TWI898470B - Motherboard moudle - Google Patents

Abstract

A motherboard module including a circuit board, a first electrical connector, a motherboard, a second electrical connector, a processor and a heat sink is provided. The first electrical connector is disposed on the circuit board. The motherboard is detachably fixed on the circuit board, and has a first surface facing the circuit board and a second surface opposite to the first surface. The second electrical connector is disposed on the first surface and plugged into the first electrical connector. The processor is disposed on the second surface. The heat sink is detachably fixed on the second surface and thermally coupled to the processor.

Description

Motherboard module

The present invention relates to a motherboard, and more particularly to a motherboard module.

The CPU, GPU, memory, cooling module (e.g., fan, heat pipe, and heat sink combination), and other electronic components on motherboards of different specifications may vary, such as in size, shape, or layout. Therefore, as specifications change, the layout of the electronic components on the motherboard must be completely redesigned, which is time-consuming, costly, and labor-intensive. Furthermore, if a user requires a specification change, the old motherboard must be completely removed and replaced with a new one, and electrical connections (e.g., signal or power lines) must be made one by one. This is not only difficult to disassemble and assemble, but also expensive to replace.

The present invention provides a motherboard module that is not only easy for users to disassemble and replace, but also helps reduce replacement costs.

The present invention provides a motherboard module comprising a circuit board, a first electrical connector, a motherboard, a second electrical connector, a processor, and a heat sink. The first electrical connector is disposed on the circuit board. The motherboard is removably secured to the circuit board and has a first surface facing the circuit board and a second surface opposite the first surface. The second electrical connector is disposed on the first surface and plugs into the first electrical connector. The processor is disposed on the second surface. The heat sink is removably secured to the second surface and thermally coupled to the processor.

Based on the above, in the motherboard module of the present invention, the heat sink is detachable from the mainboard, and the motherboard is also detachable from the circuit board. If the user needs to change specifications, they can quickly replace the old motherboard with a new one. Electrical connections (such as signal or power lines) can also be made simultaneously with the installation of the new motherboard on the circuit board. This not only simplifies assembly and disassembly but also helps reduce replacement costs.

In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings.

Figure 1A is a schematic side view of a motherboard module according to one embodiment of the present invention. Figure 1B is a schematic disassembled view of the motherboard module according to one embodiment of the present invention. Referring to Figures 1A and 1B , in this embodiment, motherboard module 100 is suitable for use in a laptop or other type of electronic device. Specifically, motherboard module 100 includes a circuit carrier 110, a first electrical connector 120, a motherboard 130, a second electrical connector 140, a processor 150, and a heat sink module 160. Motherboard 130 is removably secured to circuit carrier 110, and heat sink module 160 is removably secured to motherboard 130.

The first electrical connector 120 may be a socket connector provided on the circuit board 110, and the second electrical connector 140 may be a plug connector provided on the motherboard 130. Specifically, the motherboard 130 has a first surface 131 facing the circuit board 110 and a second surface 132 opposite the first surface 131. The second electrical connector 140 is provided on the first surface 131 to be plugged into the first electrical connector 120. In other words, the motherboard 130 can be electrically connected to the circuit board 110 via the second electrical connector 140 and the first electrical connector 120 to transmit signals or power.

As shown in Figures 1A and 1B, the processor 150 is disposed on the second surface 132 and may be a central processing unit (CPU) or a graphics processing unit (GPU). Furthermore, the heat dissipation module 160 may include a heat sink 161, a heat pipe 162, and a fan 163. The heat sink 161 is removably secured to the second surface 132 and thermally coupled to the processor 150. Specifically, the fan 163 is disposed on one side of the motherboard 130, and the heat pipe 162 extends between the heat sink 161 and the fan 163. The heat pipe 162 includes an evaporation section 162a and a condensation section 162b opposite the evaporation section 162a. The evaporation section 162a is disposed on the heat sink 161 and thermally coupled to the heat sink 161. Furthermore, the condensation section 162b is disposed corresponding to the fan 163.

As shown in Figure 1A, the processor 150 and the evaporation section 162a are located on opposite sides of the heat sink 161 and in contact with the heat sink 161. The processor 150 is located between the motherboard 130 and the heat sink 161, and the first electrical connector 120 and the second electrical connector 140 are located between the circuit board 110 and the motherboard 130.

As shown in 1B , if the user needs to change specifications, they can first remove the heat sink 161 from the main board 130, and then remove the main board 130 from the circuit board 110. Then, the new main board is installed and fixed on the circuit board 110. Specifically, the new main board has a processor with different specifications, but also has the second electrical connector 140. While the new main board is installed on the circuit board 110, the second electrical connector 140 is plugged into the first electrical connector 120 to complete the electrical connection (for example, connecting signal lines or power lines). Finally, the heat sink 161 is installed and fixed on the new main board so that the heat sink 161 contacts and is thermally coupled to the processor on the new main board. The above replacement process is simple and intuitive, and helps to reduce replacement costs.

