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TWI892382B - Integrated multi-feed antenna - Google Patents

Integrated multi-feed antenna

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Publication number
TWI892382B
TWI892382B TW112150690A TW112150690A TWI892382B TW I892382 B TWI892382 B TW I892382B TW 112150690 A TW112150690 A TW 112150690A TW 112150690 A TW112150690 A TW 112150690A TW I892382 B TWI892382 B TW I892382B
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Taiwan
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conductive layer
feed
integrated multi
antenna
feed antenna
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TW112150690A
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Chinese (zh)
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TW202527370A (en
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李偉宇
鍾蔿
翁金輅
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財團法人工業技術研究院
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Publication of TW202527370A publication Critical patent/TW202527370A/en
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Publication of TWI892382B publication Critical patent/TWI892382B/en

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Abstract

The disclosure provides an integrated multi-feed antenna, comprising a first conductor layer, a second conductor layer and a plurality of feeding conductor lines. The second conductor layer has a first center position. The second conductor layer has a closed slit structure. The closed slit structure surrounds the first center position to encircle forming a center area. The second conductor layer is spaced apart from the first conductor layer at a first interval. Each of the plurality of feeding conductor lines has one end electrically connecting to or electrically coupled to the second conductor layer, and each has another end electrically connecting to a signal source. Each of the plurality of feeding conductor lines excites the second conductor layer to generate at least one resonant mode. The plurality of resonant modes cover at least one identical wireless communication band.

Description

整合式多饋入天線Integrated multi-feed antenna

本發明所屬之技術領域係關於一種多饋入天線設計,特別是關於一種能達成高整合度的多饋入天線架構。The technical field to which the present invention belongs is related to a multi-feed antenna design, and more particularly to a multi-feed antenna architecture capable of achieving high integration.

為了要能夠提升無線通訊品質與資料傳輸速率,導致了多輸入多輸出(MIMO, Multi-Input Multi-Output System)多天線陣列、場型可變化多天線陣列架構以及高增益多天線陣列的應用普及。因此具有高整合度優勢的多天線共構設計已成為熱門的研究主題之一。然而要如何才能夠成功將寬頻天線單元設計成高整合度的多天線陣列,並且同時達成良好匹配以及良好隔離度的優勢,是一項不易克服的技術挑戰。To improve wireless communication quality and data transmission rates, the application of multi-input, multi-output (MIMO) multi-antenna arrays, variable-pattern multi-antenna array architectures, and high-gain multi-antenna arrays has become widespread. Consequently, multi-antenna co-architecture designs, with their high integration advantages, have become a hot research topic. However, successfully designing broadband antenna units into a highly integrated multi-antenna array while simultaneously achieving good matching and isolation remains a significant technical challenge.

複數個相同頻段操作的天線整合成天線陣列,可能會產生相互耦合干擾的問題,因此造成多天線饋入埠間隔離度變差,進而導致輻射特性與天線效率衰減的情形發生。並造成資料傳輸速度的下降,增加了多天線整合的實現困難。部分的先前技術文獻已提出在多天線間接地面上設計共振結構作為耦合能量隔離器,來提升多天線間能量隔離度設計方式。然而這樣的設計方法,可能導致激發額外的耦合電流,造成多天線間的相關係數增加。也可能增加多天線陣列的整體尺寸,造成製程不穩定因素,進而造成量產成本提高。因此較不易廣泛實現於各種不同的通訊設備或裝置當中。When multiple antennas operating in the same frequency band are integrated into an antenna array, mutual coupling interference may occur, resulting in a deterioration in the isolation between the feed ports of the multiple antennas, which in turn leads to a decrease in radiation characteristics and antenna efficiency. This also causes a decrease in data transmission speed, increasing the difficulty of implementing multi-antenna integration. Some previous technical literature has proposed designing a resonant structure on the ground plane between multiple antennas as a coupling energy isolator to improve the energy isolation between multiple antennas. However, such a design method may lead to the excitation of additional coupling currents, resulting in an increase in the correlation coefficient between multiple antennas. It may also increase the overall size of the multi-antenna array, causing process instability factors, and thus increasing mass production costs. Therefore, it is not easy to be widely implemented in various different communication equipment or devices.

因此需要一種可以解決上述這些問題的高整合度天線陣列設計方式,以滿足未來高資料傳輸通訊裝置或設備的實際應用需求。Therefore, a highly integrated antenna array design method that can solve the above problems is needed to meet the practical application requirements of future high-data transmission communication devices or equipment.

有鑑於此,本揭露的實施範例揭露一種整合式多饋入天線。依據範例之一些實作例能解決上述等技術問題。In view of this, the present disclosure discloses an integrated multi-feed antenna. Some implementation examples according to the example can solve the above-mentioned technical problems.

根據一實施範例,本揭露提出一種整合式多饋入天線。該多饋入天線陣列,包含一第一導體層、一第二導體層以及複數個饋入導體線。該第二導體層具有一第一中心位置。該第二導體層並具有一封閉槽縫結構。該封閉槽縫結構環繞該第一中心位置包圍形成一中央區域。該第二導體層與該第一導體層之間具一有一第一間距。該複數個饋入導體線均各自具有一端電氣連接或電氣耦接於該第二導體層,並各自具有另一端電氣連接一訊號源。該複數個饋入導體線均各自激發該第二導體層產生各自的至少一共振模態。該複數個共振模態涵蓋至少一相同的無線通訊頻段。According to one embodiment, the present disclosure provides an integrated multi-feed antenna. The multi-feed antenna array includes a first conductive layer, a second conductive layer, and a plurality of feed conductive lines. The second conductive layer has a first center position. The second conductive layer also has a closed slot structure. The closed slot structure surrounds the first center position to form a central area. There is a first distance between the second conductive layer and the first conductive layer. The plurality of feed conductive lines each have one end electrically connected or electrically coupled to the second conductive layer, and each have the other end electrically connected to a signal source. The plurality of feed conductive lines each excite the second conductive layer to generate at least one resonant mode of their own. The plurality of resonance modes cover at least one same wireless communication frequency band.

為了對本案之上述及其他內容有更佳的瞭解,下文特舉實施例,並配合所附圖式,作詳細說明如下:In order to better understand the above and other aspects of this case, the following examples are given and illustrated in detail with reference to the accompanying figures:

圖1A為本揭露一實施例整合式多饋入天線1之結構圖。如圖1A所示,該整合式多饋入天線1,包含一第一導體層11、一第二導體層12以及複數個饋入導體線131、132、133。該第二導體層12具有一第一中心位置121。該第二導體層12並具有一封閉槽縫結構122。該封閉槽縫結構122環繞該第一中心位置121包圍形成一中央區域123。該第二導體層12與該第一導體層11之間具一有一第一間距d1。該複數個饋入導體線131、132、133均各自具有一端電氣耦接於該第二導體層12,並各自具有另一端電氣連接一訊號源141、142、143。該複數個饋入導體線131、132、133均各自激發該第二導體層12產生各自的至少一共振模態1411、1421、1431(如圖1B所示),該複數個共振模態1411、1421、1431涵蓋至少一相同的無線通訊頻段15(如圖1B所示)。Figure 1A illustrates the structure of an integrated multi-feed antenna 1 according to an embodiment of the present disclosure. As shown in Figure 1A , the integrated multi-feed antenna 1 comprises a first conductive layer 11, a second conductive layer 12, and a plurality of feed conductors 131, 132, and 133. The second conductive layer 12 has a first center 121. The second conductive layer 12 also includes a closed slot structure 122. The closed slot structure 122 surrounds the first center 121 to form a central region 123. A first distance d1 is defined between the second conductive layer 12 and the first conductive layer 11. Each of the plurality of feed conductors 131, 132, and 133 has one end electrically coupled to the second conductive layer 12 and another end electrically connected to a signal source 141, 142, and 143. The plurality of feed conductors 131, 132, and 133 each excite the second conductive layer 12 to generate at least one resonant mode 1411, 1421, and 1431 (as shown in FIG. 1B ). The plurality of resonant modes 1411, 1421, and 1431 cover at least one identical wireless communication frequency band 15 (as shown in FIG. 1B ).

