TWI889524B - Light emitting element array structure, display apparatus and manufacturing method thereof - Google Patents

Abstract

The display apparatus includes light emitting element array structures and a driving backplane. Each of the light-emitting element array structure includes a first strip base, first conductive patterns, first light-emitting elements, a second strip base, second conductive patterns and second light-emitting elements. The first light-emitting elements are bonded to the first conductive patterns. The second light-emitting elements are bonded to the second conductive patterns. The light emitting element array structures are bonded to the driving backplane. The first strip base and the second strip base of one of the light-emitting element array structures are arranged in a first direction. The first light-emitting elements of the one of the light-emitting element array structures are arranged in a second direction. The first direction and the second direction are interlaced with each other and substantially parallel to the driving backplane. In addition, a manufacturing method of the display apparatus is also provided.

Description

Light-emitting element array structure, display device and manufacturing method thereof

The present invention relates to an optoelectronic device and a manufacturing method thereof, and in particular to a display device and a manufacturing method thereof.

The LED display panel includes a driving backplane and multiple LED elements transferred to the driving backplane. Inheriting the characteristics of LEDs, LED display panels have the advantages of power saving, high efficiency, high brightness and fast response time. In addition, compared with organic LED display panels, LED display panels also have the advantages of easy color adjustment, long luminous life and no image burn-in. Therefore, LED display panels are regarded as the next generation of display technology.

However, the uniformity or defects of multiple LED components on the wafer will cause abnormal photoelectric characteristics. If the multiple LED components on the wafer cannot be fully inspected before the LED components are transferred to the drive backplane, it is easy to cause dark spots on the LED display panel. In addition, there are many uncontrollable factors in the process of transferring multiple LED components, which will cause yield loss.

The present invention provides a display device with good performance.

The present invention provides a method for manufacturing a display device, which can manufacture a display device with good performance.

The display device of the present invention includes a plurality of light-emitting element array structures and a driving backplane. Each light-emitting element array structure includes a first strip substrate, a plurality of first conductive patterns, a plurality of first light-emitting elements, a second strip substrate, a plurality of second conductive patterns, and a plurality of second light-emitting elements. The plurality of first conductive patterns are disposed on the first strip substrate and are separated from each other. The plurality of first light-emitting elements are disposed on the first strip substrate and are bonded to the plurality of first conductive patterns. The second strip substrate is disposed on the plurality of first light-emitting elements. The plurality of second conductive patterns are disposed on the second strip substrate and are separated from each other. The plurality of second light-emitting elements are disposed on the second strip substrate and are bonded to the plurality of second conductive patterns. The plurality of light-emitting element array structures are bonded to the driving backplane. The first strip substrate and the second strip substrate of the light-emitting element array structure are arranged in a first direction. The plurality of first light-emitting elements of the light-emitting element array structure are arranged in the second direction. The first direction and the second direction are interlaced with each other and are substantially parallel to the driving backplane.

The light-emitting element array structure of the present invention includes a first strip substrate, a plurality of first conductive patterns, a plurality of first light-emitting elements, a second strip substrate, a plurality of second conductive patterns, and a plurality of second light-emitting elements. The first strip substrate has a first surface and a sidewall adjacent to the first surface of the first strip substrate. The sidewall of the first strip substrate has a plurality of first holes separated from each other. The plurality of first conductive patterns are arranged on the first surface of the first strip substrate, and are respectively filled into the plurality of first holes of the sidewall of the first strip substrate. The plurality of first light-emitting elements are arranged on the first surface of the first strip substrate, and are bonded to the plurality of first conductive patterns. The second strip substrate is arranged on the plurality of first light-emitting elements, and has a first surface and a sidewall adjacent to the first surface of the second strip substrate. The sidewall of the second strip substrate has a plurality of second holes separated from each other. A plurality of second conductive patterns are disposed on the first surface of the second strip substrate and are respectively filled into a plurality of second holes on the sidewall of the second strip substrate. A plurality of second light-emitting elements are disposed on the first surface of the second strip substrate and are bonded to the plurality of second conductive patterns.

The manufacturing method of the display device of the present invention comprises the following steps: providing a first light-emitting element array substrate, wherein the first light-emitting element array substrate comprises a first circuit substrate and a plurality of first light-emitting elements, the first circuit substrate has a plurality of first conductive strips, the plurality of first light-emitting elements are arranged on the first circuit substrate and arranged into a plurality of first light-emitting element rows and a plurality of first light-emitting element columns, the plurality of first light-emitting element columns are electrically connected to the plurality of first conductive strips; stacking the first light-emitting element array substrate and a second light-emitting element array substrate, wherein the second light-emitting element array substrate comprises a second circuit substrate and a plurality of second light-emitting elements, the second circuit substrate has a plurality of second conductive strips, the plurality of second light-emitting elements are arranged on the second circuit substrate and arranged into a plurality of second light-emitting element rows and a plurality of second light-emitting element columns, the plurality of second light-emitting element columns are electrically connected to the plurality of second conductive strips, the light-emitting elements The plurality of first light-emitting element rows of the first light-emitting element array substrate of the light-emitting element stacking structure are substantially aligned with the plurality of second light-emitting element rows of the second light-emitting element array substrate of the light-emitting element stacking structure. A light-emitting element stacking structure includes the first light-emitting element array substrate and the second light-emitting element array substrate. The light-emitting element stacking structure has a plurality of pre-cutting lanes, each of which is located adjacent to the plurality of first light-emitting element rows. Between two adjacent second light-emitting element rows; cutting the light-emitting element stacking structure along a plurality of pre-cutting paths to form a plurality of light-emitting element array structures, wherein each light-emitting element array structure includes a plurality of first conductive patterns cut from a plurality of first conductive strips, a first light-emitting element row, a plurality of second conductive patterns cut from a plurality of second conductive strips, and a second light-emitting element row; and bonding the plurality of light-emitting element array structures to a driving backplane.

