TWI890951B - 氮化鋁接合體 - Google Patents
氮化鋁接合體Info
- Publication number
- TWI890951B TWI890951B TW111131119A TW111131119A TWI890951B TW I890951 B TWI890951 B TW I890951B TW 111131119 A TW111131119 A TW 111131119A TW 111131119 A TW111131119 A TW 111131119A TW I890951 B TWI890951 B TW I890951B
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- TW
- Taiwan
- Prior art keywords
- aln
- aln member
- yttrium oxide
- circular plate
- diffusion layer
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Abstract
氮化鋁接合體10,係使第1AlN構件11與第2AlN構件12接合而成者。第1AlN構件11的氧化釔含有率,在偵測極限以下。第2AlN構件12,含有氧化釔。
Description
本發明係有關於氮化鋁(AlN)接合體。
於習知技術,已知有一種陶瓷加熱器,具備:AlN製的板件,內置有電阻發熱體,該電阻發熱體具有載置晶圓的晶圓載置面;以及AlN製的筒狀軸,接合在板件的背面,亦即晶圓載置面的相反側(參照專利文獻1)。
[習知技術文獻]
[專利文獻]
[專利文獻1]日本專利第6878677號公報
[發明所欲解決的問題]
上述陶瓷加熱器,係使例如含有5質量%之氧化釔的AlN製的板件、與含有5質量%之氧化釔的AlN製的筒狀軸,塗上助熔劑加以接合而製造。近年,為了以熱電偶量測板件的外周溫度,有時會在板件設置熱電偶用的溝槽。再者,作為對晶圓成膜之際的對策,有時會在板件設置氣體迫淨(purge)用的溝槽。因此,過往研究要在形成有此種溝槽的板件接合筒狀軸。如此一來,發現以習知之接合方法,會產生以溝槽為起點的裂縫。裂縫的產生,是由於接合時的壓機壓力很高。
本發明係為了解決此種課題而研發,其主要目的是提供一種會妥善地接合、且無裂縫的氮化鋁接合體。
[解決問題之技術手段]
本發明之氮化鋁接合體的一個態樣,係一種氮化鋁接合體,其係使第1AlN構件與第2AlN構件接合而成;於該氮化鋁接合體,
該第1AlN構件的氧化釔含有率,在偵測極限以下;
該第2AlN構件,含有氧化釔。
本發明之氮化鋁接合體的另一態樣,係一種氮化鋁接合體,其係使第1AlN構件與第2AlN構件接合而成;於該氮化鋁接合體,
該第1AlN構件,具有由於接合而形成的第1擴散層;
該第2AlN構件,具有由於接合而形成的第2擴散層;
該第1AlN構件當中,該第1擴散層以外之部分的氧化釔含有率,在偵測極限以下;
該第2AlN構件當中,該第2擴散層以外之部分,含有氧化釔。
參照圖式,說明本發明的較佳實施形態如下。圖1~圖4係氮化鋁接合體10~40的前視圖,圖5係陶瓷加熱器的縱剖面圖(於包含中心軸的平面截斷時的剖面圖)。於以下的說明中,上下、左右、前後係如圖1所示。又,上下、左右、前後,僅為相對的位置關係。於本說明書中,呈現數值範圍的「~」,用於意指:記載於其前後之數值,係作為下限值及上限值而包含在內。
