TWI891901B - Adhesive sheet - Google Patents
Adhesive sheetInfo
- Publication number
- TWI891901B TWI891901B TW110133019A TW110133019A TWI891901B TW I891901 B TWI891901 B TW I891901B TW 110133019 A TW110133019 A TW 110133019A TW 110133019 A TW110133019 A TW 110133019A TW I891901 B TWI891901 B TW I891901B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- adhesive sheet
- meth
- acrylate
- transfer layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
本發明係提供一種黏著片,其係可將被黏著體可剝離地暫時固定者,且以低輸出之雷射光即可顯現出剝離性,可無需剝離後洗淨被黏著體之步驟,且剝離顯現部位之範圍狹窄。 本發明之黏著片係具備黏著劑層及配置於該黏著劑層之單側之轉印層者,且該轉印層係藉由照射活性能量線而硬化之層,該黏著片之該黏著劑層貼合於玻璃時之於23℃下之黏著力I為2 N/20 mm以上,該黏著片之該黏著劑層貼合於玻璃時之於23℃下之黏著力I相對於對該轉印層照射300 mJ/cm 2之紫外線後之於23℃下之黏著力B的比為5以上。 The present invention provides an adhesive sheet that can temporarily fix an adherend in a releasable manner. The releasability can be demonstrated by low-output laser light, eliminating the need for cleaning the adherend after peeling. Furthermore, the peeling demonstration area is narrow. The adhesive sheet of the present invention comprises an adhesive layer and a transfer layer disposed on one side of the adhesive layer. The transfer layer is hardened by irradiation with active energy rays. The adhesive layer of the adhesive sheet exhibits an adhesion force (I) of 2 N/20 mm or greater at 23°C when bonded to glass. The adhesive layer exhibits an adhesion force (I) of 2 N/20 mm or greater at 23°C when bonded to glass, and a ratio of the adhesion force (B) of the transfer layer at 23°C after irradiation with 300 mJ/ cm² of ultraviolet rays is 5 or greater.
Description
本發明係關於一種黏著片。The present invention relates to an adhesive sheet.
於加工以電子零件為代表之各種構件時,通常進行如下操作:使用黏著片將構件暫時固定於支持體上,於輸送、加工等之後,將加工過之構件從支持體上剝離。例如於專利文獻1中記載有如下方法:將基板(被加工構件)於介隔接著劑層及分離層暫時固定於支持體上之狀態下進行加工,加工後,藉由雷射光照射而破壞分離層,連同接著劑層一起將基板從支持體上剝離,之後,從基板上去除接著劑層。然而,上述方法需要從構件上去除接著劑層並洗淨構件之非接著面之步驟,於生產成本方面存在問題。又,亦存在當以高輸出照射雷射光時會對構件造成損傷之問題。When processing various components, such as electronic parts, the following process is typically performed: the component is temporarily fixed to a support using an adhesive sheet. After transport and processing, the processed component is peeled from the support. For example, Patent Document 1 describes a method in which a substrate (the component to be processed) is temporarily fixed to a support with an adhesive layer and a separation layer interposed therebetween. After processing, the separation layer is destroyed by laser irradiation, and the substrate is peeled from the support along with the adhesive layer. The adhesive layer is then removed from the substrate. However, this method requires the steps of removing the adhesive layer from the component and cleaning the non-adhesive surface of the component, which poses a problem in terms of production costs. Furthermore, there is also the problem of damaging components when irradiating with high-output laser light.
又,於專利文獻2中記載有如下方法:介隔接著劑層將複數個被加工構件暫時固定於載體上,使雷射光束集中在接著劑層上而使其發泡,藉此將被加工構件之一部分選擇性地從載體上分離、轉印。然而,該方法存在如下問題:雷射照射後所產生之發泡會隨著時間推移擴散,結果導致載體剝離,使得無需轉印之被加工構件產生不必要之脫落。 先前技術文獻 專利文獻 Patent Document 2 describes a method in which multiple workpieces are temporarily fixed to a carrier through an adhesive layer. A laser beam is then focused on the adhesive layer to cause foaming, thereby selectively separating and transferring a portion of the workpieces from the carrier. However, this method suffers from the problem that the foaming generated by laser irradiation spreads over time, causing the carrier to peel off and the workpieces that do not need to be transferred to fall off unnecessarily. Prior Art Patent Document
專利文獻1:日本專利5875850號 專利文獻2:日本專利6053756號 Patent Document 1: Japanese Patent No. 5875850 Patent Document 2: Japanese Patent No. 6053756
[發明所欲解決之問題][Identify the problem you want to solve]
本發明係為了解決上述先前之問題而完成者,其目的在於提供一種黏著片,其係可將被黏著體可剝離地暫時固定者,且以低輸出之雷射光即可顯現出剝離性,可無需剝離後洗淨被黏著體之步驟,且剝離顯現部位之範圍狹窄。 [解決問題之技術手段] The present invention was developed to resolve the aforementioned problems. Its purpose is to provide an adhesive sheet that can temporarily secure an adherend in a removable manner. The adhesive sheet can be releasably activated using low-output laser light, eliminating the need for post-stripping cleaning of the adherend. Furthermore, the area where the releasable adhesive sheet is activated is narrow. [Technical Solution]
本發明之黏著片係具備黏著劑層及配置於該黏著劑層之單側之轉印層者,且該轉印層係藉由照射活性能量線會硬化之層,將該黏著片之黏著劑層貼合於玻璃板時之於23℃下之黏著力I為2 N/20 mm以上,將該黏著片之黏著劑層貼合於玻璃板時之於23℃下之黏著力I相對於對該轉印層照射300 mJ/cm 2之紫外線後之於23℃下之黏著力B的比為5以上。 於一實施方式中,上述黏著片於上述黏著劑層與上述轉印層之間進而具備基材。 於一實施方式中,照射300 mJ/cm 2之紫外線後,上述轉印層於23℃下之壓入彈性模數B為上述黏著劑層於23℃下之壓入彈性模數I之5倍以上。 於一實施方式中,上述轉印層含有活性能量線硬化型黏著劑,該活性能量線硬化型黏著劑含有丙烯酸系聚合物作為基礎聚合物。 於一實施方式中,上述黏著片可用於如下用途:使用該黏著片將構件暫時固定於支持體上,於輸送及/或加工等之後,藉由雷射光照射將該構件從支持體上剝離。 [發明之效果] The adhesive sheet of the present invention comprises an adhesive layer and a transfer layer disposed on one side of the adhesive layer. The transfer layer is hardened by exposure to active energy rays. When the adhesive layer of the adhesive sheet is bonded to a glass plate, the adhesive force (I) at 23°C is at least 2 N/20 mm. Furthermore, the ratio of the adhesive force (I) at 23°C to the adhesive force (B) at 23°C after irradiation of the transfer layer with 300 mJ/ cm² of ultraviolet light is 5 or greater. In one embodiment, the adhesive sheet further comprises a substrate between the adhesive layer and the transfer layer. In one embodiment, after irradiation with 300 mJ/ cm² of ultraviolet light, the transfer layer has an indentation modulus (B) at 23°C that is at least five times the indentation modulus (I) of the adhesive layer at 23°C. In one embodiment, the transfer layer contains an active energy ray-curable adhesive containing an acrylic polymer as a base polymer. In one embodiment, the adhesive sheet can be used to temporarily secure a component to a support, and then, after transport and/or processing, the component can be removed from the support by laser irradiation. [Effects of the Invention]
根據本發明,可提供一種黏著片,其係可將被黏著體可剝離地暫時固定者,且以低輸出之雷射光即可表現出剝離性,可無需剝離後洗淨被黏著體之步驟,且剝離顯現部位之範圍狹窄。According to the present invention, an adhesive sheet can be provided that can temporarily fix an adherend in a releasable manner, and the releasability can be exhibited by low-output laser light, eliminating the need for cleaning the adherend after peeling, and the range of the peeling display area is narrow.
A.黏著片之概要 圖1(a)係本發明之一實施方式之黏著片之概略剖視圖。該實施方式之黏著片100具備黏著劑層10及配置於黏著劑層10之單側之轉印層20。圖1(b)係本發明之另一實施方式之黏著片之概略剖視圖。該實施方式之黏著片200於黏著劑層10與轉印層20之間進而具備基材30。本發明之黏著片亦可在供於使用之前,以保護黏著面為目的,而於黏著劑層及轉印層之外側設置剝離襯墊,但並未圖示。又,只要能夠獲得本發明之效果,則黏著片亦可進而含有任意適當之其他層。 A. Adhesive Sheet Overview Figure 1(a) is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention. Adhesive sheet 100 of this embodiment comprises an adhesive layer 10 and a transfer layer 20 disposed on one side of adhesive layer 10. Figure 1(b) is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the present invention. Adhesive sheet 200 of this embodiment further comprises a substrate 30 between adhesive layer 10 and transfer layer 20. Although not shown, the adhesive sheet of the present invention may also be provided with a peel liner outside the adhesive layer and transfer layer to protect the adhesive surface prior to use. Furthermore, as long as the effects of the present invention can be achieved, the adhesive sheet may further contain any other appropriate layers.
本發明之黏著片可用於如下用途:使用該黏著片將構件暫時固定於支持體(例如玻璃基體)上,於輸送、加工等之後,將該構件從支持體上剝離。於剝離時,進行雷射光照射,可精確地僅將處在所需位置上之構件剝離。The adhesive sheet of the present invention can be used to temporarily fix a component to a support (e.g., a glass substrate) and then remove the component from the support after transportation or processing. During the removal process, laser light irradiation can precisely remove only the component at the desired location.
上述轉印層係藉由照射活性能量線會硬化之層。更詳細而言,上述轉印層係以如下方式構成:具有用以固定被黏著體之黏著性,且藉由照射活性能量線會硬化,該黏著性會降低。較佳為於硬化後,仍殘留可固定被黏著體程度之黏著力(例如被黏著體不會自然落下程度之黏著力)。於一實施方式中,藉由照射活性能量線,轉印層整體之黏著力會降低。作為活性能量線,例如可例舉:伽瑪射線、紫外線、可見光線、紅外線(熱線)、射頻波、α射線、β射線、電子束、電漿流、電離輻射、及粒子束等。較佳為紫外線。The transfer layer is a layer that hardens by irradiation with active energy rays. More specifically, the transfer layer is constructed in the following manner: it has an adhesive property for fixing an adherend, and hardens by irradiation with active energy rays, and the adhesive property is reduced. Preferably, after hardening, an adhesive force that can fix the adherend remains (for example, an adhesive force that prevents the adherend from falling off naturally). In one embodiment, the adhesive force of the entire transfer layer is reduced by irradiation with active energy rays. Examples of active energy rays include gamma rays, ultraviolet rays, visible rays, infrared rays (heat rays), radio frequency waves, alpha rays, beta rays, electron beams, plasma currents, ionizing radiation, and particle beams. Ultraviolet rays are preferred.
上述黏著劑層可為任意適當之構成,只要能夠獲得本發明之效果即可。於一實施方式中,上述黏著劑層含有壓敏黏著劑。上述黏著片可將黏著劑層貼合於支持體(例如玻璃基體)來使用。對於上述黏著片,可藉由如下操作而使配置在該部位處之被黏著體剝離:藉由雷射光照射而使上述黏著劑層(於具有基材之構成中,還包括基材)局部產生應變,該應變會傳播至轉印層,而使得轉印層表面(貼合面)暫時發生形狀變化。於本發明中,藉由調整黏著劑層之成分(例如基礎聚合物之種類;黏著賦予劑、交聯劑等添加劑之種類;其等之調配量等),可使黏著劑層吸收規定波長之雷射光,其結果導致容易產生黏著劑層之應變。又,關於基材,亦可藉由適當選擇其構成材料而製成容易產生應變之基材。又,如上所述,藉由使轉印層硬化後照射雷射光,可較佳地顯現出由應變傳播產生之剝離性。於本發明中,藉由上述作用而顯現出剝離性,因此無需高輸出之雷射光,並無需剝離後洗淨被黏著體之步驟,且可使剝離顯現部位之範圍變窄。又,剝離後轉印層表面形狀之變化不會持續(即範圍不會隨時間推移變廣,反而可以恢復至變化前之形狀),因此,可防止於無需剝離之部位處被黏著體發生不必要之脫落等異常。The adhesive layer can be of any appropriate structure as long as the effects of the present invention can be achieved. In one embodiment, the adhesive layer contains a pressure-sensitive adhesive. The adhesive sheet can be used by bonding the adhesive layer to a support (e.g., a glass substrate). The adhesive sheet can be peeled off by the following operation: the adhesive layer (including the substrate in a structure with a substrate) is locally strained by irradiating it with laser light, and the strain is transmitted to the transfer layer, causing the transfer layer surface (bonding surface) to temporarily change shape. In the present invention, by adjusting the adhesive layer's composition (e.g., the type of base polymer; the type and amount of additives such as adhesion promoters and crosslinkers), the adhesive layer can be made to absorb laser light of a specified wavelength, resulting in easier strain generation within the adhesive layer. Furthermore, by appropriately selecting the substrate's constituent materials, a strain-prone substrate can be created. Furthermore, as described above, by curing the transfer layer and then irradiating it with laser light, the releasability resulting from strain propagation can be optimally exhibited. In the present invention, the aforementioned action achieves releasability, eliminating the need for high-output laser light and the need for post-stripping washes. Furthermore, the area where the peeling occurs is narrowed. Furthermore, the surface shape of the transfer layer after peeling does not change continuously (i.e., the area does not widen over time and instead returns to its pre-change shape). This prevents unwanted shedding of the adherend in areas not requiring peeling.
將上述黏著片之黏著劑層貼合於玻璃板時之於23℃下之黏著力I為2 N/20 mm以上。藉由提高該黏著力I,可使由雷射光照射所致之各層之變形適性化,可使剝離顯現部位之範圍變窄,可防止於無需剝離之部位處被黏著體發生不必要之脫落等異常。上述黏著力I較佳為2 N/20 mm~25 N/20 mm,進而較佳為5 N/20 mm~20 N/20 mm。若為此種範圍,則上述本發明之效果變得顯著。黏著力係按照JIS Z 0237:2000來測定。具體而言,藉由使2 kg之輥往返1次而將黏著片之黏著劑層貼合於玻璃板(算術平均表面粗糙度Ra:50±25 nm),於23℃下放置30分鐘後,於剝離角度180°、剝離速度(拉伸速度)300 mm/min之條件下剝離黏著片,從而進行測定。When the adhesive layer of the adhesive sheet is attached to a glass plate, its adhesion strength (I) at 23°C is 2 N/20 mm or greater. By increasing this adhesion strength (I), deformation of the layers caused by laser irradiation can be optimized, narrowing the area where peeling occurs, and preventing abnormalities such as unwanted detachment of the adherend in areas where peeling is not necessary. The adhesion strength (I) is preferably 2 N/20 mm to 25 N/20 mm, and more preferably 5 N/20 mm to 20 N/20 mm. Within this range, the effects of the present invention are significantly achieved. Adhesion strength is measured in accordance with JIS Z 0237:2000. Specifically, the adhesive layer of the adhesive sheet is bonded to a glass plate (arithmetic mean surface roughness Ra: 50 ± 25 nm) by reciprocating a 2 kg roller once. After standing at 23°C for 30 minutes, the adhesive sheet is peeled off at a peeling angle of 180° and a peeling speed (tensile speed) of 300 mm/min for measurement.
