TWI887969B - Cu-Ag-Sn alloy wire and its manufacturing method, and probe for electrical and electronic component inspection using Cu-Ag-Sn alloy wire - Google Patents

Abstract

The purpose of the invention of the present application is to provide a Cu-Ag-Sn alloy wire and a method for manufacturing the same, which has a good balance between low resistance and high hardness, excellent casting workability, stable product quality, and reduced manufacturing cost. To achieve this purpose, the invention of the present application uses a Cu-Ag-Sn alloy wire containing 6wt%~10wt% Ag, 0.1wt%~0.9wt% Sn, and the remainder is composed of Cu and inevitable impurities, and a method for manufacturing the same.

Description

Cu-Ag-Sn alloy wire and its manufacturing method, and probe for electrical and electronic component inspection using Cu-Ag-Sn alloy wire

The invention of this application relates to a Cu-Ag-Sn alloy wire and a method for manufacturing the same, as well as a probe pin for inspecting electrical and electronic components obtained by using the Cu-Ag-Sn alloy wire.

In the past, probe cards, contact probes, etc. have been known as probes for inspecting electrical and electronic components such as semiconductor integrated circuits and semiconductor packages with narrow pitch electrodes. These probes for inspecting electrical and electronic components use a plurality of probes made of extremely small diameter metal wires (also called metal fine wires and alloy fine wires). Furthermore, the metal wires used for the probes are expected to have a good balance between low resistance and high hardness. In addition, extremely small diameter metal wires with such characteristics are used as conductor materials for wires and cables in electronic equipment such as mobile devices, industrial robots, and medical equipment, and there is also a high demand.

Patent document 1 discloses the invention of a Cu-Ag alloy fine wire having both high conductivity and high strength. Furthermore, the Cu-Ag alloy fine wire of this patent document 1 is characterized by "the Cu-Ag alloy fine wire having an Ag content of 1 to 10 wt%, the remainder being Cu and inevitable impurities, and the entire structure of the Cu solid solution being composed of a recrystallized structure" (see claim 1 of patent document 1).

In addition, Patent Document 2 discloses "an alloy material comprising 10-30wt% silver (Ag), 0.5-10wt% nickel (Ni), 0.01-0.1wt% iridium (Ir), 5-20wt% palladium (Pd), 0.5-5wt% tin (Sn), a combination of ruthenium (Ru) and Ir with an upper limit of 0.1wt% and 0-0.09wt%, and the remainder being copper (Cu) and inevitable impurities" (see Patent Document 2, claim 1). [Prior Art Document] [Patent Document]

[Patent document 1]    Japanese Patent No. 5051647 [Patent document 2]    Japanese Patent No. 6728057

[The problem the invention is trying to solve]

However, the invention described in Patent Document 1 does not have sufficient casting workability when stably obtaining metal wires with a minimum diameter of 110 μm or less, and therefore does not meet the "stable product quality" required by the industry. In addition, the invention described in Patent Document 2 requires the inclusion of five or more metals as components in order to obtain an alloy material with a hardness of 300 HV or more as a probe for inspecting electrical and electronic components, so the manufacturing cost is relatively high (see Table 1 of Patent Document 2). Therefore, the market is demanding a metal wire and a method for manufacturing the same that has a good balance between low resistance and high hardness, excellent casting workability, stable product quality, and suppressed manufacturing costs. [Means for solving the problem]

The inventor of this application has made great efforts to solve the above-mentioned problem by adopting the following means.

A. Cu-Ag-Sn alloy wire The Cu-Ag-Sn alloy wire of this application is characterized in that it contains 6wt%~10wt% Ag, 0.1wt%~0.9wt% Sn, and the remainder is composed of Cu and inevitable impurities.

The Cu-Ag-Sn alloy wire of the present application preferably has a total content of unavoidable impurities of 0.02wt% or less.

The Cu-Ag-Sn alloy wire of the present application preferably has a specific resistance of less than 5 μΩ·cm and a Vickers hardness of 300HV~360HV.

The Cu-Ag-Sn alloy wire of the present application preferably has a diameter of 110 μm or less.

B. Probe for inspecting electrical and electronic components The probe for inspecting electrical and electronic components of this application is characterized in that it is obtained by using the Cu-Ag-Sn alloy wire of this application.

