TWI888221B - Workpiece processing device, grindstone, and workpiece processing method - Google Patents
Workpiece processing device, grindstone, and workpiece processing method Download PDFInfo
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- TWI888221B TWI888221B TW113126559A TW113126559A TWI888221B TW I888221 B TWI888221 B TW I888221B TW 113126559 A TW113126559 A TW 113126559A TW 113126559 A TW113126559 A TW 113126559A TW I888221 B TWI888221 B TW I888221B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
- B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
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- H10P52/00—
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
本發明係關於一種工件加工裝置、磨石及工件加工方法。 The present invention relates to a workpiece processing device, a grinding stone and a workpiece processing method.
過去,為了施行半導體晶圓等圓板狀之工件(被加工物)的外周部之倒角加工,而將磨石抵靠於工件的外周部,施行研磨。為了提高工件的倒角部之形狀及尺寸的精度,具有下述方法:在磨石的外周部,形成和工件的完成形狀相對應之形狀及尺寸的溝(成型溝),將工件的外周部插入至該溝內,使工件旋轉,藉由溝的內周面將工件的外周部研磨。然而,在此方法中,每當欲製造之工件的形狀或尺寸改變時,必須更換磨石,不適合多種類的少量生產。此外,若重複倒角加工,則磨石的外周部之溝的內周面磨耗或破損,溝的形狀及尺寸改變,故工件的倒角加工之精度降低。因此,若長時間地施行工件的倒角加工,則產生必須將磨石更換或重新修整之必要。 In the past, in order to perform chamfering on the outer periphery of a disc-shaped workpiece (processed object) such as a semiconductor wafer, a grinding stone was pressed against the outer periphery of the workpiece and ground. In order to improve the accuracy of the shape and size of the chamfered portion of the workpiece, there is the following method: a groove (molding groove) having a shape and size corresponding to the finished shape of the workpiece is formed on the outer periphery of the grinding stone, the outer periphery of the workpiece is inserted into the groove, the workpiece is rotated, and the outer periphery of the workpiece is ground by the inner peripheral surface of the groove. However, in this method, the grinding stone must be replaced every time the shape or size of the workpiece to be manufactured changes, which is not suitable for small-scale production of various types. In addition, if the chamfering process is repeated, the inner peripheral surface of the groove on the outer periphery of the grinding stone is worn or damaged, and the shape and size of the groove change, so that the accuracy of the chamfering process of the workpiece is reduced. Therefore, if the chamfering of the workpiece is performed for a long time, it is necessary to replace the grinding stone or recondition it.
為了因應必要施行磨石的更換或修整,在專利文獻1、2記載之方法中,先製作具有和工件的完成形狀相對應之成型溝的主磨石,使磨石材料的外周部抵接於主磨石之溝的內周面,予以研磨,藉此製作作為成型材的整形磨石(整形子)。進一步,藉由使整形磨石的外周部抵接於磨石材料,形成與主磨石相同之成型溝,而可調整(修整)為實際之工件的倒角加工所使用之磨石的形狀。整形磨石,由較倒角用磨石(例如樹脂結合磨石)更硬的材料(例如綠色碳化矽(Green Silicon Carbide,GC)磨石)形成;主磨石,由較整形磨石更硬的材料(例如金屬結合磨石)形成。將如此地使用整形磨石將磨石修整的程序,稱作整形(truing)。
In order to replace or trim the grinding stone as needed, the methods described in
於專利文獻1、2,除了教示了使用對於圓板狀之工件平行地配置的圓板狀之磨石的成型溝施行倒角加工之方法以外,亦教示了使用對於圓板狀之工件的外周之切線方向傾斜地配置的圓板狀之磨石的溝施行工件的倒角之方法(螺旋式加工方法)。關於螺旋式倒角加工方法,專利文獻3亦有記載。在專利文獻3所記載之方法中,對於工件的外周之切線方向傾斜地配置的磨石,在外周部形成有凹形的溝,具有朝向內側之傾斜面。使該傾斜面抵接於工件的外周部,施行研磨。於專利文獻4,揭露了「藉由對於圓板狀之工件平行地配置的圓板狀之磨石施行研磨,其後,藉由對於圓板狀之工件的外周之切線方向傾斜地配置的圓板狀之磨石,以螺旋式施行更精密的研磨」之加工方法、以及用於將螺旋式之精密研磨用的磨石進行整形之整形磨石及整形方法。
In addition to teaching a method of chamfering a disc-shaped workpiece using a groove formed on a disc-shaped grindstone arranged parallel to the disc-shaped workpiece,
若如同專利文獻1~4所記載,使用對於工件的外周之切線方向傾斜地配置的磨石施行工件之倒角加工,則在設置於磨石的外周部之溝的內周面與工件的外周部之接觸部分的長度長之狀態下施行研磨,進一步,使工件以低速旋轉並研磨,藉此可使工件的倒角部之表面粗糙度減小。因此,之後施行的精加工之拋光製程變得容易實施。 If the chamfering of the workpiece is performed using a grindstone arranged obliquely in the tangential direction of the outer periphery of the workpiece as described in patent documents 1 to 4, grinding is performed in a state where the inner peripheral surface of the groove provided on the outer periphery of the grindstone and the contact portion of the outer periphery of the workpiece are long, and further, the workpiece is rotated and ground at a low speed, thereby reducing the surface roughness of the chamfered portion of the workpiece. Therefore, the polishing process of the subsequent finishing process becomes easy to implement.
於專利文獻5,揭露了「使用在外周部設置有厚度方向的尺寸較工件的厚度更大之溝的磨石,使磨石之溝的內周面抵接於工件的外周部,施行倒角加工」之方法。此外,於專利文獻5,亦揭露了「使用較工件更厚、在外周部並未設置溝、且外周部之剖面形狀為凸形的磨石,使磨石之構成外周部的凸形部分之一部分的傾斜面抵接於工件的外周部,施行倒角加工」之方法。 Patent document 5 discloses a method of "using a grindstone with a groove having a thickness dimension greater than the thickness of the workpiece on the outer periphery, and making the inner peripheral surface of the groove of the grindstone abut against the outer periphery of the workpiece to perform chamfering". In addition, patent document 5 discloses a method of "using a grindstone thicker than the workpiece, without a groove on the outer periphery, and with a convex cross-sectional shape of the outer periphery, and making the inclined surface of a part of the convex part of the grindstone abut against the outer periphery of the workpiece to perform chamfering".
在專利文獻6記載之方法中,將圓板狀之磨石配置為對於圓板狀之工件正交。工件,可將位於其平面形狀的中心之旋轉軸作為中心而旋轉。磨石,可將與工件的旋轉軸正交之旋轉軸作為中心而旋轉,且亦可沿與該旋轉軸垂直的方向(與圓板狀之工件平行的方向)、或沿與旋轉軸平行的方向(與圓板狀之工件正交的方向)移動。在使工件旋轉的狀態下,使磨石旋轉並接近工件,使旋轉之磨石的外周部,抵接於沿與磨石的旋轉方向正交的方向旋轉之工件的外周部並使磨石移動,藉以施行工件的倒角加工。此等加工製程稱作圓磨(contouring)。 In the method described in Patent Document 6, a disk-shaped grinding stone is arranged to be orthogonal to a disk-shaped workpiece. The workpiece can rotate about a rotation axis located at the center of its plane shape. The grinding stone can rotate about a rotation axis orthogonal to the rotation axis of the workpiece, and can also move in a direction perpendicular to the rotation axis (a direction parallel to the disk-shaped workpiece) or in a direction parallel to the rotation axis (a direction orthogonal to the disk-shaped workpiece). While the workpiece is rotating, the grinding stone is rotated and approaches the workpiece, and the outer peripheral portion of the rotating grinding stone is brought into contact with the outer peripheral portion of the workpiece rotating in a direction orthogonal to the rotation direction of the grinding stone, and the grinding stone is moved, thereby performing chamfering processing on the workpiece. Such processing processes are called contouring.
在專利文獻7記載之方法中,使用配置為對於圓板狀之工件正交的杯型磨石,與專利文獻6同樣地,在使工件旋轉的狀態下,使杯型磨石旋轉並接近工件。使 旋轉之杯型磨石的杯具狀之前端面,抵接於沿與杯型磨石的旋轉方向正交的方向旋轉之工件的外周部並使杯型磨石移動,藉以施行工件的倒角加工。 In the method described in Patent Document 7, a cup-shaped grindstone arranged to be perpendicular to a disk-shaped workpiece is used. As in Patent Document 6, the cup-shaped grindstone is rotated and brought close to the workpiece while the workpiece is rotating. The cup-shaped front end surface of the rotating cup-shaped grindstone is brought into contact with the outer periphery of the workpiece rotating in a direction perpendicular to the rotation direction of the cup-shaped grindstone, and the cup-shaped grindstone is moved to perform chamfering of the workpiece.
於專利文獻8,揭露了使用2個圓板狀之磨石與專利文獻6同樣地施行倒角加工的方法、及使用2個杯型磨石與專利文獻7同樣地施行倒角加工的方法。 Patent document 8 discloses a method of using two disc-shaped grinding stones to perform chamfering in the same manner as in Patent document 6, and a method of using two cup-shaped grinding stones to perform chamfering in the same manner as in Patent document 7.
在專利文獻9記載之方法中,使用大型的雙重構造之杯型的第一磨石、以及杯型的第二磨石,施行工件的外周部之加工;該第一磨石具有內周側之磨石要素(杯具狀)、及外周側的較內周側之磨石要素所實行之研磨更精密的研磨所用之磨石要素(杯具狀)。 In the method described in Patent Document 9, a large double-structured cup-shaped first grindstone and a cup-shaped second grindstone are used to process the outer periphery of a workpiece; the first grindstone has a grindstone element (cup shape) on the inner periphery and a grindstone element (cup shape) on the outer periphery for grinding more precisely than the grinding stone element on the inner periphery.
在專利文獻10記載之方法中,在晶圓的周端縮徑加工中,將2個無溝磨石分別維持固持於一定高度並接觸晶圓,將其加工;在圓磨加工中,使該2個無溝磨石分別於晶圓周端部的各面各別地移動,從上下將晶圓周端部之徑向的同一處夾入,將各自的面同時加工。 In the method described in patent document 10, in the peripheral end diameter reduction processing of the wafer, two grooveless grinding stones are respectively maintained at a certain height and contacted with the wafer to process it; in the circular grinding processing, the two grooveless grinding stones are respectively moved on each surface of the peripheral end of the wafer, and the same radial position of the peripheral end of the wafer is clamped from top and bottom to process each surface simultaneously.
在專利文獻11記載之方法中,使用外周部具有凸形研磨部分的圓板狀之磨石,將圓板狀之工件與磨石彼此平行地配置,使磨石與工件旋轉,並遵循依據磨石之圓弧狀部分的曲率半徑算出之移動條件使磨石對於工件相對地移動,俾使凸形研磨部分和工件的接觸部分沿著工件之期望的剖面形狀移動。 In the method described in Patent Document 11, a disk-shaped grinding stone having a convex grinding portion on the outer periphery is used, the disk-shaped workpiece and the grinding stone are arranged parallel to each other, the grinding stone and the workpiece are rotated, and the grinding stone is moved relative to the workpiece according to the movement conditions calculated based on the curvature radius of the circular arc-shaped portion of the grinding stone, so that the contact portion between the convex grinding portion and the workpiece moves along the desired cross-sectional shape of the workpiece.
[習知技術文獻] [Learning Technology Literature]
[專利文獻] [Patent Literature]
專利文獻1:日本特開2005-153085號公報 Patent document 1: Japanese Patent Publication No. 2005-153085
專利文獻2:日本特開2007-165712號公報 Patent document 2: Japanese Patent Publication No. 2007-165712
專利文獻3:日本特開平5-152259號公報 Patent document 3: Japanese Patent Publication No. 5-152259
專利文獻4:日本特開2007-044817號公報 Patent document 4: Japanese Patent Publication No. 2007-044817
專利文獻5:日本特開平11-207585號公報 Patent document 5: Japanese Patent Publication No. 11-207585
專利文獻6:日本特開2000-317789號公報 Patent document 6: Japanese Patent Publication No. 2000-317789
專利文獻7:日本特開2008-034776號公報 Patent document 7: Japanese Patent Publication No. 2008-034776
專利文獻8:日本特開2014-37014號公報 Patent document 8: Japanese Patent Publication No. 2014-37014
專利文獻9:日本特開2017-154240號公報 Patent document 9: Japanese Patent Publication No. 2017-154240
專利文獻10:日本特開2008-177348號公報 Patent document 10: Japanese Patent Publication No. 2008-177348
專利文獻11:日本特許7093875號公報 Patent document 11: Japanese Patent No. 7093875
在如同專利文獻1~4所記載地對於工件的外周之切線方向傾斜地配置的磨石之外周部,不易精度良好地形成用於將工件倒角的溝。為了在工件形成期望的形狀之倒角部,溝的內周面必須以適當之角度及適當之接觸長度接觸工件的外周部。在對於工件的外周之切線方向傾斜配置的磨石中,難以形成具有如此地以適當之角度及適當之接觸長度正確地和工件的外周部接觸之內周面的溝。尤其是,利用使工件旋轉之驅動部、或使用於將工件研磨的磨石旋轉之驅動部, 使整形磨石旋轉而施行整形的情況,難以精度良好地形成可在對於工件的外周之切線方向傾斜的狀態下進行良好的倒角加工之溝,需要可更簡單地整形之方法。此外,若欲製造的之工件的倒角部之形狀或尺寸改變,則製作整形磨石所用之主磨石的溝之形狀亦必須變更,造成作業繁複。 It is difficult to form a groove for chamfering a workpiece with good accuracy on the outer peripheral portion of a grindstone arranged obliquely in the tangential direction of the outer periphery of the workpiece as described in Patent Documents 1 to 4. In order to form a chamfered portion of a desired shape on the workpiece, the inner peripheral surface of the groove must contact the outer peripheral portion of the workpiece at an appropriate angle and an appropriate contact length. In a grindstone arranged obliquely in the tangential direction of the outer periphery of the workpiece, it is difficult to form a groove having an inner peripheral surface that accurately contacts the outer peripheral portion of the workpiece at an appropriate angle and an appropriate contact length. In particular, when the shaping grindstone is rotated by a driving unit for rotating the workpiece or a driving unit for rotating the grindstone for grinding the workpiece, it is difficult to accurately form a groove that can be well chamfered while being inclined in the tangential direction of the outer periphery of the workpiece, and a simpler shaping method is needed. In addition, if the shape or size of the chamfered portion of the workpiece to be manufactured changes, the shape of the groove of the main grindstone used to make the shaping grindstone must also be changed, making the operation complicated.
在使用對於工件的外周之切線方向傾斜地配置的磨石施行工件之加工的情況,由於溝的內周面之形狀或尺寸無法輕易地變更,故難以為了接近期望之加工形狀而施行細微的修正。因此,作為工件,在製作具有定向平面部之晶圓的情況,使用對於工件的外周之切線方向傾斜地配置的磨石之主要用於形成工件的外周之圓弧狀部分的溝,亦無法精度良好地形成定向平面部。因此,必須先將定向平面部形成用的溝,和圓弧狀部分之形成用的溝各別形成,磨石的製造變得繁複,且由於2條溝分別使用,而使加工時間增長。 When processing a workpiece using a grindstone that is tilted in the tangential direction of the workpiece, it is difficult to make fine corrections to approach the desired processing shape because the shape or size of the inner circumference of the groove cannot be easily changed. Therefore, when manufacturing a wafer having an oriented flat portion as a workpiece, the groove mainly used to form the arc-shaped portion of the outer circumference of the workpiece using a grindstone that is tilted in the tangential direction of the workpiece cannot form the oriented flat portion with good accuracy. Therefore, the groove for forming the oriented flat portion and the groove for forming the arc-shaped portion must be formed separately, which complicates the manufacture of the grindstone and increases the processing time because the two grooves are used separately.
在專利文獻5記載之方法中,使工件的外周部,抵接於係磨石之溝的內周面之一部分的傾斜面、或係磨石的外周之凸形部分之一部分的傾斜面,予以研磨。藉由使工件沿著磨石的傾斜面相對地移動,而將工件的外周面研磨,因此,研磨後之工件的外周部之形狀成為和磨石的傾斜面相對應之形狀。磨石之外周的傾斜面之角度無法任意變更,故難以將工件的倒角部行成為任意形狀。此外,於工件之兩面的倒角部、前端的直線部、及直線部與倒角部之間的曲面部中,使工件沿著磨石相對地來回移動(往返移動;traverse)並施行研磨,故加工繁複且加工時間長。 In the method described in Patent Document 5, the outer periphery of the workpiece is ground by contacting the inclined surface of a portion of the inner periphery of the groove of the grindstone or the inclined surface of a portion of the convex portion of the outer periphery of the grindstone. The outer periphery of the workpiece is ground by moving the workpiece relatively along the inclined surface of the grindstone, so that the shape of the outer periphery of the workpiece after grinding becomes a shape corresponding to the inclined surface of the grindstone. The angle of the inclined surface of the outer periphery of the grindstone cannot be changed arbitrarily, so it is difficult to form the chamfered portion of the workpiece into an arbitrary shape. In addition, in the chamfered portions on both sides of the workpiece, the straight portion at the front end, and the curved portion between the straight portion and the chamfered portion, the workpiece is moved back and forth (traverse) relatively along the grindstone and ground, so the processing is complicated and the processing time is long.
在專利文獻6記載之方法中,圓板狀之磨石配置為對於圓板狀之工件正交,因而若使用大型磨石,則有磨石干擾到用於支持或驅動工件之機構(例如吸附台或旋轉機構)的疑慮。因此,為了不妨礙工件之穩定的支持或流暢的驅動,使用小型磨石而非大型磨石。其結果,加工效率惡化、加工時間增長。此外,相較於大型磨石,小型磨石在施行同一工件的倒角加工時,其同一部位和工件的外周部接觸而研磨之時間更長,故磨石的使用壽命短。進一步,工件,以和磨石接觸之部位沿著期望的剖面形狀之軌跡移動,但由於在工件之各自的部位充分受到研磨後才使工件移動,故為了使效率良好,工件必須以高速旋轉。如此地使工件以高速旋轉並施行研磨,且沿與工件的旋轉方向正交之方向旋轉的磨石之條痕,於工件的外表面,以沿著工件之厚度方向延伸的形狀形成,故研磨後的部分之表面粗糙度大。即便於此研磨製程後,欲施行更精密的精加工之拋光製程,仍因沿著與工件的旋轉方向正交之方向的條痕之存在,而使拋光困難。尤其是,工件的成為傾斜面狀之部分,在後續製程之精密拋光製程中不易拋光,具有未受到充分拋光而殘留條痕的可能性。 In the method described in Patent Document 6, the disc-shaped grinding stone is arranged to be orthogonal to the disc-shaped workpiece. Therefore, if a large grinding stone is used, there is a concern that the grinding stone interferes with the mechanism (such as an adsorption table or a rotating mechanism) used to support or drive the workpiece. Therefore, in order not to hinder the stable support or smooth driving of the workpiece, a small grinding stone is used instead of a large grinding stone. As a result, the processing efficiency deteriorates and the processing time increases. In addition, compared with a large grinding stone, when a small grinding stone is used to perform chamfering processing on the same workpiece, the same part of the workpiece is in contact with the outer periphery of the workpiece and the grinding time is longer, so the service life of the grinding stone is short. Furthermore, the workpiece moves along the trajectory of the desired cross-sectional shape at the part in contact with the grindstone, but since the workpiece is moved only after each part of the workpiece is fully polished, the workpiece must be rotated at high speed for good efficiency. In this way, the workpiece is rotated at high speed and polished, and the streaks of the grindstone rotating in a direction perpendicular to the rotation direction of the workpiece are formed on the outer surface of the workpiece in a shape extending along the thickness direction of the workpiece, so the surface roughness of the polished part is large. Even after this grinding process, if a polishing process for more precise finishing is to be performed, polishing is still difficult due to the presence of streaks in a direction perpendicular to the rotation direction of the workpiece. In particular, the inclined part of the workpiece is not easy to polish in the precision polishing process of the subsequent process, and there is a possibility that streaks will remain due to insufficient polishing.
在專利文獻7記載之方法中,杯型磨石的製作繁複,尤其是整形困難。此外,杯型磨石不易以使杯具狀的前端面適當地接觸工件的外周部之方式配置、驅動,用於支持及驅動杯型磨石的機構複雜。 In the method described in Patent Document 7, the manufacture of the cup-shaped grindstone is complicated, and shaping is particularly difficult. In addition, the cup-shaped grindstone is not easy to be arranged and driven in such a way that the front end surface of the cup-shaped grindstone properly contacts the outer periphery of the workpiece, and the mechanism for supporting and driving the cup-shaped grindstone is complicated.
在專利文獻8記載之方法中,除了具有前述專利文獻6、7記載之方法中的問題以外,尚具有「為了將2個磨石同時驅動,裝置變得複雜,且在2個磨石之間容易發生尺寸或形狀的不同,不易穩定地施行高精度的倒角加工」等問題。 In addition to the problems of the methods described in the aforementioned patent documents 6 and 7, the method described in patent document 8 also has the problem that "in order to drive two grinding stones at the same time, the device becomes complicated, and the size or shape difference between the two grinding stones is likely to occur, making it difficult to stably perform high-precision chamfering processing."
在專利文獻9記載之方法中,第一磨石的形狀非常地複雜,第一磨石的製作繁複。此外,由於工件以2根旋轉軸作為中心而各自旋轉,故用於支持及驅動工件的機構亦複雜。如此地,實施專利文獻9記載之方法的加工裝置非常地複雜。 In the method described in Patent Document 9, the shape of the first grinding stone is very complicated, and the manufacturing of the first grinding stone is complicated. In addition, since the workpiece rotates around two rotating shafts, the mechanism for supporting and driving the workpiece is also complicated. As such, the processing device for implementing the method described in Patent Document 9 is very complicated.
在專利文獻10記載之方法中,與專利文獻6記載之方法同樣地,使用配置為對於圓板狀之工件正交的圓板狀之磨石施行研磨。另,在此方法中,為了調整高速旋轉之工件的厚度方向位置,必須具備利用壓電元件之機構,加工裝置變得複雜、昂貴,且由於經常調整工件的厚度方向位置並使工件旋轉,故具有期望的剖面形狀之形成精度變差的傾向。尤其是,難以使工件之期望的剖面形狀之圓弧狀的部分之半徑(R尺寸),在圓板狀之工件的全周中成為一定。 In the method described in patent document 10, similarly to the method described in patent document 6, grinding is performed using a disc-shaped grindstone arranged to be orthogonal to the disc-shaped workpiece. In addition, in this method, in order to adjust the thickness direction position of the workpiece rotating at high speed, a mechanism using a piezoelectric element is required, which makes the processing device complicated and expensive, and since the thickness direction position of the workpiece is frequently adjusted and the workpiece is rotated, the forming accuracy of the desired cross-sectional shape tends to deteriorate. In particular, it is difficult to make the radius (R dimension) of the arc-shaped portion of the desired cross-sectional shape of the workpiece constant throughout the entire circumference of the disc-shaped workpiece.
