TWI894958B - Wafer probing equipment using a probe card positioning module - Google Patents

Abstract

A wafer probing device using a probe card positioning module combines the precision movement capabilities of a wafer carrier and a probe card positioning module to achieve precise positioning of multiple probe cards to support parallel testing. By simply operating a lifting mechanism, the shield above the wafer carrier can be easily and quickly removed, allowing for more flexible wafer placement and easier adjustment of the probe card positioning module and the wafer carrier. Maintenance and repair are easy. Furthermore, the probe card positioning module is mounted on a load-bearing bracket, making the design of the probe card positioning module more flexible and facilitating changes or simplifications in the mechanical design to accommodate a wider range of application requirements. The present invention also discloses installing at least one image capture device in the probe card positioning module to monitor and correct probe positioning drift caused by temperature changes, achieving more stable and reliable wafer probing capabilities.

Description

Wafer probing equipment using a probe card positioning module

This invention is a wafer probing device for use in wafer-level automated test systems. Through the innovative integration of a wafer stage and a probe card positioning module, it enhances the precision positioning capabilities of multiple probe cards. It also provides greater flexibility in mechanical design, facilitating the development of more reliable, convenient, and cost-effective parallel testing solutions to increase wafer test throughput.

With the continued growth of semiconductor technology and industry scale, more powerful chips have emerged. This necessitates more accurate and efficient analysis of semiconductor device parameters and reliability by acquiring larger amounts of test data. Consequently, more wafer testers are needed to achieve sufficient test capacity. However, limited space in factory test lines or laboratories makes it difficult to continuously plan for additional wafer testers. Therefore, increasing test capacity per unit time and within this limited space has always been a key concern for the industry.

To achieve greater test throughput within limited space, parallel testing is a typical development direction. It is known that to test multiple DUTs simultaneously, multiple probe cards can be used to simultaneously probe DUTs at different locations on the wafer surface. As shown in Figures 24 and 25 , the commonly used probing device has a first track 2 and a second track 3 positioned on either side of a platform 1, along with a third track 4 that can slide on both tracks. However, this commonly used technology still has many shortcomings, five of which are listed below:

1. The conventional third track 4 must span the opening 5 of the platform 1. Its ends are slidably positioned on the first and second tracks 2 and 3 on either side of the opening 5, respectively. This requires the third track 4 to be long enough to span the opening 5. This limitation not only limits the freedom of track length design, but more importantly, the use of a longer track easily amplifies the effects of thermal expansion and contraction caused by temperature fluctuations. This is especially true when the stage 6 beneath the third track 4 requires high-temperature heating (e.g., 200°C). This is a significant issue for wafer probing equipment requiring ultra-high-precision positioning.

2. The third track 4 in the conventional technology is equipped with multiple probe stations 8. These probe stations 8 have numerous paths for mutual interference. For example, each probe station 8 can interfere with each other through the connection to the third track 4. Furthermore, multiple third tracks 4 can also interfere with each other through the connection to the first track 2 or the second track 3. However, during the initial operation of the test process, each probe station 8 must be adjusted sequentially so that each probe card 9 can accurately align with the DUT A below. If there are too many mechanical connections between the probe stations 8, which can easily cause mutual interference, it will be difficult to adjust and align the probe cards 9 in a sequential manner.

3. The track's fixed foundation in the applied technology is platform 1 beneath it. However, platform 1 sits adjacent to a large, high-temperature-heated carrier 6. The temperature control device 7 for carrier 6 is not very stable, and its operation still results in temperature fluctuations. Furthermore, during wafer testing, the relative positions of the various probe stages 8 or the third track 4 relative to carrier 6 or platform 1 often need to be changed. These factors make it difficult to maintain an ideal thermal equilibrium between the mechanisms. This situation presents a problem for the applied technology, which relies on platform 1 adjacent to a high-temperature heat source as its foundation.

