TWI898239B - Heat shield positioning jig, heat shield positioning method and silicon single crystal manufacturing method - Google Patents
Heat shield positioning jig, heat shield positioning method and silicon single crystal manufacturing methodInfo
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- TWI898239B TWI898239B TW112127535A TW112127535A TWI898239B TW I898239 B TWI898239 B TW I898239B TW 112127535 A TW112127535 A TW 112127535A TW 112127535 A TW112127535 A TW 112127535A TW I898239 B TWI898239 B TW I898239B
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- heat shield
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- jig
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- single crystal
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
本發明關於遮熱板定位治具、遮熱板定位方法以及矽單晶製造方法。The present invention relates to a heat shield plate positioning jig, a heat shield plate positioning method and a silicon single crystal manufacturing method.
習知,已知製造矽單晶的矽單晶製造裝置(例如,參考專利文獻1)。 在這種矽單晶製造裝置設置有包圍從坩堝內的矽熔液拉升中的矽單晶的遮熱板。例如,遮熱板其上端部由圍繞坩堝以及遮熱板的保熱筒支持。 [先前技術文獻] [專利文獻] As is known, a silicon single crystal manufacturing apparatus for manufacturing a silicon single crystal is known (for example, see Patent Document 1). This silicon single crystal manufacturing apparatus is provided with a heat shield that surrounds the silicon single crystal being pulled from a silicon melt within a crucible. For example, the upper end of the heat shield is supported by a heat retaining cylinder that surrounds the crucible and the heat shield. [Prior Art Document] [Patent Document]
[專利文獻1] 日本專利第2022-083492號公報[Patent Document 1] Japanese Patent No. 2022-083492
[發明所欲解決之問題][Identify the problem you want to solve]
矽單晶製造裝置被構成為由線或軸拉升的矽單晶的中心軸與腔室的中心軸一致。然後,遮熱板被配置為其中心軸與矽單晶的中心軸一致較佳。如果遮熱板的中心軸與矽單晶的中心軸不一致,則由於矽單晶與遮熱板之間流動的惰性氣體的流量的不均勻,而有矽單晶晃動、或在矽單晶周圍的熱環境發生不均勻的風險。Silicon single crystal manufacturing equipment is configured so that the central axis of the silicon single crystal, which is pulled up by a wire or shaft, is aligned with the central axis of the chamber. Furthermore, a heat shield is positioned so that its central axis preferably aligns with the central axis of the silicon single crystal. If the central axis of the heat shield is not aligned with the central axis of the silicon single crystal, there is a risk of the silicon single crystal wobbling or uneven thermal environment around the silicon single crystal due to uneven flow of the inert gas between the silicon single crystal and the heat shield.
習知,雖然遮熱板的配置位置是由作業者目視或使用捲尺而決定的,但這些方法無法容易地進行遮熱板的定位,又,由作業者決定有產生配置位置的偏差的風險。It is known that although the placement of the heat shield is determined by the operator visually or using a tape measure, these methods do not allow for easy positioning of the heat shield, and there is a risk of positional deviation when the operator determines the placement.
本發明的目的是提供可以容易且適當地進行遮熱板的水平方向的定位的遮熱板定位治具、遮熱板定位方法以及矽單晶製造方法。 [解決問題之手段] The present invention aims to provide a heat shield positioning jig, a heat shield positioning method, and a silicon single crystal manufacturing method that can easily and appropriately position a heat shield in the horizontal direction. [Solution]
本發明的遮熱板定位治具係為進行包圍在腔室內拉升中的矽單晶的遮熱板的定位的遮熱板定位治具,包括被構成為相對於前述腔室可自由裝配拆卸的治具主體,在前述治具主體中設置有進行相對於前述腔室的前述治具主體的水平方向的定位的治具用定位部、以及進行相對於前述治具主體的前述遮熱板的水平方向的定位的遮熱板用定位部。The heat shield positioning jig of the present invention is used to position a heat shield surrounding a silicon single crystal being pulled within a chamber. The jig comprises a jig body configured to be freely attachable and detachable relative to the chamber. The jig body includes a jig positioning portion for horizontally positioning the jig body relative to the chamber, and a heat shield positioning portion for horizontally positioning the heat shield relative to the jig body.
在本發明的遮熱板定位治具中,較佳是在前述治具主體的鉛直方向側的部位設置有複數個前述遮熱板用定位部,用於分別進行水平方向的尺寸彼此不同的複數種類型的遮熱板的水平方向的定位,前述治具主體以對應於定位對象的前述遮熱板的前述遮熱板用定位部面向於前述遮熱板的上側的姿勢,而裝配於前述腔室。In the heat shield positioning jig of the present invention, it is preferred that a plurality of heat shield positioning portions are provided on the vertical side of the jig body for horizontally positioning a plurality of types of heat shields having different horizontal dimensions. The jig body is mounted in the chamber with the heat shield positioning portion corresponding to the heat shield to be positioned facing the upper side of the heat shield.
在本發明的遮熱板定位治具中,較佳是在前述治具主體的鉛直方向的一側的部位設置有至少一個前述遮熱板用定位部,在前述治具主體的鉛直方向的另一側的部位設置有剩餘的前述遮熱板用定位部。In the heat shield positioning jig of the present invention, preferably, at least one heat shield positioning portion is provided on one side of the jig body in the vertical direction, and the remaining heat shield positioning portions are provided on the other side of the jig body in the vertical direction.
在本發明的遮熱板定位治具中,較佳是前述治具主體包括基部、以及從前述基部在彼此不同的方向延伸於水平方向的複數個腕部,在前述複數個腕部分別設置有前述治具用定位部以及前述遮熱板用定位部。In the heat shield plate positioning jig of the present invention, it is preferred that the jig body includes a base and a plurality of arms extending horizontally from the base in different directions, and the jig positioning portion and the heat shield plate positioning portion are respectively provided on the plurality of arms.
在本發明的遮熱板定位治具中,較佳是在前述基部以及前述複數個腕部中的至少一個設置有用於把持前述治具主體的把持部。In the heat shield positioning jig of the present invention, it is preferred that the base and at least one of the plurality of arms be provided with a gripping portion for gripping the jig body.
在本發明的遮熱板定位治具中,較佳是前述把持部由貫通設置有前述把持部的部位的貫通孔構成。In the heat shield plate positioning jig of the present invention, it is preferred that the holding portion is formed by a through hole penetrating through a portion where the holding portion is provided.
本發明的遮熱板定位方法,係為使用上述的遮熱板定位治具而進行包圍在腔室內拉升中的矽單晶的遮熱板的定位的遮熱板定位方法,其中將前述遮熱板暫時配置在前述腔室內,同時進行藉由前述治具用定位部的相對於前述腔室的前述治具主體的水平方向的定位、以及藉由前述遮熱板用定位部的相對於前述治具主體的前述遮熱板的水平方向的定位,或是進行一方的定位之後再進行定位另一方的定位,將前述遮熱板定位治具與前述腔室以及前述遮熱板分離。The heat shield positioning method of the present invention utilizes the aforementioned heat shield positioning jig to position a heat shield surrounding a silicon single crystal being pulled within a chamber. The method comprises temporarily placing the heat shield within the chamber and simultaneously performing horizontal positioning relative to the jig body within the chamber using the jig positioning portion and horizontal positioning relative to the jig body using the heat shield positioning portion, or performing one positioning step followed by the other, before separating the heat shield positioning jig from the chamber and the heat shield.
本發明的矽單晶製造方法使用上述的遮熱板定位方法,進行包圍在腔室內拉升中的矽單晶的遮熱板的定位,在前述腔室內拉升矽單晶。The silicon single crystal manufacturing method of the present invention uses the above-mentioned heat shield positioning method to position the heat shield surrounding the silicon single crystal being pulled up in the chamber, and pulls up the silicon single crystal in the chamber.
[實施例] 以下,說明關於本發明的一實施例。 [Example] The following describes an example of the present invention.