圖1所示之氮化鋁接合體10,是使用助熔劑(接合用的膏狀物)而接合了第1AlN構件11與第2AlN構件12者。作為助熔劑,例如可以使用含有氧化鈣(CaO)與氧化鋁(Al
2O
3)與氧化釔(Y
2O
3)者。第1AlN構件11與第2AlN構件12,是相同大小的圓板構件。第1AlN構件11的氧化釔含有率在偵測極限以下,第2AlN構件12則含有氧化釔。第2AlN構件12的氧化釔含有率,較佳係在0.07質量%以上。第1AlN構件11,較佳係含有由:氧化釔以外的稀土類金屬氧化物、氧化鎂(MgO)及氧化鈦(TiO
2)所構成的群組中選出的至少1種氧化物。氧化物的總添加量,可以設為例如0.1~3質量%。作為稀土類氧化物,可舉出例如氧化鈰(CeO
2)或三氧化二釤(Sm
2O
3)等等。第1AlN構件11,較佳係含有氧化釔以外的稀土類金屬氧化物或氧化鎂與氧化鈦,更佳係含有氧化鎂與氧化鈦。
圖2所示之氮化鋁接合體20,是對氮化鋁接合體10的第1AlN構件11當中之與第2AlN構件12之接合面位於相反側的面,使用助熔劑而接合了第3AlN構件13者。作為助熔劑,例如可以使用含有氧化鈣與氧化鋁與氧化釔者。第3AlN構件13,係與第1及第2AlN構件11、12相同大小的圓板構件。第3AlN構件13,含有氧化釔。第3AlN構件13的氧化釔含有率,較佳為0.07質量%以上。
圖3所示之氮化鋁接合體30,是使用助熔劑而接合了第1AlN構件31與第2AlN構件32者。作為助熔劑,例如可以使用含有氧化鈣(CaO)與氧化鋁(Al
2O
3)與氧化釔(Y
2O
3)者。第1AlN構件31與第2AlN構件32,是相同大小的圓板構件。第1AlN構件31,具有由於接合而形成的第1擴散層31a。第2AlN構件32,具有由於接合而形成的第2擴散層32a。第1及第2擴散層31a、32a,係助熔劑成分擴散而成的薄層。第1AlN構件31當中,第1擴散層31a以外之部分的氧化釔含有率,係在偵測極限以下;而在第2AlN構件32當中,第2擴散層32a以外之部分,則含有氧化釔。第2AlN構件32當中,第2擴散層32a以外之部分的氧化釔含有率,較佳係在0.07質量%以上。第1AlN構件31,較佳係含有由:氧化釔以外的稀土類金屬氧化物、氧化鎂(MgO)及氧化鈦(TiO
2)所構成的群組中選出的至少1種氧化物。氧化物的總添加量,可以設為例如0.1~3質量%。作為稀土類氧化物,可舉出例如氧化鈰或三氧化二釤等等。第1AlN構件31,較佳係含有氧化釔以外的稀土類金屬氧化物或氧化鎂與氧化鈦,更佳係含有氧化鎂與氧化鈦。
圖4所示之氮化鋁接合體40,是對氮化鋁接合體30的第1AlN構件31當中之與第2AlN構件32之接合面位於相反側的面,使用助熔劑而接合了第3AlN構件33者。作為助熔劑,例如可以使用含有氧化鈣與氧化鋁與氧化釔者。第3AlN構件33,係與第1及第2AlN構件31、32相同大小的圓板構件。第1AlN構件31,具有由於與第3AlN構件33接合而形成的另一第1擴散層31a。第3AlN構件33,具有由於接合而形成的第3擴散層33a。第3擴散層33a,係助熔劑成分擴散而成的薄層。第1AlN構件31當中,2個第1擴散層31a以外之部分的氧化釔含有率,係在偵測極限以下。而在第3AlN構件33當中,第3擴散層33a以外之部分,則含有氧化釔。第3AlN構件33當中,第3擴散層33a以外之部分的氧化釔含有率,較佳係在0.07質量%以上。
