TWI898371B - Electronic equipment using immersion liquid cooling style and its electronic module - Google Patents

Abstract

An electronic equipment using immersion liquid cooling style includes a casing, a fan device and an electronic module. The electronic module includes a container, a cover plate, a heat-dissipation unit, a first heat-generating source module and a second heat-generating source module. The container is located within the casing and formed with an immersion recess that is filled with non-conductive coolant. The cover plate hermetically covers the immersion recess, and is formed with a conductive portion penetrated through the cover plate. The heat-dissipation unit is connected to the external side of the container. The first heat-generating source module is fixed in the immersion recess, immersed in the cooling liquid, electrically connected to the conductive portion, and thermally connected to the heat-dissipation unit through the container. The second heat-generating source module is located outside the immersion recess and electrically connected to the first heat-generating source module through the conductive portion. The fan device is located in the casing and used to deliver airflow toward the heat-dissipation unit and take away the heat energy from the heat-dissipation unit.

Description

Electronic equipment and electronic modules using immersion liquid cooling mode

The present invention relates to an electronic device, and more particularly to an electronic device and an electronic module thereof that adopts an immersion liquid cooling mode.

Immersion cooling technology involves immersing the entire structure containing heat-generating components (such as motherboards, disk arrays, etc.) in a non-conductive coolant, allowing the coolant to remove the heat generated by the operation of the heat-generating components.

However, installing a cooling water tank within the chassis to accommodate all of the above components would require significant space and incur costs for consumables such as coolant. Therefore, achieving a desired balance between heat dissipation performance and equipment investment costs using immersion cooling technology has long been a challenge for the industry.

It can be seen from this that the above-mentioned technologies still have inconveniences and defects, which are problems that the industry urgently needs to solve.

One purpose of the present invention is to provide an electronic device and electronic module thereof that utilizes immersion liquid cooling to resolve the difficulties mentioned above in the prior art.

One embodiment of the present invention provides an electronic device that adopts an immersion liquid cooling mode. The electronic device includes a casing, a power supply, a fan device and an electronic module. The casing has an internal space. The power supply is located in the internal space. The electronic module includes a container unit, a cover, a heat sink, a first heat source module and a second heat source module. The container unit includes a container body and an immersion tank. The container body is located in the internal space, the immersion tank is formed on one side of the container body, and is filled with non-conductive cooling liquid. The cover includes a cover and an electrically conductive portion. The cover tightly covers the container body and the immersion tank, and the electrically conductive portion is provided on the cover. The heat sink is connected to the outside of the container body. The first heat source module is fixed within the immersion tank and at least partially immersed in the coolant. It is electrically connected to the electrical conductor and thermally connected to the heat sink through the container body. The second heat source module is located outside the immersion tank and electrically connected to the power supply. It is also electrically connected to the first heat source module through the electrical conductor. A fan assembly is located within the internal space and electrically connected to the power supply to transport air toward the heat sink and remove heat from the heat sink.

According to one or more embodiments of the present invention, in the aforementioned electronic device, the cover is located between the first heat source module and the second heat source module.

According to one or more embodiments of the present invention, in the aforementioned electronic device, the heat sink is integrally formed on a surface of the container body that faces away from the lid.

According to one or more embodiments of the present invention, in the aforementioned electronic device, the electronic module further includes at least one heat sink fin located on the cover.

According to one or more embodiments of the present invention, in the aforementioned electronic device, the heat sink fin is fixedly disposed on a surface of the cover facing away from the immersion tank and extends in a direction away from the immersion tank.

According to one or more embodiments of the present invention, in the aforementioned electronic device, a heat sink fin is fixedly disposed on a surface of the cover facing the immersion tank and extends into the immersion tank.

According to one or more embodiments of the present invention, in the aforementioned electronic device, the cover further includes a first electrical connection portion and a second electrical connection portion. The first electrical connection portion and the second electrical connection portion are respectively located on opposite surfaces of the cover and are respectively connected to the electrical conductive portion. The first electrical connection portion is electrically connected to the first heat source module, and the second electrical connection portion is electrically connected to the second heat source module. The first electrical connection portion is staggered with the heat sink fins, wherein the heat sink fins are located on the long sides of the cover.

According to one or more embodiments of the present invention, in the aforementioned electronic device, the container body further includes an outlet and an inlet. The outlet and inlet are formed on the sidewall of the container body and are respectively connected to the immersion tank, wherein the outlet is located between the inlet and the cover.

