TWI899112B - High density plasma enhanced chemical vapor deposition chamber - Google Patents

Abstract

The present disclosure relates to methods and apparatus for showerhead for a deposition chamber. In one embodiment, a showerhead for a plasma deposition chamber is provided that includes a plurality of perforated tiles each coupled to one or more of a plurality of support members, and a plurality of inductive couplers within the showerhead, wherein one inductive coupler of the plurality of inductive couplers corresponds to one of the plurality of perforated tiles, wherein the support members provide precursor gases to a volume formed between the inductive couplers and the perforated tiles.

Description

High-density plasma enhanced chemical vapor deposition chamber

Embodiments of the present disclosure generally relate to an apparatus for processing large-area substrates. More particularly, embodiments of the present disclosure relate to a chemical vapor deposition system for device fabrication.

In the manufacture of solar panels and flat panel displays, a number of processes are utilized to deposit thin films onto substrates, such as semiconductor substrates, solar panel substrates, and liquid crystal display (LCD) and/or organic light-emitting diode (OLED) substrates, to form electronic devices thereon. Deposition is generally accomplished by introducing a precursor gas into a vacuum chamber having a substrate disposed on a temperature-controlled substrate support. The precursor gas is typically introduced via a gas distribution plate located near the top of the vacuum chamber. The precursor gas in the vacuum chamber can be energized (e.g., excited) into a plasma by applying radio frequency (RF) power from one or more RF sources coupled to the chamber to a conductive showerhead disposed in the chamber. The excited gas reacts to form a layer of material on the surface of a substrate positioned on a temperature-controlled substrate support.

The size of substrates used to form electronic devices now routinely exceeds 1 square meter in surface area. Achieving uniform film thickness across these substrates is difficult. As substrate size increases, film thickness uniformity becomes even more challenging. Traditionally, capacitively coupled electrode arrangements have been used to deposit films on substrates of this size, using plasmas formed in conventional chambers to ionize gas atoms and form radicals from the deposition gas. Recently, inductively coupled plasma arrangements, historically utilized for deposition on round substrates or wafers, are being explored for use in deposition processes on these large substrates. However, inductive coupling utilizes dielectric materials as structural support components, and these materials do not have the structural strength to withstand the structural loads created by atmospheric pressure on one side of the chamber's large structural portion above the atmosphere, and vacuum pressure conditions on the other side, as used in conventional chambers for such large substrates. Consequently, inductively coupled plasma systems have been developed for plasma processing of large substrates. However, process uniformity, such as deposition thickness uniformity across large substrates, has been less than ideal.

Therefore, a need exists for an inductively coupled plasma source for use with large area substrates that is configured to improve film thickness uniformity across the deposition surface of the substrate.

Embodiments of the present disclosure include methods and apparatus for a showerhead, and a plasma deposition chamber having a showerhead, capable of forming one or more films on large area substrates.

In one embodiment, a showerhead for a plasma deposition chamber is provided, comprising a plurality of perforated bricks, each coupled to one or more of a plurality of support members, and a plurality of inductive couplers within the showerhead, wherein one of the plurality of inductive couplers corresponds to one of the plurality of perforated bricks, wherein the support members provide a precursor gas to a space formed between the inductive couplers and the perforated bricks.

In another embodiment, a plasma deposition chamber is provided that includes a showerhead having a plurality of perforated bricks, an inductive coupler corresponding to one or more of the plurality of perforated bricks, and a plurality of support members for supporting each of the perforated bricks, wherein one or more of the support members provides a precursor gas to a space formed between the inductive coupler and the perforated brick.

In another embodiment, a plasma deposition chamber is provided, comprising a showerhead having a plurality of perforated bricks, each coupled to one or more of a plurality of support members, a plurality of dielectric plates, one of the plurality of dielectric plates corresponding to one of the plurality of perforated bricks, and a plurality of inductive couplers, one of the plurality of inductive couplers corresponding to one of the plurality of dielectric plates, wherein the support members provide a precursor gas to a space formed between the inductive couplers and the perforated bricks.

In another embodiment, a method for depositing a film on a substrate is disclosed, comprising flowing a precursor gas to a plurality of gas spaces of a showerhead, each of the gas spaces comprising a perforated brick and an inductive coupler electrically connected to the respective gas space, and varying the flow of the precursor gas into each of the gas spaces.