圖5所示之陶瓷加熱器50,具備:圓形板件52,其具有晶圓載置面52a,並埋設有電阻發熱體52b;筒狀軸53,直徑小於圓形板件52;以及中間環51,夾在圓形板件52與筒狀軸53之間。圓形板件52,在內部具有沿著半徑方向設置的熱電偶溝槽52c。筒狀軸53,在與圓形板件52相向之側,具有凸緣53a。中間環51與圓形板件52係使用助熔劑而接合,中間環51與筒狀軸53亦使用助熔劑而接合。作為助熔劑,例如可以使用含有氧化鈣與氧化鋁與氧化釔者。接合方法,如圖6所示,首先以使圓形板件52的晶圓載置面52a朝下的方式,將圓形板件52載置於工作台;對於與晶圓載置面52a係相反側的面,環狀地塗布助熔劑P;在其上方載置中間環51,並將助熔劑P塗佈在中間環51的頂面;在其上方,以使凸緣53a朝下的方式,載置筒狀軸53。在此狀態下,從上方對凸緣53a施加荷重(例如10~40kg/cm
2),並以既定之接合溫度(例如1600~1700℃)進行處理。於圖5,圓形板件52相當於上述第2AlN構件12、32,筒狀軸53相當於上述第3AlN構件13、33,中間環51相當於上述之第1AlN構件11、31。又,亦可取代或外加於熱電偶溝槽52c,而在圓形板件52設置氣體迫淨用的溝槽,以作為對晶圓成膜之際的對策。
圖7所示之陶瓷加熱器60,具備:第2圓形板件62,其具有晶圓載置面62a,並埋設有電阻發熱體(加熱器)62b;第3圓形板件63,與筒狀軸64接合;第1圓形板件61,夾在第2圓形板件62與第3圓形板件63之間。第1~第3圓形板件61~63,係使用助熔劑而彼此接合,形成積層板65。作為助熔劑,例如可以使用含有氧化鈣與氧化鋁與氧化釔者。積層板65,在內部具有沿著半徑方向設置的熱電偶溝槽66。熱電偶溝槽66,係由形成於第1圓形板件61的直線溝槽61c、以及沿著上下方向貫穿第3圓形板件63的貫穿孔63c而構成。筒狀軸64,在與第3圓形板件63相向之側,具有凸緣64a,凸緣64a則與第3圓形板件63接合。接合,可以按照圖6進行。於圖7,第2圓形板件62相當於上述第2AlN構件12、32,第3圓形板件63相當於上述第3AlN構件13、33,第1圓形板件61相當於上述第1AlN構件11、31。又,亦可取代或外加於熱電偶溝槽66,而在積層板65設置氣體迫淨用的溝槽,以作為對晶圓成膜之際的對策。
若藉由以上詳述之實施形態的氮化鋁接合體10~40或陶瓷加熱器50、60,就能以低荷重來接合各構件。因此,會妥善地接合,同時在各構件亦不易產生裂縫。再者,用於接合之助熔劑的滲出量會減少,在使用時所產生的微粒量也會減少。更進一步地,各構件的變形會減少。
又,本發明並不受上述實施形態限定,只要是屬於本發明之技術範圍,則得以各種態樣實施,自不待贅言。
例如,在上述實施形態,作為第1~第3AlN構件11~13,例示了相同大小的圓板構件,但並不限定於此。例如,第1~第3AlN構件11~13,亦可為各自不同形狀、不同大小者。至於第1~第3AlN構件31~33亦同。
在上述實施形態,使用了助熔劑(接合用的膏狀物);但亦可使用接合用的薄片以取代助熔劑。
再者,亦可使得含有氧化釔的較厚AlN板件,彼此夾著不含氧化釔(在偵測極限以下)的較薄AlN板件而進行燒結,以製得導熱係數高的積層型AlN板件。AlN板件,係氧化釔含有率越高,則導熱係數就越高。由於所製得之積層型AlN板件,係以含有氧化釔的板件所占比例居多,所以導熱係數會很良好。
而在要藉由板件之接合以在板件內設置熱電偶溝槽、氣體溝槽等等之際,可採較低的壓力進行燒結;可以預防變形,同時可以製作出導熱係數良好的板件。
