TWI887315B - Packaging container for sterilization - Google Patents
Packaging container for sterilization Download PDFInfo
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- TWI887315B TWI887315B TW109143890A TW109143890A TWI887315B TW I887315 B TWI887315 B TW I887315B TW 109143890 A TW109143890 A TW 109143890A TW 109143890 A TW109143890 A TW 109143890A TW I887315 B TWI887315 B TW I887315B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
- B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
- B65D81/2069—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas in a special atmosphere
- B65D81/2076—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas in a special atmosphere in an at least partially rigid container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
- B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D1/00—Rigid or semi-rigid containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material or by deep-drawing operations performed on sheet material
- B65D1/22—Boxes or like containers with side walls of substantial depth for enclosing contents
- B65D1/26—Thin-walled containers, e.g. formed by deep-drawing operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D43/00—Lids or covers for rigid or semi-rigid containers
- B65D43/02—Removable lids or covers
- B65D43/0202—Removable lids or covers without integral tamper element
- B65D43/0204—Removable lids or covers without integral tamper element secured by snapping over beads or projections
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
- B65D77/10—Container closures formed after filling
- B65D77/20—Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers
- B65D77/2024—Container closures formed after filling by applying separate lids or covers, i.e. flexible membrane or foil-like covers the cover being welded or adhered to the container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/28—Applications of food preservatives, fungicides, pesticides or animal repellants
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Food Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pest Control & Pesticides (AREA)
- Ceramic Engineering (AREA)
- Packages (AREA)
Abstract
Description
[關聯申請案之相互參考] [Cross-reference of related applications]
本申請案係主張日本國特願2019-223878號之優先權,並藉由援引而納入於本申請案說明書的記載中。 This application claims priority to Japanese Patent Application No. 2019-223878, and is incorporated by reference into the description of this application.
本發明係關於殺菌處理用的包裝容器,例如關於在以蔬菜等食品為內容物來包裝並進行殺菌處理時可較佳地使用之包裝容器。 The present invention relates to a packaging container for sterilization, for example, a packaging container that can be preferably used when packaging and sterilizing food such as vegetables.
於包裝食品中,係有在食品工廠等經過調理並加工後之食品被容納於具有開口之容器內,並在對該容器施加頂封或罩蓋之狀態下進行流通者。然而,由於使用頂封或罩蓋之包裝食品並非完全地密封,所以外部氣體可能會侵入於容器內。因此,此等包裝食品的有效期限為極短之大概1至2日,而有廢棄損耗率極高(製品良率差)之問題。 Among packaged foods, there are foods that have been conditioned and processed in food factories, etc., and are placed in containers with openings, and are circulated with the top seal or cover applied to the container. However, since packaged foods with top seals or covers are not completely sealed, external gases may invade the container. Therefore, the shelf life of such packaged foods is extremely short, about 1 to 2 days, and there is a problem of extremely high waste rate (poor product yield).
近來,如此的包裝食品係有下列包裝食品在市面上流通,亦即容器與蓋被熱封等之容器內被完全密封而延長了保存期限者。當中亦有藉由冷藏保存而使保存期限超過2週之包裝食品。 Recently, such packaged foods are circulated in the market, that is, the container and the lid are completely sealed in the container, such as heat-sealed, to extend the shelf life. Some of them have a shelf life of more than 2 weeks by refrigerating.
然而,即使可藉由熱封等來密封容器而防止細菌從外部之侵入,成形容器的內部亦非完全無菌之狀態。因此,極有可能發生在流通過程中由於環境的變化而使容器內的細菌繁殖之情形。因此,為了更延長保存期限,需盡可能地使食品工廠中的作業環境接近於無菌狀態,因而要求嚴格地管理潔淨度。以往,係有人提出一種在將食品容納於容器之狀態下進行加熱殺菌後,於無塵室(無菌室)內以蓋構件來密閉該容器本體之方法(專利文獻1),例如,處理經調理加工後的食品之作業環境的潔淨度亦有被管理至NASA規格無塵室的10000或1000等級之高等級之情形。然而,在導入此無塵室之情形下,係有空調設備的設置和其維持管理耗費極大的成本之問題。 However, even if the container can be sealed by heat sealing to prevent bacteria from entering from the outside, the inside of the molded container is not completely sterile. Therefore, it is very likely that bacteria in the container will multiply due to changes in the environment during the circulation process. Therefore, in order to extend the shelf life, the working environment in the food factory must be as close to the sterile state as possible, and strict cleanliness management is required. In the past, someone proposed a method of sealing the container body with a cover member in a clean room (sterile room) after heat sterilizing the food in the container (Patent Document 1). For example, the cleanliness of the working environment for processing processed food is also managed to a high level of 10000 or 1000 of the NASA standard clean room. However, when introducing this clean room, there is a problem of extremely high cost in the installation and maintenance of air conditioning equipment.
此外,除了食品之外,亦存在有各種在作為製品而流通於市場前應進行殺菌處理之對象物,因而要求對該等對象物有效率地進行殺菌處理。 In addition to food, there are also various objects that need to be sterilized before being circulated in the market as products, so it is required to sterilize these objects efficiently.
[先前技術文獻] [Prior Art Literature]
[專利文獻] [Patent Literature]
[專利文獻1] 日本國特開平9-9937號公報 [Patent Document 1] Japanese Patent Publication No. 9-9937
本發明之課題在於提供一種在對內容物進行殺菌處理時可較佳地使用之包裝容器,例如,該課題在於提供一種較佳地使用在屬於內容物的一例之食品的殺菌處理,而能夠延長食品的品質保持期間之包裝容器。 The subject of the present invention is to provide a packaging container that can be preferably used when sterilizing the contents. For example, the subject is to provide a packaging container that can be preferably used in the sterilization of food as an example of the contents, and can extend the quality preservation period of the food.
本發明之包裝容器係一種用以使容納於內部之內容物暴露於殺菌用氣體來進行殺菌,然後封裝該內容物後使其流通之殺菌處理用的包裝容器,係具備容器本體,該容器本體包含:於上方具有開口且容納內容物之容納部,以及從前述容納部的開口緣朝外延伸之凸緣部;前述凸緣部具有:一次密封區域,係與覆蓋前述開口之蓋構件在一次密封工序中被一次密封;二次密封區域,係與前述蓋構件在一次密封工序後的二次密封工序中被二次密封;凸緣最上部,其上表面係位於該凸緣部的上表面中之最上方;凸緣下部,其上表面係位於該凸緣最上部的上表面之下方;以及至少1個貫通區域,係位於較前述一次密封區域更內側處且設置有貫通前述凸緣部之貫通孔;並且前述凸緣部構成為:於前述蓋構件與前述一次密封區域被密封後,在被前述凸緣最上部所支撐之前述蓋構件與前述凸緣下部之間,形成有可供氣體於外部與前述容納部內之間流通之流通路徑,於前述蓋構件與前述二次密封區域被密封後,前述流通路徑被封閉。 The packaging container of the present invention is a packaging container for sterilization treatment, which exposes the contents contained therein to a sterilizing gas for sterilization, and then seals the contents and allows them to circulate. The packaging container has a container body, which includes: a container portion having an opening at the top and containing the contents, and a flange portion extending outward from the opening edge of the container portion; the flange portion has: a primary sealing area, which is sealed with a cover member covering the opening in a primary sealing process; a secondary sealing area, which is secondary sealed with the cover member in a secondary sealing process after the primary sealing process; and an uppermost portion of the flange, the upper surface of which is sealed with a seal. The flange portion has a surface located at the top of the upper surface of the flange portion; the flange lower portion has an upper surface located below the upper surface of the uppermost portion of the flange; and at least one through area is located further inward than the aforementioned primary sealing area and is provided with a through hole that penetrates the aforementioned flange portion; and the aforementioned flange portion is configured such that after the aforementioned cover member and the aforementioned primary sealing area are sealed, a flow path for gas to flow between the outside and the aforementioned accommodating portion is formed between the aforementioned cover member and the aforementioned flange lower portion supported by the aforementioned uppermost portion, and after the aforementioned cover member and the aforementioned secondary sealing area are sealed, the aforementioned flow path is closed.
此外,於前述包裝容器中,前述貫通孔亦可藉由在前述貫通區域的一部分上形成裂縫而形成。 In addition, in the aforementioned packaging container, the aforementioned through hole can also be formed by forming a crack on a portion of the aforementioned through area.
前述貫通區域亦可具有朝向上方膨起之彎曲面,前述彎曲面的上端亦可構成前述凸緣最上部。 The aforementioned through area may also have a curved surface that bulges upward, and the upper end of the aforementioned curved surface may also constitute the uppermost portion of the aforementioned flange.
此外,於前述包裝容器中,前述貫通區域亦可為往下方凹入之凹部,前述裂縫亦可形成於該凹部內。 In addition, in the aforementioned packaging container, the aforementioned through area may also be a concave portion that is concave downward, and the aforementioned crack may also be formed in the concave portion.
此外,於前述包裝容器中,前述凸緣部亦可設置在前述容納部之開口緣的全周,前述貫通區域亦可設置有複數個,並且配置在隔著前述容納部之相對向位置上。 In addition, in the aforementioned packaging container, the aforementioned flange portion may also be provided on the entire circumference of the opening edge of the aforementioned storage portion, and the aforementioned through-area may also be provided in plural numbers and arranged at opposite positions across the aforementioned storage portion.
本發明之其他包裝容器係一種用以使容納於內部之內容物暴露於殺菌用氣體來進行殺菌,然後封裝該內容物後使其流通之包裝容器,係具備容器本體,該容器本體包含:於上方具有開口且容納內容物之容納部,以及從前述容納部的開口緣朝外延伸之凸緣部;前述凸緣部具有:一次密封區域,係與覆蓋前述開口之蓋構件在一次密封工序中被一次密封;以及二次密封區域,係與前述蓋構件在一次密封工序後的二次密封工序中被二次密封;並且前述凸緣部構成為:於前述蓋構件與前述一次密封區域同被密封後,在其與前述蓋構件之間形成有可供氣體於外部與前述容納部內之間流通之流通路徑,於前述蓋構件與前述二次密封區域被密封後,前述流通路徑被封閉。 Another packaging container of the present invention is a packaging container for exposing the contents contained therein to a sterilizing gas for sterilization, and then sealing the contents to allow them to circulate. The packaging container comprises a container body, the container body comprising: a container portion having an opening at the top and containing the contents, and a flange portion extending outward from the opening edge of the container portion; the flange portion has: a primary sealing area, which is sealed with a cover member covering the opening in the primary sealing area; The flange is sealed once in the process; and the secondary sealing area is sealed twice with the cover member in the secondary sealing process after the primary sealing process; and the flange is configured such that after the cover member and the primary sealing area are sealed together, a flow path is formed between the flange and the cover member for gas to flow between the outside and the inside of the container, and after the cover member and the secondary sealing area are sealed, the flow path is closed.
此外,於前述包裝容器的前述凸緣部中,亦可在較前述一次密封區域更內側處設置有貫通前述凸緣部之至少1個貫通孔,前述貫通孔亦能夠以成為前述流通路徑的一部分之方式構成。 In addition, in the aforementioned flange portion of the aforementioned packaging container, at least one through hole penetrating the aforementioned flange portion may be provided at a location further inward than the aforementioned primary sealing area, and the aforementioned through hole may also be configured in a manner that becomes a part of the aforementioned flow path.
再者,於前述包裝容器中,前述貫通孔亦可藉由在前述凸緣部的一部分上形成裂縫而形成。 Furthermore, in the aforementioned packaging container, the aforementioned through hole can also be formed by forming a crack on a portion of the aforementioned flange portion.
此外,於前述包裝容器中,前述凸緣部亦可具有:以前述裂縫為交界使前述凸緣部的一部分朝向上方變形而形成之凸緣最上部,在藉由該凸緣最上部所支撐之前述蓋構件與前述凸緣部之間亦可形成有前述流通路徑。 In addition, in the aforementioned packaging container, the aforementioned flange portion may also have: a flange uppermost portion formed by deforming a portion of the aforementioned flange portion upward with the aforementioned crack as a boundary, and the aforementioned flow path may also be formed between the aforementioned cover member supported by the aforementioned flange uppermost portion and the aforementioned flange portion.
再者,於前述包裝容器中,朝向前述上方變形之前述凸緣部的一部分亦可具有朝向上方膨起之彎曲面。 Furthermore, in the aforementioned packaging container, a portion of the aforementioned flange portion deformed toward the aforementioned upward direction may also have a curved surface that bulges toward the upward direction.
此外,於前述包裝容器中,前述凸緣部亦可具有:凸緣最上部,其上表面係位於該凸緣部的上表面中之最上方,前述包裝容器亦可在被該凸緣最上部所支撐之前述蓋構件與前述凸緣部之間形成有前述流通路徑。 In addition, in the aforementioned packaging container, the aforementioned flange portion may also have: a flange uppermost portion, whose upper surface is located at the uppermost of the upper surfaces of the flange portion, and the aforementioned packaging container may also form the aforementioned flow path between the aforementioned cover member supported by the flange uppermost portion and the aforementioned flange portion.
此外,於前述包裝容器中,前述凸緣部亦可設置在前述容納部之開口緣的全周,前述貫通孔亦可設置有複數個,並且配置在隔著前述容納部之相對向位置上。 In addition, in the aforementioned packaging container, the aforementioned flange portion may also be provided on the entire circumference of the opening edge of the aforementioned storage portion, and the aforementioned through holes may also be provided in plurality and arranged at opposite positions across the aforementioned storage portion.