上述黏著片之轉印層剛貼合於不鏽鋼板後之於23℃下之初始黏著力A較佳為1 N/20 mm~20 N/20 mm,更佳為1.5 N/20 mm~15 N/20 mm,進而較佳為2 N/20 mm~10 N/20 mm。若為此種範圍,則可獲得能夠良好地保持被黏著體之黏著片。又,轉印層側之黏著力亦按照JIS Z 0237:2000來測定。具體而言,藉由使2 kg之輥往返1次而將黏著片之轉印層貼合於不鏽鋼板(算術平均表面粗糙度Ra:50±25 nm),於23℃下放置30分鐘後,於剝離角度180°、剝離速度(拉伸速度)300 mm/min之條件下剝離黏著片,從而進行測定。轉印層之黏著力會因活性能量線照射及雷射光照射而發生變化,於本說明書中,「初始黏著力」意指照射活性能量線及雷射光之前之黏著力。The initial adhesion force A of the transfer layer of the adhesive sheet at 23°C, immediately after being bonded to the stainless steel plate, is preferably 1 N/20 mm to 20 N/20 mm, more preferably 1.5 N/20 mm to 15 N/20 mm, and even more preferably 2 N/20 mm to 10 N/20 mm. Within this range, an adhesive sheet capable of effectively retaining the adherend is obtained. The adhesion force of the transfer layer is also measured in accordance with JIS Z 0237:2000. Specifically, the transfer layer of the adhesive sheet was bonded to a stainless steel plate (arithmetic mean surface roughness Ra: 50 ± 25 nm) using a 2 kg roller with one reciprocating motion. After standing at 23°C for 30 minutes, the adhesive sheet was peeled off at a peeling angle of 180° and a peeling speed (tensile speed) of 300 mm/min for measurement. The adhesion of the transfer layer changes with irradiation with active energy rays and laser light. In this specification, "initial adhesion" refers to the adhesion before irradiation with active energy rays and laser light.
於一實施方式中,上述黏著片之黏著力B(亦稱為硬化後黏著力B)較佳為1 N/20 mm以下,更佳為0.5 N/20 mm以下,進而較佳為0.2 N/20 mm以下,特佳為0.1 N/20 mm以下,上述黏著力B係將黏著片貼合於上述不鏽鋼板並對轉印層照射300 mJ/cm 2之紫外線後之於23℃下之黏著力。若為此種範圍,則可獲得剝離性優異、糊劑殘留較少之黏著片。硬化後黏著力B之下限例如為0.01 N/20 mm(較佳為0.001 N/20 mm)。上述紫外線照射例如使用紫外線照射裝置(日東精機公司製造,商品名「UM-810」),對轉印層照射高壓水銀燈之紫外線(特性波長:365 nm、累計光量:300 mJ/cm 2)來進行。紫外線照射可從黏著劑層側來進行。 In one embodiment, the adhesive sheet has an adhesion force B (also referred to as adhesion force B after curing) of preferably 1 N/20 mm or less, more preferably 0.5 N/20 mm or less, even more preferably 0.2 N/20 mm or less, and particularly preferably 0.1 N/20 mm or less. This adhesion force B is measured at 23°C after the adhesive sheet is attached to the stainless steel plate and the transfer layer is irradiated with UV light at 300 mJ/ cm² . Within this range, an adhesive sheet with excellent releasability and minimal adhesive residue can be obtained. The lower limit of the adhesion force B after curing is, for example, 0.01 N/20 mm (preferably 0.001 N/20 mm). The above-mentioned ultraviolet irradiation is performed, for example, using an ultraviolet irradiation device (manufactured by Nitto Seiki Co., Ltd., trade name "UM-810"), by irradiating the transfer layer with ultraviolet rays (characteristic wavelength: 365 nm, cumulative light intensity: 300 mJ/ cm2 ). The ultraviolet irradiation can be performed from the adhesive layer side.
將黏著劑層貼合於玻璃時之於23℃下之黏著力I相對於轉印層之硬化後黏著力B的比(黏著力I/硬化後黏著力B)為5以上。換言之,於上述黏著片中,硬化後黏著力B為黏著力I之0.2倍以下(較佳為0.1倍以下,更佳為0.05倍以下,進而較佳為0.005倍以下)。藉由將(黏著力I/硬化後黏著力B)以上述方式進行特定,可使由雷射光照射所致之各層之變形適性化,且可獲得利用雷射光照射之剝離性優異之黏著片。此種黏著片可於窄範圍內實現確實之剝離性。(黏著力I/硬化後黏著力B)較佳為10以上,更佳為20以上,進而較佳為200以上。若為此種範圍,則上述本發明之效果變得顯著。(黏著力I/硬化後黏著力B)之上限例如為1000,較佳為5000,更佳為10000。即,於上述黏著片中,硬化後黏著力B可為黏著力I之0.0001倍以上。The ratio of the adhesive strength I at 23°C when the adhesive layer is bonded to glass to the adhesive strength B of the transfer layer after curing (Adhesion I/Adhesion B after curing) is 5 or greater. In other words, in the adhesive sheet, the adhesive strength B after curing is 0.2 times or less (preferably 0.1 times or less, more preferably 0.05 times or less, and even more preferably 0.005 times or less) of the adhesive strength I. By specifying (Adhesion I/Adhesion B after curing) in this manner, the deformation of each layer caused by laser light irradiation can be optimized, resulting in an adhesive sheet with excellent releasability by laser light irradiation. Such an adhesive sheet can achieve reliable releasability within a narrow range. (Adhesion I/Adhesion B after curing) is preferably 10 or greater, more preferably 20 or greater, and even more preferably 200 or greater. Within this range, the aforementioned effects of the present invention become significant. The upper limit of (Adhesion I/Adhesion B after curing) is, for example, 1000, preferably 5000, and even more preferably 10000. In other words, in the adhesive sheet described above, Adhesion B after curing can be at least 0.0001 times Adhesion I.
轉印層之初始黏著力A相對於轉印層之硬化後黏著力B之比(初始黏著力A/硬化後黏著力B)較佳為5以上,更佳為10以上,更佳為10~100,進而較佳為30~80。若為此種範圍,則可獲得被黏著體之固定性與剝離性之平衡性優異之黏著片。The ratio of the initial adhesion force A of the transfer layer to the adhesion force B of the transfer layer after curing (initial adhesion force A/adhesion force B after curing) is preferably 5 or greater, more preferably 10 or greater, even more preferably 10-100, and even more preferably 30-80. Within this range, an adhesive sheet having an excellent balance between adherence and releasability can be obtained.
於上述黏著片中,與上述黏著劑層相接地配置之層(例如轉印層、基材、其他層)及黏著劑層於23℃下之抓固力較佳為2 N/20 mm以上,更佳為4 N/20 mm以上,進而較佳為6 N/20 mm以上,特佳為8 N/20 mm以上。該抓固力之上限例如為30 N/20 mm(較佳為50 N/20 mm)。抓固力係於23℃下、剝離角度180°、剝離速度(拉伸速度)300 mm/min之條件下,將黏著劑層從相鄰層上剝離而測定。In the adhesive sheet, the gripping force of the adhesive layer and the layers disposed in contact with the adhesive layer (e.g., transfer layer, substrate, other layers) at 23°C is preferably 2 N/20 mm or greater, more preferably 4 N/20 mm or greater, even more preferably 6 N/20 mm or greater, and particularly preferably 8 N/20 mm or greater. The upper limit of this gripping force is, for example, 30 N/20 mm (preferably 50 N/20 mm). The gripping force is measured by peeling the adhesive layer from the adjacent layer at 23°C, a peeling angle of 180°, and a peeling speed (tensile speed) of 300 mm/min.
於上述黏著片中,與上述轉印層相接地配置之層(例如黏著劑層、基材、其他層)及轉印層於23℃下之抓固力較佳為2 N/20 mm以上,更佳為4 N/20 mm以上,進而較佳為6 N/20 mm以上,特佳為8 N/20 mm以上。該抓固力之上限例如為30 N/20 mm(較佳為50 N/20 mm)。抓固力係於23℃下、剝離角度180°、剝離速度(拉伸速度)300 mm/min之條件下,將轉印層從相鄰層上剝離而測定。In the adhesive sheet, the gripping force of the layers disposed in contact with the transfer layer (e.g., adhesive layer, substrate, other layers) and the transfer layer at 23°C is preferably 2 N/20 mm or greater, more preferably 4 N/20 mm or greater, even more preferably 6 N/20 mm or greater, and particularly preferably 8 N/20 mm or greater. The upper limit of this gripping force is, for example, 30 N/20 mm (preferably 50 N/20 mm). The gripping force is measured by peeling the transfer layer from the adjacent layer at 23°C, a peel angle of 180°, and a peeling speed (tensile speed) of 300 mm/min.
本發明之黏著片之波長248 nm之透光率較佳為50%以下,更佳為30%以下,進而較佳為10%以下,特佳為5%以下。於一實施方式中,黏著片之波長248 nm之透光率可藉由黏著劑層及/或基材之該光的透過率來控制。具體而言,藉由調整黏著劑層之成分(例如基礎聚合物之種類;黏著賦予劑、交聯劑等添加劑之種類;其等之調配量等)、黏著劑層之厚度、基材之構成材料、及基材之厚度等來控制上述透過率。於本發明中,藉由降低該透光率,可促進黏著劑層及/或基材產生應變,降低剝離時之雷射輸出。本發明之黏著片由於以低輸出之雷射光便顯現出剝離性,故若使用該黏著片,則可降低剝離時對被黏著體之損傷,而防止該被黏著體之破損。波長248 nm之透光率越低越佳,其下限例如為0.5%(較佳為0%)。The transmittance of the adhesive sheet of the present invention at a wavelength of 248 nm is preferably 50% or less, more preferably 30% or less, further preferably 10% or less, and particularly preferably 5% or less. In one embodiment, the transmittance of the adhesive sheet at a wavelength of 248 nm can be controlled by the transmittance of the light through the adhesive layer and/or the substrate. Specifically, the transmittance is controlled by adjusting the components of the adhesive layer (e.g., the type of base polymer; the type of additives such as adhesive imparting agents and crosslinking agents; and their blending amounts, etc.), the thickness of the adhesive layer, the constituent materials of the substrate, and the thickness of the substrate. In the present invention, by reducing the transmittance, strain in the adhesive layer and/or the substrate can be promoted, thereby reducing the laser output during peeling. Because the adhesive sheet of this invention exhibits releasability even with low-output laser light, its use can reduce damage to the adherend during peeling, preventing damage to the adherend. The lower the transmittance at a wavelength of 248 nm, the better, with a lower limit of, for example, 0.5% (preferably 0%).
本發明之黏著片之波長365 nm之透光率較佳為50%以上,更佳為60%以上,進而較佳為70%以上。若處於該範圍內,則可獲得較佳地產生藉由照射活性能量線之轉印層之硬化之黏著片。黏著片之波長365 nm之透光率越高越佳,其上限例如為95%(較佳為100%)。The adhesive sheet of the present invention preferably has a transmittance of 50% or greater at a wavelength of 365 nm, more preferably 60% or greater, and even more preferably 70% or greater. Within this range, the adhesive sheet can be effectively cured by the transfer layer irradiated with active energy rays. The higher the transmittance of the adhesive sheet at a wavelength of 365 nm, the better. The upper limit is, for example, 95% (preferably 100%).
本發明之黏著片之霧度值較佳為70%以下,更佳為65%以下。若為此種範圍,則可獲得藉由照射活性能量線會較佳地產生轉印層之硬化的黏著片。於一實施方式中,上述黏著片之霧度值為20%以下。黏著片之霧度值越低越佳,其下限例如為0.1%。The adhesive sheet of the present invention preferably has a haze value of 70% or less, more preferably 65% or less. Within this range, the transfer layer of the adhesive sheet can be effectively cured by irradiation with active energy rays. In one embodiment, the haze value of the adhesive sheet is 20% or less. The lower the haze value of the adhesive sheet, the better, with a lower limit of 0.1%, for example.
黏著片之厚度較佳為1 μm~300 μm,更佳為5 μm~200 μm。於一實施方式中,上述黏著片之厚度為30 μm以下。若黏著片較薄,則可獲得黏著劑層上所產生之應變易於傳播至轉印層而剝離性優異之黏著片。The thickness of the adhesive sheet is preferably 1 μm to 300 μm, more preferably 5 μm to 200 μm. In one embodiment, the thickness of the adhesive sheet is 30 μm or less. A thinner adhesive sheet can easily transfer strain generated in the adhesive layer to the transfer layer, resulting in an adhesive sheet with excellent releasability.
於上述黏著片進而含有基材及/或任意適當之其他層之情形時,黏著劑層與轉印層之距離較佳為未達50 μm,更佳為30 μm以下,進而較佳為25 μm以下,特佳為10 μm以下。若為此種範圍,則可獲得黏著劑層上所產生之應變易於傳播至轉印層而剝離性優異之黏著片。When the adhesive sheet further includes a substrate and/or any other appropriate layers, the distance between the adhesive layer and the transfer layer is preferably less than 50 μm, more preferably less than 30 μm, even more preferably less than 25 μm, and particularly preferably less than 10 μm. Within this range, strain generated in the adhesive layer is easily transferred to the transfer layer, resulting in an adhesive sheet with excellent releasability.
B.轉印層 上述轉印層之厚度較佳為1 μm~30 μm,更佳為2 μm~20 μm,進而較佳為3 μm~10 μm。若為此種範圍,則上述效果變得顯著。 B. Transfer Layer The thickness of the transfer layer is preferably 1 μm to 30 μm, more preferably 2 μm to 20 μm, and even more preferably 3 μm to 10 μm. Within this range, the aforementioned effects are most pronounced.
上述轉印層於23℃下之初始壓入彈性模數A較佳為0.1 MPa以上且未達14 MPa,更佳為0.1 MPa~10 MPa,進而較佳為0.2 MPa~8 MPa。若為此種範圍,則可獲得固定性優異之黏著片。壓入彈性模數可藉由於23℃下之單一壓入法,以壓入速度10 nm/s、壓入深度100 nm進行測定。轉印層之黏著力會因活性能量線照射及雷射光照射而發生變化,但於本說明書中,「初始壓入彈性模數A」意指照射活性能量線及雷射光之前之黏著力。The initial compression modulus A of the transfer layer at 23°C is preferably 0.1 MPa or greater and less than 14 MPa, more preferably 0.1 MPa to 10 MPa, and even more preferably 0.2 MPa to 8 MPa. Within this range, an adhesive sheet with excellent fixation can be obtained. The compression modulus can be measured by a single compression method at 23°C at an compression speed of 10 nm/s and a compression depth of 100 nm. The adhesion of the transfer layer will change due to irradiation with active energy rays and laser light, but in this specification, "initial compression modulus A" means the adhesion before irradiation with active energy rays and laser light.
上述轉印層較佳為照射300 mJ/cm 2之紫外線後,於23℃下之壓入彈性模數B(亦稱為硬化後彈性模數B)達到14 MPa以上之層,更佳為達到15 MPa以上之層,進而較佳為達到20 MPa以上之層,特佳為達到50 MPa以上之層。若為此種範圍,則可獲得剝離性優異之黏著片。又,可防止剝離時之被黏著體之污染。於23℃下之硬化後彈性模數B之上限例如為500 MPa(較佳為300 MPa)。 The transfer layer preferably has an indentation modulus B (also called post-curing modulus B) of 14 MPa or greater at 23°C after irradiation with 300 mJ/ cm² of UV light, more preferably 15 MPa or greater, even more preferably 20 MPa or greater, and particularly preferably 50 MPa or greater. This range yields an adhesive sheet with excellent releasability. It also prevents contamination of the adherend during peeling. The upper limit of the post-curing modulus B at 23°C is, for example, 500 MPa (preferably 300 MPa).
上述轉印層較佳為照射300 mJ/cm 2之紫外線後,於23℃下之壓入彈性模數B達到轉印層於23℃下之初始壓入彈性模數A的20倍以上,更佳為達到30倍以上,更佳為達到30倍~1000倍,特佳為達到50倍~200倍。若為此種範圍,則可獲得被黏著體之固定性與剝離性之平衡性優異之黏著片。 The transfer layer preferably has an indentation modulus (B) at 23°C after irradiation with 300 mJ/ cm² of UV light that is at least 20 times, more preferably at least 30 times, even more preferably 30 to 1000 times, and particularly preferably 50 to 200 times, of the transfer layer's initial indentation modulus (A) at 23°C. Within this range, an adhesive sheet exhibiting an excellent balance between adherence and release properties can be obtained.