<矽單晶製造設備的構成> 首先,說明關於矽單晶製造裝置的構成。 圖1是示出矽單晶製造裝置的構成的示意圖。 <Silicon Single Crystal Manufacturing Equipment Configuration> First, the configuration of the silicon single crystal manufacturing apparatus will be described. Figure 1 is a schematic diagram illustrating the configuration of the silicon single crystal manufacturing apparatus.
圖1示出的矽單晶製造裝置1是使用提拉法製造矽單晶SM。矽單晶製造裝置1製造直體部的直徑例如為200mm以上且450mm以下的矽單晶SM。 矽單晶製造裝置1包括腔室11、坩堝12、加熱器13、保溫筒14、遮熱板15、拉升部16、以及坩堝驅動部17。 The silicon single crystal manufacturing apparatus 1 shown in Figure 1 produces silicon single crystals (SM) using the Czochralski method. Silicon single crystal manufacturing apparatus 1 produces silicon single crystals (SM) having a straight body diameter of, for example, 200 mm to 450 mm. Silicon single crystal manufacturing apparatus 1 includes a chamber 11, a crucible 12, a heater 13, a heat-insulating cylinder 14, a heat shield 15, a pulling unit 16, and a crucible drive unit 17.
腔室11包括主腔室111、頂腔室112、以及牽引腔室113。The chamber 11 includes a main chamber 111, a top chamber 112, and a traction chamber 113.
主腔室111形成為有底圓筒狀。主腔室111收容坩堝12、加熱器13、保溫筒14、以及遮熱板15。The main chamber 111 is formed in a bottomed cylindrical shape and houses the crucible 12 , the heater 13 , the heat-insulating cylinder 14 , and the heat shield 15 .
頂腔室112形成為上端的直徑小於下端的直徑的大致圓錐台筒狀。頂腔室112其下端氣密地連接於主腔室111的上端,並且覆蓋主腔室111的上方。The top chamber 112 is formed into a substantially conical cylindrical shape with a diameter at the upper end being smaller than that at the lower end. The lower end of the top chamber 112 is airtightly connected to the upper end of the main chamber 111 and covers the upper portion of the main chamber 111.
牽引腔室113形成為圓筒狀。牽引腔室113其下端氣密地連接於頂腔室112的上端。牽引腔室113暫時收容拉升後的矽單晶SM。The pulling chamber 113 is formed in a cylindrical shape. The lower end of the pulling chamber 113 is airtightly connected to the upper end of the top chamber 112. The pulling chamber 113 temporarily accommodates the pulled silicon single crystal SM.
這樣,藉由主腔室111、頂腔室112、以及牽引腔室113分別氣密地連接,而在腔室11內形成密封空間。In this way, the main chamber 111, the top chamber 112, and the traction chamber 113 are airtightly connected to form a sealed space in the chamber 11.
在牽引腔室113的上部設置有氣體導入口113A,以將氬氣(Ar)等的惰性氣體導入腔室11內。在主腔室111的下部設置有氣體排出口111A,藉由驅動真空泵(未示出),而將此腔室11內的氣體排出。A gas inlet 113A is provided at the top of the traction chamber 113 to introduce an inert gas such as argon (Ar) into the chamber 11. A gas exhaust port 111A is provided at the bottom of the main chamber 111 to exhaust the gas in the chamber 11 by driving a vacuum pump (not shown).
坩堝12配置在主腔室111內,並且儲存在矽熔液添加摻雜劑的摻雜劑添加熔液MD。另外,對應於矽單晶SM的電阻率,在矽熔液可以不添加摻雜劑。Crucible 12 is disposed in main chamber 111 and stores dopant-added melt MD, which is a silicon melt to which a dopant is added. Depending on the resistivity of silicon single crystal SM, no dopant may be added to the silicon melt.
加熱器13形成為圓筒狀。加熱器13以所定間隔隔開而配置在坩堝12的外側,並且熔化坩堝12內的矽原料。The heaters 13 are cylindrical and are arranged outside the crucible 12 at predetermined intervals to melt the silicon raw material in the crucible 12 .
保溫筒14形成為圓筒狀。保溫筒14以所定間隔隔開而配置在加熱器13的外側。The heat-insulating tubes 14 are formed in a cylindrical shape and are arranged outside the heater 13 at predetermined intervals.
遮熱板15包括上端的直徑大於下端的直徑的圓錐台筒狀的遮熱板主體151、以及從遮熱板主體151的上端整周往外突出成凸緣狀的被支持部152。遮熱板15以包圍從摻雜劑添加熔液MD拉升中的矽單晶SM的方式在被支持部152被載置於保溫筒14的上端的狀態下被支持。遮熱板15遮擋從加熱器13向矽單晶SM的輻射熱。The heat shield 15 comprises a conical cylindrical heat shield body 151, with a larger diameter at its upper end than at its lower end, and a supported portion 152 extending outward from the entire circumference of the upper end of the heat shield body 151. The heat shield 15 is supported by the supported portion 152, which is placed on the upper end of the heat-insulating cylinder 14, so as to surround the silicon single crystal SM being pulled from the dopant-doped melt MD. The heat shield 15 blocks radiant heat from the heater 13 toward the silicon single crystal SM.
拉升部16包括在一端安裝有晶種SC的電纜161、以及使此電纜161升降以及旋轉的拉升驅動部162。The pull-up unit 16 includes a cable 161 having a seed crystal SC attached to one end thereof, and a pull-up drive unit 162 for moving the cable 161 upward, downward, and in rotation.
坩堝驅動部17包括從下方支持坩堝12的支持軸171,並且使坩堝12以所定速度旋轉以及升降。The crucible driving unit 17 includes a support shaft 171 that supports the crucible 12 from below, and rotates and elevates the crucible 12 at a predetermined speed.
具有以上構成的矽單晶製造裝置1被構成為使得電纜161、藉由此電纜161拉升的矽單晶SM的中心軸、以及腔室11的中心軸為一致。The silicon single crystal manufacturing apparatus 1 having the above-described structure is configured so that the cable 161, the central axis of the silicon single crystal SM pulled by the cable 161, and the central axis of the chamber 11 are aligned.
<遮熱板定位治具的構成> 接下來,說明關於進行遮熱板15的相對於腔室11的水平方向的定位的遮熱板定位治具。 圖2是示出遮熱板定位治具的俯視圖,(A)示出了本實施例的遮熱板定位治具,並且(B)示出了變形例的遮熱板定位治具。圖3是示出本實施例的遮熱板定位治具的側視圖,(A)示出遮熱板定位治具的整體,(B)示出遮熱板定位治具的一部分。 <Heat Shield Positioning Jig Structure> Next, the heat shield positioning jig, which horizontally positions the heat shield 15 relative to the chamber 11, will be described. Figure 2 is a top view of the heat shield positioning jig. (A) shows the heat shield positioning jig of this embodiment, and (B) shows the heat shield positioning jig of a modified example. Figure 3 is a side view of the heat shield positioning jig of this embodiment. (A) shows the entire heat shield positioning jig, and (B) shows a portion of the heat shield positioning jig.
圖2(A)示出的遮熱板定位治具2是在進行遮熱板15的相對於主腔室111(腔室11)的方向的水平方向的定位時使用。遮熱板定位治具2包括治具主體21。The heat shield plate positioning jig 2 shown in FIG2(A) is used to position the heat shield plate 15 in the horizontal direction relative to the main chamber 111 (chamber 11). The heat shield plate positioning jig 2 includes a jig body 21.
