TWI800056B - 線路裸板的檢測設備 - Google Patents
線路裸板的檢測設備 Download PDFInfo
- Publication number
- TWI800056B TWI800056B TW110139927A TW110139927A TWI800056B TW I800056 B TWI800056 B TW I800056B TW 110139927 A TW110139927 A TW 110139927A TW 110139927 A TW110139927 A TW 110139927A TW I800056 B TWI800056 B TW I800056B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- inspection apparatus
- bare circuit
- bare
- inspection
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0864—Measuring electromagnetic field characteristics characterised by constructional or functional features
- G01R29/0878—Sensors; antennas; probes; detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/10—Radiation diagrams of antennas
- G01R29/105—Radiation diagrams of antennas using anechoic chambers; Chambers or open field sites used therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0864—Measuring electromagnetic field characteristics characterised by constructional or functional features
- G01R29/0871—Complete apparatus or systems; circuits, e.g. receivers or amplifiers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B17/00—Monitoring; Testing
- H04B17/10—Monitoring; Testing of transmitters
- H04B17/101—Monitoring; Testing of transmitters for measurement of specific parameters of the transmitter or components thereof
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110139927A TWI800056B (zh) | 2021-10-27 | 2021-10-27 | 線路裸板的檢測設備 |
| US17/647,012 US11579178B1 (en) | 2021-10-27 | 2022-01-04 | Inspection apparatus for bare circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110139927A TWI800056B (zh) | 2021-10-27 | 2021-10-27 | 線路裸板的檢測設備 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI800056B true TWI800056B (zh) | 2023-04-21 |
| TW202317994A TW202317994A (zh) | 2023-05-01 |
Family
ID=85198802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110139927A TWI800056B (zh) | 2021-10-27 | 2021-10-27 | 線路裸板的檢測設備 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US11579178B1 (zh) |
| TW (1) | TWI800056B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116027119A (zh) * | 2021-10-27 | 2023-04-28 | 欣兴电子股份有限公司 | 线路裸板的检测设备 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7721868B2 (ja) * | 2020-03-26 | 2025-08-13 | ニデックアドバンステクノロジー株式会社 | 基板検査装置 |
| KR102858506B1 (ko) * | 2020-05-13 | 2025-09-10 | 동우 화인켐 주식회사 | 안테나 검사 장치 및 방법 |
| TWI804309B (zh) * | 2022-05-11 | 2023-06-01 | 量崴科技股份有限公司 | 天線測試系統 |
| TWI851079B (zh) * | 2023-03-14 | 2024-08-01 | 欣興電子股份有限公司 | 線路裸板的檢測系統及其檢測方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107247192A (zh) * | 2017-06-12 | 2017-10-13 | 深圳市信维通信股份有限公司 | 一种移动终端天线测试系统及方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004152916A (ja) * | 2002-10-29 | 2004-05-27 | Nec Corp | 半導体デバイス検査装置及び検査方法 |
| US8907694B2 (en) * | 2009-12-17 | 2014-12-09 | Xcerra Corporation | Wiring board for testing loaded printed circuit board |
| US8686736B2 (en) * | 2010-11-23 | 2014-04-01 | Infineon Technologies Ag | System and method for testing a radio frequency integrated circuit |
| JP6267918B2 (ja) * | 2013-10-09 | 2018-01-24 | ローム株式会社 | ノイズ源を含むデバイスの評価方法 |
| TW201528712A (zh) * | 2013-12-09 | 2015-07-16 | Patrick Antoine Rada | 無線發送器及無線接收器之無線耦合射頻校準及測試方法 |
| US10852349B2 (en) | 2018-04-09 | 2020-12-01 | Mediatek Inc. | Wireless test system for testing microelectronic devices integrated with antenna |
| TWI693414B (zh) | 2019-09-10 | 2020-05-11 | 矽品精密工業股份有限公司 | 檢測設備及其測試裝置 |
| TWM595760U (zh) | 2020-02-07 | 2020-05-21 | 中華精測科技股份有限公司 | 封裝積體電路之測試裝置及自動化測試設備 |
-
2021
- 2021-10-27 TW TW110139927A patent/TWI800056B/zh active
-
2022
- 2022-01-04 US US17/647,012 patent/US11579178B1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107247192A (zh) * | 2017-06-12 | 2017-10-13 | 深圳市信维通信股份有限公司 | 一种移动终端天线测试系统及方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116027119A (zh) * | 2021-10-27 | 2023-04-28 | 欣兴电子股份有限公司 | 线路裸板的检测设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| US11579178B1 (en) | 2023-02-14 |
| TW202317994A (zh) | 2023-05-01 |
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