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TWI896876B - Manufacturing method of piezoelectric material - Google Patents

Manufacturing method of piezoelectric material

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Publication number
TWI896876B
TWI896876B TW111116195A TW111116195A TWI896876B TW I896876 B TWI896876 B TW I896876B TW 111116195 A TW111116195 A TW 111116195A TW 111116195 A TW111116195 A TW 111116195A TW I896876 B TWI896876 B TW I896876B
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lead
free piezoelectric
powder
piezoelectric powder
polymer composite
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TW111116195A
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Chinese (zh)
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TW202343839A (en
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張鳴助
鄭宇琪
丁國峻
謝政霖
李政達
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詠業科技股份有限公司
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Priority to TW111116195A priority Critical patent/TWI896876B/en
Priority to CN202210517741.1A priority patent/CN117004320A/en
Publication of TW202343839A publication Critical patent/TW202343839A/en
Application granted granted Critical
Publication of TWI896876B publication Critical patent/TWI896876B/en

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    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
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    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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Abstract

The invention provides a manufacturing method of piezoelectric materials, which at least includes the following steps: providing a lead-free piezoelectric powder, dispersing the lead-free piezoelectric powder in a solvent, adding a powder surface modifier to modify the surface of the lead-free piezoelectric powder, removing most solvents to form a lead-free piezoelectric powder slurry, mixing the lead-free piezoelectric powder slurry with an epoxy resin or an acrylic resin, so as to form a lead-free piezoelectric powder polymer composite slurry, and manufacturing the lead-free piezoelectric powder polymer composite slurry into a lead-free piezoelectric powder polymer composite material by a light curing step or a heat curing step.

Description

壓電材料的製作方法Method for preparing piezoelectric material

本發明係有關於壓電材料領域，尤其是關於一種可藉由光或是熱達到固化的壓電材料的製作方法。 The present invention relates to the field of piezoelectric materials, and more particularly to a method for preparing a piezoelectric material that can be cured by light or heat.

習知的壓電陶瓷材料常包含有鋯鈦酸鉛(Pb(ZrTi)O3，PZT)。然而，PZT材質包含有鉛，其有毒性且對於環境危害較大。因此近期逐漸發展以其他材料取代傳統的PZT材質製作成壓電陶瓷材料。 Conventional piezoelectric ceramic materials often contain lead zirconium titanate (Pb(ZrTi)O 3 , PZT). However, PZT contains lead, which is toxic and poses a significant environmental risk. Therefore, there has been a recent trend toward using other materials to replace traditional PZT in the production of piezoelectric ceramics.

其中一種使用中的壓電材料為聚偏二氟乙烯(polyvinylidene difluoride，PVDF)，然而使用PVDF作為壓電材料仍有缺點，那就是由於PVDF含有氟，因此當材質經過高溫燒結製程時，其中的氟元素容易與其他分子在高溫下產生反應，並且可能影響材料品質。此外，目前多數的壓電材料在製作過程中，均需要進行高溫高達900度以上的燒結步驟，因此對於製作機台的要求與限制也較高。 One piezoelectric material currently in use is polyvinylidene difluoride (PVDF). However, using PVDF as a piezoelectric material has its drawbacks. Because PVDF contains fluorine, the fluorine easily reacts with other molecules during the high-temperature sintering process, potentially affecting material quality. Furthermore, most current piezoelectric materials require a sintering step at temperatures exceeding 900°C during production, placing significant demands and limitations on the manufacturing equipment.

本發明提供一種壓電材料的製作方法，至少包含以下步驟：提供一無鉛壓電粉體，將無鉛壓電粉體分散於一溶劑中，且加入一粉體表面修飾劑，以 對無鉛壓電粉體的表面進行修飾，移除多數溶劑，形成一無鉛壓電粉體漿料，將無鉛壓電粉體漿料與一環氧基樹脂或一壓克力樹脂混合，形成一無鉛壓電粉體高分子複合漿料，以及將無鉛壓電粉體高分子複合漿料以一光固化步驟或一熱固化步驟製作成一無鉛壓電粉體高分子複合材料。 The present invention provides a method for manufacturing a piezoelectric material, comprising at least the following steps: providing a lead-free piezoelectric powder; dispersing the lead-free piezoelectric powder in a solvent; adding a powder surface modifier to modify the surface of the lead-free piezoelectric powder and remove most of the solvent to form a lead-free piezoelectric powder slurry; mixing the lead-free piezoelectric powder slurry with an epoxy resin or an acrylic resin to form a lead-free piezoelectric powder polymer composite slurry; and subjecting the lead-free piezoelectric powder polymer composite slurry to a light-curing step or a heat-curing step to produce a lead-free piezoelectric powder polymer composite material.

