TWI887773B - Heatwing - Google Patents

Abstract

A plate steam chamber array assembly has a plurality of plate steam chambers connected in an array, and each plate steam chamber has a evaporation area and an evacuated sealed chamber. The plate steam chambers can directly contact adjacent plate steam chambers. A steam chamber fixture surrounding the array has an inner surface that engages the outer edges of at least two plate steam chambers of the array to press the surface of the plate steam chamber array directly against a heat source.

Description

Hot Wings

The present invention relates generally to phase change heat sinks and, more particularly, to plate vapor chambers and uses thereof.

Compared with high thermal conductivity solid metal blocks, phase change heat sinks have higher equivalent thermal conductivity and better heat dissipation performance. They are widely used due to their many advantages such as high thermal conductivity and good temperature uniformity. These advantages are achieved through the liquid working medium sealed in the heat sink, and the heat sink relies on the phase change of the liquid working medium for heat transfer. Currently, the commonly used phase change heat sinks are heat pipes and vapor chambers.

See Figure 1. As shown in Figure 1, a typical heat pipe consists of a hollow cylindrical chamber 11, a capillary structure 12 and a phase change medium 13 sealed in the chamber. The production of a heat pipe generally includes: evacuating the chamber and partially filling the chamber with a working medium 13; impregnating the capillary structure 12 tightly attached to the inner surface of the chamber 11 with the working medium 13; and sealing the chamber. One end of the heat pipe serves as an evaporation zone 14, which contacts the heat source to absorb heat from the heat source, and the other end serves as a condensation zone 15, which is used for direct or auxiliary heat dissipation. Equipment such as fans can improve efficiency. The remaining portion of the heat pipe between the evaporation zone 14 and the condensation zone 15 is called the insulating portion. When the evaporation zone 14 is heated, the working liquid medium 13 in the capillary structure 12 vaporizes into a vapor working medium 16. The vapor working medium then flows through the pipe 17 under the action of the pressure difference into the condensation zone 15, where it condenses back into the liquid working medium 13, releasing heat. Thereafter, the recovered liquid working medium 13 flows along the capillary structure 12 under the action of the capillary pressure and returns to the evaporation zone 14. As the cycle is repeated, heat 18 is continuously transferred from the evaporation zone 14 to the condensation zone 15, thereby achieving heat dissipation. However, due to the relatively small diameter of the heat pipe, the vapor transfer therein occurs in a nearly one-dimensional, linear manner. In addition, limited by the narrowness of the vapor transport pipe and the minimum return channel width of the liquid working medium, the heat pipe often reaches its heat transfer limit before operating at its optimal performance level.

As an improved type of heat pipe, Chinese Patent Publication No. CN201364059Y discloses a steam chamber, or flat plate heat pipe. As shown in the figure. As shown in Figure 2, steam chambers 42" and 42' both use their two plates as working plates. In the steam chamber, steam is transmitted in a nearly two-dimensional plane. Compared with heat pipes, steam chambers provide a larger steam channel area and a larger liquid working medium return channel width, thereby ensuring better temperature uniformity than heat pipes. However, during use, such steam chambers 42", 42' are arranged perpendicular to the plane of the heat source. The heat conducting sheet 41 and the fixture 412 for fixing the steam chamber transfer heat in turn, and finally reach the steam chambers 42" and 42'. In such a structure, the distance from the heat source to the steam chamber is too long, and the average distance is equal to the thickness of the heat conducting sheet 41 plus half the height of the steam chamber fixture, while the total heat conducting width of the entire heat conducting sheet 41 and the steam chamber fixture 412 is too short, which is only the sum of the widths of the two steam chamber fixtures 412, resulting in a higher thermal resistance.

Aspects of the present document relate to a plate vapor chamber array assembly, comprising a plurality of plate chambers connected in an array, each plate chamber being in direct contact with at least one adjacent plate chamber of the array, each plate chamber being formed by a first plate spaced apart from a second plate, forming a condensation region having a length and a height, the first plate and the second plate being connected together by a frame, the frame forming an evaporation region on a first end of the first plate, a chamber between the first end of the first plate and the first end of the second plate, the evaporation region having a thickness defined as the distance between the first plate and the second plate, and an evaporation length defined as the length of the evaporation region, the evaporation length of the evaporation region within the cavity being greater than the thickness of the evaporation region, the frame sealing the first plate to the second plate, thereby forming a sealed cavity having an enclosed hollow space defined by the cavity therein. A first plate, a second plate and a frame, a capillary structure layer within each of a plurality of plate-shaped chambers, adjacent inner surfaces of each chamber and at least a portion of the first plate and the second plate, a capillary structure layer for each of a plurality of plate-shaped chambers also attached to an inner surface of at least a portion of the frame, a phase change working medium is sealed within a sealed chamber of each of the plurality of plate-shaped chambers, each sealed chamber is evacuated, and a steam chamber clamp surrounds the array and includes at least one steam chamber clamp opening within the steam chamber clamp and an inner surface of the steam chamber clamp opening is configured to engage the outer edges of at least two plate vapor chambers of the array, wherein the steam chamber clamp is configured to press a surface of the plate vapor chamber array directly against a heat source, wherein an evaporation region is configured to be coupled to an evaporation length and its thickness in a direct, planar, physical manner. in contact with a heat source, and wherein the condensation zone is configured not to be in direct physical contact with the heat source and is configured to extend away from the heat source.

Specific embodiments may include one or more of the following features. The evaporation length of the evaporation zone within the chamber is at least five times greater than the thickness of the evaporation zone. The evaporation length of the evaporation zone within the chamber is at least twice greater than the thickness of the evaporation zone. At least one steam chamber clamp opening in the steam chamber clamp includes a plurality of steam chamber clamp openings, each of which is sized to receive at least one plate steam chamber passing therethrough. The inner surface of at least one steam chamber clamp opening is non-perpendicularly angled to the upper and lower surfaces of the steam chamber. The inner surface of each steam chamber opening in at least one steam chamber clamp opening is shaped to cooperate with a plurality of plate-shaped chambers. At least one heat sink extends between at least two of the plurality of plate-shaped chambers. At least one heat sink fin is saw-tooth shaped and extends back and forth between at least two chambers in the plurality of plate-shaped chambers.