其中,該封閉槽縫結構122具有一槽縫間距s1,該槽縫間距s1介於該無線通訊頻段15(如圖1B所示,4.6 GHz~4.9 GHz)最低操作頻率之0.001波長到0.08波長之間。該中央區域123之面積小於該第二導體層12之面積,該中央區域123之面積介於該第二導體層12之面積0.01倍到0.43倍之間。該第二導體層12之面積小於該第一導體層11之面積,該第二導體層12之面積介於該無線通訊頻段15最低操作頻率之0.13波長之平方到0.79波長之平方之間。該中央區域123之面積介於該無線通訊頻段15最低操作頻率之0.018波長之平方到0.35波長之平方之間。該複數個饋入導體線131、132、133的數量為3。該複數個饋入導體線131、132、133的數量大於1並且小於等於5。該複數個饋入導體線131、132、133位於該第一導體層11與該第二導體層12之間。該複數個饋入導體線131、132、133均各自具有一端電氣耦接於該第二導體層12,並且該複數個饋入導體線131、132、133與該第二導體層12之間並各自具有一耦合間距s131、s132、s133。該耦合間距s131、s132、s133介於該無線通訊頻段15最低操作頻率之0.005波長到0.19波長之間。該第一間距d1介於該無線通訊頻段15最低操作頻率之0.0023波長到0.29波長之間。該訊號源141、142、143係為傳輸線、阻抗匹配電路、放大器電路、饋入網路、開關電路、連接器元件、濾波器電路、積體電路晶片或射頻前端模組。該整合式多饋入天線1於實際應用時可以採用但不受限於電路板製程、導體件切割製程或塑料射出成形製程及塑料金屬化製程來製作並組裝實現。該整合式多饋入天線1可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統或波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。The closed slot structure 122 has a slot spacing s1 that is between 0.001 and 0.08 wavelengths of the lowest operating frequency in the wireless communication band 15 (4.6 GHz to 4.9 GHz, as shown in FIG. 1B ). The area of the central region 123 is smaller than the area of the second conductive layer 12, ranging from 0.01 to 0.43 times the area of the second conductive layer 12. The area of the second conductive layer 12 is smaller than the area of the first conductive layer 11 and is between 0.13 wavelengths squared and 0.79 wavelengths squared, the lowest operating frequency of the wireless communication band 15. The area of the central region 123 is between 0.018 wavelengths squared and 0.35 wavelengths squared, the lowest operating frequency of the wireless communication band 15. The number of the plurality of feed conductive lines 131, 132, 133 is 3. The number of the plurality of feed conductive lines 131, 132, 133 is greater than 1 and less than or equal to 5. The plurality of feed conductors 131, 132, 133 are located between the first conductive layer 11 and the second conductive layer 12. Each of the plurality of feed conductors 131, 132, 133 has one end electrically coupled to the second conductive layer 12, and each of the plurality of feed conductors 131, 132, 133 has a coupling distance s131, s132, s133 with the second conductive layer 12. The coupling distances s131, s132, s133 are between 0.005 wavelength and 0.19 wavelength, which is the lowest operating frequency of the wireless communication band 15. The first distance d1 is between 0.0023 and 0.29 wavelengths, the lowest operating frequency of the wireless communication band 15. The signal sources 141, 142, and 143 are transmission lines, impedance matching circuits, amplifier circuits, feed networks, switching circuits, connector components, filter circuits, integrated circuit chips, or radio frequency front-end modules. In practical applications, the integrated multi-feed antenna 1 can be manufactured and assembled using, but is not limited to, circuit board manufacturing processes, conductor cutting processes, plastic injection molding processes, and plastic metallization processes. The integrated multi-feed antenna 1 can be configured in multiple groups to form an integrated multi-feed antenna array, which can be applied to a multiple-input multiple-output antenna system, a field-switching antenna system, or a beamforming antenna system, or can be used to improve radiation gain through a transmission line or an RF feed network electrical connection.

圖1A中本揭露一實施例整合式多饋入天線1,其藉由設計該第二導體層12具有一封閉槽縫結構122,並設計該封閉槽縫結構122環繞該第一中心位置121包圍形成一中央區域123。並設計該封閉槽縫結構122具有一槽縫間距s1,該槽縫間距s1介於該無線通訊頻段15(如圖1B所示,4.6 GHz~4.9 GHz)最低操作頻率之0.001波長到0.08波長之間,能夠有效抑制該複數個饋入導體線131、132、133於該第二導體層12所激發共振電流的能量耦合程度,成功使得該複數個共振模態1411、1421、1431間達成良好的隔離度(如圖1C所示),達成多訊號源共構整合的技術功效。並且設計該中央區域123之面積並介於該第二導體層12之面積0.01倍到0.43倍之間。以及設計該中央區域123之面積介於該無線通訊頻段15最低操作頻率之0.018波長之平方到0.35波長之平方之間。能夠優化該複數個饋入導體線131、132、133與該第二導體層12之間的輸入阻抗,來成功使得該複數個共振模態1411、1421、1431達成良好的阻抗匹配程度(如圖1B所示)。因此本揭露一實施例整合式多饋入天線1能夠功達成多天線相容整合的技術功效。該整合式多饋入天線1可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統或波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。FIG1A shows an integrated multi-feed antenna 1 according to an embodiment of the present disclosure. The second conductive layer 12 is designed to have a closed slot structure 122 , and the closed slot structure 122 is designed to surround the first center position 121 to form a central area 123 . The closed slot structure 122 is designed to have a slot spacing s1 between 0.001 and 0.08 wavelengths of the lowest operating frequency of the wireless communication band 15 (4.6 GHz to 4.9 GHz, as shown in FIG1B ). This effectively suppresses the energy coupling of the resonant currents generated by the plurality of feed conductors 131, 132, and 133 in the second conductive layer 12, successfully achieving good isolation between the plurality of resonant modes 1411, 1421, and 1431 (as shown in FIG1C ), achieving the technical effect of multi-signal source co-integration. The area of the central region 123 is designed to be between 0.01 and 0.43 times the area of the second conductive layer 12. The area of the central region 123 is designed to be between 0.018 wavelengths squared and 0.35 wavelengths squared, the lowest operating frequency of the wireless communication band 15. This optimizes the input impedance between the plurality of feed conductors 131, 132, and 133 and the second conductive layer 12, successfully achieving good impedance matching between the plurality of resonant modes 1411, 1421, and 1431 (as shown in FIG. 1B ). Therefore, the integrated multi-feed antenna 1 of an embodiment of the present disclosure can successfully achieve the technical benefits of multi-antenna compatible integration. The integrated multi-feed antenna 1 can be configured in multiple groups to form an integrated multi-feed antenna array, which can be applied to a multiple-input multiple-output antenna system, a field-switching antenna system, or a beamforming antenna system, or can be used to improve radiation gain through a transmission line or an RF feed network electrical connection.

圖1B為本揭露一實施例整合式多饋入天線1之返回損失曲線圖。其選擇導體件切割製程製作組裝實現,並以下列尺寸進行實驗:該槽縫間距s1之距離約為0.89 mm; 該第一間距d1之距離約為8.3 mm; 該中央區域123之面積約為15.2 mm 2; 該第二導體層12之面積約為641.1 mm 2; 該耦合間距s131、s132、s133之距離均約為1.6 mm。如圖1B所示,該複數個饋入導體線131、132、133均各自成功激發該第二導體層12產生各自的至少一匹配良好共振模態1411、1421、1431(如圖1B所示),涵蓋至少一相同的無線通訊頻段15(如圖1B所示,4.6 GHz~4.9 GHz)。在本實施例中,該無線通訊頻段15之頻段範圍為4.6 GHz~4.9 GHz,該第一通訊頻段15之最低操作頻率為4.6 GHz。圖1C為本揭露一實施例整合式多饋入天線1之隔離度曲線圖。如1C圖所示,該訊號源141與該訊號源142之間的隔離度曲線為1412,該訊號源141與該訊號源143之間的隔離度曲線為1413,該訊號源142與該訊號源143之間的隔離度曲線為1423。如第1D圖所示,該整合式多饋入天線1之多饋入訊號源141與該訊號源142、該訊號源143之間均能夠達成良好的隔離度。 Figure 1B shows a return loss curve for an integrated multi-feedback antenna 1 according to an embodiment of the present disclosure. The antenna was fabricated and assembled using a selective conductor cutting process, and experiments were conducted with the following dimensions: the slot spacing s1 was approximately 0.89 mm; the first spacing d1 was approximately 8.3 mm; the area of the central region 123 was approximately 15.2 mm² ; the area of the second conductive layer 12 was approximately 641.1 mm² ; and the coupling spacings s131, s132, and s133 were all approximately 1.6 mm. As shown in FIG1B , the plurality of feed conductors 131, 132, and 133 each successfully excite the second conductive layer 12 to generate at least one well-matched resonant mode 1411, 1421, and 1431 (as shown in FIG1B ), covering at least one identical wireless communication band 15 (4.6 GHz to 4.9 GHz, as shown in FIG1B ). In this embodiment, the frequency range of the wireless communication band 15 is 4.6 GHz to 4.9 GHz, and the lowest operating frequency of the first communication band 15 is 4.6 GHz. FIG1C is a graph of the isolation of the integrated multi-feed antenna 1 according to an embodiment of the present disclosure. As shown in FIG1C , the isolation curve between signal source 141 and signal source 142 is 1412, the isolation curve between signal source 141 and signal source 143 is 1413, and the isolation curve between signal source 142 and signal source 143 is 1423. As shown in FIG1D , the integrated multi-feed antenna 1 achieves good isolation between the multi-feed signal source 141 and both the signal sources 142 and 143.

