TWI895250B - Adhesive for repeated bending device, adhesive sheet, repeated bending folding layer component and repeated bending device - Google Patents
Adhesive for repeated bending device, adhesive sheet, repeated bending folding layer component and repeated bending deviceInfo
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- TWI895250B TWI895250B TW108140809A TW108140809A TWI895250B TW I895250 B TWI895250 B TW I895250B TW 108140809 A TW108140809 A TW 108140809A TW 108140809 A TW108140809 A TW 108140809A TW I895250 B TWI895250 B TW I895250B
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- storage modulus
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
本發明提供:反覆彎折性優異的反覆彎折裝置用黏著劑、黏著片、反覆彎折積層部件及反覆彎折裝置。 本發明的反覆彎折裝置用黏著劑,是用於將構成反覆彎折裝置之一彎折性部件、與另一彎折性部件予以貼合的反覆彎折裝置用黏著劑;其中,-20℃儲存彈性模數G'(-20)除以85℃儲存彈性模數G'(85)的商值之儲存彈性模數變化度超過2.5;且,-20℃儲存彈性模數G'(-20)為0.070MPa以上且0.200MPa以下。The present invention provides an adhesive for a repetitive bending device having excellent repetitive bending properties, an adhesive sheet, a repetitive bending layer component, and a repetitive bending device. The adhesive for a repetitive bending device of the present invention is used to bond one repetitive bending component to another repetitive bending component constituting the repetitive bending device; wherein the storage modulus of elasticity (G'(-20)) is greater than 2.5, and the storage modulus of elasticity (G'(85)) is greater than 0.070 MPa and less than 0.200 MPa.
Description
本發明是關於反覆彎折裝置用的黏著劑及黏著片、以及反覆彎折積層部件及反覆彎折裝置。The present invention relates to an adhesive and an adhesive sheet for a repeated bending device, a repeated bending folding layer component, and a repeated bending device.
近年,裝置一種之電子機器的顯示體(顯示器),有提案可彎折的彎折性顯示器。彎折性顯示器除僅單次形成曲面之外,尚有提案反覆彎折(彎曲)用途的反覆彎折顯示器。In recent years, there have been proposals for flexible displays (displays) for electronic devices. In addition to single-curved displays, there have also been proposals for recurved displays that can bend repeatedly.
如上述的反覆彎折顯示器中,構成該彎折性顯示器之一的可彎折部件(彎折性部件)、與其他彎折性部件,可考慮利用黏著片的黏著劑層進行貼合。然而,若反覆彎折顯示器使用習知黏著片,則會有在黏著劑層與被黏物的界面處發生浮起、剝離等問題。In the aforementioned reversible display, the bendable component (flexible component) that constitutes one of the reversible displays can be bonded to other reversible components using the adhesive layer of an adhesive sheet. However, using conventional adhesive sheets for reversible displays can cause problems such as lifting and peeling at the interface between the adhesive layer and the adherend.
專利文獻1所揭示黏著劑的課題在於:即便反覆彎折,仍可抑制黏著劑層發生浮起、剝離情形。 [先行技術文獻] [專利文獻]The adhesive disclosed in Patent Document 1 is designed to prevent the adhesive layer from lifting or peeling even after repeated bending. [Prior Art Document] [Patent Document]
[專利文獻1]日本專利特開2016-108555號公報[Patent Document 1] Japanese Patent Publication No. 2016-108555
[發明所欲解決之課題][The problem that the invention aims to solve]
另一方面,如上述的反覆彎折顯示器,在反覆彎折時會有在彎折部出現折痕的情況。專利文獻1所記載的黏著劑並無法充分解決該反覆彎折性的問題。On the other hand, the aforementioned reversible bend display may have creases formed at the bend portion when it is repeatedly bent. The adhesive described in Patent Document 1 cannot fully solve the problem of reversible bendability.
本發明有鑑於如上述實況而完成,目的在於提供:反覆彎折性優異的反覆彎折裝置用黏著劑、黏著片、反覆彎折積層部件及反覆彎折裝置。 [解決課題之手段]The present invention was made in light of the above-described circumstances, and its purpose is to provide an adhesive for a repetitive bending device, an adhesive sheet, a repetitive bending layer component, and a repetitive bending device that exhibit excellent repetitive bending properties. [Means for Solving the Problem]
為解決上述目的,第1,本發明所提供的反覆彎折裝置用黏著劑,是用於將構成反覆彎折裝置之一彎折性部件、與另一彎折性部件予以貼合用的反覆彎折裝置用黏著劑;其中,-20℃儲存彈性模數G'(-20)除以85℃儲存彈性模數G'(85)的商值之儲存彈性模數變化度超過2.5;且,-20℃儲存彈性模數G'(-20)為0.070MPa以上且0.200MPa以下(發明1)。To achieve the above-mentioned purpose, first, the present invention provides an adhesive for a repetitive bending device, which is used to bond one of the repetitive bending components to another repetitive bending component; wherein the storage modulus variation of the quotient of the storage modulus G'(-20) at -20°C divided by the storage modulus G'(85) at 85°C exceeds 2.5; and the storage modulus G'(-20) at -20°C is greater than 0.070 MPa and less than 0.200 MPa (Invention 1).
上述發明(發明1)的反覆彎折裝置用黏著劑,藉由具有上述儲存彈性模數G'相關物性,當使利用由該黏著劑所構成的黏著劑層,將一彎折性部件與另一彎折性部件予以貼合而成的積層體進行彎折時,可成為反覆彎折性優異、廣範圍溫度下在彎折部不易出現折痕。The adhesive for the repetitive bending device of the above-mentioned invention (Invention 1) has the physical properties related to the above-mentioned storage elastic modulus G'. When a laminate formed by bonding a bendable component to another bendable component using an adhesive layer composed of the adhesive is bent, the laminate has excellent repetitive bendability and is less likely to have creases at the bend portion over a wide temperature range.
上述發明(發明1)中,較佳凝膠分率為40%以上且95%以下(發明2)。In the above invention (Invention 1), the preferred gel fraction is 40% or more and 95% or less (Invention 2).
上述發明(發明1,2)中,較佳上述黏著劑為丙烯酸系黏著劑(發明3)。In the above inventions (Inventions 1 and 2), it is preferred that the adhesive is an acrylic adhesive (Invention 3).
第2,本發明所提供的黏著片(發明4),具有供將構成反覆彎折裝置之一彎折性部件、與另一彎折性部件予以貼合用之黏著劑層的黏著片;其中,上述黏著劑層由上述反覆彎折裝置用黏著劑(發明1~3)構成。Second, the present invention provides an adhesive sheet (Invention 4) having an adhesive layer for bonding one bendable component constituting a repetitive bending device to another bendable component; wherein the adhesive layer is composed of the adhesive for the repetitive bending device (Inventions 1-3).
上述發明(發明4)中,較佳上述黏著片對聚醯亞胺的黏著力達6N/25mm以上(發明5)。In the above invention (Invention 4), it is preferred that the adhesive sheet has an adhesion to polyimide of 6N/25mm or more (Invention 5).
上述發明(發明4,5)中,較佳上述黏著劑層的厚度為1μm以上且300μm以下(發明6)。In the above inventions (Inventions 4 and 5), the thickness of the adhesive layer is preferably not less than 1 μm and not more than 300 μm (Invention 6).
上述發明(發明4~6)中,較佳上述黏著片具備有2片剝離片;而,上述黏著劑層以鄰接上述2片剝離片之剝離面的狀態被上述剝離片挾持(發明7)。In the above inventions (Inventions 4 to 6), it is preferred that the adhesive sheet has two release sheets; and the adhesive layer is held by the release sheets in a state of being adjacent to the release surfaces of the two release sheets (Invention 7).
第3,本發明所提供的反覆彎折積層部件(發明8),具備有:構成反覆彎折裝置之一彎折性部件及另一彎折性部件、以及將上述一彎折性部件與上述另一彎折性部件相互貼合之黏著劑層的反覆彎折積層部件;其中,上述黏著劑層由上述反覆彎折裝置用黏著劑(發明1~3)構成。Third, the repeatedly-bending accumulative layer component provided by the present invention (Invention 8) comprises: a bendable component and another bendable component constituting a repeatedly-bending device, and an adhesive layer for bonding the one bendable component and the other bendable component to each other; wherein the adhesive layer is composed of the adhesive for the repeatedly-bending device (Inventions 1-3).
第4,本發明所提供的反覆彎折裝置(發明9),具備有上述反覆彎折積層部件(發明8)。 [發明效果]Fourthly, the present invention provides a repeated bending device (Invention 9) comprising the aforementioned repeated bending folding layer component (Invention 8). [Effects of the Invention]
本發明的反覆彎折裝置用黏著劑、黏著片、反覆彎折積層部件及反覆彎折裝置,反覆彎折性優異、廣範圍溫度下在彎折部不易出現折痕。The adhesive, adhesive sheet, repeatedly bending layer component and repeatedly bending device of the present invention have excellent repeatedly bending properties and are unlikely to have creases at the bending portion under a wide temperature range.
以下,針對本發明實施形態進行說明。 [反覆彎折裝置用黏著劑] 本實施形態的反覆彎折裝置用黏著劑(以下亦簡稱「黏著劑」),是用於將構成反覆彎折裝置之一彎折性部件與另一彎折性部件,進行貼合之黏著劑。相關反覆彎折裝置與彎折性部件,容後述。The following describes an embodiment of the present invention. [Adhesive for Repeated Bending Devices] The adhesive for a repeated bending device (hereinafter referred to as "adhesive") of this embodiment is used to bond one bending member to another bending member that constitutes the repeated bending device. The repeated bending device and bending members will be described later.
本實施形態的黏著劑,較佳是將-20℃儲存彈性模數G'(-20),除以85℃儲存彈性模數G'(85)的商值(G'(-20)/G'(85))之儲存彈性模數變化度超過2.5,且,-20℃儲存彈性模數G'(-20)較佳為0.070MPa以上且0.200MPa以下。另外,本說明書的儲存彈性模數之測定方法,如後述試驗例所示。The adhesive of this embodiment preferably has a storage modulus variation (G'(-20)/G'(85)) of more than 2.5, which is the quotient of the storage modulus G'(-20) at -20°C divided by the storage modulus G'(85) at 85°C. Furthermore, the storage modulus G'(-20) at -20°C is preferably not less than 0.070 MPa and not more than 0.200 MPa. The storage modulus measurement method of this specification is described in the test examples below.
本實施形態的黏著劑藉由具有上述儲存彈性模數G'相關物性,當使利用由該黏著劑所構成黏著劑層,將一彎折性部件與另一彎折性部件予以貼合而成的積層體進行彎折時,可成為反覆彎折性優異、廣範圍溫度下在彎折部不易出現折痕。特別若儲存彈性模數變化度超過2.5,便可發揮良好的黏著力,可抑制在黏著劑層與被黏物的界面處發生浮起、剝離。又,特別若儲存彈性模數G'(-20)達0.070MPa以上,則推定在黏著劑層與被黏物的界面處不易發生微小浮起。又,特別若儲存彈性模數G'(-20)在0.200MPa以下,則因黏著劑層硬度對被黏物的作用小,導致被黏物本身不易出現折痕。藉由綜合性發揮此項作用效果,判斷在廣範圍溫度下,彎折部仍不易出現折痕。具體而言,使上述積層體在0℃、25℃、80℃各溫度下彎折10萬次時,在彎折部仍不易出現折痕。特別該積層體的一彎折性部件為聚醯亞胺薄膜、或含聚醯亞胺薄膜之積層體的情況,仍可發揮上述優異的反覆彎折性。The adhesive of this embodiment, by possessing the aforementioned properties related to the storage modulus G', exhibits excellent repeated bendability when a laminate formed by laminating one bendable component to another using an adhesive layer formed from this adhesive is bent, with little crease formation at the bent portion over a wide temperature range. In particular, when the storage modulus variability exceeds 2.5, excellent adhesion is achieved, suppressing lifting and peeling at the interface between the adhesive layer and the adherend. Furthermore, when the storage modulus G'(-20) is 0.070 MPa or greater, it is estimated that microlifting is less likely to occur at the interface between the adhesive layer and the adherend. Furthermore, especially if the storage elastic modulus G'(-20) is below 0.200 MPa, the adhesive layer's hardness has little effect on the adherend, making it less likely that the adherend itself will crease. By comprehensively utilizing this effect, it is determined that the bends will not crease over a wide temperature range. Specifically, when the laminate is bent 100,000 times at temperatures of 0°C, 25°C, and 80°C, creases will not form at the bends. In particular, when a bendable component of the laminate is a polyimide film or a laminate containing a polyimide film, the above-mentioned excellent repeated bendability can still be exerted.
就從上述反覆彎折性的觀點,上述儲存彈性模數變化度較佳為3.0以上、更佳為3.5以上、特佳為4.0以上。又,上述儲存彈性模數變化度較佳為50以下、更佳為40以下、特佳為35以下、最佳為27以下。藉此,可輕易使低溫至高溫的黏著力與儲存彈性模數收束於較佳範圍。From the perspective of repeated flexing resistance, the storage modulus variation is preferably 3.0 or greater, more preferably 3.5 or greater, and particularly preferably 4.0 or greater. Furthermore, the storage modulus variation is preferably 50 or less, more preferably 40 or less, particularly preferably 35 or less, and most preferably 27 or less. This allows for easy adjustment of the adhesive strength and storage modulus from low to high temperatures within optimal ranges.
