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TWI898390B - Display device - Google Patents

Display device

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Publication number
TWI898390B
TWI898390B TW113101443A TW113101443A TWI898390B TW I898390 B TWI898390 B TW I898390B TW 113101443 A TW113101443 A TW 113101443A TW 113101443 A TW113101443 A TW 113101443A TW I898390 B TWI898390 B TW I898390B
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Taiwan
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light
dielectric layer
emitting element
emitting
display device
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TW113101443A
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Chinese (zh)
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TW202528811A (en
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向瑞傑
陳志強
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宏碁股份有限公司
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Publication of TWI898390B publication Critical patent/TWI898390B/en

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Abstract

A display device includes a driving substrate, a plurality of light-emitting elements, a first dielectric layer and a second dielectric layer. The light-emitting elements are disposed on the driving substrate. Each light-emitting element has a light-emitting surface facing away from the driving substrate, and sidewalls surrounding the light-emitting surface. The first dielectric layer surrounds and contacts the sidewall of a first light-emitting element among the light-emitting elements. The second dielectric layer surrounds and contacts the first dielectric layer. A first interface formed between the first dielectric layer and the second dielectric layer has an included angle with the sidewall of the first light-emitting element, and satisfies the following conditions: nL1>n1>n2>1, wherein nL1 is the refractive index of the first light-emitting element, n1 is the refractive index of the first dielectric layer, and n2 is the refractive index of the second dielectric layer.

Description

顯示裝置Display device

本發明是有關於一種電子裝置,且特別是有關於一種顯示裝置。 The present invention relates to an electronic device, and in particular to a display device.

微型發光二極體面板包括主動元件基板及主動元件基板上的微型發光二極體(Micro Light Emitting Diode,Micro LED),並與主動元件基板中的驅動電路層電性連接。微型發光二極體面板因高亮度、高解析度及高對比度等優點,使其成為各大廠商研發的焦點。 A micro-LED panel consists of an active device substrate and micro-LEDs (Micro LEDs) on the active device substrate, which are electrically connected to the driver circuit layer within the active device substrate. Micro-LED panels have become a focus of research and development for major manufacturers due to their advantages such as high brightness, high resolution, and high contrast.

然而,由於微型發光二極體體積小、從微型發光二極體側邊出光的占比高、容易造成在大視角觀看顯示裝置時有較為明顯的色偏。在相關技術中,有利用調整不同顏色的微型發光二極體的厚度或形狀的方法以改善色偏之技術;或者調整各微型發光二極體的發光層材料之手段以改善上述問題。然而這些方法也都提升了微型發光二極體的製程難度,使得採用微型發光二極體的顯示裝置成本難以降低。 However, due to the small size of microLEDs and the high proportion of light emitted from their sides, they can easily cause noticeable color shift when viewing displays at wide viewing angles. Related technologies include adjusting the thickness or shape of microLEDs of different colors to improve color shift, or adjusting the material of the light-emitting layer of each microLED to address this issue. However, these methods also increase the complexity of the microLED manufacturing process, making it difficult to reduce the cost of displays using microLEDs.

本發明提供一種顯示裝置,有效降低發光二極體之側邊出光比例、可改善色偏問題,並且製造容易,應用在微型發光二極體顯示裝置時可有效降低生產成本。 This invention provides a display device that effectively reduces the side light emission ratio of LEDs, improves color shift, and is easy to manufacture. When used in micro-LED display devices, it can effectively reduce production costs.

本發明的一實施例的顯示裝置,包括驅動基板、多個發光元件、第一介質層以及第二介質層。這些發光元件設置在驅動基板上。每一個發光元件具有背離驅動基板的出光面以及環繞出光面的側壁。第一介質層環繞且接觸這些發光元件中第一發光元件的側壁。第二介質層環繞且接觸第一介質層。第一介質層和第二介質層之間形成的第一交界面與第一發光元件的側壁之間具有夾角,並且滿足以下條件式:nL1>n1>n2>1,其中nL1為第一發光元件的折射率,n1為第一介質層的折射率,n2為第二介質層的折射率。 A display device according to one embodiment of the present invention includes a driver substrate, a plurality of light-emitting elements, a first dielectric layer, and a second dielectric layer. The light-emitting elements are disposed on the driver substrate. Each light-emitting element has a light-emitting surface facing away from the driver substrate and sidewalls surrounding the light-emitting surface. The first dielectric layer surrounds and contacts the sidewalls of a first light-emitting element among the light-emitting elements. The second dielectric layer surrounds and contacts the first dielectric layer. The first interface formed between the first dielectric layer and the second dielectric layer forms an angle with the sidewall of the first light-emitting element, and satisfies the following condition: nL1>n1>n2>1, where nL1 is the refractive index of the first light-emitting element, n1 is the refractive index of the first dielectric layer, and n2 is the refractive index of the second dielectric layer.

基於上述,本發明的實施例的顯示裝置藉由第一介質層和第二介質層所形成的交界面與發光元件的側壁間具有夾角,以及發光元件、第一介質層和第二介質層的折射率之關係,可以有效降低發光元件從側壁的出光強度佔發光元件的總出光強度的比例,提升發光元件的正向出光、改善了顯示裝置中顯示光束的色偏問題。此外,相較於以不同尺寸或材料的發光元件改善側邊漏光之手段,本實施例的發光元件的大小或厚度可以一致,使得發光元件的製作和轉移容易,應用在微型發光二極體顯示裝置時可有效降低生產成本。 Based on the above, the display device of the embodiment of the present invention utilizes the angle between the interface formed by the first and second dielectric layers and the sidewalls of the light-emitting element, as well as the relationship between the refractive indices of the light-emitting element, the first and second dielectric layers, to effectively reduce the proportion of light intensity emitted from the sidewalls of the light-emitting element to the total light intensity of the light-emitting element. This improves the forward light output of the light-emitting element and alleviates the color shift of the display light beam in the display device. Furthermore, compared to methods that use light-emitting elements of different sizes or materials to improve side light leakage, the light-emitting elements of this embodiment can be of uniform size or thickness, facilitating their manufacture and transfer. This can effectively reduce production costs when used in micro-LED display devices.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 To make the above features and advantages of the present invention more clearly understood, the following examples are given and described in detail with reference to the accompanying drawings.

