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TWI888136B - Display module - Google Patents

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Publication number
TWI888136B
TWI888136B TW113117797A TW113117797A TWI888136B TW I888136 B TWI888136 B TW I888136B TW 113117797 A TW113117797 A TW 113117797A TW 113117797 A TW113117797 A TW 113117797A TW I888136 B TWI888136 B TW I888136B
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Taiwan
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colloid
display module
frame
present disclosure
solid particles
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TW113117797A
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Chinese (zh)
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TW202434969A (en
Inventor
許清鋒
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友達光電股份有限公司
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Abstract

A display module includes a frame, a panel, a first colloid, and a second colloid. The panel has a display area and a peripheral area. The peripheral area surrounds the display area. The first colloid is formed by curing a first hydrogel. The second colloid is formed by curing a second hydrogel. An adhesive strength of the second colloid is smaller than an adhesive strength of the first colloid. The first colloid and the second colloid are disposed on the peripheral area of the panel and connect the panel and the frame.

Description

顯示模組Display module

本揭露是有關於一種顯示模組,特別是有關於一種具有窄邊框的顯示模組。 The present disclosure relates to a display module, and more particularly to a display module with a narrow bezel.

隨著科技產業的演進,顯示器在電視、電腦、手機上都有廣泛的應用。近年來,窄邊框的平面顯示器因其簡潔、美觀、相同尺寸下的可視面積大等優點,已成為高品質顯示器的發展趨勢。 With the development of the technology industry, monitors are widely used in televisions, computers, and mobile phones. In recent years, narrow-frame flat-panel monitors have become the development trend of high-quality monitors due to their simplicity, beauty, and large visible area under the same size.

目前常見實現窄邊框設計的方式主要是在顯示模組中,通過減小膠體塗佈面積,減小邊框寬度。一般來說,為了避免貼合時發生溢膠,可能在液態膠的外圍增加擋體或使用固態膠作為止擋。然而,擋體與固態膠都有其佔據的寬度,導致邊框縮窄有其極限。 Currently, the most common way to achieve narrow bezel design is to reduce the glue coating area and the bezel width in the display module. Generally speaking, in order to avoid glue overflow during bonding, a baffle may be added to the periphery of the liquid glue or solid glue may be used as a stopper. However, both the baffle and the solid glue have their own width, resulting in a limit to the narrowing of the bezel.

因此,如何提出一種可解決上述問題的顯示模組,是目前業界亟欲投入研發資源解決的問題之一。 Therefore, how to come up with a display module that can solve the above problems is one of the problems that the industry is eager to invest R&D resources to solve.

有鑑於此,本揭露之一目的在於提出一種可有解決上述問題的顯示模組。 In view of this, one purpose of this disclosure is to propose a display module that can solve the above problems.

本揭露的一方面是有關於一種顯示模組包括框體、板體、第一膠體以及第二膠體。板體具有顯示區域與周邊區域。周邊區域圍繞顯示區域。第一膠體由第一水膠層固化形成。第二膠體由第二水膠層固化形成。第二膠體的黏著力小於第一膠體的黏著力。第一膠體與第二膠體設置於板體的周邊區域,且連接板體與框體。 One aspect of the present disclosure is related to a display module including a frame, a plate, a first colloid and a second colloid. The plate has a display area and a peripheral area. The peripheral area surrounds the display area. The first colloid is formed by curing a first hydrocolloid layer. The second colloid is formed by curing a second hydrocolloid layer. The adhesive force of the second colloid is less than the adhesive force of the first colloid. The first colloid and the second colloid are arranged in the peripheral area of the plate and connect the plate and the frame.

在一些實施方式中,第一膠體與第二膠體相互接觸,並形成封閉迴路圍繞板體的顯示區域。 In some embodiments, the first colloid and the second colloid contact each other and form a closed loop around the display area of the board.

在一些實施方式中,框體具有凸起部,對應於第二膠體的位置。 In some embodiments, the frame has a raised portion corresponding to the position of the second colloid.

在一些實施方式中,第一膠體部分重疊於凸起部。 In some embodiments, the first colloid partially overlaps the raised portion.

在一些實施方式中,第二膠體進一步包括固態粒子,均勻分布於第二膠體中。 In some embodiments, the second colloid further includes solid particles uniformly distributed in the second colloid.

在一些實施方式中,固態粒子為可壓縮粒子。 In some embodiments, the solid particles are compressible particles.

在一些實施方式中,固態粒子於壓縮後具有大於或等於0.1毫米的粒徑。 In some embodiments, the solid particles have a particle size greater than or equal to 0.1 mm after compression.

在一些實施方式中,固態粒子包括不透光材料。 In some embodiments, the solid particles include an opaque material.

在一些實施方式中,固態粒子具有在OD1與OD4之間的光密度。 In some embodiments, the solid particles have an optical density between OD1 and OD4.

在一些實施方式中,在溫度23℃的環境下,第二膠體在塗佈後的1至3分鐘內具有在0.3MPa與0.5MPa之間的黏著力。 In some embodiments, at a temperature of 23°C, the second colloid has an adhesion between 0.3 MPa and 0.5 MPa within 1 to 3 minutes after coating.

在一些實施方式中,第一膠體的支撐性小於第二膠體的支撐性。 In some embodiments, the first colloid has a support property less than the second colloid.

在一些實施方式中,第二膠體的支撐性為0.1MPa。 In some embodiments, the support of the second colloid is 0.1 MPa.

在一些實施方式中,第一膠體與第二膠體沿著封閉迴路交替設置。 In some embodiments, the first colloid and the second colloid are alternately arranged along the closed loop.

在一些實施方式中,第一膠體連續地設置於板體與框體之間,形成封閉迴路。 In some embodiments, the first colloid is continuously disposed between the plate and the frame to form a closed loop.

在一些實施方式中,第二膠體連續地設置於封閉迴路的內側,並形成另一封閉迴路。 In some embodiments, the second colloid is continuously disposed inside the closed loop to form another closed loop.

在一些實施方式中,第二膠體連續地設置於封閉迴路的外側,並形成另一封閉迴路。 In some embodiments, the second colloid is continuously disposed outside the closed loop to form another closed loop.

在一些實施方式中,第二膠體間斷地設置於封閉迴路的內側。 In some embodiments, the second colloid is intermittently disposed inside the closed loop.

在一些實施方式中,第二膠體間斷地設置於封閉迴路的外側。 In some embodiments, the second colloid is intermittently disposed outside the closed loop.