According to one or more embodiments of the present invention, the aforementioned electronic device further includes a liquid cooling exchanger. The liquid cooling exchanger is connected to the immersion tank via an outlet and an inlet to receive and deliver cooling liquid within the immersion tank.

According to one or more embodiments of the present invention, in the aforementioned electronic device, the housing further comprises a partition plate, a first tube, and a second tube. The partition plate is fixed within the internal space, dividing the internal space into a stacked upper and lower regions. A liquid cooling exchanger is fixed within the lower region, and the electronic module is fixed within the upper region. The first tube is connected to the inlet and the liquid cooling exchanger, respectively, and the second tube is connected to the outlet and the liquid cooling exchanger, respectively.

One embodiment of the present invention provides an electronic module. The electronic module includes a container unit, a cover, a heat sink, a first heat source module, and a second heat source module. The container unit includes a container body and an immersion tank. The immersion tank is formed on one side of the container body and is used to hold a non-conductive coolant. The cover includes a lid and an electrical conductive portion. The lid hermetically covers the container body and the immersion tank, and the electrical conductive portion is disposed on the lid. The heat sink is connected to the exterior of the container body. The first heat source module is fixed in the immersion tank, at least partially immersed in the coolant, electrically connected to the electrical conductive portion, and thermally connected to the heat sink through the container body. The second heat source module is located outside the immersion tank and is electrically connected to the first heat source module through the electrical conductive portion.

According to one or more embodiments of the present invention, in the aforementioned electronic module, the cover is located between the first heat source module and the second heat source module.

According to one or more embodiments of the present invention, in the aforementioned electronic module, the heat sink is integrally formed on a surface of the container body that faces away from the lid.

According to one or more embodiments of the present invention, in the aforementioned electronic module, the electronic module further includes at least one heat sink fin, which is located on the cover.

According to one or more embodiments of the present invention, in the aforementioned electronic module, the heat sink fin is fixedly disposed on a surface of the cover facing away from the immersion tank and extends in a direction away from the immersion tank.

According to one or more embodiments of the present invention, in the aforementioned electronic module, a heat sink fin is fixedly disposed on a surface of the cover facing the immersion tank and extends into the immersion tank.

According to one or more embodiments of the present invention, in the aforementioned electronic module, the cover further includes a first electrical connection portion and a second electrical connection portion. The first electrical connection portion and the second electrical connection portion are located on opposite sides of the cover and are respectively connected to the electrical conductive portion. The first electrical connection portion is electrically connected to the first heat source module, and the second electrical connection portion is electrically connected to the second heat source module. The first electrical connection portion is staggered with the heat sink fins, which are located on the long sides of the cover.

According to one or more embodiments of the present invention, in the aforementioned electronic module, the container body further includes an outlet and an inlet. The outlet and inlet are formed on the sidewall of the container body and are respectively connected to the immersion tank, wherein the outlet is located between the inlet and the cover.

Through the above architecture, the electronic equipment and its electronic modules utilizing immersion liquid cooling in this case can reduce the volume of container units and the cost of consumables such as coolant, thereby achieving maximum heat dissipation efficiency at a reasonable equipment investment cost.

The above description is merely intended to illustrate the problems that the present invention aims to solve, the technical means used to solve them, and the resulting effects. The specific details of the present invention will be described in detail in the following embodiments and related figures.

10, 11, 12: Electronic equipment

100: Chassis

110: Interior Space

120: Air Inlet

130: Air outlet

140: Divider

150: Upper Level Area

160: Lower Level

170: First tube

180: Second tube

200: Power supply

300: Fan device

400: Liquid cooling exchanger

500, 501, 502, 503, 504: Electronic modules

510:Container unit

511: Container body

511T: Top

511B: Bottom

512: Immersion Tank

513: Export Department

514: Entrance Department

520: Cover plate

521,525: Cover

521A: Page 1

521B: Side 2

522: Long side

523,524: Electrical connection

530: First electrical connection portion

540: Second electrical connection portion

550,560: Heatsink fins

551: First heat sink fin

561: Second heat sink fin

570: Radiator

571: Base

572: Fin body

573: Channel

580: First heat source module

590: Second heat source module

AA,BB: Line segment

C: Coolant

G: Spacing area

R1, R2: Airflow

W: Wire

X, Y, Z: Axes

To make the above and other objects, features, advantages, and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows: Figure 1 is a side view of an electronic module according to one embodiment of the present invention.

Figure 2 is a side view of the electronic module in Figure 1.

Figure 3 is a side view of an electronic module according to an embodiment of the present invention.

