TWI895006B - Memory device and data accessing method thereof - Google Patents
Memory device and data accessing method thereofInfo
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Abstract
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本發明是有關於一種記憶體裝置以及其資料存取方法,且特別是有關於一種可提升資料讀取速率的記憶體裝置以及其資料存取方法。The present invention relates to a memory device and a data access method thereof, and in particular to a memory device and a data access method thereof capable of improving data reading rate.
在反及閘式快閃記憶體裝置中,在習知的技術領域中,當要針對記憶胞區塊進行資料讀取動作中,需先針對記憶胞區塊中的讀取選中字元線施加讀取電壓,並針對記憶胞區塊中的未選中字元線施加通過電壓。並在當讀取電壓以及通過電壓的電壓值穩定後,透過開啟記憶胞串來讀出選中記憶胞中的儲存資料。而在要執行下一次的資料讀取動作時,則需要重新針對所要讀取的記憶胞區塊中的字元線施加讀取電壓以及通過電壓,並等待讀取電壓以及通過電壓上升至穩定電壓值後,才能讀出選中記憶胞中的儲存資料。也就是說,在多個記憶胞區塊的連續的資料讀取動作中,會因為重複的讀取電壓以及通過電壓的穩定狀態的等待動作,而耗去大量的等待時間,並降低記憶體裝置的工作效率。In conventional NAND flash memory devices, to read data from a memory cell block, a read voltage is applied to the selected word line in the memory cell block, and a pass voltage is applied to the unselected word lines in the memory cell block. Once the read and pass voltages stabilize, the memory cell string is turned on to read the data stored in the selected memory cell. To perform the next data read operation, the read voltage and pass voltage must be reapplied to the word lines in the memory cell block to be read. The device then waits for the read voltage and pass voltage to reach a stable value before reading the stored data in the selected memory cell. This means that when continuously reading data from multiple memory cell blocks, the repeated waiting for the read voltage and pass voltage to stabilize consumes a significant amount of waiting time, reducing the operating efficiency of the memory device.
本發明提供一種記憶體裝置以及其資料存取方法,可提升資料的讀取速率。The present invention provides a memory device and a data access method thereof, which can improve the data reading rate.
本發明的記憶體裝置的資料存取方法包括:在第一時間區間中,對第一記憶胞區塊的第一讀取選中字元線施加讀取電壓;在第一時間區間中的第一資料讀出時間區間中開啟第一記憶胞區塊中的至少一第一記憶胞串;在第二時間區間中,對第二記憶胞區塊的第二讀取選中字元線施加讀取電壓,其中第一時間區與該第二時間區間部分重疊;以及,在第二時間區間中的第二資料讀出時間區間中開啟第二記憶胞區塊中的至少一第二記憶胞串,其中第一資料讀出時間區間與第二資料讀出時間區間不相互重疊。The data access method of the memory device of the present invention includes: applying a read voltage to a first read selected word line of a first memory cell block in a first time interval; enabling at least a first memory cell string in the first memory cell block in a first data read time interval in the first time interval; applying a read voltage to a second read selected word line of a second memory cell block in a second time interval, wherein the first time interval and the second time interval partially overlap; and enabling at least a second memory cell string in the second memory cell block in a second data read time interval in the second time interval, wherein the first data read time interval and the second data read time interval do not overlap with each other.
本發明的記憶體裝置的另一資料存取方法包括:對應記憶體裝置的多條字元線以區分出多個記憶胞區塊;根據讀取順序以設定記憶胞區塊中的第一記憶胞區塊以及第二記憶胞區塊;在開啟第一記憶胞區塊中的至少一第一記憶胞串以進行讀取動作時,針對第二記憶胞區塊的字元線進行預設定動作;以及,在第一記憶胞區塊的至少一第一記憶胞串讀取動作完成後,開啟第二記憶胞區塊的至少一第二記憶胞串。Another data access method for a memory device of the present invention includes: distinguishing a plurality of memory cell blocks according to a plurality of word lines of the memory device; setting a first memory cell block and a second memory cell block in the memory cell blocks according to a read order; performing a preset operation on the word lines of the second memory cell block when at least one first memory cell string in the first memory cell block is enabled for a read operation; and, after the read operation on the at least one first memory cell string in the first memory cell block is completed, enabling at least one second memory cell string in the second memory cell block.