As shown in FIG1A , in this embodiment, the motherboard module 100 further includes a plurality of first positioning posts 101, a plurality of second positioning posts 102, and a plurality of positioning screws 103. The plurality of first positioning posts 101 can be a plurality of screw posts disposed between the circuit board 110 and the motherboard 130, with opposite ends of each first positioning post 101 contacting the circuit board 110 and the motherboard 130, respectively. For example, the circuit board 110 and the motherboard 130 each have a plurality of screw holes, wherein the plurality of screw holes of the circuit board 110 are aligned with the plurality of screw holes of the motherboard 130, and the plurality of first positioning posts 101 are aligned between the plurality of screw holes of the circuit board 110 and the plurality of screw holes of the motherboard 130.

The plurality of second positioning posts 102 are positioned opposite the plurality of first positioning posts 101. The plurality of second positioning posts 102 can be a plurality of screw posts disposed between the motherboard 130 and the heat sink 161, with opposite ends of each second positioning post 102 contacting the motherboard 130 and the heat sink 161, respectively. For example, the motherboard 130 and the heat sink 161 each have a plurality of screw holes, wherein the plurality of screw holes of the motherboard 130 are aligned with the plurality of screw holes of the heat sink 161, and the plurality of second positioning posts 102 are positioned between the plurality of screw holes of the motherboard 130 and the plurality of screw holes of the heat sink 161.

As shown in FIG1A , a plurality of first locating posts 101 are used to determine the spacing between the circuit board 110 and the motherboard 130, while a plurality of second locating posts 102 are used to determine the spacing between the motherboard 130 and the heat sink 161. Furthermore, a plurality of locating screws 103 pass through the plurality of screw holes in the heat sink 161, the plurality of second locating posts 102, the plurality of screw holes in the motherboard 130, and the plurality of first locating posts 101, and then lock into the plurality of screw holes in the circuit board 110, thereby securing the heat sink 161 to the motherboard 130 and the motherboard 130 to the circuit board 110.

As shown in FIG. 1B , after loosening the plurality of positioning screws 103 , the heat sink 161 can be removed from the motherboard 130 , and the motherboard 130 can be removed from the circuit carrier 110 .

In summary, in the motherboard module of the present invention, the heat sink is detachable from the mainboard, and the motherboard is also detachable from the circuit board. If the user requires a specification change, the old motherboard can be quickly replaced with a new one. While the new motherboard is being installed on the circuit board, the second electrical connector plugs into the first electrical connector to complete the electrical connection (e.g., connecting signal or power lines). This not only simplifies assembly and disassembly but also helps reduce replacement costs.

Although the present invention has been disclosed above by way of embodiments, they are not intended to limit the present invention. Any person having ordinary skill in the art may make slight modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

100: Motherboard module 101: First positioning post 102: Second positioning post 103: Positioning screw 110: Circuit board 120: First electrical connector 130: Motherboard 131: First surface 132: Second surface 140: Second electrical connector 150: Processor 160: Heat sink module 161: Heat sink 162: Heat pipe 162a: Evaporation section 162b: Condensation section 163: Fan

Figure 1A is a schematic side view of a motherboard module according to one embodiment of the present invention. Figure 1B is a schematic disassembled view of the motherboard module according to one embodiment of the present invention.

100: Motherboard module 101: First positioning post 102: Second positioning post 103: Positioning screw 110: Circuit board 120: First electrical connector 130: Motherboard 131: First surface 132: Second surface 140: Second electrical connector 150: Processor 160: Heat sink module 161: Heat sink 162: Heat pipe 162a: Evaporation section 162b: Condensation section 163: Fan

Claims (9)

A motherboard module includes: a circuit carrier; a first electrical connector disposed on the circuit carrier; a motherboard detachably fixed to the circuit carrier and having a first surface facing the circuit carrier and a second surface opposite to the first surface; a second electrical connector disposed on the first surface and plugged into the first electrical connector; a processor disposed on the second surface; and a heat dissipation module detachably fixed to the motherboard, wherein the heat dissipation module includes: a heat sink detachably fixed to the second surface and thermally coupled to the processor; a heat pipe having an evaporation section and a condensation section opposite to the evaporation section, wherein the evaporation section is disposed on the heat sink and thermally coupled to the heat sink; and a fan disposed on one side of the motherboard, with the condensation section disposed corresponding to the fan. The motherboard module as described in claim 1, wherein the processor and the evaporation section are respectively located on opposite sides of the heat sink. The motherboard module as described in claim 1, wherein the processor is located between the motherboard and the heat sink. The motherboard module as described in claim 1, wherein the first electrical connector and the second electrical connector are located between the circuit carrier and the motherboard. The motherboard module as described in claim 1 further includes: a plurality of positioning posts arranged between the motherboard and the heat sink, and the opposite ends of each positioning post contact the motherboard and the heat sink respectively. The motherboard module as described in claim 1 further includes: a plurality of positioning posts arranged between the circuit carrier and the motherboard, and the opposite ends of each positioning post contact the circuit carrier and the motherboard respectively. The motherboard module as described in claim 1 further includes: a plurality of first positioning posts, arranged between the circuit carrier and the motherboard, and the opposite ends of each first positioning post respectively contact the circuit carrier and the motherboard; and a plurality of second positioning posts, arranged between the motherboard and the heat sink, and the opposite ends of each second positioning post respectively contact the motherboard and the heat sink. The motherboard module as described in claim 7, wherein the second positioning columns are opposite to the first positioning columns. The motherboard module as described in claim 8 further includes: a plurality of positioning screws locked to the second positioning columns and the first positioning columns.