4. While using multiple probe stations 8 facilitates parallel testing, the wider spatial distribution of the multiple probe stations 8 during wafer temperature fluctuations can exacerbate dimensional errors caused by thermal expansion and contraction, making probe positioning drift more likely. Therefore, ensuring that multiple probe stations 8 maintain precise positioning without drift during wafer testing is a major challenge. However, conventional techniques only involve manual observation and adjustment at the initial stage of the process to align each probe card 9 individually, achieving temporary alignment between each probe card 9 and the DUT A. However, the positioning status of each probe card 9 on each probe station 8 is not monitored or recorded during the subsequent testing process. Therefore, it is impossible to immediately detect whether the contact position between each probe card 9 and the DUT A has drifted. Typically, the cause of the test anomaly is only identified after the wafer test mission is complete due to excessive test data anomalies.

5. The third track 4 and the multiple probe stages 8 it supports directly block the platform 1 opening 5 and the carrier 6 below. Therefore, wafers cannot be placed or retrieved from above the platform 1 opening 5. Wafers can only be placed or retrieved from the side of the carrier 6 below the platform 1 opening 5. This limits the mechanical design, preventing the adoption of some cost-saving system design concepts, and also makes maintenance of the carrier 6 very inconvenient.

To address the numerous issues with the learned approach, the inventors, after extensive observation and reflection, as well as numerous prototype tests and improvements, have developed a wafer probing system using a probe card positioning module. This system completely resolves or effectively improves many of the shortcomings of the learned approach.

The present invention discloses a wafer probing device using a probe card positioning module, which includes a wafer probing base, the wafer probing base having a wafer carrier and a carrier moving device. The wafer carrier is located above the carrier moving device so that the carrier moving device can move the wafer carrier. The wafer carrier carries and adsorbs a wafer, and the wafer probing base has a lifting mechanism, which has a load-bearing bracket. At least one probe card positioning module, mounted on the load-bearing bracket, having at least one probe alignment device, the probe alignment device being equipped with at least one probe card, the probe card being equipped with at least one probe, and the probe alignment device being adjustable to change the relative position between the probe card and the wafer; and an electromechanical control system electrically connected to the probe card positioning module.

With the above structure, the advantages of the present invention are as follows:

1. Good stability and availability: Since the present invention completely abandons the third rail with two sliding ends set above the platform in the conventional technology, there is no need to configure motors at both ends of the long rail to push the sliding long rail. Therefore, there is no need to worry about the motors pushing the two ends of the third rail to slide having to bear the weight of the rail itself and the weight of multiple detection platforms. The present invention does not need to be limited by the track length limit caused by the conventional technology that the track must cross the platform opening by using the design of the load-bearing bracket, so it can flexibly use distributed By independently installing multiple probe alignment devices or adopting a short track design, the probe card positioning module of the present invention, if actuated by an electric device, can reduce the weight it bears, helping to improve the reliability and extend the service life of the wafer probing equipment. Furthermore, the present invention integrates the mature and stable stage motion device, which is primarily responsible for the relative movement between the probe card and the wafer. This significantly reduces the workload of the probe card positioning module, effectively delaying its wear.

2. Reduced thermal balance issues between the high-temperature heat source and the mechanism: This invention uses the load-bearing bracket of the lifting mechanism as the fixed base for the probe card positioning module. Therefore, compared to conventional designs, the probe card positioning module in this invention is not placed on a platform as is conventionally done. As a result, the mechanism's fixed base is further away from the high-temperature heat source of the wafer stage below. This reduces the impact of the high-temperature heat source and helps alleviate probe positioning drift caused by unstable thermal balance between the high-temperature heat source and the mechanism.

3. More flexible wafer access: The present invention allows for the quick and easy temporary removal of obstructions above the wafer carrier (e.g., the probe card positioning module and the load-bearing bracket) with simple operation of the lifting mechanism. This allows for more flexible and diverse wafer access, allowing wafers to be accessed from above or from the side of the wafer carrier. This provides greater freedom in the hardware design of the wafer probing equipment, allowing for greater adaptability to diverse application scenarios and supporting greater structural simplification to reduce equipment costs.