治具主體21被構成為相對於主腔室111可自由裝配拆卸。 治具主體21由確保剛性並且不會發生主腔室111內的金屬污染的材料構成較佳。又,雖然治具主體21由於在室溫環境下使用,而不需要耐熱性,但為了藉由作業者搬運,所以輕量化較佳。作為具有這些功能的材料,可以例示出鐵氟龍(註冊商標)或石墨。 另外,為了避免主腔室111內的金屬污染,避免在治具主體21的與遮熱板15接觸的部位使用金屬即可。因此,治具主體21的不與遮熱板15接觸的部位可以由金屬構成。 The jig body 21 is designed to be freely attachable and detachable to the main chamber 111. The jig body 21 is preferably constructed of a material that ensures rigidity and prevents metal contamination within the main chamber 111. Furthermore, while heat resistance is not required for the jig body 21, which is used at room temperature, lightweight construction is desirable to facilitate handling by workers. Examples of materials that meet these requirements include Teflon (registered trademark) and graphite. Furthermore, to prevent metal contamination within the main chamber 111, metal should be avoided in areas of the jig body 21 that come into contact with the heat shield 15. Therefore, areas of the jig body 21 that do not come into contact with the heat shield 15 can be constructed of metal.
治具主體21包括基部211以及四個腕部212。四個腕部212在俯視觀察時以從基部211放射狀地延伸相同長度的方式配置。也就是說,四個腕部212在俯視觀察時以從基部211在彼此不同的水平方向延伸相同長度的方式,並且以相鄰的腕部212形成的角度相等的方式(形成90°的方式)配置。 另外,如圖2(B)所示,治具主體21可以被構成為包括三個腕部212。在這種情況下,三個腕部212在俯視觀察時以從基部211在彼此不同的水平方向延伸相同長度的方式,並且以相鄰的腕部212形成的角度相等的方式(形成120°的方式)配置較佳。又,治具主體21可以被構成為包括兩個或五個以上的腕部212。又,雖然相鄰的腕部212形成的角度不必相等,但是從改善重量平衡的觀點來看,相鄰的腕部212形成的角度相等較佳。 The jig body 21 includes a base 211 and four arms 212. The four arms 212 are arranged to extend radially from the base 211 by the same length when viewed from above. Specifically, the four arms 212 are arranged to extend from the base 211 by the same length in different horizontal directions when viewed from above, and so that the angles formed by adjacent arms 212 are equal (forming a 90° angle). Alternatively, as shown in FIG2(B), the jig body 21 may be configured to include three arms 212. In this case, the three arms 212 are preferably arranged to extend from the base 211 by the same length in different horizontal directions when viewed from above, and so that the angles formed by adjacent arms 212 are equal (forming a 120° angle). Alternatively, the jig body 21 may include two, five, or more arms 212. Furthermore, although the angles formed by adjacent wrists 212 do not necessarily need to be equal, it is preferred that the angles formed by adjacent wrists 212 be equal from the perspective of improving weight balance.
如圖3(A)所示,基部211例如形成為圓板狀,在基部211的外周面固定有四個腕部212。As shown in FIG. 3(A) , the base portion 211 is formed in, for example, a disk shape, and four arm portions 212 are fixed to the outer peripheral surface of the base portion 211 .
在治具主體21設置有治具用定位部22。治具用定位部22具有進行相對於主腔室111的治具主體21的水平方向的定位的功能。治具用定位部22由各腕部212的延伸方向的頂端構成。也就是說,在治具主體21設置有四個治具用定位部22。 在側視觀察時,構成治具用定位部22的各腕部212的延伸方向的頂端形成為大致圓弧形。另外,在側視觀察時,治具用定位部22可以形成為直線狀或凹凸狀。如圖2(A)所示,四個腕部212形成為使得外接於四個治具用定位部22的虛擬外接圓P的直徑R在主腔室111的內徑以下。例如,四個腕部212形成為使得虛擬外接圓P的直徑R與主腔室111的內徑的差為0mm以上且1mm以下。 遮熱板定位治具2的外徑(圖2(A)示出的虛擬外接圓P的直徑R)可以是例如在1m以上且2.5m以下的範圍的尺寸。 The jig body 21 is provided with a jig positioning portion 22. The jig positioning portion 22 serves to horizontally position the jig body 21 relative to the main chamber 111. The jig positioning portion 22 is formed by the top end of each arm 212 in the direction in which it extends. In other words, four jig positioning portions 22 are provided on the jig body 21. When viewed from the side, the top end of each arm 212 forming the jig positioning portion 22 is formed into a generally arcuate shape in the direction in which it extends. Furthermore, when viewed from the side, the jig positioning portion 22 can be formed into a straight line or a concave-convex shape. As shown in Figure 2(A), the four arms 212 are formed so that the diameter R of the virtual circumscribed circle P circumscribing the four jig positioning portions 22 is less than the inner diameter of the main chamber 111. For example, the four arms 212 are formed so that the difference between the diameter R of the virtual circumcircle P and the inner diameter of the main chamber 111 is between 0 mm and 1 mm. The outer diameter of the heat shield positioning jig 2 (the diameter R of the virtual circumcircle P shown in FIG2(A) ) can be, for example, between 1 m and 2.5 m.
如稍後將詳細描述的,在四個腕部212的延伸方向與水平方向平行並且各治具用定位部22抵接於或面向於主腔室111的內周面的狀態下,藉由治具主體21插入於主腔室111內,進行相對於主腔室111的治具主體21的水平方向的定位。As will be described in detail later, with the four arms 212 extending in a direction parallel to the horizontal direction and each jig positioning portion 22 abutting against or facing the inner circumferential surface of the main chamber 111, the jig body 21 is inserted into the main chamber 111 to position the jig body 21 horizontally relative to the main chamber 111.
如圖3(A)、圖3(B)所示,在治具主體21的鉛直方向側的部位設置有第一遮熱板用定位部23、第二遮熱板用定位部24、以及第三遮熱板用定位部25。As shown in FIG. 3A and FIG. 3B , a first heat shield plate positioning portion 23 , a second heat shield plate positioning portion 24 , and a third heat shield plate positioning portion 25 are provided on the lead vertical side of the jig body 21 .
第一遮熱板用定位部23、第二遮熱板用定位部24、以及第三遮熱板用定位部25具有進行相對於治具主體21的遮熱板15的水平方向的定位的功能。 第一遮熱板用定位部23進行被支持部152的外徑為第一長度的遮熱板15(以下,有時稱為「第一遮熱板15」)的定位。 第二遮熱板用定位部24進行被支持部152的外徑為比第一長度短的第二長度的遮熱板15(以下,有時稱為「第二遮熱板15」)的定位。 第三遮熱板用定位部25進行被支持部152的外徑為比第一長度、第二長度短的第三長度的遮熱板15(以下,有時稱為「第三遮熱板15」)的定位。也就是說,在治具主體21設置有複數個遮熱板用定位部(第一遮熱板用定位部23、第二遮熱板用定位部24、以及第三遮熱板用定位部25),以為了分別進行水平方向的尺寸彼此不同的複數種類型的遮熱板15的水平方向的定位。 另外,在下文中,第一遮熱板15的被支持部152有時稱為第一被支持部152,第二遮熱板15的被支持部152有時稱為第二被支持部152,第三遮熱板15的被支持部152有時稱為第三被支持部152。 The first heat shield positioning portion 23, the second heat shield positioning portion 24, and the third heat shield positioning portion 25 function to horizontally position the heat shield 15 relative to the jig body 21. The first heat shield positioning portion 23 positions a heat shield 15 whose supported portion 152 has an outer diameter of a first length (hereinafter, sometimes referred to as the "first heat shield 15"). The second heat shield positioning portion 24 positions a heat shield 15 whose supported portion 152 has an outer diameter of a second length, shorter than the first length (hereinafter, sometimes referred to as the "second heat shield 15"). The third heat shield positioning portion 25 positions a heat shield 15 whose supported portion 152 has an outer diameter of a third length, shorter than the first and second lengths (hereinafter, sometimes referred to as the "third heat shield 15"). Specifically, the jig body 21 is provided with a plurality of heat shield positioning portions (a first heat shield positioning portion 23, a second heat shield positioning portion 24, and a third heat shield positioning portion 25) to horizontally position a plurality of heat shields 15 having different horizontal dimensions. Also, hereinafter, the supported portion 152 of the first heat shield 15 may be referred to as the first supported portion 152, the supported portion 152 of the second heat shield 15 may be referred to as the second supported portion 152, and the supported portion 152 of the third heat shield 15 may be referred to as the third supported portion 152.