C. Method for manufacturing Cu-Ag-Sn alloy wire The method for manufacturing Cu-Ag-Sn alloy wire of the present application is the method for manufacturing the above-mentioned Cu-Ag-Sn alloy wire of the present application, and is characterized in that it comprises the following steps 1 to 4: Step 1: The metal raw material is prepared into a composition of 6wt%~10wt% Ag, 0.1wt%~0.9wt% Sn, and the remainder is Cu and inevitable impurities, and is melted in a vacuum or inert gas to obtain an ingot; Step 2: The ingot is subjected to a solution treatment in an inert gas or a slightly reducing gas to obtain an ingot after the solution treatment; Step 3: For the ingot that has been solution treated, after cold working with a cross-sectional reduction rate of more than 25%, aging treatment is performed in an inert gas or a slightly reducing gas, thereby obtaining an ingot that has been aging treated; and Step 4: For the ingot that has been aging treated, cold working with a cross-sectional reduction rate of more than 99.95% is further performed to obtain a Cu-Ag-Sn alloy wire.

In the method for manufacturing the Cu-Ag-Sn alloy wire of the present application, it is preferred that the total content of unavoidable impurities in the ingot in the aforementioned step 1 is less than 0.02wt%. [Effect of the invention]

According to the invention of the present application, a Cu-Ag-Sn alloy wire and a method for manufacturing the same can be provided, which has a good balance between low resistance and high hardness, excellent casting workability, stable product quality, and suppressed manufacturing cost. In addition, according to the invention of the present application, a probe for inspecting electrical and electronic components can be provided, which has market value and high reliability for inspecting semiconductor integrated circuits and semiconductor packages with narrow pitch electrodes.

[Form used to implement the invention]

A. Cu-Ag-Sn alloy wire The Cu-Ag-Sn alloy wire of the present application is characterized in that it contains 6wt%~10wt% Ag, 0.1wt%~0.9wt% Sn, and the remainder is composed of Cu and inevitable impurities. The Cu-Ag-Sn alloy wire of the present application has a good balance between low resistance and high hardness, excellent casting workability, stable product quality, and suppressed manufacturing cost by having this structure.

The main component of the Cu-Ag-Sn alloy wire of the present application is copper (Cu). Although copper has low electrical resistance, its hardness is relatively low, so copper alone cannot form an alloy wire with good durability. Therefore, a certain amount of silver (Ag) is added as a component, and it is heat-treated (solution treatment and aging treatment) together with copper, and hardened by precipitation of silver to form a high-hardness alloy wire. The appropriate silver content in the Cu-Ag-Sn alloy wire of the present application is 6wt%~10wt%. Here, if the silver content of this Cu-Ag-Sn alloy wire is less than 6wt%, there is a tendency that the effect of improving hardness cannot be obtained by precipitation hardening of silver, so it is not good. On the other hand, even if the silver content of the Cu-Ag-Sn alloy wire exceeds 10wt%, the hardness does not increase dramatically, but the raw material cost tends to increase, which makes the cost balance of the product worse, so it is not good.

In addition, the Cu-Ag-Sn alloy wire in this application contains 0.1wt%~0.9wt% tin (Sn). If a predetermined amount of tin is added as an ingredient during the production of this alloy wire rod, the melting point of the alloy as the casting raw material will be lowered, thereby improving the fluidity of the molten liquid (melted metal). Therefore, the casting processability will be significantly improved and the quality of the casting ingot will be stabilized. As a result, the alloy wire obtained will become a product with extremely stable quality. Here, if the tin content of the Cu-Ag-Sn alloy wire rod is less than 0.1 wt%, the effect of stabilizing the product quality of the alloy wire rod by improving the casting processability tends to be unfavorable. On the other hand, even if the tin content of the Cu-Ag-Sn alloy wire exceeds 0.9wt%, the plastic workability decreases and there is a tendency that an alloy wire having stable product quality cannot be obtained with good reproducibility, which is not favorable.

