TWI891316B - Testing device and processing machine - Google Patents

Abstract

The testing device includes a testing mechanism, a detecting mechanism, and a transportation mechanism. The testing mechanism has a first testing unit and a second testing unit arranged along a first axis so as to electronically contact the first point and the second point of the electronic component respectively for testing. The detecting mechanism is independently arranged and has a first imaging unit and a second imaging unit arranged along a second axis in order to take the pictures of the first face and the second face for detection. The transportation mechanism has at least one transportation unit to move the electronic component to the position between the first imaging unit and the second imaging unit for taking images, and further to move the electronic component to the position between the first testing unit and the second testing unit for testing. Thereby, the accuracy and the efficiency of testing can be promoted.

Description

Testing equipment and operating machines

The present invention provides a testing device that effectively improves detection accuracy and testing throughput.

Today, some electronic components have multiple first contacts and multiple second contacts on the top and bottom surfaces, respectively, to facilitate electrical testing. The electronic component can be a printed circuit board, a flexible substrate, or an integrated circuit with chips mounted on both the top and bottom surfaces.

Take a printed circuit board as an example. Its top and bottom surfaces are respectively provided with a plurality of first contacts and a plurality of second contacts. Since the printed circuit board has undergone multiple processing steps, in order to ensure the quality, the industry uses a tester to perform a test operation on the printed circuit board. That is, the tester first performs a test operation on the plurality of first contacts on the top surface of the printed circuit board. After the test is completed, the printed circuit board is transferred to a flipper to be flipped over. Only after the bottom of the printed circuit board is facing upward can the tester perform testing operations on the multiple second contacts on the bottom of the printed circuit board. However, this method requires the time-consuming process of repeatedly turning the printed circuit board over to perform the testing operation. After the multiple second contacts on the bottom of the printed circuit board are tested, the top of the printed circuit board must be turned upward again before it can be unloaded and stored. This makes the operation sequence cumbersome and time-consuming, and fails to improve production capacity.

Furthermore, the multiple first contacts and multiple second contacts on a printed circuit board are becoming increasingly precise and tiny. If the probe of the tester cannot accurately align and contact the multiple first contacts and multiple second contacts on the top and bottom surfaces of the printed circuit board, the accuracy and test quality of the test operation will be affected.

The first object of the present invention is to provide a testing device comprising a testing mechanism, a detecting mechanism and a conveying mechanism; the testing mechanism is configured along a first axis with a first testing unit having a first tester and a second testing unit having a second tester, the first tester being capable of electrically contacting a first contact and a second contact on the top and bottom surfaces of an electronic component, respectively, relative to the second tester; the detecting mechanism is independently configured, and a first imaging unit having a first imager is configured along a second axis. The electronic component comprises a first imager and a second imaging unit having a second imager. The first imager is positioned opposite the second imager and can capture images of a first portion to be inspected and a second portion to be inspected on the top and bottom surfaces of the electronic component, respectively. The transport mechanism comprises at least one transport unit having a transporter for transporting the electronic component in at least one direction to the testing mechanism and the detection mechanism. The transporter of the transport mechanism transports the electronic component between the first and second imagers for precise imaging of the first and second portions to be inspected. The electronic component is then transported between the first and second testers. Based on the image data, the first and second testers move along a first axis to accurately electrically contact the first and second contacts of the electronic component to perform testing, thereby improving test throughput and quality.

A second object of the present invention is to provide a testing device in which the first imaging unit and the second imaging unit of the detection mechanism are independently configured on a frame or machine using a first support frame and a second support frame respectively, so as to prevent the first imager and the second imager from being affected by vibration of other mechanisms (such as the testing mechanism), thereby improving the imaging accuracy.

A third objective of the present invention is to provide a testing device in which a conveyor of a conveying mechanism is capable of exposing a first contact on the top surface and a second contact on the bottom surface of an electronic component. In conjunction with the first and second testers disposed oppositely in the testing mechanism, the conveyor is capable of displacing along a first axis to directly electrically contact the first and second contacts of the electronic component to perform testing operations. This eliminates the need for a flipper, thereby saving costs and shortening testing operation time.

A fourth object of the present invention is to provide a testing device having a conveyor mechanism with a carrier and a positioning structure. The carrier is used to hold electronic components, and the positioning structure can position or release the electronic components on the carrier to provide stable support or easy access to the electronic components, thereby improving ease of use.

