TWI889269B - Line laser measurement system and method for determining cutting yield and precision - Google Patents

Abstract

A line laser module is provided for measuring whether a plane of an object is flush. The line laser module includes a laser emitter, a sensor module and an analysis and calculation module. The laser emitter is mounted above a side of the plane for emitting a laser line at a direction perpendicular to the side. The sensor module is used to simultaneously sense plural reflections of the laser line of the laser emitter relative to depths of the plane. The analysis and calculation module is used to analyze and calculate the plural reflections for determining whether the plane is a flush plane or not.

Description

Line laser measurement system and method for judging cutting yield and accuracy

The present invention is a line laser measurement system and a method for judging cutting yield and precision, and in particular, a line laser measurement system and a method for judging cutting yield and precision that use a first and a second line laser sensor to simultaneously scan an object to be measured to obtain data.

The main function of a general IC carrier is to carry IC as a carrier, mainly to protect circuits, fix lines and dissipate excess heat. It is a key component in the packaging process. Therefore, it is also very important whether the difference of the cut surface of the four sides (also known as cross-sectional difference/discontinuity) is quite flat without too much fluctuation. The known technology for measuring the bevel angle of the cut surface of the carrier is to use a single charge coupled device (CCD) optical lens to move on the cut surface of the four sides of the carrier/object to be measured for measurement. Since CCD simply converts the image into a digital signal, for a carrier with a thickness of only 0.10mm to 0.36mm, the analog cut surface obtained by CCD is quite rough, and the error of the obtained bevel angle measurement result is quite large. Therefore, it is necessary to obtain a more accurate and faster simulated cutting surface to reduce the error of bevel measurement and shorten the time.

Therefore, it is worth pondering how to solve the problem that the simulated cutting surface of the substrate obtained by CCD is quite rough. This invention application is based on the deficiencies in the prior art. After careful testing and research, and with a spirit of perseverance, the present invention is finally conceived. The following is a brief description of the present invention.

The line laser measurement system of the present invention is used to measure a polygonal object to be tested. The simulated cutting surface of the polygonal object to be tested is calculated by using data obtained simultaneously by the first and second line laser sensors on two opposite sides, thereby accelerating the collection of thickness discontinuity and bevel information of the polygonal object to be tested.

The invention is a line laser measurement system for measuring a first object to be measured, wherein the first object to be measured has a thickness direction and includes first, second, third and fourth cutting surfaces, and the first and second cutting surfaces are located on two opposite sides of the first object to be measured. The line laser measurement system includes first and second line laser sensors and an analysis and calculation module. The first position of the first line laser sensor is a first reference position, the first position is located above the first cutting surface of the first object to be tested, the second line laser sensor is located above the second cutting surface of the first object to be tested, and the first and second line laser sensors are configured to scan simultaneously above the first and second cutting surfaces respectively to obtain first data and second data parallel to the thickness direction; and the analysis and calculation module is coupled to the first and second line laser sensors, wherein the analysis and calculation module is configured to simulate the first and second cutting surfaces of the first object to be tested according to the first and second data to obtain first and second simulated cutting surfaces.

From a main technical point of view, the present invention is a line laser measurement module for measuring an object to be measured, wherein the object to be measured includes a cut surface, and the line laser measurement module includes a line laser sensor. The line laser sensor is disposed above the cut surface, wherein the line laser sensor is configured to emit a line laser to the cut surface; obtain data of the cut surface; and provide the data to an analysis and calculation module, so that the analysis and calculation module simulates the cut surface of the object to be measured according to the data to obtain a simulated cut surface.

From another practicable perspective, the present invention may include a line laser module for measuring whether the plane of the object to be measured is flat, including a laser emitter, a sensor module, and an analysis and calculation module. The laser emitter is disposed on one side of the plane to emit laser light in a direction perpendicular to the side; the sensor module is used to simultaneously sense the multiple reflections of the laser light of the laser emitter at a depth related to the plane; and the analysis and calculation module is used to analyze and calculate the multiple reflections to determine whether the plane is a flat plane.