本揭露的另一方面是有關於一種顯示模組包括框體、板體以及膠體。板體具有顯示區域與周邊區域。周邊區域圍繞顯示區域。膠體由水膠層固化形成。水膠層包括固態粒子,均勻分布於水膠層中。膠體設置於板體的周邊區域且連接板體與框體。 Another aspect of the present disclosure is related to a display module including a frame, a plate and a colloid. The plate has a display area and a peripheral area. The peripheral area surrounds the display area. The colloid is formed by curing a hydrogel layer. The hydrogel layer includes solid particles uniformly distributed in the hydrogel layer. The colloid is disposed in the peripheral area of the plate and connects the plate and the frame.

在一些實施方式中,膠體圍繞板體的顯示區域,形成封閉迴路。 In some embodiments, the colloid surrounds the display area of the panel to form a closed loop.

在一些實施方式中,固態粒子為可壓縮粒子。 In some embodiments, the solid particles are compressible particles.

在一些實施方式中,固態粒子於壓縮後具有大於或等於0.1毫米的粒徑。 In some embodiments, the solid particles have a particle size greater than or equal to 0.1 mm after compression.

在一些實施方式中,框體具有凸起部。 In some embodiments, the frame has a raised portion.

在一些實施方式中,固態粒子包括不透光材料。 In some embodiments, the solid particles include an opaque material.

在一些實施方式中,固態粒子具有在OD1與OD4之間的光密度。 In some embodiments, the solid particles have an optical density between OD1 and OD4.

綜上所述,於本揭露的一些實施方式的顯示模組中,使用分別具有高黏著力與高支撐性的兩種物質,可以確保同時提供板體與框體之間期望的黏著強度與間隙。進一步來說,設置具有高黏著力的第一膠體黏著板體與框體,同時藉由具有高支撐性的第二膠體達到足夠的膠體高度,以在板體與框體之間保留間隙,並且,在第一膠體完全固化前,可以藉由具有高初始黏著力的第二膠體提供板體的預固定。此外,藉由在第二膠體中設置固態粒子,可以在第一膠體完全固化前,維持板體與框體之間的間隙。相對於常見的顯示模組,可以省去作為止擋的擋體與固態膠,進而達到邊框縮窄的效果。 In summary, in the display module of some embodiments of the present disclosure, two substances having high adhesion and high support are used, respectively, to ensure that the desired adhesion strength and gap between the board and the frame are provided at the same time. Further, a first colloid having high adhesion is provided to adhere the board and the frame, and a second colloid having high support is used to achieve a sufficient colloid height to retain a gap between the board and the frame, and before the first colloid is completely cured, the second colloid having high initial adhesion can provide pre-fixation of the board. In addition, by providing solid particles in the second colloid, the gap between the board and the frame can be maintained before the first colloid is completely cured. Compared with common display modules, the stopper and solid glue can be omitted, thereby achieving the effect of narrowing the frame.

本揭露的這些與其他方面通過結合圖式對優選實施例進行以下的描述,本揭露的實施例將變得顯而易見,但在不脫離本公開的新穎概念的精神和範圍的情況下,可以進行其中的變化和修改。 These and other aspects of the present disclosure are described below in conjunction with the drawings to describe preferred embodiments, and the embodiments of the present disclosure will become apparent, but changes and modifications therein may be made without departing from the spirit and scope of the novel concepts of the present disclosure.

6,8,10,18,20,24,26:方塊 6,8,10,18,20,24,26: Blocks

100A,100B:板體 100A, 100B: Plate

110A,110B:顯示區域 110A, 110B: Display area

120A,120B:周邊區域 120A, 120B: Peripheral area

200A,200B:框體 200A, 200B: Frame

210:凸起部 210: Raised part

300A,300B,300C,300D,300E,300F,300G,300H:第一膠體 300A, 300B, 300C, 300D, 300E, 300F, 300G, 300H: First colloid

400A,400B,400C,400D,400E,400F,400G:第二膠體 400A, 400B, 400C, 400D, 400E, 400F, 400G: Second colloid

500:固態粒子 500:Solid particles

A-A,B-B,C-C:線段 A-A,B-B,C-C: line segment

D:粒徑 D: Particle size

G:間隙 G: Gap

W:寬度 W: Width

圖式繪示了本揭露的一個或多個實施例,並且與書面描述一起用於解釋本揭露之原理。在所有圖式中,儘可能使用相同的圖式標記指代實施例的相似或相同元件,其中:第1圖為根據本揭露的一些實施方式的板體、第一膠體以及第二膠體的示意圖。 The drawings illustrate one or more embodiments of the present disclosure and are used together with the written description to explain the principles of the present disclosure. In all drawings, the same drawing marks are used as much as possible to refer to similar or identical elements of the embodiments, wherein: FIG. 1 is a schematic diagram of a plate, a first colloid, and a second colloid according to some embodiments of the present disclosure.

第2圖為根據本揭露的一些實施方式的板體與框體形成的顯示模組的示意圖。 Figure 2 is a schematic diagram of a display module formed by a plate and a frame according to some embodiments of the present disclosure.

第3圖為根據本揭露的一些實施方式的顯示模組沿著線段A-A繪示的剖面示意圖。 Figure 3 is a schematic cross-sectional view of a display module along line segment A-A according to some embodiments of the present disclosure.

第4圖為根據本揭露的一些實施方式的顯示模組沿著線段B-B繪示的局部剖面圖。 Figure 4 is a partial cross-sectional view of a display module along line segment B-B according to some embodiments of the present disclosure.

第5圖為根據本揭露的一些實施方式的顯示模組沿著線段C-C繪示的局部剖面圖。 Figure 5 is a partial cross-sectional view of a display module along line segment C-C according to some embodiments of the present disclosure.

第6圖為根據本揭露的一些實施方式的顯示模組依第2圖中的方塊6繪示的局部放大圖。 FIG. 6 is a partial enlarged view of the display module according to some embodiments of the present disclosure, shown in block 6 in FIG. 2.

第7圖為根據本揭露的一些實施方式的顯示模組沿著線段A-A繪示的剖面示意圖。 Figure 7 is a schematic cross-sectional view of a display module along line segment A-A according to some embodiments of the present disclosure.

第8圖為根據本揭露的一些實施方式的顯示模組依第7圖中的方塊8繪示的局部放大圖。 FIG. 8 is a partial enlarged view of the display module according to some embodiments of the present disclosure, shown as block 8 in FIG. 7.