在專利文獻11記載之方法中,使磨石的外周部之凸形研磨部分接近工件並施行工件的研磨,故研磨時之負載、振動大。此外,由於凸形研磨部分的半徑方向體積大,故磨石的重量、旋轉時之慣性矩大,結果而言,磨石的旋轉時之振動容易變大,磨石的製造成本變高。此外,即便在研磨時將研磨水(冷卻劑)供給至磨石和工件的接觸部分,接觸到凸形研磨部分之研磨水仍容易飛散,難以施行效率良好而流暢的研磨。 In the method described in Patent Document 11, the convex grinding portion of the outer circumference of the grinding stone is brought close to the workpiece to grind the workpiece, so the load and vibration during grinding are large. In addition, since the convex grinding portion has a large volume in the radial direction, the weight of the grinding stone and the inertia moment during rotation are large. As a result, the vibration of the grinding stone during rotation tends to increase, and the manufacturing cost of the grinding stone increases. In addition, even if grinding water (coolant) is supplied to the contact portion between the grinding stone and the workpiece during grinding, the grinding water that contacts the convex grinding portion is still easy to scatter, making it difficult to perform efficient and smooth grinding.
本發明之目的在於提供一種工件加工裝置、磨石、及工件加工方法,可輕易、效率良好且精度良好地施行工件的倒角加工,且支持及驅動工件及磨石的機構簡單,且可輕易地進行磨石的修整。 The purpose of the present invention is to provide a workpiece processing device, a grinding stone, and a workpiece processing method, which can easily, efficiently and accurately perform chamfering of the workpiece, and the mechanism for supporting and driving the workpiece and the grinding stone is simple, and the grinding stone can be easily trimmed.
本發明之工件加工裝置,用於將圓板狀之工件形成為期望的剖面形狀,其特徵在於:具備支持該工件的工件支持機構、對於該工件平行地配置的圓板狀之磨石、及支持該磨石的磨石支持機構;該工件支持機構使該工件旋轉,該磨石支持機構使該磨石旋轉;成為該工件支持機構所進行之該工件的旋轉之中心的旋轉軸,與成為該磨石支持機構所進行之該磨石的旋轉之中心的旋轉軸彼此平行;該工件支持機構,具備僅將該工件之單側的面吸附之吸附構件;該吸附構件的平面形狀,呈半徑較該工件之半徑更小的圓形;圓形之該吸附構件的外周部分,具有厚度越往外側越變薄之前端較薄形狀;該磨石於外周部具有凹形研磨部分;該凹形研磨部分之沿著該磨石的該旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈至少在厚度方向之兩端部各自具備圓弧狀部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分之形狀,該直線部分施行用於將該工件的直徑之減小、或使該工件的外周部之厚度方向的中間部平滑化的至少一方之研磨;該磨石與該工件,藉由該磨石支持機構或該工件支持機構,以可彼此接近、遠離的方式相對地移動;該磨石支持機構或該工件支持機構,遵循依據該磨石的該圓弧狀部分之曲率半徑算出的移動條件,使該磨石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動;該磨石的該圓弧狀部分之曲率半徑至少為該工件的厚度之10倍以上,俾使該磨石的該圓弧狀部分,以與該工件之該期望的剖面形狀之倒角部間實質上不產生間隙的方式抵接於該工件;位於該工件的藉由該吸附構件吸附之該單側的面側之該圓弧狀部分,在沿 著該磨石的該旋轉軸之剖面中具有的長度,為該期望的剖面形狀之該工件的該單側的面側之該倒角部的長度以上,且未滿下述長度:和該工件之該單側的面側之端部,在該圓弧狀部分的切線以與該吸附構件之該前端較薄形狀的角度一致之角度延伸的位置中接觸的狀態下,抵接於該吸附構件之該前端較薄形狀的長度。 The workpiece processing device of the present invention is used to form a circular plate-shaped workpiece into a desired cross-sectional shape, and is characterized in that: it has a workpiece supporting mechanism for supporting the workpiece, a circular plate-shaped grindstone arranged parallel to the workpiece, and a grindstone supporting mechanism for supporting the grindstone; the workpiece supporting mechanism rotates the workpiece, and the grindstone supporting mechanism rotates the grindstone; the rotation axis serving as the center of rotation of the workpiece performed by the workpiece supporting mechanism and the rotation axis serving as the center of rotation of the grindstone performed by the grindstone supporting mechanism are parallel to each other; the workpiece supporting mechanism has an adsorption component for adsorbing only one side of the workpiece; the adsorption component The plane shape is a circle with a smaller radius than the radius of the workpiece; the outer peripheral portion of the circular adsorption member has a front end thinner shape with the thickness becoming thinner toward the outside; the grindstone has a concave grinding portion at the outer peripheral portion; the cross-sectional shape of the concave grinding portion along the cross-sectional shape of the rotation axis of the grindstone is a concave shape that is concave from the outer peripheral side to the inner peripheral side, and has a shape in which at least both ends in the thickness direction have arc-shaped portions, and between the arc-shaped portions at the two ends, there is a straight line portion with a thickness greater than the thickness of the workpiece, and the straight line portion is used to reduce the diameter of the workpiece or to thicken the outer peripheral portion of the workpiece. The grindstone and the workpiece are relatively moved by the grindstone supporting mechanism or the workpiece supporting mechanism in a manner that they can approach or move away from each other; the grindstone supporting mechanism or the workpiece supporting mechanism moves the grindstone relative to the workpiece in accordance with a moving condition calculated based on the radius of curvature of the circular arc portion of the grindstone, so that the contact portion between the concave grinding portion and the workpiece moves along the desired cross-sectional shape of the workpiece; the radius of curvature of the circular arc portion of the grindstone is at least 10 times the thickness of the workpiece, so that the circular arc portion of the grindstone can contact the workpiece with the concave grinding portion. The length of the arc-shaped portion located on the surface side of the workpiece adsorbed by the adsorption member in the section along the rotation axis of the grindstone is greater than the length of the chamfered portion on the surface side of the workpiece of the desired cross-sectional shape, and less than the following length: the length of the thinner front end shape of the adsorption member is in contact with the end of the surface side of the workpiece at a position where the tangent of the arc-shaped portion extends at an angle consistent with the angle of the thinner front end shape of the adsorption member.
本發明之另一種工件加工裝置,用於將圓板狀之工件形成為期望的剖面形狀,其特徵在於:具備支持該工件的工件支持機構、對於該工件平行地配置的圓板狀之磨石、及支持該磨石的磨石支持機構;該工件支持機構使該工件旋轉,該磨石支持機構使該磨石旋轉;成為該工件支持機構所進行之該工件的旋轉之中心的旋轉軸,與成為該磨石支持機構所進行之該磨石的旋轉之中心的旋轉軸彼此平行;該工件支持機構,具備僅將該工件之單側的面吸附之吸附構件;該吸附構件的平面形狀,呈半徑較該工件之半徑更小的圓形;圓形之該吸附構件的外周部分,具有厚度越往外側越變薄之前端較薄形狀;該磨石於外周部具有凹形研磨部分;該凹形研磨部分之沿著該磨石的該旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈下述形狀:至少在厚度方向之兩端部,各自具備圓弧狀部分、及位於較該圓弧狀部分更為厚度方向外側而與該圓弧狀部分連續地連結的斜面部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分之形狀,該直線部分施行用於將該工件的直徑之減小、或使該工件的外周部之厚度方向的中間部平滑化的至少一方之研磨;該斜面部分,沿著該圓弧狀部分與該斜面部分之邊界位置中的該圓弧狀部分之切線方向而延伸,其角度與該期望的剖面形狀之該工件的該單側之面側的倒角部 之角度一致;該磨石與該工件,藉由該磨石支持機構或該工件支持機構,以可彼此接近、遠離的方式相對地移動;該磨石支持機構或該工件支持機構,遵循依據該磨石的該圓弧狀部分之曲率半徑算出的移動條件,使該磨石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動;該磨石的該圓弧狀部分之曲率半徑至少為該工件的厚度之10倍以上;位於該工件的由該吸附構件吸附之該單側的面側之該斜面部分,在沿著該磨石的該旋轉軸之剖面中具有的長度,為該期望的剖面形狀之該工件的該單側的面側之該倒角部的長度以上,且未滿下述長度:於該斜面部分延伸之方向對於該工件之該單側的面所夾的角度,較該吸附構件之該前端較薄形狀對於該工件之該單側的面所夾的角度更小之情況,和該工件之該單側的面側之端部,在該圓弧狀部分的切線以與該吸附構件之該前端較薄形狀的角度一致之角度延伸的位置中接觸的狀態下,該斜面部分抵接於該吸附構件之該前端較薄形狀的長度。 Another workpiece processing device of the present invention is used to form a circular plate-shaped workpiece into a desired cross-sectional shape, and is characterized in that: it has a workpiece supporting mechanism for supporting the workpiece, a circular plate-shaped grindstone arranged parallel to the workpiece, and a grindstone supporting mechanism for supporting the grindstone; the workpiece supporting mechanism rotates the workpiece, and the grindstone supporting mechanism rotates the grindstone; the rotation axis serving as the center of rotation of the workpiece by the workpiece supporting mechanism and the rotation axis serving as the center of rotation of the grindstone by the grindstone supporting mechanism are parallel to each other; the workpiece supporting mechanism has an adsorption component for adsorbing only one side of the workpiece; the plane shape of the adsorption component is a circle with a radius smaller than the radius of the workpiece; the outer surface of the circular adsorption component is The grindstone has a concave grinding portion on the outer peripheral portion; the cross-sectional shape of the concave grinding portion along the rotation axis of the grindstone is a concave shape that is concave from the outer peripheral side to the inner peripheral side, and has the following shape: at least at both ends in the thickness direction, each has an arc-shaped portion and an inclined surface portion that is located further outward in the thickness direction than the arc-shaped portion and continuously connected to the arc-shaped portion, and between the arc-shaped portions at the two ends, there is a straight line portion with a thickness greater than the thickness of the workpiece, and the straight line portion is used to grind at least one of reducing the diameter of the workpiece or smoothing the middle portion in the thickness direction of the outer peripheral portion of the workpiece; the inclined surface The concave grinding portion and the workpiece are provided with a concave grinding portion, which extends along the tangent direction of the arc-shaped portion at the boundary position between the arc-shaped portion and the inclined surface portion, and the angle thereof is consistent with the angle of the chamfered portion of the single side of the workpiece of the desired cross-sectional shape; the grindstone and the workpiece are relatively moved in a manner that they can approach and move away from each other by the grindstone supporting mechanism or the workpiece supporting mechanism; the grindstone supporting mechanism or the workpiece supporting mechanism moves the grindstone relative to the workpiece in accordance with the moving conditions calculated based on the radius of curvature of the arc-shaped portion of the grindstone, so that the contact portion between the concave grinding portion and the workpiece moves along the desired cross-sectional shape of the workpiece; the radius of curvature of the arc-shaped portion of the grindstone is at least 10 times the thickness of the workpiece. The inclined surface portion located on the surface side of the workpiece adsorbed by the adsorption member has a length in the cross section along the rotation axis of the grindstone that is greater than the length of the chamfered portion of the surface side of the workpiece of the desired cross-sectional shape, and less than the following length: the angle between the inclined surface portion and the surface side of the workpiece in the direction of extension is smaller than the angle between the front end thinner shape of the adsorption member and the surface side of the workpiece, and the end of the surface side of the workpiece is in contact at a position where the tangent of the arc-shaped portion extends at an angle consistent with the angle of the front end thinner shape of the adsorption member, and the inclined surface portion abuts against the length of the front end thinner shape of the adsorption member.
本發明之工件加工方法,用於使用磨石將圓板狀之工件形成為期望的剖面形狀,其特徵在於:該磨石可旋轉、呈圓板狀,於外周部具備凹形研磨部分;該凹形研磨部分之沿著該磨石的旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈至少在厚度方向之兩端部各自具備圓弧狀部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分之形狀,該直線部分施行用於將該工件的直徑之減小、或使該工件的外周部之厚度方向的中間部平滑化的至少一方之研磨;該工件加工方法,包含:將該工件與該磨石彼此平行地配置之步驟;以及使該磨石旋轉,且以與該磨石的該旋轉軸平行 之旋轉軸為中心而使該工件旋轉,並遵循依據該磨石的該圓弧狀部分之曲率半徑算出的移動條件,使該磨石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動之步驟;使該磨石對於該工件相對地移動之步驟,包含:使僅單側的面由吸附構件吸附之該工件、及該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該一方的面側之外周部研磨,形成該工件之該期望的剖面形狀之倒角部;使該磨石,沿著該工件的外周端面,從該一方的面側往另一方的面側,對於該工件相對地移動;以及使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該另一方的面側之外周部研磨,形成該工件之該期望的剖面形狀之倒角部;該吸附構件的平面形狀,呈半徑較該工件之半徑更小的圓形;圓形之該吸附構件的外周部分,具有厚度越往外側越變薄之前端較薄形狀;該磨石的該圓弧狀部分之曲率半徑至少為該工件的厚度之10倍以上,俾使該磨石的該圓弧狀部分,以與該工件之該期望的剖面形狀之該倒角部間實質上不產生間隙的方式,抵接於該工件;位於該工件的藉由該吸附構件吸附之該單側的面側之該圓弧狀部分,在沿著該磨石的該旋轉軸之剖面中具有的長度,為該期望的剖面形狀之該工件的該單側的面側之該倒角部的長度以上,且未滿下述長度:和該工件之該單側的面側之端部,在該圓弧狀部分的切線以與該吸附構件之該前端較薄形狀的角度一致之角度延伸的位置中接觸的狀態下,抵接於該吸附構件之該前端較薄形狀的長度;在施行該工件之該一方的面側或該另一方的面側之外周部的粗研磨時,使該工 件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,以該磨石的該旋轉軸與該工件的該旋轉軸位於同一平面內之方式,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,而後使該磨石的對於該工件之相對移動停止;在施行該工件之該一方的面側或該另一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,以該磨石的該旋轉軸與該工件的該旋轉軸位於同一平面內之方式,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,以在沿對於曲線移動時該磨石的該旋轉軸與該工件的該旋轉軸所在之該平面垂直或斜向地交叉的方向延伸之平面內,使該磨石的該旋轉軸與該工件的該旋轉軸相對地移動之方式,使該磨石對於該工件相對地直線移動。 The workpiece processing method of the present invention is used to form a disk-shaped workpiece into a desired cross-sectional shape using a grindstone, and is characterized in that: the grindstone is rotatable, disk-shaped, and has a concave grinding portion on the outer periphery; the cross-sectional shape of the concave grinding portion in the cross-sectional shape along the rotation axis of the grindstone is a concave shape that is concave from the outer periphery to the inner periphery, and has a shape in which each of the two end portions in the thickness direction has an arc-shaped portion, and a straight line portion having a thickness greater than the thickness of the workpiece is provided between the arc-shaped portions at the two end portions, and the straight line portion A method for processing a workpiece is provided for performing grinding for reducing the diameter of the workpiece or smoothing the middle portion of the outer peripheral portion of the workpiece in the thickness direction. The method comprises: arranging the workpiece and the grinding stone in parallel with each other; and rotating the grinding stone, rotating the workpiece around a rotation axis parallel to the rotation axis of the grinding stone, and moving the grinding stone relative to the workpiece according to a movement condition calculated based on the radius of curvature of the circular arc portion of the grinding stone, so that the concave grinding portion and the contact portion of the workpiece are smoothed. The step of moving the grinding stone relative to the workpiece along the desired cross-sectional shape of the workpiece; the step of moving the grinding stone relative to the workpiece, comprising: rotating the workpiece, which has only one side adsorbed by the adsorption component, and the grinding stone, and moving the arc-shaped portion of the concave grinding portion of the grinding stone from the outer peripheral end face of the workpiece to one side of the face, relative to the workpiece, in a curve according to the angle pre-calculated according to the moving condition, thereby grinding the outer peripheral portion of the one side of the workpiece to form a chamfered portion of the desired cross-sectional shape of the workpiece; moving the grinding stone along The outer peripheral end face of the workpiece is moved relative to the workpiece from the one side to the other side; and the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved relative to the workpiece in a curved line from the outer peripheral end face of the workpiece to the other side of the face, following the angle pre-calculated according to the moving condition, thereby grinding the outer peripheral portion of the other side of the workpiece to form a chamfered portion of the desired cross-sectional shape of the workpiece; the plane shape of the adsorption member has a radius that is larger than the half of the workpiece. The outer peripheral portion of the circular adsorption member has a thinner shape at the front end where the thickness becomes thinner toward the outside; the radius of curvature of the arc-shaped portion of the grindstone is at least 10 times the thickness of the workpiece, so that the arc-shaped portion of the grindstone abuts against the workpiece in a manner that substantially no gap is generated between the chamfered portion of the desired cross-sectional shape of the workpiece; the arc-shaped portion located on the single side of the workpiece adsorbed by the adsorption member has a length in the cross section along the rotation axis of the grindstone, The length of the chamfered portion of the one side of the workpiece having the desired cross-sectional shape is greater than or equal to the length of the chamfered portion of the one side of the workpiece, and less than the following length: the length of the chamfered portion of the one side of the workpiece in contact with the end of the one side of the workpiece, in a position where the tangent of the arc-shaped portion extends at an angle consistent with the angle of the thinner shape of the front end of the adsorption member; when performing rough grinding of the outer peripheral portion of the one side of the workpiece or the other side of the workpiece, the workpiece and the grindstone are rotated, and the concave grinding of the grindstone is The arc-shaped portion of the concave grinding portion of the grindstone is moved from the outer peripheral end face of the workpiece to the one side face or the other side face in a manner that the rotation axis of the grindstone and the rotation axis of the workpiece are located in the same plane, and the workpiece is relatively moved in a curved line according to the angle calculated in advance according to the movement condition, and then the relative movement of the grindstone with respect to the workpiece is stopped; when performing precision grinding of the outer peripheral portion of the one side face or the other side face of the workpiece, the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved from The outer peripheral end surface of the workpiece moves toward the one surface or the other surface in a manner that the rotation axis of the grindstone and the rotation axis of the workpiece are located in the same plane, and after the workpiece is relatively moved in a curved line by an angle pre-calculated according to the moving condition, the grindstone is relatively moved in a straight line in a plane extending in a direction perpendicular or obliquely intersecting the plane where the rotation axis of the grindstone and the rotation axis of the workpiece are located during the curved movement.
另一工件加工方法,用於使用磨石將圓板狀之工件形成為期望的剖面形狀,其特徵在於:該磨石可旋轉、呈圓板狀,於外周部具備凹形研磨部分;該凹形研磨部分之沿著該磨石的旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈下述形狀:至少在厚度方向之兩端部,各自具備圓弧狀部分、及位於較該圓弧狀部分更為厚度方向外側而與該圓弧狀部分連續地連結的斜面部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分之形狀,該直線部分施行用於將該工件的直徑之減小、或使該工件的外周部之厚度方向的中間部平滑化的至少一方之研磨;該工件加工方法,包含:將該工件與該磨石彼此平行地配置之步驟;以及使該磨石旋轉,且以與該磨石的該旋轉軸平行之旋轉軸為中心而使該工件旋轉,並遵循依據該磨石的該圓弧 狀部分之曲率半徑算出的移動條件,使該磨石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動之步驟;使該磨石對於該工件相對地移動之步驟,包含:使僅單側的面由吸附構件吸附之該工件、及該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該一方的面側之外周部研磨,形成該工件之該期望的剖面形狀之倒角部;使該磨石,沿著該工件的外周端面,從該一方的面側往另一方的面側,對於該工件相對地移動;以及使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該另一方的面側之外周部研磨,形成該工件之該期望的剖面形狀之倒角部;該吸附構件的平面形狀,呈半徑較該工件之半徑更小的圓形;圓形之該吸附構件的外周部分,具有厚度越往外側越變薄之前端較薄形狀;該磨石的該圓弧狀部分之曲率半徑至少為該工件的厚度之10倍以上;該斜面部分,沿著該圓弧狀部分與該斜面部分之邊界位置中的該圓弧狀部分之切線方向而延伸,其角度與該期望的剖面形狀之該工件的該單側之面側的該倒角部之角度一致;位於該工件的由該吸附構件吸附之該單側的面側之該斜面部分,在沿著該磨石的該旋轉軸之剖面中具有的長度,為該期望的剖面形狀之該工件的該單側的面側之該倒角部的長度以上,且未滿下述長度:於該斜面部分延伸之方向對於該工件之該單側的面所夾的角度,較該吸附構件之該前端較薄形狀對於該工件之該單側的面所夾的角度更小之情況,和該工件之該單側的面側之端部,在該圓弧狀部分的切線以與該吸附構件之該前端較薄形狀的角度一致之角度延伸的位置中 接觸的狀態下,該斜面部分抵接於該吸附構件之該前端較薄形狀的長度;在施行該工件之該一方的面側或該另一方的面側之外周部的粗研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,以該磨石的該旋轉軸與該工件的該旋轉軸位於同一平面內之方式,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,而後使該磨石的對於該工件之相對移動停止;在施行該工件之該一方的面側或該另一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,以該磨石的該旋轉軸與該工件的該旋轉軸位於同一平面內之方式,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,維持使該磨石的該旋轉軸與該工件的該旋轉軸位於曲線移動時該磨石的該旋轉軸與該工件的該旋轉軸所在之該平面內的狀態,使該磨石對於該工件相對地直線移動。 Another workpiece processing method is used to form a disk-shaped workpiece into a desired cross-sectional shape using a grindstone, wherein the grindstone is rotatable, disk-shaped, and has a concave grinding portion on the outer periphery; the cross-sectional shape of the concave grinding portion in the cross-sectional shape along the rotation axis of the grindstone is a concave shape that is concave from the outer periphery to the inner periphery, and has the following shape: at least at both ends in the thickness direction, each has an arc-shaped portion, and an inclined surface portion that is located further outward in the thickness direction than the arc-shaped portion and continuously connected to the arc-shaped portion, and between the arc-shaped portions at the two ends, there is a The workpiece processing method comprises: a step of arranging the workpiece and the grindstone in parallel with each other; and rotating the grindstone, rotating the workpiece around a rotation axis parallel to the rotation axis of the grindstone, and moving the grindstone relative to the workpiece according to a movement condition calculated based on the radius of curvature of the circular arc-shaped portion of the grindstone, so that the concave portion of the grindstone is smoothed. The step of moving the concave grinding portion and the contact portion of the workpiece along the desired cross-sectional shape of the workpiece; the step of moving the grindstone relative to the workpiece, comprising: rotating the workpiece, which has only one side adsorbed by the adsorption component, and the grindstone, and moving the arc-shaped portion of the concave grinding portion of the grindstone from the outer peripheral end face of the workpiece to one side of the face, relative to the workpiece, in a curved line according to the angle pre-calculated according to the moving condition, thereby grinding the outer peripheral portion of the one side of the workpiece to form a chamfered portion of the desired cross-sectional shape of the workpiece; moving the grindstone along The outer peripheral end face of the workpiece is moved relative to the workpiece from the one side to the other side; and the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved relative to the workpiece from the outer peripheral end face of the workpiece to the other side of the face, following the angle pre-calculated according to the moving condition, thereby grinding the outer peripheral portion of the other side of the workpiece to form a chamfered portion of the desired cross-sectional shape of the workpiece; the plane shape of the adsorption component is a circle with a radius smaller than the radius of the workpiece; the circular adsorption component The peripheral portion of the workpiece has a shape in which the thickness becomes thinner toward the outside and the front end is thinner; the radius of curvature of the arc-shaped portion of the grindstone is at least 10 times the thickness of the workpiece; the inclined surface portion extends along the tangent direction of the arc-shaped portion at the boundary position between the arc-shaped portion and the inclined surface portion, and its angle is consistent with the angle of the chamfered portion on the surface side of the single side of the workpiece of the desired cross-sectional shape; the inclined surface portion located on the surface side of the single side of the workpiece adsorbed by the adsorption member has a length in the cross section along the rotation axis of the grindstone of the desired cross-sectional shape. The cross-sectional shape is greater than the length of the chamfered portion of the one-side surface of the workpiece, and less than the following length: when the angle between the inclined surface and the one-side surface of the workpiece in the direction of extension is smaller than the angle between the thinner shape of the front end of the adsorption member and the one-side surface of the workpiece, and the end of the one-side surface of the workpiece is in contact at a position where the tangent of the arc-shaped portion extends at an angle consistent with the angle of the thinner shape of the front end of the adsorption member, the inclined surface portion abuts against the thinner shape of the front end of the adsorption member; when the angle between the inclined surface and the one-side surface of the workpiece is smaller than the angle between the thinner shape of the front end of the adsorption member and the one-side surface of the workpiece, the inclined surface portion abuts against the thinner shape of the front end of the adsorption member; When the outer peripheral portion of the one side face or the other side face of the workpiece is roughly ground, the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved relative to the workpiece in a curved line from the outer peripheral end face of the workpiece to the one side face or the other side face in a manner that the rotation axis of the grindstone and the rotation axis of the workpiece are located in the same plane, following the angle calculated in advance according to the movement condition, and then the relative movement of the grindstone relative to the workpiece is stopped; when the outer peripheral portion of the one side face or the other side face of the workpiece is precisely ground, During grinding, the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved from the outer peripheral end surface of the workpiece to the one surface or the other surface, so that the rotation axis of the grindstone and the rotation axis of the workpiece are located in the same plane. After the workpiece is moved in a curved line relative to the workpiece by an angle pre-calculated according to the movement condition, the state in which the rotation axis of the grindstone and the rotation axis of the workpiece are located in the plane where the rotation axis of the grindstone and the rotation axis of the workpiece are located during the curved movement is maintained, and the grindstone is moved in a straight line relative to the workpiece.