10,10A:顯示裝置 10,10A: Display device

100:驅動基板 100: Drive substrate

110A,110B,110C:發光元件 110A, 110B, 110C: Light-emitting element

110AS,110BS,110CS:側壁 110AS, 110BS, 110CS: Sidewalls

100T,110T:頂面 100T, 110T: Top

111:第一型半導體層 111: First type semiconductor layer

112:第二型半導體層 112: Type II semiconductor layer

113:發光層 113: Luminescent layer

120,130:介質層 120,130: Dielectric layer

G:間隙 G: Gap

IF1,IF2,IF3:交界面 IF1, IF2, IF3: Interface

L1:正向光 L1: Forward light

L2:側向光 L2: Side light

N1,N2:法線 N1, N2: normal line

X,Y,Z:方向 X, Y, Z: Direction

αA,αB,αC:夾角 αA, αB, αC: Angle

θ1,θ2,θ3:角度 θ1, θ2, θ3: Angles

I-I:剖線 I-I: section line

圖1A是本發明一實施例的顯示裝置的俯視示意圖。 Figure 1A is a schematic top view of a display device according to one embodiment of the present invention.

圖1B是圖1A沿I-I剖線的剖視示意圖。 Figure 1B is a schematic cross-sectional view of Figure 1A along line I-I.

圖2是本發明另一實施例的顯示裝置的俯視示意圖。 Figure 2 is a schematic top view of a display device according to another embodiment of the present invention.

圖3A以及圖3B是本發明實施例改善側邊出光的光學原理示意圖。 Figures 3A and 3B are schematic diagrams of the optical principle of improving side light emission according to an embodiment of the present invention.

本文使用的「約」、「近似」、「本質上」、或「實質上」包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,「約」可以表示在所述值的一個或多個標準偏差內,或例如±30%、±20%、±15%、±10%、±5%內。再者,本文使用的「約」、「近似」、「本質上」、或「實質上」可依製程特性、量測性質、切割性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。亦即本文中所繪示的直角或是任何角度,其實質上可以為具有小曲率半徑之圓角。 As used herein, "about," "approximately," "substantially," or "substantially" includes the stated value and the average within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the specific amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within, for example, ±30%, ±20%, ±15%, ±10%, or ±5%. Furthermore, as used herein, "about," "approximately," "substantially," or "substantially" can be selected based on process characteristics, measurement properties, cutting properties, or other properties, rather than using a single standard deviation to apply to all properties. That is, a right angle or any angle depicted herein can be substantially rounded with a small radius of curvature.

在附圖中,為了清楚起見,放大了層、膜、面板、區域等的厚度。應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件「上」或「連接到」另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。如本文所使用的,「連接」可以指物理及/或電性連接。再者,「電性連接」可為二元件間存在其它元件。 In the accompanying drawings, the thickness of layers, films, panels, regions, etc., is exaggerated for clarity. It should be understood that when an element, such as a layer, film, region, or substrate, is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" can refer to physical and/or electrical connections. Furthermore, "electrically connected" can mean the presence of other elements between two elements.

現將詳細地參考本發明的示範性實施方式,示範性實施方式的實例說明於所附圖式中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。 Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

圖1A是本發明一實施例的顯示裝置的俯視示意圖。請參照圖1A,顯示裝置10包括驅動基板100、多個發光元件(例如發光元件110A、發光元件110B、發光元件110C)在方向X和方向Y上排列成陣列設置在驅動基板100上。多個介質層120設置在驅動基板100上,並分別環繞且接觸發光元件110A、發光元件110B、發光元件110C。介質層130設置在驅動基板100上,並分別環繞且接觸多個介質層120。發光元件110A、110B、110C可以定義為顯示裝置10的顯示子畫素,用以接收來自驅動基板100的電訊號發出光束以形成顯示光。 Figure 1A is a schematic top view of a display device according to an embodiment of the present invention. Referring to Figure 1A , display device 10 includes a driver substrate 100 and a plurality of light-emitting elements (e.g., light-emitting element 110A, light-emitting element 110B, and light-emitting element 110C) arranged in an array in directions X and Y on driver substrate 100. A plurality of dielectric layers 120 are disposed on driver substrate 100, surrounding and contacting light-emitting elements 110A, 110B, and 110C, respectively. A dielectric layer 130 is disposed on driver substrate 100, surrounding and contacting each of dielectric layers 120. The light-emitting elements 110A, 110B, and 110C can be defined as display sub-pixels of the display device 10, which receive electrical signals from the driving substrate 100 and emit light beams to form display light.

驅動基板100包括多種訊號線(例如資料線、掃描線或電源線)。並且例如是採用矽晶圓材料且包括互補式金屬氧化物半導體(Complementary Metal Oxide Semiconductor,CMOS)的基板, 藉此提高驅動基板100中各開關元件的反應速度及降低功耗,以滿足顯示裝置10快速響應及高解析度的需求。然而本發明並不以此為限。在其他實施例中,驅動基板100也可以是印刷電路板(printed circuit board,PCB)。在其它實施例中,驅動基板100也可以是玻璃基板和畫素電路層的組合,其中畫素電路層是採用半導體製程形成於玻璃基板上,且畫素電路層可包括主動元件(例如薄膜電晶體)和多種訊號線(例如資料線、掃描線或電源線),但不以此為限。 The driver substrate 100 includes various signal lines (e.g., data lines, scan lines, or power lines). For example, it may be made of a silicon wafer and include a complementary metal oxide semiconductor (CMOS) substrate. This improves the response speed of the switching elements in the driver substrate 100 and reduces power consumption, thereby meeting the fast response and high-resolution requirements of the display device 10. However, the present invention is not limited to this. In other embodiments, the driver substrate 100 may also be a printed circuit board (PCB). In other embodiments, the driver substrate 100 may also be a combination of a glass substrate and a pixel circuit layer, wherein the pixel circuit layer is formed on the glass substrate using a semiconductor process and may include active components (such as thin film transistors) and various signal lines (such as data lines, scan lines, or power lines), but is not limited thereto.