Embodiments of the present disclosure include processing systems operable to deposit multiple layers onto large-area substrates. As used herein, a large-area substrate is one having a major side with a large surface area, such as a substrate having a surface area typically of about 1 square meter or greater. However, substrates are not limited to any particular size or shape. In one aspect, the term "substrate" refers to any polygonal, square, rectangular, curved, or non-circular workpiece, such as a glass or polymer substrate, such as used in the manufacture of flat panel displays.

Here, a showerhead is configured to flow gas through a process volume of a chamber in a plurality of independently controlled zones to improve the uniformity of treatment of the surface of a substrate exposed to the gas in the process zone. In addition, each zone is configured with a plenum, one or more perforated plates between the plenum and the process volume of the chamber, and a coil or portion of a coil dedicated to the zone or individual perforated plates. The plenum is formed between the dielectric window, the perforated plates, and the surrounding structure. Each plenum is configured to allow the process gas to flow and be distributed as a result of a relatively uniform flow rate, or in some cases a flow rate customized for the gas, through the perforated plates and into the process volume. In some embodiments, the plenum has a thickness that is less than twice the thickness of a dark compartment of a plasma formed by the process gas under pressure within the plenum. In certain embodiments, an inductive coupler in the form of a coil is positioned behind the dielectric window and inductively couples energy through the dielectric window, plenum, and perforated plate to impact and support the plasma in the processing volume. Additionally, additional process gas flow is provided in the region between adjacent perforated plates. The flow of process gas in each region and through the region between the perforated plates is controlled to produce a uniform or customized gas flow to achieve the desired processing results on the substrate.

Embodiments of the present disclosure include a high-density plasma chemical vapor deposition (HDP CVD) processing chamber operable to form one or more film layers on a substrate. The processing chamber disclosed herein is adapted to deliver energized precursor gas species generated in a plasma. The plasma may be generated by inductively coupling energy into a gas under vacuum. The embodiments disclosed herein may be adapted for use in chambers manufactured by AKT America, Inc., a subsidiary of Applied Materials, Inc., located in Santa Clara, California. It should be understood that the embodiments discussed herein may also be implemented in chambers available from other manufacturers.

FIG. 1 is a cross-sectional side view of an illustrative processing chamber 100 according to one embodiment of the present disclosure. An example substrate 102 is shown within a chamber body 104. The processing chamber 100 also includes a lid assembly 106 and a pedestal or substrate support assembly 108. The lid assembly 106 is disposed at an upper end of the chamber body 104, and the substrate support assembly 108 is at least partially disposed within the chamber body 104. The substrate support assembly 108 is coupled to a rod 110. The rod 110 is coupled to a drive 112 that moves the substrate support assembly 108 vertically (in the Z direction) within the chamber body 104. The substrate support assembly 108 of the processing chamber 100 shown in FIG. 1 is in a processing position. However, the substrate support assembly 108 can be lowered in the Z direction to a position adjacent to the transfer opening 114. While lowered, lift pins 116 movably disposed within the substrate support assembly 108 contact the bottom 118 of the chamber body 104. Once the lift pins 116 contact the bottom 118, they can no longer move downward with the substrate support assembly 108 and maintain the substrate 102 in a relatively fixed position as the substrate receiving surface 120 of the substrate support assembly 108 moves downward therefrom. Thereafter, an end effector or robot blade (not shown) is inserted into the transfer opening 114 and between the substrate 102 and the substrate receiving surface 120 to transfer the substrate 102 out of the chamber body 104.

The lid assembly 106 may include a backing plate 122 positioned on the chamber body 104. The lid assembly 106 also includes a gas distribution assembly or showerhead 124. The showerhead 124 delivers a process gas from a gas source to a processing region 126 between the showerhead 124 and the substrate 102. The showerhead 124 is also coupled to a purge gas source that provides a purge gas, such as a fluorine-containing gas, to the processing region 126.

