TWI893971B - Valve assembly for controlling flow, method for controlling flow and substrate processing apparatus including the same - Google Patents

Abstract

The flow control valve assembly of the present invention includes: a gas inlet and outlet portion, including an inlet flow path for gas flowing into a substrate processing gas, an outlet flow path connected to a process chamber for performing substrate processing and supplying the gas, and a valve compartment connecting the inlet flow path and the outflow flow path; a valve portion, including a diaphragm valve, arranged at the upper part of the inlet flow path, a pressure rod, which applies pressure to the diaphragm valve to adjust the opening rate of the inlet flow path and the flow rate of the gas, and a pneumatic adjustment unit, which controls the valve used for lifting and lowering the pressure rod to adjust the supply of air, thereby adjusting the flow rate of the gas passing through the valve compartment; and a control portion, which controls the operation of the gas inlet and outlet portion and the valve portion. The control portion controls the driving of the pneumatic regulating unit as follows: after the diaphragm valve is opened by supplying the valve regulating air at a first supply pressure, the diaphragm valve is controlled by supplying the valve regulating air at a second supply pressure lower than the first supply pressure, and the diaphragm valve is closed at the second supply pressure.

Description

Flow control valve assembly, flow control method, and substrate processing device including the valve assembly

The present invention relates to a flow control valve assembly, a flow control method, and a substrate processing device including the valve assembly.

Recently, with the increasing integration density of semiconductor devices, precise control of substrate processing equipment is required.

Generally, semiconductor devices are manufactured by performing various substrate processing processes, such as thin film deposition and etching, in a vacuum atmosphere within a substrate processing apparatus. These substrate processing processes are performed by spraying process gases onto the substrate via a gas injection unit while the substrate is positioned on a substrate support within a processing chamber. During this process, characteristics such as the deposition rate and uniformity of the thin film are affected by the flow rate of the process gas supplied to perform the substrate processing process.

The substrate processing apparatus includes a process chamber for substrate processing and a gas supply system for supplying process gases used for substrate processing into the process chamber. The gas supply system includes a vaporizer for vaporizing a raw material, a supply pipeline connecting the vaporizer and the process chamber, and a plurality of flow control valves and sensors disposed on the supply pipeline to regulate the flow of the fluid. Specifically, the flow control valve is provided with an electromagnetic valve that controls its opening and closing by applying air pressure to a valve actuator.

However, this flow control valve structure utilizes a solenoid valve to regulate air pressure. When the air pressure in the valve actuator is high, the valve opens faster but closes later. Conversely, when the air pressure in the valve actuator is low, the valve opens later and closes faster.

As mentioned above, conventional flow control valves have a problem in that air pressure conditions cause a delay in closing or opening time, making high-speed opening and closing control difficult. Therefore, it is necessary to research methods to compensate for this problem.

According to one embodiment, a valve assembly for fluid flow control and a fluid flow control method capable of achieving high-speed on-off control are provided.

The flow control valve assembly according to the embodiment includes: a gas inlet and outlet portion, including an inlet flow path for the substrate processing gas, an outflow flow path connected to a process chamber for performing substrate processing and supplying the gas, and a valve compartment connecting the inflow flow path and the outflow flow path; a valve portion, including a diaphragm valve, which is arranged at the upper part of the inflow flow path, a pressure rod, which applies pressure to the diaphragm valve to adjust the opening rate of the inflow flow path and the flow rate of the gas, and a pneumatic adjustment unit, which controls A valve regulating air supply for driving the lifting and lowering of the pressure rod, thereby regulating the flow rate of the gas passing through the valve compartment; and a control unit for controlling the operation of the valve unit, wherein the control unit controls the driving of the pneumatic regulating unit to supply the valve regulating air at a first supply pressure to open the diaphragm valve, and then supply the valve regulating air at a second supply pressure lower than the first supply pressure to close the diaphragm valve.

According to one embodiment, the valve comprises: a valve body defining an internal storage space and having one side connected to at least one air supply pipe, enabling the valve to regulate air flow; and a piston that divides the storage space within the valve body and rises and falls along the inner wall of the valve body in response to the flow of air regulated by the valve, thereby causing the pressure rod to rise and fall. Furthermore, the valve comprises an elastic return member disposed on one side of the piston to provide an elastic force, causing the pressure rod to pressurize the diaphragm valve and close the inflow path.