再者,就從上述反覆彎折性的觀點,-20℃儲存彈性模數G'(-20)較佳為0.075MPa以上、更佳為0.080MPa以上、特佳為0.090MPa以上。同樣的,就從反覆彎折性的觀點,-20℃儲存彈性模數G'(-20)較佳為0.190MPa以下、更佳為0.180MPa以下、特佳為未滿0.110MPa、最佳為未滿0.100MPa。Furthermore, from the perspective of the aforementioned repeated flexing resistance, the -20°C storage modulus G'(-20) is preferably 0.075 MPa or higher, more preferably 0.080 MPa or higher, and particularly preferably 0.090 MPa or higher. Similarly, from the perspective of repeated flexing resistance, the -20°C storage modulus G'(-20) is preferably 0.190 MPa or lower, more preferably 0.180 MPa or lower, particularly preferably less than 0.110 MPa, and most preferably less than 0.100 MPa.
另外,藉由上述-20℃儲存彈性模數G'(-20)與上述儲存彈性模數變化度同時滿足上述各範圍,不僅可獲得在低溫至高溫的所有溫度範圍內均具優異耐彎折性的裝置,且相關常溫下的黏著劑加工性等處置性亦優異。Furthermore, by simultaneously satisfying the aforementioned ranges for the -20°C storage modulus G'(-20) and the storage modulus variability, not only is a device provided with excellent flexural resistance across the entire temperature range from low to high temperatures, but also excellent handling properties such as adhesive processability at room temperature.
85℃儲存彈性模數G'(85)較佳為0.050MPa以下、更佳為0.040MPa以下、特佳為0.030MPa以下、最佳為0.025MPa以下、最最佳為0.015MPa以下。藉此,儲存彈性模數變化度輕易進入前述範圍內,且隨彎折,從黏著劑層作用於被黏物的力減少,可獲得高溫下的耐彎折性優異之裝置。另一方面,85℃儲存彈性模數G'(85)較佳為0.005MPa以上、更佳為0.008MPa以上、特佳為0.010MPa以上、最佳為0.012MPa以上。若85℃儲存彈性模數G'(85)過低,則高溫下的黏著劑層過軟,導致凝聚力降低,且在彎折部分與非彎折部分處,會於黏著劑層發生密度差等情形,因而黏著劑層本身會發生折痕、白濁等情形。然而,藉由85℃儲存彈性模數G'(85)的上限值設為上述,便不易發生該等不良情況。The storage modulus G'(85) at 85°C is preferably 0.050 MPa or less, more preferably 0.040 MPa or less, particularly preferably 0.030 MPa or less, optimally 0.025 MPa or less, and most optimally 0.015 MPa or less. Thus, the storage modulus variation easily falls within the aforementioned range, and the force acting from the adhesive layer on the adherend decreases with bending, thereby achieving a device with excellent bending resistance at high temperatures. On the other hand, the storage modulus G'(85) at 85°C is preferably 0.005 MPa or more, more preferably 0.008 MPa or more, particularly preferably 0.010 MPa or more, and optimally 0.012 MPa or more. If the 85°C storage modulus G'(85) is too low, the adhesive layer will be too soft at high temperatures, resulting in reduced cohesion, and a density difference will occur in the adhesive layer at the bent part and the non-bent part, so that the adhesive layer itself will have creases, whitening, etc. However, by setting the upper limit of the 85°C storage modulus G'(85) to the above value, such undesirable conditions are less likely to occur.
本實施形態的黏著劑之25℃儲存彈性模數G'(25),較佳為0.080MPa以下、更佳為0.070MPa以下、特佳為0.060MPa以下、最佳為0.050MPa以下。藉此可輕易發揮黏著性。另一方面,25℃儲存彈性模數G'(25)較佳為0.010MPa以上、更佳為0.015MPa以上、特佳為0.020MPa以上、最佳0.025MPa以上。藉此,除在標準環境溫度區域下的反覆彎折性優異之外,刀尖劃割(tip cut)等加工性亦良好。The 25°C storage modulus G'(25) of the adhesive of this embodiment is preferably 0.080 MPa or less, more preferably 0.070 MPa or less, particularly preferably 0.060 MPa or less, and optimally 0.050 MPa or less. This allows for easy development of adhesive properties. On the other hand, the 25°C storage modulus G'(25) is preferably 0.010 MPa or more, more preferably 0.015 MPa or more, particularly preferably 0.020 MPa or more, and optimally 0.025 MPa or more. This allows for excellent repeated bending properties within a standard ambient temperature range and also good processability such as tip cutting.
本實施形態的黏著劑之凝膠分率,較佳為40%以上、更佳為43%以上、特佳為46%以上、最佳為50%以上。藉此,黏著劑可發揮能承受反覆彎折之較佳凝聚力。結果,成為前述反覆彎折性更優異。另一方面,本實施形態的黏著劑之凝膠分率,較佳為95%以下、更佳為90%以下、特佳為85%以下、最佳為80%以下、最最佳為77%以下。藉此,推定可抑制因反覆彎折造成黏著劑中的交聯構造遭破壞,能抑制黏著劑層本身出現白濁。另外,本說明書的凝膠分率之測定方法如後述試驗例所示。The gel fraction of the adhesive of this embodiment is preferably 40% or more, more preferably 43% or more, particularly preferably 46% or more, and optimally 50% or more. This allows the adhesive to exhibit superior cohesive strength capable of withstanding repeated bending. As a result, the aforementioned repeated bending resistance is even better. On the other hand, the gel fraction of the adhesive of this embodiment is preferably 95% or less, more preferably 90% or less, particularly preferably 85% or less, optimally 80% or less, and most optimally 77% or less. This is presumably to suppress the destruction of the cross-linked structure in the adhesive due to repeated bending, and to prevent the adhesive layer from becoming cloudy. The method for determining the gel fraction in this specification is described in the test examples below.
本實施形態黏著劑的種類,在滿足上述物性之前提下,其餘並無特別的限定,可為例如:丙烯酸系黏著劑、聚酯系黏著劑、聚胺酯系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑等中之任一者。又,該黏著劑可為乳膠型、溶劑型或無溶劑型中之任一者,亦可為交聯式或非交聯式中之任一者。該等之中,較佳為輕易滿足前述物性、且黏著物性、光學特性等亦優異的丙烯酸系黏著劑,更佳為溶劑型丙烯酸系黏著劑。The type of adhesive used in this embodiment is not particularly limited, provided it meets the aforementioned physical properties. It may be, for example, any of acrylic, polyester, polyurethane, rubber, and silicone adhesives. Furthermore, the adhesive may be latex-based, solvent-based, or solvent-free, and may be crosslinked or non-crosslinked. Of these, acrylic adhesives are preferred, as they easily meet the aforementioned physical properties and exhibit excellent adhesive and optical properties. Solvent-based acrylic adhesives are even more preferred.
本實施形態的黏著劑具體較佳為由含有:(甲基)丙烯酸酯聚合物(A)、與交聯劑(B)的黏著性組合物(以下亦稱「黏著性組合物P」),進行交聯而成的黏著劑。若為該黏著劑,便可輕易滿足前述物性,且可輕易獲得良好的黏著力。另外,本說明書中,所謂「(甲基)丙烯酸」是指丙烯酸與甲基丙烯酸雙方。其他的類似用詞亦同樣。又,「聚合物」亦涵蓋「共聚物」的概念。The adhesive of this embodiment is preferably a cross-linked adhesive composition (hereinafter referred to as "adhesive composition P") comprising a (meth)acrylate polymer (A) and a crosslinking agent (B). This adhesive easily satisfies the aforementioned physical properties and readily achieves excellent adhesion. In this specification, "(meth)acrylic acid" refers to both acrylic acid and methacrylic acid. The same applies to other similar terms. Furthermore, the term "polymer" also encompasses "copolymer."
(1)黏著性組合物P之成分 (1-1)(甲基)丙烯酸酯聚合物(A) (甲基)丙烯酸酯聚合物(A)較佳為構成該聚合物的單體單元,含有:(甲基)丙烯酸烷基酯、與分子內具有反應性官能基之單體(含反應性官能基之單體)。(1) Components of Adhesive Composition P (1-1) (Meth)acrylate Polymer (A) (Meth)acrylate polymer (A) preferably comprises monomer units comprising an alkyl (meth)acrylate and a monomer having a reactive functional group in the molecule (a monomer containing a reactive functional group).
(甲基)丙烯酸酯聚合物(A)藉由構成該聚合物的單體單元含有(甲基)丙烯酸烷基酯,便可顯現較佳黏著性。(甲基)丙烯酸烷基酯較佳為烷基碳數為1~20之(甲基)丙烯酸烷基酯。烷基可任意為直鏈狀或分支鏈狀,亦可具有環狀構造。The (meth)acrylate polymer (A) exhibits improved adhesion when its monomer units contain an alkyl (meth)acrylate. The alkyl (meth)acrylate is preferably one having 1 to 20 carbon atoms. The alkyl group may be linear or branched, or may have a cyclic structure.
烷基的碳數為1~20的(甲基)丙烯酸烷基酯可舉例如:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸正十二烷酯、(甲基)丙烯酸肉豆蔻酯、(甲基)丙烯酸棕櫚酯、(甲基)丙烯酸硬脂酯等。其中,從前述儲存彈性模數G'相關物性的觀點,較佳為烷基的碳數為1~8的(甲基)丙烯酸酯、更佳為烷基的碳數為4~8的(甲基)丙烯酸酯。具體較佳為(甲基)丙烯酸正丁酯與(甲基)丙烯酸-2-乙基己酯、更佳為丙烯酸正丁酯與丙烯酸-2-乙基己酯。另外,該等可單獨使用1種、亦可組合使用2種以上。Examples of alkyl (meth)acrylates having an alkyl group with 1 to 20 carbon atoms include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-decyl (meth)acrylate, n-dodecyl (meth)acrylate, myristyl (meth)acrylate, benzyl (meth)acrylate, and stearyl (meth)acrylate. From the perspective of the aforementioned properties related to the storage elastic modulus G', (meth)acrylates having an alkyl group with 1 to 8 carbon atoms are preferred, and (meth)acrylates having an alkyl group with 4 to 8 carbon atoms are more preferred. Specifically, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and 2-ethylhexyl acrylate are more preferred. In addition, these may be used alone or in combination of two or more.
(甲基)丙烯酸酯聚合物(A)較佳為構成該聚合物的單體單元之烷基的碳數為1~20之(甲基)丙烯酸烷基酯含有達60質量%以上、更佳為含有達80質量%以上、特佳為含有達90質量%以上、最佳為含有達95質量%以上。若將(甲基)丙烯酸烷基酯設為上述量以上,便可對(甲基)丙烯酸酯聚合物(A)賦予較佳黏著性,且可輕易將儲存彈性模數G'調整於較低值。又,烷基的碳數為1~20的(甲基)丙烯酸烷基酯較佳為含有99.9質量%以下、更佳為含有99.5質量%以下、特佳為含有99.0質量%以下。藉由將(甲基)丙烯酸烷基酯設為上述量以下,便可在(甲基)丙烯酸酯聚合物(A)中導入所需量的其他單體成分。The (meth)acrylate polymer (A) preferably contains 60% by mass or more, more preferably 80% by mass or more, particularly preferably 90% by mass or more, and most preferably 95% by mass or more of an alkyl (meth)acrylate having 1 to 20 carbon atoms in the alkyl group of the monomer units constituting the polymer. When the alkyl (meth)acrylate content is set above this amount, the (meth)acrylate polymer (A) can be imparted with improved adhesion and the storage modulus G' can be easily adjusted to a lower value. Furthermore, the content of 99.9% by mass or less, more preferably 99.5% by mass or less, and particularly preferably 99.0% by mass or less of an alkyl (meth)acrylate having 1 to 20 carbon atoms in the alkyl group is preferably set below this amount. By setting the alkyl (meth)acrylate content below this amount, it is possible to incorporate desired amounts of other monomer components into the (meth)acrylate polymer (A).
(甲基)丙烯酸酯聚合物(A)藉由構成該聚合物的單體單元含有具反應性官能基之單體,經由源自該含反應性官能基單體的反應性官能基,與後述交聯劑(B)產生反應,藉此便形成交聯構造(三維網目構造),可獲得具所需凝聚力的黏著劑。該黏著劑可輕易滿足前述儲存彈性模數G'相關物性(及凝膠分率)。The (meth)acrylate polymer (A) contains a monomer with a reactive functional group in its monomer units. The reactive functional groups derived from the reactive functional group-containing monomer react with the crosslinking agent (B) described below, thereby forming a crosslinked structure (a three-dimensional mesh structure), resulting in an adhesive with the desired cohesive strength. This adhesive can easily meet the aforementioned storage modulus G'-related physical properties (and gel fraction).
(甲基)丙烯酸酯聚合物(A)中,構成該聚合物的單體單元所含有之具反應性官能基單體,較佳可舉例如:分子內具羥基的單體(含羥基單體)、分子內具羧基的單體(含羧基單體)、分子內具胺基的單體(含胺基單體)等。該等含反應性官能基單體可單獨使用1種、亦可併用2種以上。In the (meth)acrylate polymer (A), the monomers comprising the polymer preferably contain a reactive functional group, for example, a monomer containing a hydroxyl group within the molecule (a hydroxyl-containing monomer), a monomer containing a carboxyl group within the molecule (a carboxyl-containing monomer), or a monomer containing an amino group within the molecule (an amino-containing monomer). These reactive functional group-containing monomers may be used alone or in combination of two or more.
