TWI898372B - Device under test socket and method for testing a device under test - Google Patents
Device under test socket and method for testing a device under testInfo
- Publication number
- TWI898372B TWI898372B TW112151098A TW112151098A TWI898372B TW I898372 B TWI898372 B TW I898372B TW 112151098 A TW112151098 A TW 112151098A TW 112151098 A TW112151098 A TW 112151098A TW I898372 B TWI898372 B TW I898372B
- Authority
- TW
- Taiwan
- Prior art keywords
- under test
- device under
- cover
- pusher
- socket
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
- G01R31/2824—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits testing of oscillators or resonators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
發明領域 Invention Field
根據本發明之實施例係關於用於測試受測裝置之受測裝置插座及方法。 Embodiments of the present invention relate to a device under test socket and method for testing a device under test.
根據本發明之實施例係關於自動化測試裝備(ATE)滑動蓋插座以用於遠場空中(OTA)測試。 Embodiments of the present invention relate to an automated test equipment (ATE) sliding cover socket for remote over-the-air (OTA) testing.
發明背景 Invention Background
裝置測試係電子裝置之現代生產及開發程序之關鍵部分。因此,大量裝置必須進行測試以使得可獲得結論性的測試結果。因此,測試環境對測試結果造成之干擾必須保持儘可能低。另一方面,為了達成合理測試輸送量,各別測試裝備應經組配以允許在以穩固且可靠方式執行測試時快速地改變受測裝置DUT。 Device testing is a key part of modern electronic device production and development processes. Consequently, a large number of devices must be tested to obtain conclusive test results. Therefore, the impact of the test environment on the test results must be kept as low as possible. Furthermore, to achieve reasonable test throughput, the respective test equipment must be configured to allow for rapid changes in the device under test (DUT) while performing tests in a robust and reliable manner.
對於裝置測試,受測裝置與測試裝備(例如,自動化測試裝備)之間的實體介面可為受測裝置插座,受測裝置實體地置放在該實體介面處,並且該實體介面可提供用於執行測試之電氣接點。除此之外,尤其對於空中OTA測試,例如DUT之天線特性的空中測試,插座可對所獲得之結果有顯著影響。 For device testing, the physical interface between the DUT and test equipment (e.g., automated test equipment) can be a DUT socket, where the DUT is physically located and provides electrical connections for testing. Furthermore, particularly for over-the-air (OTA) testing, such as testing the antenna characteristics of a device under test (DUT), the socket can significantly impact the obtained results.
因此,需要得到受測裝置插座及使用此插座測試DUT之方法的概念,此例如關於待測試之DUT的連續改變而在測試之穩固性及精度與複雜度及速度之間作出較佳折衷。 Therefore, there is a need for a device under test socket and a method for testing a DUT using the socket, which provides a good compromise between test robustness and accuracy, and complexity and speed, for example, with respect to continuous changes in the DUT to be tested.
此係藉由本申請案之獨立請求項之主題來達成。根據本發明之其他實施例係由本申請案之附屬請求項的主題界定。 This is achieved by the subject matter of the independent claim of this application. Other embodiments according to the present invention are defined by the subject matter of the dependent claims of this application.
發明概要 Summary of the Invention
根據本發明之實施例包含一種用於測試(例如用於固持及/或接觸)受測裝置DUT(例如包含一或多個天線結構之受測裝置)之受測裝置插座。該受測裝置插座包含:基座結構,例如其具有受測裝置凹穴以用於使該受測裝置機械地居中;以及蓋,其中該蓋經組配以可藉由該蓋例如圍繞延伸穿過該受測裝置凹穴之軸線的旋轉(例如藉由相對於該基座結構之旋轉)而固定(例如可拆卸地固定)至該基座結構。此外,該蓋經組配以朝向該基座結構之受測裝置部分(例如朝向該基座結構之受測裝置凹穴,例如以便將該受測裝置推動至該受測裝置凹穴中及/或以便確保在該受測裝置與一或多個電氣接點(例如配置於該受測裝置凹穴中)之間的可靠電氣接觸,其中舉例而言,該推動器可為或可不為該蓋之部分)推動一推動器(例如低介電常數結構;例如「電磁透明(electromagnetically transparent)」結構或實質上「電磁透明結構(electromagnetic transparent structure)」,例如由Evonik HF71材料製成之結構,例如由硬質泡沫製成或由閉孔硬質泡沫製成或由基於聚甲基丙烯醯亞胺化學物質之閉孔硬質泡沫製成的結構)。 Embodiments according to the present invention include a DUT socket for testing (e.g., for holding and/or contacting) a DUT (e.g., a DUT including one or more antenna structures). The DUT socket includes a base structure, e.g., having a DUT recess for mechanically centering the DUT, and a cover, wherein the cover is configured to be secured (e.g., removably secured) to the base structure by, for example, rotating the cover about an axis extending through the DUT recess (e.g., by rotating the cover relative to the base structure). Furthermore, the cover is configured to push a pusher (e.g., a low dielectric constant structure; e.g., an “electromagnetically transparent” structure or an essentially “electromagnetic transparent structure,” e.g., a structure made of Evonik HF71 material, e.g., made of rigid foam or made of closed-cell rigid foam or made of closed-cell rigid foam based on polymethacrylimide chemistry) toward a device under test portion of the base structure (e.g., toward a device under test cavity of the base structure, e.g., in order to push the device under test into the device under test cavity and/or in order to ensure reliable electrical contact between the device under test and one or more electrical contacts (e.g., arranged in the device under test cavity), wherein, for example, the pusher may or may not be part of the cover).
另外,該蓋之中心部分(其例如在該蓋固定至該基座結構時與該受測裝置部分/受測裝置凹穴相反)係開放的及/或包含例如具有小於或等於1.2之相對介電常數的低介電常數材料,例如以實現電磁波之實質上無失真傳輸,例如對於在1GHz與1000GHz之間的微波頻率範圍內之一頻率。 In addition, a central portion of the cover (which, for example, is opposite the DUT portion/DUT cavity when the cover is secured to the base structure) is open and/or comprises a low-permittivity material, for example, having a relative permittivity of less than or equal to 1.2, for example, to achieve substantially distortion-free transmission of electromagnetic waves, for example, for a frequency in the microwave frequency range between 1 GHz and 1000 GHz.
根據實施例之主要想法係提供該受測裝置插座作為具有二個主要元件(即,基座結構及蓋)之插座,以使得受測裝置可配置於基座結構與蓋之間(例如由該基座結構及該蓋圍封)的體積中(例如在插座之閉合狀態中,例如在蓋附接 至基座結構時)。 The main idea according to the embodiment is to provide the device under test socket as a socket having two main components (i.e., a base structure and a cover), such that the device under test can be arranged in a volume between (e.g., enclosed by) the base structure and the cover (e.g., in the closed state of the socket, e.g., when the cover is attached to the base structure).
本案發明人認識到,此類蓋可提供可裝卸式罩(例如,帽)之功能性,其中一方面,蓋可易於裝卸以便更換DUT,且其中另一方面,在閉合狀態中(例如,其中蓋附接至基座結構),DUT穩固地固持於測試位置中。 The inventors of the present invention have recognized that such a cover can provide the functionality of a removable cover (e.g., a cap), wherein, on the one hand, the cover can be easily removed to facilitate replacement of the DUT, and wherein, on the other hand, in the closed state (e.g., with the cover attached to a base structure), the DUT is securely held in a test position.
具體言之,本案發明人認識到,可快速地執行經由旋轉移動之固定,從而允許快速更換DUT。此外,舉例而言,為了實現上文所解釋之緊固或固定DUT以供測試,該蓋經組配以例如在執行旋轉移動以便安裝至基座結構的同時朝向受測裝置部分推動在蓋與DUT之間的例如充當轉接器之推動器,此可因此引起對DUT施加力且可因此確保DUT與測試裝備之間的良好電氣接觸。對於不同DUT,可任擇地提供不同推動器。 Specifically, the inventors of this invention have recognized that securing via rotational movement can be performed quickly, thereby allowing for rapid replacement of DUTs. Furthermore, to achieve the aforementioned securing or securing of a DUT for testing, for example, the cover is equipped with a pusher, such as an adapter, that pushes the cover and the DUT toward the device under test while simultaneously performing a rotational movement for attachment to a base structure. This can thereby apply force to the DUT and ensure good electrical contact between the DUT and the test equipment. Different pushers can optionally be provided for different DUTs.
此外,為了不僅在上文所解釋的裝置之快速可更換性與測試之穩固性之間提供良好折衷,而且提供測試之精確度,本案發明人認識到,該蓋之中心部分可為開放的及/或可包含低介電常數材料或由低介電常數材料製成。因此,對由DUT輻射或發射之信號(亦即,例如待量測以用於測試)的影響可保持為較低。 Furthermore, in order to provide a good compromise between not only the rapid replaceability of the device explained above and the robustness of the test, but also the accuracy of the test, the inventors of this invention have realized that the central portion of the cover can be open and/or can include or be made of a low-k dielectric material. Thus, the impact on signals radiated or emitted by the DUT (i.e., to be measured for testing purposes) can be kept low.
根據本發明之實施例,受測裝置插座包含推動器,該推動器經組配以朝向受測裝置凹穴推動受測裝置,例如將受測裝置推動至受測裝置凹穴中。該推動器可包含低介電常數材料,例如具有小於或等於1.2之相對介電常數的材料,並且該蓋可經組配以朝向受測裝置凹穴推動該推動器,例如以便確保受測裝置與一或多個電氣接點(例如配置於該受測裝置凹穴中)之間的可靠電氣接觸。任擇地,該推動器可為或可不為該蓋之部分。 According to an embodiment of the present invention, the DUT socket includes a pusher configured to push the DUT toward a DUT recess, for example, to push the DUT into the DUT recess. The pusher may include a low-k dielectric material, for example, a material having a relative dielectric constant less than or equal to 1.2, and the cover may be configured to push the pusher toward the DUT recess, for example, to ensure reliable electrical contact between the DUT and one or more electrical contacts (e.g., disposed in the DUT recess). Optionally, the pusher may or may not be part of the cover.
推動器可充當用於例如基於該蓋之旋轉而朝向DUT平移或向前移動的轉接器或調適裝置,以使得DUT可經推動至接觸區域上,例如以用於提供良好電氣接觸。包含低介電常數材料之推動器可允許使得對DUT之所發射(例 如OTA)信號的干擾保持為較低。 The pusher can function as an adapter or adaptor that translates or moves toward the DUT, for example, based on rotation of the cover, so that the DUT can be pushed onto a contact area, for example, to provide good electrical contact. A pusher composed of a low-k dielectric material can minimize interference with the DUT's transmitted (e.g., OTA) signal.
根據本發明之實施例,推動器至少實質上由具有小於或等於1.2之相對介電常數的材料製成。本案發明人認識到,此類材料之使用允許使例如尤其用於OTA天線測試之信號干擾保持為較低。 According to an embodiment of the present invention, the actuator is at least substantially made of a material having a relative dielectric constant less than or equal to 1.2. The inventors have recognized that the use of such a material allows signal interference, such as is particularly useful in OTA antenna testing, to be kept low.
根據本發明之實施例,推動器至少實質上由硬質泡沫材料(例如閉孔硬質泡沫材料或基於聚甲基丙烯醯亞胺化學物質之閉孔硬質泡沫材料)製成,例如由Evonik HF71材料製成。此可允許簡單地且針對例如具有不同形狀之不同DUT而單獨地調適此類推動器之生產。因此,可提供用於良好裝配基座結構、DUT、推動器及蓋以進行穩固測試之精確裝配之推動器。 According to an embodiment of the present invention, the pusher is at least substantially made of a rigid foam material (e.g., a closed-cell rigid foam material or a closed-cell rigid foam material based on polymethacrylimide chemistry), such as Evonik HF71. This allows for simple and individual adaptation of the production of such pushers to different DUTs, for example, with different shapes. Consequently, a precisely assembled pusher can be provided for a good fit of the base structure, DUT, pusher, and lid for robust testing.
根據本發明之實施例,推動器之材料包含大於80MPa之拉伸模數。因此,推動器可包含充足硬度,以便實現DUT在插座內之良好接觸及固定。 According to an embodiment of the present invention, the material of the pusher has a tensile modulus greater than 80 MPa. Therefore, the pusher can have sufficient rigidity to achieve good contact and securement of the DUT within the socket.
根據本發明之實施例,推動器之材料的拉伸模數小於蓋之材料之拉伸模數的十分之一。 According to an embodiment of the present invention, the tensile modulus of the material of the pusher is less than one tenth of the tensile modulus of the material of the cover.
根據本發明之實施例,基座結構包含豁口,該豁口經組配以收納該推動器且任擇地使該推動器居中。因此,可提供基座結構、DUT、推動器及蓋之良好裝配以進行穩固測試。 According to an embodiment of the present invention, the base structure includes a notch configured to receive the pusher and optionally center the pusher. This provides a good assembly of the base structure, DUT, pusher, and lid for robust testing.
