TWI895143B - Heat dissipation device - Google Patents
Heat dissipation deviceInfo
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- TWI895143B TWI895143B TW113139405A TW113139405A TWI895143B TW I895143 B TWI895143 B TW I895143B TW 113139405 A TW113139405 A TW 113139405A TW 113139405 A TW113139405 A TW 113139405A TW I895143 B TWI895143 B TW I895143B
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Abstract
Description
本揭露係有關於一種裝置,特別是指一種散熱裝置。 This disclosure relates to a device, and more particularly to a heat dissipation device.
中央處理單元(Central Processing Unit,簡稱CPU),主要負責系統資料的處理以及指令的解碼、執行。現今,CPU的效能已有卓越的提升,其可以處理更大的運算量,並具有更快的處理速度。然而,在CPU的運作過程中,由於需要消耗更多的能量來進行運算,因此會產生大量的熱能,這會導致降低CPU的效能、使用壽命。 The Central Processing Unit (CPU) is primarily responsible for processing system data and decoding and executing instructions. Today, CPU performance has significantly improved, allowing it to handle larger workloads and achieve faster processing speeds. However, CPU operation consumes more energy to perform calculations, generating significant heat. This reduces CPU performance and lifespan.
過去的做法,是在CPU附近配置散熱風扇,藉由引導氣流的方式,來排出CPU的熱能,以進行CPU的散熱。惟,所述散熱風扇的散熱效果已經達到極限,無法更進一步增加散熱效果。 In the past, a cooling fan was placed near the CPU to direct airflow and dissipate heat from the CPU. However, the cooling effect of these fans has reached its limit and cannot be further improved.
本揭露之目的在於,提供一種散熱裝置,藉以對CPU有效進行散熱。 The purpose of this disclosure is to provide a heat dissipation device to effectively dissipate heat from a CPU.
前述目的並不妨礙其他目的之存在。若所屬技術領域之具有通常知識者自本揭露的說明書、申請專利範圍或圖式等之記載能推導出之目的者,亦 包含在本揭露目的之中。故本揭露的目的不侷限於前述列舉之目的。 The aforementioned objectives do not preclude the existence of other objectives. Any objectives that can be inferred by a person skilled in the art from the description, patent application, or drawings of this disclosure are also included in the objectives of this disclosure. Therefore, the objectives of this disclosure are not limited to the aforementioned objectives.
為達成上述目的,本揭露提供一種散熱裝置,其設置於一基座,散熱裝置包括一第一風扇及一鼓風組件。第一風扇可轉動地設置於基座,第一風扇具有一轉動部及複數第一葉片,複數第一葉片環設於轉動部;鼓風組件設置於第一風扇,鼓風組件具有一第一支架及複數第一鼓風葉片,第一支架設置於複數第一葉片,複數第一鼓風葉片沿轉動部的軸向排列於第一支架。 To achieve the above objectives, the present disclosure provides a heat dissipation device mounted on a base. The heat dissipation device includes a first fan and a blower assembly. The first fan is rotatably mounted on the base and has a rotating portion and a plurality of first blades disposed around the rotating portion. The blower assembly is mounted on the first fan and includes a first bracket and a plurality of first blower blades. The first bracket is mounted on the plurality of first blades, and the plurality of first blower blades are arranged on the first bracket along the axis of the rotating portion.
綜合上述,於第一風扇與鼓風組件的配合之下,本揭露可以引導不同方向的氣流,進一步地增加風流流量,藉以達到對CPU有效散熱之目的。 In summary, with the cooperation of the first fan and the blower assembly, the present disclosure can guide airflow in different directions, further increasing the airflow rate, thereby achieving the purpose of effectively cooling the CPU.