Various aspects of the document relate to a plate steam chamber array assembly, which includes a plurality of plate steam chambers connected in an array, each plate steam chamber is closely arranged with at least one adjacent plate steam chamber of the array, each plate steam chamber is formed by a first plate separated from a second plate, the second plate forms a condensation area having a certain length and height, the first plate and the second plate are connected together by a frame, and the frame forms an evaporation area between a first end of the chamber and the second plate. a first end of the first plate and a first end of the second plate, the evaporation region has a thickness defined as the distance between the first plate and the second plate, and an evaporation length defined as the length of the evaporation region, the length of the evaporation region within the chamber is greater than the thickness of the evaporation region, the frame seals the first plate with the second plate to form a sealed cavity having a closed and hollow space defined by the cavity inside the first plate, the second plate and the frame, the sealed chamber is evacuated, and the steam chamber clamp surrounds the array and has an inner surface of the steam chamber clamp opening, the inner surface of the steam chamber clamp opening is configured to engage the outer edges of at least two plate steam chambers in the second plate steam chamber. array and pressing the surface of the plate vapor chamber array directly against a heat source, wherein the evaporation region is configured to couple with the evaporation length and its thickness in direct, planar, physical contact with the heat source, and wherein the condensation region is configured not to be in direct physical contact with the heat source and is configured to extend away from the heat source.

Specific embodiments may include one or more of the following features. The evaporation length of the evaporation zone within the chamber is at least five times greater than the thickness of the evaporation zone. At least one steam chamber fixture opening in the steam chamber fixture includes a plurality of steam chamber fixture openings, each steam chamber fixture opening being sized to receive at least one plate steam chamber therethrough. The inner surface of at least one steam chamber fixture opening is angled non-perpendicularly to the upper and lower surfaces of the steam chamber. The inner surface of each of the at least one steam chamber fixture opening is shaped to mate with the plurality of plate chambers. At least one heat sink extends between at least two of the plurality of plate chambers.

Aspects of the present invention relate to a plate steam chamber array assembly including a plurality of plate steam chambers connected in an array, each plate steam chamber including a condensation region having a length and a height, a first plate and a second plate connected together through a frame, the frame forming an evaporation region on a first end of the chamber, and sealing the first plate to the second plate to form a sealed chamber having a closed and hollow space defined by the chamber inside the first plate, the second plate, and the frame, the sealed chamber being evacuated, and a steam chamber fixture surrounding the array and having an inner surface of the steam chamber fixture opening, the inner surface of the steam chamber fixture opening being configured to engage the outer edges of at least two of the plate soaking chambers of the second plate array and press the surface of the plate steam chamber array directly against a heat source.

Specific embodiments may include one or more of the following features. At least one steam chamber clamp opening in the clamp includes a plurality of steam chamber clamp openings, each steam chamber clamp opening being sized to receive at least one plate steam chamber therethrough. An inner surface of at least one steam chamber clamp opening is angled non-perpendicularly to an upper surface and a lower surface of the steam chamber. At least two steam plate chambers are in direct contact with at least one adjacent plate steam chamber of the array. At least one heat sink extends between at least two of the plurality of plate chambers. At least one heat sink fin is saw-tooth shaped and extends back and forth between at least two of the plurality of plate chambers.

A phase change heat sink with a large steam channel area, a wide working fluid return channel, a short distance between the center and edge of the evaporator, a large condenser heat dissipation area, and a high heat transfer limit.

One aspect of the present invention provides a plate steam chamber, which includes: a sealed hollow chamber, including two plates and a frame connecting the two plates; a capillary structure layer tightly attached to the inner surface of the chamber; and a phase change medium sealed in the chamber. Part of the frame or a part of the periphery of one of the two plates directly contacts the heat source, thereby serving as the evaporation area of the plate heat chamber, while the rest of the chamber does not directly contact the heat source. The part in contact with the heat source serves as the condensation area of the plate steam chamber. The length and width of the chamber are much greater than the thickness of the chamber.

In one or more specific embodiments, the materials from which the chamber can be made include copper, aluminum, stainless steel metals and their alloys, high thermal conductivity ceramics and other high thermal conductivity materials. In one or more specific embodiments, the capillary structure layer can be a single or multi-layer structure made of sintered powders, wire lattices, grooves etched into the chamber, fibers, coated or grown carbon nanowalls, carbon nanotubes, or carbon. Nanocapsules, other coated or grown nano- or micron-thin organic or inorganic layers, or any combination of the above, or any other suitable structure that provides capillary attraction. In one or more specific embodiments, materials that can be used as phase change working media include water and other liquids, low melting point metals, carbon nanocapsules, other nanoparticles, mixtures of the above materials, and other materials with gas-liquid phase transition. The temperature is within the operating temperature range of the plate vapor chamber.

In one or more specific embodiments, the two plates are parallel or substantially parallel to each other. In one or more specific embodiments, each plate may be rectangular or in any other shape, and may be flat or curved. In one or more specific embodiments, the cross-sectional area of the portion of the plate soaking chamber close to the evaporation zone is greater than the cross-sectional area of the upper portion of the plate soaking chamber. Alternatively, the cross-sectional area of the portion close to the evaporation zone may also be less than or equal to the cross-sectional area of the top portion. In one or more embodiments, the plate soaking chamber may be evacuated to a certain degree of vacuum, and may accordingly further include a support or connection structure disposed between the two plates according to the mechanical strength of the chamber and the positive and negative pressures to be adjusted. Applied thereto. In one or more embodiments, the support or connection structure may be in the shape of a point, line, or sheet.

In one or more embodiments, the plate soaking chamber may also include fins. In one or more embodiments, the plate steam chamber and/or fins may be coated with a black body radiator material. In one or more embodiments, the plate soaking chamber may also include hoses for vacuuming and liquid filling. In one or more embodiments, the array of plate soaking chambers may be disposed on a heat source.

One aspect of the present disclosure provides a device, which includes a heating component and at least one plate steam chamber, each plate steam chamber includes: a sealed hollow chamber, including two plates and a frame connecting the two plates; a capillary structure layer is tightly attached to the inner surface of the chamber; a phase change working medium is sealed in the chamber, wherein a portion of the frame of each plate steam chamber or a portion of the periphery of one of its two plates is in direct contact with the heating component, thereby playing a role in evaporation. The evaporation area of the plate steam chamber, the remaining portion of the plate steam chamber that is not in contact with the heating component serves as the condensation area of the plate steam chamber, wherein the length and width of the plate steam chamber of each plate steam chamber are respectively much greater than the thickness of the plate steam chamber.