上述含反應性官能基單體中,較佳為含羥基單體或含羧基單體、更佳為含羥基單體。含羥基單體可輕易滿足前述儲存彈性模數G'相關物性(及凝膠分率)。即,含反應性官能基單體具有使所獲得黏著劑的儲存彈性模數G'(特別是高溫的儲存彈性模數G')上升之傾向,但若含羥基單體便可抑低上升幅度,可輕易微調整所獲得黏著劑的儲存彈性模數G'。Among the above-mentioned reactive functional group-containing monomers, hydroxyl-containing monomers or carboxyl-containing monomers are preferred, with hydroxyl-containing monomers being even more preferred. Hydroxyl-containing monomers can easily satisfy the aforementioned physical properties related to the storage modulus G' (and gel fraction). Specifically, while reactive functional group-containing monomers tend to increase the storage modulus G' (particularly the high-temperature storage modulus G') of the resulting adhesive, the use of hydroxyl-containing monomers can suppress this increase, making it easy to fine-tune the storage modulus G' of the resulting adhesive.
含羥基單體可舉例如:(甲基)丙烯酸-2-羥乙酯、(甲基)丙烯酸-2-羥丙酯、(甲基)丙烯酸-3-羥丙酯、(甲基)丙烯酸-2-羥丁酯、(甲基)丙烯酸-3-羥丁酯、(甲基)丙烯酸-4-羥丁酯等(甲基)丙烯酸羥烷基酯等。上述中,就從滿足前述儲存彈性模數G'相關物性(及凝膠分率)的容易度觀點,較佳為具碳數為1~4之羥烷基的(甲基)丙烯酸羥烷基酯。具體較佳可例如:(甲基)丙烯酸-2-羥乙酯、(甲基)丙烯酸-4-羥丁酯等,更佳為可例如:丙烯酸-2-羥乙酯或丙烯酸-4-羥丁酯。該等可單獨使用1種、亦可組合使用2種以上。Examples of hydroxyl-containing monomers include hydroxyalkyl (meth)acrylates such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. Of these, hydroxyalkyl (meth)acrylates having a hydroxyalkyl group with 1 to 4 carbon atoms are preferred, given their ease in satisfying the aforementioned storage elastic modulus G' (and gel fraction). Specifically, 2-hydroxyethyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate are preferred, with 2-hydroxyethyl acrylate and 4-hydroxybutyl acrylate being more preferred. These may be used alone or in combination of two or more.
含羧基單體可舉例如:丙烯酸、甲基丙烯酸、巴豆酸、順丁烯二酸、伊康酸、檸康酸等乙烯性不飽和羧酸。其中,就從所獲得(甲基)丙烯酸酯聚合物(A)的黏著力觀點,較佳為丙烯酸。該等可單獨使用1種、亦可組合使用2種以上。Examples of carboxyl group-containing monomers include ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, and citric acid. Of these, acrylic acid is preferred from the perspective of the adhesion of the resulting (meth)acrylate polymer (A). These monomers may be used alone or in combination of two or more.
(甲基)丙烯酸酯聚合物(A)中,構成該聚合物之單體單元的含反應性官能基單體,下限值較佳含有0.1質量%以上、更佳含有0.5質量%以上、特佳含有1.0質量%以上。又,(甲基)丙烯酸酯聚合物(A)中,構成該聚合物的單體單元之含反應性官能基單體上限值,較佳含有10質量%以下、更佳含有7質量%以下、特佳含有5質量%以下。若(甲基)丙烯酸酯聚合物(A)中,依上述量含有單體單元之含反應性官能基單體,則藉由與交聯劑(B)的交聯反應,便可使所獲得黏著劑的凝聚力成為適度、可輕易滿足前述儲存彈性模數G'相關物性(及凝膠分率)、特別是85℃儲存彈性模數G'(85)。In the (meth)acrylate polymer (A), the lower limit of the content of the reactive functional group-containing monomer in the monomer units constituting the polymer is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and particularly preferably 1.0% by mass or more. Furthermore, in the (meth)acrylate polymer (A), the upper limit of the content of the reactive functional group-containing monomer in the monomer units constituting the polymer is preferably 10% by mass or less, more preferably 7% by mass or less, and particularly preferably 5% by mass or less. If the (meth)acrylate polymer (A) contains monomer units containing reactive functional groups in the above-mentioned amount, then through the crosslinking reaction with the crosslinking agent (B), the cohesive force of the obtained adhesive can be made appropriate, and the physical properties related to the aforementioned storage modulus G' (and gel fraction) can be easily satisfied, especially the storage modulus G' (85) at 85°C.
(甲基)丙烯酸酯聚合物(A)中,構成該聚合物的單體單元較佳未含有含羧基單體。因為羧基屬於酸成分,因而藉由未含有含羧基單體,即便黏著劑的黏貼對象因酸而發生不良情況(例如有存在錫摻雜氧化銦(ITO)等透明導電膜、金屬膜、金屬篩網等情況),仍可抑制因酸造成的該等不良情況(腐蝕、電阻值變化等)。The (meth)acrylate polymer (A) preferably does not contain carboxyl-containing monomers in its monomer units. Because carboxyl groups are acidic components, the absence of carboxyl-containing monomers can suppress acid-induced adverse effects (e.g., corrosion, resistance changes, etc.) even when the adhesive is applied to surfaces susceptible to acidic effects (e.g., transparent conductive films such as tin-doped indium oxide (ITO), metal films, and metal meshes).
此處所謂「未含有含羧基單體」,是指實質未含有含羧基單體,除完全未含有含羧基單體之外,亦容許在不會因羧基造成透明導電膜、金屬配線等遭腐蝕的程度內,含有含羧基單體。具體而言,(甲基)丙烯酸酯聚合物(A)中,單體單元的含羧基單體較佳為容許含有0.1質量%以下、更佳為0.01質量%以下、特佳為0.001質量%以下的量。The term "free of carboxyl group-containing monomers" herein means substantially free of carboxyl group-containing monomers. Besides being completely free of carboxyl group-containing monomers, the presence of carboxyl group-containing monomers is also permitted to the extent that the carboxyl groups do not cause corrosion of transparent conductive films, metal wiring, etc. Specifically, the (meth)acrylate polymer (A) preferably contains carboxyl group-containing monomers in a monomer unit at a concentration of 0.1% by mass or less, more preferably 0.01% by mass or less, and particularly preferably 0.001% by mass or less.
(甲基)丙烯酸酯聚合物(A)視所需,構成該聚合物的單體單元可含有其他單體。其他單體為不致阻礙含反應性官能基單體的前述作用,較佳為不含有反應性官能基的單體。該單體可舉例如:N-丙烯醯基啉、N-乙烯基-2-吡咯啶酮等非反應性含氮原子單體;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯;醋酸乙烯酯、苯乙烯等。該等可單獨使用1種、亦可組合使用2種以上。The (meth)acrylate polymer (A) may contain other monomers as needed. Other monomers are monomers that do not hinder the aforementioned effects of the monomer containing a reactive functional group, and preferably do not contain a reactive functional group. Examples of such monomers include N-acryloyl Non-reactive nitrogen-containing monomers such as phenanthene and N-vinyl-2-pyrrolidone; alkoxyalkyl (meth)acrylates such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate; vinyl acetate, styrene, etc. These may be used alone or in combination of two or more.
(甲基)丙烯酸酯聚合物(A)的聚合態樣可為無規共聚物、亦可為嵌段共聚物。The polymerization form of the (meth)acrylate polymer (A) may be a random copolymer or a block copolymer.
(甲基)丙烯酸酯聚合物(A)的重量平均分子量較佳為25萬以上、更佳為30萬以上、特佳為40萬以上、最佳為50萬以上、最最佳為90萬以上。又,(甲基)丙烯酸酯聚合物(A)的重量平均分子量較佳為230萬以下、更佳為200萬以下、特佳為170萬以下、最佳為150萬以下。若(甲基)丙烯酸酯聚合物(A)的重量平均分子量在上述範圍內,便可輕易滿足前述儲存彈性模數G'相關物性、及凝膠分率,特別可輕易滿足前述儲存彈性模數變化度。另外,本說明書中的「重量平均分子量」是利用凝膠滲透色層分析儀(GPC)法所測定的標準聚苯乙烯換算值。The weight-average molecular weight of the (meth)acrylate polymer (A) is preferably 250,000 or greater, more preferably 300,000 or greater, particularly preferably 400,000 or greater, optimally 500,000 or greater, and most optimally 900,000 or greater. Furthermore, the weight-average molecular weight of the (meth)acrylate polymer (A) is preferably 2.3 million or less, more preferably 2 million or less, particularly preferably 1.7 million or less, and optimally 1.5 million or less. When the weight-average molecular weight of the (meth)acrylate polymer (A) is within the above range, it is easy to satisfy the aforementioned properties related to the storage modulus G' and the gel fraction, particularly the aforementioned storage modulus variability. The "weight-average molecular weight" in this specification is a standard polystyrene-equivalent value measured by gel permeation chromatography (GPC).
黏著性組合物P中,(甲基)丙烯酸酯聚合物(A)可單獨使用1種、亦可組合使用2種以上。In the adhesive composition P, the (meth)acrylate polymer (A) may be used alone or in combination of two or more.
(1-2)交聯劑(B) 交聯劑(B)以含有該交聯劑(B)的黏著性組合物P之加熱等為觸發,使(甲基)丙烯酸酯聚合物(A)進行交聯形成三維網目構造。藉此,可提升所獲得黏著劑的凝聚力,輕易滿足前述儲存彈性模數G'相關物性及凝膠分率,特別可輕易滿足前述儲存彈性模數變化度。(1-2) Crosslinking Agent (B) The crosslinking agent (B) is triggered by heating the adhesive composition P containing it, for example, to crosslink the (meth)acrylate polymer (A) to form a three-dimensional network structure. This enhances the cohesive strength of the resulting adhesive, making it easier to meet the aforementioned storage modulus G'-related physical properties and gel fraction requirements, particularly the aforementioned storage modulus variability.
上述交聯劑(B)只要能與(甲基)丙烯酸酯聚合物(A)所具有反應性基產生反應便可,可例如:異氰酸酯系交聯劑、環氧系交聯劑、胺系交聯劑、三聚氰胺系交聯劑、氮丙啶系交聯劑、肼系交聯劑、醛系交聯劑、唑啉系交聯劑、金屬烷氧化物系交聯劑、金屬螯合系交聯劑、金屬鹽系交聯劑、銨鹽系交聯劑等。上述中,較佳為使用與含反應性官能基單體間之反應性優異的異氰酸酯系交聯劑。另外,交聯劑(B)可單獨使用1種、或組合使用2種以上。The crosslinking agent (B) can be any crosslinking agent as long as it reacts with the reactive groups of the (meth)acrylate polymer (A). Examples include isocyanate crosslinking agents, epoxy crosslinking agents, amine crosslinking agents, melamine crosslinking agents, aziridine crosslinking agents, hydrazine crosslinking agents, aldehyde crosslinking agents, oxazoline crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, and ammonium salt crosslinking agents. Of these, isocyanate crosslinking agents are preferred due to their excellent reactivity with monomers containing reactive functional groups. The crosslinking agent (B) can be used alone or in combination of two or more.
異氰酸酯系交聯劑至少含有聚異氰酸酯化合物。聚異氰酸酯化合物可例如:甲苯二異氰酸酯、二苯基甲烷二異氰酸酯、二甲苯撐基二異氰酸酯(xylylene diisocyanate)等芳香族聚異氰酸酯;六亞甲基二異氰酸酯等脂肪族聚異氰酸酯;異佛爾酮二異氰酸酯、氫化二苯基甲烷二異氰酸酯等脂環式聚異氰酸酯等、以及該等的縮二脲體、三聚異氰酸酯體;以及與例如:乙二醇、丙二醇、新戊二醇、三羥甲基丙烷、蓖麻油等含低分子活性氫化合物的反應產物亦即加成體等。其中,就從與羥基之反應性的觀點,較佳為三羥甲基丙烷改質之芳香族聚異氰酸酯,更佳為三羥甲基丙烷改質甲苯二異氰酸酯、或三羥甲基丙烷改質二甲苯撐基二異氰酸酯。Isocyanate crosslinking agents contain at least a polyisocyanate compound. Examples of polyisocyanate compounds include aromatic polyisocyanates such as toluene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; aliphatic polyisocyanates such as hexamethylene diisocyanate; alicyclic polyisocyanates such as isophorone diisocyanate and hydrogenated diphenylmethane diisocyanate; their biuret and trimer forms; and their reaction products, i.e., adducts, with low-molecular-weight active hydrogen-containing compounds such as ethylene glycol, propylene glycol, neopentyl glycol, trihydroxymethylpropane, and castor oil. Among them, from the viewpoint of reactivity with hydroxyl groups, trihydroxymethylpropane-modified aromatic polyisocyanates are preferred, and trihydroxymethylpropane-modified toluene diisocyanate or trihydroxymethylpropane-modified xylene diisocyanate are more preferred.