Here, as the inevitable impurities that may be contained in this Cu-Ag-Sn alloy wire, various elements such as Si, Fe, Pt, Au, Bi, Ca, In, Ir, Mg, Mn, and Sb can be cited. However, for the Cu-Ag-Sn alloy wire of the present application, it is preferred that the total content of the inevitable impurities is 0.02wt% or less. If the total content of the inevitable impurities in the Cu-Ag-Sn alloy wire exceeds 0.02wt%, the inevitable impurities tend to have an adverse effect on the characteristics of the Cu-Ag-Sn alloy wire, such as increasing the specific resistance (also called specific resistivity, volume resistivity). Furthermore, for the determination of the content of the constituent elements of the Cu-Ag-Sn alloy wire of the invention of the present application, conventionally known methods can be used without particular limitation. Therefore, for example, this measurement can be performed using a high-frequency inductively coupled plasma (ICP) spectrometer, an X-ray fluorescence (XRF) analysis device, etc. Alternatively, a simple analysis method such as energy dispersive X-ray (EDX) spectrometry or wavelength dispersive X-ray (WDX) spectrometry can be used.

The Cu-Ag-Sn alloy wire of the present application preferably has a specific resistance of 5μΩ.cm or less and a Vickers hardness of 300HV~360HV. If the specific resistance of the Cu-Ag-Sn alloy wire exceeds 5μΩ.cm, the resistance of the alloy wire becomes too high and tends to be extremely limited to this use, which is not good. More specifically, if the specific resistance of the Cu-Ag-Sn alloy wire exceeds 5μΩ.cm, for example, when the alloy wire is used as a probe, it tends to be difficult to correctly detect the tiny current in the electrical circuit formed on the substrate. On the other hand, although there is no particular limit to the lower limit of the specific resistance of the Cu-Ag-Sn alloy wire, it is preferred that the specific resistance of the Cu-Ag-Sn alloy wire is 2μΩ.cm or more. Even if the specific resistance of Cu-Ag-Sn alloy wire is less than 2μΩ.cm, the added value of copper alloy wire will not be greatly improved, and it will simply lead to an increase in manufacturing costs.

Furthermore, if the Vickers hardness of the Cu-Ag-Sn alloy wire is less than 300 HV, the durability of the product tends to be insufficient, so it is not good. More specifically, if the Vickers hardness of the Cu-Ag-Sn alloy wire is less than 300 HV, for example, when the alloy wire is used as a probe to repeatedly perform conductivity inspections on electrical and electronic components, problems such as bending and bending may occur, and the durability and reliability of the product tend to be insufficient. On the other hand, even if the Vickers hardness of the Cu-Ag-Sn alloy wire exceeds 360 HV, for example, when the alloy wire is used as a probe for inspecting electrical and electronic components, there is a concern that the surface may be damaged during conductivity inspections, etc., depending on the type of material constituting the electrical circuit on the substrate, so it is not good.

Next, the Cu-Ag-Sn alloy wire of the present application preferably has a diameter of 110 μm or less. Here, if the diameter of the Cu-Ag-Sn alloy wire exceeds 110 μm, the diameter of the alloy wire will exceed the distance between the electrodes of the narrow pitch electrodes of the semiconductor package, etc., and the use of the alloy wire will be extremely limited to the use as a probe needle for electrical and electronic component inspection such as a probe card and a contact probe, and the added value of the copper-based alloy wire will tend to decrease, so it is not good. In addition, the Cu-Ag-Sn alloy wire of the present application preferably has a diameter of 30 μm or less. If the diameter of the Cu-Ag-Sn alloy wire is 30μm or less, the inspection accuracy tends to be significantly improved when used as a probe for inspecting electrical and electronic components of semiconductor integrated circuits with fine pitch electrodes with a miniaturized structure. On the other hand, although the lower limit of the diameter of the Cu-Ag-Sn alloy wire is not particularly limited, it is preferably a Cu-Ag-Sn alloy wire with a diameter of 20μm or more. If the diameter of the Cu-Ag-Sn alloy wire is less than 20μm, the alloy wire becomes too thin and the strength is reduced, and the durability as a product tends to be insufficient. More specifically, if the diameter of the Cu-Ag-Sn alloy wire is less than 20 μm, it tends to bend and bend when used as a probe for repeated conductivity inspections of electrical and electronic components, resulting in insufficient durability and reliability of the product.

B. Probe for inspecting electrical and electronic components The probe for inspecting electrical and electronic components of the present application is characterized in that it is obtained by using the Cu-Ag-Sn alloy wire mentioned above. By having this requirement, the probe for inspecting electrical and electronic components of the present application can be appropriately used as a probe for inspecting electrical and electronic components such as semiconductor integrated circuits and semiconductor packages having narrow pitch electrodes, and therefore has high market value and excellent reliability.