According to one embodiment, the valve includes: a valve body connected to a first air supply pipe and a second air supply pipe; and a pneumatic regulating unit having a first solenoid valve and a second solenoid valve, respectively disposed in the first air supply pipe and the second air supply pipe. After the control unit opens the first solenoid valve and supplies the valve-regulated air at the first supply pressure, it opens the second solenoid valve and closes the first solenoid valve to supply the valve-regulated air at the second supply pressure. The maximum supply pressures of the first and second solenoid valves are different.

According to one embodiment, the pneumatic adjustment unit further includes: an induction sensor disposed on one side of the first solenoid valve and used to confirm the open state of the first solenoid valve.

According to one embodiment, the maximum supply pressure of the first solenoid valve may be 0.45 to 1 MPa, while the maximum supply pressure of the second solenoid valve may be 0.1 to less than 0.45 MPa. In particular, the maximum supply pressure of the first solenoid valve may be 0.6 MPa, while the maximum supply pressure of the second solenoid valve may be 0.3 MPa.

According to one embodiment, the valve portion includes a pneumatic regulating unit having a pneumatically variable solenoid valve disposed in the air supply conduit. After applying a first power source to the pneumatically variable solenoid valve and supplying the valve-regulated air at the first supply pressure, the control portion applies a second power source having a lower current flow rate than the first power source to the pneumatically variable solenoid valve, thereby supplying the valve-regulated air at the second supply pressure. The pneumatically variable solenoid valve can adjust its opening ratio based on the current flow rate of the applied power source. In this case, the first supply pressure is 0.45 to 1 MPa, while the second supply pressure is 0.1 to less than 0.45 MPa.

Furthermore, a substrate processing apparatus according to an embodiment may include: a process chamber forming a processing space for performing substrate processing; a substrate support portion disposed within the processing space to accommodate a substrate; a gas injection portion to inject gas into the processing space for substrate processing; a gas supply portion to supply process gas to the gas injection portion; and a flow control valve assembly according to any one of claims 1 to 9, disposed between the gas supply portion and the gas injection portion to adjust the flow rate of the gas.

According to one embodiment, a flow control method using the flow control valve assembly includes the following steps: receiving a gas supply signal and supplying a valve-regulated air at a first supply pressure, thereby opening the diaphragm valve and allowing gas to flow through the gas inlet and outlet to supply gas to a process chamber; changing the supply of the valve-regulated air at a second supply pressure lower than the first supply pressure to maintain the gas supply to the process chamber; and receiving a gas blocking signal to block the supply of the valve-regulated air, thereby blocking the flow of gas through the gas inlet and outlet.

According to one embodiment, the step of supplying gas to the process chamber further includes the step of confirming whether the air is regulated by the supply valve at the first supply pressure.

The flow control valve assembly in this embodiment opens the valve at a supply pressure favorable for opening when air pressure is initially applied. It then changes the supply pressure to open the valve at a pressure favorable for closing. Then, the gas supply is cut off, enabling high-speed opening and closing control. This allows precise control of process gas flow rates, significantly improving process stability in substrate processing equipment.

1: Substrate processing equipment

10, 10': Valve assembly

20: Processing Chamber

21: Chamber body

22: Upper cover

30: Substrate support

40: Gas injection unit

41: Gas pipeline

50: Gas supply unit

100: Gas inlet and outlet

110: Inflow path

111: Inflow hole

130:Outflow path

131: Outflow hole

150: Valve compartment

200:Valve department

210: Valve body

211: First air supply pipe (air supply pipe)

213: Second air supply pipe (air supply pipe)

215: Internal flow path

220: Pressure rod

230: Piston

240: Elastic recovery component

250: Diaphragm Valve

260, 260': Pneumatic adjustment unit

261: First solenoid valve (solenoid valve)

263: Second solenoid valve (solenoid valve)

265: Pneumatic variable solenoid valve (solenoid valve)

267: Sensor

300: Control Department

S:Substrate

S100~S300: Steps

Figure 1 is a structural diagram of a substrate processing apparatus according to an embodiment; Figure 2 is a structural diagram of a flow control valve assembly according to Embodiment 1, in a state where gas flow is permitted; Figure 3 is a structural diagram of the flow control valve assembly according to Embodiment 1, in a state where gas flow is blocked; Figure 4 is a structural diagram of the flow control valve assembly according to Embodiment 2, in a state where gas flow is permitted; Figure 5 is a structural diagram of the flow control valve assembly according to Embodiment 2, in a state where gas flow is blocked; and Figure 6 is a process diagram illustrating a flow control method according to an embodiment.