另一方面,多個發光元件(例如發光元件110A、110B或110C)例如是微型發光二極體(micro light emitting diode,micro LED)、次毫米發光二極體(mini light emitting diode,mini LED)、或其它尺寸大小的發光二極體,本發明並不以此為限。舉例來說,本實施例採用的是微型發光二極體,而顯示裝置10可以是微型發光二極體顯示裝置。發光元件可以為紫外光(UV)發光二極體或是藍光發光二極體。另一方面,本實施例的發光元件可以是覆晶式(flip-chip type)發光二極體或是垂直式(vertical-chip type)發光二極體。舉例來說,本實施例透過位於各發光元件磊晶結構同一側的電極(未繪示)或相對兩側的電極(未繪示),與驅動基板100上對應的接合墊(未示出)相互對位,並利用習知的表面黏合技術(Surface-mount technology,SMT)相互接合,以達成發光元件110A、110B和110C與驅動基板100的電性連接,然而本發明並不以此為限。 On the other hand, the plurality of light-emitting elements (e.g., light-emitting elements 110A, 110B, or 110C) may be, for example, micro light-emitting diodes (micro LEDs), sub-millimeter light-emitting diodes (mini LEDs), or light-emitting diodes of other sizes, but the present invention is not limited thereto. For example, the present embodiment uses micro LEDs, and the display device 10 may be a micro LED display device. The light-emitting element may be an ultraviolet (UV) light-emitting diode or a blue light-emitting diode. On the other hand, the light-emitting element of the present embodiment may be a flip-chip type light-emitting diode or a vertical-chip type light-emitting diode. For example, in this embodiment, electrodes (not shown) located on the same side of each light-emitting device epitaxial structure or electrodes (not shown) on opposite sides are aligned with corresponding bonding pads (not shown) on the driver substrate 100 and bonded together using conventional surface-mount technology (SMT) to achieve electrical connection between the light-emitting devices 110A, 110B, and 110C and the driver substrate 100. However, the present invention is not limited to this.

圖1B是圖1A沿I-I剖線的剖視示意圖。請同時參照圖1A以及圖1B,發光元件110A、110B以及110C,各自可以具有頂面110T且與驅動基板100的頂面100T相對設置。發光元件110B以及110C可以參照發光元件110A的相關說明並且加以類推。每一個發光元件具有背離驅動基板100的出光面以及環繞出光面的側壁。頂面110T可以視為發光元件110A、110B以及110C的出光面,並且各發光元件從頂面110T發出的光束可以稱為正向光L1。而另一方面,發光元件110A、110B以及110C各自也具有連接頂面110T的側壁110AS、側壁110BS以及側壁110CS,並且從側壁110AS、側壁110BS以及側壁110CS發出的光束可以稱為側向光L2。值得一提的是,正向光L1和側向光L2的傳遞方向並非完全集中為一直線方向而可以具有出光範圍。因此正向光L1和側向光L2的傳遞方向可以是指發光元件110A、110B或110C向各方向所發出的光束中,能量最強的光束的傳遞方向。 FIG1B is a schematic cross-sectional view taken along line I-I of FIG1A . Referring to both FIG1A and FIG1B , each of light-emitting elements 110A, 110B, and 110C may have a top surface 110T and be disposed opposite the top surface 100T of the driver substrate 100. The description of light-emitting elements 110B and 110C can be similarly applied to the description of light-emitting element 110A. Each light-emitting element has a light-emitting surface facing away from the driver substrate 100 and sidewalls surrounding the light-emitting surface. Top surface 110T may be considered the light-emitting surface of light-emitting elements 110A, 110B, and 110C, and the light beam emitted from top surface 110T by each light-emitting element may be referred to as forward light L1. On the other hand, each of the light-emitting elements 110A, 110B, and 110C also has sidewalls 110AS, 110BS, and 110CS connected to the top surface 110T. The light beams emitted from the sidewalls 110AS, 110BS, and 110CS can be referred to as sidelight L2. It's worth noting that the propagation directions of the forward light L1 and sidelight L2 aren't completely linear but can have a range of light output. Therefore, the propagation directions of the forward light L1 and sidelight L2 can refer to the propagation directions of the light beams with the highest energy among the light beams emitted in various directions by the light-emitting element 110A, 110B, or 110C.

發光元件110A、110B以及110C的材料,可以各自包括在方向Z上由上而下依序堆疊的第一型半導體層111、發光層113和第二型半導體層112。第一型半導體層111可以是N型半導體層,而第二型半導體層112可以是P型半導體層,然而本發明並不限於此。此外,第一型半導體層111及第二型半導體層112可以各自包括摻雜濃度不同的高濃度摻雜層以及具有正常摻雜濃度的半導體層的多層結構。舉例來說,第二型半導體層112與驅動基板100的接合墊接觸的部分可以包括高摻雜的P+氮化鎵(GaN), 以利於第二型半導體層112和接合墊之間的歐姆接觸。在其它的實施例中,也可使用其它材料作為第一型半導體層111及第二型半導體層112的基材,例如砷化鎵(GaAs)、磷化鋁(AlP)、氮化鎵(GaN)、氮化铟镓(InGaN)、磷化铟镓(InGaP)、鋁鎵銦磷(AlGaInP)、磷化鋁鎵(AlInP)、砷化鎵銦(InGaN)、氮化鋁鎵(AlGaN)等,本實施例對此並不加以限定。 The materials of light-emitting elements 110A, 110B, and 110C may each include a first-type semiconductor layer 111, a light-emitting layer 113, and a second-type semiconductor layer 112 stacked sequentially from top to bottom in direction Z. The first-type semiconductor layer 111 may be an N-type semiconductor layer, and the second-type semiconductor layer 112 may be a P-type semiconductor layer, but the present invention is not limited to this. Furthermore, the first-type semiconductor layer 111 and the second-type semiconductor layer 112 may each include a multilayer structure comprising a highly doped layer with varying dopant concentrations and a semiconductor layer with a normal dopant concentration. For example, the portion of the second semiconductor layer 112 that contacts the bonding pad of the driver substrate 100 may include highly doped P + gallium nitride (GaN) to facilitate ohmic contact between the second semiconductor layer 112 and the bonding pad. In other embodiments, other materials may be used as the substrates for the first semiconductor layer 111 and the second semiconductor layer 112, such as gallium arsenide (GaAs), aluminum phosphide (AlP), gallium nitride (GaN), indium gallium nitride (InGaN), indium gallium phosphide (InGaP), aluminum gallium indium phosphide (AlGaInP), aluminum gallium phosphide (AlInP), gallium indium arsenide (InGaN), aluminum gallium nitride (AlGaN), etc. This embodiment is not limited to this.