A fifth objective of the present invention is to provide a processing machine comprising a machine, a feeding device, a receiving device, a testing device, and a central control device. The feeding device is disposed on the machine and is equipped with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is disposed on the machine and is equipped with at least one receiver for accommodating at least one tested electronic component; the testing device of the present invention is disposed on the machine and is equipped with a testing mechanism, a detection mechanism, and a conveying mechanism for testing, imaging, and conveying at least one electronic component; the central control device is configured to control and integrate the operations of each device to perform automated operations.

To help you better understand this invention, we will provide you with a better understanding of this invention by providing a preferred embodiment with accompanying drawings.

Referring to Figures 1 to 5, the operating machine of the present invention includes a machine 10, a feeding device 20, a receiving device 30, a testing device 40, and a central control device (not shown). In this embodiment, the operating machine is used to test electronic components, which may be printed circuit boards 50. The top surface of the printed circuit board 50 is provided with a plurality of first contacts (not shown), and the bottom surface is provided with a plurality of second contacts (not shown). Furthermore, the printed circuit board 50 can use the first contacts and the second contacts as the first and second parts to be inspected, or the top and bottom surfaces can each be provided with a first and second parts to be inspected. In this embodiment, the printed circuit board 50 uses the first contacts and the second contacts as the first and second parts to be inspected, respectively.

A feeding device 20 is disposed on the machine 10 and is provided with at least one feeder for accommodating at least one electronic component to be tested. In this embodiment, the feeding device 20 is capable of accommodating multiple printed circuit boards 50 to be tested. A receiving device 30 is disposed on the machine 10 and is provided with at least one receiver for accommodating at least one tested electronic component. In this embodiment, the receiving device 30 is capable of accommodating multiple tested printed circuit boards 50. The test device 40 of the present invention is disposed on the machine 10 for testing, imaging, and transporting at least one electronic component. A central control device is used to control and integrate the operations of various devices to perform automated operations.

Depending on the operating requirements, the operating machine further includes a cleaning device 60 equipped with at least one cleaning element to remove contaminants from electronic components. Examples of such contaminants include dust and debris. In this embodiment, the cleaning device 60 is positioned on one side of the feeder 20. The cleaning element is a roller with suitable viscosity, designed to remove contaminants from the printed circuit boards 50 being transferred by the testing device 40.

Depending on the operating requirements, the operating machine further includes a printing device 70. The printing device 70 is equipped with at least one printer 71 for printing markings on electronic components. Markings such as model numbers, product information, or manufacturer information can be printed on these components. Printer 71 can be a laser printer or inkjet printer. In this embodiment, the printing device 70 is positioned on one side of the receiving device 30 and includes printer 71 and a support 72. Support 72 is configured to support the tested printed circuit board 50 transferred by the testing device 40. Printer 71 is a laser printer for printing on the printed circuit board 50.

According to the operation requirements, the operation function is sufficient to configure at least one temporary device (not shown) on the machine 10 for temporarily placing at least one electronic component; the temporary device is provided with at least one temporary table for placing electronic components, for example, the temporary table can be used to temporarily place tested electronic components.

The testing device 40 of the present invention includes a testing mechanism, a detection mechanism, and a conveying mechanism. Depending on the operation requirements, the testing device 40 may further include a material transfer mechanism.

The testing mechanism comprises a first testing unit 41 and a second testing unit 42 arranged opposite each other along a first axis L1. A first tester 411 of the first testing unit 41 faces a second tester 421 of the second testing unit 42. The first tester 411 and the second tester 421 are capable of electrically contacting the first and second contacts of an electronic component, respectively, to perform testing.

In this embodiment, the first test unit 41 includes a first tester 411, a first mount 412, a first test machine 413, and a first test adjuster 414. Furthermore, the first tester 411 and the electronic component are relatively displaced toward each other. Depending on the working requirements, the first mount 412 can be a fixed device or a movable device. In this embodiment, the first test unit 41 is provided with at least one first test driver (not shown). The first test driver can be a pressure cylinder, a linear motor, or a motor and at least one transmission assembly, wherein the transmission assembly is a pulley assembly or a screw-screw assembly. The first mount 412 is a transfer arm and is driven by the first test driver to move in at least one direction. The first mount 412 can move in the Z direction along the first axis L1 from the top toward the printed circuit board 50 to be tested. The first test adjuster 414 is mounted on the first mount 412 and can move in the Z direction synchronously. The adjuster 414 is capable of driving the first tester 411 to perform at least one directional displacement and/or angular displacement to adjust its position. In this embodiment, the first test adjuster 414 is capable of driving the first tester 411 to perform X-Y-Z directional displacement and angular displacement (e.g., horizontal angular rotational displacement) to fine-tune its position, allowing the first tester 411 to more accurately electrically contact the first contact (not shown) on the top surface of the printed circuit board 50. The first test adjuster 414 also has a first transmission frame 415 for assembling the first tester 413. The first tester 413 is electrically connected to the first tester 411 via wiring to transmit a test program and can move with the displacement of the first tester 411.