上述轉印層較佳為照射300 mJ/cm 2之紫外線後,於23℃下之壓入彈性模數B達到黏著劑層於23℃下之壓入彈性模數I的5倍以上,更佳為達到10倍以上,進而較佳為達到50倍~5000倍,特佳為達到100倍~3000倍。若為此種範圍,則可使由雷射光照射所致之各層之變形適性化,且可獲得利用雷射光照射之剝離性優異之黏著片。此種黏著片可於窄範圍內實現確實之剝離性。 The transfer layer preferably has an indentation modulus (B) at 23°C of at least five times the indentation modulus (I) of the adhesive layer at 23°C after irradiation with 300 mJ/ cm² of UV light, more preferably at least 10 times, further preferably 50 to 5000 times, and particularly preferably 100 to 3000 times. Within this range, deformation of each layer caused by laser irradiation can be mitigated, resulting in an adhesive sheet with excellent releasability upon laser irradiation. Such an adhesive sheet can achieve reliable releasability within a narrow range.
於一實施方式中,上述轉印層包含活性能量線硬化型黏著劑。活性能量線硬化型黏著劑亦可進而含有紫外線吸收劑及/或光聚合起始劑。In one embodiment, the transfer layer includes an active energy ray-curable adhesive. The active energy ray-curable adhesive may further contain an ultraviolet absorber and/or a photopolymerization initiator.
(活性能量線硬化型黏著劑) 於一實施方式中,活性能量線硬化型黏著劑係使用含有作為母劑之基礎聚合物及能夠與該基礎聚合物鍵結之活性能量線反應性化合物(單體或低聚物)之活性能量線硬化型黏著劑(A1)。於另一實施方式中,使用含有活性能量線反應性聚合物作為基礎聚合物之活性能量線硬化型黏著劑(A2)。較佳為上述基礎聚合物具有可與光聚合起始劑發生反應之官能基。作為該官能基,例如可例舉羥基、羧基等。 (Active Energy Ray-Curing Adhesive) In one embodiment, an active energy ray-curing adhesive (A1) is used that contains a base polymer as a matrix and an active energy ray-reactive compound (monomer or oligomer) capable of bonding to the base polymer. In another embodiment, an active energy ray-curing adhesive (A2) is used that contains an active energy ray-reactive polymer as a base polymer. Preferably, the base polymer has a functional group that reacts with a photopolymerization initiator. Examples of such functional groups include hydroxyl groups and carboxyl groups.
作為上述黏著劑(A1)可使用之基礎聚合物,例如可例舉:天然橡膠、聚異丁烯橡膠、苯乙烯-丁二烯橡膠、苯乙烯-異戊二烯-苯乙烯嵌段共聚物橡膠、再生橡膠、丁基橡膠、聚異丁烯橡膠、及腈橡膠(NBR)等橡膠系聚合物;矽酮系聚合物;及丙烯酸系聚合物等。該等聚合物可單獨使用,或亦可將2種以上組合使用。其中較佳為丙烯酸系聚合物。Examples of base polymers that can be used in the adhesive (A1) include rubber-based polymers such as natural rubber, polyisobutylene rubber, styrene-butadiene rubber, styrene-isoprene-styrene block copolymer rubber, reclaimed rubber, butyl rubber, polyisobutylene rubber, and nitrile rubber (NBR); silicone-based polymers; and acrylic polymers. These polymers can be used alone or in combination of two or more. Acrylic polymers are preferred.
作為丙烯酸系聚合物,可例舉:(甲基)丙烯酸烷基酯、(甲基)丙烯酸環烷基酯、及(甲基)丙烯酸芳基酯等含烴基之(甲基)丙烯酸酯之均聚物或共聚物;及該含有烴基之(甲基)丙烯酸酯與其他共聚合性單體之共聚物等。作為(甲基)丙烯酸烷基酯,例如可例舉:(甲基)丙烯酸之甲酯、乙酯、丙酯、異丙酯、丁酯、異丁酯、第二丁酯、第三丁酯、戊酯、異戊酯、己酯、庚酯、辛酯、2-乙基己酯、異辛酯、壬酯、癸酯、異癸酯、十一烷基酯、十二烷基酯即月桂酯、十三烷基酯、十四烷基酯、十六烷基酯、十八烷基酯、及二十烷基酯。作為(甲基)丙烯酸環烷基酯,例如可例舉(甲基)丙烯酸之環戊酯及環己酯。作為(甲基)丙烯酸芳基酯,例如可例舉(甲基)丙烯酸苯酯及(甲基)丙烯酸苄酯。來自上述含有烴基之(甲基)丙烯酸酯之結構單元之含有比率相對於基礎聚合物100重量份,較佳為40重量份以上,更佳為60重量份以上。Examples of acrylic polymers include homopolymers or copolymers of alkyl (meth)acrylates, such as alkyl (meth)acrylates, cycloalkyl (meth)acrylates, and aryl (meth)acrylates; and copolymers of such alkyl (meth)acrylates and other copolymerizable monomers. Examples of alkyl (meth)acrylates include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, amyl, isoamyl, hexyl, heptyl, octyl, 2-ethylhexyl, isooctyl, nonyl, decyl, isodecyl, undecyl, dodecyl (i.e., lauryl), tridecyl, tetradecyl, hexadecyl, octadecyl, and eicosyl (meth)acrylates. Examples of cycloalkyl (meth)acrylates include cyclopentyl and cyclohexyl (meth)acrylates. Examples of the aryl (meth)acrylate include phenyl (meth)acrylate and benzyl (meth)acrylate. The content of the structural units derived from the alkyl-containing (meth)acrylate is preferably 40 parts by weight or more, more preferably 60 parts by weight or more, based on 100 parts by weight of the base polymer.
作為上述其他共聚合性單體,例如可例舉:含羧基之單體、酸酐單體、含羥基之單體、含縮水甘油基之單體、含磺酸基之單體、含磷酸基之單體、丙烯醯胺、及丙烯腈等含官能基之單體等。作為含羧基之單體,例如可例舉:丙烯酸、甲基丙烯酸、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、及丁烯酸。作為酸酐單體,例如可例舉馬來酸酐及伊康酸酐。作為含有羥基之單體,例如可例舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、及(甲基)丙烯酸(4-羥甲基環己基)甲酯。作為含縮水甘油基之單體,例如可例舉:(甲基)丙烯酸縮水甘油酯及(甲基)丙烯酸甲基縮水甘油酯。作為含磺酸基之單體,例如可例舉:苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、及(甲基)丙烯醯氧基萘磺酸。作為含磷酸基之單體,例如可例舉2-羥乙基丙烯醯基磷酸酯。作為丙烯醯胺,例如可例舉N-丙烯醯𠰌啉。其等可單獨使用1種,亦可將2種以上組合使用。來自上述共聚合性單體之結構單元之含有比率相對於基礎聚合物100重量份,較佳為60重量份以下,更佳為40重量份以下。Examples of the aforementioned other copolymerizable monomers include monomers containing carboxyl groups, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, acrylamide, and functional group-containing monomers such as acrylonitrile. Examples of carboxyl group-containing monomers include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Examples of acid anhydride monomers include maleic anhydride and itaconic anhydride. Examples of monomers containing a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate. Examples of monomers containing a glycidyl group include glycidyl (meth)acrylate and methylglycidyl (meth)acrylate. Examples of monomers containing sulfonic acid groups include styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth)acryloyloxynaphthalenesulfonic acid. Examples of monomers containing phosphoric acid groups include 2-hydroxyethylacryloyl phosphate. Examples of acrylamide include N-acryloylisothiazolinone. These monomers may be used alone or in combination of two or more. The content of the structural units derived from the copolymerizable monomers is preferably 60 parts by weight or less, and more preferably 40 parts by weight or less, per 100 parts by weight of the base polymer.
丙烯酸系聚合物可含有來自多官能單體之結構單元,以於聚合物骨架中形成交聯結構。作為多官能單體,例如可例舉:己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯(即聚(甲基)丙烯酸縮水甘油酯)、(甲基)丙烯酸聚酯、及胺基甲酸酯(甲基)丙烯酸酯。其等可單獨使用1種,亦可將2種以上組合使用。來自上述多官能單體之結構單元之含有比率相對於基礎聚合物100重量份,較佳為40重量份以下,更佳為30重量份以下。Acrylic polymers may contain structural units derived from multifunctional monomers to form a cross-linked structure within the polymer backbone. Examples of such multifunctional monomers include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trihydroxymethylpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy (meth)acrylate (i.e., polyglycidyl (meth)acrylate), (meth)acrylate polyesters, and urethane (meth)acrylates. These monomers may be used alone or in combination. The content of the structural units derived from the multifunctional monomer is preferably 40 parts by weight or less, more preferably 30 parts by weight or less, based on 100 parts by weight of the base polymer.
上述丙烯酸系聚合物之重量平均分子量較佳為10萬~300萬,更佳為20萬~200萬。重量平均分子量可藉由GPC(Gel Permeation Chromatography,凝膠滲透層析術)(溶劑:THF(Tetrahydrofuran,四氫呋喃))來測定。The weight average molecular weight of the acrylic polymer is preferably 100,000 to 3,000,000, more preferably 200,000 to 2,000,000. The weight average molecular weight can be measured by GPC (Gel Permeation Chromatography) (solvent: THF (tetrahydrofuran)).
作為上述黏著劑(A1)可使用之上述活性能量線反應性化合物,例如可例舉具有丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基、及乙炔基等具有聚合性碳-碳多重鍵之官能基的光反應性單體或低聚物。作為該光反應性之單體之具體例,可例舉:三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇單羥基五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、及聚乙二醇二(甲基)丙烯酸酯等(甲基)丙烯酸與多元醇之酯化物;多官能胺基甲酸酯(甲基)丙烯酸酯;環氧(甲基)丙烯酸酯;及寡酯(甲基)丙烯酸酯等。又,亦可使用甲基丙烯醯基異氰酸酯、2-甲基丙烯醯氧乙基異氰酸酯(甲基丙烯酸2-異氰酸基乙酯)、及間異丙烯基-α,α-二甲基苄基異氰酸酯等單體。作為光反應性之低聚物之具體例,可例舉上述單體之二聚物~五聚物等。光反應性之低聚物之分子量較佳為100~3000。Examples of the active energy ray-reactive compound that can be used as the binder (A1) include photoreactive monomers or oligomers having a functional group having a polymerizable carbon-carbon multiple bond, such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, and an ethynyl group. Specific examples of the photoreactive monomer include esters of (meth)acrylic acid and polyols such as trihydroxymethylpropane tri(meth)acrylate, tetrahydroxymethylmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and polyethylene glycol di(meth)acrylate; multifunctional urethane (meth)acrylate; epoxy (meth)acrylate; and oligoester (meth)acrylate. Monomers such as methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate (2-isocyanatoethyl methacrylate), and m-isopropenyl-α,α-dimethylbenzyl isocyanate can also be used. Specific examples of photoreactive oligomers include dimers to pentamers of the above monomers. The molecular weight of the photoreactive oligomer is preferably 100 to 3000.
又,上述活性能量線反應性化合物亦可使用環氧化丁二烯、甲基丙烯酸縮水甘油酯、丙烯醯胺、及乙烯基矽氧烷等單體;或含有該單體之低聚物。Furthermore, the active energy ray-reactive compound may be a monomer such as epoxidized butadiene, glycidyl methacrylate, acrylamide, or vinyl siloxane, or an oligomer containing the monomer.
進而,亦可使用鎓鹽等有機鹽類與分子內具有複數個雜環之化合物的混合物作為上述活性能量線反應性化合物。該混合物中,有機鹽會因活性能量線(例如紫外線、電子束)照射而裂解從而生成離子,該離子作為起始種會引起雜環之開環反應,從而可形成三維網狀結構。作為上述有機鹽類,例如可例舉:錪鹽、鏻鹽、銻鹽、鋶鹽、及硼酸鹽等。作為上述分子內具有複數個雜環之化合物中之雜環,可例舉:環氧乙烷、氧雜環丁烷、氧雜環戊烷、硫雜環丙烷、及氮丙啶等。Furthermore, a mixture of an organic salt such as an onium salt and a compound containing multiple heterocyclic rings within the molecule can also be used as the active energy ray-reactive compound. In this mixture, the organic salt is cleaved upon exposure to active energy rays (e.g., ultraviolet light or electron beams), generating ions. These ions act as initiators, initiating a ring-opening reaction of the heterocyclic rings, thereby forming a three-dimensional network structure. Examples of such organic salts include iodonium salts, phosphonium salts, antimony salts, stibnium salts, and borate salts. Examples of the heterocyclic ring in the aforementioned compound having a plurality of heterocyclic rings in the molecule include ethylene oxide, cyclohexane, cyclopentane, cyclothiopropane, and aziridine.
於上述黏著劑(A1)中,活性能量線反應性化合物之含有比率相對於基礎聚合物100重量份,較佳為0.1重量份~500重量份,更佳為5重量份~300重量份,進而較佳為40重量份~150重量份。In the adhesive (A1), the active energy ray-reactive compound is preferably contained in an amount of 0.1 to 500 parts by weight, more preferably 5 to 300 parts by weight, and even more preferably 40 to 150 parts by weight, based on 100 parts by weight of the base polymer.
作為上述黏著劑(A2)所包含之活性能量線反應性聚合物(基礎聚合物),例如可例舉具有丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基、及乙炔基等具有碳-碳多重鍵之官能基的聚合物。作為活性能量線反應性聚合物之具體例,可例舉:含有多官能(甲基)丙烯酸酯之聚合物;陽離子光聚合型聚合物;聚桂皮酸乙烯酯等含有桂皮醯基之聚合物;經重氮化之胺基酚醛樹脂;及聚丙烯醯胺等。Examples of the active energy ray-reactive polymer (base polymer) included in the adhesive (A2) include polymers having functional groups with carbon-carbon multiple bonds, such as acryloyl, methacryloyl, vinyl, allyl, and ethynyl groups. Specific examples of active energy ray-reactive polymers include polymers containing multifunctional (meth)acrylates; cationic photopolymerizable polymers; polymers containing cinnamic groups, such as polyvinyl cinnamate; diazotized aminophenol resins; and polyacrylamide.
於一實施方式中,可使用將活性能量線聚合性之碳-碳多重鍵導入至上述丙烯酸系聚合物之側鏈、主鏈及/或主鏈末端而構成之活性能量線反應性聚合物。作為向丙烯酸系聚合物導入輻射聚合性之碳-碳雙鍵之方法,例如可例舉如下方法:使含有具有規定官能基(第1官能基)之單體之原料單體共聚而獲得丙烯酸系聚合物後,使具有可與第1官能基之間產生反應並進行鍵結之規定官能基(第2官能基)、及輻射聚合性碳-碳雙鍵之化合物在維持碳-碳雙鍵之輻射聚合性之狀態下,與丙烯酸系聚合物進行縮合反應或加成反應。In one embodiment, an active energy ray-reactive polymer can be used, wherein active energy ray-polymerizable carbon-carbon multiple bonds are introduced into the side chains, main chain, and/or main chain terminals of the acrylic polymer. As a method for introducing radiation-polymerizable carbon-carbon double bonds into the acrylic polymer, for example, the following method can be cited: after copolymerizing a raw monomer containing a monomer having a predetermined functional group (first functional group) to obtain the acrylic polymer, a compound having a predetermined functional group (second functional group) that reacts with the first functional group to form a bond and a radiation-polymerizable carbon-carbon double bond is subjected to a condensation reaction or an addition reaction with the acrylic polymer while maintaining the radiation-polymerizable carbon-carbon double bond.