還可藉由使得含有氧化釔的氮化鋁、與氧化釔係在偵測極限以下的氮化鋁交互重疊,就可以層疊3層以上。
[實施例]
以下針對本發明之實施例進行說明。又,本發明並不受以下實施例所限定。
[實施例1]
1. 圓形板件之製作
將Y
2O
3粉末添加至AlN原料粉末,並藉由球磨機而混合成混合粉末,再以噴霧乾燥使其顆粒化。Y
2O
3粉末之添加,要達到相對於整體會占5質量%。接著,使用所得到的顆粒,製作出圓盤形狀的成形體。然後,藉由對此成形體進行熱壓燒結,而製作出作為AlN燒結體的圓形板件。於熱壓燒結,燒結時的最高溫度(燒結溫度)設為1650~1850℃,燒結溫度下的保持時間設為2小時,壓機壓力設為20MPa,氣氛設為氮氣氣氛。
2. 筒狀軸之製作
將Y
2O
3粉末添加至AlN原料粉末,並藉由球磨機而混合成混合粉末,再以噴霧乾燥使其顆粒化。Y
2O
3粉末之添加,要達到在燒結體中的含量會占5質量%。接著,使用所得到的顆粒,製作出成形體。然後,藉由對此成形體進行常壓燒結,而製作出AlN燒結體(筒狀軸)。燒結時的最高溫度(燒結溫度)設為1750~1900℃,燒結溫度下的保持時間設為1~5小時,氣氛設為氮氣氣氛。
3. 中間環之製作
將MgO粉末、TiO
2粉末添加至AlN原料粉末,並藉由球磨機而混合成混合粉末,再以噴霧乾燥使其顆粒化。MgO粉末之添加,要達到在燒結體中的含量會占1質量%;TiO
2粉末之添加,要達到在燒結體中的含量會占0.5質量%。接著,使用所得到的顆粒,製作出成形體。然後,藉由對此成形體進行熱壓燒結,而製作出AlN燒結體。於熱壓燒結,燒結時的最高溫度(燒結溫度)設為1750~1850℃,燒結溫度下的保持時間設為1~5小時,壓機壓力設為20MPa,氣氛設為氮氣氣氛。以機械加工而挖空燒結後的板體之中央部,製作出厚度3mm的中間環。又,中間環亦可係成形為環形後進行燒結而成。
4. 接合體之製作
如下調製助熔劑(接合用的膏狀物)。膏狀物之製作,有以下步驟:(a)使CaO與Al
2O
3與Y
2O
3以質量比35~40:42~47:17~22混合成合計為100的混合粉,並在1330~1390℃下進行熱處理,而製得合成粉的步驟;(b)合成粉與AlN粉末以質量比100:60~70混合後,粉碎到平均粒徑成為30μm以下,而製得粉碎粉的步驟;(c)以乙醇作為溶媒加以揉合的步驟。用圓形板件、筒狀軸、中間環及助熔劑,如下製作接合體(有軸板件)。如圖6,由下依序積層圓形板件、膏狀物、中間環、膏狀物、筒狀軸。接合係以最高溫度1600~1700℃、荷重10~40kg/cm
2、氮氣氣氛進行。又,亦可使用接合用的薄片以取代助熔劑。
5. 評鑑
針對所製得的接合體,藉由超音波探傷裝置來檢查接合面有無缺陷,結果在接合面並未發現缺陷。再者,觀察接合面的SEM(掃描式電子顯微鏡)照片,結果在接合面並未看到缺陷,確認到具有良好的接合性。觀察接合體的外觀,結果圓形板件與筒狀軸為白色,中間環則為灰色(推測是由於TiO
2的影響)。在中間環,雖然看到在與圓形板件之接合面的附近、或與筒狀軸之接合面的附近,有著助熔劑成分擴散而成的擴散層;但以射頻電感耦合電漿原子發射光譜分析(ICP-AES9)量測該等擴散層以外之部分的Y
2O
3含有率,結果是在偵測極限以下(5質量ppm以下)。在圓形板件,雖然看到在與中間環之接合面的附近有擴散層,但同樣地量測該擴散層以外之部分的Y
2O
3含有率,結果是5質量%。在筒狀軸,雖然看到在與中間環之接合面的附近有擴散層,但同樣地量測該擴散層以外之部分的Y