圖1B、圖1C所涵蓋之通訊頻段操作、實驗數據,僅是為了實驗證明圖1A中本揭露一實施例整合式多饋入天線1之技術功效。並未用來限制本揭露整合式多饋入天線1於實際應用情況所能涵蓋的通訊頻段操作、應用與規格。該整合式多饋入天線可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統、波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。The communication band operations and experimental data shown in Figures 1B and 1C are intended solely to demonstrate the technical efficacy of the integrated multi-feed antenna 1 of Figure 1A , an embodiment of the present disclosure. They are not intended to limit the communication band operations, applications, and specifications of the integrated multi-feed antenna 1 in practical applications. Multiple integrated multi-feed antennas can be configured to form an integrated multi-feed antenna array for applications in multiple-input multiple-output (MIMO) antenna systems, field-switching antenna systems, beamforming antenna systems, or to enhance radiation gain through transmission lines or RF feed network electrical connections.

圖2A為本揭露一實施例整合式多饋入天線2之結構圖。如圖2A所示,該整合式多饋入天線2,包含一第一導體層21、一第二導體層22以及複數個饋入導體線231、232。該第二導體層22具有一第一中心位置221。該第二導體層22並具有一封閉槽縫結構222。該封閉槽縫結構222環繞該第一中心位置221包圍形成一中央區域223。該第二導體層22與該第一導體層21之間具一有一第一間距d1。該複數個饋入導體線231、232均各自具有一端電氣連接於該第二導體層22,並各自具有另一端電氣連接一訊號源241、242。該複數個饋入導體線231、232均各自激發該第二導體層22產生各自的至少一共振模態2411、2421,該複數個共振模態2411、2421涵蓋至少一相同的無線通訊頻段25(如圖2B所示)。該實施例整合式多饋入天線2並具有一第三導體層26,該第二導體層22位於該第一導體層21以及該第三導體層26之間,該第三導體層26與該第二導體層22之間具有一第二間距d2。該第二間距d2介於該無線通訊頻段25最低操作頻率之0.011波長到0.23波長之間。該第三導體層26之面積小於該第一導體層21之面積,該第三導體層26之面積介於該無線通訊頻段25最低操作頻率之0.13波長之平方到0.83波長之平方之間。該第三導體層26具有一第二中心位置261,該第二中心位置261對齊該第二導體層22之第一中心位置221。Figure 2A illustrates the structure of an integrated multi-feed antenna 2 according to an embodiment of the present disclosure. As shown in Figure 2A , the integrated multi-feed antenna 2 includes a first conductive layer 21, a second conductive layer 22, and a plurality of feed conductors 231 and 232. The second conductive layer 22 has a first center 221. The second conductive layer 22 also includes a closed slot structure 222. The closed slot structure 222 surrounds the first center 221 to form a central region 223. A first distance d1 is defined between the second conductive layer 22 and the first conductive layer 21. Each of the plurality of feed conductors 231 and 232 has one end electrically connected to the second conductive layer 22 and another end electrically connected to a signal source 241 or 242. The plurality of feed conductors 231 and 232 each excite the second conductive layer 22 to generate at least one resonant mode 2411 or 2421, respectively. These resonant modes 2411 and 2421 cover at least one identical wireless communication band 25 (as shown in FIG. 2B ). The integrated multi-feed antenna 2 of this embodiment includes a third conductive layer 26 located between the first conductive layer 21 and the third conductive layer 26. A second distance d2 is defined between the third conductive layer 26 and the second conductive layer 22. The second distance d2 is between 0.011 and 0.23 wavelengths of the lowest operating frequency of the wireless communication band 25. The area of the third conductive layer 26 is smaller than the area of the first conductive layer 21, and is between the square of 0.13 and 0.83 wavelengths of the lowest operating frequency of the wireless communication band 25. The third conductive layer 26 has a second center position 261, which is aligned with the first center position 221 of the second conductive layer 22.

其中,該封閉槽縫結構222具有一槽縫間距s1,該槽縫間距s1介於該無線通訊頻段25(如圖2B所示,3.3 GHz~3.8 GHz)最低操作頻率之0.001波長到0.08波長之間。該中央區域223之面積小於該第二導體層22之面積,中央區域223之面積介於該第二導體層22之面積0.01倍到0.43倍之間。該第二導體層22之面積小於該第一導體層21之面積,該第二導體層22之面積介於該無線通訊頻段25最低操作頻率之0.13波長之平方到0.79波長之平方之間。該中央區域223之面積介於該無線通訊頻段25最低操作頻率之0.018波長之平方到0.35波長之平方之間。該複數個饋入導體線231、232的數量為2。該複數個饋入導體線231、232的數量大於1並且小於等於5。該複數個饋入導體線231、232位於該第一導體層21與該第二導體層22之間。該複數個饋入導體線231、232均各自具有一端電氣連接於該第二導體層22。該第一間距d1介於該無線通訊頻段25最低操作頻率之0.0023波長到0.29波長之間。該訊號源241、242係為傳輸線、阻抗匹配電路、放大器電路、饋入網路、開關電路、連接器元件、濾波器電路、積體電路晶片或射頻前端模組。該整合式多饋入天線2於實際應用時可以採用但不受限於電路板製程、導體件切割製程或塑料射出成形製程及塑料金屬化製程來製作並組裝實現。該整合式多饋入天線2可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統或波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。The closed slot structure 222 has a slot spacing s1 that is between 0.001 and 0.08 wavelengths of the lowest operating frequency of the wireless communication band 25 (3.3 GHz to 3.8 GHz, as shown in FIG. 2B ). The area of the central region 223 is smaller than the area of the second conductive layer 22, ranging from 0.01 to 0.43 times the area of the second conductive layer 22. The area of the second conductive layer 22 is smaller than the area of the first conductive layer 21 and is between 0.13 wavelengths squared and 0.79 wavelengths squared, the lowest operating frequency of the wireless communication band 25. The area of the central region 223 is between 0.018 wavelengths squared and 0.35 wavelengths squared, the lowest operating frequency of the wireless communication band 25. The number of the plurality of feed conductive lines 231, 232 is 2. The number of the plurality of feed conductive lines 231, 232 is greater than 1 and less than or equal to 5. The plurality of feed conductive lines 231, 232 are located between the first conductive layer 21 and the second conductive layer 22. Each of the plurality of feed conductors 231 and 232 has one end electrically connected to the second conductive layer 22. The first spacing d1 is between 0.0023 and 0.29 wavelengths, the lowest operating frequency of the wireless communication band 25. The signal sources 241 and 242 are transmission lines, impedance matching circuits, amplifier circuits, feed networks, switching circuits, connector components, filter circuits, integrated circuit chips, or radio frequency front-end modules. In practical applications, the integrated multi-feed antenna 2 can be manufactured and assembled using, but is not limited to, circuit board manufacturing processes, conductor cutting processes, plastic injection molding processes, and plastic metallization processes. The integrated multi-feed antenna 2 can be configured in multiple groups to form an integrated multi-feed antenna array, which can be applied to a multiple-input multiple-output antenna system, a field-switching antenna system, or a beamforming antenna system, or can be used to improve radiation gain through transmission lines or RF feed network electrical connections.