4. Easy machine maintenance and parts replacement: With the help of the lifting mechanism, the present invention can quickly and easily remove the shielding above the wafer carrier, making it easier to perform maintenance on the wafer carrier. Furthermore, the present invention can install multiple probe card positioning modules on the load-bearing bracket. Because each probe card positioning module can achieve good mechanical independence, it is very easy to perform maintenance and replacement. There is no complex mechanical linkage between them, and there is no need for complicated disassembly and assembly operations.

5. Improved Mechanical Interference: This invention also discloses that each probe alignment device is provided with an extended fixture. With the assistance of these extended fixtures, the limitations caused by mechanical interference between the probe alignment devices can be effectively improved, allowing the relative distance between the probe cards to be closer, thereby supporting more application requirements.

6. Providing More Stable and Reliable Wafer Probing Capabilities: The present invention further discloses installing at least one image capture device on each probe card positioning module or on an auxiliary track. These image capture devices facilitate the collection of optical or thermal imaging data, facilitating more efficient alignment between the probe cards and the wafer at the initial stage of the testing process. Furthermore, during subsequent wafer testing, these devices can be used to detect, record, or proactively correct positioning deviations on the probe cards. This effectively resolves the probe positioning drift issue that is often encountered with conventional techniques.

[The present invention]

100: Wafer probing equipment using a probe card positioning module

10: Wafer probe base

11:Wafer carrier

111: Wafer

112: Heating device

12: Stage moving device

13: Lifting mechanism

131: Screw device

14: Load-bearing bracket

15: Support Platform

16: Positioning block

17: Positioning column

20: Probe card positioning module

21: Probe alignment device

211: Electric fine-tuning device

2111: Z-axis actuator

2112:Y-axis actuator

2113:X-axis actuator

212: Manual fine-tuning device

22: Detecting Tracks

23: Detection Slide

24: Probe Card

241: Probe

25: Drive device

26: Manual operating device

27: Extension fixings

28: Image capture device

29: Auxiliary track

291: Camera Positioning Slide

30: Electromechanical control system

[Learning]

1: Platform

2: Track 1

3: Second Track

4: Third Track

5: Opening

6: Carrier

7: Temperature control device

8: Detector Station

9: Probe Card

A: Component under test

[Figure 1] is a perspective view of the first embodiment of the present invention.

Figure 2 is a partial enlarged view of point A in Figure 1.

Figure 3 is a schematic diagram of the lowering of the lifting mechanism of the first embodiment of the present invention.

[Figure 4] is a perspective view of the second embodiment of the present invention.

Figure 5 is a partial enlarged view of point B in Figure 4.

[Figure 6] is a perspective view of the third embodiment of the present invention.

Figure 7 is a partial enlarged view of point C in Figure 6.

[Figure 8] is a perspective view of the fourth embodiment of the present invention.

Figure 9 is a partial enlarged view of point D in Figure 8.

[Figure 10] is a perspective view of the fifth embodiment of the present invention.

Figure 11 is a schematic diagram of the lowering of the lifting mechanism of the fifth embodiment of the present invention.

[Figure 12] is a perspective view of the sixth embodiment of the present invention.

Figure 13 is a partial enlarged view of the load-bearing bracket in Figure 12 after it is unfolded.

[Figure 14] is a perspective view of the seventh embodiment of the present invention.

Figure 15 is a partial enlarged view of the probe card positioning module in Figure 14.

[Figure 16] is a perspective view of the eighth embodiment of the present invention.

Figure 17 is a partial enlarged view of point E in Figure 16.

[Figure 18] is a perspective view of the ninth embodiment of the present invention.

Figure 19 is a partial enlarged view of point F in Figure 18.

[Figure 20] is a perspective view of the tenth embodiment of the present invention.

Figure 21 is a partial enlarged view of point G in Figure 20.

[Figure 22] is a perspective view of the eleventh embodiment of the present invention.