本發明的特徵在於，提供一種可藉由光或是熱來固化的壓電材料的製作方法，其中上述壓電材料主要包含有無鉛壓電粉體，其不含有氟或是鉛，因此無傳統材料的缺點，將無鉛壓電粉體混合於可藉由光或熱固化的高分子材料中(例如環氧基樹脂或壓克力樹脂)，製作成無鉛壓電粉體高分子複合漿料。其中無鉛壓電粉體高分子複合漿料可藉由網印、塗佈、3D列印等方法形成各種形狀的材料層之後，再以光或熱固化來形成所需的無鉛壓電粉體高分子複合材料。本發明製作方法中不需要進行高溫燒結製程，製程的靈活性較高、且對於機台的限制也較低。 The present invention is characterized by providing a method for producing a piezoelectric material that can be cured by light or heat. The piezoelectric material primarily comprises lead-free piezoelectric powder, which does not contain fluorine or lead and therefore does not suffer from the drawbacks of conventional materials. The lead-free piezoelectric powder is mixed with a light- or heat-curable polymer material (such as an epoxy resin or acrylic resin) to produce a lead-free piezoelectric powder-polymer composite slurry. The lead-free piezoelectric powder-polymer composite slurry can be formed into various material layers through methods such as screen printing, coating, and 3D printing, and then cured by light or heat to form the desired lead-free piezoelectric powder-polymer composite material. The manufacturing method of the present invention does not require a high-temperature sintering process, which allows for greater process flexibility and places fewer restrictions on equipment.

S01、S02、S03、S04、S05、S06、S07:步驟 S01, S02, S03, S04, S05, S06, S07: Steps

第1圖繪示製作本發明壓電材料的流程圖。 Figure 1 shows a flow chart for producing the piezoelectric material of the present invention.

為使熟習本發明所屬技術領域之一般技藝者能更進一步了解本發明，下文特列舉本發明之較佳實施例，並配合所附圖式，詳細說明本發明的構成內容及所欲達成之功效。 To enable those skilled in the art to better understand the present invention, the following lists preferred embodiments of the present invention and, together with the accompanying drawings, describes in detail the structure and intended effects of the present invention.

為了方便說明，本發明之各圖式僅為示意以更容易了解本發明，其 詳細的比例可依照設計的需求進行調整。在文中所描述對於圖形中相對元件之上下關係，在本領域之人皆應能理解其係指物件之相對位置而言，因此皆可以翻轉而呈現相同之構件，此皆應同屬本說明書所揭露之範圍，在此容先敘明。 For ease of explanation, the figures of this invention are for illustrative purposes only, and their detailed scales may be adjusted according to design requirements. Those skilled in the art will readily understand that the descriptions of relative positions of elements in the figures refer to the relative positions of the objects. Therefore, the figures can be reversed to present the same components, and this is within the scope of this specification. This is explained here.

請參考第1圖，第1圖繪示製作本發明壓電材料的流程圖。如第1圖所示，首先為步驟S01：提供一定數量的無鉛壓電粉體，並混合於溶劑中。其中本發明中所使用的無鉛壓電粉體不含有鉛也不含有氟，因此並無傳統技術中的缺點(含鉛有毒對環境危害高、含氟在高溫時容易質變)。舉例來說，無鉛壓電粉體包含有鈦酸鋇(BT)、鹼金屬鈮酸鉀鈉(KNN)、鈦酸鉍鈉(BNT)等材質，但本發明不限於此。另外此處的溶劑包含有醇類或酮類等，但不限於此。 Please refer to Figure 1, which illustrates a flow chart for preparing the piezoelectric material of the present invention. As shown in Figure 1, the first step is step S01: providing a certain amount of lead-free piezoelectric powder and mixing it with a solvent. The lead-free piezoelectric powder used in the present invention contains neither lead nor fluorine, thus avoiding the drawbacks of conventional technologies (lead is toxic and poses a high risk to the environment, and fluorine is susceptible to degradation at high temperatures). For example, the lead-free piezoelectric powder includes materials such as barium titanium oxide (BT), alkaline metal potassium sodium niobate (KNN), and bismuth sodium titanium oxide (BNT), but the present invention is not limited to these materials. Furthermore, the solvent herein may include, but is not limited to, alcohols or ketones.

