TWI897745B - Electronic device and method of suppressing noise generated by buck ic - Google Patents

Abstract

An electronic device is configured for a buck IC to be disposed, and includes a machine body, a circuit board and a plurality of anti-noise capacitors. The circuit board is disposed on the machine body, and is configured for the buck IC to be disposed. The circuit board has a power plane. The power plane has a plurality of via portions. The anti-noise capacitors are disposed on at least one side of the power plane. At least a part of the anti-noise capacitors are located close to the via portions. At least another part of the anti-noise capacitors are located away from the via portions. The distance between any two adjacent anti-noise capacitors located away from the via portions is configured to be less than or equal to one-eighth of the wavelength of the noise generated by the buck IC.

Description

Electronic device and method for suppressing noise in buck-boost circuit

The present invention relates to an electronic device and a method for suppressing noise in a buck-boost circuit, and in particular to an electronic device equipped with an anti-noise capacitor and a method for suppressing noise in a buck-boost circuit.

In recent years, the design of circuit boards in electronic products has become increasingly complex to meet user needs. This has led to increasingly severe noise interference generated by the electronic components on the circuit boards, which in turn affects the operation of the electronic components.

Typically, manufacturers install noise-reducing absorbers on circuit boards. However, this additional absorber increases the manufacturing cost of electronic products and affects the circuit board's configuration. Therefore, effectively reducing the noise intensity generated by electronic components is a challenge that researchers must address.

The present invention provides an electronic device and a method for suppressing noise in a buck-boost circuit, thereby effectively reducing the noise intensity in the electronic device.

An electronic device disclosed in one embodiment of the present invention is configured for a buck-boost circuit and includes a housing, a circuit board, and a plurality of anti-noise capacitors. The circuit board is mounted on the housing and configured for the buck-boost circuit. The circuit board has a power supply layer. The power supply layer has a plurality of power supply through-layer portions. The anti-noise capacitors are disposed on at least one side of the power supply layer. At least some of the anti-noise capacitors are located near each of the power supply through-layer portions. At least another portion of the anti-noise capacitors is located away from each of the power supply through-layer portions. The distance between any two adjacent anti-noise capacitors located away from the power supply through-layers is designed to be less than or equal to one-eighth of the wavelength of the noise generated by the buck-boost circuit.

Another embodiment of the present invention discloses a method for suppressing noise in a buck-boost circuit, comprising disposing at least some of a plurality of anti-noise capacitors near a plurality of power-through-layer portions of a power layer of a circuit board and at least some of these anti-noise capacitors away from these power-through-layer portions. The distance between any two adjacent anti-noise capacitors located away from these power-through-layer portions is less than or equal to one-eighth the wavelength of the noise generated by the buck-boost circuit.

According to the electronic device and the method for suppressing noise in the buck-boost circuit of the above embodiment, at least part of the anti-noise capacitors are located near the power supply through-layer portions, at least another part of the anti-noise capacitors are located far from the power supply through-layer portions, and the distance between any two adjacent anti-noise capacitors located far from the power supply through-layer portions is, for example, less than This is equivalent to one-eighth the wavelength of the noise generated by the buck-boost circuit, effectively reducing the noise intensity in electronic devices. This prevents excessive manufacturing costs from excessively high anti-noise capacitors, poor anti-noise performance from insufficient anti-noise capacitors, and prevents short circuits or open circuits from occurring due to insufficient anti-noise capacitors.

The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention and provide further explanation of the scope of the patent application of the present invention.

Please refer to Figures 1 to 3. Figure 1 is a schematic plan view of an electronic device according to an embodiment of the present invention. Figure 2 is a line graph of the noise frequency of the electronic device of Figure 1. Figure 3 is a flow chart of a method for suppressing noise in a buck-boost circuit according to an embodiment of the present invention.