Figure 23 is a partial enlarged view of point H in Figure 22.

Figure 24 is a top view of the commonly used detection device.

Figure 25 is a schematic cross-sectional view of a commonly used detection device.

Please refer to Figures 1 to 3, which illustrate a first embodiment of the present invention, which discloses a wafer probing apparatus 100 using a probe card positioning module, comprising:

A wafer probe base 10 is provided with a wafer carrier 11 and a carrier moving device 12. The wafer carrier 11 is located above the carrier moving device 12 so that the carrier moving device 12 can drive the wafer carrier 11 to move in three axes. The wafer carrier 11 carries a wafer 111 on its upper end surface by vacuum adsorption. A heating device 112 is provided inside the wafer carrier 11 to heat the wafer 111 to a high temperature (e.g., 200°C). A lifting mechanism 13 is provided on one side of the wafer probe base 10. In this example, the lifting mechanism 13 employs a rotary and split design, allowing the lifting mechanism 13 and the wafer probe base 10 to be separated from each other, thereby distributing the weight of the equipment and facilitating transportation. However, in some embodiments, the lifting mechanism 13 and the wafer probe base 10 may be integrated into one unit, or may employ a vertical lifting or other equivalent design. In this embodiment, the lifting mechanism 13 is pivotally connected to a load-bearing bracket 14. However, the load-bearing bracket 14 can be easily modified into a variety of different equivalent designs and is not limited to the form disclosed in this embodiment.

A probe card positioning module 20 is provided. In this embodiment, the probe card positioning module 20 is mounted on the bottom surface of the load-bearing bracket 14. However, the combination of the probe card positioning module 20 and the load-bearing bracket 14 can be easily modified to adopt a variety of different equivalent configurations, not limited to this embodiment. The probe card positioning module 20 includes a plurality of probe alignment devices 21, each of which is independently mounted on the probe card positioning module 20. This significantly reduces mutual interference and facilitates sequential adjustment of each probe alignment device 21 to align with the object under test (the wafer 111). Each probe alignment device 21 includes an electric fine-tuning device 211. The adjustment device 211 includes a Z-axis actuator 2111, a Y-axis actuator 2112, and an X-axis actuator 2113, enabling electronically controlled fine-motion capabilities in the X, Y, and Z axes. Each of the electric fine-motion adjustment devices 211 can flexibly utilize a piezoelectric stage, piezoelectric actuator, piezoelectric motor, stepper motor, servo motor, voice coil motor, or other actuators with electronically controlled fine-motion capabilities. In more complex applications, the electric fine-motion adjustment devices 211 may also include actuators with rotation or tilt functions to provide more advanced fine-motion capabilities. In this embodiment, a probe card 24 is provided on the lower end surface of each probe alignment device 21, and each probe card 24 is equipped with at least one probe 241.

An electromechanical control system 30 electrically connects the probe card positioning module 20 and the probe alignment devices 21, enabling the electromechanical control system 30 to control each probe alignment device 21 to move each probe card 24. In more complex applications, the electromechanical control system 30 can also control each probe alignment device 21 to rotate or tilt each probe card 24. In this embodiment, the electromechanical control system 30 is located on the load-bearing bracket 14. However, the location of the electromechanical control system 30 can be easily changed and its position is not limited to this embodiment.

To further illustrate the structural features, technical means employed, and intended effects of the present invention, we will describe the use of the present invention. We believe this will provide a deeper and more detailed understanding of the present invention, as follows:

Referring to Figures 1 to 3 , before wafer testing, the probe alignment devices 21 are first confirmed to be correctly positioned on the probe cards 24. The electromechanical control system 30 is then used to adjust the probe alignment devices 21 to the appropriate position. The lift mechanism 13 then lowers the probe card positioning module 20 until the probes 241 are in close contact with the surface of the wafer 111. The electromechanical control system 30 and the stage movement device 12 are then used to fine-tune the probe alignment devices 21 and the wafer stage 11, respectively, ensuring that the probes 241 of the probe cards 24 contact the appropriate position on the surface of the wafer 111. This achieves precise alignment between the probe cards 24 and the wafer 111.