根據本發明之實施例,蓋及推動器經組配為受測裝置插座之單獨組件。因此,可易於更換DUT專用推動器。此外,亦可更換磨損之推動器,而不必替換整個插座。 According to an embodiment of the present invention, the cover and pusher are assembled as a single component of the DUT socket. Therefore, the DUT-specific pusher can be easily replaced. Furthermore, a worn pusher can be replaced without having to replace the entire socket.
根據本發明之實施例,推動器附接(例如膠合或旋擰或使用任何其他連接技術或接合方法附接)至蓋,例如以形成單個組件(「單件結構」),以使得例如包含蓋及推動器之單個機械組件可藉由旋轉手動地固定至基座結構,及/或例如以使得在蓋旋轉以將該蓋固定至基座結構時,推動器與蓋一起旋轉。因此,插座可包含較少部分,此可實現更快速地更換DUT。 According to an embodiment of the present invention, the pusher is attached (e.g., glued or screwed or attached using any other connection technique or joining method) to the cover, e.g., to form a single assembly ("monolithic structure"), such that, for example, a single mechanical assembly including the cover and the pusher can be manually secured to the base structure by rotation, and/or, for example, such that when the cover is rotated to secure it to the base structure, the pusher rotates with the cover. Thus, the socket can include fewer parts, which can enable faster replacement of DUTs.
根據本發明之實施例,推動器以浮動方式機械地耦接至蓋(例如以可旋轉方式耦接,以使得例如推動器可相對於該蓋移動及/或旋轉;及/或例如以形成單個組件(「單件結構」),以使得例如包含該蓋之單個機械組件以及推動器可藉由該蓋之旋轉手動地固定至基座結構;及/或例如以使得在蓋旋轉以將該蓋固定至基座結構時,推動器不與該蓋一起旋轉,而是插入且導引於受測裝置凹穴中)。因此,作為一實例,蓋之旋轉可導致蓋與DUT之間的距離減小,其中推動器例如配置於蓋與DUT之間的居中位置中,以使得推動器由於浮動耦接而不旋轉,但僅在豎直方向(例如垂直於蓋之旋轉移動的旋轉平面,例如旋轉之法線方向)上朝向DUT移動及/或在DUT上施加力。此外,推動器與DUT之間的相對移動可減少(例如與推動器連同蓋一起旋轉相比),此可保護DUT,例如尤其未封裝之DUT。作為一實例,推動器及蓋可經耦接以使得僅平移力而無扭矩可轉遞至DUT。 According to an embodiment of the present invention, the pusher is mechanically coupled to the cover in a floating manner (for example, coupled in a rotatable manner so that, for example, the pusher can be moved and/or rotated relative to the cover; and/or, for example, to form a single assembly ("single-piece structure") so that, for example, a single mechanical assembly including the cover and the pusher can be manually fixed to the base structure by rotating the cover; and/or, for example, so that when the cover is rotated to fix the cover to the base structure, the pusher does not rotate with the cover, but is inserted and guided in a recess of the device under test). Thus, as an example, rotation of the lid can result in a reduction in the distance between the lid and the DUT, with the actuator being positioned, for example, in a central position between the lid and the DUT. This allows the actuator to not rotate due to the floating coupling, but to move toward and/or exert a force on the DUT only in a vertical direction (e.g., perpendicular to the rotational plane of the lid's rotational movement, e.g., the normal direction of rotation). Furthermore, relative movement between the actuator and the DUT can be reduced (e.g., compared to rotating the actuator together with the lid), which can protect the DUT, particularly an unpackaged DUT. As an example, the actuator and lid can be coupled such that only translational forces, and no torque, are transmitted to the DUT.
根據本發明之實施例,推動器經組配以手動地插入至基座結構之豁口中,且任擇地在基座結構之豁口中居中及/或對準。此外,推動器可經組配以在蓋藉由該蓋之旋轉而緊固(例如可拆卸地固定)至基座結構時藉由來自該蓋之力而經推向受測裝置凹穴。因此,可以較低時間工作量執行插座之簡單組裝。 According to an embodiment of the present invention, the pusher is configured to be manually inserted into a notch in a base structure and optionally centered and/or aligned within the notch. Furthermore, the pusher can be configured to be pushed toward the DUT cavity by force from the cover when the cover is secured (e.g., removably secured) to the base structure by rotation. Thus, the socket can be easily assembled with minimal time and effort.
根據本發明之實施例,保護器結構在推動器鄰近於蓋之區域中附接至推動器,例如在該推動器與該蓋之間具有保護器結構。此外,保護器結構可經配置以處於推動器與蓋之間,例如在蓋朝向受測裝置凹穴施加力之區域中。舉例而言,保護器結構可包含耐磨材料。保護器可例如由於蓋與推動器之相對旋轉移動而減少推動器之磨損。 According to an embodiment of the present invention, a protector structure is attached to the pusher in an area adjacent to the cover, for example, the protector structure is positioned between the pusher and the cover. Furthermore, the protector structure can be positioned between the pusher and the cover, for example, in an area where the cover applies a force toward the device under test cavity. For example, the protector structure can comprise a wear-resistant material. The protector can reduce wear on the pusher, for example, due to relative rotational movement of the cover and the pusher.
根據本發明之實施例,保護器結構附接至推動器之頂表面,該頂表面背對受測裝置凹穴,並且保護器結構經配置於推動器之頂表面的外部區中,從而使推動器之頂表面的中心區自由。因此,可減少對由DUT發射之信號的信 號干擾。 According to an embodiment of the present invention, a protector structure is attached to the top surface of the pusher, which faces away from the DUT cavity. The protector structure is positioned in the outer region of the pusher's top surface, leaving the center region of the pusher's top surface free. This reduces signal interference with signals transmitted by the DUT.
根據本發明之實施例,保護器結構之材料包含比推動器之材料更高的機械穩定性(例如,更高拉伸模數,較佳地大於3500MPa,及/或更高耐磨性),及/或保護器結構之材料包含大於或等於2且例如較佳地小於或等於3.5之相對介電常數。因此,保護器可為穩固且耐磨的,同時僅以極有限方式干擾測試信號。 According to an embodiment of the present invention, the material of the protector structure has higher mechanical stability (e.g., higher tensile modulus, preferably greater than 3500 MPa, and/or higher wear resistance) than the material of the actuator, and/or the material of the protector structure has a relative dielectric constant greater than or equal to 2, and for example, preferably less than or equal to 3.5. As a result, the protector can be robust and wear-resistant while only interfering with the test signal in a very limited manner.
根據本發明之實施例,舉例而言,當在平行於受測裝置平面之平面上觀察時或當在平行於基座結構之主表面的平面上觀察時,推動器之橫截面積在自受測裝置凹穴朝向蓋之一方向上例如連續地或逐步地加寬。此可實現推動器在插座內之簡單的插入及/或居中。 According to an embodiment of the present invention, for example, when viewed in a plane parallel to the plane of the device under test or when viewed in a plane parallel to the main surface of the base structure, the cross-sectional area of the pusher widens continuously or gradually in a direction from the device under test cavity toward the cover. This allows for easier insertion and/or centering of the pusher within the socket.
根據本發明之實施例,舉例而言,當在平行於受測裝置平面之平面上觀察時,推動器在該蓋附近之橫截面積比推動器在受測裝置凹穴附近之橫截面積大至少二倍。此可實現推動器在插座內之尤其簡單的插入及/或居中。 According to an embodiment of the present invention, for example, the cross-sectional area of the pusher near the cover, when viewed in a plane parallel to the plane of the device under test, is at least twice as large as the cross-sectional area of the pusher near the recess of the device under test. This allows for particularly simple insertion and/or centering of the pusher within the socket.
根據本發明之實施例,推動器在蓋附近包含圓形橫截面;及/或推動器在受測裝置凹穴附近包含圓形橫截面,而例如受測裝置凹穴包含矩形形狀。此可實現推動器在插座內之尤其簡單的插入及/或居中。 According to an embodiment of the present invention, the pusher has a circular cross-section near the cover; and/or the pusher has a circular cross-section near the DUT recess, where the DUT recess has a rectangular shape, for example. This allows for particularly simple insertion and/or centering of the pusher within the socket.
根據本發明之實施例,推動器之形狀在受測裝置凹穴附近經調適成該受測裝置凹穴之形狀,例如以使得推動器的周邊至少大致平行於受測裝置凹穴之周邊,例如在其間具有間隙。因此,可提供良好且緊密之裝配及居中以用於穩固且準確之DUT測試。 According to an embodiment of the present invention, the shape of the pusher is adapted to the shape of the DUT cavity near the DUT cavity, for example, such that the perimeter of the pusher is at least approximately parallel to the perimeter of the DUT cavity, e.g., with a gap therebetween. This provides a good and tight fit and centering for stable and accurate DUT testing.
根據本發明之實施例,推動器(例如推動器之狹窄部分)經組配以在蓋附接至基座結構時伸入受測裝置凹穴中(且任擇地朝向受測裝置凹穴推動該推動器),其中舉例而言,推動器之並未伸入受測裝置凹穴中的一部分在與推動器之伸入受測裝置凹穴中的一部分相比時可加寬(例如包含至少二倍之橫截面 積)。替代地,推動器經組配以在蓋附接至基座結構時不進入(例如伸入其中)受測裝置凹穴(且任擇地朝向受測裝置凹穴推動該推動器)。因此,實施例可允許在凹入區域中在存在及不存在DUT之情況下處理裝置測試情境。 According to an embodiment of the present invention, a pusher (e.g., a narrow portion of the pusher) is configured to extend into a DUT cavity (and optionally push the pusher toward the DUT cavity) when the lid is attached to the base structure. For example, the portion of the pusher that does not extend into the DUT cavity may be wider (e.g., having at least twice the cross-sectional area) than the portion of the pusher that does extend into the DUT cavity. Alternatively, the pusher is configured not to enter (e.g., extend into) the DUT cavity (and optionally push the pusher toward the DUT cavity) when the lid is attached to the base structure. Thus, embodiments can allow device testing scenarios to be handled in the recessed area with and without a DUT.
根據本發明之實施例,推動器經組配以例如在受測裝置經置放於受測裝置凹穴中時覆蓋該受測裝置,且覆蓋該受測裝置周圍之區域,例如避免產生具有與DUT天線陣列相同尺寸之空腔。因此,可避免非所需共振。 According to an embodiment of the present invention, the actuator is configured to cover the DUT when placed in the DUT cavity, and to cover the area surrounding the DUT, for example, to avoid creating a cavity with the same dimensions as the DUT antenna array. Thus, undesirable resonances can be avoided.