FIG1 is a structural diagram showing a substrate processing apparatus according to an embodiment.

1 , a substrate processing apparatus 1 according to an embodiment includes flow control valve assemblies 10 , 10 ′, a process chamber 20 , a substrate support portion 30 , a gas injection portion 40 , and a gas supply portion 50 .

The interior of the process chamber 20 forms a processing space for processing substrates S. The process chamber 20 includes a chamber body 21 and a cover 22 located on the upper ends of the sidewalls of the chamber body 21 to maintain an airtight seal. The process chamber 20 is connected to an exhaust port and a vacuum pump to exhaust process gases from the processing space and adjust the vacuum level within the processing space. The process chamber 20 can have various conventional configurations used for substrate processing.

The substrate support 30 is disposed within the processing space of the process chamber 20 , allowing the substrate S to be positioned within the processing space. The substrate support 30 is positioned within the process chamber 20 so that the substrate S faces the gas injection unit 40 . The substrate support 30 includes a base, etc., for positioning the substrate S.

The gas injection unit 40 is disposed in the process chamber 20 opposite the substrate support unit 30 and is capable of injecting process gas into the processing space. The gas injection unit 40 can have various configurations, such as a shower head or a nozzle. When the gas injection unit 40 is a shower head, it is attached to the process chamber 20 in a manner that partially covers the upper portion of the process chamber 20. In particular, the gas injection unit 40 is attached to the upper cover 22 in the form of a hood over the chamber body 21.

The gas supply unit 50 is a device that supplies the process gas to the gas injection unit 40 and is connected to the gas injection unit 40.

The gas supply unit 50 generates process gas from a liquid or solid source. The flow rate of the process gas is controlled by the flow control valve assemblies 10 and 10', and the gas is supplied to the gas injection unit 40.

The substrate processing apparatus 1 according to the embodiment may include: a flow control valve assembly 10, 10', which is disposed on one side of a gas pipeline 41 connected to a gas supply unit 50 and transporting a process gas, and is used to control the flow rate of the process gas.

The flow control valve assemblies 10, 10' according to the embodiment are arranged in an array structure on the gas ejection portion 40 or are arranged in a gas box (not shown) together with a general mass flow controller.

The substrate processing apparatus 1 according to the embodiment achieves high-speed flow control through the flow control valve assemblies 10 and 10'. Consequently, the substrate processing apparatus 1 according to the embodiment can precisely control the flow of process gas and supply it to the substrate S through the gas injection unit 40. Consequently, the process stability of the substrate processing apparatus 1 can be significantly improved.

The substrate processing apparatus 1 according to the embodiment can be any one of a chemical vapor deposition (CVD) apparatus, a plasma enhanced chemical vapor deposition (PECVD) apparatus, and an atomic layer deposition (ALD) apparatus.

The flow control valve assemblies 10 and 10' according to the embodiments are described in detail below.

The flow control valve assemblies 10 and 10' according to the embodiments are used to control the flow of fluids, such as gases used in substrate processing, and can be connected to fluid supply lines. Furthermore, the flow control valve assemblies 10 and 10' according to the embodiments can also be installed within a vaporizer as part of the vaporizer.

Specifically, the flow control valve assemblies 10 and 10' are used to regulate the flow of a fluid. For example, the flow control valve assemblies 10 and 10' apply air pressure to control the opening and closing of the diaphragm valve 250, thereby regulating the flow of fluid into the process chamber 20.

Figure 2 is a structural diagram showing the flow control valve assembly 10 according to Example 1, in a state allowing gas flow; Figure 3 is a structural diagram showing the flow control valve assembly 10 according to Example 1, in a state blocking gas flow; Figure 4 is a structural diagram showing the flow control valve assembly 10' according to Example 2, in a state allowing gas flow; and Figure 5 is a structural diagram showing the flow control valve assembly 10' according to Example 2, in a state blocking gas flow.

2 to 5 , the flow control valve assembly 10 or 10 ′ according to the embodiment includes a gas inlet and outlet portion 100 , a valve portion 200 , and a control portion 300 .