接下來，如步驟S02：對混合有無鉛壓電粉體的溶劑進行表面修飾。其中，可在溶劑中加入表面修飾劑來達到表面修飾效果，其中表面修飾劑包含例如矽烷偶合劑、磷酸脂偶合劑、金屬類酸脂偶合劑，加上分散劑以及抗沉降劑來對無鉛壓電粉體的表面進行修飾。加入上述表面修飾劑的目的在於可以增加無鉛壓電粉體粒子的懸浮性和可分散性，使得無鉛壓電粉體可以更均勻地分散於溶劑中，也比較能避免溶劑放置一段時間後產生粉體的沉澱(達到抗沉降的效果)。此外，此處加入表面修飾劑也有利於後續的均質混合與再分散性。 Next, as in step S02, the solvent mixed with the lead-free piezoelectric powder is surface-modified. A surface modifier can be added to the solvent to achieve the surface modification effect. The surface modifier includes, for example, a silane coupling agent, a phosphate coupling agent, a metal acid coupling agent, a dispersant, and an anti-settling agent to modify the surface of the lead-free piezoelectric powder. The purpose of adding the above-mentioned surface modifier is to increase the suspension and dispersibility of the lead-free piezoelectric powder particles, allowing the lead-free piezoelectric powder to be more evenly dispersed in the solvent. It also helps to prevent the powder from settling after being left in the solvent for a period of time (achieving an anti-settling effect). In addition, adding a surface modifier here also facilitates subsequent homogeneous mixing and redispersibility.

接下來如步驟S03：移除大部分溶劑。這裡的方法例如使用風乾或是加熱等步驟，使得上述溶劑被蒸發。當多數溶劑被移除後，形成可再分散性的無鉛壓電粉體漿料。 Next, in step S03, the majority of the solvent is removed. This method involves, for example, air drying or heating to evaporate the solvent. Once the majority of the solvent is removed, a redispersible lead-free piezoelectric powder slurry is formed.

接著，如步驟S04：再加入酮類或醚類等溶劑，以及預先混合好的高分 子樹脂。本步驟中，其中高分子樹脂具有可以被光或是熱所固化的特性。當上述無鉛壓電粉體混合高分子樹脂之後製作成複合漿料，後續即可以光或是熱等方式來固化複合漿料，因此不需要進行燒結步驟即可形成硬化的壓電材料。 Next, as in step S04, a solvent such as a ketone or ether is added, along with the pre-mixed polymer resin. In this step, the polymer resin is capable of being cured by light or heat. Once the lead-free piezoelectric powder is mixed with the polymer resin to form a composite slurry, the composite slurry can be cured by light or heat, eliminating the need for a sintering step to form a hardened piezoelectric material.