根據本發明之實施例,當在垂直於當該蓋固定至基座時該支撐結構所配置於的平面之投影上觀察時,或當在當該蓋固定至該基座(例如在支撐結構之中心區域中具有開口或低介電常數材料)時垂直於受測裝置平面(例如當受測裝置插入至受測裝置凹穴中時受測裝置或受測裝置之一或多個天線所配置於的平面)之投影上觀察時,該蓋包含例如包圍(例如完全包圍)受測裝置位置(例如受測裝置凹穴)之機械剛性支撐結構(其例如較佳地為內部開放的),其中舉例而言,支撐結構之中心區域中的開口或低介電常數材料可例如大於受測裝置凹穴,或其中舉例而言,在支撐結構之中心區域中的開口或低介電常數材料之二個垂直方向上(例如在支撐結構所配置於之平面內的二個方向上)的延伸部可例如比受測裝置凹穴之對應延伸部(例如在相同二個方向上)大至少50%,或其中舉例而言,在支撐結構之中心區域中的開口或低介電常數材料之二個垂直方向上(例如在支撐結構所配置於之平面內的二個方向上)的延伸部可例如比受測裝置凹穴之對應延伸部(例如在相同二個方向上)大至少100%,或其中舉例而言,在支撐結構之中心區域中的開口或低介電常數材料大到使得自錐束中之受測裝置凹穴之中心發射的輻射穿過該支撐結構之該中心區域中的該開口或穿過該低介電常數材料,該錐束之軸線垂直於受測裝置平面,且該錐束之開口角等於30度,或其中舉例而言,該開口經調適以使得該開口之內部邊界距一線(其垂直於支撐結構所配置於之平面且延伸穿過受測裝置凹穴之中心)的距離大於或等於該受測裝置 凹穴之該中心距該支撐結構所配置於之該平面的距離,或其中舉例而言,支撐結構之中心區域中的低介電常數材料經調適以使得該支撐結構之該中心區域中的該低介電常數材料之外部邊界距一線(其垂直於支撐結構所配置於之平面且延伸穿過受測裝置凹穴之中心)的最小距離大於或等於該受測裝置凹穴之該中心距該支撐結構所配置於之該平面的距離。此可允許提供插座之穩固蓋。 According to an embodiment of the present invention, the cover includes, for example, a mechanically rigid support structure (which is preferably an inner portion) surrounding (for example, completely surrounding) a position of the device under test (for example, a device under test cavity) when viewed in a projection perpendicular to the plane in which the support structure is disposed when the cover is secured to the base, or when viewed in a projection perpendicular to a plane of the device under test (for example, a plane in which the device under test or one or more antennas of the device under test are disposed when the device under test is inserted into the device under test cavity) when the cover is secured to the base (for example, having an opening or a low-k material in the central region of the support structure). open), wherein, for example, the opening or the low-k dielectric material in the central region of the support structure may be, for example, larger than the cavity of the device under test, or wherein, for example, the extension of the opening or the low-k dielectric material in the central region of the support structure in two perpendicular directions (for example, in two directions in the plane in which the support structure is arranged) may be, for example, at least 50% larger than the corresponding extension of the cavity of the device under test (for example, in the same two directions), or wherein, for example, the extension of the opening or the low-k dielectric material in the central region of the support structure in two perpendicular directions (for example, in the plane in which the support structure is arranged) may be, for example, at least 50% larger than the corresponding extension of the cavity of the device under test (for example, in the same two directions). The extension of the device under test cavity in two directions in the plane of the device under test may, for example, be at least 100% larger than the corresponding extension of the device under test cavity (for example in the same two directions), or, for example, the opening or the low-k dielectric constant material in the central region of the support structure is so large that radiation emitted from the center of the device under test cavity in the cone passes through the opening in the central region of the support structure or through the low-k dielectric constant material, the axis of the cone is perpendicular to the device under test plane, and the opening angle of the cone is equal to 30 degrees, or, for example, the opening is adapted so that the inner boundary of the opening is 100% from a line (which is perpendicular to the plane of the device under test) The distance between the center of the DUT cavity and the plane in which the support structure is arranged and extending through the center of the DUT cavity is greater than or equal to the distance between the center of the DUT cavity and the plane in which the support structure is arranged. Alternatively, for example, the low-k dielectric material in the central region of the support structure is adapted such that the minimum distance between the outer edge of the low-k dielectric material in the central region of the support structure and a line (perpendicular to the plane in which the support structure is arranged and extending through the center of the DUT cavity) is greater than or equal to the distance between the center of the DUT cavity and the plane in which the support structure is arranged. This allows for providing a secure cover for the socket.
根據本發明之實施例,支撐結構包含具有在2與3.5之間的相對介電常數之材料。因此,例如用於OTA測試之測試結果干擾可保持為較低。 According to an embodiment of the present invention, the support structure includes a material having a relative dielectric constant between 2 and 3.5. As a result, interference with test results, such as for OTA testing, can be kept low.
根據本發明之實施例,支撐結構例如至少實質上由聚醚醚酮(PEEK)製成。本案發明人認識到,此類材料非常適合於提供良好介電常數與拉伸模數之間的良好折衷。 According to an embodiment of the present invention, the support structure is, for example, at least substantially made of polyetheretherketone (PEEK). The inventors of this application have recognized that this material is well suited to provide a good compromise between a good dielectric constant and a good tensile modulus.
根據本發明之實施例,支撐結構包含實質上矩形外周邊並且該支撐結構在中心(例如內部)區域中包含具有圓形周邊之開口,例如圓形開口或矩形開口,其中矩形之邊角係圓角,圓角半徑大於邊長的四分之一。 According to an embodiment of the present invention, the support structure comprises a substantially rectangular outer perimeter and the support structure comprises an opening with a circular perimeter in a central (e.g., inner) region, such as a circular opening or a rectangular opening, wherein the corners of the rectangle are rounded, and the radius of the rounded corners is greater than one-quarter of the side length.
根據本發明之實施例,複數個卡鉤(例如至少三個卡鉤或至少四個卡鉤)經配置於蓋處或蓋之支撐結構處(例如附接至支撐結構或與支撐結構一起製成為一個整體件)。此外,配置於該蓋處或該支撐結構處之該等卡鉤可經調適以與配置於基座結構處(例如附接至基座結構或與支撐結構一起製成為一個整體件)之各別配合卡鉤(例如至少三個卡鉤或至少四個卡鉤)嚙合。任擇地,卡鉤可由具有在2與3.5之間的相對介電常數之材料製成。任擇地,作為一實例,卡鉤可由與蓋之支撐結構相同的材料製成。作為另一任擇特徵,卡鉤可由PEEK製成。本案發明人認識到,使用複數個卡鉤,可提供將蓋附接至基座結構之簡單、快速且穩固方式。 According to an embodiment of the present invention, a plurality of hooks (e.g., at least three hooks or at least four hooks) are disposed on the lid or on a support structure of the lid (e.g., attached to the support structure or formed integrally with the support structure). Furthermore, the hooks disposed on the lid or on the support structure can be adapted to engage with respective mating hooks (e.g., at least three hooks or at least four hooks) disposed on the base structure (e.g., attached to the base structure or formed integrally with the support structure). Optionally, the hooks can be made of a material having a relative dielectric constant between 2 and 3.5. Optionally, as an example, the hooks can be made of the same material as the support structure of the lid. As another optional feature, the hooks can be made of PEEK. The inventors have recognized that using multiple hooks provides a simple, quick, and secure way to attach the cover to the base structure.
根據本發明之實施例,該等卡鉤(例如配置於蓋處或支撐結構處之該等卡鉤及/或配置於基座結構處之該等卡鉤)在受測裝置插座之區域中配置於 推動器旁邊。因此,設計之複雜度可保持為較低並且測試中之各別信號干擾亦如此。 According to an embodiment of the present invention, the hooks (e.g., the hooks disposed on the cover or support structure and/or the hooks disposed on the base structure) are disposed adjacent to the actuator in the area of the DUT socket. This keeps design complexity low, as well as any signal interference under test.
根據本發明之實施例,該等卡鉤(例如配置於蓋處或支撐結構處之該等卡鉤及/或配置於基座結構處之該等卡鉤)係L形。此實現蓋與基座結構之簡單附接及分離。 According to an embodiment of the present invention, the hooks (e.g., the hooks disposed on the lid or the support structure and/or the hooks disposed on the base structure) are L-shaped. This allows for easy attachment and detachment of the lid and the base structure.
根據本發明之實施例,配置於基座結構處之該等卡鉤的各別第一部分經組配以使配置於基座結構處之該等卡鉤的各別第二部分與基座結構之表面(例如主表面)保持一間隔,其中配置於基座結構處之該等卡鉤的各別第一部分可例如實質上垂直於(例如具有+/-5度之容限)基座結構之主表面而延伸。此外,配置於基座結構處之該等卡鉤的各別第二部分(其例如藉由各別第一部分與基座結構之主表面間隔開)之各別內表面可經組配以允許配置於蓋處或配置於支撐結構處之各別卡鉤與例如配置於基座結構處之該等卡鉤的各別第二部分之該等各別內表面嚙合。任擇地,配置於蓋處或配置於支撐結構處之各別卡鉤可例如在該蓋旋轉時移動至基座結構之主表面與各別內表面之間的間隔中。 According to an embodiment of the present invention, the first portions of the hooks disposed on the base structure are configured so that the second portions of the hooks disposed on the base structure are spaced apart from a surface (e.g., a main surface) of the base structure, wherein the first portions of the hooks disposed on the base structure may, for example, extend substantially perpendicularly (e.g., with a tolerance of +/- 5 degrees) to the main surface of the base structure. Furthermore, the inner surfaces of the second portions of the hooks disposed on the base structure (which are spaced apart from the main surface of the base structure, for example, by the first portions) may be configured to allow the hooks disposed on the cover or on the support structure to engage with the inner surfaces of the second portions of the hooks disposed on the base structure, for example. Optionally, the respective hooks arranged on the cover or on the support structure can be moved into the gap between the main surface and the respective inner surface of the base structure, for example when the cover is rotated.
根據本發明之實施例,配置於蓋處或例如該蓋之支撐結構處之該等卡鉤的各別第一部分經組配以使配置於該蓋處或(例如該蓋之)該支撐結構處之該等卡鉤的各別第二部分與該蓋或(例如該蓋之)該支撐結構之表面(例如主表面)保持一間隔。任擇地,配置於支撐結構處之該等卡鉤的各別第一部分可例如實質上垂直於(例如具有+/-5度之容限)支撐結構之主表面而延伸。此外,配置於蓋處或支撐結構處之該等卡鉤的各別第二部分(其例如藉由各別第一部分與蓋或支撐結構之主表面間隔開)之各別內表面可經組配以與配置於基座結構處之各別卡鉤的各別內表面嚙合,例如以在該蓋旋轉時移動至基座結構之主表面與配置於基座結構處的該等卡鉤之各別內表面之間的間隔中。任擇地,配置於基座結構處之該等卡鉤的各別第二部分之各別內表面可例如實質上平行於(例如具有+/-5 度之容限)基座結構之主表面而延伸。 According to an embodiment of the present invention, the first portions of the hooks disposed on the lid or, for example, the support structure of the lid are configured so that the second portions of the hooks disposed on the lid or, for example, the support structure of the lid are spaced apart from a surface (for example, a main surface) of the lid or, for example, the support structure of the lid. Optionally, the first portions of the hooks disposed on the support structure may extend substantially perpendicularly (for example, with a tolerance of +/- 5 degrees) to the main surface of the support structure. Furthermore, the respective inner surfaces of the respective second portions of the hooks disposed on the lid or support structure (separated from the main surface of the lid or support structure, for example, by the respective first portions) can be configured to engage with the respective inner surfaces of the respective hooks disposed on the base structure, for example, so as to move into the gap between the main surface of the base structure and the respective inner surfaces of the hooks disposed on the base structure when the lid is rotated. Optionally, the respective inner surfaces of the respective second portions of the hooks disposed on the base structure can extend substantially parallel to the main surface of the base structure (e.g., with a tolerance of +/- 5 degrees).
因此,可提供用於DUT之精確界定之空間測試組配。 Therefore, a precisely defined spatial test setup for the DUT can be provided.
根據本發明之實施例,該等卡鉤(例如配置於蓋處或支撐結構處之該等卡鉤及/或配置於基座結構處之該等卡鉤)經組配以藉由摩擦或藉由可藉由該蓋之手動旋轉而解決的卡扣功能性來固定該蓋。此可實現DUT之快速且簡單更換。 According to an embodiment of the present invention, the hooks (e.g., the hooks disposed on the cover or the support structure and/or the hooks disposed on the base structure) are configured to secure the cover by friction or by a snap-fit functionality that can be achieved by manually rotating the cover. This enables quick and easy replacement of DUTs.
根據本發明之實施例包含一種用於測試受測裝置之方法,其中該方法包含將受測裝置插入至測試插座中,例如插入至測試插座之受測裝置凹穴中,其中受測裝置插座包含:基座結構,例如其具有受測裝置凹穴以用於使該受測裝置機械地居中;以及蓋,其中該蓋之中心部分(其例如在該蓋固定至基座結構時與受測裝置部分/受測裝置凹穴相反)係開放的及/或包含例如具有小於或等於1.2之相對介電常數的低介電常數材料(例如以實現電磁波之實質上無失真傳輸,例如對於在1GHz與1000GHz之間的微波頻率範圍內之一頻率)。 Embodiments according to the present invention include a method for testing a device under test, wherein the method includes inserting the device under test into a test socket, for example, into a device under test cavity of the test socket, wherein the device under test socket includes: a base structure, for example, having a device under test cavity for mechanically centering the device under test; and a cover, wherein a central portion of the cover (which is, for example, opposite the device under test portion/device under test cavity when the cover is secured to the base structure) is open and/or includes a low-dielectric-constant material, for example, having a relative dielectric constant of less than or equal to 1.2 (for example, to achieve substantially distortion-free transmission of electromagnetic waves, for example, for a frequency in the microwave frequency range between 1 GHz and 1000 GHz).
該方法進一步包含藉由旋轉(例如手動旋轉)蓋(例如圍繞延伸穿過受測裝置凹穴之軸線及/或例如藉由相對於基座結構之旋轉)來將該蓋固定(例如可拆卸地固定)至該基座結構,其中該蓋朝向基座結構之受測裝置部分(例如朝向基座結構之受測裝置凹穴,例如以便將受測裝置推動至受測裝置凹穴中及/或以便確保在受測裝置與一或多個電氣接點(例如配置於受測裝置凹穴中)之間的可靠電氣接觸)推動一推動器(例如低介電常數結構;例如「電磁透明(electromagnetically transparent)」結構或實質上「電磁透明結構(electromagnetic transparent structure)」;例如由Evonik HF71材料製成之結構;例如由硬質泡沫製成或由閉孔硬質泡沫製成或由基於聚甲基丙烯醯亞胺化學物質之閉孔硬質泡沫製成的結構)。任擇地,該推動器可為或可不為該蓋之部分。 The method further comprises securing (e.g., removably securing) the cover to the base structure by rotating (e.g., manually) the cover (e.g., about an axis extending through the DUT cavity and/or, e.g., by rotating relative to the base structure), wherein the cover pushes a pusher (e.g., a low dielectric constant structure; e.g., an "electromagnetically transparent" structure or a substantially "electromagnetic transparent structure"; e.g., a structure provided by Evonik) toward a DUT portion of the base structure (e.g., toward the DUT cavity of the base structure, e.g., to push the DUT into the DUT cavity and/or to ensure reliable electrical contact between the DUT and one or more electrical contacts (e.g., disposed in the DUT cavity)). HF71 material; for example, a structure made of rigid foam or a closed-cell rigid foam or a closed-cell rigid foam based on polymethacrylimide chemistry). Optionally, the pusher may or may not be part of the cover.
