TWI893652B - Illuminated keyswitch structure and illuminating module - Google Patents
Illuminated keyswitch structure and illuminating moduleInfo
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- TWI893652B TWI893652B TW113105557A TW113105557A TWI893652B TW I893652 B TWI893652 B TW I893652B TW 113105557 A TW113105557 A TW 113105557A TW 113105557 A TW113105557 A TW 113105557A TW I893652 B TWI893652 B TW I893652B
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Abstract
Description
本發明關於一種按鍵結構,尤其是關於一種發光按鍵結構及照射模組。 The present invention relates to a key structure, and more particularly to a light-emitting key structure and an illumination module.
本案為美國專利申請18/353,925號(2023年7月18日申請)的部分延續案並主張其優先權,其為美國專利申請17/847,853號(2022年6月23日申請)現為美國專利11,728,110號的延續案,其為美國專利申請17/234,808號(2021年4月20日申請)現為美國專利11,764,004號的部分延續案並主張台灣專利申請案110100264號(2021年1月5日申請)及中國專利申請案202110441985.1號(2021年4月23日申請)以及美國臨時申請案63/325,623(2022年3月31日申請)的優先權。本案同時主張美國臨時申請案63/446,794(2023年2月17日申請)的優先權。上述專利申請案之全部內容透過引用併入本文並構成為本說明書的一部份。 This case is a continuation-in-part of and claims priority to U.S. Patent Application No. 18/353,925 (filed on July 18, 2023), which is a continuation-in-part of U.S. Patent Application No. 17/847,853 (filed on June 23, 2022), now a continuation-in-part of U.S. Patent Application No. 11,728,110, which is a continuation-in-part of U.S. Patent Application No. 17/234,808 (filed on April 20, 2021). This application is a continuation-in-part of U.S. Patent No. 11,764,004 and claims priority to Taiwan Patent No. 110100264 (filed on January 5, 2021), China Patent No. 202110441985.1 (filed on April 23, 2021), and U.S. Provisional Application No. 63/325,623 (filed on March 31, 2022). This application also claims priority to U.S. Provisional Application No. 63/446,794 (filed on February 17, 2023). The entire contents of the aforementioned patent applications are incorporated herein by reference and made a part of this specification.
市面上有些發光按鍵結構於其底板下方設置專屬光源,以朝上發射光線。底板對應光源處會形成開孔,以使光線能穿過底板。通常為避免底板與光源間產生靜電放電,也為了保護光源,而在光源上和光源電路板上貼附絕緣片。光源原則上是凸出設置於電路板,使得絕緣片整體亦呈凸出結構。此凸出結構將使得發光按鍵結構於光源附近的部分呈現不平整的現象,不利於發 光按鍵結構的構件組裝,亦不利於發光按鍵結構的整體薄型化設計。此外,凸出的絕緣片會進入底板的開孔內,甚至光源也會部分地進入開孔內,此結構配置會增加與底板上方的結構件(例如支撐鍵帽的支架)產生結構干涉的機會,造成鍵帽無法順利上下升降,或間接損壞光源。 Some illuminated key structures on the market feature a dedicated light source beneath their baseplate, emitting light upward. Openings are formed in the baseplate corresponding to the light source to allow light to pass through. To prevent electrostatic discharge between the baseplate and the light source and to protect the light source, an insulating sheet is typically attached to the light source and its circuit board. The light source typically protrudes from the circuit board, creating a protruding insulating sheet. This protrusion creates an uneven surface near the light source, hindering component assembly and overall thinness. Furthermore, the protruding insulating sheet will enter the opening of the baseplate, and even the light source will partially enter the opening. This structural configuration increases the chance of structural interference with the structural components above the baseplate (such as the bracket supporting the keycap), causing the keycap to be unable to move up and down smoothly or indirectly damaging the light source.
再者,在發光鍵盤中,照射模組通常用於照射鍵帽字符及鍵帽輪廓。然而,當光源位於鍵帽下方時,光源正上方的鍵帽字符會變得過亮,而遠離光源的字符(例如角落字符)及鍵帽輪廓變得太暗,使得字符間及鍵帽輪廓間難以達到照度均勻。 Furthermore, in illuminated keyboards, an illumination module is typically used to illuminate the keycap characters and keycap outlines. However, when the light source is located below the keycaps, the keycap characters directly above the light source appear too bright, while the characters farther from the light source (such as corner characters) and keycap outlines appear too dark, making it difficult to achieve uniform illumination between characters and keycap outlines.
本發明之一目的在於提供一種發光按鍵結構,其利用平整的間隔件以隔開底板與發光件,此有助於結構尺寸控制、確保混光距離,亦有助於保護發光件,避免發光件與底板上方的構件產生結構干涉,造成損傷。 One objective of the present invention is to provide a light-emitting key structure that utilizes a flat spacer to separate the base plate from the light-emitting element. This helps control structural dimensions, ensures light mixing distance, and protects the light-emitting element by preventing structural interference with components above the base plate, which could cause damage.
根據本發明之一實施例,發光按鍵結構包含底板、驅動電路板、間隔件、發光件及透光覆蓋結構。底板具有多個開孔和分隔多個開孔的多個肋部;驅動電路板設置於底板下方;間隔件設置於底板下方且設置於驅動電路板上方,間隔件具有通孔;發光件設置於驅動電路板上且位於通孔中,發光件垂直地對應於底板的其中一個開孔;透光覆蓋結構包括至少一個第一覆蓋層和至少一個第二覆蓋層;其中,第一覆蓋層覆蓋發光件且與底板的所述其中一個開孔的垂直投影重疊;其中,第二覆蓋層垂直地對應於發光件和底板的所述其中一個開孔,第二覆蓋層阻擋發光件往所述其中一個開孔發出的至少部分光線,以降低從所述其中一個開孔提供的發光強度。 According to one embodiment of the present invention, the light-emitting key structure includes a base plate, a driving circuit board, a spacer, a light-emitting element, and a light-transmitting cover structure. The base plate has a plurality of openings and a plurality of ribs separating the plurality of openings; the driver circuit board is disposed below the base plate; a spacer is disposed below the base plate and above the driver circuit board, the spacer having a through hole; a light-emitting element is disposed on the driver circuit board and located in the through hole, the light-emitting element vertically corresponding to one of the openings in the base plate; the light-transmitting cover structure includes at least one first cover layer and at least one second cover layer; the first cover layer covers the light-emitting element and overlaps with a vertical projection of the one of the openings in the base plate; the second cover layer vertically corresponds to the light-emitting element and the one of the openings in the base plate, and the second cover layer blocks at least a portion of light emitted by the light-emitting element toward the one of the openings, thereby reducing the intensity of light emitted from the one of the openings.
於另一實施例,第一覆蓋層覆蓋在間隔件的通孔內的驅動電路板上方。 In another embodiment, the first covering layer covers the driving circuit board in the through hole of the spacer.
於另一實施例,間隔件的通孔垂直地與底板的至少兩個開孔連通,及/或間隔件的通孔與底板的至少兩個肋部連通。 In another embodiment, the through hole of the spacer is vertically connected to at least two openings of the bottom plate, and/or the through hole of the spacer is connected to at least two ribs of the bottom plate.
於另一實施例,第一覆蓋層與底板的至少兩個開孔的垂直投影重疊,及/或第一覆蓋層與底板的至少兩個肋部的垂直投影重疊。 In another embodiment, the vertical projections of at least two openings of the first covering layer and the bottom plate overlap, and/or the vertical projections of at least two ribs of the first covering layer and the bottom plate overlap.
於另一實施例,間隔件包括設置在上方的頂膠和設置在下方的底膠;間隔件、頂膠和底膠的整體厚度大於等於發光件的高度與位於發光件上方的一部分透光覆蓋結構的厚度的總和。 In another embodiment, the spacer includes a top sealant disposed on top and a bottom sealant disposed on the bottom; the overall thickness of the spacer, the top sealant, and the bottom sealant is greater than or equal to the sum of the height of the light-emitting element and the thickness of a portion of the light-transmitting cover structure located above the light-emitting element.
於另一實施例,間隔件包括設置在上方的頂膠及/或設置在下方的底膠;間隔件還包括位於其上無頂膠或底膠的環狀淨空邊緣,且環狀淨空邊緣圍繞間隔件的通孔的周邊。 In another embodiment, the spacer includes a top sealant disposed on the top and/or a bottom sealant disposed on the bottom; the spacer further includes an annular clear edge on which no top sealant or bottom sealant is disposed, and the annular clear edge surrounds the periphery of the through hole of the spacer.
於另一實施例,第二覆蓋層還包括上吸光層和底反射層。 In another embodiment, the second covering layer further includes an upper light absorbing layer and a bottom reflective layer.
於另一實施例,上吸光層的直徑可小於底反射層的直徑。 In another embodiment, the diameter of the upper light-absorbing layer may be smaller than the diameter of the bottom reflective layer.
於另一實施例,第一覆蓋層通過建構在底板和間隔件之間且不進入通孔的平坦第一覆蓋層達成。 In another embodiment, the first cover layer is achieved by constructing a flat first cover layer between the base plate and the spacer and not entering the through hole.
於另一實施例,第二覆蓋層還包括設置在平坦第一覆蓋層頂部的上吸光層和設置在平坦第一覆蓋層底部的底反射層。 In another embodiment, the second covering layer further includes an upper light absorbing layer disposed on top of the flat first covering layer and a bottom reflecting layer disposed on the bottom of the flat first covering layer.
於另一實施例,平坦第一覆蓋層包括設置於上方的中隔膠,平坦第一覆蓋層還包括位於其上無中隔膠的環狀淨空邊緣,且環狀淨空邊緣圍繞間隔件的通孔的垂直投影的周邊。 In another embodiment, the flat first covering layer includes a septum glue disposed thereon, and the flat first covering layer further includes an annular clear edge without the septum glue thereon, and the annular clear edge surrounds the periphery of the vertical projection of the through hole of the spacer.
於另一實施例,第二覆蓋層具有反射性,以反射光線回到位於間隔件的通孔中的第一覆蓋層。 In another embodiment, the second cover layer is reflective to reflect light back to the first cover layer located in the through hole of the spacer.
於另一實施例,至少一個第二覆蓋層具有反射性,且屏蔽於底板的其中一個肋部與第一覆蓋層之間,以自所述其中一個肋部反射光線回到第一覆蓋層。 In another embodiment, at least one second cover layer is reflective and is shielded between one of the ribs of the base plate and the first cover layer to reflect light from the one of the ribs back to the first cover layer.
於另一實施例,驅動電路板包括設置於其上的多個反射件,多個反射件垂直地位於與底板的至少兩個開孔對應的位置。 In another embodiment, the driving circuit board includes a plurality of reflective elements disposed thereon, wherein the plurality of reflective elements are vertically positioned corresponding to at least two openings of the base plate.
於另一實施例,驅動電路板包括至少一個面反射件和多個點反射件,面反射件設置於驅動電路板的頂部,且多個點反射件位於面反射件上且垂直地對應於底板的至少兩個開孔。 In another embodiment, the driving circuit board includes at least one surface reflector and multiple point reflectors. The surface reflector is disposed on the top of the driving circuit board, and the multiple point reflectors are located on the surface reflector and vertically correspond to at least two openings of the bottom plate.
於另一實施例,發光按鍵結構還包括鍵帽,其具有至少一透光部,其中光線穿過底板的多個開孔後照射透光部。 In another embodiment, the luminous key structure further includes a key cap having at least one light-transmitting portion, wherein light passes through the plurality of openings in the base plate and illuminates the light-transmitting portion.
於一衍生實施例,發光按鍵結構包括底板、驅動電路板、間隔件、發光件和透光覆蓋結構。底板具有多個開孔和分隔多個開孔的多個肋部;驅動電路板設置於底板下方;間隔件設置於底板下方且設置於驅動電路板上;間隔件具有通孔;發光件設置於驅動電路板上且位於通孔中,且發光件垂直地對應於底板的其中一個開孔;透光覆蓋結構包括平坦第一覆蓋層、塊狀第一覆蓋層和至少一個第二覆蓋層,其中,塊狀第一覆蓋層覆蓋發光件和間隔件的通孔內的驅動電路板,且塊狀第一覆蓋層更與底板的所述其中一個開孔的垂直投影重疊;其中平坦第一覆蓋層建構在底板與間隔件之間且不進入通孔;其中第二覆蓋層至少部分設置在平坦第一覆蓋層且垂直地對應於發光件和底板的所述 其中一個開孔,第二覆蓋層阻擋發光件往所述其中一個開孔發出的至少部分光線,以降低從所述其中一個開孔提供的發光強度。 In a derivative embodiment, the light-emitting key structure includes a base plate, a driving circuit board, a spacer, a light-emitting element, and a transparent cover structure. The base plate has a plurality of openings and a plurality of ribs separating the plurality of openings; the driving circuit board is disposed below the base plate; the spacer is disposed below the base plate and disposed on the driving circuit board; the spacer has a through hole; the light-emitting element is disposed on the driving circuit board and is located in the through hole, and the light-emitting element vertically corresponds to one of the openings of the base plate; the transparent cover structure includes a flat first cover layer, a block first cover layer, and at least one second cover layer, wherein the block first cover layer covers the through hole of the light-emitting element and the spacer. The drive circuit board is housed within the substrate, and the block-shaped first cover layer further overlaps a vertical projection of one of the openings in the substrate; the planar first cover layer is constructed between the substrate and the spacer and does not enter the through-hole; and the second cover layer is at least partially disposed on the planar first cover layer and perpendicularly corresponds to the light-emitting element and one of the openings in the substrate. The second cover layer blocks at least a portion of light emitted by the light-emitting element toward the one of the openings, thereby reducing the intensity of light emitted from the one of the openings.
於另一衍生實施例,驅動電路板包括設置於其上的多個反射件,多個反射件位於與底板的至少兩個開孔垂直地對應的位置。 In another derivative embodiment, the driving circuit board includes a plurality of reflective elements disposed thereon, wherein the plurality of reflective elements are located at positions vertically corresponding to at least two openings of the base plate.
於另一衍生實施例,驅動電路板包括至少一個面反射件和多個點反射件,面反射件設置於驅動電路板的頂部,多個點反射件位於面反射件上且垂直地對應於底板的至少兩個開孔。 In another derivative embodiment, the driving circuit board includes at least one surface reflector and multiple point reflectors. The surface reflector is disposed on the top of the driving circuit board, and the multiple point reflectors are located on the surface reflector and vertically correspond to at least two openings of the bottom plate.
於另一衍生實施例,第二覆蓋層具有反射性,以反射光線回到位於間隔件的通孔中的第一覆蓋層。 In another variant embodiment, the second cover layer is reflective to reflect light back to the first cover layer located in the through hole of the spacer.
於本發明另一實施例,發光按鍵結構包含底板、驅動電路板、間隔件、發光件及透光覆蓋結構,底板具有開孔;驅動電路板具有面反射件及至少一個點反射件設置於其上;間隔件黏合於驅動電路板,間隔件具有通孔及至少部分圍繞通孔的無膠淨空邊緣;發光件設置於驅動電路板並鄰近面反射件及點反射件;透光覆蓋結構覆蓋發光件並包含反射層,其中反射層將光從發光件朝面反射件及/或點反射件反射,使得光自面反射件及/或點反射件向上反射而通過間隔件的通孔,然後向上照射穿過底板的開孔。 In another embodiment of the present invention, a light-emitting key structure includes a base plate, a driver circuit board, a spacer, a light-emitting element, and a transparent cover structure. The base plate has an opening; the driver circuit board has a surface reflector and at least one point reflector disposed thereon; the spacer is bonded to the driver circuit board and has a through hole and a glue-free clear edge at least partially surrounding the through hole; the light-emitting element is disposed on the driver circuit board and adjacent to the surface reflector and the point reflector; the transparent cover structure covers the light-emitting element and includes a reflective layer, wherein the reflective layer reflects light from the light-emitting element toward the surface reflector and/or the point reflector, causing the light to be reflected upward from the surface reflector and/or the point reflector, pass through the through hole of the spacer, and then illuminate upward through the opening of the base plate.
於本發明又另一實施例,照射模組用以照射按鍵,其包含驅動電路板、間隔件、發光件及透光覆蓋結構,驅動電路板具有面反射件及至少一個點反射件設置於其上;間隔件黏合於驅動電路板,間隔件具有通孔及至少部分圍繞通孔的無膠淨空邊緣;發光件設置於驅動電路板且在面反射件及至少一個點反射件中;透光覆蓋結構覆蓋發光件並包含反射層,其中反射層將光從發 光件反射,而面反射件及/或至少一個點反射件將光反射以通過間隔件的通孔,然後向上照射穿過透光覆蓋結構。 In yet another embodiment of the present invention, an illumination module for illuminating a keypad includes a driver circuit board, a spacer, a light-emitting element, and a transparent cover structure. The driver circuit board has a surface reflector and at least one point reflector disposed thereon. The spacer is bonded to the driver circuit board and has a through hole and a clear, adhesive-free edge at least partially surrounding the through hole. The light-emitting element is disposed on the driver circuit board and between the surface reflector and the at least one point reflector. The transparent cover structure covers the light-emitting element and includes a reflective layer. The reflective layer reflects light from the light-emitting element, while the surface reflector and/or the at least one point reflector reflect light so that it passes through the through hole of the spacer and then radiates upward through the transparent cover structure.