發光層113的結構可以是多重量子井(Multiple-Quantum Well,MQW)結構、單一量子井結構、雙異質結構(Double Heterostructure)、單異質結構或其組合。本發明並不以此為限。並且如圖1B所示,發光層113位於第一型半導體層111及第二型半導體層112之間。因此,第一型半導體層111可以用來提供電子且第二型半導體層112可以用來提供電洞,使電子和電洞在發光層113中結合並將能量轉換為光子而發光。 The structure of the light-emitting layer 113 can be a multiple-quantum well (MQW) structure, a single quantum well structure, a double heterostructure, a single heterostructure, or a combination thereof. The present invention is not limited thereto. As shown in FIG1B , the light-emitting layer 113 is located between the first-type semiconductor layer 111 and the second-type semiconductor layer 112 . Therefore, the first-type semiconductor layer 111 can be used to provide electrons, and the second-type semiconductor layer 112 can be used to provide holes. The electrons and holes combine in the light-emitting layer 113, converting their energy into photons and emitting light.

在一些實施例中,發光元件110A可以是用於發出紅光的紅色發光二極體,發光元件110B可以是用於發出綠光的綠色發光二極體,而發光元件110C可以是用於發出藍光的藍色發光二極體。因此發光元件110A所發出的光的波長,可以大於發光元件110B和發光元件110C所發出的光的波長。然而本發明並不限於此。在其他實施例中,發光元件110A、110B或110C也可以皆為藍色發光二極體,並在介質層130背離驅動基板100的一側設置波長轉換層(未繪示)以將藍光轉換成不同色光,本發明並不限於此。 In some embodiments, light-emitting element 110A may be a red LED for emitting red light, light-emitting element 110B may be a green LED for emitting green light, and light-emitting element 110C may be a blue LED for emitting blue light. Therefore, the wavelength of light emitted by light-emitting element 110A may be greater than the wavelengths of light emitted by light-emitting elements 110B and 110C. However, the present invention is not limited to this. In other embodiments, light-emitting elements 110A, 110B, or 110C may all be blue LEDs, and a wavelength conversion layer (not shown) may be disposed on the side of the dielectric layer 130 facing away from the driver substrate 100 to convert blue light into light of a different color. The present invention is not limited to this.

另一方面,多個介質層120環繞且分別接觸側壁110AS、 側壁110BS以及側壁110CS。介質層130接觸多個介質層120。在介質層130和多個介質層120之間,形成對應發光元件110A、110B以及110C的交界面IF1、IF2和IF3。基於實際設計,在介質層130和介質層120之間可以不具有其他膜層。或者,在介質層130和介質層120之間可以具有其他膜層。在一些實施例中,多個介質層120和介質層130可以直接接觸驅動基板100的頂面100T。然而本發明並不限於此,在其他實施例中,多個介質層120和驅動基板100之間、或者介質層130和驅動基板100之間可以設置吸光層或是黑色矩陣層,以增加顯示裝置10的對比度及解析度,本發明並不限於此。 Meanwhile, multiple dielectric layers 120 surround and contact sidewalls 110AS, 110BS, and 110CS, respectively. Dielectric layer 130 contacts multiple dielectric layers 120. Interfaces IF1, IF2, and IF3 corresponding to light-emitting elements 110A, 110B, and 110C are formed between dielectric layer 130 and multiple dielectric layers 120. Depending on the actual design, no other layers may be present between dielectric layer 130 and dielectric layer 120. Alternatively, other layers may be present between dielectric layer 130 and dielectric layer 120. In some embodiments, the plurality of dielectric layers 120 and the dielectric layer 130 may directly contact the top surface 100T of the driving substrate 100. However, the present invention is not limited to this. In other embodiments, a light-absorbing layer or a black matrix layer may be disposed between the plurality of dielectric layers 120 and the driving substrate 100, or between the dielectric layer 130 and the driving substrate 100, to increase the contrast and resolution of the display device 10. The present invention is not limited to this.

值得一提的是,交界面IF1和側壁110AS之間可以形成夾角αA、交界面IF2和側壁110BS之間可以形成夾角αB,並且交界面IF3和側壁110CS之間可以形成夾角αC。換句話說,在顯示裝置10的剖面圖中,以發光元件110A為例,介質層120可以具有三角形的輪廓,其中三角形的底設置在驅動基板100上、而三角形的高接觸發光元件110A的側壁110AS,並且夾角αA可以是三角形輪廓中背離驅動基板100突出的夾角。或者可以理解為,在驅動基板100的頂面100T上,多個發光元件之一和互相接觸的介質層120兩兩之間可以構成島狀結構。交界面IF1圍繞發光元件110A,交界面IF2圍繞發光元件110B,且交界面IF3圍繞發光元件110C。交界面IF1、IF2和IF3形成上述各島狀結構的邊緣,並且多個島狀結構彼此之間被介質層130隔開。 It is worth noting that an angle αA may be formed between interface IF1 and sidewall 110AS, an angle αB may be formed between interface IF2 and sidewall 110BS, and an angle αC may be formed between interface IF3 and sidewall 110CS. In other words, in the cross-sectional view of display device 10, taking light-emitting element 110A as an example, dielectric layer 120 may have a triangular outline, wherein the base of the triangle is disposed on driver substrate 100 and the sidewall 110AS of triangular high-contact light-emitting element 110A is formed. Angle αA may be the angle of the triangular outline that protrudes away from driver substrate 100. Alternatively, it can be understood that on the top surface 100T of the driver substrate 100, island structures can be formed between each of the multiple light-emitting elements and the dielectric layer 120 that contacts each other. Interface IF1 surrounds light-emitting element 110A, interface IF2 surrounds light-emitting element 110B, and interface IF3 surrounds light-emitting element 110C. Interfaces IF1, IF2, and IF3 form the edges of each island structure, and the multiple island structures are separated from each other by the dielectric layer 130.