The showerhead 124 also functions as a plasma source 128. To function as the plasma source 128, the showerhead 124 includes one or more inductively coupled plasma generating components, or coils 130. Each of the one or more coils 130 can be a single coil 130, two coils 130, or more than two coils 130 and will hereinafter be referred to simply as a coil 130. Each of the one or more coils 130 is coupled across a power source and a ground 133. The showerhead 124 also includes a faceplate 132 comprising a plurality of discrete perforated bricks 134. The power source includes matching circuitry or regulation capabilities for adjusting the electrical characteristics of the coils 130.

Each of the perforated bricks 134 is supported by a plurality of support members 136. Each of the one or more coils 130, or portions of one or more coils 130, is positioned on or above a respective dielectric plate 138. An example of a coil 130 positioned above a dielectric plate 138 within the cover assembly 106 is more clearly shown in FIG. 2A. A plurality of air spaces 140 are defined by the surfaces of the dielectric plate 138, the perforated bricks 134, and the support members 136. Each of the one or more coils 130 is configured to establish an electric field that energizes the process gas into a plasma in the process region 126 below the gas space 140 as the gas flows into the gas space 140 and through adjacent perforated bricks to the chamber space below. Process gas from a gas source is provided to each of the gas spaces 140 via conduits in the support member 136. The volume or flow rate of gas entering and exiting the showerhead is controlled in different zones of the showerhead 124. Zone control of the process gas is provided by a plurality of flow controllers, such as the mass flow controllers 142, 143, and 144 shown in FIG. 1 . For example, the flow rate of gas to the periphery or outer region of the showerhead 124 is controlled by flow controllers 142, 143, while the flow rate of gas to the central region of the showerhead 124 is controlled by flow controller 144. When chamber cleaning is required, clean gas from a clean gas source flows to each of the gas spaces 140 and, thus, into the processing region 126, where the clean gas is energized into ions, free radicals, or both. The energized clean gas flows through the perforated bricks 134 and into the processing region 126 to clean the chamber components.

FIG. 2A is an enlarged view of a portion of the cover assembly 106 of FIG. 1 . As explained above, precursor gas flows from a gas source through inlets 200 formed by the backing plate 122 to the gas space 140. Each of the inlets 200 is coupled to a respective conduit 205 formed in the support member 136. The conduits 205 provide the precursor gas to the gas space 140 at outlet openings 210. Some of the conduits 205 provide gas to two adjacent gas spaces 140 (one of the conduits 205 is shown in dashed lines in FIG. 2A ). The gas flow to the respective gas spaces 140 is more clearly shown in FIG. 4 .

The conduit 205 includes a flow restrictor 215 to control flow into the gas space 140. The size of the flow restrictor 215 can be varied to control the flow of gas therethrough. For example, each of the flow restrictors 215 includes an orifice of a specific size (e.g., diameter) to control flow. Furthermore, the size of each of the flow restrictors 215 can be varied as needed to provide a larger orifice size, or a smaller orifice size, as needed to control flow therethrough.

As shown in FIG. 2A , the perforated brick 134 includes a plurality of openings 218 extending therethrough. Each of the openings 218 is aligned (concentric) with an opening 220 formed in the cover plate 222. The plurality of openings 218 and each of the openings 220 allow gas to flow from the gas space 140 into the processing region 126 at a desired flow rate, depending on the diameter of the openings 218 extending between the gas space 140 and the cover plate 222. The openings 218 and/or 220, and/or the rows and columns of openings 218 and/or 220, can be designed with different sizes and/or have different spacings to even out the flow of gas through each of the perforated bricks 134 and each of the cover plates 222. Alternatively, the gas flow from each of openings 218 and/or 220 may be non-uniform, depending on the desired gas flow characteristics.

Each of the cover plates 222 includes a fixed portion 225 that surrounds the side of the perforated brick 134. Each fixed portion 225 includes a plurality of openings 230 that allow gas to flow from the conduit 205 into the secondary plenum 235 and then into the processing area 126.