根據實施例,該方法包含執行受測裝置之空中測試,其中透過蓋 之中心部分(其為開放的及/或其包含低介電常數材料)且透過推動器執行在受測裝置(其例如由推動器推動至受測裝置凹穴中)與測試天線之間的無線傳輸。 According to an embodiment, the method includes performing an over-the-air test of a device under test, wherein wireless transmission is performed between the device under test (which is pushed into a cavity of the device under test, for example, by the pusher) and a test antenna through a central portion of a cover (which is open and/or comprises a low-k dielectric constant material) and by a pusher.
如上文所描述之方法可基於與上文所描述之受測裝置插座相同的考慮因素。順便而言,該方法可藉由亦關於受測裝置插座所描述之所有特徵及功能性來完成。反之亦然,其適用於關於上文所描述之受測裝置插座的各別方法之特徵。 The method described above can be based on the same considerations as the DUT socket described above. Incidentally, the method can be implemented using all features and functionalities also described with respect to the DUT socket. Vice versa, this applies to the features of the respective methods described with respect to the DUT socket.
100,200,600,900,1300:受測裝置插座 100, 200, 600, 900, 1300: Tested device sockets
110,210,610,910,1210,1310:基座結構 110, 210, 610, 910, 1210, 1310: Base structure
112,612,912,1312:豁口 112, 612, 912, 1312: Gap
115,215,915:互鎖區段 115, 215, 915: Interlocking sections
120,220,620,920,1220,1320:蓋 120, 220, 620, 920, 1220, 1320: Cover
122,622:中心部分,中心區域 122,622: Central part, central area
130,230,630,730,930,1230,1330:推動器 130, 230, 630, 730, 930, 1230, 1330: Thrusters
140:受測裝置 140: Device under test
150:表面 150: Surface
160:凹入接觸區域 160: Recessed contact area
170,270,670:受測裝置凹穴 170, 270, 670: Test device cavity
214,224,619,624,914,924,1314,1324,1334:卡鉤 214,224,619,624,914,924,1314,1324,1334: Hook
214a,224a:各別第一部分 214a, 224a: Part 1 of each
214b,224b:各別第二部分 214b, 224b: Second part of each
214B,224B:各別內表面 214B, 224B: Respective inner surfaces
216,616:第一層 216,616: First level
218,618:第二層 218,618: Second level
222:孔,中心部分,中心區域 222: hole, center part, center area
226:主要區段,支撐結構 226: Main section, supporting structure
232,632,1232,1332:保護器結構 232,632,1232,1332: Protector structure
280,440,940:螺釘 280,440,940: Screws
400:自動化測試裝備 400:Automated testing equipment
410,1000:載板 410,1000:Carrier board
420:遠場工程插座 420: Remote Engineering Socket
422:白色推動器材料 422: White actuator material
424:套環 424: Ring
430:量測天線 430: Measurement Antenna
617:電氣插座 617: Electrical socket
626,1326:支撐結構 626,1326:Support structure
640:DUT AiP 640:DUT AiP
1100:簡單蓋插座 1100: Simple socket cover
1200:旋轉蓋插座,受測裝置插座 1200: Rotating cover socket, device under test socket
1322:開放區段,開口,中心部分,中心區域 1322: open section, opening, center part, center area
1360:DUT接觸區域 1360: DUT contact area
1370:凹入區域,凹部,受測裝置位置,受測裝置凹穴 1370: recessed area, recess, device under test location, device under test cavity
1390:箭頭 1390: Arrow
圖式未必按比例繪製,實際上重點一般放在繪示本發明之原理上。在以下描述中,參考以下圖式描述本發明之各種實施例,其中:圖1 展示根據本發明之實施例的受測裝置插座之示意圖;圖2 展示根據本發明之實施例的受測裝置插座之示意性3D渲染;圖3a)、圖3b) 展示圖3a)之具有加壓螺釘之蛤殼蓋的圖像,以及圖3b)之槓桿/凸輪蓋插座的圖像;圖4 展示具有附接載板之自動化測試裝備的相片,其中遠場工程插座安裝於載板上;圖5 展示遠場工程插座之相片;圖6 展示根據實施例之受測裝置插座之示意性分解視圖;圖7 展示根據實施例之推動器之示意圖;圖8a)至圖8d) 展示根據實施例之受測裝置插座之示意圖,其中蓋旋轉以便固定至基座結構;圖9a)、圖9b) 展示根據本發明之實施例的處於圖9a)之接觸狀態中以及處於圖9b)之自由狀態中的受測裝置插座之示意圖;圖10至圖12展示根據本發明之實施例的圖10a)至圖10c)之在無插座的情況下、圖11a)至圖11c)之在具有簡單蓋插座的情況下以及圖12a)至圖12d)之在 具有旋轉蓋插座的情況下遠場OTA測試之模擬結果;以及圖13a)至圖13c) 展示根據實施例之受測裝置插座之示例性組裝製程的相片。 The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various embodiments of the present invention are described with reference to the following drawings, in which: FIG1 shows a schematic diagram of a device under test socket according to an embodiment of the present invention; FIG2 shows a schematic 3D rendering of a device under test socket according to an embodiment of the present invention; FIG3a) and FIG3b) show an image of the clamshell cover with the pressure screw of FIG3a), and an image of the lever/cam cover socket of FIG3b); FIG4 shows a photograph of an automated test equipment with an attached carrier board, wherein the remote engineering socket is mounted on the carrier board; FIG5 shows a photograph of the remote engineering socket; FIG6 shows a schematic exploded view of the device under test socket according to an embodiment; FIG7 shows a schematic diagram of a pusher according to an embodiment; and FIG8a) to FIG8d) show a schematic diagram of a pusher according to an embodiment. Schematic diagrams of a device under test (DUT) socket according to an embodiment are shown, wherein the cover is rotated for securing to a base structure; FIG9a) and FIG9b) schematic diagrams of a device under test (DUT) socket according to an embodiment of the present invention in a contacted state (FIG. 9a) and a free state (FIG. 9b); FIG10 to FIG12 show simulation results of remote OTA testing according to an embodiment of the present invention, in the absence of a socket (FIG. 10a) to FIG10c), in the presence of a simple cover (FIG. 11a) to FIG11c), and in the presence of a rotating cover (FIG. 12a) to FIG12d); and FIG13a) to FIG13c) photographs of an exemplary assembly process for a device under test socket according to an embodiment.
較佳實施例之詳細說明 Detailed description of the preferred embodiment
即使具有相同或等效功能性之相同或等效的一或多個元件出現於不同圖式中,以下描述中仍藉由相同或等效元件符號來表示該等一或多個元件。 Even if the same or equivalent components with the same or equivalent functionality appear in different drawings, the same or equivalent component numbers will be used to represent the same or equivalent components in the following description.
在以下描述中,闡述複數個細節以提供對本發明之實施例的更透徹解釋。然而,對於熟習此項技術者將顯而易見的係,可在無此等具體細節之情況下實踐本發明之實施例。在其他情況下,熟知結構及裝置以方塊圖形式而非詳細地展示,以免混淆本發明之實施例。另外,除非另外特定地指出,否則可將本文中稍後描述之不同實施例的特徵彼此組合。 In the following description, numerous details are set forth to provide a more thorough explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring the embodiments of the present invention. Furthermore, unless specifically stated otherwise, features of different embodiments described later in this document may be combined with one another.
圖1展示根據本發明之實施例的受測裝置插座之示意圖。圖1展示包含基座結構110及蓋120之受測裝置插座100。另外,展示了推動器130及受測裝置140。作為任擇實例,受測裝置插座100展示為配置於載板表面150上,該載板表面具有用於受測裝置140之凹入接觸區域160,例如包含接觸接腳,例如彈簧式頂針或接觸墊。然而,任擇地,圖1中所展示之表面150亦可為基座結構110之部分,以使得基座結構110任擇地包含凹入接觸區域160,該凹入接觸區域可形成受測裝置凹穴170或為該受測裝置凹穴之部分。 FIG1 shows a schematic diagram of a device under test (DUT) socket according to an embodiment of the present invention. FIG1 shows a DUT socket 100 including a base structure 110 and a cover 120. Also shown are a pusher 130 and a DUT 140. As an optional example, the DUT socket 100 is shown as being disposed on a carrier surface 150 having a recessed contact area 160 for the DUT 140, for example including contact pins such as spring-loaded ejector pins or contact pads. However, the surface 150 shown in FIG1 may alternatively be part of the base structure 110, such that the base structure 110 optionally includes the recessed contact area 160, which may form or be part of a DUT cavity 170.
蓋120經組配以藉由蓋120之旋轉而可固定至基座結構110。因此,作為一實例,基座結構110及蓋120包含互鎖部分或互鎖區段115。作為一實例,基座結構110及蓋120可包含互鎖齒、卡鉤及/或螺紋。經由摩擦之互鎖亦可為可能的。 The lid 120 is configured to be secured to the base structure 110 by rotating the lid 120. Therefore, as an example, the base structure 110 and the lid 120 include interlocking portions or sections 115. As an example, the base structure 110 and the lid 120 may include interlocking teeth, hooks, and/or threads. Interlocking by friction may also be possible.
此外,蓋120經組配以朝向基座結構110之受測裝置部分推動推 動器130。在圖1中所展示之實例中,基座結構110之受測裝置部分可為基座結構110的中心部分,受測裝置在經歷測試時配置於該中心部分中或該中心部分之投影中。作為一實例,在圖1之配置中,受測裝置部分係凹入的,從而形成受測裝置凹穴170。換言之,作為任擇特徵,蓋120經組配以朝向受測裝置凹穴170推動推動器130。作為一實例,基於用於將蓋120附接或安裝至基座結構110之蓋120的旋轉移動,蓋120與受測裝置之間的距離可減小,以便將推動器130推動至受測裝置140上或朝向該受測裝置推動。因此,可提供受測裝置140與接觸區域160之間的良好接觸。 Furthermore, the cover 120 is configured to push the pusher 130 toward the DUT portion of the base structure 110. In the example shown in FIG1 , the DUT portion of the base structure 110 may be the central portion of the base structure 110, with the DUT positioned within or within a projection of the central portion during testing. As one example, in the configuration of FIG1 , the DUT portion is recessed, forming a DUT cavity 170. In other words, as an optional feature, the cover 120 is configured to push the pusher 130 toward the DUT cavity 170. For example, by rotating the cover 120 to attach or mount it to the base structure 110, the distance between the cover 120 and the device under test can be reduced, allowing the actuator 130 to be pushed onto or toward the device under test 140. This allows for better contact between the device under test 140 and the contact area 160.
此外,作為任擇特徵,蓋120之中心部分122係開放的。任擇地,部分122可包含低介電常數材料。此可允許在測試時受測裝置140之OTA信號之實質上無失真傳輸。 Additionally, as an optional feature, the central portion 122 of the cover 120 is open. Optionally, portion 122 may comprise a low-k dielectric material. This may allow for substantially distortion-free transmission of OTA signals from the device under test 140 during testing.
作為任擇特徵,在圖1中所展示之組配中,基座結構110包含經組配以收納推動器130之豁口112。可提供豁口作為蓋120與受測裝置140之間的容積。任擇地,推動器130及豁口112之形狀可彼此對應,例如以便提供推動器130之緊湊且緊密的裝配。 As an optional feature, in the assembly shown in FIG. 1 , the base structure 110 includes a notch 112 configured to accommodate the pusher 130 . The notch can be provided as a volume between the lid 120 and the device under test 140 . Optionally, the shapes of the pusher 130 and the notch 112 can correspond to each other, for example, to provide a compact and tight fit for the pusher 130 .
任擇地,受測裝置插座100可包含推動器130。舉例而言,蓋120及推動器130可為二個單獨部分,如圖1中所展示。在此組配中,推動器130可在經由蓋120與推動器130之間的摩擦進行測試時保持在適當位置。可基於由使用互鎖區段115安裝蓋120及基座結構110所引起之張力而施加力。因此,任擇地,推動器130可以浮動方式機械地耦接至蓋120。 Optionally, the DUT socket 100 may include a pusher 130. For example, the cover 120 and pusher 130 may be two separate parts, as shown in FIG1 . In this arrangement, the pusher 130 can be held in place during testing by friction between the cover 120 and the pusher 130. The force applied may be based on the tension caused by the installation of the cover 120 and the base structure 110 using the interlocking section 115. Thus, the pusher 130 may optionally be mechanically coupled to the cover 120 in a floating manner.