The gas inlet and outlet portion 100 provides a channel for gas flow and circulation. To this end, the gas inlet and outlet portion 100 may include an inlet flow path 110, an outlet flow path 130, and a valve compartment 150.

The inlet channel 110 provides a passage for gas to flow in. One end of the inlet channel 110 is connected to the gas supply unit 50 via a gas pipe 41, allowing gas to flow in. The other end of the inlet channel 110 forms an inlet hole 111. After passing through the inlet hole 111, the gas moves along the valve compartment 150 and is supplied to the process chamber 20 through the outflow channel 130. A diaphragm valve 250 is installed above the inlet hole 111 to control its opening and closing. When the inlet hole 111 is open, the gas flows into the outflow channel 130. When the inlet hole 111 is closed, the gas flow is blocked.

One end of the outflow channel 130 is connected to the process chamber 20 where substrate processing is performed, forming a channel for supplying the gas flowing through the inflow channel 110 to the process chamber 20. The other end of the outflow channel 130 forms an outflow hole 131. When the inflow hole 111 is opened, the gas can flow in. The gas can be a vaporized gas, i.e., the process gas used for substrate processing. The gas can be a single gas or a mixed gas.

The valve compartment 150 is formed between the inflow channel 110 and the outflow channel 130, providing a space for connecting the inflow channel 110 and the outflow channel 130. The valve compartment 150 is connected to the inflow port 111 and the outflow port 131, respectively. A diaphragm valve 250 may be mounted on the valve compartment 150 to control the opening and closing of the inflow port 111. The valve compartment 150 may have a structure that can be raised and lowered, with a pressure rod mounted on the top to control the operation of the diaphragm valve 250.

The valve 200 can adjust the opening ratio of the inlet hole 111 to adjust the flow rate of the gas passing through the gas inlet and outlet 100. The valve 200 can adjust the opening ratio of the inlet hole 111 of the gas inlet and outlet 100 according to the valve regulating the flow of air.

To this end, the valve portion 200 may include: a valve body 210, a pressure rod 220, a piston 230, an elastic recovery member 240, a diaphragm valve 250, and pneumatic adjustment units 260, 260'.

The interior of the valve body 210 forms a receiving space to allow the valve regulating air to enter, and can accommodate the pressure rod 220, piston 230, elastic return member 240, etc. The valve body 210 can be in the shape of a circular or polygonal container with the upper and lower parts closed.

The valve body 210 is connected to at least one air supply pipe 211, 213 respectively.

1 and 2 , the flow control device 10 according to Embodiment 1 is connected to a plurality of air supply pipes 211 and 213, respectively.

The plurality of air supply pipes 211 and 213 are respectively connected to the internal flow path 215 formed within the internal storage space of the valve body 210, forming a channel for supplying valve-regulated air to the internal storage space of the valve body 210.

For example, the valve body 210 may have an upper portion connected to a first air supply pipe 211 and a second air supply pipe 213, respectively. While the attached diagram shows only two air supply pipes 211 and 213, the number of air supply pipes 211 and 213 can be selectively adjusted as needed. As described above, if multiple air supply pipes 211 and 213 are provided, solenoid valves 261 and 263 with different maximum supply pressures are installed on each of the air supply pipes 211 and 213, respectively, to serve as the pneumatic regulating unit 260.

3 and 4 , the flow control device 10 ′ according to Embodiment 2 may have a structure in which the valve body 210 is connected to an air supply pipe 211 . A pneumatic variable solenoid valve 265 is provided on the air supply pipe 211 as a pneumatic control unit 260 ′.

Furthermore, an exhaust passage (not shown) is formed on one side of the valve body 210, which can eject the valve-regulated air supplied to the interior of the accommodating space to the outside.

The pressure rod 220 is partially housed within the housing of the valve body 210, while one end is housed within the valve compartment 150. The pressure rod 220 is positioned above the diaphragm valve 250 mounted within the valve compartment 150. The pressure rod 220 can be driven downward to apply pressure to the diaphragm valve 250, or it can be driven upward to adjust the opening and closing of the inlet port 111. The pressure rod 220 can have various conventional structures, with one end forming an elastic pressure tip to apply pressure to the diaphragm valve 250.