The support members 136 are coupled to the back plate 122 by fasteners 240, such as screws or bolts. Each of the support members 136 supports the perforated brick 134 with an interface portion 245 of the cover plate 222. Each of the interface portions 245 can be a ledge or shelf that supports a portion of the perimeter or edge of the perforated brick 134. The interface portion 245 is secured to the support member 136 by fasteners 250, such as screws or bolts. Portions of the interface portion 245 include the secondary air chamber 235. Each of the interface portions 245 also supports the perimeter or edge of the perforated brick 134. One or more seals 265 are used to seal the gas space 140. For example, seal 265 is a resilient material, such as an O-ring seal or a polytetrafluoroethylene (PTFE) joint seal. One or more seals 265 may be provided between support member 136 and perforated brick 134 and fixed portion 225 of cover plate 222. Cover plate 222 may be removed as necessary to replace one or more perforated bricks 134.

Furthermore, each of the support members 136 supports the dielectric plate 138 (shown in FIG. 2A ) by means of a shelf 270 extending therefrom. In the showerhead 124/plasma source 128 embodiment, the dielectric plate 138 has a smaller lateral surface area (in the X-Y plane) than the entire showerhead 124/plasma source 128. Shelves 270 are utilized to support the dielectric plate 138. The reduced lateral surface area of the multiple dielectric plates 138 allows the dielectric material to be used as a physical shield between the vacuum environment and the plasma in the gas space 140 and the processing region 126 and the atmospheric environment in which the adjacent coil 130 is typically located without imparting large stresses therein due to the large area supporting the atmospheric pressure load.

Seal 265 is used to seal space 275 (at atmospheric or near atmospheric pressure) from gas space 140 (at subatmospheric pressure in the millitorr or less range during processing). Interface member 280 is shown extending from support member 136 and utilizes fasteners 285 to push dielectric plate 138 against seal 265 and shelf 270. Seal 265 can also be used to seal the space between the outer periphery of perforated brick 134 and support member 136.

The material used for the shower head 124/plasma source 128 is selected based on one or more of electrical properties, strength and chemical stability. The coil 130 is made of a conductive material. The back plate 122 and the support member 136 are made of a material capable of supporting the weight of the supported components and the atmospheric pressure load, and may include metal or other similar materials. The back plate 122 and the support member 136 can be made of a non-magnetic material (for example, a non-paramagnetic or non-ferromagnetic material), such as an aluminum material. The cover plate 222 is also formed of a non-magnetic material, such as a metal material, such as aluminum. The perforated brick 134 is made of a ceramic material, such as quartz, alumina or other similar materials. The dielectric plate 138 is made of quartz, alumina or sapphire material.

FIG2B is a top plan view of one embodiment of a coil 130 positioned on a dielectric plate 138 built into the cover assembly 106. In one embodiment, the coil 130 configuration shown in FIG2B can be used such that the illustrated coil configuration is individually formed on each of the dielectric plates 138, such that each planar coil is connected in series with adjacently positioned coils 130 in a desired pattern across the showerhead 124. The coil 130 includes a conductive pattern 290 in the shape of a rectangular spiral. The electrical connection includes an electrical input terminal 295A and an electrical output terminal 295B. Each of the one or more coils 130 of the showerhead 124 is connected in series and/or in parallel.

FIG3A is a bottom plan view of one embodiment of the faceplate 132 of the showerhead 124. As described above, the showerhead 124 is configured to include one or more zones, each with independently controlled gas flow. For example, the faceplate 132 includes a central zone 300A, middle zones _300B1 and _300B2 , and outer zones _300C1 and _300C2 .

Showerhead 124 includes a gas distribution manifold 305 that controls gas flow to each of the central zone 300A, the middle zones _300B1 and _300B2 , and the outer zones _300C1 and _300C2 . Gas flow to the zones is controlled by a plurality of flow controllers 310, which are shown as flow controllers 142, 143, and 144 in FIG. Each flow controller 310 can be a needle valve or a mass flow controller. Flow controller 130 can also include a diaphragm valve to start or stop gas flow.

FIG3B is a partial bottom plan view of another embodiment of the face plate 132 of the showerhead 124. In this embodiment, the perforated bricks 134 are supported by a cover plate 222. Fasteners 250 are used to secure the perforated cover plate 222 to the support member 136, which is not shown in this view because it is behind the cover plate 222.