與此一致地,作為任擇特徵,蓋120及推動器130可經組配為受測裝置插座100之獨立組件。因此,組裝受測裝置插座100可例如包含將推動器130手動地或自動地插入至基座結構之豁口112中。如之前所解釋,蓋120接著可使用旋轉移動附接或安裝或緊固至基座結構110。舉例而言,使用螺紋,當旋 轉時,蓋120與基座結構110之間的距離可減小,或替代地,蓋可經朝下推動且隨後旋轉以例如緊固互鎖齒,以使得在任何情況下,當蓋藉由該蓋之旋轉而緊固至基座結構110時,推動器130可藉由來自蓋120之力而移向或經推向或經壓向受測裝置凹穴170(例如凹入區域)。 In accordance therewith, as an optional feature, the cover 120 and the pusher 130 can be assembled as separate components of the DUT socket 100. Thus, assembling the DUT socket 100 can, for example, include manually or automatically inserting the pusher 130 into the recess 112 of the base structure. As previously explained, the cover 120 can then be attached, mounted, or secured to the base structure 110 using a rotational motion. For example, using threads, the distance between the cover 120 and the base structure 110 can be reduced when rotated, or alternatively, the cover can be pushed downward and then rotated to, for example, tighten interlocking teeth. In any case, when the cover is tightened to the base structure 110 by rotation of the cover, the pusher 130 can be moved toward, pushed toward, or pressed toward the device under test cavity 170 (e.g., a recessed area) by the force from the cover 120.
任擇地,舉例而言,蓋120及推動器130可經組配以例如經由螺釘或任何種類之接合(諸如膠)而固定地彼此附接。另外,蓋120與推動器130之間的互鎖機構亦為可能的。 Alternatively, for example, the cover 120 and the pusher 130 may be assembled so as to be fixedly attached to each other, for example, via screws or any type of fastening (such as glue). Furthermore, an interlocking mechanism between the cover 120 and the pusher 130 is also possible.
此外,任擇地,推動器130可包含低介電常數材料以便在測試時減少對受測裝置140之OTA信號的干擾。因此,作為一實例,推動器可包含具有小於或等於1.2之相對介電常數的材料或甚至由該材料製成。任擇地,推動器130可由硬質泡沫材料製成。作為另一任擇特徵,推動器之材料可包含大於80MPa之拉伸模數。具體言之,關於拉伸模數,作為任擇特徵,推動器130之材料的拉伸模數可小於蓋120之材料之拉伸模數的十分之一。 Furthermore, the actuator 130 may optionally comprise a low-dielectric constant material to reduce interference with the OTA signal of the device under test 140 during testing. Thus, as an example, the actuator may comprise, or even be made of, a material having a relative dielectric constant less than or equal to 1.2. Optionally, the actuator 130 may be made of a rigid foam material. As another optional feature, the material of the actuator may have a tensile modulus greater than 80 MPa. Specifically, with respect to the tensile modulus, as an optional feature, the tensile modulus of the material of the actuator 130 may be less than one-tenth of the tensile modulus of the material of the cover 120.
作為另一任擇特徵,在圖1中,推動器130之橫截面積在自受測裝置凹穴170朝向蓋120之方向上加寬,因此,可促進在豁口112中裝配及插入推動器。作為一實例,推動器130可具有倒階梯金字塔形及/或圓錐形之形狀。作為一實例,推動器130在蓋120附近之橫截面積可比推動器130在受測裝置凹穴170附近之橫截面積大至少二倍。任擇地,推動器可在蓋120附近包含圓形橫截面及/或在受測裝置凹穴170附近包含圓形橫截面。如圖1中所展示,推動器130之形狀可因此在受測裝置凹穴170附近經調適成受測裝置凹穴170之形狀。 As another optional feature, in FIG1 , the pusher 130 has a cross-sectional area that widens in a direction from the DUT cavity 170 toward the lid 120 , thereby facilitating assembly and insertion of the pusher into the notch 112 . As an example, the pusher 130 may have an inverted stepped pyramid shape and/or a conical shape. As an example, the cross-sectional area of the pusher 130 near the lid 120 may be at least twice as large as the cross-sectional area of the pusher 130 near the DUT cavity 170 . Alternatively, the pusher may have a circular cross-sectional area near the lid 120 and/or a circular cross-sectional area near the DUT cavity 170 . As shown in FIG1 , the shape of the pusher 130 can thus be adapted to the shape of the DUT cavity 170 in the vicinity of the DUT cavity 170 .
以下參考圖2,例如關於專利提案。圖2展示根據本發明之實施例的受測裝置插座之示意性3D渲染。受測裝置插座200包含蓋220及基座結構210。 Reference is made below to FIG. 2 , for example, regarding the patent proposal. FIG. 2 shows a schematic 3D rendering of a device under test socket according to an embodiment of the present invention. The device under test socket 200 includes a cover 220 and a base structure 210.
作為一實例,蓋220包含經由螺釘280附接至蓋220之主要區段226(例如支撐結構)的卡鉤224。應注意,卡鉤224及主要區段226亦可例如經由3D印刷、模製及/或鑄造製程由單件結構製成。如在圖1之上下文中所解釋,作為任擇特徵,蓋220包含開放區段,例如孔222。 As an example, the cover 220 includes a hook 224 attached to a main section 226 (e.g., a support structure) of the cover 220 via screws 280. It should be noted that the hook 224 and the main section 226 can also be made from a single piece, for example, via 3D printing, molding, and/or casting processes. As explained in the context of FIG. 1 , the cover 220 optionally includes an open section, such as a hole 222.
圖2以透明方式進一步展示推動器230及任擇保護器結構232,該保護器結構在推動器鄰近於蓋之區域中附接至推動器230。保護器結構232經配置於推動器230與蓋220之間。保護器結構232可緩衝自蓋220施加至推動器230之力及/或扭矩。此外,尤其在蓋220及推動器230為單獨部分之情況下,在蓋220安裝至基座結構210時,保護器結構232可例如由於自蓋220朝向推動器230之重複旋轉力而減少推動器230之磨損。 FIG2 further transparently illustrates the pusher 230 and an optional protector structure 232 attached to the pusher 230 in the area adjacent to the lid. The protector structure 232 is disposed between the pusher 230 and the lid 220. The protector structure 232 can buffer forces and/or torques applied to the pusher 230 from the lid 220. Furthermore, particularly when the lid 220 and the pusher 230 are separate parts, the protector structure 232 can reduce wear on the pusher 230, for example, due to repeated rotational forces from the lid 220 toward the pusher 230 when the lid 220 is mounted to the base structure 210.
如所展示,在圖2中,作為任擇特徵,保護器結構232可附接至推動器230之頂表面,該頂表面背對受測裝置凹穴270,並且保護器結構232經配置於推動器230之頂表面的外部區中,從而使推動器之頂表面的中心區自由。受測裝置凹穴270透過透明顯示之推動器230而在圖2中可見。 As shown in FIG. 2 , as an optional feature, a protector structure 232 can be attached to the top surface of the pusher 230, which faces away from the DUT cavity 270 . The protector structure 232 is disposed in an outer region of the top surface of the pusher 230 , thereby leaving the central region of the top surface of the pusher free. The DUT cavity 270 is visible in FIG. 2 through the transparently displayed pusher 230 .
根據卡鉤224,基座結構包含卡鉤214,從而一起形成受測裝置插座200之互鎖區段215。作為一實例,基座結構包含形成卡鉤214之第一層216以及第二層218,該等層使用螺釘280而彼此附接。此外,應注意,基座區段210可為例如模製或鑄造或印刷之一個單一部分,及/或層可以任何其他形式附接,諸如接合,例如使用膠。作為一實例,層218可包含用於卡鉤214之開口。然而,卡鉤224亦可為層218之部分。此外,卡鉤224可例如為單獨部分,其例如使用螺釘附接至層216、218中之任一者。 Based on the hook 224, the base structure includes the hook 214, thereby forming an interlocking section 215 of the device under test socket 200. As an example, the base structure includes a first layer 216 forming the hook 214 and a second layer 218, which are attached to each other using screws 280. It should also be noted that the base section 210 can be a single part, for example molded, cast, or printed, and/or the layers can be attached in any other way, such as by bonding, for example using glue. As an example, the layer 218 can include an opening for the hook 214. However, the hook 224 can also be part of the layer 218. In addition, the hook 224 can be, for example, a separate part that is attached to either layer 216, 218, for example using screws.
任擇地,保護器結構232之材料包含比推動器230之材料更高的機械穩定性,及/或保護器結構232之材料包含大於或等於2之相對介電常數。 Optionally, the material of the protector structure 232 comprises higher mechanical stability than the material of the actuator 230, and/or the material of the protector structure 232 comprises a relative dielectric constant greater than or equal to 2.
此外,如圖2中所展示,任擇地,配置於基座結構210處之卡鉤 214的各別第一部分214a可形成以便使卡鉤214之各別第二部分214b與基座結構之表面保持一間隔,並且配置於基座結構處之卡鉤的各別第二部分之各別內表面214B可經組配以允許各別卡鉤224與各別內表面嚙合。 Furthermore, as shown in FIG. 2 , optionally, the respective first portions 214a of the hooks 214 disposed on the base structure 210 may be formed so as to maintain a spacing between the respective second portions 214b of the hooks 214 and the surface of the base structure, and the respective inner surfaces 214B of the respective second portions of the hooks disposed on the base structure may be configured to allow the respective hooks 224 to engage with the respective inner surfaces.
反之亦然,作為任擇特徵,配置於蓋120處或在實例中更具體言之配置於支撐結構226處之卡鉤的各別第一部分224a經組配以使卡鉤224之各別第二部分224b與蓋或支撐結構的表面保持一間隔,並且卡鉤224之各別第二部分的各別內表面224B經組配以與配置於基座結構210處之各別卡鉤214的各別內表面214B嚙合。 Vice versa, as an optional feature, the respective first portions 224a of the hooks disposed on the cover 120, or more specifically, on the support structure 226 in this example, are configured so that the respective second portions 224b of the hooks 224 are spaced apart from the surface of the cover or support structure, and the respective inner surfaces 224B of the respective second portions of the hooks 224 are configured to engage with the respective inner surfaces 214B of the respective hooks 214 disposed on the base structure 210.
作為任擇特徵,卡鉤214、224可經組配以藉由摩擦或藉由可藉由蓋之手動旋轉(參見例如圖8)而解決的卡扣功能性來固定蓋220。 As an optional feature, the hooks 214, 224 can be configured to secure the cover 220 by friction or by a snap-fit functionality that can be resolved by manual rotation of the cover (see, for example, FIG. 8 ).
再次,參考圖2,應注意,舉例而言,本專利申請案提議例如在DUT手動地插入於插座上之工程階段中用於空中(OTA)ATE測試之手動插座,例如200。 Again, referring to FIG. 2 , it should be noted that, for example, this patent application proposes a manual socket, such as 200, for use in over-the-air (OTA) ATE testing during the engineering phase where the DUT is manually inserted into the socket.
對於OTA測試,插座之頂蓋(例如220)在一些情況下係關鍵的,此係因為其應允許且不干擾由DUT天線陣列產生之波束。 For OTA testing, the top cover of the socket (e.g., 220) is critical in some cases because it should allow and not interfere with the beam generated by the DUT antenna array.
亦希望,例如200之插座實現在工程中手動地測試大量DUT時容易地更換DUT。 It is also desirable to have, for example, 200 sockets to facilitate easy replacement of DUTs when manually testing a large number of DUTs in a project.
作為所提議之插座的實例,設計展示於圖2中且將在下文中更詳細地描述。根據一態樣,特性係例如220之蓋經設計以易於移除,且例如亦經設計以用於OTA測試之最佳效能。 As an example of a proposed socket, a design is shown in FIG2 and will be described in more detail below. According to one aspect, features such as the cover 220 are designed for easy removal and are also designed for optimal performance during OTA testing, for example.
為了較佳地理解實施例,參考專利提案企業之背景。 For a better understanding of the embodiments, please refer to the background of the patent proposal company.
OTA插座在一些情況下與平台無關,此意謂其可例如用於不同平台上。呈現於本專利申請案中之設計可用於客戶OTA測試站點。 In some cases, the OTA socket is platform-independent, meaning it can be used on different platforms, for example. The design presented in this patent application can be used at customer OTA test sites.
關於實施例,應注意,當前典型之工程插座選項具有OTA遠場測 試之缺點。 Regarding this embodiment, it should be noted that current typical engineering socket options have shortcomings in OTA remote field testing.