此外,各發光元件的折射率nL、介質層120的折射率n1以及介質層130的折射率n2可以進一步滿足以下條件式:nL>n1>n2>1。舉例來說,發光元件110A的折射率為nL1,且發光元件110A的島狀結構滿足以下條件式:nL1>n1>n2>1。其中介質層120和介質層130可以是以透光的聚合物為基材、例如光學透明膠(Optical Clear Adhesive,OCA)、聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、聚對苯二甲酸乙二酯(PET)等等,並經由包括參雜無機化合物的高折射率的奈米微粒製作而成,例如矽氧化物(SiOx)、氮氧化鋁(AlOxNy)、矽氮化物(SiNx)、五氧化二鈮(Nb2O5)、二氧化鈦(TiO2)等,藉此選擇適當的介質層120和介質層130的折射率。在一些實施例中,介質層120和介質層130也可以是由無機化合物組成,本發明並不限於此。 Furthermore, the refractive index nL of each light-emitting element, the refractive index n1 of the dielectric layer 120, and the refractive index n2 of the dielectric layer 130 can further satisfy the following condition: nL>n1>n2>1. For example, the refractive index of light-emitting element 110A is nL1, and the island structure of light-emitting element 110A satisfies the following condition: nL1>n1>n2>1. The dielectric layers 120 and 130 can be based on a light-transmitting polymer, such as optically clear adhesive (OCA), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), etc., and can be fabricated from high-refractive-index nanoparticles doped with inorganic compounds, such as silicon oxide ( SiOx ), aluminum oxynitride ( AlOxNy ), silicon nitride ( SiNx ), niobium pentoxide ( Nb2O5 ) , titanium dioxide ( TiO2 ), etc., thereby selecting appropriate refractive indices for the dielectric layers 120 and 130. In some embodiments, the dielectric layers 120 and 130 can also be composed of inorganic compounds, but the present invention is not limited thereto.

以發光元件110A為例,經由上述各元件間折射率的差異以及夾角αA的角度大小,從側壁110AS發出的側向光L2可以依序在側壁110AS發生第一次折射,並在交界面IF1處發生第二次折射。經由上述兩次折射讓原本容易使不同色光混色而造成色偏的側向光L2,被導向至顯示裝置10的正向光L1相近的方向(例如被導向方向Z),藉此發光元件110A的側邊漏光可以有效降低。換句話說,也提升了發光元件110A中,正向出光的光束強度佔總出光強度的比例,也有利於提升顯示裝置10的顯示畫面的亮度。 Taking light-emitting element 110A as an example, due to the aforementioned differences in refractive index between the various elements and the size of the angle αA, the sidelight L2 emitted from sidewall 110AS undergoes a first refraction at sidewall 110AS and a second refraction at interface IF1. These two refractions allow the sidelight L2, which would otherwise easily cause color shift by mixing different colors, to be directed in a direction similar to the forward light L1 of the display device 10 (e.g., in direction Z). This effectively reduces sidelight leakage from light-emitting element 110A. In other words, the proportion of the forward light intensity in light-emitting element 110A to the total light intensity is increased, thereby enhancing the brightness of the display screen of display device 10.

另一方面,相較於相關技術中,經由調整發光元件的各層別厚度,達到不同發光元件(例如三原色的發光二極體)在不同視 角下的色光峰值差異最小化以降低大視角下的色偏問題,本發明實施例的發光元件110A、110B和110C可以皆採用實質上相同的大小或厚度,藉此降低各發光元件的製造以及轉移難度,也有利於提升顯示裝置10的製造良率以及降低生產成本。 On the other hand, compared to related technologies, which minimize the difference in color peak values of different light-emitting elements (e.g., three-primary-color LEDs) at different viewing angles by adjusting the thickness of each layer of the light-emitting element, thereby reducing color shift issues at wide viewing angles, the light-emitting elements 110A, 110B, and 110C in this embodiment of the present invention can all be of substantially the same size or thickness. This reduces the difficulty in manufacturing and transferring each light-emitting element, and also helps improve the manufacturing yield of the display device 10 and reduce production costs.

在一些實施例中,發光元件110A、110B以及110C的折射率nL可以滿足以下條件式:4≧nL>1。舉例來說,發光元件110A的折射率為nL1,且發光元件110A滿足以下條件式:4≧nL1>1。在一些實施例中,介質層120的折射率n1以及介質層130的折射率n2也可以進一步滿足以下條件式:4>n1>1,4>n2>1。在一些實施例中,夾角αA、αB和αC的角度值可以小於等於45度且大於0度。在上述條件下,也可以進一步改善發光元件110A、110B以及110C的側向漏光問題,以增加各發光元件正向出光(例如朝向方向Z)的比例。 In some embodiments, the refractive index nL of light-emitting elements 110A, 110B, and 110C may satisfy the following condition: 4 ≥ nL > 1. For example, the refractive index of light-emitting element 110A is nL1, and light-emitting element 110A satisfies the following condition: 4 ≥ nL1 > 1. In some embodiments, the refractive index n1 of dielectric layer 120 and the refractive index n2 of dielectric layer 130 may further satisfy the following conditions: 4 > n1 > 1, and 4 > n2 > 1. In some embodiments, the angles αA, αB, and αC may be less than or equal to 45 degrees and greater than 0 degrees. Under the above conditions, the lateral light leakage problem of the light-emitting elements 110A, 110B, and 110C can be further improved, thereby increasing the proportion of light emitted in the forward direction (e.g., toward direction Z) by each light-emitting element.