本發明的記憶體裝置包括多個記憶胞區塊以及控制器。控制器耦接至上述的記憶胞區塊,並用以執行如上所述的資料存取方法。The memory device of the present invention includes a plurality of memory cell blocks and a controller. The controller is coupled to the memory cell blocks and is used to execute the data access method described above.
基於上述,本發明的記憶體裝置可透過對下一個要存取的記憶胞區塊的字元線執行預設定動作,在相互部分重疊的第一時間區間以及第二時間區間,連續的針對不同記憶胞區塊進行資料讀取動作。如此一來,對應不同記憶胞區塊的第一資料讀出時間區間以及第二資料讀出時間區間可相連接的被產生,有效提升記憶胞的資料讀取效率。Based on the above, the memory device of the present invention can execute a preset action on the word line of the next memory cell block to be accessed, continuously performing data read operations on different memory cell blocks during partially overlapping first and second time intervals. In this way, the first data read time intervals and second data read time intervals corresponding to different memory cell blocks can be generated in a continuous manner, effectively improving memory cell data read efficiency.
請參照圖1,圖1繪示本發明一實施例的記憶體裝置的資料存取方法的流程圖。在本實施例中,記憶體裝置包括多個記憶胞區塊,各個記憶胞區塊具有一個或多個記憶胞串。各個記憶胞串上的多個記憶胞可分別耦接至多條字元線。在本實施例中,記憶體裝置可以為反及式(NAND)快閃記憶體裝置。Please refer to Figure 1, which illustrates a flow chart of a data access method for a memory device according to one embodiment of the present invention. In this embodiment, the memory device includes multiple memory cell blocks, each of which has one or more memory cell strings. The multiple memory cells in each memory cell string can be coupled to multiple word lines. In this embodiment, the memory device can be a NAND flash memory device.
在本實施例的資料存取方法的流程中,步驟S110中,記憶體裝置的控制器可在第一時間區間中,對多個記憶胞區塊中的第一記憶胞區塊的第一讀取選中字元線施加一讀取電壓。接著,在步驟S120中,控制器可在第一時間區間中的第一資料讀出時間區間中開啟第一記憶胞區塊中的至少一第一記憶胞串。藉此,被開啟的第一記憶胞區塊中的一條或多條第一記憶胞串中,對應第一讀取選中字元線的記憶胞中所儲存的資料可以在第一資料讀出時間區間中被讀出。In the data access method of this embodiment, in step S110, a controller of a memory device may apply a read voltage to a first read-selected word line of a first memory cell block among a plurality of memory cell blocks during a first time interval. Next, in step S120, the controller may enable at least one first memory cell string in the first memory cell block during a first data read time interval within the first time interval. Consequently, data stored in memory cells corresponding to the first read-selected word line in one or more first memory cell strings in the enabled first memory cell block can be read during the first data read time interval.
此外,在步驟S130中,記憶體裝置的控制器可在第二時間區間中,對多個記憶胞區塊中的第二記憶胞區塊的第二讀取選中字元線施加讀取電壓。其中,第二時間區間與前述的第一時間區間可以不相同,在細節上,第二時間區間可與前述的第一時間區間有部分相互重疊,但不完全相互重疊。Furthermore, in step S130, the controller of the memory device may apply a read voltage to a second read-selected word line of a second memory cell block among the plurality of memory cell blocks during a second time period. The second time period may be different from the first time period. Specifically, the second time period may partially overlap with the first time period, but not completely.
接著,在步驟S140中,控制器可在第二時間區間中的第二資料讀出時間區間中開啟第二記憶胞區塊中的至少一第二記憶胞串。藉此,被開啟的第一記憶胞區塊中的一條或多條第二記憶胞串中,對應第二讀取選中字元線的記憶胞中所儲存的資料可以在第二資料讀出時間區間中被讀出。Next, in step S140, the controller may enable at least one second memory cell string in the second memory cell block during a second data read time period within the second time period. Thus, data stored in memory cells corresponding to the second read-selected word line in one or more second memory cell strings in the enabled first memory cell block can be read during the second data read time period.