圖2A中本揭露一實施例整合式多饋入天線2,雖然其設計該複數個饋入導體線231、232均各自電氣連接於該第二導體層22。並且設計具有一第三導體層26,該第二導體層22位於該第一導體層21以及該第三導體層26之間,與該實施例整合式多饋入天線1並不完全相同。然而該整合式多饋入天線2其同樣藉由設計該第二導體層22具有一封閉槽縫結構222,並設計該封閉槽縫結構222環繞該第一中心位置221包圍形成一中央區域223。並設計該封閉槽縫結構222具有一槽縫間距s1,該槽縫間距s1介於該無線通訊頻段25最低操作頻率之0.001波長到0.08波長之間,能夠有效抑制該複數個饋入導體線231、232於該第二導體層22所激發共振電流的能量耦合程度,成功使得該複數個共振模態2411、2421間達成良好的隔離度(如圖2C所示),達成多訊號源241、242共構整合的技術功效。並且設計該中央區域223之面積並介於該第二導體層22之面積0.01倍到0.43倍之間。以及設計該中央區域223之面積介於該無線通訊頻段25最低操作頻率之0.018波長之平方到0.35波長之平方之間。能夠優化該複數個饋入導體線231、232與該第二導體層22之間的輸入阻抗,來成功使得該複數個共振模態2411、2421達成良好的阻抗匹配程度(如圖2B所示)。因此本揭露一實施例整合式多饋入天線2同樣能夠功達成與該實施例整合式多饋入天線1相同之多天線相容整合的技術功效。該整合式多饋入天線2同樣可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統、波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。FIG2A shows an integrated multi-feed antenna 2 according to an embodiment of the present disclosure. Although the plurality of feed conductors 231 and 232 are each electrically connected to the second conductive layer 22 and a third conductive layer 26 is provided between the first conductive layer 21 and the third conductive layer 26, the integrated multi-feed antenna 2 is not identical to the integrated multi-feed antenna 1 according to the embodiment. However, the integrated multi-feed antenna 2 also includes a closed slot structure 222 on the second conductive layer 22, and the closed slot structure 222 is designed to surround the first center position 221 to form a central area 223. The closed slot structure 222 is designed to have a slot spacing s1 between 0.001 and 0.08 wavelengths of the lowest operating frequency of the wireless communication band 25. This effectively suppresses the energy coupling of the resonant currents generated by the plurality of feed conductors 231 and 232 in the second conductive layer 22, successfully achieving good isolation between the plurality of resonant modes 2411 and 2421 (as shown in FIG. 2C ), achieving the technical effect of co-integrating multiple signal sources 241 and 242. Furthermore, the area of the central region 223 is designed to be between 0.01 and 0.43 times the area of the second conductive layer 22. The area of the central region 223 is designed to be between 0.018 wavelengths squared and 0.35 wavelengths squared, the lowest operating frequency of the wireless communication band 25. This optimizes the input impedance between the plurality of feed conductors 231, 232 and the second conductive layer 22, successfully achieving good impedance matching between the plurality of resonant modes 2411, 2421 (as shown in FIG. 2B ). Therefore, the integrated multi-feed antenna 2 of an embodiment of the present disclosure can also successfully achieve the same multi-antenna compatible integration technical benefits as the integrated multi-feed antenna 1 of the embodiment. The integrated multi-feed antenna 2 can also be configured in multiple groups to form an integrated multi-feed antenna array, which can be applied to a multiple-input multiple-output antenna system, a field-switching antenna system, a beamforming antenna system, or to improve radiation gain through transmission lines or RF feed network electrical connections.

圖2B為本揭露一實施例整合式多饋入天線2之返回損失曲線圖。其選擇電路板(Dk值約為3.48; Df值約為0.003)製程製作組裝實現,並以下列尺寸進行實驗:該槽縫間距s1之距離約為0.33 mm; 該第一間距d1之距離約為1 mm; 該中央區域223之面積約為12.6 mm 2; 該第二導體層22之面積約為530.7 mm 2; 該第三導體層26之面積約為855.3 mm 2; 該第二間距d2之距離約為5.5 mm。如圖2B所示,該複數個饋入導體線231、232均各自成功激發該第二導體層22產生各自的至少一匹配良好共振模態2411、2421 (如圖2B所示),涵蓋至少一相同的無線通訊頻段25(如圖2B所示,3.3 GHz~3.8 GHz)。在本實施例中,該無線通訊頻段25之頻段範圍為3.3 GHz~3.8 GHz,該第一通訊頻段25之最低操作頻率為3.3 GHz。圖2C為本揭露一實施例整合式多饋入天線2之隔離度曲線圖。如2C圖所示,該訊號源241與該訊號源242之間的隔離度曲線為2412。如圖2C所示,該整合式多饋入天線2之多饋入訊號源241與該訊號源242之間均能夠達成良好的隔離度。圖2D為本揭露一實施例整合式多饋入天線2之輻射效率曲線圖,該訊號源241的輻射效率曲線為24111,該訊號源242的輻射效率曲線為24211。如2D圖所示,該整合式多饋入天線2之共振模態2411、2421均能夠達成良好的輻射效率。 Figure 2B shows the return loss curve of an integrated multi-feedback antenna 2 according to an embodiment of the present disclosure. The antenna was fabricated and assembled using a selected circuit board (Dk value of approximately 3.48 and Df value of approximately 0.003). Experiments were conducted with the following dimensions: the slot spacing s1 was approximately 0.33 mm; the first spacing d1 was approximately 1 mm; the area of the central region 223 was approximately 12.6 mm² ; the area of the second conductive layer 22 was approximately 530.7 mm² ; the area of the third conductive layer 26 was approximately 855.3 mm² ; and the second spacing d2 was approximately 5.5 mm. As shown in FIG2B , the plurality of feed conductors 231 and 232 each successfully excite the second conductive layer 22 to generate at least one well-matched resonant mode 2411 and 2421 (as shown in FIG2B ), covering at least one identical wireless communication band 25 (3.3 GHz to 3.8 GHz, as shown in FIG2B ). In this embodiment, the wireless communication band 25 has a frequency range of 3.3 GHz to 3.8 GHz, and the lowest operating frequency of the first communication band 25 is 3.3 GHz. FIG2C is a graph of the isolation of the integrated multi-feed antenna 2 according to an embodiment of the present disclosure. As shown in FIG2C , the isolation curve between the signal source 241 and the signal source 242 is 2412. As shown in Figure 2C, the integrated multi-feed antenna 2 achieves good isolation between the multi-feed signal source 241 and the signal source 242. Figure 2D shows the radiation efficiency curves of the integrated multi-feed antenna 2 according to an embodiment of the present disclosure. The radiation efficiency curve for the signal source 241 is 24111, and the radiation efficiency curve for the signal source 242 is 24211. As shown in Figure 2D, the resonant modes 2411 and 2421 of the integrated multi-feed antenna 2 achieve good radiation efficiency.

圖2B、圖2C、圖2D所涵蓋之通訊頻段操作、實驗數據,僅是為了實驗證明圖2A中本揭露一實施例整合式多饋入天線2之技術功效。並未用來限制本揭露整合式多饋入天線2於實際應用情況所能涵蓋的通訊頻段操作、應用與規格。該整合式多饋入天線2可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統、波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。The communication frequency band operations and experimental data shown in Figures 2B, 2C, and 2D are intended solely to demonstrate the technical efficacy of the integrated multi-feed antenna 2 of Figure 2A , an embodiment of the present disclosure. They are not intended to limit the communication frequency band operations, applications, and specifications of the disclosed integrated multi-feed antenna 2 in practical applications. Multiple integrated multi-feed antennas 2 can be configured to form an integrated multi-feed antenna array for applications in multiple-input multiple-output (MIMO) antenna systems, field-switching antenna systems, beamforming antenna systems, or to enhance radiation gain through transmission lines or RF feed network electrical connections.