Figure 4 is a side view of an electronic module according to an embodiment of the present invention.

Figure 5 is a top view of an electronic module according to one embodiment of the present invention.

Figure 6A is a cross-sectional view taken along line AA in Figure 5.

Figure 6B is a cross-sectional view taken along line BB in Figure 5.

Figure 7 is a side view of an electronic device according to an embodiment of the present invention.

Figure 8 is a side view of an electronic device according to an embodiment of the present invention.

Figure 9 is a side view of an electronic device according to an embodiment of the present invention.

Several embodiments of the present invention are disclosed below with reference to the accompanying drawings. For the sake of clarity, numerous practical details are included in the following description. However, it should be understood that these practical details are not intended to limit the present invention. In other words, these practical details are not essential to an embodiment of the present invention. Furthermore, to simplify the drawings, some commonly used structures and components are depicted in a simplified schematic manner.

FIG1 is a side view of an electronic module 500 according to an embodiment of the present invention. FIG2 is a side view of the electronic module 500 of FIG1. In this embodiment, as shown in FIG1 and FIG2, an electronic module 500 adopting an immersion liquid cooling mode includes a container unit 510, a cover plate 520, a heat sink 570, a first heat source module 580, and a second heat source module 590. The container unit 510 includes a container body 511 and an immersion tank 512. The immersion tank 512 is formed on one surface of the container body 511 and contains a non-conductive coolant C. In this embodiment, the coolant C is filled or almost filled in the immersion tank 512. The cover plate 520 includes a cover 521 and multiple conductive portions 523. The cover 521 tightly covers the container body 511 and the immersion tank 512. The conductive portions 523 are spaced apart on the cover 521, and each conductive portion 523 extends through the cover 521. The cover 521 includes a first surface 521A and a second surface 521B that face each other. The two ends of each conductive portion 523 are connected to the first surface 521A and the second surface 521B of the cover 521, respectively. The heat sink 570 is connected to the outside of the container body 511. The first heat source module 580 is fixed in the immersion tank 512 and immersed in the coolant C. The first heat source module 580 is electrically connected to these electrical conductive portions 523 and is thermally connected to the heat sink 570 through the container body 511. The second heat source module 590 is located outside the immersion tank 512 and is electrically connected to the first heat source module 580 located within the immersion tank 512 through these electrical conductive portions 523 of the lid 521.

Thus, when the first heat source module 580 is operating, the heat energy of the first heat source module 580 is evenly distributed in the coolant C, and then transferred from the container body 511 to the radiator 570, and then diffused into the air in the radiator 570, thereby achieving the purpose of heat dissipation and cooling.

More specifically, in this embodiment, the power (i.e., the heat generation level) of the first heat source module 580 is greater than the power (i.e., the heat generation level) of the second heat source module 590. For example, the first heat source module 580 is a power switching module (such as a metal oxide semiconductor field effect transistor, MOSFET), and the second heat source module 590 is a passive component such as a capacitor or inductor. However, the present invention is not limited to this.

In this embodiment, the combination of the lid 521 and the container body 511 allows the immersion tank 512 to be a closed tank, meaning that the immersion tank 512 is not connected to the outside world. However, the present invention is not limited to this. For example, the container body 511 is rectangular, and the lid 521 is located on the side of the container body 511 (hereinafter referred to as the top surface 511T) where the immersion tank 512 is located. The first surface 521A of the lid 521 directly covers and contacts the top surface 511T of the container body 511.

In this embodiment, the cover 521 is positioned between the first heat source module 580 and the second heat source module 590. For example, the cover 521 is flat and is directly fixed between the first heat source module 580 and the second heat source module 590. In other words, the first heat source module 580 is secured to the cover 520 and directly sandwiched between the cover 521 and the inner wall of the immersion tank 512, thereby rapidly transferring heat energy to the heat sink 570. The second heat source module 590 is secured to the cover 520 and supported by the cover 520, thereby smoothly exchanging signals with the first heat source module 580. However, the present invention is not limited to this. The first heat source module 580 is located within the immersion tank 512 and directly contacts the cover 521 and the inner wall of the immersion tank 512.

Furthermore, the cover 520 is a circuit board comprising a plurality of first electrical connectors 530 and second electrical connectors 540. The first electrical connectors 530 and second electrical connectors 540 are located on opposite sides of the cover 521 and are connected to the electrical conductive portions 523, such as vias. The first electrical connectors 530 directly contact the first heat source module 580, while the second electrical connectors 540 directly contact the second heat source module 590. However, the present invention is not limited to this. In other embodiments, the cover 520 may also be an adapter board or a combination of a circuit board and adapter board.