作為第1官能基與第2官能基之組合,例如可例舉:羧基與環氧基、環氧基與羧基、羧基與氮丙啶基、氮丙啶基與羧基、羥基與異氰酸基、及異氰酸基與羥基。該等組合中,就追蹤反應之容易度之觀點而言,較佳為羥基與異氰酸基之組合或異氰酸基與羥基之組合。又,製作具有高反應性之異氰酸基之聚合物在技術上難度較高,就丙烯酸系聚合物之製作或獲取之容易度之觀點而言,更佳為丙烯酸系聚合物側之上述第1官能基為羥基且上述第2官能基為異氰酸基之情形。於此情形時,作為兼具輻射聚合性碳-碳雙鍵與作為第2官能基之異氰酸基之異氰酸酯化合物,例如可例舉:甲基丙烯醯異氰酸酯、2-甲基丙烯醯氧乙基異氰酸酯、及間異丙烯基-α,α-二甲基苄基異氰酸酯。又,具有第1官能基之丙烯酸系聚合物較佳為含有上述來自含羥基之單體之結構單元,亦較佳為含有來自2-羥乙基乙烯基醚、4-羥丁基乙烯基醚、或二乙二醇單乙烯基醚等醚系化合物之結構單元。Examples of combinations of the first functional group and the second functional group include a carboxyl group and an epoxy group, an epoxy group and a carboxyl group, a carboxyl group and an aziridine group, an aziridine group and a carboxyl group, a hydroxyl group and an isocyanate group, and an isocyanate group and a hydroxyl group. Of these combinations, from the perspective of ease of reaction tracking, the combination of a hydroxyl group and an isocyanate group or the combination of an isocyanate group and a hydroxyl group is preferred. Furthermore, the production of highly reactive isocyanate polymers is technically difficult. From the perspective of ease of production or acquisition of acrylic polymers, it is more preferred for the first functional group on the acrylic polymer side to be a hydroxyl group and the second functional group to be an isocyanate group. In this case, examples of isocyanate compounds having both a radiation-polymerizable carbon-carbon double bond and an isocyanate group as a second functional group include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, and m-isopropenyl-α,α-dimethylbenzyl isocyanate. Furthermore, the acrylic polymer having a first functional group preferably contains structural units derived from the above-mentioned hydroxyl-containing monomers, and more preferably contains structural units derived from ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, or diethylene glycol monovinyl ether.
上述黏著劑(A2)亦可進而含有上述活性能量線反應性化合物(單體或低聚物)。The adhesive (A2) may further contain the active energy ray-reactive compound (monomer or oligomer).
上述活性能量線硬化型黏著劑可含有紫外線吸收劑及/或光聚合起始劑。所使用之紫外線吸收劑及光聚合起始劑之詳情如下所述。The active energy ray-curable adhesive may contain a UV absorber and/or a photopolymerization initiator. Details of the UV absorber and photopolymerization initiator used are described below.
於一實施方式中,上述活性能量線硬化型黏著劑可含有光敏劑。作為光敏劑,可例舉:川崎化成工業股份有限公司製造之商品名「UVS-581」、9,10-二乙氧基蒽(例如川崎化成工業公司製造,商品名「UVS-1101」)等。作為上述光敏劑之其他例,可例舉:9,10-二丁氧基蒽(例如川崎化成工業公司製造,商品名「UVS-1331」)、2-異丙基9-氧硫𠮿、二苯甲酮、9-氧硫𠮿衍生物、及4,4'-雙(二甲胺基)二苯甲酮等。作為9-氧硫𠮿衍生物,例如可例舉乙氧羰基9-氧硫𠮿、異丙基9-氧硫𠮿等。In one embodiment, the active energy ray-curable adhesive may contain a photosensitizer. Examples of the photosensitizer include: "UVS-581" manufactured by Kawasaki Chemical Industries, Ltd., 9,10-diethoxyanthracene (e.g., "UVS-1101" manufactured by Kawasaki Chemical Industries, Ltd.). Other examples of the photosensitizer include: 9,10-dibutoxyanthracene (e.g., "UVS-1331" manufactured by Kawasaki Chemical Industries, Ltd.), 2-isopropyl-9-oxysulfonylsulfonate, , benzophenone, 9-oxosulfuron Derivatives, and 4,4'-bis(dimethylamino)benzophenone, etc. As 9-oxosulfuron Derivatives, for example, ethoxycarbonyl 9-oxosulfonium , isopropyl 9-oxysulfonium wait.
上述光敏劑之含有比率相對於基礎聚合物100重量份,較佳為0.01重量份~2重量份,更佳為0.5重量份~2重量份。The content ratio of the above-mentioned photosensitizer is preferably 0.01 to 2 parts by weight, and more preferably 0.5 to 2 parts by weight, relative to 100 parts by weight of the base polymer.
較佳為上述活性能量線硬化型黏著劑含有交聯劑。作為交聯劑,例如可例舉:異氰酸酯系交聯劑、環氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、及胺系交聯劑等。The active energy ray-curable adhesive preferably contains a crosslinking agent. Examples of the crosslinking agent include isocyanate crosslinking agents, epoxy crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, carbodiimide crosslinking agents, and amine crosslinking agents.
上述交聯劑之含有比率相對於黏著劑之基礎聚合物100重量份,較佳為0.5重量份~10重量份,更佳為1重量份~8重量份。The content of the crosslinking agent is preferably 0.5 to 10 parts by weight, more preferably 1 to 8 parts by weight, relative to 100 parts by weight of the base polymer of the adhesive.
於一實施方式中,可較佳地使用異氰酸酯系交聯劑。異氰酸酯系交聯劑就可與多種官能基發生反應之觀點而言較佳。作為上述異氰酸酯系交聯劑之具體例,可例舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(東梭公司製造,商品名「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(東梭公司製造,商品名「Coronate HL」)、及六亞甲基二異氰酸酯之異氰尿酸酯體(東梭公司製造,商品名「Coronate HX」)等異氰酸酯加成物等。可較佳地使用具有3個以上異氰酸基之交聯劑。In one embodiment, an isocyanate crosslinking agent is preferably used. Isocyanate crosslinking agents are preferred because they can react with various functional groups. Specific examples of the isocyanate crosslinking agent include: low-order aliphatic polyisocyanates such as butyl diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentyl diisocyanate, cyclohexyl diisocyanate, and isophorone diisocyanate; aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylenediisocyanate; trihydroxymethylpropane/toluene diisocyanate trimer adduct (produced by Dongsoo Co., Ltd., trade name "Coronate L"), trihydroxymethylpropane/hexamethylene diisocyanate trimer adduct (produced by Dongsoo Co., Ltd., trade name "Coronate Isocyanate adducts such as the isocyanurate of hexamethylene diisocyanate (manufactured by Dongsoo Co., Ltd., trade name "Coronate HX") and the like are also suitable. A crosslinking agent having three or more isocyanate groups is preferably used.
活性能量線硬化型黏著劑可視需要進而含有任意適當之添加劑。作為添加劑,例如可例舉:活性能量線聚合促進劑、自由基捕捉劑、偶合劑(例如矽烷偶合劑)、黏著賦予劑、塑化劑(例如偏苯三甲酸酯系塑化劑、均苯四甲酸酯系塑化劑等)、顏料、染料、填充劑、抗老化劑、導電材料、抗靜電劑、光穩定劑、剝離調整劑、軟化劑、界面活性劑、阻燃劑、抗氧化劑、粒子、及紫外線吸收劑等。Active energy ray-curable adhesives may further contain any appropriate additives as needed. Examples of such additives include active energy ray polymerization accelerators, free radical scavengers, coupling agents (e.g., silane coupling agents), adhesion promoters, plasticizers (e.g., trimellitate-based plasticizers, pyromellitate-based plasticizers, etc.), pigments, dyes, fillers, anti-aging agents, conductive materials, antistatic agents, light stabilizers, exfoliation modifiers, softeners, surfactants, flame retardants, antioxidants, particles, and ultraviolet absorbers.
(光聚合起始劑) 作為光聚合起始劑,可使用任意適當之起始劑。作為光聚合起始劑,例如可例舉:4-(2-羥基乙氧基)苯基(2-羥基-2-丙基)酮、α-羥基-α,α'-二甲基苯乙酮、2-甲基-2-羥基苯丙酮、及1-羥基環己基苯基酮等α-酮醇系化合物;甲氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基苯乙酮、及2-甲基-1-[4-(甲硫基)-苯基]-2-𠰌啉基丙烷-1-酮等苯乙酮系化合物;安息香乙醚、安息香異丙醚、及茴香偶姻甲醚等安息香醚系化合物;苯偶醯二甲基縮酮等縮酮系化合物;2-萘磺醯氯等芳香族磺醯氯系化合物;1-苯酮-1,1-丙二酮-2-(鄰乙氧羰基)肟等光活性肟系化合物;二苯甲酮、苯甲醯苯甲酸、及3,3'-二甲基-4-甲氧基二苯甲酮等二苯甲酮系化合物;9-氧硫𠮿、2-氯9-氧硫𠮿、2-甲基9-氧硫𠮿、2,4-二甲基9-氧硫𠮿、異丙基9-氧硫𠮿、2,4-二氯9-氧硫𠮿、2,4-二乙基9-氧硫𠮿、及2,4-二異丙基9-氧硫𠮿等9-氧硫𠮿系化合物;樟腦醌;鹵代酮;醯基膦氧化物;及醯基膦酸酯等。光聚合起始劑之使用量可設定為任意適當之量。 (Photopolymerization initiator) Any appropriate initiator can be used as the photopolymerization initiator. Examples of the photopolymerization initiator include: α-ketoalcohol compounds such as 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl-2-hydroxypropiophenone, and 1-hydroxycyclohexylphenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, and 2-methyl-1-[4-(methylthio)-phenyl]-2-oxo-1-propane -1-ketone and other acetophenone compounds; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether, and anisole methyl ether; ketone compounds such as benzoyl dimethyl ketal; aromatic sulfonyl chloride compounds such as 2-naphthalenesulfonyl chloride; optically active oxime compounds such as 1-benzophenone-1,1-propanedione-2-(o-ethoxycarbonyl)oxime; benzophenone compounds such as benzophenone, benzoylbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone; 9-oxysulfonium , 2-chloro-9-oxysulfuronium , 2-methyl 9-oxosulfuronium , 2,4-dimethyl 9-oxosulfuronium , isopropyl 9-oxysulfonium , 2,4-dichloro-9-oxysulfuronium , 2,4-diethyl 9-oxosulfuron , and 2,4-diisopropyl 9-oxysulfonium 9-Oxosulfuronium compounds; camphorquinone; halogenated ketones; acylphosphine oxides; and acylphosphonates. The amount of the photopolymerization initiator used can be set to any appropriate amount.
於一實施方式中,可使用於400 nm以下(較佳為380 nm以下,更佳為340 nm以下)之範圍內具有最大吸收波長之光聚合起始劑。In one embodiment, a photopolymerization initiator having a maximum absorption wavelength in the range of 400 nm or less (preferably 380 nm or less, more preferably 340 nm or less) can be used.
上述光聚合起始劑之使用量可設定為任意適當之量。The amount of the photopolymerization initiator used can be set to any appropriate amount.
上述光聚合起始劑亦可使用市售品。例如,作為於400 nm以下之範圍內具有最大吸收波長之光聚合起始劑,可例舉巴斯夫公司製造之商品名「Irgacure 127」、「Irgacure 369」、「Irgacure 369E」、「Irgacure 379」、「Irgacure 379EG」、「Irgacure 819」、「Irgacure TOP」、「Irgacure 784」、及「Irgacure OXE01」等。Commercially available photopolymerization initiators may be used. For example, photopolymerization initiators having a maximum absorption wavelength in the range of 400 nm or less include BASF products sold under the trade names "Irgacure 127," "Irgacure 369," "Irgacure 369E," "Irgacure 379," "Irgacure 379EG," "Irgacure 819," "Irgacure TOP," "Irgacure 784," and "Irgacure OXE01."
C.黏著劑層 上述黏著劑層之厚度較佳為30 μm以下,更佳為20 μm以下,進而較佳為10 μm以下。若為此種範圍,則上述效果變得顯著。黏著劑層厚度之下限例如為1 μm(較佳為0.5 μm)。 C. Adhesive Layer The thickness of the adhesive layer is preferably 30 μm or less, more preferably 20 μm or less, and even more preferably 10 μm or less. Within this range, the aforementioned effects are significant. The lower limit of the adhesive layer thickness is, for example, 1 μm (preferably 0.5 μm).
上述黏著劑層於23℃下之壓入彈性模數I較佳為0.05 MPa~20 MPa,更佳為0.08 MPa~10 MPa,進而較佳為0.08 MPa~5 MPa。若為此種範圍,可使由雷射光照射所致之各層之變形適性化,且可獲得利用雷射光照射之剝離性優異之黏著片。此種黏著片於窄範圍內可實現確實之剝離性。The compression modulus (I) of the adhesive layer at 23°C is preferably 0.05 MPa to 20 MPa, more preferably 0.08 MPa to 10 MPa, and even more preferably 0.08 MPa to 5 MPa. Within this range, deformation of each layer caused by laser irradiation can be adaptively controlled, resulting in an adhesive sheet with excellent releasability upon laser irradiation. Such an adhesive sheet can achieve reliable releasability within a narrow range.
上述黏著劑層之波長248 nm之透光率較佳為50%以下,更佳為30%以下,進而較佳為10%以下,特佳為5%以下。上述黏著劑層之波長248 nm之透光率越低越佳,其下限例如為0.5%(較佳為0%)。The light transmittance of the adhesive layer at a wavelength of 248 nm is preferably 50% or less, more preferably 30% or less, further preferably 10% or less, and particularly preferably 5% or less. The lower the light transmittance of the adhesive layer at a wavelength of 248 nm, the better, and its lower limit is, for example, 0.5% (preferably 0%).
上述黏著劑層之波長365 nm之透光率較佳為50%以上,更佳為60%以上,進而較佳為70%以上。上述黏著劑層之波長365 nm之透光率越高越佳,其上限例如為95%(較佳為100%)。The light transmittance of the adhesive layer at a wavelength of 365 nm is preferably 50% or greater, more preferably 60% or greater, and even more preferably 70% or greater. The higher the light transmittance of the adhesive layer at a wavelength of 365 nm, the better. The upper limit is, for example, 95% (preferably 100%).
上述黏著劑層之黏著片之霧度值較佳為70%以下,更佳為65%以下。於一實施方式中,上述黏著劑層之霧度值為20%以下。黏著劑層之霧度值越低越佳,其下限例如為0.1%。The adhesive sheet of the adhesive layer preferably has a haze value of 70% or less, more preferably 65% or less. In one embodiment, the haze value of the adhesive layer is 20% or less. The lower the haze value of the adhesive layer, the better, and its lower limit is, for example, 0.1%.
上述黏著劑層含有任意適當之黏著劑。該黏著劑可使用任意適當之黏著劑,只要可獲得本發明之效果即可。作為上述黏著劑,例如可使用壓敏黏著劑。The adhesive layer contains any suitable adhesive. Any suitable adhesive can be used as long as the effects of the present invention can be achieved. For example, a pressure-sensitive adhesive can be used as the adhesive.
(壓敏黏著劑) 作為壓敏黏著劑,例如可例舉:丙烯酸系黏著劑、橡膠系黏著劑、乙烯基烷基醚系黏著劑、矽酮系黏著劑、聚酯系黏著劑、聚醯胺系黏著劑、胺基甲酸酯系黏著劑、及苯乙烯-二烯嵌段共聚物系黏著劑等。其中較佳為丙烯酸系黏著劑或橡膠系黏著劑,更佳為丙烯酸系黏著劑。再者,上述黏著劑可單獨使用,或可將2種以上組合使用。於一實施方式中,就紫外線吸收之觀點而言,可使用含有具有芳香環及/或雙鍵之基礎聚合物之黏著劑。就此種方面而言,可較佳地使用丙烯酸系黏著劑。 (Pressure-Sensitive Adhesives) Examples of pressure-sensitive adhesives include acrylic adhesives, rubber adhesives, vinyl alkyl ether adhesives, silicone adhesives, polyester adhesives, polyamide adhesives, urethane adhesives, and styrene-diene block copolymer adhesives. Of these, acrylic adhesives and rubber adhesives are preferred, with acrylic adhesives being more preferred. These adhesives may be used alone or in combination of two or more. In one embodiment, from the perspective of UV absorption, an adhesive containing a base polymer having an aromatic ring and/or a double bond may be used. In this regard, acrylic adhesives are preferably used.