10: First growth substrate

100: First light-emitting element array substrate

110: First circuit substrate

112: First conductive strip

112’, 112C’: first conductive pattern

112a, 312a, 316a, 512a, 516a, 712a: first joint

112b, 312b, 316b, 512b, 516b, 712b: Partial

112b’, 312b’, 316b’, 512b’, 516b’, 712b’: second joint

114: First base

114’: The first strip-shaped base

114a, 114a’, 314a, 314a’, 514a, 514a’: first surface

114c’, 314c’, 514c’, 714c’, 200c’, 400c’, 600c’: side wall

114h, 114h’: First hole

120, 120B: first light emitting element

121, 321, 521: Type I semiconductor layer

122, 322, 522: Type II semiconductor layer

123, 323, 523: Active layer

124, 324, 524: first electrode

125, 325, 525: Second electrode

200, 200A: First optical adhesive layer

200’: The first optical adhesive structure

200u, 400u, 600u: Strip opening

300: Second light-emitting element array substrate

310: Second circuit substrate

312: Second conductive strip

312’, 312C’: Second conductive pattern

314: Second base

314’: Second strip-shaped base

314b, 314b’, 514b, 514b’: second surface

314h1, 314h1’: Second hole

314h2, 314h2’, 514h2, 514h2’, 714h, 714h’, 714’: holes

316, 516, 712: Conductive strips

316’, 516’, 712’: Conductive pattern

320, 320B: second light-emitting element

400, 400A: Second optical adhesive layer

400’: Second optical adhesive structure

500: The third light-emitting element array substrate

510: Third circuit substrate

512: The third conductive strip

512’, 512C’: The third conductive pattern

514: The third base

514’: The third stripe-shaped base

514h1, 514h1’: The third hole

520, 520B: third light-emitting element

600, 600A: Third optical adhesive layer

600D: Color conversion layer

600D’: Color conversion structure

600’: The third optical adhesive structure

700:Packaging substrate

712: Conductive strip

714:Packaging substrate

714’: Packaging strip substrate

714b, 714b’: surface

800: Test line

810: Conductor

900: Drive backplane

910: First embankment structure

920: Second embankment structure

930: Third embankment structure

C: Pre-cutting track

C114h: First hole row

C120: First light-emitting element row

C314h1: Second hole row

C320: Second light-emitting element row

C314h2, C514h2, C714h: Hole row

C514h1: The third hole row

C520: The third light-emitting element row

DP: Display Device

d1: first direction

d2: second direction

d3:Third direction

R120: The first light-emitting element row

R114h: First hole row

R314h1: Second hole row

R320: Second light-emitting element row

R314h2, R514h2, R714h: Hole column

R514h1: The third hole row

R520: The third row of light-emitting elements

S, SD: light-emitting element stacking structure

s, sA, sB, sC, sD: light-emitting element array structure

V: Direction

I-I’, II-II’, III-III’, IV-IV’, V-V’, VI-VI’, VII-VII’, VIII-VIII’, IX-IX’, X-X’, XI-XI’, XII-XII’, XIII-XIII’: line segments

Figures 1A to 1M are three-dimensional schematic diagrams of the manufacturing process of a display device according to an embodiment of the present invention.

Figure 2 is a cross-sectional schematic diagram of the first light-emitting element array substrate of an embodiment of the present invention.

Figure 3 is a cross-sectional schematic diagram of the first light-emitting element array substrate of an embodiment of the present invention.

Figure 4 is a schematic cross-sectional view of the first light-emitting element array substrate of an embodiment of the present invention.

Figure 5 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical adhesive, and the second light-emitting element array substrate of an embodiment of the present invention.

Figure 6 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical adhesive, and the second light-emitting element array substrate of an embodiment of the present invention.

FIG7 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical adhesive, and the second light-emitting element array substrate of an embodiment of the present invention.

FIG8 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical adhesive, the second light-emitting element array substrate, the second optical adhesive, and the third light-emitting element array substrate of an embodiment of the present invention.

FIG9 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical adhesive, the second light-emitting element array substrate, the second optical adhesive, and the third light-emitting element array substrate of an embodiment of the present invention.

FIG10 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical adhesive, the second light-emitting element array substrate, the second optical adhesive, and the third light-emitting element array substrate of an embodiment of the present invention.

Figure 11 is a cross-sectional schematic diagram of a light-emitting element stacking structure of an embodiment of the present invention.

Figure 12 is a cross-sectional schematic diagram of a light-emitting element stacking structure of an embodiment of the present invention.

Figure 13 is a cross-sectional schematic diagram of a light-emitting element stacking structure of an embodiment of the present invention.

Figure 14 is a three-dimensional schematic diagram of the light-emitting element array structure of an embodiment of the present invention.

Figure 15 is a cross-sectional schematic diagram of the light-emitting element array structure of an embodiment of the present invention.

Figure 16 is a side view schematic diagram of the light-emitting element array structure of an embodiment of the present invention.

Figures 17A to 17K are three-dimensional schematic diagrams of the manufacturing process of the light-emitting element array structure of another embodiment of the present invention.

FIG18A is a three-dimensional schematic diagram of a portion of the manufacturing process of a light-emitting element array structure of another embodiment of the present invention.

Figure 18B is a three-dimensional schematic diagram of the light-emitting element array structure of another embodiment of the present invention.

FIG. 19A is a three-dimensional schematic diagram of a portion of the manufacturing process of a light-emitting element array structure in another embodiment of the present invention.

FIG19B is a three-dimensional schematic diagram of the light-emitting element array structure of another embodiment of the present invention.

Figure 20A is a three-dimensional schematic diagram of the stacked structure of light-emitting elements of an embodiment of the present invention.

Figure 20B is a three-dimensional schematic diagram of the light-emitting element array structure of an embodiment of the present invention.

Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same element symbols are used in the drawings and description to represent the same or similar parts.

It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it may be directly on or connected to another element, or an intermediate element may also exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intermediate elements. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrically connected" or "coupled" may mean that there are other elements between two elements.

As used herein, "approximately", "approximately", or "substantially" includes the stated value and the average value within an acceptable deviation range of a specific value determined by a person of ordinary skill in the art, taking into account the measurement in question and the specific amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "approximately" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, "approximately", "approximately", or "substantially" as used herein can select a more acceptable deviation range or standard deviation based on the optical properties, etching properties, or other properties, and can apply to all properties without using one standard deviation.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. It will be further understood that those terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present invention, and will not be interpreted as an idealized or overly formal meaning unless expressly so defined herein.

FIG. 1A to FIG. 1M are three-dimensional schematic diagrams of the manufacturing process of the display device of an embodiment of the present invention. Referring to FIG. 1A and FIG. 1B, first, a first light-emitting element array substrate 100 is provided. Referring to FIG. 1A, in detail, in some embodiments, a first growth substrate (e.g., a first wafer) 10 and a plurality of first light-emitting elements 120 formed on the first growth substrate 10 may be provided first; referring to FIG. 1A and FIG. 1B, then, the plurality of first light-emitting elements 120 on the first growth substrate 10 are transferred to the first circuit substrate 110, and the plurality of first light-emitting elements 120 are bonded to the first circuit substrate 110 to form the first light-emitting element array substrate 100; but the present invention is not limited thereto.

FIG2 is a schematic cross-sectional view of a first light-emitting element array substrate of an embodiment of the present invention. FIG2 corresponds to line segment I-I' of FIG1B. FIG3 is a schematic cross-sectional view of a first light-emitting element array substrate of an embodiment of the present invention. FIG3 corresponds to line segment II-II' of FIG1B. FIG4 is a schematic cross-sectional view of a first light-emitting element array substrate of an embodiment of the present invention. FIG4 corresponds to line segment III-III' of FIG1B.

Referring to FIG. 1B , the first light emitting element array substrate 100 includes a first circuit substrate 110 and a plurality of first light emitting elements 120 electrically connected to the first circuit substrate 110. The first circuit substrate 110 includes a first base 114 and a plurality of first conductive strips 112 disposed on the first base 114. Referring to FIG. 1B , FIG. 2 and FIG. 3 , in some embodiments, the first surface 114a of the first base 114 has a plurality of first holes 114h, the plurality of first holes 114h are arranged into a plurality of first hole rows R114h and a plurality of first hole lines C114h, the plurality of first conductive strips 112 are separated from each other, and each first conductive strip 112 is disposed on the first surface 114a of the first base 114 and filled with a corresponding first hole row R114h.