In this embodiment, the heat sink 570 is located on the side of the container body 511 facing away from the lid 521 (hereinafter referred to as the bottom surface 511B). The heat sink 570 is integrally formed on the bottom surface 511B of the container body 511. For example, the heat sink 570 is a fin assembly. The fin assembly can be used with various heat sinks (such as extruded aluminum or cut aluminum). However, the present invention is not limited to this. In other embodiments, the heat sink 570 can be a heat pipe or a tower.

Figure 3 is a side view of an electronic module 501 according to an embodiment of the present invention. The electronic module 501 of this embodiment is substantially similar to the electronic module 500 of the aforementioned embodiment. The difference is that, as shown in Figure 3, the electronic module 501 further includes at least one heat sink fin 550. Heat sink fin 550 is fabricated on the cover 520 and located outside the immersion tank 512. More specifically, in this embodiment, heat sink fin 550 is fixedly mounted on a surface of the cover 525 facing away from the immersion tank 512 (e.g., the second surface 521B) and extends away from the immersion tank 512 (e.g., along the Z axis). It is used to accelerate and remove some of the heat energy from the first heat source module 580 and the second heat source module 590.

Furthermore, compared to the circuit board cover 520 in Figure 1, the cover 520 in this embodiment is an adapter board. The cover 525 is, for example, a rigid substrate (e.g., metal or plastic), and the electrically conductive portion 524 is, for example, a metal post that passes through two opposing surfaces of the rigid substrate (e.g., first surface 521A and second surface 521B). The ends of the metal post are exposed outside the rigid substrate and electrically connect to the first heat source module 580 and the second heat source module 590, respectively. In other words, unlike a circuit board, the surface of the adapter board lacks layout traces, the first electrical connection portion 530, and the second electrical connection portion 540.

However, the present invention is not limited thereto. In other embodiments, the cover plate 520 may also be a combination of a rigid substrate and a circuit board, for example, a circuit board integrated onto a rigid substrate.

Figure 4 is a side view of an electronic module 502 according to an embodiment of the present invention. As shown in Figure 4, electronic module 502 of this embodiment is substantially identical to electronic module 500 of Figure 3 above, differing in that heat sink fins 560 are located within immersion tank 512. Specifically, in this embodiment, heat sink fins 560 are fixedly mounted on a surface of cover 521 facing immersion tank 512 (e.g., first surface 521A) and extend into immersion tank 512 to accelerate the removal of some of the heat energy from second heat source module 590.

Furthermore, in this embodiment, a spacer G is defined between the first heat source module 580 and the cover 521. Within this spacer G, heat sink fins 560 extend from the cover 521 toward the first heat source module 580, accelerating the removal of some of the heat energy from the first and second heat source modules 580 and 590. The cover 520 in this embodiment is a circuit board, which is electrically connected to the first heat source module 580 via wires W.

Figure 5 is a top view of an electronic module 503 according to an embodiment of the present invention. Figure 6A is a cross-sectional view taken along line AA in Figure 5. Figure 6B is a cross-sectional view taken along line BB in Figure 5. The electronic module 503 of this embodiment is substantially the same as the electronic module 501 of the aforementioned embodiment, differing in that, as shown in Figures 5 to 6B, the heat sink fins comprise a plurality of first heat sink fins 551 and a plurality of second heat sink fins 561. The first heat sink fins 551 and the second heat sink fins 561 are respectively fixedly disposed on two opposing surfaces of the cover 521 (e.g., the first surface 521A and the second surface 521B). More specifically, the first heat sink fin 551 is located on the side of the cover 521 facing the immersion tank 512 (e.g., the first side 521A) and is staggered with the first electrical connection portion 530. The second heat sink fin 561 is located on the side of the cover 521 facing away from the immersion tank 512 (e.g., the second side 521B) and is staggered with the second electrical connection portion 540. The first heat sink fin 551 and the second heat sink fin 561 are located on the long sides of the cover 521, respectively.

More specifically, for example, the first electrical connection portion 530 is located between two long sides 522 of the first surface 521A of the cover 521, and the first heat sink fin 551 is located adjacent to one of the long sides 522 of the first surface 521A of the cover 521. The second electrical connection portion 540 is located between two long sides 522 of the second surface 521B of the cover 521, and the second heat sink fin 561 is located adjacent to the other long side 522 of the second surface 521B of the cover 521.