100:散熱裝置 100: Heat dissipation device
1:基座 1: Base
1a:動力源 1a: Power Source
10:第一風扇 10: First Fan
11:轉動部 11: Rotating part
12:第一葉片 12: First leaf
121:外側邊緣 121: Outer edge
20:鼓風組件 20: Blower assembly
21:第一支架 21: First bracket
211:內側 211: Inside
22:第一鼓風葉片 22: First blast blade
221:第一內弧面 221: First inner arc surface
222:外弧面 222: Outer curved surface
23:第二鼓風葉片 23: Second blower blade
231:第二內弧面 231: Second inner arc surface
24:第二支架 24: Second bracket
30:第二風扇 30: Second Fan
31:第二葉片 31: Second leaf
A1:第一通風區域 A1: First ventilation area
A2:第二通風區域 A2: Second ventilation area
D1:第一間距 D1: First spacing
D3:第三間距 D3: Third distance
L:軸向 L: Axial direction
圖1係為本揭露一實施例之散熱裝置立體示意圖,尤其是呈現散熱裝置外觀特徵之示意圖。 Figure 1 is a schematic three-dimensional diagram of a heat sink according to an embodiment of the present disclosure, particularly illustrating the exterior features of the heat sink.
圖2係為本揭露一實施例之散熱裝置一側視角示意圖,尤其是呈現第一風扇與鼓風組件配置關係之示意圖。 Figure 2 is a schematic side view of a heat dissipation device according to an embodiment of the present disclosure, particularly illustrating the arrangement of the first fan and the air blowing assembly.
圖3係為本揭露某一實施例之散熱裝置立體示意圖(一),尤其是呈現第二鼓風葉片外觀特徵之示意圖。 Figure 3 is a schematic three-dimensional diagram (I) of a heat dissipation device according to one embodiment of the present disclosure, particularly illustrating the external features of the second blower blade.
圖4係為本揭露某一實施例之散熱裝置一側視角示意圖(一),尤其是呈現第一鼓風葉片與第二鼓風葉片配置關係之示意圖。 Figure 4 is a schematic side view of a heat dissipation device according to one embodiment of the present disclosure (1), particularly illustrating the arrangement of the first and second blower blades.
圖5係為本揭露某一實施例之散熱裝置實施示意圖,尤其是呈現散熱裝置引導氣流之示意圖。 Figure 5 is a schematic diagram illustrating an embodiment of a heat sink according to the present disclosure, and more particularly, illustrates the airflow directed by the heat sink.
圖6係為本揭露某一實施例之散熱裝置立體示意圖(二),尤其是呈現第二風扇 外觀特徵之示意圖。 Figure 6 is a schematic three-dimensional diagram (Part 2) of a heat dissipation device according to one embodiment of the present disclosure, particularly illustrating the external features of the second fan.
圖7係為圖6沿A-A剖面線之剖面視角示意圖,尤其是呈現各元件配置關係之示意圖。 Figure 7 is a schematic cross-sectional view taken along line A-A of Figure 6, specifically illustrating the arrangement of various components.
為便於描述本揭露於上述內容一欄中所表示的中心思想,茲以具體實施例表達。實施例中各種不同物件係按適於說明之比例、尺寸、變形量或位移量而描繪,並非按實際元件的比例予以繪製,合先敘明。 To facilitate the description of the central concept of this disclosure as presented above, specific embodiments are presented. The various objects in these embodiments are depicted using proportions, dimensions, deformations, or displacements suitable for illustration, and are not drawn to scale according to actual components. This should be noted in advance.
以下參照各圖式詳細描述本揭露的示例性實施例,且不意圖將本揭露的技術原理限制於特定公開的實施例,而本揭露的範圍僅由申請專利範圍限制,涵蓋了替代、修改及等同物。 The following describes exemplary embodiments of the present disclosure in detail with reference to the drawings. This is not intended to limit the technical principles of the present disclosure to the specific disclosed embodiments. The scope of the present disclosure is limited only by the scope of the patent application and covers alternatives, modifications, and equivalents.