Referring to FIG. 1B , FIG. 2 and FIG. 4 , a plurality of first light emitting elements 120 are disposed on the first circuit substrate 110 and arranged into a plurality of first light emitting element rows R120 and a plurality of first light emitting element columns C120. Each first light emitting element 120 includes a first type semiconductor layer 121, a second type semiconductor layer 122, an active layer 123 located between the first type semiconductor layer 121 and the second type semiconductor layer 122, a first electrode 124 electrically connected to the first type semiconductor layer 121, and a second electrode 125 electrically connected to the second type semiconductor layer 122. In some embodiments, the first electrode 124 and the second electrode 125 may be selectively located on opposite sides of the active layer 123. That is, in some embodiments, the first light-emitting element 120 may be selectively a vertical light-emitting element, but the present invention is not limited thereto. In some embodiments, the first light-emitting element 120 is, for example, a micro light-emitting diode (μLED), but the present invention is not limited thereto. The first light-emitting element 120 is used to emit a first color light. In some embodiments, the first color light is, for example, blue light, but the present invention is not limited thereto.

Please refer to FIG. 1B and FIG. 2 , multiple first light-emitting element rows R120 are electrically connected to multiple first conductive strips 112. In some embodiments, multiple first light-emitting element rows R120 can be electrically connected to multiple first conductive strips 112 respectively, but the present invention is not limited thereto. In some embodiments, multiple first electrodes 124 of multiple first light-emitting elements 120 of the same first light-emitting element row R120 can be respectively bonded to multiple first bonding portions 112a of the same first conductive strip 112, wherein the multiple first bonding portions 112a are disposed on the first surface 114a of the first substrate 114 facing the multiple first light-emitting elements 120 and are located outside the area of the multiple first holes 114h.

Please refer to FIG. 1B and FIG. 3. In some embodiments, a first hole row C114h and a plurality of portions 112b of a plurality of first conductive strips 112 filled in a plurality of first holes 114h of the first hole row C114h are located between two adjacent first light-emitting element rows C120.

Please refer to FIG. 1C. Then, in some embodiments, a first optical adhesive layer 200 may be formed on the first light-emitting element array substrate 100 to cover a plurality of first light-emitting elements 120. In some embodiments, the first light-emitting element 120 may be selectively a vertical light-emitting element, and the first optical adhesive layer 200 may selectively expose the second electrode 125 of the first light-emitting element 120 (see FIG. 2 and FIG. 4), but the present invention is not limited thereto.

Please refer to FIG. 1D and FIG. 1E, then, stack the first light emitting element array substrate 100 and the second light emitting element array substrate 300. Please refer to FIG. 1D, for example, in some embodiments, the second circuit substrate 310 can be selectively fixed on the first light emitting element array substrate 100; please refer to FIG. 1E, then, the second light emitting elements 320 on the second growth substrate (for example: the second wafer; not shown) are transferred to the second circuit substrate 310, and the second light emitting elements 320 are bonded to the second circuit substrate 310 to form the second light emitting element array substrate 300; but the present invention is not limited thereto.

FIG5 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical glue, and the second light-emitting element array substrate of an embodiment of the present invention. FIG5 corresponds to the line segment IV-IV' of FIG1E. FIG6 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical glue, and the second light-emitting element array substrate of an embodiment of the present invention. FIG6 corresponds to the line segment V-V' of FIG1E. FIG7 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical glue, and the second light-emitting element array substrate of an embodiment of the present invention. FIG7 corresponds to the line segment VI-VI' of FIG1E.

Referring to FIG. 1E , the second light-emitting element array substrate 300 includes a second circuit substrate 310 and a plurality of second light-emitting elements 320 electrically connected to the second circuit substrate 310. The second circuit substrate 310 includes a second base 314 and a plurality of second conductive strips 312 disposed on the second base 314 . Referring to FIG. 1E , FIG. 5 and FIG. 6 , in some embodiments, the second base 314 has a first surface 314a facing the plurality of second light-emitting elements 320, the first surface 314a of the second base 314 has a plurality of second holes 314h1, the plurality of second holes 314h1 are arranged into a plurality of second hole rows R314h1 and a plurality of second hole lines C314h1, the plurality of second conductive strips 312 are separated from each other, and each second conductive strip 312 is disposed on the first surface 314a of the second base 314 and filled with a corresponding second hole row R314h1.

1E, 5 and 7, a plurality of second light-emitting elements 320 are disposed on the second circuit substrate 310 and arranged into a plurality of second light-emitting element rows R320 and a plurality of second light-emitting element columns C320. Each second light-emitting element 320 includes a first-type semiconductor layer 321, a second-type semiconductor layer 322, an active layer 323 located between the first-type semiconductor layer 321 and the second-type semiconductor layer 322, a first electrode 324 electrically connected to the first-type semiconductor layer 321, and a second electrode 325 electrically connected to the second-type semiconductor layer 322. In some embodiments, the first electrode 324 and the second electrode 325 may be selectively located on opposite sides of the active layer 323. That is, in some embodiments, the second light-emitting element 320 may be selectively a vertical light-emitting element, but the present invention is not limited thereto. In some embodiments, the second light-emitting element 320 is, for example, a micro light-emitting diode (μLED), but the present invention is not limited thereto. The second light-emitting element 320 is used to emit a second color light different from the first color light. In some embodiments, the second color light is, for example, green light, but the present invention is not limited thereto.

Please refer to FIG. 1E and FIG. 5 , multiple second light-emitting element rows R320 are electrically connected to multiple second conductive strips 312. In some embodiments, multiple second light-emitting element rows R320 can be electrically connected to multiple second conductive strips 312 respectively, but the present invention is not limited thereto. In some embodiments, multiple first electrodes 324 of multiple second light-emitting elements 320 of the same second light-emitting element row R320 can be respectively bonded to multiple first bonding portions 312a of the same second conductive strip 312, wherein the multiple first bonding portions 312a are disposed on the first surface 314a of the second substrate 314 facing the multiple second light-emitting elements 320 and are located outside the area of the multiple second holes 314h1.

Please refer to FIG. 1E and FIG. 6. In some embodiments, a second hole row C314h1 and multiple portions 312b of multiple second conductive strips 312 filled in multiple second holes 314h1 of the second hole row C314h1 are located between two adjacent second light-emitting element rows C320.

Please refer to FIG. 1E, FIG. 5 and FIG. 6. In some embodiments, the second circuit substrate 310 may also selectively include a plurality of conductive strips 316. The second base 314 of the second circuit substrate 310 has a second surface 314b facing the plurality of first light-emitting elements 120. The second surface 314b has a plurality of holes 314h2. The plurality of holes 314h2 are arranged into a plurality of hole rows R314h2 and a plurality of hole lines C314h2. The plurality of conductive strips 316 are separated from each other. Each conductive strip 316 is disposed on the second surface 314b of the second base 314 and filled with a corresponding hole row R314h2.

Please refer to FIG. 1E and FIG. 5. In some embodiments, a plurality of first light-emitting element rows R120 may be electrically connected to a plurality of conductive strips 316 respectively. In some embodiments, a plurality of second electrodes 125 of a plurality of first light-emitting elements 120 of the same first light-emitting element row R120 may be respectively bonded to a plurality of first bonding portions 316a of the same conductive strip 316, wherein the plurality of first bonding portions 316a are disposed on the second surface 314b of the second substrate 314 facing the plurality of first light-emitting elements 120 and are located outside the area of the plurality of holes 314h2.