FIG7 is a side view of an electronic device 10 according to an embodiment of the present invention. As shown in FIG2 and FIG7, the electronic device 10 includes a housing 100, a power supply 200, a fan device 300, and the electronic module 500 of FIG1. The housing 100 has an internal space 110, an air inlet 120, and an air outlet 130. The air inlet 120 and the air outlet 130 are opposite to each other, formed on different side walls of the housing 100, and are respectively connected to the internal space 110. The power supply 200, the fan device 300, and the electronic module 500 are respectively fixed in the internal space 110, and the power supply 200 is electrically connected to the fan device 300 and the electronic module 500. However, the present invention is not limited thereto. In other embodiments, the electronic module may also be the electronic modules 501 to 503 (Figures 3 to 6B) of other embodiments.

For example, heat sink 570 includes a base 571 and multiple fins 572. Base 571 is connected to bottom surface 511B of container body 511. Fins 572 are spaced apart along a transverse axis (e.g., the X-axis) on base 571, forming a channel 573 between any two adjacent fins 572. Each fin 572 and channel 573 is elongated, with their long axes (e.g., the Y-axis) parallel to each other.

Therefore, since the heat sink 570 is located between the air inlet 120 and the air outlet 130, and the fan device 300 is located between the air inlet 120 and the heat sink 570, when the fan device 300 is in operation, it generates airflow R1 through the air inlet 120 and transports airflow R1 toward the air outlet 130 through the channels 573 of the heat sink 570. A portion of the airflow R1 removes heat energy from the heat sink 570 through the air outlet 130, while the remaining airflow R2 circulates through the second heat source module 590 in the internal space 110 and returns to the fan device 300.

Figure 8 is a side view of an electronic device 11 according to an embodiment of the present invention. The electronic device 11 of this embodiment is substantially similar to the electronic device 10 of the aforementioned embodiment. The difference lies in that, as shown in Figure 8 , the container unit 510 of the electronic module 504 further includes an outlet 513 and an inlet 514. The outlet 513 and inlet 514 are formed on different sidewalls of the container body 511 and are respectively connected to the immersion tank 512. The outlet 513 is located between the inlet 514 and the lid 521. The immersion tank 512 is connected to a liquid cooling exchanger 400 located outside the housing 100 via the outlet 513 and inlet 514. The liquid cooling exchanger 400 is used to receive and deliver the coolant C within the immersion tank 512.

FIG9 is a side view of an electronic device 12 according to an embodiment of the present invention. The electronic device 11 of this embodiment is substantially identical to the electronic device 12 of the aforementioned embodiment. The difference is that, as shown in FIG9 , the housing 100 further comprises a partition 140, a first tube 170, and a second tube 180. The partition 140 is secured within the interior space 110, dividing the interior space 110 into a stacked upper region 150 and a lower region 160. The electronic module 504 is secured within the upper region 150, and the aforementioned liquid cooling exchanger 400 is secured within the lower region 160, rather than being located outside the housing 100. The first tube 170 is connected to the inlet 514 and the liquid cooling exchanger 400, respectively. The second tube 180 is connected to the outlet 513 and the liquid cooling exchanger 400, respectively. For example, the chassis 100 is a rack for accommodating a standard 2U or 3U rack-mount server. However, the present invention is not limited thereto.

Through the above architecture, the electronic equipment and its electronic modules utilizing immersion liquid cooling in this case can reduce container volume and consumable costs such as coolant, thereby achieving maximum heat dissipation efficiency at a reasonable equipment investment cost.

Finally, the embodiments disclosed above are not intended to limit the present invention. Anyone skilled in the art may make various modifications and improvements without departing from the spirit and scope of the present invention, and all of these modifications and improvements are protected by the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

500: Electronic module 510: Container unit 511: Container body 511T: Top surface 511B: Bottom surface 512: Immersion tank 520: Lid 521: Lid body 521A: First surface 521B: Second surface 523: Electrical connection 530: First electrical connection 540: Second electrical connection 570: Heat sink 572: Fin body 580: First heat source module 590: Second heat source module C: Coolant X, Y, Z: Axes

Claims (16)