請參閱圖1至圖7所示,於本揭露實施例中,本揭露提供一種散熱裝置100,其設置於一基座1。 Referring to Figures 1 to 7 , in an embodiment of the present disclosure, a heat dissipation device 100 is provided, which is disposed on a base 1.
基座1具有一動力源1a,所述動力源1a可以令散熱裝置100進行轉動。 The base 1 has a power source 1a, which can rotate the heat sink 100.
請配合參閱圖1所示,散熱裝置100包括一第一風扇10及一鼓風組件20。 Please refer to Figure 1 . The heat dissipation device 100 includes a first fan 10 and an air blowing assembly 20.
第一風扇10可轉動地設置於基座1。請配合參閱圖2所示,第一風扇10具有一轉動部11及複數第一葉片12。轉動部11連接於基座1的動力源1a,轉動部11能帶動複數第一葉片12進行轉動。複數第一葉片12環設於轉動部11。其中,複數第一葉片12的葉片數量得依據實際情形作調整,並不以本揭露的記載為限制。 The first fan 10 is rotatably mounted on the base 1. Referring to Figure 2 , the first fan 10 comprises a rotating portion 11 and a plurality of first blades 12. The rotating portion 11 is connected to the power source 1a of the base 1 and drives the plurality of first blades 12 to rotate. The plurality of first blades 12 are disposed around the rotating portion 11. The number of blades in the plurality of first blades 12 can be adjusted based on actual circumstances and is not limited by the description herein.
鼓風組件20設置於第一風扇10。請配合參閱圖2所示,鼓風組件20具有一第一支架21及複數第一鼓風葉片22。其中,複數第一鼓風葉片22的數量得依據實際情形作調整,並不以本揭露的記載為限制。 The air blower assembly 20 is mounted on the first fan 10. Referring to FIG. 2 , the air blower assembly 20 comprises a first bracket 21 and a plurality of first air blower blades 22 . The number of the plurality of first air blower blades 22 may be adjusted based on actual circumstances and is not limited by the description herein.
第一支架21設置於複數第一葉片12,第一支架21能隨複數第一葉片12的轉動而進行轉動。複數第一鼓風葉片22沿轉動部11的軸向L排列於第一支架21。藉此,複數第一鼓風葉片22可以吸入散熱裝置100側邊的空氣,進一步地增加風流流量,達到較佳散熱之目的。 The first bracket 21 is mounted on the plurality of first blades 12 and rotates with the rotation of the plurality of first blades 12. The plurality of first blower blades 22 are arranged on the first bracket 21 along the axial direction L of the rotating portion 11. This allows the plurality of first blower blades 22 to draw in air from the sides of the heat sink 100, further increasing airflow and achieving optimal heat dissipation.
請配合參閱圖2所示,鼓風組件20的第一支架21呈一環狀。複數第一鼓風葉片22沿第一支架21的內側211排列設置,令複數第一鼓風葉片22呈環狀排列設置。其中,複數第一葉片12遠離轉動部11之一側具有一外側邊緣121,第一支架21相鄰於外側邊緣121。藉此,當複數第一鼓風葉片22進行轉動時,能最佳化地吸入散熱裝置100側邊的空氣。 Referring to Figure 2 , the first bracket 21 of the blower assembly 20 is ring-shaped. A plurality of first blower blades 22 are arranged along an inner side 211 of the first bracket 21 , forming a ring-shaped arrangement. The first blades 12 have an outer edge 121 on a side distal from the rotating portion 11 , and the first bracket 21 is adjacent to the outer edge 121 . This allows the first blower blades 22 to optimally draw air from the sides of the heat sink 100 as they rotate.
請配合參閱圖3所示,鼓風組件20具有複數第二鼓風葉片23。其中,複數第二鼓風葉片23的數量得依據實際情形作調整,並不以本揭露的記載為限制。 Please refer to Figure 3 , which shows that the air blowing assembly 20 has a plurality of second air blowing blades 23. The number of the plurality of second air blowing blades 23 may be adjusted based on actual circumstances and is not limited to the description of this disclosure.
