TWI896915B - Ultrasonic detection device - Google Patents
Ultrasonic detection deviceInfo
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Abstract
Description
本發明係有關於超音波探測裝置,且特別有關於可進行短軸空間編碼的超音波探測裝置。 The present invention relates to an ultrasonic detection device, and more particularly to an ultrasonic detection device capable of performing short-axis spatial encoding.
超音波探測裝置(或稱為換能器)是對目標物體發射超音波訊號然後利用回波訊號評估目標物體的探測裝置,目前已廣泛地應用於醫學、工業、物聯網等各種領域中。超音波探測裝置根據其陣元(或稱為聲波產生單元)配置的不同,可分為許多類型,例如單陣元式(single-element)、二維陣列式(2D array)等。傳統的單陣元式超音波探測裝置需要使用馬達帶動,從而具有掃描時間長、馬達不易維護保養等缺點。而二維陣列式超音波探測裝置則包含排成二維陣列的多個陣元,但由於多個陣元需要分別接線以電性連接電路板,從而具有組裝複雜、體積大等缺點。 Ultrasonic detectors (or transducers) emit ultrasonic signals at a target object and then use the echo signals to evaluate the target object. They are currently widely used in various fields, including medicine, industry, and the Internet of Things. Ultrasonic detectors can be divided into various types, such as single-element and two-dimensional array, depending on the configuration of their array elements (or sound wave generating units). Traditional single-element ultrasonic detectors require a motor, which leads to long scanning times and difficult motor maintenance. Two-dimensional array ultrasonic detection devices consist of multiple array elements arranged in a two-dimensional array. However, because each array element needs to be individually wired to electrically connect to the circuit board, it has disadvantages such as complex assembly and large size.
因此,亟需提出一種新的超音波探測裝置,以改善上述問題。 Therefore, there is an urgent need to propose a new ultrasonic detection device to improve the above problems.
本揭露係有關於超音波探測裝置,其壓電層可沿著短軸方向輸出多個具有不同訊號波形的超音波訊號,以達成短軸空間編碼,從而改善前述問題。 This disclosure relates to an ultrasonic detection device whose piezoelectric layer can output multiple ultrasonic signals with different signal waveforms along the short-axis direction to achieve short-axis spatial encoding, thereby improving the aforementioned problems.
根據本發明之一方面,提供一種超音波探測裝置。超音波探測裝置包含匹配元件、背後層、配置於匹配元件與背後層之間的複數個壓電層、以及直接或間接電性連接複數個壓電層的控制器。複數個壓電層包含沿著第一方向配置於第一位置的第一壓電元件與配置於第二位置的第二壓電元件。匹配元件、複數個壓電層與背後層係沿著第二方向配置。複數個壓電層沿第三方向排列。第一方向、第二方向與第三方向彼此互相垂直。控制器用以至少驅動第一壓電元件使第一壓電元件輸出具有第一訊號波形的第一超音波訊號以及驅動第二壓電元件使第二壓電元件輸出具有第二訊號波形的第二超音波訊號中之一。第一訊號波形不同於第二訊號波形。 According to one aspect of the present invention, an ultrasonic detection device is provided. The ultrasonic detection device includes a matching element, a backing layer, a plurality of piezoelectric layers arranged between the matching element and the backing layer, and a controller directly or indirectly electrically connected to the plurality of piezoelectric layers. The plurality of piezoelectric layers include a first piezoelectric element arranged at a first position along a first direction and a second piezoelectric element arranged at a second position. The matching element, the plurality of piezoelectric layers and the backing layer are arranged along a second direction. The plurality of piezoelectric layers are arranged along a third direction. The first direction, the second direction and the third direction are perpendicular to each other. The controller is used to at least drive the first piezoelectric element so that the first piezoelectric element outputs one of a first ultrasonic signal having a first signal waveform and drive the second piezoelectric element so that the second piezoelectric element outputs one of a second ultrasonic signal having a second signal waveform. The first signal waveform is different from the second signal waveform.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to better understand the above and other aspects of the present invention, the following embodiments are specifically described in detail with reference to the accompanying drawings:
10,20,30,40:超音波探測裝置 10, 20, 30, 40: Ultrasonic detection device
101,102,402:匹配元件 101, 102, 402: Matching components
103,203,303,403:壓電結構 103, 203, 303, 403: Piezoelectric structure
104,204,404:背後層 104,204,404:Background layer
105:控制器 105: Controller
113,213,313:壓電層 113,213,313: Piezoelectric layer
181,182,183,281,282,283,381,382,383:訊號波形 181,182,183,281,282,283,381,382,383:Signal waveform
206:反射層 206: Reflective layer
401:透鏡 401: Lens
1131,1132,1133,2131,2132,2133,3131,3132,3133:壓電元件 1131, 1132, 1133, 2131, 2132, 2133, 3131, 3132, 3133: Piezoelectric components
D1,D2,D3:方向 D1, D2, D3: Direction
H1,H2,H3,H4,H5,H6:厚度 H1, H2, H3, H4, H5, H6: Thickness
P1,P2,P3:位置 P1, P2, P3: Location
S:介面 S: Interface
T1,T3:溝槽組合 T1, T3: Groove combination
T11~T17,T31~T37:溝槽 T11~T17, T31~T37: Grooves
第1A圖係繪示本發明之一實施例的超音波探測裝置在第三方向上的剖面示意圖; 第1B圖係繪示第1A圖之超音波探測裝置在第一方向上的剖面示意圖;第1C圖係繪示本發明之一實施例的訊號波形的示意圖;第2A圖係繪示本發明之第二實施例的超音波探測裝置在第三方向上的剖面示意圖;第2B圖係繪示第2A圖之超音波探測裝置在第一方向上的剖面示意圖;第2C圖係繪示本發明之一實施例的訊號波形的示意圖;第3A圖係繪示本發明之第三實施例的超音波探測裝置在第三方向上的剖面示意圖;第3B圖係繪示第3A圖之超音波探測裝置在第一方向上的剖面示意圖;第3C圖係繪示本發明之一實施例的訊號波形的示意圖;及第4圖係繪示本發明一實施例的超音波探測裝置的分解圖。 FIG1A is a schematic diagram illustrating a cross-section of an ultrasonic detection device according to one embodiment of the present invention in the third direction. FIG1B is a schematic diagram illustrating a cross-section of the ultrasonic detection device according to FIG1A in the first direction. FIG1C is a schematic diagram illustrating a signal waveform according to one embodiment of the present invention. FIG2A is a schematic diagram illustrating a cross-section of an ultrasonic detection device according to a second embodiment of the present invention in the third direction. FIG2B is a schematic diagram illustrating a cross-section of the ultrasonic detection device according to FIG2A in the first direction. FIG2C is a schematic diagram illustrating a signal waveform of an embodiment of the present invention; FIG3A is a schematic diagram illustrating a cross-sectional view of an ultrasonic detection device in a third direction according to a third embodiment of the present invention; FIG3B is a schematic diagram illustrating a cross-sectional view of the ultrasonic detection device in FIG3A in a first direction; FIG3C is a schematic diagram illustrating a signal waveform of an embodiment of the present invention; and FIG4 is an exploded view of an ultrasonic detection device in an embodiment of the present invention.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下。 In order to better understand the above and other aspects of the present invention, the following embodiments are specifically described below with reference to the accompanying drawings.