In this embodiment, the second test unit 42 includes a second tester 421, a second mount 422, a second test machine 423, and a second test adjuster 424. Furthermore, the second tester 421 and the electronic component are relatively displaced toward each other. Depending on the working requirements, the second mounting device 422 can be a fixed device or a movable device. In this embodiment, the second test unit 42 is provided with at least one second test driver (not shown). The second test driver can be a pressure cylinder, a linear motor, or a motor and at least one transmission group. The transmission group is a belt pulley group or a screw-screw group. The second mounting device 422 is a transfer arm and is driven by the second test driver (not shown) to move in at least one direction. The second mounting device 422 can move in the Z direction along the first axis L1 from the bottom toward the printed circuit board 50 to be tested. The second test adjuster 424 is provided. Mounted on the second mounting bracket 422 and capable of synchronous Z-axis displacement, the second test adjuster 424 drives the second tester 421 to adjust its position by at least one axial displacement and/or angular displacement. In this embodiment, the second test adjuster 424 drives the second tester 421 to adjust its position by X-Y-Z axial displacement and angular displacement, enabling fine adjustment of the second tester 421 relative to the first tester 411, enabling more precise electrical contact with the second contact (not shown) on the bottom surface of the printed circuit board 50. The second test adjuster 424 also utilizes a second drive frame 425 for mounting a second tester 423. The second tester 423 is electrically connected to the second tester 421 via wiring to transmit the test program and can move with the movement of the second tester 421.

According to operational requirements, the first tester 413 can also be configured on the machine 10 and electrically connected to the first tester 411 via a line; the second tester 423 can also be configured on the machine 10 and electrically connected to the second tester 421 via a line, without being limited to this embodiment.

The detection mechanism comprises a first imaging unit 43 and a second imaging unit 44 disposed opposite each other along the second axis L2. The first imager 431 of the first imaging unit 43 faces the second imager 441 of the second imaging unit 44. The first imager 431 and the second imager 441 are capable of capturing images of the first and second portions of the electronic component, respectively, for inspection.

In this embodiment, the first imaging unit 43 includes a first imager 431, a first support frame 432 and a first detection adjuster 433. According to the operation requirements, the first support frame 432 can be mounted on an independent frame (not shown) or the machine 10 to reduce vibration and avoid affecting the imaging accuracy of the first imager 431. In this embodiment, the first imaging unit 43 is mounted on an independent frame (not shown). The first support frame 432 432 is equipped with a first detection adjuster 433. The first detection adjuster 433 can drive the first imager 431 to move in at least one direction to adjust the position. In this embodiment, the first detection adjuster 433 can drive the first imager 431 to move in the Z direction along the second axis L2 to adjust the height position. The first imager 431 is a CCD and can capture the first portion to be inspected (not shown) on the top surface of the printed circuit board 50 from top to bottom.

In this embodiment, the second imaging unit 44 includes a second imager 441, a second support frame 442, and a second detection adjuster 443. Depending on the operation requirements, the second support frame 442 can be mounted on an independent frame (not shown) or the machine 10 to reduce vibration and avoid affecting the imaging accuracy of the second imager 441. In this embodiment, the second imaging unit 44 is mounted on an independent frame (not shown). The second support frame 442 is equipped with a second detection adjuster 443. The second detection adjuster 443 can drive the second imager 441 to move in at least one direction to adjust its position. In this embodiment, the second detection adjuster 443 can drive the second imager 441 to move in the Z direction along the second axis L2 to adjust its height. The second imager 441 is a CCD. Opposite to the first imager 431, the second imager 441 can capture an image of a second portion to be inspected (not shown) on the bottom surface of the printed circuit board 50 from bottom to top.

The transport mechanism is provided with at least one transport unit, and the transport unit's transport device is capable of transporting electronic components for displacement in at least one direction between the first tester 411 and the second tester 421 of the testing mechanism for testing, and transporting electronic components for displacement in at least one direction between the first imager 431 and the second imager 441 of the detection mechanism for imaging.