圖3為本揭露一實施例整合式多饋入天線3之結構圖。如圖3所示,該整合式多饋入天線3,包含一第一導體層31、一第二導體層32以及複數個饋入導體線331、332。該第二導體層32具有一第一中心位置321。該第二導體層32並具有一封閉槽縫結構322。該封閉槽縫結構322環繞該第一中心位置321包圍形成一中央區域323。該中央區域323具有一中央槽孔結構3231。該封閉槽縫結構322具有2個電氣短路結構3221、3222。該電氣短路結構3221、3222電氣連接該中央區域323與該第二導體層32。該第二導體層32與該第一導體層31之間具一有一第一間距d1。該複數個饋入導體線331、332均各自具有一端電氣連接於該第二導體層32,並各自具有另一端電氣連接一訊號源341、342,該複數個饋入導體線331、332均各自激發該第二導體層32產生各自的至少一共振模態,該複數個共振模態涵蓋至少一相同的無線通訊頻段。Figure 3 illustrates the structure of an integrated multi-feed antenna 3 according to an embodiment of the present disclosure. As shown in Figure 3 , the integrated multi-feed antenna 3 comprises a first conductive layer 31, a second conductive layer 32, and a plurality of feed conductors 331 and 332. The second conductive layer 32 has a first center position 321. The second conductive layer 32 also has a closed slot structure 322. The closed slot structure 322 surrounds the first center position 321 to form a central region 323. The central region 323 has a central slot structure 3231. The closed slot structure 322 has two electrical short-circuit structures 3221 and 3222. The electrical short-circuit structures 3221 and 3222 electrically connect the central region 323 and the second conductive layer 32. A first distance d1 is defined between the second conductive layer 32 and the first conductive layer 31. The plurality of feed conductors 331 and 332 each have one end electrically connected to the second conductive layer 32 and another end electrically connected to a signal source 341 or 342. The plurality of feed conductors 331 and 332 each excite the second conductive layer 32 to generate at least one resonant mode. These resonant modes encompass at least one common wireless communication frequency band.

其中,該封閉槽縫結構322具有一槽縫間距s1,該槽縫間距s1介於該無線通訊頻段最低操作頻率之0.001波長到0.08波長之間。該中央區域323之面積小於該第二導體層32之面積,並介於該第二導體層32之面積0.01倍到0.43倍之間。該第二導體層32之面積小於該第一導體層31之面積,該第二導體層32之面積介於該無線通訊頻段最低操作頻率之0.13波長之平方到0.79波長之平方之間。該中央區域323之面積介於該無線通訊頻段最低操作頻率之0.018波長之平方到0.35波長之平方之間。該複數個饋入導體線331、332的數量為2。該複數個饋入導體線331、332的數量大於1並且小於等於5。該複數個饋入導體線331、332均各自具有一端電氣連接於該第二導體層32。該複數個饋入導體線331、332平行於該第二導體層32。該複數個饋入導體線331、332也可以配置位於該第一導體層31與該第二導體層32之間,並且平行於該第二導體層32並且與該第二導體層32之間並各自具有一耦合間距。該第一間距d1介於該無線通訊頻段最低操作頻率之0.0023波長到0.29波長之間。該訊號源341、342係為傳輸線、阻抗匹配電路、放大器電路、饋入網路、開關電路、連接器元件、濾波器電路、積體電路晶片或射頻前端模組。該整合式多饋入天線3於實際應用時可以採用但不受限於電路板製程、導體件切割製程或塑料射出成形製程及塑料金屬化製程來製作並組裝實現。該整合式多饋入天線3可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統或波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。The closed slot structure 322 has a slot spacing s1 between 0.001 and 0.08 wavelengths of the lowest operating frequency in the wireless communication band. The area of the central region 323 is smaller than the area of the second conductive layer 32 and is between 0.01 and 0.43 times the area of the second conductive layer 32. The area of the second conductive layer 32 is smaller than the area of the first conductive layer 31 and is between 0.13 and 0.79 wavelengths squared, the lowest operating frequency in the wireless communication band. The area of the central region 323 is between 0.018 wavelengths squared and 0.35 wavelengths squared, the lowest operating frequency of the wireless communication band. The number of the plurality of feed conductors 331 and 332 is 2. The number of the plurality of feed conductors 331 and 332 is greater than 1 and less than or equal to 5. Each of the plurality of feed conductors 331 and 332 has one end electrically connected to the second conductive layer 32. The plurality of feed conductors 331 and 332 are parallel to the second conductive layer 32. The plurality of feed conductors 331 and 332 can also be disposed between the first conductive layer 31 and the second conductive layer 32, parallel to the second conductive layer 32, and each having a coupling distance d1 between them. The first distance d1 is between 0.0023 and 0.29 wavelengths, the lowest operating frequency of the wireless communication band. The signal sources 341 and 342 can be transmission lines, impedance matching circuits, amplifier circuits, feed networks, switching circuits, connector components, filter circuits, integrated circuit chips, or RF front-end modules. In practical applications, the integrated multi-feed antenna 3 can be manufactured and assembled using, but not limited to, circuit board manufacturing processes, conductor cutting processes, plastic injection molding processes, and plastic metallization processes. Multiple integrated multi-feed antennas 3 can be configured to form an integrated multi-feed antenna array, which can be used in multiple-input multiple-output antenna systems, field-switching antenna systems, or beamforming antenna systems, or to enhance radiation gain through transmission lines or RF feed network electrical connections.

圖3中本揭露一實施例整合式多饋入天線3,雖然其設計該複數個饋入導體線331、332均各自電氣連接於該第二導體層32,並且平行於該第二導體層32。以及設計該中央區域323具有一中央槽孔結構3231。並且設計該封閉槽縫結構322具有2個電氣短路結構3221、3222,以及該第二導體層32的形狀為方形與該實施例整合式多饋入天線1並不完全相同。然而該整合式多饋入天線3其同樣藉由設計該第二導體層32具有一封閉槽縫結構322,並設計該封閉槽縫結構322環繞該第一中心位置321包圍形成一中央區域323。並設計該封閉槽縫結構322具有一槽縫間距s1,該槽縫間距s1介於該無線通訊頻段最低操作頻率之0.001波長到0.08波長之間,能夠有效抑制該複數個饋入導體線331、332於該第二導體層32所激發共振電流的能量耦合程度,成功使得該複數個共振模態間達成良好的隔離度,達成多訊號源341、342共構整合的技術功效。並且設計該中央區域323之面積並介於該第二導體層32之面積0.01倍到0.43倍之間。以及設計該中央區323域之面積介於該無線通訊頻段最低操作頻率之0.018波長之平方到0.35波長之平方之間。能夠優化該複數個饋入導體線331、332與該第二導體層32之間的輸入阻抗,來成功使得該複數個共振模態達成良好的阻抗匹配程度。因此本揭露一實施例整合式多饋入天線3同樣能夠功達成與該實施例整合式多饋入天線1相同之多天線相容整合的技術功效。該整合式多饋入天線3同樣可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統、波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。FIG3 shows an integrated multi-feed antenna 3 according to an embodiment of the present disclosure. Although the plurality of feed conductors 331 and 332 are each electrically connected to and parallel to the second conductive layer 32, the central region 323 is designed to have a central slot structure 3231, the closed slot structure 322 is designed to have two electrical short-circuit structures 3221 and 3222, and the second conductive layer 32 is square in shape, these are not identical to the integrated multi-feed antenna 1 according to the embodiment. However, the integrated multi-feed antenna 3 also features a closed slot structure 322 on the second conductive layer 32, which surrounds the first center position 321 to form a central region 323. Furthermore, the closed slot structure 322 is designed to have a slot spacing s1 between 0.001 and 0.08 wavelengths, the lowest operating frequency of the wireless communication band. This effectively suppresses the degree of energy coupling between the resonant currents generated by the plurality of feed conductors 331 and 332 in the second conductive layer 32, successfully achieving good isolation between the plurality of resonant modes and the technical effectiveness of co-integrating multiple signal sources 341 and 342. The area of the central region 323 is designed to be between 0.01 and 0.43 times the area of the second conductive layer 32. Furthermore, the area of the central region 323 is designed to be between 0.018 wavelengths squared and 0.35 wavelengths squared, the lowest operating frequency in the wireless communication band. This optimizes the input impedance between the plurality of feed conductors 331, 332 and the second conductive layer 32, successfully achieving good impedance matching between the plurality of resonant modes. Therefore, the integrated multi-feed antenna 3 of the first embodiment of the present disclosure can also successfully achieve the same multi-antenna compatible integration technical benefits as the integrated multi-feed antenna 1 of the first embodiment. The integrated multi-feed antenna 3 can also be configured in multiple groups to form an integrated multi-feed antenna array, which can be applied to a multiple-input multiple-output antenna system, a field-switching antenna system, a beamforming antenna system, or to improve radiation gain through transmission lines or RF feed network electrical connections.