請參照第1A圖與第1B圖。第1A圖係繪示本發明之一實施例的超音波探測裝置10在第三方向D3上的剖面示意圖。第1B圖係繪示第1A圖之超音波探測裝置10在第一方向D1上的剖面示意圖。超音波探測裝置10包含匹配元件101、匹配元 件102、壓電結構103、背後層104與控制器105。匹配元件101、匹配元件102、壓電結構103與背後層104可沿著第二方向D2配置。匹配元件102介於匹配元件101與壓電結構103之間。壓電結構103介於匹配元件102與背後層104之間。在此實施例中,超音波探測裝置10繪示為包含兩個匹配元件(即匹配元件101與匹配元件102),但本發明不以此為限,超音波探測裝置可包含更多或更少的匹配元件。 Please refer to Figures 1A and 1B. Figure 1A is a schematic cross-sectional view of an ultrasonic detection device 10 according to one embodiment of the present invention, taken along a third direction D3. Figure 1B is a schematic cross-sectional view of the ultrasonic detection device 10 shown in Figure 1A, taken along a first direction D1. The ultrasonic detection device 10 includes a matching element 101, a matching element 102, a piezoelectric structure 103, a backing layer 104, and a controller 105. The matching element 101, the matching element 102, the piezoelectric structure 103, and the backing layer 104 can be arranged along a second direction D2. The matching element 102 is located between the matching element 101 and the piezoelectric structure 103. The piezoelectric structure 103 is located between the matching element 102 and the backing layer 104. In this embodiment, the ultrasonic detection device 10 is shown as including two matching elements (i.e., matching element 101 and matching element 102), but the present invention is not limited thereto. The ultrasonic detection device may include more or fewer matching elements.
壓電結構103可包含沿著第三方向D3排列的複數個壓電層113。複數個壓電層113配置於匹配元件101與背後層104之間。如第1B圖所示,每一壓電層113可沿著第一方向D1延伸。第一方向D1、第二方向D2與第三方向D3可彼此垂直。在一實施例中,超音波探測裝置10可包含長軸方向與短軸方向,長軸方向可例如與第三方向D3相同,短軸方向可與第一方向D1相同。壓電層113可包含複數個壓電元件,例如至少兩個壓電元件。複數個壓電元件可沿著第一方向D1配置,且分別配置於第一方向D1上的不同位置。例如,如第1B圖所示,壓電層113可包含沿著第一方向D1配置的壓電元件1131、壓電元件1132與壓電元件1133。壓電元件1131可配置於壓電層113中的位置P1。壓電元件1132可配置於壓電層113中的位置P2。壓電元件1133可配置於壓電層113中的位置P3。位置P1、位置P2與位置P3彼此不同。在此實施例中,位置P2可介於位置P1與位置P3之間。壓電元件1132可介於壓電元件1131與壓電元件1133 之間。在此實施例中,超音波探測裝置10繪示為包含三個壓電元件,但本發明不以此為限,超音波探測裝置可包含更多或更少的壓電元件。在一實施例中,沿著第三方向D3排列的複數個壓電層113之間可具有縫隙(縫隙內填入膠材或維持空氣縫隙)。在一實施例中,壓電元件1131可鄰接於壓電元件1132,壓電元件1132可鄰接於壓電元件1131與壓電元件1133之間。在一實施例中,壓電元件1131、壓電元件1132與壓電元件1133彼此之間可不包含填充膠材的縫隙或空氣縫隙。 The piezoelectric structure 103 may include a plurality of piezoelectric layers 113 arranged along a third direction D3. The plurality of piezoelectric layers 113 are disposed between the matching element 101 and the back layer 104. As shown in FIG1B , each piezoelectric layer 113 may extend along a first direction D1. The first direction D1, the second direction D2, and the third direction D3 may be perpendicular to each other. In one embodiment, the ultrasonic detection device 10 may include a long axis direction and a short axis direction, the long axis direction may be, for example, the same as the third direction D3, and the short axis direction may be the same as the first direction D1. The piezoelectric layer 113 may include a plurality of piezoelectric elements, for example, at least two piezoelectric elements. The plurality of piezoelectric elements may be disposed along the first direction D1 and respectively disposed at different positions on the first direction D1. For example, as shown in FIG. 1B , the piezoelectric layer 113 may include a piezoelectric element 1131, a piezoelectric element 1132, and a piezoelectric element 1133 arranged along a first direction D1. The piezoelectric element 1131 may be arranged at position P1 in the piezoelectric layer 113. The piezoelectric element 1132 may be arranged at position P2 in the piezoelectric layer 113. The piezoelectric element 1133 may be arranged at position P3 in the piezoelectric layer 113. Position P1, position P2, and position P3 are different from each other. In this embodiment, position P2 may be between position P1 and position P3. The piezoelectric element 1132 may be located between the piezoelectric element 1131 and the piezoelectric element 1133. In this embodiment, the ultrasonic detection device 10 is shown as including three piezoelectric elements, but the present invention is not limited thereto; the ultrasonic detection device may include more or fewer piezoelectric elements. In one embodiment, gaps (filled with glue or maintaining air gaps) may be provided between the plurality of piezoelectric layers 113 arranged along the third direction D3. In one embodiment, the piezoelectric element 1131 may be adjacent to the piezoelectric element 1132, and the piezoelectric element 1132 may be adjacent to the piezoelectric element 1131 and the piezoelectric element 1133. In one embodiment, the piezoelectric elements 1131, 1132, and 1133 may not include gaps filled with glue or air gaps between each other.
壓電元件1131、壓電元件1132與壓電元件1133在第二方向D2上可具有不同的厚度。厚度可代表壓電元件的上表面(例如是朝向背後層104的表面)與下表面(例如是朝向匹配元件102的表面)在第二方向D2上的距離。例如,如第1B圖所示,壓電元件1131在第二方向D2上具有厚度H1,壓電元件1132在第二方向D2上具有厚度H2,壓電元件1133在第二方向D2上具有厚度H3。壓電元件1131的厚度H1、壓電元件1132的厚度H2與壓電元件1133的厚度H3可彼此不同。在此實施例中,壓電元件1132的厚度H2大於壓電元件1131的厚度H1和壓電元件1133的厚度H3,壓電元件1131的厚度H1可大於壓電元件1133的厚度H3,但本發明不以此為限。壓電元件1131、壓電元件1132與壓電元件1133的厚度可以是階梯式的變化,也可以是漸變式的變化。 The piezoelectric element 1131, the piezoelectric element 1132, and the piezoelectric element 1133 may have different thicknesses in the second direction D2. The thickness may represent the distance between the upper surface (e.g., the surface facing the back layer 104) and the lower surface (e.g., the surface facing the matching element 102) of the piezoelectric element in the second direction D2. For example, as shown in FIG. 1B , the piezoelectric element 1131 has a thickness H1 in the second direction D2, the piezoelectric element 1132 has a thickness H2 in the second direction D2, and the piezoelectric element 1133 has a thickness H3 in the second direction D2. The thickness H1 of the piezoelectric element 1131, the thickness H2 of the piezoelectric element 1132, and the thickness H3 of the piezoelectric element 1133 may be different from each other. In this embodiment, the thickness H2 of the piezoelectric element 1132 is greater than the thickness H1 of the piezoelectric element 1131 and the thickness H3 of the piezoelectric element 1133. The thickness H1 of the piezoelectric element 1131 may be greater than the thickness H3 of the piezoelectric element 1133, but the present invention is not limited to this. The thicknesses of the piezoelectric elements 1131, 1132, and 1133 may vary in steps or gradients.