第一遮熱板用定位部23個別地設置在各腕部212的鉛直方向的一側的部位(圖3(A)、圖3(B)中的上端)。第二遮熱板用定位部24以及第三遮熱板用定位部25分別逐一設置在各腕部212的鉛直方向的另一側的部位(圖3A、圖3B中的下端)。 藉由各個第一遮熱板用定位部23、第二遮熱板用定位部24、以及第三遮熱板用定位部25抵接於第一被支持部152、第二被支持部152、以及第三被支持部152的上端緣部,而進行第一遮熱板15,第二遮熱板15、以及第三遮熱板15的水平方向的定位。 The first heat shield positioning portion 23 is provided on one side of each arm 212 in the vertical direction (the upper end in Figures 3(A) and 3(B)). The second heat shield positioning portion 24 and the third heat shield positioning portion 25 are provided on the other side of each arm 212 in the vertical direction (the lower end in Figures 3A and 3B). The first, second, and third heat shield positioning portions 23, 24, 25 abut against the upper edges of the first, second, and third supported portions 152, 152, and 152, respectively, thereby horizontally positioning the first, second, and third heat shields 15, 15, and 15.
各個第一遮熱板用定位部23分別包括第一水平面231以及第一鉛直面232。各個第一遮熱板用定位部23更包括第一傾斜面233較佳。 第一水平面231形成為面方向平行於水平方向,並構成為可抵接於第一被支持部152的上表面。 第一鉛直面232形成為從第一水平面231的腕部212的頂端側的端部延伸於鉛直方向,並且構成為可抵接於或可面向於第一被支持部152的側面。第一鉛直面232可以形成為對應於第一被支持部152的側面的圓弧面狀,或可以形成為平面狀。各個第一鉛直面232形成為內接於各個第一鉛直面232的第一虛擬內接圓的直徑R1為第一被支持部152的外徑以上。例如,各個第一鉛直面232形成為第一虛擬內接圓的直徑R1與第一被支持部152的外徑的差為0mm以上且1mm以下。 第一傾斜面233形成為從第一鉛直面232的與第一水平面231相反側的端部相對於鉛直方向而傾斜。第一傾斜面233以隨著遠離第一鉛直面232,而遠離基部211的方式傾斜。 Each first heat shield positioning portion 23 includes a first horizontal surface 231 and a first lead surface 232. Each first heat shield positioning portion 23 preferably further includes a first inclined surface 233. The first horizontal surface 231 is formed parallel to the horizontal direction and is configured to abut the upper surface of the first supported portion 152. The first lead surface 232 extends in the lead direction from the end of the first horizontal surface 231 at the top side of the arm portion 212 and is configured to abut or face the side surface of the first supported portion 152. The first lead surface 232 can be formed as an arcuate surface corresponding to the side surface of the first supported portion 152, or it can be formed as a flat surface. Each first lead surface 232 is formed so that the diameter R1 of a first virtual inscribed circle inscribed within the first lead surface 232 is greater than or equal to the outer diameter of the first supported portion 152. For example, each first lead surface 232 is formed so that the difference between the diameter R1 of the first virtual inscribed circle and the outer diameter of the first supported portion 152 is greater than or equal to 0 mm and less than or equal to 1 mm. The first inclined surface 233 is formed so as to be inclined relative to the lead vertical direction from the end of the first lead surface 232 opposite the first horizontal surface 231. The first inclined surface 233 is inclined so as to move away from the base 211 as it moves away from the first lead surface 232.
各個第二遮熱板用定位部24分別包括第二水平面241以及第二鉛直面242。各個第三遮熱板用定位部25分別包括第三水平面251以及第三鉛直面252。各個第二遮熱板用定位部24更包括第二傾斜面243較佳。各個第三遮熱板用定位部25更包括第三傾斜面253較佳。 第二水平面241、第三水平面251形成為面方向平行於水平方向,並構成為可抵接於第二被支持部152、第三被支持部152的上表面。 第二鉛直面242、第三鉛直面252形成為從第二水平面241、第三水平面251的腕部212的頂端側的端部延伸於鉛直方向,並且構成為可抵接於或可面向於第二被支持部152、第三被支持部152的側面。第二鉛直面242、第三鉛直面252可以形成為對應於第二被支持部152、第三被支持部152的側面的圓弧面狀,或可以形成為平面狀。各個第二鉛直面242、第三鉛直面252形成為內接於各個第二鉛直面242、第三鉛直面252的第二虛擬內接圓、第三虛擬內接圓的直徑R2、R3為第二被支持部152、第三被支持部152的外徑以上。例如,各個第二鉛直面242、第三鉛直面252形成為第二虛擬內接圓、第三虛擬內接圓的直徑R2、R3與第二被支持部152、第三被支持部152的外徑的差為0mm以上且1mm以下。 第二傾斜面243、第三傾斜面253形成為從第二鉛直面242、第三鉛直面252的與第二水平面241、第三水平面251相反側延伸方向的端部相對於鉛直方向而傾斜。第二傾斜面243、第三傾斜面253以隨著遠離第二鉛直面242、第三鉛直面252,而遠離基部211的方式傾斜。 Each second heat shield positioning portion 24 includes a second horizontal surface 241 and a second lead surface 242. Each third heat shield positioning portion 25 includes a third horizontal surface 251 and a third lead surface 252. Each second heat shield positioning portion 24 preferably includes a second inclined surface 243. Each third heat shield positioning portion 25 preferably includes a third inclined surface 253. The second and third horizontal surfaces 241 and 251 are formed parallel to the horizontal direction and are configured to abut the upper surfaces of the second and third supported portions 152 and 152. The second and third lead surfaces 242, 252 are formed to extend in the lead direction from the ends of the top side of the arm portion 212 of the second and third horizontal surfaces 241, 251, and are configured to abut or face the side surfaces of the second and third supported portions 152, 152. The second and third lead surfaces 242, 252 can be formed into arcuate surfaces corresponding to the side surfaces of the second and third supported portions 152, 152, or can be formed into flat surfaces. Each of the second and third lead surfaces 242 and 252 is formed so that the diameters R2 and R3 of the second and third virtual inscribed circles inscribed in the second and third lead surfaces 242 and 252 are greater than the outer diameters of the second and third supported portions 152 and 152, respectively. For example, each of the second and third lead surfaces 242 and 252 is formed so that the difference between the diameters R2 and R3 of the second and third virtual inscribed circles and the outer diameters of the second and third supported portions 152 and 152 is greater than or equal to 0 mm and less than or equal to 1 mm. The second and third inclined surfaces 243 and 253 are formed to be inclined relative to the lead vertical direction from the ends of the second and third lead surfaces 242 and 252 extending in the direction opposite to the second and third horizontal surfaces 241 and 251. The second and third inclined surfaces 243 and 253 are inclined so as to move away from the base 211 as they move away from the second and third lead surfaces 242 and 252.
各個第一遮熱板用定位部23、第二遮熱板用定位部24、以及第三遮熱板用定位部25可以設置在距遮熱板定位治具2的中心等距離的位置(在與虛擬外接圓P同心的圓上)。藉由這種構成,可以確實地使遮熱板15的中心軸與腔室11的中心軸一致而設置遮熱板15。Each of the first heat shield positioning portion 23, the second heat shield positioning portion 24, and the third heat shield positioning portion 25 can be positioned equidistant from the center of the heat shield positioning jig 2 (on a circle concentric with the virtual circumcircle P). This configuration allows the heat shield 15 to be positioned with its central axis reliably aligned with the central axis of the chamber 11.