In this embodiment, at least one transport unit of the transport mechanism includes a first transport unit 45 and a second transport unit 46. The first transporter of the first transport unit 45 and the second transporter of the second transport unit 46 can successively transport electronic components between the first imaging unit 43 and the second imaging unit 44, and between the first testing unit 41 and the second testing unit 42, for performing imaging operations and testing operations.

The first conveying unit 45 includes a first conveyor and a first conveying driver; the first conveyor is equipped with a first carrier 451 and a first positioning structure, and the first carrier 451 includes a first frame and a first connecting component. Depending on the working requirements, the first frame and the first connecting component can be independent components or formed as an integral part. In this embodiment, the first frame is a hollow frame, and the top surface of the two side frame rods serves as the first supporting portion 4511, which can support the printed circuit board and expose the first and second contacts on the top and bottom surfaces of the printed circuit board 50 to the outside; the first connecting component is set on the outer surface of one side frame rod of the first frame. The first positioning structure includes two first positioning members 452 and two first power sources 453. The two first positioning members 452 are designed in the same manner. Taking one first positioning member 452 as an example, the first positioning member 452 is pivotally mounted on the first supporting portion 4511 of the first frame member with two support frames. The two first power sources 453 are designed in the same manner. Taking one first power source 453 as an example, according to the working requirements, the first power source 453 can be a rotary cylinder, a direct-drive motor, or a motor and at least one transmission group, or a pressure cylinder and at least one transmission group. The transmission group can be a pulley group or a gear group, etc., and is not limited to this embodiment. In this embodiment, the first power source 453 is provided with a pressure cylinder on the support frame. The pressure cylinder drives a transmission block to move, and the transmission block drives a belt pulley assembly to operate. The belt pulley assembly drives the first positioning member 452 to rotate and swing, so that the first positioning member 452 can position or release the printed circuit board 50 on the first carrier 451 to provide stable support or easy access to the printed circuit board 50.

The first transport driver 454 includes at least one directional drive source to drive the first transport for displacement in at least one direction. In this embodiment, the first transport driver 454 includes an X-direction drive source and a Y-direction drive source. The X-direction drive source is connected to the first connecting member of the first carrier 451, enabling the first carrier 451 to be transported for displacement in the X-Y direction.

The second transport unit 46 comprises a second conveyor and a second transport drive. The second conveyor is equipped with a second carrier 461 and a second positioning structure. The second carrier 461 comprises a second frame and a second connecting member. Depending on the operational requirements, the second frame and the second connecting member can be separate components or integrally formed. In this embodiment, the second frame is a hollow body with the top surfaces of the two side frame bars serving as the second receiving portion 4611, capable of receiving a printed circuit board (PCB). The first and second contacts on the top and bottom surfaces of the PCB 50 are exposed. The second connecting member is provided on the outer surface of one side frame bar of the second frame. The second positioning structure includes two second positioning members 462 and two second power sources 463. The two second positioning members 462 are designed in the same manner. Taking one second positioning member 462 as an example, the second positioning member 462 is pivotally mounted on the second supporting portion 4611 of the second frame member with two support frames. The two second power sources 463 are designed in the same manner. Taking one second power source 463 as an example, according to the working requirements, the second power source 463 can be a rotary cylinder, a direct-drive motor, or a motor and at least one transmission group, or a pressure cylinder and at least one transmission group. The transmission group can be a pulley group or a gear group, etc., and is not limited to this embodiment. In this embodiment, the second power source 463 comprises a cylinder mounted on the support frame. The cylinder drives a transmission block to move, which in turn drives a pulley assembly, which in turn rotates and oscillates the second positioning member 462. This allows the second positioning member 462 to position or release the printed circuit board 50 on the second carrier 461, ensuring stable loading or easy removal of the printed circuit board 50.

The second transport driver 464 includes at least one directional drive source to drive the second transport for displacement in at least one direction. In this embodiment, the second transport driver 464 includes another X-direction drive source and another Y-direction drive source. The second X-direction drive source is connected to the second connecting member of the second carrier 461, enabling the transport of the second carrier 461 for X-Y directional displacement.

According to the operation requirements, the first conveyor driver 454 and the second conveyor driver 464 may further include a Z-direction drive source to drive the first conveyor and the second conveyor to perform X-Y-Z direction displacement, and can transport electronic components by staggered displacement, which is not limited to this embodiment.

The material transfer mechanism is provided with at least one material transfer unit, and the material transfer unit is used for the conveying mechanism to transfer electronic components.