壓電元件可包含壓電材料,例如可包含鋯鈦酸鉛(Lead-Zirconate-Titanate;PZT)、PZT陶瓷、單晶鎂鈮酸鉛-鈦酸鉛(lead magnesium niobate-lead titanate;PMN-PT)、聚偏二氟乙烯(polyvinylidene fluoride;PVDF)、聚(偏二氟乙烯-共-三氟乙烯)(poly(vinylidenefluoride-co-trifluoroethylene);PVDF-TrFE)及其他PVDF共聚物中的一或多者。壓電元件可透過施加外力(壓力)產生電壓(壓電效應)或透過施加電壓產生變形(逆壓電效應)。另外,壓電元件亦可包含微機械超聲換能器(Micromachined Ultrasonic Transducer;MUT),壓電元件1131、壓電元件1132與壓電元件1133可利用不同厚度、長度或寬度的薄板振動、不同驅動的電壓訊號或如本發明所述之其他方式,使壓電元件1131、壓電元件1132與壓電元件1133輸出不同的訊號波形。 Piezoelectric devices may include piezoelectric materials, such as one or more of lead-zirconate-titanate (PZT), PZT ceramics, single-crystalline lead magnesium niobate-lead titanate (PMN-PT), polyvinylidene fluoride (PVDF), poly(vinylidenefluoride-co-trifluoroethylene) (PVDF-TrFE), and other PVDF copolymers. Piezoelectric devices can generate voltage (piezoelectric effect) or deformation (inverse piezoelectric effect) by applying an external force (pressure). Additionally, the piezoelectric element may also include a micromachined ultrasonic transducer (MUT). Piezoelectric element 1131, piezoelectric element 1132, and piezoelectric element 1133 can utilize the vibration of thin plates of varying thickness, length, or width, different driving voltage signals, or other methods as described in the present invention to cause piezoelectric element 1131, piezoelectric element 1132, and piezoelectric element 1133 to output different signal waveforms.
控制器105直接或間接電性連接複數個壓電層113,可用以驅動一或多個壓電元件輸出超音波訊號。控制器105可對壓電元件施加電壓,讓壓電元件產生高頻率振動以對目標物體輸出超音波訊號;壓電元件亦可接收自目標物體反射及/或散射之超音波訊號,以產生目標超音波影像。控制器105可用以執行以下動作(a)至動作(c)中的至少一者:(a)驅動壓電元件1131,使壓電元件1131輸出具有訊號波形的超音波訊號;(b)驅動壓電元件1132,使壓電元件1132輸出具有訊號波形的超音波訊號;(c)驅動壓電元件1133,使壓電元件1133輸出具有訊號波形的 超音波訊號。控制器105可用以執行動作(a)至動作(c)中的一或多種,亦即是驅動壓電元件1131、壓電元件1132與壓電元件1133中的一或多個。在一實施例中,控制器105可同時驅動多個壓電元件,或可具有時間間隔地驅動多個壓電元件。由於壓電元件1131的厚度H1、壓電元件1132的厚度H2與第壓電元件1133的厚度H3彼此不同,壓電元件1131輸出的超音波訊號的訊號波形、壓電元件1132輸出的超音波訊號的訊號波形、以及壓電元件1133輸出的超音波訊號的訊號波形彼此不同。超音波訊號的訊號波形不同可以是頻率不同、週期不同、波形大小不同或波形組成不同等。換言之,本發明之壓電層113可沿著短軸方向輸出多個具有不同訊號波形的超音波訊號,且多個具有不同訊號波形的超音波訊號來自壓電層113的不同位置,藉此達成短軸空間編碼的效果。在一實施例中,如第1C圖所示,壓電元件1131輸出的超音波訊號的訊號波形可以是訊號波形181,壓電元件1132輸出的超音波訊號的訊號波形可以是訊號波形182,壓電元件1133輸出的超音波訊號的訊號波形可以是訊號波形183。 The controller 105 is directly or indirectly electrically connected to the plurality of piezoelectric layers 113 and can be used to drive one or more piezoelectric elements to output ultrasonic signals. The controller 105 applies voltage to the piezoelectric elements, causing them to vibrate at a high frequency to output ultrasonic signals to the target object. The piezoelectric elements can also receive ultrasonic signals reflected and/or scattered from the target object to produce an ultrasonic image of the target. Controller 105 can be used to perform at least one of the following actions (a) through (c): (a) driving piezoelectric element 1131 so that piezoelectric element 1131 outputs an ultrasonic signal having a signal waveform; (b) driving piezoelectric element 1132 so that piezoelectric element 1132 outputs an ultrasonic signal having a signal waveform; (c) driving piezoelectric element 1133 so that piezoelectric element 1133 outputs an ultrasonic signal having a signal waveform. Controller 105 can be used to perform one or more of actions (a) through (c), that is, to drive one or more of piezoelectric element 1131, piezoelectric element 1132, and piezoelectric element 1133. In one embodiment, the controller 105 can drive multiple piezoelectric elements simultaneously or with time intervals. Because the thickness H1 of the piezoelectric element 1131, the thickness H2 of the piezoelectric element 1132, and the thickness H3 of the piezoelectric element 1133 are different, the ultrasonic signal waveforms output by the piezoelectric element 1131, the ultrasonic signal waveforms output by the piezoelectric element 1132, and the ultrasonic signal waveforms output by the piezoelectric element 1133 are different. The different ultrasonic signal waveforms can be caused by different frequencies, different periods, different waveform sizes, or different waveform compositions. In other words, the piezoelectric layer 113 of the present invention can output multiple ultrasonic signals with different waveforms along the short-axis direction, and these multiple ultrasonic signals with different waveforms originate from different locations within the piezoelectric layer 113, thereby achieving a short-axis spatial encoding effect. In one embodiment, as shown in FIG1C , the ultrasonic signal output by piezoelectric element 1131 may have a waveform 181, the ultrasonic signal output by piezoelectric element 1132 may have a waveform 182, and the ultrasonic signal output by piezoelectric element 1133 may have a waveform 183.