The present invention can also be a method for determining the yield and cutting accuracy of an object to be tested, using a line laser measurement system, wherein the line laser measurement system includes a first and a second line laser sensor, an analysis and calculation module, and a comparison module, and the method includes cutting the object to be cut by a cutting machine to obtain a plurality of objects to be tested; moving the first and the second line laser sensors to above a specific object to be tested; allowing the first and the second line laser sensors to simultaneously obtain the first and second data of the specific object to be tested respectively; simulating the first and second simulated cutting surfaces of the specific object to be tested according to the first and the second data by the analysis and calculation module; and comparing the first and the second simulated cutting surfaces with the specifications of the specific object to be tested by the comparison module to determine whether the specific object to be tested is a defective product.

The present invention can be used for products that require the measurement of the thickness of the cutting surface and the bevel of the cutting surface. The measured data can be further analyzed, and according to the changes in the data, it can be judged what should be paid attention to in the previous process, such as: the degree of wear of the blade used to cut the product or the precision setting during cutting, etc. (That is, when the blade is first used, it is not worn out yet, so a lower precision can be set naturally. As the blade is used for a longer time, its degree of wear increases, and the precision setting must be relatively improved.) The present invention obtains data on two opposite sides at the same time, thereby speeding up the collection efficiency. According to the different positions of multiple objects to be tested in the tray, the present invention can simultaneously scan a whole row of objects to be tested without changing the distance between the two sensors.

Please refer to the first to fifth figures, which show a line laser measurement system 20 for measuring the first object to be measured 11 in the tray 10 as shown in the first figure, wherein the first object to be measured 11 has a thickness direction (Z-axis direction) as shown in the third figure and includes a first cutting surface 31, a second cutting surface 32, a third cutting surface 33 and a fourth cutting surface 34, and the first and second cutting surfaces 31 and 32 are located on opposite sides of the first object to be measured 11. The line laser measurement system 20 includes a first line laser sensor 41 and a second line laser sensor 42 as shown in the fourth figure and an analysis and calculation module 21. The first position of the first line laser sensor 41 is a first reference position, and the first position is located above the first cutting surface 31 of the first object to be tested 11. The second line laser sensor 42 is located above the second cutting surface 32 of the first object to be tested 11, and the first and second line laser sensors 41, 42 are configured to simultaneously scan above the first and second cutting surfaces 31, 32, respectively, to obtain first data and second data parallel to the thickness direction. The analysis and calculation module 21 is coupled to the first and second line laser sensors 41, 42, wherein the analysis and calculation module 21 is configured to simulate the first and second cutting surfaces 31, 32 of the first object to be tested 11 according to the first and second data to obtain the first simulated cutting surface 61 and the second simulated cutting surface 62 as shown in the fifth figure. Furthermore, the moving direction MD of the first and second line laser sensors 41 , 42 is along the first side 351 and the second side 352 of the object 11 to be measured (ie, the direction of the Y axis) to obtain complete data of the first and second cutting surfaces 31 , 32 .

In the above-mentioned embodiment, the third and fourth cutting surfaces 33, 34 of the line laser measurement system 20 are located at two opposite sides of the first object to be measured 11, the second position of the first line laser sensor 41 is the second reference position, and the second position is located above the third cutting surface 33 of the first object to be measured 11, the second line laser sensor 42 is located above the fourth cutting surface 34 of the first object to be measured 11, and the first and second line laser sensors 41, 42 are configured to respectively measure the third and fourth cutting surfaces 33, 34. 4 to obtain the third and fourth data, the first and second line laser sensors 41, 42 will move along the direction of the third side 353 and the fourth side 354 of the object to be tested 11 (i.e., the direction of the X axis) to obtain the complete data of the third and fourth cutting surfaces 33, 34, and the analysis and calculation module 21 is used to simulate the third and fourth cutting surfaces 33, 34 of the first object to be tested 11 according to the third and fourth data to obtain the third simulated cutting surface 63 and the fourth simulated cutting surface 64.

In the aforementioned embodiments, the line laser measurement system 20 further includes a comparison module 22 coupled to the analysis and calculation module 21, wherein the comparison module 22 is configured to compare the first and second simulated cutting surfaces 61, 62 or the third and fourth simulated cutting surfaces 63, 64 with the specifications of the first object to be tested 11 to determine whether the first object to be tested 11 is a defective product.