此外,於前述包裝容器中,前述一次密封區域的上表面亦可位於前述凸緣部的上表面中之最上方,前述二次密封區域的上表面亦可位於前述一次密封區域的上表面之下方,前述凸緣部亦能夠構成為:於前述蓋構件與前述一次密封區域被密封後,在前述二次密封區域的上表面與前述蓋構件的下表面之間形成有間隙,前述間隙亦可以成為前述流通路徑的一部分之方式構成。 In addition, in the aforementioned packaging container, the upper surface of the aforementioned primary sealing area may also be located at the uppermost of the upper surfaces of the aforementioned flange portion, and the upper surface of the aforementioned secondary sealing area may also be located below the upper surface of the aforementioned primary sealing area. The aforementioned flange portion may also be configured such that after the aforementioned cover member and the aforementioned primary sealing area are sealed, a gap is formed between the upper surface of the aforementioned secondary sealing area and the lower surface of the aforementioned cover member, and the aforementioned gap may also be configured in a manner that becomes a part of the aforementioned flow path.
此外,於前述包裝容器中,前述容納部亦可包含載置有內容物之底板,前述底板的上表面亦可具有凹凸形狀。 In addition, in the aforementioned packaging container, the aforementioned storage portion may also include a bottom plate on which the contents are placed, and the upper surface of the aforementioned bottom plate may also have a concave-convex shape.
本發明之包裝容器亦可更具備蓋構件,前述容器本體及前述蓋構件亦可由包含至少一層的氣體阻隔層之多層結構體所構成。 The packaging container of the present invention may also be equipped with a cover member, and the aforementioned container body and the aforementioned cover member may also be composed of a multi-layer structure including at least one gas barrier layer.
1:包裝容器 1: Packaging container
2:容納部 2: Storage area
3:凸緣部 3: Flange
4:容器本體 4: Container body
5:蓋構件 5: Cover components
6:包裝食品 6: Packaged food
20:開口 20: Open mouth
21:開口緣 21: Opening up
22:底板 22: Base plate
23:側壁 23: Side wall
30:凸緣上表面(上表面) 30: Flange upper surface (upper surface)
31:一次密封區域 31: Primary sealing area
32:二次密封區域 32: Secondary sealing area
33:凸緣最上部 33: Uppermost part of flange
33A:第一凸緣最上部(凸緣最上部) 33A: The uppermost part of the first flange (the uppermost part of the flange)
33B:第二凸緣最上部(凸緣最上部) 33B: The uppermost part of the second flange (the uppermost part of the flange)
33C:第三凸緣最上部(凸緣最上部) 33C: The top of the third flange (top of the flange)
33D:第四凸緣最上部(凸緣最上部) 33D: The uppermost part of the fourth flange (the uppermost part of the flange)
33E:第五凸緣最上部(凸緣最上部) 33E: The top of the fifth flange (top of the flange)
33F:第六凸緣最上部(凸緣最上部) 33F: The uppermost part of the sixth flange (the uppermost part of the flange)
33G:第七凸緣最上部(凸緣最上部) 33G: The top of the seventh flange (top of the flange)
33H:第八凸緣最上部(凸緣最上部) 33H: The top of the eighth flange (top of the flange)
34:凸緣下部 34: Lower flange
35:凸緣下表面 35: flange lower surface
36:貫通區域 36: Through area
38,38A,38B:貫通孔 38,38A,38B:Through holes
39:槽部(凹部) 39: Groove (concave)
220:底板上表面 220: Upper surface of the bottom plate
221:底板下表面 221: Bottom surface of the base plate
222:底板突起部 222: Bottom plate protrusion
223:底板傾斜面 223: Bottom plate slope
230:第1凸緣上表面 230: Upper surface of the first flange
330:凸緣最上部上表面 330: Upper surface of the uppermost part of the flange
340:凸緣下部上表面 340: Upper surface of the lower flange
360:槽部 360: Groove
361:上表面 361: Upper surface
362:下表面 362: Lower surface
363:外周緣 363: Periphery
380:裂縫 380: Cracks
381:直線 381: Straight line
382:交界 382: Junction
C:間隙 C: Gap
F:食品 F: Food
L:切斷線 L: Cutting line
R:流通路徑 R: Circulation path
S:加熱蒸氣 S: Heating steam
圖1A為本發明之包裝容器的一實施型態之示意圖,為前述包裝容器的俯視圖。 Figure 1A is a schematic diagram of an embodiment of the packaging container of the present invention, which is a top view of the aforementioned packaging container.
圖1B為前述包裝容器的一實施型態之示意圖,為前述包裝容器的側視圖。 Figure 1B is a schematic diagram of an embodiment of the aforementioned packaging container, which is a side view of the aforementioned packaging container.
圖2為圖1A之II-II位置上的剖面圖。 Figure 2 is a cross-sectional view at position II-II in Figure 1A.
圖3為顯示前述包裝容器的製造方法中之各工序之圖。 Figure 3 is a diagram showing the various steps in the manufacturing method of the aforementioned packaging container.
圖4A為前述包裝容器的貫通孔形成工序及食品容納工序後之示意圖,為前述包裝容器的俯視圖。 FIG4A is a schematic diagram of the aforementioned packaging container after the through hole forming process and the food containing process, and is a top view of the aforementioned packaging container.
圖4B為前述包裝容器的貫通孔形成工序及食品容納工序後之示意圖,為前述包裝容器的側視圖。 FIG. 4B is a schematic diagram of the aforementioned packaging container after the through hole forming process and the food containing process, and is a side view of the aforementioned packaging container.
圖5為圖4A之V-V位置上的剖面圖。 Figure 5 is a cross-sectional view at the V-V position of Figure 4A.
圖6A為前述包裝容器的一次密封工序後之示意圖,為前述包裝容器的俯視圖。 Figure 6A is a schematic diagram of the aforementioned packaging container after the first sealing process, and is a top view of the aforementioned packaging container.
圖6B為前述包裝容器的一次密封工序後之示意圖,為前述包裝容器的側視圖。 Figure 6B is a schematic diagram of the aforementioned packaging container after the first sealing process, and is a side view of the aforementioned packaging container.
圖7為圖6A之VII-VII位置上的剖面圖。 Figure 7 is a cross-sectional view at position VII-VII of Figure 6A.
圖8A為前述包裝容器的二次密封工序後之示意圖,為前述包裝容器的俯視圖。 Figure 8A is a schematic diagram of the aforementioned packaging container after the secondary sealing process, and is a top view of the aforementioned packaging container.
圖8B為前述包裝容器的二次密封工序後之示意圖,為前述包裝容器的側視圖。 Figure 8B is a schematic diagram of the aforementioned packaging container after the secondary sealing process, and is a side view of the aforementioned packaging container.
圖9為圖8A之IX-IX位置上的剖面圖。 Figure 9 is a cross-sectional view at the IX-IX position of Figure 8A.
圖10A為本發明之包裝容器的其他實施型態之示意圖,為前述包裝容器的俯視圖。 Figure 10A is a schematic diagram of another embodiment of the packaging container of the present invention, which is a top view of the aforementioned packaging container.
圖10B為本發明之包裝容器的其他實施型態之示意圖,為圖10A之X-X位置上的剖面圖。 FIG. 10B is a schematic diagram of another embodiment of the packaging container of the present invention, which is a cross-sectional view at the X-X position of FIG. 10A .
圖11A為前述包裝容器的貫通孔形成工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 11A is a schematic diagram of the aforementioned packaging container after the through hole forming process, and is a top view of the aforementioned packaging container.
圖11B為前述包裝容器的貫通孔形成工序後之示意圖,為圖11A之XI-XI位置上的剖面圖。 FIG. 11B is a schematic diagram of the aforementioned packaging container after the through hole forming process, and is a cross-sectional view at the XI-XI position of FIG. 11A .
圖12A為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 12A is a schematic diagram of another embodiment of the packaging container of the present invention after the primary sealing process, and is a top view of the aforementioned packaging container.
圖12B為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為圖12A之XII-XII位置上的剖面圖。 FIG. 12B is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a cross-sectional view at the XII-XII position of FIG. 12A .
圖13A為前述包裝容器的其他實施型態之二次密封工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 13A is a schematic diagram of another embodiment of the aforementioned packaging container after the secondary sealing process, and is a top view of the aforementioned packaging container.
圖13B為前述包裝容器的其他實施型態之二次密封工序後之示意圖,為圖13A之XIII-XIII位置上的剖面圖。 FIG. 13B is a schematic diagram of another embodiment of the aforementioned packaging container after the secondary sealing process, and is a cross-sectional view at the XIII-XIII position of FIG. 13A .
圖14A為圖12A所示之包裝容器的二次密封工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 14A is a schematic diagram of the packaging container shown in FIG. 12A after the secondary sealing process, and is a top view of the aforementioned packaging container.
圖14B為圖12A所示之包裝容器的二次密封工序後之示意圖,為圖14A之XIV-XIV位置上的剖面圖。 FIG. 14B is a schematic diagram of the packaging container shown in FIG. 12A after the secondary sealing process, and is a cross-sectional view at the XIV-XIV position of FIG. 14A .
圖15A為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 15A is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a top view of the aforementioned packaging container.
圖15B為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為圖15A之XV-XV位置上的剖面圖。 FIG. 15B is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a cross-sectional view at the XV-XV position of FIG. 15A .
圖16A為前述包裝容器的其他實施型態之二次密封工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 16A is a schematic diagram of another embodiment of the aforementioned packaging container after the secondary sealing process, and is a top view of the aforementioned packaging container.
圖16B為前述包裝容器的其他實施型態之二次密封工序後之示意圖,為圖16A之XVI-XVI位置上的剖面圖。 FIG. 16B is a schematic diagram of another embodiment of the aforementioned packaging container after the secondary sealing process, and is a cross-sectional view at the XVI-XVI position of FIG. 16A .
圖17A為本發明之包裝容器的其他實施型態之示意圖,為貫通孔形成工序前之前述包裝容器的俯視圖。 FIG. 17A is a schematic diagram of another embodiment of the packaging container of the present invention, which is a top view of the aforementioned packaging container before the through hole forming process.
圖17B為本發明之包裝容器的其他實施型態之示意圖,為貫通孔形成工序後之前述包裝容器的俯視圖。 FIG. 17B is a schematic diagram of another embodiment of the packaging container of the present invention, which is a top view of the aforementioned packaging container after the through hole forming process.
圖18A為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 18A is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a top view of the aforementioned packaging container.
圖18B為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為圖18A之XVIII-XVIII位置上的剖面圖。 FIG. 18B is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a cross-sectional view at the XVIII-XVIII position of FIG. 18A.
圖19A為前述包裝容器的二次密封工序後之示意圖,為前述包裝容器的俯視圖。 Figure 19A is a schematic diagram of the aforementioned packaging container after the secondary sealing process, and is a top view of the aforementioned packaging container.
圖19B為前述包裝容器的二次密封工序後之示意圖,為圖19A之XIX-XIX位置上的剖面圖。 FIG. 19B is a schematic diagram of the aforementioned packaging container after the secondary sealing process, and is a cross-sectional view at the XIX-XIX position of FIG. 19A.
圖20A為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 20A is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a top view of the aforementioned packaging container.
圖20B為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為圖20A之XX-XX位置上的剖面圖。 FIG. 20B is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a cross-sectional view at the XX-XX position of FIG. 20A.
圖21A為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 21A is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a top view of the aforementioned packaging container.
圖21B為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為圖21A之XXI-XXI位置上的剖面圖。 FIG. 21B is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a cross-sectional view at the XXI-XXI position of FIG. 21A.
圖22A為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 22A is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a top view of the aforementioned packaging container.
圖22B為本發明之包裝容器的其他實施型態之一次密封工序後之示意圖,為圖22A之XXII-XXII位置上的剖面圖。 FIG. 22B is a schematic diagram of another embodiment of the packaging container of the present invention after a primary sealing process, and is a cross-sectional view at the position XXII-XXII of FIG. 22A.
圖23A為前述包裝容器的二次密封工序後之示意圖,為前述包裝容器的俯視圖。 Figure 23A is a schematic diagram of the aforementioned packaging container after the secondary sealing process, and is a top view of the aforementioned packaging container.
圖23B為前述包裝容器的二次密封工序後之示意圖,為圖23A之XXIII-XXIII位置上的剖面圖。 FIG23B is a schematic diagram of the aforementioned packaging container after the secondary sealing process, and is a cross-sectional view at the position XXIII-XXIII of FIG23A.
圖24A為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 24A is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a top view of the aforementioned packaging container.
圖24B為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為圖24A之XXIV-XXIV位置上的剖面圖。 FIG. 24B is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a cross-sectional view at the position of XXIV-XXIV in FIG. 24A.
圖25A為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 25A is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a top view of the aforementioned packaging container.
圖25B為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為圖25A之XXV-XXV位置上的剖面圖。 FIG. 25B is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a cross-sectional view at the position of XXV-XXV in FIG. 25A.
圖26A為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為顯示圖24A的變形例之俯視圖。 FIG. 26A is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a top view showing a variation of FIG. 24A .
圖26B為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為顯示圖25A的變形例之部分俯視圖。 FIG. 26B is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a partial top view showing a variation of FIG. 25A .
圖27A為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為顯示圖24A的變形例之剖面圖。 FIG. 27A is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a cross-sectional view showing a variation of FIG. 24A .
圖27B為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為顯示圖25A的變形例之剖面圖。 FIG. 27B is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a cross-sectional view showing a variation of FIG. 25A .
圖28A為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為前述包裝容器的俯視圖。 FIG. 28A is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a top view of the aforementioned packaging container.
圖28B為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為圖28A之XXVIII-XXVIII位置上的剖面圖。 FIG28B is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a cross-sectional view at the position of XXVIII-XXVIII in FIG28A.