請參照第2A圖與第2B圖。第2A圖係繪示本發明之另一實施例的超音波探測裝置20在第三方向D3上的剖面示意圖。第2B圖係繪示第2A圖之超音波探測裝置20在第一方向D1上的剖面示意圖。第2A-2B圖之超音波探測裝置20和第1A-1B圖之超音波探測裝置10的不同之處說明如下。超音波探測裝置20還包含配置於背後層204上的反射層206。背後層204 可在第二方向D2上介於反射層206與壓電結構203之間。壓電結構203可包含沿著第三方向D3排列的複數個壓電層213。如第2B圖所示,每一壓電層213可沿著第一方向D1延伸。壓電層213可包含沿著第一方向D1配置且分別配置於第一方向D1上的不同位置的複數個壓電元件,例如至少兩個壓電元件。例如,壓電層213可包含沿著第一方向D1配置的壓電元件2131、壓電元件2132與壓電元件2133。壓電元件2131可配置於壓電層213中的位置P1。壓電元件2132可配置於壓電層213中的位置P2。壓電元件2133可配置於壓電層213中的位置P3。位置P1、位置P2與位置P3彼此不同。位置P2可介於位置P1與位置P3之間。壓電元件2132可介於壓電元件2131與壓電元件2133之間。在一實施例中,壓電元件2131可鄰接於壓電元件2132,壓電元件2132可鄰接於壓電元件2131與壓電元件2133之間。在一實施例中,壓電元件2131、壓電元件2132與壓電元件2133彼此之間可不包含填充膠材的縫隙或空氣縫隙。壓電層213的壓電元件2131、壓電元件2132與壓電元件2133在第二方向D2上可具有相同的厚度。 Please refer to Figures 2A and 2B. Figure 2A is a schematic cross-sectional view of an ultrasonic detection device 20 according to another embodiment of the present invention, taken along the third direction D3. Figure 2B is a schematic cross-sectional view of the ultrasonic detection device 20 of Figure 2A, taken along the first direction D1. The differences between the ultrasonic detection device 20 of Figures 2A-2B and the ultrasonic detection device 10 of Figures 1A-1B are described below. The ultrasonic detection device 20 further includes a reflective layer 206 disposed on the backing layer 204. The backing layer 204 may be positioned between the reflective layer 206 and the piezoelectric structure 203 in the second direction D2. The piezoelectric structure 203 may include a plurality of piezoelectric layers 213 arranged along the third direction D3. As shown in FIG. 2B , each piezoelectric layer 213 may extend along a first direction D1. The piezoelectric layer 213 may include a plurality of piezoelectric elements, such as at least two piezoelectric elements, arranged along the first direction D1 and at different positions in the first direction D1. For example, the piezoelectric layer 213 may include a piezoelectric element 2131, a piezoelectric element 2132, and a piezoelectric element 2133 arranged along the first direction D1. The piezoelectric element 2131 may be arranged at position P1 in the piezoelectric layer 213. The piezoelectric element 2132 may be arranged at position P2 in the piezoelectric layer 213. The piezoelectric element 2133 may be arranged at position P3 in the piezoelectric layer 213. Position P1, position P2, and position P3 are different from each other. Position P2 may be between positions P1 and P3. Piezoelectric element 2132 may be located between piezoelectric element 2131 and piezoelectric element 2133. In one embodiment, piezoelectric element 2131 may be adjacent to piezoelectric element 2132, and piezoelectric element 2132 may be adjacent to piezoelectric element 2131 and piezoelectric element 2133. In one embodiment, no gaps filled with adhesive or air may exist between piezoelectric element 2131, piezoelectric element 2132, and piezoelectric element 2133. The piezoelectric element 2131, piezoelectric element 2132, and piezoelectric element 2133 of the piezoelectric layer 213 may have the same thickness in the second direction D2.
背後層204可具有變化的厚度。背後層204在對應位置P1的部分在第二方向D2上具有厚度H4,背後層204在對應位置P2的部分在第二方向D2上具有厚度H5,背後層204在對應位置P3的部分在第二方向D2上具有厚度H6,厚度H4、厚度H5與厚度H6可彼此不同。背後層204的厚度可以是階梯式 的變化,也可以是漸變式的變化。反射層206和背後層204包含不同材料。反射層206具有第一聲反射係數,背後層204具有第二聲反射係數,反射層206的第一聲反射係數可大於背後層204的第二聲反射係數。反射層206和背後層204包含不同材料使反射層206和背後層204之間可具有介面S。壓電元件2131和介面S之間具有一第一距離(可大致等於厚度H4),壓電元件2132和介面S之間具有一第二距離(可大致等於厚度H5),壓電元件2133和介面S之間具有一第三距離(可大致等於厚度H6),第一距離、第二距離與第三距離可彼此不同。 The back layer 204 may have varying thicknesses. The portion of the back layer 204 corresponding to position P1 has a thickness H4 in the second direction D2. The portion of the back layer 204 corresponding to position P2 has a thickness H5 in the second direction D2. The portion of the back layer 204 corresponding to position P3 has a thickness H6 in the second direction D2. Thicknesses H4, H5, and H6 may differ from each other. The thickness of the back layer 204 may vary in a stepwise or gradient manner. The reflective layer 206 and the back layer 204 are made of different materials. The reflective layer 206 has a first acoustic reflection coefficient, and the back layer 204 has a second acoustic reflection coefficient. The first acoustic reflection coefficient of the reflective layer 206 may be greater than the second acoustic reflection coefficient of the back layer 204. The reflective layer 206 and the backing layer 204 are made of different materials, creating an interface S between the reflective layer 206 and the backing layer 204. There is a first distance between the piezoelectric element 2131 and the interface S (which may be approximately equal to thickness H4), a second distance between the piezoelectric element 2132 and the interface S (which may be approximately equal to thickness H5), and a third distance between the piezoelectric element 2133 and the interface S (which may be approximately equal to thickness H6). The first, second, and third distances may be different.