C. Method for manufacturing Cu-Ag-Sn alloy wire The method for manufacturing Cu-Ag-Sn alloy wire of the present application is the method for manufacturing the above-mentioned Cu-Ag-Sn alloy wire of the present application, and is characterized by having the following steps 1 to 4. By having this requirement, the method for manufacturing Cu-Ag-Sn alloy wire of the present application can manufacture an alloy wire that has a good balance between low resistance and high hardness, excellent casting workability, stable product quality, and suppressed manufacturing cost. The content of each step will be explained below.

Step 1: The metal raw material is prepared into a composition of 6wt%~10wt% Ag, 0.1wt%~0.9wt% Sn, and the remainder is Cu and inevitable impurities, and is melted in a vacuum or inert gas to obtain an ingot.

This step 1 is a step of forming an ingot (cast block) as a raw material for obtaining a Cu-Ag-Sn alloy wire having a predetermined composition by casting. The appropriate silver (Ag) content of this ingot is 6wt% to 10wt%. If the silver content of the ingot is less than 6wt%, there is a tendency that the hardness improvement effect cannot be obtained through precipitation hardening of silver, so it is not good. On the other hand, even if the silver content of the ingot exceeds 10wt%, the hardness of the alloy wire will not be increased dramatically, and there is a tendency that the cost of raw materials increases and the cost balance of the product becomes worse, so it is not good.

In addition, the appropriate tin (Sn) content of this ingot is 0.1wt%~0.9wt%. Here, if the tin content of the ingot is less than 0.1wt%, there is a tendency to fail to obtain the effect of improving casting workability, so it is not good. On the other hand, even if the tin content of the ingot exceeds 0.9wt%, the plastic workability will be reduced, so when the alloy wire is cold-worked to a predetermined cross-sectional reduction rate in step 4 described later, there is a tendency to become easy to break the wire, so it is not good. Furthermore, the alloy composition of the ingot used for this casting is actually the composition of the Cu-Ag-Sn alloy wire itself.

Here, as the inevitable impurities that may be contained in the ingot, various elements such as Si, Fe, Pt, Au, Bi, Ca, In, Ir, Mg, Mn, and Sb can be cited. However, the total content of the inevitable impurities in the ingot is preferably 0.02wt% or less. If the total content of the inevitable impurities in the ingot exceeds 0.02wt%, the total content of the inevitable impurities in the Cu-Ag-Sn alloy wire obtained in step 4 will also exceed 0.02wt%. As a result, the inevitable impurities tend to have an adverse effect on the characteristics of the Cu-Ag-Sn alloy wire, such as increasing the specific resistance of the Cu-Ag-Sn alloy wire obtained in step 4. Furthermore, the content of the constituent elements of the cast ingot in step 1 can be determined by conventionally known methods without particular limitation. Therefore, for example, this determination can be performed using a high-frequency inductively coupled plasma (ICP) spectrometer, an X-ray fluorescence (XRF) analysis device, etc. Alternatively, a simple analysis method such as energy dispersive X-ray (EDX) spectrometry analysis or wavelength dispersive X-ray (WDX) spectrometry analysis can also be used.

The ingot manufacturing conditions of step 1 can be conventionally known without particular limitation. For example, the metal raw material can be placed in a heat-resistant container and vacuum melted at a melting temperature of 1200°C to 1300°C and a vacuum degree of 1×10 ³ Pa to 1×10 ^-2 Pa. Alternatively, the metal raw material can be melted in an inert gas such as argon by a continuous casting method.

Step 2: The ingot obtained in step 1 is solution treated in an inert gas or a slightly reducing gas to obtain a solution treated ingot.

This step 2 is to dissolve (solidify) the silver and tin additives used for modification into the copper (Cu) of the base material in the state of each being an atom. As the conditions for the solid solution treatment (heat treatment), the conventionally known ones can be adopted. Therefore, for example, the ingot obtained in the above step 1 can be placed in a heat-resistant container and heat-treated at about 700°C to 900°C for 1 to 3 hours in an inert gas atmosphere such as nitrogen and argon, or in a slightly reducing gas atmosphere such as a mixed gas of 95% nitrogen and 5% hydrogen, and then directly cooled.