The piston 230 divides the housing space of the valve body 210. In response to the supply or injection of valve-regulated air, one of the divided spaces is lifted and lowered along the inner wall of the valve body 210, thereby lifting and lowering the pressure rod 220. At the center of the piston 230, the pressure rod 220 is connected to a structure capable of receiving driving force.

The elastic return member 240 is housed within the housing of the valve body 210 and positioned on one side of the piston 230 to assist in the upward and downward movement of the piston 230. For example, the elastic return member 240 functions as follows: the piston 230 is raised and lowered by the air pressure generated by the air supply, and then the air pressure is released, returning the piston 230 to its original position.

The elastic return member 240 can be a coil spring, exerting an elastic force to cause the pressure rod 220 to pressurize the top surface of the diaphragm valve 250, thereby closing the inflow port 111. Furthermore, the elastic return member 240 can elastically deform, causing the pressure rod to rise based on the operation of the solenoid, thereby releasing the pressure on the diaphragm valve 250.

The diaphragm valve 250 is housed within the valve compartment 150 and is positioned above the inlet 111. The diaphragm valve 250 is a diaphragm-shaped elastic structure, also known as a sealing gasket, diaphragm valve, or umbrella-shaped check valve.

The diaphragm valve 250 elastically deforms in response to the pressure of the pressure rod 220, thereby opening and closing the inlet 111. Furthermore, the diaphragm valve 250 can adjust the opening area of the inlet 111 by adjusting the pressure applied by the pressure rod 220, thereby controlling the flow rate of the fluid. As the piston 230's lift height increases, the diaphragm valve 250 expands the opening area of the inlet 111 as the pressure applied by the pressure rod 220 decreases.

The pneumatic regulating unit 260 regulates the opening and closing of the diaphragm valve by controlling the valve regulating air supplied to the valve body 210. To this end, the pneumatic regulating unit 260 includes electromagnetic valves 261, 263, and 265 connected to the air supply pipes 211 and 213.

The electromagnetic valves 261, 263, and 265 are controlled by electrical signals. When power is applied, they open and supply high-pressure valve-regulated air to the valve body 210 through the air supply pipes 211 and 213. When power is cut off, the electromagnetic valves 261, 263, and 265 close the air supply pipes 211 and 213, thereby blocking the supply of valve-regulated air.

In particular, in the flow control valve assemblies 10, 10' according to the embodiments, the pneumatic regulating units 260, 260' can be controlled such that, when air pressure is initially applied, air is supplied at a first supply pressure that facilitates opening, allowing gas flow. The supply pressure is then changed to a second supply pressure that facilitates closing. This improves the responsiveness of the flow control valve assemblies 10, 10'.

Specifically, referring to Figures 1 and 2, in the flow control valve assembly 10 according to Embodiment 1, the pneumatic regulating unit 260 includes a plurality of electromagnetic valves 261 and 263 with different maximum supply pressures.

One electromagnetic valve 261, 263 is installed on each of the air supply pipes 211, 213. The maximum supply pressures of the electromagnetic valves 261, 263 are different from each other. In other words, the maximum flow area and maximum supply pressure of the electromagnetic valves 261, 263 are different from each other.

The flow control valve assembly 10 according to Example 1 includes a pneumatic regulating unit 260 having a first solenoid valve 261 and a second solenoid valve 263. These solenoid valves 261 and 263 are controlled by electrical signals, utilizing the force of the magnetic field generated by the solenoid to control the flow of fluid. One first solenoid valve 261 and one second solenoid valve 263 are installed in the first air supply conduit 211 and the second air supply conduit 213, respectively.

The maximum supply pressure of the first solenoid valve 261 is in the range of 0.45 to 1 MPa. The maximum supply pressure of the second solenoid valve 263 is in the relatively lower range of 0.1 to less than 0.45 MPa.

More specifically, the maximum supply pressure of the first solenoid valve 261 is 0.45 to 0.6 MPa, while the maximum supply pressure of the second solenoid valve 263 is 0.3 to less than 0.45 MPa. In particular, the maximum supply pressure of the first solenoid valve 261 may be 0.6 MPa, while the maximum supply pressure of the second solenoid valve 263 may be 0.3 MPa.

The first solenoid valve 261 exhibits a characteristic of faster opening speed but delayed closing. The second solenoid valve 263 exhibits a characteristic of delayed opening time but faster closing speed.