控制器105可用以執行以下動作(a)至動作(c)中的至少一者:(a)驅動壓電元件2131,使壓電元件2131輸出具有訊號波形的超音波訊號;(b)驅動壓電元件2132,使壓電元件2132輸出具有訊號波形的超音波訊號;(c)驅動壓電元件2133,使壓電元件2133輸出具有訊號波形的超音波訊號。在此實施例中,控制器105驅動壓電元件2131使壓電元件2131朝向目標物體(例如朝向負的第二方向D2,或朝向匹配元件101和102)發射前超音波訊號,並使壓電元件2131朝向反射層206和背後層204(或朝向正的第二方向D2)發射的後超音波訊號,後超音波訊號會在介面S發生反射及/或折射而轉變為朝向目標物體的方向行進,轉向後的後超音波訊號和前超音波訊號發生干涉以形成具有訊號波形的超音波訊號。壓電元件2132輸出的超音波訊號與壓電元件2133輸出的超音波訊號的形成方式亦類似壓電元件2131的超音 波訊號的形成方式。在一實施例中,轉向後的後超音波訊號和前超音波訊號發生的干涉會在前超音波訊號抵達目標物體之前發生。由於壓電元件2131和介面S之間的第一距離、壓電元件2132和介面S之間的第二距離、壓電元件2133和介面S之間的第三距離彼此不同,壓電元件2131輸出的超音波訊號的訊號波形、壓電元件2132輸出的超音波訊號的訊號波形、以及壓電元件2133輸出的超音波訊號的訊號波形彼此不同。換言之,本發明之壓電層213可沿著短軸方向輸出多個具有不同訊號波形的超音波訊號,且多個具有不同訊號波形的超音波訊號來自壓電層213的不同位置,藉此達成短軸空間編碼的效果。 The controller 105 can be used to perform at least one of the following actions (a) to (c): (a) driving the piezoelectric element 2131 so that the piezoelectric element 2131 outputs an ultrasonic signal having a signal waveform; (b) driving the piezoelectric element 2132 so that the piezoelectric element 2132 outputs an ultrasonic signal having a signal waveform; (c) driving the piezoelectric element 2133 so that the piezoelectric element 2133 outputs an ultrasonic signal having a signal waveform. In this embodiment, controller 105 drives piezoelectric element 2131 to emit a front ultrasonic signal toward the target object (e.g., in the negative second direction D2, or toward matching elements 101 and 102). It also emits a rear ultrasonic signal toward reflective layer 206 and back layer 204 (or in the positive second direction D2). The rear ultrasonic signal is reflected and/or refracted at interface S, redirected toward the target object. The redirected rear ultrasonic signal interferes with the front ultrasonic signal to form an ultrasonic signal having a signal waveform. The ultrasonic signals output by piezoelectric element 2132 and piezoelectric element 2133 are generated in a manner similar to that of the ultrasonic signal generated by piezoelectric element 2131. In one embodiment, interference between the redirected rear ultrasonic signal and the front ultrasonic signal occurs before the front ultrasonic signal reaches the target object. Because the first distance between the piezoelectric element 2131 and the interface S, the second distance between the piezoelectric element 2132 and the interface S, and the third distance between the piezoelectric element 2133 and the interface S are different, the ultrasonic signal waveforms output by the piezoelectric element 2131, the ultrasonic signal waveforms output by the piezoelectric element 2132, and the ultrasonic signal waveforms output by the piezoelectric element 2133 are different. In other words, the piezoelectric layer 213 of the present invention can output multiple ultrasonic signals with different signal waveforms along the short-axis direction, and the multiple ultrasonic signals with different signal waveforms come from different positions of the piezoelectric layer 213, thereby achieving the effect of short-axis spatial encoding.
控制器105可用以執行動作(a)至動作(c)中的一或多種,亦即是驅動壓電元件2131、壓電元件2132與壓電元件2133中的一或多個。在一實施例中,控制器105可同時驅動多個壓電元件,或可具有時間間隔地驅動多個壓電元件。在一實施例中,如第2C圖所示,壓電元件2131輸出的超音波訊號的訊號波形可以是訊號波形281,壓電元件2132輸出的超音波訊號的訊號波形可以是訊號波形282,壓電元件2133輸出的超音波訊號的訊號波形可以是訊號波形283。 The controller 105 can be used to perform one or more of actions (a) to (c), namely, driving one or more of the piezoelectric element 2131, the piezoelectric element 2132, and the piezoelectric element 2133. In one embodiment, the controller 105 can drive multiple piezoelectric elements simultaneously or with time intervals. In one embodiment, as shown in FIG. 2C , the ultrasonic signal output by the piezoelectric element 2131 can have a waveform of signal 281, the ultrasonic signal output by the piezoelectric element 2132 can have a waveform of signal 282, and the ultrasonic signal output by the piezoelectric element 2133 can have a waveform of signal 283.
請參照第3A圖與第3B圖。第3A圖係繪示本發明之又一實施例的超音波探測裝置30在第三方向D3上的剖面示意圖。第3B圖係繪示第3A圖之超音波探測裝置30在第一方向 D1上的剖面示意圖。第3A-3B圖之超音波探測裝置30和第1A-1B圖之超音波探測裝置10的不同之處說明如下。 Please refer to Figures 3A and 3B. Figure 3A is a schematic cross-sectional view of an ultrasonic detection device 30 according to another embodiment of the present invention, taken along a third direction D3. Figure 3B is a schematic cross-sectional view of the ultrasonic detection device 30 of Figure 3A taken along a first direction D1. The differences between the ultrasonic detection device 30 of Figures 3A-3B and the ultrasonic detection device 10 of Figures 1A-1B are described below.
壓電結構303可包含沿著第三方向D3排列的複數個壓電層313。每一壓電層313可沿著第一方向D1延伸。壓電層313可包含沿著第一方向D1配置且分別配置於第一方向D1上的不同位置的複數個壓電元件,例如至少兩個壓電元件。例如,如第3B圖所示,壓電層313可包含沿著第一方向D1配置的壓電元件3131、壓電元件3132與壓電元件3133。壓電元件3131可配置於壓電層313中的位置P1。壓電元件3132可配置於壓電層313中的位置P2。壓電元件3133可配置於壓電層313中的位置P3。位置P1、位置P2與位置P3彼此不同。位置P2可介於位置P1與位置P3之間。壓電元件3132可介於壓電元件3131與壓電元件3133之間。壓電層313的壓電元件3131、壓電元件3132與壓電元件3133在第二方向D2上可具有相同的厚度。 The piezoelectric structure 303 may include a plurality of piezoelectric layers 313 arranged along a third direction D3. Each piezoelectric layer 313 may extend along a first direction D1. The piezoelectric layer 313 may include a plurality of piezoelectric elements, such as at least two piezoelectric elements, arranged along the first direction D1 and at different positions in the first direction D1. For example, as shown in FIG. 3B , the piezoelectric layer 313 may include a piezoelectric element 3131, a piezoelectric element 3132, and a piezoelectric element 3133 arranged along the first direction D1. The piezoelectric element 3131 may be arranged at position P1 in the piezoelectric layer 313. The piezoelectric element 3132 may be arranged at position P2 in the piezoelectric layer 313. The piezoelectric element 3133 may be disposed at position P3 in the piezoelectric layer 313. Positions P1, P2, and P3 are different from each other. Position P2 may be between position P1 and position P3. The piezoelectric element 3132 may be located between the piezoelectric element 3131 and the piezoelectric element 3133. The piezoelectric element 3131, the piezoelectric element 3132, and the piezoelectric element 3133 of the piezoelectric layer 313 may have the same thickness in the second direction D2.