在本發明的一本實施例中，高分子樹脂包含有環氧樹脂、壓克力樹脂、矽氧烷樹脂、聚醯胺或醯亞胺樹脂等，但本發明不限於此。在此以環氧基樹脂以及壓克力樹脂為例進行說明。其中本實施例中的環氧基樹脂包含20%-50%的環氧基寡合物、20%-45%的環氧樹脂硬化劑、1%-5%的光起始劑、1%-10%的矽烷偶合劑、1%-5%的流變劑以及1%-5%的消泡劑等助劑配成60份環氧基樹脂。壓克力樹脂則包含10%-40%的壓克力單體、10%-50%的壓克力寡合物、1%-5%的光起始劑、1%-10%的矽烷偶合劑、1%-5%的流變劑以及1%-5%的消泡劑等助劑配成60份壓克力樹脂。將上述的60份環氧基樹脂或60份壓克力樹脂，與100份丁酮以及100份無鉛壓電粉體漿料，使用均質機進行均質攪拌與脫泡，形成前驅無鉛壓電粉體高分子複合漿料。 In one embodiment of the present invention, the polymer resin includes epoxy resin, acrylic resin, silicone resin, polyamide, or imide resin, but the present invention is not limited thereto. Epoxy resin and acrylic resin are used as examples for illustration. The epoxy resin in this embodiment comprises 60 parts of epoxy resin, including 20%-50% epoxy oligomer, 20%-45% epoxy resin hardener, 1%-5% photoinitiator, 1%-10% silane coupling agent, 1%-5% rheological agent, and 1%-5% defoaming agent. The acrylic resin contains 10%-40% acrylic monomer, 10%-50% acrylic oligomer, 1%-5% photoinitiator, 1%-10% silane coupling agent, 1%-5% rheological agent, and 1%-5% defoaming agent, among other additives, to make 60 parts of acrylic resin. These 60 parts of epoxy resin or 60 parts of acrylic resin are mixed with 100 parts of butanone and 100 parts of lead-free piezoelectric powder slurry using a homogenizer for homogenization and defoaming to form the lead-free piezoelectric powder polymer composite slurry.

接著如步驟S05：移除酮類或醚類等易揮發的溶劑之後，將前驅無鉛壓電粉體高分子複合漿料製成無鉛壓電粉體高分子複合漿料。此處所述移除溶劑的方法，例如為加熱步驟，但不限於此。 Then, in step S05, after removing volatile solvents such as ketones and ethers, the lead-free piezoelectric powder polymer composite slurry is converted into a lead-free piezoelectric powder polymer composite slurry. The solvent removal method described herein may include, but is not limited to, a heating step.

如步驟S06：將無鉛壓電粉體高分子複合漿料形成為所需形狀後再固化。此處所形成的無鉛壓電粉體高分子複合漿料為具有一定黏性的流體，其可以藉由塗佈、網印、3D列印等方式將其形成在一載板上，接著以照光或是加熱等方式將其固化。在一些實施例中，可以以多層塗佈、多層網印或多層3D列印交替多次光固化或熱固化，來形成厚度更厚的漿料堆疊層。藉由上述方法，可 以輕易調整後續的壓電材料層的厚度。 For example, in step S06, the lead-free piezoelectric powder-polymer composite slurry is formed into the desired shape and then solidified. The resulting lead-free piezoelectric powder-polymer composite slurry is a fluid with a certain viscosity. It can be applied to a substrate by coating, screen printing, or 3D printing, and then solidified by exposure to light or heat. In some embodiments, multiple layers of coating, screen printing, or 3D printing can be applied, followed by multiple light-curing or heat-curing cycles, to form thicker slurry stacks. This method allows for easy adjustment of the thickness of subsequent piezoelectric material layers.

值得注意的是，本發明中所製作出的無鉛壓電粉體高分子複合漿料由於已經含有可藉由光或熱固化的樹脂等材料，因此在成形時不需要再經過燒結製程。另外，燒結製程與熱固化的差異在於，一般來說燒結製程的溫度約在攝氏900度以上，而熱固化的溫度大約在攝氏100度至攝氏200度左右。所以可以簡化製程並且降低機台的要求。 It's worth noting that the lead-free piezoelectric powder polymer composite slurry produced in this invention already contains materials such as resins that can be cured by light or heat, so it doesn't require a sintering process during molding. Furthermore, the difference between sintering and heat curing is that sintering generally occurs at temperatures above 900°C, while heat curing is typically between 100°C and 200°C. This simplifies the process and reduces equipment requirements.

如步驟S07，在固化後的無鉛壓電粉體高分子複合漿料表面形成電極並進行極化以完成壓電材料。此步驟與習知技術相似，在此不多加贅述。 In step S07, electrodes are formed on the surface of the cured lead-free piezoelectric powder polymer composite slurry and polarized to complete the piezoelectric material. This step is similar to conventional techniques and will not be elaborated on here.