FIG4 is a schematic bottom plan view of another embodiment of a showerhead 124, illustrating a gas flow pattern injected into a gas space 140 formed within the showerhead 124. The length 400 and width 405 of the substrate are shown on the side of the showerhead 124. Propellant flow to the gas space 140 can be provided unidirectionally, as indicated by arrow 410, or bidirectionally, as indicated by arrow 415. Propellant flow control can be provided by flow controllers 142, 143, and 144 (shown in FIG1). Furthermore, gas flow zones, such as edge zones 420, corner zones 425, and center zones 430, can be provided by flow controllers 142, 143, and 144 (shown in FIG1). The precursor flow rate to the gas space 140 and/or each of the zones can be adjusted by changing the size of one or a combination of the opening 220, the opening 230, and the restrictor 215 (all shown in FIG. 2A).

The flow rates to each of the gas spaces 140 can be the same or different. The flow rates to the gas space 140 can be controlled by mass flow controllers 142, 143, and 144 shown in FIG. 1 . The flow rate to the gas space 140 can be additionally controlled by the size of the restrictor 215 as described above. The flow rate to the processing area 126 can be controlled by the size of the openings 220 in the perforated bricks 134 and the size of the openings 230 in the cover plate 222. Bidirectional flow or unidirectional flow into the gas space 140 can be utilized as needed to provide sufficient gas flow to the processing area 126.

Methods of controlling gas flow include 1) multiple zones (center/edge/corner/any other zone) of different flow rates from mass flow controllers 142, 143, and 144; 2) flow control by varying orifice sizes (size of restrictor 215); 3) flow direction control (unidirectional or bidirectional) into the gas space 140; and 4) flow control by the size of the openings 220 in the perforated bricks 134, the number of openings 220 in the perforated bricks 134, and/or the location of the openings 220 in the perforated bricks 134. The mass flow rate of gas provided by the showerhead 124 as described herein is improved by approximately 280 percent in non-uniformity percentage (NU%) (e.g., from 57% non-uniformity (prior art) to approximately 15% non-uniformity).

FIG5 is a bottom cross-sectional view of the support frame 500, viewed along the section line shown in FIG1. The support frame 500 is composed of a plurality of support members 136. The support frame 500 in FIG5 is cut along a cross-section of the conduit 205, showing the various sizes (orifice sizes) of the flow restrictors 215. In one embodiment, the various orifices of each flow restrictor 215 can be changed or configured based on the desired gas flow characteristics.

In this embodiment, each of the flow restrictors 215 includes a first diameter portion 505, a second diameter portion 510, and a third diameter portion 515. The diameters of the first diameter portion 505, the second diameter portion 510, and the third diameter portion 515 can be different or the same. The diameters can be selected based on the desired flow characteristics for the showerhead 124. In one embodiment, the first diameter portion 505 has the smallest diameter, the third diameter portion 515 has the largest diameter, and the second diameter portion 510 has a diameter between the first diameter portion 505 and the third diameter portion 515. In the illustrated embodiment, a plurality of flow restrictors 215 having a first diameter portion 505 are shown in a central portion of the support frame 500 , while a plurality of flow restrictors 215 having a third diameter portion 515 are shown in an outer portion of the support frame 500 .

Additionally, a plurality of flow restrictors 215 having a second diameter portion 510 are shown in the middle region between the central portion and the outer portion. In other embodiments, the positions of the flow restrictors 215 having the first diameter portion 505, the second diameter portion 510, and the third diameter portion 515 as shown in FIG. 5 may be reversed within the support frame 500. Alternatively, the flow restrictors 215 having the first diameter portion 505, the second diameter portion 510, and the third diameter portion 515 may be positioned in various portions of the support frame 500 depending on the desired characteristics and the control of the gas space 140. Uniform gas flow across the showerhead 124 may be desirable in some embodiments. However, in other embodiments, the gas flow to each of the gas spaces 140 of the showerhead 124 may be non-uniform. The non-uniform gas flow may be due to certain physical structures and/or geometries of the processing chamber 100. For example, it may be desirable to have more gas flow in the portion of the showerhead 124 adjacent to the transfer port 114 (shown in FIG. 1 ) than in other portions of the showerhead 124.