The electronic device 10 of this embodiment is used for providing a buck-boost circuit (not shown) and includes a body 11, a circuit board 12, and a plurality of anti-noise capacitors 13. The circuit board 12 is provided on the body 11, and one side of the circuit board 12 is used for providing the buck-boost circuit. The other side of the circuit board 12 has a power layer 121, but is not limited thereto. The power layer 121 has a plurality of power through-layer portions 1211. These power through-layer portions 1211 correspond to through-holes for the power source, memory, and universal serial bus (USB). The length L1 of the power layer 121 along the X-axis direction is, for example, 130 mm, and the length L2 of the power layer 121 along the Y-axis direction is, for example, 76 mm.

These anti-noise capacitors 13 are positioned at least partially on one side of the power layer 121 and at least partially on opposite sides of the power layer 121, depending on the placement of other electronic components on the circuit board 12. Similarly, the power layer 121 is also positioned at opposite ends, with one anti-noise capacitor 13 positioned at one end and two anti-noise capacitors 13 positioned at the other end. The high-impedance reflective properties of the anti-noise capacitors 13 reduce noise generated by the buck-boost circuit.

At least some of these anti-noise capacitors 13 are located near these power supply through-layer portions 1211, and at least another portion of these anti-noise capacitors 13 is located away from these power supply through-layer portions 1211. The distance between any two adjacent anti-noise capacitors 13 located away from these power supply through-layer portions 1211 is, for example, less than or equal to one-eighth of the wavelength of the noise generated by the buck-boost circuit. In this way, for example, within the noise frequency range of 734 to 741 MHz, the noise intensity can be reduced from -88.05 dBm to -94.03 dBm, and even to -97.72 dBm in some frequency bands.

For example, the noise frequency generated by the buck-boost circuit is selected to have a wavelength of 800 MHz. This means that the distance between any two adjacent anti-noise capacitors 13 located far from the power supply through-layer portions 1211 is less than or equal to 2 cm. Furthermore, the capacitance of these anti-noise capacitors 13 is selected to have a resonant frequency with the noise, such as 180 pF.

In this embodiment, at least part of the anti-noise capacitors 13 are located near the power through-layer portions 1211, and at least another part of the anti-noise capacitors 13 are located away from the power through-layer portions 1211. The distance between any two adjacent anti-noise capacitors 13 located away from the power through-layer portions 1211 is, for example, less than or equal to the step-up/step-down voltage. The wavelength of the noise generated by the circuit is one-eighth of that of the noise generated by the circuit, so the noise intensity in the electronic device 10 can be effectively reduced. The manufacturing cost of the electronic device 10 will not be too high due to the provision of too many anti-noise capacitors 13, nor will the anti-noise effect be poor due to the provision of too few anti-noise capacitors 13, nor will the circuit be short-circuited or open-circuited due to the provision of too few anti-noise capacitors 13.

In this embodiment, one side of the circuit board 12 is used for the buck-boost circuit, and the other side of the circuit board 12 has a power supply layer 121, but the present invention is not limited to this. In other embodiments, the buck-boost circuit and the power supply layer can also be provided on the same side of the circuit board according to the configuration of other electronic components of the circuit board.

In this embodiment, the anti-noise capacitors 13 are at least partially disposed on one side of the power layer 121, and at least partially disposed on two opposite sides of the power layer 121, but the present invention is not limited thereto. In other embodiments, depending on the configuration of other electronic components on the circuit board, the anti-noise capacitors may be disposed entirely on one side of the power layer, or on two opposite sides of the power layer.

In this embodiment, a single anti-noise capacitor 13 is provided at one end of the power layer 121, and a second anti-noise capacitor 13 is provided at the other end of the power layer 121, but this is not limiting. In other embodiments, depending on the configuration of other electronic components on the circuit board, a single anti-noise capacitor may be provided at both opposing ends of the power layer, or a second anti-noise capacitor may be provided at both opposing ends of the power layer.

In this embodiment, the capacitance value of these anti-noise capacitors 13 is 180 pF, but is not limited thereto. In other embodiments, an anti-noise capacitor with a capacitance value of 150 pF may be selected based on the resonance frequency of these anti-noise capacitors and the noise.