請配合參閱圖3及圖4所示,複數第二鼓風葉片23沿轉動部11的軸向L設置於轉動部11,且複數第二鼓風葉片23環狀排列於轉動部11。請配合參閱圖5所示,當第一風扇10進行轉動時,第一鼓風葉片22會吸入散熱裝置100側邊的空氣,並引導至第二鼓風葉片23,第二鼓風葉片23擋住部分氣流,使所述部分氣流引導至第一風扇10。當然地,第一風扇10同時亦會吸入不同方向的空氣,以增加風流流量。 As shown in Figures 3 and 4 , a plurality of second blower blades 23 are disposed on the rotating portion 11 along the axial direction L of the rotating portion 11 and are arranged in a ring around the rotating portion 11. As shown in Figure 5 , when the first fan 10 rotates, the first blower blades 22 draw in air from the sides of the heat sink 100 and direct it toward the second blower blades 23. The second blower blades 23 block some of the airflow, directing it toward the first fan 10. Of course, the first fan 10 also draws in air from different directions to increase airflow.
於本揭露一實施例中,各第一鼓風葉片22分別具有一第一內弧面 221及一外弧面222。各第一內弧面221朝向另一個第一鼓風葉片22的外弧面222,從而讓各第一鼓風葉片22環狀排列於第一支架21。進一步地,各第二鼓風葉片23分別具有一第二內弧面231,各第二內弧面231朝向複數第一鼓風葉片22,藉以擋住圖5中的部分氣流。藉此,透過各第一鼓風葉片22、各第二鼓風葉片23內弧面的設計,增加引導氣流的效果。 In one embodiment of the present disclosure, each first blast blade 22 has a first inner curved surface 221 and an outer curved surface 222. Each first inner curved surface 221 faces the outer curved surface 222 of another first blast blade 22, thereby allowing the first blast blades 22 to be arranged in a circular pattern on the first bracket 21. Furthermore, each second blast blade 23 has a second inner curved surface 231, which faces the plurality of first blast blades 22, thereby blocking a portion of the airflow shown in Figure 5. Thus, the design of the inner curved surfaces of each first blast blade 22 and each second blast blade 23 enhances the airflow guidance effect.
於本揭露一實施例中,各第一鼓風葉片22之間分別具有一第一間距D1。進一步地,第一鼓風葉片22與第二鼓風葉片23間之最近距離為一第三間距D3。 In one embodiment of the present disclosure, each first blast blade 22 has a first spacing D1 between them. Furthermore, the closest distance between the first blast blade 22 and the second blast blade 23 is a third spacing D3.
於本揭露一實施例中,複數第一鼓風葉片22與複數第二鼓風葉片23之間形成一第一通風區域A1。而複數第二鼓風葉片23圈圍出一第二通風區域A2。深入來說,第一通風區域A1分布於複數第二鼓風葉片23之外圍,第二通風區域A2分布於複數第二鼓風葉片23之內圍。而第一通風區域A1之體積大於第二通風區域A2之體積,亦即第一通風區域A1乘載之風流流量大於第二通風區域A2乘載之風流流量。 In one embodiment of the present disclosure, a first ventilation area A1 is formed between the plurality of first blast blades 22 and the plurality of second blast blades 23. The plurality of second blast blades 23 enclose a second ventilation area A2. Specifically, the first ventilation area A1 is located outside the plurality of second blast blades 23, while the second ventilation area A2 is located inside the plurality of second blast blades 23. The volume of the first ventilation area A1 is larger than that of the second ventilation area A2, meaning that the airflow rate carried by the first ventilation area A1 is greater than that carried by the second ventilation area A2.