作為上述丙烯酸系黏著劑,例如可例舉以丙烯酸系聚合物(均聚物或共聚物)作為基礎聚合物之丙烯酸系黏著劑等,該丙烯酸系聚合物使用1種或2種以上之(甲基)丙烯酸烷基酯作為單體成分。作為(甲基)丙烯酸烷基酯之具體例,可例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、及(甲基)丙烯酸二十烷基酯等(甲基)丙烯酸C1-20烷基酯。其中,可較佳地使用具有碳數為4~18之直鏈狀或支鏈狀之烷基之(甲基)丙烯酸烷基酯。Examples of the acrylic adhesive include acrylic adhesives having an acrylic polymer (homopolymer or copolymer) as a base polymer, wherein the acrylic polymer uses one or more alkyl (meth)acrylates as monomer components. Specific examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, and nonyl (meth)acrylate. C1-20 alkyl (meth)acrylates such as octadecyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, nonadecyl (meth)acrylate, and eicosyl (meth)acrylate are preferably used. Among them, alkyl (meth)acrylates having a linear or branched alkyl group with 4 to 18 carbon atoms are preferably used.
上述丙烯酸系聚合物亦可視需要含有對應於能夠與上述(甲基)丙烯酸烷基酯共聚之其他單體成分的單元,以改善凝集力、耐熱性、交聯性等,。作為此種單體成分,例如可例舉:丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、及丁烯酸等含羧基之單體;馬來酸酐、伊康酸酐等酸酐單體;(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸羥基己酯、(甲基)丙烯酸羥基辛酯、(甲基)丙烯酸羥基癸酯、(甲基)丙烯酸羥基月桂酯、及甲基丙烯酸(4-羥甲基環己基)甲酯等含有羥基之單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、及(甲基)丙烯醯氧基萘磺酸等含磺酸基之單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、及N-羥甲基丙烷(甲基)丙烯醯胺等(N-取代)醯胺系單體;(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲胺基乙酯、及(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸胺基烷基酯系單體;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯系單體;N-環己基馬來醯亞胺、N-異丙基馬來醯亞胺、N-月桂基馬來醯亞胺、及N-苯基馬來醯亞胺等馬來醯亞胺系單體;N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-環己基伊康醯亞胺、及N-月桂基伊康醯亞胺等伊康醯亞胺系單體;N-(甲基)丙烯醯氧基亞甲基丁二醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基丁二醯亞胺、及N-(甲基)丙烯醯基-8-氧基八亞甲基丁二醯亞胺等丁二醯亞胺系單體;乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基𠰌啉、N-乙烯基羧醯胺類、苯乙烯、α-甲基苯乙烯、及N-乙烯基己內醯胺等乙烯基系單體;丙烯腈、甲基丙烯腈等氰基丙烯酸酯單體;(甲基)丙烯酸縮水甘油酯等含有環氧基之丙烯酸系單體;聚乙二醇(甲基)丙烯酸酯、聚丙二醇(甲基)丙烯酸酯、甲氧基乙二醇(甲基)丙烯酸酯、及甲氧基聚丙二醇(甲基)丙烯酸酯等乙二醇系丙烯酸酯單體;(甲基)丙烯酸四氫糠酯、含氟(甲基)丙烯酸酯、(甲基)丙烯酸矽酮酯等具有雜環、鹵素原子、及矽原子等之丙烯酸酯系單體;己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧丙烯酸酯、聚酯丙烯酸酯、及胺基甲酸酯丙烯酸酯等多官能單體;異戊二烯、丁二烯、及異丁烯等烯烴系單體;及乙烯基醚等乙烯基醚系單體等。該等單體成分可單獨使用,或亦可將2種以上組合使用。The acrylic polymer may also contain units corresponding to other monomer components copolymerizable with the alkyl (meth)acrylate, as needed, to improve cohesion, heat resistance, crosslinking, etc. Examples of such monomer components include: monomers containing carboxyl groups such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; acid anhydride monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, and (meth) Monomers containing hydroxyl groups such as hydroxydecyl acrylate, hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl methacrylate; monomers containing sulfonic acid groups such as styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidepropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth)acryloyloxynaphthalenesulfonic acid; (meth)acrylamide, N,N-dimethyl(meth)acrylate (N-substituted)amide monomers such as enamide, N-butyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, and N-hydroxymethylpropane (meth)acrylamide; (meth)acrylamide alkyl (meth)acrylate monomers such as aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and tert-butylaminoethyl (meth)acrylate; methoxyethyl (meth)acrylate, ethyl (meth)acrylate (Meth)acrylate monomers such as methoxyethyl ester; maleimide monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, and N-phenylmaleimide; N-methyliconimide, N-ethyliconimide, N-butyliconimide, N-octyliconimide, N-2-ethylhexyliconimide, N-cyclohexyliconimide, and N-laurylmaleimide. Iconimide monomers such as 1,2-dioxadiazole; N-(meth)acryloyloxymethylenebutaneimide, N-(meth)acryloyl-6-oxyhexamethylenebutaneimide, and N-(meth)acryloyl-8-oxyoctamethylenebutaneimide; vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinyl Vinyl monomers such as pyrimidine, vinylpiperidinium, vinylpyrrolidone, vinylpyrrole, vinylimidazole, vinyloxazole, vinylisocyanate, N-vinylcarboxamides, styrene, α-methylstyrene, and N-vinylcaprolactam; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; acrylic monomers containing epoxy groups such as glycidyl (meth)acrylate; polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate Acrylates, methoxyethylene glycol (meth)acrylate, methoxypolypropylene glycol (meth)acrylate and other ethylene glycol acrylate monomers; (meth)acrylate tetrahydrofurfuryl, fluorinated (meth)acrylate, (meth)acrylate silicone esters and other acrylate monomers having heterocyclic rings, halogen atoms, and silicon atoms; hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate and other ) acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trihydroxymethylpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester acrylate, and urethane acrylate; olefin monomers such as isoprene, butadiene, and isobutylene; and vinyl ether monomers such as vinyl ether. These monomer components may be used alone or in combination of two or more.
作為上述橡膠系黏著劑,例如可例舉以如下橡膠作為基礎聚合物之橡膠系黏著劑:天然橡膠;聚異戊二烯橡膠、苯乙烯-丁二烯(SB)橡膠、苯乙烯-異戊二烯(SI)橡膠、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(SIS)橡膠、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)橡膠、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS)橡膠、苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物(SEPS)橡膠、苯乙烯-乙烯-丙烯嵌段共聚物(SEP)橡膠、再生橡膠、丁基橡膠、聚異丁烯、及其等之改性體等合成橡膠等。Examples of the rubber-based adhesive include those based on the following rubber polymers: natural rubber; polyisoprene rubber, styrene-butadiene (SB) rubber, styrene-isoprene (SI) rubber, styrene-isoprene-styrene block copolymer (SIS) rubber, styrene-butadiene-styrene block copolymer (SBS) rubber, styrene-ethylene-butylene-styrene block copolymer (SEBS) rubber, styrene-ethylene-propylene-styrene block copolymer (SEPS) rubber, styrene-ethylene-propylene block copolymer (SEP) rubber, recycled rubber, butyl rubber, polyisobutylene, and synthetic rubbers such as modified forms thereof.
上述壓敏黏著劑可視需要含有任意適當之添加劑。作為該添加劑,例如可例舉:交聯劑、黏著賦予劑(例如松香系黏著賦予劑、萜烯系黏著賦予劑、及烴系黏著賦予劑等)、塑化劑(例如偏苯三甲酸酯系塑化劑、均苯四甲酸酯系塑化劑)、顏料、染料、抗老化劑、導電材料、抗靜電劑、光穩定劑、剝離調整劑、軟化劑、界面活性劑、阻燃劑、抗氧化劑、紫外線吸收劑、及粒子等。The pressure-sensitive adhesive may contain any appropriate additives as needed. Examples of such additives include crosslinking agents, adhesion promoters (e.g., rosin-based adhesion promoters, terpene-based adhesion promoters, and hydrocarbon-based adhesion promoters), plasticizers (e.g., trimellitic acid ester-based plasticizers and pyromellitic acid ester-based plasticizers), pigments, dyes, anti-aging agents, conductive materials, antistatic agents, light stabilizers, stripping modifiers, softeners, surfactants, flame retardants, antioxidants, ultraviolet absorbers, and particles.
作為上述交聯劑,例如可例舉:異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、及過氧化物系交聯劑,此外還可例舉:脲系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、及胺系交聯劑等。其中較佳為異氰酸酯系交聯劑或環氧系交聯劑。於一實施方式中,就紫外線吸收之觀點而言,可使用具有芳香環及/或雙鍵之交聯劑(例如芳香族異氰酸酯系交聯劑)。Examples of the crosslinking agent include isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, and peroxide crosslinking agents. Urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, and amine crosslinking agents are also included. Among these, isocyanate crosslinking agents and epoxy crosslinking agents are preferred. In one embodiment, from the perspective of UV absorption, a crosslinking agent having an aromatic ring and/or double bond (e.g., an aromatic isocyanate crosslinking agent) can be used.
作為上述異氰酸酯系交聯劑之具體例,可例舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、及異佛爾酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、及苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(東梭公司製造,商品名「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(東梭公司製造,商品名「Coronate HL」)、及六亞甲基二異氰酸酯之異氰尿酸酯體(東梭公司製造,商品名「Coronate HX」)等異氰酸酯加成物等。異氰酸酯系交聯劑之含量可根據所需之黏著力而設定為任意適當之量,相對於基礎聚合物100重量份,代表性的是0.1重量份~20重量份,更佳為0.5重量份~10重量份。Specific examples of the isocyanate crosslinking agent include: lower aliphatic polyisocyanates such as butyl diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentyl diisocyanate, cyclohexyl diisocyanate, and isophorone diisocyanate; aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylenediisocyanate; trihydroxymethylpropane/toluene diisocyanate trimer adduct (produced by Dongsoo Co., Ltd., trade name "Coronate L"), trihydroxymethylpropane/hexamethylene diisocyanate trimer adduct (produced by Dongsoo Co., Ltd., trade name "Coronate Isocyanate adducts such as hexamethylene diisocyanate ("HL"), and the isocyanurate of hexamethylene diisocyanate (manufactured by Dongsoo Co., Ltd., trade name "Coronate HX"). The content of the isocyanate crosslinking agent can be set to any appropriate amount based on the desired adhesion, typically 0.1 to 20 parts by weight, and more preferably 0.5 to 10 parts by weight, relative to 100 parts by weight of the base polymer.
作為上述環氧系交聯劑,例如可例舉:N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-縮水甘油基胺基甲基)環己烷(三菱瓦斯化學公司製造,商品名「Tetrad C」)、1,6-己二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 1600」)、新戊二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 1500NP」)、乙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 40E」)、丙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 70P」)、聚丙二醇二縮水甘油醚(日本油脂公司製造,商品名「EPIOL E-400」)、聚丙二醇二縮水甘油醚(日本油脂公司製造,商品名「EPIOL P-200」)、山梨醇聚縮水甘油醚(長瀨化成公司製造,商品名「DENACOL EX-611」)、丙三醇聚縮水甘油醚(長瀨化成公司製造,商品名「DENACOL EX-314」)、季戊四醇聚縮水甘油醚、聚丙三醇聚縮水甘油醚(長瀨化成公司製造,商品名「DENACOL EX-512」)、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三縮水甘油基-三(2-羥乙基)異氰尿酸酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚、及分子內具有2個以上環氧基之環氧系樹脂等。環氧系交聯劑之含量可根據所需之黏著力而設定為任意適當之量,相對於基礎聚合物100重量份,代表性的是0.01重量份~10重量份,更佳為0.03重量份~5重量份。Examples of the epoxy crosslinking agent include N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N-glycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "Tetrad C"), 1,6-hexanediol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1600"), neopentyl glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1500NP"), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 40E"), propylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 70P"), polypropylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL E-400"), polypropylene glycol diglycidyl ether (manufactured by NOF Corporation, trade name "EPIOL P-200"), sorbitol polyglycidyl ether (manufactured by Nagase Chemicals, trade name "DENACOL EX-611"), glycerol polyglycidyl ether (manufactured by Nagase Chemicals, trade name "DENACOL EX-314"), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (manufactured by Nagase Chemicals, trade name "DENACOL EX-512), sorbitan polyglycidyl ether, trihydroxymethylpropane polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl-tri(2-hydroxyethyl)isocyanurate, resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins having two or more epoxy groups in the molecule. The content of the epoxy crosslinking agent can be set to any appropriate amount depending on the desired adhesion, and is typically 0.01 to 10 parts by weight, more preferably 0.03 to 5 parts by weight, relative to 100 parts by weight of the base polymer.
作為上述黏著賦予劑,例如可例舉:松香系樹脂(例如松香酯樹脂等)、萜烯系樹脂(例如萜烯酚共聚物(萜烯改性酚樹脂)、氫化萜烯樹脂等)、苯并呋喃-茚系樹脂、脂環族飽和烴系樹脂、石油系樹脂(例如脂肪族/芳香族共聚系石油樹脂、芳香族系石油樹脂等烴系石油樹脂等)、及酚系樹脂等。於一實施方式中,就紫外線吸收之觀點而言,可使用具有芳香環及/或雙鍵之交聯劑(例如松香系樹脂)。黏著賦予劑之含量可根據所需之黏著力而設定為任意適當之量,相對於基礎聚合物100重量份,代表性的是1重量份~50重量份,更佳為10重量份~30重量份。Examples of the aforementioned tackifiers include rosin resins (e.g., rosin ester resins), terpene resins (e.g., terpene-phenol copolymers (terpene-modified phenol resins), hydrogenated terpene resins, coumarone-indene resins, alicyclic saturated hydrocarbon resins, petroleum resins (e.g., aliphatic/aromatic copolymerized petroleum resins, aromatic petroleum resins, and other hydrocarbon petroleum resins), and phenolic resins. In one embodiment, from the perspective of UV absorption, a crosslinking agent having an aromatic ring and/or double bond (e.g., a rosin resin) can be used. The content of the adhesion-imparting agent can be set to any appropriate amount according to the required adhesion, and is typically 1 to 50 parts by weight, more preferably 10 to 30 parts by weight, relative to 100 parts by weight of the base polymer.
D.基材 上述基材可含有任意適當之樹脂。作為該樹脂,例如可例舉:聚乙烯系樹脂、聚丙烯系樹脂、聚丁烯系樹脂、及聚甲基戊烯系樹脂等聚烯烴系樹脂、聚胺基甲酸酯系樹脂、聚酯系樹脂、聚醯亞胺系樹脂、聚醚酮系樹脂、聚苯乙烯系樹脂、聚氯乙烯系樹脂、聚偏二氯乙烯系樹脂、氟系樹脂、矽系樹脂、纖維素系樹脂、及離子聚合物樹脂等。其中較佳為聚烯烴系樹脂。 D. Substrate The substrate may contain any appropriate resin. Examples of such resins include polyolefin resins such as polyethylene resins, polypropylene resins, polybutylene resins, and polymethylpentene resins, polyurethane resins, polyester resins, polyimide resins, polyetherketone resins, polystyrene resins, polyvinyl chloride resins, polyvinylidene chloride resins, fluorine resins, silicone resins, cellulose resins, and ionic polymer resins. Polyolefin resins are preferred.
於一實施方式中,上述基材係含有選自由聚對苯二甲酸乙二酯系樹脂、聚醯亞胺系樹脂、聚苯乙烯系樹脂、及聚碳酸酯系樹脂所組成之群中之至少1種。含有該等樹脂之基材就波長248 nm之透光率較低之觀點而言較為有利。In one embodiment, the substrate comprises at least one resin selected from the group consisting of polyethylene terephthalate resins, polyimide resins, polystyrene resins, and polycarbonate resins. Substrates comprising these resins are advantageous in that they have lower transmittance at a wavelength of 248 nm.
上述基材之厚度較佳為2 μm~300 μm,更佳為2 μm~100 μm,進而較佳為2 μm~50 μm。於一實施方式中,上述基材之厚度為未達50 μm,更佳為30 μm以下,進而較佳為20 μm以下,特佳為10 μm以下,最佳為5 μm以下。藉由使基材之厚度較薄,可獲得黏著劑層上產生之應變易於傳播至轉印層而剝離性優異之黏著片。The thickness of the substrate is preferably 2 μm to 300 μm, more preferably 2 μm to 100 μm, and even more preferably 2 μm to 50 μm. In one embodiment, the thickness of the substrate is less than 50 μm, more preferably 30 μm or less, even more preferably 20 μm or less, particularly preferably 10 μm or less, and most preferably 5 μm or less. A thinner substrate allows strain generated in the adhesive layer to be easily transferred to the transfer layer, resulting in an adhesive sheet with excellent releasability.