2O
3含有率,結果是5質量%。再者,接合強度,依照JIS1601(日本工業規格)而以四點彎曲方式進行量測,結果是370MPa。
[比較例1]
使用與實施例1同樣的圓形板件及筒狀軸,如下製作了接合體。亦即,在圓形板件與筒狀軸之間塗佈與實施例1相同的助熔劑,加以接合。接合係以最高溫度1630℃、荷重80kg/cm
2、氮氣氣氛進行。目測所製得之接合體,結果在圓形板件有產生裂縫。
[比較例2]
使用與實施例1同樣的圓形板件及筒狀軸,如下製作了接合體。亦即,在圓形板件與筒狀軸之間塗佈與實施例1相同的助熔劑,加以接合。接合係以最高溫度1630℃、荷重40kg/cm
2、氮氣氣氛進行。所製得之接合體,接合強度低;SEM觀察的結果,確認到助熔劑在接合界面結塊。
又,於上述實施例1,係使含有5質量%之氧化釔的圓形板件、與含有5質量%之氧化釔的筒狀軸,夾著氧化釔為低濃度之中間環而接合;但亦可使含有5質量%之氧化釔的圓形板件、與氧化釔為低濃度的筒狀軸,不夾中間環就接合。
再者,亦可使含有數質量%之氧化釔的圓形板件、與含有比圓形板件更低濃度之氧化釔的筒狀軸,夾著氧化釔濃度比圓形板件及筒狀軸更低的中間環而接合。在此情況下,藉由使用「氧化釔在偵測極限以下的中間環」,而能得到強度更高的接合體。
本發明係以2021年8月23日提出申請之日本專利申請第2021-135883號作為優先權主張的基礎,而在本說明書中援用其所有內容。
10:氮化鋁接合體
11:第1AlN構件
12:第2AlN構件
13:第3AlN構件
20,30,40:氮化鋁接合體
31:第1AlN構件
32:第2AlN構件
31a:第1擴散層
32a:第2擴散層
33a:第3擴散層
50,60:陶瓷加熱器
51:中間環
52:圓形板件
52a,62a:晶圓載置面
52b,62b:電阻發熱體
52c,66:熱電偶溝槽
53,64:筒狀軸
53a,64a:凸緣
61:第1圓形板件
61c:直線溝槽
62:第2圓形板件
63:第3圓形板件
63c:貫穿孔
65:積層板
P:助熔劑
[圖1]氮化鋁接合體10的前視圖。
[圖2]氮化鋁接合體20的前視圖。
[圖3]氮化鋁接合體30的前視圖。
[圖4]氮化鋁接合體40的前視圖。
[圖5]陶瓷加熱器50的縱剖面圖。
[圖6]陶瓷加熱器50的製造步驟圖。
[圖7]陶瓷加熱器60的縱剖面圖。
10:氮化鋁接合體
11:第1AlN構件
12:第2AlN構件
Claims (10)
- 一種氮化鋁(AlN)接合體,係使第1AlN構件與第2AlN構件接合而成;其中,該第1AlN構件的氧化釔含有率,在偵測極限以下;該第2AlN構件,含有氧化釔;該氮化鋁接合體更包含第3AlN構件,接合在該第1AlN構件當中之與該第2AlN構件之接合面位於相反側的面;該第3AlN構件,含有氧化釔;該第2AlN構件,係具有晶圓載置面的圓形板件;該第3AlN構件,係直徑小於該圓形板件的筒狀軸;該第1AlN構件,係夾在該圓形板件與該筒狀軸之間的環狀物;該第1AlN構件含有氧化鎂及氧化鈦以作為氧化物,且該氧化物的總添加量為0.1~3質量%。
- 一種氮化鋁(AlN)接合體,係使第1AlN構件與第2AlN構件接合而成;其中,該第1AlN構件的氧化釔含有率,在偵測極限以下;該第2AlN構件,含有氧化釔;該氮化鋁接合體更包含第3AlN構件,接合在該第1AlN構件當中之與該第2AlN構件之接合面位於相反側的面;該第3AlN構件,含有氧化釔;該第2AlN構件,係具有埋設了加熱器之晶圓載置面的第2圓形板件;該第3AlN構件,係與筒狀軸接合的第3圓形板件;該第1AlN構件,係夾在該第2圓形板件與該第3圓形板件之間的第1圓形板件;該第1AlN構件含有氧化鎂及氧化鈦以作為氧化物,且該氧化物的總添加量為0.1~3質量%。