圖4為本揭露一實施例整合式多饋入天線4之結構圖。如圖4所示,該整合式多饋入天線4,包含一第一導體層41、一第二導體層42以及複數個饋入導體線431、432、433。該第二導體層42具有一第一中心位置421。該第二導體層42並具有一封閉槽縫結構422。該封閉槽縫結構422環繞該第一中心位置421包圍形成一中央區域423。該中央區域423藉由一接地導體線4232電氣連接於該第一導體層41。該第二導體層42與該第一導體層41之間具一有一第一間距d1。第二導體層42大致為圓形。該複數個饋入導體線431、432、433均各自具有一端電氣連接於該第二導體層42,並各自具有另一端電氣連接一訊號源441、442、443,該複數個饋入導體線431、432、433均各自激發該第二導體層42產生各自的至少一共振模態,該複數個共振模態涵蓋至少一相同的無線通訊頻段。該實施例整合式多饋入天線4並具有一第三導體層46,該第二導體層42位於該第一導體層41以及該第三導體層46之間,該第三導體層46與該第二導體層42具有一第二間距d2。第三導體層46大致為方形。該第二間距d2介於該無線通訊頻段最低操作頻率之0.011波長到0.23波長之間。該第三導體層46之面積小於該第一導體層41之面積,該第三導體層46之面積介於該無線通訊頻段最低操作頻率之0.13波長之平方到0.83波長之平方之間。該第三導體層46具有一第二中心位置461,該第二中心位置461對齊該第二導體層42之第一中心位置421。Figure 4 illustrates the structure of an integrated multi-feed antenna 4 according to an embodiment of the present disclosure. As shown in Figure 4 , the integrated multi-feed antenna 4 includes a first conductive layer 41, a second conductive layer 42, and a plurality of feed conductors 431, 432, and 433. The second conductive layer 42 has a first center position 421. The second conductive layer 42 also includes a closed slot structure 422. The closed slot structure 422 surrounds the first center position 421 to form a central region 423. The central region 423 is electrically connected to the first conductive layer 41 via a ground conductor 4232. A first distance d1 is defined between the second conductive layer 42 and the first conductive layer 41. The second conductive layer 42 is generally circular. The plurality of feed conductive lines 431, 432, and 433 each have one end electrically connected to the second conductive layer 42 and another end electrically connected to a signal source 441, 442, and 443. Each of the plurality of feed conductive lines 431, 432, and 433 excites the second conductive layer 42 to generate at least one resonant mode, each of which covers at least one common wireless communication frequency band. The integrated multi-feed antenna 4 of this embodiment also includes a third conductive layer 46. The second conductive layer 42 is located between the first conductive layer 41 and the third conductive layer 46. A second distance d2 is defined between the third conductive layer 46 and the second conductive layer 42. The third conductive layer 46 is generally square. The second spacing d2 is between 0.011 and 0.23 wavelengths of the lowest operating frequency in the wireless communication band. The area of the third conductive layer 46 is smaller than that of the first conductive layer 41, ranging from 0.13 to 0.83 wavelengths squared of the lowest operating frequency in the wireless communication band. The third conductive layer 46 has a second center position 461 that is aligned with the first center position 421 of the second conductive layer 42.

其中,該封閉槽縫結構422具有一槽縫間距s1,該槽縫間距s1介於該無線通訊頻段最低操作頻率之0.001波長到0.08波長之間。該中央區域423之面積小於該第二導體層42之面積,並介於該第二導體層42之面積0.01倍到0.43倍之間。該第二導體層42之面積小於該第一導體層41之面積,該第二導體層42之面積介於該無線通訊頻段最低操作頻率之0.13波長之平方到0.79波長之平方之間。該中央區域423之面積介於該無線通訊頻段最低操作頻率之0.018波長之平方到0.35波長之平方之間。該複數個饋入導體線431、432、433的數量為3。該複數個饋入導體線431、432、433的數量大於1並且小於等於5。該複數個饋入導體線431、432、433位於該第一導體層41與該第二導體層42之間。該複數個饋入導體線431、432、433均各自具有一端電氣連接於該第二導體層42。該第一間距d1介於該無線通訊頻段最低操作頻率之0.0023波長到0.29波長之間。該訊號源441、442、443係為傳輸線、阻抗匹配電路、放大器電路、饋入網路、開關電路、連接器元件、濾波器電路、積體電路晶片或射頻前端模組。該整合式多饋入天線4於實際應用時可以採用但不限於電路板製程、導體件切割製程或塑料射出成形製程及塑料金屬化製程來製作並組裝實現。該整合式多饋入天線4可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統或波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。The closed slot structure 422 has a slot spacing s1 between 0.001 and 0.08 wavelengths of the lowest operating frequency in the wireless communication band. The area of the central region 423 is smaller than the area of the second conductive layer 42 and is between 0.01 and 0.43 times the area of the second conductive layer 42. The area of the second conductive layer 42 is smaller than the area of the first conductive layer 41 and is between 0.13 and 0.79 wavelengths squared, the lowest operating frequency in the wireless communication band. The area of the central region 423 is between 0.018 wavelengths squared and 0.35 wavelengths squared, the lowest operating frequency of the wireless communication band. The number of the plurality of feed conductors 431, 432, 433 is 3. The number of the plurality of feed conductors 431, 432, 433 is greater than 1 and less than or equal to 5. The plurality of feed conductors 431, 432, 433 are located between the first conductive layer 41 and the second conductive layer 42. Each of the plurality of feed conductors 431, 432, 433 has one end electrically connected to the second conductive layer 42. The first distance d1 is between 0.0023 wavelengths and 0.29 wavelengths, the lowest operating frequency of the wireless communication band. The signal sources 441, 442, and 443 are transmission lines, impedance matching circuits, amplifier circuits, feed networks, switching circuits, connector components, filter circuits, integrated circuit chips, or radio frequency front-end modules. In practical applications, the integrated multi-feed antenna 4 can be manufactured and assembled using, but not limited to, circuit board manufacturing processes, conductor cutting processes, plastic injection molding processes, and plastic metallization processes. The integrated multi-feed antenna 4 can be configured in multiple groups to form an integrated multi-feed antenna array, which can be applied to a multiple-input multiple-output antenna system, a field-switching antenna system, or a beamforming antenna system, or can be electrically connected to a transmission line or RF feed network to increase radiation gain.

圖4中本揭露一實施例整合式多饋入天線4,雖然其設計該複數個饋入導體線431、432、433均各自電氣連接於該第二導體層42,以及設計該中央區域423藉由一接地導體線4232電氣連接於該第一導體層41。並且設計具有一第三導體層46,該第二導體層42位於該第一導體層41以及該第三導體層46之間,與該實施例整合式多饋入天線1並不完全相同。然而該整合式多饋入天線4其同樣藉由設計該第二導體層42具有一封閉槽縫結構422,並設計該封閉槽縫結構422環繞該第一中心位置421包圍形成一中央區域423。並設計該封閉槽縫結構422具有一槽縫間距s1,該槽縫間距s1介於該無線通訊頻段最低操作頻率之0.001波長到0.08波長之間,能夠有效抑制該複數個饋入導體線431、432、433於該第二導體層42所激發共振電流的能量耦合程度,成功使得該複數個共振模態間達成良好的隔離度,達成多訊號源441、442、443共構整合的技術功效。並且設計該中央區域423之面積並介於該第二導體層42之面積0.01倍到0.43倍之間。以及設計該中央區域423之面積介於該無線通訊頻段最低操作頻率之0.018波長之平方到0.35波長之平方之間。能夠優化該複數個饋入導體線431、432、433與該第二導體層42之間的輸入阻抗,來成功使得該複數個共振模態達成良好的阻抗匹配程度。因此本揭露一實施例整合式多饋入天線4同樣能夠功達成與該實施例整合式多饋入天線1相同之多天線相容整合的技術功效。該整合式多饋入天線4同樣可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統、波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。FIG4 shows an integrated multi-feed antenna 4 according to an embodiment of the present disclosure. Although the plurality of feed conductors 431, 432, and 433 are each electrically connected to the second conductive layer 42, and the central region 423 is electrically connected to the first conductive layer 41 via a ground conductor 4232, the antenna also includes a third conductive layer 46, with the second conductive layer 42 located between the first conductive layer 41 and the third conductive layer 46. This design is not entirely identical to the integrated multi-feed antenna 1 according to the embodiment. However, the integrated multi-feed antenna 4 is also designed to have a closed slot structure 422 on the second conductive layer 42, and the closed slot structure 422 is designed to surround the first center position 421 to form a central area 423. The closed slot structure 422 is designed to have a slot spacing s1 between 0.001 and 0.08 wavelengths of the lowest operating frequency in the wireless communication band. This effectively suppresses the energy coupling of the resonant currents generated by the plurality of feed conductors 431, 432, and 433 in the second conductive layer 42, successfully achieving good isolation between the plurality of resonant modes and realizing the technical effectiveness of co-integration of multiple signal sources 441, 442, and 443. Furthermore, the area of the central region 423 is designed to be between 0.01 and 0.43 times the area of the second conductive layer 42. The area of the central region 423 is designed to be between 0.018 wavelengths squared and 0.35 wavelengths squared, the lowest operating frequency of the wireless communication band. This optimizes the input impedance between the plurality of feed conductors 431, 432, 433 and the second conductive layer 42, successfully achieving good impedance matching between the plurality of resonant modes. Therefore, the integrated multi-feed antenna 4 of the first embodiment of this disclosure can also successfully achieve the same multi-antenna compatible integration technical benefits as the integrated multi-feed antenna 1 of the first embodiment. The integrated multi-feed antenna 4 can also be configured in multiple groups to form an integrated multi-feed antenna array, which can be applied to a multiple-input multiple-output antenna system, a field-switching antenna system, a beamforming antenna system, or to improve radiation gain through transmission lines or RF feed network electrical connections.