值得注意的,在本實施例中,第一資料讀出時間區間以及第二資料讀出時間區間完全不相互重疊。在第一資料讀出時間區間中,對應第一讀取選中字元線的記憶胞的被讀出的資料可透過對應的位元線來被傳送出來。而在第一資料讀出時間區間中,對應第二讀取選中字元線的記憶胞的被讀出的資料同樣可透過對應的位元線來被傳送出來。其中,在本實施例中,對應第一讀取選中字元線的記憶胞與對應第二讀取選中字元線的記憶胞可對應至相同的位元線。It is worth noting that in this embodiment, the first data read time period and the second data read time period do not overlap at all. During the first data read time period, the data read from the memory cells corresponding to the first read-selected word line can be transmitted via the corresponding bit lines. During the second data read time period, the data read from the memory cells corresponding to the second read-selected word line can also be transmitted via the corresponding bit lines. In this embodiment, the memory cells corresponding to the first read-selected word line and the memory cells corresponding to the second read-selected word line can correspond to the same bit line.
在本實施例中,記憶體裝置的控制器,當在第一時間區間中,在第一記憶胞區塊的資料讀取動作尚未完成時,可透過在第二時間區間與第一時間區間重疊的時間區間中,先行針對第二記憶胞區塊的第二讀取選中字元線施加讀取電壓。如此一來,當在第一時間區間中的第一資料讀出時間區間中所執行的第一記憶胞區塊的記憶胞的資料讀取動作完成後,記憶體裝置的控制器可在第一資料讀出時間區間後的第二資料讀出時間區間即刻的執行第二記憶胞區塊的記憶胞的資料讀取動作。如此一來,可有效提升多個記憶體區塊間的記憶胞的儲存資料的讀取效率。In this embodiment, when a data read operation on a first memory cell block has not yet been completed during a first time interval, the controller of the memory device can preliminarily apply a read voltage to a second read-selected word line of a second memory cell block during a second time interval that overlaps the first time interval. In this manner, after the data read operation on the memory cells of the first memory cell block executed during the first data read time interval within the first time interval is completed, the controller of the memory device can immediately execute a data read operation on the memory cells of the second memory cell block during the second data read time interval that follows the first data read time interval. In this way, the efficiency of reading data stored in memory cells across multiple memory blocks can be effectively improved.
請參照圖2,圖2繪示本發明一實施例的記憶體裝置的示意圖。記憶體裝置200包括多個記憶胞區塊B1~B3以及控制器210。控制器210耦接至記憶胞區塊B1~B3。在本實施例中,各個記憶胞區塊B1~B3包括多個記憶胞串(例如記憶胞串MS1)。各個記憶胞區塊B1~B3中的記憶胞串分別耦接至多條位元線BL0~BLM。位元線BL0~BLM並分別耦接至多個頁緩衝器(page buffer, PB)221~22M。Please refer to Figure 2, which shows a schematic diagram of a memory device according to an embodiment of the present invention. Memory device 200 includes a plurality of memory cell blocks B1-B3 and a controller 210. Controller 210 is coupled to memory cell blocks B1-B3. In this embodiment, each memory cell block B1-B3 includes a plurality of memory cell strings (e.g., memory cell string MS1). The memory cell strings in each memory cell block B1-B3 are respectively coupled to a plurality of bit lines BL0-BLM. The bit lines BL0-BLM are also respectively coupled to a plurality of page buffers (PB) 221-22M.