綜合以上說明書與圖式，本發明提供一種壓電材料的製作方法，包含提供一定數量的無鉛壓電粉體，將無鉛壓電粉體分散於一溶劑中，且加入一定數量的粉體表面修飾劑，以對無鉛壓電粉體的表面進行修飾，移除多數溶劑，形成一定數量的無鉛壓電粉體漿料，將無鉛壓電粉體漿料與一環氧基樹脂或一壓克力樹脂或聚醯胺混合，形成一無鉛壓電粉體高分子複合漿料，以及將無鉛壓電粉體高分子複合漿料以一光固化步驟或一熱固化步驟製作成一無鉛壓電粉體高分子複合材料。 In summary, the present invention provides a method for manufacturing a piezoelectric material, comprising providing a certain amount of lead-free piezoelectric powder, dispersing the lead-free piezoelectric powder in a solvent, adding a certain amount of a powder surface modifier to modify the surface of the lead-free piezoelectric powder, removing most of the solvent to form a certain amount of lead-free piezoelectric powder slurry, mixing the lead-free piezoelectric powder slurry with an epoxy resin, an acrylic resin, or a polyamide to form a lead-free piezoelectric powder polymer composite slurry, and subjecting the lead-free piezoelectric powder polymer composite slurry to a light-curing step or a heat-curing step to produce a lead-free piezoelectric powder polymer composite material.

在本發明的一些實施例中，其中更包含在無鉛壓電粉體高分子複合材料的一表面製作一電極，並對無鉛壓電粉體高分子複合材料進行極化，以製作為壓電材料。 In some embodiments of the present invention, an electrode is fabricated on a surface of a lead-free piezoelectric powder polymer composite material, and the lead-free piezoelectric powder polymer composite material is polarized to produce a piezoelectric material.

在本發明的一些實施例中，其中粉體表面修飾劑包含有矽烷偶合 劑、磷酸脂偶合劑、分散劑以及抗沉降劑。 In some embodiments of the present invention, the powder surface modification agent comprises a silane coupling agent, a phosphate coupling agent, a dispersant, and an anti-settling agent.

在本發明的一些實施例中，其中無鉛壓電粉體的表面進行修飾後，改變無鉛壓電粉體表面的官能性，例如：OH鍵與表面修飾劑鍵結，以增進粉體與高分子基材的相容性，以達到抗沉降的效果。 In some embodiments of the present invention, the surface of the lead-free piezoelectric powder is modified to alter its surface functionality, such as by forming OH bonds with the surface modifier, thereby enhancing the compatibility of the powder with the polymer matrix and achieving an anti-settling effect.

在本發明的一些實施例中，其中環氧基樹脂包含20%-50%的環氧基寡合物、20%-45%的環氧樹脂硬化劑、1%-5%的光起始劑、1%-10%的矽烷偶合劑、1%-5%的流變劑以及1%-5%的消泡劑。 In some embodiments of the present invention, the epoxy resin contains 20%-50% of an epoxy oligomer, 20%-45% of an epoxy resin hardener, 1%-5% of a photoinitiator, 1%-10% of a silane coupling agent, 1%-5% of a rheological agent, and 1%-5% of a defoaming agent.

在本發明的一些實施例中，其中壓克力樹脂包含10%-40%的壓克力單體、10%-50%的壓克力寡合物、1%-5%的光起始劑、1%-10%的矽烷偶合劑、1%-5%的流變劑以及1%-5%的消泡劑。 In some embodiments of the present invention, the acrylic resin contains 10%-40% acrylic monomer, 10%-50% acrylic oligomer, 1%-5% photoinitiator, 1%-10% silane coupling agent, 1%-5% rheological agent, and 1%-5% defoaming agent.

在本發明的一些實施例中，其中無鉛壓電粉體不含有鉛也不含有氟。 In some embodiments of the present invention, the lead-free piezoelectric powder contains neither lead nor fluorine.