第9圖為根據本揭露的一些實施方式的顯示模組沿著線段A-A繪示的剖面示意圖。 Figure 9 is a schematic cross-sectional view of a display module along line segment A-A according to some embodiments of the present disclosure.

第10圖為根據本揭露的一些實施方式的顯示模組依第9圖中的方塊10繪示的局部放大圖。 FIG. 10 is a partial enlarged view of the display module according to some embodiments of the present disclosure, shown in block 10 in FIG. 9 .

第11圖為根據本揭露的一些實施方式的板體、第一膠體以及第二膠體的示意圖。 Figure 11 is a schematic diagram of a plate, a first colloid, and a second colloid according to some embodiments of the present disclosure.

第12圖為根據本揭露的一些實施方式的板體、第一膠體以及第二膠體的示意圖。 Figure 12 is a schematic diagram of a plate, a first colloid, and a second colloid according to some embodiments of the present disclosure.

第13圖為根據本揭露的一些實施方式的板體、第一膠體以及第二膠體的示意圖。 Figure 13 is a schematic diagram of a plate, a first colloid, and a second colloid according to some embodiments of the present disclosure.

第14圖為根據本揭露的一些實施方式的板體、第一膠體以及第二膠體的示意圖。 Figure 14 is a schematic diagram of a plate, a first colloid, and a second colloid according to some embodiments of the present disclosure.

第15圖為根據本揭露的另一些實施方式的板體、第一膠體以及固態粒子的示意圖。 Figure 15 is a schematic diagram of a plate, a first colloid, and solid particles according to other embodiments of the present disclosure.

第16圖為根據本揭露的另一些實施方式的顯示模組沿著線段A-A繪示的剖面示意圖。 Figure 16 is a schematic cross-sectional view of a display module along line segment A-A according to other embodiments of the present disclosure.

第17圖為根據本揭露的另一些實施方式的顯示模組沿著線段B-B繪示的剖面示意圖。 Figure 17 is a schematic cross-sectional view of a display module along line segment B-B according to other embodiments of the present disclosure.

第18圖為根據本揭露的另一些實施方式的顯示模組依第16圖中的方塊18繪示的局部放大圖。 FIG. 18 is a partial enlarged view of the display module according to other embodiments of the present disclosure, shown in block 18 in FIG. 16 .

第19圖為根據本揭露的另一些實施方式的顯示模組沿著線段A-A繪示的剖面示意圖。 Figure 19 is a schematic cross-sectional view of a display module along line segment A-A according to other embodiments of the present disclosure.

第20圖為根據本揭露的另一些實施方式的顯示模組依第19圖中的方塊20繪示的局部放大圖。 FIG. 20 is a partial enlarged view of the display module according to other embodiments of the present disclosure, shown in block 20 in FIG. 19 .

第21圖為根據本揭露的另一些實施方式的板體、第一膠體、第二膠體以及固態粒子的示意圖。 Figure 21 is a schematic diagram of a plate, a first colloid, a second colloid, and solid particles according to other embodiments of the present disclosure.

第22圖為根據本揭露的另一些實施方式的顯示模組沿著線段A-A繪示的剖面示意圖。 Figure 22 is a schematic cross-sectional view of a display module along line segment A-A according to other embodiments of the present disclosure.

第23圖為根據本揭露的另一些實施方式的顯示模組沿著線段B-B繪示的剖面示意圖。 Figure 23 is a schematic cross-sectional view of a display module along line segment B-B according to other embodiments of the present disclosure.

第24圖為根據本揭露的另一些實施方式的顯示模組依第22圖中的方塊24繪示的局部放大圖。 FIG. 24 is a partial enlarged view of the display module according to other embodiments of the present disclosure, shown in block 24 in FIG. 22 .

第25圖為根據本揭露的另一些實施方式的顯示模組沿著線段A-A繪示的剖面示意圖。 Figure 25 is a schematic cross-sectional view of a display module along line segment A-A according to other embodiments of the present disclosure.

第26圖為根據本揭露的另一些實施方式的顯示模組依第25圖中的方塊26繪示的局部放大圖。 FIG. 26 is a partial enlarged view of the display module according to other embodiments of the present disclosure, shown as block 26 in FIG. 25 .

以下揭露內容現在在此將透過圖式及參考資料被更完整描述,一些示例性的實施例被繪示在圖式中。本揭露可以被以不同形式實施並且不應被以下提及的實施例所限制。但是,這些實施例被提供以幫助更完整的理解本揭露之內容並且向本領域之技術人員充分傳達本揭露的範圍。 The following disclosure will now be more fully described here through figures and references, and some exemplary embodiments are illustrated in the figures. The present disclosure can be implemented in different forms and should not be limited by the embodiments mentioned below. However, these embodiments are provided to help a more complete understanding of the content of the present disclosure and fully convey the scope of the present disclosure to those skilled in the art.

在圖式中,為了清楚起見,放大了層、膜、面板、區域等的厚度。在整個說明書中,相同的參考標號會貫穿全文指代相似元件。應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件「上」或「連接到」另一元件時,其可以直接在另一元件上或與另一元件連接,或者中 間元件可以也存在。相反,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。 In the drawings, the thickness of layers, films, panels, regions, etc., is exaggerated for clarity. Throughout the specification, the same reference numerals will refer to similar elements throughout the text. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to another element, or intermediate elements may also exist. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intermediate elements.

請參照第1圖,其為根據本揭露的一些實施方式的板體100A、第一膠體300A以及第二膠體400A的示意圖。在一些實施方式中,板體100A為顯示面板。如第1圖中所示,板體100A具有顯示區域110A與周邊區域120A。周邊區域120A圍繞顯示區域110A。第一膠體300A與第二膠體400A設置於周邊區域120A上。 Please refer to FIG. 1, which is a schematic diagram of a board 100A, a first colloid 300A, and a second colloid 400A according to some embodiments of the present disclosure. In some embodiments, the board 100A is a display panel. As shown in FIG. 1, the board 100A has a display area 110A and a peripheral area 120A. The peripheral area 120A surrounds the display area 110A. The first colloid 300A and the second colloid 400A are disposed on the peripheral area 120A.