Compared with the conventional plate steam chamber, the plate steam chamber according to the present invention may have one or more of the following advantages: Since the plate steam chamber of the present invention is a sealed plate-shaped hollow chamber, its length is by making a part of the periphery of one of the two plates or a part of the frame (having a limited area relative to the entire chamber area) contact the surface of the heat source, and its width and width are much greater than its thickness so that it serves as an evaporation zone, and the steam is transported in a nearly two-dimensional, planar manner in the plate-type soaking chamber, the steam transport channel area is large, and the temperature uniformity is high. Since the gap between the two plates is very small, a very short distance from the center to the edge of the evaporation zone can be achieved, thereby solving the problem of premature drying of the central area of the evaporation zone. The plate steam chamber uses two larger plates as the condensation area, which ensures a very large condensation area, is conducive to heat dissipation, and provides a larger working medium return channel width, which is about twice the width of the plate steam chamber and allows a large flux of the working medium. The plate steam chamber of the present invention has a greatly improved heat transfer limit, so it can achieve a higher heat flux density than the traditional plate steam chamber.

The above and other aspects, features, applications and advantages will be apparent to one of ordinary skill in the art from the specification, drawings and claims. Unless otherwise specified, the words and phrases in the specification and claims are intended to be given the plain, ordinary and customary meanings to one of ordinary skill in the applicable art. The inventor is fully aware that he can be his own lexicon compiler if necessary. The inventor expressly chooses, as their own lexicon compiler, to use only the plain and ordinary meanings of the terms in the specification and claims unless they expressly state otherwise and then further expressly set forth the "special" definition of the term and explain how it differs from the plain and ordinary meaning. In the absence of an express statement of intent to apply a "special" definition, it is the inventor's intent and intention that the plain, plain and ordinary meanings of the terms be applied in the interpretation of the specification and claims.

The inventors are also aware of the normal rules of English grammar. Therefore, if a term, term or phrase is intended to be further characterized, specified or abbreviated in some manner, such term, term or phrase will expressly include additional adjectives, descriptive terms or other modifiers as normally found in English grammar rules. Without the use of such adjectives, descriptive terms or modifiers, the intention is to give such term, term or phrase its plain and ordinary English meaning to a person skilled in the applicable field as described above.

Furthermore, the inventors are fully aware of 35 U.S.C. § 112(f). Therefore, the use of the terms "function," "means," or "step" in the detailed description or in the claims is not intended to somehow indicate an intent to invoke 35 U.S.C. § 112(f) to define the invention. Instead, if the provisions of 35 U.S.C. were to attempt to invoke § 112(f) to define the invention, the claims would specifically and unambiguously recite the precise phrase "for" or "step" and would also reference the word "function" (i.e., would recite "means for performing the function of [insert function]") without describing any structure, material, or act that supports that function in such phrase. Therefore, even if a claim recites "means for performing a function..." or "steps for performing a function...", if the claim also recites any structure, material, or act to support the means or step, or to perform the described function, then the inventors expressly intend not to invoke 35 U.S.C. § 112(f). Furthermore, even if the provisions of 35 U.S.C. cite § 112(f) to define claimed aspects, such aspects are not limited to the specific structures, materials, or acts described in the preferred embodiments, but also include any and all structures, materials, or acts that perform the claimed functions as described in the alternative embodiments or forms of the present disclosure, or known existing or later developed equivalent structures, materials, or acts that perform the claimed functions. The above and other aspects, features and advantages will be obvious to a person of ordinary skill in the art from the specification, drawings and claims.

2: Plate steam chamber

3: Heat source

4: Cylindrical heat source

11: Cylindrical chamber of heat pipe

12: Capillary structure

13: Phase change working medium

14: Evaporation zone

15: Condensation area

16: Steam working fluid

17: Capillary pipes

18: Calories

20: First board

21: Second board

22: The second end of the plate steam chamber frame (first outer surface)

23: The first end of the plate steam chamber frame (the second outer surface)

24: Evaporation zone

25: Evaporation zone center

26: Condensate flow direction

27: Steam diffusion direction

28: Steam channel

31: Point support

32: Linear support

33: Sheet support

40: Steam room clamp

41: Heat conducting sheet

42': Plate steam room

42": Plate steam room

42: Clamp fixing hole

44: Bottom outer edge of plate steam chamber

46: Plate steam chamber opening

48: Inner surface of the plate steam chamber opening

50: Heat sink

411: Clamp bottom

412: Steam room clamp

421: Plate steam chamber

The following will describe the implementation method in conjunction with the accompanying drawings, in which the same reference numerals represent the same elements, and: Figure 1 shows a schematic cross-sectional view of a conventional heat pipe.

Figure 2 shows a schematic cross-section of a conventional steam chamber.

FIG3 shows a three-dimensional view of a plate steam chamber according to the first embodiment of the present invention.

FIG4 shows a schematic cross-sectional view taken along line A-A of FIG3.

Figure 5 shows a schematic cross-sectional view of a plate steam chamber according to the second embodiment of the present invention.

Figure 6 shows a schematic cross-sectional view of a plate steam chamber according to the third embodiment of the present invention.

FIG7 shows a schematic cross-sectional view of a plate steam chamber according to a fourth embodiment of the present invention.

FIG8 shows a schematic cross-sectional view of a plate steam chamber according to the fifth embodiment of the present invention.

FIG9 shows a schematic cross-sectional view of a plate steam chamber according to the sixth embodiment of the present invention.

FIG10 shows a three-dimensional view of a plate steam chamber array according to the seventh embodiment of the present disclosure.

FIG11 shows a schematic cross-sectional view of a plate steam chamber array according to the eighth embodiment of the present invention.

Figure 12 is a three-dimensional exploded view of Figure 11.

FIG. 13 shows a three-dimensional view of a plate steam chamber array according to the ninth embodiment of the present disclosure.

FIG. 14 shows a three-dimensional view of a plate steam chamber assembly array according to the tenth embodiment of the present invention.