壓電層313的多個壓電元件可包含沿著第二方向D2延伸的溝槽組合,或者可不包含溝槽。溝槽組合包含沿著第二方向D2延伸的一或多個溝槽。舉例而言,如第3B圖所示,壓電元件3131包含沿著第二方向D2延伸的溝槽組合T1,壓電元件3133包含沿著第二方向延伸D2的溝槽組合T3,壓電元件3132可不包含溝槽。在一實施例中,沿著第三方向D3排列的複數個壓電層313之間可具有縫隙(縫隙內填入膠材或維持空氣縫隙)。 The multiple piezoelectric elements of the piezoelectric layer 313 may or may not include trenches. The trench combination includes one or more trenches extending along the second direction D2. For example, as shown in Figure 3B , piezoelectric element 3131 includes trench combination T1 extending along the second direction D2, piezoelectric element 3133 includes trench combination T3 extending along the second direction D2, and piezoelectric element 3132 may not include trenches. In one embodiment, gaps (filled with glue or maintaining air gaps) may be provided between the multiple piezoelectric layers 313 arranged along the third direction D3.
壓電元件3131的溝槽組合T1可包含從壓電元件3131的上表面沿著第二方向D2向下延伸的一或多個溝槽T11~T17。溝槽T11~T17可沿著第一方向D1彼此間隔地配置。在此實施例中,溝槽T11~T17可沿著正的第一方向D1彼此間隔地依序配置。溝槽T11~T17可具有在第二方向D2上的深度。溝槽T11~T17的深度可彼此相同或彼此不同,或者溝槽T11~T17中的一部分溝槽的深度可彼此相同(且其他部分溝槽的深度可彼此相同或不同)。例如,如第3B圖所示,溝槽組合T1中的溝槽T12、T13、T14、T15的深度彼此相同,溝槽T11、T16的深度彼此相同,溝槽T12、T13、T14、T15的深度不同於溝槽T11、T16的深度,溝槽T17的深度不同於溝槽T11~T16的深度,溝槽T11的深度可大於溝槽T12的深度。溝槽T11~T17的深度可大於零且小於等於壓電元件3131在第二方向D2上的厚度。在一實施例中,當溝槽的深度大於零且小於壓電元件3131在第二方向D2上的厚度時,表示壓電元件3131未完全切斷,溝槽兩側的壓電元件可共用電極或接線。在一實施例中,當溝槽的深度等於壓電元件3131在第二方向D2上的厚度時,可在溝槽兩側額外配置電極或接線以確保電性連接。在一實施例中,可在溝槽T11~T17中填充膠材或維持空氣縫隙。 The trench assembly T1 of the piezoelectric element 3131 may include one or more trenches T11-T17 extending downward from the upper surface of the piezoelectric element 3131 along the second direction D2. The trenches T11-T17 may be spaced apart from one another along the first direction D1. In this embodiment, the trenches T11-T17 may be spaced apart from one another and arranged sequentially along the positive first direction D1. The trenches T11-T17 may have a depth in the second direction D2. The depths of the trenches T11-T17 may be the same or different, or the depths of some of the trenches T11-T17 may be the same (and the depths of other trenches may be the same or different). For example, as shown in FIG3B , the depths of trenches T12, T13, T14, and T15 in trench assembly T1 are the same, the depths of trenches T11 and T16 are the same, the depths of trenches T12, T13, T14, and T15 are different from the depths of trenches T11 and T16, and the depth of trench T17 is different from the depths of trenches T11-T16. The depth of trench T11 may be greater than the depth of trench T12. The depths of trenches T11-T17 may be greater than zero and less than or equal to the thickness of the piezoelectric element 3131 in the second direction D2. In one embodiment, when the trench depth is greater than zero and less than the thickness of the piezoelectric element 3131 in the second direction D2, the piezoelectric element 3131 is not completely severed, and the piezoelectric elements on both sides of the trench can share electrodes or wiring. In one embodiment, when the trench depth is equal to the thickness of the piezoelectric element 3131 in the second direction D2, additional electrodes or wiring can be placed on both sides of the trench to ensure electrical connection. In one embodiment, trenches T11-T17 can be filled with glue or maintain air gaps.
溝槽T11~T17中的相鄰二者可具有在第一方向D1上的間距。多個間距可彼此相同(亦即溝槽T11~T17等距分布)或彼此不同,或者多個間距中的一部分間距可彼此相同(且 其他部分間距可彼此相同或不同)。例如,如第3B圖所示,溝槽T13和溝槽T14之間的間距可大於溝槽T11和溝槽T12之間的間距,溝槽T11和溝槽T12之間的間距可大於溝槽T15和溝槽T16之間的間距。 Adjacent trenches T11-T17 may have a spacing in the first direction D1. The spacings may be the same (i.e., trenches T11-T17 are equally spaced) or different, or some of the spacings may be the same (and others may be the same or different). For example, as shown in FIG3B , the spacing between trenches T13 and T14 may be greater than the spacing between trenches T11 and T12, and the spacing between trenches T11 and T12 may be greater than the spacing between trenches T15 and T16.
壓電元件3133的溝槽組合T3可包含從壓電元件3133的上表面沿著第二方向D2向下延伸的一或多個溝槽T31~T37彼此間隔地配置。溝槽T31~T37可沿著第一方向D1彼此間隔地配置。在此實施例中,溝槽T37、T31~T36可沿著正的第一方向D1彼此間隔地依序配置。溝槽T31~T37可具有在第二方向D2上的深度。溝槽T31~T37的深度可彼此相同或彼此不同,或者溝槽T31~T37中的一部分溝槽的深度可彼此相同(且其他部分溝槽的深度可彼此相同或不同)。例如,如第3B圖所示,溝槽組合T3中的溝槽T31、T32、T34、T35的深度彼此相同,溝槽T33、T36的深度彼此相同,溝槽T31、T32、T34、T35的深度不同於溝槽T33、T36的深度,溝槽T37的深度不同於溝槽T31~T36的深度,溝槽T32的深度可小於溝槽T33的深度。溝槽T31、T32、T34、T35的深度可小於溝槽組合T1之溝槽T11~T17的深度。溝槽T31~T37的深度可大於零且小於等於壓電元件3133在第二方向D2上的厚度。在一實施例中,當溝槽的深度大於零且小於壓電元件3133在第二方向D2上的厚度時,表示壓電元件3133未完全切斷,溝槽兩側的壓電元件可共用電極或接線。在一實施例中,當溝槽的深度等於壓電元件3133在第二方 向D2上的厚度時,可在溝槽兩側額外配置電極或接線以確保電性連接。在一實施例中,可在溝槽T31~T37中填充膠材或維持空氣縫隙。 The trench assembly T3 of the piezoelectric element 3133 may include one or more trenches T31-T37 extending downward from the upper surface of the piezoelectric element 3133 along the second direction D2, spaced apart from each other. The trenches T31-T37 may be spaced apart from each other along the first direction D1. In this embodiment, trenches T37 and T31-T36 may be spaced apart from each other in sequence along the positive first direction D1. The trenches T31-T37 may have a depth in the second direction D2. The depths of the trenches T31-T37 may be the same or different, or the depths of some of the trenches T31-T37 may be the same (while the depths of other trenches may be the same or different). For example, as shown in FIG3B , the depths of trenches T31, T32, T34, and T35 in trench assembly T3 are the same, while the depths of trenches T33 and T36 are the same. The depths of trenches T31, T32, T34, and T35 are different from the depths of trenches T33 and T36. The depth of trench T37 is different from the depths of trenches T31-T36. The depth of trench T32 may be less than the depth of trench T33. The depths of trenches T31, T32, T34, and T35 may be less than the depths of trenches T11-T17 in trench assembly T1. The depths of trenches T31-T37 may be greater than zero and less than or equal to the thickness of the piezoelectric element 3133 in the second direction D2. In one embodiment, when the trench depth is greater than zero and less than the thickness of the piezoelectric element 3133 in the second direction D2, the piezoelectric element 3133 is not completely severed, and the piezoelectric elements on both sides of the trench can share electrodes or wiring. In one embodiment, when the trench depth is equal to the thickness of the piezoelectric element 3133 in the second direction D2, additional electrodes or wiring can be placed on both sides of the trench to ensure electrical connection. In one embodiment, the trenches T31-T37 can be filled with glue or maintain air gaps.