圖29A為用以說明前述包裝容器中的貫通孔形成工序之剖面圖,係顯示貫通孔形成工序前的狀態。 FIG. 29A is a cross-sectional view used to illustrate the through-hole forming process in the aforementioned packaging container, showing the state before the through-hole forming process.
圖29B為用以說明前述包裝容器中的貫通孔形成工序之剖面圖,係顯示於凸緣部形成裂縫之工序。 FIG. 29B is a cross-sectional view used to illustrate the process of forming a through hole in the aforementioned packaging container, showing the process of forming a crack in the flange portion.
圖29C為用以說明前述包裝容器中的貫通孔形成工序之剖面圖,係顯示形成凸緣最上部之工序。 FIG. 29C is a cross-sectional view used to illustrate the process of forming the through hole in the aforementioned packaging container, showing the process of forming the uppermost part of the flange.
圖29D為用以說明前述包裝容器中的貫通孔形成工序之剖面圖,係顯示凸緣最上部形成後之狀態。 FIG. 29D is a cross-sectional view used to illustrate the through-hole forming process in the aforementioned packaging container, showing the state after the uppermost portion of the flange is formed.
圖30A為本發明之包裝容器的其他實施型態之示意圖,為貫通孔形成工序前之前述包裝容器的俯視圖。 FIG. 30A is a schematic diagram of another embodiment of the packaging container of the present invention, which is a top view of the aforementioned packaging container before the through hole forming process.
圖30B為本發明之包裝容器的其他實施型態之示意圖,為圖30A的剖面圖。 FIG. 30B is a schematic diagram of another embodiment of the packaging container of the present invention, which is a cross-sectional view of FIG. 30A .
圖30C為本發明之包裝容器的其他實施型態之示意圖,為貫通孔形成工序後的剖面圖。 FIG. 30C is a schematic diagram of another embodiment of the packaging container of the present invention, which is a cross-sectional view after the through-hole forming process.
圖31A為本發明之包裝容器的其他實施型態之示意圖,為貫通孔形成工序前之前述包裝容器的俯視圖。 FIG. 31A is a schematic diagram of another embodiment of the packaging container of the present invention, which is a top view of the aforementioned packaging container before the through hole forming process.
圖31B為本發明之包裝容器的其他實施型態之示意圖,為圖31A的剖面圖。 FIG31B is a schematic diagram of another embodiment of the packaging container of the present invention, which is a cross-sectional view of FIG31A.
圖31C為本發明之包裝容器的其他實施型態之示意圖,為貫通孔形成工序後的剖面圖。 FIG. 31C is a schematic diagram of another embodiment of the packaging container of the present invention, which is a cross-sectional view after the through-hole forming process.
圖32A為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為顯示第一變形例之示意圖。 FIG. 32A is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a schematic diagram showing the first variant.
圖32B為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為顯示第二變形例之示意圖。 FIG. 32B is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a schematic diagram showing the second variant.
圖32C為本發明之包裝容器的其他實施型態之貫通孔形成工序後之示意圖,為顯示第三變形例之示意圖。 FIG. 32C is a schematic diagram of another embodiment of the packaging container of the present invention after the through hole forming process, and is a schematic diagram showing the third variant.
以下係參考圖1至圖9來說明本發明的一實施型態。圖1及圖2為顯示本發明之包裝容器的一實施型態之圖。此外,圖3為用以說明本發明之包裝食品的製造方法的一實施型態之圖,圖4至圖9為依序顯示此製造方法的各工序之圖。 The following is a description of an embodiment of the present invention with reference to Figures 1 to 9. Figures 1 and 2 are diagrams showing an embodiment of the packaging container of the present invention. In addition, Figure 3 is a diagram for illustrating an embodiment of the method for manufacturing the packaged food of the present invention, and Figures 4 to 9 are diagrams showing the various steps of the manufacturing method in sequence.
首先說明本發明的一實施型態之包裝容器的結構。本發明之包裝容器係用以使容納於內部之作為內容物的一例之食品暴露於作為殺菌用氣體的一例之加熱蒸氣來進行殺菌,然後封裝該內容物(例如食品)以作為包裝食品而流通之殺菌處理用的包裝容器。如圖1及圖2所示,包裝容器1係具備容器本體4,該容器本體4包含:於上方具有開口20之容納部2,以及從容納部2的開口緣21朝外延伸之凸緣部3。
First, the structure of a packaging container of an embodiment of the present invention is described. The packaging container of the present invention is used to sterilize the food contained therein as an example of the content by exposing it to heated steam as an example of the sterilizing gas, and then the content (e.g., food) is sealed to be circulated as packaged food for sterilization. As shown in Figures 1 and 2, the
以下,包裝容器1中的上下方向係與圖1、圖2、圖4至圖9中的上下方向一致。此外,凸緣部3中的內側及外側係與凸緣部3中之與開口緣21接近的一側及遠離的一側一致。
Hereinafter, the up-down direction in the
如圖1A及圖1B所示,容器本體4為可藉由蓋構件而封閉之容器。本實施型態之容器本體4為托盤形狀,惟亦可採用杯形狀、瓶形狀等之任意形狀。此外,容器本體4的材質為合成樹脂。容器本體4的厚度因部位的不同而
非均一,惟亦可於任一部位上皆相同。於本實施型態之容器本體4中,凸緣部3的厚度大於容納部2的厚度。於本實施型態之容器本體4中,容納部2及凸緣部3是由單一構件所構成。具體而言,容器本體4係藉由將1片薄片成形來構成。
As shown in FIG. 1A and FIG. 1B , the
此外,本實施型態之蓋構件具有柔軟性。蓋構件例如由合成樹脂製的膜材所構成。具體而言,構成蓋構件之膜材為經雙軸拉伸之塑膠製的膜材。 In addition, the cover member of this embodiment is flexible. The cover member is, for example, made of a film material made of a synthetic resin. Specifically, the film material constituting the cover member is a film material made of a plastic that has been biaxially stretched.
容納部2為容納食品之部位。本實施型態之容納部2係包含位於下方之底板22。此外,容納部2係包含從底板22的外周緣往上方延伸之側壁23。
The
底板22例如為邊角呈圓緩之矩形板狀。此外,底板22具有:與食品接觸之底板上表面220;以及將容器本體4載置於載置面時成為被載置於此載置面之表面之底板下表面221。
The
底板上表面220具有凹凸形狀。具體而言,於底板上表面220四個角部以外之中央部,設置有從底板上表面220朝向上方突出設置之複數個底板突起部222。此外,底板上表面220的四個角部係由愈接近於各個角部的頂點之部位就愈位於上方之底板傾斜面223所構成。
The
底板突起部222的各部係以大致均等或不均等的間隔來配置。於一對底板突起部222、222之間形成有蒸氣流通之蒸氣流通部,底板突起部222例如以點接觸或線接觸之樣式來支撐容納於容器本體4之內容物。此外,底板突起部222係以使底板突起部222與內容物之間的接觸面積盡可能地降低之方式來設計。
Each part of the
於圖1A所示之實施型態中,形成於底板突起部222、222之間之複數個蒸氣流通部以大致均等的間隔來配置。根據此構成,在藉由蒸氣對容納於
容器本體4之內容物(例如食品)進行殺菌時,通過形成於底部之蒸氣流通路徑,不僅從內容物的上表面及側面,亦可從該內容物的下表面使蒸氣流入,藉此可更均等且有效地藉由蒸氣對內容物進行殺菌。
In the embodiment shown in FIG. 1A , a plurality of steam flow portions formed between the
底板突起部222的高度雖並無須特別限定,惟以容器底部的內側最下表面(亦即容器本體4的內表面中之最下方的高度)為基準,例如為2mm以上、3mm以上或4mm以上。此外,底板突起部222的高度雖並無須特別限定,惟以容器底部的內側最下表面為基準,例如為15mm以下、13mm以下或10mm以下。藉由使底板突起部222的高度位於此範圍內,蒸氣更容易流入於蒸氣流通路徑,可更有效地進行內容物之下表面側的蒸氣殺菌。
Although the height of the
底板突起部222的高度較佳為容器本體4的深度(亦即從容器本體4的開口20至鉛直方向上之內表面的最下方部分為止之距離)之10%以上40%以下。根據該構成,由於蒸氣流通路徑的剖面積增加,所以蒸氣更容易流入於蒸氣流通路徑,可更有效地進行內容物之下表面側的蒸氣殺菌。
The height of the
底板傾斜面223係為了消除容納部2的角部而設置。例如在取出容納於容納部2內之食品時,底板傾斜面223防止此食品滯留在底板22的角部附近而容易從容納部2中取出此食品。此外,底板傾斜面223係以與底板突起部222隔著間隔之狀態來配置。
The bottom plate inclined
側壁23例如以愈是位於上方之部位,於俯視觀看時愈擴開之方式來構成。側壁23的上端緣構成容納部2的開口緣21。
The
凸緣部3為與蓋構件被密封之部位。凸緣部3例如設置在開口緣21之周方向的全周。本實施型態之凸緣部3大致呈板狀,且以於俯視觀看時包
圍容納部2之方式配置為環狀。具體而言,凸緣部3於俯視觀看時為具有4處的角部之環狀。
The
此外,如圖2所示,凸緣部3具有朝向上方之凸緣上表面30以及朝向下方之凸緣下表面35。再者,凸緣部3具有:與覆蓋開口20之蓋構件在一次密封工序中被密封之一次密封區域31,以及與蓋構件在二次密封工序中被密封之二次密封區域32。此外,凸緣部3具有凸緣最上部33以及凸緣下部34。凸緣最上部33係具有位於凸緣上表面30中之最上方之凸緣最上部上表面330。凸緣下部34係具有位於較凸緣最上部上表面330更下方之凸緣下部上表面340。
In addition, as shown in FIG. 2 , the
本實施型態之凸緣部3係具有設置有貫通凸緣部3之貫通孔之貫通區域36(參考圖1A)。於本實施型態中,貫通孔,亦即貫通區域36係位於較一次密封區域31更內側處。設置在貫通區域36之貫通孔係貫通凸緣下表面35與凸緣上表面30之間。此外,於本實施型態之凸緣部3中,設置有複數個貫通區域36。
The
設置在凸緣部3之貫通區域36的數目可為一個,惟較佳是在凸緣部3設置使氣體流入於凸緣部3內之貫通孔以及使氣體從凸緣部3內流出之貫通孔兩者,故較佳為複數個。具體而言,於此凸緣部3中,設置有與凸緣部3的角部數目為相同數目(例如於本實施型態中為四個)之貫通區域36。
The number of through-
一次密封區域31為凸緣部3的一部分,係用以藉由一次密封工序來暫時密封蓋構件與凸緣部3之區域。一次密封工序係在將食品容納於容納部2後且於所容納之食品的殺菌前進行。
The
本實施型態之一次密封區域31係位於凸緣部3的外周部。此外,一次密封區域31在開口緣21的周方向上呈連續。具體而言,一次密封區域31
係在凸緣部3的外周部上之較外周緣更內側,於周方向連續地延伸。更具體而言,一次密封區域31係在凸緣部3的外周部之較外周緣更內側,涵蓋開口緣21的周方向全周而連續地延伸。
The
二次密封區域32為在作為密封工序的二次密封工序中,蓋構件與凸緣部3被密封之區域。二次密封工序係在對容納於容納部2之食品進行殺菌後進行。二次密封區域32為凸緣部3的至少一部分。再者,二次密封區域32亦可包含與一次密封區域31重複(相同)之區域。本實施型態之二次密封區域32為凸緣部3的全區域。
The
凸緣部3的上表面30於上下方向之位置(高度)係由於凸緣部3包含凸緣最上部33或凸緣下部34而成為不均一(參考圖1B)。
The position (height) of the
凸緣最上部33為上表面相對地位於上方之部位。本實施型態之凸緣最上部上表面330較凸緣下部上表面340位於例如約1mm以上的上方。該凸緣最上部33係在進行一次密封工序後且進行二次密封工序前,可將蓋構件支撐於較凸緣下部上表面340更上方。
The
具體而言,凸緣最上部33為將凸緣部3部分地從下方朝向上方推壓所形成之凸部。藉此,凸緣最上部上表面330朝向上方突出。本實施型態之凸緣最上部33為中空,惟亦可為實心。
Specifically, the
於本實施型態之凸緣部3中設置有不同形狀的凸緣最上部33。具體而言如圖1A所示,凸緣最上部33係包含:俯視觀看時具有橢圓形狀之第一凸緣最上部33A;以及俯視觀看時具有圓形狀之第二凸緣最上部33B。第一凸緣最上部33A及第二凸緣最上部33B皆為凸緣最上部上表面330具有彎曲形狀之
凸部。此外,第一凸緣最上部33A及第二凸緣最上部33B皆為高度(上下方向上的尺寸)較俯視觀看時的外徑更小之凸部。
In the
此外,本實施型態之凸緣最上部33係設置在貫通區域36的附近。例如,凸緣最上部33的至少一個被設置在較貫通區域36更內側處。本實施型態之凸緣最上部33全部被設置在較貫通區域36更內側處。具體而言,凸緣最上部33於各貫通區域36的內側設置有複數個(例如各自為一對)。凸緣最上部33以對應於各貫通區域36之方式於其內側各自設置有一個,惟在進行一次密封工序後,較佳是以複數個凸緣最上部33來支撐蓋構件,故較佳係設置有複數個。
In addition, the flange
凸緣下部34為上表面相對地位於下方之部位。本實施型態之凸緣下部34為於凸緣部3中前述凸緣最上部33以外之部位。
The flange
貫通區域36例如配置在隔著容納部2之相對向位置上。於凸緣部3為在4處具有角部之環狀之情形下,貫通區域36較佳係於俯視觀看時在凸緣部3的各角部上分別形成於1處,合計4處。各貫通區域36的形狀較佳皆為同等。
The through