Since each probe alignment device 21 can be independently mounted on the probe card positioning module 20, during the sequential precision alignment adjustment process, interference from the probe alignment devices 21 pulling against each other, necessitating multiple fine-tuning operations, is less likely to occur.

After the alignment step is completed, actual wafer testing can begin. Specifically, the testing process primarily involves the stage motion device 12 driving the wafer stage 11 for precise three-axis movement. This allows the wafer 111 to precisely shift relative to the probe cards 24. This allows each probe 241 to accurately contact different locations on the surface of the wafer 111, allowing the test instrument (not shown) to simultaneously test the characteristics of circuit components at various locations on the surface of the wafer 111.

Continuing with Figures 4 and 5, the second embodiment of the present invention is disclosed. This second embodiment differs from the first embodiment in that the probe card positioning module 20 is provided with a probe track 22, which is equipped with a plurality of probe slides 23. Each probe alignment device 21 is mounted on each of the probe slides 23. In this embodiment, the electric fine-tuning device 211 includes a Y-axis actuator 2112 and an X-axis actuator 2113, and is manufactured using piezoelectric technology for the X and Y-axis electric fine-tuning devices. 211, the Z-axis fine-tuning function has been omitted to reduce costs. The electromechanical control system 30 is electrically connected to each of the detection slides 23 and each of the probe alignment devices 21, allowing the electromechanical control system 30 to control the movement of each of the detection slides 23 along the detection track 22 and to control the precise movement of each of the probe alignment devices 21 in the X and Y axes. By combining the wider range of movement provided by the detection track 22 with the precise movement capabilities of each of the probe alignment devices 21, the present invention has sufficient application flexibility.

In the second embodiment of the present invention, the detection rail 22 is fixed to the load-bearing bracket 14. The ends of the detection rail 22 do not slide. Compared to the third rail used in the conventional art, which has sliding ends, the detection rail 22 has better foundation stability. Furthermore, the length of the detection rail 22 can be designed more freely, completely eliminating the conventional requirement that the rail must span the platform opening. Furthermore, the detection rail 22 is located at a relatively higher point, further away from the high-temperature heat source of the wafer stage 11 below, thereby reducing the impact of thermal balance issues.

Continuing with Figures 6 and 7 , the third embodiment of the present invention is disclosed. This third embodiment differs from the second embodiment in that the probe card positioning module 20 is rotated 90 degrees relative to the load-bearing bracket 14 and then mounted on the load-bearing bracket 14. This embodiment demonstrates that the probe card positioning module 20 utilizes a well-designed modular design, avoiding the complexity of conventional large, overlapping slide rail mechanisms. Therefore, the present invention can easily adapt its design to different orientations.

Continuing with Figures 8 and 9, which illustrate a fourth embodiment of the present invention, the fourth embodiment differs from the aforementioned second embodiment in that each probe alignment device 21 includes an electric fine-tuning device 211 and a manual fine-tuning device 212. Each manual fine-tuning device 212 is disposed on the lower end surface of each electric fine-tuning device 211, and each probe card 24 is disposed on the lower end surface of each manual fine-tuning device 212. Furthermore, each electric fine-tuning device 211 and each manual fine-tuning device 212 have been simplified to While only providing precise movement and fine-tuning in one direction, in more practical applications, the manual fine-tuning function included in each probe alignment device 21 can be expanded or modified based on specific needs. For example, a manual fine-tuning device 212 supporting movement, rotation, or tilting can be added. This allows each manual fine-tuning device 212 to be manually operated to drive each probe card 24 to move, rotate, or tilt. This significantly simplifies the motorized mechanism design, reducing costs and avoiding increased system complexity or failure rate due to unnecessary motorized mechanism design.