更另一工件加工方法,用於使用磨石將圓板狀之工件形成為期望的剖面形狀,其特徵在於:該磨石可旋轉、呈圓板狀,於外周部具備凹形研磨部分;該凹形研磨部分之沿著該磨石的旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈至少在厚度方向之兩端部各自具備圓弧狀部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分之形狀,該直線部分施行用於將該工件的直徑之減小、或使該工件的外周部之厚度方向的中間部平滑化的至少一方之研磨;該工件加工方法,包含:將該工件與該磨石彼此平行地配置之步驟;以及使該磨石旋轉,且以與該磨石的該旋轉軸平行 之旋轉軸為中心而使該工件旋轉,並遵循依據該磨石的該圓弧狀部分之曲率半徑算出的移動條件,使該磨石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動之步驟;使該磨石對於該工件相對地移動之步驟,包含:使僅單側的面由吸附構件吸附之該工件、及該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該一方的面側之外周部研磨,形成該工件之該期望的剖面形狀之倒角部;使該磨石,沿著該工件的外周端面,從該一方的面側往另一方的面側,對於該工件相對地移動;以及使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該另一方的面側之外周部研磨,形成該工件之該期望的剖面形狀之倒角部;該吸附構件的平面形狀,呈半徑較該工件之半徑更小的圓形;圓形之該吸附構件的外周部分,具有厚度越往外側越變薄之前端較薄形狀;該磨石的該圓弧狀部分之曲率半徑至少為該工件的厚度之10倍以上,俾使該磨石的該圓弧狀部分,以與該工件之該期望的剖面形狀之該倒角部間實質上不產生間隙的方式,抵接於該工件;位於該工件的藉由該吸附構件吸附之該單側的面側之該圓弧狀部分,在沿著該磨石的該旋轉軸之剖面中具有的長度,為該期望的剖面形狀之該工件的該單側的面側之該倒角部的長度以上,且未滿下述長度:和該工件之該單側的面側之端部,在該圓弧狀部分的切線以與該吸附構件之該前端較薄形狀的角度一致之角度延伸的位置中接觸的狀態下,抵接於該吸附構件之該前端較薄形狀的長度;在施行該工件之該一方的面側或該另一方的面側之外周部的粗研磨時,使該工 件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,而後使該磨石的對於該工件之相對移動停止;在施行該工件之該一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並考慮該工件的旋轉時產生之厚度方向的位置誤差,以該工件旋轉時通過的厚度方向之該一方的面側中最為外側之位置為基準,使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,使移動停止,在該磨石和該工件之該一方的面側之該倒角部的斜面接觸之位置,調整該工件的厚度方向之位置並減緩該工件的旋轉速度,使其旋轉至少一圈以上,藉以抵消該工件之旋轉時的位置誤差並將該工件之該一方的面側研磨;在施行該工件之該另一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並考慮該工件的旋轉時產生之厚度方向的位置誤差,以該工件旋轉時通過的厚度方向之該另一方的面側中最為外側之位置為基準,使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該另一方的面,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,使移動停止,在該磨石和該工件之該另一方的面側之該倒角部的斜面接觸之位置,調整該工件的厚度方向之位置並減緩該工件的旋轉速度,使其旋轉至少一圈以上,藉以抵消該工件之旋轉時的位置誤差並將該工件之該另一方的面側研磨。 Another workpiece processing method is used to form a disk-shaped workpiece into a desired cross-sectional shape using a grindstone, wherein the grindstone is rotatable, disk-shaped, and has a concave grinding portion on the outer periphery; the cross-sectional shape of the concave grinding portion in the cross-sectional shape along the rotation axis of the grindstone is concave from the outer periphery to the inner periphery, and is in the shape of having arc-shaped portions at at least two end portions in the thickness direction, and having a straight line portion having a thickness greater than the thickness of the workpiece between the arc-shaped portions at the two end portions, and the straight line portion is used to reduce the diameter of the workpiece or to make the middle of the outer periphery of the workpiece in the thickness direction. The method for processing a workpiece comprises: arranging the workpiece and the grinding stone in parallel with each other; rotating the grinding stone and rotating the workpiece around a rotation axis parallel to the rotation axis of the grinding stone, and moving the grinding stone relative to the workpiece according to a movement condition calculated based on the radius of curvature of the circular arc portion of the grinding stone so that the contact portion between the concave grinding portion and the workpiece moves along the desired cross-sectional shape of the workpiece; the step of moving the grinding stone relative to the workpiece comprises: rotating the workpiece with only one side surface adsorbed by an adsorption member and the grinding stone relative to the workpiece; The invention relates to a method for grinding a chamfered portion of the workpiece with a grinding wheel and a grinding wheel, wherein the grinding wheel is provided with a grinding wheel and a grinding wheel, and wherein the grinding wheel is provided ... The curved movement follows the angle calculated in advance according to the movement condition, thereby grinding the outer peripheral portion of the other side of the workpiece to form the chamfered portion of the desired cross-sectional shape of the workpiece; the plane shape of the adsorption component is a circle with a radius smaller than the radius of the workpiece; the outer peripheral portion of the circular adsorption component has a thinner shape at the front end where the thickness becomes thinner as it goes outward; the radius of curvature of the arc-shaped portion of the grindstone is at least 10 times the thickness of the workpiece, so that the arc-shaped portion of the grindstone abuts against the workpiece in a manner that substantially no gap is generated between the arc-shaped portion and the chamfered portion of the desired cross-sectional shape of the workpiece; the adsorption component is located at the workpiece. The length of the arc-shaped portion of the surface side of the workpiece adsorbed by the adsorption member in the cross section along the rotation axis of the grindstone is greater than the length of the chamfered portion of the surface side of the workpiece of the desired cross-sectional shape, and less than the following length: the length of the end of the surface side of the workpiece abutting against the thinner shape of the front end of the adsorption member in a state where the tangent of the arc-shaped portion extends at an angle consistent with the angle of the thinner shape of the front end of the adsorption member; when performing rough grinding of the outer peripheral portion of the surface side of the one side or the other side of the workpiece, the workpiece is brought into contact with the surface side of the workpiece. The grindstone is rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved in a curve relative to the workpiece from the outer peripheral end face of the workpiece to the one side face or the other side face according to the angle pre-calculated according to the movement condition, and then the relative movement of the grindstone relative to the workpiece is stopped; when performing precision grinding of the outer peripheral portion of the one side face of the workpiece, the workpiece and the grindstone are rotated, and considering the position error in the thickness direction generated when the workpiece is rotated, the arc-shaped portion of the concave grinding portion of the grindstone is moved relative to the one side face of the workpiece according to the angle pre-calculated according to the movement condition, and the position error in the thickness direction generated when the workpiece is rotated is taken into account, and the outermost position of the one side face of the workpiece in the thickness direction is taken as the reference. , from the outer peripheral end face of the workpiece to the one side face, after the workpiece is moved relative to the curve by an angle pre-calculated according to the movement condition, the movement is stopped, and at the position where the grindstone and the inclined surface of the chamfered portion of the one side face of the workpiece contact, the position of the workpiece in the thickness direction is adjusted and the rotation speed of the workpiece is slowed down, so that the workpiece rotates at least one circle, thereby offsetting the position error of the workpiece during rotation and grinding the one side face of the workpiece; when performing precision grinding of the outer peripheral portion of the other side face of the workpiece, the workpiece and the grindstone are rotated, and the position error in the thickness direction generated during the rotation of the workpiece is taken into consideration. The workpiece rotates through the outermost position of the other side of the thickness direction as a reference, and the arc-shaped portion of the concave grinding portion of the grindstone moves from the outer peripheral end face of the workpiece to the other side of the workpiece by an angle calculated in advance according to the movement conditions, and then stops the movement. At the position where the grindstone and the chamfered portion of the other side of the workpiece contact, the position of the workpiece in the thickness direction is adjusted and the rotation speed of the workpiece is slowed down, so that the workpiece rotates at least one circle, thereby offsetting the position error of the workpiece during rotation and grinding the other side of the workpiece.
依本發明,則可提供一種工件加工裝置、磨石、及工件加工方法,可輕易、效率良好且精度良好地施行工件的倒角加工,且支持及驅動工件及磨石的機構簡單,且可輕易地進行磨石的修整。 According to the present invention, a workpiece processing device, a grinding stone, and a workpiece processing method can be provided, which can easily, efficiently and accurately perform chamfering of the workpiece, and the mechanism for supporting and driving the workpiece and the grinding stone is simple, and the grinding stone can be easily trimmed.
1:工件加工裝置 1: Workpiece processing device
2:工件 2: Workpiece
2a:倒角部 2a: Chamfered part
2b:單側的面(受到吸附的面) 2b: Single-sided surface (surface that is adsorbed)
3,6,14:旋轉軸 3,6,14: Rotation axis
4:工件支持機構 4: Workpiece support mechanism
4a:X方向移動台 4a: X-direction moving stage
4b:Y方向移動台 4b: Y-direction moving stage
4c:Z方向移動台 4c: Z-direction moving stage
4d:馬達 4d: Motor
5:磨石 5: Grindstone
5a:基底圓板部 5a: base disc
5b:凹形研磨部分 5b: Concave grinding part
5c:安裝孔 5c: Mounting hole
5d:凹部 5d: concave part
5e:圓弧狀部分 5e: Arc-shaped part
5f:直線部分 5f: Straight line part
5g:剖面長方形研磨部分 5g: Rectangular grinding section
5h:斜面部分 5h: Sloped part
7:磨石支持機構 7: Grindstone support mechanism
7a:殼體 7a: Shell
7b:旋轉軸承部 7b: Rotating bearing part
7c:主軸 7c: Main axis
7d:凸緣部 7d: flange
7e:螺栓 7e: Bolts
10:吸附構件 10: Adsorption components
10a:前端較薄形狀 10a: Thinner front end shape
11:整形磨石(整形子) 11: Shaping grinding stone (shaping stone)
12:附溝磨石 12: Grinding stone with groove
12a:溝 12a: Groove
13:附溝磨石支持機構 13: Grooved grinding stone support mechanism
15:溫度調整機構 15: Temperature adjustment mechanism
16:磨石 16: Grindstone
16a:成型溝 16a: Forming groove
圖1係示意本發明的第1實施形態之工件加工裝置的前視圖。 FIG1 is a front view of a workpiece processing device according to the first embodiment of the present invention.
圖2係顯示圖1所示之工件加工裝置的磨石之剖面圖。 FIG2 is a cross-sectional view of the grinding stone of the workpiece processing device shown in FIG1.
圖3A係示意本發明的第1實施形態之工件加工方法的一例之一製程的前視圖。 FIG3A is a front view showing a process of an example of a workpiece processing method of the first embodiment of the present invention.
圖3B係示意接續圖3A所示的製程之製程的前視圖。 FIG. 3B is a front view showing a process that is a continuation of the process shown in FIG. 3A .
圖3C係示意接續圖3B所示的製程之製程的前視圖。 FIG. 3C is a front view showing a process that is a continuation of the process shown in FIG. 3B .
圖3D係示意接續圖3C所示的製程之製程的前視圖。 FIG. 3D is a front view showing a process that is a continuation of the process shown in FIG. 3C .
圖4係顯示圖3B所示的製程之放大圖。 Figure 4 is an enlarged view of the process shown in Figure 3B.
圖5係顯示接續圖4所示的製程之製程的放大圖。 FIG5 is an enlarged view showing a process following the process shown in FIG4.
圖6係顯示接續圖5所示的製程之製程的放大圖。 FIG6 is an enlarged view showing a process following the process shown in FIG5.
圖7A係顯示本發明的第1實施形態中加工後之工件的例子之前視圖。 FIG. 7A is a front view showing an example of a workpiece after processing in the first embodiment of the present invention.
圖7B係用於說明工件的頂面側之厚度方向與水平方向的位置偏移之大小的說明圖。 FIG. 7B is an explanatory diagram for illustrating the magnitude of the positional offset in the thickness direction and the horizontal direction of the top surface side of the workpiece.
圖7C係用於說明工件的底面側之厚度方向與水平方向的位置偏移之大小的說明圖。 FIG. 7C is an explanatory diagram for explaining the magnitude of the positional offset in the thickness direction and the horizontal direction of the bottom side of the workpiece.
圖8係顯示本發明的第1實施形態中加工後之工件的另一例之前視圖。 FIG8 is a front view showing another example of a workpiece after processing in the first embodiment of the present invention.
圖9係顯示習知工件加工裝置的磨石之一例的剖面圖。 FIG9 is a cross-sectional view showing an example of a grinding stone of a known workpiece processing device.
圖10係詳細地顯示圖1所示之工件加工裝置的磨石及磨石支持機構之一例的剖面圖。 FIG10 is a cross-sectional view showing in detail an example of a grindstone and a grindstone support mechanism of the workpiece processing device shown in FIG1 .
圖11係用於說明本發明的第1實施形態之磨石的適宜尺寸之說明圖。 FIG. 11 is an explanatory diagram for explaining the appropriate size of the grinding stone of the first embodiment of the present invention.
圖12係顯示本發明的第2實施形態之工件加工裝置的磨石之剖面圖。 FIG12 is a cross-sectional view showing the grinding stone of the workpiece processing device of the second embodiment of the present invention.
圖13係用於說明本發明的第2實施形態之磨石的適宜尺寸之說明圖。 FIG. 13 is an explanatory diagram for explaining the appropriate size of the grinding stone of the second embodiment of the present invention.
圖14係示意本發明的第3實施形態之工件加工裝置的前視圖。 FIG. 14 is a front view of a workpiece processing device according to the third embodiment of the present invention.
圖15係顯示本發明的第4實施形態之工件加工裝置的前視圖。 FIG. 15 is a front view showing the workpiece processing device of the fourth embodiment of the present invention.
圖16係用於說明本發明之工件加工方法的一例之工件及磨石的俯視圖。 FIG. 16 is a top view of a workpiece and a grinding stone used to illustrate an example of the workpiece processing method of the present invention.
圖17係用於說明本發明之工件加工方法的另一例之工件的俯視圖。 FIG. 17 is a top view of a workpiece used to illustrate another example of the workpiece processing method of the present invention.
圖18係用於說明使用圖17所說明之工件加工方法的例子之說明圖。 FIG18 is an explanatory diagram for explaining an example of a workpiece processing method using the method described in FIG17.