於本發明再另一實施例,照射模組用以照射按鍵,其包含驅動電路板、發光件、透光覆蓋結構及間隔件,驅動電路板具有面反射件及至少一個點反射件設置於其上;發光件設置於驅動電路板且位在面反射件及至少一個點反射件中;透光覆蓋結構覆蓋發光件並包含反射層及平坦透明層,反射層將光從發光件反射;間隔件黏合於平坦透明層及驅動電路板之間,間隔件具有通孔及至少部分圍繞通孔的無膠淨空邊緣,使得面反射件及至少一個點反射件中的一者或兩者至少部分地設置在發光件及無膠淨空邊緣之間。 In yet another embodiment of the present invention, an illumination module is used to illuminate a keypad and includes a driver circuit board, a light-emitting element, a transparent cover structure, and a spacer. The driver circuit board has a surface reflector and at least one point reflector disposed thereon; the light-emitting element is disposed on the driver circuit board and positioned between the surface reflector and the at least one point reflector; the transparent cover structure covers the light-emitting element and includes a reflective layer and a flat transparent layer, with the reflective layer reflecting light from the light-emitting element; and the spacer is bonded between the flat transparent layer and the driver circuit board. The spacer has a through hole and a clear, adhesive-free edge at least partially surrounding the through hole, such that one or both of the surface reflector and the at least one point reflector are at least partially positioned between the light-emitting element and the clear, adhesive-free edge.
於一實施例,透光覆蓋結構的反射層至少部分允許光通過。 In one embodiment, the reflective layer of the light-transmitting cover structure at least partially allows light to pass through.
於一實施例,透光覆蓋結構的反射層與面反射件及/或至少一個點反射件至少部分重疊。 In one embodiment, the reflective layer of the light-transmitting cover structure at least partially overlaps with the surface reflective element and/or at least one point reflective element.
於一實施例,透光覆蓋結構更包含平坦透明層,其覆蓋發光件而不進入通孔。 In one embodiment, the light-transmitting covering structure further includes a flat transparent layer that covers the light-emitting element without entering the through hole.
於一實施例,間隔件黏合於驅動電路板及透光覆蓋結構的平坦透明層之間。 In one embodiment, the spacer is bonded between the driving circuit board and the flat transparent layer of the light-transmitting cover structure.
於一實施例,間隔件的通孔與底板的開孔重疊。 In one embodiment, the through hole of the spacer overlaps with the opening of the base plate.
於一實施例,吸光層設置於透光覆蓋結構的反射層上方。 In one embodiment, the light absorbing layer is disposed above the reflective layer of the light-transmitting cover structure.
於一實施例,吸光層的直徑小於反射層的直徑。 In one embodiment, the diameter of the light-absorbing layer is smaller than the diameter of the reflective layer.
於一實施例,面反射件及至少一個點反射件中的一者或兩者至少部分地設置於發光件及無膠淨空邊緣之間。 In one embodiment, one or both of the surface reflector and the at least one point reflector are at least partially disposed between the light emitting element and the edge of the adhesive-free clear space.
於本發明之另一變化例,照射模組用以照射按鍵,其包含驅動電路板、發光件、覆蓋結構及間隔件,驅動電路板其上設有反射件層;發光件設置於驅動電路板並鄰近反射件層;覆蓋結構具有島狀覆蓋部;間隔件黏合於覆蓋結構及驅動電路板之間,間隔件具有通孔及至少部分圍繞通孔的無膠淨空邊緣,其中島狀覆蓋部覆蓋於發光件及通孔上方。 In another variation of the present invention, an illumination module is used to illuminate a keypad and includes a driver circuit board, a light-emitting element, a covering structure, and a spacer. The driver circuit board has a reflective layer disposed thereon; the light-emitting element is disposed on the driver circuit board and adjacent to the reflective layer; the covering structure has an island-shaped covering portion; and the spacer is bonded between the covering structure and the driver circuit board. The spacer has a through hole and a clear, glue-free edge at least partially surrounding the through hole, wherein the island-shaped covering portion covers the light-emitting element and the through hole.
於一實施例,覆蓋結構更具有圍繞島狀覆蓋部的框狀覆蓋部,島狀覆蓋部延伸連接框狀覆蓋部的相對兩側,以在框狀覆蓋部中定義兩個可透光部,且兩個可透光部圍繞發光件。 In one embodiment, the covering structure further includes a frame-shaped covering portion surrounding the island-shaped covering portion. The island-shaped covering portion extends to connect opposite sides of the frame-shaped covering portion to define two light-transmissive portions in the frame-shaped covering portion. The two light-transmissive portions surround the light-emitting element.
於一實施例,照射模組更包含出光圖案,其中出光圖案包含反射圖案以及擴散圖案,反射圖案在反射件層上,擴散圖案在間隔件上,且出光圖案用以向上導引光至兩個可透光部之至少其中一個。 In one embodiment, the illumination module further includes a light-emitting pattern, wherein the light-emitting pattern includes a reflective pattern and a diffusion pattern. The reflective pattern is on the reflective layer, and the diffusion pattern is on the spacer. The light-emitting pattern is used to guide light upward to at least one of the two light-transmissive portions.
於一實施例,兩個可透光部各具有二個或更多個角落及三個或更多個側邊,使得框狀覆蓋部的各角落對應於兩個可透光部的該些角落中的一個。 In one embodiment, each of the two light-transmitting portions has two or more corners and three or more side edges, such that each corner of the frame-shaped covering portion corresponds to one of the corners of the two light-transmitting portions.
於一實施例,覆蓋結構包含第一覆蓋層及第二覆蓋層,第一覆蓋層用以實質反射光線,且第二覆蓋層用以實質遮擋光線;第一覆蓋層及第二覆蓋層中的至少一個形成島狀覆蓋部,且第一覆蓋層及第二覆蓋層一起形成框狀覆蓋部。 In one embodiment, the covering structure includes a first covering layer and a second covering layer. The first covering layer is configured to substantially reflect light, and the second covering layer is configured to substantially block light. At least one of the first covering layer and the second covering layer forms an island-shaped covering portion, and the first covering layer and the second covering layer together form a frame-shaped covering portion.
於一實施例,覆蓋結構更包含平坦覆蓋層,第一覆蓋層及第二覆蓋層設置於平坦覆蓋層的同一側或兩相反側,且第一覆蓋層較第二覆蓋層靠近間隔件。 In one embodiment, the covering structure further includes a planar covering layer, the first covering layer and the second covering layer are disposed on the same side or on opposite sides of the planar covering layer, and the first covering layer is closer to the spacer than the second covering layer.
於一實施例,第二覆蓋層自第一覆蓋層延伸以至少部分圍繞兩個可透光部中的至少一個。 In one embodiment, the second covering layer extends from the first covering layer to at least partially surround at least one of the two light-transmissive portions.
於另一衍生實施例,發光按鍵結構包含底板、鍵帽及照射模組,底板具有開孔;鍵帽相對於底板設置;照射模組包含:驅動電路板、發光件、覆蓋結構及間隔件,驅動電路板其上設有反射件層;發光件設置於驅動電路板並鄰近反射件層;覆蓋結構具有框狀覆蓋部及島狀覆蓋部;間隔件黏合於覆蓋結構及驅動電路板之間,間隔件具有通孔及無膠淨空邊緣,通孔對應開孔,無膠淨空邊緣至少部分圍繞通孔,其中框狀覆蓋部圍繞鍵帽的輪廓設置,且島狀覆蓋部覆蓋於發光件及通孔上方。 In another derivative embodiment, the light-emitting key structure includes a base plate, a key cap and an illumination module, wherein the base plate has an opening; the key cap is arranged relative to the base plate; the illumination module includes: a driving circuit board, a light-emitting element, a covering structure and a spacer, wherein the driving circuit board has a reflective element layer thereon; the light-emitting element is arranged on the driving circuit board and adjacent to the reflective element layer; the covering structure The structure comprises a frame-shaped covering portion and an island-shaped covering portion. A spacer is bonded between the covering structure and the driver circuit board. The spacer has a through hole and a glue-free clear edge. The through hole corresponds to the opening, and the glue-free clear edge at least partially surrounds the through hole. The frame-shaped covering portion is disposed around the outline of the keycap, and the island-shaped covering portion covers the light-emitting element and the through hole.
於一實施例,兩個可透光部各具有二個或更多個角落及三個或更多個側邊,使得鍵帽的各角落對應於兩個可透光部的該些角落中的一個。 In one embodiment, each of the two light-transmissive portions has two or more corners and three or more side edges, such that each corner of the keycap corresponds to one of the corners of the two light-transmissive portions.
於一實施例,兩個可透光部各具有二個或更多個角落及三個或更多個側邊,鍵帽的各側邊對應於兩個可透光部的該些側邊中的至少一個。 In one embodiment, each of the two light-transmissive portions has two or more corners and three or more side edges, and each side edge of the keycap corresponds to at least one of the side edges of the two light-transmissive portions.
於一實施例,底板更具有圍繞開孔設置的兩個或更多個周邊開孔,且兩個可透光部各至少部分地對應於兩個或更多個周邊開孔中的至少一個。 In one embodiment, the base plate further has two or more peripheral openings disposed around the opening, and each of the two light-transmissive portions at least partially corresponds to at least one of the two or more peripheral openings.
於一實施例,照射模組更包含出光圖案,出光圖案對應兩個可透光部,並用以向上導引光穿過兩個可透光部之至少其中一個且進一步穿過兩個或更多個周邊開孔。 In one embodiment, the illumination module further includes a light-emitting pattern corresponding to the two light-transmitting portions and configured to guide light upward through at least one of the two light-transmitting portions and further through two or more peripheral openings.
於一實施例,鍵帽具有多個透光部,且兩個可透光部中的一個位於多個透光部中的兩個之間。 In one embodiment, the keycap has multiple light-transmitting portions, and one of the two light-transmitting portions is located between two of the multiple light-transmitting portions.
於一實施例,鍵帽具有多個透光部,且兩個可透光部中的一個位於多個透光部中的一個與鍵帽之輪廓之間。 In one embodiment, the keycap has multiple light-transmitting portions, and one of the two light-transmitting portions is located between one of the multiple light-transmitting portions and the outline of the keycap.
於另一衍生實施例,照射模組用以照射按鍵,其包含驅動電路板、發光件、覆蓋結構、間隔件及出光圖案,驅動電路板其上設有反射件層;發光件設置於驅動電路板並鄰近反射件層;覆蓋結構具有島狀覆蓋部;間隔件黏合於覆蓋結構及驅動電路板之間,間隔件具有通孔及至少部分圍繞通孔的無膠淨空邊緣;出光圖案包含反射圖案以及擴散圖案,反射圖案在反射件層上,擴散圖案在間隔件上,其中島狀覆蓋部覆蓋於發光件及通孔上方,且出光圖案實質設置鄰近島狀覆蓋部並用以向上導引光。 In another derivative embodiment, an illumination module is used to illuminate a key, and includes a driver circuit board, a light-emitting element, a covering structure, a spacer, and a light-emitting pattern. The driver circuit board has a reflective layer disposed thereon; the light-emitting element is disposed on the driver circuit board and adjacent to the reflective layer; the covering structure has an island-shaped covering portion; the spacer is bonded between the covering structure and the driver circuit board, and the spacer has a through hole and a glue-free clear edge that at least partially surrounds the through hole; the light-emitting pattern includes a reflective pattern and a diffusion pattern, the reflective pattern is on the reflective layer, and the diffusion pattern is on the spacer, wherein the island-shaped covering portion covers the light-emitting element and the through hole, and the light-emitting pattern is actually disposed adjacent to the island-shaped covering portion and is used to guide light upward.
根據本發明之實施例,對具有專屬低照度發光件的發光按鍵而言,可強化整個鍵帽的照明均勻性。再者,可藉由對應的反射性第二覆蓋層來解決由於光朝底板肋部而造成的照度損失。此外,導入較大的塊狀第一覆蓋層來覆蓋間隔件的通孔內的發光件,其大到足以與底板的多個開孔中的至少兩個的垂直投影重疊。這樣的塊狀第一覆蓋層在下方可具有反射件,以將回收光朝鍵帽角落的透光部反射,進而改善照度均勻性。更導入平坦第一覆蓋層以配合或不配合塊狀第一覆蓋層應用,藉此最佳化具有低照度發光件之發光按鍵的照明均勻性。 According to an embodiment of the present invention, for illuminated keys with dedicated low-illuminance light-emitting elements, the lighting uniformity of the entire keycap can be enhanced. Furthermore, the illumination loss caused by light directed toward the ribs of the base plate can be resolved by a corresponding reflective second cover layer. In addition, a larger block-shaped first cover layer is introduced to cover the light-emitting elements within the through-holes of the spacer elements. The block-shaped first cover layer is large enough to overlap the vertical projections of at least two of the multiple openings in the base plate. Such a block-shaped first cover layer can have a reflective element underneath to reflect the recycled light toward the light-transmitting portions in the corners of the keycap, thereby improving the illumination uniformity. A flat first cover layer can be used with or without a blocky first cover layer to optimize the illumination uniformity of illuminated keys with low-intensity lighting elements.
在閱讀了以下在各個附圖和附圖中示出的較佳實施例的詳細說明之後,本發明的上述和其他目的對於本領域普通技術人員來說無疑將變得顯而易見。 The above and other objects of the present invention will no doubt become apparent to those skilled in the art after reading the following detailed description of the preferred embodiments shown in the various drawings and accompanying drawings.
1:發光按鍵結構 1: Luminous button structure
10:底板 10: Base Plate
102:底面 102: Bottom
104:開孔 104: Opening
104’:周邊開孔 104’: Peripheral openings
106:肋部 106: Ribs
12:鍵帽 12: Keycaps
120、120a、120b:透光部 120, 120a, 120b: Translucent portion
14:升降機構 14: Lifting mechanism
16:開關電路板 16: Switch circuit board
162:開關 162: Switch
164:穿孔 164: Perforation
18:彈性復位件 18: Elastic return element
20:驅動電路板 20: Driver circuit board
202:上表面 202: Upper surface
204:電路 204: Circuit
206:連接墊 206: Connecting pad
208:反射件 208: Reflective element
208a:點反射件 208a: Point reflector
208b:反射圖案 208b: Reflection pattern
211:主佈線 211: Main Layout
212:子佈線 212: Sub-wiring
22:發光件 22: Luminous parts
222:頂面 222: Top
224:側面 224:Side
24:間隔件 24: Spacer
24a:擴散圖案 24a: Diffusion pattern
242、242’:通孔 242, 242’: Through hole
242a、242b、242c、242d:側壁 242a, 242b, 242c, 242d: Side walls
244:上表面 244: Upper surface
244a:環狀淨空邊緣 244a: Annular clear edge
244b:淨空外緣 244b: Clear Space Outer Edge
246:下表面 246: Lower surface
246a:環狀淨空邊緣 246a: Annular clear edge
246b:淨空外緣 246b: Clear Space Outer Edge
26、26’:頂膠 26, 26’: Top glue
28、28’:底膠 28, 28': Base glue
30、30a、30b、30c:透光覆蓋結構 30, 30a, 30b, 30c: Translucent covering structure
30’:覆蓋結構 30’: Covering structure
30a’:島狀覆蓋部 30a’: Island-shaped covering part
30b’:框狀覆蓋部 30b’: Frame-shaped covering portion
302、302’:第一覆蓋層 302, 302’: First covering layer
3021:邊緣 3021:Edge
304、304’:第二覆蓋層 304, 304’: Second covering layer
3041:邊緣 3041:Edge
306:平坦第一覆蓋層 306: Flat first covering layer
306’:平坦覆蓋層 306’: Flat cover layer
306a:環狀淨空邊緣 306a: Annular clear edge
306b:可透光部 306b: Translucent portion
308:中隔膠 308: Septum glue
A:圓圈 A:Circle
D1:垂直方向 D1: Vertical direction
圖1為根據一實施例之發光按鍵結構之爆炸圖。 Figure 1 is an exploded view of a luminous key structure according to one embodiment.
圖2為圖1之發光按鍵結構之截面圖。 Figure 2 is a cross-sectional view of the luminous key structure in Figure 1.