此外,於本實施型態中,貫通區域36為往下方凹入之凹部。此外,貫通區域36於俯視觀看時為圓形狀。具體而言,貫通區域36為朝向下方凹入成大致半球狀之凹部。
In addition, in this embodiment, the through
於本實施型態之貫通區域36的凹部中更形成有槽部360。具體而言,貫通區域36的上表面361係朝向下方凹入,且於該上表面361上設置有往下方凹入之槽部360。
A
槽部360的形狀,例如為於屬於貫通區域36中位於最下方之點的最下點上交叉(例如在此最下點上大致正交)之十字狀。換言之,槽部360於俯
視觀看時具有從貫通區域36的中心輻射狀地擴展之形狀。槽部360的寬度(與槽部360的延伸方向正交之方向上的尺寸)例如為0.5mm。
The shape of the
接著說明使用本發明之包裝容器之處理對象物的殺菌處理方法。一實施型態之殺菌處理方法係以食品為內容物,主要的工序係依序進行食品容納工序、貫通孔形成工序、一次密封工序、殺菌工序及二次密封工序。更具體而言如圖3所示,係依序進行食品容納工序、貫通孔形成工序、一次密封工序、脫氣工序、殺菌工序、冷卻工序、氣體取代工序及二次密封工序。以下說明此一實施型態的各工序。此外,本實施型態之方法係以使用上述實施型態之包裝容器1之情形來進行說明。
Next, the sterilization method of the treatment object using the packaging container of the present invention is described. The sterilization method of one embodiment is to use food as the content, and the main processes are to carry out the food containing process, the through hole forming process, the primary sealing process, the sterilization process and the secondary sealing process in sequence. More specifically, as shown in FIG3, the food containing process, the through hole forming process, the primary sealing process, the degassing process, the sterilization process, the cooling process, the gas replacement process and the secondary sealing process are carried out in sequence. The following describes each process of this embodiment. In addition, the method of this embodiment is described by using the
首先如圖4A及圖4B所示,在進行將食品F容納於包裝容器1之食品容納工序後,進行貫通孔形成工序,該貫通孔形成工序係將貫通貫通區域36之貫通孔38形成於較凸緣部3的一次密封區域31更內側處。食品F例如可採用當日配送食品,亦即在食品工廠等經調理加工後的食品或是兒童加工食品等之任意食品。
First, as shown in FIG. 4A and FIG. 4B, after the food storage process of storing the food F in the
如圖5所示,本實施型態之貫通孔38係藉由在貫通區域36的一部分上形成有裂縫380而形成。於本實施型態之貫通孔形成工序中,貫通區域36係在貫通區域36的外周緣363與凸緣部3之貫通區域36的周圍區域呈連續之狀態下,成為位於較此周圍區域更下方之狀態。換言之,貫通區域36係以貫通區域36的外周緣363為交界,成為位於較凸緣部3之貫通區域36的周圍區域更下方之狀態。
As shown in FIG. 5 , the through
於本實施型態之貫通孔形成工序中,裂縫380係藉由從上方使貫通區域36裂開而形成。於形成裂縫380時,例如可採用下述方法:使用在前端
具備穿孔針之穿孔用輔助具(圖中未顯示),並將該穿孔針穿刺於貫通區域36方法。穿孔針藉由貫通區域36上所設置之槽部360所導引,並刺往貫通區域36的最下點,使貫通區域36沿著槽部360裂開。其結果使貫通區域36以十字狀的裂縫380為交界而分成四個部位。
In the through hole forming process of this embodiment, the
接著如圖6A、圖6B及圖7所示,在進行將覆蓋容納部2的開口20之蓋構件5與凸緣部3的一次密封區域31密封之一次密封工序後,進行殺菌工序,該殺菌工序係經由形成於凸緣部3與蓋構件5之間之流通路徑R使加熱蒸氣S流通於容納部2內,然後使食品F暴露於加熱蒸氣S以進行殺菌(參考圖7)。本實施型態之一次密封工序為將屬於凸緣部3的外周部之一次密封區域31與蓋構件5,在凸緣部3之外周部的周方向上線狀地密封之工序(參考圖6A)。此外,於此一次密封工序中,蓋構件5例如藉由使用熱封機(圖中未顯示)而熱熔接於一次密封區域31。
Next, as shown in FIG. 6A, FIG. 6B and FIG. 7, after the primary sealing process of sealing the
於本實施型態中,係說明使用日阪製作所股份有限公司製,短時間調理殺菌裝置RIC(以下亦僅稱為RIC)來進行殺菌工序之情形。在此所謂短時間調理殺菌裝置RIC(圖中未顯示),意指具備有:可容納成為處理對象之容器包裝的食品之處理槽;將蒸氣供給至該處理槽之蒸氣供給裝置;對該處理槽內進行脫氣以成為真空狀態之減壓裝置;以及加熱該處理槽內之加熱裝置者。 In this embodiment, the sterilization process is described using a short-time conditioning sterilization device RIC (hereinafter referred to as RIC) manufactured by Hiroka Seisakusho Co., Ltd. The short-time conditioning sterilization device RIC (not shown in the figure) here refers to a device having: a processing tank that can accommodate container-packaged food that becomes the processing object; a steam supply device that supplies steam to the processing tank; a decompression device that degases the processing tank to form a vacuum state; and a heating device that heats the processing tank.
於本實施型態中,於殺菌工序前係進行對容納部2內進行脫氣之脫氣工序。進行脫氣工序時,係排列複數個將食品F容納於托盤上並一次密封蓋構件5後之包裝容器1,然後在上下方向上重疊複數段該托盤之狀態下容納於構成RIC之處理槽內。閉合處理槽的蓋而密封處理槽後,對該處理槽內進行脫
氣直到真空狀態為止。於處理槽內被脫氣至真空狀態為止時,容納部2內的空氣經由流通路徑R亦被脫氣,容納部2內亦與處理槽內相同成為真空狀態。
In this embodiment, a degassing process is performed before the sterilization process to degas the
於殺菌工序中,將加熱蒸氣S供給至處理槽內並且使處理槽內的溫度成為例如100℃至145℃。供給至處理槽內之加熱蒸氣S係從凸緣部3的下方經由流通路徑R(貫通孔38及間隙C)流通於容納部2內。藉此,容納於容納部2內之食品F藉由加熱蒸氣S所殺菌。
In the sterilization process, heated steam S is supplied to the processing tank and the temperature in the processing tank is set to, for example, 100°C to 145°C. The heated steam S supplied to the processing tank flows from the bottom of the
於本實施型態中,於殺菌工序後進行將食品F冷卻之冷卻工序。於冷卻工序中,將前述處理槽內減壓以排出加熱蒸氣S,然後使該處理槽內成為真空狀態,藉此使水分蒸發並從食品F中奪去潛熱而使食品F被冷卻。 In this embodiment, a cooling process is performed to cool the food F after the sterilization process. In the cooling process, the pressure in the aforementioned processing tank is reduced to discharge the heated steam S, and then the processing tank is made into a vacuum state, thereby evaporating the water and removing the latent heat from the food F, so that the food F is cooled.
再者,於冷卻工序後,開啟前述處理槽的蓋並連同托盤來取出容納有食品F之包裝容器1。
Furthermore, after the cooling process, the lid of the aforementioned processing tank is opened and the
然後較佳係實施氣體取代工序。於該氣體取代工序中,係將氮氣或二氧化碳氣體等惰性氣體經由流通路徑R供給至容納部2內。
Then it is preferred to perform a gas replacement process. In the gas replacement process, an inert gas such as nitrogen or carbon dioxide is supplied to the
本實施型態之氣體取代工序及二次密封工序係在包裝容器1被載置於熱封機的模具之狀態下進行。於該模具中設置有:於載置包裝容器1時可經由形成於容器本體4之貫通孔38來供給惰性氣體之供給路徑。於本實施型態之氣體取代工序中,惰性氣體經由模具的供給路徑被供給至4處的貫通孔38中之任一個貫通孔38。此外,於該模具中,在對應於剩餘3個貫通孔38之位置亦形成有空氣排出用的排出路徑,被所供給惰性氣體擠壓之包裝容器1內的空氣,係經由該供給路徑往外部釋出。
The gas replacement process and secondary sealing process of this embodiment are performed when the
如圖8A及圖8B所示,在進行氣體取代工序後,係進行將蓋構件5與二次密封區域32密封之二次密封工序。藉此得到由包裝容器1與蓋構件5與食品F所構成之包裝食品6。
As shown in FIG8A and FIG8B, after the gas replacement process, the secondary sealing process of sealing the
本實施型態之二次密封工序為將屬於凸緣部3的外周部之二次密封區域32與蓋構件5面狀地密封之工序。於二次密封工序中,蓋構件5例如藉由使用熱封機(圖中未顯示)而熱熔接於二次密封區域32。
The secondary sealing process of this embodiment is a process of sealing the
於本實施型態中,熱封機具備:載置有容器本體4並進行氣體取代之前述模具(承接模具),以及從上方按壓蓋構件5之模具(熱封用模具);由於二次密封工序於進行氣體取代後,在將包裝容器載置於承接模具之狀態下迅速地進行密封,所以可將包裝容器1內的氧濃度維持在極低的狀態。
In this embodiment, the heat sealer is equipped with: a mold (receiving mold) on which the
由於包裝容器1的二次密封區域32為凸緣部3的全區域,所以在進行二次密封時凸緣部3的全區域從上下方向被加壓,如圖9所示,貫通孔38被封閉並且凸緣最上部33亦被壓潰而使間隙C被封閉。於本實施型態之包裝容器1中,於二次密封後的包裝容器1中貫通孔38雖僅由蓋構件5所封閉,惟在進行二次密封時,藉由在將凸緣部3載置於上表面呈平坦面之模具之狀態下從上下方向來加壓凸緣部3的全區域,於二次密封後的包裝容器1中,貫通孔38亦可藉由施加於蓋構件5而變形(壓潰)之貫通區域36所封閉。此外,於進行二次密封時,亦可從上下方向來加壓凸緣部3中之凸緣最上部33以外之全區域。在此情形下,在凸緣最上部33不被壓潰而殘留之狀態下使間隙C被封閉。
Since the
以上的包裝容器1可較佳地使用作為例如在將食品F容納於容納部2,並於凸緣部3的貫通區域36設置貫通孔38後,將蓋構件5與凸緣部3的一次密封區域31密封,然後在經由流通路徑R使加熱蒸氣S流通於容納部2內
來對食品F進行殺菌後,將蓋構件5與凸緣部3的二次密封區域32密封之包裝食品6的包裝容器1。
The
於此包裝容器1中,在較凸緣部3的一次密封區域31更內側處設置有貫通孔38時,此貫通孔38係構成流通路徑R的一部分。此外,於一次密封區域31與蓋構件5同被密封時,於凸緣下部34與蓋構件5之間產生間隙C,此間隙C係構成流通路徑R的一部分。因此在對食品F進行殺菌時,加熱蒸氣S從凸緣部3的下方經由以貫通孔38及間隙C所構成之流通路徑R流通於容納部2內,藉此可對容納部2內的食品F進行殺菌。
In this
尤其於包裝容器1中,由於凸緣最上部上表面330位於較凸緣下部上表面340更上方,所以在對食品F進行殺菌時,凸緣最上部33係保持流通路徑R所包含之間隙C。因此可在藉由凸緣最上部33將此間隙C不會被封閉之狀態予以確實地維持的狀態下,使加熱蒸氣S流通於容納部2內。
In particular, in the
再者,於此包裝容器1中,蓋構件5位於流通路徑R上方,亦即流通路徑R不會於蓋構件5上暴露,所以落下的細菌不易經由流通路徑R而混入於包裝容器1內。此外,由於二次密封區域32是以與蓋構件5被密封以使流通路徑R被封閉而構成,所以藉由蓋構件5與容器本體4之二次密封,包裝容器1可完全地封裝食品F。
Furthermore, in this
於本實施型態之包裝容器1中,於貫通區域36的一部分形成裂縫380而設置貫通孔38時(參考圖5),於貫通孔38的形成時不會使凸緣部3的一部分破裂,不會產生凸緣部3的碎片。因此可防止凸緣部3的碎片混入於容納部2內。
In the
此外,於本實施型態之包裝容器1中,由於貫通區域36為往下方凹入之凹部(參考圖2),所以在形成貫通孔38時將穿孔針刺穿於此凹入的貫通區域36,藉此使貫通區域36之經穿孔的部位被保持在位於較凸緣部3的其他區域更下方之狀態(參考圖5),並且不易從該位於下方之狀態往上方返回。藉此可防止貫通孔38被封閉,並可維持貫通孔38的貫通狀態直到凸緣部3的二次密封區域與蓋構件5被密封為止。
In addition, in the
再者,於本實施型態之包裝容器1中,由於在隔著容納部2之位置上配置有貫通區域36(參考圖1A),於此位置設置貫通孔38時,藉由使氣體經由貫通孔38從容納部2的兩側流通(參考圖4A),可抑制食品F的加熱不均。
Furthermore, in the
於本實施型態中所使用之容器本體4及蓋構件5較佳係具有氣體阻隔層。亦即,容器本體4及蓋構件5較佳係由包含至少一層的氧阻隔層之多層結構體所構成。藉由使容器本體4及蓋構件5具備氣體阻隔層,而更有效率地抑制殺菌處理後之需氣菌的增殖,所以可進一步增長各實施型態中所達成之品質保持期間。前述氣體阻隔層可考量氧阻隔層。
The
氧阻隔層為具有防止氣體的穿透之功能之層,例如在20℃、65%RH條件下,依據JIS-K7126-2(2006年)第2部(等壓法)所測定之氧穿透率為100cc.20μm/(m2.day.atm)以下之層,較佳為50cc.20μm/(m2.day.atm)以下,尤佳為10cc.20μm/(m2.day.atm)以下之層。在此所謂「10cc.20μm/(m2.day.atm)」的氧穿透率,意指在20μm的阻隔材(意指單獨由氧阻隔層所構成之情形)中,於氧氣1氣壓下之1日的氧穿透量為10cc之意。 The oxygen barrier layer is a layer that has the function of preventing gas penetration. For example, under the conditions of 20°C and 65%RH, the oxygen permeability measured according to JIS-K7126-2 (2006) Part 2 (isobaric method) is 100cc. 20μm/(m2.day.atm) or less, preferably 50cc. 20μm/(m2.day.atm) or less, and particularly preferably 10cc. 20μm/(m2.day.atm) or less. The oxygen permeability of "10cc.20μm/(m2.day.atm)" here means that in a 20μm barrier material (meaning the case consisting of an oxygen barrier layer alone), the oxygen permeability per day under 1 atmosphere of oxygen is 10cc.