以下,參考圖式,茲就本發明之實施形態予以說明。圖1係示意本發明的第1實施形態之工件加工裝置1的前視圖。圖2係顯示工件加工裝置1的磨石5之剖面圖。工件加工裝置1,係將半導體晶圓、玻璃基板、陶瓷等圓板狀之工件2研磨,施行工件2的外周部之倒角的裝置。工件加工裝置1,特別適合包含矽(Si)、矽碳化物(SiC)、氮化鎵(GaN)、砷化鎵(GaAs)、藍寶石等的高硬度之工件2的倒角加工。然而,亦可將工件加工裝置1,使用在其他種類之工件的加工。
Hereinafter, the implementation form of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a workpiece processing device 1 of the first implementation form of the present invention. FIG. 2 is a cross-sectional view showing a grindstone 5 of the workpiece processing device 1. The workpiece processing device 1 is a device for grinding a disc-shaped
工件加工裝置1,具備:工件支持機構4,支持圓板狀之工件2且使其以旋轉軸3為中心而旋轉;以及磨石支持機構7,支持圓板狀之磨石5且使其以旋轉軸6為中心而旋轉。作為一例,工件2呈直徑50~300mm、厚度1mm以下程度的圓板狀,磨石5呈直徑100~200mm、厚度20~60mm程度的圓板狀。為求方便,圖式中將工件2的厚度較厚地圖示。工件支持機構4與磨石支持機構7,將圓板狀之工件2與圓板狀之磨石5彼此平行地支持。工件支持機構4,藉由吸附構件10將圓板狀之工件2的單側之面2b吸附固持,可使工件2,以位於工件2的平面形狀之中心且對於工件2正交的旋轉軸3為中心而旋轉。同樣地,磨石支持機構7,可使圓板狀之磨石5,以位於磨石5的平面形狀之中心且對於磨石5正交的旋轉軸6為中心而旋轉。作為工件支持機構4所進行之工件2的旋轉之中心的旋轉軸3,與作為磨石支持機構7所進行之磨石5的旋轉之中心的旋轉軸6,彼此平行。磨石5與工件2,藉由磨石支持機構7或工件支持機構4,以可彼此接近或遠離的方式相對地移動。作為一例,磨石支持機構7,於使磨石5旋轉之狀態下,可在對於磨石5及工件2平行的面內(在與旋轉軸3及旋轉軸6正交的面內),使磨石5沿著磨石5接近工件2之方向、或遠離工件2之方向移動,並可在對於磨石5及工件2正交的面內(在與旋轉軸3及旋轉軸6平行的面內),使磨石5沿著磨石5接近工件2之方向、或遠離工件2之方向移動。因此,磨石5,藉由磨石支持機構7,至少在包含旋轉軸3、6的面內,相對於工件2可從任意方向接近,並可往任意方向遠離。工件支持機構4具備溫度調整機構15,其產生用於將工件支持機構4的旋轉軸3之溫度保持為一定的液體或氣體之流動。另,雖未詳述,但工件支持機構4及磨石支持機構7,亦可由公知之吸附台、旋轉馬達、或可動平台等構成。關於工件支持機構4之詳細且具體的構成例,將於後述內容說明。
The workpiece processing device 1 comprises: a workpiece support mechanism 4, which supports a disk-shaped
工件加工裝置1的磨石5,如圖2所示,具備:基底圓板部5a,成為基體;凹形研磨部分5b,位於基底圓板部5a之外周部;以及剖面長方形研磨部分5g,沿厚度方向而與凹形研磨部分5b並排設置。基底圓板部5a,由鋁、不鏽鋼等之合金形成,設置有:直形的安裝孔5c,沿厚度方向延伸,使旋轉軸6貫穿其中;以及凹部5d,用於安裝至磨石支持機構7之未圖示的固持部(例如凸緣部)。磨石5之位於外周部的凹形研磨部分5b,由金屬結合磨石或樹脂結合磨石等形成;凹形研磨部分5b之沿著磨石5的旋轉軸6之剖面中的剖面形狀,係從半徑方向外側(外周側)往內側(內周側)凹入的凹形,呈「在厚度方向之兩端部各自具備圓弧狀部分5e,在兩端部的圓弧狀部分5e之間具備具有工件2的厚度以上之厚度的直線部分5f」之形狀。凹形研磨部分5b,並未包含往半徑方向外側突出之凸形的部分。剖面長方形研磨部分5g,於磨石5的厚度方向中位於較凹形研磨部分5b更為外側;剖面長方形研磨部分5g之和工件2相對向的面,於沿著旋轉軸6之剖面中,呈與磨石5的厚度方向平行之直線狀。在圖2,將圓弧狀部分5e與直線部分5f之邊界以假想的線(2點鏈線)顯示。
As shown in FIG. 2 , the grindstone 5 of the workpiece processing device 1 comprises: a base disc portion 5a, which serves as a base; a
針對使用圖1所示之工件加工裝置1的工件加工方法予以說明。圖3A~圖3D係依序示意該工件加工方法之一例的前視圖。如圖3A~圖3D所示,磨石5的厚度遠較工件2的厚度更大。首先,將被加工物,即工件2(例如半導體晶圓),藉由工件支持機構4之吸附構件10吸附固持,使其以旋轉軸3為中心而旋轉。使工件2旋轉,但並未移動。使安裝在磨石支持機構7之磨石5,藉由磨石支持機構7,以旋轉軸6為中心而旋轉,且移動俾使磨石5的外周部抵接於工件2的外周部。作為
一例,如圖3A所示,將安裝在磨石支持機構7的磨石5,配置為剖面長方形研磨部分5g和吸附固持在工件支持機構4之吸附構件10的工件2相對向。使工件2以旋轉軸3為中心而旋轉,且使磨石5以旋轉軸6為中心而旋轉,並使磨石5的剖面長方形研磨部分5g抵接於工件2的外周部而研磨。如此地使用剖面長方形研磨部分5g施行工件2的外周部之粗研磨(粗研),將工件2的徑減小,俾接近期望的大小。使如此地藉由剖面長方形研磨部分5g粗略地研磨後之工件2的外周面,如圖3B所示,抵接於磨石5的凹形研磨部分5b之直線部分5f,施行更精密的研磨(精研),使工件2成為期望之大小(期望之直徑)。
A workpiece processing method using the workpiece processing device 1 shown in FIG. 1 is described. FIG. 3A to FIG. 3D are front views of an example of the workpiece processing method, respectively. As shown in FIG. 3A to FIG. 3D, the thickness of the grindstone 5 is much greater than the thickness of the
而後,使磨石5,移動至工件2之一方的面側(圖3A~圖3D所示之例子為工件2的上方),並持續工件2的旋轉與磨石5的旋轉,如圖3C所示,在使磨石5的外周部抵接於工件2之一方的面之外周部的狀態下,使磨石5對於工件2移動。具體而言,使磨石5,從工件2的厚度方向之中心附近且為半徑方向內側起,往工件2之另一方的面側(圖3A~圖3D所示之例子為底面側)且為半徑方向外側緩緩地移動。藉此,使磨石5之上側的凹形研磨部分5b之圓弧狀部分5e抵接於工件2的外周部之一方的面側(上側)的邊緣而研磨,施行倒角,形成倒角部2a。
Then, the grindstone 5 is moved to one side of the workpiece 2 (the upper side of the
工件2的外周部之上側的邊緣之倒角完成後,使磨石5移動(上升)至一方的面側(圖3A~圖3D所示之例子為上方),俾使磨石5的厚度方向之中心附近和工件2相對向。而後,如圖3D所示,使磨石5的凹形研磨部分5b之圓弧狀部分5e抵接於工件2之另一方的面之外周部,使磨石5上升,並從工件2的半徑方向內側往外側移動。如此地,使旋轉的磨石5之下側的凹形研磨部分5b之圓弧狀部分5e抵接於
工件2的外周部,將工件2研磨,藉以施行工件2的外周部之下側的邊緣之倒角,形成倒角部2a。最後,成為工件2位於較磨石5的凹形研磨部分5b更為外側而磨石5未和工件2接觸之狀態,結束工件2的倒角加工。如圖3A~圖3D所示,於工件2及磨石5的厚度方向中,磨石5,從和工件2的中心相對向之位置起,往一方的面側與另一方的面側(上下)來回移動(往返移動),施行工件2的外周部之上側的邊緣之倒角與下側的邊緣之倒角。工件2的外周部之上側的邊緣之倒角、與下側的邊緣之倒角,皆藉由工件2的半徑方向中之磨石5的同一方向之移動(從工件2的半徑方向內側往外側之移動)而施行。在本實施形態,兩面的倒角部2a,僅藉由使磨石5從工件2的半徑方向內側往外側之單方向的動作形成。例如,如同專利文獻5所記載,使磨石與工件,不僅在工件之前端的直線部,在直線部與倒角部之間的曲面部或兩面的倒角部中亦相對地來回移動(往返移動)而進行研磨,與該方法相較,在本實施形態,可將研磨加工輕易且短時間、效率良好地實施。此外,由於本實施形態之磨石5的凹形研磨部分5b主要為圓弧狀的曲面,故容易配合形成之倒角部2a的形狀及尺寸而計算、設計曲面形狀。另,於一部分的圖式中,為了容易判斷工件2之期望的剖面形狀,而有即便為倒角部2a的形成途中或形成前之幾乎階段,仍圖示了幾近完成的狀態之倒角部2a的形狀之情況。
After the chamfering of the edge on the upper side of the outer periphery of the
參考圖4~圖6,針對此工件加工方法更詳細地予以說明。在本實施形態之加工方法,藉由計算而求出磨石5與工件2之相對移動的移動條件,俾使磨石5之凹形研磨部分5b和工件2的接觸部分沿著工件2之期望的剖面形狀移動。本實施形態之磨石5的尺寸為已知,故用於使磨石5與工件2相對地移動的移動條件,係依據磨石5之凹形研磨部分5b的位於厚度方向之兩端部的圓弧狀部分5e之曲率
半徑而算出。磨石支持機構7或工件支持機構4,遵循如此地算出的移動條件,使磨石5對於工件2相對地移動。例如,將工件2之期望的剖面形狀,表示為在包含工件2的旋轉軸3與磨石5的旋轉軸6之面內的二維座標,以使磨石5和工件2的接觸部分追蹤各座標的點之方式,設定磨石5與工件2的相對移動之移動條件。如此地,在本實施形態,將磨石5與工件2進行NC控制(Numerical Control,數值控制),使其等相對地移動,藉以施行工件2的研磨。
Referring to Fig. 4 to Fig. 6, this workpiece processing method is described in more detail. In the processing method of this embodiment, the moving conditions for the relative movement of the grindstone 5 and the
具體而言,使磨石5的剖面長方形研磨部分5g抵接於工件2的外周部,施行粗研磨(粗研)後,如圖4所示,使磨石5的凹形研磨部分5b之直線部分5f抵接於工件2的外周部,施行更精密的研磨(精研),將工件2的直徑減小。將工件2研磨至工件2的外周部幾近成為直線狀、工件2的直徑成為期望的大小為止。其後,如圖5所示,於工件2之一方的面側(例如上側)中,從預先設定的位置P1,以使工件2之一方的面側(例如上側)之角部沿著磨石5的凹形研磨部分5b之圓弧狀部分5e相對地曲線滑動的方式,使磨石5對於工件2沿厚度方向相對地移動。依據預先算出的移動條件,使磨石5與工件2沿厚度方向與半徑方向相對地適當移動,藉此,磨石5對於工件2相對地追蹤期望的曲線軌跡。而後,在到達至「由工件2的從半徑方向外側往內側之相對移動的開始點P1算起之角度α,成為預先設定的既定角度」之位置P2後,使磨石5與工件2的相對移動量成為一定,使磨石5對於工件2相對地直線移動。藉此,形成工件2之期望的剖面形狀(以2點鏈線圖示)之直線部分。角度α,係在包含工件2的旋轉軸3與磨石5的旋轉軸6之面內從工件2的內周側測定之角度。而後,磨石5相對地移動至工件2的厚度方向之一方的面之外側,和工件2成為非接觸,完成工件2之一方的面之研磨。於工件2之另一方的
面側中,亦如圖6所示,施行將圖5所示的工件2之一方的面側之動作實質上上下反轉的動作,藉此施行工件2之另一方的面之研磨。
Specifically, after rough grinding (rough grinding) is performed by making the cross-sectional rectangular grinding portion 5g of the grindstone 5 abut against the outer periphery of the
磨石5與工件2之大小的差,實際上遠較圖4~圖6所示更大(例如,磨石5的圓弧狀部分5e之曲率半徑為工件2的厚度之數十倍),具有磨石5的圓弧狀部分5e之和工件2的外周面接觸之部分幾近成為直線狀的情況。例如,有可能以「在磨石5移動而移動角度α成為既定大小之時間點(參考圖5、6),磨石5的圓弧狀部分5e,與形成在工件2的倒角部2a之期望的形狀(於圖5、6以2點鏈線圖示)之間產生的間隙小至可忽略之程度,可將工件2的倒角部2a全體研磨為期望的形狀」之方式,和工件2接觸。於此情況,亦考慮省略「在磨石5移動而移動角度α成為既定大小之時間點,中止磨石5的移動,其後使磨石5對於工件2相對地直線移動」之製程。施行更精密的研磨之情況,宜施行「使磨石5曲線地移動直至移動角度α成為既定大小後,使磨石5對於工件2相對地直線移動」之製程。然而,在施行較粗略的研磨作為精密的研磨之前階段的情況,亦可省略「使磨石5曲線地移動直至移動角度α成為既定大小後,使磨石5對於工件2相對地直線移動」之製程,將作業簡化。在本實施形態,磨石5的圓弧狀部分5e之曲率半徑至少為工件2的厚度之10倍以上,俾使磨石5的圓弧狀部分5e,以與工件2之期望的剖面形狀之倒角部2a間實質上不產生間隙的方式抵接於工件2。
The difference in size between the grindstone 5 and the
如此地,在本實施形態,遵循預先算出的移動條件使磨石5與工件2相對地移動,藉此,使磨石5和工件2的接觸部分,追蹤依據工件2之期望的剖面形狀而算出之移動軌跡。其結果,可將工件2形成為期望的剖面形狀。此外,在施行種
類不同之工件2的加工之情況,配合新加工的工件2之期望的剖面形狀,算出用於將該工件2加工的移動條件。此時,依據磨石5的圓弧狀部分5e之曲率半徑將移動條件算出,故可使用同一磨石5,將各種形狀之工件2正確地加工。
Thus, in this embodiment, the grinding stone 5 and the
針對本實施形態之效果予以說明。在專利文獻6、10記載之習知的加工方法中,構造上,難以使用太大(大徑)的磨石,故必須以小(小徑)的磨石施行加工。其結果,磨石的使用壽命短、磨石的更換或修整之施行頻率高。然而,在本實施形態,磨石5及磨石支持機構7干擾到其他構件(具體而言,工件支持機構4)之疑慮小,故構造上的限制小,可使用大(大徑)的磨石5將工件2加工。因此,磨石5的使用壽命長、磨石5的更換或修整之頻率低。此外,在專利文獻6、10記載之加工方法中,磨石的旋轉方向,與對於工件之相對的移動方向,實質上一致(皆為工件2的厚度方向)。因此,若在磨石之外周部存在大的凹凸部,則容易因磨石的旋轉而在工件之外周面產生沿著旋轉方向(工件的厚度方向)的線狀痕。該磨石旋轉,並對於工件沿與旋轉方向相同的方向(亦即,與線狀痕實質上平行的方向)相對地移動,故線狀痕並未消失,容易殘留。磨石的使工件之外周面產生線狀痕的部分(大的凹凸部),沿工件的厚度方向相對移動,其在工件之周向的位置維持未改變。因此,於工件,可能殘留未與該大的凹凸部抵接而並未深刻地研磨至與線狀痕相同之程度的部分。其結果,即便磨石移動,線狀痕仍未消失,容易殘留。另,雖工件沿與磨石的旋轉方向正交之方向旋轉,但藉由工件的旋轉而在周向移動之長度,遠較磨石與工件沿工件的厚度方向相對移動之長度更長。磨石,施行工件的全周之研磨、及往工件的厚度方向之相對移動,故為了使工件的加工時間不成為太長,必須使磨石對於工件沿工件的厚度方向相對地移動
之速度不成為太慢。工件的抵接於磨石之部分,其工件的周向之寬度窄,為了使磨石對於工件沿工件的厚度方向相對地移動之速度不成為太慢,需要將工件的旋轉速度(周向的移動速度)加快,將磨石抵接於工件的全周而研磨所需之時間減短。由於如此地將工件的旋轉速度加快,即便工件與磨石往彼此正交之方向旋轉,研磨後之工件的表面粗糙度仍變得粗糙。相對於此,在本實施形態,磨石5的旋轉方向,與對於工件2之相對的移動方向,實質上正交。磨石5的旋轉方向為工件2的周向,相對移動方向為工件2的厚度方向。若磨石5的外周部存在大的凹凸部,則因磨石5的旋轉,在工件2的外周面產生沿著周向之線狀痕。由於該磨石5旋轉,並對於工件2,沿與旋轉方向正交的方向(亦即與線狀痕實質上正交的方向)相對地移動,故線狀痕不易殘留。由於磨石5的使工件2之外周面產生線狀痕的部分(大的凹凸部),沿周向旋轉,並沿與線狀痕正交的方向移動,故該大的凹凸部依序抵接於工件2的外周面之幾近全體。因此,工件2的外周面之幾近全體,藉由該大的凹凸部,深刻地研磨至與線狀痕相同之程度。如此地,由於磨石5的旋轉方向,與對於工件2之相對的移動方向實質上正交,故在工件2的外周面產生之線狀痕容易消失而變得平滑。另,在此構成中,即便工件2的旋轉速度快,由於磨石5的旋轉方向(工件2的周向)與磨石5的相對移動方向(工件2的厚度方向)正交、相對移動距離短,即使磨石5沿工件2的厚度方向非常緩慢地相對移動,加工時間仍不至於如此長。因此,使磨石5之工件2的厚度方向之相對移動速度較緩慢,將工件2的全周充分地研磨,藉此,可使研磨後之工件的表面粗糙度良好。
The effect of this embodiment is explained. In the known processing methods described in patent documents 6 and 10, it is difficult to use a grindstone that is too large (large diameter) due to the structure, so a small (small diameter) grindstone must be used for processing. As a result, the service life of the grindstone is short, and the frequency of replacement or repair of the grindstone is high. However, in this embodiment, there is little concern that the grindstone 5 and the grindstone support mechanism 7 interfere with other components (specifically, the workpiece support mechanism 4), so there are few structural restrictions, and a large (large diameter) grindstone 5 can be used to process the
在專利文獻5記載之習知的加工方法中,使工件沿著磨石的外形相對地移動,藉此施行研磨,故加工後之工件的形狀,由磨石的外形(尤其是磨石的曲線狀或直線狀之傾斜面的形狀、角度)決定。因此,為了形狀不同之工件,必須更換磨石。相對於此,在本實施形態,磨石5與工件2的相對移動,並非沿著磨石5的外形進行,而係遵循考慮磨石5之凹形研磨部分5b的圓弧狀部分5e之曲率半徑所所算出的移動條件而進行。因此,形狀不同之工件2時,變更移動條件即可,無須更換磨石5。亦即,能夠以不更換磨石5的方式,使用同一磨石5形成各種形狀之工件2。移動條件,係藉由依據磨石5之凹形研磨部分5b的圓弧狀部分5e之曲率半徑等的計算而求出,由於磨石5與工件2之相對的移動係依據該移動條件受到數值控制,故加工精度良好。如此地,依本實施形態,則可達到下述等諸多優良效果:可藉由同一磨石5形成各種形狀之工件2,且加工精度良好,進一步,磨石5的使用壽命長。
In the known processing method described in patent document 5, the workpiece is relatively moved along the outer shape of the grindstone to perform grinding, so the shape of the workpiece after processing is determined by the outer shape of the grindstone (especially the shape and angle of the curved or straight inclined surface of the grindstone). Therefore, in order to produce workpieces of different shapes, the grindstone must be replaced. In contrast, in this embodiment, the relative movement of the grindstone 5 and the
依本實施形態之加工裝置及加工方法,則如圖7A所示,外周部係藉由一對圓弧狀部分及將其等連接的直線部分形成之所謂的T形之工件2,以及如圖8所示,外周部為半圓狀之所謂的R形之工件2,皆可精度良好地形成。圖7A所示的T形之工件2的情況,藉由依據了「外周部的一對圓弧狀部分各自之曲率半徑R1與R2、和各圓弧狀部分分別連結的直線傾斜面部分之長度Y1與Y2、此等傾斜面部分之相對於工件2的表面之角度θ1與θ2、一對圓弧狀部分之間的直線部分之長度C0、以及圖7A未顯示的磨石5之凹形研磨部分5b的圓弧狀部分5e之曲率半徑」的計算求出移動條件,並遵循該移動條件而施行加工。圖8所示的R形之工件2的情況,藉由依據了「外周部之半圓形的部分之半徑R、從半圓形的部分起分別連結至兩
側的直線傾斜面部分之長度Y1與Y2、此等傾斜面部分之相對於工件2的表面之角度θ1與θ2、以及圖8未顯示的磨石5之凹形研磨部分5b的圓弧狀部分5e之曲率半徑」的計算求出移動條件,並遵循該移動條件施行加工。如此地,圖7A所示的T形之工件2、與圖8所示的R形之工件2,皆可藉由依據了「圖示之期望的剖面形狀的各部之尺寸、及磨石5之凹形研磨部分5b的圓弧狀部分5e之曲率半徑」的計算求出移動條件,並以遵循該移動條件之數值控制精度良好地加工。
According to the processing device and processing method of this embodiment, as shown in Figure 7A, a so-called T-shaped
在本實施形態,磨石支持機構7,可藉由調整工件2的半徑方向中之倒角加工開始前的磨石5之位置(亦即磨石5開始接觸工件2之位置),及倒角加工結束時的磨石5之位置(亦即磨石5結束與工件2的接觸之位置),而調整倒角部2a之大小。此外,可在考慮了如此地調整後的倒角部2a之大小、及藉由磨石5研磨工件2之速度後,調整磨石支持機構7使磨石5上升或下降之速度、及沿工件2的半徑方向移動之速度,藉以調整工件2的倒角部2a之角度、形狀等。進一步,依磨石5的外周部之曲線部中的哪個部分接觸工件並研磨,而改變磨石5的相對於工件2之接觸角度,故可調整工件2的倒角部2a之角度、形狀等。如此地,主要藉由控制磨石支持機構7所進行之磨石5的移動,而可實現工件2的倒角部2a之期望的形狀或尺寸。因此,磨石支持機構7,宜藉由數值控制(NC控制)將磨石5驅動。
In the present embodiment, the grinding stone support mechanism 7 can adjust the size of the chamfered
本實施形態之磨石5具備凹形研磨部分5b,藉由此凹形研磨部分5b施行工件2的倒角等之研磨,故可穩定地進行流暢的研磨,且可使磨石5低成本化並延長使用壽命。例如,雖未圖示,但在如專利文獻11記載之構成般地使磨石具備凸形研磨部分,藉由該凸形研磨部分施行工件的倒角等之研磨的情況,在使凸形
研磨部分抵接於工件之狀態下,使磨石的中心(旋轉軸)與工件的中心(旋轉軸)以彼此接近之方式相對移動,並施行研磨。由於此係磨石與工件碰撞之方向的相對移動,故研磨中之碰撞及振動大,對磨石及工件分別施加的負載大。此外,具備凸形研磨部分之磨石,重量較大、慣性矩亦較大。相對於此,本實施形態之磨石5,具備凹形研磨部分5b,在使凹形研磨部分5b抵接於工件2之狀態下,使磨石5的中心(旋轉軸6)與工件2的中心(旋轉軸3)往彼此遠離之方向相對移動,並施行研磨。此一方式,相較於磨石5與工件2的往碰撞之方向的相對移動,研磨中之碰撞及振動較小、對磨石5及工件2分別施加的負載較小、研磨面變得漂亮。此外,與凸形研磨部分相較,研磨所實際使用之部分具有相同程度的大小之凹形研磨部分5b,可小型化及輕量化,可將慣性矩亦減小。此一方式,亦有助於減少研磨中之振動。在如此地藉由磨石5的凹形研磨部分5b施行工件2的倒角等之研磨的構成中,由於振動、負載小,故劣化緩慢、使用壽命延長。此一方式,帶來磨石5的製作成本降低。
The grindstone 5 of this embodiment has a
例如如同專利文獻11記載之構成般地藉由磨石的凸形研磨部分施行工件的倒角等之研磨的情況,凸形研磨部分和工件的接觸部分幾近為點接觸。然而,如同本實施形態般地藉由磨石5的凹形研磨部分5b施行工件2的倒角等之研磨的情況,凹形研磨部分5b和工件2的接觸部分為面接觸,可效率良好而穩定地研磨,研磨面變得漂亮。
For example, when the chamfering of the workpiece is performed by the convex grinding part of the grindstone as in the configuration described in patent document 11, the contact part between the convex grinding part and the workpiece is almost point contact. However, when the chamfering of the
此外,在磨石具備凸形研磨部分,藉由該凸形研磨部分施行工件之研磨的情況,即便為了流暢地施行研磨,將研磨水(冷卻劑)供給至磨石和工件的接觸部
分,研磨水仍不易保存在磨石和工件的接觸部分。因此,不易施行效率良好而流暢之研磨,需要大量的研磨水。相對於此,在本實施形態,磨石5具備凹形研磨部分5b,藉由該凹形研磨部分5b施行工件2之研磨的情況,供給至磨石5和工件2的接觸部分之研磨水,於凹形研磨部分5b之內側中保存在磨石5和工件2的接觸部分。因此,可輕易施行效率良好而流暢之研磨,以少量的研磨水使用量即可完成,可流暢地研磨而不發生網孔堵塞、過度摩擦或發熱。
Furthermore, when the grindstone has a convex grinding portion and the workpiece is ground by the convex grinding portion, even if grinding water (coolant) is supplied to the contact portion between the grindstone and the workpiece in order to perform smooth grinding, the grinding water is not easy to be retained in the contact portion between the grindstone and the workpiece. Therefore, it is not easy to perform efficient and smooth grinding, and a large amount of grinding water is required. In contrast, in the present embodiment, the grindstone 5 has a
如此地,本實施形態之磨石5,藉由具備凹形研磨部分5b而非凸形研磨部分,而具有許多優點。過去,雖亦曾使用具備凹形研磨部分之磨石,但習知的凹形研磨部分,如圖9所示,具有所謂的成型溝16a,即與期望的研磨後之工件的形狀互補之形狀的溝。使用習知的具有成型溝16a之磨石16的加工方法之情況,於磨石16之特定部位,例如成型溝16a的內周面中工件2最早抵接到之部分P3,發生磨耗或損傷的可能性高。若施行多個工件2的加工,則於該部分P3發生磨耗或損傷,造成成型溝16a之形狀改變,因而若使用該磨石16將工件2加工,則加工精度變低。於此情況,必須進行磨石16的更換或修整。相對於此,在本實施形態,具備遠較工件2更大的凹形研磨部分5b,使磨石5的凹形研磨部分5b之各種部位抵接於工件2而進行研磨,故不存在僅於特定部位特別容易發生磨耗或損傷之情形。因此,磨石5的使用壽命較長。進一步,在本實施形態,另行設置與凹形研磨部分5b不同的剖面長方形研磨部分5g,使用此剖面長方形研磨部分5g,施行用於使工件2的大小接近期望的大小之粗研磨。藉此,抑制凹形研磨部分5b的直線部分5f之過度的磨耗或損傷,追求磨石5之使用壽命延長。然而,剖面長
方形研磨部分5g,並非為本發明之必須構成要件,亦可成為僅藉由凹形研磨部分5b的直線部分5f施行用於使工件2成為期望的直徑之研磨的構成。
As such, the grindstone 5 of the present embodiment has many advantages by having a
另,前述實施形態之構成,係磨石支持機構7使磨石5旋轉並移動,工件支持機構4使工件2旋轉但不移動之構成,並未限定於此等構成。亦即,亦可成為磨石支持機構7僅使磨石5旋轉而不移動,工件支持機構4使工件2旋轉,且藉由數值控制使工件2移動之構成。於此情況,工件支持機構4,在對於磨石5及工件2平行之面內(與旋轉軸3及旋轉軸6正交之面內),可使工件2往工件2接近磨石5的方向、或遠離磨石5的方向,且在對於磨石5及工件2呈正交之面內(與旋轉軸3及旋轉軸6平行之面內),可使工件2往工件2接近磨石5的方向、或遠離磨石5的方向移動。因此,工件2,藉由工件支持機構4,至少在包含旋轉軸3、6之面內,可對於磨石5從任意方向接近,並可往任意方向遠離。在此構成中,亦可使工件2與磨石5相對地移動,俾使工件2與磨石5成為與圖3A~圖6所示之各製程相同的位置關係,可實施與圖3A~圖6所示之加工方法相同的加工。
In addition, the configuration of the above-mentioned embodiment is a configuration in which the grindstone support mechanism 7 rotates and moves the grindstone 5, and the workpiece support mechanism 4 rotates but does not move the
在本實施形態,使磨石5與工件2,往相同或完全相反之方向旋轉,而非彼此正交之方向,故磨石5的旋轉與工件2的旋轉產生協同效應,無須使磨石5本身之旋轉速度太快。因此,磨石支持機構7,亦可不為可高速旋轉驅動之機構,可追求構造的簡化、低成本化。此外,由於使工件2與磨石5平行地旋轉並施行研磨,故可將工件2的倒角部之表面粗糙度減小。
In this embodiment, the grinding stone 5 and the
依本實施形態,則磨石5對於工件2平行地配置,故可將磨石5增大而不使磨石5干擾到工件支持機構4。藉此,可使用大型磨石5將工件2的外周部形成為任意剖面形狀,而不使包含磨石支持機構7之工件加工裝置1的構成變得複雜。此外,藉由使用大型磨石5,可使加工效率良、減短加工時間,且可利用磨石5的外周部之廣大範圍進行加工,故磨石5的使用壽命增長。進一步,在使用形成有和完成狀態之工件2的形狀相對應之形狀的溝16a(成型溝)之磨石16進行加工的情況,容易發生與倒角加工前之工件2的邊緣抵接之溝16a的內周面(尤其是傾斜面P3的部分)之磨耗或破損,但在本實施形態,並非為對於倒角加工前之工件2的邊緣僅使磨石5之特定一部位持續抵接之構成,故不易發生磨石5之破損,使用壽命長。
According to this embodiment, the grindstone 5 is arranged parallel to the
將工件2插入至設置於磨石16的成型溝16a內而加工之情況,可形成特定形狀及尺寸的倒角部,但為了形成不同形狀及尺寸的倒角部,必須更換為具有不同的溝16a之磨石16。然而,依本實施形態,則使具備凹形研磨部分5b之磨石5對於工件2相對地移動,施行倒角,故藉由以數值控制將磨石5的移動路徑變更,而可將形成之倒角部2a的形狀或尺寸變更。亦即,可藉由單一的磨石5,形成各種形狀及尺寸之倒角部2a。
When the
於圖10顯示圖1及圖2所示意之磨石5及磨石支持機構7的詳細構成例。此變形例之磨石5,例如具備:金屬製的基底圓板部5a;凹形研磨部分5b,位於基底圓板部5a的外周部,由樹脂結合磨石形成;以及剖面長方形研磨部分5g,沿厚度方向而與凹形研磨部分5b並排設置。基底圓板部5a,由鋁、不鏽鋼等之合金
形成,設置有使旋轉軸6貫穿其中的安裝孔5c、以及凹部5d。凹形研磨部分5b係從外周側往內周側凹入的凹形,具備:圓弧狀部分5e,係厚度方向之兩端部;以及直線部分5f,位於圓弧狀部分5e之間,具有工件2的厚度以上之厚度。剖面長方形研磨部分5g,於磨石5的厚度方向中位於較凹形研磨部分5b更為外側,其和工件2相對向的面呈與磨石5的厚度方向平行之直線狀。
FIG10 shows a detailed configuration example of the grindstone 5 and grindstone support mechanism 7 shown in FIG1 and FIG2. The grindstone 5 of this modified example, for example, comprises: a base disk portion 5a made of metal; a
圖10所示之磨石支持機構7,具備殼體7a、旋轉軸承部7b、主軸7c、凸緣部7d、及螺栓7e。藉由配置於殼體7a內之旋轉軸承部7b,將主軸7c以可旋轉的方式支持。在主軸7c的往殼體7a之外側突出的前端安裝有凸緣部7d,藉由螺栓7e將凸緣部7d固定於主軸7c。而後,使殼體7a貫穿磨石5的凹部5d,將磨石5的安裝孔5c固定在凸緣部7d。若藉由未圖示之驅動手段將主軸7c旋轉,則凸緣部7d及磨石5,與主軸7c一體地旋轉。亦即,主軸7c成為磨石支持機構7的旋轉軸6。以使磨石5的重心,位於係安裝該磨石5的安裝位置即凸緣部7d,與支持主軸7c的旋轉軸承部7b之間的方式,支持磨石5。如此地,藉由使磨石5的重心,位於磨石5的安裝位置(凸緣部7d)與旋轉軸承部7b之間,而使磨石5的支持及旋轉穩定。 The grindstone support mechanism 7 shown in FIG. 10 includes a housing 7a, a rotary bearing 7b, a main shaft 7c, a flange 7d, and a bolt 7e. The main shaft 7c is supported in a rotatable manner by the rotary bearing 7b disposed in the housing 7a. The flange 7d is mounted on the front end of the main shaft 7c protruding outward from the housing 7a, and the flange 7d is fixed to the main shaft 7c by the bolt 7e. Then, the housing 7a is passed through the recess 5d of the grindstone 5, and the mounting hole 5c of the grindstone 5 is fixed to the flange 7d. If the main shaft 7c is rotated by a driving means not shown in the figure, the flange 7d and the grindstone 5 rotate integrally with the main shaft 7c. That is, the main shaft 7c becomes the rotating shaft 6 of the grindstone supporting mechanism 7. The grindstone 5 is supported in such a manner that the center of gravity of the grindstone 5 is located between the flange 7d, which is the mounting position of the grindstone 5, and the rotating bearing 7b supporting the main shaft 7c. In this way, by positioning the center of gravity of the grindstone 5 between the mounting position of the grindstone 5 (the flange 7d) and the rotating bearing 7b, the support and rotation of the grindstone 5 are stabilized.