上述基材於23℃下之壓入彈性模數較佳為5000 MPa以下,更佳為3000 MPa以下,進而較佳為1000 MPa以下。若為此種範圍,則可製成不易吸收黏著劑層所產生之應變且易於將應變傳播至轉印層的基材。基材於23℃下之壓入彈性模數之下限較佳為1 MPa,更佳為5 MPa,進而較佳為10 MPa。若為此種範圍,則可獲得具有適度剛性且處理性優異之黏著片。The substrate's compression modulus at 23°C is preferably 5000 MPa or less, more preferably 3000 MPa or less, and even more preferably 1000 MPa or less. Within this range, the substrate is less susceptible to strain generated by the adhesive layer and readily transmits strain to the transfer layer. The lower limit of the substrate's compression modulus at 23°C is preferably 1 MPa, more preferably 5 MPa, and even more preferably 10 MPa. Within this range, an adhesive sheet with moderate rigidity and excellent handleability is obtained.
基材之全光線透過率較佳為70%以上,更佳為80%以上,進而較佳為90%以上,特佳為95%以上。基材之全光線透過率之上限例如為98%(較佳為99%)。The total light transmittance of the substrate is preferably 70% or higher, more preferably 80% or higher, further preferably 90% or higher, and particularly preferably 95% or higher. The upper limit of the total light transmittance of the substrate is, for example, 98% (preferably 99%).
E.黏著片之製造方法 上述黏著片可藉由任意適當之方法來製造。黏著片例如可於基材或剝離襯墊上分別塗佈會形成黏著劑層及轉印層之上述黏著劑而獲得。作為塗佈方法,可採用:棒式塗佈機塗佈、氣刀塗佈、凹版塗佈、反向凹版塗佈、逆輥塗佈、模唇塗佈、模塗佈、浸漬塗佈、膠版印刷、柔版印刷、及網版印刷等各種方法。又,亦可藉由於剝離襯墊上形成黏著劑層,於另一剝離襯墊上形成轉印層,並將該等貼合、或將其等貼合於基材,而形成黏著片。 E. Adhesive Sheet Manufacturing Method The adhesive sheet can be manufactured by any suitable method. For example, the adhesive sheet can be obtained by separately coating the adhesive described above on a substrate or a release liner to form an adhesive layer and a transfer layer. Various coating methods can be used, including bar coating, air knife coating, gravure coating, reverse gravure coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexographic printing, and screen printing. Alternatively, an adhesive sheet can be formed by forming an adhesive layer on a release liner, forming a transfer layer on another release liner, and laminating these or laminating them to a substrate.
F.黏著片之使用方法 本發明之黏著片可用於在加工及/或輸送任意適當之被加工構件(例如電子零件)時暫時固定該被加工構件之情形。作為本發明之黏著片之使用方法,例如可例舉如下方法:(i)將黏著劑層貼合於支持體;(ii)將被加工構件貼合於被黏著片之轉印層以進行固定;(ii)加工或輸送該被加工構件;(iii)對黏著片照射活性能量線(例如紫外線)而使黏著片之轉印層側之黏著力降低;(iv)對需要顯現剝離性之部位照射雷射光,以使黏著劑層產生應變來使用。根據該方法,能夠藉由自然落下使被加工構件剝離。又,於將複數個被加工構件暫時固定之情形時,亦能夠僅剝離其一部分。若使用本發明之黏著片,則可使黏著力降低至會自然落下之程度,因此即使為非常小(例如50 μm見方)之被加工構件,亦能夠逐個分別地剝離。 F. Adhesive Sheet Usage Method The adhesive sheet of the present invention can be used to temporarily secure any suitable workpiece (e.g., electronic components) during processing and/or transport. Examples of methods for using the adhesive sheet of the present invention include: (i) attaching the adhesive layer to a support; (ii) attaching the workpiece to the transfer layer of the adhesive sheet to secure it; (iii) processing or transporting the workpiece; (iv) irradiating the adhesive sheet with active energy radiation (e.g., ultraviolet radiation) to reduce the adhesive strength of the transfer layer side of the adhesive sheet; and (iv) irradiating the area where releasability is desired with laser light to induce strain in the adhesive layer. This method enables the workpiece to be released by natural falling. Furthermore, when temporarily securing multiple workpieces, it is possible to peel only a portion of them. The adhesive sheet of the present invention reduces the adhesive force to a level that allows the workpiece to fall off naturally, allowing even very small workpieces (e.g., 50 μm square) to be peeled off individually.
作為上述(i)中之支持體,例如可使用玻璃板。支持體較佳為具有透光性。支持體之全光線透過率例如為50%以上,較佳為80%以上。As the support in (i) above, a glass plate can be used, for example. The support is preferably light-transmissive. The total light transmittance of the support is, for example, 50% or more, preferably 80% or more.
於一實施方式中,上述(iii)中之活性能量線係從黏著片之黏著劑層側(實質上為支持體側)照射的。In one embodiment, the active energy rays in the above-mentioned (iii) are irradiated from the adhesive layer side (substantially the support side) of the adhesive sheet.
於一實施方式中,上述(iv)中之雷射光係從黏著片之黏著劑層側(實質上為支持體側)照射的。In one embodiment, the laser light in (iv) above is irradiated from the adhesive layer side (substantially the support side) of the adhesive sheet.
於一實施方式中,上述雷射光之波長為200 nm~300 nm。 [實施例] In one embodiment, the wavelength of the laser light is 200 nm to 300 nm. [Example]
以下,藉由實施例對本發明具體地進行說明,但本發明並不限定於該等實施例。實施例之試驗及評估方法如下所述。又,只要未特別標明,則「份」及「%」即為重量標準。The present invention is described in detail below using examples, but the present invention is not limited to these examples. The testing and evaluation methods of the examples are described below. Furthermore, unless otherwise specified, "parts" and "%" are by weight.
(1)黏著劑層對於玻璃之黏著力I 將黏著片之轉印層側PET(Polyethylene terephthalate,聚對苯二甲酸乙二醇酯)隔離膜剝離後,貼合於厚度25 μm之PET(東麗製造,Lumirror S10)。之後將另一面之PET隔離膜剝離,藉由使2 kg之輥往返1次而貼合於玻璃板(松浪玻璃工業公司製造,商品名「S200423」),利用按照JIS Z 0237:2000之方法(剝離角度180°、剝離速度(拉伸速度)300 mm/min、測定溫度:23℃)來測定黏著力。 (1) Adhesion of adhesive layer to glass I After peeling off the PET (Polyethylene terephthalate) separator film on the transfer layer side of the adhesive sheet, it was laminated to a 25 μm thick PET (Lumirror S10 manufactured by Toray). The PET separator film on the other side was then peeled off and laminated to a glass plate (S200423 manufactured by Matsunami Glass Industries Co., Ltd.) by moving a 2 kg roller back and forth once. The adhesion was measured using the method according to JIS Z 0237:2000 (peeling angle 180°, peeling speed (tensile speed) 300 mm/min, measurement temperature: 23°C).
(2)轉印層對於不鏽鋼板之黏著力 將黏著片之黏著劑層側PET隔離膜(於比較例2中係貼合於轉印層之一PET隔離膜)剝離後,貼合於厚度25 μm之PET(東麗製造,Lumirror S10)。之後將另一面之PET隔離膜剝離,藉由使2 kg之輥往返1次而貼合於SUS304(Steel Use Stainless 304,304不鏽鋼),利用按照JIS Z 0237:2000之方法(剝離角度180°、剝離速度(拉伸速度)300 mm/min、測定溫度:23℃)來測定黏著力,並作為初始黏著力A。 利用相同之方法,將黏著片貼合於SUS304後,使用紫外線照射裝置(日東精機製造,商品名「UM-810」),從黏著劑層側整面地照射高壓水銀燈之紫外線(特定波長:365 nm、累計光量:300 mJ/cm 2)後,同樣地測定黏著力,並作為硬化後黏著力B。 (2) Adhesion of the transfer layer to the stainless steel plate: After peeling off the PET separator film on the adhesive layer side of the adhesive sheet (in Comparative Example 2, it was a PET separator film bonded to the transfer layer), the sheet was bonded to 25 μm thick PET (Lumirror S10 manufactured by Toray). The PET separator film on the other side was then peeled off and bonded to SUS304 (Steel Use Stainless 304, 304 stainless steel) by moving a 2 kg roller back and forth once. The adhesion was measured using the method according to JIS Z 0237:2000 (peeling angle 180°, peeling speed (tensile speed) 300 mm/min, measuring temperature: 23°C) and was taken as the initial adhesion A. Using the same method, the adhesive sheet was bonded to SUS304 and then irradiated with ultraviolet light (specific wavelength: 365 nm, cumulative light intensity: 300 mJ/cm 2 ) from the adhesive layer side using a UV irradiation device (Nitto Seiki, trade name "UM-810"). The adhesive strength was then measured in the same manner and designated as the post-curing adhesive strength B.
(3)壓入彈性模數(硬化前) 關於黏著劑層及轉印層之壓入彈性模數,係使用Hysitron公司製造之TriboIndenter TI-950測定壓入彈性模數而得。測定係藉由23℃下之單一壓入法,以壓入速度10 nm/s、壓入深度100 nm來進行。 (3) Indentation Modulus (Before Curing) The indentation modulus of the adhesive layer and transfer layer was measured using a TriboIndenter TI-950 manufactured by Hysitron. The measurement was performed using a single indentation method at 23°C, with an indentation speed of 10 nm/s and an indentation depth of 100 nm.
(4)壓入彈性模數(硬化後) 將黏著片之黏著劑層側PET隔離膜(於比較例2中,貼合於轉印層之一PET隔離膜)剝離後,使用手動輥貼合於大型載玻片(松浪玻璃製造,商品名「S9111」)。使用紫外線照射裝置(日東精機製造,商品名「UM-810」),從所得之樣品之載玻片面側整面地照射高壓水銀燈之紫外線(特定波長:365 nm、累計光量:300 mJ/cm 2)。之後,剝離另一PET隔離膜而使轉印層露出,使用Hysitron公司製造之TriboIndenter TI-950來測定壓入彈性模數。測定係藉由23℃下之單一壓入法,以壓入速度10 nm/s、壓入深度100 nm來進行。 (4) Pressed elastic modulus (after curing) After peeling off the PET separator film on the adhesive layer side of the adhesive sheet (in Comparative Example 2, one of the PET separator films bonded to the transfer layer) and bonding it to a large glass slide (Matsunami Glass, trade name "S9111") using a manual roller. Using a UV irradiation device (Nitto Seiki, trade name "UM-810"), the entire surface of the glass slide of the obtained sample was irradiated with ultraviolet light from a high-pressure mercury lamp (specific wavelength: 365 nm, cumulative light intensity: 300 mJ/ cm2 ). Afterwards, the other PET separator was peeled off to expose the transfer layer. The indentation modulus was measured using a Hysitron TriboIndenter TI-950. The measurement was performed using a single indentation method at 23°C, with an indentation speed of 10 nm/s and an indentation depth of 100 nm.
(5)霧度值 使用霧度計(村上色彩技術研究所製造,商品名「HAZE METER HM-150」),測定黏著片之霧度值。 (5) Haze value Use a haze meter (manufactured by Murakami Color Technology Laboratory, trade name "HAZE METER HM-150") to measure the haze value of the adhesive sheet.
(6)透光率 使用分光光度計(Hitachi High-Tech Science製造,商品名「分光光度計U-4100」),測定黏著片之波長365 nm之透光率及248 nm之透光率。 (6) Light transmittance Using a spectrophotometer (manufactured by Hitachi High-Tech Science, trade name "Spectrophotometer U-4100"), the light transmittance of the adhesive sheet at a wavelength of 365 nm and 248 nm was measured.
(7)剝離性(轉印性) 將黏著片之黏著劑層側PET隔離膜(於比較例2中,係貼合於轉印層之一PET隔離膜)剝離後,使用手動輥貼合於石英板(AS ONE公司製造)。之後,將另一面之PET隔離膜剝離後,使125 μm×100 μm之矽晶片貼合於轉印層之黏著面。 使用紫外線照射裝置(日東精機製造,商品名「UM-810」),從石英板面側整面地照射高壓水銀燈之紫外線(特定波長:365 nm、累計光量:300 mJ/cm 2)。 之後,從石英板側,僅對目標構件位置照射(1 plus per chip)波長248 nm之雷射光(照射面積:130 μm×105 μm、輸出100 mJ/cm 2),將自然落下之情形評估為合格(〇),將未自然落下之情形評估為不合格(×)。 (7) Releasability (Transferability) After peeling off the PET separator film on the adhesive layer side of the adhesive sheet (in Comparative Example 2, it is one of the PET separator films attached to the transfer layer), it was attached to a quartz plate (manufactured by AS ONE) using a manual roller. After that, the PET separator film on the other side was peeled off, and a 125 μm × 100 μm silicon wafer was attached to the adhesive surface of the transfer layer. Using an ultraviolet irradiation device (manufactured by Nitto Seiki, trade name "UM-810"), the entire surface of the quartz plate was irradiated with ultraviolet rays from a high-pressure mercury lamp (specific wavelength: 365 nm, cumulative light intensity: 300 mJ/ cm2 ). Afterwards, only the target component position was irradiated (1 plus per chip) with 248 nm laser light (irradiation area: 130 μm × 105 μm, output 100 mJ/cm 2 ) from the quartz plate side. Those that naturally fell off were evaluated as passing (0), while those that did not naturally fall off were evaluated as failing (×).
(8)有無變形 藉由顯微鏡觀察雷射照射後之轉印層表面之變形。將在雷射照射部位與除此以外之部位之間能觀察到顯著色差之情形評估為不合格(×),將並非如此之情形評估為合格(○)。 又,將實施例1(有無變形評估:合格)之轉印層表面之顯微鏡照相圖示於圖2(a)中,將比較例1(有無變形評估:不合格)之轉印層表面之顯微鏡照相圖示於圖2(b)中。 (8) Deformation The deformation of the transfer layer surface after laser irradiation was observed under a microscope. Cases where a significant color difference was observed between the laser irradiated area and other areas were evaluated as unacceptable (×), and cases where no significant color difference was observed were evaluated as acceptable (○). In addition, a microscope photograph of the transfer layer surface of Example 1 (evaluation of deformation: acceptable) is shown in Figure 2(a), and a microscope photograph of the transfer layer surface of Comparative Example 1 (evaluation of deformation: unacceptable) is shown in Figure 2(b).
(9)糊劑殘留 目視觀察上述「(1)黏著劑層對於玻璃之黏著力」之評估後之玻璃板。將玻璃上殘留黏著劑層之情形評估為不合格(×),將並非如此之情形評估為合格(○)。 (9) Residue of adhesive Visually inspect the glass plate after the evaluation of "(1) Adhesion of adhesive layer to glass" above. If there is residual adhesive layer on the glass, evaluate it as unacceptable (×); if there is no residual adhesive layer on the glass, evaluate it as acceptable (○).
[製造例1]丙烯酸聚合物I之調整 將丙烯酸2-乙基己酯30重量份、丙烯酸丁酯70重量份、丙烯酸3重量份、及丙烯酸4-羥基丁酯1重量份加以混合,而製備單體組合物。 繼而,將氮氣導入至具備有氮氣導入管、溫度計、及攪拌機之反應容器中,於氮氣氛圍下,添加上述單體組合物103.1重量份、過氧化苯甲醯(BPO)0.2重量份、及甲苯150重量份,於60℃下攪拌6小時,獲得含有丙烯酸系聚合物I之丙烯酸系聚合物溶液I。 [Production Example 1] Preparation of Acrylic Polymer I A monomer composition was prepared by mixing 30 parts by weight of 2-ethylhexyl acrylate, 70 parts by weight of butyl acrylate, 3 parts by weight of acrylic acid, and 1 part by weight of 4-hydroxybutyl acrylate. Next, nitrogen gas was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer. Under a nitrogen atmosphere, 103.1 parts by weight of the monomer composition, 0.2 parts by weight of benzoyl peroxide (BPO), and 150 parts by weight of toluene were added. The mixture was stirred at 60°C for 6 hours to obtain an acrylic polymer solution I containing acrylic polymer I.