Please refer to FIG. 1E and FIG. 6. In some embodiments, a hole row C314h2 and multiple portions 316b of multiple conductive strips 316 filled in multiple holes 314h2 of the hole row C314h2 are located between two adjacent second light-emitting element rows C320.

1E, 5 and 7, the first light emitting device rows C120 of the first light emitting device array substrate 100 are substantially aligned with the second light emitting device rows C320 of the second light emitting device array substrate 300. In some embodiments, the first light emitting device columns R120 of the first light emitting device array substrate 100 can be substantially aligned with the second light emitting device columns R320 of the second light emitting device array substrate 300. Referring to FIG. 1E and FIG. 6, in some embodiments, the first conductive strips 112, the second conductive strips 312 and the conductive strips 316 can be substantially aligned. Please refer to FIG. 1E, FIG. 5 and FIG. 6. In some embodiments, the plurality of first holes 114h arranged in an array, the plurality of second holes 314h1 arranged in an array and the plurality of holes 314h2 arranged in an array can be substantially aligned.

Please refer to FIG. 1F. Then, in some embodiments, a second optical adhesive layer 400 may be formed on the second light-emitting element array substrate 300 to cover a plurality of second light-emitting elements 320. In some embodiments, the second light-emitting element 320 may be selectively a vertical light-emitting element, and the second optical adhesive layer 400 may selectively expose the second electrode 325 of the second light-emitting element 320 (see FIG. 5 and FIG. 7), but the present invention is not limited thereto.

Please refer to FIG. 1G and FIG. 1H. Next, the third light-emitting element array substrate 500 is stacked on the second light-emitting element array substrate 300. For example, in some embodiments, the third circuit substrate 510 can be selectively fixed on the second light-emitting element array substrate 300, and then the third light-emitting elements 520 on the third growth substrate (for example, the third wafer; not shown) are transferred to the third circuit substrate 510, and the third light-emitting elements 520 are bonded to the third circuit substrate 510 to form the third light-emitting element array substrate 500; but the present invention is not limited thereto.

FIG8 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical glue, the second light-emitting element array substrate, the second optical glue and the third light-emitting element array substrate of an embodiment of the present invention. FIG8 corresponds to the line segment VII-VII' of FIG1H. FIG9 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical glue, the second light-emitting element array substrate, the second optical glue and the third light-emitting element array substrate of an embodiment of the present invention. FIG9 corresponds to the line segment VIII-VIII' of FIG1H. FIG10 is a cross-sectional schematic diagram of the first light-emitting element array substrate, the first optical glue, the second light-emitting element array substrate, the second optical glue and the third light-emitting element array substrate of an embodiment of the present invention. FIG10 corresponds to the line segment IX-IX' of FIG1H.

Referring to FIG. 1H , the third light-emitting element array substrate 500 includes a third circuit substrate 510 and a plurality of third light-emitting elements 520 electrically connected to the third circuit substrate 510. The third circuit substrate 510 includes a third base 514 and a plurality of third conductive strips 512 disposed on the third base 514. Referring to FIG. 1H , FIG. 8 and FIG. 9 , in some embodiments, the third base 514 has a plurality of third holes 514h1, the plurality of third holes 514h1 are arranged into a plurality of third hole rows R514h1 and a plurality of third hole lines C514h1, the plurality of third conductive strips 512 are separated from each other, and each third conductive strip 512 is disposed on the first surface 514a of the third base 514 and filled with a corresponding third hole row R514h1.

1H, 8 and 10, a plurality of third light-emitting elements 520 are disposed on the third circuit substrate 510 and arranged into a plurality of third light-emitting element rows R520 and a plurality of third light-emitting element columns C520. Each third light-emitting element 520 includes a first-type semiconductor layer 521, a second-type semiconductor layer 522, an active layer 523 located between the first-type semiconductor layer 521 and the second-type semiconductor layer 522, a first electrode 524 electrically connected to the first-type semiconductor layer 521, and a second electrode 525 electrically connected to the second-type semiconductor layer 522. In some embodiments, the first electrode 524 and the second electrode 525 may be selectively located on opposite sides of the active layer 523. That is, in some embodiments, the third light-emitting element 520 may be selectively a vertical light-emitting element, but the present invention is not limited thereto. In some embodiments, the third light-emitting element 520 is, for example, a micro light-emitting diode (μLED), but the present invention is not limited thereto. The third light-emitting element 520 is used to emit a third color light. In some embodiments, the third color light is, for example, red light, but the present invention is not limited thereto.

Please refer to FIG. 1H and FIG. 8 , multiple third light-emitting element rows R520 are electrically connected to multiple third conductive strips 512. In some embodiments, multiple third light-emitting element rows R520 can be electrically connected to multiple third conductive strips 512 respectively, but the present invention is not limited thereto. In some embodiments, multiple first electrodes 524 of multiple third light-emitting elements 520 of the same third light-emitting element row R520 can be respectively bonded to multiple first bonding portions 512a of the same third conductive strip 512, wherein the multiple first bonding portions 512a are disposed on the first surface 514a of the third substrate 514 facing the multiple third light-emitting elements 520 and are located outside the area of the multiple third holes 514h1.

Please refer to FIG. 1H and FIG. 8 . In some embodiments, a third hole row R514h1 and multiple portions 512b of multiple third conductive strips 512 filled in multiple third holes 514h1 of the third hole row R514h1 are located between two adjacent third light-emitting element rows C520.

Please refer to FIG. 1H, FIG. 8 and FIG. 10. In some embodiments, the third circuit substrate 510 may further selectively include a plurality of conductive strips 516. The third base 514 of the third circuit substrate 510 has a second surface 514b facing the plurality of second light-emitting elements 320. The second surface 514b has a plurality of holes 514h2. The plurality of holes 514h2 are arranged into a plurality of hole rows R514h2 and a plurality of hole lines C514h2. The plurality of conductive strips 516 are separated from each other. Each conductive strip 516 is disposed on the second surface 514b of the third base 514 and filled with a corresponding hole row R514h2.

Please refer to FIG. 1H and FIG. 8 . In some embodiments, multiple second light-emitting element rows R320 can be electrically connected to multiple conductive strips 516 respectively. In some embodiments, multiple second electrodes 325 of multiple second light-emitting elements 320 of the same second light-emitting element row R320 can be respectively bonded to multiple first bonding portions 516a of the same conductive strip 516, wherein the multiple first bonding portions 516a are disposed on the second surface 514b of the third substrate 514 facing the multiple second light-emitting elements 320 and are located outside the area of the multiple holes 514h2.

Please refer to FIG. 1H and FIG. 9. In some embodiments, a hole row C514h2 and multiple portions 516b of multiple conductive strips 516 filled in multiple holes 514h2 of the hole row C514h2 are located between two adjacent third light-emitting element rows C520.

1G, 8 and 9, the first light emitting device rows C120 of the first light emitting device array substrate 100, the second light emitting device rows C320 of the second light emitting device array substrate 300 and the third light emitting device rows C520 of the third light emitting device array substrate 500 are substantially aligned. In some embodiments, the first light emitting device columns R120 of the first light emitting device array substrate 100, the second light emitting device columns R320 of the second light emitting device array substrate 300 and the third light emitting device columns R520 of the third light emitting device array substrate 500 are substantially aligned. In some embodiments, the first conductive strips 112, the conductive strips 316, the second conductive strips 312, the conductive strips 516 and the third conductive strips 512 may be substantially aligned. In some embodiments, the plurality of first holes 114h, the plurality of holes 314h2, the plurality of second holes 314h1, the plurality of holes 514h2, and the plurality of third holes 514h1 may be substantially aligned.