圖3為圖2中圓圈A之放大圖。 Figure 3 is an enlarged view of circle A in Figure 2.
圖4為頂膠於間隔件塗佈範圍之實施例之示意圖。 Figure 4 is a schematic diagram of an embodiment of the coating range of the top glue on the spacer.
圖5為底膠於間隔件塗佈範圍之實施例之示意圖。 Figure 5 is a schematic diagram of an embodiment of the primer coating area on the spacer.
圖6為間隔件的通孔之實施例之截面圖。 Figure 6 is a cross-sectional view of an embodiment of a through hole in a spacer.
圖7為間隔件的通孔之另一實施例之截面圖。 Figure 7 is a cross-sectional view of another embodiment of a through hole in a spacer.
圖8為間隔件的通孔之另一實施例之截面圖。 Figure 8 is a cross-sectional view of another embodiment of a through hole in a spacer.
圖9為位於間隔件的通孔內透光覆蓋結構之實施例之截面圖。 Figure 9 is a cross-sectional view of an embodiment of a light-transmitting cover structure located within a through-hole of a spacer.
圖10為位於間隔件的通孔內透光覆蓋結構之另一實施例之截面圖。 Figure 10 is a cross-sectional view of another embodiment of a light-transmitting cover structure located within a through-hole of a spacer.
圖11為發光按鍵結構的一變化例的截面圖。 Figure 11 is a cross-sectional view of a variation of the luminous key structure.
圖12A、圖12B和圖12C分別為某些變化例的第二覆蓋層的示例圖案示意圖。 Figures 12A, 12B, and 12C are schematic diagrams of example patterns of the second covering layer in certain variations.
圖13為根據另一變化例之發光按鍵結構的截面圖。 Figure 13 is a cross-sectional view of a luminous key structure according to another variation.
圖14為根據另一變化例之發光按鍵結構的爆炸圖。 Figure 14 is an exploded view of a luminous key structure according to another variation.
圖15為圖14的發光按鍵結構的截面圖。 Figure 15 is a cross-sectional view of the light-emitting key structure of Figure 14.
圖16為根據一衍生例之發光按鍵結構的截面圖。 Figure 16 is a cross-sectional view of a luminous key structure according to a derivative example.
圖17為發光按鍵結構之另一變化例之截面圖。 Figure 17 is a cross-sectional view of another variation of the luminous key structure.
圖18至圖21分別為圖17之發光按鍵結構之構件的平面示意圖。 Figures 18 to 21 are schematic plan views of the components of the luminous key structure of Figure 17.
圖22為圖17之發光按鍵結構的某些構件堆疊的平面示意圖。 Figure 22 is a schematic plan view of the stacking of certain components of the luminous key structure of Figure 17.
請參閱圖1至圖3。根據一實施例之發光按鍵結構1包含底板10、鍵帽12、升降機構14、開關電路板16、彈性復位件18、驅動電路板20、發光件22及間隔件24。鍵帽12設置於底板10之上。升降機構14連接至底板10與鍵帽12之間,使得鍵帽12經由升降機構14能相對於底板10上下移動。開關電路板16設置於底板10上並具有開關162(以帶影線之圓圈表示於圖1)。彈性復位件18對應開關162設置於鍵帽12與開關162之間。鍵帽12可被按壓以向下擠壓彈性復位件18,使得彈性復位件18觸發開關162。開關162可以由位於開關電路板16上方的觸發凸點所觸發。觸發凸點延伸自彈性復位件18、升降機構14或鍵帽12等位於開關電路板16上方的任意元件。當鍵帽12不被按壓時,彈性復位件18的回彈力使鍵帽12向上移動回至原位。其中,升降機構14由剪刀腳支架實作,其包含兩個個別連接至底板10與鍵帽12之間且相互樞接的支架。開關電路板16由薄膜電路板實作,其包含上電路載板、下電路載板及設置於上電路載板及下電路載板間之中間絕緣板。開關由相對位於上電路載板及下電路載板上之電路接點實作。彈性復位件18可由例如但不限於橡膠圓突實作。 Please refer to Figures 1 to 3. According to one embodiment, a light-emitting key structure 1 includes a base plate 10, a keycap 12, a lifting mechanism 14, a switch circuit board 16, an elastic reset member 18, a drive circuit board 20, a light-emitting member 22, and a spacer 24. The keycap 12 is disposed on the base plate 10. The lifting mechanism 14 is connected between the base plate 10 and the keycap 12, allowing the keycap 12 to move up and down relative to the base plate 10. The switch circuit board 16 is disposed on the base plate 10 and has a switch 162 (indicated by a hatched circle in Figure 1). The elastic reset member 18 is disposed between the keycap 12 and the switch 162, corresponding to the switch 162. The keycap 12 can be pressed downward to squeeze the elastic reset member 18, causing the elastic reset member 18 to trigger the switch 162. The switch 162 can be triggered by a trigger bump located above the switch circuit board 16. The trigger bump extends from any component located above the switch circuit board 16, such as the elastic reset member 18, the lifting mechanism 14, or the keycap 12. When the keycap 12 is not pressed, the rebound force of the elastic reset member 18 causes the keycap 12 to move upward and return to its original position. The lifting mechanism 14 is implemented by a scissor-leg bracket, which includes two brackets that are individually connected between the base plate 10 and the keycap 12 and are pivotally connected to each other. The switch circuit board 16 is implemented as a thin film circuit board, comprising an upper circuit board, a lower circuit board, and an intermediate insulating plate disposed between the upper and lower circuit boards. The switch is implemented by circuit contacts located opposite each other on the upper and lower circuit boards. The elastic reset member 18 can be implemented, for example, but not limited to, a rubber protrusion.
於實作上,升降機構14、開關電路板16及彈性復位件18亦可由其他能產生同樣功效的結構實作。例如,升降機構14可由蝴蝶支架或其他能提供對應的鍵帽上下移動之機構等實作。於實作上,長度較長的鍵帽(例如空白鍵、輸入鍵、倒退鍵、移位鍵等)的升降機構可由多個剪刀腳支架、蝴蝶支架或其組合實作。又例如,開關電路板16可由帶有觸碰開關之電路板實作。又例如,開關電路板16可由印刷電路板或軟性電路板實作,其上形成兩個相鄰的接點作為開關162。彈性復位件18具有對應此兩接點的導電部並能透過此導電部 同時接觸此兩接點以實作開關162的觸發。又例如,彈性復位件18可由彈簧或其他彈性結構實作。 In practice, the lifting mechanism 14, the switch circuit board 16, and the elastic reset member 18 can also be implemented by other structures that can produce the same effect. For example, the lifting mechanism 14 can be implemented by a butterfly bracket or other mechanism that can provide a corresponding keycap to move up and down. In practice, the lifting mechanism of a longer keycap (such as a blank key, input key, reverse key, shift key, etc.) can be implemented by multiple scissor-foot brackets, butterfly brackets, or a combination thereof. For another example, the switch circuit board 16 can be implemented by a circuit board with a touch switch. For another example, the switch circuit board 16 can be implemented by a printed circuit board or a flexible circuit board, on which two adjacent contacts are formed as a switch 162. The elastic reset member 18 has a conductive portion corresponding to the two contacts and can simultaneously contact the two contacts through the conductive portion to trigger the switch 162. For example, the elastic reset member 18 can be implemented by a spring or other elastic structure.
此外,於本實施例中,驅動電路板20設置於底板10下方並具有上表面202。發光件22電性設置於驅動電路板20的上表面202上。發光件22可以是單顆單色發光二極體(例如白色)、或多顆不同顏色的發光二極體(例如紅、綠、藍)。間隔件24設置於底板10與驅動電路板20之間。底板10具有底面102,以及一個或多個開孔104/104'。開關電路板16具有穿孔164。間隔件24具有通孔242。底板10的開孔104、開關電路板16的穿孔164及間隔件24的通孔242於垂直方向D1相連通(圖中如雙箭頭所示),三者在垂直方向D1的投影可以完全對正對齊、或至少局部地重疊。換言之,開孔104、穿孔164及通孔242於垂直方向D1上至少部分重疊,使得於垂直方向D1上,存在有一筆直通道,穿過開孔104、穿孔164及通孔242。在其他實作方式中,開關電路板16除了電路以外是可透光的,穿孔164並非絕對必要。發光件22具有頂面222且位於通孔242中。頂面222於高度上低於底板10的底面102。藉此,發光按鍵結構1於發光件22附近處的結構可保持平整,有助於結構尺寸控制。此外,在其他實施例中,發光件22和通孔242也可以是位於對應底板10的其他開孔104'的位置。在尺寸較大的倍數按鍵中、或者在需要多一顆指示光源的按鍵中,多個發光件22可能分別位於對應不同的底板10的開孔104、104'。 Furthermore, in this embodiment, the driver circuit board 20 is disposed below the base plate 10 and has an upper surface 202. A light-emitting element 22 is electrically disposed on the upper surface 202 of the driver circuit board 20. The light-emitting element 22 can be a single single-color LED (e.g., white) or multiple LEDs of different colors (e.g., red, green, and blue). A spacer 24 is disposed between the base plate 10 and the driver circuit board 20. The base plate 10 has a bottom surface 102 and one or more openings 104/104'. The switch circuit board 16 has a through hole 164. The spacer 24 has a through hole 242. The opening 104 of the base plate 10, the through-hole 164 of the switch circuit board 16, and the through-hole 242 of the spacer 24 are connected in the vertical direction D1 (as shown by the double arrows in the figure). The projections of the three in the vertical direction D1 can be completely aligned or at least partially overlap. In other words, the opening 104, the through-hole 164, and the through-hole 242 at least partially overlap in the vertical direction D1, so that a straight channel exists in the vertical direction D1, passing through the opening 104, the through-hole 164, and the through-hole 242. In other embodiments, the switch circuit board 16 is light-transmissive except for the circuitry, and the through-hole 164 is not absolutely necessary. The light-emitting element 22 has a top surface 222 and is located in the through-hole 242. The top surface 222 is lower in height than the bottom surface 102 of the base plate 10. This allows the illuminated key structure 1 to remain flat near the light-emitting element 22, facilitating structural size control. Furthermore, in other embodiments, the light-emitting element 22 and through-hole 242 may be located at positions corresponding to other openings 104' of the base plate 10. In larger multi-layer keys, or keys requiring an additional indicator light source, multiple light-emitting elements 22 may be located in corresponding openings 104 and 104' of the base plate 10.
間隔件24還可防止發光件22結構上進入底板10的開孔104中,以避免發光件22與發光按鍵結構1內位於底板10上方之其他構件(例如其可能因作動而暫時地進入開孔104內)產生結構干涉,造成損傷。另外,於本實施例中,間隔件24呈板狀,並與驅動電路板20輪廓相當,此結構配置更有助於使底板 10、驅動電路板20及間隔件24整體保持平整,但實作上不以此為限。例如間隔件24呈環狀(例如呈圓形、方形或其他幾何形之環狀),圍繞發光件22,其仍能發揮使發光按鍵結構1於發光件22附近處的結構保持平整的功效。另外,於實作上,開關電路板16亦可設置於底板10下方而與驅動電路板20結構上整合成單一電路板。例如,去除開關電路板16,而相對於彈性復位件18、升降機構14或鍵帽12三者任意一個延伸的觸發凸點,於驅動電路板20上對應觸發凸點之處設置觸碰開關。底板10對應地形成開孔,以使彈性復位件18能向下移動而接觸此觸碰開關。 The spacer 24 also prevents the light-emitting element 22 from structurally entering the opening 104 of the base plate 10, thereby preventing structural interference between the light-emitting element 22 and other components within the light-emitting key structure 1 located above the base plate 10 (for example, components that might temporarily enter the opening 104 during operation), potentially causing damage. Furthermore, in this embodiment, the spacer 24 is plate-shaped and conforms to the contour of the driver circuit board 20. This structural configuration further helps maintain a flat overall structure of the base plate 10, driver circuit board 20, and spacer 24, but this is not a limitation in practice. For example, the spacer 24 may be annular (e.g., circular, square, or other geometrically shaped) surrounding the light-emitting element 22, while still maintaining the flatness of the light-emitting key structure 1 near the light-emitting element 22. Furthermore, in practice, the switch circuit board 16 may be disposed beneath the base plate 10 and structurally integrated with the driver circuit board 20 into a single circuit board. For example, the switch circuit board 16 may be removed, and a touch switch may be provided on the driver circuit board 20 at a location corresponding to the trigger bump extending from any of the elastic reset member 18, the lift mechanism 14, or the keycap 12. A corresponding opening is formed in the base plate 10 to allow the elastic reset member 18 to move downward and contact the touch switch.
於本實施例中,間隔件24的通孔242的側壁242a圍繞發光件22並足夠靠近於發光件22的側面。側壁242a的頂邊也高於發光件22,以保護發光件22。因此,不論是否發光件22是否被絕緣材料覆蓋,都能對發光件22提供保護效果,而在組裝過程或運作過程避免干涉撞擊。再者,通孔242的側壁242a不透光,使得發光件22發出的光線不會進入間隔件24內,可避免按鍵或鍵盤周圍非預期的側漏光現象。於實作上,當間隔件24使用可透光材料製作時,可於側壁242a上塗滿不透光層。又,間隔件24可直接使用不透光材料製作,使得整個間隔件24不透光。再者,於本實施例中,間隔件24的通孔242大於底板10的開孔104(例如於垂直方向D1上,開孔104的投影落於通孔242的投影內,且發光件22落在開孔104的投影內),有助於抑制通孔242側壁242a反射的光線直接自開孔104射出。又,開關電路板16的穿孔164大於底板10的開孔104(例如於垂直方向D1上,開孔104的投影落於穿孔164的投影內),有助於抑制自開孔104射出的光線從穿孔164側壁進入開關電路板16。在其他實施例中,底板10的開孔104/104'尺寸,不必然小於間隔件24的通孔242尺寸,只要二者在垂直方向D1的投影至 少局部地重疊,並且發光件22完全地落在底板10的開孔104/104'垂直方向D1投影內,且不被底板10直接遮擋即可。 In this embodiment, the sidewalls 242a of the through-hole 242 in the spacer 24 surround the light-emitting element 22 and are sufficiently close to the side surfaces of the light-emitting element 22. The top of the sidewalls 242a are also higher than the light-emitting element 22 to protect it. Therefore, regardless of whether the light-emitting element 22 is covered with insulating material, it is protected from interference and impact during assembly or operation. Furthermore, the sidewalls 242a of the through-hole 242 are opaque, preventing light emitted by the light-emitting element 22 from entering the spacer 24, thus preventing unintended sidelight leakage around the keys or keyboard. In practice, when the spacer 24 is made of a light-transmitting material, the sidewalls 242a can be coated with an opaque layer. Alternatively, the spacer 24 can be made directly of opaque material, rendering the entire spacer 24 opaque. Furthermore, in this embodiment, the through-hole 242 of the spacer 24 is larger than the opening 104 of the base plate 10 (for example, in the vertical direction D1, the projection of the opening 104 falls within the projection of the through-hole 242, and the light-emitting element 22 falls within the projection of the opening 104). This helps prevent light reflected from the sidewalls 242a of the through-hole 242 from being emitted directly from the opening 104. Furthermore, the through-hole 164 of the switch circuit board 16 is larger than the opening 104 of the base plate 10 (for example, the projection of the opening 104 in the vertical direction D1 falls within the projection of the through-hole 164). This helps prevent light emitted from the opening 104 from entering the switch circuit board 16 through the sidewalls of the through-hole 164. In other embodiments, the size of the openings 104/104' in the base plate 10 does not necessarily need to be smaller than the size of the through-hole 242 in the spacer 24, as long as their projections in the vertical direction D1 at least partially overlap, and the light-emitting element 22 completely falls within the projection of the openings 104/104' in the base plate 10 in the vertical direction D1 and is not directly blocked by the base plate 10.
此外,於本實施例中,發光按鍵結構1包含頂膠26及底膠28(為簡化圖1的圖面,未繪示於此圖中),以使間隔件24分別與底板10及驅動電路板20結合。其中,間隔件24具有上表面244及與上表面244相對之下表面246。頂膠26設置於上表面244與底板10的底面102之間。頂膠26避開所有底板10的開孔104/104'。間隔件24經由頂膠26與底板10固定連接(即頂膠26黏合上表面244與底板10的底面102)。底膠28設置於下表面246與驅動電路板20的上表面202之間。間隔件24經由底膠28與驅動電路板20固定連接(即底膠28黏合下表面246與驅動電路板20的上表面202)。另外,頂膠26及底膠28實作上亦得以不透光材料製作,可避免光線進入頂膠26及底膠28內。 Furthermore, in this embodiment, the light-emitting key structure 1 includes a top adhesive 26 and a bottom adhesive 28 (not shown in FIG. 1 to simplify the diagram) to bond the spacer 24 to the base plate 10 and the driver circuit board 20, respectively. The spacer 24 has an upper surface 244 and a lower surface 246 opposite the upper surface 244. The top adhesive 26 is disposed between the upper surface 244 and the bottom surface 102 of the base plate 10. The top adhesive 26 avoids all openings 104/104' of the base plate 10. The spacer 24 is fixedly connected to the base plate 10 via the top adhesive 26 (i.e., the top adhesive 26 adheres to the upper surface 244 and the bottom surface 102 of the base plate 10). The base glue 28 is disposed between the lower surface 246 and the upper surface 202 of the driver circuit board 20. The spacer 24 is fixedly connected to the driver circuit board 20 via the base glue 28 (i.e., the base glue 28 adheres to the lower surface 246 and the upper surface 202 of the driver circuit board 20). Furthermore, the top glue 26 and the base glue 28 are also made of opaque materials to prevent light from entering the top glue 26 and the base glue 28.