In the aforementioned embodiments, each line laser sensor 41, 42 in the line laser measurement system 20 emits a line laser 30 on each cutting surface 31~34, respectively. For a general ultra-high precision in-line profile sensor, the number of profile data in each line laser can be as high as 3200. Each of the first to fourth data includes a plurality of heights of a plurality of points on each cutting surface 31~34, and the analysis and calculation module 21 is used to determine the bevel line 81 of each cutting surface 31~34 as shown in Figure 7 based on the plurality of heights, and the plurality of points have a spacing of 2.5μm. The first object to be tested 11 is a polygonal object to be tested, such as a carrier or PCB. Although a quadrilateral is used as an example in the first figure, in actual application, it can correspond to a specific polygonal object to be tested. The carrier is for the purpose of making measurements on the control of the necessary process before the IC is installed in the future, and the IC is usually connected to the carrier in a flip-chip manner. The first and second line laser sensors 41, 42 have respective sensor modules 71, 72 as shown in the sixth figure, and the sensor modules 71, 72 are used to sense the multiple heights of the multiple points.

In the aforementioned embodiments, the first object to be measured 11 of the line laser measurement system 20 further includes a top surface 82 and a bottom surface 83, and the bevel line 81 is a connecting line between the top surface 82 and the bottom surface 83, and the bevel line 81 forms an oblique angle θ with the thickness direction. The comparison module 22 is used to determine whether the bevel angle θ meets the specification, and the ideal cutting surface 90 shown in Figure 8 is a 90° vertical surface.

In the aforementioned embodiments, the first and second line laser sensors 41, 42 of the line laser measurement system 20 are mounted on the bracket 73 in a non-coaxial positioning manner, and the first object to be measured 11 is scanned without changing the distance between the first and second line laser sensors 41, 42, and the second object to be measured 12 is scanned.

From a main technical point of view, the present invention is a line laser measurement module (e.g., a module including a first line laser sensor 41 and a sensor module 71) for measuring an object to be tested (e.g., a first object to be tested 11), wherein the object to be tested includes a cutting surface (e.g., a first cutting surface 31), and the line laser measurement module includes a line laser sensor (e.g., a first line laser sensor 41). The line laser sensor is disposed above the cutting surface, wherein the line laser sensor is configured to emit a line laser 30 to the cutting surface; obtain data of the cutting surface (e.g., the first data); and provide the data to the analysis and calculation module 21, so that the analysis and calculation module 21 simulates the cutting surface of the object to be tested 11 according to the data to obtain a simulated cutting surface (e.g., a first simulated cutting surface 61).

From another practicable perspective, the present invention may include a line laser module for measuring whether the plane (e.g., the first cutting surface 31) of the object to be measured 11 is flat, including a laser emitter (e.g., the first line laser sensor 41), a sensor module 71, and an analysis and calculation module 21. The laser emitter is disposed on one side (e.g., the first side 351) of the plane to emit a laser line (e.g., the line laser 30) in a direction perpendicular to the side; the sensor module 71 is used to simultaneously sense the multiple reflections of the laser line of the laser emitter at a depth related to the plane; and the analysis and calculation module 21 is used to analyze and calculate the multiple reflections to determine whether the plane is a flat plane.

The present invention can also be a method for determining the yield and cutting accuracy of a test object (e.g., a first test object 11), using a line laser measurement system 20, wherein the line laser measurement system 20 includes a first and a second line laser sensor 41, 42, an analysis and calculation module 21, and a comparison module 22, and the method includes cutting the test object (e.g., a printed circuit board) by a cutting machine (not shown in the figure) to obtain a plurality of test objects; moving the first and the second line laser sensors 41, 42 to a specific The method comprises the steps of: placing a first laser beam on the top of a specific object to be tested (for example, a first object to be tested 11); causing the first and second line laser sensors 41 and 42 to respectively obtain the first and second data of the specific object to be tested at the same time; simulating the first and second simulated cutting surfaces 61 and 62 of the specific object to be tested according to the first and second data by the analysis and calculation module 21; and comparing the first and second simulated cutting surfaces 61 and 62 with the specifications of the specific object to be tested by the comparison module 22 to determine whether the specific object to be tested is a defective product.