上述氧阻隔層例如包含:乙烯-乙烯醇共聚物(以下亦稱為「EVOH(Ethylene Vinyl Alcohol Copolymer)」)、含有磷及多價金屬元素之複合結 構體、加工澱粉、聚醯胺、聚酯、聚二氯亞乙烯、丙烯腈共聚物、聚二氟亞乙烯、聚氯三氟乙烯、聚乙烯醇、無機層狀化合物、無機蒸鍍層、金屬箔等之氣體阻隔材料。尤其從具有良好的氧阻隔性及熔融成形性之理由來看,上述氧阻隔層較佳係含有EVOH、聚醯胺及加工澱粉或此等之組合,從具有特別優異的熔融成形性之理由來看,尤佳係含有EVOH。 The oxygen barrier layer includes, for example, ethylene-vinyl alcohol copolymer (hereinafter also referred to as "EVOH (Ethylene Vinyl Alcohol Copolymer)"), a composite structure containing phosphorus and polyvalent metal elements, processed starch, polyamide, polyester, polyvinylidene chloride, acrylonitrile copolymer, polyvinylidene fluoride, polychlorotrifluoroethylene, polyvinyl alcohol, inorganic layered compound, inorganic vapor deposition layer, metal foil and other gas barrier materials. In particular, from the perspective of having good oxygen barrier properties and melt formability, the oxygen barrier layer preferably contains EVOH, polyamide and processed starch or a combination thereof, and from the perspective of having particularly excellent melt formability, it is particularly preferred to contain EVOH.
(EVOH) (EVOH)
EVOH例如可藉由使乙烯-乙烯酯共聚物皂化而得到。乙烯-乙烯酯共聚物的製造及皂化可藉由一般所知的方法來進行。可使用於該方法之乙烯酯可列舉出:乙酸乙烯酯、甲酸乙烯酯、丙酸乙烯酯、三甲基乙酸乙烯酯以及叔碳酸乙烯酯等之脂肪酸乙烯酯。 EVOH can be obtained, for example, by saponifying ethylene-vinyl ester copolymers. The production and saponification of ethylene-vinyl ester copolymers can be carried out by generally known methods. Vinyl esters that can be used in this method include: vinyl acetate, vinyl formate, vinyl propionate, trimethylacetic acid vinyl esters, and fatty acid vinyl esters such as vinyl versatate.
於本發明中,EVOH的乙烯單元含量較佳例如為20莫耳%以上、22莫耳%以上或24莫耳%以上。此外,EVOH的乙烯單元含量較佳例如為60莫耳%以下、55莫耳%以下或50莫耳%以下。乙烯單元含量為20莫耳%以上時,其熔融成形性及高溫下的氧阻隔性有提升之傾向。乙烯單元含量為60莫耳%以下時,氧阻隔性有提升之傾向。此EVOH中之乙烯單元含量例如可藉由核磁共振法(NMR:Nuclear Magnetic Resonance)來測定。 In the present invention, the ethylene unit content of EVOH is preferably, for example, 20 mol% or more, 22 mol% or more, or 24 mol% or more. In addition, the ethylene unit content of EVOH is preferably, for example, 60 mol% or less, 55 mol% or less, or 50 mol% or less. When the ethylene unit content is 20 mol% or more, its melt forming property and oxygen barrier property at high temperature tend to be improved. When the ethylene unit content is 60 mol% or less, the oxygen barrier property tends to be improved. The ethylene unit content in this EVOH can be measured, for example, by nuclear magnetic resonance (NMR: Nuclear Magnetic Resonance).
於本發明中,EVOH之乙烯酯成分的皂化度較佳例如為80莫耳%以上、90莫耳%以上或99莫耳%以上。藉由使皂化度成為80莫耳%以上,例如可提高上述氧阻隔層的氧阻隔性。另一方面,EVOH之乙烯酯成分的皂化度例如可為100%以下、99%以下。EVOH的皂化度可藉由1H-NMR來測定乙烯酯結構所含有之氫原子的峰值面積以及乙烯醇結構所含有之氫原子的峰值面積來算
出。藉由使EVOH的皂化度位於上述範圍內,可將良好的氧阻隔性提供至構成容器本體4或蓋構件5之氧阻隔層。
In the present invention, the saponification degree of the vinyl ester component of EVOH is preferably, for example, 80 mol% or more, 90 mol% or more, or 99 mol% or more. By making the saponification degree 80 mol% or more, for example, the oxygen barrier property of the above-mentioned oxygen barrier layer can be improved. On the other hand, the saponification degree of the vinyl ester component of EVOH can be, for example, less than 100% or less than 99%. The saponification degree of EVOH can be calculated by measuring the peak area of hydrogen atoms contained in the vinyl ester structure and the peak area of hydrogen atoms contained in the vinyl alcohol structure by 1H-NMR. By making the saponification degree of EVOH within the above range, good oxygen barrier properties can be provided to the oxygen barrier layer constituting the
此外,在不阻礙本發明的目的之範圍內,EVOH可具有來自乙烯及乙烯酯及其皂化物以外之其他單體的單元。於EVOH具有其他單體單元之情形下,該其他單體單元相對於EVOH的全結構單元之含量例如為30莫耳%以下、20莫耳%以下、10莫耳%以下或5莫耳%以下。再者,於EVOH具有來自該其他單體的單元之情形下,該含量例如為0.05莫耳%以上或0.1莫耳%以上。 In addition, within the scope of not hindering the purpose of the present invention, EVOH may have units derived from other monomers other than ethylene and vinyl esters and saponified products thereof. In the case where EVOH has other monomer units, the content of the other monomer units relative to the total structural units of EVOH is, for example, 30 mol% or less, 20 mol% or less, 10 mol% or less, or 5 mol% or less. Furthermore, in the case where EVOH has units derived from the other monomers, the content is, for example, 0.05 mol% or more or 0.1 mol% or more.
如此之EVOH可具有之其他單體例如可列舉出:丙烯、丁烯、戊烯、己烯等之烯;3-醯氧基-1-丙烯、3-醯氧基-1-丁烯、4-醯氧基-1-丁烯、3,4-二醯氧基-1-丁烯、3-醯氧基-4-甲基-1-丁烯、4-醯氧基-1-丁烯、3,4-二醯氧基-1-丁烯、3-醯氧基-4-甲基-1-丁烯、4-醯氧基-2-甲基-1-丁烯、4-醯氧基-3-甲基-1-丁烯、3,4-二醯氧基-2-甲基-1-丁烯、4-醯氧基-1-戊烯、5-醯氧基-1-戊烯、4,5-二醯氧基-1-戊烯、4-醯氧基-1-己烯、5-醯氧基-1-己烯、6-醯氧基-1-己烯、5,6-二醯氧基-1-己烯、1,3-二乙醯氧基-2-亞甲基丙烷等之含酯基烯或其皂化物;丙烯酸、甲基丙烯酸、巴豆酸、伊康酸等之不飽和酸或其酐、鹽、或是單或二烷酯等;丙烯腈、甲基丙烯腈等之腈;丙烯醯胺、甲基丙烯醯胺等之醯胺;乙烯基磺酸、烯丙基磺酸、甲基烯丙基磺酸等之烯烴磺酸或其鹽;乙烯基三甲氧矽烷、乙烯基三乙氧矽烷、乙烯基三(β-甲氧基-乙氧基)矽烷、γ-甲基丙烯氧基丙基三甲氧矽烷等之乙烯基矽烷化合物;烷基乙烯基醚類、乙烯基酮、N-乙烯基吡咯啶酮、氯乙烯、二氯亞乙烯等。 Such other monomers that EVOH may have include, for example, propylene, butene, pentene, hexene, etc.; 3-acyloxy-1-propylene, 3-acyloxy-1-butene, 4-acyloxy-1-butene, 3,4-diacyloxy-1-butene, 3-acyloxy-4-methyl-1-butene, 4-acyloxy-1-butene, 3,4-diacyloxy-1-butene; , 3-acyloxy-4-methyl-1-butene, 4-acyloxy-2-methyl-1-butene, 4-acyloxy-3-methyl-1-butene, 3,4-diacyloxy-2-methyl-1-butene, 4-acyloxy-1-pentene, 5-acyloxy-1-pentene, 4,5-diacyloxy-1-pentene, 4-acyloxy-1-hexene, 5-acyloxy-1-hexene Ester-containing olefins such as 1,2-dimethoxy-1-hexene, 6-acyloxy-1-hexene, 5,6-diacyloxy-1-hexene, 1,3-diethoxy-2-methylenepropane, or their saponified products; unsaturated acids such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, or their anhydrides, salts, or mono- or di-alkyl esters; nitriles such as acrylonitrile and methacrylonitrile; amides such as acrylamide and methacrylamide; olefin sulfonic acids such as vinyl sulfonic acid, allyl sulfonic acid, methylallyl sulfonic acid, or their salts; vinyl silane compounds such as vinyl trimethoxysilane, vinyl triethoxysilane, vinyl tri(β-methoxy-ethoxy) silane, γ-methacryloxypropyl trimethoxysilane, or the like; alkyl vinyl ethers, vinyl ketone, N-vinyl pyrrolidone, vinyl chloride, vinylidene chloride, etc.
EVOH可為經由胺基甲酸酯化、縮酮化、氰乙基化、氧化烯化等手段所變性之EVOH。如此地經變性之EVOH係有提升上述氧阻隔層的熔融成形性之傾向。 EVOH can be EVOH modified by urethanization, acetalization, cyanoethylation, oxyalkylation, etc. Such modified EVOH tends to improve the melt formability of the above-mentioned oxygen barrier layer.
EVOH亦可組合使用2種以上之乙烯單元含量、皂化度、共聚物成分、有無變性或變性的種類等為相異之EVOH。 EVOH can also be used in combination of two or more types of EVOH with different ethylene unit content, saponification degree, copolymer components, presence or absence of modification or type of modification, etc.
EVOH可藉由塊狀聚合法、溶液聚合法、懸浮聚合法、乳化聚合法等之一般所知的方法而得到。於一實施型態中,係使用可在無溶劑或醇等之溶液中進行聚合之塊狀聚合法或溶液聚合法。 EVOH can be obtained by generally known methods such as bulk polymerization, solution polymerization, suspension polymerization, and emulsion polymerization. In one embodiment, a bulk polymerization method or a solution polymerization method that can be performed in a solvent-free solution or in an alcohol solution is used.
溶液聚合法中所使用之溶劑並無特別限定,例如為醇,較佳為甲醇、乙醇、丙醇等之低級醇。聚合反應液中之溶劑的用量可考量目的之EVOH的黏度平均聚合度或溶劑的鏈轉移來選擇,反應液所含有之溶劑與全單體量之質量比(溶劑/全單體)例如為0.01至10,較佳為0.05至3。 The solvent used in the solution polymerization method is not particularly limited, for example, alcohol, preferably methanol, ethanol, propanol and other lower alcohols. The amount of solvent in the polymerization reaction solution can be selected by considering the viscosity average polymerization degree of the target EVOH or the chain transfer of the solvent. The mass ratio of the solvent to the total monomer amount (solvent/total monomer) contained in the reaction solution is, for example, 0.01 to 10, preferably 0.05 to 3.
此外,上述聚合所使用之觸媒例如可列舉出:2,2-偶氮雙異丁腈、2,2-偶氮雙-(2,4-二甲基戊腈)、2,2-偶氮雙-(4-甲氧基-2,4-二甲基戊腈)、2,2-偶氮雙-(2-環丙基丙腈)等之偶氮系起始劑;過氧化異丁醯、異丙苯基過氧基新癸酸酯、二異丙基過氧基碳酸酯、二正丙基過氧基二碳酸酯、三級丁基過氧基新癸酸酯、過氧化月桂醯、過氧化苯甲醯、氫過氧化三級丁基等之有機過氧化物系起始劑等。 In addition, the catalyst used in the above polymerization can be listed as follows: azo initiators such as 2,2-azobisisobutyronitrile, 2,2-azobis-(2,4-dimethylvaleronitrile), 2,2-azobis-(4-methoxy-2,4-dimethylvaleronitrile), 2,2-azobis-(2-cyclopropylpropionitrile); organic peroxide initiators such as isobutylene peroxide, isopropyl peroxyneodecanoate, diisopropyl peroxycarbonate, di-n-propyl peroxydicarbonate, tertiary butyl peroxyneodecanoate, lauryl peroxide, benzoyl peroxide, tertiary butyl hydroperoxide, etc.