請參照第2圖,其為根據本揭露的一些實施方式的板體100A與框體200A形成的顯示模組的示意圖。具體來說,將板體100A設有第一膠體300A與第二膠體400A的一面(即第1圖中繪示的面)面向框體200A設置,使得第一膠體300A與第二膠體400A接觸框體200A並與其黏著,所形成的顯示模組的俯視圖即如第2圖中所示,其沿線段A-A剖切的剖面示意圖則如第3圖中所示。在一些實施方式中,框體200A為金屬殼體。 Please refer to FIG. 2, which is a schematic diagram of a display module formed by a board 100A and a frame 200A according to some embodiments of the present disclosure. Specifically, the board 100A is provided with a side (i.e., the side shown in FIG. 1) of the first colloid 300A and the second colloid 400A facing the frame 200A, so that the first colloid 300A and the second colloid 400A contact and adhere to the frame 200A. The top view of the display module formed is shown in FIG. 2, and the cross-sectional schematic diagram thereof cut along the line segment A-A is shown in FIG. 3. In some embodiments, the frame 200A is a metal shell.

第2圖中的線段A-A、線段B-B以及線段C-C為參考剖面。應當理解,儘管在第2圖中標註元件為板體100A與框體200A,然而,在後續圖式中,由本揭露的另一些實施方式形成的顯示模組亦以上述三個參考剖面進行繪示。 Line segments A-A, B-B, and C-C in FIG. 2 are reference cross sections. It should be understood that although the components labeled in FIG. 2 are the plate 100A and the frame 200A, in the subsequent drawings, the display modules formed by other embodiments of the present disclosure are also depicted using the above three reference cross sections.

請參照第3圖,其為根據線段A-A繪示的顯示模組的剖面示意圖。如第3圖中所示,第一膠體300A與第二膠體400A連接板體100A與框體200A。 Please refer to Figure 3, which is a cross-sectional schematic diagram of the display module drawn according to the line segment A-A. As shown in Figure 3, the first gel 300A and the second gel 400A connect the board 100A and the frame 200A.

第一膠體300A由第一水膠層固化形成,第二膠體400A由第二水膠層固化形成。在一些實施方式中,第一水膠層與第二水膠層分別包括不同組成。第二膠體400A在第一膠體300A完全固化前提供將板體100A預固定於框體200A上的黏著力,並在顯示模組中,提供板體100A支撐力,以維持板體100A與框體200A之間的間隙G(如第4圖中所示)。 The first gel 300A is formed by curing the first hydrogel layer, and the second gel 400A is formed by curing the second hydrogel layer. In some embodiments, the first hydrogel layer and the second hydrogel layer include different components. The second gel 400A provides adhesive force to pre-fix the board 100A on the frame 200A before the first gel 300A is completely cured, and in the display module, provides support force for the board 100A to maintain the gap G between the board 100A and the frame 200A (as shown in Figure 4).

進一步來說,在一些實施方式中,在溫度23℃的環境下,第二膠體400A在塗佈後的1至3分鐘內的初始黏著力在0.3MPa與0.5MPa之間,以避免板體100A在第一水膠層固化的過程中相對於框體200A滑移。應當理解,在整個說明書中,黏著力代表使膠體自被黏著物剝離所需要的應力。換言之,在一些實施方式中,在溫度23℃的環境下,將第二膠體400A黏著於板體100A與框體200A之間後,需提供在0.3MPa與0.5MPa之間的應力才能使第二膠體400A自板體100A或框體200A剝離。在一些實施方式中,第二膠體400A的初始黏著力大於第一膠體300A的初始黏著力。 Further, in some embodiments, in an environment with a temperature of 23°C, the initial adhesion of the second gel 400A within 1 to 3 minutes after coating is between 0.3 MPa and 0.5 MPa to prevent the board 100A from slipping relative to the frame 200A during the curing process of the first hydrogel layer. It should be understood that throughout the specification, adhesion represents the stress required to peel the gel from the adherend. In other words, in some embodiments, in an environment with a temperature of 23°C, after the second gel 400A is adhered between the board 100A and the frame 200A, a stress between 0.3 MPa and 0.5 MPa is required to peel the second gel 400A from the board 100A or the frame 200A. In some embodiments, the initial adhesion of the second colloid 400A is greater than the initial adhesion of the first colloid 300A.

在一些實施方式中,第一水膠層與第二水膠層的不同組成使得第二膠體400A的支撐性大於第一膠體300A的支撐性,使得在顯示區域110A中,板體100A與框體200A之間具有間隙G。應當理解,在整個說明書中,支撐性代表在預設的壓縮範圍內,膠體所能承受的壓應力。舉例來說,在一些實施方式中,第二膠體400A具有0.1 MPa的支撐性,代表第二膠體400A在承受0.1MPa的壓應力時,在受力方向上的壓縮率小於或等於30%。 In some embodiments, the different compositions of the first hydrogel layer and the second hydrogel layer make the support of the second colloid 400A greater than the support of the first colloid 300A, so that in the display area 110A, there is a gap G between the board 100A and the frame 200A. It should be understood that throughout the specification, support represents the compressive stress that the colloid can withstand within a preset compression range. For example, in some embodiments, the second colloid 400A has a support of 0.1 MPa, which means that when the second colloid 400A is subjected to a compressive stress of 0.1MPa, the compression rate in the force direction is less than or equal to 30%.

在一些實施方式中,第一水膠層與第二水膠層的不同組成使得完全固化後的第一膠體300A的黏著力大於第二膠體400A的黏著力。換言之,在第一膠體300A與第二膠體400A完全固化後,主要由第一膠體300A提供板體100A與框體200A之間的黏著力。舉例來說,在一些實施方式中,固化後的第一膠體300A具有1MPa以上的黏著力。 In some embodiments, the different compositions of the first hydrogel layer and the second hydrogel layer make the adhesion of the first gel 300A after full curing greater than the adhesion of the second gel 400A. In other words, after the first gel 300A and the second gel 400A are fully cured, the adhesion between the board 100A and the frame 200A is mainly provided by the first gel 300A. For example, in some embodiments, the cured first gel 300A has an adhesion of more than 1 MPa.

請再次參照第1圖,在一些實施方式中,第一膠體300A與第二膠體400A相互接觸,並形成一封閉迴路圍繞顯示區域110A。在一些實施方式中,多個第一膠體300A與第二膠體400A沿著封閉迴路交替設置。如此一來,第二膠體400A可以為板體100A提供平均的支撐性,而第一膠體300A為板體100A與框體200A之間提供黏著力。同時,第一膠體300A有助於第二膠體400A黏固在其位置上。 Please refer to Figure 1 again. In some embodiments, the first colloid 300A and the second colloid 400A contact each other and form a closed loop around the display area 110A. In some embodiments, multiple first colloids 300A and second colloids 400A are alternately arranged along the closed loop. In this way, the second colloid 400A can provide even support for the board 100A, while the first colloid 300A provides adhesion between the board 100A and the frame 200A. At the same time, the first colloid 300A helps the second colloid 400A to stick to its position.