在本實施形態,施行2階段的研磨製程:用於將工件2的半徑減小之研磨、以及為了將工件2形成為期望的剖面形狀而施行工件2的外周部之兩面的倒角之研磨。一般而言,前者之研磨為粗研磨,後者之研磨為精密研磨。精密研磨與粗研磨為相對的表現,相較於粗研磨,精密研磨係形狀尺寸精度更高、研磨後的面之表面粗糙度成為更小的研磨。於本實施形態之磨石5,在基底圓板部5a的外周部,設置有:凹形研磨部分(精密研磨部分)5b,主要使用在用於將工件2形
成為期望的剖面形狀之研磨;以及剖面長方形研磨部分(粗研磨部分)5g,主要使用在用於將工件2的半徑減小之研磨。
In this embodiment, a two-stage grinding process is performed: grinding for reducing the radius of the
在本實施形態,將未加工之工件2裝設於工件支持機構4,使其旋轉;使安裝在磨石支持機構7之磨石5,以旋轉軸6(主軸7c)為中心而旋轉,並如圖3A所示,使剖面長方形研磨部分5g抵接於工件2的外周部。藉此,將工件2的外周部粗研磨,使工件2的外徑成為期望的大小。接著,如圖3B所示,使磨石5的凹形研磨部分5b之直線部分5f抵接於工件2的外周部,將工件2的外周部精密研磨,使工件2的外周部之厚度方向的中間部平滑化。而後,如圖3C~3D所示,使磨石5的凹形研磨部分5b之圓弧狀部分5e抵接於工件2的外周部,施行工件2之兩面的邊緣之倒角,將工件2形成為期望的剖面形狀。本實施形態之剖面長方形研磨部分5g,為磨石粒度較粗之部分;凹形研磨部分5b的磨石粒度較細,為施行較剖面長方形研磨部分5g所進行之用於將工件2的半徑減小之研磨更精密的研磨之部分。在本實施形態,除了前述效果以外,進一步獲得如下效果:藉由2階段之研磨製程施行倒角的情況,可僅藉由單一的磨石5輕易地施行兩製程,製程簡單且成本低。
In this embodiment, the
一般在施行半導體晶圓等工件2的倒角之情況,藉由磨石將工件2的外周面研磨,將半徑減小,將工件2的不需要之部分去除並使其成為期望的大小,並調整外形,且施行定心。其後,藉由磨石,在工件2形成倒角部2a。假設在藉由一個凹形研磨部分施行此等研磨之情況,前階段的用於將工件2的半徑減小之研磨(粗研磨),主要藉由使磨石的凹形研磨部分之厚度方向的中心附近之部位抵接於
工件2而施行。後階段的用於形成倒角部2a之研磨(精密研磨),係藉由使凹形研磨部分之厚度方向的兩端之圓弧狀部分抵接於工件2而施行。通常,用於將工件2的半徑減小之研磨,研磨量(研磨的體積)較用於形成倒角部2a之研磨更大。因此,凹形研磨部分之厚度方向的中心附近之部位,磨耗較厚度方向的兩端之圓弧狀部分更為劇烈,造成凹形研磨部分的全體形狀破壞。其結果,具有工件2的加工精度降低之疑慮。相對於此,在本實施形態,用於將工件2的半徑減小之研磨,主要藉由剖面長方形研磨部分5g施行;用於使半徑變小後之工件2的外周面平滑化之研磨,可藉由凹形研磨部分5b的直線部分5f施行;用於形成工件2的倒角部2a之研磨,可藉由凹形研磨部分5b的圓弧狀部分5e施行。亦即,可將用於將工件2的半徑減小之研磨、用於使工件2的外周面平滑化之研磨、及用於形成倒角部2a之研磨,藉由磨石5之不同的部位施行。剖面長方形研磨部分5g之形狀及尺寸,與凹形研磨部分5b的直線部分5f及圓弧狀部分5e之形狀及尺寸,可各自獨立管理,即便各自的磨耗量不同,藉由將加工條件適當地調整,仍可施行良好的加工。此外,凹形研磨部分5b的圓弧狀部分5e較為均等地磨耗,並未發生「僅使用在主要用於形成倒角部2a之研磨,相較於其他部分,僅一部分(例如厚度方向的中心附近之部位)發生顯著較大的磨耗」之情況。因此,磨石的凹形研磨部分5b之形狀無大幅變化,可抑制工件2的加工精度之降低。剖面長方形研磨部分5g受到大量磨耗,但由於和工件2相對向的面呈與和磨石5的厚度方向平行之直線狀,係單純的形狀,故即便發生磨耗,加工精度仍未下降太多。
Generally, when chamfering a
另,雖未圖示,但可不使用凸緣部地,將構成旋轉軸6的主軸7c之錐狀部分,插入至設置於磨石5之錐形的安裝孔5c內,將螺帽等固定構件安裝至從基底圓板 部5a突出的主軸7c之前端,藉此,將磨石5,以固定在構成旋轉軸6的主軸7c而可與主軸7c一同的方式支持。如此一來,則本實施形態之磨石支持機構7中,可省略凸緣部而將磨石5穩定地固定在構成旋轉軸6的主軸7c,且可抑制磨石5之對於旋轉軸6(主軸7c)的偏心。 In addition, although not shown, the tapered portion of the main shaft 7c constituting the rotating shaft 6 can be inserted into the tapered mounting hole 5c provided in the grindstone 5 without using the flange, and a fixing member such as a nut can be installed on the front end of the main shaft 7c protruding from the base circular plate part 5a, thereby fixing the grindstone 5 to the main shaft 7c constituting the rotating shaft 6 and supporting it together with the main shaft 7c. In this way, in the grindstone support mechanism 7 of this embodiment, the flange can be omitted and the grindstone 5 can be stably fixed to the main shaft 7c constituting the rotating shaft 6, and the eccentricity of the grindstone 5 with respect to the rotating shaft 6 (main shaft 7c) can be suppressed.
如圖1、及圖3A~圖3D所示,本實施形態之工件支持機構4,具備僅將工件2之單側的面(例如鉛直方向底面)2b吸附之吸附構件10。因此,如圖3B、圖3C、圖3D所示地藉由磨石5的凹形研磨部分5b之圓弧狀部分5e施行用於形成工件2的倒角之研磨時,必須避免吸附構件10抵接於圓弧狀部分5e。吸附構件10的平面形狀為半徑較工件2之半徑更小的圓形;圓形之吸附構件10的外周部分,具有厚度越往外側越變薄之前端較薄形狀10a。吸附構件10之半徑r1,若由工件2之期望的剖面形狀之半徑r2與工件2之厚度t表示,則宜為r2-10t≦r1≦r2-5t。吸附構件10之前端較薄形狀10a的角度θ1,若由工件2之期望的剖面形狀之倒角部2a的角度θ2表示,則宜為θ2-10≦θ1≦θ2+5。圓弧狀部分5e的位於工件2之藉由吸附構件10吸附的面(例如鉛直方向底面)2b側之長度,如同圖11所示意,在沿著磨石5的旋轉軸6之剖面中,未滿下述長度:和工件2之前述面(例如鉛直方向底面)2b側的端部,在該圓弧狀部分5e的切線以與吸附構件10之前端較薄形狀10a的角度θ3一致之角度θ3延伸的位置(圖11的點A)中接觸之狀態下,抵接於吸附構件10之前端較薄形狀10a的長度。在圖11所示意之狀態下,圓弧狀部分5e之點A上的切線,從水平方向傾斜θ3,與吸附構件10之前端較薄形狀10a的底面平行。在此狀態下,假設若圓弧狀部分5e,延伸至吸附構件10之前端較薄形狀10a的底面與圓弧狀部分5e抵接之點D,則無法進行更進一步的研磨製程。因此,圓弧狀部分5e的長度,
未滿到達至點D的長度。使此點D上的切線之從水平方向算起的傾斜角度為θ4,使圓弧狀部分5e之曲率半徑為r。於圖11,作為圓弧狀部分5e之通過點A、D的半徑(與各點上之切線正交的半徑)各自對於垂直方向所夾之角度,分別顯示角度θ3、θ4。此處,已知角度θ3為吸附構件10之前端較薄形狀10a的尺寸。因而,將磨石5的圓弧狀部分5e之曲率半徑r,與表示圓弧狀部分5e之長度的極限點之角度θ4的關係,如同以下地表示。另,繪出與圓弧狀部分5e之點A上的切線平行(亦即與通過點A的半徑正交)且通過點D之直線時,使從該直線起,沿著通過點A的半徑至到達點A為止之距離為r’。
As shown in FIG. 1 and FIG. 3A to FIG. 3D, the workpiece support mechanism 4 of this embodiment has an adsorption member 10 that adsorbs only a single side surface (e.g., the bottom surface in the vertical direction) 2b of the
r cos(θ3-θ4)=r-r’ r cos( θ 3- θ 4) = r - r'
θ3-θ4=cos-1[(r-r’)/r] θ 3- θ 4=cos -1 [( r - r' )/ r ]
θ4=θ3-cos-1[(r-r’)/r] θ 4= θ 3-cos -1 [( r - r' )/ r ]
藉由此等計算,可設定用於使圓弧狀部分5e具有未滿下述長度之條件:和工件2之底面側的端部,在該圓弧狀部分5e的切線以與吸附構件10之前端較薄形狀10a的角度θ3一致之角度θ3延伸的位置中接觸之狀態下,抵接於吸附構件10之前端較薄形狀10a的長度。
By such calculations, a condition can be set for making the arc-shaped
在如此地求出角度θ4的計算中,使用從與圓弧狀部分5e之點A上的切線平行(與通過點A的半徑正交)且通過點D之直線起,沿著通過點A的半徑至到達點A之距離r’。可將此距離r’如同下述地求出。此處,使期望的剖面形狀之工件2的半徑與吸附構件10之半徑的差為L。而後,將該距離L分割為三段,使較與通過圓弧狀部分5e之點A的半徑之交點更為外周側的長度為R2。其與圖7A、圖8所示的工件2之期望的剖面形狀之下側的曲線部之曲率半徑一致。此外,將從距離L除去
長度R2以外的部分,以與圓弧狀部分5e之點A上的切線平行(與通過點A的半徑正交)且通過點D之直線的交點為中心,分割為兩段,使其內周側之部分的長度為x1,使外周側之部分的長度為x2。使成為長度x1之部分與長度x2之部分的分隔點之交點起至工件2的底面為止之距離為B2。使吸附構件10之從與工件2的底面接觸之面起至其下方之前端較薄形狀10a為止的距離為T。使圖7A、圖8所示的工件2之期望的剖面形狀之從底面側的圓弧狀部分5e之開始點起至工件2的底面為止的距離為B2。
In the calculation for obtaining the angle θ4 in this way, the distance r' from the straight line that is parallel to the tangent line at point A of the arc-shaped
x1 tan θ3=T+B2
x 1 tan θ 3 = T +
x1=(T+B2)/tan θ3 x 1 = ( T + B 2) / tan θ 3
x2=L-R2-x1=L-R2-(T+B2)/tan θ3 x 2= L - R 2- x 1= L - R 2-( T + B 2)/tan θ 3
’=R2+x2 sin θ3=R2+[L-R2-(T+B2)/tan θ3]sin θ3
' =
將如此地求出的r’,代入至前述求算角度θ4之數學式,藉此,依據圖7A、圖8所示的工件2之期望的剖面形狀之尺寸(即曲率半徑R2及距離B2)、吸附構件10之已知尺寸(即距離T及前端較薄形狀10a之角度θ3)、由工件2之期望的剖面形狀之尺寸與吸附構件10之已知尺寸求出的距離L、及磨石5的圓弧狀部分5e之曲率半徑r,求出用於決定圓弧狀部分5e的長度上限之角度θ4。
Substituting the thus obtained r' into the mathematical formula for calculating the angle θ4, the angle θ4 for determining the upper limit of the length of the arc-shaped
另一方面,如圖7A、圖8所示,求出為了形成工件2的倒角部2a之投影在水平方向的長度A2所需之圓弧狀部分5e的長度。若將圓弧狀部分5e的長度為必要最小限度之情況的角度θmax,使用工件2的倒角部2a之對於水平方向所夾的角度θ2、及曲線部分之曲率半徑R2表示,則如同下述。
On the other hand, as shown in Fig. 7A and Fig. 8, the length of the arc-shaped
A2=R2-R2sin θ2+r tan(θ2-θ max )×cos θ2=R2(1-sin θ2)+r tan(θ2-θ max )×cos θ2
A 2= R 2-
[A2-R2(1-sin θ2)]/r cos θ2=tan(θ2-θ max ) [ A 2- R 2(1-sin θ 2)]/ r cos θ 2=tan( θ 2- θ max )
θ2-θ max =tan-1{[A2-R2(1-sin θ2)]/r cos θ2} θ 2- θ max =tan -1 {[ A 2- R 2(1-sin θ 2)]/ r cos θ 2}
θ max =θ2-tan-1{[A2-R2(1-sin θ2)]/r cos θ2} θ max = θ 2-tan -1 {[ A 2- R 2(1-sin θ 2)]/ r cos θ2 }
藉由此等計算,可設定用於使圓弧狀部分5e具有下述長度的條件:期望的剖面形狀之工件2的底面側之倒角部2a的長度以上。依據圖7A、圖8所示的工件2之期望的剖面形狀之尺寸,即曲率半徑R2、角度θ2、及距離A2,求出用於決定圓弧狀部分5e的長度下限之角度θmax。
By such calculations, it is possible to set a condition for making the arc-shaped
磨石的圓弧狀部分5e,藉由成為在如同以上地計算而求出之從垂直方向算起的角度θmax與角度θ4之間的範圍內終止之構成,而可將工件2精度良好地加工為期望的剖面形狀。此一關係,無論角度θ2與角度θ3之大小關係皆可適用。另,以上說明,係在藉由吸附構件10將工件2的底面吸附之構成中,將藉由磨石5將工件2的底面良好地研磨所用之條件,依據「期望的剖面形狀之工件2的下側之各部的尺寸、及磨石5之下側的圓弧狀部分5e之各部的尺寸」而求出。關於藉由吸附構件10將工件2的頂面吸附之構成,可依據「期望的剖面形狀之工件2的上側而非下側之各部的尺寸、及磨石5之上側而非下側的圓弧狀部分5e之各部的尺寸」,藉由與前述計算實質上相同之方法,求出藉由磨石5將工件2的頂面良好地研磨所用之條件。
The arc-shaped
接著,針對本發明的第2實施形態予以說明。圖12係顯示本實施形態之工件加工裝置1的磨石5的剖面圖。本實施形態之磨石5,與第1實施形態之磨石5同樣地,具備:基底圓板部5a;凹形研磨部分5b,位於基底圓板部5a之外周部;以及剖面長方形研磨部分5g,沿厚度方向而與凹形研磨部分5b並排設置。基底圓板部5a及剖面長方形研磨部分5g,與第1實施形態之基底圓板部5a及剖面長方形研磨部分5g實質上為相同構成,故將說明省略。凹形研磨部分5b之在沿著磨石5的旋轉軸6之剖面中的剖面形狀,係從半徑方向外側(外周側)往內側(內周側)凹入的凹形,至少在厚度方向之兩端部各自具備:圓弧狀部分5e;以及斜面部分5h,位於較圓弧狀部分5e更為厚度方向外側,與圓弧狀部分5e連續地連結。於兩端部的圓弧狀部分5e之間,設置了具有工件2的厚度以上之厚度的直線部分5f。在「圓弧狀部分5e的切線對於水平方向傾斜之角度」,與「期望的剖面形狀之工件2的倒角部2a之對於水平方向所夾之角度θ2」一致的點B中,由圓弧狀部分5e轉變為斜面部分5h。因此,斜面部分5h對於水平方向以角度θ2延伸。
Next, the second embodiment of the present invention will be described. FIG. 12 is a cross-sectional view showing a grindstone 5 of a workpiece processing device 1 of the present embodiment. The grindstone 5 of the present embodiment, like the grindstone 5 of the first embodiment, comprises: a base disc portion 5a; a
本實施形態中,求出在藉由吸附構件10將工件2之單側的面(例如鉛直方向底面)吸附之狀態下,使該面抵接於磨石5而良好地施行研磨所用之條件。斜面部分5h的位於工件2之藉由吸附構件10吸附的面(例如鉛直方向底面)側之長度,如同圖13所示意,在沿著磨石5的旋轉軸6之剖面中,未滿下述長度:和工件2的前述面(例如鉛直方向底面)2b側之端部,在該圓弧狀部分5e的切線以與吸附構件10之前端較薄形狀10a的角度θ3一致之角度θ3延伸的位置(圖13的點A)中接觸的狀態下,斜面部分5h抵接於吸附構件10之前端較薄形狀10a的長度。在圖13所示意之狀態下,圓弧狀部分5e之點A上的切線,從水平方向傾斜θ3,與吸附構件10之前
端較薄形狀10a的底面平行。在此狀態下,若斜面部分5h,延伸至吸附構件10之前端較薄形狀10a的底面與斜面部分5h抵接之點E,則無法進行更進一步的研磨。因此,斜面部分5h的長度,未滿到達至點E的長度。使從圓弧狀部分5e之曲率中心起延伸至點E的直線之對於垂直方向所夾的角度為θ5。繪出與圓弧狀部分5e之點A上的切線平行(亦即與通過點A的半徑正交)且通過點E之直線時,使從該直線起,沿著通過點B的半徑至到達點B為止之距離為x5。此外,使沿著該直線,通過點A的半徑與通過點B的半徑之間的距離為x4。
In this embodiment, conditions for performing good grinding by bringing a single side surface (e.g., bottom surface in the vertical direction of lead) of the
x5=’-x4 tan[(θ3-θ2)/2] x 5= ' - x 4 tan[( θ 3- θ 2)/2]
x4=(r-’)tan(θ3-θ2) x 4 = ( r - ' )tan( θ 3 - θ 2)
x3=r tan(θ2-θ5)=x5/tan(θ3-θ2) x 3=r tan( θ 2- θ 5)= x 5/tan( θ 3- θ 2)
θ5=θ2-tan-1[x5/r tan(θ3-θ2)] θ 5= θ 2-tan -1 [ x 5/r tan( θ 3- θ 2)]
藉由此等計算,可設定用於使斜面部分5h具有未滿下述長度之條件:凹形研磨部分5b和工件2的底面側之端部,在圓弧狀部分5e的切線以與吸附構件10之前端較薄形狀10a的角度θ3一致之角度θ3延伸的位置中接觸的狀態下,斜面部分5h抵接於吸附構件10之前端較薄形狀10a的長度。因此,藉由「磨石5的斜面部分5h,在前述從垂直方向算起的角度θmax與角度θ5之間的範圍內終止」之構成,而可將工件2精度良好地加工為期望的剖面形狀。
By such calculations, it is possible to set a condition for making the inclined surface portion 5h have a length less than the following: the length of the inclined surface portion 5h abutting against the thinner shape 10a of the front end of the suction member 10 in a state where the tangent line of the arc-shaped
接著,針對本發明的第3實施形態予以說明。圖14係示意本實施形態之工件加工裝置的前視圖。本實施形態之工件加工裝置,具備:磨石5,與第1實施形態之磨石5類似,但僅於頂面側具備剖面長方形研磨部分5g;以及圓板狀之附溝磨石12,對於圓板狀之工件2的外周之切線方向斜向配置。附溝磨石12,藉由附
溝磨石支持機構13支持,且可將旋轉軸14作為中心而旋轉。此工件加工裝置,藉由2階段之研磨製程施行倒角;藉由使用與第1實施形態相同之磨石5的剖面長方形研磨部分5g及凹形研磨部分5b實施前述加工方法,而施行前段之粗研磨製程。而後,藉由對於工件2的外周之切線方向斜向配置的附溝磨石12,施行後段之精密研磨製程。於附溝磨石12的外周部設置有凹形的溝12a,藉由將工件2的外周部插入至該溝12a內,而可使溝12a的內周面抵接於工件2的外周部而予以研磨,形成倒角部。依本實施形態,則可獲得表面粗糙度小等之螺旋式加工方法所產生的效果,且藉由以旋轉並移動之磨石5施行粗研磨,亦可獲得將其後施行的使用附溝磨石12之螺旋式精密研磨以更短的時間效率良好地施行等效果。
Next, the third embodiment of the present invention will be described. FIG. 14 is a front view of the workpiece processing device of this embodiment. The workpiece processing device of this embodiment comprises: a grindstone 5, which is similar to the grindstone 5 of the first embodiment, but has a cross-sectional rectangular grinding portion 5g only on the top surface side; and a circular plate-shaped grooved grindstone 12, which is arranged obliquely in the tangential direction of the outer periphery of the circular plate-shaped
本實施形態之工件加工裝置,具備附溝磨石12的整形用之整形磨石11,其可取代工件2而安裝在工件支持機構4,可將旋轉軸3作為中心而旋轉。整形磨石11,例如以較由樹脂結合磨石形成之附溝磨石12更硬的綠色碳化矽磨石等形成,係具有與工件2幾近同等之直徑與厚度的磨石。將由綠色碳化矽磨石等形成的整形磨石11,使用通常由金屬結合磨石形成的磨石5,藉由與工件2的加工同樣之方法加工,形成欲轉印至傾斜的附溝磨石12之剖面形狀(和預先設定的溝12a之形狀相對應的形狀)。與工件2的加工同樣之方法,係依據磨石5的圓弧狀部分5e之曲率半徑,先算出「磨石5的凹形研磨部分5b與整形磨石11的接觸部分,沿著和預先設定的溝12a之形狀相對應的形狀移動」之移動條件,並遵循該移動條件,使整形磨石11對於磨石5相對地移動,藉此,形成整形磨石11之外形。預先設定的溝12a之形狀,係適合用於將與溝12a的內周面抵接之工件2形成為期望的剖面形狀之形狀。如此地,使剖面形狀形成後之整形磨石11,以旋轉軸3為中心而旋
轉,並抵靠於將溝形成或修整前的傾斜之附溝磨石12的外周部,將整形磨石11之外形轉印至附溝磨石12的外周部,將溝12a形成或修整。如此地,可輕易地施行附溝磨石12的整形。另,整形磨石11,於經驗上設想在傾斜之附溝磨石12的整形時產生之微小的剖面形狀之變化後,形成為預先包含了所設想的剖面形狀之變化的形狀。
The workpiece processing device of this embodiment has a shaping grindstone 11 for shaping the grooved grindstone 12, which can be installed on the workpiece support mechanism 4 instead of the
另,磨石的磨耗強度例如為:粒度#320之綠色碳化矽磨石較粒度#3000之樹脂結合磨石更強,粒度#800之金屬結合磨石較粒度#320之綠色碳化矽磨石更強。因此,能夠以粒度#800之金屬結合磨石將粒度#320之綠色碳化矽磨石研磨,形成為期望的剖面形狀。此外,藉由將粒度#320之綠色碳化矽磨石,抵緊於在粒度#3000的樹脂結合磨石設置之溝的內周面,而可將溝之形狀修整。另,以下記載之各磨石,基本上分別具有前述粒度。在使用由金屬結合磨石形成之具有成型溝的磨石施行粗研磨,並使用由樹脂結合磨石形成之傾斜的附溝磨石施行精密研磨之習知的工件加工裝置中,使由綠色碳化矽磨石形成的整形磨石,抵接於金屬結合磨石之成型溝的內周面,將成型溝之形狀轉印。其後,將由綠色碳化矽磨石形成之整形磨石,抵接於傾斜之樹脂結合磨石,施行溝的形成或修整。藉由如此地形成的由樹脂結合磨石形成之傾斜的附溝磨石之溝,施行工件(晶圓)的精密研磨。因此,工件,僅可形成為取決於金屬結合磨石的成型溝之形狀的剖面形狀,無法形成為不同的剖面形狀。 In addition, the wear strength of the grinding stone is, for example, that the green silicon carbide grinding stone with a grain size of #320 is stronger than the resin bonded grinding stone with a grain size of #3000, and the metal bonded grinding stone with a grain size of #800 is stronger than the green silicon carbide grinding stone with a grain size of #320. Therefore, the green silicon carbide grinding stone with a grain size of #800 can be ground into a desired cross-sectional shape. In addition, by pressing the green silicon carbide grinding stone with a grain size of #320 against the inner peripheral surface of the groove provided in the resin bonded grinding stone with a grain size of #3000, the shape of the groove can be trimmed. In addition, each grinding stone described below basically has the above-mentioned grain size. In a known workpiece processing device that performs rough grinding using a grindstone having a formed groove formed by a metal bonded grindstone and performs precision grinding using an inclined grooved grindstone formed by a resin bonded grindstone, a shaping grindstone formed by a green silicon carbide grindstone is brought into contact with the inner peripheral surface of the formed groove of the metal bonded grindstone to transfer the shape of the formed groove. Thereafter, the shaping grindstone formed by the green silicon carbide grindstone is brought into contact with the inclined resin bonded grindstone to form or trim the groove. The workpiece (wafer) is precisely ground using the groove of the inclined grooved grindstone formed by the resin bonded grindstone. Therefore, the workpiece can only be formed into a cross-sectional shape determined by the shape of the forming groove of the metal-bonded grindstone, and cannot be formed into a different cross-sectional shape.