In the aforementioned embodiment, the method further includes that after the first and second line laser sensors 41 and 42 obtain the first and second data, the analysis and calculation module 21 simulates the first and second simulated cutting surfaces 61 and 62 of the object to be tested, and obtains the simulated cutting line 101 of the cutting machine cutting the object to be cut as shown in Figure 9; and the comparison module 22 judges the cutting accuracy of the cutting machine based on the simulated cutting line 101.

In summary, the present invention discloses a novel line laser measurement system, which can simulate the first and second cutting surfaces of the first object to be measured according to the first and second data through scanning by the first and second line laser sensors, and obtain the first and second simulated cutting surfaces. Therefore, the system has industrial value and achieves the intended purpose of developing the present invention.

Although the present invention is disclosed as above with the preferred embodiments, it is not intended to limit the scope of the present invention. Any changes and modifications made by a person skilled in the art without departing from the spirit and scope of the present invention should fall within the scope of the present invention.

10: tray                   11: first object to be measured 12: second object to be measured                 20: line laser measurement system 21: analysis and calculation module       22: comparison module 30: line laser                31: first cutting surface 32: second cutting surface               33: third cutting surface 34: fourth cutting surface               351: first side 352: second side                 353: third side 354: fourth side                 41: first line laser sensor 42: second line laser sensor    61: first simulated cutting surface 62: second simulated cutting surface       MD: moving direction 63: third simulated cutting surface       64: fourth simulated cutting surface 71, 72: Sensor module      73: Bracket 81: Bevel line                82: Top surface 83: Bottom surface                  θ: Angle 90: Ideal cutting surface                 101: Simulated cutting line

Figure 1: is a three-dimensional schematic diagram of the tray used in the preferred embodiment of the present invention and the object to be tested therein; Figure 2: is a schematic diagram of the structure of the line laser measurement system of the preferred embodiment of the present invention; Figure 3: is a three-dimensional schematic diagram of the line laser sensor of the line laser measurement system in Figure 2 shooting a line laser; Figure 4: is a three-dimensional schematic diagram of the first and second line laser sensors in Figure 2 installed on the bracket; Figure 5: is a three-dimensional schematic diagram of the first and second simulated cutting surfaces of the object to be tested in Figure 1; Figure 6: is a three-dimensional schematic diagram of the first and second line laser sensors in Figure 4 viewed from above; Figure 7: is a schematic diagram of the oblique line between the top and bottom surfaces of the object to be tested in Figure 1; Figure 8: is a schematic diagram of the ideal cutting surface between the top and bottom surfaces of the object to be tested in Figure 1; and Figure 9: is a schematic diagram of using the system in Figure 2 to obtain a simulated cutting line of the object to be cut by the cutting machine.

11: The first object to be tested

30: Line laser

31: First cutting surface

32: Second cutting surface

33: The third cutting surface

34: Fourth cutting surface

351: First side

352: Second side

353: The third side

354: The fourth side

41: First-line laser sensor

MD: moving direction

Claims (10)