聚合溫度較佳為20℃至90℃,尤佳為40℃至70℃。聚合時間較佳為2小時至15小時,尤佳為3小時至11小時。聚合率相對於投入的乙烯酯較佳為10%至90%,尤佳為30%至80%。聚合後之溶液中的樹脂含有率較佳為5%至85%,尤佳為20%至70%。 The polymerization temperature is preferably 20°C to 90°C, and more preferably 40°C to 70°C. The polymerization time is preferably 2 hours to 15 hours, and more preferably 3 hours to 11 hours. The polymerization rate is preferably 10% to 90% relative to the input vinyl ester, and more preferably 30% to 80%. The resin content in the solution after polymerization is preferably 5% to 85%, and more preferably 20% to 70%.
於上述聚合中,於既定時間的聚合後或到達既定的聚合率後,可視需要添加聚合禁止劑並蒸發去除未反應的乙烯氣體,可去除未反應的乙烯酯。 In the above polymerization, after a predetermined polymerization time or after reaching a predetermined polymerization rate, a polymerization inhibitor may be added as needed to evaporate and remove unreacted ethylene gas, thereby removing unreacted vinyl ester.
接著於上述共聚物溶液中添加鹼觸媒,使上述共聚物皂化。連續式或分批式皆可採用作為皂化的方法。可添加之鹼觸媒的例子可列舉出氫氧化鈉、氫氧化鉀、醇化鹼金屬等。 Then, an alkaline catalyst is added to the copolymer solution to saponify the copolymer. Both continuous and batch methods can be used as saponification methods. Examples of alkaline catalysts that can be added include sodium hydroxide, potassium hydroxide, alkali metal alcoholates, etc.
皂化反應後的EVOH係含有鹼觸媒、乙酸鈉或乙酸鉀等之衍生鹽類、其他雜質等。因此,較佳係視需要進行中和或洗淨並藉此去除該等觸媒、鹽類、雜質。在此,在以幾乎不含既定的離子(例如金屬離子、氯化物離子)之水(例如離子交換水)來洗淨皂化反應後的EVOH時,亦可不完全去除乙酸鈉或乙酸鉀等之衍生鹽類而使其一部分殘存。 EVOH after saponification contains alkaline catalysts, derivative salts such as sodium acetate or potassium acetate, and other impurities. Therefore, it is better to neutralize or wash as needed to remove the catalysts, salts, and impurities. Here, when washing EVOH after saponification with water (such as ion exchange water) that contains almost no predetermined ions (such as metal ions and chloride ions), it is also possible to not completely remove the derivative salts such as sodium acetate or potassium acetate and leave some of them.
EVOH亦可含有其他熱塑性樹脂、金屬鹽、酸、硼化合物、塑化劑、填充材料、抗結塊劑、潤滑劑、穩定劑、界面活性劑、著色劑、紫外線吸收劑、抗帶電劑、乾燥劑、交聯劑、各種纖維等之補強材料、其他成分。從上述氧阻隔層的熱穩定性或與其他樹脂之接著性良好之理由來看,較佳係含有金屬鹽及酸。 EVOH may also contain other thermoplastic resins, metal salts, acids, boron compounds, plasticizers, fillers, anti-caking agents, lubricants, stabilizers, surfactants, colorants, ultraviolet absorbers, antistatic agents, desiccants, crosslinking agents, various fiber reinforcements, and other ingredients. From the perspective of the thermal stability of the oxygen barrier layer or good adhesion with other resins, it is better to contain metal salts and acids.
從提升層間接著性之點來看,上述金屬鹽較佳係使用鹼金屬鹽,從提升熱穩定性之點來看,較佳係含有鹼土類金屬鹽。於EVOH含有金屬鹽之情形下,該含量相對於EVOH以該金屬鹽的金屬原子換算,例如為1ppm以上、5ppm以上、10ppm以上或20ppm以上。此外,於EVOH含有金屬鹽之情形下,該含量相對於EVOH以該金屬鹽的金屬原子換算,例如為10000ppm以下、5000ppm以下、1000ppm以下或500ppm以下。藉由使金屬鹽的含量位於由上述
下限及上限所構成之範圍內,係有良好地保持上述氧阻隔層的層間接著性,並且良好地保持在回收容器本體4時之EVOH的熱穩定性。
From the viewpoint of improving the indirectness of the layer, the above-mentioned metal salt is preferably an alkaline metal salt, and from the viewpoint of improving the thermal stability, it is preferably an alkaline earth metal salt. When EVOH contains a metal salt, the content thereof is, for example, 1 ppm or more, 5 ppm or more, 10 ppm or more, or 20 ppm or more, calculated as the metal atom of the metal salt relative to EVOH. In addition, when EVOH contains a metal salt, the content thereof is, for example, 10000 ppm or less, 5000 ppm or less, 1000 ppm or less, or 500 ppm or less, calculated as the metal atom of the metal salt relative to EVOH. By making the content of the metal salt within the range formed by the above lower limit and upper limit, the interlayer adhesion of the above oxygen barrier layer is well maintained, and the thermal stability of EVOH when the
上述酸例如可列舉出羧酸化合物、磷酸化合物等。此等酸從可提高將EVOH熔融成形時的熱穩定性之觀點來看為有用。於EVOH含有羧酸化合物之情形下,羧酸的含量(亦即含有EVOH之氧阻隔層的乾燥組成物中之羧酸的含量)例如為1ppm以上、10ppm以上或50ppm以上。此外,羧酸化合物的含量例如為10000ppm以下、1000ppm以下或500ppm以下。於EVOH含有磷酸化合物之情形下,磷酸的含量(亦即含有EVOH之氧阻隔層之磷酸化合物的磷酸根換算含量)例如為1ppm以上、10ppm以上或30ppm以上。此外,磷酸化合物的含量例如為10000ppm以下、1000ppm以下或300ppm以下。藉由使EVOH在上述範圍內含有羧酸化合物或磷酸化合物,係有EVOH於熔融成形時的熱穩定性變得良好之傾向。 Examples of the above-mentioned acid include carboxylic acid compounds and phosphoric acid compounds. These acids are useful from the viewpoint of improving the thermal stability of EVOH when it is melt-formed. In the case where EVOH contains a carboxylic acid compound, the content of the carboxylic acid (that is, the content of the carboxylic acid in the dry composition containing the oxygen barrier layer of EVOH) is, for example, 1 ppm or more, 10 ppm or more, or 50 ppm or more. In addition, the content of the carboxylic acid compound is, for example, less than 10000 ppm, less than 1000 ppm, or less than 500 ppm. In the case where EVOH contains a phosphoric acid compound, the content of phosphoric acid (that is, the phosphate-converted content of the phosphoric acid compound in the oxygen barrier layer containing EVOH) is, for example, 1 ppm or more, 10 ppm or more, or 30 ppm or more. In addition, the content of the phosphoric acid compound is, for example, less than 10000 ppm, less than 1000 ppm, or less than 300 ppm. By making EVOH contain a carboxylic acid compound or a phosphoric acid compound within the above range, the thermal stability of EVOH during melt molding tends to be improved.
於EVOH含有上述硼化合物之情形下,該含量(亦即含有EVOH之氧阻隔層的乾燥組成物中之硼化合物的硼換算含量)例如為1ppm以上、10ppm以上或50ppm以上。此外,硼化合物的含量例如為2000ppm以下、1000ppm以下或500ppm以下。藉由使EVOH在上述範圍內含有硼化合物或磷酸化合物,係有EVOH於熔融成形時的熱穩定性變得良好之傾向。 When EVOH contains the above-mentioned boron compound, the content (i.e., the boron-converted content of the boron compound in the dry composition containing the oxygen barrier layer of EVOH) is, for example, 1 ppm or more, 10 ppm or more, or 50 ppm or more. In addition, the content of the boron compound is, for example, less than 2000 ppm, less than 1000 ppm, or less than 500 ppm. By making EVOH contain a boron compound or a phosphoric acid compound within the above range, there is a tendency that the thermal stability of EVOH during melt molding becomes good.
用以使包含EVOH之氧阻隔層含有上述羧酸化合物、磷酸化合物或硼化合物之方法並無特別限定,例如可在含有EVOH之組成物的顆粒化時添加該等化合物來混練。上述羧酸化合物、磷酸化合物或硼化合物的添加方法並無特別限定,可列舉出:以乾燥粉末之形式來添加之方法,於含浸既定溶劑之膏的狀態下添加之方法,於懸浮於既定液體之狀態下添加之方法,溶解於既定溶劑並 作為溶液來添加之方法,浸漬於既定溶液之方法等。尤其從可使該等化合物均質地分散於EVOH中之理由來看,較佳係採用溶解於既定溶劑而作為溶液來添加之方法以及浸漬於既定溶液之方法。如此的方法所使用之溶劑並無特別限定,考量到作為添加劑所添加之該等化合物的溶解性、成本、處理的容易度、作業環境的安全性等,較佳為水。 There is no particular limitation on the method for making the oxygen barrier layer containing EVOH contain the above-mentioned carboxylic acid compound, phosphoric acid compound or boron compound. For example, the above-mentioned compounds can be added and kneaded when the composition containing EVOH is granulated. There is no particular limitation on the method for adding the above-mentioned carboxylic acid compound, phosphoric acid compound or boron compound. Examples include: a method of adding in the form of dry powder, a method of adding in a paste state impregnated with a predetermined solvent, a method of adding in a state suspended in a predetermined liquid, a method of adding as a solution by dissolving in a predetermined solvent, a method of immersing in a predetermined solution, etc. In particular, from the reason that the above-mentioned compounds can be uniformly dispersed in EVOH, the method of adding as a solution by dissolving in a predetermined solvent and the method of immersing in a predetermined solution are preferably adopted. The solvent used in this method is not particularly limited. Considering the solubility, cost, ease of handling, safety of the working environment, etc. of the compounds added as additives, water is preferred.
於多層結構體中的氧阻隔層含有EVOH作為主成分之情形下,該氧阻隔層中之EVOH的比率例如為60質量%以上、70質量%以上、80質量%以上、90質量%以上或100質量%。在此,本說明書中所使用之用語「氧阻隔層的主成分」,意指於構成氧阻隔層之成分中具有最大的質量%之成分。 When the oxygen barrier layer in the multilayer structure contains EVOH as the main component, the ratio of EVOH in the oxygen barrier layer is, for example, 60% by mass or more, 70% by mass or more, 80% by mass or more, 90% by mass or more, or 100% by mass. Here, the term "main component of the oxygen barrier layer" used in this specification means the component with the largest mass% among the components constituting the oxygen barrier layer.
於多層結構體中的氧阻隔層含有EVOH作為主成分之情形下,該氧阻隔層的平均厚度例如為3μm以上、5μm以上或10μm以上。此外,該氧阻隔層的平均厚度例如為100μm以下或50μm以下。在此,本說明書中所使用之用語「氧阻隔層的平均厚度」,意指多層結構體所含有之上述含有EVOH作為主成分之氧阻隔層之全體厚度的合計除以該氧阻隔層的層數後之值。藉由使氧阻隔層的平均厚度位於上述範圍內,構成本發明之包裝容器之容器本體4或蓋構件5的耐久性或柔軟性、外觀特性有變得良好之傾向。
In the case where the oxygen barrier layer in the multilayer structure contains EVOH as the main component, the average thickness of the oxygen barrier layer is, for example, 3 μm or more, 5 μm or more, or 10 μm or more. In addition, the average thickness of the oxygen barrier layer is, for example, 100 μm or less or 50 μm or less. Here, the term "average thickness of the oxygen barrier layer" used in this specification means the value obtained by dividing the total thickness of the above-mentioned oxygen barrier layer containing EVOH as the main component contained in the multilayer structure by the number of layers of the oxygen barrier layer. By making the average thickness of the oxygen barrier layer within the above range, the durability, softness, and appearance characteristics of the
(含有磷及多價金屬元素之複合結構體) (Complex structure containing phosphorus and polyvalent metal elements)
含有磷及多價金屬元素之複合結構體係具有藉由使磷化合物與多價金屬的化合物進行反應所形成之阻隔層。此結構體可藉由將含有磷化合物之溶液與含有多價金屬的化合物之溶液或分散液混合而調製塗覆劑,並將該塗覆劑塗佈於基材上,以使多價金屬的化合物與磷化合物進行反應來形成。在此以M來表示上述多價金屬原子時,於多價金屬原子M與磷原子之間形成有以M-O-P所表示 之鍵。M-O-P鍵於紅外線吸收光譜中的特性吸收帶域,可於1080cm-1至1130cm-1的區域中觀察到,於該複合結構體的紅外線吸收光譜中,800cm-1至1400cm-1的區域中之最大吸收波數較佳係位於1080cm-1至1130cm-1的範圍。複合結構體的最大吸收波數位於上述範圍內時,該複合結構體係有具有優異的氧阻隔性之傾向。 The composite structure containing phosphorus and a polyvalent metal element has a barrier layer formed by reacting a phosphorus compound with a polyvalent metal compound. The structure can be formed by mixing a solution containing a phosphorus compound with a solution or dispersion containing a polyvalent metal compound to prepare a coating agent, and applying the coating agent on a substrate to react the polyvalent metal compound with the phosphorus compound. When M is used to represent the polyvalent metal atom, a bond represented by M-O-P is formed between the polyvalent metal atom M and the phosphorus atom. The characteristic absorption band of the M-O-P bond in the infrared absorption spectrum can be observed in the region of 1080cm-1 to 1130cm-1. In the infrared absorption spectrum of the composite structure, the maximum absorption wave number in the region of 800cm-1 to 1400cm-1 is preferably in the range of 1080cm-1 to 1130cm-1. When the maximum absorption wave number of the composite structure is within the above range, the composite structure tends to have excellent oxygen barrier properties.