請配合參閱圖6所示,鼓風組件20具有一第二支架24。請配合參閱圖7所示,第二支架24設置於複數第一鼓風葉片22遠離第一支架21之一側,使得第一支架21與第二支架24相對設置。散熱裝置100更包括一第二風扇30,第二風扇30設置於第二支架24,使得第一風扇10與第二風扇30相對設置。藉此,本揭露能進一步提升引入空氣的流量。 As shown in FIG6 , the air blower assembly 20 includes a second bracket 24 . As shown in FIG7 , the second bracket 24 is positioned on a side of the plurality of first air blower blades 22 away from the first bracket 21 , such that the first bracket 21 and the second bracket 24 are positioned opposite each other. The heat dissipation device 100 further includes a second fan 30 , which is positioned on the second bracket 24 , such that the first fan 10 and the second fan 30 are positioned opposite each other. This further increases the flow rate of the introduced air.
於本揭露一實施例中,鼓風組件20的第二支架24呈一環狀。第二風扇30具有複數第二葉片31,複數第二葉片31設置於第二支架24,第二支架24得相鄰於複數第二葉片31的葉片邊緣。而複數第二鼓風葉片23可以與第二風扇30接 觸或不接觸。 In one embodiment of the present disclosure, the second bracket 24 of the air blower assembly 20 is ring-shaped. The second fan 30 has a plurality of second blades 31 mounted on the second bracket 24. The second bracket 24 is positioned adjacent to the edges of the second blades 31. The second air blower blades 23 may or may not be in contact with the second fan 30.
總結來說,本揭露具有以下技術特點: In summary, this disclosure has the following technical features:
一、於第一風扇10與鼓風組件20的配合之下,本揭露可以引導不同方向的氣流。如此一來,即可增加風流流量,以有效對CPU進行散熱。 1. With the cooperation of the first fan 10 and the air blowing assembly 20, the present disclosure can guide airflow in different directions. This increases the airflow rate and effectively dissipates heat from the CPU.
二、本揭露可以依據不同實施情形,組合第一風扇10、鼓風組件20、第二風扇30,從而進一步地增加風流流量。 Second, the present disclosure can be combined with a first fan 10, a blower assembly 20, and a second fan 30 according to different implementation scenarios to further increase the airflow rate.
前述功效並不妨礙其他功效之存在。若本領域通常知識者自說明書、申請專利範圍或圖式等之記載可以導出之功效者,亦包含在本揭露功效中。因此,本揭露的功效不侷限於前述列舉之功效。 The aforementioned effects do not preclude the existence of other effects. Effects that can be inferred from the description, patent application, or drawings by a person skilled in the art are also included in the effects disclosed herein. Therefore, the effects disclosed herein are not limited to the aforementioned effects.
以上所舉實施例僅用以闡述本揭露而已,並非用以限制本揭露之範圍。舉凡,不違背本揭露創作精神所從事的各種修改或變化,俱屬本揭露意欲保護之範疇。 The above examples are intended only to illustrate the present disclosure and are not intended to limit its scope. Any modifications or variations that do not violate the spirit of the present disclosure are intended to be protected by the present disclosure.
100:散熱裝置 100: Heat dissipation device
1:基座 1: Base
10:第一風扇 10: First Fan
11:轉動部 11: Rotating part
12:第一葉片 12: First leaf
121:外側邊緣 121: Outer edge
20:鼓風組件 20: Blower assembly
21:第一支架 21: First bracket
211:內側 211: Inside
22:第一鼓風葉片 22: First blast blade
221:第一內弧面 221: First inner arc surface
L:軸向 L: Axial direction
Claims (8)
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| CN104405667A (en) * | 2014-11-20 | 2015-03-11 | 珠海格力电器股份有限公司 | Air draft device and range hood |
| CN110005638B (en) * | 2019-04-30 | 2024-01-12 | 苏州睿昕汽车配件有限公司 | Integrated guide hub structure fan |
| WO2023202327A1 (en) * | 2022-04-18 | 2023-10-26 | 续新电器技术(深圳)有限公司 | Combined fan blade structure and air outlet device |
| TWM665852U (en) * | 2024-10-16 | 2025-01-21 | 李格通 | Heat sink |
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