Please refer to FIG. 1H and FIG. 1I. Then, in some embodiments, a third optical adhesive layer 600 may be formed on the third light-emitting element array substrate 500 to cover a plurality of third light-emitting elements 520. In some embodiments, the third light-emitting element 520 may be selectively a vertical light-emitting element, and the third optical adhesive layer 600 may selectively expose the second electrode 525 of the third light-emitting element 520 (see FIG. 8 and FIG. 10), but the present invention is not limited thereto.

Please refer to FIG. 1I and FIG. 1J. Then, in some embodiments, a packaging substrate 700 may be formed on the third light-emitting element array substrate 500 to complete the light-emitting element stacking structure S.

FIG11 is a schematic cross-sectional view of a stacked structure of a light-emitting element of an embodiment of the present invention. FIG11 corresponds to the line segment X-X’ of FIG1J. FIG12 is a schematic cross-sectional view of a stacked structure of a light-emitting element of an embodiment of the present invention. FIG12 corresponds to the line segment XI-XI’ of FIG1J. FIG13 is a schematic cross-sectional view of a stacked structure of a light-emitting element of an embodiment of the present invention. FIG13 corresponds to the line segment XII-XII’ of FIG1J.

Referring to FIG. 1J, in some embodiments, the package substrate 700 may include a package base 714 and a plurality of conductive strips 712 disposed on the package base 714. Referring to FIG. 1J, FIG. 11 and FIG. 12, in some embodiments, the package base 714 has a surface 714b facing the plurality of third light-emitting elements 520, the surface 714b may have a plurality of holes 714h, the plurality of holes 714h are arranged into a plurality of hole rows R714h and a plurality of hole lines C714h, the plurality of conductive strips 712 are separated from each other, each conductive strip 712 is disposed on the surface 714b of the base 714 and filled with a corresponding hole row R714h.

Please refer to FIG. 1J and FIG. 11 . In some embodiments, a plurality of third light-emitting element rows R520 may be electrically connected to a plurality of conductive strips 712 respectively. In some embodiments, a plurality of second electrodes 525 of a plurality of third light-emitting elements 520 of the same third light-emitting element row R520 may be respectively bonded to a plurality of first bonding portions 712a of the same conductive strip 712, wherein the plurality of first bonding portions 712a are disposed on a surface 714b of the package substrate 714 facing the plurality of third light-emitting elements 520 and are located outside the area of the plurality of holes 714h.

Please refer to FIG. 1J and FIG. 12 . In some embodiments, a hole row C714h and multiple portions 712b of multiple conductive strips 712 filled in multiple holes 714h of the hole row C714h are located between two adjacent third light-emitting element rows C520.

In some embodiments, the plurality of first conductive strips 112, the plurality of conductive strips 316, the plurality of second conductive strips 312, the plurality of conductive strips 516, the plurality of third conductive strips 512, and the plurality of conductive strips 712 may be substantially aligned. In some embodiments, the plurality of first holes 114h, the plurality of holes 314h2, the plurality of second holes 314h1, the plurality of holes 514h2, the plurality of third holes 514h1, and the plurality of holes 714h may be substantially aligned.

1J and 11 , in some embodiments, the light emitting device stack structure S includes a first light emitting device array substrate 100, a first optical adhesive layer 200, a second light emitting device array substrate 300, a second optical adhesive layer 400, a third light emitting device array substrate 500, a third optical adhesive layer 600, and a packaging substrate 700. The light emitting device stack structure S has a plurality of pre-cut streets C. Each pre-cut street C is located between two adjacent first light emitting device rows C120, between two adjacent second light emitting device rows C320, and between two adjacent third light emitting device rows C520. Please refer to Figure 1J and Figure 1K. Then, the light-emitting element stacking structure S is cut along multiple pre-cutting lanes C to form multiple light-emitting element array structures s.

FIG14 is a three-dimensional schematic diagram of a light-emitting element array structure of an embodiment of the present invention. FIG15 is a cross-sectional schematic diagram of a light-emitting element array structure of an embodiment of the present invention. FIG15 corresponds to line segment XIII-XIII' of FIG1J. FIG16 is a side view schematic diagram of a light-emitting element array structure of an embodiment of the present invention. FIG16 is a side view of the light-emitting element array structure s as seen along direction V of FIG1J.

Please refer to Figures 1J, 11, 14, 15 and 16. Each light-emitting element array structure s includes a first strip substrate 114' cut from a first substrate 114. The first strip substrate 114' has a first surface 114a' and a side wall 114c' adjacent to the first surface 114a' of the first strip substrate 114'. The side wall 114c' of the first strip substrate 114' is formed when the light-emitting element stacking structure S is cut. The side wall 114c' of the first strip substrate 114' has a plurality of first holes 114h' separated from each other. Each first hole 114h' of the light-emitting element array structure s is cut from a first hole 114h of the light-emitting element stacking structure S.

Each light-emitting device array structure s further includes a plurality of first conductive patterns 112' cut out from a plurality of first conductive strips 112. The plurality of first conductive patterns 112' are disposed on the first surface 114a' of the first strip-shaped substrate 114' and are respectively filled into a plurality of first holes 114h' of the sidewall 114c' of the first strip-shaped substrate 114'. Each first conductive pattern 112' includes a first joint portion 112a cut out from a first conductive strip 112 and a second joint portion 112b' connected to the first joint portion 112a, wherein the second joint portion 112b' is cut out from a portion 112b of the first conductive strip 112 located in a first hole 114h. The first joint portion 112a of each first conductive pattern 112' is joined to a corresponding first light-emitting device 120. The second joint portion 112b' of each first conductive pattern 112' is used to electrically connect to the test circuit 800 (please refer to FIG. 1M) and/or the driving backplane 900 (please refer to FIG. 1N) in subsequent manufacturing processes.

Each light-emitting element array structure s further includes a first light-emitting element row C120. The first light-emitting elements 120 of the first light-emitting element row C120 are disposed on the first surface 114a' of the first strip substrate 114' and bonded to the first conductive patterns 112'. In some embodiments, the first electrodes 124 of the first light-emitting elements 120 of the first light-emitting element row C120 are bonded to the first bonding portions 112a of the first conductive patterns 112'.

In some embodiments, each light-emitting element array structure s further includes a first optical adhesive structure 200' cut out from the first optical adhesive layer 200, wherein the first optical adhesive structure 200' covers a plurality of first light-emitting elements 120 of a first light-emitting element row C120.

Each light-emitting element array structure s further includes a second strip-shaped substrate 314′ cut from the second substrate 314. The second strip-shaped substrate 314′ is disposed on a plurality of first light-emitting elements 120. The second strip-shaped substrate 314′ has a first surface 314a′ and a side wall 314c′ adjacent to the first surface 314a′ of the second strip-shaped substrate 314′. The side wall 314c′ of the second strip-shaped substrate 314′ is formed when the light-emitting element stacking structure S is cut. The side wall 314c′ of the second strip-shaped substrate 314′ has a plurality of second holes 314h1′ separated from each other. Each second hole 314h1′ of the light-emitting element array structure s is cut from a second hole 314h1 of the light-emitting element stacking structure S. In some embodiments, the sidewall 314c' of the second strip substrate 314' further has a plurality of holes 314h2' separated from each other. Each hole 314h2' of the light-emitting element array structure s is cut out from a hole 314h2 of the light-emitting element stacking structure S.