首先,參考圖3a)。圖3a)展示具有加壓螺釘之蛤殼蓋的圖像(www.ironwoodelectronics.com/products/lid-tool-socket-accessories)。 First, refer to Figure 3a). Figure 3a shows an image of a clamshell lid with press screws (www.ironwoodelectronics.com/products/lid-tool-socket-accessories).
用於非OTA應用之典型工程插座(例如圖3a)中所展示)具有易於打開之蓋以及例如用以將裝置推動至插座之電氣接點中的加壓螺釘。已發現,在OTA應用之情況下,蓋與加壓螺釘將在天線波束之路徑中。 A typical engineering socket for non-OTA applications, such as that shown in Figure 3a, has an easily opened cover and, for example, a press screw that pushes the device into the socket's electrical contacts. It has been found that in OTA applications, the cover and press screw will be in the antenna beam path.
其次,參考圖3b)。圖3b)展示槓桿/凸輪蓋插座之圖像(www.zaxeu.com/test-socket-based-elastomeric-matrix-connectors)。 Next, refer to Figure 3b). Figure 3b shows an image of a lever/cam socket (www.zaxeu.com/test-socket-based-elastomeric-matrix-connectors).
看起來很適合遠場OTA之一種類型的傳統插座係圖3b)中所展示之具有槓桿/凸輪蓋之插座,其中存在用於天線波束的DUT之頂部上方的開放區域。已發現,此種插座亦會產生大量問題,因為大量部分仍在波束通路上、大量部分係金屬的並且插座開口由於其與天線陣列之尺寸相同而在一些頻率下產生共振。 One type of conventional socket that appears well-suited for remote OTA is the one with a lever/cam cover, as shown in Figure 3b), where there is an open area above the top of the DUT for the antenna beam. However, this socket has been found to cause significant problems because a significant portion remains in the beam path, a significant portion is metal, and the socket opening resonates at some frequencies due to being the same size as the antenna array.
關於遠場OTA測試,參考圖4及圖5。圖4展示具有附接載板410之自動化測試裝備400的相片,其中遠場工程插座420安裝於載板410上。因此,圖4展示遠場工程設置。此外,自動化測試裝備400包含量測天線430。圖5展示遠場工程插座之相片。 For remote OTA testing, refer to Figures 4 and 5. Figure 4 shows a photograph of automated test equipment 400 with an attached carrier board 410, on which a remote engineering socket 420 is mounted. Thus, Figure 4 shows a remote engineering setup. Furthermore, automated test equipment 400 includes a measurement antenna 430. Figure 5 shows a photograph of the remote engineering socket.
圖4及圖5展示當前在使用中之簡單OTA遠場工程插座420。例如422之白色推動器材料由電磁透明材料(例如,HF71)製成。存在例如424之套環,其由PEEK(塑膠)製成以得到某一硬度。蓋藉由4個螺釘440固定。插座對於OTA遠場測試具有良好效能,但更換DUT較為繁瑣,此係因為其需要手動地移除及附接4個螺釘。 Figures 4 and 5 show a simple OTA remote engineering socket 420 currently in use. The white pusher material, such as 422, is made of an electromagnetically transparent material (e.g., HF71). There is a collar, such as 424, made of PEEK (plastic) to provide a certain degree of rigidity. The cover is secured by four screws 440. The socket provides good performance for OTA remote testing, but DUT replacement is cumbersome because it requires manual removal and attachment of four screws.
作為一實例,使用具有圖4中所展示之設置的本發明之受測裝置插座,可執行用於測試受測裝置之本發明方法。因此,DUT可插入於插座中並 且蓋可藉由旋轉該蓋而固定至基座結構,其中該蓋朝向基座結構之受測裝置部分推動推動器。任擇地,可執行受測裝置之空中測試,其中透過蓋之中心部分(其為開放的及/或其包含低介電常數材料)且透過推動器執行在受測裝置與測試天線(例如430)之間的無線傳輸。 As an example, the present method for testing a DUT can be performed using a DUT socket of the present invention having the configuration shown in FIG. Thus, a DUT can be inserted into the socket and a cover can be secured to a base structure by rotating the cover, wherein the cover pushes a pusher toward the DUT portion of the base structure. Optionally, over-the-air testing of the DUT can be performed, wherein wireless transmission between the DUT and a test antenna (e.g., 430) is performed through the center portion of the cover (which is open and/or includes a low-k dielectric constant material) and via the pusher.
接下來參考圖6及圖2,其關於根據實施例之所提議的ATE OTA滑動蓋插座設計。 Next, refer to Figure 6 and Figure 2, which are related to the proposed ATE OTA sliding cover socket design according to an embodiment.
圖6展示根據實施例之受測裝置插座之示意性分解視圖。圖6展示受測裝置插座600,該受測裝置插座包含基座結構610(作為任擇特徵,具有用於推動器630之豁口612)及蓋620(作為任擇特徵,具有開放中心部分622及支撐結構626),以及推動器630及保護器結構632,其可具有與圖1及/或圖2之各別元件相同或對應的特徵。 FIG6 shows a schematic exploded view of a DUT socket according to an embodiment. FIG6 shows a DUT socket 600, which includes a base structure 610 (optionally having a notch 612 for a pusher 630) and a cover 620 (optionally having an open center portion 622 and a support structure 626), as well as a pusher 630 and a protector structure 632, which may have features identical to or corresponding to those of the respective components of FIG1 and/or FIG2.
作為任擇特徵,蓋可包含PEEK或甚至由PEEK製成,例如具有<3.5之介電常數及/或>3500MPa之拉伸模數。各別卡鉤624及保護器結構632亦可包含PEEK或甚至由PEEK製成。 As an optional feature, the cover may comprise or even be made of PEEK, for example having a dielectric constant <3.5 and/or a tensile modulus >3500 MPa. The respective hooks 624 and protector structure 632 may also comprise or even be made of PEEK.
如之前所解釋,保護器結構可附接(例如安裝、膠合或旋擰)至推動器630,尤其在例如背對DUT且朝向蓋620之上表面上,以便配置於推動器630之上表面的邊緣及/或邊沿區中,從而使推動器之頂表面的中心區自由。 As previously explained, the protector structure can be attached (e.g., mounted, glued, or screwed) to the pusher 630, particularly on the upper surface facing away from the DUT and toward the cover 620, so as to be disposed at the edge and/or edge region of the upper surface of the pusher 630, thereby leaving the central region of the top surface of the pusher free.
此外,作為一實例,基座結構610包含第一層616及第二層618。作為一實例,層616可經組配以形成電氣插座617。形成基座結構610之卡鉤的卡鉤基座可為層616、618之部分或單獨元件。卡鉤基座可包含PEEK或甚至由PEEK製成。 Furthermore, as an example, the base structure 610 includes a first layer 616 and a second layer 618. As an example, the layers 616 can be assembled to form an electrical receptacle 617. The hook base forming the hook of the base structure 610 can be part of the layers 616, 618 or a separate component. The hook base can include or even be made of PEEK.
如圖6中所指示,推動器630可例如實施為Evonik HF71。任擇地,推動器之材料可具有或甚至應具有例如<1.2的介電常數及/或>80MPa之拉伸模數。 As indicated in FIG6 , the pusher 630 can be implemented as an Evonik HF71, for example. Optionally, the material of the pusher can or should even have, for example, a dielectric constant of <1.2 and/or a tensile modulus of >80 MPa.
如圖6中所展示,基座結構610可形成裝置凹穴670,DUT(例如DUT AiP 640(封裝中天線))可配置於該裝置凹穴中。 As shown in FIG6 , the base structure 610 may form a device cavity 670 in which a DUT (e.g., a DUT AiP 640 (antenna in package)) may be disposed.
舉例而言,例如200、600之插座設計不需要任何手動旋擰。僅旋轉例如220、620之蓋,此使得更換例如640之DUT極為容易。 For example, socket designs like the 200 and 600 don't require any manual twisting. Just twist the cover like the 220 and 620, making it extremely easy to replace a DUT like the 640.
舉例而言,任擇地,例如220、620之蓋設計有意地製作成使得低介電常數材料不僅覆蓋例如640之DUT,而且覆蓋DUT周圍的區域,從而避免產生具有與DUT天線陣列相同尺寸之空腔。 For example, optionally, the cover design, such as 220, 620, is intentionally made so that the low-k material covers not only the DUT, such as 640, but also the area surrounding the DUT, thereby avoiding the creation of a cavity with the same dimensions as the DUT antenna array.
舉例而言,任擇地,PEEK蓋及卡鉤(例如,214、224、624、619)提供機械硬度,但例如與DUT天線陣列保持得足夠遠以避免天線波束之帶內共振。 For example, optionally, a PEEK cover and hooks (e.g., 214, 224, 624, 619) provide mechanical rigidity, but are held sufficiently far away from the DUT antenna array to avoid in-band resonance of the antenna beam, for example.
舉例而言,使用製程係DUT(例如640)首先插入於電氣插座上(例如插入至凹穴270、670中),接著具有保護器(例如232、632)之推動器(例如230、630)以正確定向置於頂部上,且最後蓋(例如220、620)經插入及旋轉以得到DUT與電氣插座(例如120、610)之良好電氣接觸。 For example, the manufacturing process is that the DUT (e.g., 640) is first inserted into the electrical socket (e.g., into the cavity 270, 670), then the pusher (e.g., 230, 630) with the protector (e.g., 232, 632) is placed on top in the correct orientation, and finally the cover (e.g., 220, 620) is inserted and rotated to obtain good electrical contact between the DUT and the electrical socket (e.g., 120, 610).
接下來,關於插座蓋閉合製程之實例,參考圖8。圖8a)至圖8d)展示根據實施例之受測裝置插座之示意圖,其中蓋旋轉以便固定至基座結構。 Next, see Figure 8 for an example of a socket cover closing process. Figures 8a) to 8d) show schematic diagrams of a device under test socket according to an embodiment, in which the cover is rotated to be secured to the base structure.
圖8a)展示在第一情形下之受測裝置插座200,其中蓋220不附接至基座結構110。如圖8a)中所展示,保護器結構232及蓋220可能不在此位置對準。如圖8b)中所展示,隨後,可旋轉蓋220,以使得卡鉤224及214互鎖。圖8c)及圖8d)展示插座之互鎖狀態。另外,在互鎖狀態中,保護器結構232及蓋220可對準以使得蓋220中之開口與推動器230的未由保護器結構232覆蓋之表面對準。 FIG8 a shows the DUT socket 200 in a first position, with the cover 220 not attached to the base structure 110. As shown in FIG8 a , the protector structure 232 and the cover 220 may not be aligned in this position. As shown in FIG8 b , the cover 220 can then be rotated to interlock the latches 224 and 214. FIG8 c and FIG8 d show the socket in an interlocked state. Furthermore, in the interlocked state, the protector structure 232 and the cover 220 can be aligned so that the opening in the cover 220 is aligned with the surface of the pusher 230 not covered by the protector structure 232.
在下文中論述可能的OTA插座變化形式。因此,參考圖7。圖7展示根據實施例之推動器之示意圖。在圖7之實例中,推動器730之橫截面積在 自受測裝置凹穴朝向蓋之方向上加寬。 Possible OTA socket variations are discussed below. Therefore, reference is made to FIG. FIG. 7 shows a schematic diagram of a pusher according to an embodiment. In the example of FIG. 7 , the cross-sectional area of pusher 730 widens in the direction from the DUT cavity toward the cover.
一個可能的任擇插座變化形式係使推動器及蓋成為單件結構。在一些情況下,此需要具有額外部分之更複雜的機械設計。在一些情況下,此更複雜設計可影響DUT天線陣列之效能。例如另外藉由圖7在下文描述用於此插座之高級概念的實例。 One possible alternative socket variation is to make the actuator and cover a single-piece structure. In some cases, this requires a more complex mechanical design with additional parts. In some cases, this more complex design can affect the performance of the DUT antenna array. An example of a high-level concept for such a socket is described below, for example, with reference to Figure 7.
此外,舉例而言,若裝置係在DUT天線陣列與DUT封裝之間具有足夠裕度之正方形,則可任擇地使用圓形推動器,且在該情況下,蓋可為單件結構。 Furthermore, if, for example, the device is square with sufficient margin between the DUT antenna array and the DUT package, a circular pusher can alternatively be used, and in that case the cover can be a single-piece structure.
此外,舉例而言,若DUT係沖洗器(或經沖洗)或略高於插座凹穴,則即使裝置係矩形,亦可使用大型圓形推動器。在一些情況下,此插座凹穴對於處置器整合而言將為不可靠的。 Furthermore, for example, if the DUT is flush (or flushed) or slightly above the socket cavity, a large circular pusher can be used even if the device is rectangular. In some cases, this socket cavity will be unreliable for processor integration.