於實作上,間隔件24可先於其上表面244及下表面246上分別塗佈頂膠26及底膠28。然後,間隔件24再藉由底膠28與驅動電路板20黏合。最後,間隔件24再藉由頂膠26與底板10黏合。一般而言,頂膠26及底膠28並不溢入間隔件24通孔242而接觸通孔242的側壁242a或發光件22。於本實施例中,頂膠26於上表面244的塗佈範圍如圖1中影線區域所示,相當於底板10於上表面244的投影區域。黏合後,頂膠26不會露出;亦即底板10及間隔件24均能完全遮蓋頂膠26。又,間隔件24的下表面246於垂直方向D1上可完全落於驅動電路板20的上表面202,故底膠28塗滿整個間隔件24下表面246上對應發光件22以外的區域,或者說底膠28塗滿整個間隔件24下表面246上對應通孔242以外的區域。同樣的,黏合後,底膠28不會露出;亦即驅動電路板20及間隔件24均能完全遮蓋底膠28。但實作上不以此為限。此外,於圖4所示之變化例中,頂膠 26'(其厚度誇張繪示於圖中)呈網格塗佈於間隔件24的上表面244上;其中,黏合後,頂膠26'仍為底板10完全遮蓋。於實作上,網格的樣式不以圖4所示的為限。網格塗佈有利於頂膠26'的塗佈裕度,可避免頂膠26'自間隔件24與底板10之間溢出,而與干擾其他構件的作動(例如接觸到升降機構14的支架)或組裝(例如接觸到發光按鍵結構1的外殼(未繪示於圖中))。 In practice, the spacer 24 can first be coated with a top glue 26 and a bottom glue 28 on its upper surface 244 and lower surface 246, respectively. The spacer 24 is then bonded to the driver circuit board 20 via the bottom glue 28. Finally, the spacer 24 is bonded to the base plate 10 via the top glue 26. Generally speaking, the top glue 26 and bottom glue 28 do not overflow into the through hole 242 of the spacer 24 and contact the sidewall 242a of the through hole 242 or the light-emitting element 22. In this embodiment, the coating area of the top glue 26 on the upper surface 244 is shown as the hatched area in Figure 1, which corresponds to the projection area of the base plate 10 on the upper surface 244. After bonding, the top adhesive 26 is not exposed; that is, the bottom plate 10 and the spacer 24 are completely covered by the top adhesive 26. Furthermore, the bottom surface 246 of the spacer 24 can completely fall on the top surface 202 of the driver circuit board 20 in the vertical direction D1. Therefore, the bottom adhesive 28 is applied to the entire area of the bottom surface 246 of the spacer 24 outside the area corresponding to the light-emitting element 22, or in other words, the bottom adhesive 28 is applied to the entire area of the bottom surface 246 of the spacer 24 outside the area corresponding to the through hole 242. Similarly, after bonding, the bottom adhesive 28 is not exposed; that is, the driver circuit board 20 and the spacer 24 are completely covered by the bottom adhesive 28. However, this is not a limitation in practice. Furthermore, in the variation shown in Figure 4 , the top adhesive 26' (its thickness is shown exaggerated in the figure) is applied in a grid pattern on the upper surface 244 of the spacer 24. After bonding, the top adhesive 26' still completely covers the base plate 10. In practice, the grid pattern is not limited to that shown in Figure 4 . The grid pattern facilitates the application of the top adhesive 26', preventing it from overflowing from between the spacer 24 and the base plate 10 and interfering with the operation of other components (e.g., contact with the bracket of the lift mechanism 14) or assembly (e.g., contact with the outer casing of the illuminated key structure 1 (not shown)).
此外,如圖4所示,上表面244具有環狀淨空邊緣244a,圍繞通孔242周圍。環狀淨空邊緣244a上未有頂膠26'(即無膠淨空邊緣),此可避免頂膠26'自間隔件24與底板10之間溢出而進入間隔件24的通孔242或底板10的開孔104。又,上表面244具有淨空外緣244b。淨空外緣244b上亦未有頂膠26',此可避免頂膠26'自間隔件24與底板10之間向外溢出。同理,於圖5所示之變化例中,底膠28'(其厚度誇張繪示於圖中)呈網格塗佈於間隔件24的下表面246上。下表面246具有環狀淨空邊緣246a及淨空外緣246b,環狀淨空邊緣246a圍繞通孔242周圍。環狀淨空邊緣246a上未有底膠28',淨空外緣246b上亦未有底膠28'。底膠28'的網格塗佈亦具如前述頂膠26'網格塗佈的效果,不另贅述。另外,於實作上,頂膠及底膠亦可呈離散的點塗佈於間隔件24的上表面244及下表面246上,同樣能使間隔件24結合至底板10及驅動電路板20。再者,由於發光按鍵結構的薄型化趨勢,發光件22與鍵帽12之間的距離逐漸縮小。當發光件22是多顆不同顏色的發光二極體組合時,就白光或特定色光而言,有可能因為發光件22與鍵帽12之間的距離太小,而造成混光距離不足。因此調整間隔件24的厚度,或者調整間隔件24/頂膠26(26')/底膠28(28')三者的總厚度,有助於調整混光距離,使得發光件22發出的多彩色光可有充足的混光距離,可以在穿過鍵帽12出光前,達到目標色光的混光效果。對發光件22的保護效果而言,間隔件24/頂膠 26(26')/底膠28(28')三者的總厚度(自驅動電路板20頂面起算,下同),或說通孔242的側壁242a高度加上頂膠26(26')厚度與底膠28(28')厚度,應該大於或等於發光件22的高度。 Furthermore, as shown in FIG4 , the upper surface 244 has an annular clear edge 244a surrounding the through-hole 242. The annular clear edge 244a is free of the top glue 26' (i.e., there is no clear edge), which prevents the top glue 26' from overflowing from between the spacer 24 and the base plate 10 and entering the through-hole 242 of the spacer 24 or the opening 104 of the base plate 10. Furthermore, the upper surface 244 has a clear outer edge 244b. The clear outer edge 244b is also free of the top glue 26', which prevents the top glue 26' from overflowing from between the spacer 24 and the base plate 10. Similarly, in the variation shown in FIG5 , primer 28 ′ (its thickness is shown exaggerated in the figure) is applied in a grid pattern on the lower surface 246 of the spacer 24. Lower surface 246 has an annular clear edge 246 a and a clear outer edge 246 b. Annular clear edge 246 a surrounds through-hole 242. There is no primer 28 ′ on annular clear edge 246 a, nor on clear outer edge 246 b. The grid pattern of primer 28 ′ also produces the same effects as the grid pattern of top glue 26 ′ described above, and will not be further described. Alternatively, in practice, the top and bottom adhesives can be applied as discrete dots on the upper and lower surfaces 244 and 246 of the spacer 24, similarly bonding the spacer 24 to the base plate 10 and driver circuit board 20. Furthermore, with the trend toward thinner light-emitting key structures, the distance between the light-emitting element 22 and the keycap 12 is gradually decreasing. When the light-emitting element 22 is a combination of multiple LEDs of different colors, the distance between the light-emitting element 22 and the keycap 12 may be too small, resulting in insufficient light mixing distance for white light or a specific color. Therefore, adjusting the thickness of the spacer 24, or adjusting the total thickness of the spacer 24/top glue 26 (26')/bottom glue 28 (28'), helps adjust the light mixing distance so that the multi-colored light emitted by the light-emitting element 22 can have a sufficient light mixing distance and can achieve the target color light mixing effect before passing through the key cap 12. In terms of the protection effect of the light-emitting element 22, the total thickness of the spacer 24/top glue 26 (26')/bottom glue 28 (28') (starting from the top surface of the driver circuit board 20, the same below), or the height of the side wall 242a of the through hole 242 plus the thickness of the top glue 26 (26') and the thickness of the bottom glue 28 (28'), should be greater than or equal to the height of the light-emitting element 22.
請回到圖1至圖3。於本實施例中,發光按鍵結構1還包含透光覆蓋結構30,其覆蓋發光件22。發光件22可為例如但不限於發光二極體。發光件22自頂面222發光(即朝上發光)。發光件22具有側面224(即鄰接頂面222且圍繞發光件22之側壁面)。透光覆蓋結構30同時覆蓋發光件22的頂面222及側面224及驅動電路板20的上表面202,使得透光覆蓋結構30同時具有調制由發光件22發射的光線及固定發光件22於驅動電路板20上的效果;其中,透光覆蓋結構30位於頂面222上方之結構可視為光調制部(以虛線框表示於圖3中),用以調制由發光件22發射的光線。此光調制部具有朝上之凸部,其具有聚光效果;但實作上不以此為限。於本實施例中,驅動電路板20的電路204的連接墊206露出於間隔件24的通孔242,發光件22電性連接於連接墊206上。透光覆蓋結構30同時覆蓋連接墊206及自通孔242露出的電路204部分,使得透光覆蓋結構30還具有靜電放電防護效果。 Returning to Figures 1 to 3 , in this embodiment, the light-emitting key structure 1 further includes a transparent cover structure 30 that covers the light-emitting element 22 . The light-emitting element 22 may be, for example, but not limited to, a light-emitting diode. The light-emitting element 22 emits light from a top surface 222 (i.e., emits light upward). The light-emitting element 22 has a side surface 224 (i.e., a sidewall surface adjacent to and surrounding the top surface 222 ). The transparent cover structure 30 covers the top surface 222 and side surfaces 224 of the light-emitting element 22, as well as the upper surface 202 of the driver circuit board 20. This allows the transparent cover structure 30 to simultaneously modulate the light emitted by the light-emitting element 22 and secure the light-emitting element 22 to the driver circuit board 20. The portion of the transparent cover structure 30 above the top surface 222 can be considered a light modulating portion (shown by a dashed frame in FIG. 3 ), which modulates the light emitted by the light-emitting element 22. This light modulating portion has an upwardly facing protrusion that provides a light-concentrating effect, but this is not a limitation in practice. In this embodiment, the connection pads 206 of the circuit 204 of the driver circuit board 20 are exposed through the through-holes 242 of the spacer 24, and the light-emitting element 22 is electrically connected to the connection pads 206. The transparent cover structure 30 covers both the connection pads 206 and the portion of the circuit 204 exposed through the through-holes 242, thus providing electrostatic discharge protection.
此外,於本實施例中,透光覆蓋結構30的最高點大致等於底板10的底面102,可避免與發光按鍵結構1內位於底板10上方之其他構件產生結構干涉。透光覆蓋結構30亦可低於底面102。又,於實作上,透光覆蓋結構30可透過點膠(例如於間隔件24固定於驅動電路板20上後)或其他的方式(例如以另外的構件組裝至發光件22)實現。另外,發光按鍵結構1於實作上亦可不具有覆蓋發光件22的透光覆蓋結構30,此時發光件22的頂面222在高度上亦可等於底板10的底面102。 Furthermore, in this embodiment, the highest point of the light-transmitting cover structure 30 is approximately equal to the bottom surface 102 of the base plate 10, thereby avoiding structural interference with other components within the light-emitting key structure 1 located above the base plate 10. The light-transmitting cover structure 30 may also be lower than the bottom surface 102. Furthermore, in practice, the light-transmitting cover structure 30 may be implemented by dispensing glue (for example, after the spacer 24 is fixed to the driver circuit board 20) or by other means (for example, by assembling it to the light-emitting element 22 using a separate component). Furthermore, the light-emitting key structure 1 may also be implemented without the light-transmitting cover structure 30 covering the light-emitting element 22. In this case, the top surface 222 of the light-emitting element 22 may also be at the same height as the bottom surface 102 of the base plate 10.
於本實施例中,透光覆蓋結構30包含第一覆蓋層302及第二覆蓋層304。第一覆蓋層302設置於頂面222上,第二覆蓋層304設置於第一覆蓋層302上。其中,第一覆蓋層302同時覆蓋發光件22的頂面222及側面224及連接墊206;第二覆蓋層304相對於頂面222設置於第一覆蓋層302上,但實作上不以此為限。例如,第二覆蓋層304覆蓋整個第一覆蓋層302。再者,於實作上,第一覆蓋層302或第二覆蓋層304可為光波長轉換層,例如但不限於其包含螢光粉、量子點。另外,透光覆蓋結構30於實作上亦得為單一層結構,或是多層的結構。 In this embodiment, the light-transmitting cover structure 30 includes a first cover layer 302 and a second cover layer 304. The first cover layer 302 is disposed on the top surface 222, and the second cover layer 304 is disposed on the first cover layer 302. The first cover layer 302 covers the top surface 222, side surfaces 224, and connection pads 206 of the light-emitting element 22. The second cover layer 304 is disposed on the first cover layer 302 relative to the top surface 222, but this is not a limitation in practice. For example, the second cover layer 304 may cover the entire first cover layer 302. Furthermore, in practice, the first cover layer 302 or the second cover layer 304 can be a wavelength conversion layer, such as, but not limited to, a layer containing phosphor or quantum dots. Furthermore, the transparent cover structure 30 can also be a single-layer structure or a multi-layer structure.
此外,於本實施例中,透光覆蓋結構30未完全充滿通孔242,使得透光覆蓋結構30與通孔242的側壁242a間存有空隙。如圖3所示,透光覆蓋結構30與通孔242的側壁242a之間形成空氣隔牆,圍繞側面224;但實作上不以此為限。例如,於圖6所示之變化例中,通孔242'的側壁242b能反射光線且呈開口朝上(即朝向底板10的開孔104)的杯狀結構,此有助於將發光件22發射的光線導向朝上行進。於本實施例中,側壁242b整體為凹面。但實作上不以此為限。例如,側壁242c為錐面(如圖7所示);又例如,側壁242d為階梯狀表面(如圖8所示);又例如,側壁可為其他能朝上導引光線之結構。前述凹面、錐面、階梯狀表面實作上可透過熱壓成型而實現。此外,如圖6所示,透光覆蓋結構30a充滿通孔242'且大致與底板10的底面102共面,但實作上不以此為限。例如,透光覆蓋結構30b具有朝上之凸部(如圖9所示)。又例如,透光覆蓋結構30c之表面上形成有微結構(例如鋸齒狀結構,如圖10所示)。同樣的,前述透光覆蓋結構30a及透光覆蓋結構30b亦可為多層結構,不待贅述。透光覆蓋結構30a及透光覆蓋結構30b之輪廓實作上亦可透過熱壓成型而實現。對發光件22的保護效果而言, 間隔件24/頂膠26(26')/底膠28(28')三者的總厚度,或說通孔242的側壁242a的高度加上頂膠26(26')厚度與底膠28(28')厚度的總和,應該大於或等於發光件22高度加上透光覆蓋結構30(或透光覆蓋結構30a/30b)位於發光件22上方區域厚度的總和。 Furthermore, in this embodiment, the light-transmitting cover structure 30 does not completely fill the through hole 242, resulting in a gap between the light-transmitting cover structure 30 and the sidewall 242a of the through hole 242. As shown in FIG3 , an air barrier is formed between the light-transmitting cover structure 30 and the sidewall 242a of the through hole 242, surrounding the side surface 224; however, this is not a limitation in practice. For example, in the variation shown in FIG6 , the sidewall 242b of the through hole 242′ is capable of reflecting light and is in the form of a cup-shaped structure with an opening facing upward (i.e., toward the opening 104 of the base plate 10). This helps guide the light emitted by the light-emitting element 22 upward. In this embodiment, the sidewall 242b is entirely concave. However, this is not a limitation in practice. For example, the side wall 242c is a cone (as shown in FIG7 ); for another example, the side wall 242d is a stepped surface (as shown in FIG8 ); for another example, the side wall may be other structures that can guide light upward. The aforementioned concave surface, cone surface, and stepped surface can be realized by hot pressing in practice. In addition, as shown in FIG6 , the light-transmitting covering structure 30a is filled with through holes 242 ' and is roughly coplanar with the bottom surface 102 of the base plate 10, but is not limited to this in practice. For example, the light-transmitting covering structure 30b has an upward convex portion (as shown in FIG9 ). For another example, a microstructure (such as a saw-tooth structure, as shown in FIG10 ) is formed on the surface of the light-transmitting covering structure 30c. Similarly, the aforementioned light-transmitting covering structure 30a and light-transmitting covering structure 30b can also be multi-layer structures, which will not be elaborated. The outlines of the light-transmitting covering structure 30a and light-transmitting covering structure 30b can also be realized through hot pressing. In terms of the protective effect of the light-emitting element 22, the total thickness of the spacer 24/top glue 26 (26')/bottom glue 28 (28'), or the height of the side wall 242a of the through hole 242 plus the thickness of the top glue 26 (26') and the thickness of the bottom glue 28 (28'), should be greater than or equal to the height of the light-emitting element 22 plus the total thickness of the light-transmitting covering structure 30 (or the light-transmitting covering structure 30a/30b) located above the light-emitting element 22.