Figure 15 is an exploded perspective view of Figure 14.

FIG. 16 shows a three-dimensional view of a plate steam chamber assembly array according to the eleventh embodiment of the present invention.

Figure 17 shows the working principle diagram.

Figure 18 shows the internal support structure of the plate steam chamber.

Figure 19 shows a three-dimensional view of a plate steam chamber array similar to that shown in Figures 17 and 18. See Figures 11-12, but also includes the plate steam chamber fixture.

FIG. 20 shows a cross-sectional view of the steam chamber fixture of the plate soaking chamber and steam chamber fixture assembly of FIG. 19 .

Figure 21 shows an exploded 3D view of a plate vapor chamber array with a vapor chamber fixture but also including heat sinks.

FIG22 shows a three-dimensional view of the assembly of the plate steam chamber array assembly of FIG21.

FIG. 23 shows a cross-sectional view of the assembled plate steam chamber array assembly of FIG. 22 taken along section line B-B.

FIG. 24 shows a cross-sectional view of an assembled plate soaking chamber 2 array assembly similar to FIG. 20 or FIG. 22 .

FIG. 25 shows an exploded three-dimensional view of a plate vapor chamber array assembly having a second vapor chamber fixture embodiment.

FIG. 26 shows a cross-sectional view of the steam chamber fixture according to the second embodiment, wherein the plate heat chamber portion is cut along the section line C-C of FIG. 25 .

FIG. 27 shows a cross-sectional view of the steam chamber fixture of FIG. 26 and a portion of a cross-sectional view of a plate steam chamber array assembled with the steam chamber fixture.

Those skilled in the art will appreciate that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the size of some elements in the drawings may be exaggerated relative to other elements to help improve understanding of the implementation.

The present disclosure, its aspects and implementations are not limited to the specific data types, components, methods or other examples disclosed herein. Many additional material types, components, methods and processes known in the art are contemplated for use with specific implementations of the present disclosure. Thus, for example, while a specific implementation is disclosed, such implementation and implementation components may include any components, models, types, materials, versions, quantities and/or the like known in the art for such systems and implementation components to be consistent with the intended operation.

The words "exemplary", "example" or various forms thereof are used herein to mean serving as an example, instance or illustration. Any aspect or design described herein as "exemplary" or "example" is not necessarily to be construed as preferred or advantageous over other aspects or designs. In addition, examples are provided only for the purpose of clarity and understanding and are not meant to limit or restrict the disclosed subject matter or related parts of this disclosure in any way. It should be understood that additional or alternative examples of various different scopes may be proposed, but they are omitted for the purpose of brevity.

In the following description, reference is made to the accompanying drawings, which form a part of the description and illustrate possible implementations by way of illustration. It is understood that other implementations may be utilized and that structural as well as procedural changes may be made without departing from the scope of this document. For convenience, various components will be described using exemplary materials, dimensions, shapes, sizes, etc. However, this document is not limited to the examples set forth and other configurations are possible and within the teachings of this disclosure. As will become apparent, changes may be made to the function and/or arrangement of any element described in the disclosed exemplary implementations without departing from the spirit and scope of this disclosure.

The first embodiment of the present disclosure is shown in Figures 3 and 4. As shown in Figures 3 and 4, the plate steam chamber of the present invention includes a chamber 2, which is essentially a hollow plate structure, including a first plate 20, a second plate 21, and a second part 22 and a first part 23 of the frame. A frame 23 connecting the two plates (20 and 21). The plate steam chamber also includes a capillary structure layer 12 tightly attached to the inner surface of the chamber 2 and a phase change working medium 13 hermetically sealed in the chamber 2. The first outer surface portion of the frame 23 of the chamber 2 is in contact with the heat source 3, and is therefore used as an evaporation area, while the rest of the chamber 2 is used as a condensation area. Alternatively, a portion of the periphery of one of the first plate body 20 and the second plate body 21 can also be used as an evaporation area.

The length and height of the plate soaking chamber are much larger than the thickness of the plate soaking chamber. Therefore, the plate steam chamber has a larger steam transmission channel area, which ensures higher temperature uniformity. In addition, since the gap between the two plates 21 (i.e., the thickness of the plate soaking chamber) is very small, a portion of the periphery of one plate 21 or the first outer surface portion of the frame 23 has limited space. Relative to the entire area of the thin plate-shaped chamber 2, it is in direct contact with the heat source 3, making it an evaporation area, realizing a very short distance from the center to the edge of the evaporator, thereby solving the problem of early drying. -Leave the central area of the evaporation zone. In other embodiments, other heat conductive materials can be inserted between the heat source and the outer surface of the frame 23.

Moreover, the plate steam chamber utilizes two larger plates in the chamber as the condensation area, ensuring a larger condensation area, which is beneficial for heat dissipation and steam condensation. In addition, this feature allows a larger channel width for the return flow of the working medium 13, thereby increasing the flow rate of the medium. Due to these and other reasons, the heat transfer limit of the plate steam chamber is greatly improved, so a higher heat flux density can be achieved.

Here, the height of the plate heat soaking chamber, that is, the height of the hollow chamber 2, is defined as the dimension protruding away from the heat source plane, that is, the height is the distance from the side of the heat source. The two plates in contact with the heat source 3 are located on the opposite sides of the two plates farthest from the heat source 3. Therefore, for flat plates 20 and 21 (such as shown in Figure 8), this distance is the length of a. For curved plates 20 and 21 (such as those shown in Figures 4 to 7 and 11), this distance is the length of the curve. The length of the plate heat soaking chamber, that is, the length of the hollow chamber 2, is defined as the dimension extending parallel to the heat source plane.

The length, height and thickness of each example of the plate soaking chamber disclosed herein can vary with the specific needs of different applications, but the common requirement for these dimensions in a specific embodiment is that both the length and height should be much larger than the thickness. In a specific embodiment, both the length and height should be at least one order of magnitude larger. However, the present invention is not limited thereto, as those skilled in the art can design the length, height and thickness of a suitable plate steam chamber based on their knowledge without departing from the spirit of the present invention.