在一些實施例中,發光元件110A、110B以及110C用於發出不同顏色的色光,故各發光元件的材質也會略為有所差異。因此可以進一步滿足以下條件式:4≧nL1>1,3.5≧nL2>1,3.5≧nL3>1,其中nL1為發光元件110A的折射率,nL2為發光元件110B的折射率,nL3為發光元件110C的折射率。而對應於不同折射率的發光元件,夾角αA、αB和αC彼此也可以不相同。舉例來說,假設接觸發出紅光的發光元件110A的折射層120具有夾角αA,接觸發出綠光的發光元件110B的折射層120具有夾角αB,接觸發出藍光的發光元件110C的折射層120具有夾角αC,則夾角αA 可以大於夾角αB以及夾角αC,藉此可以使不同色光的發光元件的正向出光比例最佳化,本發明並不限於此。 In some embodiments, light-emitting elements 110A, 110B, and 110C are designed to emit different colors of light, so the materials of each light-emitting element may differ slightly. Therefore, the following conditions can be satisfied: 4 ≧ nL1 > 1, 3.5 ≧ nL2 > 1, and 3.5 ≧ nL3 > 1, where nL1 is the refractive index of light-emitting element 110A, nL2 is the refractive index of light-emitting element 110B, and nL3 is the refractive index of light-emitting element 110C. For light-emitting elements with different refractive indices, the angles αA, αB, and αC can also be different. For example, assuming that the refractive layer 120 contacting the red-emitting light-emitting element 110A has an angle αA, the refractive layer 120 contacting the green-emitting light-emitting element 110B has an angle αB, and the refractive layer 120 contacting the blue-emitting light-emitting element 110C has an angle αC, then the angle αA can be greater than both the angles αB and αC. This optimizes the forward light output ratio of the light-emitting elements of different colors. The present invention is not limited to this.

而值得一提的是,為了進一步使側向光L2可以有效被導向顯示裝置10的正視角方向(如方向Z),介質層130可以進一步延伸至多個發光元件之間的間隙G中(例如發光元件110A和發光元件110B之間的間隙G)。並且介質層130可以接觸驅動基板100的頂面100T,藉此可以降低側向光L2在方向X和方向Y的漏光比例,以及可經由介質層130封裝各發光元件和介質層120,增加顯示裝置10的可靠度及結構強度,然而本發明並不以此為限。 It is worth noting that, to further effectively guide the sidelight L2 toward the normal viewing angle of the display device 10 (e.g., direction Z), the dielectric layer 130 can further extend into the gaps G between the multiple light-emitting elements (e.g., the gap G between the light-emitting element 110A and the light-emitting element 110B). Furthermore, the dielectric layer 130 can contact the top surface 100T of the driving substrate 100, thereby reducing the leakage rate of the sidelight L2 in directions X and Y. Furthermore, the dielectric layer 130 can encapsulate the light-emitting elements and the dielectric layer 120, thereby increasing the reliability and structural strength of the display device 10. However, the present invention is not limited to this.

以下將列舉另一些實施例以詳細說明本發明,其中相同的構件將標示相同的符號,並且省略相同技術內容的說明,省略部分請參考前述實施例,以下不再贅述。 The following examples illustrate the present invention in detail. Identical components are denoted by identical symbols, and descriptions of identical technical contents are omitted. For omitted parts, please refer to the aforementioned examples and will not be further elaborated below.

圖2是本發明另一實施例的顯示裝置的俯視示意圖。本實施例的顯示裝置10A與顯示裝置10相似,其差異在於:使側向光L2朝向正視角出光的原理不同。詳細而言,顯示裝置10A的折射層120的夾角(例如夾角αA、αB和αB)是朝向驅動基板100突出。換個角度來說,以發光元件110A為例,介質層120可以具有倒三角形的輪廓,其中三角形的底背離驅動基板100設置、而三角形的高接觸發光元件110A的側壁110AS,並且夾角αA可以是三角形輪廓中朝向驅動基板100突出的夾角。 Figure 2 is a schematic top view of a display device according to another embodiment of the present invention. Display device 10A of this embodiment is similar to display device 10, differing in the principle of directing side light L2 toward a normal viewing angle. Specifically, the angles (e.g., angles αA, αB, and αB) of the refractive layer 120 of display device 10A protrude toward the driver substrate 100. To put it another way, taking light-emitting element 110A as an example, dielectric layer 120 can have an inverted triangular profile, with the base of the triangle facing away from the driver substrate 100 and the sidewalls 110AS of the triangular high-contact light-emitting element 110A facing away. Angle αA can be the portion of the triangular profile that protrudes toward the driver substrate 100.

經由上述配置,從側壁110AS發出的側向光L2可以依序在側壁110AS發生一次折射,並且有利於在交界面IF1處發生全 反射。經由上述一次折射以及一次全反射,使得側向光L2也容易被導向至顯示裝置10的正向光L1相近的方向,藉此發光元件110A的側邊漏光可以有效降低、提升顯示裝置10A在正視角下的影像品質。換一個角度來說,也提升了發光元件110A中,正向出光的光束強度佔總出光強度的比例,也有利於提升顯示裝置10A的顯示畫面的亮度。 With this configuration, the sidelight L2 emitted from the sidewall 110AS undergoes a single refraction on the sidewall 110AS, which facilitates total internal reflection at the interface IF1. This single refraction and total internal reflection facilitates the direction of the sidelight L2, which is similar to the forward light L1 of the display device 10. This effectively reduces sidelight leakage from the light-emitting element 110A, improving the image quality of the display device 10A at normal viewing angles. Alternatively, the ratio of the forward light intensity of the light-emitting element 110A to the total light intensity is increased, thereby enhancing the brightness of the display screen of the display device 10A.

