广东技术师范学院 | 一种处理器多电源管理控制装置、系统及方法 |
| US10665579B2 (en) * | 2016-02-16 | 2020-05-26 | Xilinx, Inc. | Chip package assembly with power management integrated circuit and integrated circuit die |
| US9917517B1 (en) * | 2016-10-26 | 2018-03-13 | Google Inc. | Switched tank converter |
-
2019
- 2019-07-31 US US16/527,569 patent/US10742211B1/en active Active
-
2020
- 2020-07-06 US US16/921,571 patent/US11552634B2/en active Active
- 2020-07-27 TW TW110141976A patent/TWI800087B/zh active
- 2020-07-27 TW TW109125275A patent/TWI749666B/zh active
- 2020-07-30 FI FIEP20188629.8T patent/FI3771962T3/fi active
- 2020-07-30 CN CN202010748713.1A patent/CN112305985B/zh active Active
- 2020-07-30 EP EP20188629.8A patent/EP3771962B1/en active Active
- 2020-07-30 CN CN202411003268.0A patent/CN118963518A/zh active Pending
- 2020-07-30 DK DK20188629.8T patent/DK3771962T3/da active
- 2020-07-30 EP EP24182119.8A patent/EP4407407A3/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130044554A1 (en) * | 2011-08-17 | 2013-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Dram repair architecture for wide i/o dram based 2.5d/3d system chips |
| US20140197409A1 (en) * | 2011-08-17 | 2014-07-17 | Rambus Inc. | Multi-chip package and interposer with signal line compression |
| US8751836B1 (en) * | 2011-12-28 | 2014-06-10 | Datadirect Networks, Inc. | Data storage system and method for monitoring and controlling the power budget in a drive enclosure housing data storage devices |
| US9059696B1 (en) * | 2013-08-01 | 2015-06-16 | Altera Corporation | Interposer with programmable power gating granularity |
| US20190227963A1 (en) * | 2019-03-28 | 2019-07-25 | Intel Corporation | Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4407407A3 (en) | 2024-10-30 |
| EP3771962A1 (en) | 2021-02-03 |
| FI3771962T3 (fi) | 2024-12-07 |
| US20210036702A1 (en) | 2021-02-04 |
| EP4407407A2 (en) | 2024-07-31 |
| US11552634B2 (en) | 2023-01-10 |
| CN112305985B (zh) | 2024-08-23 |
| TWI749666B (zh) | 2021-12-11 |
| DK3771962T3 (da) | 2024-12-02 |
| EP3771962B1 (en) | 2024-09-04 |
| CN118963518A (zh) | 2024-11-15 |
| CN112305985A (zh) | 2021-02-02 |
| TW202123611A (zh) | 2021-06-16 |
| US10742211B1 (en) | 2020-08-11 |
| TW202226758A (zh) | 2022-07-01 |
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