記憶胞區塊B1中的多個記憶胞耦接至字元線WL10~WL1N;記憶胞區塊B2中的多個記憶胞耦接至字元線WL20~WL2N;記憶胞區塊B3中的多個記憶胞耦接至字元線WL30~WL3N。記憶胞區塊B1、B2、B3中的多個記憶胞串分別相互對應,並分別耦接至位元線BL0~BLM。也就是說,記憶胞區塊B1、B2、B3中,在位置上相互對應的三個記憶胞串,可耦接至相同的一共用位元線。Multiple memory cells in memory cell block B1 are coupled to word lines WL10-WL1N; multiple memory cells in memory cell block B2 are coupled to word lines WL20-WL2N; and multiple memory cells in memory cell block B3 are coupled to word lines WL30-WL3N. Multiple memory cell strings in memory cell blocks B1, B2, and B3 correspond to each other and are coupled to bit lines BL0-BLM, respectively. In other words, the three corresponding memory cell strings in memory cell blocks B1, B2, and B3 can be coupled to the same shared bit line.
關於記憶胞串MS1的實施細節,記憶胞串MS1具有相互串接的多個記憶胞MC以及耦接在記憶胞串MS1兩端的記憶胞串選擇開關SS1以及接地選擇開關GS1。其中,記憶胞MC的控制端分別耦接至多條字元線WL10~WL1N,接地選擇開關GS1耦接在多個記憶胞MC以及參考接地端GND間,記憶胞串選擇開關SS1則耦接在記憶胞MC與對應的位元線BL0間。接地選擇開關GS1受控於控制信號GSL1,記憶胞串選擇開關SS1則受控於控制信號SSL1。Regarding the implementation details of memory cell string MS1, memory cell string MS1 includes multiple memory cells MC connected in series, and a memory cell string select switch SS1 and a ground select switch GS1 coupled to both ends of memory cell string MS1. The control terminals of the memory cells MC are coupled to multiple word lines WL10 to WL1N, respectively. The ground select switch GS1 is coupled between the multiple memory cells MC and the reference ground terminal GND. The memory cell string select switch SS1 is coupled between the memory cells MC and the corresponding bit line BL0. The ground select switch GS1 is controlled by a control signal GSL1, while the memory cell string select switch SS1 is controlled by a control signal SSL1.
在本實施例中,控制器210可以為具運算能力的處理器,或者控制器210可以是任意形式的數位電路,或是透過硬體描述語言(Hardware Description Language, HDL)或是其他任意本領域具通常知識者所熟知的數位電路的設計方式來進行設計,並透過現場可程式邏輯門陣列(Field Programmable Gate Array, FPGA)、複雜可程式邏輯裝置(Complex Programmable Logic Device, CPLD)或是特殊應用積體電路(Application-specific Integrated Circuit, ASIC)的方式來實現的硬體電路。In this embodiment, the controller 210 can be a processor with computing capabilities, or the controller 210 can be any form of digital circuit, or a hardware circuit designed using a hardware description language (HDL) or any other digital circuit design method known to those skilled in the art, and implemented using a field programmable gate array (FPGA), a complex programmable logic device (CPLD), or an application-specific integrated circuit (ASIC).
關於記憶體裝置200的資料讀取動作的細節,可同步參照圖2以及圖3,其中圖3繪示的本發明實施例的記憶體裝置的動作波形圖。在圖3中,記憶體裝置200的控制器210可先針對記憶胞區塊B1執行資料讀取動作。並且,控制器210可在第一時間區間TP1中,針對記憶胞區塊B1中被選中以進行資料讀取動作的讀取選中字元線施加一讀取電壓Vread,並針對讀取選中字元線以外的未選中字元線施加通過電壓Vpass。For details on the data read operation of memory device 200, please refer to Figures 2 and 3 , where Figure 3 illustrates waveforms of the memory device according to an embodiment of the present invention. In Figure 3 , controller 210 of memory device 200 may first perform a data read operation on memory cell block B1. Furthermore, during a first time period TP1, controller 210 may apply a read voltage Vread to a selected read word line in memory cell block B1 that is selected for data read, and apply a pass voltage Vpass to unselected word lines other than the selected read word line.