Here, it is preferred to use a shaper to remove the metal near the surface of the solution treated ingot obtained in step 2 (also called shaping (peeling) processing) as necessary. For the solution treated ingot, by removing the metal at a thickness of about 1 mm from the surface, the oxide film produced on the surface and the impurities mixed into the surface of the ingot from the crucible and buried in the crucible and the like through contact with the heat-resistant container during manufacturing can be removed, thereby improving its purity.

Step 3: The solution treated ingot obtained in step 2 is cold worked to a cross-sectional reduction rate of 25% or more, and then aged in an inert gas or a slightly reducing gas to obtain an aged ingot.

In this step 3, first, a groove roll rolling mill is used to cold-work the solution treated ingot obtained in the above step 2 at a predetermined cross-sectional reduction rate (cross-sectional reduction rate = (cross-sectional area of the Cu-Ag-Sn alloy before cold working - cross-sectional area of the Cu-Ag-Sn alloy after cold working) ÷ cross-sectional area of the Cu-Ag-Sn alloy before cold working × 100) at near room temperature, and the hardness is increased by work hardening. Here, the appropriate cross-sectional reduction rate for cold working in step 3 is 25% or more. If the cross-sectional reduction rate of cold working in step 3 is less than 25%, there is a tendency that the hardness of the solution treated ingot cannot be increased by work hardening, so it is not good. On the other hand, although the upper limit of the cross-sectional reduction rate is not particularly limited, the cross-sectional reduction rate of the cold working in step 3 is preferably 60% or less. Even if the cross-sectional reduction rate of the cold working in step 3 exceeds 60%, the hardness of the Cu-Ag-Sn alloy wire will not be extremely increased, so there is a tendency to cause cumbersome processing procedures and increase manufacturing costs.

Next, the ingot cold-worked under the above conditions is subjected to aging treatment (heat treatment), and the silver and tin dissolved in the copper of the base material in the state of atoms (solid solution) are precipitated to increase the hardness. As the conditions for the aging treatment, the conventionally known ones can be adopted. Therefore, for example, the ingot cold-worked to a predetermined cross-sectional reduction rate can be placed in a heat-resistant container, and heat-treated at about 350°C to 550°C for 8 hours to 20 hours in an inert gas atmosphere such as nitrogen and argon, or in a slightly reducing gas atmosphere such as a mixed gas of 95% nitrogen and 5% hydrogen, and then directly cooled.

Step 4: The ingot obtained in step 3 after aging treatment is further subjected to cold working with a cross-sectional reduction rate of 99.95% or more, thereby obtaining a Cu-Ag-Sn alloy wire.

In step 4, the ingot obtained in step 3 above, which has been subjected to aging treatment, is subjected to cold drawing at a predetermined cross-sectional reduction rate at near room temperature using a groove roll rolling mill, a wire drawing machine, etc., so that the hardness is increased through work hardening, and at the same time, an extremely fine wire (metal wire with an extremely small diameter) having a high added value as a copper-based alloy wire is processed.

FIG1 shows the relationship between the working degree η (working degree η=ln(A ₀ /A ₁ ), A ₀ : cross-sectional area of the Cu-Ag-Sn alloy before cold working, A ₁ = cross-sectional area of the Cu-Ag-Sn alloy after cold working) and the Vickers hardness of the Cu-Ag-Sn alloy wire for the ingots obtained by the method of step 3 above and subjected to aging treatment in the present application. In FIG1 , in order to clearly show the change in Vickers hardness in the strong working region where the cross-sectional reduction rate is 99.95% or more (i.e., the working degree η is 8 or more), the horizontal axis is the working degree rather than the cross-sectional reduction rate. The Vickers hardness of the Cu-Ag-Sn alloy wire is a value measured using a Vickers hardness tester at a test load of HV0.005, using a test piece obtained by cutting a portion of the alloy wire into 10 mm and then grinding the cross section to make it smooth.