雖然稍後將詳細描述,但例如,在第一遮熱板用定位部23位於下側的姿勢下,治具主體21被插入於主腔室111內,第一水平面231抵接於載置於保溫筒14的第一被支持物152的上表面,並且藉由第一鉛直面232抵接於或面向於第一被支持部152的側面,而進行相對於主腔室111的第一遮熱板15的水平方向的定位。Although described in detail later, for example, with the first heat shield positioning portion 23 positioned downward, the jig body 21 is inserted into the main chamber 111, the first horizontal surface 231 abuts against the upper surface of the first supported object 152 placed on the heat insulation cylinder 14, and the first lead straight surface 232 abuts against or faces the side surface of the first supported portion 152, thereby horizontally positioning the first heat shield 15 relative to the main chamber 111.
又,把手213分別固定於基部211的上表面以及下表面。把手213是利用於當作業者把持並搬運治具主體21時。也就是說,把手213作為本發明的把持部而發揮功能。Furthermore, handles 213 are fixed to the upper and lower surfaces of the base 211. The handles 213 are used by the operator to hold and carry the jig body 21. In other words, the handles 213 function as the gripping portion of the present invention.
又,在各腕部212的延伸方向的頂端側形成有在水平方向貫通各腕部212的貫通孔212A。貫通孔212A形成為作業者的手可以伸入的尺寸,並且是利用於當作業者把持並搬運治具主體21時。貫通孔212A作為本發明的把持部而發揮功能。又,貫通孔212A有助於治具主體21的輕量化。Furthermore, a through hole 212A is formed at the top end of each arm 212 in the direction of its extension, extending horizontally through each arm 212. Through hole 212A is sized to accommodate a worker's hand and is used when the worker grasps and carries jig body 21. Through hole 212A functions as the gripping portion of the present invention and contributes to the weight reduction of jig body 21.
<遮熱板定位方法> 接下來,將說明關於使用遮熱板定位治具2而進行遮熱板15的相對於腔室11的水平方向的定位的遮熱板定位方法。 另外,雖然說明關於藉由遮熱板定位治具2的第一遮熱板用定位部23而進行第一遮熱板15的定位的方法,但是藉由第二遮熱板用定位部24而進行第二遮熱板15的定位的方法、或藉由第三遮熱板用定位部25而進行第三遮熱板15的定位的方法也與以下說明同樣地進行。又,在以下的說明的作業者進行的作業可以是至少一個作業者進行,也可以是裝置進行。 圖4是示出相對於遮熱板的腔室的水平方向的定位狀態的示意圖。 <Heat Shield Positioning Method> Next, we will describe a heat shield positioning method for horizontally positioning the heat shield 15 relative to the chamber 11 using the heat shield positioning jig 2. Although this method describes positioning the first heat shield 15 using the first heat shield positioning portion 23 of the heat shield positioning jig 2, the following description also describes positioning the second heat shield 15 using the second heat shield positioning portion 24 or the third heat shield positioning portion 25. Furthermore, the worker-operated tasks described below may be performed by at least one worker or by a device. Figure 4 is a schematic diagram illustrating the horizontal positioning of the heat shield relative to the chamber.
首先,如圖4所示,作業者將第一遮熱板15的第一被支持部152暫時放置在保溫筒14的上端。 接下來,作業者握住位於與設置有第一遮熱板用定位部23的一側相反側的把手213,或者將手伸入於貫通孔212A內,在第一遮熱板用定位部23位於下側的姿勢下,也就是說,在第一遮熱板用定位部23面向於定位對象的第一遮熱板15的上側的姿勢下,將遮熱板定位治具2插入於主腔體111內。 First, as shown in Figure 4, the operator temporarily places the first supported portion 152 of the first heat shield 15 on the upper end of the heat insulation cylinder 14. Next, the operator grasps the handle 213 located on the side opposite the side where the first heat shield positioning portion 23 is located, or inserts their hand into the through hole 212A. With the first heat shield positioning portion 23 positioned downward, that is, facing the upper side of the first heat shield 15 to be positioned, the operator inserts the heat shield positioning jig 2 into the main cavity 111.
當遮熱板定位治具2插入於主腔室111內時,藉由位於腕部212的頂端的治具用定位部22抵接於主腔室111的內周面接觸,而進行藉由治具用定位部22的相對於主腔室111的遮熱板定位治具2的水平方向的定位。When the heat shield plate positioning jig 2 is inserted into the main chamber 111, the jig positioning portion 22 located at the top end of the arm 212 contacts the inner circumferential surface of the main chamber 111, thereby horizontally positioning the heat shield plate positioning jig 2 relative to the main chamber 111 by the jig positioning portion 22.
此外,當遮熱板定位治具2插入於主腔室111內時,至少一個第一遮熱板用定位部23的第一傾斜面233抵接於第一被支持部152的上端角部。之後,藉由伴隨遮熱板定位治具2的插入,第一傾斜面233與第一被支持部152的上端角部的抵接位置逐漸往第一鉛直面232移動,第一遮熱板15在水平方向移動。然後,藉由插入遮熱板定位治具2直到第一鉛直面232與第一被支持部152的側面抵接,進行由第一遮熱板用定位部23的相對於主腔室111的第一遮熱板15的水平方向的定位。之後,插入遮熱板定位治具2直到第一水平面231抵接於第一被支持部152的上表面。Furthermore, when the heat shield positioning jig 2 is inserted into the main chamber 111, the first inclined surface 233 of at least one first heat shield positioning portion 23 abuts the upper corner of the first supported portion 152. Subsequently, as the heat shield positioning jig 2 is inserted, the abutment position of the first inclined surface 233 and the upper corner of the first supported portion 152 gradually moves toward the first lead surface 232, causing the first heat shield 15 to move horizontally. The heat shield positioning jig 2 is then inserted until the first lead surface 232 abuts the side surface of the first supported portion 152, thereby horizontally positioning the first heat shield 15 relative to the main chamber 111 using the first heat shield positioning portion 23. The heat shield positioning jig 2 is then inserted until the first horizontal surface 231 abuts the upper surface of the first supported portion 152.
之後,作業者握住位於上側的把手213、或將手伸入貫通孔212A內,而以不使第一遮熱板15偏離的方式進行的同時將遮熱板定位治具2從主腔室111內取出。也就是說,作業者使遮熱板定位治具2與主腔室111以及第一遮熱板15分離。 藉由以上的作業,以使第一遮熱板15的中心軸與主腔室111的中心軸一致的方式,也就是說,以使第一遮熱板15的中心軸與矽單晶SM的中心軸一致的方式,調整第一遮熱板15的水平方向的位置。 The operator then grasps the upper handle 213 or reaches into the through-hole 212A to remove the heat shield positioning jig 2 from the main chamber 111, ensuring that the first heat shield 15 does not move. In other words, the operator separates the heat shield positioning jig 2 from the main chamber 111 and the first heat shield 15. Through these steps, the horizontal position of the first heat shield 15 is adjusted so that its central axis aligns with that of the main chamber 111, or more specifically, with that of the silicon single crystal SM.
另外,在暫時放置的第一遮熱板15的中心軸位於主腔室111的中心軸上的情況下,第一傾斜面233與第一被支持部152的上端角部不抵接,伴隨遮熱板定位治具2的插入,第一遮熱板15不在水平方向移動。In addition, when the central axis of the temporarily placed first heat shield plate 15 is located on the central axis of the main chamber 111, the first inclined surface 233 does not abut the upper corner of the first supported portion 152, and the first heat shield plate 15 does not move horizontally as the heat shield plate positioning jig 2 is inserted.