In some cases, such a large improvement in heat dissipation is not needed, and fewer plate chambers are needed on the heat source to increase heat dissipation several times. In these cases, it is sufficient that the aspect ratio of the evaporation zone is less than an order of magnitude. Therefore, in other specific embodiments, the length and height are at least five times greater than the thickness. In other specific embodiments, the length and height are at least three times greater than the thickness. And in other specific embodiments, the length and height are at least two times greater than the thickness.

The materials used to make the chamber 2 include copper, aluminum, stainless steel and its alloys, high thermal conductivity ceramics and other high thermal conductivity materials, all of which can ensure good heat transfer performance of the plate vapor chamber. The capillary structure layer 12 can be a single-layer or multi-layer structure made of sintered powder, wire lattice, grooves etched into the chamber, fibers, coated or grown carbon nanowalls, carbon nanotubes or nanocapsules, other coated or grown nanomaterials. Or micron-thin organic or inorganic layers, or any combination of the above, or any other suitable structure that provides capillary attraction.

Materials that can be used as the working medium 13 sealed in the plate soaking chamber include water and other liquids, low melting point metals, carbon nanocapsules, other nanoparticles, mixtures of the above materials, and other materials with gas-liquid phases that change in temperature within the working temperature range of the plate steam chamber. The plate soaking chamber can be evacuated to a certain degree of vacuum, and can accordingly further include a support or connection structure (not shown) disposed between the first plate 20 and the second plate 21. The support or connection structure can be based on the mechanical strength of the chamber 2 and the positive and negative pressures applied thereto. The support or connection structure can be in the shape of a point, a line, a sheet, or any other shape. In addition, in some alternative embodiments where the chamber 2 has sufficient strength to withstand the required load, the plate soaking chamber may not include a support or connection structure.

In the first embodiment, the two plates 20 and 21 are parallel to each other except for their bottom portions, and the bottom portion of the chamber 2 in close contact with the heat source 3 is thicker than the upper portion of the plate steam chamber. In some alternative embodiments of the present disclosure, the plates 20 and 21 are parallel to each other, or the top and bottom portions of the chamber 2 may have different thicknesses.

The plate soaking chamber may also include auxiliary features arranged on the plate, such as fins (not shown), tubes for vacuuming and liquid filling (not shown), etc. The fins can promote the dissipation of heat inside the plate vapor chamber. In addition, in order to obtain better heat transfer performance, the plate vapor chamber and/or the fins can be coated with a black body heat sink material to further promote heat dissipation inside the plate vapor chamber and the fins. The tubes can be used to generate the required vacuum conditions for the working medium in the plate soaking chamber. It should be noted that in some alternative embodiments, the plate soaking chamber may not include fins and tubes.

The plate soaking chamber constructed according to the second to sixth embodiments of the present disclosure are shown in Figures 11 to 19, respectively. As shown in Figures 5 to 9. As shown in Figures 5 to 7, the plate steam chamber of the present invention can have different bottom cross-sectional shapes, such as a convex arc shape near the bottom of plates 20 and 21. The evaporation area shown in Figure 5, the concave arc shape shown in Figure 6, and the roughly rectangular shape shown in Figure 7. In addition, the first outer surface portion of the frame 23 of the chamber can be slightly thicker than the second outer surface portion of the frame 22 of the plate steam chamber. Alternatively, it can be understood that the thickness of the first outer surface portion of the frame 23 of the plate steam chamber can also be equal to or less than the thickness of the second outer surface portion of the frame 22 of the plate steam chamber.

As shown in Figures 4 to 9, the frame of the plate steam chamber may include a first portion 23 of the frame and a second portion 22 of the frame (as shown in Figures 4 to 7 and 9), or only a first outer surface portion of the frame 23, and the second outer surface portion of the frame is absent or partially absent (as shown in Figure 8). In the latter case, the hollow chamber can be closed at the top by directly connecting the tops of the two plates 20 and 21. In addition, as shown in Figures 4 to 7 and 9, the second outer surface portion of the frame 22 can be closed. It can be closed by different techniques and thus have different shapes, such as the arc shape shown in Figure 1. As shown in Figure 5, a straight line shape is shown. As shown in Figure 6, a shape with a protrusion that can be formed at different positions, as shown in Figures 7 and 9.

As shown in Figures 5 to 9 and 11, the plate steam chamber can have a variety of overall shapes, such as a wedge shape as shown in Figure 8 and a shape with a bent plate as shown in Figures 20 and 21, as shown in Figures 6 and 7. In addition, as shown in Figure 9, the plate heat soaking chamber can have a portion of the periphery of the two plates (20 and 21) in contact with the heat source 3 as an evaporation zone. In addition, as shown in Figure 11, the plate steam chamber can be bent to protrude laterally in response to height restrictions. Figure 10 shows the seventh embodiment of the present invention. As shown in the figure, in this embodiment, a plurality of plate steam chambers of Figure 3 are arranged in an array and set on the heat source, completely covering the top of the heat source. This array arrangement expands the two-dimensional phase change heat transfer to three-dimensional space, so that a higher heat flux density can be obtained.

FIG. 11 and FIG. 12 show the eighth embodiment of the present disclosure. As shown in the figure, in this embodiment, a plurality of J-shaped plate steam chambers of FIG. 7 are arranged in an array and disposed on the heat source, completely covering the top surface of the heat source. Unlike the seventh embodiment, each plate steam chamber in the array of this embodiment is bent to protrude laterally from the heat source, and is therefore particularly suitable for applications with height restrictions.

FIG. 13 shows a three-dimensional view of the plate steam chamber array according to the ninth embodiment of the present disclosure. FIG. 14 is a three-dimensional view of the plate steam chamber assembly array according to the tenth embodiment of the present invention. FIG. 15 is an exploded three-dimensional view of FIG. 14.

In Figures 14 and 15, 2 is a plate steam chamber. 3 is a heat source. L is the length of the first outer surface portion of the frame. H is the height of the chamber. D is the thickness of the chamber. 20 is the first plate, and 21 is the second plate. The first end 23 of the chamber is the end of the chamber where the first outer surface portion of the frame is located, and the second end 22 of the chamber is the other end of the chamber where the second outer surface portion of the frame is located, and its height and length are the height and length of the chamber before it is bent; the thickness of this chamber is the width of the first outer surface portion of the frame.