另外,如圖1至圖3所示,於發光按鍵結構1中,彈性復位件18可透光,使得即使發光件22位於彈性復位件18下方,發光件22發射的光線仍能朝向鍵帽12行進,以對鍵帽12的透光部120(以虛線框表示於圖1及圖2中;例如數字、符號、字母、文字、圖形或其組合等等)提供所有的背光。此外,於本實施例中,發光件22自頂面222發光,但實作上不以此為限。例如,發光件22亦可為側發光,搭配呈杯狀結構的通孔側壁(例如側壁242b~d),仍可效地導引發光件22發射的光線朝向鍵帽12行進。 Furthermore, as shown in Figures 1 through 3 , in the luminous key structure 1 , the elastic reset element 18 is translucent. This allows light emitted by the luminous element 22 to travel toward the keycap 12 even when the luminous element 22 is located below the elastic reset element 18 , thereby providing full backlighting for the translucent portion 120 of the keycap 12 (indicated by a dashed frame in Figures 1 and 2 ; e.g., numbers, symbols, letters, text, graphics, or combinations thereof). Furthermore, in this embodiment, the luminous element 22 emits light from the top surface 222 , but this is not a limitation. For example, the luminous element 22 can also be side-emitting, and in combination with cup-shaped through-hole sidewalls (e.g., sidewalls 242b-d), the light emitted by the luminous element 22 can still be effectively guided toward the keycap 12 .
請參閱圖1,對於單個薄型的發光按鍵1,其專用的發光件22建構成非常靠近鍵帽12,發光件22只需低照度即可照亮鍵帽12。然而,雖成功地降低功耗,但整個鍵帽12的照明均勻性可能成為顯現的議題。例如,鍵帽12的內側(即位於鍵帽12的中間區域的)透光部120可能具有最亮的強度,而四個角落的透光部120可能暗得多。 Referring to Figure 1 , for a single, thin, illuminated key 1, its dedicated light-emitting element 22 is constructed very close to the keycap 12. Only low illumination is required to illuminate the keycap 12. However, while this successfully reduces power consumption, uniform illumination across the entire keycap 12 can become a significant issue. For example, the light-transmitting portion 120 on the inner side of the keycap 12 (i.e., in the center area of the keycap 12) may have the brightest intensity, while the light-transmitting portions 120 at the four corners may be much dimmer.
請參閱圖11,其為一變化實施例的發光按鍵結構的截面圖。圖11中具低照度的發光件22設置在間隔件24的單個大通孔242內。發光件22垂直對應底板10的其中一個開孔104或104'。單個通孔242的尺寸可以與鍵帽12的大部分的投影區域重疊。單個通孔242的尺寸足以與圖1中的底板10的四個角落的開孔104'和內開孔104中的至少兩個或多個連通。換言之,大通孔242與底板10的多個肋部106的垂直投影重疊。或者,單個通孔242至少部分地與四個角落的 開孔104'中的至少一個重疊,而且還至少部分地與底板10的內開孔104重疊。當然,單個通孔242至少部分地與底板10的一個或多個肋部106重疊。同樣地,透光覆蓋結構30包括第一覆蓋層302和第二覆蓋層304。第一覆蓋層302和第二覆蓋層304都可以是透光的。或者,第一覆蓋層302是透光的,而第二覆蓋層304可以是至少部分透光的,部分光被吸收或反射。塊狀第一覆蓋層302不僅設置於發光件22的頂面222上,且至少覆蓋了通孔242的大部分以及通孔242內的驅動電路板20的頂面,使得第一覆蓋層302至少部分地與底板10的四個角落的開孔104'和內開孔104的每一個的垂直投影重疊。第二覆蓋層304設置在第一覆蓋層302上並對應於發光件22,且第二覆蓋層304至少部分地與內側的開孔104的垂直投影重疊。換言之,第二覆蓋層304設置於發光件22與底板10的開孔104或104'之間,且垂直對應發光件22與底板10的開孔104或104'。第二覆蓋層304的直徑大於發光件22的直徑,也可以小於內側的開孔104的直徑,以允許光線通過底板10的肋部106與第二覆蓋層304間的間隙。在變化實施例中,第二覆蓋層304可以具有與內側的開孔104相同的直徑。第一覆蓋層302和第二覆蓋層304可以都至少部分地透光,以允許發光件22所發出的光通過。第一覆蓋層302可以由高透光性、可固化凝膠材料製成,以允許光在第一覆蓋層302本身內傳遞。在某些條件下(例如固化第一覆蓋層302以達到光滑、堅硬和平坦的表面),部分光線可以在第一覆蓋層302內部實現全內反射,而且允許光線在其中橫向傳播,從而減少穿過底板內側的開孔104的光線,且發光件22的大部分光可以廣泛地擴散到底板10的所有四個角落的開孔104'和內側的開孔104的垂直投影。因此,穿過鍵帽12的四個角落的透光部120的光線具有足以與內側的透光部120相近的照度,從而實現鍵帽12的所有透光部120的照度均勻。 Please refer to Figure 11, which is a cross-sectional view of a light-emitting key structure according to a modified embodiment. In Figure 11, the low-illumination light-emitting element 22 is disposed within a single large through-hole 242 of the spacer 24. The light-emitting element 22 corresponds vertically to one of the openings 104 or 104' of the base plate 10. The size of the single through-hole 242 can overlap with most of the projected area of the key cap 12. The size of the single through-hole 242 is sufficient to communicate with at least two or more of the openings 104' and the inner opening 104 at the four corners of the base plate 10 in Figure 1. In other words, the large through-hole 242 overlaps with the vertical projections of the multiple ribs 106 of the base plate 10. Alternatively, a single through hole 242 at least partially overlaps with at least one of the four corner openings 104' and also at least partially overlaps with the inner opening 104 of the base plate 10. Of course, a single through hole 242 at least partially overlaps with one or more ribs 106 of the base plate 10. Similarly, the light-transmitting cover structure 30 includes a first cover layer 302 and a second cover layer 304. Both the first cover layer 302 and the second cover layer 304 can be light-transmitting. Alternatively, the first cover layer 302 can be light-transmitting, while the second cover layer 304 can be at least partially light-transmitting, absorbing or reflecting some of the light. The block-shaped first cover layer 302 is not only disposed on the top surface 222 of the light-emitting element 22, but also covers at least a majority of the through-hole 242 and the top surface of the driver circuit board 20 within the through-hole 242. This ensures that the first cover layer 302 at least partially overlaps with the vertical projections of each of the four corner openings 104' and the inner opening 104 of the base plate 10. A second cover layer 304 is disposed on the first cover layer 302 and corresponds to the light-emitting element 22. The second cover layer 304 at least partially overlaps with the vertical projection of the inner opening 104. In other words, the second cover layer 304 is disposed between the light-emitting element 22 and the opening 104 or 104' of the base plate 10, and is perpendicular to the light-emitting element 22 and the opening 104 or 104' of the base plate 10. The diameter of the second cover layer 304 is larger than the diameter of the light-emitting element 22, but can also be smaller than the diameter of the inner opening 104 to allow light to pass through the gap between the rib 106 of the base plate 10 and the second cover layer 304. In a variant embodiment, the second cover layer 304 can have the same diameter as the inner opening 104. Both the first cover layer 302 and the second cover layer 304 can be at least partially light-transmissive to allow light emitted by the light-emitting element 22 to pass through. The first cover layer 302 can be made of a highly translucent, curable gel material to allow light to propagate within the first cover layer 302. Under certain conditions (e.g., curing the first cover layer 302 to achieve a smooth, hard, and flat surface), some light can be totally internally reflected within the first cover layer 302, allowing the light to propagate laterally therein, thereby reducing the amount of light that passes through the openings 104 on the inner side of the base plate. The majority of the light from the light-emitting element 22 can be widely diffused to the openings 104' at all four corners of the base plate 10 and the vertical projection of the openings 104 on the inner side. Therefore, the light passing through the light-transmitting portions 120 at the four corners of the keycap 12 has an illumination level comparable to that of the light-transmitting portions 120 on the inner side, thereby achieving uniform illumination across all light-transmitting portions 120 of the keycap 12.
第二覆蓋層304可由塑料片或油墨塗層實現,其設置在第一覆蓋層302上且與發光件22對齊。參閱圖12A、圖12B和圖12C,每個是根據本發明的變化實施例的第二覆蓋層304的示例圖案示意圖。可以應用各種透光圖案設計來判定第二覆蓋層304的透光效果。在圖12A中,第二覆蓋層304為具有兩條或更多條平行線組彼此對齊相交的圖案。在圖12B中,第二覆蓋層304由同心的圓或同心的橢圓構成。線和線組的寬度和密度是可調整的,以改變第二覆蓋層304的透光率。如圖12C所示,第二覆蓋層304為由多個網點整合而成的圖案,其中每個網點的形狀和大小以及網點之間的間隔也可用於調整第二覆蓋層304的透光率。無論第二覆蓋層304的透光率、反射率和吸收率為何,第二覆蓋層304至少部分地阻擋(反射或吸收)來自發光件22的光線往底板10的對應的上方開孔104傳遞,從而降低鍵帽12對應的內側的透光部120的發光強度。 The second covering layer 304 can be implemented by a plastic sheet or an ink coating, which is disposed on the first covering layer 302 and aligned with the light-emitting element 22. Referring to Figures 12A, 12B, and 12C, each is a schematic diagram of an example pattern of the second covering layer 304 according to a variant embodiment of the present invention. Various light-transmitting pattern designs can be applied to determine the light-transmitting effect of the second covering layer 304. In Figure 12A, the second covering layer 304 is a pattern having two or more parallel line groups aligned and intersecting with each other. In Figure 12B, the second covering layer 304 is composed of concentric circles or concentric ellipses. The width and density of the lines and line groups are adjustable to change the light transmittance of the second covering layer 304. As shown in Figure 12C, the second cover layer 304 is a pattern formed by integrating multiple dots. The shape and size of each dot, as well as the spacing between dots, can also be used to adjust the light transmittance of the second cover layer 304. Regardless of the transmittance, reflectivity, and absorptivity of the second cover layer 304, the second cover layer 304 at least partially blocks (reflects or absorbs) light from the light-emitting element 22 from transmitting to the corresponding upper opening 104 of the base plate 10, thereby reducing the light intensity of the corresponding inner light-transmitting portion 120 of the keycap 12.
回到圖11,透光覆蓋結構30可被設置為部分進入底板10的開孔104,並且部分留在底板10的底面102之下。圖4、圖5中所示的頂膠26(26')和底膠28(28')(在圖11中省略)可以分別適用於圖11的間隔件24的頂部和底部。因此,間隔件24、頂膠26(26')和底膠28(28')的總厚度大於等於發光件22的高度與發光件22上方的透光覆蓋結構30的第一覆蓋層302的厚度之和。在圖11中,儘管第二覆蓋層304高於底板10的底面並進入開孔104,但仍有可能通過減少透光覆蓋結構30的厚度,或增加間隔件24、頂膠26(26')和底膠28(28')中的至少一個的厚度,來降低第二覆蓋層304和整個透光覆蓋結構30,以保持與底板10的底面在相同的高度或保持在其下方。在這種情況下,間隔件24、頂膠26(26')和底膠28(28')的總厚度大於等於發光件22的高度與發光件22上方的透光覆蓋結構30的厚度之和。 Returning to FIG11 , the light-transmitting cover structure 30 can be configured to partially enter the opening 104 of the base plate 10 and partially remain below the bottom surface 102 of the base plate 10. The top glue 26 (26') and bottom glue 28 (28') shown in FIG4 and FIG5 (omitted in FIG11 ) can be applied to the top and bottom of the spacer 24 of FIG11 , respectively. Therefore, the total thickness of the spacer 24, the top glue 26 (26'), and the bottom glue 28 (28') is greater than or equal to the sum of the height of the light-emitting element 22 and the thickness of the first cover layer 302 of the light-transmitting cover structure 30 above the light-emitting element 22. In FIG11 , although the second cover layer 304 is higher than the bottom surface of the base plate 10 and enters the opening 104, it is still possible to lower the second cover layer 304 and the entire light-transmitting cover structure 30 by reducing the thickness of the light-transmitting cover structure 30 or increasing the thickness of at least one of the spacer 24, the top glue 26 (26'), and the bottom glue 28 (28') to maintain the same height as or below the bottom surface of the base plate 10. In this case, the total thickness of the spacer 24, the top glue 26 (26'), and the bottom glue 28 (28') is greater than or equal to the sum of the height of the light-emitting element 22 and the thickness of the light-transmitting cover structure 30 above the light-emitting element 22.
請參閱圖13,其為本發明另一變化實施例的發光按鍵結構1的截面圖。第二覆蓋層304可以包括將光反射回第一覆蓋層的反射層。選擇性地,第二覆蓋層304可以包括兩個塗層,例如上吸光層和底反射層。如果需要,上吸光層的直徑可以小於底反射層的直徑,以允許一定比例的非反射光穿過。反射性的第二覆蓋層304將光更好地反射回第一覆蓋層302,以重新用於照明所有內側的透光部120和角落的透光部120。參閱圖4及圖13,間隔件24的上表面244可具有環狀淨空邊緣244a,其圍繞於間隔件24的通孔242的周邊。環狀淨空邊緣244a無頂膠26',其能够防止頂膠26'溢流進入間隔件24的通孔242或底板10的開孔104。同樣地,參閱圖5和圖13,間隔件24的下表面246可以具有圍繞間隔件24的通孔242周邊的環狀淨空邊緣246a(圖13中省略)。環狀淨空邊緣246a無底膠28',以避免底膠28'進入通孔242。 Please refer to Figure 13, which is a cross-sectional view of the light-emitting key structure 1 of another variant embodiment of the present invention. The second cover layer 304 may include a reflective layer that reflects light back to the first cover layer. Optionally, the second cover layer 304 may include two coating layers, such as an upper light-absorbing layer and a bottom reflective layer. If necessary, the diameter of the upper light-absorbing layer may be smaller than the diameter of the bottom reflective layer to allow a certain proportion of non-reflected light to pass through. The reflective second cover layer 304 better reflects light back to the first cover layer 302 to be reused to illuminate all inner light-transmitting portions 120 and the light-transmitting portions 120 in the corners. Referring to Figures 4 and 13 , the upper surface 244 of the spacer 24 may have an annular clear edge 244a surrounding the through-hole 242 of the spacer 24. The annular clear edge 244a is free of the top glue 26', which prevents the top glue 26' from overflowing into the through-hole 242 of the spacer 24 or the opening 104 of the base plate 10. Similarly, referring to Figures 5 and 13 , the lower surface 246 of the spacer 24 may have an annular clear edge 246a (omitted in Figure 13 ) surrounding the through-hole 242 of the spacer 24. The annular clear edge 246a is free of the bottom glue 28' to prevent the bottom glue 28' from entering the through-hole 242.