接著,在第一時間區間TP1中,當讀取電壓Vread以及通過電壓Vpass已上升至穩定電壓值後,控制器210可在第一讀取時間區間tR1中,針對記憶胞區塊B1中的記憶胞串中的接地選擇開關以及記憶胞串選擇開關分別施加控制信號SSL1以及GSL1,並透過具有相對高電壓值的控制信號SSL1以及GSL1來使記憶胞區塊B1中的記憶胞串中的接地選擇開關以及記憶胞串選擇開關被導通,並使記憶胞區塊B1中的記憶胞串被開啟。Then, in the first time period TP1, after the read voltage Vread and the pass voltage Vpass have risen to a stable voltage value, the controller 210 may apply control signals SSL1 and GSL1 to the ground selection switch and the memory cell string selection switch in the memory cell string in the memory cell block B1, respectively, in the first read time period tR1, and through the control signals SSL1 and GSL1 having relatively high voltage values, the ground selection switch and the memory cell string selection switch in the memory cell string in the memory cell block B1 are turned on, and the memory cell string in the memory cell block B1 is turned on.
在本實施例中,通過電壓Vpass可大於讀取電壓Vread。其中,在當記憶胞區塊B1中的記憶胞串被開啟後,記憶胞區塊B1中接收通過電壓Vpass的記憶胞(未選中記憶胞)被完全導通而不影響到對應的位元線上的電流。而接收讀取電壓Vread的記憶胞(選中記憶胞)則可根據所儲存的資料來產生位元線上的電流。因此,記憶體裝置200可透過感測位元線BL0~BLM上的電流大小,可以得知記憶胞區塊B1中的多個記憶胞串中分別對應的被選中記憶胞中所儲存的資料。In this embodiment, the pass voltage Vpass can be greater than the read voltage Vread. When the memory cell strings in memory cell block B1 are turned on, the memory cells in memory cell block B1 that receive the pass voltage Vpass (unselected memory cells) are fully turned on without affecting the current on the corresponding bit lines. The memory cells that receive the read voltage Vread (selected memory cells) can generate current on the bit lines based on the stored data. Therefore, by sensing the current on bit lines BL0-BLM, the memory device 200 can determine the data stored in the selected memory cells corresponding to the multiple memory cell strings in memory cell block B1.
值得一提的,在本實施例中,第二時間區間TP2與第一時間區間TP1是部分重疊的,並且,第二時間區間TP2也可與第一時間區間TP1中的第一讀取時間區間tR1是部分重疊的。也就是說,在記憶胞區塊B1的資料讀取動作在被執行的同時,控制器可在第二時間區間TP2中,針對記憶胞區塊B2中被選中以進行資料讀取動作的讀取選中字元線施加讀取電壓Vread,並針對讀取選中字元線以外的未選中字元線施加通過電壓Vpass。It is worth noting that, in this embodiment, the second time period TP2 partially overlaps with the first time period TP1, and the second time period TP2 may also partially overlap with the first read time period tR1 within the first time period TP1. That is, while the data read operation of the memory cell block B1 is being executed, the controller may, during the second time period TP2, apply a read voltage Vread to the read-selected word line in the memory cell block B2 that is selected for data read, and apply a pass voltage Vpass to unselected word lines other than the read-selected word line.
從圖3可以得知,對應第二記憶胞區塊的讀取電壓Vread以及通過電壓Vpass,可在記憶胞區塊B1執行資料讀取動作的同時,預先的被施加至記憶胞區塊B2中的對應的各字元線上,以針對記憶胞區塊B1的字元線進行預設定動作。並且,在第一讀取時間區間tR1完成前,記憶胞區塊B2中各字元線上的讀取電壓Vread以及通過電壓Vpass可達穩定狀態。如此一來,在第一讀取時間區間tR1完成後,控制器210可在第二讀取時間區間tR2中透過提供具有相對高電壓值的控制信號SSL2以及GSL2來使記憶胞區塊B2中的記憶胞串中的接地選擇開關以及記憶胞串選擇開關被導通,並執行記憶胞區塊B2中的記憶胞的資料讀取動作。As shown in Figure 3, the read voltage Vread and pass voltage Vpass corresponding to the second memory cell block can be pre-applied to the corresponding word lines in memory cell block B2 while memory cell block B1 is performing a data read operation, thereby performing a preset operation on the word lines of memory cell block B1. Furthermore, before the completion of the first read time period tR1, the read voltage Vread and pass voltage Vpass on each word line in memory cell block B2 can reach a stable state. In this way, after the first read time interval tR1 is completed, the controller 210 can provide control signals SSL2 and GSL2 with relatively high voltage values in the second read time interval tR2 to turn on the ground selection switch and the memory cell string selection switch in the memory cell string in the memory cell block B2, and perform the data reading operation of the memory cells in the memory cell block B2.