在另一些實施方式的製程中,先將第一水膠層間斷地塗佈於周邊區域120A的預定位置。接著塗佈第二水膠層,並進行固化,形成第二膠體400A,以形成如第1圖中所示的封閉迴路,再進行第一水膠層的固化,形成第一膠體300A。 In the process of other embodiments, the first hydrogel layer is first applied intermittently at predetermined positions of the peripheral area 120A. Then the second hydrogel layer is applied and cured to form the second gel 400A to form a closed loop as shown in FIG. 1, and then the first hydrogel layer is cured to form the first gel 300A.

在一些實施方式中,第一水膠層與第二水膠層包括具有不同組成的UV濕固型熱熔膠或其類似物。舉例來說, 反應型聚氨酯(polyurethane reactive,PUR)。如此一來,在製程中,可以先於周邊區域120A的預定位置塗佈第一水膠層。接著,將第二水膠層塗佈以形成如第1圖中所示的封閉迴路,並進行紫外光照射固化,形成第二膠體400A,再讓第一水膠層自然固化。在第一水膠層完全固化前,第二膠體400A提供支撐與固定的功能。 In some embodiments, the first hydrogel layer and the second hydrogel layer include UV wet-curable hot melt adhesive or the like having different compositions. For example, reactive polyurethane (PUR). Thus, in the manufacturing process, the first hydrogel layer can be applied to the predetermined position of the peripheral area 120A before the first hydrogel layer is applied. Then, the second hydrogel layer is applied to form a closed loop as shown in FIG. 1, and cured by ultraviolet light to form the second gel 400A, and then the first hydrogel layer is allowed to cure naturally. Before the first hydrogel layer is completely cured, the second gel 400A provides support and fixation functions.

請參照第4圖與第5圖,其分別為根據線段B-B與線段C-C繪示的顯示模組的局部剖面圖。如第4圖與第5圖中所示,第一膠體300A與第二膠體400A設置於板體100A與框體200A之間,沿著一封閉迴路(如第1圖中所示)彼此交替設置,而不內外並列。 Please refer to Figures 4 and 5, which are partial cross-sectional views of the display module drawn according to line segment B-B and line segment C-C, respectively. As shown in Figures 4 and 5, the first colloid 300A and the second colloid 400A are arranged between the plate 100A and the frame 200A, and are arranged alternately with each other along a closed loop (as shown in Figure 1), but not in parallel inside and outside.

請參照第6圖,其為根據第2圖中方塊6繪示的顯示模組的局部放大圖。如第6圖中所示,第一膠體300A與第二膠體400A相互接觸,形成一封閉迴路,以避免物質如灰塵進入顯示區域110A,提供氣密與防塵效果。在一些實施方式中,第一膠體300A與第二膠體400A之間具有明顯的接觸介面。 Please refer to FIG. 6, which is a partial enlarged view of the display module according to block 6 in FIG. 2. As shown in FIG. 6, the first colloid 300A and the second colloid 400A contact each other to form a closed loop to prevent substances such as dust from entering the display area 110A, providing airtight and dustproof effects. In some embodiments, there is a clear contact interface between the first colloid 300A and the second colloid 400A.

第7圖為根據本揭露的一些實施方式的板體100A與框體200B形成的顯示模組沿著線段A-A的剖面示意圖,第8圖為根據第7圖中方塊8繪示的局部放大圖。如第7圖與第8圖中所示,相較於框體200A,框體200B進一步包括多個凸起部210。這些凸起部210分別對應於第二膠體400B的位置,以利塗佈過程中的定位。此外,由於凸起部210的設置,第二膠體400B相較於第二膠體 400A可以具有較小的厚度,而能在固化之前提供足夠的支撐力。 FIG. 7 is a schematic cross-sectional view of a display module formed by a plate 100A and a frame 200B according to some embodiments of the present disclosure along line segment A-A, and FIG. 8 is a partial enlarged view shown in block 8 in FIG. 7. As shown in FIG. 7 and FIG. 8, compared with the frame 200A, the frame 200B further includes a plurality of protrusions 210. These protrusions 210 correspond to the positions of the second gel 400B, respectively, to facilitate positioning during the coating process. In addition, due to the provision of the protrusions 210, the second gel 400B can have a smaller thickness than the second gel 400A, and can provide sufficient support before curing.

在第7圖與第8圖所對應的實施方式中,由於第二膠體400B的黏著力小於第一膠體300A的黏著力,可能導致在凸起部210的邊緣,發生第二膠體400B與第一膠體300A之間或第二膠體400B與凸起部210之間的剝離(peeling)。因此,如第9圖與第10圖中所示,在一些實施方式中,第一膠體300B部分地重疊於凸起部210,以防止黏著力較小的第二膠體400C剝離。第9圖為根據本揭露的另一些實施方式的板體100A與框體200B形成的顯示模組沿著線段A-A的剖面示意圖,第10圖為根據第9圖中方塊10繪示的顯示模組的局部放大圖。此外,在這個實施方式中,第一膠體300B可以藉由凸起部210增加黏著面積,提供更強的抓附力,增加膠體的穩固性。 In the embodiments corresponding to FIGS. 7 and 8 , since the adhesive force of the second colloid 400B is smaller than the adhesive force of the first colloid 300A, peeling may occur between the second colloid 400B and the first colloid 300A or between the second colloid 400B and the convex portion 210 at the edge of the protrusion 210. Therefore, as shown in FIGS. 9 and 10 , in some embodiments, the first colloid 300B partially overlaps the convex portion 210 to prevent the second colloid 400C with smaller adhesive force from peeling. FIG. 9 is a schematic cross-sectional view of a display module formed by a plate 100A and a frame 200B along line segment A-A according to other embodiments of the present disclosure, and FIG. 10 is a partial enlarged view of the display module shown in block 10 in FIG. 9. In addition, in this embodiment, the first colloid 300B can increase the adhesive area by means of the protrusion 210, provide a stronger gripping force, and increase the stability of the colloid.