In the fourth embodiment, the electric fine-tuning device 211 is indirectly coupled to the probe card 24. In the first embodiment, the probe card 24 is provided on the lower end surface of the electric fine-tuning device 211, so the probe card 24 is directly or indirectly coupled to the electric fine-tuning device 211.

In the fourth embodiment, the manual fine-tuning device 212 is directly coupled to the probe card 24. In other applications, the probe alignment device 21 can change the coupling order between the electric fine-tuning device 211 and the manual fine-tuning device 212 to meet different application requirements. Thus, the probe card 24 is directly or indirectly coupled to the manual fine-tuning device 212.

Continuing to refer to FIG. 10 and FIG. 11 , which disclose the fifth embodiment of the present invention, the fifth embodiment of the present invention is different from the first and fourth embodiments in that the wafer probe base 10 is provided with an auxiliary platform 15 extending inwardly from the upper end surface, and the top surface of the auxiliary platform 15 is provided with two positioning blocks 16, and the load-bearing bracket 14 is provided with a positioning column 1 corresponding to each positioning block 16. 7. As shown in Figure 11, each positioning post 17 can be inserted and fixed into each positioning block 16, thereby assisting in the accurate positioning of the load-bearing support 14 and providing some dust and light shielding for the wafer carrier 11. The shape and position of the auxiliary platform 15 can be varied to meet different application requirements, and the positioning blocks 16 and positioning posts 17 can also be modified and positioned in different locations.

Continuing to refer to FIG. 12 and FIG. 13 , which disclose the sixth embodiment of the present invention, the sixth embodiment of the present invention is different from the second embodiment in that the load-bearing bracket 14 is provided with a plurality of the probe card positioning modules 20, each of which is spaced apart from each other and each of which is provided with the detection track 22 Each detection track 22 is provided with a detection slide 23, and each detection track 22 is connected to a driving device 25 on one side. The driving device 25 is electrically connected to the electromechanical control system 30. Each driving device 25 can be a stepping motor or an electric device with equivalent function. Each detection slide 23 is driven by each driving device 25 to move in each detection The probe card positioning modules 20 move along the rails 22. Each probe alignment device 21 is mounted on the end surface of each probe slide 23. However, the arrangement is not limited to this embodiment and is also possible. In this embodiment, each probe rail 22 is a short rail. Due to the modular arrangement of each probe rail 22, each probe slide 23, and each probe alignment device 21, the use of short rails not only reduces costs but also ensures that each probe card positioning module 20 has good mechanical independence. There is no mechanical overlap between them, making maintenance and replacement very easy. Furthermore, the probe alignment devices 21 effectively avoid interference during the precise alignment of the wafer under test during the test process.

Continuing to refer to FIG. 14 and FIG. 15 and in conjunction with FIG. 13 , the seventh embodiment of the present invention is disclosed. The seventh embodiment of the present invention differs from the aforementioned sixth embodiment in that, in order to save space, the lifting mechanism 13 adopts an integrated design for vertical lifting, so that the lifting mechanism 13 and the wafer detection base 10 are integrated into one body, and a screw device 131 is provided to realize the vertical lifting of the load-bearing bracket 14, avoiding the disadvantage of the split type and the rotary type design occupying more factory space, and in order to save equipment costs, one side of each detection track 22 is split. A manual operating device 26 is provided, rather than the drive device 25 (stepping motor) used in the sixth embodiment. This embodiment allows each of the manual operating devices 26 to be manually operated, allowing each of the probe slides 23 to move along the probe tracks 22. This embodiment is particularly suitable for applications where cost reduction is a priority and frequent movement of the probe slides 23 is not required. In particular, for many applications, the precise movement capability of the wafer stage 11 can already provide the relative displacement required for wafer testing processes, allowing each of the probe slides 23 to remain stationary after initial adjustment.