Furthermore, the pneumatic adjustment units 260, 260' may also include a sensor 267. The sensor 267 is used to confirm whether the solenoid valves 261, 263 are open or closed. When a fluid supply signal is transmitted to the sensor 267, it confirms whether the solenoid valves 261, 263 are open or closed. If the solenoid valves 261, 263 are confirmed to be closed, a detection signal is generated and transmitted to the control unit 300. The control unit 300 then generates a signal for opening the solenoid valves 261, 263 and transmits it to the solenoid valves 261, 263.

3 and 4 , in the flow control valve assembly 10 ′ according to Embodiment 2, the pneumatic regulating unit 260 ′ may include a pneumatic variable valve that changes the air pressure according to pressure conditions.

The pneumatic variable solenoid valve 265 exhibits the characteristic of adjusting the output supply pressure according to the current applied to the solenoid.

The pneumatically variable solenoid valve 265 is powered to a maximum supply pressure of 0.45 to 1 MPa, regulating air flow through the air supply pipe 211 supply valve. The power is then reduced to a maximum supply pressure of 0.1 to 0.45 MPa, opening the valve while reducing the supply area of the air supply pipe 211. The pneumatically variable solenoid valve 265 can be installed on one air supply pipe 211.

More specifically, the pneumatic variable solenoid valve 265 can have a maximum supply pressure of 0.45 to 0.6 MPa, and the supply pressure can be adjusted to 0.1 to less than 0.45 MPa. In particular, the pneumatic variable solenoid valve 265 can have a maximum supply pressure of 0.6 MPa and a minimum supply pressure of 0.3 MPa.

The control unit 300 can regulate the flow of gas by driving the control valve 200.

Specifically, the control unit 300 transmits a preset flow rate value to the flow control valve assembly 10, 10' and controls the actuation of the pneumatic regulating units 260, 260 according to the preset flow rate value, thereby controlling the flow rate of the process gas supplied to the process chamber 20.

When receiving a fluid supply signal and flow rate information, the control unit 300 applies power to the solenoid valves 261, 263, and 265, causing them to regulate air at a first supply pressure with a shorter opening time. Furthermore, after the diaphragm valve 250 is opened, the supply pressure is changed to a second supply pressure, allowing the valves to regulate air.

For example, when receiving a fluid supply signal and flow rate information, the control unit 300 supplies power to the first solenoid valve 261, opening the first air supply pipe 211 and regulating air with the first supply pressure valve. At this point, the control unit 300 uses a sensor to confirm the open state of the first solenoid valve 261.

Next, upon confirming that the first solenoid valve 261 is open, the control unit 300 applies power to the second solenoid valve 263, opening the second air supply pipe 213, which has a shorter closing time. The control unit 300 then cuts off power to the first solenoid valve 261. In this way, the control unit 300 regulates air flow through the supply valve in the second air supply pipe 213.

After the fluid supply is completed, the control unit 300 cuts off the power applied to the second solenoid valve 263, thereby blocking the valve-regulated air supplied through the second air supply pipe 213.

Specifically, when air pressure is initially applied, the control unit 300 utilizes the first solenoid valve 261, which is prone to opening, to supply air to the valve. Once the air pressure is released, the second solenoid valve 263, which is prone to closing, briefly blocks the supply of air to the valve. This significantly reduces the opening and closing time of the flow control valve assembly, which typically takes 10 ms/delta, to 2 ms/delta.

Furthermore, when a fluid supply signal is transmitted to the control unit 300, a high current power source is applied, causing the pneumatic variable solenoid valve 265 to activate at maximum supply pressure, thereby shortening the opening time. This opens the air supply pipe 211. At this time, the control unit 300 uses a sensor to confirm the open state of the pneumatic variable solenoid valve 265.

Next, when the control unit 300 detects the opening of the pneumatic variable solenoid valve 265, it applies a relatively low current power source to reduce the open area of the air supply duct 211, thereby lowering the supply pressure and activating the system.

Furthermore, when the fluid supply ends, the control unit 300 cuts off the power supply to the pneumatic variable solenoid valve 265, thereby cutting off the valve-regulated air supply through the air supply pipe 211.

Specifically, when air pressure is initially applied, the control unit 300 applies a high-current power source to open the air supply duct 211 at maximum supply pressure to shorten the opening time. Subsequently, when the air pressure is released, a relatively low-current power source is applied to achieve conditions conducive to closing, thereby reducing the open area of the air supply duct 211. This significantly reduces the opening and closing time of the flow control valve assembly, which typically takes 10 ms/delta, to 2 ms/delta.