請參照第11圖,其為根據本揭露的一些實施方式的板體100B、第一膠體300C以及第二膠體400D的示意圖。如第11圖中所示,板體100B具有顯示區域110B與周邊區域120B。第一膠體300C與第二膠體400D設置於周邊區域120B上。第一膠體300C連續地設置,形成一封閉迴路。第二膠體400D連續地設置於第一膠體300C的內側並與第一膠體300C接觸,形成另一封閉迴路。如第1圖與第11圖中所示,在維持相同的膠體塗佈寬度W的情況下,板體100B相較於板體100A具有較小的顯示區域110B與較大的周邊區域120B。 Please refer to FIG. 11, which is a schematic diagram of a board 100B, a first colloid 300C, and a second colloid 400D according to some embodiments of the present disclosure. As shown in FIG. 11, the board 100B has a display area 110B and a peripheral area 120B. The first colloid 300C and the second colloid 400D are arranged on the peripheral area 120B. The first colloid 300C is arranged continuously to form a closed loop. The second colloid 400D is arranged continuously on the inner side of the first colloid 300C and contacts the first colloid 300C to form another closed loop. As shown in FIG. 1 and FIG. 11, while maintaining the same colloid coating width W, the board 100B has a smaller display area 110B and a larger peripheral area 120B than the board 100A.

請參照第12圖,其為根據本揭露的一些實施方式的板體100B、第一膠體300D以及第二膠體400E的示意圖。如第12圖中所示,第一膠體300D連續地設置,形成一封閉迴路。相對於第二膠體400D,第二膠體400E連續地設置於第一膠體300D的外側並與第一膠體300D接觸,形成另一封閉迴路。 Please refer to FIG. 12, which is a schematic diagram of the plate 100B, the first colloid 300D, and the second colloid 400E according to some embodiments of the present disclosure. As shown in FIG. 12, the first colloid 300D is continuously arranged to form a closed loop. Relative to the second colloid 400D, the second colloid 400E is continuously arranged on the outer side of the first colloid 300D and contacts the first colloid 300D to form another closed loop.

請參照第13圖,其為根據本揭露的一些實施方式的板體100B、第一膠體300E以及第二膠體400F的示意圖。如第13圖中所示,第一膠體300E連續地設置,形成一封閉迴路。相對於第11圖中的第二膠體400D,第二膠體400F間斷地設置於第一膠體300E的內側,並與第一膠體300E接觸。 Please refer to FIG. 13, which is a schematic diagram of the plate 100B, the first colloid 300E and the second colloid 400F according to some embodiments of the present disclosure. As shown in FIG. 13, the first colloid 300E is continuously arranged to form a closed loop. Compared with the second colloid 400D in FIG. 11, the second colloid 400F is intermittently arranged on the inner side of the first colloid 300E and contacts the first colloid 300E.

請參照第14圖,其為根據本揭露的一些實施方式的板體100B、第一膠體300F以及第二膠體400G的示意圖。如第14圖中所示,第一膠體300F連續地設置,形成一封閉迴路。相對於第12圖中的第二膠體400E,第14圖中的第二膠體400G間斷地設置於第一膠體300F的外側,並與第一膠體300F接觸。 Please refer to FIG. 14, which is a schematic diagram of the plate 100B, the first colloid 300F and the second colloid 400G according to some embodiments of the present disclosure. As shown in FIG. 14, the first colloid 300F is continuously arranged to form a closed loop. Compared with the second colloid 400E in FIG. 12, the second colloid 400G in FIG. 14 is intermittently arranged on the outer side of the first colloid 300F and contacts the first colloid 300F.

請參照第15圖,其為根據本揭露的另一些實施方式的板體100A、第一膠體300G以及固態粒子500的示意圖。如第15圖中所示,在一些實施方式中,顯示模組可以藉由一種水膠層黏接,並在水膠層中加入固態粒子500,使得固態粒子500均勻分布在水膠層中,提供支撐力。舉例來說,如第15圖中所示,第一膠體300G設置於板體 100A的周邊區域120A上,固態粒子500均勻分布在第一膠體300G中。第一膠體300G圍繞顯示區域110A,並形成一封閉迴路。 Please refer to FIG. 15, which is a schematic diagram of a board 100A, a first colloid 300G, and solid particles 500 according to other embodiments of the present disclosure. As shown in FIG. 15, in some embodiments, the display module can be bonded by a hydrogel layer, and solid particles 500 are added to the hydrogel layer so that the solid particles 500 are evenly distributed in the hydrogel layer to provide support. For example, as shown in FIG. 15, the first colloid 300G is disposed on the peripheral area 120A of the board 100A, and the solid particles 500 are evenly distributed in the first colloid 300G. The first colloid 300G surrounds the display area 110A and forms a closed loop.

第16圖為根據本揭露的另一些實施方式的板體100A與框體200A形成的顯示模組沿著線段A-A的顯示模組的剖面示意圖。第17圖為沿著線段B-B的顯示模組的剖面示意圖。第18圖為根據第16圖中方塊18繪示的顯示模組的局部放大圖。 FIG. 16 is a schematic cross-sectional view of a display module formed by a plate body 100A and a frame body 200A according to other embodiments of the present disclosure along line segment A-A. FIG. 17 is a schematic cross-sectional view of a display module along line segment B-B. FIG. 18 is a partial enlarged view of a display module shown in block 18 in FIG. 16.

相似地,第一膠體300G由第一水膠層固化形成。第一膠體300G在固化後提供板體100A與框體200A之間的黏著力。舉例來說,在一些實施方式中,固化後的第一膠體300G具有1MPa以上的黏著力。 Similarly, the first colloid 300G is formed by curing the first hydrocolloid layer. After curing, the first colloid 300G provides adhesion between the board 100A and the frame 200A. For example, in some embodiments, the cured first colloid 300G has an adhesion of more than 1 MPa.

在第一水膠層固化形成第一膠體300G的過程中,固態粒子500提供支撐力,以確保在顯示區域110A中,板體100A與框體200A之間具有所需的間隙G。在一些實施方式中,固態粒子500為可壓縮粒子。舉例來說,固態粒子500為橡膠球。 During the process of curing the first hydrogel layer to form the first gel 300G, the solid particles 500 provide support to ensure that there is a required gap G between the board 100A and the frame 200A in the display area 110A. In some embodiments, the solid particles 500 are compressible particles. For example, the solid particles 500 are rubber balls.