A line laser measurement system is used to measure a first object to be measured, wherein the first object to be measured has a thickness direction and includes a first, a second, a third and a fourth cutting surface, and the first and the second cutting surfaces are located on two opposite sides of the first object to be measured. The line laser measurement system includes: a first and a second line laser sensor, wherein a first position of the first line laser sensor is a first reference position, and the first position is located above the first cutting surface of the first object to be measured, and the second line laser sensor is located above the second cutting surface of the first object to be measured, and the first and the second line laser sensors are configured to respectively obtain a first data and a second data parallel to the thickness direction by scanning with a first and a second line laser simultaneously above the first and the second cutting surfaces, and the first and the second line lasers are perpendicular to the first and the second cutting surfaces; and An analysis and calculation module is coupled to the first and second line laser sensors, wherein the analysis and calculation module is configured to simulate the first and second cutting surfaces of the first object to be tested according to the first and second data to obtain a first and a second simulated cutting surface. A line laser measurement system as described in claim 1, wherein the third and the fourth cutting surfaces are located on opposite sides of the first object to be measured, a second position of the first line laser sensor is a second reference position, the second position is located above the third cutting surface of the first object to be measured, the second line laser sensor is located above the fourth cutting surface of the first object to be measured, and the first and the second line laser sensors are configured to scan above the third and the fourth cutting surfaces respectively to obtain a third and a fourth data, and the analysis and calculation module is used to simulate the third and the fourth cutting surfaces of the first object to be measured according to the third and the fourth data to obtain a third and a fourth simulated cutting surface. The line laser measurement system as described in claim 2 further includes a comparison module coupled to the analysis and calculation module, wherein the comparison module is configured to compare the first and second simulated cutting surfaces or the third and fourth simulated cutting surfaces with a specification of the first object to be tested so as to determine whether the first object to be tested is a defective product. A line laser measurement system as described in claim 3, wherein each of the first to fourth data includes a plurality of heights of a plurality of points on each of the cutting surfaces, and the analysis and calculation module is used to determine a bevel line of each of the cutting surfaces based on the plurality of heights, the plurality of points have a spacing of 2.5 μm, the first object to be tested is a polygonal object to be tested, the polygonal object to be tested is a carrier board, a PCB or a specific polygonal object to be tested, the first and second line laser sensors each have a sensor module, and the sensor module is used to sense the plurality of heights of the plurality of points. A line laser measurement system as described in claim 4, wherein the first object to be measured further includes a top surface and a bottom surface, the bevel line is a connecting line between the top surface and the bottom surface, and the bevel line forms an angle with the thickness direction, and the comparison module is used to determine whether the bevel angle meets the specification. A line laser measurement system as described in claim 1, wherein the first and second line laser sensors are mounted on a bracket in a non-coaxial positioning manner, and the scanning of the first object to be measured and the second object to be measured is completed without changing the distance between the first and second line laser sensors. A line laser measurement module for measuring an object to be measured, wherein the object to be measured includes a cutting surface, and the line laser measurement module includes: A line laser sensor, arranged above the cutting surface, wherein the line laser sensor is configured to: emit a line laser scan to the cutting surface, and the line laser is perpendicular to the cutting surface; obtain a data of the cutting surface; and provide the data to an analysis and calculation module, so that the analysis and calculation module simulates the cutting surface of the object to be measured according to the data to obtain a simulated cutting surface. A line laser module is used to measure whether a plane of a test object is flat, comprising: A laser emitter, arranged on one side of the plane, for emitting a line laser scan in a direction perpendicular to the side, and the line laser is perpendicular to the cutting surface; A sensor module, for simultaneously sensing the multiple reflections of the line laser of the laser emitter at a depth related to the plane; and An analysis and calculation module, for analyzing and calculating the multiple reflections to determine whether the plane is a flat plane. A method for determining a yield rate and a cutting accuracy setting of an object to be tested uses a line laser measurement system, wherein the line laser measurement system includes a first and a second line laser sensor, an analysis and calculation module, and a comparison module, and the method includes: Cutting an object to be cut by a cutting machine to obtain a plurality of objects to be tested; Moving the first and the second line laser sensors to the top of a specific object to be tested, the specific object to be tested includes a first and a second cutting surface; Making the first and the second line laser sensors simultaneously scan the first and the second cutting surfaces of the specific object to be tested with a first and a second line laser respectively, and the first and the second line lasers are perpendicular to the first and the second cutting surfaces; Using the analysis and calculation module to simulate a first and a second simulated cutting surface of the specific object to be tested according to the first and the second data; and The comparison module compares the first and second simulated cutting surfaces with a specification of the specific object to be tested to determine whether the specific object to be tested is a substandard product. The method as described in claim 9 further comprises: After the first and second line laser sensors obtain the first and second data, the analysis and calculation module simulates the first and second simulated cutting surfaces of the object to be tested, and obtains a simulated cutting line of the object to be cut by the cutting machine; and The comparison module determines the cutting accuracy of the cutting machine based on the simulated cutting line.

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