The flow control valve assembly according to the embodiment described above opens the valve at a supply pressure favorable for opening when air pressure is initially applied. It then changes the supply pressure to open the valve at a pressure favorable for closing, and then shuts off the gas supply, achieving high-speed opening and closing control. This allows precise control of the process gas flow rate, significantly improving process stability in substrate processing equipment.

In particular, the flow control valve assembly according to the embodiment is used to control the gas supply in a substrate processing apparatus for performing atomic layer deposition (ALD).

In addition, FIG6 is a process diagram showing a flow control method according to an embodiment.

Referring to FIG. 6 , the flow control method according to the embodiment includes the following steps: supplying gas to process chamber 20 ( S100 ); maintaining the gas supply ( S200 ); and blocking the flow of gas ( S300 ). The flow control method according to the embodiment can be implemented using either the flow control valve assembly 10 or 10 ′ according to Embodiment 1 or Embodiment 2.

During step S100 of supplying gas to the process chamber 20, the control unit 300 receives a gas supply signal and flow rate information, generates a power supply signal, and transmits it to the solenoid valves 261 and 265. This signal opens the solenoid valves 261 and 265, regulating the air flow at a first supply pressure. The pressurizing rod 220 is then driven upward, opening the diaphragm valve 250. Furthermore, gas is allowed to flow through the gas inlet/outlet 100, and gas is supplied to the process chamber 20.

This step may also include confirming whether the valve is regulating air at the first supply pressure. Specifically, the open state of the first solenoid valve 261 or the pneumatic variable solenoid valve 265 is confirmed using the induction sensor 267. If the open state is confirmed and the first solenoid valve 261 or the pneumatic variable solenoid valve 265 is not open, the control unit 300 may generate and transmit a power supply signal again.

Next, in step S200 of maintaining the gas supply, the supply pressure is changed to supply the valve-regulated air at a second supply pressure lower than the first supply pressure.

In this step, the control unit 300 generates a power supply signal and transmits it to the second solenoid valve 263, opening the second solenoid valve 263 and regulating the air flow with the second supply pressure valve. Furthermore, the power supply to the first solenoid valve 261 is interrupted. Furthermore, the flow rate is controlled to maintain the gas supply to the process chamber 20.

Alternatively, in this step, the controller 300 generates a pneumatic variable signal to reduce the amount of current applied to the power supply in order to adjust the air supply valve to a second supply pressure lower than the first supply pressure. Furthermore, the flow rate is controlled to maintain the gas supply to the process chamber 20.

Then, in step S300 of blocking the flow of gas, the control unit 300, upon receiving the gas blocking signal, generates a power blocking signal and transmits it to the solenoid valves 263 and 265. After the solenoid valves 263 and 265 interrupt the supply of regulated air, the pressure rod 220 descends via the elastic return member 240, applying pressure to the diaphragm valve 250, blocking the flow of gas through the inlet hole 111. This effectively blocks the flow of gas through the gas inlet and outlet 100.

The flow control method according to this embodiment controls the actuation of the electromagnetic valve to create conditions favorable for gas flow and blockage, achieving high-speed control of gas flow supply. Consequently, the fluid flow control method according to this embodiment can precisely control the flow of process gas supplied to the substrate S via the gas injection unit 40. Consequently, the substrate processing apparatus 1 can significantly improve process stability.

10: Valve assembly

100: Gas inlet and outlet

110: Inflow path

111: Inflow hole

130:Outflow path

131: Outflow hole

150: Valve compartment

200: Valve department

210: Valve body

211: First air supply pipe (air supply pipe)

213: Second air supply pipe (air supply pipe)

215: Internal flow path

220: Pressure rod

230: Piston

240: Elastic recovery component

250: Diaphragm Valve

260: Pneumatic adjustment unit

261: First solenoid valve (solenoid valve)

263: Second solenoid valve (solenoid valve)

267: Sensor

300: Control Department

Claims (13)