In this embodiment, the method for suppressing noise in a buck-boost circuit includes, but is not limited to, the following steps. First, as described in step S100, at least some of the plurality of anti-noise capacitors 13 are positioned near a plurality of power-through-layer portions 1211 of a power layer 121 of a circuit board 12. Next, as described in step S200, at least another portion of these anti-noise capacitors 13 are positioned away from these power-through-layer portions 1211. Steps S100 and S200 are not limited to the order described above. Furthermore, the distance between any two adjacent anti-noise capacitors 13 located far from the power supply through-layer portions 1211 is, for example, less than or equal to one eighth of the wavelength of the noise generated by a buck-boost circuit. This reduces the noise intensity generated by the buck-boost circuit.

According to the electronic device and the method for suppressing noise in the buck-boost circuit of the above embodiment, at least part of the anti-noise capacitors are located near the power supply through-layer portions, at least another part of the anti-noise capacitors are located far from the power supply through-layer portions, and the distance between any two adjacent anti-noise capacitors located far from the power supply through-layer portions is, for example, less than This is equivalent to one-eighth the wavelength of the noise generated by the buck-boost circuit, effectively reducing the noise intensity in electronic devices. This prevents excessive manufacturing costs from excessively high anti-noise capacitors, poor anti-noise performance from insufficient anti-noise capacitors, and prevents short circuits or open circuits from occurring due to insufficient anti-noise capacitors.

Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Anyone skilled in the art may make slight modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.

10: Electronic device 11: Frame 12: Circuit board 121: Power supply layer 1211: Power supply through-layer 13: Anti-noise capacitor L1, L2: Length S100, S200: Steps

Figure 1 is a schematic plan view of an electronic device according to an embodiment of the present invention. Figure 2 is a line graph of the noise intensity of the electronic device shown in Figure 1. Figure 3 is a flow chart of a method for suppressing noise in a buck-boost circuit according to an embodiment of the present invention.

10: Electronic devices

11: Body

12: Circuit board

121: Power supply layer

1211: Power supply through layer

13: Anti-noise capacitor

Claims (10)

An electronic device for mounting a buck-boost circuit comprises: a housing; a circuit board disposed within the housing and configured to mount the buck-boost circuit, the circuit board having a power supply layer having a plurality of power supply through-layer portions; and a plurality of anti-noise capacitors disposed on at least one side of the power supply layer, with at least some of the anti-noise capacitors being located proximate to the power supply through-layer portions, and at least some of the anti-noise capacitors being located distally from the power supply through-layer portions. Furthermore, the distance between any two adjacent anti-noise capacitors located distally from the power supply through-layer portions is configured to be less than or equal to one-eighth the wavelength of noise generated by the buck-boost circuit. The electronic device as described in claim 1, wherein at least one of the anti-noise capacitors is provided at each of the two opposite ends of the power layer. The electronic device as described in claim 1, wherein the capacitance value of the anti-noise capacitors is 180 pF. The electronic device as described in claim 1, wherein the capacitance value of the anti-noise capacitors is 150 pF. The electronic device as described in claim 1, wherein the distance between any two adjacent anti-noise capacitors located far away from the power supply through-layer portions is less than or equal to 2 centimeters. A method for suppressing noise in a buck-boost circuit comprises: Disposing at least some of a plurality of anti-noise capacitors near a plurality of power supply through-layer portions of a power supply layer of a circuit board; and disposing at least another portion of the anti-noise capacitors away from the power supply through-layer portions; wherein the distance between any two adjacent anti-noise capacitors located away from the power supply through-layer portions is less than or equal to one-eighth of the wavelength of the noise generated by the buck-boost circuit. The method for suppressing noise in a buck-boost circuit as described in claim 6, wherein at least one of the anti-noise capacitors is provided at each of the two opposite ends of the power layer. The method for suppressing noise in a buck-boost circuit as described in claim 6, wherein the capacitance of the anti-noise capacitors is 180 pF. The method for suppressing noise in a buck-boost circuit as described in claim 6, wherein the capacitance of the anti-noise capacitors is 150 pF. The method for suppressing noise in a buck-boost circuit as described in claim 6, wherein the distance between any two adjacent anti-noise capacitors located far away from the power supply through-layer portions is less than or equal to 2 centimeters.