黏著性組合物P中的交聯劑(B)含有量,相對於(甲基)丙烯酸酯聚合物(A)100質量份,較佳為0.01質量份以上、更佳為0.06質量份以上、特佳為0.12質量份以上。又,該含有量較佳為2.0質量份以下、更佳為1.5質量份以下、特佳為1.0質量份以下、最佳為0.5質量份以下。若交聯劑(B)的含有量在上述範圍內,便可輕易滿足前述儲存彈性模數G'相關物性及凝膠分率,特別輕易滿足前述儲存彈性模數變化度。The content of the crosslinking agent (B) in the adhesive composition P is preferably 0.01 parts by mass or greater, more preferably 0.06 parts by mass or greater, and particularly preferably 0.12 parts by mass or greater, relative to 100 parts by mass of the (meth)acrylate polymer (A). Furthermore, the content is preferably 2.0 parts by mass or less, more preferably 1.5 parts by mass or less, particularly preferably 1.0 parts by mass or less, and most preferably 0.5 parts by mass or less. When the content of the crosslinking agent (B) is within the above range, the aforementioned properties related to the storage modulus G' and the gel fraction can be easily met, particularly the aforementioned storage modulus variability.
(1-3)各種添加劑 黏著性組合物P中,視所需,亦可添加丙烯酸系黏著劑通常使用的各種添加劑,例如:矽烷偶合劑、紫外線吸收劑、抗靜電劑、賦黏劑、抗氧化劑、光安定劑、軟化劑、填充劑、折射率調整劑等。另外,後述聚合溶劑與稀釋溶劑並未包含於構成黏著性組合物P的添加劑中。(1-3) Various Additives Adhesive composition P may optionally contain various additives commonly used in acrylic adhesives, such as silane coupling agents, UV absorbers, antistatic agents, tackifiers, antioxidants, light stabilizers, softeners, fillers, and refractive index modifiers. The polymerization solvent and diluent described below are not included in the additives that constitute adhesive composition P.
黏著性組合物P較佳含有上述矽烷偶合劑。藉此,所獲得黏著劑層可提升與被黏物之彎折性部件間的密接性,使黏著力更佳。The adhesive composition P preferably contains the aforementioned silane coupling agent. Thus, the resulting adhesive layer can enhance the adhesion to the flexible component of the adherend, resulting in better adhesion.
矽烷偶合劑就從與(甲基)丙烯酸酯聚合物(A)間之相溶性佳、且具有透光性的觀點,較佳為分子內具有至少1個烷氧基矽基的有機矽化合物。The silane coupling agent is preferably an organic silicon compound having at least one alkoxysilyl group in its molecule from the viewpoint of good compatibility with the (meth)acrylate polymer (A) and light transparency.
該矽烷偶合劑可舉例如:乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、甲基丙烯醯氧基丙基三甲氧基矽烷等含聚合性不飽和基之矽化合物;3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷等具環氧構造之矽化合物;3-巰丙基三甲氧基矽烷、3-巰丙基三乙氧基矽烷、3-巰丙基二甲氧基甲基矽烷等含巰基之矽化合物;3-胺丙基三甲氧基矽烷、N-(2-胺乙基)-3-胺丙基三甲氧基矽烷、N-(2-胺乙基)-3-胺丙基甲基二甲氧基矽烷等含胺基之矽化合物;3-氯丙基三甲氧基矽烷、3-異氰酸酯丙基三乙氧基矽烷;或由該等中至少1者、與例如:甲基三乙氧基矽烷、乙基三乙氧基矽烷、甲基三甲氧基矽烷、乙基三甲氧基矽烷等含烷基之矽化合物的縮合物等。該等可單獨使用1種、亦可組合使用2種以上。Examples of the silane coupling agent include: vinyl trimethoxysilane, vinyl triethoxysilane, methacryloyloxypropyl trimethoxysilane and other silane compounds containing polymerizable unsaturated groups; 3-glycidoxypropyl trimethoxysilane, 3-glycidoxypropyl methyl dimethoxysilane, 2-(3,4-epoxycyclohexyl) ethyl trimethoxysilane and other silane compounds with epoxy structures; 3-butyl trimethoxysilane, 3-butyl triethoxysilane, 3-butyl dimethoxymethyl silane and the like. Silicon compounds containing alkyl groups; amino group-containing silicon compounds such as 3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, and N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane; 3-chloropropyltrimethoxysilane, and 3-isocyanatepropyltriethoxysilane; or condensates of at least one of these with alkyl group-containing silicon compounds such as methyltriethoxysilane, ethyltriethoxysilane, methyltrimethoxysilane, and ethyltrimethoxysilane. These compounds may be used alone or in combination of two or more.
黏著性組合物P中的矽烷偶合劑含有量,相對於(甲基)丙烯酸酯聚合物(A)100質量份,較佳為0.01質量份以上、更佳為0.05質量份以上、特佳為0.1質量份以上。又,該含有量較佳為1質量份以下、更佳為0.5質量份以下、特佳為0.3質量份以下。藉由矽烷偶合劑的含有量在上述範圍內,所獲得黏著劑層便提升與被黏物之彎折性部件間的密接性,使黏著力更大。The silane coupling agent content in the adhesive composition P is preferably 0.01 parts by mass or greater, more preferably 0.05 parts by mass or greater, and particularly preferably 0.1 parts by mass or greater, relative to 100 parts by mass of the (meth)acrylate polymer (A). Furthermore, the content is preferably 1 part by mass or less, more preferably 0.5 parts by mass or less, and particularly preferably 0.3 parts by mass or less. When the silane coupling agent content is within this range, the resulting adhesive layer improves adhesion to the flexible component of the adherend, resulting in greater adhesion.
(2)黏著性組合物P之製造 黏著性組合物P為製造(甲基)丙烯酸酯聚合物(A),再將所獲得(甲基)丙烯酸酯聚合物(A)、與交聯劑(B)進行混合,且視所需加入添加劑便可製造。(2) Preparation of Adhesive Composition P The adhesive composition P is prepared by preparing a (meth)acrylate polymer (A), mixing the obtained (meth)acrylate polymer (A) with a crosslinking agent (B), and adding additives as needed.
(甲基)丙烯酸酯聚合物(A)為將構成聚合物的單體混合物,利用通常的自由基聚合法進行聚合便可製造。(甲基)丙烯酸酯聚合物(A)的聚合,最好視所需使用聚合開始劑,利用溶液聚合法實施。藉由利用溶液聚合法使(甲基)丙烯酸酯聚合物(A)進行聚合,便可輕易使所獲得聚合物呈高分子量化、與進行子量分佈調整,更可減少低分子量體生成。所以,即便凝膠分率較小、緩和交聯程度的情況,仍不易因反覆彎折發生黏著劑偏頗情形,可輕易獲得反覆彎折性優異的黏著劑。(Meth)acrylate polymer (A) is a mixture of monomers that constitute the polymer, and can be produced by conventional free radical polymerization. Polymerization of (meth)acrylate polymer (A) is preferably carried out by solution polymerization, using a polymerization initiator as needed. By polymerizing (meth)acrylate polymer (A) by solution polymerization, it is easy to increase the molecular weight of the resulting polymer, adjust its molecular weight distribution, and reduce the formation of low-molecular-weight products. Therefore, even with a low gel fraction and a moderate degree of crosslinking, the adhesive is less likely to become biased due to repeated flexing, making it easy to obtain an adhesive with excellent repeated flexing properties.
溶液聚合法所使用的聚合溶劑,可例如:醋酸乙酯、醋酸正丁酯、醋酸異丁酯、甲苯、丙酮、己烷、甲乙酮等,亦可併用2種以上。The polymerization solvent used in the solution polymerization method may be, for example, ethyl acetate, n-butyl acetate, isobutyl acetate, toluene, acetone, hexane, methyl ethyl ketone, etc., and two or more thereof may be used in combination.
聚合開始劑可舉例如:偶氮系化合物、有機過氧化物等,亦可併用2種以上。偶氮系化合物可舉例如:2,2'-偶氮雙異丁腈、2,2'-偶氮雙(2-甲基丁腈)、1,1'-偶氮雙(環己烷-1-羰腈)、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙(2,4-二甲基-4-甲氧基戊腈)、二甲基-2,2'-偶氮雙(2-甲基丙酸酯)、4,4'-偶氮雙(4-氰基戊酸)、2,2'-偶氮雙(2-羥甲基丙腈)、2,2'-偶氮雙[2-(2-咪唑啉-2-基)丙烷]等。Examples of polymerization initiators include azo compounds and organic peroxides, and two or more types may be used in combination. Examples of azo compounds include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethyl-4-methoxyvaleronitrile), dimethyl-2,2'-azobis(2-methylpropionate), 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobis(2-hydroxymethylpropionitrile), and 2,2'-azobis[2-(2-imidazolin-2-yl)propane].
有機過氧化物可舉例如:過氧化苯甲醯、過氧化苯甲酸第三丁基酯、異丙苯過氧化氫、過氧化二碳酸二異丙酯、過氧化二碳酸二正丙酯、過氧化二碳酸二(2-乙氧基乙酯)、過氧化新癸酸第三丁酯、過氧化三甲乙酸第三丁酯、(3,5,5-三甲基己醯基)過氧化物、過氧化二丙醯、過氧化二乙醯等。Examples of organic peroxides include benzoyl peroxide, t-butyl perbenzoate, isopropyl hydroperoxide, diisopropyl peroxydicarbonate, di-n-propyl peroxydicarbonate, di(2-ethoxyethyl) peroxydicarbonate, t-butyl peroxyneodecanoate, t-butyl peroxytrimethylacetate, (3,5,5-trimethylhexanoyl) peroxide, dipropyl peroxide, and diacetyl peroxide.
另外,上述聚合步驟中,藉由摻合2-巰基乙醇等鏈轉移劑,便可調節所獲得聚合物的重量平均分子量。In addition, during the polymerization step, the weight average molecular weight of the obtained polymer can be adjusted by adding a chain transfer agent such as 2-hydroxyethanol.
若獲得(甲基)丙烯酸酯聚合物(A)之後,便在(甲基)丙烯酸酯聚合物(A)的溶液中,添加交聯劑(B)、以及視所需的添加劑與稀釋溶劑,經充分混合,便獲得經溶劑稀釋的黏著性組合物P(塗佈溶液)。After obtaining the (meth)acrylate polymer (A), a crosslinking agent (B), and optionally, additives and a diluent are added to the (meth)acrylate polymer (A) solution. After thorough mixing, a solvent-diluted adhesive composition P (coating solution) is obtained.
另外,當上述各成分中有任一者使用固態狀的情況,或者依未稀釋狀態與其他成分混合時有產生析出的情況,亦可預先將該成分單獨溶解(稀釋)於稀釋溶劑中之後,才與其他成分混合。In addition, when any of the above components is used in a solid state, or when it precipitates when mixed with other components in an undiluted state, the component can be dissolved (diluted) in a diluent before mixing with other components.
上述稀釋溶劑可使用例如:己烷、庚烷、環己烷等脂肪族烴;甲苯、二甲苯等芳香族烴;二氯甲烷、氯化乙烯等鹵化烴;甲醇、乙醇、丙醇、丁醇、1-甲氧基-2-丙醇等醇;丙酮、甲乙酮、2-戊酮、異佛爾酮、環己酮等酮;醋酸乙酯、醋酸丁酯等酯;乙基賽珞蘇等賽珞蘇系溶劑等等。Examples of the diluent include aliphatic hydrocarbons such as hexane, heptane, and cyclohexane; aromatic hydrocarbons such as toluene and xylene; halogenated hydrocarbons such as dichloromethane and ethylene chloride; alcohols such as methanol, ethanol, propanol, butanol, and 1-methoxy-2-propanol; ketones such as acetone, methyl ethyl ketone, 2-pentanone, isophorone, and cyclohexanone; esters such as ethyl acetate and butyl acetate; and cellosol-based solvents such as ethylcellosol.
依此所調製塗佈溶液的濃度・黏度,只要在可塗佈的範圍內,其餘並無特別的限制,可配合狀況再行適當選定。例如依黏著性組合物P的濃度成為10~60質量%方式進行稀釋。另外,獲得塗佈溶液時,稀釋溶劑等的添加並非屬必要條件,若黏著性組合物P呈現可塗佈的黏度等,則亦可不用添加稀釋溶劑。此情況,黏著性組合物P成為直接將(甲基)丙烯酸酯聚合物(A)的聚合溶劑當作稀釋溶劑的塗佈溶液。The concentration and viscosity of the prepared coating solution are not particularly limited, as long as they are within the coatable range, and can be appropriately selected based on the application conditions. For example, the adhesive composition P can be diluted to a concentration of 10-60% by mass. Furthermore, the addition of a diluent is not essential when preparing the coating solution. If the adhesive composition P exhibits a coatable viscosity, the addition of a diluent is not necessary. In this case, the adhesive composition P becomes a coating solution using the (meth)acrylate polymer (A) polymerization solvent as the diluent.
(3)黏著劑之製造 本實施形態的黏著劑較佳由黏著性組合物P進行交聯而成。黏著性組合物P的交聯,通常可利用加熱處理實施。另外,該加熱處理亦可兼為在從所需對象物上塗佈的黏著性組合物P塗膜中,揮發稀釋溶劑等之時的乾燥處理。(3) Adhesive Preparation The adhesive of this embodiment is preferably formed by crosslinking the adhesive composition P. Crosslinking of the adhesive composition P can generally be performed by heat treatment. Furthermore, the heat treatment can also serve as a drying process when the diluent solvent is evaporated from the film of the adhesive composition P applied to the desired object.