Continuing to refer to FIG. 16 and FIG. 17 , which disclose an eighth embodiment of the present invention, the eighth embodiment of the present invention differs from the second embodiment in that an extension fixture 27 is provided on one side or lower end face of each probe alignment device 21, and a probe card 24 is provided on the lower end face of each extension fixture 27. The shape or size of the extension fixtures 27 can be adjusted according to application requirements (the same, partially the same, or both). The provision of the extended fixtures 27 effectively mitigates the limitations caused by mechanical interference between the probe alignment devices 21, allowing the probe cards 24 to be closer together to support a wider range of application requirements. Furthermore, in certain applications, the design of the extended fixtures 27 can also be modified to position the probe alignment devices 21 further away from the wafer stage 11 below, reducing the impact of high-temperature heat sources.

Continuing to refer to FIG. 18 and FIG. 19 , which discloses a ninth embodiment of the present invention, the ninth embodiment of the present invention differs from the aforementioned second embodiment in that each of the detection slides 23 is further provided with an image capture device 28. The image capture device 28 can be used to obtain optical imaging or thermal imaging recording data of each of the probes 241 and the surface of the wafer 111 to analyze whether there is a deviation in the positioning of each of the probes 241, which helps to solve problems caused by temperature changes. For example, if the wafer 111 is subjected to a temperature increase test, the temperature change will cause thermal expansion and contraction, which can easily cause each of the probes 241 to be deformed. Precise alignment between the probes 241 and the wafer 111 cannot maintain stability over an extended period. Therefore, the image capture devices 28 facilitate the collection of optical or thermal imaging data. This not only facilitates more efficient alignment adjustment between the probes 241 and the wafer 111 during the initial testing phase, but also allows for the use of machine vision and artificial intelligence-related technologies such as image analysis during subsequent wafer testing to proactively correct positioning deviations of the probe cards 24. This effectively resolves the probe positioning drift problem that plagues conventional techniques.

Referring to FIG. 20 and FIG. 21 , the tenth embodiment of the present invention is disclosed. The tenth embodiment of the present invention differs from the ninth embodiment in that an auxiliary rail 29 is provided on the load-bearing bracket 14. The auxiliary rail 29 and the detection rail 22 are spaced apart by an appropriate distance. The auxiliary rail 29 is provided with a plurality of camera positioning slides 291. Each of the camera positioning slides 291 is provided with an image capture device 28. The camera positioning slides 291 are electrically connected to the electromechanical control system 30 so that the electromechanical control system 30 can control each of the camera positioning slides. The positioning slide 291 moves along the auxiliary rail 29, allowing each image capture device 28 to accurately capture the contact position between each probe 241 and the wafer 111. Furthermore, since the image capture devices 28 are all located on the auxiliary rail 29, interference with the precise positioning capabilities of the probe card positioning module 20 is avoided. Each image capture device 28 is located diagonally above each probe card 24 and can capture images individually or simultaneously, facilitating real-time monitoring of probe positioning drift during wafer testing and even enabling automatic correction.

Referring to Figures 22 and 23 , the eleventh embodiment of the present invention is disclosed. The primary difference between the eleventh embodiment and the first embodiment is that the probe card positioning module 20 in this embodiment is equipped with a plurality of image capture devices 28 , each corresponding to a probe alignment device 21 . The optical or thermal imaging information provided by these image capture devices 28 assists with probe alignment adjustment steps in the early stages of the wafer testing process and facilitates real-time analysis and correction of probe positioning drift during wafer testing.

In summary, this invention can address many shortcomings of conventional technologies and is truly an excellent advancement in practicality. Furthermore, after extensive research into technical documentation for similar products both domestically and internationally, no similar designs have been found in the literature. Therefore, this invention satisfies the patentability requirements and an application is filed in accordance with the law.

However, the above description is merely a preferred embodiment of the present invention. Therefore, any equivalent structural changes made by applying the present invention description and patent application scope should be included in the patent scope of the present invention.