溝槽T31~T37中的相鄰二者可具有在第一方向D1上的間距。多個間距可彼此相同(亦即溝槽T31~T37等距分布)或彼此不同,或者多個間距中的一部分間距可彼此相同(且其他部分間距可彼此相同或不同)。例如,如第3B圖所示,溝槽T31~T37可大致以相同間距分布。溝槽組合T1之溝槽T13與溝槽T14之間的間距可大於溝槽組合T3之溝槽T32與溝槽T33之間的間距。 Adjacent trenches T31-T37 may be spaced apart in the first direction D1. The spacings may be the same (i.e., trenches T31-T37 are equally spaced) or different, or some of the spacings may be the same (and others may be the same or different). For example, as shown in FIG3B , trenches T31-T37 may be spaced approximately the same. The spacing between trenches T13 and T14 in trench combination T1 may be greater than the spacing between trenches T32 and T33 in trench combination T3.
在此實施例中,藉由使壓電元件3131、壓電元件3132與壓電元件3133中的溝槽組合彼此不同,以使壓電元件3131、壓電元件3132與壓電元件3133被控制器105驅動而輸出的超音波訊號的訊號波形彼此不同。溝槽組合不同可代表溝槽組合包含的溝槽的形式及/或分布方式不同。例如,溝槽組合不同可代表多個溝槽組合各自包含的溝槽數量不同(例如第3B圖中的壓電元件3131與壓電元件3132各自包含的溝槽數量不同);或者溝槽組合不同可代表多個溝槽組合各自包含的溝槽深度不同(例如第3B圖中的壓電元件3131中的溝槽T12在第二方向D2上的深度不同於壓電元件3133中的溝槽T31在第二方向D2上的深度,壓電元件3132則不包含溝槽);或者溝槽組合不同可代表多個溝槽組合各自包含的溝槽深度排列順序不同,例如一溝槽組 合可包含沿著正的第一方向D1配置深度由大到小的溝槽,另一溝槽組合可包含沿著正的第一方向D1配置深度由小到大的溝槽(例如第3B圖中的壓電元件3131包含沿著正的第一方向D1配置的溝槽T11與溝槽T12,溝槽T11在第二方向D2上的深度大於溝槽T12在第二方向D2上的深度,壓電元件3133包含沿著正的第一方向D1配置的溝槽T32與溝槽T33,溝槽T32在第二方向D2上的深度小於溝槽T33在第二方向D2上的深度);或者溝槽組合不同可代表多個溝槽組合各自包含的溝槽間距不同(例如第3B圖中的壓電元件3131中的溝槽T13與溝槽T14之間的間距不同於壓電元件3133中的溝槽T31與溝槽T32之間的間距)等,皆可改變壓電元件輸出的超音波訊號的訊號波形。第3B圖是舉例說明其中一種溝槽組合不同的態樣,但本發明不以此為限,溝槽組合中的溝槽的形式及/或分布方式可以有更多的態樣。換言之,本發明之壓電層313可沿著短軸方向輸出多個具有不同訊號波形的超音波訊號,且多個具有不同訊號波形的超音波訊號來自壓電層313的不同位置,藉此達成短軸空間編碼的效果。 In this embodiment, the piezoelectric element 3131, the piezoelectric element 3132, and the piezoelectric element 3133 have different groove combinations, so that the ultrasonic signals output by the piezoelectric element 3131, the piezoelectric element 3132, and the piezoelectric element 3133 when driven by the controller 105 have different waveforms. The different groove combinations may mean that the grooves included in the groove combinations are different in form and/or distribution. For example, different trench combinations may mean that the number of trenches included in each of the plurality of trench combinations is different (for example, the number of trenches included in the piezoelectric element 3131 and the number of trenches included in the piezoelectric element 3132 in FIG. 3B is different); or different trench combinations may mean that the depth of the trenches included in each of the plurality of trench combinations is different (for example, the depth of the trench T12 in the piezoelectric element 3131 in FIG. 3B in the second direction D2 is different from that of the piezoelectric element 3132 in FIG. 3B). The depth of the trench T31 in the piezoelectric element 3133 in the second direction D2, while the piezoelectric element 3132 does not include a trench); or the different trench combinations may mean that the trench depths in the multiple trench combinations are arranged in a different order. For example, one trench combination may include trenches arranged in descending order of depth along the positive first direction D1, while another trench combination may include trenches arranged in descending order of depth along the positive first direction D1. The piezoelectric element 3131 in FIG. 3B includes a trench T11 and a trench T12 arranged along the positive first direction D1, wherein the depth of the trench T11 in the second direction D2 is greater than the depth of the trench T12 in the second direction D2, and the piezoelectric element 3133 includes a trench T32 and a trench T33 arranged along the positive first direction D1, wherein the depth of the trench T32 in the second direction D2 is less than The depth of trench T33 in the second direction D2); or different trench combinations can mean that the trench spacings within each of the multiple trench combinations are different (for example, the spacing between trenches T13 and T14 in piezoelectric element 3131 in FIG. 3B is different from the spacing between trenches T31 and T32 in piezoelectric element 3133). All of these can change the waveform of the ultrasonic signal output by the piezoelectric element. FIG. 3B illustrates one example of different trench combinations, but the present invention is not limited thereto. The form and/or distribution of the trenches in a trench combination can vary greatly. In other words, the piezoelectric layer 313 of the present invention can output multiple ultrasonic signals with different signal waveforms along the short-axis direction, and the multiple ultrasonic signals with different signal waveforms come from different positions of the piezoelectric layer 313, thereby achieving the effect of short-axis spatial encoding.
控制器105可用以驅動壓電元件3131、壓電元件3132與壓電元件3133中的一或多個。在一實施例中,控制器105可同時驅動多個壓電元件,或可具有時間間隔地驅動多個壓電元件。在一實施例中,如第3C圖所示,壓電元件3131輸出的超音波訊號的訊號波形可以是訊號波形381,壓電元件3132輸出的超 音波訊號的訊號波形可以是訊號波形382,壓電元件3133輸出的超音波訊號的訊號波形可以是訊號波形383。 The controller 105 can be used to drive one or more of the piezoelectric element 3131, the piezoelectric element 3132, and the piezoelectric element 3133. In one embodiment, the controller 105 can drive multiple piezoelectric elements simultaneously or at intervals. In one embodiment, as shown in FIG3C , the ultrasonic signal output by the piezoelectric element 3131 can have a waveform 381, the ultrasonic signal output by the piezoelectric element 3132 can have a waveform 382, and the ultrasonic signal output by the piezoelectric element 3133 can have a waveform 383.