相對於此,在本發明,由綠色碳化矽磨石形成之整形磨石11,可藉由由金屬結合磨石形成之磨石5的凹形研磨部分5b形成為任意剖面形狀,故可在藉由該
整形磨石11整形之附溝磨石12,形成任意剖面形狀的溝12a。藉此,能夠不更換磨石的方式施行各種剖面形狀之工件2的加工。此外,可在將附溝磨石12整形後,先施行一次工件2的加工,實際測定加工後之工件2的剖面形狀,與目標形狀比較而進行反饋。假設在加工後之工件2的剖面形狀與目標形狀不同之情況,將藉由磨石5的凹形研磨部分5b修整之整形磨石11的剖面形狀變更(修正),藉由具有變更了剖面形狀之整形磨石11,將附溝磨石12再度整形。如此地,可使藉由附溝磨石12修整之工件2的剖面形狀,接近目標形狀。在前述之習知的工件加工裝置,使用具有成型溝之金屬結合磨石,故即便加工後之工件的剖面形狀與目標形狀不同,仍無法進行整形磨石11的剖面形狀之變更(修正)。然而,依本發明之方法,則可顯著提高加工後之工件的剖面形狀之精度,亦即工件2的加工精度。
In contrast, in the present invention, the shaping grindstone 11 formed of green silicon carbide grindstone can be formed into an arbitrary cross-sectional shape by the
接著,針對本發明的第4實施形態予以說明。圖15係示示意本實施形態之工件加工裝置的前視圖。本實施形態之工件加工裝置,具備與第3實施形態同樣的對於圓板狀之工件2的外周之切線方向斜向配置的附溝磨石12。與第3實施形態同樣的磨石5安裝在磨石支持機構7,可將旋轉軸6作為中心而旋轉。工件2安裝在工件支持機構4,可將旋轉軸3作為中心而旋轉,且在對於工件2及磨石5平行之面內(與旋轉軸3及旋轉軸6正交之面內),可往接近磨石5的方向、或遠離磨石5的方向移動,且在對於磨石5及工件2正交之面內(與旋轉軸3及旋轉軸6平行之面內),可往接近磨石5的方向、遠離磨石5的方向移動。如圖15所示,工件支持機構4,具備X方向移動台4a、Y方向移動台4b、Z方向移動台4c、及馬達4d。X方向移動台4a,在對於磨石5及工件2平行之面內,可沿磨石5及工件2的寬度方向(圖15之與紙面正交的方向)移動。Y方向移動台4b,搭載於X方向移動台4a上,在對
於磨石5及工件2平行之面內,可沿磨石5及工件2的接近分離方向(圖15的左右方向)移動。Z方向移動台4c,搭載於Y方向移動台4b上,在對於磨石5及工件2正交之面內,可沿高度方向(圖15的上下方向)移動。雖未詳述,但X方向移動台4a、Y方向移動台4b、及Z方向移動台4c,各自具備公知之引導手段(例如LM導件)與移動手段(例如滾珠螺桿、螺帽、旋轉驅動手段),可沿前述各方向移動。馬達4d,搭載於Z方向移動台4c上,係經由旋轉軸3而支持工件2,且使旋轉軸3旋轉之驅動手段。馬達4d為發熱之構件;以覆蓋該馬達4d及旋轉軸3之至少一方之方式,設置溫度調整機構15。溫度調整機構15,使液體或氣體於未圖示的流路流通,調整馬達4d及旋轉軸3之至少一方的溫度。
Next, the fourth embodiment of the present invention will be described. FIG15 is a front view of the workpiece processing device of this embodiment. The workpiece processing device of this embodiment has a grooved grindstone 12 arranged obliquely in the tangential direction of the outer periphery of the disk-shaped
依此工件加工裝置,則可達成前述第1~第3實施形態各自之效果。此外,雖未圖示,但亦可使與第3實施形態同樣之整形磨石11旋轉並以與附溝磨石12抵接的方式移動,簡單且效率良好而高精度地施行附溝磨石12的整形。 According to this workpiece processing device, the effects of the first to third embodiments can be achieved. In addition, although not shown, the shaping grindstone 11 can be rotated and moved in contact with the groove grindstone 12, which can simply, efficiently and accurately shape the groove grindstone 12.
工件支持機構4,並非使工件2常時高速旋轉,亦存在使低速旋轉之情況、不施行工件2的旋轉之情況。具體而言,在藉由磨石5的凹形研磨部分5b或剖面長方形研磨部分5g施行工件2之研磨時,工件2高速旋轉。在藉由對於圓板狀之工件2的外周之切線方向斜向配置的附溝磨石12施行工件2之研磨時,工件2低速旋轉。此外,在工件2更換時,工件支持機構4無須施行旋轉運動。過去,在將複數個工件2連續加工之情況,工件支持機構4,重複以旋轉軸3為中心之工件2的高速旋轉、工件2的低速旋轉、及旋轉運動停止狀態。工件支持機構4,在工件2的高速旋轉時發熱而成為高溫,在工件2的低速旋轉時成為較高速旋轉時更
為低溫,在旋轉運動停止狀態成為更低溫。工件支持機構4重複此等溫度變化之結果,尤其使旋轉軸3發生伸縮等變形。一旦安裝工件2的旋轉軸3變形,工件2的厚度方向之位置有所變化,則即便如同前述地進行數值控制,使工件2與磨石相對移動,加工精度仍大幅降低。
The workpiece support mechanism 4 does not rotate the
因而,在本發明之各實施形態,設置附屬於工件支持機構4的溫度調整機構15。溫度調整機構15,產生液體或氣體之流動,將工件支持機構4的旋轉軸3之溫度的變動減小,抑制旋轉軸3之變形。如此地,藉由抑制在工件2的加工時旋轉軸3之因熱所導致的變形,而防止工件2的加工精度之降低。
Therefore, in each embodiment of the present invention, a temperature adjustment mechanism 15 is provided attached to the workpiece support mechanism 4. The temperature adjustment mechanism 15 generates a flow of liquid or gas to reduce the temperature variation of the rotating shaft 3 of the workpiece support mechanism 4 and suppress the deformation of the rotating shaft 3. In this way, by suppressing the deformation of the rotating shaft 3 caused by heat during the processing of the
此外,為了將旋轉軸3之溫度盡可能保持為一定,宜持續施行以旋轉軸3為中心的旋轉運動。例如,在工件2的更換或補充時、或因作業製程上的問題而中斷工件2的加工時,工件支持機構4仍宜持續以旋轉軸3為中心的旋轉運動。如此地,藉由將工件支持機構4,在未安裝工件2、未施行工件2的加工之狀態下,保持施行以旋轉軸3為中心的旋轉運動之狀態(為求方便,稱作空轉狀態或預備旋轉動作),而可將溫度之變動抑制於小範圍,容易使溫度在短時間變得穩定。進一步,在此預備旋轉動作中,並非僅施行高速旋轉,或僅施行低速旋轉,而係與實際之工件2的加工時同樣地,交互地重複高速旋轉(以與磨石所進行的加工中之工件2的高速旋轉時相同之速度旋轉)、及低速旋轉(以與磨石所進行的加工中之工件2的低速旋轉時相同之速度旋轉),此點在將溫度變動抑制於小範圍的點上較佳。藉此,在由預備旋轉動作轉變為工件2的加工時,可立即使旋轉軸3之溫度穩定,可施行高精度的加工。尤其是,若使預備旋轉動作中的高速旋轉之持續
時間與低速旋轉之持續時間的比,和實際的工件2之加工中的高速旋轉之持續時間與低速旋轉之持續時間的比一致,則可進行根據實際的工件2之加工時的溫度管理,故為較佳態樣。然而,若預備旋轉動作的高速旋轉之持續時間與低速旋轉之持續時間為長時間,則在開始實際的工件2之加工時,用於等待預備旋轉動作結束而轉變為工件2之加工的適合時序(例如切換預備旋轉動作之旋轉速度的時序)之待機時間增長,有作業效率降低的可能性。因而,如同前述,宜使預備旋轉動作中的高速旋轉之持續時間與低速旋轉之持續時間的比,和實際的工件2之加工中的高速旋轉之持續時間與低速旋轉之持續時間的比一致,並使預備旋轉動作中的高速旋轉之持續時間及低速旋轉之持續時間,分別較實際的工件2之加工中的高速旋轉之持續時間及低速旋轉之持續時間更為減短。藉此,藉由根據實際的工件2之加工時的溫度管理,將旋轉軸3之溫度變化抑制為小範圍,抑制加工精度的降低,且進一步,可減短由預備旋轉動作轉變為工件2的加工時之待機時間,抑制作業效率的降低。
In addition, in order to keep the temperature of the rotating shaft 3 as constant as possible, it is preferable to continue the rotational movement around the rotating shaft 3. For example, when the
本發明之磨石5,係「凹形研磨部分5b之通過磨石5的旋轉軸6之剖面中的剖面形狀,具有將位於厚度方向之兩端部的一對圓弧狀部分5e藉由直線部分5f連接之剖面形狀」的構成。磨石5的厚度方向之一方的端部之圓弧狀部分5e,與另一方的端部之圓弧狀部分5e,宜為以各自之曲率半徑的平均值成為期望之大小的方式個別地形成之部分。藉此,相較於將凹形研磨部分5b全體加工成為同一曲率半徑的情況,可將厚度方向之一方的端部與另一方的端部皆高精度而良好地形成。此外,宜將厚度方向之一方的端部之圓弧狀部分5e的曲率半徑,與另一方的端部之圓弧狀部分5e的曲率半徑各自之誤差,減小至某程度。例如,使厚
度方向之一方的端部之圓弧狀部分5e的曲率半徑之最大值與最小值的差、及另一方的端部之圓弧狀部分5e的曲率半徑之最大值與最小值的差,皆進入至容許範圍內,亦即成為預先設定的既定數值(第1既定值)以下。此外,使厚度方向之一方的端部之圓弧狀部分5e的曲率半徑之平均值,與另一方的端部之圓弧狀部分5e的曲率半徑之平均值的差,進入至容許範圍內,亦即成為預先設定的既定數值(第2既定值)以下。
The grindstone 5 of the present invention is configured such that "the cross-sectional shape of the
在本發明,如同前述,使用磨石5將圓板狀之工件2形成為期望的剖面形狀;該磨石5於外周部具備凹形研磨部分5b,此凹形研磨部分5b,呈「具有厚度方向之兩端部的圓弧狀部分5e、及兩端部的圓弧狀部分5e之間的直線部分5f」之形狀。該工件加工方法,包含:將工件2與磨石5彼此平行地配置之步驟;以及使磨石5旋轉,且以與磨石5的旋轉軸6平行之旋轉軸3為中心,使工件2旋轉,並遵循依據磨石5的圓弧狀部分5e之曲率半徑算出的移動條件,使磨石5對於工件2相對地移動,俾使凹形研磨部分5b和工件2的接觸部分沿著工件2之期望的剖面形狀移動之步驟。使磨石5對於工件2相對地移動之步驟,包含:使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往一方的面,對於工件2相對地曲線移動遵循該移動條件預先算出的角度,藉此將工件2之一方的面側之外周部研磨;使磨石5,沿著工件2的外周端面,從一方的面側往另一方的面側對於工件2相對地移動;以及使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往另一方的面,對於工件2相對地曲線移動遵循該移動條件預先算出的角度,藉此將工件2之另一方的面側之外周部研磨。在施行工件2之一方的面側或另一方的面側之外周部的粗研磨時,
使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往一方的面或另一方的面,以磨石5的旋轉軸6與工件2的旋轉軸3位於同一平面內之方式(沿著圖16的箭頭F1),對於工件2相對地曲線移動遵循該移動條件預先算出的角度,而後使磨石5的對於工件2之相對移動停止。相對於此,在施行工件2之一方的面側或另一方的面側之外周部的精密研磨時,使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往一方的面或另一方的面,以磨石5的旋轉軸6與工件2的旋轉軸3位於同一平面內之方式(沿著圖16的箭頭F1),對於工件2相對地曲線移動了遵循該移動條件預先算出的角度後,以在沿對於曲線移動時磨石5的旋轉軸6與工件2的旋轉軸3所在之平面垂直或斜向地交叉的方向延伸之平面內,使磨石5的旋轉軸6與工件2的旋轉軸3相對地移動之方式(例如沿著圖16的箭頭F2、F3、F4、F5之任一者),使磨石5對於工件2相對地直線移動。
In the present invention, as described above, a disk-shaped
依此方法,則工件2的研磨後之部分的粗糙度變得良好(變得更平滑)。若針對其理由予以說明,則係因在磨石5的表面(研磨所使用的面),分散有鑽石等磨粒所突出的部分。在工件2的與磨石5的接觸部分中,磨石5的鑽石等磨粒所突出的部分接觸到工件2之部位,較其他部位受到更深的切削。其後,藉由使磨石5對於工件2相對地直線移動,而使磨石5的凹形研磨部分5b之圓弧狀部分5e,將工件2之包含較深地切削的部分之區域全體再次研磨。藉此,於前一製程中由於與鑽石等磨粒之接觸而較深地切削的部分,與磨石5的凹形研磨部分5b之圓弧狀部分5e接觸而受到研磨、變得平滑,並未殘留。尤其是,改變前一製程中磨石5的旋轉軸6與工件的旋轉軸3之相對的移動方向,沿著對於曲線移動時的磨石5與
工件2之相對移動方向垂直或斜向地交叉,且與工件2之旋轉方向傾斜或正交的方向相對移動,藉以可將包含前一製程中由於與鑽石等磨粒之接觸而較深地切削的部分之區域再次研磨,且可抑制工件2因磨石5的凹形研磨部分5b之圓弧狀部分5e而過度研磨,造成角度變得過小之情形。
According to this method, the roughness of the part of the
此外,本發明中,亦有下述情況:使用磨石5將圓板狀之工件2形成為期望的剖面形狀;該磨石5於外周部具備凹形研磨部分5b,此凹形研磨部分5b,呈「於厚度方向之兩端部,具備圓弧狀部分5e、及位於較圓弧狀部分5e更為厚度方向外側而與圓弧狀部分5e連續地連結的斜面部分5h,且具備兩端部的圓弧狀部分5e之間的直線部分5f」之形狀。該工件加工方法,包含:將工件2與磨石5彼此平行地配置之步驟;以及使磨石5旋轉,且以與磨石5的旋轉軸6平行之旋轉軸3為中心,使工件2旋轉,並遵循依據磨石5的圓弧狀部分5e之曲率半徑算出的移動條件,使磨石5對於工件2相對地移動,俾使凹形研磨部分5b和工件2的接觸部分沿著工件2之期望的剖面形狀移動之步驟。使磨石5對於工件2相對地移動之步驟,包含:使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往一方的面,對於工件2相對地曲線移動遵循該移動條件預先算出的角度,藉此將工件2之一方的面側之外周部研磨;使磨石5,沿著工件2的外周端面,從一方的面側往另一方的面側對於工件2相對地移動;以及使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往另一方的面,對於工件2相對地曲線移動遵循該移動條件預先算出的角度,藉此將工件2之另一方的面側之外周部研磨。在施行工件2之一方的面側或另一方的面側之外周部的粗研磨時,使工件2與磨石5旋轉,並使磨石5的凹形研磨部
分5b之圓弧狀部分5e,從工件2的外周端面往一方的面或另一方的面,以磨石5的旋轉軸6與工件2的旋轉軸3位於同一平面內之方式(沿著圖16的箭頭F1),對於工件2相對地曲線移動遵循該移動條件預先算出的角度,而後使磨石5的對於工件2之相對移動停止。相對於此,在施行工件2之一方的面側或另一方的面側之外周部的精密研磨時,使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往一方的面或另一方的面,以磨石5的旋轉軸6與工件2的旋轉軸3位於同一平面內之方式(沿著圖16的箭頭F1),對於工件2相對地曲線移動了遵循該移動條件預先算出的角度後,維持使磨石5的旋轉軸6與工件2的旋轉軸3位於曲線移動時磨石5的旋轉軸6與工件2的旋轉軸3所在之平面內的狀態(繼續沿著圖16的箭頭F1),使磨石5對於工件2相對地直線移動。
In addition, in the present invention, there is also the following situation: a grindstone 5 is used to form a circular plate-shaped
依此方法,則由於在磨石5的凹形研磨部分5b設置有斜面部分5h,故將包含由於與鑽石等磨粒之接觸而較深地切削的部分之區域,藉由磨石5的斜面部分5h再度受到研磨,故於前一製程中由於與鑽石等磨粒之接觸而較深地切削的部分變得平滑而未殘留。此外,工件2最後藉由斜面部分5h研磨,故不存在過度研磨而造成角度變小之疑慮。因此,無須藉由磨石5與工件2之曲線的相對移動、及其後之直線的相對移動而改變移動方向,從平面觀察時,亦可將工件2筆直地拉出。
According to this method, since the concave
此外,本發明中,一種工件加工方法,使用磨石5將圓板狀之工件2形成為期望的剖面形狀;該磨石5於外周部具備凹形研磨部分5b,此凹形研磨部分5b,呈「具備厚度方向之兩端部的圓弧狀部分5e、及兩端部的圓弧狀部分5e之間的直
線部分5f」之形狀;該工件加工方法,包含:將工件2與磨石5彼此平行地配置之步驟;以及使磨石5旋轉,且以與磨石5的旋轉軸6平行之旋轉軸3為中心,使工件2旋轉,並遵循依據磨石5的圓弧狀部分5e之曲率半徑算出的移動條件,使磨石5對於工件2相對地移動,俾使凹形研磨部分5b和工件2的接觸部分沿著工件2之期望的剖面形狀移動之步驟。使磨石5對於工件2相對地移動之步驟,包含:使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往一方的面,對於工件2相對地曲線移動遵循該移動條件預先算出的角度,藉此將工件2之一方的面側之外周部研磨;使磨石5,沿著工件2的外周端面,從一方的面側往另一方的面側對於工件2相對地移動;以及使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往另一方的面,對於工件2相對地曲線移動遵循該移動條件預先算出的角度,藉此將工件2之另一方的面側之外周部研磨。在施行工件2之一方的面側或另一方的面側之外周部的粗研磨時,使工件2與磨石5旋轉,並使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往一方的面或另一方的面,對於工件2相對地曲線移動遵循該移動條件預先算出的角度,而後使磨石5的對於工件2之相對移動停止。在施行工件2之一方的面側之外周部的精密研磨時,使工件2與磨石5旋轉,並考慮工件2的旋轉時產生之厚度方向的位置誤差,以工件2旋轉時通過的厚度方向之一方的面側中最為外側之位置(例如圖18的Hmax)為基準,使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往一方的面,對於工件2相對地曲線移動了遵循該移動條件預先算出的角度後,使移動停止,在磨石5和工件2之一方的面側之倒角部2a的斜面接觸之位置,調整工件2的厚度方向之位置並減緩工件2的旋轉速度,使其旋轉至少一圈以上,藉以抵消工件2之旋轉
時的位置誤差並將工件2之一方的面側研磨。在施行工件2之另一方的面側之外周部的精密研磨時,使工件2與磨石5旋轉,並考慮工件2的旋轉時產生之厚度方向的位置誤差,以工件2旋轉時通過的厚度方向之另一方的面側中最為外側之位置(例如圖18的Hmin)為基準,使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往另一方的面,對於工件2相對地曲線移動了遵循該移動條件預先算出的角度後,使移動停止,在磨石5和工件2之另一方的面側之倒角部2a的斜面接觸之位置,調整工件2的厚度方向之位置並減緩工件2的旋轉速度,使其旋轉至少一圈以上,藉以抵消工件2之旋轉時的位置誤差並將工件2之另一方的面側研磨。
In addition, in the present invention, a workpiece processing method uses a grindstone 5 to form a disk-shaped
若對於此方法之技術意義予以說明,則如同前述各實施形態地使工件2及磨石5旋轉之情況,具有與旋轉軸平行之方向(厚度方向)的位置於旋轉時晃動之可能性。一般而言,在厚度方向的位置產生±1.5μm~±3μm程度之誤差。由於此等厚度方向之誤差,造成研磨後之工件2的平面形狀亦大幅變動。尤其是,圖7A、圖8所示之工件2的角度θ1、θ2小的情況,厚度方向之位置偏移,產生水平方向(面內方向)之巨大的位置偏移。具體而言,如同圖7B所示意,若假設使上側的厚度方向之位置偏移O1為對邊,使水平方向之位置偏移K1為臨邊的直角三角形,則tanθ1=O1/K1,亦即K1=O1/tanθ1。同樣地,如同圖7C所示意,若假設使下側的厚度方向之位置偏移O2為對邊,使水平方向之位置偏移K2為臨邊的直角三角形,則tanθ2=O2/K2,亦即K2=O2/tanθ2。例如若角度θ1、θ2為22°,則水平方向之位置偏移K1、K2為厚度方向之位置偏移O1、O2的約2.5倍。因此,厚度方向之位置偏移O1、O2為±3μm時,水平方向之位置偏移K1、K2約為±7.5μm。於
圖8所示的R形之工件2中,亦發生和圖7A所示的T形之工件2同樣的水平方向之位置偏移K1、K2與厚度方向之位置偏移O1、O2的關係(參考圖7B~7C)。如同前述,有在工件2之頂面與底面的尺寸(例如圖7A、圖8所示之尺寸A1、A2)分別產生最大7.5μm程度之誤差的可能性。角度θ1、θ2更小之情況,工件2之頂面與底面的尺寸(例如尺寸A1、A2)之誤差變得更大。因而,發明人考慮:調查工件2的旋轉中的厚度方向之位置的晃動之傾向,於工件支持機構4內建未圖示的壓電元件等,在工件2的旋轉中使壓電元件以高速精細地作動,使工件2沿厚度方向移動俾抵銷厚度方向之位置的晃動。然而,於此情況,工件支持機構4之構成變得非常複雜,導致高成本化且容易故障。若配合工件2的高速旋轉而使工件2以高速上下移動,則研磨後之工件2的形狀變得不平滑,有工件的尺寸(例如圖7A、圖8所示之曲率半徑R1、R2等)之精度變差的可能性。若欲藉由將工件2的旋轉速度減慢而解決此等問題,則導致作業效率降低、加工成本變高。
If the technical significance of this method is explained, as in the case where the
因此,為了不使作業效率太過降低,宜將使工件2上下移動之裝置的作動、及與其相伴的工件2之厚度方向的移動,在工件2的旋轉中以必要最小限度施行,而非常時施行。具體而言,在施行工件2之一方的面側(頂面側)及另一方的面側(底面側)之外周部的精密研磨前,調查工件支持機構4所造成之工件2的旋轉時之厚度方向的位置偏移狀態。亦即,藉由工件支持機構4使工件2實際旋轉,並測定例如圖17所示之8個點H1~H8的高度方向之差異。而後,求出各點H1~H8的高度中之從此等高度的中間點算起之差為最大值的正值Hmax(作為一例為+3μm程度)、及差為最大值的負值Hmin(作為一例為-3μm程度)。而後,使工件2與磨石5旋轉,並以厚度方向之最高點Hmax為基準,使磨石5的凹形研磨部分5b之圓弧狀
部分5e,從工件2的外周端面往頂面,對於工件2相對地曲線移動了遵循移動條件預先算出的角度後,停止移動。而後,在磨石5和工件2的頂面側之倒角部2a的斜面接觸之位置,調整工件2的厚度方向之位置並減緩工件2的旋轉速度,使其旋轉至少一圈以上,藉以抵消工件2之旋轉時的位置誤差並將工件2的頂面側研磨。同樣地,使工件2與磨石5旋轉,並以厚度方向之最低點Hmin為基準,使磨石5的凹形研磨部分5b之圓弧狀部分5e,從工件2的外周端面往底面,對於工件2相對地曲線移動了遵循移動條件預先算出的角度後,停止移動。而後,在磨石5和工件2的底面側之倒角部2a的斜面接觸之位置,調整工件2的厚度方向之位置並減緩工件2的旋轉速度,使其旋轉至少一圈以上,藉以抵消工件2之旋轉時的位置誤差並將工件2的底面側研磨。
Therefore, in order not to reduce the working efficiency too much, the operation of the device for moving the
依此方法,則於研磨製程之最終階段中,以抵消工件2之旋轉時的位置誤差之方式,使工件2沿厚度方向移動並將工件2研磨,藉此可使研磨面變得平滑,精度良好地形成為期望的剖面形狀。另,此工件2之厚度方向的移動、及工件2的低速旋轉,亦可僅為研磨製程之最終階段的轉1圈或轉數圈,在其之前的階段,使工件2高速旋轉並施行研磨,並未施行工件2之厚度方向的移動。因此,防止因厚度方向的微小位置偏移而產生之剖面形狀中最為重要的水平方向(面內方向)之尺寸上的大幅位置偏移,藉由凹狀形狀磨石所產生之效果及鈍角的連接,幾乎可忽略剖面的圓弧狀部分與斜面部之連接處的影響,因此可進行高精度之加工,且作業效率並未降低太多,不易發生裝置的故障。工件2之厚度方向的移動,在工件2的低速旋轉時進行,故無須壓電元件等昂貴的裝置,可使用滾珠螺桿等施行。如此地,依此方法,則工件2的加工精度佳,作業效率良好且加工成本未
提高太多。另,亦可將此方法,與施行磨石5與工件2的曲線相對移動及其後的直線相對移動並施行研磨之前述方法組合實施。