An electronic device employing immersion liquid cooling comprises: A housing having an internal space; A power supply located within the internal space; An electronic module comprising: A container unit comprising a container body and an immersion tank, the container body being located within the internal space, the immersion tank being formed on one surface of the container body and containing a non-conductive coolant; A cover comprising a lid and an electrically conductive portion, the lid hermetically covering the container body and the immersion tank, the electrically conductive portion being disposed through the lid; A heat sink connected to the exterior of the container body; A first heat source module is fixed in the immersion tank and at least partially immersed in the coolant, electrically connected to the electrical conductive portion, and thermally connected to the heat sink through the container body; a second heat source module is located outside the immersion tank, electrically connected to the power supply, and electrically connected to the first heat source module through the electrical conductive portion, wherein the cover is located between the first heat source module and the second heat source module; and a fan device is located in the internal space and electrically connected to the power supply to transport air toward the heat sink and remove heat energy from the heat sink. An electronic device using an immersion liquid cooling mode as described in claim 1, wherein the heat sink is integrally formed on a side of the container body facing away from the cover. The electronic device adopting the immersion liquid cooling mode as described in claim 1, wherein the electronic module further includes at least one heat sink fin, and the heat sink fin is located on the cover. In the electronic device adopting the immersion liquid cooling mode as described in claim 3, the heat sink fin is fixedly arranged on a side of the cover facing away from the immersion tank and extends in a direction away from the immersion tank. In the electronic device adopting the immersion liquid cooling mode as described in claim 3, the heat sink fin is fixedly arranged on a side of the cover facing the immersion tank and extends into the immersion tank. An electronic device using an immersion liquid cooling mode as described in claim 3, wherein the cover further includes a first electrical connection portion and a second electrical connection portion, the first electrical connection portion and the second electrical connection portion are respectively located on two opposite surfaces of the cover body and are respectively connected to the electrical conductive portion, the first electrical connection portion is electrically connected to the first heat source module, the second electrical connection portion is electrically connected to the second heat source module, and is staggered with the heat sink fin, wherein the heat sink fin is located on the long side of the cover. An electronic device adopting an immersion liquid cooling mode as described in claim 1, wherein the container body further includes an outlet portion and an inlet portion, the outlet portion and the inlet portion are formed on the side wall of the container body and are respectively connected to the immersion tank, wherein the outlet portion is located between the inlet portion and the cover plate. The electronic device employing immersion liquid cooling as described in claim 7 further comprises: A liquid cooling exchanger connected to the immersion tank via the outlet and the inlet for receiving and transferring the coolant within the immersion tank. The electronic device employing immersion liquid cooling as described in claim 8, wherein the housing further comprises a partition plate, a first tube, and a second tube. The partition plate is secured within the interior space, dividing the interior space into an upper region and a lower region stacked on top of each other. The liquid cooling exchanger is secured within the lower region, and the electronic module is secured within the upper region. The first tube is connected to the inlet and the liquid cooling exchanger, respectively, and the second tube is connected to the outlet and the liquid cooling exchanger, respectively. An electronic module comprises: a container unit comprising a container body and an immersion tank, the immersion tank being formed on one side of the container body and containing a non-conductive coolant; a cover comprising a lid and an electrically conductive portion, the lid hermetically covering the container body and the immersion tank, the electrically conductive portion being disposed through the lid; a heat sink connected to the exterior of the container body; a first heat source module fixed in the immersion tank, at least partially immersed in the coolant, electrically connected to the electrically conductive portion, and thermally connected to the heat sink through the container body; and A second heat source module is located outside the immersion tank and is electrically connected to the first heat source module via the electrical conductive portion, wherein the cover is located between the first heat source module and the second heat source module. An electronic module as described in claim 10, wherein the heat sink is integrally formed on a side of the container body facing away from the cover. The electronic module of claim 10 further comprises: At least one heat sink located on the cover. The electronic module as described in claim 12, wherein the heat sink fin is fixedly disposed on a side of the cover facing away from the immersion tank and extends in a direction away from the immersion tank. The electronic module as described in claim 12, wherein the heat sink fin is fixedly disposed on a side of the cover facing the immersion tank and extends into the immersion tank. An electronic module as described in claim 12, wherein the cover further includes a first electrical connection portion and a second electrical connection portion, the first electrical connection portion and the second electrical connection portion are respectively located on two opposite surfaces of the cover body and are respectively connected to the electrical conductive portion, the first electrical connection portion is electrically connected to the first heat source module, the second electrical connection portion is electrically connected to the second heat source module, and is staggered with the heat sink fin, wherein the heat sink fin is located on the long side of the cover body. An electronic module as described in claim 10, wherein the container body further includes an outlet portion and an inlet portion, the outlet portion and the inlet portion are formed on the side wall of the container body and are respectively connected to the immersion tank, wherein the outlet portion is located between the inlet portion and the cover plate.