圖5為本揭露一實施例將三組該整合式多饋入天線4(如圖4所示)形成一整合式多饋入天線陣列5之結構圖。該訊號源係為傳輸線、阻抗匹配電路、放大器電路、饋入網路、開關電路、連接器元件、濾波器電路、積體電路晶片或射頻前端模組。該整合式多饋入天線陣列5於實際應用時可以採用但不受限於電路板製程、導體件切割製程或塑料射出成形製程及塑料金屬化製程來製作並組裝實現。該整合式多饋入天線陣列5應用於多輸入多輸出天線系統、場形切換天線系統或波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。圖5僅是本揭露整合式多饋入天線配置多組形成整合式多饋入天線陣列之實施例之一。並未用來限制本揭露整合式多饋入天線於實際應用情況所能組合形成的整合式多饋入天線陣列排列數目、排列組合、排列形狀以及排列方式。FIG5 illustrates the structure of an integrated multi-feed antenna array 5 formed from three sets of integrated multi-feed antennas 4 (as shown in FIG4 ) according to one embodiment of the present disclosure. The signal source may be a transmission line, an impedance matching circuit, an amplifier circuit, a feed network, a switch circuit, a connector component, a filter circuit, an integrated circuit chip, or an RF front-end module. In practical applications, the integrated multi-feed antenna array 5 can be manufactured and assembled using, but is not limited to, circuit board manufacturing processes, conductor cutting processes, plastic injection molding processes, and plastic metallization processes. The integrated multi-feed antenna array 5 is used in a multiple-input multiple-output antenna system, a field-switching antenna system, or a beamforming antenna system, or to enhance radiation gain through electrical connections to a transmission line or RF feed network. FIG. 5 is merely one example of configuring multiple integrated multi-feed antennas to form an integrated multi-feed antenna array. It is not intended to limit the number, combinations, shapes, or methods of integrated multi-feed antenna arrays that can be formed using the disclosed integrated multi-feed antennas in practical applications.

綜上所述,雖然本案已以實施例揭露如上,然其並非用以限定本案。本案所屬技術領域中具有通常知識者,在不脫離本案之精神和範圍內,當可作各種之更動與潤飾。因此,本案之保護範圍當視後附之申請專利範圍所界定者為準。In summary, although this application has been disclosed above through embodiments, these are not intended to limit the application. Those skilled in the art will readily appreciate that various modifications and enhancements are possible without departing from the spirit and scope of this application. Therefore, the scope of protection for this application shall be determined by the appended patent application.

1、2、3、4:整合式多饋入天線 11、21、31、41、51:第一導體層 12、22、32、42:第二導體層 121、221、321、421:第一中心位置 122、222、322、422:封閉槽縫結構 123、223、323、423:中央區域 131、132、133、231、232、331、332、431、432、433:饋入導體線 141、142、143、241、242、341、342、441、442、443:訊號源 1411、1421、1431、2411、2421:共振模態之返回損失曲線 1412、1413、1423、2412:隔離度曲線 24111、24211:輻射效率曲線 15、25:無線通訊頻段 26、46:第三導體層 261、461:第二中心位置 3221、3222:電氣短路結構 3231:中央槽孔結構 4232:接地導體線 5:整合式多饋入天線陣列 d1:第一間距 d2:第二間距 s1:槽縫間距 s131、s132、s133:耦合間距 1, 2, 3, 4: Integrated multi-feed antenna 11, 21, 31, 41, 51: First conductive layer 12, 22, 32, 42: Second conductive layer 121, 221, 321, 421: First center position 122, 222, 322, 422: Closed slot structure 123, 223, 323, 423: Central region 131, 132, 133, 231, 232, 331, 332, 431, 432, 433: Feed conductors 141, 142, 143, 241, 242, 341, 342, 441, 442, 443: Signal source 1411, 1421, 1431, 2411, 2421: Resonant mode return loss curves 1412, 1413, 1423, 2412: Isolation curves 24111, 24211: Radiation efficiency curves 15, 25: Wireless communication frequency bands 26, 46: Third conductor layer 261, 461: Second center position 3221, 3222: Electrical short-circuit structure 3231: Central slot structure 4232: Ground conductor 5: Integrated multi-feed antenna array d1: First spacing d2: Second spacing s1: Slot spacing s131, s132, s133: Coupling spacing

圖1A為本揭露一實施例整合式多饋入天線1之結構圖。 圖1B為本揭露一實施例整合式多饋入天線1之返回損失曲線圖。 圖1C為本揭露一實施例整合式多饋入天線1之隔離度曲線圖。 圖2A為本揭露一實施例整合式多饋入天線2之結構圖。 圖2B為本揭露一實施例整合式多饋入天線2之返回損失曲線圖。 圖2C為本揭露一實施例整合式多饋入天線2之隔離度曲線圖。 圖2D為本揭露一實施例整合式多饋入天線2之輻射效率曲線圖。 圖3為本揭露一實施例整合式多饋入天線3之結構圖。 圖4為本揭露一實施例整合式多饋入天線4之結構圖。 圖5為本揭露一實施例整合式多饋入天線4配置多組形成整合式多饋入天線陣列5之結構圖。 Figure 1A is a structural diagram of an integrated multi-feed antenna 1 according to an embodiment of the present disclosure. Figure 1B is a graph showing return loss for the integrated multi-feed antenna 1 according to an embodiment of the present disclosure. Figure 1C is a graph showing isolation for the integrated multi-feed antenna 1 according to an embodiment of the present disclosure. Figure 2A is a structural diagram of an integrated multi-feed antenna 2 according to an embodiment of the present disclosure. Figure 2B is a graph showing return loss for the integrated multi-feed antenna 2 according to an embodiment of the present disclosure. Figure 2C is a graph showing isolation for the integrated multi-feed antenna 2 according to an embodiment of the present disclosure. Figure 2D is a graph showing radiation efficiency for the integrated multi-feed antenna 2 according to an embodiment of the present disclosure. Figure 3 is a structural diagram of an integrated multi-feed antenna 3 according to an embodiment of the present disclosure. Figure 4 is a block diagram of an integrated multi-feed antenna 4 according to an embodiment of the present disclosure. Figure 5 is a block diagram of an integrated multi-feed antenna array 5 formed by configuring multiple sets of integrated multi-feed antennas 4 according to an embodiment of the present disclosure.