塗覆劑所塗佈之基材並無特別限定,例如可列舉出:熱塑性樹脂、熱硬化性樹脂等之樹脂;布帛、紙類等之纖維集合體;木材;玻璃等。特別是以熱塑性樹脂及纖維集合體為佳,尤佳為熱塑性樹脂。基材的型態並無特別限制,可為膜或片材等之層狀。基材尤佳是由熱塑性樹脂膜及紙所構成者,更佳為熱塑性樹脂膜。熱塑性樹脂膜較佳為聚酯,從可對複合結構體賦予良好的機械強度之理由來看,尤佳為聚對苯二甲酸乙二酯。 The substrate on which the coating agent is applied is not particularly limited, and examples thereof include: resins such as thermoplastic resins and thermosetting resins; fiber aggregates such as cloth and paper; wood; glass, etc. In particular, thermoplastic resins and fiber aggregates are preferred, and thermoplastic resins are particularly preferred. The form of the substrate is not particularly limited, and may be a layer such as a film or sheet. The substrate is particularly preferably composed of a thermoplastic resin film and paper, and more preferably a thermoplastic resin film. The thermoplastic resin film is preferably polyester, and polyethylene terephthalate is particularly preferred because it can impart good mechanical strength to the composite structure.
多價金屬元素只要是2個分子以上的磷化合物可反應之多價金屬元素即可,並無特別限定,可使用任意元素。例如,多價金屬元素可為半多價金屬元素。多價金屬元素的例子可列舉出:鎂、鈣、鋅、鋁、矽、鈦、鋯等元素,特佳為鋁。 The polyvalent metal element is not particularly limited as long as it is a polyvalent metal element that can react with more than two molecules of phosphorus compounds, and any element can be used. For example, the polyvalent metal element can be a semi-polyvalent metal element. Examples of polyvalent metal elements include magnesium, calcium, zinc, aluminum, silicon, titanium, zirconium and the like, and aluminum is particularly preferred.
多價金屬元素的化合物只要是可與磷化合物反應而形成複合結構體者即可,並無特別限定,可使用任意化合物。此外,多價金屬化合物可作為溶解於溶劑之溶液來使用,或是作為使多價金屬化合物的微粒分散於溶劑之分散液而使用,例如可使用含有硝酸鋁作為多價金屬化合物之水溶液。 The compound of the polyvalent metal element is not particularly limited as long as it can react with the phosphorus compound to form a composite structure, and any compound can be used. In addition, the polyvalent metal compound can be used as a solution dissolved in a solvent, or as a dispersion in which microparticles of the polyvalent metal compound are dispersed in a solvent. For example, an aqueous solution containing aluminum nitrate as the polyvalent metal compound can be used.
再者,亦可使多價金屬化合物的微粒分散於水或水性溶劑中而作為分散液來使用。此分散液較佳為氧化鋁微粒的分散液。一般而言,多價金屬氧化物的微粒於該表面上具有羥基,由於羥基的存在,可與上述磷化合物進行反應 而形成上述鍵。多價金屬氧化物的微粒例如能夠以可水解的特性基鍵結於金屬原子之化合物為原料,使其水解並縮合此水解生成物而合成。原料的例子可列舉出氯化鋁、三乙氧化鋁及異丙氧化鋁。縮合上述水解生成物之方法例如可列舉出溶膠凝膠法等之液相合成法。此外,多價金屬氧化物的微粒較佳例如具有球狀、扁平狀、多面體狀、纖維狀或針狀的型態,從可提高氧阻隔性之理由來看,較佳係具有纖維狀或針狀的型態。再者,為了提高氧阻隔性及透明性,多價金屬氧化物微粒的平均粒徑較佳為1nm以上100nm以下。 Furthermore, microparticles of a polyvalent metal compound may be dispersed in water or an aqueous solvent and used as a dispersion. This dispersion is preferably a dispersion of aluminum oxide microparticles. In general, microparticles of a polyvalent metal oxide have hydroxyl groups on the surface, and due to the presence of hydroxyl groups, they can react with the above-mentioned phosphorus compound to form the above-mentioned bonds. Microparticles of a polyvalent metal oxide can be synthesized, for example, by using a compound in which a hydrolyzable characteristic group is bonded to a metal atom as a raw material, hydrolyzing it, and condensing the hydrolysis product. Examples of raw materials include aluminum chloride, aluminum triethoxide, and aluminum isopropoxide. Methods for condensing the above-mentioned hydrolysis product include, for example, liquid phase synthesis methods such as the sol-gel method. In addition, the polyvalent metal oxide particles preferably have a spherical, flat, polyhedral, fibrous or needle-shaped shape. From the reason that the oxygen barrier property can be improved, the fibrous or needle-shaped shape is preferred. Furthermore, in order to improve the oxygen barrier property and transparency, the average particle size of the polyvalent metal oxide particles is preferably greater than 1nm and less than 100nm.
磷化合物只要是可與多價金屬的化合物反應而形成上述鍵者即可,並無特別限定,可使用任意的磷化合物。磷化合物例如可列舉出磷酸系化合物及其衍生物。具體的例子可列舉出:磷酸、多磷酸、亞磷酸、膦酸。上述多磷酸可列舉出:由焦磷酸、三磷酸或4個以上的磷酸縮合而成之多磷酸。此外、磷酸系化合物的衍生物可列舉出:磷酸鹽、酯(例如磷酸三甲酯)、鹵化物、脫水物(例如五氧化磷)。 The phosphorus compound is not particularly limited as long as it can react with a polyvalent metal compound to form the above-mentioned bond, and any phosphorus compound can be used. Examples of phosphorus compounds include phosphoric acid compounds and their derivatives. Specific examples include: phosphoric acid, polyphosphoric acid, phosphorous acid, and phosphonic acid. Examples of the above-mentioned polyphosphoric acid include: polyphosphoric acid formed by condensation of pyrophosphoric acid, triphosphoric acid, or 4 or more phosphoric acids. In addition, derivatives of phosphoric acid compounds include: phosphates, esters (such as trimethyl phosphate), halides, and dehydrates (such as phosphorus pentoxide).
此磷化合物可作為溶液來使用,例如可作為以水為溶劑之水溶液,或是作為如低級醇溶液之含有親水性的有機溶劑之溶液來使用。 This phosphorus compound can be used as a solution, for example, as an aqueous solution with water as a solvent, or as a solution containing a hydrophilic organic solvent such as a lower alcohol solution.
塗覆劑可藉由混合多價金屬化合物的溶液或分散液以及磷化合物的溶液而得到。於上述塗覆劑中可添加有其他成分。其他成分的例子可列舉出:高分子化合物、金屬錯合物、黏度化合物、交聯劑、塑化劑、抗氧化劑、紫外線吸收劑、阻燃劑等。高分子化合物的例子可列舉出:聚乙烯醇、聚乙酸乙烯酯的部分皂化物、聚(甲基)丙烯酸羥乙酯、多醣類(例如澱粉)、丙烯酸系聚合物(例如聚丙烯酸、聚甲基丙烯酸、丙烯酸-甲基丙烯酸共聚物)以及此等之鹽、乙烯-乙烯醇共聚物、乙烯-順丁烯二酸酐共聚物、苯乙烯-順丁烯二酸酐共聚物、異丁 烯-順丁烯二酸酐交替共聚物、乙烯-丙烯酸共聚物、乙烯-丙烯酸乙酯共聚物的皂化物等。 The coating agent can be obtained by mixing a solution or dispersion of a polyvalent metal compound and a solution of a phosphorus compound. Other components may be added to the above coating agent. Examples of other components include: polymer compounds, metal complexes, viscosity compounds, crosslinking agents, plasticizers, antioxidants, ultraviolet absorbers, flame retardants, etc. Examples of polymer compounds include: polyvinyl alcohol, partially saponified products of polyvinyl acetate, poly(hydroxyethyl meth)acrylate, polysaccharides (such as starch), acrylic polymers (such as polyacrylic acid, polymethacrylic acid, acrylic acid-methacrylic acid copolymers) and salts thereof, ethylene-vinyl alcohol copolymers, ethylene-maleic anhydride copolymers, styrene-maleic anhydride copolymers, isobutylene-maleic anhydride alternating copolymers, ethylene-acrylic acid copolymers, saponified products of ethylene-ethyl acrylate copolymers, etc.
例如對塗佈上述塗覆劑並將溶劑乾燥去除所得到之塗佈膜進行加熱處理,藉此使多價金屬化合物與磷化合物反應而形成上述鍵,而可形成含有磷及多價金屬元素之複合結構體。加熱處理所採用之溫度較佳為110℃以上,尤佳為120℃以上,更佳為140℃以上,特佳為170℃以上。於加熱處理所採用之溫度較低之情形下,為了形成充分的鍵結而需花費更多時間,有時使生產力降低。加熱處理所採用之溫度的上限會因基材膜種類而有不同,例如為240℃或220℃。此外,加熱處理所需之時間例如為0.1秒以上、1秒以上或5秒以上。此外,加熱處理所需之時間例如為1小時以下、15分鐘以下或5分鐘以下。如此的加熱處理可在大氣環境下、氮氣環境下或氬氣環境下的任一環境下進行。 For example, the coating film obtained by applying the coating agent and drying and removing the solvent is subjected to heat treatment, so that the polyvalent metal compound and the phosphorus compound react to form the above-mentioned bond, and a composite structure containing phosphorus and polyvalent metal elements can be formed. The temperature used for the heat treatment is preferably above 110°C, more preferably above 120°C, more preferably above 140°C, and particularly preferably above 170°C. In the case where the temperature used for the heat treatment is lower, it takes more time to form a sufficient bond, which sometimes reduces productivity. The upper limit of the temperature used for the heat treatment varies depending on the type of substrate film, for example, 240°C or 220°C. In addition, the time required for the heat treatment is, for example, more than 0.1 seconds, more than 1 second, or more than 5 seconds. In addition, the time required for the heat treatment is, for example, less than 1 hour, less than 15 minutes, or less than 5 minutes. Such heat treatment can be performed in any environment of atmospheric environment, nitrogen environment, or argon environment.
包含含有磷及多價金屬元素之複合結構體作為主成分之氧阻隔層之單層的平均厚度的下限,例如為0.05μm以上或0.1μm以上。包含含有磷及多價金屬元素之複合結構體作為主成分之氧阻隔層之單層的平均厚度,例如為4μm以下或2μm以下。本說明書中所使用之用語「包含含有磷及多價金屬元素之複合結構體作為主成分之氧阻隔層之單層的平均厚度」,意指多層結構體所含有之上述含有複合結構體作為主成分之氧阻隔層全體之厚度的合計除以該氧阻隔層的層數後之值。於上述氧阻隔層之單層的平均厚度小於上述下限時,難以形成均一厚度的層,有時使所得到之多層結構體的耐久性降低。於上述氧阻隔層之單層的平均厚度高於上述上限時,所得到之多層結構體的柔軟性、拉伸性、熱性形成等有時會降低。 The lower limit of the average thickness of a single layer of an oxygen barrier layer including a composite structure containing phosphorus and a polyvalent metal element as a main component is, for example, 0.05 μm or more or 0.1 μm or more. The lower limit of the average thickness of a single layer of an oxygen barrier layer including a composite structure containing phosphorus and a polyvalent metal element as a main component is, for example, 4 μm or less or 2 μm or less. The term "average thickness of a single layer of an oxygen barrier layer including a composite structure containing phosphorus and a polyvalent metal element as a main component" used in this specification means the value obtained by dividing the total thickness of all oxygen barrier layers containing the composite structure as a main component contained in the multilayer structure by the number of layers of the oxygen barrier layer. When the average thickness of the single layer of the oxygen barrier layer is less than the above lower limit, it is difficult to form a layer of uniform thickness, which may reduce the durability of the obtained multilayer structure. When the average thickness of the single layer of the oxygen barrier layer is higher than the above upper limit, the flexibility, stretchability, thermal properties, etc. of the obtained multilayer structure may be reduced.
(加工澱粉) (Processed starch)
成為加工澱粉的原料之澱粉並無特別限定,例如可列舉出來自小麥、玉米、木薯、馬鈴薯、米、燕麥、葛粉及豌豆原料者。澱粉較佳為高直鏈澱粉,尤佳為高直鏈玉米澱粉及高直鏈木薯澱粉。 The starch used as the raw material for processing starch is not particularly limited, and examples thereof include starch from wheat, corn, cassava, potato, rice, oats, arrowroot starch and peas. The starch is preferably high-amylose starch, and particularly preferably high-amylose corn starch and high-amylose cassava starch.
加工澱粉較佳係以藉由醚、酯或此等之組合的官能基使羥基被取代之方式化學地改質上述澱粉者。加工澱粉較佳是以含有碳數2至6的羥烷基之方式改質上述澱粉者,或是藉由與羧酸酐進行反應來改質上述澱粉者。於加工澱粉為以含有碳數2至6的羥烷基之方式改質上述澱粉者之情形下,較佳係具有碳數2至4的官能基作為上述加工澱粉的取代基,例如,較佳係具有可生成羥醚取代基之羥乙基或羥丁基,此外,於加工澱粉為藉由與羧酸酐進行反應來改質上述澱粉者之情形下,官能基較佳為丁酸酯或更低級的同系物,更佳為乙酸酯。為了製造酯衍生物,亦可使用順丁烯二酸、鄰苯二甲酸或辛烯基琥珀酸酐等之二羧酸酐。 The processed starch is preferably a starch chemically modified in which the hydroxyl group is substituted by a functional group of ether, ester or a combination thereof. The processed starch is preferably a starch modified in which a hydroxyl group having 2 to 6 carbon atoms is contained, or the processed starch is modified by reacting with a carboxylic anhydride. In the case where the processed starch is a starch modified in which a hydroxyl group having 2 to 6 carbon atoms is contained, it is preferred that the processed starch has a functional group having 2 to 4 carbon atoms as a substituent, for example, it is preferred that the processed starch has a hydroxyethyl group or a hydroxybutyl group which can generate a hydroxyether substituent. Furthermore, in the case where the processed starch is a starch modified by reacting with a carboxylic anhydride, the functional group is preferably a butyrate or a lower homologue, and more preferably an acetate. To make ester derivatives, dicarboxylic anhydrides such as maleic acid, phthalic acid or octenylsuccinic anhydride can also be used.