In this embodiment, at least one material transfer unit includes a first material transfer unit 471, a second material transfer unit 472 and a third material transfer unit 473; the first material transfer unit 471 can be displaced in the X-Z direction to transfer the printed circuit board 50 to be tested to the feeding device 20, the decontamination device 60 and the first conveying unit 45; the second material transfer unit 472 can be displaced in the X-Z direction to transfer the printed circuit board 50 to be tested/tested to the first conveying unit 45, the second conveying unit 46 and the printing device 70; the third material transfer unit 473 can be displaced in the Y-Z direction to transfer the tested printed circuit board 50 to the printing device 70 and the receiving device 30.

Please refer to Figures 6 to 11. The first material transfer unit 471 of the testing device 40 takes out the printed circuit board 50 to be tested from the feeding device 20, and transfers the printed circuit board 50 to be tested to the first receiving portion 4511 of the first carrier 451 of the first conveying unit 45 through the decontamination device 60. The first conveying unit 45 drives the first positioning member 452 to rotate with the first power source 453 to clamp the printed circuit board 50 to be tested for positioning.

The first transport unit 45 drives the first carrier 451 to move in the Y direction by the first transport driver 454, and transports the printed circuit board 50 to be tested to between the first imager 431 of the first imaging unit 43 and the second imager 441 of the second imaging unit 44, so that the first contact point (not shown) on the top surface of the printed circuit board 50 to be tested is opposite to the first imager 431, and the second contact point (not shown) on the bottom surface of the printed circuit board 50 to be tested is opposite to the second imager 441. The first imager 431 captures an image of the first contact of the printed circuit board 50 from top to bottom, while the second imager 441 captures an image of the second contact of the printed circuit board 50 from bottom to top. The first imager 431 and the second imager 441 transmit the captured image data to a processor (not shown). Since the first imager 431 and the second imager 441 are independently mounted on the first support frame 432 and the second support frame 442, respectively, and are not mounted on the testing mechanism or the material transfer mechanism, they are protected from vibration, thereby improving imaging accuracy.

The first transport unit 45 drives the first carrier 451 to move in the Y direction to the bottom of the second material transfer unit 472 with the first transport driver 454, so that the second material transfer unit 472 can take out the printed circuit board 50 to be tested. The first carrier 451 leaves, and the second transport unit 46 drives the second carrier 461 to move in the Y direction to the bottom of the second material transfer unit 472 with the second transport driver 464. The second material transfer unit 472 places the printed circuit board 50 to be tested on the second supporting part 4611 of the second carrier 461. The second transport unit 46 drives the second positioning member 462 to rotate with the second power source 463 to clamp the printed circuit board 50 to be tested and position it.

The second transport unit 46 drives the second carrier 461 to move in the Y direction by the second transport driver 464, and moves the printed circuit board 50 to be tested between the first tester 411 of the first test unit 41 and the second tester 421 of the second test unit 42. The first test unit 41 uses the first test adjuster 414 to fine-tune the position of the first tester 411 based on the image data captured by the first imager 431. The first mounter 412 drives the first tester 411 and the first tester 413 to move downward in the Z direction, ensuring that the first tester 411 makes precise electrical contact with the first contact of the printed circuit board 50 under test. The second test unit 42 uses the second test adjuster 424 to fine-tune the position of the second tester 421 based on the image data captured by the second imager 441. The second mounter 422 drives the second tester 421 and the second tester 423 to move upward in the Z direction. , the second tester 421 electrically contacts the second contact of the printed circuit board 50 under test; therefore, the first tester 411 and the second tester 421 accurately perform testing operations on the printed circuit board 50, thereby improving the test quality.

After the test is completed, the second transport unit 46 drives the second carrier 461 to move in the Y direction with the second transport driver 464, and moves the tested printed circuit board 50 in the Y direction to the bottom of the second material transfer unit 472, and causes the second positioning member 462 to release the tested printed circuit board 50, so that the second material transfer unit 472 can transfer the tested printed circuit board 50 from the second carrier 461 to the base 72 of the printing device 70, so that the printer 71 can perform the printing operation on the printed circuit board 50. After printing is completed, according to the test results, the third material transfer unit 473 transfers the tested printed circuit board 50 to the receiving device 30 for storage.