[製造例2]丙烯酸聚合物II之調整 將丙烯酸乙酯70重量份、丙烯酸2-羥基乙酯30重量份、甲基丙烯酸甲酯5重量份、及丙烯酸羥基乙酯4重量份加以混合,而製備單體組合物。 繼而,將氮氣導入至具備有氮氣導入管、溫度計、及攪拌機之反應容器中,於氮氣氛圍下,添加甲苯295重量份、上述單體組合物109重量份、及過氧化苯甲醯(BPO)0.2重量份,於60℃下攪拌6小時,獲得含有重量平均分子量50萬之丙烯酸系聚合物II之丙烯酸系聚合物溶液II。 [Production Example 2] Preparation of Acrylic Polymer II A monomer composition was prepared by mixing 70 parts by weight of ethyl acrylate, 30 parts by weight of 2-hydroxyethyl acrylate, 5 parts by weight of methyl methacrylate, and 4 parts by weight of hydroxyethyl acrylate. Next, nitrogen gas was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer. Under a nitrogen atmosphere, 295 parts by weight of toluene, 109 parts by weight of the monomer composition, and 0.2 parts by weight of benzoyl peroxide (BPO) were added. The mixture was stirred at 60°C for 6 hours to obtain an acrylic polymer solution II containing an acrylic polymer II with a weight-average molecular weight of 500,000.
[製造例3]丙烯酸聚合物III之調整 將丙烯酸2-乙基己酯100重量份、丙烯酸2重量份、及三羥甲基丙烷三丙烯酸酯0.01重量加以混合,而製備單體組合物。 繼而,將氮氣導入至具備有氮氣導入管、溫度計、及攪拌機之反應容器中,於氮氣氛圍下,添加上述單體組合物102.01重量份、過氧化苯甲醯(BPO)0.2重量份、及甲苯189重量份,於60℃下攪拌7小時,獲得含有丙烯酸系聚合物III之丙烯酸系聚合物溶液III。 [Preparation Example 3] Preparation of Acrylic Polymer III A monomer composition was prepared by mixing 100 parts by weight of 2-ethylhexyl acrylate, 2 parts by weight of acrylic acid, and 0.01 parts by weight of trihydroxymethylpropane triacrylate. Next, nitrogen gas was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer. Under a nitrogen atmosphere, 102.01 parts by weight of the monomer composition, 0.2 parts by weight of benzoyl peroxide (BPO), and 189 parts by weight of toluene were added. The mixture was stirred at 60°C for 7 hours to obtain an acrylic polymer solution III containing acrylic polymer III.
[製造例4]丙烯酸聚合物IV之調整 將丙烯酸丁酯100重量份、丙烯酸乙酯78重量份、及丙烯酸羥基乙酯40重量份加以混合,而製備單體組合物。 繼而,將氮氣導入至具備有氮氣導入管、溫度計、及攪拌機之反應容器中,於氮氣氛圍下,添加甲苯507重量份、上述單體組合物218重量份、及過氧化苯甲醯(BPO)1.2重量份,於60℃下攪拌5小時。之後,冷卻至室溫,添加2-甲基丙烯醯氧乙基異氰酸酯42.6重量份並使其發生反應,於共聚物中之丙烯酸2-羥基乙酯之側鏈末端OH基上加成NCO基,獲得含有於末端具有碳-碳雙鍵之丙烯酸系聚合物IV之丙烯酸系聚合物溶液IV。 [Preparation Example 4] Preparation of Acrylic Polymer IV A monomer composition was prepared by mixing 100 parts by weight of butyl acrylate, 78 parts by weight of ethyl acrylate, and 40 parts by weight of hydroxyethyl acrylate. Next, nitrogen gas was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer. Under a nitrogen atmosphere, 507 parts by weight of toluene, 218 parts by weight of the monomer composition, and 1.2 parts by weight of benzoyl peroxide (BPO) were added, and the mixture was stirred at 60°C for 5 hours. The mixture was then cooled to room temperature, and 42.6 parts by weight of 2-methacryloyloxyethyl isocyanate was added and allowed to react, thereby adding NCO groups to the terminal OH groups of the side chains of 2-hydroxyethyl acrylate in the copolymer, thereby obtaining an acrylic polymer solution IV containing an acrylic polymer IV having a carbon-carbon double bond at the terminal end.
[製造例5]丙烯酸聚合物V之調整 將丙烯酸2-乙基己酯100重量份、丙烯醯𠰌啉25.5重量份、及丙烯酸羥基乙酯18.5重量份加以混合,而製備單體組合物。 繼而,將氮氣導入至具備有氮氣導入管、溫度計、及攪拌機之反應容器中,於氮氣氛圍下,添加甲苯60重量份、上述單體組合物144重量份、及過氧化苯甲醯(BPO)0.3重量份,於60℃下攪拌4小時。之後,冷卻至室溫,添加2-甲基丙烯醯氧乙基異氰酸酯12重量份並使其發生反應,於共聚物中之丙烯酸2-羥基乙酯之側鏈末端OH基上加成NCO基,獲得含有於末端具有碳-碳雙鍵之丙烯酸系聚合物V之丙烯酸系聚合物溶液V。 [Production Example 5] Preparation of Acrylic Polymer V A monomer composition was prepared by mixing 100 parts by weight of 2-ethylhexyl acrylate, 25.5 parts by weight of acryloyl thiophene, and 18.5 parts by weight of hydroxyethyl acrylate. Next, nitrogen gas was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer. Under a nitrogen atmosphere, 60 parts by weight of toluene, 144 parts by weight of the monomer composition, and 0.3 parts by weight of benzoyl peroxide (BPO) were added, and the mixture was stirred at 60°C for 4 hours. The mixture was then cooled to room temperature, and 12 parts by weight of 2-methacryloyloxyethyl isocyanate was added and allowed to react, thereby adding NCO groups to the terminal OH groups of the side chains of 2-hydroxyethyl acrylate in the copolymer, thereby obtaining an acrylic polymer solution V containing an acrylic polymer V having a carbon-carbon double bond at the terminal end.
[製造例6]丙烯酸聚合物VI之調整 將丙烯酸2-甲氧基乙酯100重量份、丙烯醯𠰌啉27重量份、及丙烯酸2-羥基乙酯22重量份加以混合,而製備單體組合物。 繼而,將氮氣導入至具備有氮氣導入管、溫度計、及攪拌機之反應容器中,於氮氣氛圍下,添加甲苯500重量份、上述單體組合物149重量份、及過氧化苯甲醯(BPO)0.3重量份,於60℃下攪拌5小時攪拌。之後,冷卻至室溫,添加2-甲基丙烯醯氧乙基異氰酸酯24重量份並使其發生反應,於共聚物中之丙烯酸2-羥基乙酯之側鏈末端OH基上加成NCO基,獲得含有於末端具有碳-碳雙鍵之丙烯酸系聚合物VI之丙烯酸系聚合物溶液VI。 [Preparation Example 6] Preparation of Acrylic Polymer VI A monomer composition was prepared by mixing 100 parts by weight of 2-methoxyethyl acrylate, 27 parts by weight of acryloyl thiophene, and 22 parts by weight of 2-hydroxyethyl acrylate. Next, nitrogen gas was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer. Under a nitrogen atmosphere, 500 parts by weight of toluene, 149 parts by weight of the monomer composition, and 0.3 parts by weight of benzoyl peroxide (BPO) were added, and the mixture was stirred at 60°C for 5 hours. The mixture was then cooled to room temperature, and 24 parts by weight of 2-methacryloyloxyethyl isocyanate was added and reacted to form an NCO group at the terminal OH group of the side chain of 2-hydroxyethyl acrylate in the copolymer, yielding an acrylic polymer solution VI containing an acrylic polymer having a carbon-carbon double bond at the terminal end.
[實施例1] (黏著劑之製備) 於含有100重量份之丙烯酸聚合物I之丙烯酸系聚合物溶液I中,添加交聯劑(東梭公司製造,商品名「Coronate L」)2重量份、黏著賦予樹脂(荒川化學工業公司製造,商品名「D-125」)30重量份,而獲得黏著劑層形成用之黏著劑(1)。 於含有100重量份之丙烯酸聚合物IV之丙烯酸聚合物溶液IV中,添加交聯劑(東梭公司製造,商品名「Coronate L」)3重量份、光聚合起始劑(巴斯夫公司製造,商品名「Irgacure 127」)10重量份,而獲得轉印層形成用之黏著劑(A)。 (黏著片) 於PET隔離膜(厚度:38 μm)之矽酮處理面上塗佈上述黏著劑(1),之後於120℃下加熱2分鐘,而形成厚度4 μm之黏著劑層。 另外,於PET隔離膜(厚度:75 μm)之矽酮處理面上塗佈上述黏著劑(A),之後於120℃下加熱2分鐘,而形成厚度5 μm之轉印層。 於PET基材(東麗公司製造,商品名「Lumirror 2DC61」,厚度:2 μm)之一面上貼合附有PET隔離膜之黏著劑層,於另一面上貼合附有PET隔離膜之轉印層,獲得了含有PET隔離膜/黏著劑層/基材/轉印層/PET隔離膜之黏著片。 對所得之黏著片進行上述評估。將結果示於表1中。 [Example 1] (Preparation of adhesive) To an acrylic polymer solution I containing 100 parts by weight of acrylic polymer I, 2 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name "Coronate L") and 30 parts by weight of an adhesive-imparting resin (manufactured by Arakawa Chemical Industries, Ltd., trade name "D-125") were added to obtain an adhesive (1) for forming an adhesive layer. To an acrylic polymer solution IV containing 100 parts by weight of acrylic polymer IV, 3 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name "Coronate L") and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, trade name "Irgacure 127") were added to obtain an adhesive (A) for forming a transfer layer. (Adhesive Sheet) The adhesive (1) was applied to the silicone treated surface of a PET separator film (thickness: 38 μm), and then heated at 120°C for 2 minutes to form an adhesive layer with a thickness of 4 μm. Separately, the adhesive (A) was applied to the silicone treated surface of a PET separator film (thickness: 75 μm), and then heated at 120°C for 2 minutes to form a transfer layer with a thickness of 5 μm. An adhesive layer with a PET separator film attached was laminated to one side of a PET substrate (Toray Industries, trade name "Lumirror 2DC61," thickness: 2 μm). A transfer layer with a PET separator film attached was laminated to the other side, resulting in an adhesive sheet consisting of a PET separator film/adhesive layer/substrate/transfer layer/PET separator film. The resulting adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[實施例2] 除使用含有100重量份之丙烯酸聚合物V之丙烯酸聚合物溶液V來代替丙烯酸聚合物溶液IV以外,與實施例1同樣地操作而獲得黏著片。對所得之黏著片進行上述評估。將結果示於表1中。 [Example 2] An adhesive sheet was obtained in the same manner as in Example 1, except that acrylic polymer solution V containing 100 parts by weight of acrylic polymer V was used instead of acrylic polymer solution IV. The obtained adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[實施例3] 於含有100重量份之丙烯酸聚合物VI之丙烯酸聚合物溶液VI中,添加交聯劑(東梭公司製造,商品名「Coronate L」)5重量份、光聚合起始劑(巴斯夫公司製造,商品名「Irgacure 127」)10重量份,獲得轉印層形成用之黏著劑(C)。 除使用黏著劑(C)來代替黏著劑(A)而形成轉印層以外,與實施例1同樣地操作而獲得黏著片。對所得之黏著片進行上述評估。將結果示於表1中。 [Example 3] To an acrylic polymer solution VI containing 100 parts by weight of acrylic polymer VI, 5 parts by weight of a crosslinking agent (manufactured by Dongsoo Co., Ltd., trade name "Coronate L") and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, trade name "Irgacure 127") were added to obtain an adhesive (C) for forming a transfer layer. Example 1 was similar to Example 1, except that adhesive (C) was used instead of adhesive (A) to form the transfer layer. An adhesive sheet was obtained. The obtained adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[實施例4] 於含有100重量份之丙烯酸聚合物VI之丙烯酸聚合物溶液VI中,添加交聯劑(東梭公司製造,商品名「Coronate L」)5重量份、光聚合起始劑(巴斯夫公司製造,商品名「Irgacure 127」)10重量份、及二氧化矽微粒子(雅都瑪公司製造,商品名「YA050C」)5重量份,而獲得轉印層形成用之黏著劑(D)。 除使用黏著劑(D)來代替黏著劑(A)而形成轉印層以外,與實施例1同樣地操作而獲得黏著片。對所得之黏著片進行上述評估。將結果示於表1中。 [Example 4] To 100 parts by weight of acrylic polymer solution VI, 5 parts by weight of a crosslinking agent ("Coronate L," manufactured by Dongsoo Co., Ltd.), 10 parts by weight of a photopolymerization initiator ("Irgacure 127," manufactured by BASF), and 5 parts by weight of silica microparticles ("YA050C," manufactured by Yaduma Co., Ltd.) were added to obtain an adhesive (D) for forming a transfer layer. Example 1: An adhesive sheet was obtained by following the same procedures as in Example 1, except that adhesive (D) was used instead of adhesive (A) to form the transfer layer. The obtained adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[實施例5] 除將黏著劑層之厚度設為20 μm以外,與實施例3同樣地操作而獲得了黏著片。對所得之黏著片進行上述評估。將結果示於表1中。 [Example 5] An adhesive sheet was obtained by following the same procedures as in Example 3, except that the adhesive layer thickness was changed to 20 μm. The obtained adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[實施例6] (黏著劑之製備) 與實施例1同樣地操作而獲得了黏著劑層形成用之黏著劑(1)。 於含有100重量份之丙烯酸聚合物VI之丙烯酸聚合物溶液VI中,添加交聯劑(東梭公司製造,商品名「Coronate L」)5重量份、光聚合起始劑(巴斯夫公司製造,商品名「Irgacure 127」)10重量份、及紫外線吸收劑(巴斯夫公司製造,商品名「Tinuvin 405」,分子量:583.8)5重量份,而獲得轉印層形成用之黏著劑(E)。 (黏著片) 於PET隔離膜(厚度:38 μm)之矽酮處理面上塗佈上述黏著劑(1),之後於120℃下加熱2分鐘,而形成厚度4 μm之黏著劑層。 另外,於PET隔離膜(厚度:75 μm)之矽酮處理面上塗佈上述黏著劑(E),之後於120℃下加熱2分鐘,而形成厚度5 μm之轉印層。 於PET基材(東麗公司製造,商品名「Lumirror S10」,厚度:25 μm)之一面貼合附有PET隔離膜之黏著劑層,於另一面貼合附有PET隔離膜之轉印層,獲得含有PET隔離膜/黏著劑層/基材/轉印層/PET隔離膜之黏著片。 對所得之黏著片進行上述評估。將結果示於表1中。 [Example 6] (Preparation of Adhesive) The same operation as in Example 1 was performed to obtain an adhesive (1) for forming an adhesive layer. To an acrylic polymer solution VI containing 100 parts by weight of acrylic polymer VI, 5 parts by weight of a crosslinking agent (manufactured by Dongsoo Co., Ltd., trade name "Coronate L"), 10 parts by weight of a photopolymerization initiator (manufactured by BASF, trade name "Irgacure 127"), and 5 parts by weight of an ultraviolet absorber (manufactured by BASF, trade name "Tinuvin 405", molecular weight: 583.8) were added to obtain an adhesive (E) for forming a transfer layer. (Adhesive sheet) The adhesive (1) was applied to the silicone treated surface of a PET separator film (thickness: 38 μm), and then heated at 120°C for 2 minutes to form an adhesive layer with a thickness of 4 μm. Separately, the adhesive (E) was applied to the silicone treated surface of a PET separator film (thickness: 75 μm), and then heated at 120°C for 2 minutes to form a transfer layer with a thickness of 5 μm. An adhesive layer with a PET separator film attached was laminated to one side of a PET substrate (Toray Industries, trade name "Lumirror S10," thickness: 25 μm). A transfer layer with a PET separator film attached was laminated to the other side, resulting in an adhesive sheet consisting of a PET separator film/adhesive layer/substrate/transfer layer/PET separator film. The resulting adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[實施例7] 除將轉印層之厚度設為25 μm以外,與實施例3同樣地操作從而獲得黏著片。對所得之黏著片進行上述評估。將結果示於表1中。 [Example 7] An adhesive sheet was obtained by following the same procedures as in Example 3, except that the thickness of the transfer layer was changed to 25 μm. The obtained adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[實施例8] (黏著劑之製備) 於含有100重量份之丙烯酸聚合物II之丙烯酸系聚合物溶液II中,添加交聯劑(東梭公司製造,商品名「Coronate L」)8.5重量份,獲得黏著劑層形成用之黏著劑(2)。 與實施例3同樣地操作而獲得了轉印層形成用之黏著劑(C)。 (黏著片) 於PET隔離膜(厚度:38 μm)之矽酮處理面上塗佈上述黏著劑(2),之後於120℃下加熱2分鐘,而形成厚度4 μm之黏著劑層。 