Each light-emitting device array structure s further includes a plurality of second conductive patterns 312' cut out from a plurality of second conductive strips 312. The plurality of second conductive patterns 312' are disposed on the first surface 314a' of the second strip-shaped substrate 314' and are respectively filled into a plurality of second holes 314h1' of the sidewall 314c' of the second strip-shaped substrate 314'. Each second conductive pattern 312' includes a first joint portion 312a cut out from a second conductive strip 312 and a second joint portion 312b' connected to the first joint portion 312a, wherein the second joint portion 312b' is cut out from a portion 312b of the second conductive strip 312 located in a second hole 314h1. The first joint portion 312a of each second conductive pattern 312' is joined to a corresponding second light-emitting device 320. The second joint portion 312b' of each second conductive pattern 312' is used to electrically connect to the test circuit 800 (please refer to FIG. 1M) and/or the driving backplane 900 (please refer to FIG. 1N) in subsequent manufacturing processes.

In some embodiments, each light-emitting device array structure s further includes a plurality of conductive patterns 316' cut out from a plurality of conductive strips 316. The plurality of conductive patterns 316' are disposed on the second surface 314b' of the second strip substrate 314' and are respectively filled into a plurality of holes 314h2' of the sidewall 314c' of the second strip substrate 314'. Each conductive pattern 316' includes a first joint portion 316a cut out from a conductive strip 316 and a second joint portion 316b' connected to the first joint portion 316a, wherein the second joint portion 316b' is cut out from a portion 316b of the conductive strip 316 located in a hole 314h2. The first joint portion 316a of each conductive pattern 316' is joined to the second electrode 125 of a corresponding first light-emitting device 120. The second joint portion 316b' of each conductive pattern 316' is used to electrically connect to the test circuit 800 (please refer to FIG. 1M) and/or the driving backplane 900 (please refer to FIG. 1N) in subsequent manufacturing processes.

Each light-emitting element array structure s further includes a second light-emitting element row C320. The plurality of second light-emitting elements 320 of the second light-emitting element row C320 are disposed on the first surface 314a' of the second strip substrate 314' and bonded to the plurality of second conductive patterns 312'. In some embodiments, the plurality of first electrodes 324 of the plurality of second light-emitting elements 320 of the second light-emitting element row C320 are respectively bonded to the plurality of first bonding portions 312a of the plurality of second conductive patterns 312'.

In some embodiments, each light-emitting element array structure s further includes a second optical adhesive structure 400' cut out from the second optical adhesive layer 400, wherein the second optical adhesive structure 400' encapsulates a plurality of second light-emitting elements 320 of a second light-emitting element row C320.

In some embodiments, each light-emitting element array structure s further includes a third strip-shaped substrate 514' cut from the third substrate 514. The third strip-shaped substrate 514' has a first surface 514a' and a side wall 514c' adjacent to the first surface 514a' of the third strip-shaped substrate 514'. The side wall 514c' of the third strip-shaped substrate 514' is formed when the light-emitting element stacking structure S is cut. The side wall 514c' of the third strip-shaped substrate 514' has a plurality of third holes 514h1' separated from each other. Each third hole 514h1' of the light-emitting element array structure s is cut from a third hole 514h1 of the light-emitting element stacking structure S. In some embodiments, the side wall 514c' of the third strip-shaped substrate 514' further has a plurality of holes 514h2' separated from each other. Each hole 514h2' of the light-emitting element array structure s is cut out from a hole 514h2 of the light-emitting element stack structure S.

Each light-emitting element array structure s further includes a plurality of third conductive patterns 512' cut out from a plurality of third conductive strips 512. The plurality of third conductive patterns 512' are disposed on the first surface 514a' of the third strip-shaped substrate 514' and are respectively filled into a plurality of third holes 514h1' of the sidewall 514c' of the third strip-shaped substrate 514'. Each third conductive pattern 512' includes a first joint portion 512a cut out from a third conductive strip 512 and a second joint portion 512b' connected to the first joint portion 512a, wherein the second joint portion 512b' is cut out from a portion 512b of the third conductive strip 512 located in a third hole 514h1. The first joint portion 512a of each third conductive pattern 512' is joined to a corresponding third light-emitting element 520. The second joint portion 512b' of each third conductive pattern 512' is used to electrically connect to the test circuit 800 (please refer to FIG. 1M) and/or the driving backplane 900 (please refer to FIG. 1N) in subsequent manufacturing processes.

In some embodiments, each light-emitting device array structure s further includes a plurality of conductive patterns 516' cut out from a plurality of conductive strips 516. The plurality of conductive patterns 516' are disposed on the second surface 514b' of the third strip-shaped substrate 514' and are respectively filled into a plurality of holes 514h2' of the sidewall 514c' of the third strip-shaped substrate 514'. Each conductive pattern 516' includes a first joint portion 516a cut out from a conductive strip 516 and a second joint portion 516b' connected to the first joint portion 516a, wherein the second joint portion 516b' is cut out from a portion 516b of the conductive strip 516 located in a hole 514h2. The first joint portion 516a of each conductive pattern 516' is joined to the second electrode 325 of a corresponding second light-emitting device 320. The second joint portion 516b' of each conductive pattern 516' is used to electrically connect to the test circuit 800 (please refer to FIG. 1M) and/or the driving backplane 900 (please refer to FIG. 1N) in subsequent manufacturing processes.

Each light-emitting element array structure s further includes a third light-emitting element row C520. A plurality of third light-emitting elements 520 of the third light-emitting element row C520 are disposed on the first surface 514a' of the third strip substrate 514' and bonded to a plurality of third conductive patterns 512'. In some embodiments, a plurality of first electrodes 524 of a plurality of third light-emitting elements 520 of the third light-emitting element row C520 are bonded to a plurality of first bonding portions 512a of a plurality of third conductive patterns 512', respectively.

In some embodiments, each light-emitting element array structure s further includes a third optical adhesive structure 600' cut from the third optical adhesive layer 600, wherein the third optical adhesive structure 600' encapsulates a plurality of third light-emitting elements 520 of a third light-emitting element row C520.

In some embodiments, each light-emitting element array structure s further includes a packaging strip substrate 714' cut from the packaging substrate 714. The packaging strip substrate 714' is disposed on a plurality of third light-emitting elements 520 in the third light-emitting element row C520. The third strip substrate 514' and the packaging strip substrate 714' are respectively located on opposite sides of the plurality of third light-emitting elements 520 in the third light-emitting element row C520.

The package strip substrate 714' has a surface 714b' and a side wall 714c' adjacent to the surface 714b' of the package strip substrate 714'. The side wall 714c' of the package strip substrate 714' is formed when the light-emitting element stacking structure S is cut. The side wall 714c' of the package strip substrate 714' has a plurality of holes 714h' separated from each other. Each hole 714h' of the light-emitting element array structure s is cut out from a hole 714h of the light-emitting element stacking structure S.