In Figures 14 and 15, four plate soaking chambers are shown that are bent in length and height. They can be used not only on heat sources with circular or annular planes, but also on heat sources with circular or annular planes. In some other illustrative embodiments, one or more plate soaking chambers can be set at the same time. If technically necessary, the curved annular panel steam chamber can be spliced together by multiple parts. In Figures 14 and 15, two annular pieces are shown to be spliced together by four chambers.

In some other exemplary embodiments, a single portion or multiple portions of the ring shape may be set. In some other illustrative embodiments, the chamber thereof may be curved or non-curved. The plate steam chamber shown in FIG. 14 and FIG. 15 has the same first portion of a narrow and long frame, a large-area steam channel, and a large-area condensation zone plate. It complies with the design rules of the plate steam chamber.

FIG16 shows a three-dimensional view of a plate steam chamber assembly array according to the eleventh embodiment of the present disclosure. In FIG16 , a ring-shaped or part-of-ring-shaped plate steam chamber is shown. They can be used for and not only for cylindrical or other curved heat sources.

In FIG. 16, 4 is a cylindrical heat source. 2 is a plate steam chamber. 20 and 21 are plates of the plate-type heat-saturating chamber. 23 is the first outer surface portion of the frame, i.e., the inner arc length of the chamber. 22 is the second outer surface portion of the frame. H is the width of the ring, i.e., the height of the chamber. L is the length of the first outer surface portion of the frame. D is the width of the first outer surface portion of the frame. In FIG. 16, the plate steam chamber shown can be assembled and arranged on the heat source in a single or multiple plate steam chambers, and it is configured as a part of the main body of the heating device, i.e., the first part of the plate heat-saturating chamber frame is a part of the main body of the heating device.

Figure 17 shows a working principle diagram. In Figure 17, 3 is a heat source. 20 and 21 are plates of the chamber. 22 is the second outer surface portion of the frame. 23 is the first outer surface portion of the frame. 24 is the evaporation zone. 25 is the center of the evaporation zone. 26 is the direction of the liquid to the evaporation zone. 27 is the vapor diffusion direction. 28 is the steam channel section. L is the length of the first outer surface portion of the frame. H is the height of the chamber. D is the thickness of the chamber and is also the width of the first outer surface portion of the frame.

As can be seen from the figure, compared with the traditional plate steam chamber, the plate steam chamber uses a narrow and flat frame as the evaporation zone and a very large plate as the condensation zone, which greatly increases the width of material transportation. When the liquid is liquid, the ratio of the cross-section of the steam channel to the area of the evaporation zone increases significantly, the distance from the edge of the evaporation zone to the center decreases significantly, and the ratio of the area of the condensation zone to the area of the evaporation zone increases significantly. Evaporation zone. Therefore, this increases the heat transfer efficiency by an order of magnitude.

Figure 18 shows the internal support structure of the plate steam chamber. 2 is the plate steam chamber. 3 is the heat source. 31 is the point support. 32 is the linear support. 33 is the sheet support.

FIG. 19 shows a three-dimensional view of a steam chamber fixture of a plate steam chamber array similar to that shown in FIGS. 11-12 and FIG. 20 shows a cross-sectional view of a steam chamber fixture of a plate steam chamber array and includes a structure located in direct contact with a heat source 3 without any intermediate structure. The plate steam clamp can be connected to a structure adjacent to the heat source 3 through a clamp fixing hole 42 or other attachment structure. The plate steam chamber fixture 40 includes a metal plate that mechanically engages the edge 44 of the plate steam chamber array. Adjacent plate steam chambers 2 are in direct contact with each other. The direct contact between the plate steam chambers 2 and with the heat source 3 increases the heat dissipation efficiency.

FIG. 21 shows an exploded three-dimensional view of a plate soaking chamber 2 with a vapor chamber fixture 40 but also including a heat sink 50. The vapor chamber fixture 40 is similar to the vapor chamber fixture of FIG. 20 and includes at least one plate soaking chamber opening 46 located within the vapor chamber fixture 40, with the side walls 48 of the opening 46 engaging the edge 44 of the array of plate vapor chambers 2. The heat sink 50 is connected to the inner edge of the array of plate soaking chambers 2 to join adjacent plate soaking chambers 2 of the array to each other at selected locations along the length of the plate soaking chambers 2. The heat sink 50 is formed of a thermally conductive material, such as copper, aluminum, zinc, graphite or other thermally conductive material for heat transfer. In the specific non-limiting example shown in Figures 21-23, the heat sink 50 follows a zigzag pattern between adjacent steam plate chambers 2, so that the heat sink 50 has a pleated shape. The heat sink 50 can be attached to the steam plate chamber 2 using standard methods used in the industry to couple thermally conductive materials, such as through thermally conductive adhesives, solder, welding, and even in some embodiments through press fit or mechanical bonding.

FIG. 22 shows a three-dimensional view of the assembled plate steam chamber 2 array assembly of FIG. 21. During assembly, the side wall 48 of the steam chamber clamp engages the edge 44 of the plate steam chamber 2 array. FIG. 23 shows a cross-sectional view of the assembled plate soaking chamber 2 array assembly of FIG. 22 taken along the section line B-B.

FIG. 24 shows a cross-sectional view of an assembled plate soaking chamber 2 array assembly similar to FIG. 20 or FIG. 22 , emphasizing the first steam chamber fixture embodiment, wherein the length of the plate soaking chamber 2 is not shown to emphasize the first steam chamber fixture embodiment. As shown in the close-up view shown in FIG. 24 , adjacent plate soaking chambers 2 are each in direct contact with each other and in direct contact with the heat source 3. In other embodiments, the gap can be between adjacent plate steam chambers 2 including a central processing unit (CPU) or a graphics processing unit (GPU). Since the heat source area is concentrated, the amount of heat generated is large, so the plate steam chambers are more efficient if they are in direct contact with each other and require a relatively large size. For similar cylinders, the heat flux is relatively low, and there can be gaps between the plate soaking chambers, and the plate soaking chamber size can be smaller. For certain CPU/GPU embodiments, adjacent plate vapor chambers should be spaced in a close-packed manner, less than or equal to 4 millimeters (mm), less than or equal to 3 mm in some embodiments, less than or equal to 2 mm in some embodiments, less than or equal to 1 mm in some embodiments, and in direct contact in some embodiments. For larger heat-generating components with lower heat flux density, the spacing between adjacent plate vapor chambers can be as large as 10 mm.