在一實施例中,超音波探測裝置10、20、30亦可實現為曲面型超音波探測裝置,相較於平面型超音波探測裝置可具有更大的視角。例如第4圖之繪示超音波探測裝置40。超音波探測裝置40包含沿著第二方向D2配置的透鏡401、匹配元件402、壓電結構403、背後層404與控制器(未繪示)。壓電結構403可具有曲面。曲面可包含球面、非球面、半球面、長短軸曲率不同之曲面等。壓電結構403中的壓電層與壓電元件的配置可應用超音波探測裝置10、20、30中的壓電結構103、203、303之配置。背後層404可應用超音波探測裝置10、20、30中的背後層104、204之配置。在一實施例中,超音波探測裝置40亦可包含反射層(未繪示),如第2B圖所示。 In one embodiment, the ultrasonic detection devices 10, 20, and 30 can also be implemented as curved ultrasonic detection devices, which can have a larger viewing angle than flat ultrasonic detection devices. For example, FIG4 shows an ultrasonic detection device 40. The ultrasonic detection device 40 includes a lens 401, a matching element 402, a piezoelectric structure 403, a backing layer 404, and a controller (not shown) arranged along the second direction D2. The piezoelectric structure 403 can have a curved surface. The curved surface can include a spherical surface, an aspherical surface, a hemispherical surface, a curved surface with different curvatures of the major and minor axes, and the like. The configuration of the piezoelectric layer and the piezoelectric element in the piezoelectric structure 403 can apply the configuration of the piezoelectric structures 103, 203, and 303 in the ultrasonic detection devices 10, 20, and 30. The backing layer 404 can employ the configuration of the backing layers 104 and 204 in the ultrasonic detection devices 10, 20, and 30. In one embodiment, the ultrasonic detection device 40 may also include a reflective layer (not shown), as shown in FIG. 2B .
本發明提供的超音波探測裝置包含在一維度上(例如長軸方向)排列的多個壓電層,且單一壓電層可沿著另一維度(例如短軸方向)輸出多個具有不同訊號波形的超音波訊號以達成短軸空間編碼,從而獲得兩個維度的空間資訊。相較於傳統的單陣列式超音波探測裝置與二維陣列式超音波探測裝置,本發明可在減少短軸方向的接線數量的情況下確保兩個維度的空間資訊,且可不使用馬達帶動,具有組裝簡易、體積小、重量輕、相容性高、掃描快速、易保養之益處。 The ultrasonic detection device provided by the present invention comprises multiple piezoelectric layers arranged in one dimension (e.g., the long axis). A single piezoelectric layer can output multiple ultrasonic signals with different waveforms along another dimension (e.g., the short axis) to achieve short-axis spatial encoding, thereby obtaining two-dimensional spatial information. Compared to traditional single-array and two-dimensional array ultrasonic detection devices, the present invention ensures two-dimensional spatial information while reducing the number of short-axis wiring and eliminating the need for a motor. It offers the advantages of simple assembly, compact size, light weight, high compatibility, fast scanning speed, and easy maintenance.
綜上所述,雖然本發明已以實施例揭露如上,然而其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍前提下,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed above through the use of embodiments, these are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.
10:超音波探測裝置101,102:匹配元件104:背後層113:壓電層1131,1132,1133:壓電元件D1,D2,D3:方向H1,H2,H3:厚度P1,P2,P3:位置10: Ultrasonic detection device 101, 102: Matching element 104: Back layer 113: Piezoelectric layer 1131, 1132, 1133: Piezoelectric elements D1, D2, D3: Directions H1, H2, H3: Thickness P1, P2, P3: Position
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201513834A (en) * | 2013-10-11 | 2015-04-16 | Seiko Epson Corp | Ultrasonic device, ultrasonic probe, ultrasonic diagnostic apparatus, and method of manufacturing ultrasonic device |
| CN105030274A (en) * | 2015-07-31 | 2015-11-11 | 苏州佳世达电通有限公司 | Ultrasonic wave probe |
| CN105943083A (en) * | 2016-05-27 | 2016-09-21 | 苏州佳世达电通有限公司 | An ultrasonic wave probe and an ultrasonic wave system |
| CN107981887A (en) * | 2017-12-19 | 2018-05-04 | 深圳先进技术研究院 | Ultrasonic transducer, focused transducer and focused transducer production method |
| US20210187549A1 (en) * | 2019-12-20 | 2021-06-24 | GE Precision Healthcare LLC | Stressed-skin backing panel for image artifacts prevention |
| CN214052411U (en) * | 2021-08-02 | 2021-08-27 | 青岛积成电子股份有限公司 | Piezoelectric patch and ultrasonic transducer for gas flow measurement |
| CN113643677A (en) * | 2021-08-20 | 2021-11-12 | 深圳先进技术研究院 | A multi-frequency ultrasonic transducer and an ultrasonic imaging system and method having the same |
| CN113710379A (en) * | 2020-03-23 | 2021-11-26 | 深圳市汇顶科技股份有限公司 | Ultrasonic transducer, ultrasonic scanning system and processing method |
-
2022
- 2022-11-30 TW TW111146013A patent/TWI896915B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201513834A (en) * | 2013-10-11 | 2015-04-16 | Seiko Epson Corp | Ultrasonic device, ultrasonic probe, ultrasonic diagnostic apparatus, and method of manufacturing ultrasonic device |
| CN105030274A (en) * | 2015-07-31 | 2015-11-11 | 苏州佳世达电通有限公司 | Ultrasonic wave probe |
| CN105943083A (en) * | 2016-05-27 | 2016-09-21 | 苏州佳世达电通有限公司 | An ultrasonic wave probe and an ultrasonic wave system |
| CN107981887A (en) * | 2017-12-19 | 2018-05-04 | 深圳先进技术研究院 | Ultrasonic transducer, focused transducer and focused transducer production method |
| US20210187549A1 (en) * | 2019-12-20 | 2021-06-24 | GE Precision Healthcare LLC | Stressed-skin backing panel for image artifacts prevention |
| CN113710379A (en) * | 2020-03-23 | 2021-11-26 | 深圳市汇顶科技股份有限公司 | Ultrasonic transducer, ultrasonic scanning system and processing method |
| CN214052411U (en) * | 2021-08-02 | 2021-08-27 | 青岛积成电子股份有限公司 | Piezoelectric patch and ultrasonic transducer for gas flow measurement |
| CN113643677A (en) * | 2021-08-20 | 2021-11-12 | 深圳先进技术研究院 | A multi-frequency ultrasonic transducer and an ultrasonic imaging system and method having the same |
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|---|---|
| TW202424428A (en) | 2024-06-16 |
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