Machine 10 Feeder 20 Receiving device 30 Testing device 40 First testing unit 41 First tester 411 First mounting device 412 First test machine 413 First test adjuster 414 First transmission frame 415 Second testing unit 42 Second tester 421 Second mounting device 422 Second test machine 423 Second test adjuster 424 Second transmission frame 425 First imaging unit 43 First imager 431 First support frame 432 First detection adjuster 433 Second imaging unit 44 Second imager 441 Second support frame 442 Second detection adjuster 443 First conveyor unit 45 First carrier 451 First support portion 4511 First positioning member 452 First power source 453 First conveyor drive 454 Second conveyor unit 46 Second carrier 461 Second receiving portion 4611 Second positioning member 462 Second power source 463 Second conveyor drive 464 First material transfer unit 471 Second material transfer unit 472 Third material transfer unit 473 First axis L1 Second axis L2 Printed circuit board 50 Decontamination device 60 Printing device 70 Printer 71 Platform 72

Figure 1: Layout of the various devices of the operating machine of the present invention. Figure 2: Schematic diagram of the testing mechanism and conveying mechanism of the testing device. Figure 3: Schematic diagram of the detection mechanism and conveying mechanism of the testing device. Figure 4: Partial schematic diagram of the first and second conveying units. Figure 5: Schematic diagram of the detection mechanism and the first conveying unit. Figures 6 to 11: Schematic diagrams of the testing device in use.

43: First imaging unit

431: First Imager

432: First Frame

433: First Detection Regulator

44: Second imaging unit

441: Second imager

442: Second support frame

443: Second Detection Regulator

45: First transport unit

451: First Vehicle

453: The First Power Source

454: First conveyor drive

L2: Second axis

Claims (8)

A testing device comprises: A testing mechanism comprising a first testing unit and a second testing unit disposed oppositely along a first axis, the first testing unit being mounted with a first mount to hold a first tester, and the second testing unit being mounted with a second mount to hold a second tester, respectively capable of electrically contacting a first contact and a second contact of an electronic component for testing; A detecting mechanism comprising a first imaging unit and a second imaging unit disposed oppositely along a second axis, the first imaging unit being mounted with a first imager on a first support, and the second imaging unit being mounted with a second imager on a second support, respectively capable of capturing images of a first portion to be inspected and a second portion to be inspected of the electronic component for inspection; Conveying mechanism: at least one conveying unit is provided, including a first conveying unit and a second conveying unit, the first conveying unit includes a first conveyor and a first conveying driver, the first conveyor is equipped with a first carrier and a first positioning structure, the first carrier can hold the electronic component, the first positioning structure can position or release the electronic component, the first conveying driver can drive the first conveyor to move in at least one direction, the second conveying unit includes a second conveyor and a second conveying driver, the second conveyor is equipped with a second carrier and a second positioning structure, The second carrier is capable of supporting the electronic component, the second positioning structure is capable of positioning or releasing the electronic component, the second transport driver is capable of driving the second transport to move in at least one direction, the second transport of the transport unit is capable of transporting the electronic component to move in at least one direction between the first tester and the second tester of the testing mechanism for testing, and the first transport is capable of transporting the electronic component to move in at least one direction between the first imager and the second imager of the detection mechanism for imaging. The test device of claim 1, wherein the first test unit of the test mechanism is provided with a first test adjuster for adjusting the position of the first tester, and the second test unit is provided with a second test adjuster for adjusting the position of the second tester. The test device as described in claim 2, wherein the first test adjuster of the first test unit is provided with a first test machine, the first test machine is electrically connected to the first test machine, and the second test adjuster of the second test unit is provided with a second test machine, the second test machine is electrically connected to the second test machine. The test device as described in claim 1, wherein the first imaging unit of the detection mechanism is provided with a first detection adjuster for adjusting the position of the first imaging unit. The test device as described in claim 1, wherein the second imaging unit of the detection mechanism is provided with a second detection adjuster for adjusting the position of the second imager. In the test device described in claim 1, the test mechanism and the detection mechanism operate independently. The testing device as described in any one of claims 1 to 6 further includes a material transfer mechanism, which is provided with at least one material transfer unit, and the material transfer unit is used to transfer the electronic component to the conveying mechanism. A processing machine comprises: a machine; a feeding device, disposed on the machine and equipped with at least one feeder for accommodating at least one electronic component to be tested; a receiving device, disposed on the machine and equipped with at least one receiver for accommodating at least one tested electronic component; at least one testing device as described in claim 1, disposed on the machine for testing, imaging, and transporting at least one electronic component; a central control device for controlling and integrating the operations of various devices to perform automated operations.