在圖1和圖13中,底板10包括肋部106,肋部106分別將四個角落的開孔104'與內側的開孔104隔開。在某些情況下,我們發現肋部106實際上阻擋了光線。肋部106不能有效地如金屬材料向下反射光線以讓光線有第二次機會反射回發光按鍵1的內部,然後導致照度損失。因此,於一些實施例中,底板10的肋部106對整個鍵帽12的照明一致性貢獻度低,可進行進一步的調整。在圖13中,顯示三個第二覆蓋層304。如果第一覆蓋層302與至少兩個開孔104或104'的垂直投影重疊,而且也與至少兩個肋部106的垂直投影重疊,這有助於提升照明一致性。兩個橫向第二覆蓋層304中的每個不僅分別覆蓋部分第一覆蓋層302的上方,而且在底板10的對應肋部106與第一覆蓋層302之間屏蔽。同理,兩個橫向第二覆蓋層304可以是反射性的,以分別將光反射回第一覆蓋層。因此,朝向肋部106的光可被反射且回收到第一覆蓋層302以進一步重複使 用。此外,在另一個衍生示例中,底板10的肋部下方的第二覆蓋層304可以通過塗覆在底面的第二覆蓋層304來實現,而不是直接塗覆在第一覆蓋層302的頂面。 In Figures 1 and 13 , the base plate 10 includes ribs 106 that separate the four corner openings 104' from the inner openings 104. In some cases, we have found that the ribs 106 actually block light. The ribs 106 do not effectively reflect light downward like metal does, allowing it to reflect back into the interior of the illuminated key 1 a second time, resulting in a loss of illumination. Therefore, in some embodiments, the ribs 106 of the base plate 10 contribute little to the uniformity of illumination across the entire keycap 12 and can be further adjusted. In Figure 13 , three second cover layers 304 are shown. If the first cover layer 302 overlaps the vertical projections of at least two openings 104 or 104' and also overlaps the vertical projections of at least two ribs 106, this helps improve lighting uniformity. Each of the two transverse second cover layers 304 not only covers a portion of the first cover layer 302 but also shields the first cover layer 302 from the corresponding rib 106 of the base plate 10. Similarly, the two transverse second cover layers 304 can be reflective to reflect light back toward the first cover layer. Thus, light directed toward the ribs 106 can be reflected and recycled back into the first cover layer 302 for further reuse. Furthermore, in another derivative example, the second covering layer 304 below the ribs of the base plate 10 can be implemented by coating the second covering layer 304 on the bottom surface, rather than directly coating it on the top surface of the first covering layer 302.
參閱圖13,光的再利用對於低照度的發光件22是重要的。為了更好地再利用從第二覆蓋層304反射到第一覆蓋層302的光,驅動電路板20包括設置在驅動電路板20的頂面的多個反射件208,且多個反射件208對應於底板10的內側的開孔104和角落的開孔104'。第一覆蓋層302覆蓋這些反射件208,即反射件208位於第一覆蓋層302的下方。因此,照亮鍵帽12的角落的透光部120的光線增加,以提高整個鍵帽12的照明均勻度。在另一個實施例中,圖13中所有的多個反射件208整合成一個器件,以得到更好的橫向透光性能。或者,除了圖13的多個反射件208以外,額外較大的底反射件208可圍繞發光件22且覆蓋通孔242內的驅動電路板20的頂面,而所有較小反射件208設置在較大的底反射件208上。 Referring to FIG. 13 , light recycling is crucial for low-light emitting elements 22. To better recycle light reflected from the second cover layer 304 to the first cover layer 302, the driver circuit board 20 includes multiple reflectors 208 disposed on its top surface. These reflectors 208 correspond to the inner openings 104 and the corner openings 104' of the base plate 10. The first cover layer 302 covers these reflectors 208, meaning the reflectors 208 are located beneath the first cover layer 302. Consequently, the amount of light illuminating the corners of the keycap 12 through the light-transmitting portion 120 is increased, improving illumination uniformity across the entire keycap 12. In another embodiment, all of the multiple reflectors 208 in FIG. 13 are integrated into a single device to achieve better lateral light transmission performance. Alternatively, in addition to the multiple reflectors 208 in FIG. 13 , an additional larger bottom reflector 208 can surround the light-emitting element 22 and cover the top surface of the driver circuit board 20 within the through hole 242, with all of the smaller reflectors 208 disposed on the larger bottom reflector 208.
參閱圖14和圖15,其分別為另一變化實施例的發光按鍵結構1的爆炸圖和截面圖。圖14和圖15與先前實施例的主要差異在於通孔242中主要是空氣且沒有充滿其他材料。此處的透光覆蓋結構30包括平坦的第一覆蓋層302和設置在平坦的第一覆蓋層302上的第二覆蓋層304。平坦的第一覆蓋層302配置在底板10與間隔件24之間。即,平坦的第一覆蓋層302覆蓋在間隔件24的通孔242上方,且覆蓋於通孔242中的發光件22的上方。平坦的第一覆蓋層302不進入通孔242中,且其也與底板10開孔104和104'中的至少兩個重疊。平坦的第一覆蓋層302仍可以由透光材料製成,而第二覆蓋層304至少部分地阻擋光線以降低鍵帽12中一個對應透光部120的發光強度。圖13中的雙層的第二覆蓋層304 同樣適用於圖15。此處,上吸光層和底反射層都可以設置在平坦的第一覆蓋層302上。或者,僅上吸光層設置在平坦的第一覆蓋層302上,而底反射層設置在平坦的第一覆蓋層302下方。本實施例的一個優點為,圖14、圖15是一種薄的、透明或半透明的片材,便於在自動製造過程中在其上印刷或塗佈一定高度的第二覆蓋層304,相較於在固化的、小得多的塊狀第一覆蓋層302(例如圖13)上形成第二覆蓋層304更容易。 Refer to Figures 14 and 15 , which are exploded views and cross-sectional views, respectively, of another alternative embodiment of the light-emitting key structure 1. The primary difference between Figures 14 and 15 and the previous embodiment is that the through-hole 242 is primarily filled with air and not with other materials. The light-transmitting cover structure 30 here includes a flat first cover layer 302 and a second cover layer 304 disposed on the flat first cover layer 302. The flat first cover layer 302 is disposed between the base plate 10 and the spacer 24. Specifically, the flat first cover layer 302 covers the through-hole 242 of the spacer 24 and also covers the light-emitting element 22 within the through-hole 242. The flat first cover layer 302 does not extend into the through-hole 242 and also overlaps at least two of the openings 104 and 104' in the base plate 10. The flat first cover layer 302 can still be made of a light-transmitting material, while the second cover layer 304 at least partially blocks light to reduce the luminous intensity of a corresponding light-transmitting portion 120 in the keycap 12. The double-layer second cover layer 304 in Figure 13 also applies to Figure 15. Here, both the upper light-absorbing layer and the bottom reflective layer can be disposed on the flat first cover layer 302. Alternatively, only the upper light-absorbing layer can be disposed on the flat first cover layer 302, while the bottom reflective layer can be disposed below the flat first cover layer 302. One advantage of this embodiment is that Figures 14 and 15 are thin, transparent or translucent sheets, making it easier to print or coat the second covering layer 304 to a certain height during automated manufacturing. This is easier than forming the second covering layer 304 on a solidified, much smaller block of the first covering layer 302 (e.g., Figure 13).
參閱圖16,其為本發明一衍生實施例的發光按鍵結構1的截面圖。對比於圖13,除了塊狀第一覆蓋層302和多個反射性的第二覆蓋層304以外,圖16中的透光覆蓋結構30還包括平坦第一覆蓋層306。平坦第一覆蓋層306可以與前述的圖14、圖15相關的實施例中說明的平坦的第一覆蓋層302相同。平坦第一覆蓋層306配置於底板10與間隔件24間,即平坦第一覆蓋層306覆蓋在間隔件24的通孔242上方,且覆蓋在通孔242中的發光件22上方。在平坦第一覆蓋層306的頂部,平坦第一覆蓋層306包括中隔膠308以與底板10黏合。平坦第一覆蓋層306的頂面還具有環狀淨空邊緣306a,圍繞所有在圖14中的角落的開孔104'的底側的周邊。此外,多個反射性第二覆蓋層304設置在平坦第一覆蓋層306上方,且位於平坦第一覆蓋層306與基板10間。多個反射性第二覆蓋層304中的其中一些被配置為對應於上述肋部106。此外,類似於圖13,為了更好地再利用從第二覆蓋層304反射到第一覆蓋層302的光,驅動電路板20包括多個點反射件208a和面反射件208。點反射件208a和面反射件208設置在驅動電路板20的頂面上,並且位於對應於底板10的內側的開孔104和角落的開孔104'。這些點反射件208a和面反射件208被塊狀第一覆蓋層302覆蓋,即位於塊狀第一覆蓋層302下方。因此,由第二覆蓋層304反射回塊狀第一覆蓋層302的光被引導到對 應於底板的角落的開孔104'的反射件208a。如此一來,鍵帽12的內側的透光部120的照度下降,而鍵帽12的角落的透光部120的照度增加,從而良好地強化整個鍵帽12的照明均勻度。 Refer to Figure 16, which is a cross-sectional view of a light-emitting key structure 1 according to a variant embodiment of the present invention. Compared to Figure 13, in addition to a blocky first cover layer 302 and a plurality of reflective second cover layers 304, the light-transmitting cover structure 30 in Figure 16 further includes a planar first cover layer 306. The planar first cover layer 306 can be the same as the planar first cover layer 302 described in the embodiments related to Figures 14 and 15 above. The planar first cover layer 306 is disposed between the base plate 10 and the spacer 24. Specifically, the planar first cover layer 306 covers the through-hole 242 of the spacer 24 and the light-emitting element 22 in the through-hole 242. On top of the flat first cover layer 306, the flat first cover layer 306 includes a spacer adhesive 308 for bonding to the base plate 10. The top surface of the flat first cover layer 306 also has a circular clear edge 306a surrounding the bottom perimeter of all corner openings 104' in Figure 14. Furthermore, a plurality of reflective second cover layers 304 are disposed above the flat first cover layer 306 and between the flat first cover layer 306 and the base plate 10. Some of the plurality of reflective second cover layers 304 are configured to correspond to the aforementioned ribs 106. Furthermore, similar to FIG13 , to better recycle light reflected from the second cover layer 304 to the first cover layer 302, the driver circuit board 20 includes a plurality of point reflectors 208a and surface reflectors 208. These point reflectors 208a and surface reflectors 208 are disposed on the top surface of the driver circuit board 20 and are located corresponding to the openings 104 on the inner side and the openings 104′ in the corners of the base plate 10. These point reflectors 208a and surface reflectors 208 are covered by the block-shaped first cover layer 302, that is, located below the block-shaped first cover layer 302. Therefore, light reflected by the second cover layer 304 back to the blocky first cover layer 302 is directed toward the reflective element 208a corresponding to the opening 104' at the corner of the base plate. This reduces the illumination of the light-transmitting portion 120 on the inner side of the keycap 12, while increasing the illumination of the light-transmitting portion 120 at the corner of the keycap 12, thereby enhancing the uniformity of illumination across the entire keycap 12.
可以有許多設置上述點反射件208a和面反射件208的方法。例如,多個平行的加強肋可以彼此對齊相交,以在其中形成菱形肋單元和菱形凹部。這些肋可以通過纏繞金屬網片形成。由於驅動電路板20的整個頂面由反射材料製成,或者在其上包括反射塗層,因此肋單元和凹部的表面具有反射性。可以將額外的高反射率塗層點填充到這些凹部的特定群組中,以將光線直接向上反射。即使沒有額外的塗層點,肋單元和凹部本身也已經是微結構,可以將光線直接反射。用非反射材料對凹部的其他部分進行平整或塗覆,可以使凹部的非平整或未塗覆區域和周圍的肋單元成為專用的反射部分,用於照亮某一透光部120。 There are many ways to arrange the above-mentioned point reflectors 208a and surface reflectors 208. For example, a plurality of parallel reinforcing ribs can be aligned and intersected with each other to form diamond-shaped rib units and diamond-shaped recesses therein. These ribs can be formed by winding a metal mesh. Since the entire top surface of the driving circuit board 20 is made of a reflective material or includes a reflective coating thereon, the surfaces of the rib units and recesses are reflective. Additional high-reflectivity coating dots can be filled into specific groups of these recesses to reflect light directly upward. Even without additional coating dots, the rib units and recesses themselves are already microstructures that can directly reflect light. By flattening or coating the rest of the recess with a non-reflective material, the uneven or uncoated area of the recess and the surrounding ribs can be transformed into dedicated reflective portions for illuminating a particular light-transmitting portion 120.
通過圖11、圖12A、圖12B、圖12C、圖13、圖14、圖15和圖16的技術方案,對於配置有專用低照度發光件22的發光按鍵1,可以良好地提高整個鍵帽12的照明均勻度。此外,光往底板10的肋部106所造成的照度損失可通過對應的反射性第二覆蓋層304來解决。此外,導入較大的塊狀第一覆蓋層302以覆蓋在間隔件24的通孔242內的發光件22,其尺寸足以與底板10的多個開孔104/104'中的至少兩個的垂直投影重疊。這種塊狀第一覆蓋層302可以在其下方具有反射件208,以將回收的光向鍵帽12角落的透光部120反射,以提高照明均勻度。還導入平坦第一覆蓋層306以配合或不配合塊狀第一覆蓋層302來應用,從而在應用低照度發光件22時優化發光按鍵結構的照明均勻度。 Through the technical solutions of Figures 11, 12A, 12B, 12C, 13, 14, 15, and 16, the illumination uniformity of the entire keycap 12 of the illuminated key 1 equipped with a dedicated low-intensity light-emitting element 22 can be significantly improved. Furthermore, the illumination loss caused by light traveling toward the ribs 106 of the base plate 10 can be addressed by the corresponding reflective second cover layer 304. Furthermore, a larger block-shaped first cover layer 302 is introduced to cover the light-emitting element 22 within the through-hole 242 of the spacer 24. Its size is sufficient to overlap the vertical projections of at least two of the multiple openings 104/104' of the base plate 10. This blocky first cover layer 302 can have a reflector 208 underneath to reflect the recovered light toward the light-transmitting portion 120 at the corner of the keycap 12, improving illumination uniformity. A flat first cover layer 306 can also be used with or without the blocky first cover layer 302, thereby optimizing illumination uniformity of the illuminated key structure when using a low-intensity light-emitting element 22.
參閱圖17,其為根據本發明另一變化例之發光按鍵結構1的截面圖。圖17與前述實施例的差異在於通孔242的尺寸小得多,以僅對應底板10的多個開孔的一部分,例如僅對應開孔104,且覆蓋結構30’的配置不同。如圖17所示,發光按鍵結構1包含底板10、鍵帽12、升降機構14、開關電路板16、彈性復位件18、驅動電路板20、發光件22及間隔件24,其與先前所述者相同或相似。舉例而言,鍵帽12設置於底板10上方,並具有多個透光部120(例如數字、符號、字母、文字、圖形或其組合)。升降機構14連接於底板10及鍵帽12之間,並用以支撐鍵帽12相對於底板10上/下移動。開關電路板16設置於鍵帽12下方,且較佳位於底板10上方。開關電路板16具有開關162。彈性復位件18對應開關162設置於鍵帽12及底板10之間。當鍵帽12被按壓時,彈性復位件18可觸發開關162。驅動電路板20、發光件22、間隔件24及覆蓋結構30’構成照射模組,其用以照射由底板10、鍵帽12、升降機構14、開關電路板16、彈性復位件18所構成的按鍵。 Referring to FIG. 17 , which is a cross-sectional view of a light-emitting key structure 1 according to another variation of the present invention, FIG. 17 differs from the aforementioned embodiment in that the through hole 242 is much smaller, corresponding to only a portion of the multiple openings of the base plate 10, for example, only corresponding to the opening 104, and the configuration of the covering structure 30' is different. As shown in FIG. 17 , the light-emitting key structure 1 includes a base plate 10, a key cap 12, a lifting mechanism 14, a switch circuit board 16, an elastic reset member 18, a drive circuit board 20, a light-emitting member 22, and a spacer 24, which are the same or similar to those previously described. For example, the key cap 12 is disposed above the base plate 10 and has a plurality of light-transmitting portions 120 (e.g., numbers, symbols, letters, text, graphics, or a combination thereof). A lifting mechanism 14 is connected between the base plate 10 and the keycap 12, supporting the keycap 12 in its upward and downward motion relative to the base plate 10. A switch circuit board 16 is disposed below the keycap 12, preferably above the base plate 10. The switch circuit board 16 includes a switch 162. A resilient reset member 18 is disposed between the keycap 12 and the base plate 10, corresponding to the switch 162. When the keycap 12 is pressed, the resilient reset member 18 triggers the switch 162. The driving circuit board 20, the light-emitting element 22, the spacer 24, and the covering structure 30' constitute an illumination module, which is used to illuminate the key formed by the base plate 10, the key cap 12, the lifting mechanism 14, the switch circuit board 16, and the elastic reset element 18.