在本實施例中,第二讀取時間區間tR2可發生在第一讀取時間區間tR1後。第二讀取時間區間tR2並可緊鄰第一讀取時間區間tR1。In this embodiment, the second read time period tR2 may occur after the first read time period tR1. The second read time period tR2 may be adjacent to the first read time period tR1.
值得注意的,在本發明實施例中,記憶體裝置200的控制器210可接續記憶胞區塊B2中的記憶胞的資料讀取動作後繼續執行記憶胞區塊B3中的記憶胞的資料讀取動作。其中,控制器210可在與第二時間區間TP2以及第二讀取時間區間tR2部分重疊的第三時間區間TP3中,預先提供讀取電壓Vread以及通過電壓Vpass至記憶胞區塊B3的各字元線上。並在第二讀取時間區間tR2後的第三讀取時間區間tR3,提供具有相對高電壓值的控制信號SSL3以及GSL3來使記憶胞區塊B3中的記憶胞串中的接地選擇開關以及記憶胞串選擇開關被導通,並執行記憶胞區塊B3中的記憶胞的資料讀取動作。It is worth noting that in this embodiment of the present invention, the controller 210 of the memory device 200 may continue to read data from the memory cells in the memory cell block B2 before continuing to read data from the memory cells in the memory cell block B3. The controller 210 may pre-provide a read voltage Vread and a pass voltage Vpass to each word line of the memory cell block B3 during a third time period TP3 that partially overlaps with the second time period TP2 and the second read time period tR2. In a third read time period tR3 following the second read time period tR2, control signals SSL3 and GSL3 having relatively high voltage values are provided to turn on the ground select switch and the memory cell string select switch in the memory cell string in the memory cell block B3, thereby performing a data read operation on the memory cells in the memory cell block B3.
由上述的實施例可以得知,本發明實施例的記憶體裝置200可快速的在不同的記憶胞區塊B1~B3間切換以執行資料讀取動作。並透過使讀取電壓Vread以及通過電壓Vpass在前一區塊的資料讀取動作未完成前,先行提供至下一個要進行資料讀取動作的記憶胞區塊,以有效減低讀取電壓Vread以及通過電壓Vpass上升至穩定狀態的等待時間,可提升記憶體裝置200的資料讀取速率。As can be seen from the above-described embodiments, the memory device 200 of the present invention can quickly switch between different memory cell blocks B1-B3 to perform data read operations. Furthermore, by providing the read voltage Vread and the pass voltage Vpass to the next memory cell block to be read before the data read operation of the previous block is completed, the waiting time for the read voltage Vread and the pass voltage Vpass to rise to a stable state is effectively reduced, thereby improving the data read rate of the memory device 200.
在圖3的實施例中,在記憶胞區塊B3的資料讀取動作後,控制器210可接續執行記憶胞區塊B1、B2或其他未繪示的記憶胞區塊的資料讀取動作。本發明實施例中,控制器210可連續的執行不相同的任二記憶胞區塊的資料讀取動作,圖3繪示針對記憶胞區塊B1至B3的依序執行資料讀取動作的方式,僅只是說明用的實施例,不用以限制本發明的實施範疇。In the embodiment of FIG. 3 , after performing a data read operation on memory cell block B3, controller 210 may subsequently perform data read operations on memory cell blocks B1, B2, or other memory cell blocks not shown. In this embodiment of the present invention, controller 210 may sequentially perform data read operations on any two different memory cell blocks. FIG. 3 illustrates sequentially performing data read operations on memory cell blocks B1 through B3. This is for illustrative purposes only and is not intended to limit the scope of the present invention.