圖3A以及圖3B是本發明實施例改善側邊出光的光學原理示意圖。以下將針對本發明實施例的顯示裝置10和顯示裝置10A的參數設計原理做進一步說明。請先參照圖3A,以顯示裝置10的發光元件110A為例,側向光L2從發光層113發出之後,可以經由光學模擬軟體或實驗得知發光元件110A於側壁110AS出光的光型分布或者出光強度對角度的關係,藉此得知側向光L2與側壁110AS的法線N1之夾角(即入射角的角度θ1)以及折射後的折射角的角度θ2。而上述值可以經由司乃耳定律(Snell's Law)得知需滿足以下條件式:nL*Sin(θ1)=n1*Sin(θ2);並且在側向光L2照射至交界面IF1後,得知側向光L2與交界面IF1的法線N2之夾角(即入射角的角度(θ2-αA))以及折射後的折射角的角度θ3。而上述值可以經由司乃耳定律得知需滿足以下條件式:n1*Sin(θ2-αA)=n2*Sin(θ3),最後在方向Z上從介質層130出光,其中介值層130外可以是空氣或是其他光學膜層(未繪示),並進一步滿足從介值層130折射至空氣或是光學膜層的司乃耳定律。 Figures 3A and 3B are schematic diagrams of the optical principle of improving side light emission according to an embodiment of the present invention. The following further explains the parameter design principle of the display device 10 and the display device 10A according to the embodiment of the present invention. Please refer to Figure 3A first. Taking the light-emitting element 110A of the display device 10 as an example, after the side light L2 is emitted from the light-emitting layer 113, the light type distribution of the light-emitting element 110A at the side wall 110AS or the relationship between the light intensity and the angle can be obtained through optical simulation software or experiments. In this way, the angle between the side light L2 and the normal N1 of the side wall 110AS (i.e., the angle of incidence θ1) and the refraction angle θ2 after refraction can be obtained. The above values can be determined from Snell's Law to satisfy the following condition: nL*Sin(θ1)=n1*Sin(θ2). Furthermore, after the sidelight L2 strikes the interface IF1, the angle between the sidelight L2 and the normal N2 of the interface IF1 (i.e., the angle of incidence (θ2-αA)) and the angle of refraction (θ3) after refraction are determined. The above values can also be determined from Snell's Law to satisfy the following condition: n1*Sin(θ2-αA)=n2*Sin(θ3). Finally, the light exits the dielectric layer 130 in the direction Z. The dielectric layer 130 can be air or another optical film (not shown), further satisfying Snell's Law regarding refraction from the dielectric layer 130 to air or an optical film.

在滿足上述折射條件下,可以藉由模擬軟體輸入折射率 n1、折射率n2、各發光元件折射率nL和夾角αA、αB和αC之參數,以建構各發光元件最佳化之正向光L1和側向光L2的出光分佈,使得發光元件的各視角發光分佈均勻化。藉此方法完成顯示裝置10的各光學參數架構。 Under the aforementioned refractive conditions, simulation software can be used to input parameters such as the refractive index n1, n2, the refractive index nL of each light-emitting element, and the angles αA, αB, and αC. This allows for the optimized forward light L1 and side light L2 distribution of each light-emitting element to be constructed, resulting in a uniform light distribution across all viewing angles. This method completes the optical parameter architecture of the display device 10.

請接著參照圖3B,以顯示裝置10A的發光元件110A為例,可以經由司乃耳定律得知需滿足以下條件式:nL*Sin(θ1)=n1*Sin(θ2);並且在側向光L2照射至交界面IF1後,可以得知側向光L2與交界面IF1的法線N2之夾角(即入射角的角度(θ2+αA)),需滿足全反射之條件式,即上述值可以經由司乃耳定律得知需滿足:n1*Sin(θ2+αA)>n2*Sin 90°,最後在方向Z上從介質層130出光,其中介值層130外可以是空氣或是其他光學膜層(未繪示),並進一步滿足從介值層130折射至空氣或是其他光學膜層的司乃耳定律。而驗證顯示裝置10A的各光學參數架構的方法可以參照前述,於此不贅述。 Please refer to FIG3B . Taking the light-emitting element 110A of the display device 10A as an example, it can be known from Snell's law that the following condition must be satisfied: nL*Sin(θ1)=n1*Sin(θ2); and after the side light L2 is irradiated on the interface IF1, it can be known that the angle between the side light L2 and the normal N2 of the interface IF1 (i.e., the angle of the incident angle (θ2+αA)) must satisfy the condition of total internal reflection. That is, the above value can be known from Snell's law to satisfy: n1*Sin(θ2+αA)>n2*Sin 90°, and finally exits the dielectric layer 130 in direction Z. The dielectric layer 130 may be surrounded by air or other optical layers (not shown), further satisfying Snell's law regarding refraction from the dielectric layer 130 to air or other optical layers. The method for verifying the optical parameter structure of the display device 10A can be found above and will not be elaborated here.

綜上所述,本發明實施例的顯示裝置,藉由介質層120和介質層130所形成的交界面與發光元件的側壁間具有夾角,以及發光元件、介質層120和介質層130的折射率之搭配,可以有效降低發光元件從側壁的出光強度佔發光元件的總出光強度的比例,提升發光元件的正向出光、改善了顯示裝置中顯示光束的色偏問題。此外,相較於以不同尺寸或材料的發光元件改善側邊漏光之手段,本實施例的發光元件的大小或厚度可以一致,使得發光元件的製作和組裝容易,應用在微型發光二極體顯示裝置時可 有效降低生產成本。 In summary, the display device of this embodiment of the present invention, through the angle between the interface formed by dielectric layers 120 and 130 and the sidewalls of the light-emitting element, and the matching of the refractive indices of the light-emitting element, dielectric layers 120, and dielectric layers 130, can effectively reduce the proportion of light intensity emitted from the sidewalls of the light-emitting element to the total light intensity of the light-emitting element, thereby improving the forward light output of the light-emitting element and improving the color shift of the display light beam in the display device. Furthermore, compared to methods that use light-emitting elements of different sizes or materials to improve side light leakage, the light-emitting elements of this embodiment can be of uniform size or thickness, making the light-emitting elements easier to manufacture and assemble, and effectively reducing production costs when used in micro-LED display devices.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed above through embodiments, they are not intended to limit the present invention. Anyone with ordinary skill in the art may make minor modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

10:顯示裝置 100:驅動基板 110A,110B,110C:發光元件 110AS, 110BS, 110CS:側壁 100T, 110T:頂面 111:第一型半導體層 112:第二型半導體層 113:發光層 120,130:介質層 G:間隙 IF1,IF2,IF3:交界面 L1:正向光 L2:側向光 X, Y, Z:方向 αA,αB,αC:夾角 10: Display device 100: Driver substrate 110A, 110B, 110C: Light-emitting element 110AS, 110BS, 110CS: Sidewalls 100T, 110T: Top surface 111: Type I semiconductor layer 112: Type II semiconductor layer 113: Light-emitting layer 120, 130: Dielectric layer G: Gap IF1, IF2, IF3: Interfaces L1: Forward light L2: Side light X, Y, Z: Directions αA, αB, αC: Angles