1:整合式多饋入天線 11:第一導體層 12:第二導體層 121:第一中心位置 122:封閉槽縫結構 123:中央區域 131、132、133:饋入導體線 141、142、143:訊號源 d1:第一間距 s1:槽縫間距 s131、s132、s133:耦合間距 1: Integrated multi-feed antenna 11: First conductive layer 12: Second conductive layer 121: First center position 122: Closed slot structure 123: Central region 131, 132, 133: Feed conductors 141, 142, 143: Signal source d1: First spacing s1: Slot spacing s131, s132, s133: Coupling spacing

Claims (18)

一種整合式多饋入天線,包含:一第一導體層;一第二導體層,其具有一第一中心位置,該第二導體層並具有一封閉槽縫結構,該封閉槽縫結構環繞該第一中心位置包圍形成一中央區域,該第二導體層與該第一導體層之間具有一第一間距;複數個饋入導體線,均各自具有一端電氣連接或電氣耦接於該第二導體層,並各自具有另一端電氣連接一訊號源,該複數個饋入導體線均各自激發該第二導體層產生各自的至少一共振模態,該複數個共振模態涵蓋至少一相同的無線通訊頻段,其中該中央區域之面積小於該第二導體層之面積,並介於該第二導體層之面積0.01倍到0.43倍之間。An integrated multi-feed antenna comprises: a first conductive layer; a second conductive layer having a first center position, the second conductive layer having a closed slot structure, the closed slot structure surrounding the first center position to form a central area, the second conductive layer and the first conductive layer having a first distance therebetween; a plurality of feed conductive lines, each having one end electrically connected or electrically coupled The plurality of feed conductors are connected to the second conductive layer and each has another end electrically connected to a signal source. The plurality of feed conductors each excite the second conductive layer to generate at least one resonant mode. The plurality of resonant modes cover at least one same wireless communication frequency band. The area of the central region is smaller than the area of the second conductive layer and is between 0.01 and 0.43 times the area of the second conductive layer. 如請求項1所述的整合式多饋入天線,其中,該封閉槽縫結構具有一槽縫間距,該槽縫間距介於該無線通訊頻段最低操作頻率之0.001波長到0.08波長之間。The integrated multi-feed antenna of claim 1, wherein the closed slot structure has a slot pitch that is between 0.001 wavelength and 0.08 wavelength of the lowest operating frequency of the wireless communication band. 如請求項1所述的整合式多饋入天線,其中,該第二導體層之面積小於該第一導體層之面積,該第二導體層之面積介於該無線通訊頻段最低操作頻率之0.13波長之平方到0.79波長之平方之間。The integrated multi-feed antenna as described in claim 1, wherein the area of the second conductive layer is smaller than the area of the first conductive layer, and the area of the second conductive layer is between 0.13 wavelength squared and 0.79 wavelength squared of the lowest operating frequency in the wireless communication band. 如請求項1所述的整合式多饋入天線,其中,該中央區域之面積介於該無線通訊頻段最低操作頻率之0.018波長之平方到0.35波長之平方之間。The integrated multi-feed antenna of claim 1, wherein an area of the central region is between 0.018 wavelength squared and 0.35 wavelength squared of the lowest operating frequency of the wireless communication band. 如請求項1所述的整合式多饋入天線,其中,該複數個饋入導體線的數量大於1並且小於等於5。The integrated multi-feed antenna of claim 1, wherein the number of the plurality of feed conductors is greater than 1 and less than or equal to 5. 如請求項1所述的整合式多饋入天線,其中,該複數個饋入導體線位於該第一導體層與該第二導體層之間或者平行於該第二導體層。The integrated multi-feed antenna as described in claim 1, wherein the plurality of feed conductors are located between the first conductor layer and the second conductor layer or parallel to the second conductor layer. 如請求項1所述的整合式多饋入天線,其中,該複數個饋入導體線均各自具有一端電氣耦接於該第二導體層,並且該複數個饋入導體線與該第二導體層之間並各自具有一耦合間距。The integrated multi-feed antenna as described in claim 1, wherein each of the plurality of feed conductors has one end electrically coupled to the second conductive layer, and each of the plurality of feed conductors has a coupling distance with the second conductive layer. 如請求項7所述的整合式多饋入天線,其中,該耦合間距介於該無線通訊頻段最低操作頻率之0.005波長到0.19波長之間。The integrated multi-feed antenna of claim 7, wherein the coupling distance is between 0.005 wavelength and 0.19 wavelength of the lowest operating frequency of the wireless communication band. 如請求項1所述的整合式多饋入天線,其中,該第一間距介於該無線通訊頻段最低操作頻率之0.0023波長到0.29波長之間。The integrated multi-feed antenna of claim 1, wherein the first spacing is between 0.0023 wavelengths and 0.29 wavelengths of the lowest operating frequency of the wireless communication band. 如請求項1所述的整合式多饋入天線,其中,具有一第三導體層,該第二導體層位於該第一導體層以及該第三導體層之間,該第三導體層與該第二導體層之間具有一第二間距。The integrated multi-feed antenna as described in claim 1, wherein a third conductor layer is provided, the second conductor layer is located between the first conductor layer and the third conductor layer, and a second distance is provided between the third conductor layer and the second conductor layer. 如請求項10所述的整合式多饋入天線,其中,該第二間距介於該無線通訊頻段最低操作頻率之0.011波長到0.23波長之間。The integrated multi-feed antenna of claim 10, wherein the second spacing is between 0.011 wavelengths and 0.23 wavelengths of the lowest operating frequency of the wireless communication band. 如請求項10所述的整合式多饋入天線,其中,該第三導體層之面積小於該第一導體層之面積,該第三導體層之面積介於該無線通訊頻段最低操作頻率之0.13波長之平方到0.83波長之平方之間。The integrated multi-feed antenna of claim 10, wherein the area of the third conductive layer is smaller than the area of the first conductive layer, and the area of the third conductive layer is between 0.13 wavelength squared and 0.83 wavelength squared of the lowest operating frequency in the wireless communication band. 如請求項10所述的整合式多饋入天線,其中,該第三導體層具有一第二中心位置,該第二中心位置對齊該第二導體層之第一中心位置。The integrated multi-feed antenna of claim 10, wherein the third conductive layer has a second center position, and the second center position is aligned with the first center position of the second conductive layer. 如請求項1所述的整合式多饋入天線,其中,該中央區域藉由一接地導體線電氣連接於該第一導體層。The integrated multi-feed antenna of claim 1, wherein the central region is electrically connected to the first conductive layer via a ground conductive line. 如請求項1所述的整合式多饋入天線,其中,該中央區域具有一中央槽孔結構。The integrated multi-feed antenna as described in claim 1, wherein the central area has a central slot structure. 如請求項1所述的整合式多饋入天線,其中,該封閉槽縫結構具有至少一個電氣短路結構。The integrated multi-feed antenna of claim 1, wherein the closed slot structure has at least one electrical short-circuit structure. 如請求項1所述的整合式多饋入天線,其中,該訊號源係為傳輸線、阻抗匹配電路、放大器電路、饋入網路、開關電路、連接器元件、濾波器電路、積體電路晶片或射頻前端模組。The integrated multi-feed antenna as described in claim 1, wherein the signal source is a transmission line, an impedance matching circuit, an amplifier circuit, a feed network, a switch circuit, a connector component, a filter circuit, an integrated circuit chip, or an RF front-end module. 如請求項1所述的整合式多饋入天線,其中,該整合式多饋入天線可配置多組形成整合式多饋入天線陣列,應用於多輸入多輸出天線系統、場形切換天線系統、波束成型天線系統或藉由傳輸線或射頻饋入網路電氣連接來提高輻射增益。The integrated multi-feed antenna of claim 1 can be configured in multiple groups to form an integrated multi-feed antenna array, which can be applied to a multiple-input multiple-output antenna system, a field-switching antenna system, a beamforming antenna system, or to improve radiation gain through electrical connection of a transmission line or radio frequency feed network.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016112839A1 (en) * 2015-01-12 2016-07-21 Huawei Technologies Co., Ltd. Combination antenna element, array and printed circuit board
CN115882191A (en) * 2021-09-29 2023-03-31 深圳富泰宏精密工业有限公司 Antenna unit and array antenna
TW202327174A (en) * 2021-12-20 2023-07-01 財團法人工業技術研究院 Multi-feed antenna

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016112839A1 (en) * 2015-01-12 2016-07-21 Huawei Technologies Co., Ltd. Combination antenna element, array and printed circuit board
CN115882191A (en) * 2021-09-29 2023-03-31 深圳富泰宏精密工业有限公司 Antenna unit and array antenna
TW202327174A (en) * 2021-12-20 2023-07-01 財團法人工業技術研究院 Multi-feed antenna

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