加熱處理的加熱溫度較佳為50~150℃、更佳為70~120℃。又,加熱時間較佳為10秒~10分鐘、更佳為50秒~2分鐘。The heating temperature of the heat treatment is preferably 50 to 150° C., more preferably 70 to 120° C. The heating time is preferably 10 seconds to 10 minutes, more preferably 50 seconds to 2 minutes.
經加熱處理後,視需要亦可設計依常溫(例如23℃、50%RH)施行1~2週程度的養生期間。當需要該養生期間的情況,便在經養生期間後形成黏著劑,而不需要養生期間的情況,便在加熱處理結束後形成黏著劑。After the heat treatment, a curing period of 1-2 weeks at room temperature (e.g., 23°C, 50% RH) can be designed as needed. If this curing period is required, the adhesive is formed after the curing period. If it is not required, the adhesive is formed after the heat treatment is completed.
利用上述加熱處理(及養生),經由交聯劑(B)使(甲基)丙烯酸酯聚合物(A)充分交聯而形成交聯構造,便可獲得黏著劑。By utilizing the aforementioned heat treatment (and curing), the (meth)acrylate polymer (A) is fully crosslinked by the crosslinking agent (B) to form a crosslinked structure, thereby obtaining an adhesive.
[黏著片] 本實施形態的黏著片具有供將構成反覆彎折裝置之一彎折性部件與另一彎折性部件,進行貼合用的黏著劑層,而該黏著劑層由前述黏著劑構成。[Adhesive Sheet] The adhesive sheet of this embodiment includes an adhesive layer for bonding one bendable member and another bendable member constituting the reciprocating bend mechanism. This adhesive layer is composed of the aforementioned adhesive.
本實施形態的黏著片一例之具體構成,如圖1所示。 如圖1所示,一實施形態的黏著片1由:2片剝離片12a,12b、及黏著劑層11構成。該黏著劑層11依鄰接該等2片剝離片12a,12b之剝離面的方式,由該2片剝離片12a,12b挾持。另外,本說明書中所謂「剝離片的剝離面」是指剝離片中具有剝離性之一面,包括經施行剝離處理過的面,以及即便未施行剝離處理但仍呈剝離性之面等任一者。Figure 1 shows the specific structure of an adhesive sheet according to one embodiment. As shown in Figure 1, the adhesive sheet 1 according to one embodiment comprises two release sheets 12a and 12b, and an adhesive layer 11. The adhesive layer 11 is held by the release sheets 12a and 12b, adjacent to their respective release surfaces. As used herein, the term "release surface of a release sheet" refers to a releasable surface of the release sheet, including both surfaces that have been subjected to a release treatment and surfaces that remain releasable even without a release treatment.
(1)構成要件 (1-1)黏著劑層 黏著劑層11由前述實施形態的黏著劑構成,較佳由黏著性組合物P進行交聯形成的黏著劑構成。(1) Constituent Elements (1-1) Adhesive Layer The adhesive layer 11 is composed of the adhesive of the aforementioned embodiment, preferably an adhesive formed by crosslinking the adhesive composition P.
本實施形態的黏著片1中,黏著劑層11的厚度(根據JIS K7130測定的值)下限值較佳為1μm以上、更佳為5μm以上、特佳為10μm以上、最佳為15μm以上。若黏著劑層11的厚度下限值為上述,便可輕易發揮所需的黏著力,能更有效抑制彎折部出現折痕情形。又,黏著劑層11的厚度上限值較佳為300μm以下、更佳為150μm以下、特佳為90μm以下,就從可獲得更薄反覆彎折裝置的觀點,最佳為40μm以下。若黏著劑層11的厚度上限值為上述,則在彎折時,從黏著劑層作用於被黏物的力被緩和,而輕易改善反覆彎折性。另外,黏著劑層11可依單層形成,亦可由複數層積層形成。In the adhesive sheet 1 of this embodiment, the lower limit of the thickness of the adhesive layer 11 (measured in accordance with JIS K7130) is preferably 1 μm or greater, more preferably 5 μm or greater, particularly preferably 10 μm or greater, and most preferably 15 μm or greater. This lower limit allows the required adhesive force to be readily exerted, effectively suppressing the formation of creases in the bent portion. Furthermore, the upper limit of the thickness of the adhesive layer 11 is preferably 300 μm or less, more preferably 150 μm or less, and particularly preferably 90 μm or less. To achieve a thinner repetitive bending device, it is most preferably 40 μm or less. If the upper limit of the thickness of the adhesive layer 11 is within the above range, the force acting from the adhesive layer on the adherend during bending is mitigated, thereby easily improving the repeated bending resistance. In addition, the adhesive layer 11 can be formed as a single layer or as a plurality of laminated layers.
本實施形態的黏著片1中,黏著劑層11的全光線穿透率(根據JIS K7361-1:1997測定的值),較佳為80%以上、更佳為90%以上、特佳為95%以上、最佳為99%以上。若全光線穿透率為上述,則透明性高,頗適用於光學用途(反覆彎折顯示器用)。In the adhesive sheet 1 of this embodiment, the total light transmittance of the adhesive layer 11 (measured in accordance with JIS K7361-1:1997) is preferably 80% or greater, more preferably 90% or greater, particularly preferably 95% or greater, and most preferably 99% or greater. This total light transmittance provides high transparency and is suitable for optical applications (such as for folding displays).
(1-2)剝離片 剝離片12a,12b直到使用黏著片1之前均保護著黏著劑層11,在使用黏著片1(黏著劑層11)時將被剝離。本實施形態的黏著片1未必一定需要剝離片12a,12b其中一者或雙方。(1-2) Peel Sheet Peel sheets 12a and 12b protect the adhesive layer 11 until the adhesive sheet 1 is used. They are peeled off when the adhesive sheet 1 (adhesive layer 11) is used. The adhesive sheet 1 of this embodiment does not necessarily require either or both of the peel sheets 12a and 12b.
剝離片12a,12b可使用例如:聚乙烯薄膜、聚丙烯薄膜、聚丁烯薄膜、聚丁二烯薄膜、聚甲基戊烯薄膜、聚氯乙烯薄膜、氯乙烯共聚物薄膜、聚對苯二甲酸乙二酯薄膜、聚萘二甲酸乙二酯薄膜、聚對苯二甲酸丁二酯薄膜、聚氨酯薄膜、乙烯-醋酸乙烯酯薄膜、離子聚合物樹脂薄膜、乙烯・(甲基)丙烯酸共聚物薄膜、乙烯・(甲基)丙烯酸酯共聚物薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜、聚醯亞胺薄膜、氟樹脂薄膜等。又,亦可使用該等的交聯薄膜。又,亦可為該等的積層薄膜。The release sheets 12a and 12b may be made of, for example, polyethylene film, polypropylene film, polybutylene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate film, ionomer resin film, ethylene-(meth)acrylic acid copolymer film, ethylene-(meth)acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, or fluororesin film. Furthermore, crosslinked films or laminated films of these materials may also be used.
對上述剝離片12a,12b的剝離面(特別是鄰接黏著劑層11之一面),最好施行剝離處理。剝離處理時所使用的剝離劑可舉例如:醇酸系、聚矽氧系、氟系、不飽和聚酯系、聚烯烴系、蠟系等剝離劑。另外,剝離片12a,12b中,最好將其中剝離片設為剝離力較大的重剝離型剝離片,而將另一剝離片設為剝離力較小的輕剝離型剝離片。The release surfaces of the release sheets 12a and 12b (particularly the surface adjacent to the adhesive layer 11) are preferably subjected to a release treatment. Examples of release agents used in the release treatment include alkyd, silicone, fluorine, unsaturated polyester, polyolefin, and wax-based release agents. Furthermore, it is preferable that one of the release sheets 12a and 12b be a heavy-peel type with a greater release force, while the other be a light-peel type with a lesser release force.
相關剝離片12a,12b的厚度並無特別的限制,通常為20~150μm程度。There is no particular limitation on the thickness of the peeling sheets 12a and 12b, and the thickness is usually about 20 to 150 μm.
(2)黏著力 本實施形態黏著片1對聚醯亞胺的黏著力,下限值較佳為6N/25mm以上、更佳為8N/25mm以上、特佳為10N/25mm以上、最佳為12N/25mm以上。若黏著片1對聚醯亞胺的黏著力下限值為上述,則以聚醯亞胺薄膜等為被黏物時,可更有效抑制彎折部出現折痕。另一方面,相關上述黏著力的上限值,有黏著劑交聯不足的情況、黏著力呈較高值的情況。依此,當黏著劑交聯不足的情況,因反覆彎折導致在黏著劑中產生密度分佈,造成黏著劑中會有出現折痕等的情況。就從此種觀點,黏著力較佳為50N/25mm以下、更佳為40N/25mm以下、特佳為30N/25mm以下、最佳為20N/25mm以下。另外,本說明書中的「黏著力」是指基本根據JIS Z0237:2009的180度拉剝法所測定之黏著力;具體的試驗方法如後述試驗例所示。(2) Adhesion The adhesive strength of the adhesive sheet 1 of this embodiment to polyimide preferably has a lower limit of 6 N/25 mm or more, more preferably 8 N/25 mm or more, particularly preferably 10 N/25 mm or more, and most preferably 12 N/25 mm or more. If the lower limit of the adhesive strength of the adhesive sheet 1 to polyimide is as described above, the occurrence of creases at the bent portion can be more effectively suppressed when a polyimide film or the like is used as an adherend. On the other hand, regarding the upper limit of the adhesive strength described above, there are cases where the adhesive is insufficiently cross-linked, and cases where the adhesive strength is relatively high. Accordingly, when the adhesive is insufficiently cross-linked, a density distribution is generated in the adhesive due to repeated bending, resulting in the occurrence of creases in the adhesive. From this perspective, the adhesive force is preferably 50 N/25 mm or less, more preferably 40 N/25 mm or less, particularly preferably 30 N/25 mm or less, and most preferably 20 N/25 mm or less. Furthermore, the term "adhesion" in this specification refers to the adhesive force measured using the 180-degree pull-peel method according to JIS Z0237:2009. The specific test method is described in the test examples below.
本實施形態黏著片1對鈉鈣玻璃的黏著力,下限值較佳為1.0N/25mm以上、更佳為2.0N/25mm以上、特佳為3.0N/25mm以上、最佳為5.0N/25mm以上。若黏著片1對鈉鈣玻璃的黏著力下限值如上述,則將由各種材料所構成部件使用為被黏物時,仍可更有效地抑制彎折部出現折痕。另一方面,上述黏著力的上限值並無特別的限定,通常較佳為50N/25mm以下、更佳為40N/25mm以下,就從黏著片出現貼合失誤時黏著片可重貼的重工性觀點,特佳為30N/25mm以下、最佳為20N/25mm以下。The adhesive strength of the adhesive sheet 1 of this embodiment to sodium calcium glass preferably has a lower limit of 1.0 N/25 mm or greater, more preferably 2.0 N/25 mm or greater, particularly preferably 3.0 N/25 mm or greater, and most preferably 5.0 N/25 mm or greater. If the lower limit of the adhesive strength of the adhesive sheet 1 to sodium calcium glass is as described above, the formation of creases at the bent portion can be more effectively suppressed when components made of various materials are used as adherends. On the other hand, the upper limit of the adhesive strength described above is not particularly limited, but is generally preferably 50 N/25 mm or less, more preferably 40 N/25 mm or less. From the perspective of reworkability, allowing the adhesive sheet to be reattached in the event of an adhesive bonding error, it is particularly preferably 30 N/25 mm or less, and most preferably 20 N/25 mm or less.
本實施形態黏著片1對無鹼玻璃的黏著力,下限值較佳為1.0N/25mm以上、更佳為2.0N/25mm以上、特佳為3.0N/25mm以上、最佳為5.0N/25mm以上。若黏著片1對無鹼玻璃的黏著力下限值如上述,則將由各種材料所構成部件使用為被黏物時,仍可更有效地抑制彎折部出現折痕。另一方面,上述黏著力的上限值並無特別的限定,通常較佳為50N/25mm以下、更佳為40N/25mm以下,就從黏著片出現貼合失誤時黏著片可重貼的重工性觀點,特佳為30N/25mm以下、最佳為15N/25mm以下。The adhesive strength of the adhesive sheet 1 of this embodiment to alkali-free glass preferably has a lower limit of 1.0 N/25 mm or greater, more preferably 2.0 N/25 mm or greater, particularly preferably 3.0 N/25 mm or greater, and most preferably 5.0 N/25 mm or greater. If the adhesive sheet 1 has the above lower limit, the formation of creases at the bent portion can be more effectively suppressed when components made of various materials are used as adherends. On the other hand, the upper limit of the adhesive strength is not particularly limited, but is generally preferably 50 N/25 mm or less, more preferably 40 N/25 mm or less. From the perspective of reworkability, allowing the adhesive sheet to be reattached in the event of an adhesive bonding error, it is particularly preferably 30 N/25 mm or less, and most preferably 15 N/25 mm or less.