- 如請求項1或2之氮化鋁接合體,其中,該第2AlN構件的氧化釔含有率,係0.07質量%以上。
- 如請求項1或2之氮化鋁接合體,其中,該第3AlN構件的氧化釔含有率,係0.07質量%以上。
- 一種氮化鋁接合體,係使第1AlN構件與第2AlN構件接合而成;其中,該第1AlN構件,具有由於接合而形成的第1擴散層;該第2AlN構件,具有由於接合而形成的第2擴散層;該第1AlN構件當中,該第1擴散層以外之部分的氧化釔含有率,在偵測極限以下;該第2AlN構件當中,該第2擴散層以外之部分,含有氧化釔;該氮化鋁接合體更包含第3AlN構件,接合在該第1AlN構件當中之與該第2AlN構件之接合面位於相反側的面,並具有由於接合而形成的第3擴散層;該第1AlN構件,具有由於與該第3AlN構件接合而形成的另一第1擴散層;該第1AlN構件當中,2個該第1擴散層以外之部分的氧化釔含有率,在偵測極限以下;該第3AlN構件當中,該第3擴散層以外之部分,含有氧化釔;該第2AlN構件,係具有晶圓載置面的圓形板件;該第3AlN構件,係直徑小於該圓形板件的筒狀軸;該第1AlN構件,係夾在該圓形板件與該筒狀軸之間的環狀物;該第1AlN構件含有氧化鎂及氧化鈦以作為氧化物,且該氧化物的總添加量為0.1~3質量%。
- 一種氮化鋁接合體,係使第1AlN構件與第2AlN構件接合而成;其中,該第1AlN構件,具有由於接合而形成的第1擴散層;該第2AlN構件,具有由於接合而形成的第2擴散層;該第1AlN構件當中,該第1擴散層以外之部分的氧化釔含有率,在偵測極限以下;該第2AlN構件當中,該第2擴散層以外之部分,含有氧化釔;該氮化鋁接合體更包含第3AlN構件,接合在該第1AlN構件當中之與該第2AlN構件之接合面位於相反側的面,並具有由於接合而形成的第3擴散層;該第1AlN構件,具有由於與該第3AlN構件接合而形成的另一第1擴散層;該第1AlN構件當中,2個該第1擴散層以外之部分的氧化釔含有率,在偵測極限以下;該第3AlN構件當中,該第3擴散層以外之部分,含有氧化釔;該第2AlN構件,係具有埋設了加熱器之晶圓載置面的第2圓形板件;該第3AlN構件,係與筒狀軸接合的第3圓形板件;該第1AlN構件,係夾在該第2圓形板件與該第3圓形板件之間的第1圓形板件;該第1AlN構件含有氧化鎂及氧化鈦以作為氧化物,且該氧化物的總添加量為0.1~3質量%。
- 如請求項5或6之氮化鋁接合體,其中,該第2AlN構件當中,該第2擴散層以外之部分的氧化釔含有率,係0.07質量%以上。
- 如請求項5或6之氮化鋁接合體,其中,該第3AlN構件當中,該第3擴散層以外之部分的氧化釔含有率,係0.07質量%以上。
- 如請求項1或5之氮化鋁接合體,其中,該圓形板件,具有溝槽。
- 如請求項2或6之氮化鋁接合體,其中,該第1至第3圓形板件積層而成的積層板,具有溝槽。
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| CN115710128A (zh) | 2023-02-24 |
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