參閱圖17及圖18,其為圖17之發光按鍵結構1的底板10的平面示意圖,底板10可由金屬沖壓而成,使得底板10具有多個肋部106,其中多個肋部106彼此連接以定義多個開孔(例如開孔104及兩個或更多個周邊開孔104’)。於此實施例,四個周邊開孔104’圍繞開孔104設置,但不限於此。於其他實施例,開孔104的一側可由一個較大的周邊開孔104’圍繞,而另一側由兩個較小的周邊開孔104’圍繞,或者由兩個較大的周邊開孔104’圍繞在兩側,或者每一側由兩個或更多個較小的周邊開孔104’圍繞。開孔104(或周邊開孔104’)較佳至少部分地對應鍵帽12的一個或更多個透光部120。於一實施例,如圖22所示,開孔104較佳對應其中一個透光部120,例如符號為「/」的透光部120b,而周邊開 孔104’對應另一個透光部120,例如符號為「?」的透光部120a。由另一觀點而言,鍵帽12的各個透光部120較佳與底板10的開孔104及104’中的一個至少部分重疊。 Referring to Figures 17 and 18 , which are schematic plan views of the base plate 10 of the luminous key structure 1 of Figure 17 , the base plate 10 can be stamped from metal, such that the base plate 10 has a plurality of ribs 106 . The ribs 106 are connected to define a plurality of openings (e.g., the opening 104 and two or more peripheral openings 104 ′). In this embodiment, four peripheral openings 104 ′ are arranged around the opening 104, but the present invention is not limited thereto. In other embodiments, the opening 104 may be surrounded on one side by a larger peripheral opening 104' and on the other side by two smaller peripheral openings 104', or on both sides by two larger peripheral openings 104', or on each side by two or more smaller peripheral openings 104'. The opening 104 (or peripheral opening 104') preferably at least partially corresponds to one or more light-transmitting portions 120 of the keycap 12. In one embodiment, as shown in FIG. 22 , the opening 104 preferably corresponds to one of the light-transmitting portions 120, such as the light-transmitting portion 120b marked with a "/", while the peripheral opening 104' corresponds to another light-transmitting portion 120, such as the light-transmitting portion 120a marked with a "?". From another perspective, each light-transmitting portion 120 of the keycap 12 preferably at least partially overlaps with one of the openings 104 and 104' of the base plate 10.
參閱圖17及圖19,其為圖17之發光按鍵結構1之覆蓋結構30’的平面示意圖,覆蓋結構30’具有島狀覆蓋部30a’。島狀覆蓋部30a’覆蓋於發光件22及間隔件24的通孔242上方。於此實施例,覆蓋結構30’可更包含框狀覆蓋部30b’,其圍繞島狀覆蓋部30a’,且島狀覆蓋部30a’延伸連接框狀覆蓋部30b’的相對兩側,以在框狀覆蓋部30b’中定義兩個可透光部306b。舉例而言,如圖22所示,框狀覆蓋部30b’圍繞鍵帽12的輪廓。換言之,框狀覆蓋部30b’較佳沿鍵帽12的輪廓連續地設置而與底板10的周邊開孔104’沒有垂直重疊,但不限於此。島狀覆蓋部30a’較佳自兩個可透光部306b的長邊的相對兩側延伸以連接框狀覆蓋部30b’,使得兩個可透光部306b圍繞設置於間隔件24的通孔242中的發光件22。 Referring to Figures 17 and 19 , which are schematic plan views of the covering structure 30' of the luminous key structure 1 of Figure 17 , the covering structure 30' includes an island-shaped covering portion 30a'. The island-shaped covering portion 30a' covers the light-emitting element 22 and the through-hole 242 of the spacer 24. In this embodiment, the covering structure 30' may further include a frame-shaped covering portion 30b' surrounding the island-shaped covering portion 30a'. The island-shaped covering portion 30a' extends to connect opposite sides of the frame-shaped covering portion 30b' to define two light-transmissive portions 306b within the frame-shaped covering portion 30b'. For example, as shown in Figure 22, the frame-shaped covering portion 30b' surrounds the outline of the keycap 12. In other words, the frame-shaped covering portion 30b' is preferably disposed continuously along the outline of the keycap 12 without vertically overlapping with the peripheral opening 104' of the base plate 10, but this is not limited to this. The island-shaped covering portion 30a' preferably extends from opposite sides of the long sides of the two light-transmitting portions 306b to connect the frame-shaped covering portion 30b', so that the two light-transmitting portions 306b surround the light-emitting element 22 disposed in the through-hole 242 of the spacer 24.
於一實施例,兩個可透光部306b的每一個較佳具有兩個或更多個角落及三個或更多個側邊,使得框狀覆蓋部30b’的各角落對應兩個可透光部306b的該些角落中的一個。舉例而言,如圖19所示,左側可透光部306b的左上角落及左下角落分別對應框狀覆蓋部30b’及鍵帽12的左上角落及左下角落。類似地,右側可透光部306b的右上角落及右下角落分別對應框狀覆蓋部30b’及鍵帽12的右上角落及右下角落。在此配置中,可改善鍵帽輪廓的照明均勻性。再者,於一實施例,島狀覆蓋部30a’在兩個可透光部306b之間的寬度較佳為可透光部306b的最長邊的長度的1/5、1/4、1/3或更多,使得在鍵帽12的中心的透光部及角落的透光部以及鍵帽12的輪廓可具有較佳的照明均勻性。 In one embodiment, each of the two light-transmissive portions 306b preferably has two or more corners and three or more sides, such that each corner of the frame-shaped cover portion 30b' corresponds to one of the corners of the two light-transmissive portions 306b. For example, as shown in FIG19 , the upper left corner and lower left corner of the left light-transmissive portion 306b correspond to the upper left corner and lower left corner of the frame-shaped cover portion 30b' and the keycap 12, respectively. Similarly, the upper right corner and lower right corner of the right light-transmissive portion 306b correspond to the upper right corner and lower right corner of the frame-shaped cover portion 30b' and the keycap 12, respectively. This configuration improves the uniformity of illumination of the keycap outline. Furthermore, in one embodiment, the width of the island-shaped covering portion 30a' between the two light-transmitting portions 306b is preferably 1/5, 1/4, 1/3, or more of the length of the longest side of the light-transmitting portion 306b. This ensures better illumination uniformity in the center and corner light-transmitting portions of the keycap 12, as well as the outline of the keycap 12.
於另一實施例(未繪示),島狀覆蓋部30a’可為獨立的覆蓋部而不連接覆蓋結構30’的其他覆蓋部。舉例而言,島狀覆蓋部30a’可設置於框狀覆蓋部30b’中而不連接框狀覆蓋部30b’,使得框狀覆蓋部30b’中形成一個環形可透光部。類似地,環形可透光部可圍繞發光件22。於又另一實施例,依據實際應用,島狀覆蓋部30a’可延伸連接框狀覆蓋部30b’的一側,以形成開環式的可透光部。換言之,島狀覆蓋部30a’可為半島形式。 In another embodiment (not shown), the island-shaped covering portion 30a' may be an independent covering portion, not connected to other covering portions of the covering structure 30'. For example, the island-shaped covering portion 30a' may be disposed within the frame-shaped covering portion 30b' without being connected thereto, thereby forming an annular light-transmitting portion within the frame-shaped covering portion 30b'. Similarly, the annular light-transmitting portion may surround the light-emitting element 22. In yet another embodiment, depending on actual application, the island-shaped covering portion 30a' may extend to connect to one side of the frame-shaped covering portion 30b' to form an open-loop light-transmitting portion. In other words, the island-shaped covering portion 30a' may be in the form of a semi-island.
參閱圖17及圖19,於一實施例,覆蓋結構30’包含第一覆蓋層302’及第二覆蓋層304’,第一覆蓋層302’用以實質反射光線,而第二覆蓋層304’用以實質阻擋光線。第一覆蓋層302’及第二覆蓋層304’中的至少一個形成島狀覆蓋部30a’,且第一覆蓋層302’及第二覆蓋層304’一起形成框狀覆蓋部30b’,但不限於此。於另一實施例,框狀覆蓋部30b’可由第一覆蓋層302’及第二覆蓋層304’中的至少一者所形成。第一覆蓋層302’及第二覆蓋層304’具有不同的透光率。第一覆蓋層302’可反射大部分的光並允許小部分的通過(或吸收小部分的光)。第二覆蓋層304’實質遮擋或吸收大部分的光,並容許小部分的光通過(或反射小部分的光)。舉例而言,於一實施例,第一覆蓋層302’可為白油墨層,第二覆蓋層304’可為黑油墨層,且兩者皆可由印刷技術形成,但不限於此。再者,覆蓋結構30’更包含平坦覆蓋層306’,第一覆蓋層302’及第二覆蓋層304’設置於平坦覆蓋層306’的同一側或兩相反側,且第一覆蓋層302’較第二覆蓋層304’靠近間隔件24。舉例而言,平坦覆蓋層306’可為可透光膜,例如聚對苯二甲酸乙二酯(PET)膜,而第一覆蓋層302’及第二覆蓋層304’設置於或印刷於平坦覆蓋層306’。於一實施例,可透光部306b較佳為平坦覆蓋層306’沒有設置第一覆蓋層302’及第二覆蓋層304’的部分。於另一實施例,可透光部306b可為平坦 覆蓋層306’沒有設置第一覆蓋層302’及第二覆蓋層304’且被切除的部分(或開口)。於一實施例,第二覆蓋層304’較第一覆蓋層302’靠近底板10(即,第一覆蓋層302’較第二覆蓋層304’靠近間隔件24)。如此一來,大部分的向上光可先被第一覆蓋層302’反射,而小部分的向上光通過第一覆蓋層302’然後被第二覆蓋層304’吸收,以有效地將向上光從垂直(朝上)方向沿橫向(或水平方向)導引傳播。 Referring to Figures 17 and 19 , in one embodiment, the cover structure 30' includes a first cover layer 302' and a second cover layer 304'. The first cover layer 302' is configured to substantially reflect light, while the second cover layer 304' is configured to substantially block light. At least one of the first cover layer 302' and the second cover layer 304' forms an island-shaped cover portion 30a', and the first cover layer 302' and the second cover layer 304' together form a frame-shaped cover portion 30b', but the present invention is not limited thereto. In another embodiment, the frame-shaped cover portion 30b' may be formed by at least one of the first cover layer 302' and the second cover layer 304'. The first cover layer 302' and the second cover layer 304' have different light transmittances. The first cover layer 302' reflects most light while allowing a small portion to pass through (or absorbing a small portion of light). The second cover layer 304' substantially blocks or absorbs most light while allowing a small portion to pass through (or reflecting a small portion of light). For example, in one embodiment, the first cover layer 302' can be a white ink layer, and the second cover layer 304' can be a black ink layer. Both can be formed using printing technology, but are not limited to this. Furthermore, the covering structure 30' further includes a flat covering layer 306'. The first covering layer 302' and the second covering layer 304' are disposed on the same side or opposite sides of the flat covering layer 306', and the first covering layer 302' is closer to the spacer 24 than the second covering layer 304'. For example, the flat covering layer 306' can be a light-transmissive film, such as a polyethylene terephthalate (PET) film, and the first covering layer 302' and the second covering layer 304' are disposed on or printed on the flat covering layer 306'. In one embodiment, the light-transmissive portion 306b is preferably the portion of the flat cover layer 306' where the first cover layer 302' and the second cover layer 304' are not disposed. In another embodiment, the light-transmissive portion 306b may be the portion (or opening) of the flat cover layer 306' where the first cover layer 302' and the second cover layer 304' are not disposed. In one embodiment, the second cover layer 304' is closer to the base plate 10 than the first cover layer 302' (i.e., the first cover layer 302' is closer to the spacer 24 than the second cover layer 304'). In this way, most of the upward light is first reflected by the first cover layer 302', while a small portion of the upward light passes through the first cover layer 302' and is then absorbed by the second cover layer 304', effectively guiding the upward light from the vertical (upward) direction to the horizontal (or horizontal) direction.
於一實施例,如圖17所示,第一覆蓋層302’及第二覆蓋層304’較佳設置於平坦覆蓋層306’的不同表面。舉例而言,第一覆蓋層302’設置於平坦覆蓋層306’的下表面(即,較靠近間隔件24),而第二覆蓋層304’設置於平坦覆蓋層306’的上表面(即,較靠近底板10),但不限於此。於另一實施例(未繪示),第一覆蓋層302’及第二覆蓋層304’可設置於平坦覆蓋層306’的同一表面。舉例而言,第一覆蓋層302’可設置於平坦覆蓋層306’的上表面,而第二覆蓋層304’設置於平坦覆蓋層306’的上表面及/或第一覆蓋層302’的上表面。選替地,第二覆蓋層304’可設置於平坦覆蓋層306’的下表面,而第一覆蓋層302’設置於平坦覆蓋層306’的下表面及/或第二覆蓋層304’的下表面。如此一來,大部分向上的光會被第一覆蓋層302’反射,而少部分通過第一覆蓋層302’被第二覆蓋層304’吸收。 In one embodiment, as shown in FIG17 , the first cover layer 302′ and the second cover layer 304′ are preferably disposed on different surfaces of the planar cover layer 306′. For example, the first cover layer 302′ is disposed on the lower surface of the planar cover layer 306′ (i.e., closer to the spacers 24), while the second cover layer 304′ is disposed on the upper surface of the planar cover layer 306′ (i.e., closer to the base plate 10), but the present invention is not limited thereto. In another embodiment (not shown), the first cover layer 302′ and the second cover layer 304′ may be disposed on the same surface of the planar cover layer 306′. For example, the first cover layer 302' can be disposed on the upper surface of the flat cover layer 306', while the second cover layer 304' can be disposed on the upper surface of the flat cover layer 306' and/or the upper surface of the first cover layer 302'. Alternatively, the second cover layer 304' can be disposed on the lower surface of the flat cover layer 306', while the first cover layer 302' can be disposed on the lower surface of the flat cover layer 306' and/or the lower surface of the second cover layer 304'. In this way, most of the upward-directed light is reflected by the first cover layer 302', while a small amount passes through the first cover layer 302' and is absorbed by the second cover layer 304'.
應注意,在圖式中(例如圖19或圖22),左影線區域為第一覆蓋層302’設置之處,而垂直影線區域為第二覆蓋層304’設置之處。當區域中同時存在左影線及垂直影線時,則該區域為第一覆蓋層302’及第二覆蓋層304’重疊設置處,且第一覆蓋層302’較第二覆蓋層304’靠近間隔件24。 Note that in the diagrams (e.g., Figure 19 or Figure 22), the left-hatched area indicates where the first cover layer 302' is located, while the vertically hatched area indicates where the second cover layer 304' is located. When both left-hatched and vertically hatched lines are present in an area, the area indicates where the first and second cover layers 302', 304' overlap, with the first cover layer 302' being closer to the spacer 24 than the second cover layer 304'.
參閱圖17,第二覆蓋層304’較佳自第一覆蓋層302’延伸而出以至少部分圍繞兩個可透光部306b中的至少一個。具體而言,島狀覆蓋部30a’對 應底板10的開孔104設置並覆蓋於發光件22上方。在兩個可透光部306b之間的區域中,第二覆蓋層304’的寬度較佳大於第一覆蓋層302’的寬度。舉例而言,第一覆蓋層302’較佳與開孔104垂直重疊且進一步延伸至肋部106,而第二覆蓋層304’與第一覆蓋層302’垂直重疊且進一步自第一覆蓋層302’延伸以與周邊開孔104’部分重疊。如圖19所示,第二覆蓋層304’界定可透光部306b的邊緣。換言之,第二覆蓋層304’的邊緣3041係作為可透光部306b的邊緣。第一覆蓋層302’的邊緣3021及第二覆蓋層304’的邊緣3041之間的區域為僅有第二覆蓋層304’設置之處,但不限於此。於其他實施例(未繪示),可透光部306b可由第一覆蓋層302’及第二覆蓋層304’中的至少一者所界定。舉例而言,第一覆蓋層302’可自第二覆蓋層304’延伸而出以圍繞可透光部306b。選替地,第一覆蓋層302’及第二覆蓋層304’可具有相同的圖案一起界定可透光部306b。 Referring to Figure 17 , the second cover layer 304' preferably extends from the first cover layer 302' to at least partially surround at least one of the two light-transmissive portions 306b. Specifically, the island-shaped cover portion 30a' is positioned corresponding to the opening 104 of the base plate 10 and covers the light-emitting element 22. In the area between the two light-transmissive portions 306b, the width of the second cover layer 304' is preferably greater than that of the first cover layer 302'. For example, the first cover layer 302' preferably vertically overlaps the opening 104 and further extends to the rib 106, while the second cover layer 304' vertically overlaps the first cover layer 302' and further extends from the first cover layer 302' to partially overlap the peripheral opening 104'. As shown in Figure 19, the second cover layer 304' defines the edge of the light-transmissive portion 306b. In other words, the edge 3041 of the second cover layer 304' serves as the edge of the light-transmissive portion 306b. The area between the edge 3021 of the first cover layer 302′ and the edge 3041 of the second cover layer 304′ is where the second cover layer 304′ is located, but this is not limited to this. In other embodiments (not shown), the light-transmissive portion 306b may be defined by at least one of the first cover layer 302′ and the second cover layer 304′. For example, the first cover layer 302′ may extend from the second cover layer 304′ to surround the light-transmissive portion 306b. Alternatively, the first cover layer 302′ and the second cover layer 304′ may have the same pattern and together define the light-transmissive portion 306b.