The steam chamber fixture 40 is mounted to a heat source or a surface near a heat source to press the plate soaking chamber 2 assembly tightly against the heat source 3. The inner surface 48 of at least one plate soaking chamber opening 46 is the inner surface 48 angled to mechanically engage the angled outer edge 44 of the plate soaking chamber 2. The inner surface 48 is angled non-perpendicular to the upper and lower surfaces of the steam chamber fixture 40.

FIG. 25 shows an exploded three-dimensional view of a plate soaking chamber 2 array assembly with a second steam chamber fixture 40 embodiment, highlighting the assembly of the straight plate soaking chamber 2 assembly with the second steam chamber fixture 40 embodiment. Similar to the first steam chamber fixture 40 embodiment, the second steam chamber fixture 40 embodiment includes at least one plate steam chamber opening 46. However, in the second steam chamber fixture 40 embodiment, there are a plurality of plate steam chamber openings 46 corresponding to the number of plate steam chambers. The number of plate soaking chambers 2 in the array of plate soaking chambers 2 mated with the steam chamber fixture 40 is shown in FIG. 2. In other embodiments, multiple plate soaking chambers 2 can be inserted into a single larger plate soaking chamber opening 46 so that the number of plate steam chamber fixture openings 46 matches the number of plate steam chambers.

FIG. 26 shows a cross-sectional view of a steam chamber fixture 40 having a plate soaking chamber gap 52 according to a second embodiment taken along the section line C-C of FIG. 25 . For clarity, the plate soaking chamber 2 and the heat source 3 of FIG. 25 are removed. In this embodiment, the plate soaking chamber opening 46 can be formed to match the external shape of the plate soaking chamber 2, and when the plate soaking chamber 2 is inserted into at least one plate soaking chamber opening 46, the plate soaking chamber opening 46 will cooperate with it. For example, the shape of at least one plate soaking chamber opening 46 can be formed to be only sufficient to maintain mechanical pressure against the array of plate soaking chambers 2 to hold it in place against the heat source 3 ( FIG. 27 ). FIG. 27 shows a cross-sectional view of the steam chamber fixture 40 of FIG. 26 . FIG. 26 shows a portion of a cross-sectional view of an array of plate soaking chambers 2 assembled with a steam chamber fixture 40 and pressing the lower surface of the array of plate soaking chambers 2 directly against a heat source 3. The sides of adjacent plate soaking chambers 2 may be in direct contact with each other, or spaced apart as previously described.

Industrial practicality

The industrial application of this invention can not only significantly reduce the size and height of the heat sink, but also significantly increase the heat flux density of the heat sink.

The heat sink combined with the plate vapor chamber can be used for heat dissipation of high-power semiconductor devices, such as high-power transistors, high-power semiconductor laser components, high-power light-emitting diodes (LEDs), high-power central processing units (CPUs), high-power graphics processing units (GPUs), etc.

When using a heat sink including a plate steam chamber, all water cooling methods can be replaced by air cooling methods, and active cooling methods can be replaced by passive cooling methods.

A heat sink combined with a plate vapor chamber can reduce the height of a desktop tower case to nearly the thickness of a laptop.

It should be understood that implementations of the plate soaking chamber are not limited to the specific components, devices, and parts disclosed in this document, but rather any components, devices, and parts consistent with the intended operation of the plate soaking chamber. Thus, for example, while specific plate soaking chambers and other components, devices, and parts are disclosed, they may include any shape, size, style, type, model, version, grade, measurement, concentration, material, weight, quantity, and/or the like consistent with the intended operation of the plate soaking chamber. Implementations are not limited to the use of any specific components, devices, and parts; provided that the components, devices, and parts selected are consistent with the intended operation of the plate soaking chamber.

Thus, the components defining any plate steam chamber implementation may be formed from any of a number of different types of materials, or combinations thereof, that can be readily formed into shaped objects so long as the selected components are consistent with the intended operation of the plate steam chamber implementation. In the event that a part, assembly, feature, or element is governed by a standard, rule, specification, or other requirement, the part may be manufactured in accordance with and in compliance with such standard, rule, specification, or other requirement.

Various plate soaking chambers may be manufactured using conventional processes augmented and modified by the processes described herein. Some of the components defining the plate soaking chamber may be manufactured simultaneously and integrally connected to one another, while other components may be purchased pre-fabricated or fabricated separately and then assembled with the integral components. Various embodiments may be manufactured using conventional processes augmented and modified by the processes described herein.

Thus, the separate or simultaneous manufacture of these parts may involve extrusion, drawing, vacuum forming, injection molding, blow molding, casting, forging, cold rolling, milling, drilling, hinging, turning, grinding, stamping, cutting, bending, welding, soldering, hardening, riveting, stamping, electroplating, etc. If any of the components are manufactured separately, they may be joined to one another in any manner, such as by the use of adhesives, welding, fasteners (e.g., bolts, nuts, screws, nails, rivets, pins), for example, depending on the specific materials from which the components are formed, among other considerations.

It should be understood that any method of forming or using a plate soaking chamber is not limited to the specific order of steps disclosed in this document. Any steps or step sequences of assembly of a plate soaking chamber indicated herein are given as examples of possible steps or step sequences, and not as limitations, as a variety of assembly processes and step sequences may be used to assemble a plate soaking chamber.

The described embodiments of the plate soaking chamber are intended as examples or explanations, not limitations. Rather, any descriptions related to the foregoing are for exemplary purposes of the present disclosure, and embodiments with similar results may be used for various other applications requiring a plate soaking chamber.