FIG6 is a schematic cross-sectional view of one embodiment of an inlet 200 that can be used with the showerhead 124 described herein. The inlet 200 includes a conduit 205 and includes a flow restrictor 215 as described in FIG2A . In some embodiments, the diameter 600 of the outlet opening 210 of the flow restrictor 215 includes a first dimension 605A of approximately 1.4 millimeters (mm) to approximately 1.6 mm. In other embodiments, the diameter 600 of the outlet opening 210 of the flow restrictor 215 includes a second dimension 605B of approximately 1.9 mm to approximately 2.1 mm. The diameter 600 of the outlet opening 210 varies across the dimensions (e.g., length/width) of the showerhead 124. For example, a flow restrictor 215 having the first dimension 605A can be utilized in the central region 300A described above in FIG3A . The flow restrictor 215 having the second dimension 605B can be utilized in regions of the showerhead 124 outside of the central region 300A described above in FIG. 3A (e.g., the middle regions _300B1 and _300B2 , and the outer regions _300C1 and _300C2 ). Furthermore, the flow restrictor 215 can be included in the showerhead 124 in various lengths 610. In some embodiments, the length 610 includes a first length 615A that can be approximately 11 mm to approximately 12 mm. In other embodiments, the length 610 of the flow restrictor 215 includes a second length 615B that is approximately 22 mm to approximately 24 mm. The flow restrictor 215 having the first length 615A can be utilized in the central region 300A described above in FIG. 3A. The flow restrictor 215 having the second length 615B can be utilized in areas of the showerhead 124 other than the central area 300A described above in FIG. 3A (e.g., the middle areas _300B1 and _300B2 , and the outer areas _300C1 and _300C2 ). As described above, the term "approximately" with respect to "size" and/or "length" is defined as +/- 0.01 mm.

Figures 7A and 7B show various views of one embodiment of a perforated brick 134 that can be used with the showerhead 124 described herein. Figure 7A shows a bottom plan view of a first surface 700 of the perforated brick 134, facing the cover plate 222 (shown in Figure 2A). Figure 7B shows a schematic cross-sectional view of one of the openings 218 formed in the perforated brick 134.

The perforated brick 134 includes a body 705 made of a ceramic material, such as _aluminum oxide ( _Al2O3 ). The body 705 includes a first surface 700 and a second surface 710 (shown in FIG. 7B ) opposite the first surface 700. The first and second surfaces 700, 710 are substantially parallel. At least the second surface 710 has a flatness of approximately 0.005 inches or less (according to engineering tolerances defined by geometric dimensioning and tolerancing (GD&T)). The peripheral edge 720 of the body 705 includes a plurality of openings 218 formed between the first and second surfaces 700, 710.

The first surface 700 includes a recessed surface 715 that interfaces between the first surface 700 and the peripheral edge 720 of the body 705. The recessed surface 715 includes a transition region 725. The transition region 725 may be a sharp shoulder or bevel that begins at the edge of the first surface 700 and extends to the peripheral edge 720 of the body 705. The transition region 725 includes rounded corners 730. The peripheral edge 720 of the body 705 includes squared corners 735.

One of the plurality of openings 218 is shown in FIG. 7B . Opening 218 includes an inlet or first hole 740 formed in second surface 710 . Opening 218 also includes an outlet or second hole 745 formed in first surface 700 . First hole 740 and second hole 745 are fluidly connected via step hole 750 . Each of first hole 740 and second hole 745 includes a flared sidewall 755 . Flared sidewall 755 may include an angle α of approximately 90 degrees (e.g., approximately 45 degrees from the plane of surfaces 700 and 710 ).

Step hole 750 includes a first orifice 760 and a second orifice 765. First orifice 760 includes a diameter 770, and second orifice 765 includes a diameter 775. Diameter 775 is larger than diameter 770. A flared section 780 is provided between first orifice 760 and second orifice 765. Flared section 780 includes an angle α of approximately 90 degrees. Diameter 770 may be approximately 0.017 inches to approximately 0.018 inches.

Embodiments of the present disclosure include methods and apparatus for a showerhead and a plasma deposition chamber having the showerhead, capable of forming one or more films on large-area substrates. Plasma uniformity and gas (or precursor) flow are controlled by a combination of the configuration of individual perforated bricks 134, coils 130 dedicated to the perforated bricks 134, and/or flow controllers 142, 143, and 144, and varying the size and/or position of flow restrictors 215.