As can be understood from FIG. 1, as the processing degree η of the ingot after aging treatment increases, the Vickers hardness of the Cu-Ag-Sn alloy wire tends to increase. Then, when the processing degree η of the ingot after aging treatment is 8 or more (i.e., the cross-sectional reduction rate is 99.95% or more), the Vickers hardness of the Cu-Ag-Sn alloy wire becomes 300 HV or more. Therefore, from the experimental point of view, the appropriate cross-sectional reduction rate of the cold working in step 4 can be said to be 99.95% or more (i.e., the processing degree η is 8 or more). Here, if the cross-sectional reduction rate of the cold working in step 4 is less than 99.95%, the Vickers hardness of the Cu-Ag-Sn alloy wire will be less than 300 HV, and the durability of the product tends to be insufficient, which is not good. More specifically, if the cross-sectional reduction rate of the cold working in step 4 is less than 99.95%, the Vickers hardness of the Cu-Ag-Sn alloy wire will be less than 300 HV, and when the alloy wire is used as a probe to repeatedly perform continuity inspections of electrical and electronic components, for example, problems such as bending and bending will occur, and the durability and reliability of the product tend to be insufficient. On the other hand, although there is no particular upper limit on the cross-sectional reduction rate of the cold working in step 4, the cross-sectional reduction rate of the cold working in step 4 is preferably 99.9999% or less (working degree is 13.5 or less). If the cross-sectional reduction rate of the cold working in step 4 exceeds 99.9999%, a large residual stress will be generated inside the ultra-strong processed Cu-Ag-Sn alloy wire, which will reduce the strength, and the durability will tend to be insufficient when the wire is processed and continuously used as a conductor material for wires and cables used in electronic equipment such as probes for electrical and electronic component inspections, mobile devices, industrial robots, and medical equipment.

Although the following provides examples to more specifically illustrate the invention of this application, the invention of this application is not limited to these examples. [Example]

In this embodiment, first, a metal raw material of silver, tin, and copper, which is prepared into an alloy composition of 6.19wt% silver (Ag), 0.20wt% tin (Sn), and the remainder copper (Cu) and inevitable impurities, is placed in an alumina crucible and melted at 1250°C in a vacuum of 1×10 ² Pa to obtain an ingot. In addition, commercially available oxygen-free copper (C1020) is used as the raw copper. In addition, the alloy composition of the ingot is measured by a high-frequency inductively coupled plasma (ICP) spectrometer. Next, the ingot was solution treated at 800°C for 2 hours in a nitrogen atmosphere, and then cooled to obtain a solution treated ingot. Next, the metal near the surface of the solution treated ingot was cut with a thickness of 1 mm using a shaper to remove the oxide film on the surface and the impurities that were mixed into the surface of the ingot from the crucible through contact with the crucible during manufacturing and buried. Next, the solution treated ingot with the surface treatment was cold worked at room temperature of 25°C using a groove roll calender to a cross-sectional reduction rate of 30%, and then aged at 450°C for 16 hours in a nitrogen atmosphere. Furthermore, the ingot after aging treatment was subjected to cold drawing at room temperature of 25°C using a groove roll rolling mill and a wire drawing machine, with a cross-sectional reduction rate of 99.9999% and a processing degree η of 13.5 (processing degree η=ln( _A0 / _A1 ), _A0 : cross-sectional area of the Cu-Ag-Sn alloy before cold working, _A1 = cross-sectional area of the Cu-Ag-Sn alloy after cold working), thereby obtaining a Cu-Ag-Sn alloy wire with a diameter of 20μm.

Here, in this embodiment, the casting workability is extremely good. Therefore, under the conditions of this embodiment, it is judged that a Cu-Ag-Sn alloy wire with stable product quality can be obtained with good reproducibility. Table 1 shows the alloy composition of this Cu-Ag-Sn alloy wire (i.e., the alloy composition of the ingot used in this embodiment) and the evaluation results of its casting workability and plastic workability. Furthermore, the total content of inevitable impurities in the Cu-Ag-Sn alloy wire (i.e., the total content of inevitable impurities in the ingot used in this embodiment) is 0.02wt% or less. In Table 1, "Casting workability" is recorded as "○" when the fluidity of the molten metal is good and the molten metal is not retained in the funnel, and a sound Cu-Ag-Sn alloy ingot with a smooth surface and no defects such as defects is obtained; "×" is recorded when the fluidity is poor and the molten metal is retained in the funnel, and a sound Cu-Ag-Sn alloy ingot is not obtained. "Plastic workability" is recorded as "○" when a Cu-Ag-Sn alloy wire with a diameter of less than 110μm is obtained without cracking, wire breaking, etc., and a Cu-Ag-Sn alloy wire with a diameter of less than 110μm is obtained, and "×" is recorded when cracking, wire breaking, etc. occur and a Cu-Ag-Sn alloy wire with a diameter of less than 110μm is not obtained.