又,在外接於四個治具用定位部22的虛擬外接圓P的直徑R與主腔室111的內徑的差不為0mm的情況下,至少一個治具用定位部22在不抵接於主腔室111的狀態下,遮熱板定位治具2插入於主腔室111內。又,在內接於四個第一鉛直面232的第一虛擬內接圓的直徑R1與第一被支持部152的外徑的差不為0mm的情況下,至少一個第一鉛直面232在不抵接於第一被支持不152的狀態下,遮熱板定位治具2插入於主腔室111內。Furthermore, when the difference between the diameter R of the virtual circumscribed circle P circumscribing the four jig positioning portions 22 and the inner diameter of the main chamber 111 is not 0 mm, the heat shield positioning jig 2 is inserted into the main chamber 111 without at least one jig positioning portion 22 abutting the main chamber 111. Furthermore, when the difference between the diameter R1 of the first virtual inscribed circle circumscribing the four first lead surfaces 232 and the outer diameter of the first supported portion 152 is not 0 mm, the heat shield positioning jig 2 is inserted into the main chamber 111 without at least one first lead surface 232 abutting the first supported portion 152.
在至少一個治具用定位部22不抵接於主腔室111的狀態、與至少一個第一鉛直面232不抵接第一被支持部152的狀態中的至少一者狀態下,在第一遮熱板15被定位的情況下,由於虛擬外接圓P的直徑R與主腔室111的內徑的差、以及第一虛擬內接圓的直徑R1與第一被支持部152的外徑的差都為1mm以下,所以第一遮熱板15的中心軸的從主腔室111的中心軸的偏離量最大為2mm。When the first heat shield 15 is positioned in at least one of the following conditions: when at least one jig positioning portion 22 is not in contact with the main chamber 111, and when at least one first lead surface 232 is not in contact with the first supported portion 152, the difference between the diameter R of the virtual circumscribed circle P and the inner diameter of the main chamber 111, and the difference between the diameter R1 of the first virtual inscribed circle and the outer diameter of the first supported portion 152, are both 1 mm or less. Therefore, the maximum deviation of the center axis of the first heat shield 15 from the center axis of the main chamber 111 is 2 mm.
如果第一遮熱板15的中心軸的從主腔室111的中心軸的偏離量為2mm以下,則可以抑制由於在矽單晶SM與第一遮熱板15之間流動的惰性氣體的流量的不均勻而導致矽單晶SM晃動、矽單晶SM周圍的熱環境變得不均勻。 因此,即使虛擬外接圓P的直徑R與主腔室111的內徑的差、以及第一虛擬內接圓P的直徑R1與第一被支持部152的外徑的差中的至少一者的差不為0mm,只要此至少一方的差為所定值(在本實施例中為1mm)以下的話,則遮熱板定位治具2可以適當地進行第一遮熱板15的水平方向的定位。 If the deviation of the center axis of the first heat shield 15 from the center axis of the main chamber 111 is 2 mm or less, wobbling of the silicon single crystal SM and uneven thermal environment around it caused by uneven flow of the inert gas between the silicon single crystal SM and the first heat shield 15 can be suppressed. Therefore, even if at least one of the difference between the diameter R of the virtual circumscribed circle P and the inner diameter of the main chamber 111, or the difference between the diameter R1 of the first virtual inscribed circle P and the outer diameter of the first supported portion 152 is not 0 mm, the heat shield positioning jig 2 can properly position the first heat shield 15 in the horizontal direction as long as this difference is less than a predetermined value (1 mm in this embodiment).
<矽單晶製造方法> 接下來,說明關於包括上述遮熱板定位方法的矽單晶製造方法。 首先,作業者藉由上述的遮熱板定位方法,進行暫時放置在主腔室111內的第一遮熱板15的水平方向的定位。 由作業者將遮熱板定位治具2從主腔室111內取出之後,矽單晶製造裝置1藉由習知的方法將腔室11內的矽單晶SM拉升。在此拉升時,由於第一遮熱板15的中心軸與矽單晶SM的中心軸一致,所以可以在抑制矽單晶SM晃動、矽單晶SM周圍的熱環境變得不均勻的狀態下,將矽單晶SM拉升。 <Silicon Single Crystal Manufacturing Method> Next, the silicon single crystal manufacturing method including the aforementioned heat shield positioning method will be described. First, the operator horizontally positions the first heat shield 15, which is temporarily placed within the main chamber 111, using the aforementioned heat shield positioning method. After the operator removes the heat shield positioning jig 2 from the main chamber 111, the silicon single crystal manufacturing apparatus 1 pulls up the silicon single crystal SM within the chamber 11 using a known method. During this pull-up, the central axis of the first heat shield 15 aligns with the central axis of the silicon single crystal SM. This allows the silicon single crystal SM to be pulled up while preventing any wobbling of the silicon single crystal SM and any uneven thermal environment surrounding the silicon single crystal SM.
[實施例的效果] 遮熱板定位治具2包括構成為相對於主腔室111而可自由裝配拆卸的治具主體21。在治具主體21設置有進行相對於主腔室111的治具主體21的水平方向的定位的治具用定位部22、以及進行相對於治具主體21的第一遮熱板15的水平方向的定位的第一遮熱板用定位部23。 因此,將第一遮熱板15暫時配置在主腔室111內,在進行藉由治具用定位部22的相對於主腔室111的治具主體21的水平方向的定位、以及藉由第一遮熱板用定位部23的相對於治具主體21的第一遮熱板15的水平方向的定位之後,僅使遮熱板定位治具2與主腔室111以及第一遮熱板15分離,而可以再現性良好地進行相對於主腔室111的第一遮熱板15的水平方向的定位。 因此,可以提供可以容易且適當地進行第一遮熱板15的水平方向的定位的遮熱板定位治具2。 又,雖然主腔室111較小的話,作業者可以目視判定第一遮熱板15的適當位置,但是在用於製造直體部的直徑為300mm以上的矽單晶SM的矽單晶製造裝置1中,由於主腔室111較大,所以作業者難以目視判定第一遮熱板15的適當位置。當相對於這樣大的主腔室111的第一遮熱板15的定位時,遮熱板定位治具2是有用的。 [Effects of the Embodiment] The heat shield positioning jig 2 includes a jig body 21 that is freely attachable and detachable relative to the main chamber 111. The jig body 21 is provided with a jig positioning portion 22 for horizontally positioning the jig body 21 relative to the main chamber 111, and a first heat shield positioning portion 23 for horizontally positioning the first heat shield 15 relative to the jig body 21. Therefore, the first heat shield plate 15 is temporarily placed in the main chamber 111. After the jig body 21 is horizontally positioned relative to the main chamber 111 by the jig positioning portions 22 and the first heat shield plate positioning portions 23, the first heat shield plate 15 can be horizontally positioned relative to the jig body 21 by simply separating the heat shield plate positioning jig 2 from the main chamber 111 and the first heat shield plate 15. This allows for highly reproducible horizontal positioning of the first heat shield plate 15 relative to the main chamber 111. Therefore, a heat shield plate positioning jig 2 is provided that allows for easy and appropriate horizontal positioning of the first heat shield plate 15. Furthermore, while workers can visually determine the proper position of the first heat shield plate 15 if the main chamber 111 is small, in the silicon single crystal manufacturing apparatus 1 used to manufacture silicon single crystals SM with a straight body diameter of 300 mm or greater, the larger main chamber 111 makes it difficult for workers to visually determine the proper position of the first heat shield plate 15. The heat shield plate positioning jig 2 is useful for positioning the first heat shield plate 15 relative to such a large main chamber 111.
在治具主體21的鉛直方向側的部位中,設置有用於分別進行水平方向的尺寸彼此不同的第一遮熱板15、第二遮熱板15、以及第三遮熱板15的水平方向的定位的第一遮熱板用定位部23、第二遮熱板用定位部24、以及第三遮熱板用定位部25。治具主體21例如以對應於定位對象的第一遮熱板15的第一遮熱板用定位部23面向於第一遮熱板15的上側的姿勢而裝配於主腔室111。 因此,藉由僅準備一個遮熱板定位治具2,就可以進行水平方向的尺寸彼此不同的第一遮熱板15、第二遮熱板15、以及第三遮熱板15的定位。 The jig body 21 is provided with first, second, and third heat shield positioning portions 23, 24, and 25 on its vertical side, respectively, for horizontally positioning the first, second, and third heat shield plates 15, 15, respectively, which have different horizontal dimensions. The jig body 21 is mounted in the main chamber 111 with the first heat shield positioning portion 23, corresponding to the first heat shield plate 15 to be positioned, facing the upper side of the first heat shield plate 15. Thus, with only a single heat shield positioning jig 2, it is possible to position the first, second, and third heat shield plates 15, 15, each of which has different horizontal dimensions.