In some embodiments, each light-emitting element array structure s further includes a plurality of conductive patterns 712' cut out from a plurality of conductive strips 712. The plurality of conductive patterns 712' are disposed on a surface 714b' of a package strip substrate 714' and are respectively filled into a plurality of holes 714h' of a side wall 714c' of the package substrate 714'. Each conductive pattern 712' includes a first joint portion 712a cut out from a conductive strip 712 and a second joint portion 712b' connected to the first joint portion 712a, wherein the second joint portion 712b' is cut out from a portion 712b of the conductive strip 712 located in a hole 714h. The first joint portion 712a of each conductive pattern 712' is joined to the second electrode 525 of a corresponding third light-emitting element 520. The second joint portion 712b' of each conductive pattern 712' is used to electrically connect to the test circuit 800 (please refer to FIG. 1M) and/or the driving backplane 900 (please refer to FIG. 1N) in subsequent manufacturing processes.

Referring to FIG. 14 , in some embodiments, the first strip substrate 114′, the second strip substrate 314′, the third strip substrate 514′, and the packaging strip substrate 714′ are arranged in a first direction d1, a plurality of first light emitting elements 120 are arranged in a second direction d2, a plurality of second light emitting elements 320 are arranged in the second direction d2, and a plurality of third light emitting elements 520 are arranged in the second direction d2. The first direction d1 and the second direction d2 are intersected, and the third direction d3 is substantially perpendicular to the first direction d1 and the second direction d2. The side wall 114c′ of the first strip substrate 114′, a side wall 200c′ of the first optical adhesive structure 200′, and a side wall 314c′ of the second strip substrate 314′ are arranged in a first direction d1. c', a side wall 400c' of the second optical adhesive structure 400', a side wall 514c' of the third strip-shaped substrate 514', a side wall 600c' of the third optical adhesive structure 600' and a side wall 714c' of the packaging strip-shaped substrate 714' are oriented toward the third direction d3, and the side wall 114c' of the first strip-shaped substrate 114', the first optical adhesive The side wall 200c' of the structure 200', the side wall 314c' of the second strip substrate 314', the side wall 400c' of the second optical adhesive structure 400', the side wall 514c' of the third strip substrate 514', the side wall 600c' of the third optical adhesive structure 600' and the side wall 714c' of the packaging strip substrate 714' are substantially aligned.

Please refer to FIG. 1L , and then, the light-emitting element array structure s is tested. In detail, the light-emitting element array structure s can be electrically connected to the test circuit 800 for testing. For example, in some embodiments, the test circuit 800 may include a test board having a plurality of wires 810, and the light-emitting element array structure s can be pressed onto the test board to electrically connect the second joint 112b’, the second joint 312b’, the second joint 316b’, the second joint 512b’, the second joint 516b’ and the second joint 712b’ of the light-emitting element array structure s to the plurality of wires 810, so that the test can be quickly performed.

Please refer to FIG. 1M. Then, multiple light-emitting device array structures s are bonded to a driving backplane 900 to complete the display device DP. Please refer to FIG. 14 and FIG. 1M. In some embodiments, the second bonding portion 112b', the second bonding portion 312b', the second bonding portion 316b', the second bonding portion 512b', the second bonding portion 516b' and the second bonding portion 712b' of each light-emitting device array structure s can be bonded to multiple pads (not shown) of the driving backplane 900.

14 and 1M, the display device DP includes a plurality of light emitting element array structures s and a driving backplane 900. The plurality of light emitting element array structures s are bonded to the driving backplane 900. The first strip substrate 114', the first light emitting element row C120, the first optical adhesive structure 200', the second strip substrate 314', the second light emitting element row C320, the second optical adhesive structure 400', the third strip substrate 514', the third light emitting element row C520, the third optical adhesive structure 600' and the packaging strip substrate 714' of the light emitting element array structure s are arranged in the first direction d1. The plurality of first light emitting elements 120 of the light emitting element array structure s are arranged in the second direction d2. The plurality of second light emitting elements 320 of the light emitting element array structure s are arranged in the second direction d2. The plurality of third light-emitting elements 520 of the light-emitting element array structure s are arranged in the second direction d2. The first direction d1 and the second direction d2 are interlaced with each other and are substantially parallel to the driving backplane 900.

In some embodiments, the side wall 114c' of the first strip substrate 114', the second joint portion 112b', the side wall 200c' of the first optical adhesive structure 200', the side wall 314c' of the second strip substrate 314', the second joint portion 316b', the second joint portion 312b', the side wall 400c' of the second optical adhesive structure 400', the side wall 514c' of the third strip substrate 514', the second joint portion 516b', the second joint portion 512b', the side wall 600c' of the third optical adhesive structure 600', the side wall 714c' and the second joint portion 712b' of the package strip substrate 714' face the driving backplane 900.

Referring to FIG. 14, FIG. 16 and FIG. 1M, in some embodiments, the first type semiconductor layer 121, the active layer 123 and the second type semiconductor layer 122 of the first light-emitting element 120 are arranged substantially parallel to the first direction d1 of the driving backplane 900. In some embodiments, the first type semiconductor layer 121, the active layer 123 and the second type semiconductor layer 122 of the second light-emitting element 320 are arranged substantially parallel to the first direction d1 of the driving backplane 900. In some embodiments, the first type semiconductor layer 521, the active layer 523 and the second type semiconductor layer 522 of the third light-emitting element 520 are arranged substantially parallel to the first direction d1 of the driving backplane 900.

It is worth mentioning that, as shown in FIG1A, in some embodiments, multiple light-emitting elements (e.g., first light-emitting element 120) on a growth substrate (e.g., first growth substrate 10) are simultaneously transferred to a circuit substrate (e.g., first circuit substrate 110), so that the alignment accuracy can be more easily improved. In addition, as shown in FIG1J to FIG1L, the light-emitting element stacking structure S is cut into multiple plate-shaped light-emitting element array structures s, and then the plate-shaped light-emitting element array structure s is pressed on the test circuit 800 for testing, so that its photoelectric characteristics can be confirmed. By eliminating the abnormal light-emitting element array structure s and transferring the normal light-emitting element array structure s to the driving backplane 900, the display device DP can be manufactured. In this way, the yield of the display device DP can be improved.

It must be noted here that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the previous embodiments, and the following embodiments will not be repeated.

Figures 17A to 17K are three-dimensional schematic diagrams of the manufacturing process of the light-emitting element array structure of another embodiment of the present invention.

The manufacturing process of the light emitting device array structure sA of FIG. 17A to FIG. 17K is similar to the manufacturing process of the light emitting device array structure s of FIG. 1A to FIG. 1K. The differences between the two are as follows. In the embodiment of FIG. 17A to FIG. 17K, as shown in FIG. 17C, the first optical adhesive layer 200A has a plurality of strip openings 200u, and a plurality of first bank structures 910 are respectively disposed in the plurality of strip openings 200u, wherein each first bank structure 910 is located between two adjacent first light emitting device rows R120; as shown in FIG. 17F, the second optical adhesive layer 400A has a plurality of strip openings 400u, and a plurality of strip openings 400u are disposed in the plurality of strip openings 200u. A plurality of second bank structures 920 are respectively provided in the openings 400u, wherein each second bank structure 920 is located between two adjacent second light-emitting element rows R320; as shown in FIG17I, the third optical adhesive layer 600A has a plurality of strip openings 600u, and a plurality of third bank structures 930 are respectively provided in the plurality of strip openings 600u, wherein each third bank structure 930 is located between two adjacent third light-emitting element rows R520. The remaining manufacturing process of the light-emitting element array structure sA is similar to the manufacturing process of the light-emitting element array structure s, and will not be repeated here. The plurality of light-emitting element array structures sA manufactured by the method shown in FIG17A to FIG17K can also be joined with the driving backplane 900 (refer to FIG1M) to form another display device.