According to this method, in the final stage of the grinding process, the
[附註1] [Note 1]
一種工件加工裝置,用於將圓板狀之工件形成為期望的剖面形狀,其特徵在於:具備支持該工件的工件支持機構、對於該工件平行地配置的圓板狀之磨石、及支持該磨石的磨石支持機構;該工件支持機構使該工件旋轉,該磨石支持機構使該磨石旋轉;成為該工件支持機構所進行之該工件的旋轉之中心的旋轉軸,與成為該磨石支持機構所進行之該磨石的旋轉之中心的旋轉軸彼此平行;該工件支持機構,具備僅將該工件之單側的面吸附之吸附構件;該吸附構件的平面形狀,呈半徑較該工件之半徑更小的圓形;圓形之該吸附構件的外周部分,具有厚度越往外側越變薄之前端較薄形狀;該磨石於外周部具有凹形研磨部分;該凹形研磨部分之沿著該磨石的該旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈至少在厚度方向之兩端部各自具備圓弧狀部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分之形狀;該磨石與該工件,藉由該磨石支持機構或該工件支持機構,以可彼此接近、遠離的方式相對地移動; 該磨石支持機構或該工件支持機構,遵循依據該磨石的該圓弧狀部分之曲率半徑算出的移動條件,使該磨石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動;該磨石的該圓弧狀部分之曲率半徑至少為該工件的厚度之10倍以上,俾使該磨石的該圓弧狀部分,以與該工件之該期望的剖面形狀之倒角部間實質上不產生間隙的方式抵接於該工件;位於該工件的藉由該吸附構件吸附之該單側的面側之該圓弧狀部分,在沿著該磨石的該旋轉軸之剖面中具有的長度,未滿下述長度:和該工件之該單側的面側之端部,在該圓弧狀部分的切線以與該吸附構件之該前端較薄形狀的角度一致之角度延伸的位置中接觸的狀態下,抵接於該吸附構件之該前端較薄形狀的長度;且為該期望的剖面形狀之該工件的該單側的面側之該倒角部的長度以上。 A workpiece processing device is used to form a disk-shaped workpiece into a desired cross-sectional shape, and is characterized in that: it has a workpiece supporting mechanism for supporting the workpiece, a disk-shaped grindstone arranged parallel to the workpiece, and a grindstone supporting mechanism for supporting the grindstone; the workpiece supporting mechanism rotates the workpiece, and the grindstone supporting mechanism rotates the grindstone; the rotation axis that is the center of rotation of the workpiece by the workpiece supporting mechanism and the rotation axis that is the center of rotation of the grindstone by the grindstone supporting mechanism are parallel to each other; the workpiece supporting mechanism has a function of adsorbing only one side of the workpiece. The adsorption member is a circular adsorption member; the plane shape of the adsorption member is a circle with a smaller radius than the radius of the workpiece; the outer peripheral portion of the circular adsorption member has a thinner front end shape with a thickness that becomes thinner toward the outside; the grindstone has a concave grinding portion at the outer peripheral portion; the cross-sectional shape of the concave grinding portion along the cross-sectional surface of the rotation axis of the grindstone is a concave shape that is concave from the outer peripheral side to the inner peripheral side, and has a shape in which at least both ends in the thickness direction have arc-shaped portions, and between the arc-shaped portions at the two ends have a straight line portion with a thickness greater than the thickness of the workpiece; the grindstone and the workpiece The grinding stone supporting mechanism or the workpiece supporting mechanism moves the grinding stone relative to the workpiece in a manner that allows the grinding stone to approach or move away from each other according to the movement conditions calculated based on the radius of curvature of the circular arc portion of the grinding stone, so that the concave grinding portion and the contact portion of the workpiece move along the desired cross-sectional shape of the workpiece; the radius of curvature of the circular arc portion of the grinding stone is at least 10 times the thickness of the workpiece, so that the circular arc portion of the grinding stone moves in a manner that is inversely proportional to the desired cross-sectional shape of the workpiece. The corners are substantially free of gaps and are in contact with the workpiece; the arc-shaped portion on the side of the workpiece adsorbed by the adsorption member has a length in the cross section along the rotation axis of the grindstone that is less than the length of the end of the side of the workpiece in contact with the thinner front end of the adsorption member at a position where the tangent of the arc-shaped portion extends at an angle consistent with the angle of the thinner front end of the adsorption member; and is greater than the length of the chamfered portion on the side of the workpiece of the desired cross-sectional shape.
[附註2] [Note 2]
一種工件加工裝置,用於將圓板狀之工件形成為期望的剖面形狀,其特徵在於:具備支持該工件的工件支持機構、對於該工件平行地配置的圓板狀之磨石、及支持該磨石的磨石支持機構;該工件支持機構使該工件旋轉,該磨石支持機構使該磨石旋轉;成為該工件支持機構所進行之該工件的旋轉之中心的旋轉軸,與成為該磨石支持機構所進行之該磨石的旋轉之中心的旋轉軸彼此平行; 該工件支持機構,具備僅將該工件之單側的面吸附之吸附構件;該吸附構件的平面形狀,呈半徑較該工件之半徑更小的圓形;圓形之該吸附構件的外周部分,具有厚度越往外側越變薄之前端較薄形狀;該磨石於外周部具有凹形研磨部分;該凹形研磨部分之沿著該磨石的該旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈下述形狀:至少在厚度方向之兩端部,各自具備圓弧狀部分、及位於較該圓弧狀部分更為厚度方向外側而與該圓弧狀部分連續地連結的斜面部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分;該磨石與該工件,藉由該磨石支持機構或該工件支持機構,以可彼此接近、遠離的方式相對地移動;該磨石支持機構或該工件支持機構,遵循依據該磨石的該圓弧狀部分之曲率半徑算出的移動條件,使該磨石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動;該磨石的該圓弧狀部分之曲率半徑至少為該工件的厚度之10倍以上;位於該工件的由該吸附構件吸附之該單側的面側之該斜面部分,在沿著該磨石的該旋轉軸之剖面中具有的長度,未滿下述長度:和該工件之該單側的面側之端部,在該圓弧狀部分的切線以與該吸附構件之該前端較薄形狀的角度一致之角度延伸的位置中接觸的狀態下,該斜面部分抵接於該吸附構件之該前端較薄形狀的長度,且為該期望的剖面形狀之該工件的該單側的面側之該倒角部的長度以上。 A workpiece processing device for forming a disk-shaped workpiece into a desired cross-sectional shape, characterized in that: it has a workpiece support mechanism for supporting the workpiece, a disk-shaped grindstone arranged parallel to the workpiece, and a grindstone support mechanism for supporting the grindstone; the workpiece support mechanism rotates the workpiece, and the grindstone support mechanism rotates the grindstone; the rotation axis that is the center of rotation of the workpiece by the workpiece support mechanism and the rotation axis that is the center of rotation of the grindstone by the grindstone support mechanism are parallel to each other; the workpiece support mechanism has a function of rotating only one side of the workpiece. An adsorption member for adsorption; the plane shape of the adsorption member is a circle with a radius smaller than the radius of the workpiece; the outer peripheral portion of the circular adsorption member has a front end thinner shape with the thickness becoming thinner as it goes outward; the grindstone has a concave grinding portion on the outer peripheral portion; the cross-sectional shape of the concave grinding portion along the cross-section of the rotation axis of the grindstone is a concave shape that is concave from the outer peripheral side to the inner peripheral side, and has the following shape: at least at both ends in the thickness direction, each has an arc-shaped portion, and an inclined portion located further outward in the thickness direction than the arc-shaped portion and continuously connected to the arc-shaped portion The concave grinding portion and the workpiece are provided with a straight line portion having a thickness greater than the thickness of the workpiece between the arc-shaped portions at the two ends; the grindstone and the workpiece are moved relative to each other in a manner that allows them to approach or move away from each other by means of the grindstone supporting mechanism or the workpiece supporting mechanism; the grindstone supporting mechanism or the workpiece supporting mechanism moves the grindstone relative to the workpiece in accordance with a moving condition calculated based on the radius of curvature of the arc-shaped portion of the grindstone, so that the contact portion between the concave grinding portion and the workpiece moves along the desired cross-sectional shape of the workpiece; the radius of curvature of the arc-shaped portion of the grindstone is At least 10 times the thickness of the workpiece; the length of the inclined surface portion located on the single side of the workpiece adsorbed by the adsorption member in the cross section along the rotation axis of the grindstone is less than the following length: the inclined surface portion abuts against the thinner shape of the front end of the adsorption member when the tangent line of the arc-shaped portion is in contact with the end of the single side of the workpiece at a position extending at an angle consistent with the angle of the thinner shape of the front end of the adsorption member, and is greater than the length of the chamfered portion of the single side of the workpiece of the desired cross-sectional shape.
[附註3] [Note 3]
如附註1或2記載之工件加工裝置,其中,於該磨石的外周部,沿厚度方向並排設置有該凹形研磨部分、及直線狀的剖面長方形研磨部分,該剖面長方形研磨部分之和該工件相對向的面,於沿著該旋轉軸之剖面中與該磨石的厚度方向平行;該磨石的該剖面長方形研磨部分,係抵接於施行該凹形研磨部分所進行之研磨前的該工件之外周部,藉由使該磨石從該工件的半徑方向外側往內側移動而將該工件研磨俾減小該工件的半徑之部分。
The workpiece processing device as described in
[附註4] [Note 4]
如附註1至3中任一項記載之工件加工裝置,其中,該吸附構件之半徑r1,若由該工件之該期望的剖面形狀之半徑r2與該工件之厚度t表示,則為r2-10t≦r1≦r2-5t;該吸附構件之該前端較薄形狀的角度θ1,若由該工件之該期望的剖面形狀之該倒角部的角度θ2表示,則為θ2-10≦θ1≦θ2+5。 A workpiece processing device as described in any one of Notes 1 to 3, wherein the radius r1 of the adsorption member, if represented by the radius r2 of the desired cross-sectional shape of the workpiece and the thickness t of the workpiece, is r2-10t≦r1≦r2-5t; the angle θ1 of the thinner front end of the adsorption member, if represented by the angle θ2 of the chamfered portion of the desired cross-sectional shape of the workpiece, is θ2-10≦θ1≦θ2+5.
[附註5] [Note 5]
如附註1至4中任一項記載之工件加工裝置,其中,該磨石支持機構,具備直接或間接地安裝該磨石的主軸、及將該主軸以可旋轉之方式支持的旋轉軸承部;將該磨石,以該磨石的重心位於該磨石的安裝位置與該旋轉軸承部之間的方式支持。 A workpiece processing device as described in any one of Notes 1 to 4, wherein the grinding stone supporting mechanism has a main shaft on which the grinding stone is directly or indirectly mounted, and a rotating bearing portion that supports the main shaft in a rotatable manner; the grinding stone is supported in a manner such that the center of gravity of the grinding stone is located between the mounting position of the grinding stone and the rotating bearing portion.
[附註6] [Note 6]
如附註1至5中任一項記載之工件加工裝置,其中,該磨石支持機構及該工件支持機構,在將該工件之一方的面側之外周部研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度;在將該工件之該另一方的面側之外周部研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度;該磨石支持機構及該工件支持機構,在施行該工件之該一方的面側或該另一方的面側之外周部的粗研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,而後使該磨石的對於該工件之相對移動停止;該磨石支持機構及該工件支持機構,在施行該工件之該一方的面側或該另一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,使該磨石對於該工件相對地直線移動。 A workpiece processing device as described in any one of Notes 1 to 5, wherein the grindstone supporting mechanism and the workpiece supporting mechanism, when grinding the outer peripheral portion of one side of the workpiece, rotate the workpiece and the grindstone, and cause the arc-shaped portion of the concave grinding portion of the grindstone to move relative to the workpiece from the outer peripheral end face of the workpiece to one side of the face at an angle pre-calculated according to the movement condition; when grinding the outer peripheral portion of the other side of the workpiece, rotate the workpiece and the grindstone, and cause the arc-shaped portion of the concave grinding portion of the grindstone to move relative to the workpiece from the outer peripheral end face of the workpiece to the other side of the face at an angle pre-calculated according to the movement condition; the grindstone supporting mechanism and the workpiece supporting mechanism, when performing grinding of the one side or the other side of the workpiece. When rough grinding the outer peripheral part of the surface side of the workpiece, the workpiece and the grindstone are rotated, and the arc-shaped part of the concave grinding part of the grindstone is moved from the outer peripheral end face of the workpiece to the one side face or the other side face in a curve relative to the workpiece according to the angle pre-calculated according to the movement condition, and then the relative movement of the grindstone relative to the workpiece is stopped; when the grindstone support mechanism and the workpiece support mechanism perform precision grinding of the outer peripheral part of the one side face or the other side face of the workpiece, the workpiece and the grindstone are rotated, and the arc-shaped part of the concave grinding part of the grindstone is moved from the outer peripheral end face of the workpiece to the one side face or the other side face in a curve relative to the workpiece according to the angle pre-calculated according to the movement condition, and then the grindstone is moved linearly relative to the workpiece.