A flow control valve assembly comprises: a gas inlet/outlet portion comprising an inlet flow path for a substrate processing gas to flow into the substrate, an outlet flow path connected to a process chamber performing substrate processing and supplying the gas, and a valve compartment connecting the inlet flow path and the outlet flow path; a valve portion comprising: a diaphragm valve disposed above the inlet flow path; a pressure rod for applying pressure to the diaphragm valve to adjust the opening ratio of the inlet flow path and the flow rate of the gas; and a pneumatic regulating unit for controlling the supply of air to a valve for raising and lowering the pressure rod, thereby regulating the flow rate of the gas passing through the valve compartment; and a control portion for controlling the operation of the valve portion. The control unit controls the driving of the pneumatic regulating unit to supply regulating air to the valve at a first supply pressure to open the diaphragm valve, and then supplies regulating air to the valve at a second supply pressure lower than the first supply pressure to close the diaphragm valve at the second supply pressure. The flow control valve assembly according to claim 1, wherein the valve portion comprises: a valve body having an internal storage space formed therein and one side of which is connected to at least one air supply pipe, allowing the valve to regulate the flow of air; and a piston that divides the storage space of the valve body and rises and falls along the inner wall of the valve body in one of the divided spaces based on the flow of air regulated by the valve, thereby raising and lowering the pressure rod. The flow control valve assembly according to claim 2, wherein the valve portion includes: An elastic return member disposed on one side of the piston to provide an elastic force so that the pressure rod presses the diaphragm valve to close the inflow channel. The flow control valve assembly according to claim 2, wherein the valve portion comprises: the valve body connected to a first air supply pipe and a second air supply pipe; and the pneumatic regulating unit having a first solenoid valve and a second solenoid valve, respectively disposed in the first air supply pipe and the second air supply pipe; wherein, after the control unit opens the first solenoid valve and supplies the valve-regulated air at the first supply pressure, it opens the second solenoid valve and closes the first solenoid valve to supply the valve-regulated air at the second supply pressure; wherein, the maximum supply pressures of the first and second solenoid valves are different. The flow control valve assembly according to claim 4, wherein the valve portion further includes: an induction sensor disposed on one side of the first solenoid valve and used to confirm the open state of the first solenoid valve. The flow control valve assembly according to claim 4, wherein the maximum supply pressure of the first solenoid valve is 0.45 to 1 MPa, and the maximum supply pressure of the second solenoid valve is 0.1 to less than 0.45 MPa. The flow control valve assembly according to claim 6, wherein the maximum supply pressure of the first solenoid valve is 0.6 MPa, and the maximum supply pressure of the second solenoid valve is 0.3 MPa. The flow control valve assembly according to claim 2, wherein the valve portion includes the pneumatic regulating unit having a pneumatically variable solenoid valve disposed in the air supply conduit; After applying a first power source to the pneumatically variable solenoid valve to supply the valve-regulated air at the first supply pressure, the control portion applies a second power source having a lower current flow rate than the first power source to the pneumatically variable solenoid valve to supply the valve-regulated air at the second supply pressure; The pneumatically variable solenoid valve adjusts its opening rate based on the current flow rate of the applied power source. The flow control valve assembly according to claim 8, wherein the first supply pressure is 0.45 to 1 MPa, and the second supply pressure is 0.1 to less than 0.45 MPa. A substrate processing apparatus comprises: a process chamber forming a processing space for performing substrate processing; a substrate support disposed within the processing space to accommodate the substrate; a gas injection portion to inject gas into the processing space for substrate processing; a gas supply portion to supply process gas to the gas injection portion; and a flow control valve assembly according to any one of claims 1 to 9, disposed between the gas supply portion and the gas injection portion to regulate the flow rate of the gas. The substrate processing apparatus according to claim 10, wherein the substrate processing apparatus is used to perform atomic layer deposition (ALD). A flow control method employing the flow control valve assembly of any one of claims 1 to 9 comprises the following steps: Receiving a gas supply signal and supplying a valve-regulated air at a first supply pressure, thereby opening a diaphragm valve to allow gas to flow through a gas inlet and outlet, thereby supplying gas to a process chamber; Changing the supply of the valve-regulated air at a second supply pressure lower than the first supply pressure to maintain the supply of gas to the process chamber; and Receiving a gas blocking signal and blocking the supply of the valve-regulated air, thereby blocking the flow of gas through the gas inlet and outlet. The flow control method of claim 12, wherein the step of supplying gas to the process chamber further comprises the following step: Confirming whether the valve-regulated air is supplied at the first supply pressure.