While the above is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be derived without departing from the basic scope thereof, the scope of which is determined by the following claims.

100: Processing chamber 102: Substrate 104: Chamber body 106: Lid assembly 108: Substrate support assembly 110: Rod 112: Drive 114: Transfer port 116: Lift pins 118: Bottom 120: Substrate receiving surface 122: Backing plate 124: Showerhead 126: Processing area 128: Plasma source 130: Coil 132: Faceplate 133: Grounding 134: Perforated brick 136: Support member 138: Dielectric plate 140: Gas space 142: Mass flow controller 143: Mass flow controller 144: Flow controller 200: Inlet 205: Conduit 210: Outlet Opening 215: Flow Restrictor 218: Opening 220: Opening 222: Cover Plate 225: Mounting Section 230: Opening 235: Secondary Chamber 240: Fastener 245: Interface Section 250: Fastener 265: Seal 270: Shelf 275: Space 280: Interface Component 285: Fastener 290: Conductor Pattern 295A: Electrical Input Terminals 295B: Electrical Output Terminals 300A: Center Section 300B: Middle Section 300C: External Section 305: Gas Distribution Manifold 310: Flow Controller 400: Length 405: Width 410: Arrow 415: Arrow 420: Edge 425: Corner 430: Center 500: Support Frame 505: First Diameter 510: Second Diameter 515: Third Diameter 600: Diameter 605A: First Dimension 605B: Second Dimension 610: Length 615A: First Length 615B: Second Length 700: First Surface 705: Main Body 710: Second Surface 715: Surface 720: Peripheral Edge 725: Transition 730: Corner 735: Square Corner 740: First Hole 745: Second hole 750: Hole 755: Sidewall 760: First opening 765: Second opening 770: Diameter 775: Diameter 780: Flared section

In order to understand the features of the present disclosure described above in detail, a more particular description of the present disclosure, briefly summarized above, can be obtained by reference to the following embodiments, some of which are illustrated in the accompanying drawings. However, it should be understood that the accompanying drawings illustrate only typical embodiments of the present disclosure and are therefore not to be considered limiting of its scope, as the present disclosure may admit to other equally effective embodiments.

FIG. 1 is a cross-sectional side view of an illustrative processing chamber according to one embodiment of the present disclosure.

FIG. 2A is an enlarged view of a portion of the cover assembly of FIG. 1 .

Figure 2B is a top plan view of one embodiment of a coil.

FIG. 3A is a bottom plan view of one embodiment of a face plate of a showerhead.

FIG3B is a partial bottom plan view of another embodiment of a face plate of a showerhead.

FIG4 is a schematic bottom plan view showing another embodiment of flow control for a showerhead.

Figure 5 is a cross-sectional plan view of the support frame for the shower head.

FIG. 6 is a schematic cross-sectional view of one embodiment of an inlet that may be used with the showerheads described herein.

FIG. 7A is a plan view of a perforated brick for use with the showerhead described herein.

FIG. 7B is a schematic cross-sectional view of one of the openings formed in the perforated brick of FIG. 7A .

To facilitate understanding, like reference numerals have been used, where possible, to designate like elements in common drawings. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation.

Domestic Storage Information (Please enter in order by institution, date, and number) None International Storage Information (Please enter in order by country, institution, date, and number) None

106: Cover assembly 122: Back plate 124: Shower head 126: Treatment area 128: Plasma source 130: Coil 132: Faceplate 133: Grounding 134: Perforated brick 136: Support member 138: Dielectric plate 140: Gas space 200: Inlet 205: Conduit 210: Outlet opening 215: Restrictor 218: Opening 220: Opening 222: Cover plate 225: Mounting section 230: Opening 235: Secondary plenum 240: Fastener 245: Interface section 250: Fastener 265: Seal 270: Shelves 275: Space 280: Interface Components 285: Fasteners

Claims (15)

