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TWI800049B - Chip packaging method and chip structure - Google Patents

Chip packaging method and chip structure Download PDF

Info

Publication number
TWI800049B
TWI800049B TW110139387A TW110139387A TWI800049B TW I800049 B TWI800049 B TW I800049B TW 110139387 A TW110139387 A TW 110139387A TW 110139387 A TW110139387 A TW 110139387A TW I800049 B TWI800049 B TW I800049B
Authority
TW
Taiwan
Prior art keywords
chip
packaging method
chip structure
chip packaging
packaging
Prior art date
Application number
TW110139387A
Other languages
Chinese (zh)
Other versions
TW202236562A (en
Inventor
輝星 周
Original Assignee
新加坡商Ｐｅｐ創新私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新加坡商Ｐｅｐ創新私人有限公司 filed Critical 新加坡商Ｐｅｐ創新私人有限公司
Publication of TW202236562A publication Critical patent/TW202236562A/en
Application granted granted Critical
Publication of TWI800049B publication Critical patent/TWI800049B/en

Links

Classifications

    • H10W90/00—
    • H10W40/22—
    • H10W70/421—
    • H10W70/424—
    • H10W74/01—
    • H10W74/111—
    • H10W90/811—
    • H10W95/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247—Connecting the strap to a bond pad of the item
    • H10W70/60—
    • H10W72/241—
    • H10W72/871—
    • H10W72/884—
    • H10W72/9413—
    • H10W90/10—
    • H10W90/736—
    • H10W90/756—
    • H10W99/00—
TW110139387A 2020-10-24 2021-10-22 Chip packaging method and chip structure TWI800049B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG10202010557R 2020-10-24
SG10202010557R 2020-10-24

Publications (2)

Publication Number Publication Date
TW202236562A TW202236562A (en) 2022-09-16
TWI800049B true TWI800049B (en) 2023-04-21

Family

ID=80141722

Family Applications (3)

Application Number Title Priority Date Filing Date
TW110212504U TWM625448U (en) 2020-10-24 2021-10-22 Chip packaging and chip structure
TW111139131A TWI829392B (en) 2020-10-24 2021-10-22 Chip packaging method and chip structure
TW110139387A TWI800049B (en) 2020-10-24 2021-10-22 Chip packaging method and chip structure

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW110212504U TWM625448U (en) 2020-10-24 2021-10-22 Chip packaging and chip structure
TW111139131A TWI829392B (en) 2020-10-24 2021-10-22 Chip packaging method and chip structure

Country Status (2)

Country Link
CN (3) CN114038843B (en)
TW (3) TWM625448U (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12506055B2 (en) 2017-11-29 2025-12-23 Pep Innovation Pte. Ltd. Chip packaging method and chip structure
TWM625448U (en) * 2020-10-24 2022-04-11 新加坡商Ｐｅｐ創新私人有限公司 Chip packaging and chip structure
KR102770115B1 (en) * 2022-05-24 2025-02-20 주식회사 티에스이 Test apparatus for semiconductor package
CN114999934B (en) * 2022-07-18 2022-10-21 威海艾迪科电子科技股份有限公司 Semiconductor packaging structure and forming method thereof
US20240222339A1 (en) * 2022-12-30 2024-07-04 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same
CN116487357A (en) * 2023-03-14 2023-07-25 珠海越亚半导体股份有限公司 Metal frame chip embedded packaging substrate and manufacturing method thereof
CN116417356B (en) * 2023-06-12 2023-09-05 甬矽半导体(宁波)有限公司 Chip packaging method, chip packaging module and embedded substrate type chip packaging structure
TWI876771B (en) * 2023-12-15 2025-03-11 立錡科技股份有限公司 Package structure
TWI892723B (en) * 2024-06-26 2025-08-01 同欣電子工業股份有限公司 Chip package structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150380356A1 (en) * 2013-09-26 2015-12-31 General Electric Company Embedded semiconductor device package and method of manufacturing thereof
TW201830590A (en) * 2013-03-14 2018-08-16 美商奇異電器公司 Power overlay structure and method of making same
TWM591703U (en) * 2019-03-11 2020-03-01 新加坡商Ｐｅｐ創新私人有限公司 Chip structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7948095B2 (en) * 2008-02-12 2011-05-24 United Test And Assembly Center Ltd. Semiconductor package and method of making the same
JP5636265B2 (en) * 2010-11-15 2014-12-03 新光電気工業株式会社 Semiconductor package and manufacturing method thereof
US9040346B2 (en) * 2012-05-03 2015-05-26 Infineon Technologies Ag Semiconductor package and methods of formation thereof
CN205004324U (en) * 2015-09-10 2016-01-27 中山大洋电机股份有限公司 An intelligent power module chip
CN106601702A (en) * 2017-01-23 2017-04-26 合肥雷诚微电子有限责任公司 Multi-chip linear power amplification structure without substrate and with high heat dissipation and manufacturing method thereof
US11114315B2 (en) * 2017-11-29 2021-09-07 Pep Innovation Pte. Ltd. Chip packaging method and package structure
CN111599696A (en) * 2020-05-28 2020-08-28 矽磐微电子(重庆)有限公司 Semiconductor module packaging method and semiconductor module
TWM625448U (en) * 2020-10-24 2022-04-11 新加坡商Ｐｅｐ創新私人有限公司 Chip packaging and chip structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201830590A (en) * 2013-03-14 2018-08-16 美商奇異電器公司 Power overlay structure and method of making same
US20150380356A1 (en) * 2013-09-26 2015-12-31 General Electric Company Embedded semiconductor device package and method of manufacturing thereof
TWM591703U (en) * 2019-03-11 2020-03-01 新加坡商Ｐｅｐ創新私人有限公司 Chip structure

Also Published As

Publication number Publication date
CN120897497A (en) 2025-11-04
TW202308086A (en) 2023-02-16
CN114038843B (en) 2025-09-05
CN217035634U (en) 2022-07-22
TW202236562A (en) 2022-09-16
CN114038843A (en) 2022-02-11
TWM625448U (en) 2022-04-11
TWI829392B (en) 2024-01-11

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