Claims (9)

一種顯示裝置,包括: 驅動基板; 多個發光元件,設置在該驅動基板上,其中該些發光元件中的每一個發光元件具有背離該驅動基板的出光面以及環繞該出光面的側壁,以及該些發光元件包括第一發光元件、第二發光元件以及第三發光元件; 第一介質層,環繞且接觸該第一發光元件的該側壁;以及 第二介質層,環繞且接觸該第一介質層; 第三介質層,其中該第三介質層圍繞且接觸該第二發光元件的該側壁,該第二介質層環繞且接觸該第三介質層; 第四介質層,其中該第四介質層圍繞且接觸該第三發光元件的該側壁,該第二介質層環繞且接觸該第四介質層, 該第一介質層和該第二介質層之間形成第一交界面,該第三介質層和該第二介質層之間形成第二交界面,該第四介質層與該第二介質層之間形成第三交界面, 該第一交界面與該第一發光元件的該側壁之間的第一夾角大於該第二發光元件的該側壁和該第二交界面之間的第二夾角,以及該第一夾角大於該第三發光元件的該側壁和該第三交界面之間的第三夾角,並且 滿足以下條件式:nL1>n1>n2>1,其中nL1為該第一發光元件的折射率,n1為該第一介質層的折射率,n2為該第二介質層的折射率。 A display device includes: a driving substrate; a plurality of light-emitting elements disposed on the driving substrate, wherein each of the light-emitting elements has a light-emitting surface facing away from the driving substrate and a sidewall surrounding the light-emitting surface, and the light-emitting elements include a first light-emitting element, a second light-emitting element, and a third light-emitting element; a first dielectric layer surrounding and contacting the sidewall of the first light-emitting element; and a second dielectric layer surrounding and contacting the first dielectric layer; a third dielectric layer, wherein the third dielectric layer surrounds and contacts the sidewall of the second light-emitting element, and the second dielectric layer surrounds and contacts the third dielectric layer; A fourth dielectric layer, wherein the fourth dielectric layer surrounds and contacts the sidewall of the third light-emitting element, the second dielectric layer surrounds and contacts the fourth dielectric layer, a first interface is formed between the first dielectric layer and the second dielectric layer, a second interface is formed between the third dielectric layer and the second dielectric layer, and a third interface is formed between the fourth dielectric layer and the second dielectric layer, a first angle between the first interface and the sidewall of the first light-emitting element is greater than a second angle between the sidewall of the second light-emitting element and the second interface, and the first angle is greater than a third angle between the sidewall of the third light-emitting element and the third interface, and The following condition is satisfied: nL1>n1>n2>1, where nL1 is the refractive index of the first light-emitting element, n1 is the refractive index of the first dielectric layer, and n2 is the refractive index of the second dielectric layer. 如請求項1所述的顯示裝置,其中該第一發光元件的折射率nL1滿足以下條件式:4≧nL1>1。The display device as described in claim 1, wherein the refractive index nL1 of the first light-emitting element satisfies the following condition: 4≧nL1>1. 如請求項1所述的顯示裝置,其中該第一介質層的折射率n1和該第二介質層的折射率n2滿足以下條件式:4>n1>1,4>n2>1。The display device as described in claim 1, wherein the refractive index n1 of the first dielectric layer and the refractive index n2 of the second dielectric layer satisfy the following conditions: 4>n1>1, 4>n2>1. 如請求項1所述的顯示裝置,其中該第二介質層還設置在該些發光元件之間的間隙中,並進一步接觸該驅動基板。The display device as described in claim 1, wherein the second dielectric layer is further disposed in the gaps between the light-emitting elements and further contacts the driving substrate. 如請求項1所述的顯示裝置,其中該第一夾角的角度值小於等於45度且大於0度。The display device as described in claim 1, wherein the angle value of the first angle is less than or equal to 45 degrees and greater than 0 degree. 如請求項5所述的顯示裝置,其中在該第一發光元件和該第一介質層的剖面方向上,該第一夾角朝向該驅動基板。The display device as described in claim 5, wherein in a cross-sectional direction of the first light-emitting element and the first dielectric layer, the first angle is toward the driving substrate. 如請求項5所述的顯示裝置,其中在該第一發光元件和該第一介質層的剖面方向上,該第一夾角背離該驅動基板。The display device as described in claim 5, wherein in a cross-sectional direction of the first light-emitting element and the first dielectric layer, the first angle is away from the driving substrate. 如請求項1所述的顯示裝置,其中該第一發光元件、該第二發光元件以及該第三發光元件為不同色,且滿足以下條件式:4≧nL1>1,3.5≧nL2>1,3.5≧nL3>1,其中nL2為該第二發光元件的折射率,nL3為該第三發光元件的折射率。The display device as described in claim 1, wherein the first light-emitting element, the second light-emitting element and the third light-emitting element are of different colors and satisfy the following conditions: 4≧nL1>1, 3.5≧nL2>1, 3.5≧nL3>1, wherein nL2 is the refractive index of the second light-emitting element, and nL3 is the refractive index of the third light-emitting element. 如請求項8所述的顯示裝置,其中該第一發光元件所發出的光的波長,大於該第二發光元件和該第三發光元件所發出的光的波長。A display device as described in claim 8, wherein the wavelength of light emitted by the first light-emitting element is greater than the wavelength of light emitted by the second light-emitting element and the third light-emitting element.
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TW201930984A (en) * 2017-10-26 2019-08-01 晶元光電股份有限公司 Light-emitting device
CN110571324A (en) * 2018-06-05 2019-12-13 三星电子株式会社 LED device
CN114114749A (en) * 2020-08-31 2022-03-01 日亚化学工业株式会社 Method for manufacturing light emitting module
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TW201930984A (en) * 2017-10-26 2019-08-01 晶元光電股份有限公司 Light-emitting device
CN110571324A (en) * 2018-06-05 2019-12-13 三星电子株式会社 LED device
CN114114749A (en) * 2020-08-31 2022-03-01 日亚化学工业株式会社 Method for manufacturing light emitting module
CN116960258A (en) * 2023-07-10 2023-10-27 深圳市洲明科技股份有限公司 Light-emitting panel and preparation method thereof and light-emitting device

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