在本發明的一些實施例中，其中無鉛壓電粉體高分子複合漿料完成後，以一塗佈、一網版列印或一3D列印製程將無鉛壓電粉體高分子複合漿料形成於一載體(例如一平面)上，然後進行光固化步驟或熱固化步驟將無鉛壓電粉體高分子複合漿料硬化。 In some embodiments of the present invention, after the lead-free piezoelectric powder-polymer composite slurry is completed, it is formed on a carrier (e.g., a flat surface) using a coating, screen printing, or 3D printing process, and then a photocuring step or a thermal curing step is performed to harden the lead-free piezoelectric powder-polymer composite slurry.

在本發明的一些實施例中，其中無鉛壓電粉體包含有鈦酸鋇(BT)、鹼金屬鈮酸鉀鈉(KNN)、鈦酸鉍鈉(BNT)。 In some embodiments of the present invention, the lead-free piezoelectric powder includes barium titanium oxide (BT), alkaline metal potassium sodium niobate (KNN), and bismuth sodium titanium oxide (BNT).

在本發明的一些實施例中，其中溶劑包含有醇類或酮類。 In some embodiments of the present invention, the solvent contains alcohols or ketones.

本發明的特徵在於，提供一種可藉由光或是熱來固化的壓電材料的製作方法，其中上述壓電材料主要包含有無鉛壓電粉體，其不含有氟或是鉛，因此無傳統材料的缺點，將無鉛壓電粉體混合於可藉由光或熱固化的高分子材料中(例如環氧基樹脂或壓克力樹脂)，製作成無鉛壓電粉體高分子複合漿料。其中無鉛壓電粉體高分子複合漿料可藉由網印、塗佈、3D列印等方法形成各種形狀的材料層之後，再以光或熱固化來形成所需的無鉛壓電粉體高分子複合材料。本發明製作方法中不需要進行高溫燒結製程，製程的靈活性較高、且對於機台的限制也較低。 The present invention is characterized by providing a method for producing a piezoelectric material that can be cured by light or heat. The piezoelectric material primarily comprises lead-free piezoelectric powder, which does not contain fluorine or lead and therefore does not suffer from the drawbacks of conventional materials. The lead-free piezoelectric powder is mixed with a light- or heat-curable polymer material (such as an epoxy resin or acrylic resin) to produce a lead-free piezoelectric powder-polymer composite slurry. The lead-free piezoelectric powder-polymer composite slurry can be formed into various material layers through methods such as screen printing, coating, and 3D printing, and then cured by light or heat to form the desired lead-free piezoelectric powder-polymer composite material. The manufacturing method of the present invention does not require a high-temperature sintering process, which allows for greater process flexibility and places fewer restrictions on equipment.

以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 The above description is merely a preferred embodiment of the present invention. All equivalent changes and modifications made within the scope of the patent application of the present invention should fall within the scope of the present invention.

S01、S02、S03、S04、S05、S06、S07:步驟S01, S02, S03, S04, S05, S06, S07: Steps

Claims (9)