(3)黏著片之製造 就黏著片1之一製造例,針對使用上述黏著性組合物P的情況進行說明。在其中一剝離片12a(或12b)之剝離面上,塗佈黏著性組合物P之塗佈液,施行加熱處理使黏著性組合物P進行熱交聯而形成塗佈層之後,在該塗佈層上重疊另一剝離片12b(或12a)之剝離面。當需要養生期間的情況便經養生期間後,使上述塗佈層成為黏著劑層11,又當不需要養生期間的情況便直接由上述塗佈層成為黏著劑層11。藉此,獲得上述黏著片1。相關加熱處理與養生的條件,如前述。(3) Production of Adhesive Sheet A production example of an adhesive sheet 1 will be described using the adhesive composition P described above. A coating liquid of the adhesive composition P is applied to the release surface of one release sheet 12a (or 12b), and a heat treatment is applied to thermally crosslink the adhesive composition P to form a coating layer. The release surface of another release sheet 12b (or 12a) is then superimposed on the coating layer. If a curing period is required, the coating layer is then converted into the adhesive layer 11. If a curing period is not required, the coating layer is directly converted into the adhesive layer 11. Thus, the adhesive sheet 1 is obtained. The relevant heat treatment and curing conditions are as described above.
黏著片1之另一製造例,是在其中一剝離片12a的剝離面上,塗佈黏著性組合物P的塗佈液,經施行加熱處理使黏著性組合物P進行熱交聯而形成塗佈層,獲得具塗佈層之剝離片12a。又,在另一剝離片12b的剝離面上,塗佈上述黏著性組合物P的塗佈液,施行加熱處理使黏著性組合物P進行熱交聯而形成塗佈層,獲得具塗佈層之剝離片12b。然後,將具塗佈層之剝離片12a、與具塗佈層之剝離片12b,依二塗佈層相互接觸的方式進行貼合。當需要養生期間的情況便經養生期間後,使上述所積層的塗佈層成為黏著劑層11,又當不需要養生期間的情況便直接由上述所積層的塗佈層成為黏著劑層11。藉此,獲得上述黏著片1。根據該製造例,即便黏著劑層11較厚的情況,仍可穩定地製造。Another example of manufacturing the adhesive sheet 1 is to apply a coating liquid of the adhesive composition P to the release surface of one release sheet 12a, and then heat-treat the release surface to thermally crosslink the adhesive composition P to form a coating layer, thereby obtaining release sheet 12a having a coating layer. Furthermore, the coating liquid of the adhesive composition P is applied to the release surface of another release sheet 12b, and then heat-treat the release surface to thermally crosslink the adhesive composition P to form a coating layer, thereby obtaining release sheet 12b having a coating layer. Next, the peeling sheet 12a with a coating layer and the peeling sheet 12b with a coating layer are bonded together so that the coating layers are in contact with each other. If a curing period is required, the deposited coating layer becomes the adhesive layer 11 after the curing period. If a curing period is not required, the deposited coating layer becomes the adhesive layer 11 directly. Thus, the adhesive sheet 1 is obtained. This manufacturing example allows for stable production even when the adhesive layer 11 is relatively thick.
上述黏著性組合物P之塗佈液的塗佈方法,可利用例如:棒塗法、刀塗法、輥塗法、刮刀塗佈法、模具塗佈法、凹版塗佈法等。The coating liquid of the adhesive composition P may be applied by, for example, rod coating, knife coating, roller coating, doctor blade coating, die coating, gravure coating, etc.
[反覆彎折積層部件] 如圖2所示,本實施形態的反覆彎折積層部件2具備有:第1彎折性部件21(一彎折性部件)、第2彎折性部件22(另一彎折性部件)、以及位於該等之間且將第1彎折性部件21與第2彎折性部件22相互貼合的黏著劑層11構成。[Repeatedly Folded Layer Member] As shown in Figure 2, the repeatedly folded layer member 2 of this embodiment comprises a first foldable member 21 (one foldable member), a second foldable member 22 (the other foldable member), and an adhesive layer 11 positioned therebetween to bond the first foldable member 21 and the second foldable member 22 to each other.
上述反覆彎折積層部件2的黏著劑層11為前述黏著片1的黏著劑層11。The adhesive layer 11 of the repeatedly folded layer component 2 is the adhesive layer 11 of the adhesive sheet 1 .
反覆彎折積層部件2是反覆彎折裝置本身,或者構成反覆彎折裝置其中一部分的部件。反覆彎折裝置較佳為可反覆彎折(包括彎曲)的顯示器,惟並不僅侷限於此。該反覆彎折裝置可舉例如:有機電致發光(有機EL)顯示器、電泳方式顯示器(電子紙)、基板使用塑膠基板(薄膜)的液晶顯示器、折疊式顯示器(foldable display)等,亦可為觸控板。The repetitively folding layer component 2 is the repetitively folding device itself, or a component that constitutes a portion of the repetitively folding device. The repetitively folding device is preferably a repetitively foldable (including curved) display, but is not limited thereto. Examples of such repetitively folding devices include organic electroluminescent (EL) displays, electrophoretic displays (electronic paper), liquid crystal displays using plastic substrates (films), foldable displays, and touch panels.
第1彎折性部件21與第2彎折性部件22是可反覆彎折(包括彎曲)的部件,可例如:覆蓋膜、阻障膜、硬塗薄膜、偏光膜(偏光板)、偏光元件、相位差薄膜(相位差板)、視野角補償薄膜、輝度提升薄膜、對比提升薄膜、擴散薄膜、半穿透反射薄膜、電極薄膜、透明導電性薄膜、金屬篩網薄膜、薄膜感測器(觸控感測膜)、液晶高分子薄膜、發光聚合物薄膜、薄膜狀液晶模組、有機EL模組(有機EL薄膜、有機EL元件)、電子紙模組(薄膜狀電子紙)、TFT(Thin Film Transistor)基板等。The first bendable component 21 and the second bendable component 22 are components that can be repeatedly bent (including bending), and can be, for example: a covering film, a barrier film, a hard coating film, a polarizing film (polarizing plate), a polarizing element, a phase difference film (phase difference plate), a viewing angle compensation film, a brightness enhancement film, a contrast enhancement film, a diffusion film, a semi-transmitting reflective film, an electrode film, a transparent conductive film, a metal screen film, a thin film sensor (touch sensing film), a liquid crystal polymer film, a light-emitting polymer film, a thin film liquid crystal module, an organic EL module (organic EL film, organic EL element), an electronic paper module (thin film electronic paper), a TFT (Thin Film Transistor) substrate, etc.
上述中,較佳第1彎折性部件21或第2彎折性部件22至少其中一者,為聚醯亞胺薄膜、或在黏著劑層11側設有聚醯亞胺薄膜的積層體。一般聚醯亞胺薄膜在與黏著劑層間之密接性低,但根據本實施形態的黏著劑層11,即便聚醯亞胺薄膜為被黏物,但仍可成為反覆彎折性優異、廣範圍溫度下在彎折部不易出現折痕。In the above, at least one of the first bendable member 21 or the second bendable member 22 is preferably a polyimide film, or a laminate of a polyimide film provided on the side of the adhesive layer 11. While polyimide film generally has poor adhesion to the adhesive layer, the adhesive layer 11 of this embodiment exhibits excellent flexing properties even when the polyimide film is the adherend, and creases are less likely to form at the bend over a wide temperature range.
第1彎折性部件21與第2彎折性部件22的楊氏模數分別較佳為0.1~10GPa、更佳為0.5~7GPa、特佳為1~5GPa。藉由第1彎折性部件21與第2彎折性部件22的楊氏模數在該範圍內,相關各彎折性部件便可輕易反覆彎折。The Young's modulus of the first and second bendable members 21 and 22 is preferably 0.1 to 10 GPa, more preferably 0.5 to 7 GPa, and particularly preferably 1 to 5 GPa, respectively. With the Young's modulus of the first and second bendable members 21 and 22 within this range, each bendable member can be easily and repeatedly bent.
第1彎折性部件21與第2彎折性部件22的厚度,分別較佳為10~3000μm、更佳為25~1000μm、特佳為50~500μm。藉由第1彎折性部件21與第2彎折性部件22的厚度在該範圍內,相關各彎折性部件便可輕易反覆彎折。The thickness of the first and second bending members 21 and 22 is preferably 10-3000 μm, more preferably 25-1000 μm, and particularly preferably 50-500 μm, respectively. When the thickness of the first and second bending members 21 and 22 falls within this range, each bending member can be easily and repeatedly bent.
在製造上述反覆彎折積層部件2時,就一例是先撕開黏著片1其中一剝離片12a,再將黏著片1上露出的黏著劑層11,貼合於第1彎折性部件21之另一面。When manufacturing the repeatedly folded layer component 2, for example, one of the peeling sheets 12a of the adhesive sheet 1 is first torn off, and then the adhesive layer 11 exposed on the adhesive sheet 1 is attached to the other side of the first foldable component 21.
然後,從黏著片1的黏著劑層11上撕開另一剝離片12b,再將黏著片1上露出的黏著劑層11與第2彎折性部件22貼合,獲得反覆彎折積層部件2。又,另一例亦可將第1彎折性部件21與第2彎折性部件22的貼合順序顛倒。Then, another peeling sheet 12b is torn off from the adhesive layer 11 of the adhesive sheet 1, and the exposed adhesive layer 11 of the adhesive sheet 1 is bonded to the second bendable member 22 to obtain the repeatedly bent layer member 2. In another example, the bonding order of the first bendable member 21 and the second bendable member 22 can be reversed.
[反覆彎折裝置] 本實施形態的反覆彎折裝置具備有上述反覆彎折積層部件2,可僅由反覆彎折積層部件2構成,亦可具備有:一或複數反覆彎折積層部件2、與另一彎折性部件。將一反覆彎折積層部件2與另一反覆彎折積層部件2進行積層時,或將反覆彎折積層部件2與另一彎折性部件進行積層時,最好隔著前述黏著片1的黏著劑層11進行積層。[Repeated Bending Device] The repeated bending device of this embodiment includes the aforementioned repeatedly-bending accumulative layer member 2. It may consist solely of the repeatedly-bending accumulative layer member 2, or it may include one or more repeatedly-bending accumulative layer members 2 and another foldable member. When laminating one repeatedly-bending accumulative layer member 2 with another repeatedly-bending accumulative layer member 2, or when laminating a repeatedly-bending accumulative layer member 2 with another foldable member, it is preferred that the laminated layers be laminated with the adhesive layer 11 of the adhesive sheet 1 interposed therebetween.
本實施形態的反覆彎折裝置,因為黏著劑層由前述黏著劑構成,因而即便在廣範圍溫度下(例如:0℃、25℃、80℃等各溫度下)進行反覆彎折時(例如10萬次),仍可抑制彎折部出現折痕。The repeated bending device of this embodiment can suppress the occurrence of creases in the bent portion even when the device is repeatedly bent (for example, 100,000 times) at a wide range of temperatures (for example, 0°C, 25°C, 80°C, etc.) because the adhesive layer is composed of the aforementioned adhesive.
本實施形態一例的反覆彎折裝置如圖3所示。另外,本發明的反覆彎折裝置並不僅侷限於該反覆彎折裝置。The repeated bending device of one embodiment of this invention is shown in FIG3. In addition, the repeated bending device of the present invention is not limited to this repeated bending device.
如圖3所示,本實施形態的反覆彎折裝置3從上起依序積層著:覆蓋膜31、第1黏著劑層32、偏光膜33、第2黏著劑層34、觸控感測膜35、第3黏著劑層36、有機EL元件37、第4黏著劑層38、及TFT基板39而構成。上述覆蓋膜31、偏光膜33、觸控感測膜35、有機EL元件37及TFT基板39屬於彎折性部件。As shown in Figure 3, the repetitive bending device 3 of this embodiment is constructed by laminating, from the top, a cover film 31, a first adhesive layer 32, a polarizing film 33, a second adhesive layer 34, a touch-sensitive film 35, a third adhesive layer 36, an organic EL element 37, a fourth adhesive layer 38, and a TFT substrate 39. These cover film 31, polarizing film 33, touch-sensitive film 35, organic EL element 37, and TFT substrate 39 are considered bendable components.
第1黏著劑層32、第2黏著劑層34、第3黏著劑層36及第4黏著劑層38中至少其中任1層,為前述黏著片1的黏著劑層11。較佳為第1黏著劑層32、第2黏著劑層34、第3黏著劑層36及第4黏著劑層38中任2層以上,是前述黏著片1的黏著劑層11,更佳為所有的黏著劑層32,34,36,38均為黏著片1的黏著劑層11。At least one of the first adhesive layer 32, the second adhesive layer 34, the third adhesive layer 36, and the fourth adhesive layer 38 is the adhesive layer 11 of the adhesive sheet 1. Preferably, at least two of the first adhesive layer 32, the second adhesive layer 34, the third adhesive layer 36, and the fourth adhesive layer 38 are the adhesive layer 11 of the adhesive sheet 1. More preferably, all of the adhesive layers 32, 34, 36, and 38 are the adhesive layer 11 of the adhesive sheet 1.
覆蓋膜31較佳為聚醯亞胺薄膜、或在第1黏著劑層32側設有聚醯亞胺薄膜的積層體。此情況,較佳為至少第1黏著劑層32為前述黏著片1的黏著劑層11。又,例如當TFT基板39含有聚醯亞胺薄膜的情況,特別當在第4黏著劑層38側設有聚醯亞胺薄膜的情況,較佳為至少第4黏著劑層38為前述黏著片1的黏著劑層11。Cover film 31 is preferably a polyimide film, or a laminate having a polyimide film disposed on the side of first adhesive layer 32. In this case, at least first adhesive layer 32 is preferably adhesive layer 11 of adhesive sheet 1. Furthermore, for example, when TFT substrate 39 includes a polyimide film, and particularly when a polyimide film is disposed on the side of fourth adhesive layer 38, at least fourth adhesive layer 38 is preferably adhesive layer 11 of adhesive sheet 1.