參閱圖17及圖20,其為圖17之發光按鍵結構1之間隔件24的平面示意圖,間隔件24可為膜狀或片狀體,其可由適當的光學材料製成,例如光學聚合物。通孔242較佳小於底板10的開孔104,而發光件22可位於通孔242中。於一實施例,間隔件24可為導光板,發光件22所發射的光從通孔242的側壁進入間隔件24。平坦覆蓋層306’較佳完全與間隔件24重疊,使得島狀覆蓋部30a’位於通孔242的正上方。間隔件24黏合於覆蓋結構30’及驅動電路板20之間。類似於前述實施例,頂膠26及底膠28分別設置於間隔件24的上表面244及下表面246,且位於通孔242的周圍。具體而言,頂膠26用以連接覆蓋結構30’及間隔件24,而底膠28用以連接間隔件24及驅動電路板20(或反射件層208)。頂膠26或底膠28可為圍繞間隔件24的通孔242的環狀黏著部,且位於可透光部306b之間。頂膠26或底膠28可由光學材料製成,其為可透光並具有比空氣更接近間隔件24的折射率。如此一來,自第一覆蓋層302’反射的光可以相當高的比例進入間隔件24,然後在間隔件24中藉由全反射傳播。 Referring to Figures 17 and 20, which are planar schematic diagrams of the spacer 24 of the light-emitting key structure 1 of Figure 17, the spacer 24 can be a film-shaped or sheet-shaped body, which can be made of a suitable optical material, such as an optical polymer. The through hole 242 is preferably smaller than the opening 104 of the base plate 10, and the light-emitting element 22 can be located in the through hole 242. In one embodiment, the spacer 24 can be a light guide plate, and the light emitted by the light-emitting element 22 enters the spacer 24 from the side wall of the through hole 242. The flat covering layer 306' is preferably completely overlapped with the spacer 24, so that the island-shaped covering portion 30a' is located directly above the through hole 242. The spacer 24 is bonded between the covering structure 30' and the driving circuit board 20. Similar to the aforementioned embodiment, top adhesive 26 and bottom adhesive 28 are disposed on the upper surface 244 and lower surface 246 of the spacer 24, respectively, and are positioned around the through-hole 242. Specifically, top adhesive 26 is used to connect the cover structure 30' and the spacer 24, while bottom adhesive 28 is used to connect the spacer 24 and the driver circuit board 20 (or the reflector layer 208). Top adhesive 26 or bottom adhesive 28 can be an annular adhesive portion surrounding the through-hole 242 of the spacer 24 and positioned between the light-transmissive portions 306b. Top adhesive 26 or bottom adhesive 28 can be made of an optical material that is light-transmissive and has a refractive index closer to that of the spacer 24 than that of air. In this way, a relatively high proportion of the light reflected from the first cover layer 302' can enter the spacer 24 and then propagate through total internal reflection in the spacer 24.
再者,間隔件24具有一個或更多個無膠淨空邊緣(例如244a或246a),其至少部分地圍繞通孔242。具體而言,頂膠26或底膠28與間隔件24 的通孔242邊緣相隔一段距離,以於其間形成環狀淨空邊緣244a或246a,即圍繞通孔242而沒有頂膠26或底膠28的區域。間隔件24可更具有擴散圖案24a,其包含多個出光部(例如微結構、出光點),用以破壞光的全反射而使光向上射出。擴散圖案24a較佳對應周邊開孔104’(或可透光部306b)設置,但不限於此。擴散圖案24a可設置於任何適當的出光位置。於一實施例,擴散圖案24a設置於間隔件24的下表面246,但不限於此。 Furthermore, the spacer 24 has one or more adhesive-free clear edges (e.g., 244a or 246a) that at least partially surround the through-hole 242. Specifically, the top adhesive 26 or bottom adhesive 28 is spaced a distance from the edge of the through-hole 242 of the spacer 24, forming an annular clear edge 244a or 246a therebetween. This is an area surrounding the through-hole 242 that is free of the top adhesive 26 or bottom adhesive 28. The spacer 24 may further have a diffusion pattern 24a comprising multiple light-emitting portions (e.g., microstructures or light-emitting points) to disrupt total internal reflection (TRI) of light and allow it to be emitted upward. The diffusion pattern 24a is preferably positioned corresponding to the peripheral opening 104' (or the light-transmissive portion 306b), but is not limited thereto. The diffusion pattern 24a can be positioned at any suitable light-emitting location. In one embodiment, the diffusion pattern 24a is positioned on the lower surface 246 of the spacer 24, but is not limited thereto.
參閱圖17及圖21,其為圖17之發光按鍵結構1之驅動電路板20的平面示意圖,驅動電路板20其上設有反射件層208,而發光件22設置於驅動電路板20並鄰近反射件層208。反射件層208用以將間隔件24的下表面246露出的光反射回間隔件24。具體而言,反射件層208可為由反射材料製成的反射膜(例如金屬箔片)、塗佈在非反射膜上的反射材料層、或摻雜有反射粒子的塑料膜(例如摻雜有反射粒子的PET膜),但不限於此。於一實施例,反射件層208可為塗佈在驅動電路板20上表面的反射塗層(例如白油墨塗層),而反射件層208的反射率較佳大於80%,但不限於此。反射件層208的開口可為穿過反射件層208的層體的通孔,或可為驅動電路板20的上表面要設置發光件22而沒有反射塗層的部分。驅動電路板20更包含一個或更多個主佈線211及一個或更多個子佈線212。舉例而言,兩個主佈線211分別提供高/低電位,而兩個子佈線212分別自兩個主佈線211延伸,使得發光件22藉由子佈線212電連接主佈線211。再者,吸光層(未繪示)可設置於反射件層208下方,並用以吸收通過反射件層208的光。 Referring to Figures 17 and 21 , which are schematic plan views of the driver circuit board 20 of the light-emitting key structure 1 of Figure 17 , a reflective layer 208 is disposed on the driver circuit board 20, and the light-emitting element 22 is disposed on the driver circuit board 20 adjacent to the reflective layer 208. The reflective layer 208 is used to reflect light exposed from the lower surface 246 of the spacer 24 back toward the spacer 24. Specifically, the reflective layer 208 can be a reflective film made of a reflective material (e.g., metal foil), a reflective material layer coated on a non-reflective film, or a plastic film doped with reflective particles (e.g., a PET film doped with reflective particles), but is not limited thereto. In one embodiment, the reflective layer 208 can be a reflective coating (e.g., a white ink coating) applied to the top surface of the driver circuit board 20. The reflectivity of the reflective layer 208 is preferably greater than 80%, but is not limited thereto. The openings in the reflective layer 208 can be through-holes extending through the reflective layer 208, or can be portions of the top surface of the driver circuit board 20 where the light-emitting elements 22 are to be disposed and which are not coated with the reflective coating. The driver circuit board 20 further includes one or more main traces 211 and one or more sub- traces 212. For example, two main wirings 211 provide high and low potentials, respectively, and two sub-wirings 212 extend from the two main wirings 211, respectively, so that the light-emitting element 22 is electrically connected to the main wirings 211 via the sub-wirings 212. Furthermore, a light-absorbing layer (not shown) can be disposed beneath the reflective layer 208 to absorb light passing through the reflective layer 208.
再者,如圖17所示,反射件層208可具有反射圖案208b,其可包括多個微結構(例如反射點),設置在反射件層208的上表面。反射圖案208b可設置遠離發光件22,並用以將光導引向上。舉例而言,反射圖案208b對應周邊開孔104’(或可透光部306b)設置,但不限於此。反射圖案208b可設置在任何適當的出光位置。於一實施例,反射圖案208b設置在反射件層208的上表面,但不限於此。 Furthermore, as shown in Figure 17 , the reflective layer 208 may have a reflective pattern 208b, which may include a plurality of microstructures (e.g., reflective dots) disposed on the top surface of the reflective layer 208. The reflective pattern 208b may be positioned away from the light-emitting element 22 and serve to direct light upward. For example, the reflective pattern 208b may be positioned corresponding to the peripheral opening 104' (or the light-transmissive portion 306b), but this is not limited to such. The reflective pattern 208b may be positioned at any suitable light-emitting location. In one embodiment, the reflective pattern 208b is disposed on the top surface of the reflective layer 208, but this is not limited to such.
從另一觀點而言,發光按鍵結構1的照射模組更包含出光圖案。出光圖案實質設置鄰近島狀覆蓋部30a’,並用以向上導引光。出光圖案包含反射件層208上的反射圖案208b及間隔件24上的擴散圖案24a。出光圖案用以向上導引光至兩個可透光部306b之至少其中一個,而後穿過底板10的至少一個周邊開孔104’。當反射圖案208b的微結構或反射點設置為在堆疊方向上(即前述實施例的垂直方向D1)與間隔件24的擴散圖案24a的出光部重疊時,可增加出光。當反射圖案208b的微結構或反射點設置為在堆疊方向上與間隔件24的擴散圖案24a的出光部不重疊時,可促進光的回收。 From another point of view, the illumination module of the light-emitting key structure 1 further includes a light-emitting pattern. The light-emitting pattern is actually arranged adjacent to the island-shaped covering portion 30a' and is used to guide light upward. The light-emitting pattern includes a reflective pattern 208b on the reflective layer 208 and a diffusion pattern 24a on the spacer 24. The light-emitting pattern is used to guide light upward to at least one of the two light-transmitting portions 306b, and then pass through at least one peripheral opening 104' of the base plate 10. When the microstructure or reflection point of the reflective pattern 208b is arranged to overlap with the light-emitting portion of the diffusion pattern 24a of the spacer 24 in the stacking direction (i.e., the vertical direction D1 of the aforementioned embodiment), the light output can be increased. When the microstructures or reflection points of the reflective pattern 208b are arranged so as not to overlap with the light-emitting portion of the diffusion pattern 24a of the spacer 24 in the stacking direction, light recovery can be enhanced.
參閱圖17及圖22,其為圖17之發光按鍵結構1的某些構件的堆疊的平面示意圖,各可透光部306b較佳至少部分地與出光圖案重疊。各可透光部306b具有兩個或更多個角落及三個或更多個側邊,使得鍵帽12的各側邊對應於兩個可透光部306b的該些側邊中的至少一個。舉例而言,鍵帽12的左側邊及右側邊分別對應左側的可透光部306b的左側邊及右側的可透光部306b的右側邊。鍵帽12的上側邊對應兩個可透光部306b的上側邊,而鍵帽12的下側邊對應兩個可透光部306b的下側邊。 Referring to Figures 17 and 22 , which are schematic plan views of certain components of the luminous key structure 1 of Figure 17 , each light-transmissive portion 306b preferably at least partially overlaps with the light-emitting pattern. Each light-transmissive portion 306b has two or more corners and three or more sides, such that each side of the keycap 12 corresponds to at least one of these sides of the two light-transmissive portions 306b. For example, the left and right sides of the keycap 12 correspond to the left side of the left light-transmissive portion 306b and the right side of the right light-transmissive portion 306b, respectively. The upper side of the keycap 12 corresponds to the upper sides of the two light-transmitting portions 306b, while the lower side of the keycap 12 corresponds to the lower sides of the two light-transmitting portions 306b.
於一實施例,兩個可透光部306b中的一個位於多個透光部120中的兩個之間。舉例而言,右側的可透光部306b位於透光部120a及透光部120b之間。換言之,右側的出光圖案位於透光部120a及透光部120b之間。於另一實施例,兩個可透光部120中的一個位於多個透光部120中的一個與鍵帽12之輪廓之間。舉例而言,右側的可透光部306b位於透光部120b及鍵帽12的右緣之間。換言之,右側的出光圖案位於透光部120b及鍵帽12的右緣之間。於又另一實施例,可透光部306b可位於其中一個透光部120的下方。舉例而言,右側的可透光部(或右側的出光圖案)位於透光部120a下方。於一實施例,在鍵帽12為方形鍵帽的實例中,可透光部306b(或出光圖案)與發光件22之間的距離以及透光部120a與發光件22之間的距離的差異較佳小於鍵帽12的邊長的1/4。於另一實施例,在鍵帽12為方形鍵帽的實例中,可透光部306b(或出光圖案)與透光 部120a之間的距離較佳小於鍵帽12的邊長的1/4。前述的「距離」可為可透光部306b(或出光圖案)與透光部120a的幾何中心間的距離、平均距離、最小距離、或最大距離。 In one embodiment, one of the two light-transmitting portions 306b is located between two of the plurality of light-transmitting portions 120. For example, the right-side light-transmitting portion 306b is located between light-transmitting portion 120a and light-transmitting portion 120b. In other words, the light-emitting pattern on the right side is located between light-transmitting portion 120a and light-transmitting portion 120b. In another embodiment, one of the two light-transmitting portions 120 is located between one of the plurality of light-transmitting portions 120 and the outline of the keycap 12. For example, the right-side light-transmitting portion 306b is located between light-transmitting portion 120b and the right edge of the keycap 12. In other words, the light-emitting pattern on the right side is located between light-transmitting portion 120b and the right edge of the keycap 12. In yet another embodiment, the light-transmissive portion 306b may be located below one of the light-transmissive portions 120. For example, the right light-transmissive portion (or the right light-emitting pattern) is located below the light-transmissive portion 120a. In one embodiment, when the keycap 12 is a square keycap, the difference between the distance between the light-transmissive portion 306b (or the light-emitting pattern) and the light-emitting element 22, and the distance between the light-transmissive portion 120a and the light-emitting element 22, is preferably less than 1/4 of the side length of the keycap 12. In another embodiment, when the keycap 12 is a square keycap, the distance between the light-transmissive portion 306b (or the light-emitting pattern) and the light-transmissive portion 120a is preferably less than 1/4 of the side length of the keycap 12. The aforementioned "distance" can be the distance between the light-transmitting portion 306b (or the light-emitting pattern) and the geometric center of the light-transmitting portion 120a, the average distance, the minimum distance, or the maximum distance.
由於出光圖案對應兩個可透光部306b設置,兩個出光圖案較佳設置為圍繞島狀覆蓋部30a’,例如位於兩相反側。依據上述實施例的配置,沒有或較少的光照射穿過底板10的開孔104而照射透光部120b,光在間隔件24中可沿橫向(或水平方向)傳播,當光碰到出光圖案時會向上射出通過兩個可透光部306b進而穿過底板102的周邊開孔104’,使得島狀覆蓋部30a’上方的透光部120b可被兩個可透光部306b照射,而靠近鍵帽12的角落或側邊的透光部120a也可被照射,改善鍵帽12中心及角落的字符的照明均勻性。 Since the light emitting patterns are arranged corresponding to the two light-transmissive portions 306b, the two light emitting patterns are preferably arranged to surround the island-shaped covering portion 30a', for example, on two opposite sides. According to the configuration of the above embodiment, little or no light passes through the openings 104 of the base plate 10 to illuminate the light-transmitting portions 120b. Instead, light propagates laterally (or horizontally) within the spacer 24. When the light strikes the light-emitting pattern, it is emitted upward through the two light-transmitting portions 306b and subsequently through the peripheral openings 104' of the base plate 102. This allows the light-transmitting portions 120b above the island-shaped cover portion 30a' to be illuminated by the two light-transmitting portions 306b. Furthermore, the light-transmitting portions 120a near the corners or sides of the keycap 12 are also illuminated, improving the uniformity of illumination for the characters in the center and corners of the keycap 12.
熟此技藝者當知在不悖離本發明精神下,於此特別說明的實施例可有例示實施例的其他修改。因此,本發明範疇亦涵蓋此類修改且僅由所附申請專利範圍限制。 Those skilled in the art will appreciate that other modifications of the exemplary embodiments specifically described herein may be made without departing from the spirit of the present invention. Therefore, the scope of the present invention also covers such modifications and is limited only by the scope of the appended patent applications.
12鍵帽 120a、120b透光部 208b反射圖案 22發光件 242通孔 24a擴散圖案 244a環狀淨空邊緣 26頂膠 30a’島狀覆蓋部 30b’框狀覆蓋部 304’第二覆蓋層 306b可透光部 12 Keycap 120a, 120b Translucent portions 208b Reflective pattern 22 Light-emitting element 242 Through-hole 24a Diffusion pattern 244a Annular clear edge 26 Top adhesive 30a Island-shaped covering portion 30b Frame-shaped covering portion 304 Second covering layer 306b Translucent portion
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| US20220198872A1 (en) * | 2017-09-14 | 2022-06-23 | Ags Llc | Push-buttons for gaming machines |
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| TW202111748A (en) * | 2019-09-12 | 2021-03-16 | 群光電能科技股份有限公司 | Illuminated keyboard and backlight module thereof |
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