2: Plate steam chamber 42: Clamp fixing hole 44: Outer edge of bottom of plate steam chamber 46: Steam chamber clamp opening 48: Inner surface of steam chamber clamp opening 50: Heat sink

Claims (17)

A plate steam chamber array assembly, comprising: A plurality of plate-shaped chambers connected in an array, in which each plate steam chamber is closely arranged with at least one adjacent plate steam chamber; each plate-shaped chamber is formed by a first plate and a second plate spaced apart and forming a condensation area having a length and a height, the first plate and the second plate being connected together through a frame, the frame being used to form a evaporation area on the first end of the plate steam chamber between the first end of the first plate and the first end of the second plate, the evaporation area having a thickness defined by the distance between the first plate and the second plate, and an evaporation length defined by the length of the evaporation area, the evaporation length of the evaporation area in the plate steam being greater than the thickness of the evaporation area, the first plate and the second plate being sealed by the frame to form a sealed chamber, the sealed chamber having a closed and hollow space defined by the plate steam chamber inside the first plate, the second plate and the frame; A capillary structure layer located in each of the plurality of plate-shaped chambers and in the inner surface of each plate-shaped chamber adjacent to at least a portion of the first plate and the second plate; and the capillary structure layer located in each of the plurality of plate-shaped chambers is further attached to the inner surface of at least a portion of the frame; A phase-change working medium, which is sealed in a sealed chamber in each of the plurality of plate-shaped chambers, each sealed chamber being evacuated; and A steam chamber fixture, which surrounds the array and includes: at least one steam chamber fixture opening located in the steam chamber fixture, and an inner surface of the steam chamber fixture opening configured to engage the outer edges of at least two plate steam chambers in the array, wherein the steam chamber fixture is configured to press the surface of the plate steam chamber array directly against a heat source; wherein the evaporation region is configured to be coupled with the evaporation length and thickness thereof in direct, planar, physical contact with a heat source; wherein the condensation region is configured not to be in direct physical contact with a heat source and is configured to extend away from the heat source; and wherein the at least one steam chamber fixture opening in the steam chamber fixture comprises a plurality of steam chamber fixture openings, each steam chamber fixture opening being sized to receive at least one plate steam chamber therethrough. A plate steam chamber array assembly as described in claim 1, wherein the evaporation length of the evaporation zone within the chamber is at least five times greater than the thickness of the evaporation zone. A plate steam chamber array assembly as described in claim 1, wherein the evaporation length of the evaporation zone within the chamber is at least twice the thickness of the evaporation zone. A plate steam chamber array assembly as described in claim 1, wherein the inner surface of at least one steam chamber clamp opening forms a non-perpendicular angle with the upper surface and the lower surface of the steam chamber clamp. A plate steam chamber array assembly as described in claim 4, wherein the inner surface of each of the at least one steam chamber clamp openings is formed to cooperate with the multiple plate-shaped chambers. The plate steam chamber array assembly as described in claim 1 also includes at least one heat sink extending between at least two chambers of the plurality of plate-shaped chambers. A plate steam chamber array assembly as described in claim 6, wherein the at least one heat sink is in a Z-shape extending back and forth between at least two chambers in the plurality of plate-shaped chambers. A plate steam chamber array assembly, comprising: A plurality of plate steam chambers connected in an array, in which each plate steam chamber is closely arranged with at least one adjacent plate chamber, each plate steam chamber is formed by a second plate and a first plate separated by a distance and forming a condensation area having a length and a height, the first plate and the second plate are connected together by a frame, the frame is used to form an evaporation area on the first end of the plate steam chamber between the first end of the first plate and the first end of the second plate, the evaporation area The region has a thickness defined by the distance between the first plate and the second plate, and has a length of the evaporation region defined by the evaporation length, the evaporation length of the evaporation region in the plate steam chamber is greater than the thickness of the evaporation region, the first plate and the second plate are sealed by the frame to form a sealed chamber, the sealed chamber has a closed and hollow space defined by the plate steam chamber inside the first plate, the second plate and the frame, and the sealed chamber is evacuated; and A steam chamber fixture surrounding the array and comprising: a steam chamber fixture opening within the steam chamber fixture, and an inner surface of the steam chamber fixture opening configured to engage the outer edges of at least two plate steam chambers in the array and press the surface of the array of plate steam chambers directly against a heat source; and wherein the evaporation region is configured to be coupled to the heat source in direct, planar, physical contact with the evaporation length and thickness thereof; wherein the condensation region is configured to not be in direct physical contact with the heat source and is configured to extend away from the heat source; and wherein the at least one steam chamber fixture opening in the steam chamber fixture comprises a plurality of steam chamber fixture openings, each steam chamber fixture opening being sized to receive at least one plate steam chamber therethrough. A plate steam chamber array assembly as described in claim 8, wherein the evaporation length of the evaporation zone within the chamber is at least five times greater than the thickness of the evaporation zone. A plate steam chamber array assembly as described in claim 8, wherein the inner surface of at least one steam chamber clamp opening forms a non-perpendicular angle with the upper surface and the lower surface of the steam chamber clamp. A plate steam chamber array assembly as described in claim 11, wherein the inner surface of each of the at least one steam chamber clamp openings is formed to cooperate with the multiple plate-shaped chambers. A plate steam chamber array assembly as described in claim 9, further comprising at least one heat sink extending between at least two of the plurality of plate-shaped chambers. A plate steam chamber array assembly, comprising: A plurality of plate steam chambers connected in an array, each plate steam chamber including a condensation area having a length and a height, a first plate and a second plate connected together by a frame, the frame forming an evaporation area on a first end of the plate steam chamber and sealing the first plate to the second plate to form a sealed chamber, the sealed chamber having a closed and hollow space defined by the steam chamber inside the first plate, the second plate and the frame, the sealed chamber being evacuated; and A steam chamber clamp surrounding the array and having an inner surface of a steam chamber clamp opening, the inner surface of the steam chamber clamp opening being configured to engage the outer edges of at least two plate steam chambers in the array of plate steam chambers and press the surface of the plate steam chamber array directly against a heat source; The at least one steam chamber fixture opening in the steam chamber fixture includes a plurality of steam chamber fixture openings, each steam chamber fixture opening being sized to receive at least one plate steam chamber passing therethrough. A plate steam chamber array assembly as described in claim 13, wherein the inner surface of at least one steam chamber clamp opening forms a non-perpendicular angle with the upper surface and the lower surface of the steam chamber clamp. A plate steam chamber array assembly as described in claim 13, wherein at least two of the steam plate chambers are in direct contact with at least one adjacent plate steam chamber in the array. The plate steam chamber array assembly as described in claim 15 further includes at least one heat sink extending between at least two of the plurality of plate-shaped chambers. A plate steam chamber array assembly as described in claim 13, wherein the at least one heat sink is in a Z-shape extending back and forth between at least two chambers among the plurality of plate-shaped chambers.