在下文中,參考圖9a)、圖9b)。圖9a)、圖9b)展示根據本發明之實施例的處於圖9a)之接觸狀態中以及處於圖9b)之自由狀態中的受測裝置插座之示意圖。 In the following, reference is made to FIG9a and FIG9b. FIG9a and FIG9b show schematic diagrams of a socket of a device under test in a contact state (FIG. 9a) and a free state (FIG. 9b) according to an embodiment of the present invention.
圖9a)、圖9b)展示具有帶有卡鉤914之基座結構910(作為任擇特徵,具有用於推動器930之豁口912)以及帶有卡鉤924及推動器930之蓋920的受測裝置插座。卡鉤914、924可形成互鎖區段915。因此,與在圖1、圖2、圖6、圖7及圖8之上下文中所論述之元件相對應的元件可具有相同或對應細節及/或功能性。 Figures 9a and 9b illustrate a device under test socket having a base structure 910 with a hook 914 (optionally having a notch 912 for a pusher 930) and a cover 920 with a hook 924 and pusher 930. Hooks 914 and 924 may form an interlocking section 915. Therefore, elements corresponding to those discussed in the context of Figures 1, 2, 6, 7, and 8 may have the same or corresponding details and/or functionality.
作為一實例,推動器930使用螺釘940而固定地附接至蓋920。螺釘940可包含PEEK或可任擇地由PEEK製成。換言之,額外螺釘940可經組配以捕獲推動器930。 As an example, pusher 930 is fixedly attached to cover 920 using screw 940. Screw 940 may include or optionally be made of PEEK. In other words, additional screw 940 may be configured to capture pusher 930.
圖9a)展示處於接觸狀態中之受測裝置插座,其中蓋920附接至基座910並且其中推動器930將受測裝置140推動至凹穴170中,以使得可提供與 接觸區域160之良好接觸以用於測試受測裝置。 FIG9 a shows the DUT socket in a contact state, wherein the cover 920 is attached to the base 910 and the pusher 930 pushes the DUT 140 into the recess 170 so that good contact with the contact area 160 can be provided for testing the DUT.
如圖9中所展示,任擇地,推動器930之形狀可在受測裝置凹穴附近經調適成受測裝置凹穴170之形狀。因此,推動器930可在蓋附接至基座結構時伸入受測裝置凹穴中。替代地,應注意,推動器930可經組配以在蓋920附接至基座結構910時不進入受測裝置凹穴。 As shown in FIG9 , the shape of pusher 930 can optionally be adapted to the shape of DUT cavity 170 near the DUT cavity. Thus, pusher 930 can extend into the DUT cavity when the lid is attached to the base structure. Alternatively, it should be noted that pusher 930 can be configured so as not to enter the DUT cavity when the lid 920 is attached to the base structure 910.
在如圖9a)中所展示之組配中,作為任擇特徵,推動器覆蓋受測裝置140及受測裝置周圍之區域。 In the assembly shown in FIG9 a), as an optional feature, the actuator covers the device under test 140 and the area surrounding the device under test.
圖9b)展示處於自由狀態中的受測裝置插座900,其中蓋920自基座結構910脫嚙。使用螺釘940,推動器930連同蓋920一起經提昇。作為一實例,蓋920具有用於推動器930之浮動功能的夾具,因為推動器裝配在插座之凹穴170上。 Figure 9b) shows the DUT socket 900 in a free state, with the cover 920 removed from the base structure 910. Using screws 940, the pusher 930 is lifted together with the cover 920. As an example, the cover 920 has a fixture for the floating function of the pusher 930, as the pusher is mounted on the socket's recess 170.
以下參考圖10、圖11及圖12,其展示模擬結果。該等圖展示根據本發明之實施例的圖10之在無插座的情況下、圖11之在具有簡單蓋插座的情況下以及圖12之在具有旋轉蓋插座的情況下遠場OTA測試之模擬結果。 Reference is made below to Figures 10, 11, and 12, which illustrate simulation results. These figures show simulation results of remote OTA testing according to an embodiment of the present invention, with no socket in Figure 10, with a simple-cover socket in Figure 11, and with a rotating-cover socket in Figure 12.
圖10a)展示在無插座之情況下在28GHz之頻率下載板1000上的受測裝置之遠場的示意圖。圖10c)展示遠場之示意圖,如圖10a)中以側視圖展示。圖10b)展示針對圖10a)中所展示之設置在不同頻率下以dBi為單位之主瓣幅度的示意圖。 Figure 10a) shows a schematic diagram of the far field of the device under test on the download board 1000 at a frequency of 28 GHz without a socket. Figure 10c) shows a schematic diagram of the far field, as shown in Figure 10a) in a side view. Figure 10b) shows a schematic diagram of the main lobe amplitude in dBi at different frequencies for the setup shown in Figure 10a).
圖11a)展示在28GHz之頻率下簡單蓋插座1100上的受測裝置之遠場的示意圖。圖11c)展示遠場之示意圖,如圖11a)中以側視圖展示。圖11b)展示針對圖11a)中所展示之設置在不同頻率下以dBi為單位之主瓣幅度的示意圖。 Figure 11a) shows a schematic diagram of the far field of the device under test on the simple cover socket 1100 at a frequency of 28 GHz. Figure 11c) shows a schematic diagram of the far field, as shown in Figure 11a) in a side view. Figure 11b) shows a schematic diagram of the main lobe amplitude in dBi at different frequencies for the setup shown in Figure 11a).
圖12a)展示在28GHz之頻率下旋轉蓋插座1200上的受測裝置之遠場的示意圖。圖12c)展示遠場之示意圖,如圖12a)中以側視圖展示。圖12b)展示針對圖12a)中所展示之設置在不同頻率下以dBi為單位之主瓣幅度的示意 圖。圖12d)展示圖12c)之放大版本。如圖12c)中所展示,根據實施例之旋轉蓋插座1200包含蓋1220及基座結構110。此外,展示了推動器1230以及保護器結構1232。 Figure 12a) shows a schematic diagram of the far field of a device under test on a rotating lid receptacle 1200 at a frequency of 28 GHz. Figure 12c) shows a schematic diagram of the far field, as shown in Figure 12a) in a side view. Figure 12b) shows a schematic diagram of the main lobe amplitude in dBi at different frequencies for the configuration shown in Figure 12a). Figure 12d) shows a zoomed-in version of Figure 12c). As shown in Figure 12c), the rotating lid receptacle 1200 according to an embodiment includes a lid 1220 and a base structure 110. Also shown are a pusher 1230 and a protector structure 1232.
如圖10、圖11及圖12中可見,始終存在對波束成形效能之影響,因為吾人使插座更為複雜,但如實例所展示,結果對於根據實施例之ATE測試而言仍然良好。 As can be seen in Figures 10, 11, and 12, there is always an impact on beamforming performance as we make the socket more complex, but as the examples demonstrate, the results remain good for ATE testing according to the embodiment.
換言之,根據實施例之例如圖12中所展示的受測裝置插座可提供可用性之間的良好折衷,例如關於容易的DUT更換以及對天線波束之干擾。 In other words, a device under test socket according to an embodiment, such as that shown in FIG. 12 , can provide a good compromise between usability, e.g., with respect to easy DUT replacement, and interference with the antenna beam.
此外,圖13a)至圖13c)展示根據實施例之受測裝置插座原型之示例性組裝製程的相片。 In addition, Figures 13a) to 13c) show photographs of an exemplary assembly process of a socket prototype of a device under test according to an embodiment.
圖13a)展示處於拆卸狀態中之受測裝置插座1300。作為任擇特徵,蓋1320包含複數個L形卡鉤1324。如圖13a)中所展示,作為任擇特徵,蓋1320可包含支撐結構1326及開放區段1322。此外,複數個卡鉤1324經配置於蓋1320處,或更精確言之在此情況下經配置於蓋之支撐結構1326處。 FIG13 a shows the device under test socket 1300 in a disassembled state. As an optional feature, the cover 1320 includes a plurality of L-shaped hooks 1324. As shown in FIG13 a , as an optional feature, the cover 1320 may include a support structure 1326 and an open section 1322. Furthermore, the plurality of hooks 1324 are disposed on the cover 1320, or more precisely, on the support structure 1326 of the cover in this case.
此外,作為任擇特徵,卡鉤經調適以與配置於基座結構1310(作為任擇特徵,具有用於推動器1330之豁口1312)處之各別配合卡鉤1314嚙合。 Additionally, as an optional feature, the hook is adapted to engage with a respective mating hook 1314 provided at the base structure 1310 (which, as an optional feature, has a notch 1312 for the pusher 1330).
作為任擇特徵,支撐結構1326可包含具有在2與3.5之間的相對介電常數之材料。此外,任擇地,支撐結構可由聚醚醚酮(PEEK)製成。 As an optional feature, the support structure 1326 may comprise a material having a relative dielectric constant between 2 and 3.5. Furthermore, the support structure may optionally be made of polyetheretherketone (PEEK).
如所展示,作為另一任擇特徵,支撐結構1326包含實質上矩形外周邊且在中心區域中包含具有圓形周邊之開口1322。 As shown, as another optional feature, the support structure 1326 includes a substantially rectangular outer perimeter and includes an opening 1322 having a circular perimeter in the central region.
此外,作為任擇特徵,基座結構1310包含形成受測裝置凹穴之凹入區域1370。在凹穴中,作為任擇特徵,DUT接觸區域1360經配置以用於向DUT提供電氣接觸以供測試。 Additionally, as an optional feature, the base structure 1310 includes a recessed area 1370 that forms a device under test cavity. In the cavity, as an optional feature, a DUT contact area 1360 is configured to provide electrical contact to the DUT for testing.
作為任擇特徵,保護器結構1332附接至推動器1330。在圖13a) 中以倒置位置展示推動器。推動器具有階梯金字塔形狀,以使得推動器1330之較小端部可在配置於凹部1370(例如DUT凹穴)中時將力施加至DUT。 As an optional feature, a protector structure 1332 is attached to a pusher 1330. In Figure 13a), the pusher is shown in an inverted position. The pusher has a stepped pyramid shape so that the smaller end of the pusher 1330 can apply force to the DUT when placed in a recess 1370 (e.g., a DUT cavity).
圖13b)展示第一組裝步驟之實例,其中推動器1330配置於基座結構1310上。如所展示,卡鉤1334(且因此處於閉合狀態中之卡鉤1324)在受測裝置插座之區域中配置於推動器1330旁邊。 FIG. 13 b ) shows an example of a first assembly step, in which the pusher 1330 is arranged on the base structure 1310 . As shown, the hook 1334 (and therefore the hook 1324 in the closed state) is arranged next to the pusher 1330 in the area of the socket of the device under test.
如圖13a)及圖13b)中所展示,推動器1330可經結構化成與基座結構1310之凹入區域相對應的不同部分,其可允許將推動器1330簡單地附接至基座結構1310上並使該推動器在該基座結構上居中(參見例如箭頭1390)。 As shown in FIG. 13 a) and FIG. 13 b), the pusher 1330 can be structured into different portions corresponding to recessed areas of the base structure 1310, which allows the pusher 1330 to be easily attached to the base structure 1310 and centered on the base structure (see, for example, arrow 1390).
在圖13c)中展示受測裝置插座1300之閉合及/或完全組裝狀態。如圖13a)、圖13b)、圖13c)中可見,作為任擇特徵,當在垂直於當蓋固定至基座時支撐結構所配置於的平面之投影上觀察時,或當在當該蓋固定至該基座時垂直於受測裝置平面之投影上觀察時,蓋1320任擇地包含包圍受測裝置位置1370之支撐結構1326。 FIG13c) shows the DUT socket 1300 in a closed and/or fully assembled state. As can be seen in FIG13a), FIG13b), and FIG13c), as an optional feature, the cover 1320 optionally includes a support structure 1326 that surrounds the DUT location 1370 when viewed in a projection perpendicular to the plane in which the support structure is disposed when the cover is secured to the base, or when viewed in a projection perpendicular to the plane of the DUT when the cover is secured to the base.
在本文中,不同發明性實施例及態樣例如在關於以下各者的部分中描述:「專利提案」、「所提議之ATE OTA滑動蓋插座設計」、「插座蓋閉合製程」、「可能的OTA插座變化形式」、「實例(實施例)」及「模擬結果(實例)」。此外,其他實施例將由所附申請專利範圍界定。 Various inventive embodiments and aspects are described herein, for example, in the sections relating to: "Patent Proposal," "Proposed ATE OTA Sliding Lid Socket Design," "Socket Lid Closing Process," "Possible OTA Socket Variations," "Examples (Examples)," and "Simulation Results (Examples)." Further embodiments are defined by the accompanying patent claims.
應注意,由申請專利範圍界定之任何實施例可任擇地由本文例如在上文所提及章節或在任何其他章節中所描述之任何細節(特徵及功能性及細節)補充。 It should be noted that any embodiment defined by the scope of the patent application may optionally be supplemented by any details (features and functionalities and details) described herein, for example, in the above-mentioned section or in any other section.