A plasma deposition chamber comprises: a chamber body arranged around an interior space; a substrate support in the interior space; and a showerhead positioned on the substrate support; the showerhead comprising: a plurality of support members; a plurality of perforated bricks, each coupled to one or more of the plurality of support members; a plurality of dielectric plates positioned to be separated from the plurality of perforated bricks; and a plurality of inductive couplers positioned on each of the plurality of dielectric plates, wherein the plurality of inductive couplers are positioned on the plurality of dielectric plates. Each of the plurality of support members includes a duct configured to provide a precursor gas to a space formed between one of the dielectric plates and one of the perforated bricks, each duct including a flow restrictor, the plurality of support members including a first support member and a second support member, the flow restrictor of the duct in the first support member having a first length, and the flow restrictor of the duct in the second support member having a second length different from the first length. The chamber of claim 1, wherein the flow restrictor of the conduit in the first support member has a first diameter, and the flow restrictor of the conduit in the second support member has a second diameter different from the first diameter. The chamber of claim 1, wherein each of the plurality of perforated bricks and the plurality of support members includes an interface portion. The chamber of claim 1 further comprising a cover plate positioned around each of the perforated bricks. The chamber of claim 4, wherein the cover plate includes an opening formed therein. The chamber of claim 5, wherein each perforated brick includes openings aligned with the openings formed in the cover plate. The chamber of claim 1, wherein the showerhead is divided into a dispersed gas delivery zone comprising a central zone, a middle zone adjacent to the central zone, and an outer zone adjacent to the middle zone. A showerhead for a plasma deposition chamber, the showerhead comprising: a plurality of support members, including a first support member and a second support member, each support member comprising one or more first support surfaces and one or more second support surfaces, wherein the plurality of first support surfaces are arranged to be separated from the plurality of second support surfaces; a plurality of gas delivery assemblies, comprising a plurality of perforated bricks and a plurality of dielectric plates positioned to be separated from the plurality of perforated bricks, wherein each of the plurality of gas delivery assemblies comprises: a perforated brick disposed on a first support surface of the plurality of first support surfaces; and a dielectric plate disposed on the plurality of second support surfaces. a second support surface of the dielectric board and a second support surface of the perforated brick; wherein a gas space is defined between a surface of the dielectric board and a surface of the perforated brick; a plurality of conduits, including a first conduit in the first support member and a second conduit in the second support member, each conduit configured to provide a precursor gas to one of the gas spaces of the plurality of gas delivery components, wherein each of the conduits includes a flow restrictor, the flow restrictor of the first conduit having a first length, and the flow restrictor of the second conduit having a second length different from the first length; and a coil disposed on each of the plurality of gas delivery components in the showerhead. The showerhead of claim 8, wherein the flow restrictor of the first conduit in the first support member has a first diameter, and the flow restrictor of the second conduit in the second support member has a second diameter different from the first diameter. The shower head of claim 8, wherein each of the plurality of perforated bricks and the supporting member includes an interface portion. The shower head as described in claim 8 further includes a cover plate positioned around each of the perforated bricks. A showerhead for a plasma deposition chamber, the showerhead comprising: a plurality of support members, including a first support member and a second support member, each support member comprising one or more first support surfaces and one or more second support surfaces, wherein the plurality of first support surfaces are arranged to be separated from the plurality of second support surfaces; a plurality of gas delivery assemblies, comprising a plurality of perforated bricks and a plurality of dielectric plates positioned to be separated from the plurality of perforated bricks, wherein each of the plurality of gas delivery assemblies comprises: a perforated brick arranged on a first support surface of the plurality of first support surfaces; and a dielectric plate arranged On a second support surface of the plurality of second support surfaces; wherein a gas space is defined and integrated between a surface of the dielectric plate and a surface of the perforated brick; a plurality of conduits, including a first conduit in the first support member and a second conduit in the second support member, each conduit configured to provide a precursor gas to one of the gas spaces of the plurality of gas delivery assemblies, wherein each of the conduits includes a flow restrictor, the flow restrictor of the first conduit having a first length and the flow restrictor of the second conduit having a second length different from the first length; and a coil coupled to the dielectric plate in the showerhead. The showerhead of claim 12, wherein the flow restrictor of the conduit in the first support member has a first diameter, and the flow restrictor of the conduit in the second support member has a second diameter different from the first diameter. The shower head as claimed in claim 12, wherein each of the perforated bricks and the supporting member includes an interface portion. The shower head of claim 14, wherein each interface portion includes a ledge supporting a portion of a periphery of the perforated bricks.