Next, a portion of the Cu-Ag-Sn alloy wire obtained by the above method was cut into a length of 1000 mm to prepare a sample for specific resistance measurement, and the specific resistance was measured using a resistance meter. Next, another portion of the Cu-Ag-Sn alloy wire obtained by the above method was cut into a length of 10 mm, and the cross section was polished to make it smooth to prepare a sample for hardness measurement, and the Vickers hardness was measured using a Vickers hardness tester with a test load of HV0.005. These measurement results are shown in Table 1. [Comparison Example]

This comparative example differs from the embodiment only in that the metal raw materials of silver, tin, and copper are mixed to form an alloy composition of 6.00wt% silver (Ag), 1.00wt% tin (Sn), and the remainder copper (Cu) and inevitable impurities. Therefore, the description of the manufacturing method and evaluation method for the Cu-Ag-Sn alloy wire is omitted. Here, the cast ingot of this comparative example (especially the ingot that has completed the aging treatment) has poor plastic workability. If it is desired to perform cold drawing to a diameter of less than 500μm, the wire will break, so the Cu-Ag-Sn alloy wire with a diameter of less than 110μm is not obtained. Therefore, the measurement of the specific resistivity and Vickers hardness of the Cu-Ag-Sn alloy wire is not completed. Based on this, Table 1 shows the alloy composition of the ingots used in the comparative example and the evaluation results of the casting workability and plastic workability of the Cu-Ag-Sn alloy.

[Table 1] [Industrial Availability]

The Cu-Ag-Sn alloy wire and the manufacturing method thereof of the present application can be applied to probes for inspection of electrical and electronic components and the manufacturing thereof. In particular, the Cu-Ag-Sn alloy wire of the present application can be suitably used in probes for inspection of electrical and electronic components such as semiconductor integrated circuits and semiconductor packages with narrow pitch electrodes. In addition, the Cu-Ag-Sn alloy wire of the present application can also be suitably used as a conductor material for wires and cables used in electronic equipment such as mobile devices, industrial robots, and medical equipment.

without

FIG. 1 is a graph showing the relationship between the processing degree η and the Vickers hardness of the Cu-Ag-Sn alloy wire for the ingot that has been subjected to aging treatment in the present application.

Claims (7)

A Cu-Ag-Sn alloy wire is characterized in that it contains 6.19wt%~10wt% of Ag, 0.1wt%~0.9wt% of Sn, and the remainder is composed of Cu and inevitable impurities. The Cu-Ag-Sn alloy wire as claimed in claim 1, wherein the total content of the unavoidable impurities is less than 0.02 wt %. The Cu-Ag-Sn alloy wire as described in claim 1 or 2, wherein the Cu-Ag-Sn alloy wire has a specific resistance of less than 5 μΩ.cm and a Vickers hardness of 300 HV to 360 HV. The Cu-Ag-Sn alloy wire as recited in claim 1, wherein the diameter of the Cu-Ag-Sn alloy wire is less than 110 μm. A probe pin for inspecting electrical and electronic components is obtained by using the Cu-Ag-Sn alloy wire as described in claim 1. A method for manufacturing a Cu-Ag-Sn alloy wire as described in claim 1, characterized in that it comprises the following steps 1 to 4: step 1: mixing a metal raw material into a composition of 6.19wt% to 10wt% Ag, 0.1wt% to 0.9wt% Sn, and the remainder being Cu and inevitable impurities, and melting the metal raw material in a vacuum or inert gas to obtain an ingot; step 2: subjecting the ingot to a solution treatment in an inert gas or a slightly reducing gas to obtain an ingot after the solution treatment; step 3: subjecting the ingot after the solution treatment to a cold working (cold working) with a cross-sectional reduction rate of 25% or more After the aging treatment, the aging treatment is performed in an inert gas or a slightly reducing gas to obtain an ingot that has been aging treated; and step 4: the ingot that has been aging treated is further cold worked with a cross-sectional reduction rate of more than 99.95% to obtain the Cu-Ag-Sn alloy wire. The method for producing a Cu-Ag-Sn alloy wire as recited in claim 6, wherein the total content of unavoidable impurities in the ingot in the aforementioned step 1 is less than 0.02 wt %.

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