另外,於PET隔離膜(厚度:75 μm)之矽酮處理面上塗佈上述黏著劑(C),之後於120℃下加熱2分鐘,而形成厚度5 μm之轉印層。 於PET基材(東麗公司製造,商品名「Lumirror 2DC61」,厚度:2 μm)之一面貼合附有PET隔離膜之黏著劑層,於另一面貼合附有PET隔離膜之轉印層,獲得含有PET隔離膜/黏著劑層/基材/轉印層/PET隔離膜之黏著片。 對所得之黏著片進行上述評估。將結果示於表1中。 [Example 8] (Preparation of Adhesive) 8.5 parts by weight of a crosslinking agent (manufactured by Dongsoo Co., Ltd., trade name "Coronate L") was added to an acrylic polymer solution II containing 100 parts by weight of an acrylic polymer II to obtain an adhesive (2) for forming an adhesive layer. The same operation as in Example 3 was performed to obtain an adhesive (C) for forming a transfer layer. (Adhesive Sheet) The adhesive (2) was applied to the silicone-treated surface of a PET separator film (thickness: 38 μm), and then heated at 120°C for 2 minutes to form an adhesive layer with a thickness of 4 μm. Separately, the aforementioned adhesive (C) was applied to the silicone-treated surface of a PET separator film (75 μm thick) and then heated at 120°C for 2 minutes to form a 5 μm thick transfer layer. The adhesive layer with the PET separator film attached was laminated to one side of a PET substrate (Toray Industries, trade name "Lumirror 2DC61," 2 μm thick), and the transfer layer with the PET separator film attached was laminated to the other side. This yielded an adhesive sheet consisting of PET separator film/adhesive layer/substrate/transfer layer/PET separator film. The resulting adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[比較例1] (黏著劑之製備) 於含有100重量份之丙烯酸聚合物III之丙烯酸系聚合物溶液III中,添加交聯劑(東梭公司製造,商品名「Coronate L」)2重量份,獲得了黏著劑層形成用之黏著劑(3)。 與實施例3同樣地操作而獲得了轉印層形成用之黏著劑(C)。 (黏著片) 於PET隔離膜(厚度:38 μm)之矽酮處理面上塗佈上述黏著劑(3),之後於120℃下加熱2分鐘,從而形成厚度4 μm之黏著劑層。 另外,PET隔離膜(厚度:75 μm)之矽酮處理面上塗佈上述黏著劑(C),之後於120℃下加熱2分鐘,從而形成厚度5 μm之轉印層。 於PET基材(東麗公司製造,商品名「Lumirror 2DC61」,厚度:2 μm)之一面貼合附有PET隔離膜之黏著劑層,於另一面貼合附有PET隔離膜之轉印層,獲得了含有PET隔離膜/黏著劑層/基材/轉印層/PET隔離膜之黏著片。 對所得之黏著片進行上述評估。將結果示於表1中。 [Comparative Example 1] (Preparation of Adhesive) 2 parts by weight of a crosslinking agent (manufactured by Dongsoo Co., Ltd., trade name "Coronate L") was added to an acrylic polymer solution III containing 100 parts by weight of an acrylic polymer III to obtain an adhesive (3) for forming an adhesive layer. The same operation as in Example 3 was performed to obtain an adhesive (C) for forming a transfer layer. (Adhesive Sheet) The adhesive (3) was applied to the silicone-treated surface of a PET separator film (thickness: 38 μm), and then heated at 120°C for 2 minutes to form an adhesive layer with a thickness of 4 μm. Separately, the aforementioned adhesive (C) was applied to the silicone-treated surface of a PET separator film (75 μm thick) and then heated at 120°C for 2 minutes to form a 5 μm thick transfer layer. The adhesive layer with the PET separator film attached was laminated to one side of a PET substrate (Toray Industries, trade name "Lumirror 2DC61," 2 μm thick), and the transfer layer with the PET separator film attached was laminated to the other side. This yielded an adhesive sheet consisting of PET separator film/adhesive layer/substrate/transfer layer/PET separator film. The resulting adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[比較例2] (黏著劑之製備) 與實施例3同樣地操作而獲得了轉印層形成用之黏著劑(C)。 (黏著片) 於PET隔離膜(厚度:75 μm)之矽酮處理面上塗佈上述黏著劑(C),之後於120℃下加熱2分鐘,而形成厚度5 μm之轉印層。 於該轉印層上積層其他PET隔離膜(厚度:38 μm),獲得了含有PET隔離膜/轉印層/PET隔離膜之黏著片。 [Comparative Example 2] (Adhesive Preparation) An adhesive (C) for forming a transfer layer was obtained by following the same procedures as in Example 3. (Adhesive Sheet) The adhesive (C) was applied to the silicone-treated surface of a PET separator film (75 μm thick) and then heated at 120°C for 2 minutes to form a 5 μm thick transfer layer. An additional PET separator film (38 μm thick) was laminated on the transfer layer to obtain an adhesive sheet consisting of a PET separator film/transfer layer/PET separator film.
[比較例3] 於含有100重量份之丙烯酸聚合物I之丙烯酸聚合物溶液I中,添加交聯劑(東梭公司製造,商品名「Coronate L」)2重量份、黏著賦予樹脂(荒川化學工業公司製造,商品名「D-125」)30重量份,而獲得轉印層形成用之黏著劑(F)。 除使用黏著劑(F)來代替黏著劑(A)形成轉印層以外,與實施例1同樣地操作從而獲得黏著片。對所得之黏著片進行上述評估。將結果示於表1中。 [Comparative Example 3] To acrylic polymer solution I containing 100 parts by weight of acrylic polymer I, 2 parts by weight of a crosslinking agent (manufactured by Tosoh Co., Ltd., trade name "Coronate L") and 30 parts by weight of a tackifying resin (manufactured by Arakawa Chemical Industries, Ltd., trade name "D-125") were added to obtain an adhesive (F) for forming a transfer layer. An adhesive sheet was obtained by following the same procedures as in Example 1, except that adhesive (F) was used instead of adhesive (A) to form the transfer layer. The obtained adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[比較例4] 於含有100重量份之丙烯酸聚合物V之丙烯酸聚合物溶液V中,添加交聯劑(東梭公司製造,商品名「Coronate L」)3重量份、光聚合起始劑(巴斯夫公司製造,商品名「Irgacure 127」)0.5重量份,而獲得轉印層形成用之黏著劑(G)。 除使用黏著劑(G)來代替黏著劑(C)而形成轉印層以外,與實施例8同樣地操作而獲得黏著片。對所得之黏著片進行上述評估。將結果示於表1中。 [Comparative Example 4] To an acrylic polymer solution V containing 100 parts by weight of acrylic polymer V, 3 parts by weight of a crosslinking agent (manufactured by Dongsoo Co., Ltd., trade name "Coronate L") and 0.5 parts by weight of a photopolymerization initiator (manufactured by BASF, trade name "Irgacure 127") were added to obtain an adhesive (G) for forming a transfer layer. Example 8 was repeated, except that adhesive (G) was used instead of adhesive (C) to form the transfer layer, to obtain an adhesive sheet. The obtained adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[比較例5] (黏著劑之製備) 與實施例1同樣地操作而獲得黏著劑層形成用之黏著劑(1)。 與比較例3同樣地操作而獲得轉印層形成用之黏著劑(F)。 (黏著片) 於PET隔離膜(厚度:38 μm)之矽酮處理面上塗佈上述黏著劑(1),之後於120℃下加熱2分鐘,從而形成厚度4 μm之黏著劑層。 另外,於PET隔離膜(厚度:75 μm)之矽酮處理面上塗佈上述黏著劑(F),之後於120℃下加熱2分鐘,從而形成厚度5 μm之轉印層。 使附有PET隔離膜之黏著劑層貼合於PET基材(東麗公司製造,商品名「Lumirror S27」,厚度:75 μm)之一面,使附有PET隔離膜轉印層貼合於另一面,獲得含有PET隔離膜/黏著劑層/基材/轉印層/PET隔離膜之黏著片。 對所得之黏著片進行上述評估。將結果示於表1中。 [Comparative Example 5] (Preparation of Adhesive) The same operation as in Example 1 was performed to obtain an adhesive (1) for forming an adhesive layer. The same operation as in Comparative Example 3 was performed to obtain an adhesive (F) for forming a transfer layer. (Adhesive Sheet) The adhesive (1) was applied to the silicone-treated surface of a PET separator film (thickness: 38 μm), and then heated at 120°C for 2 minutes to form an adhesive layer with a thickness of 4 μm. In addition, the adhesive (F) was applied to the silicone-treated surface of a PET separator film (thickness: 75 μm), and then heated at 120°C for 2 minutes to form a transfer layer with a thickness of 5 μm. An adhesive layer with a PET separator film was laminated to one side of a PET substrate (Toray Industries, trade name "Lumirror S27," thickness: 75 μm). A transfer layer with a PET separator film was laminated to the other side. This produced an adhesive sheet consisting of a PET separator film/adhesive layer/substrate/transfer layer/PET separator film structure. The resulting adhesive sheet was subjected to the aforementioned evaluations. The results are shown in Table 1.
[比較例6] 除使用PP(Polypropylene,聚丙烯)基材(東麗公司製造,商品名「Torayfan BO 12D-KW37」,厚度:12 μm)來代替PET基材(東麗公司製造,商品名「Lumirror S27」,厚度:75 μm)以外,與比較例5同樣地操作而獲得了黏著片。 對所得之黏著片進行上述評估。將結果示於表1中。 [Comparative Example 6] An adhesive sheet was obtained by following the same procedures as in Comparative Example 5, except that a PP (polypropylene) substrate (Toray Industries, trade name "Torayfan BO 12D-KW37," thickness: 12 μm) was used instead of a PET substrate (Toray Industries, trade name "Lumirror S27," thickness: 75 μm). The resulting adhesive sheet was evaluated as described above. The results are shown in Table 1.
[表1]
10:黏著劑層 20:轉印層 30:基材 100:黏著片 200:黏著片 10: Adhesive layer 20: Transfer layer 30: Base material 100: Adhesive sheet 200: Adhesive sheet
圖1(a)係本發明之一實施方式之黏著片之概略剖視圖。圖1(b)係本發明之另一實施方式之黏著片之概略剖視圖。 圖2(a)係實施例1之轉印層表面之顯微鏡照相圖。圖2(b)係比較例1之轉印層表面之顯微鏡照相圖。 Figure 1(a) is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention. Figure 1(b) is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the present invention. Figure 2(a) is a microscopic photograph of the transfer layer surface of Example 1. Figure 2(b) is a microscopic photograph of the transfer layer surface of Comparative Example 1.
10:黏著劑層 10: Adhesive layer
20:轉印層 20: Transfer layer
30:基材 30: Base material
100:黏著片 100: Adhesive sheet
200:黏著片 200: Adhesive sheet
Claims (6)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-201704 | 2020-12-04 | ||
| JP2020201704A JP7748801B2 (en) | 2020-12-04 | 2020-12-04 | adhesive sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202231811A TW202231811A (en) | 2022-08-16 |
| TWI891901B true TWI891901B (en) | 2025-08-01 |
Family
ID=81854093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110133019A TWI891901B (en) | 2020-12-04 | 2021-09-06 | Adhesive sheet |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7748801B2 (en) |
| KR (1) | KR20230111601A (en) |
| CN (1) | CN116419843A (en) |
| TW (1) | TWI891901B (en) |
| WO (1) | WO2022118499A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240137586A (en) * | 2022-02-02 | 2024-09-20 | 닛토덴코 가부시키가이샤 | Adhesive sheet |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201811947A (en) * | 2016-07-19 | 2018-04-01 | 日東電工股份有限公司 | Adhesive sheet having excellent properties both for adhesion and peeling and having no residual paste after peeling |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6053756U (en) | 1983-09-20 | 1985-04-16 | 日清紡績株式会社 | Warp sizing device with split magazine creel cart |
| JP4886937B2 (en) * | 2001-05-17 | 2012-02-29 | リンテック株式会社 | Dicing sheet and dicing method |
| JP2012033637A (en) | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
| WO2012157671A1 (en) * | 2011-05-17 | 2012-11-22 | リンテック株式会社 | Film and adhesive sheet |
| JP5875850B2 (en) | 2011-12-16 | 2016-03-02 | 東京応化工業株式会社 | Laminate and separation method |
| JP6036502B2 (en) | 2013-04-10 | 2016-11-30 | 王子ホールディングス株式会社 | Multilayer double-sided pressure-sensitive adhesive sheet, laminate, display device with touch panel, and multi-layer double-sided pressure-sensitive adhesive sheet peeling method |
| JP6377541B2 (en) * | 2015-01-20 | 2018-08-22 | 富士フイルム株式会社 | Flexible device manufacturing method and flexible device laminate |
| CN108307636B (en) * | 2015-05-13 | 2021-04-23 | 琳得科株式会社 | surface protection film |
-
2020
- 2020-12-04 JP JP2020201704A patent/JP7748801B2/en active Active
-
2021
- 2021-08-10 CN CN202180071047.5A patent/CN116419843A/en active Pending
- 2021-08-10 KR KR1020237011319A patent/KR20230111601A/en active Pending
- 2021-08-10 WO PCT/JP2021/029529 patent/WO2022118499A1/en not_active Ceased
- 2021-09-06 TW TW110133019A patent/TWI891901B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201811947A (en) * | 2016-07-19 | 2018-04-01 | 日東電工股份有限公司 | Adhesive sheet having excellent properties both for adhesion and peeling and having no residual paste after peeling |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230111601A (en) | 2023-07-25 |
| CN116419843A (en) | 2023-07-11 |
| WO2022118499A1 (en) | 2022-06-09 |
| JP7748801B2 (en) | 2025-10-03 |
| JP2022089364A (en) | 2022-06-16 |
| TW202231811A (en) | 2022-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1912038B (en) | Adhesive sheet and process for preparing it and method for processing the product | |
| EP2644669A1 (en) | Heat-peelable pressure-sensitive adhesive sheet | |
| TWI870621B (en) | Adhesive Sheet | |
| JP2025142020A (en) | Member processing method | |
| CN114901770A (en) | Adhesive sheet | |
| CN115485347B (en) | Adhesive sheet | |
| TWI882055B (en) | Adhesive Sheet | |
| JP7742306B2 (en) | adhesive sheet | |
| KR102836523B1 (en) | Adhesive sheet | |
| TWI891901B (en) | Adhesive sheet | |
| TWI882110B (en) | Adhesive Sheet | |
| TW202204550A (en) | Pressure-sensitive adhesive sheet for semiconductor processing | |
| TWI906288B (en) | Adhesive sheet | |
| KR20070019572A (en) | Adhesive sheet, manufacturing method thereof and processing method of product | |
| WO2023100401A1 (en) | Adhesive sheet | |
| TW202600630A (en) | Adhesive sheet | |
| CN121182390A (en) | Adhesive sheet | |
| TW202547962A (en) | Reuse methods for transport carriers | |
| CN120529723A (en) | Method for recycling transport carrier | |
| TW202405114A (en) | Adhesive sheet for temporary fixation of electronic parts | |
| CN118434814A (en) | Adhesive sheet |