[附註7] [Note 7]
如附註1至6中任一項記載之工件加工裝置,其中, 除了具備具有該凹形研磨部分之該磨石以外,更具備:圓板狀之附溝磨石,對於該工件的外周之切線方向斜向配置,使用在較該磨石的該凹形研磨部分所進行之研磨更精密的研磨;以及附溝磨石支持機構,支持該附溝磨石;該附溝磨石支持機構,使該附溝磨石旋轉。 A workpiece processing device as described in any one of Notes 1 to 6, wherein, in addition to the grindstone having the concave grinding portion, it further comprises: a circular plate-shaped grooved grindstone, which is arranged obliquely in the tangential direction of the outer periphery of the workpiece and is used for grinding more precisely than the grinding performed by the concave grinding portion of the grindstone; and a grooved grindstone support mechanism, which supports the grooved grindstone; the grooved grindstone support mechanism rotates the grooved grindstone.
[附註8] [Note 8]
如附註7記載之工件加工裝置,其中,其特徵在於:更具備可取代該工件而安裝在該工件支持機構之整形磨石;該整形磨石,藉由該磨石支持機構或該工件支持機構,遵循該移動條件對於該磨石相對地移動,藉以形成外形;該附溝磨石,抵靠於該整形磨石,使該整形磨石的外形轉印,藉以將溝形成或修整。 The workpiece processing device as described in Note 7 is characterized in that: it is further provided with a shaping grinding stone that can replace the workpiece and be installed on the workpiece support mechanism; the shaping grinding stone is moved relative to the grinding stone by the grinding stone support mechanism or the workpiece support mechanism in accordance with the moving condition to form an outer shape; the groove-attaching grinding stone abuts against the shaping grinding stone to transfer the outer shape of the shaping grinding stone to form or trim the groove.
[附註9] [Note 9]
如附註1至8中任一項記載之工件加工裝置,其中,該工件支持機構具備溫度調整機構,其產生用於將該工件支持機構的該旋轉軸之溫度保持為一定的液體或氣體之流動。 A workpiece processing device as described in any one of Notes 1 to 8, wherein the workpiece support mechanism has a temperature adjustment mechanism that generates a flow of liquid or gas for maintaining the temperature of the rotating shaft of the workpiece support mechanism at a certain level.
[附註10] [Note 10]
一種磨石,係附註1或2記載之工件加工裝置所包含的該磨石,其特徵在於:該直線部分為磨石粒度較該圓弧狀部分更粗之部分,該圓弧狀部分為使用在較該直線部分所進行之研磨更精密的研磨之部分。
A grindstone is included in the workpiece processing device described in
[附註11] [Note 11]
一種磨石,係附註3記載之工件加工裝置所包含的該磨石,其特徵在於:該剖面長方形研磨部分為磨石粒度較該凹形研磨部分更粗之部分,該凹形研磨部分為使用在較該剖面長方形研磨部分所進行之研磨更精密的研磨之部分。 A grindstone is included in the workpiece processing device described in Note 3, and is characterized in that: the cross-sectional rectangular grinding portion is a portion of the grindstone with a coarser grain size than the concave grinding portion, and the concave grinding portion is a portion used for more precise grinding than the grinding performed by the cross-sectional rectangular grinding portion.
[附註12] [Note 12]
一種磨石,係附註1至9中任一項記載之工件加工裝置所包含的該磨石,其特徵在於:厚度方向之一方的端部之該圓弧狀部分與另一方的端部之該圓弧狀部分,係以各自之曲率半徑的平均值成為期望之大小的方式個別地形成之部分。 A grindstone included in a workpiece processing device described in any one of Notes 1 to 9, characterized in that the arc-shaped portion at one end in the thickness direction and the arc-shaped portion at the other end are portions formed individually in such a way that the average value of their respective curvature radii becomes a desired size.
[附註13] [Note 13]
一種磨石,係附註1至9中任一項記載之工件加工裝置所包含的該磨石,其特徵在於:厚度方向之一方的端部之該圓弧狀部分的曲率半徑之最大值與最小值的差、及另一方的端部之該圓弧狀部分的曲率半徑之最大值與最小值的差,皆為第1既定值以下;厚度方向之一方的端部之該圓弧狀部分的曲率半徑之平均值,與另一方的端部之該圓弧狀部分的曲率半徑之平均值的差,為第2既定值以下。 A grindstone included in a workpiece processing device described in any one of Notes 1 to 9, characterized in that: the difference between the maximum value and the minimum value of the radius of curvature of the arc-shaped portion at one end in the thickness direction and the difference between the maximum value and the minimum value of the radius of curvature of the arc-shaped portion at the other end are both less than a first predetermined value; and the difference between the average value of the radius of curvature of the arc-shaped portion at one end in the thickness direction and the average value of the radius of curvature of the arc-shaped portion at the other end is less than a second predetermined value.
[附註14] [Note 14]
一種磨石,係附註1至9中任一項記載之工件加工裝置所包含的該磨石,其特徵在於:具備沿厚度方向延伸之直形或錐狀的安裝孔。 A grinding stone is a grinding stone included in a workpiece processing device described in any one of Notes 1 to 9, characterized in that it has a straight or tapered mounting hole extending in the thickness direction.
[附註15] [Note 15]
一種工件加工方法,用於使用磨石將圓板狀之工件形成為期望的剖面形狀,其特徵在於:該磨石可旋轉、呈圓板狀,於外周部具備凹形研磨部分;該凹形研磨部分之沿著該磨石的旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈至少在厚度方向之兩端部各自具備圓弧狀部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分之形狀;該工件加工方法,包含:將該工件與該磨石彼此平行地配置之步驟;以及使該磨石旋轉,且以與該磨石的該旋轉軸平行之旋轉軸為中心而使該工件旋轉,並遵循依據該磨石的該圓弧狀部分之曲率半徑算出的移動條件,使該磨石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動之步驟;使該磨石對於該工件相對地移動之步驟,包含:使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該一方的面側之外周部研磨; 使該磨石,沿著該工件的外周端面,從該一方的面側往另一方的面側,對於該工件相對地移動;以及使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該另一方的面側之外周部研磨;在施行該工件之該一方的面側或該另一方的面側之外周部的粗研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,以該磨石的該旋轉軸與該工件的該旋轉軸位於同一平面內之方式,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,而後使該磨石的對於該工件之相對移動停止;在施行該工件之該一方的面側或該另一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,以該磨石的該旋轉軸與該工件的該旋轉軸位於同一平面內之方式,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,以在沿對於曲線移動時該磨石的該旋轉軸與該工件的該旋轉軸所在之該平面垂直或斜向地交叉的方向延伸之平面內,使該磨石的該旋轉軸與該工件的該旋轉軸相對地移動之方式,使該磨石對於該工件相對地直線移動。 A workpiece processing method is used to form a disk-shaped workpiece into a desired cross-sectional shape using a grindstone, wherein the grindstone is rotatable, disk-shaped, and has a concave grinding portion on the outer periphery; the cross-sectional shape of the concave grinding portion in the cross-sectional shape along the rotation axis of the grindstone is a concave shape that is concave from the outer periphery to the inner periphery, and is in a shape in which each of the two end portions in the thickness direction has an arc-shaped portion, and a straight line portion having a thickness greater than the thickness of the workpiece is provided between the arc-shaped portions at the two end portions; the workpiece processing method comprises: a step of arranging the workpiece and the grindstone parallel to each other; and rotating the grindstone, and rotating the workpiece around a rotation axis parallel to the rotation axis of the grindstone, and following a rotation direction according to the grindstone. The step of moving the grinding stone relative to the workpiece according to the movement condition calculated by the radius of curvature of the arc-shaped portion so that the concave grinding portion and the contact portion of the workpiece move along the desired cross-sectional shape of the workpiece; the step of moving the grinding stone relative to the workpiece includes: rotating the workpiece and the grinding stone, and moving the arc-shaped portion of the concave grinding portion of the grinding stone from the outer peripheral end face of the workpiece to one side of the surface relative to the workpiece in a curve following the angle pre-calculated according to the movement condition, thereby grinding the outer peripheral portion of the one side of the workpiece; moving the grinding stone relative to the workpiece along the outer peripheral end face of the workpiece from the one side of the surface to the other side of the surface; and rotating the workpiece and the grinding stone, and The arc-shaped portion of the concave grinding portion of the grindstone is caused to move in a curve relative to the workpiece from the outer peripheral end face of the workpiece to the other face at an angle calculated in advance according to the moving condition, thereby grinding the outer peripheral portion of the other face side of the workpiece; when performing rough grinding of the outer peripheral portion of the one face side or the other face side of the workpiece, the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is caused to move in a curve relative to the workpiece from the outer peripheral end face of the workpiece to the one face side or the other face side in a manner that the rotation axis of the grindstone and the rotation axis of the workpiece are located in the same plane, and the angle calculated in advance according to the moving condition is followed, and then the relative movement of the grindstone relative to the workpiece is When performing precision grinding of the outer peripheral portion of the one side or the other side of the workpiece, the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved relative to the workpiece in a curved line by an angle pre-calculated according to the moving condition in such a manner that the rotation axis of the grindstone and the rotation axis of the workpiece are located in the same plane from the outer peripheral end face of the workpiece to the one side or the other side, and then the grindstone is moved relative to the workpiece in a straight line in such a manner that the rotation axis of the grindstone and the rotation axis of the workpiece are moved relative to each other in a plane extending in a direction perpendicular or obliquely intersecting the plane where the rotation axis of the grindstone and the rotation axis of the workpiece are located during the curved movement.
[附註16] [Note 16]
一種工件加工方法,用於使用磨石將圓板狀之工件形成為期望的剖面形狀,其特徵在於:該磨石可旋轉、呈圓板狀,於外周部具備凹形研磨部分;該凹形 研磨部分之沿著該磨石的旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈下述形狀:至少在厚度方向之兩端部,各自具備圓弧狀部分、及位於較該圓弧狀部分更為厚度方向外側而與該圓弧狀部分連續地連結的斜面部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分;該工件加工方法,包含:將該工件與該磨石彼此平行地配置之步驟;以及使該磨石旋轉,且以與該磨石的該旋轉軸平行之旋轉軸為中心而使該工件旋轉,並遵循依據該磨石的該圓弧狀部分之曲率半徑算出的移動條件,使該磨石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動之步驟;使該磨石對於該工件相對地移動之步驟,包含:使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該一方的面側之外周部研磨;使該磨石,沿著該工件的外周端面,從該一方的面側往另一方的面側,對於該工件相對地移動;以及使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該另一方的面側之外周部研磨;在施行該工件之該一方的面側或該另一方的面側之外周部的粗研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工 件的外周端面往該一方的面或該另一方的面,以該磨石的該旋轉軸與該工件的該旋轉軸位於同一平面內之方式,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,而後使該磨石的對於該工件之相對移動停止;在施行該工件之該一方的面側或該另一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,以該磨石的該旋轉軸與該工件的該旋轉軸位於同一平面內之方式,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,維持使該磨石的該旋轉軸與該工件的該旋轉軸位於曲線移動時該磨石的該旋轉軸與該工件的該旋轉軸所在之該平面內的狀態,使該磨石對於該工件相對地直線移動。 A workpiece processing method for forming a disk-shaped workpiece into a desired cross-sectional shape using a grindstone, wherein the grindstone is rotatable, disk-shaped, and has a concave grinding portion on the outer periphery; the cross-sectional shape of the concave grinding portion in the cross-sectional shape along the rotation axis of the grindstone is a concave shape that is concave from the outer periphery to the inner periphery, and has the following shape: at least at both ends in the thickness direction, each has an arc-shaped portion, and an inclined surface portion that is located further outward in the thickness direction than the arc-shaped portion and continuously connected to the arc-shaped portion, and a straight line portion having a thickness greater than the thickness of the workpiece is provided between the arc-shaped portions at the two ends; the workpiece processing method comprises: the steps of arranging the workpiece and the grindstone in parallel with each other; and rotating the grindstone, and The workpiece is rotated around a rotation axis parallel to the rotation axis of the grindstone, and the grindstone is moved relative to the workpiece according to a movement condition calculated based on the radius of curvature of the circular arc portion of the grindstone, so that the concave grinding portion and the contact portion of the workpiece are moved along the desired cross-sectional shape of the workpiece; the step of moving the grindstone relative to the workpiece includes: rotating the workpiece and the grindstone, and moving the circular arc portion of the concave grinding portion of the grindstone from the outer peripheral end face of the workpiece to one side of the workpiece in a curve relative to the workpiece according to an angle calculated in advance according to the movement condition, thereby grinding the outer peripheral portion of the one side of the workpiece; and moving the grindstone from the one side of the workpiece to the other side along the outer peripheral end face of the workpiece. The workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved relative to the workpiece from the outer peripheral end face of the workpiece to the other side face, following the angle calculated in advance according to the moving condition, thereby grinding the outer peripheral portion of the other side face of the workpiece; when performing the rough grinding of the outer peripheral portion of the one side face of the workpiece or the other side face, the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved relative to the workpiece from the outer peripheral end face of the workpiece to the one side face or the other side face, following the moving condition in a manner that the rotation axis of the grindstone and the rotation axis of the workpiece are located in the same plane. The grinding stone is stopped from moving relative to the workpiece after the angle calculated in advance according to the moving condition is reached; when performing precision grinding of the outer peripheral portion of the one side or the other side of the workpiece, the workpiece and the grinding stone are rotated, and the arc-shaped portion of the concave grinding portion of the grinding stone is moved relative to the workpiece in a curved line from the outer peripheral end face of the workpiece to the one side or the other side of the workpiece in a manner that the rotation axis of the grinding stone and the rotation axis of the workpiece are located in the same plane. After the workpiece is moved relative to the workpiece in a curved line, the rotation axis of the grinding stone and the rotation axis of the workpiece are maintained in the plane where the rotation axis of the grinding stone and the rotation axis of the workpiece are located during the curved movement, and the grinding stone is moved relative to the workpiece in a straight line.
[附註17] [Note 17]
一種工件加工方法,用於使用磨石將圓板狀之工件形成為期望的剖面形狀,其特徵在於:該磨石可旋轉、呈圓板狀,於外周部具備凹形研磨部分;該凹形研磨部分之沿著該磨石的旋轉軸之剖面中的剖面形狀,係從外周側往內周側凹入的凹形,呈至少在厚度方向之兩端部各自具備圓弧狀部分,且在該兩端部的該圓弧狀部分之間具備具有該工件的厚度以上之厚度的直線部分之形狀;該工件加工方法,包含:將該工件與該磨石彼此平行地配置之步驟;以及使該磨石旋轉,且以與該磨石的該旋轉軸平行之旋轉軸為中心而使該工件旋轉,並遵循依據該磨石的該圓弧狀部分之曲率半徑算出的移動條件,使該磨 石對於該工件相對地移動,俾使該凹形研磨部分和該工件的接觸部分沿著該工件之該期望的剖面形狀移動之步驟;使該磨石對於該工件相對地移動之步驟,包含:使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該一方的面側之外周部研磨;使該磨石,沿著該工件的外周端面,從該一方的面側往另一方的面側,對於該工件相對地移動;以及使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,藉此將該工件之該另一方的面側之外周部研磨;在施行該工件之該一方的面側或該另一方的面側之外周部的粗研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,對於該工件相對地曲線移動遵循該移動條件預先算出的角度,而後使該磨石的對於該工件之相對移動停止;在施行該工件之該一方的面側或該另一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面或該另一方的面,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,使移動停止;在施行該工件之該一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並考慮該工件的旋轉時產生之厚度方向的位置誤差,以該工件旋轉時通過的厚度方向之該一方的面側中最為外側之位置為基準,使該磨石的該凹形研 磨部分之該圓弧狀部分,從該工件的外周端面往該一方的面,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,使移動停止,在該磨石和該工件之該一方的面側之倒角部的斜面接觸之位置,調整該工件的厚度方向之位置並減緩該工件的旋轉速度,使其旋轉至少一圈以上,藉以抵消該工件之旋轉時的位置誤差並將該工件之該一方的面側研磨;在施行該工件之該另一方的面側之外周部的精密研磨時,使該工件與該磨石旋轉,並考慮該工件的旋轉時產生之厚度方向的位置誤差,以該工件旋轉時通過的厚度方向之該另一方的面側中最為外側之位置為基準,使該磨石的該凹形研磨部分之該圓弧狀部分,從該工件的外周端面往該另一方的面,對於該工件相對地曲線移動了遵循該移動條件預先算出的角度後,使移動停止,在該磨石和該工件之該另一方的面側之倒角部的斜面接觸之位置,調整該工件的厚度方向之位置並減緩該工件的旋轉速度,使其旋轉至少一圈以上,藉以抵消該工件之旋轉時的位置誤差並將該工件之該另一方的面側研磨。 A workpiece processing method is used to form a disk-shaped workpiece into a desired cross-sectional shape using a grindstone, wherein the grindstone is rotatable, disk-shaped, and has a concave grinding portion on the outer periphery; the cross-sectional shape of the concave grinding portion in the cross-sectional shape along the rotation axis of the grindstone is a concave shape that is concave from the outer periphery to the inner periphery, and is in a shape in which at least both ends in the thickness direction each have an arc-shaped portion, and a straight line portion having a thickness greater than the thickness of the workpiece is provided between the arc-shaped portions at the two ends; A workpiece processing method, comprising: a step of arranging the workpiece and the grindstone in parallel with each other; and a step of rotating the grindstone, rotating the workpiece around a rotation axis parallel to the rotation axis of the grindstone, and moving the grindstone relative to the workpiece according to a movement condition calculated based on the radius of curvature of the circular arc portion of the grindstone, so that the concave grinding portion and the contact portion of the workpiece move along the desired cross-sectional shape of the workpiece; the step of moving the grindstone relative to the workpiece, comprising : The workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved relative to the workpiece in a curve from the outer peripheral end face of the workpiece to one side of the face, following the angle pre-calculated according to the moving condition, thereby grinding the outer peripheral portion of the one side of the workpiece; the grindstone is moved relative to the workpiece along the outer peripheral end face of the workpiece from the one side of the face to the other side of the face; and the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved relative to the workpiece from the one side of the face to the other side of the face. The outer peripheral portion of the other side of the workpiece is ground by moving the workpiece in a relatively curved line from the outer peripheral end face of the workpiece to the other side, following the angle calculated in advance according to the moving condition; when performing the rough grinding of the outer peripheral portion of the one side of the workpiece or the other side of the workpiece, the workpiece and the grindstone are rotated, and the arc-shaped portion of the concave grinding portion of the grindstone is moved in a relatively curved line from the outer peripheral end face of the workpiece to the one side of the workpiece or the other side of the workpiece, following the angle calculated in advance according to the moving condition. The grinding stone is moved relative to the workpiece by an angle calculated in advance according to the moving condition, and then the relative movement of the grinding stone with respect to the workpiece is stopped; when performing precision grinding of the outer peripheral portion of the one side face or the other side face of the workpiece, the workpiece and the grinding stone are rotated, and the arc-shaped portion of the concave grinding portion of the grinding stone is moved from the outer peripheral end face of the workpiece to the one side face or the other side face, relative to the workpiece, by a curved line at an angle calculated in advance according to the moving condition, and then the movement is stopped; when performing precision grinding of the one side face of the workpiece, the outer peripheral portion of the one side face or the other side face is rotated, and the arc-shaped portion of the concave grinding portion of the grinding stone is moved relative to the workpiece by an angle calculated in advance according to the moving condition, and then the movement is stopped; During precision grinding of the outer periphery, the workpiece and the grindstone are rotated, and considering the position error in the thickness direction generated during the rotation of the workpiece, the arc-shaped portion of the concave grinding portion of the grindstone is moved from the outer periphery end face of the workpiece to the one side face by an angle calculated in advance according to the movement condition relative to the workpiece, based on the outermost position of the one side face in the thickness direction through which the workpiece passes during the rotation, and then the movement is stopped. The position of the bevel contacting the workpiece is adjusted in the thickness direction and the rotation speed of the workpiece is slowed down so that the workpiece rotates at least one circle to offset the position error of the workpiece during rotation and grind the one side of the workpiece; when performing precision grinding of the outer periphery of the other side of the workpiece, the workpiece and the grindstone are rotated, and the position error in the thickness direction generated when the workpiece rotates is considered, and the outermost position of the other side of the workpiece in the thickness direction is taken as the reference, The arc-shaped portion of the concave grinding portion of the grindstone is moved from the outer peripheral end surface of the workpiece to the other side surface, relative to the workpiece, by an angle calculated in advance according to the moving conditions, and then the movement is stopped. At the position where the grindstone and the chamfered portion of the other side surface of the workpiece are in contact, the position of the workpiece in the thickness direction is adjusted and the rotation speed of the workpiece is slowed down so that the workpiece rotates at least one circle, thereby offsetting the position error of the workpiece during rotation and grinding the other side surface of the workpiece.
1:工件加工裝置 1: Workpiece processing device
2:工件 2: Workpiece
3,6:旋轉軸 3,6: Rotation axis
4:工件支持機構 4: Workpiece support mechanism
5:磨石 5: Grindstone
5a:基底圓板部 5a: base disc
5b:凹形研磨部分 5b: Concave grinding part
5g:剖面長方形研磨部分 5g: Rectangular grinding section
7:磨石支持機構 7: Grindstone support mechanism
10:吸附構件 10: Adsorption components
15:溫度調整機構 15: Temperature adjustment mechanism
Claims (17)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023119334A JP7462818B2 (en) | 2023-07-21 | 2023-07-21 | Workpiece machining device, grinding wheel, and workpiece machining method |
| JP2023-119334 | 2023-07-21 |
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| Publication Number | Publication Date |
|---|---|
| TW202510070A TW202510070A (en) | 2025-03-01 |
| TWI888221B true TWI888221B (en) | 2025-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113126559A TWI888221B (en) | 2023-07-21 | 2024-07-16 | Workpiece processing device, grindstone, and workpiece processing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7462818B2 (en) |
| TW (1) | TWI888221B (en) |
| WO (1) | WO2025022848A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2025118141A (en) | 2024-01-31 | 2025-08-13 | Agc株式会社 | Polishing apparatus and polishing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152259A (en) * | 1991-11-28 | 1993-06-18 | Tokyo Seimitsu Co Ltd | Method for chamfering semiconductor wafer |
| JPH11207585A (en) * | 1998-01-27 | 1999-08-03 | Mitsubishi Materials Silicon Corp | Wafer chamfering method |
| JP2000317789A (en) * | 1999-05-12 | 2000-11-21 | Tokyo Seimitsu Co Ltd | Wafer chamfering method and device |
-
2023
- 2023-07-21 JP JP2023119334A patent/JP7462818B2/en active Active
-
2024
- 2024-06-12 WO PCT/JP2024/021319 patent/WO2025022848A1/en active Pending
- 2024-07-16 TW TW113126559A patent/TWI888221B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152259A (en) * | 1991-11-28 | 1993-06-18 | Tokyo Seimitsu Co Ltd | Method for chamfering semiconductor wafer |
| JPH11207585A (en) * | 1998-01-27 | 1999-08-03 | Mitsubishi Materials Silicon Corp | Wafer chamfering method |
| JP2000317789A (en) * | 1999-05-12 | 2000-11-21 | Tokyo Seimitsu Co Ltd | Wafer chamfering method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023126661A (en) | 2023-09-07 |
| WO2025022848A1 (en) | 2025-01-30 |
| JP7462818B2 (en) | 2024-04-05 |
| TW202510070A (en) | 2025-03-01 |
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