在治具主體21的鉛直方向的一側的部位設置有第一遮熱板用定位部23,在另一側的部位設置有第二遮熱板用定位部24以及第三遮熱板用定位部25。 因此,藉由當進行第一遮熱板15的定位時,以第一遮熱板用定位部23面向於第一遮熱板15的上側的姿勢將遮熱板定位治具2裝配於主腔室111,並當進行第二遮熱板15以及第三遮熱板15的定位時,以第二遮熱板用定位部24、第三遮熱板用定位部25以面向於第二遮熱板15、第三遮熱板15的上側的姿勢將遮熱板定位治具2裝配於主腔室111,而可以進行第一遮熱板15、第二遮熱板15、以及第三遮熱板15的水平方向的定位。 A first heat shield positioning portion 23 is provided on one vertical side of the jig body 21, while a second heat shield positioning portion 24 and a third heat shield positioning portion 25 are provided on the other side. Thus, by attaching the heat shield positioning jig 2 to the main chamber 111 with the first heat shield positioning portion 23 facing the upper side of the first heat shield 15 when positioning the first heat shield 15, and attaching the heat shield positioning jig 2 to the main chamber 111 with the second heat shield positioning portion 24 and the third heat shield positioning portion 25 facing the upper sides of the second and third heat shield 15 when positioning the second and third heat shield 15, the first, second, and third heat shields 15 can be positioned horizontally.
治具主體21包括基部211、以及從基部211在彼此不同的方向延伸於水平方向的複數個腕部212。在各腕部212分別設置有治具用定位部22以及第一遮熱板用定位部23、第二遮熱板用定位部24、以及第三遮熱板用定位部25。 藉由這樣,由基部211以及腕部212而構成治具主體21,可以達到遮熱板定位治具2的輕量化。 The jig body 21 comprises a base 211 and a plurality of arms 212 extending horizontally from the base 211 in different directions. Each arm 212 is provided with a jig positioning portion 22, as well as a first heat shield positioning portion 23, a second heat shield positioning portion 24, and a third heat shield positioning portion 25. Combining the base 211 and arms 212 to form the jig body 21, the heat shield positioning jig 2 is lightweight.
在基部211設置有作為把持部而發揮功能的把手213。又,在腕部212設置有作為把持部而發揮功能的貫通孔212A。 因此,作業者可以使用把手213或貫通孔212A而容易地使遮熱板定位治具2移動。 The base 211 is provided with a handle 213 that functions as a grip. Furthermore, the wrist 212 is provided with a through-hole 212A that also functions as a grip. Thus, the operator can easily move the heat shield positioning jig 2 using the handle 213 or through-hole 212A.
[變形例] 以上,雖然參考附圖而詳述了關於本發明實施例,但是具體的構成並不限定於此實施例,在不脫離本發明的主旨的範圍的各種改進以及設計變更等也包含在本發明中。 [Variations] Although the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the specific configuration is not limited to these embodiments. Various improvements and design modifications that do not depart from the spirit of the present invention are also included in the present invention.
例如,在遮熱板定位治具2,可以不設置第一遮熱板用定位部23、第二遮熱板用定位部24、以及第三遮熱板用定位部25中的一個或兩個。又,在遮熱板定位治具2,可以設置有四個以上的遮熱板用定位部,用於進行水平方向的尺寸彼此不同的四種類型以上的遮熱板15的水平位置的定位。在這種情況下,將四個以上的遮熱板用定位部設置於各腕部212的距遮熱板定位治具2的中心等距離(與虛擬外接圓P同心的圓上)的位置較佳。For example, the heat shield positioning jig 2 may not include one or two of the first heat shield positioning portion 23, the second heat shield positioning portion 24, and the third heat shield positioning portion 25. Alternatively, the heat shield positioning jig 2 may include four or more heat shield positioning portions to horizontally position four or more types of heat shields 15 having different horizontal dimensions. In this case, the four or more heat shield positioning portions are preferably located on each arm 212 at equal distances from the center of the heat shield positioning jig 2 (on a circle concentric with the virtual circumcircle P).
在治具主體21的例如鉛直方向的一側的部位(圖3(A)、圖3(B)中的上端)可以設置第一遮熱板用定位部23、第二遮熱板用定位部24、以及第三遮熱板用定位部25。A first heat shield plate positioning portion 23 , a second heat shield plate positioning portion 24 , and a third heat shield plate positioning portion 25 may be provided on one side of the jig body 21 in the vertical direction (the upper end in FIG. 3A and FIG. 3B ).
可以由外徑為主腔室111的內徑以下的圓板狀構件構成治具主體21,也可以由外接圓的直徑為主腔室111的內徑以下的多角形的板狀構件構成。在這種情況下,可以將圓板狀構件的側面、或多角形板狀構件的俯視觀察時的角部作為治具用定位部而發揮功能,並且可以在圓板狀構件、或多角板狀構件的主面設置遮熱板用定位部。The jig body 21 can be formed from a circular plate-shaped member having an outer diameter less than the inner diameter of the main chamber 111, or from a polygonal plate-shaped member having a circumscribed circle with a diameter less than the inner diameter of the main chamber 111. In this case, the side surfaces of the circular plate-shaped member or the corners of the polygonal plate-shaped member when viewed from above can function as jig positioning portions, and positioning portions for the heat shield can be provided on the main surfaces of the circular plate-shaped member or the polygonal plate-shaped member.
在治具主體21不設置有作為把持部而發揮功能的把手213以及貫通孔212A中的至少一者。又,可以在基部211設置有作為把持部而發揮功能的貫通孔,也可以在腕部212設置有把手213。The jig body 21 is not provided with at least one of the handle 213 and the through hole 212A that function as a grip. Alternatively, the base 211 may be provided with a through hole that functions as a grip, or the arm 212 may be provided with the handle 213.
可以將水平儀配置在基部211以及四個腕部212中的至少一個。如果形成這樣的構成,則可以判定遮熱板15是否水平配置。A level may be provided at the base 211 and at least one of the four arms 212. With this configuration, it is possible to determine whether the heat shield 15 is horizontally disposed.
作為治具用定位部22,雖然例示了抵接於主腔室111的內周面的構成,但是也可以是抵接於主腔室111的內周面以及外周面中的至少外周面的構成。Although the jig positioning portion 22 is exemplified as being in contact with the inner peripheral surface of the main chamber 111 , it may also be in contact with at least the outer peripheral surface of the inner and outer peripheral surfaces of the main chamber 111 .
例如,作為第一遮熱板用定位部23,藉由與構成第一遮熱板15的遮熱板主體151的上側或下側的開口邊緣或、或者藉由與遮熱板主體151的內周面抵接,可以適用進行相對於主腔室111的第一遮熱板15的水平方向的定位的構成。For example, the first heat shield positioning portion 23 may be configured to horizontally position the first heat shield 15 relative to the main chamber 111 by contacting the upper or lower opening edge of the heat shield main body 151 constituting the first heat shield 15, or by contacting the inner peripheral surface of the heat shield main body 151.
可以改變腕部212的水平方向的長度,使得可以以一個遮熱板定位治具2進行相對於內徑彼此不同的主腔室111的遮熱板15的水平方向的定位。例如,可以例如藉由經由旋轉軸連接兩個分割腕部而構成一個腕部212,並且藉由使位於外側的分割腕部旋轉而改變腕部212的長度。又,代替旋轉軸,可以藉由例如經由齒條機構連接兩個分割腕部,並且使位於外側的分割腕部滑動而改變腕部212的長度。The horizontal length of the arm 212 can be varied, enabling the horizontal positioning of the heat shield 15 relative to main chambers 111 having different inner diameters using a single heat shield positioning jig 2. For example, the arm 212 can be constructed by connecting two split arms via a rotating shaft, and the length of the arm 212 can be varied by rotating the outer split arm. Alternatively, instead of using a rotating shaft, the length of the arm 212 can be varied by connecting the two split arms via a toothed mechanism, and sliding the outer split arm.