值得注意的,本發明實施例的資料讀取動作也可以應用在其他種類的記憶體裝置中,並沒有限定須應用在反及閘式快閃記憶體裝置中。It is worth noting that the data reading operation of the embodiment of the present invention can also be applied to other types of memory devices and is not limited to being applied to NAND flash memory devices.
此外,在本發明其他實施例中,一份需求資料可拆分為多個資料頁,並預先依照一設定順序的依序的儲存在不同記憶胞區塊中。如此一來,當要針對需求資料進行資料讀取動作時,則可應用本發明圖3的實施例,根據多個資料頁的儲存順序,依序的針對各個記憶胞區塊來執行快速的資料讀取動作。如此一來,需求資料可被快速的讀出,提升系統的工作效能。Furthermore, in other embodiments of the present invention, a set of demand data can be split into multiple data pages and pre-stored in different memory cell blocks in a predetermined order. Thus, when data is to be read from the demand data, the embodiment of FIG. 3 of the present invention can be applied to quickly read data from each memory cell block based on the storage order of the multiple data pages. This allows for rapid data retrieval, improving system performance.
綜上所述,本發明的記憶體裝置透過在目前的記憶胞區塊的資料讀取動作進行時,預先針對下一個要進行資料讀取動作的下一個記憶胞區塊的字元線施加對應的讀取電壓以及通過電壓。如此一來,在連續的記憶胞區塊的資料讀取動作中,可省去字元線上的讀取電壓以及通過電壓的穩定時間的等待時間,有效提升記憶胞的資料讀取效率。In summary, the memory device of the present invention pre-applies the corresponding read voltage and pass voltage to the word line of the next memory cell block to be read, while the data read operation of the current memory cell block is in progress. This eliminates the waiting time for the read voltage and pass voltage on the word line to stabilize during consecutive memory cell block data read operations, effectively improving memory cell data read efficiency.
200:記憶體裝置 210:控制器 221~22M:頁緩衝器 B1~B3:記憶胞區塊 BL0~BLM:位元線 GND:參考接地端 GS1:接地選擇開關 GSL1~GSL3、SSL1~SSL3:控制信號 MC:記憶胞 MS1:記憶胞串 S110~S140:步驟 SS1:記憶胞串選擇開關 TP1~TP3、tR1~tR3:時間區間 Vpass:通過電壓 Vread:讀取電壓 WL10~WL3N:字元線 200: Memory device 210: Controller 221-22M: Page buffer B1-B3: Memory cell block BL0-BLM: Bit line GND: Ground reference GS1: Ground select switch GSL1-GSL3, SSL1-SSL3: Control signals MC: Memory cell MS1: Memory cell string S110-S140: Step SS1: Memory cell string select switch TP1-TP3, tR1-tR3: Time interval Vpass: Pass voltage Vread: Read voltage WL10-WL3N: Word line
圖1繪示本發明一實施例的記憶體裝置的資料存取方法的流程圖。 圖2繪示本發明一實施例的記憶體裝置的示意圖。 圖3繪示本發明實施例的記憶體裝置的動作波形圖。 Figure 1 illustrates a flow chart of a data access method for a memory device according to an embodiment of the present invention. Figure 2 illustrates a schematic diagram of a memory device according to an embodiment of the present invention. Figure 3 illustrates an operational waveform diagram of the memory device according to an embodiment of the present invention.
S110~S140:步驟 S110~S140: Steps
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| US20230162795A1 (en) * | 2021-11-24 | 2023-05-25 | Samsung Electronics Co., Ltd. | Memory device for controlling word line voltage and operating method thereof |
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| TW201711029A (en) * | 2015-09-11 | 2017-03-16 | 東芝股份有限公司 | Memory system |
| US20230162795A1 (en) * | 2021-11-24 | 2023-05-25 | Samsung Electronics Co., Ltd. | Memory device for controlling word line voltage and operating method thereof |
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