上述反覆彎折裝置3,即便在廣範圍溫度下(例如:0℃、25℃、80℃等各溫度下)進行反覆彎折時(例如10萬次),至少在黏著片1由黏著劑層11構成的黏著劑層、與利用該黏著劑層貼合的彎折性部件之積層部分,可抑制彎折部出現折痕。The above-mentioned repeated bending device 3 can suppress the occurrence of creases in the bent portion even when repeated bending is performed (for example, 100,000 times) at a wide range of temperatures (for example, 0°C, 25°C, 80°C, etc.), at least in the laminated portion of the adhesive sheet 1 consisting of the adhesive layer 11 and the bendable component bonded by the adhesive layer.
以上所說明的實施形態是為了能輕易理解本發明而記載,並非為限定本發明而記載。所以,上述實施形態所揭示的各要件亦涵蓋隸屬於本發明技術範圍內的所有設計變更與均等物。The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit the present invention. Therefore, the various elements disclosed in the embodiments described above also encompass all design changes and equivalents within the technical scope of the present invention.
例如黏著片1的剝離片12a,12b之其中任一或雙方亦可省略,又,亦可取代剝離片12a及/或12b,改為積層所需的彎折性部件。 [實施例]For example, either or both of the release sheets 12a and 12b of the adhesive sheet 1 may be omitted. Alternatively, the release sheets 12a and/or 12b may be replaced with a flexible member required for lamination. [Example]
以下,利用實施例等針對本發明進行更具體說明,惟,本發明範圍並不僅侷限於該等實施例等。Hereinafter, the present invention will be described in more detail using embodiments, etc. However, the scope of the present invention is not limited to these embodiments, etc.
[實施例1] 1.(甲基)丙烯酸酯聚合物(A)之調製 使丙烯酸正丁酯54質量份、丙烯酸-2-乙基己酯45質量份、及丙烯酸-4-羥丁酯1質量份,利用溶液聚合法進行共聚合,而調製得(甲基)丙烯酸酯聚合物(A)。經依後述方法測定該(甲基)丙烯酸酯聚合物(A)的分子量,結果重量平均分子量(Mw)80萬。[Example 1] 1. Preparation of (Meth)acrylate Polymer (A) (Meth)acrylate Polymer (A) was prepared by copolymerizing 54 parts by mass of n-butyl acrylate, 45 parts by mass of 2-ethylhexyl acrylate, and 1 part by mass of 4-hydroxybutyl acrylate via a solution polymerization method. The molecular weight of (meth)acrylate Polymer (A) was measured according to the method described below, and the weight-average molecular weight (Mw) was 800,000.
2.黏著性組合物之調製 將上述步驟1所獲得(甲基)丙烯酸酯聚合物(A)100質量份(固形份換算值;以下亦同)、交聯劑(B)之三羥甲基丙烷改質二甲苯撐基二異氰酸酯(XDI;綜研化學公司製、產品名「TD-75」)0.25質量份、以及矽烷偶合劑之3-環氧丙氧基丙基三甲氧基矽烷(Si1)0.20質量份予以混合,充分攪拌,利用甲乙酮稀釋,獲得黏著性組合物的塗佈溶液。2. Preparation of the Adhesive Composition Mix 100 parts by weight (solids basis; the same applies hereinafter) of the (meth)acrylate polymer (A) obtained in Step 1 above, 0.25 parts by weight of trihydroxymethylpropane-modified xylene diisocyanate (XDI; Soken Chemical Co., Ltd., product name "TD-75") as a crosslinker (B), and 0.20 parts by weight of 3-glycidoxypropyltrimethoxysilane (Si1) as a silane coupling agent. Stir thoroughly and dilute with methyl ethyl ketone to obtain a coating solution of the adhesive composition.
3.黏著片之製造 所獲得黏著性組合物的塗佈溶液,在聚對苯二甲酸乙二酯薄膜單面經利用聚矽氧系剝離劑施行剝離處理過的重剝離型剝離片(Lintec公司製、產品名「SP-PET752150」)之剝離處理面上,利用刀式塗佈機施行塗佈。然後,對塗佈層,依90℃施行1分鐘加熱處理而形成塗佈層。3. Adhesive Sheet Preparation The resulting adhesive composition coating solution was applied using a knife coater onto the release-treated surface of a heavy-duty release sheet (Lintec, product name "SP-PET752150"), which had been treated on one side with a silicone release agent. The coating layer was then heated at 90°C for one minute to form a coating.
其次,將依上述所獲得重剝離型剝離片上的塗佈層、與將聚對苯二甲酸乙二酯薄膜單面利用聚矽氧系剝離劑施行剝離處理過的輕剝離型剝離片(Lintec公司製、產品名「SP-PET381130」),依該輕剝離型剝離片的剝離處理面接觸於塗佈層的方式貼合,在23℃、50%RH條件下施行7天養生,而製作具有厚度25μm黏著劑層的黏著片,即由重剝離型剝離片/黏著劑層(厚度:25μm)/輕剝離型剝離片構成的黏著片。另外,黏著劑層的厚度為根據JIS K7130,使用定壓厚度測定器(TECLOCK公司製、產品名「PG-02」)測定的值。Next, the coating layer on the heavy-peel release sheet obtained above and the light-peel release sheet (Lintec, product name "SP-PET381130") which was prepared by peeling a polyethylene terephthalate film on one side with a silicone release agent were placed on the light-peel release sheet. The release sheet was laminated with the release-treated surface in contact with the coating layer and cured for 7 days at 23°C and 50% RH to produce an adhesive sheet with a 25μm thick adhesive layer. This adhesive sheet consisted of a heavy-peel release sheet, an adhesive layer (25μm thick), and a light-peel release sheet. The adhesive layer thickness was measured in accordance with JIS K7130 using a constant-pressure thickness gauge (TECLOCK, product name "PG-02").
此處,將(甲基)丙烯酸酯聚合物(A)設為100質量份(固形份換算值)時,黏著性組合物的各摻合(固形份換算值)如表1所示。另外,表1所記載代號等的詳細內容如下。 [(甲基)丙烯酸酯聚合物(A)] BA:丙烯酸正丁酯 2EHA:丙烯酸-2-乙基己酯 4HBA:丙烯酸-4-羥丁酯 IBXA:丙烯酸異莰酯 ACMO:N-丙烯醯基啉 HEA:丙烯酸-2-羥乙酯 MMA:甲基丙烯酸甲酯 [交聯劑(B)] XDI:三羥甲基丙烷改質二甲苯撐基二異氰酸酯(綜研化學公司製、產品名「TD-75」) TDI:三羥甲基丙烷改質甲苯二異氰酸酯(TOYOCHEM公司製、產品名「BHS8515」) [矽烷偶合劑] Si1:3-環氧丙氧基丙基三甲氧基矽烷 Si2:3-環氧丙氧基丙基甲基二甲氧基矽烷Here, when the (meth)acrylate polymer (A) is taken as 100 parts by mass (solid content conversion value), the various blending amounts (solid content conversion value) of the adhesive composition are shown in Table 1. In addition, the details of the codes etc. described in Table 1 are as follows. [(meth)acrylate polymer (A)] BA: n-butyl acrylate 2EHA: 2-ethylhexyl acrylate 4HBA: 4-hydroxybutyl acrylate IBXA: isoborneol acrylate ACMO: N-acryloyl HEA: 2-Hydroxyethyl acrylate MMA: Methyl methacrylate [Crosslinking agent (B)] XDI: Trihydroxymethylpropane-modified xylene diisocyanate (Soken Chemical Co., Ltd., product name "TD-75") TDI: Trihydroxymethylpropane-modified toluene diisocyanate (Toyochem, product name "BHS8515") [Silane coupling agent] Si1: 3-Glycyloxypropyltrimethoxysilane Si2: 3-Glycyloxypropylmethyldimethoxysilane
[實施例2~12、比較例1~3] 除將構成(甲基)丙烯酸酯聚合物(A)的各單體種類與比例、(甲基)丙烯酸酯聚合物(A)之重量平均分子量(Mw)、交聯劑(B)之種類與摻合量、矽烷偶合劑之種類、以及黏著劑層之厚度,變更如表1所示之外,其餘均依照與實施例1同樣地製造黏著片。[Examples 2-12, Comparative Examples 1-3] Adhesive sheets were prepared in the same manner as in Example 1, except that the types and ratios of the monomers constituting the (meth)acrylate polymer (A), the weight-average molecular weight (Mw) of the (meth)acrylate polymer (A), the type and amount of the crosslinking agent (B), the type of the silane coupling agent, and the thickness of the adhesive layer were changed as shown in Table 1.
[試驗例1](凝膠分率之測定) 將實施例與比較例所製作的黏著片裁剪為80mm×80mm尺寸,利用聚酯製篩網(品名:特多龍篩網 #200)包住其黏著劑層,利用精密天秤秤量質量,經扣減掉上述篩網的質量,計算出僅有黏著劑的質量。將此時的質量設為M1。[Test Example 1] (Gel Fraction Determination) The adhesive sheets produced in the Examples and Comparative Examples were cut into 80 mm x 80 mm sheets. The adhesive layer was wrapped with a polyester mesh (Tetoron Mesh #200). The mass was measured using a precision balance. The mass of the adhesive alone was deducted from the mass of the mesh to calculate the mass. This mass was designated M1.
其次,將由上述聚酯製篩網包住的黏著劑,在室溫下(23℃)浸漬於醋酸乙酯中24小時。然後,取出黏著劑,在溫度23℃、相對濕度50%環境下進行24小時風乾,更在80℃烤箱中進行12小時乾燥。經乾燥後,利用精密天秤秤量質量,經扣減掉上述篩網的質量,計算出僅有黏著劑的質量。將此時的質量設為M2。凝膠分率(%)依(M2/M1)×100表示。結果如表2所示。Next, the adhesive wrapped in the polyester mesh was immersed in ethyl acetate at room temperature (23°C) for 24 hours. The adhesive was then removed and air-dried at 23°C and 50% relative humidity for 24 hours, followed by drying in an 80°C oven for 12 hours. After drying, the mass was measured using a precision scale. The mass of the mesh was subtracted to calculate the mass of the adhesive alone. This mass was designated M2. The gel fraction (%) was expressed as (M2/M1) × 100. The results are shown in Table 2.
[試驗例2](儲存彈性模數(G')之測定) 將實施例與比較例所製作黏著片的黏著劑層施行複數層積層,形成厚度3mm的積層體。從所獲得黏著劑層的積層體打穿直徑8mm的圓柱體(高度3mm),將其設為樣品。[Test Example 2] (Storage Modulus (G') Measurement) The adhesive layers of the adhesive sheets produced in the Examples and Comparative Examples were laminated multiple times to form a 3mm thick laminate. A cylinder with an 8mm diameter (3mm height) was punched through the laminate to create a sample.
針對上述樣品,根據JIS K7244-6,使用黏彈性測定器(REOMETRIC公司製、DYNAMIC ANALAYZER),利用扭轉剪切法,依以下條件測定儲存彈性模數G',取得-20℃儲存彈性模數G'(-20)、25℃儲存彈性模數G'(25)及85℃儲存彈性模數G'(85)(MPa)。結果如表2所示。 測定頻率:1Hz 測定溫度:-20℃~140℃For the above samples, the storage modulus G' was measured using a viscoelasticity tester (Dynamic Analayzer, manufactured by REOMETRIC) using the torsional shear method under the following conditions in accordance with JIS K7244-6. The storage modulus G'(-20) at -20°C, the storage modulus G'(25) at 25°C, and the storage modulus G'(85) at 85°C (MPa) were obtained. The results are shown in Table 2. Measurement frequency: 1 Hz Measurement temperature: -20°C to 140°C
再者,根據所取得的儲存彈性模數G'(-20)與儲存彈性模數G'(85),計算出儲存彈性模數G'(-20)除以儲存彈性模數G'(85)的商值之儲存彈性模數變化度。結果如表2所示。Furthermore, based on the obtained storage modulus G'(-20) and storage modulus G'(85), the storage modulus variation is calculated as the quotient of storage modulus G'(-20) divided by storage modulus G'(85). The results are shown in Table 2.
[試驗例3](黏著力之測定) 從實施例與比較例所獲得黏著片上撕開輕剝離型剝離片,再將露出的黏著劑層,貼合於具有易接著層之聚對苯二甲酸乙二酯(PET)薄膜(東洋紡公司製、產品名「PET A4300」、厚度:100μm)的易接著層上,獲得重剝離型剝離片/黏著劑層/PET薄膜的積層體。將所獲得積層體裁剪為寬25mm、長110mm。[Test Example 3] (Adhesion Measurement) The light-peel release sheet was removed from the adhesive sheets obtained in the Examples and Comparative Examples. The exposed adhesive layer was then laminated to the easily adhesive layer of a polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., product name "PET A4300," thickness: 100 μm) with an easily adhesive layer. This resulted in a heavy-peel release sheet/adhesive layer/PET film laminate. The laminate was cut into pieces 25 mm wide and 110 mm long.