由於受到板體100A施加的壓力,固態粒子500產生壓縮,因此在第一水膠層完全固化後,固態粒子500處於被壓縮的狀態。舉例來說,在一些實施方式中,在第一水膠層固化後,固態粒子500壓縮後的粒徑D大於或等於0.1毫米,如第17圖中所示。相應地,板體100A與框體200A之間的間隙G大於或等於0.1毫米。 Due to the pressure applied by the plate 100A, the solid particles 500 are compressed, so after the first hydrogel layer is completely cured, the solid particles 500 are in a compressed state. For example, in some embodiments, after the first hydrogel layer is cured, the particle size D of the compressed solid particles 500 is greater than or equal to 0.1 mm, as shown in FIG. 17. Correspondingly, the gap G between the plate 100A and the frame 200A is greater than or equal to 0.1 mm.

為了防止顯示模組通過膠體溢光,在一些實施方式中,固態粒子500包括不透光材料。舉例來說,固態粒子500具有跟第一膠體300G接近的透光度。例如,固態粒子500的光密度在OD1與OD4之間。在一些實施方式中,固態粒子500呈現黑色。 In order to prevent the display module from overflowing through the colloid, in some embodiments, the solid particles 500 include opaque materials. For example, the solid particles 500 have a transmittance close to that of the first colloid 300G. For example, the optical density of the solid particles 500 is between OD1 and OD4. In some embodiments, the solid particles 500 appear black.

請參照第19圖,其為根據本揭露的一些實施方式的板體100A與框體200B形成的顯示模組沿著線段A-A的剖面示意圖。第20圖為根據第19圖中方塊20繪示的局部放大圖。 Please refer to Figure 19, which is a schematic cross-sectional view of a display module formed by a plate 100A and a frame 200B along line segment A-A according to some embodiments of the present disclosure. Figure 20 is a partial enlarged view of block 20 in Figure 19.

與第7圖、第8圖的實施方式相似,在第19圖、第20圖中,框體200B進一步包括多個凸起部210。由於凸起部210的設置,第一膠體300H可以在部分位置具有較小的厚度,而能在固化之前提供足夠的支撐力。同時,固態粒子500可以具有較小的壓縮後粒徑D,而能維持板體100A與框體200A之間具有間隙G。此外,第一膠體300H可以藉由凸起部210增加黏著面積,提供更強的抓附力,增加膠體的穩固性。 Similar to the implementation of Figures 7 and 8, in Figures 19 and 20, the frame 200B further includes a plurality of protrusions 210. Due to the provision of the protrusions 210, the first colloid 300H can have a smaller thickness at some locations, and can provide sufficient support before solidification. At the same time, the solid particles 500 can have a smaller compressed particle size D, and can maintain a gap G between the plate 100A and the frame 200A. In addition, the first colloid 300H can increase the adhesion area through the protrusions 210, provide a stronger gripping force, and increase the stability of the colloid.

請參照第21圖,其為根據本揭露的一些實施方式的板體100A、第一膠體300A、第二膠體400A以及固態粒子500的示意圖。與第1圖的實施方式不同,第21圖的顯示模組進一步包括固態粒子500均勻分布在第二膠體400A中。 Please refer to FIG. 21, which is a schematic diagram of a plate 100A, a first colloid 300A, a second colloid 400A, and solid particles 500 according to some embodiments of the present disclosure. Different from the embodiment of FIG. 1, the display module of FIG. 21 further includes solid particles 500 uniformly distributed in the second colloid 400A.

請參照第22圖、第23圖以及第24圖。第22圖為根據本揭露的另一些實施方式的板體100A與框體 200A形成的顯示模組沿著線段A-A的剖面示意圖。第23圖為沿著與線段B-B的剖面示意圖。第24圖為根據第22圖中方塊24繪示的顯示模組的局部放大圖。與第3圖、第4圖以及第6圖中所示不同,在這個實施方式中,顯示模組進一步包括固態粒子500均勻分布在第二膠體400A中,為第二膠體400A提供進一步的支撐力,增加膠體的穩固性。 Please refer to Figures 22, 23 and 24. Figure 22 is a schematic cross-sectional view of a display module formed by a plate body 100A and a frame body 200A according to other embodiments of the present disclosure along line segment A-A. Figure 23 is a schematic cross-sectional view along line segment B-B. Figure 24 is a partial enlarged view of a display module shown in block 24 in Figure 22. Different from Figures 3, 4 and 6, in this embodiment, the display module further includes solid particles 500 uniformly distributed in the second colloid 400A, providing further support for the second colloid 400A and increasing the stability of the colloid.

請參照第25圖與第26圖。第25圖為根據本揭露的另一些實施方式的板體100A與框體200B形成的顯示模組沿著線段A-A的剖面示意圖。第26圖為根據第25圖中方塊26繪示的顯示模組的局部放大圖。與第9圖、第10圖中所示不同,顯示模組進一步包括固態粒子500均勻分布在第二膠體400A中,為第二膠體400A提供進一步的支撐力。 Please refer to Figures 25 and 26. Figure 25 is a schematic cross-sectional view of a display module formed by a plate 100A and a frame 200B according to other embodiments of the present disclosure along line segment A-A. Figure 26 is a partial enlarged view of a display module shown in block 26 in Figure 25. Different from Figures 9 and 10, the display module further includes solid particles 500 uniformly distributed in the second colloid 400A to provide further support for the second colloid 400A.

以上對於本揭露之具體實施方式之詳述,可以明顯地看出,於本揭露的一些實施方式的顯示模組中,使用分別具有高黏著力與高支撐性的兩種物質,可以確保同時提供板體與框體之間期望的黏著強度與間隙。進一步來說,設置具有高黏著力的第一膠體黏著板體與框體,同時藉由具有高支撐性的第二膠體達到足夠的膠體高度,以在板體與框體之間保留間隙,並且,在第一膠體完全固化前,可以藉由具有高初始黏著力的第二膠體提供板體的預固定。此外,藉由在第二膠體中設置固態粒子,可以在第一膠體完全固化前,維持板體與框體之間的間隙。相對於常見的 顯示模組,可以省去作為止擋的擋體與固態膠,進而達到邊框縮窄的效果。 From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the display module of some embodiments of the present disclosure, the use of two materials with high adhesion and high support can ensure that the desired adhesion strength and gap between the board and the frame are provided at the same time. Further, a first colloid with high adhesion is provided to adhere the board and the frame, and at the same time, a sufficient colloid height is achieved by a second colloid with high support to retain a gap between the board and the frame, and before the first colloid is completely cured, the second colloid with high initial adhesion can provide pre-fixation of the board. In addition, by providing solid particles in the second colloid, the gap between the board and the frame can be maintained before the first colloid is completely cured. Compared with the common display module, the stopper and solid glue can be omitted, thereby achieving the effect of narrowing the frame.