一種壓電材料的製作方法，包含:提供一無鉛壓電粉體；將該無鉛壓電粉體分散於一溶劑中，且加入一粉體表面修飾劑，以對該無鉛壓電粉體的表面進行修飾，其中該粉體表面修飾劑包含有矽烷偶合劑、磷酸脂偶合劑、分散劑以及抗沉降劑；移除多數該溶劑，形成一無鉛壓電粉體漿料；將該無鉛壓電粉體漿料與一可固化材料混合，形成一無鉛壓電粉體高分子複合漿料，其中該可固化材料包含環氧基樹脂、壓克力樹脂、矽氧烷或聚醯胺；以及將該無鉛壓電粉體高分子複合漿料以一光固化步驟或一熱固化步驟製作成一無鉛壓電粉體高分子複合材料。A method for manufacturing a piezoelectric material comprises: providing a lead-free piezoelectric powder; dispersing the lead-free piezoelectric powder in a solvent, and adding a powder surface modifier to modify the surface of the lead-free piezoelectric powder, wherein the powder surface modifier comprises a silane coupling agent, a phosphate coupling agent, a dispersant, and an anti-settling agent; removing most of the solvent to form a lead-free piezoelectric material; Powder slurry; mixing the lead-free piezoelectric powder slurry with a curable material to form a lead-free piezoelectric powder polymer composite slurry, wherein the curable material includes epoxy resin, acrylic resin, silicone or polyamide; and manufacturing the lead-free piezoelectric powder polymer composite slurry into a lead-free piezoelectric powder polymer composite material through a light curing step or a heat curing step. 如申請專利範圍第1項所述的壓電材料的製作方法，其中更包含在該無鉛壓電粉體高分子複合材料的一表面製作一電極，並對該無鉛壓電粉體高分子複合材料進行極化，以製作為該壓電材料。The method for manufacturing a piezoelectric material as described in claim 1 further includes forming an electrode on a surface of the lead-free piezoelectric powder polymer composite material and polarizing the lead-free piezoelectric powder polymer composite material to produce the piezoelectric material. 如申請專利範圍第1項所述的壓電材料的製作方法，其中該無鉛壓電粉體的表面進行修飾後，改變該無鉛壓電粉體表面的官能性，以增進粉體與高分子基材的相容性。As described in the first embodiment of the invention, the surface of the lead-free piezoelectric powder is modified to change the surface functionality of the lead-free piezoelectric powder to enhance the compatibility of the powder with the polymer substrate. 如申請專利範圍第1項所述的壓電材料的製作方法，其中該環氧基樹脂包含20%-50%的環氧基寡合物、20%-45%的環氧樹脂硬化劑、1%-5%的光起始劑、1%-10%的矽烷偶合劑、1%-5%的流變劑以及1%-5%的消泡劑。The method for preparing a piezoelectric material as described in claim 1, wherein the epoxy resin comprises 20%-50% of an epoxy oligomer, 20%-45% of an epoxy resin hardener, 1%-5% of a photoinitiator, 1%-10% of a silane coupling agent, 1%-5% of a rheological agent, and 1%-5% of a defoaming agent. 如申請專利範圍第1項所述的壓電材料的製作方法，其中該壓克力樹脂包含10%-40%的壓克力單體、10%-50%的壓克力寡合物、1%-5%的光起始劑、1%-10%的矽烷偶合劑、1%-5%的流變劑以及1%-5%的消泡劑。The method for preparing a piezoelectric material as described in claim 1, wherein the acrylic resin comprises 10%-40% of an acrylic monomer, 10%-50% of an acrylic oligomer, 1%-5% of a photoinitiator, 1%-10% of a silane coupling agent, 1%-5% of a rheological agent, and 1%-5% of a defoaming agent. 如申請專利範圍第1項所述的壓電材料的製作方法，其中該無鉛壓電粉體不含有鉛也不含有氟。The method for producing a piezoelectric material as described in claim 1, wherein the lead-free piezoelectric powder contains neither lead nor fluorine. 如申請專利範圍第1項所述的壓電材料的製作方法，其中該無鉛壓電粉體高分子複合漿料完成後，以一塗佈、一網版列印或一3D列印製程將該無鉛壓電粉體高分子複合漿料形成於一載體上，然後進行該光固化步驟或該熱固化步驟將該無鉛壓電粉體高分子複合漿料硬化。As described in item 1 of the patent application, the method for manufacturing a piezoelectric material comprises the following steps: after the lead-free piezoelectric powder polymer composite slurry is completed, the lead-free piezoelectric powder polymer composite slurry is formed on a carrier by a coating, a screen printing, or a 3D printing process, and then the photocuring step or the thermal curing step is performed to harden the lead-free piezoelectric powder polymer composite slurry. 如申請專利範圍第1項所述的壓電材料的製作方法，其中該無鉛壓電粉體包含有鈦酸鋇(BT)、鹼金屬鈮酸鉀鈉(KNN)、鈦酸鉍鈉(BNT)。The method for manufacturing a piezoelectric material as described in claim 1, wherein the lead-free piezoelectric powder comprises barium titanium oxide (BT), alkaline metal potassium sodium niobate (KNN), and bismuth sodium titanium oxide (BNT). 如申請專利範圍第1項所述的壓電材料的製作方法，其中該溶劑包含有醇類、酮類或醚類。In the method for producing a piezoelectric material as described in claim 1, the solvent contains alcohols, ketones, or ethers.
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