100: Wafer probing equipment using a probe card positioning module

10: Wafer probe base

11:Wafer carrier

111: Wafer

12: Stage moving device

13: Lifting mechanism

14: Load-bearing bracket

20: Probe card positioning module

21: Probe alignment device

30: Electromechanical control system

Claims (16)

A wafer probing device using a probe card positioning module comprises: A wafer probe base, the wafer probe base having a wafer carrier and a carrier moving device. The wafer carrier is located above the carrier moving device so that the carrier moving device can move the wafer carrier. The wafer carrier carries and adsorbs a wafer. The wafer probe base has a lifting mechanism, which is equipped with a load-bearing bracket. At least one probe card positioning module, mounted on the load-bearing bracket, comprising at least one probe alignment device, the probe alignment device comprising at least one probe card, the probe card being equipped with at least one probe, and the probe alignment device having an adjustment function capable of changing the relative position between the probe card and the wafer; An electromechanical control system electrically connected to the probe card positioning module. The wafer probing apparatus using a probe card positioning module as described in claim 1, wherein a heating device is installed inside the wafer carrier, and the carrier moving device can drive the wafer carrier to move along three axes. The wafer probing apparatus using a probe card positioning module as described in claim 1, wherein the probe alignment device includes at least one electric fine-tuning device, which is directly or indirectly coupled to the probe card and electrically connected to the electromechanical control system, so that the electromechanical control system can control the probe alignment device to move, rotate, or tilt the probe card. The wafer probing apparatus using a probe card positioning module as described in claim 1, wherein the probe alignment device includes at least one manual fine-tuning device, which is directly or indirectly coupled to the probe card so that the probe card can be moved, rotated, or tilted by manual operation of the manual fine-tuning device. The wafer probing apparatus using a probe card positioning module as described in claim 1, wherein the probe card positioning module is provided with at least one probing track, and the probing track is provided with at least one probing slide, and the probe alignment device is provided on the probing slide. In the wafer probing apparatus using a probe card positioning module as described in claim 5, the probing slide is electrically connected to the electromechanical control system, so that the electromechanical control system can control the movement of the probing slide along the probing track. The wafer probing apparatus using a probe card positioning module as described in claim 5, wherein one side of the probing track is connected to a driving device, the driving device is electrically connected to the electromechanical control system, and the probing slide is driven by the driving device to move on the probing track. In the wafer probing apparatus using a probe card positioning module as described in claim 5, a manual operating device is connected to one side of the probing track, and the probing slide can be moved on the probing track by manually operating the manual operating device. In the wafer probing apparatus using a probe card positioning module as described in claim 1, the lifting mechanism can be a separate design and placed on one side of the wafer probing base, or an integrated design can be adopted so that the lifting mechanism and the wafer probing base are integrated into one body. The wafer probing apparatus using a probe card positioning module as described in claim 1, wherein an extension fixture is provided on one side or lower end surface of the probe alignment device, and the probe card is provided on the extension fixture. The wafer probing apparatus using a probe card positioning module as described in claim 5 further comprises at least one image capture device, which can be used to obtain optical imaging or thermal imaging data. The wafer probing apparatus using a probe card positioning module as described in claim 11, wherein the image capture device is disposed on the probing slide. The wafer probing apparatus using a probe card positioning module as described in claim 11, wherein the load-bearing support is provided with at least one auxiliary rail, the auxiliary rail and the probing rail being spaced apart from each other by a distance, the auxiliary rail being provided with at least one imaging positioning slide, and the image capture device being disposed on the imaging positioning slide. In the wafer probing apparatus using a probe card positioning module as described in claim 13, the imaging positioning slide is electrically connected to the electromechanical control system, so that the electromechanical control system can control the imaging positioning slide to move along the auxiliary rail. In the wafer probing apparatus using a probe card positioning module as described in claim 3, the electric fine-tuning device can utilize a piezoelectric stage, a piezoelectric actuator, a piezoelectric motor, a stepper motor, a servo motor, or a voice coil motor. The wafer probing apparatus using a probe card positioning module as described in claim 1, wherein the probe card positioning module is provided with at least one image capture device, which can be used to obtain optical imaging or thermal imaging data.