FIG18A is a three-dimensional schematic diagram of a manufacturing process of a portion of a light-emitting element array structure of another embodiment of the present invention. FIG18B is a three-dimensional schematic diagram of a light-emitting element array structure of another embodiment of the present invention. FIG18A shows a manufacturing process of a portion of the light-emitting element array structure sB of FIG18B.

18A and 18B , the light emitting device array structure sB and its manufacturing process are similar to the aforementioned light emitting device array structure s and its manufacturing process. The main difference between the two is that the types of the first light emitting device 120B, the second light emitting device 320B and the third light emitting device 520B are different. In the embodiment of FIG. 18A and FIG. 18B , the first electrode 124 and the second electrode 125 of the first light emitting element 120B may be located on the same side of the active layer (not shown) of the first light emitting element 120B, the first electrode 324 and the second electrode 325 of the second light emitting element 320B may be located on the same side of the active layer (not shown) of the second light emitting element 320B, and the first electrode 524 and the second electrode 525 of the third light emitting element 520B may be located on the same side of the active layer (not shown) of the third light emitting element 520B. That is, the first light emitting element 120B, the second light emitting element 320B and the third light emitting element 520B may be flip chip light emitting elements. The light-emitting element array structure sB shown in FIG18B can also be bonded to a driving backplane 900 (see FIG1M ) to form another display device.

FIG. 19A is a three-dimensional schematic diagram of a partial manufacturing process of a light-emitting element array structure of another embodiment of the present invention. FIG. 19B is a three-dimensional schematic diagram of a light-emitting element array structure of another embodiment of the present invention. FIG. 19A shows a partial manufacturing process of the light-emitting element array structure sC of FIG. 19B.

The light-emitting element array structure sC of FIG. 19A and FIG. 19B and its manufacturing process are similar to the light-emitting element array structure sB of FIG. 18A and FIG. 18B and its manufacturing process. The main difference between the two is that: in the embodiment of FIG. 19A to FIG. 19B, the plurality of second electrodes 125 of two adjacent first light-emitting elements 120B can be bonded to the same first conductive pattern 112C', the plurality of second electrodes (not shown) of two adjacent second light-emitting elements 320B can be bonded to the same second conductive pattern 312C', and the plurality of second electrodes (not shown) of two adjacent third light-emitting elements 520B can be bonded to the same third conductive pattern 512C'. The light-emitting element array structure sC shown in FIG. 19B can also be bonded to a driving backplane 900 (refer to FIG. 1M) to form another display device.

FIG. 20A is a three-dimensional schematic diagram of a light-emitting element stacking structure of an embodiment of the present invention. FIG. 20B is a three-dimensional schematic diagram of a light-emitting element array structure of an embodiment of the present invention. The light-emitting element array structure sD shown in FIG. 20B is cut out from the light-emitting element stacking structure SD of FIG. 20A.

The light-emitting element stacking structure SD of FIG. 20A and the light-emitting element array structure sD of FIG. 20B are similar to the light-emitting element stacking structure S of FIG. 1J and the light-emitting element array structure s of FIG. 14 , respectively. The difference between the light-emitting element stacking structure SD of FIG. 20A and the light-emitting element stacking structure S of FIG. 1J is as follows.

The light-emitting element stacking structure SD of FIG. 20A replaces the third optical adhesive layer 600 of the light-emitting element stacking structure S of FIG. 1J with a color conversion layer 600D. For example, in the embodiment of FIG. 20A , the color conversion layer 600D can convert the third color light (e.g., blue light) emitted by the third light-emitting element 520B into the target color light (e.g., red light).

The light-emitting element array structure sD of FIG. 20B is a third optical adhesive structure 600' that replaces the light-emitting element array structure s of FIG. 14 with a color conversion structure 600D'. The color conversion structure 600D' of FIG. 20B is cut out from the color conversion layer 600D of FIG. 20A. Similarly, in the embodiment of FIG. 20B, the color conversion structure 600D' can convert the third color light (e.g., blue light) emitted by the third light-emitting element 520B into the target color light (e.g., red light).

900: Drive backplane

DP: Display Device

d1: first direction

d2: second direction

d3:Third direction

s: Light-emitting element array structure

Claims (6)

A display device includes: a plurality of light-emitting element array structures, wherein each light-emitting element array structure includes: a first strip substrate; a plurality of first conductive patterns disposed on the first strip substrate and spaced apart from each other; a plurality of first light-emitting elements disposed on the first strip substrate and bonded to the first conductive patterns; a second strip substrate; The invention relates to a driving backplane, wherein the first strip substrate and the second strip substrate of the light-emitting element array structure are arranged on the first light-emitting elements; a plurality of second conductive patterns are arranged on the second strip substrate and are separated from each other; and a plurality of second light-emitting elements are arranged on the second strip substrate and are bonded to the second conductive patterns; and a driving backplane, wherein the light-emitting element array structure is bonded to the driving backplane; the first strip substrate and the second strip substrate of the light-emitting element array structure are arranged in a first direction, and the first light-emitting elements of the light-emitting element array structure are arranged in a second direction, and the first direction and the second direction are staggered with each other and are substantially parallel to the driving backplane. A display device as described in claim 1, wherein the first light-emitting elements of the light-emitting element array structure are arranged into a first light-emitting element row in the second direction, the second light-emitting elements of the light-emitting element array structure are arranged into a second light-emitting element row in the second direction, and the first light-emitting element row and the second light-emitting element row are arranged in the first direction. In the display device as described in claim 1, a first type semiconductor layer, an active layer and a second type semiconductor layer of the first light-emitting element are arranged in a first direction substantially parallel to the driving backplane. A display device as described in claim 1, wherein the first strip substrate has a first surface and a side wall adjacent to the first surface of the first strip substrate, the side wall of the first strip substrate has a plurality of first holes separated from each other, the first conductive patterns are arranged on the first surface of the first strip substrate and are respectively filled in the first holes of the side wall of the first strip substrate, the first light-emitting elements are arranged on the first surface of the first strip substrate, and the side wall of the first strip substrate faces the driving backplane. A display device as described in claim 4, wherein each of the first conductive patterns includes a first joint portion disposed on the first surface of the first strip substrate and a second joint portion of the first hole disposed on the side wall of the first strip substrate, a first light-emitting element is joined to the first joint portion of the first conductive pattern, and the second joint portion of the first conductive pattern is joined to the driving backplane. A display device as described in claim 1, wherein each of the light-emitting element array structures further includes: a first optical adhesive structure, disposed on the first strip-shaped substrate and covering the first light-emitting elements; a second optical adhesive structure, disposed on the second strip-shaped substrate and covering the second light-emitting elements; the first strip-shaped substrate, the first optical adhesive structure, the second strip-shaped substrate and the second optical adhesive structure are arranged substantially parallel to the first direction of the driving backplane.