例如,可以以同時進行藉由治具用定位部22的相對於主腔室111的治具主體21的水平方向的定位、以及藉由第一遮熱板用定位部23的相對於治具主體21的第一遮熱板15的水平方向的定位的方式,而構成遮熱板定位治具2。又,例如,可以以在進行藉由第一遮熱板用定位部23的相對於治具主體21的第一遮熱板15的水平方向的定位之後、再進行藉由治具用定位部22的相對於主腔室111的治具主體21的水平方向的定位的方式,而構成遮熱板定位治具2。For example, the heat shield positioning jig 2 can be configured so that the jig body 21 is positioned horizontally relative to the main chamber 111 by the jig positioning portion 22, and the first heat shield positioning portion 23 is used to position the first heat shield 15 horizontally relative to the jig body 21. Alternatively, for example, the heat shield positioning jig 2 can be configured so that the jig body 21 is positioned horizontally relative to the main chamber 111 by the jig positioning portion 22 after the first heat shield positioning portion 23 positions the first heat shield 15 horizontally relative to the jig body 21.
1:矽單晶製造裝置 2:遮熱板定位治具 11:腔室 12:坩堝 13:加熱器 14:保溫筒 15:遮熱板 16:拉升部 17:坩堝驅動部 21:治具主體 22:治具用定位部 23:第一遮熱板用定位部 24:第二遮熱板用定位部 25:第三遮熱板用定位部 111:主腔室 111A:氣體排出口 112:頂腔室 113:牽引腔室 113A:氣體導入口 151:遮熱板主體 152:被支持部 161:電纜 162:拉升驅動部 171:支持軸 211:基部 212:腕部 212A:貫通孔/把持部 213:把手/把持部 231:第一水平面 232:第一鉛直面 233:第一傾斜面 241:第二水平面 242:第二鉛直面 243:第二傾斜面 251:第三水平面 252:第三鉛直面 253:第三傾斜面 MD:摻雜劑添加熔液 R1,R2,R3:直徑 SC:晶種 SM:矽單晶 1: Silicon Single Crystal Manufacturing Apparatus 2: Heat Shield Positioning Jig 11: Chamber 12: Crucible 13: Heater 14: Insulation Cylinder 15: Heat Shield 16: Puller 17: Crucible Drive 21: Jig Body 22: Jig Positioning Unit 23: First Heat Shield Positioning Unit 24: Second Heat Shield Positioning Unit 25: Third Heat Shield Positioning Unit 111: Main Chamber 111A: Gas Exhaust Port 112: Top Chamber 113: Puller Chamber 113A: Gas Inlet 151: Heat Shield Body 152: Support Unit 161: Cable 162: Puller Drive 171: Support shaft 211: Base 212: Wrist 212A: Through-hole/Handle 213: Handle/Handle 231: First horizontal surface 232: First lead plane 233: First inclined surface 241: Second horizontal surface 242: Second lead plane 243: Second inclined surface 251: Third horizontal surface 252: Third lead plane 253: Third inclined surface MD: Dopant addition melt R1, R2, R3: Diameters SC: Seed crystal SM: Silicon single crystal
圖1是示出本發明的一實施例中的矽單晶製造裝置的構成的示意圖。 圖2是示出遮熱板定位治具的俯視圖,(A)示出了前述一實施例的遮熱板定位治具,並且(B)示出了變形例的遮熱板定位治具。 圖3是示出前述一實施例的遮熱板定位治具的側視圖,(A)示出了遮熱板定位治具的整體,並且(B)示出了遮熱板定位治具的一部分。 圖4是顯示實施例中遮熱板相對於腔室的進行水平方向的定位狀態的示意圖。 Figure 1 is a schematic diagram illustrating the configuration of a silicon single crystal manufacturing apparatus according to an embodiment of the present invention. Figure 2 is a top view of a heat shield positioning jig, with (A) showing the heat shield positioning jig according to the aforementioned embodiment and (B) showing a heat shield positioning jig according to a modified embodiment. Figure 3 is a side view of the heat shield positioning jig according to the aforementioned embodiment, with (A) showing the entire heat shield positioning jig and (B) showing a portion of the heat shield positioning jig. Figure 4 is a schematic diagram illustrating the horizontal positioning of a heat shield relative to a chamber according to an embodiment.
1:矽單晶製造裝置 1: Silicon single crystal manufacturing equipment
2:遮熱板定位治具 2: Heat shield positioning fixture
14:保溫筒 14: Thermostatic tube
15:遮熱板 15:Heat shield
21:治具主體 21: Fixture body
22:治具用定位部 22: Positioning part for jig
23:第一遮熱板用定位部 23: Positioning portion for the first heat shield
111:主腔室 111:Main chamber
151:遮熱板主體 151: Heat shield body
152:被支持部 152: Supported Department
211:基部 211: Base
212:腕部 212: Wrist
212A:貫通孔/把持部 212A: Through hole/handle
213:把手/把持部 213: Handle/Grip
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-172240 | 2022-10-27 | ||
| JP2022172240A JP2024063994A (en) | 2022-10-27 | 2022-10-27 | Thermal shield positioning tool, thermal shield positioning method, and silicon single crystal manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202432906A TW202432906A (en) | 2024-08-16 |
| TWI898239B true TWI898239B (en) | 2025-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112127535A TWI898239B (en) | 2022-10-27 | 2023-07-24 | Heat shield positioning jig, heat shield positioning method and silicon single crystal manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2024063994A (en) |
| CN (1) | CN117947497A (en) |
| TW (1) | TWI898239B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW588127B (en) * | 2000-02-01 | 2004-05-21 | Komatsu Denshi Kinzoku Kk | Apparatus for pulling single crystal by CZ method |
| US20060090695A1 (en) * | 2004-11-04 | 2006-05-04 | Jyh-Chen Chen | Heat shield and crystal growth equipment |
| TW201109482A (en) * | 2009-09-08 | 2011-03-16 | Univ Shinshu | Equipment for growing sapphire single crystal |
| CN209456614U (en) * | 2018-12-24 | 2019-10-01 | 哈尔滨奥瑞德光电技术有限公司 | A kind of clamp structure of large size single crystal furnace heat screen |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2937109B2 (en) * | 1996-02-29 | 1999-08-23 | 住友金属工業株式会社 | Single crystal manufacturing apparatus and manufacturing method |
| JP4161804B2 (en) * | 2003-05-30 | 2008-10-08 | 株式会社Sumco | Heat shielding member of silicon single crystal pulling device |
-
2022
- 2022-10-27 JP JP2022172240A patent/JP2024063994A/en active Pending
-
2023
- 2023-07-24 TW TW112127535A patent/TWI898239B/en active
- 2023-10-26 CN CN202311405414.8A patent/CN117947497A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW588127B (en) * | 2000-02-01 | 2004-05-21 | Komatsu Denshi Kinzoku Kk | Apparatus for pulling single crystal by CZ method |
| US20060090695A1 (en) * | 2004-11-04 | 2006-05-04 | Jyh-Chen Chen | Heat shield and crystal growth equipment |
| TW201109482A (en) * | 2009-09-08 | 2011-03-16 | Univ Shinshu | Equipment for growing sapphire single crystal |
| CN209456614U (en) * | 2018-12-24 | 2019-10-01 | 哈尔滨奥瑞德光电技术有限公司 | A kind of clamp structure of large size single crystal furnace heat screen |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202432906A (en) | 2024-08-16 |
| JP2024063994A (en) | 2024-05-14 |
| CN117947497A (en) | 2024-04-30 |
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