另一方面,被黏物準備以下3種。 (1)鈉鈣玻璃板(日本板硝子公司製、產品名「鈉鈣玻璃」、厚度:1.1mm) (2)在鈉鈣玻璃板(日本板硝子公司製、產品名「鈉鈣玻璃」、厚度:1.1mm)其中一面上,黏貼具黏著劑層之聚醯亞胺薄膜(東麗杜邦公司製、產品名「KAPTON 100PI」、聚醯亞胺薄膜厚度:25μm、黏著劑層厚度:5μm),而形成的積層體(聚醯亞胺薄膜側為被黏面) (3)無鹼玻璃板(NSG PRECISION公司製、產品名「Corning Glass EAGLE XG」、厚度:0.7mm)On the other hand, the following three types of adherends were prepared. (1) Sodium calcium glass plate (manufactured by Nippon Sheet Glass Co., Ltd., product name "Sodium Calcium Glass", thickness: 1.1 mm) (2) A laminate formed by laminating a polyimide film (manufactured by DuPont Toray, product name "KAPTON 100PI", polyimide film thickness: 25 μm, adhesive layer thickness: 5 μm) with an adhesive layer on one side of the soda calcium glass plate (manufactured by Nippon Sheet Glass Co., Ltd., product name "Sodium Calcium Glass", thickness: 1.1 mm) (the polyimide film side was the adherend surface) (3) Alkali-free glass plate (manufactured by NSG Precision Co., Ltd., product name "Corning Glass EAGLE XG", thickness: 0.7 mm)
在23℃、50%RH環境下,從上述積層體上撕開重剝離型剝離片,再將露出的黏著劑層黏貼於上述各被黏物上,利用栗原製作所公司製熱壓鍋,依0.5MPa、50℃施行20分鐘加壓。然後,在23℃、50%RH的條件下放置24小時後,使用拉伸試驗機(ORIENTEC公司製、張力機),依剝離速度300mm/min、剝離角度180度的條件,測定將PET薄膜與黏著劑層的積層體,從被黏物上剝離時的黏著力(N/25mm)。此處所記載以外的條件均根據JIS Z0237:2009施行測定。結果如表2所示。In an environment of 23°C and 50% RH, a heavy-peel release sheet was removed from the laminate, and the exposed adhesive layer was then applied to each of the adherends. Pressurization was performed in a Kurihara Seisakusho hot press at 0.5 MPa and 50°C for 20 minutes. After 24 hours at 23°C and 50% RH, the adhesion force (N/25mm) of the laminated PET film and adhesive layer when peeled from the adherend was measured using a tensile tester (Orientec) at a peel speed of 300 mm/min and a peel angle of 180 degrees. All conditions other than those listed here were measured according to JIS Z0237:2009. The results are shown in Table 2.
[試驗例4](反覆彎折性之評價) 在23℃、50%RH環境下,從實施例與比較例所製作的黏著片上撕開輕剝離型剝離片,再將露出的黏著劑層貼合於聚醯亞胺(PI)薄膜(東麗杜邦公司製、產品名「KAPTON 100PI」、厚度:25μm、楊氏模數:3.4GPa)其中一面上。接著,撕開重剝離型剝離片,將露出的黏著劑層貼合於聚對苯二甲酸乙二酯(PET)薄膜(東洋紡公司製、產品名「COSMOSHINE A4300」、厚度:100μm、楊氏模數:4.5GPa)其中一面。然後,利用栗原製作所公司製熱壓鍋,依0.5MPa、50℃施行20分鐘加壓後,於23℃、50%RH條件下放置24小時。將依此所獲得由PI薄膜/黏著劑層/PET薄膜構成的積層體,裁剪為寬50mm、長200mm,設為樣品。[Test Example 4] (Evaluation of Repeated Bending Properties) In an environment of 23°C and 50% RH, the light-peel release sheet was removed from the adhesive sheets produced in the Examples and Comparative Examples. The exposed adhesive layer was then laminated to one side of a polyimide (PI) film (manufactured by DuPont Toray, product name "KAPTON 100PI," thickness: 25 μm, Young's modulus: 3.4 GPa). Next, the heavy-peel release sheet was removed, and the exposed adhesive layer was laminated to one side of a polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., product name "COSMOSHINE A4300," thickness: 100 μm, Young's modulus: 4.5 GPa). The samples were then pressurized in a Kurihara Seisakusho hot press at 0.5 MPa and 50°C for 20 minutes and then placed at 23°C and 50% RH for 24 hours. The resulting laminate consisting of PI film/adhesive layer/PET film was cut into pieces 50 mm wide and 200 mm long to serve as samples.
所獲得樣品,使用耐久試驗機(YUASA SYSTEM機器公司製、產品名「面狀體無荷重U字伸縮試驗機 形式:CL09-typeD01-FSC90」」),依以下條件施行反覆彎折。然後,目視確認彎折部狀態,依以下基準評價各試驗溫度下的反覆彎折性,結果如表2所示。The samples were subjected to repeated bending under the following conditions using a durability testing machine (manufactured by Yuasa System Instruments Co., Ltd., product name: "Planar Body Unloaded U-Shaped Elongation Testing Machine Model: CL09-typeD01-FSC90"). The state of the bent portion was then visually inspected, and the repeated bending resistance at each test temperature was evaluated according to the following criteria. The results are shown in Table 2.
<試驗條件> 彎折方向:依相對向於PET薄膜側的方式彎折 最小彎折徑:3mmϕ 彎折回數:100000次 試驗溫度:0℃、25℃、80℃ <反覆彎折性之評價基準> ◎…彎折部沒有存在折痕。 〇…彎折部雖有存在折痕,但從正前面觀看時幾乎無法確認到該折痕。 △…彎折部有存在折痕,即便從正前面看亦可確認到該折痕的存在,但該折痕部分並沒有白濁。 ×…彎折部有存在折痕,且該折痕部分的白濁明顯。<Test Conditions> Bending Direction: Bend toward the side of the PET film Minimum Bend Diameter: 3mm Bending Cycles: 100,000 Test Temperatures: 0°C, 25°C, and 80°C <Evaluation Criteria for Repeated Bending Resistance> ◎…No crease at the bend. ○…A crease at the bend is present, but it is barely noticeable when viewed from the front. △…A crease at the bend is noticeable even when viewed from the front, but there is no white turbidity. ×…A crease at the bend is present, and the turbidity is noticeable.
[試驗例5](全光線穿透率之測定) 將實施例與比較例所獲得黏著片的黏著劑層貼合於玻璃上,設為測定用樣品。利用玻璃施行背景測定,且針對上述測定用樣品,根據JIS K7361-1:1997,使用測霾計(日本電色工業公司製、產品名「NDH-5000」)測定全光線穿透率(%)。結果如表2所示。[Test Example 5] (Measurement of Total Light Transmittance) The adhesive layers of the adhesive sheets obtained in the Examples and Comparative Examples were attached to glass to serve as measurement samples. Background measurements were performed on the glass, and the total light transmittance (%) of the measurement samples was measured using a haze meter (NDH-5000, manufactured by Nippon Denshoku Industries) in accordance with JIS K7361-1:1997. The results are shown in Table 2.
[表1]
[表2]
由表2得知,實施例的黏著片之黏著劑層,將2個彎折性部件予以貼合,在低溫至高溫的各溫度下進行反覆彎折時,可抑制彎折部出現折痕。 [產業上之可利用性]Table 2 shows that the adhesive layer of the adhesive sheet of the embodiment can suppress the formation of creases at the bent portion when two bendable components are bonded together and repeatedly bent at various temperatures ranging from low to high. [Industrial Applicability]
本發明頗適用於將構成反覆彎折裝置的一彎折性部件(特別是聚醯亞胺薄膜、或含聚醯亞胺薄膜之積層體)、與另一彎折性部件進予以貼合。The present invention is suitable for bonding a bendable component (especially a polyimide film or a laminate containing a polyimide film) constituting a repetitive bending device to another bendable component.
1:黏著片 11:黏著劑層 12a,12b:剝離片 2:反覆彎折積層部件 21:第1彎折性部件 22:第2彎折性部件 3:反覆彎折裝置 31:覆蓋膜 32:第1黏著劑層 33:偏光膜 34:第2黏著劑層 35:觸控感測膜 36:第3黏著劑層 37:有機EL元件 38:第4黏著劑層 39:TFT基板1: Adhesive sheet 11: Adhesive layer 12a, 12b: Release sheet 2: Repeated bending layer component 21: First bending component 22: Second bending component 3: Repeated bending device 31: Cover film 32: First adhesive layer 33: Polarizing film 34: Second adhesive layer 35: Touch sensor film 36: Third adhesive layer 37: Organic EL element 38: Fourth adhesive layer 39: TFT substrate
圖1是本發明一實施形態的黏著片剖視圖; 圖2是本發明一實施形態的反覆彎折積層部件之剖視圖;以及 圖3是本發明一實施形態的反覆彎折裝置剖視圖。Figure 1 is a cross-sectional view of an adhesive sheet according to an embodiment of the present invention; Figure 2 is a cross-sectional view of a repeatedly bent folding layer component according to an embodiment of the present invention; and Figure 3 is a cross-sectional view of a repeatedly bent folding device according to an embodiment of the present invention.
1:黏著片 1: Adhesive sheet
11:黏著劑層 11: Adhesive layer
12a,12b:剝離片 12a, 12b: Peeling film
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| JP2022116859A (en) * | 2021-01-29 | 2022-08-10 | 日東電工株式会社 | Optical adhesive sheet for foldable device |
| JP2022156356A (en) * | 2021-03-31 | 2022-10-14 | リンテック株式会社 | Adhesive sheet, repeated bending laminate member and repeated bending device |
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| JP2023006451A (en) * | 2021-06-30 | 2023-01-18 | 日東電工株式会社 | Optical adhesive layer and optical film having optical adhesive layer |
| JP2023006450A (en) * | 2021-06-30 | 2023-01-18 | 日東電工株式会社 | Optical adhesive layer |
| JP2023022806A (en) * | 2021-08-03 | 2023-02-15 | 日東電工株式会社 | Adhesive and adhesive sheet |
| CN118234819A (en) | 2021-12-07 | 2024-06-21 | 日东电工株式会社 | Strengthening film |
| CN116376477A (en) * | 2021-12-23 | 2023-07-04 | 华为技术有限公司 | Adhesive film and its preparation method, composite component and electronic device |
| JP2023095069A (en) * | 2021-12-24 | 2023-07-06 | 日東電工株式会社 | optical adhesive sheet |
| JP2024016815A (en) * | 2022-07-26 | 2024-02-07 | artience株式会社 | Laminate for flexible display, and flexible display |
| JP2024081844A (en) | 2022-12-07 | 2024-06-19 | 日東電工株式会社 | Adhesive sheet |
| WO2024134868A1 (en) | 2022-12-23 | 2024-06-27 | 東洋インキScホールディングス株式会社 | Adhesive agent layer, adhesive sheet using same, laminate, and flexible image display device |
| JP2024140046A (en) | 2023-03-28 | 2024-10-10 | 日東電工株式会社 | Adhesive sheet |
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| TW201814020A (en) * | 2016-09-16 | 2018-04-16 | 琳得科股份有限公司 | Adhesive for flexible display, adhesive sheet, flexible laminated member and flexible display |
Family Cites Families (9)
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| JP5243990B2 (en) | 2009-02-18 | 2013-07-24 | 日東電工株式会社 | Double-sided adhesive sheet |
| JP6225025B2 (en) | 2011-08-03 | 2017-11-01 | リンテック株式会社 | Gas barrier pressure-sensitive adhesive sheet, method for producing the same, electronic member, and optical member |
| JP6150536B2 (en) | 2012-01-31 | 2017-06-21 | 日本合成化学工業株式会社 | Masking adhesive film and method of using the adhesive film |
| KR101813764B1 (en) | 2014-11-28 | 2017-12-29 | 삼성에스디아이 주식회사 | Adhesive composition for optical film, adhesive layer, optical member and image display device |
| JP6330833B2 (en) | 2016-03-05 | 2018-05-30 | 三菱ケミカル株式会社 | Laminated polyester film |
| JP6932421B2 (en) | 2016-08-15 | 2021-09-08 | 日東電工株式会社 | Adhesive layer for flexible image display device, laminate for flexible image display device, and flexible image display device |
| WO2018174012A1 (en) | 2017-03-23 | 2018-09-27 | 日東電工株式会社 | Optical laminate |
| JP7051382B2 (en) * | 2017-11-16 | 2022-04-11 | リンテック株式会社 | Repeated bending device |
| CN113474700B (en) | 2019-02-27 | 2023-06-20 | 住友化学株式会社 | laminated body |
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- 2019-11-11 TW TW108140809A patent/TWI895250B/en active
- 2019-12-03 KR KR1020190159062A patent/KR20200104783A/en not_active Ceased
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| TW201814020A (en) * | 2016-09-16 | 2018-04-16 | 琳得科股份有限公司 | Adhesive for flexible display, adhesive sheet, flexible laminated member and flexible display |
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| KR20200104783A (en) | 2020-09-04 |
| CN111621245B (en) | 2024-01-16 |
| CN111621245A (en) | 2020-09-04 |
| TW202035122A (en) | 2020-10-01 |
| JP7069065B2 (en) | 2022-05-17 |
| JP2020139034A (en) | 2020-09-03 |
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