前面描述內容僅對於本揭露之示例性實施例給予說明和描述,並無意窮舉或限制本揭露所公開之發明的精確形式。以上教示可以被修改或者進行變化。 The foregoing description is merely illustrative and descriptive of exemplary embodiments of the present disclosure and is not intended to limit the precise form of the invention disclosed by the present disclosure. The above teachings may be modified or varied.

被選擇並說明的實施例是用以解釋本揭露之內容以及他們的實際應用從而激發本領域之其他技術人員利用本揭露及各種實施例,並且進行各種修改以符合預期的特定用途。在不脫離本揭露之精神和範圍的前提下,替代性實施例將對於本揭露所屬領域之技術人員來說為顯而易見者。因此,本揭露的範圍是根據所附發明申請專利範圍而定,而不是被前述說明書和其中所描述之示例性實施例所限定。 The embodiments selected and described are used to explain the content of the present disclosure and their practical applications to inspire other technicians in the field to use the present disclosure and various embodiments, and make various modifications to meet the expected specific uses. Alternative embodiments will be obvious to technicians in the field to which the present disclosure belongs without departing from the spirit and scope of the present disclosure. Therefore, the scope of the present disclosure is based on the scope of the attached invention application, rather than being limited by the aforementioned specification and the exemplary embodiments described therein.

100A:板體 100A: Plate

110A:顯示區域 110A: Display area

120A:周邊區域 120A: Peripheral area

300A:第一膠體 300A: First colloid

400A:第二膠體 400A: Second colloid

500:固態粒子 500:Solid particles

Claims (16)

一種顯示模組,包含: 一框體; 一板體,具有一顯示區域與一周邊區域,該周邊區域圍繞該顯示區域; 一第一膠體,由一第一水膠層固化形成,該第一水膠層包含複數個固態粒子,均勻分布於該第一水膠層中;以及 一第二膠體,由一第二水膠層固化形成,其中該第一水膠層與該第二水膠層分別包含不同組成, 其中該第一膠體與該第二膠體設置於該板體的該周邊區域且連接該板體與該框體。 A display module comprises: a frame; a plate having a display area and a peripheral area, the peripheral area surrounding the display area; a first colloid formed by solidifying a first hydrogel layer, the first hydrogel layer comprising a plurality of solid particles uniformly distributed in the first hydrogel layer; and a second colloid formed by solidifying a second hydrogel layer, wherein the first hydrogel layer and the second hydrogel layer respectively comprise different compositions, wherein the first colloid and the second colloid are arranged in the peripheral area of the plate and connect the plate and the frame. 如請求項1所述之顯示模組,其中該第一膠體圍繞該板體的該顯示區域,形成一封閉迴路。The display module as described in claim 1, wherein the first colloid surrounds the display area of the board to form a closed loop. 如請求項2所述之顯示模組,其中該第一膠體具有1 MPa以上的一黏著力。The display module as described in claim 2, wherein the first colloid has an adhesion force of more than 1 MPa. 如請求項1所述之顯示模組,其中該些固態粒子為可壓縮粒子。A display module as described in claim 1, wherein the solid particles are compressible particles. 如請求項4所述之顯示模組,其中該些固態粒子於壓縮後具有大於或等於0.1毫米的一粒徑。A display module as described in claim 4, wherein the solid particles have a particle size greater than or equal to 0.1 mm after compression. 如請求項1所述之顯示模組,其中該框體具有複數個凸起部。A display module as described in claim 1, wherein the frame has a plurality of protrusions. 如請求項1所述之顯示模組,其中該些固態粒子包含不透光材料。A display module as described in claim 1, wherein the solid particles comprise opaque material. 如請求項1所述之顯示模組,其中該些固態粒子具有在OD1與OD4之間的一光密度。A display module as described in claim 1, wherein the solid particles have an optical density between OD1 and OD4. 如請求項1所述之顯示模組,其中該第二膠體的一黏著力大於該第一膠體的一黏著力。The display module as described in claim 1, wherein an adhesion force of the second colloid is greater than an adhesion force of the first colloid. 如請求項1所述之顯示模組,其中該第二膠體具有1 MPa以上的一黏著力。The display module as described in claim 1, wherein the second colloid has an adhesion force of more than 1 MPa. 如請求項1所述之顯示模組,其中該第一膠體與該第二膠體相互接觸。The display module as described in claim 1, wherein the first colloid and the second colloid are in contact with each other. 如請求項1所述之顯示模組,其中該框體具有一凸起部對應於該第一膠體的一位置。A display module as described in claim 1, wherein the frame has a protrusion corresponding to a position of the first colloid. 如請求項12所述之顯示模組,其中該第二膠體部分重疊於該凸起部。A display module as described in claim 12, wherein the second colloid portion overlaps the protrusion. 如請求項1所述之顯示模組,其中在溫度23℃的環境下,該第一膠體在塗佈後的1至3分鐘內具有在0.3 MPa與0.5 MPa之間的一黏著力。The display module as claimed in claim 1, wherein the first colloid has an adhesion between 0.3 MPa and 0.5 MPa within 1 to 3 minutes after coating at a temperature of 23°C. 如請求項1所述之顯示模組,其中該第一膠體的一支撐性大於該第二膠體的一支撐性。A display module as described in claim 1, wherein the first colloid has a greater support than the second colloid. 如請求項15所述之顯示模組,其中該第一膠體的一支撐性為0.1 MPa。A display module as described in claim 15, wherein the first colloid has a support strength of 0.1 MPa.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010060591A (en) * 2008-09-01 2010-03-18 Epson Imaging Devices Corp Electro-optical device, electronic equipment, and method for manufacturing electro-optical device
TW201316051A (en) * 2011-10-07 2013-04-16 Hannstar Display Corp Polarizer, display module, tough display device and manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010060591A (en) * 2008-09-01 2010-03-18 Epson Imaging Devices Corp Electro-optical device, electronic equipment, and method for manufacturing electro-optical device
TW201316051A (en) * 2011-10-07 2013-04-16 Hannstar Display Corp Polarizer, display module, tough display device and manufacturing the same

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