此外,描述於上文所提及章節及/或子章節中之實施例可個別地使用,且亦可任擇地由任何其他章節或子章節中之任何特徵或由包括於申請專利範圍中之任何特徵來補充。 In addition, the embodiments described in the above-mentioned sections and/or subsections may be used individually and may also be optionally supplemented by any features in any other sections or subsections or by any features included in the scope of the patent application.
此外,應注意,本文中所描述之個別態樣可個別地或組合地使用。 因此,細節可添加至該等個別態樣中之各者,而不將細節添加至該等態樣中之另一者。 Furthermore, it should be noted that the individual aspects described herein can be used individually or in combination. Thus, details may be added to each of these individual aspects without also adding details to another of these aspects.
亦應注意,本揭露內容明確地或隱含地描述可用於自動化測試裝備或自動化測試系統中之特徵。因此,本文中所描述之任何特徵可用於自動化測試裝備或自動化測試系統之上下文中。 It should also be noted that this disclosure explicitly or implicitly describes features that can be used in automated test equipment or automated test systems. Therefore, any feature described herein can be used in the context of automated test equipment or automated test systems.
此外,本文中所揭露之與方法相關之特徵及功能性亦可用於設備(經組配以執行此類功能性)中。此外,本文中關於設備所揭露之任何特徵及功能性亦可用於對應方法中。換言之,本文中所揭露之方法可任擇地藉由關於設備所描述的特徵及功能性中之任一者加以補充。 Furthermore, the features and functionality disclosed herein in relation to the methods may also be employed in apparatuses configured to perform such functionality. Furthermore, any features and functionality disclosed herein with respect to the apparatus may also be employed in the corresponding methods. In other words, the methods disclosed herein may optionally be supplemented by any of the features and functionality described with respect to the apparatuses.
儘管已在設備之上下文中描述了一些態樣,但顯然,此等態樣亦表示對應方法的描述,其中區塊或裝置對應於方法步驟或方法步驟之特徵。類似地,方法步驟之上下文中所描述的態樣亦表示對應設備之對應區塊或項目或特徵的描述。 Although some aspects have been described in the context of an apparatus, it is apparent that these aspects also represent a description of the corresponding method, where a block or device corresponds to a method step or a feature of a method step. Similarly, aspects described in the context of a method step also represent a description of the corresponding block, item, or feature of the corresponding apparatus.
取決於某些實施要求,本發明之實施例可在硬體或軟體中實施。可使用數位儲存媒體(例如軟碟、DVD、CD、ROM、PROM、EPROM、EEPROM或快閃記憶體)來執行實施,該數位儲存媒體上儲存有與可編程電腦系統協作(或能夠與之協作)以使得執行各別方法之電子可讀控制信號。 Depending on certain implementation requirements, embodiments of the present invention can be implemented in hardware or software. Implementation can be performed using a digital storage medium (e.g., a floppy disk, DVD, CD, ROM, PROM, EPROM, EEPROM, or flash memory) having stored thereon electronically readable control signals that cooperate (or are capable of cooperating) with a programmable computer system to cause the execution of the respective method.
根據本發明之一些實施例包含具有電子可讀控制信號之資料載體,該等電子可讀控制信號能夠與可編程電腦系統協作以使得執行本文中所描述的方法中之一者。 Some embodiments according to the invention comprise a data carrier having electronically readable control signals capable of cooperating with a programmable computer system, such that one of the methods described herein is performed.
一般而言,本發明之實施例可實施為具有程式碼之電腦程式產品,當電腦程式產品在電腦上運行時,該程式碼為操作性的以用於執行方法中的一者。程式碼可例如儲存於機器可讀載體上。 Generally speaking, embodiments of the present invention may be implemented as a computer program product having program code, which, when the computer program product is run on a computer, is operable to perform one of the methods. The program code may, for example, be stored on a machine-readable carrier.
其他實施例包含儲存於機器可讀載體上的用於執行本文中所描述 之方法中之一者的電腦程式。 Other embodiments comprise the computer program for performing one of the methods described herein, stored on a machine-readable carrier.
換言之,因此,本發明方法之實施例係具有當電腦程式在電腦上運行時用於執行本文中所描述的方法中之一者的程式碼之電腦程式。 In other words, an embodiment of the method according to the invention is, therefore, a computer program having a program code for performing one of the methods described herein, when the computer program runs on a computer.
因此,本發明方法之另一實施例係包含記錄於其上的用於執行本文中所描述的方法中之一者的電腦程式之資料載體(或數位儲存媒體,或電腦可讀媒體)。 Therefore, another embodiment of the present method is a data carrier (or a digital storage medium, or a computer-readable medium) comprising recorded thereon the computer program for performing one of the methods described herein.
因此,本發明方法之另一實施例係表示用於執行本文中所描述的方法中之一者的電腦程式之資料流或信號序列。資料流或信號序列可例如經組配以經由資料通訊連接,例如經由網際網路而傳輸。 Therefore, a further embodiment of the method according to the invention is a data stream or a signal sequence representing a computer program for performing one of the methods described herein. The data stream or the signal sequence can, for example, be configured to be transmitted via a data communication connection, for example via the Internet.
另一實施例包含經組配或經調適以執行本文中所描述之方法中之一者的處理構件,例如電腦或可編程邏輯裝置。 Another embodiment comprises a processing means, for example a computer or a programmable logic device, configured or adapted to perform one of the methods described herein.
另一實施例包含電腦,其上安裝有用於執行本文中所描述之方法中之一者之電腦程式。 Another embodiment comprises a computer on which is installed the computer program for performing one of the methods described herein.
在一些實施例中,可編程邏輯裝置(例如現場可編程閘陣列)可用以執行本文中所描述之方法的功能性中之一些或全部。在一些實施例中,現場可編程閘陣列可與微處理器協作,以便執行本文中所描述之方法中之一者。一般而言,該等方法較佳地由任何硬體設備執行。 In some embodiments, a programmable logic device (e.g., a field programmable gate array) may be used to perform some or all of the functionality of the methods described herein. In some embodiments, a field programmable gate array may cooperate with a microprocessor to perform one of the methods described herein. In general, the methods are preferably performed by any hardware device.
上文所描述之實施例僅繪示本發明之原理。應理解,對本文中所描述之配置及細節的修改及變化對於熟習此項技術者將為顯而易見的。因此,其僅意欲由接下來之請求項之範疇限制,而非由藉由本文中實施例之描述及解釋所呈現的具體細節限制。 The embodiments described above are merely illustrative of the principles of the present invention. It should be understood that modifications and variations of the configurations and details described herein will be apparent to those skilled in the art. Therefore, it is intended that the present invention be limited only by the scope of the claims that follow, rather than by the specific details presented through the description and explanation of the embodiments herein.
100:受測裝置插座 100: Device under test socket
110:基座結構 110: Base structure
112:豁口 112: Gap
115:互鎖區段 115: Interlocking Section
120:蓋 120: Cover
122:中心部分,中心區域 122: Central part, central area
130:推動器 130:Thruster
140:受測裝置 140: Device under test
150:表面 150: Surface
160:凹入接觸區域 160: Recessed contact area
170:受測裝置凹穴 170: Test device cavity
Claims (32)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP23156893 | 2023-02-15 | ||
| EP23156893.2 | 2023-02-15 | ||
| EP23157424 | 2023-02-17 | ||
| EP23157424.5 | 2023-02-17 | ||
| WOPCT/EP2023/070381 | 2023-07-21 | ||
| PCT/EP2023/070381 WO2024170107A1 (en) | 2023-02-15 | 2023-07-21 | Device under test socket and method for testing a device under test |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202434890A TW202434890A (en) | 2024-09-01 |
| TWI898372B true TWI898372B (en) | 2025-09-21 |
Family
ID=87429421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112151098A TWI898372B (en) | 2023-02-15 | 2023-12-27 | Device under test socket and method for testing a device under test |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20250130401A (en) |
| CN (1) | CN120693529A (en) |
| TW (1) | TWI898372B (en) |
| WO (1) | WO2024170107A1 (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040178815A1 (en) * | 2003-03-12 | 2004-09-16 | Chun-Na Ou | Tester for printed circuit boards |
| US7108535B1 (en) * | 2005-07-12 | 2006-09-19 | Spansion, Llc | Integrated circuit test socket |
| US20080265918A1 (en) * | 2007-04-24 | 2008-10-30 | Protos Electronics, Inc. | Object-clamping lid subassembly of a test socket for testing electrical characteristics of an object |
| US20090258512A1 (en) * | 2006-08-02 | 2009-10-15 | Toshio Ohta | Ic socket |
| US20100062623A1 (en) * | 2008-09-08 | 2010-03-11 | Hon Hai Precision Industry Co., Ltd. | Ic socket with floatable pressing device for receiving testing ic packages of different sizes |
| TW201920974A (en) * | 2017-09-25 | 2019-06-01 | 南韓商Isc股份有限公司 | Test socket |
| US20190349096A1 (en) * | 2018-05-11 | 2019-11-14 | Teradyne, Inc. | Handler change kit for a test system |
| TW202014719A (en) * | 2018-10-10 | 2020-04-16 | 黃東源 | Socket device for testing IC |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5838161A (en) * | 1996-05-01 | 1998-11-17 | Micron Technology, Inc. | Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect |
| JP2015094741A (en) * | 2013-11-14 | 2015-05-18 | パナソニックIpマネジメント株式会社 | Module socket |
| WO2015094177A1 (en) * | 2013-12-17 | 2015-06-25 | Waveconnex Inc. | Waveguides for capturing close-proximity electromagnetic radiation transmitted by wireless chips during testing on automated test equipment (ate) |
-
2023
- 2023-07-21 CN CN202380094189.2A patent/CN120693529A/en active Pending
- 2023-07-21 WO PCT/EP2023/070381 patent/WO2024170107A1/en not_active Ceased
- 2023-07-21 KR KR1020257026075A patent/KR20250130401A/en active Pending
- 2023-12-27 TW TW112151098A patent/TWI898372B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040178815A1 (en) * | 2003-03-12 | 2004-09-16 | Chun-Na Ou | Tester for printed circuit boards |
| US7108535B1 (en) * | 2005-07-12 | 2006-09-19 | Spansion, Llc | Integrated circuit test socket |
| US20090258512A1 (en) * | 2006-08-02 | 2009-10-15 | Toshio Ohta | Ic socket |
| US20080265918A1 (en) * | 2007-04-24 | 2008-10-30 | Protos Electronics, Inc. | Object-clamping lid subassembly of a test socket for testing electrical characteristics of an object |
| US20100062623A1 (en) * | 2008-09-08 | 2010-03-11 | Hon Hai Precision Industry Co., Ltd. | Ic socket with floatable pressing device for receiving testing ic packages of different sizes |
| TW201920974A (en) * | 2017-09-25 | 2019-06-01 | 南韓商Isc股份有限公司 | Test socket |
| US20190349096A1 (en) * | 2018-05-11 | 2019-11-14 | Teradyne, Inc. | Handler change kit for a test system |
| TW202014719A (en) * | 2018-10-10 | 2020-04-16 | 黃東源 | Socket device for testing IC |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202434890A (en) | 2024-09-01 |
| CN120693529A (en) | 2025-09-23 |
| WO2024170107A1 (en) | 2024-08-22 |
| KR20250130401A (en) | 2025-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111417857B (en) | Socket device for semiconductor device test | |
| US7833021B2 (en) | Burn-in socket with adapter for loading IC package | |
| JP4757917B2 (en) | Integrated circuit test socket | |
| JP2018503818A (en) | Inspection device | |
| CN100545666C (en) | Probe device capable of corresponding to various testers | |
| TWI898372B (en) | Device under test socket and method for testing a device under test | |
| KR20030022736A (en) | Burn-in test socket | |
| JPH11237434A (en) | Semiconductor element test carrier, semiconductor element test method, and semiconductor element test apparatus | |
| KR20050057576A (en) | Cam-ring system for electrical inter-connection between dut board and a test head | |
| CN112514176A (en) | IC socket for semiconductor | |
| US7301326B1 (en) | Modular interface | |
| CN1985554A (en) | IC socket | |
| US7021954B2 (en) | Test connector with metallic stiffener | |
| CN118613777A (en) | Port replicator | |
| US7575460B2 (en) | IC socket | |
| US6500019B1 (en) | Electrical socket | |
| JP6400485B2 (en) | Socket for electrical parts | |
| US7607931B2 (en) | Test socket adjustable to solid state image pickup devices of different sizes | |
| JP2008076331A (en) | Inspection device | |
| KR101345816B1 (en) | The socket for test of semiconductor package | |
| US6839948B2 (en) | Tooling plate adapted to facilitate rapid and precise attachment into a probing station | |
| JP4941169B2 (en) | Probe card mechanism | |
| KR20090056754A (en) | Electronic Component Alignment Mechanism | |
| US7385408B1 (en) | Apparatus and method for testing integrated circuit devices having contacts on multiple surfaces | |
| WO2005026754A1 (en) | Semiconductor test system |