加工澱粉較佳為含有羥丙基之羥丙基化直鏈澱粉,尤佳為羥丙基化高直鏈澱粉。 The processed starch is preferably a hydroxypropylated straight chain starch containing hydroxypropyl groups, and is particularly preferably a hydroxypropylated high straight chain starch.
加工澱粉的取代度是以每單位無水葡萄糖之取代基的平均數來表示,通常最大值為3,上述加工澱粉的取代度較佳為0.05以上且未達1.5。 The degree of substitution of processed starch is expressed as the average number of substituents per unit of anhydrous glucose, and the maximum value is usually 3. The degree of substitution of the above-mentioned processed starch is preferably above 0.05 and below 1.5.
加工澱粉亦可含有其他澱粉。其他澱粉例如可列舉出高直鏈澱粉與低直鏈澱粉之混合物。 Processed starch may also contain other starches. Other starches include, for example, a mixture of high-amyl starch and low-amyl starch.
加工澱粉亦可含有水。水相對於加工澱粉可發揮作為塑化劑的功能。水的含有率例如為20質量%以下或12質量%以下。以加工澱粉為主成分之氧阻隔層的水分含有率,一般為使用環境下的相對濕度中之平衡水分含有率。 Processed starch may also contain water. Water can function as a plasticizer relative to processed starch. The water content is, for example, less than 20% by mass or less than 12% by mass. The moisture content of the oxygen barrier layer with processed starch as the main component is generally the equilibrium moisture content in the relative humidity under the use environment.
加工澱粉亦可含有1種或複數種水溶性聚合物。水溶性聚合物並無特別限定,例如可列舉出聚乙酸乙烯酯、聚乙烯醇或此等之組合。特佳為聚乙烯醇。1種或複數種水溶性聚合物的含有率例如為20質量%以下或12質量%以下。此外,1種或複數種水溶性聚合物的含有率例如為1質量%以上或4質量%以上。 Processed starch may also contain one or more water-soluble polymers. The water-soluble polymer is not particularly limited, and examples thereof include polyvinyl acetate, polyvinyl alcohol, or a combination thereof. Polyvinyl alcohol is particularly preferred. The content of one or more water-soluble polymers is, for example, 20% by mass or less or 12% by mass or less. In addition, the content of one or more water-soluble polymers is, for example, 1% by mass or more or 4% by mass or more.
加工澱粉亦可含有1種或複數種塑化劑。塑化劑並無特別限定,較佳為多元醇。多元醇的例子可列舉出山梨醇、甘油、麥芽糖醇、木醣醇以及此等之組合。加工澱粉中之1種或複數種塑化劑的含有率例如為20質量%以下或12質量%以下。 Processed starch may also contain one or more plasticizers. The plasticizer is not particularly limited, but preferably a polyol. Examples of polyols include sorbitol, glycerol, maltitol, xylitol, and combinations thereof. The content of one or more plasticizers in the processed starch is, for example, less than 20% by mass or less than 12% by mass.
加工澱粉亦可含有潤滑劑。潤滑劑的例子可列舉出碳數12至22的脂肪酸、碳數12至22的脂肪酸鹽以及此等之組合。加工澱粉中之潤滑劑的含量例如為5質量%以下。 Processed starch may also contain lubricants. Examples of lubricants include fatty acids with carbon numbers of 12 to 22, fatty acid salts with carbon numbers of 12 to 22, and combinations thereof. The content of lubricants in processed starch is, for example, 5% by mass or less.
含有加工澱粉作為主成分之氧阻隔層之單層的平均厚度例如為10μm以上或100μm以上。含有加工澱粉作為主成分之氧阻隔層之單層的平均厚度例如為1000μm以下或800μm以下。本說明書中所使用之用語「含有加工澱粉作為主成分之氧阻隔層之單層的平均厚度」,意指多層結構體所含有之上述含有加工澱粉作為主成分之氧阻隔層全體之厚度的合計除以該氧阻隔層的層數後之值。於上述氧阻隔層之單層的平均厚度小於上述下限時,難以形成均一厚度的層,有時使所得到之多層結構體的耐久性降低。於上述氧阻隔層之單層的平均厚度高於上述上限時,所得到之多層結構體的柔軟性、拉伸性、熱性形成等有時會降低。 The average thickness of a single layer of the oxygen barrier layer containing processed starch as a main component is, for example, greater than 10 μm or greater than 100 μm. The average thickness of a single layer of the oxygen barrier layer containing processed starch as a main component is, for example, less than 1000 μm or less than 800 μm. The term "average thickness of a single layer of the oxygen barrier layer containing processed starch as a main component" used in this specification means the value obtained by dividing the total thickness of all the oxygen barrier layers containing processed starch as a main component contained in the multilayer structure by the number of layers of the oxygen barrier layer. When the average thickness of a single layer of the oxygen barrier layer is less than the above lower limit, it is difficult to form a layer of uniform thickness, and the durability of the obtained multilayer structure is sometimes reduced. When the average thickness of the single layer of the oxygen barrier layer is higher than the upper limit, the flexibility, stretchability, thermal conductivity, etc. of the obtained multi-layer structure may be reduced.
(無機層狀化合物) (Inorganic layered compounds)
含有無機層狀化合物之阻隔層係例如在無機層狀化合物分散於熱塑性樹脂中時,顯現出起因於無機層狀化合物之阻隔性之層。含有無機層狀化合物之阻隔層所使用之熱塑性樹脂並無特別限定,例如可列舉出聚醯胺、乙烯-乙烯醇共聚物等。 The barrier layer containing an inorganic layered compound is a layer that exhibits barrier properties due to the inorganic layered compound when the inorganic layered compound is dispersed in a thermoplastic resin. The thermoplastic resin used in the barrier layer containing an inorganic layered compound is not particularly limited, and examples thereof include polyamide, ethylene-vinyl alcohol copolymer, etc.
無機層狀化合物可列舉出:膨潤性雲母、黏土、蒙特石(Montmorillonite)、膨潤石(Smectite)、水滑石(Hydrotalcite)等之無機層狀化合物。此外,無機層狀化合物亦可為經有機處理之有機變性無機層狀化合物。 Inorganic layered compounds include: swelling mica, clay, montmorillonite, smectite, hydrotalcite, etc. In addition, inorganic layered compounds can also be organically modified inorganic layered compounds that have been organically treated.
無機層狀化合物例如由板狀結晶所構成,係具有圓形、非圓形、橢圓形、大致呈長圓形、大致呈繭圓形等之任意外觀。無機層狀化合物之可藉由電子顯微鏡所測定之板狀結晶之長邊的平均長度較佳係滿足既定範圍。 The inorganic layered compound is composed of plate-like crystals, for example, and has any appearance such as circular, non-circular, elliptical, roughly oblong, roughly spherical, etc. The average length of the long side of the plate-like crystals of the inorganic layered compound that can be measured by an electron microscope preferably satisfies a predetermined range.
無機層狀化合物之長邊的平均長度較佳為70nm以上,尤佳為80nm以上,更佳為90nm以上。無機層狀化合物係藉由拉伸時所產生之應力而在膜面內配向,惟於無機層狀化合物之長邊的平均長度未達70nm時,配向的程度不足,有時無法得到充分的氧穿透性能。另一方面,無機層狀化合物之長邊的平均長度可為2000nm以下。 The average length of the long side of the inorganic layered compound is preferably 70 nm or more, more preferably 80 nm or more, and even more preferably 90 nm or more. The inorganic layered compound is oriented within the film surface by the stress generated during stretching, but when the average length of the long side of the inorganic layered compound is less than 70 nm, the degree of orientation is insufficient, and sometimes sufficient oxygen permeability cannot be obtained. On the other hand, the average length of the long side of the inorganic layered compound can be less than 2000 nm.
此外,無機層狀化合物較佳係不含厚度超過2μm的粗大物質。於無機層狀化合物含有超過2μm的粗大物質之情形下,透明性或拉伸性有時會降低。 In addition, the inorganic layered compound preferably does not contain coarse matter with a thickness exceeding 2 μm. In the case where the inorganic layered compound contains coarse matter with a thickness exceeding 2 μm, transparency or stretchability may sometimes be reduced.
含有無機層狀化合物之阻隔層中之無機層狀化合物的含量以該阻隔層的質量為基準計,較佳為0.3至20質量%。 The content of the inorganic layered compound in the barrier layer containing the inorganic layered compound is preferably 0.3 to 20% by mass based on the mass of the barrier layer.
(無機蒸鍍層) (Inorganic vapor deposition layer)
無機蒸鍍層為例如將無機物蒸鍍於基材上所得到之阻隔層。可構成無機蒸鍍層之基材例如可列舉出:熱塑性樹脂、熱硬化性樹脂等之樹脂;布帛、紙類等之纖維集合體;木材;玻璃等。較佳為熱塑性樹脂及纖維集合體,尤佳為熱塑性樹脂。於基材由上述樹脂所構成之情形下,該型態較佳係具有膜或片等之層狀。 The inorganic vapor-deposited layer is a barrier layer obtained by, for example, vapor-depositing an inorganic substance onto a substrate. Examples of substrates that can constitute the inorganic vapor-deposited layer include: resins such as thermoplastic resins and thermosetting resins; fiber aggregates such as cloth and paper; wood; glass, etc. Preferred are thermoplastic resins and fiber aggregates, and particularly preferred are thermoplastic resins. When the substrate is composed of the above-mentioned resins, the form is preferably a layered form such as a film or a sheet.
基材所使用之熱塑性樹脂例如可列舉出:聚乙烯、聚丙烯等之聚烯烴系樹脂;聚對苯二甲酸乙二酯(PET)、聚-2,6-萘二甲酸乙二酯、聚對苯二甲酸丁二酯或此等之共聚物等之聚酯系樹脂;尼龍-6、尼龍-66、尼龍-12等之聚醯胺系樹脂;聚乙烯醇、乙烯-乙烯醇共聚物等之含羥基聚合物;聚苯乙烯;聚(甲基)丙烯酸酯;聚丙烯腈;聚乙酸乙烯酯;聚碳酸酯;聚丙烯酸酯;再生纖維素;聚醯亞胺;聚醚醯亞胺;聚碸;聚醚碸;聚醚醚酮;離子聚合物樹脂等。較佳係選自由聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、尼龍-6及尼龍-66所組成之群組的至少1種熱塑性樹脂。 Examples of the thermoplastic resin used for the substrate include: polyolefin resins such as polyethylene and polypropylene; polyester resins such as polyethylene terephthalate (PET), polyethylene-2,6-naphthalate, polybutylene terephthalate or copolymers thereof; polyamide resins such as nylon-6, nylon-66, nylon-12; hydroxyl-containing polymers such as polyvinyl alcohol and ethylene-vinyl alcohol copolymers; polystyrene; poly(meth)acrylate; polyacrylonitrile; polyvinyl acetate; polycarbonate; polyacrylate; regenerated cellulose; polyimide; polyetherimide; polysulfone; polyethersulfone; polyetheretherketone; ionomer resins, etc. Preferably, it is at least one thermoplastic resin selected from the group consisting of polyethylene, polypropylene, polyethylene terephthalate, nylon-6 and nylon-66.
於使用由熱塑性樹脂所構成之膜作為基材之情形下,基材可為拉伸膜或無拉伸膜中任一者。從所得到之多層結構體的加工適性(印刷、層合等)優異者來看,較佳為拉伸膜,尤佳為雙軸拉伸膜。雙軸拉伸膜可為藉由同步雙軸拉伸法、逐次雙軸拉伸法以及管狀拉伸法中任一種方法所製造之雙軸拉伸膜。 When a film made of a thermoplastic resin is used as a substrate, the substrate may be either a stretched film or a non-stretched film. From the perspective of the superior processing suitability (printing, lamination, etc.) of the obtained multi-layer structure, a stretched film is preferred, and a biaxially stretched film is particularly preferred. The biaxially stretched film may be a biaxially stretched film produced by any of the synchronous biaxial stretching method, the sequential biaxial stretching method, and the tubular stretching method.
可使用於基材之紙類例如可列舉出:牛皮紙、道林紙、模造紙、玻璃紙、羊皮紙、合成紙、白板紙、灰底白板紙、牛奶盒原紙、紙杯原紙、象牙紙等。 Examples of paper that can be used as a substrate include: kraft paper, woodfree paper, molded paper, glass paper, parchment paper, synthetic paper, whiteboard paper, gray-backed whiteboard paper, milk carton paper, paper cup paper, ivory paper, etc.
於基材的型態為層狀之情形下,從所得到之多層結構體的機械強度及加工性良好者來看,該厚度較佳為1μm至1,000μm,尤佳為5μm至500μm,更佳為9μm至200μm。 When the substrate is in a layered form, the thickness is preferably 1 μm to 1,000 μm, more preferably 5 μm to 500 μm, and even more preferably 9 μm to 200 μm, in view of the mechanical strength and processability of the obtained multi-layer structure.
無機物例如可列舉出:鋁、錫、銦、鎳、鈦、鉻等之金屬;氧化矽、氧化鋁等之金屬氧化物;氮化矽等之金屬氮化物;氮氧化矽等之金屬氮氧化物;碳氮化矽等之金屬碳氮化物等。從相對於氧或水蒸氣之阻隔性優異者來看,較佳是由鋁、氧化鋁、氧化矽、氧化鎂及氮化矽等中任一種或是此等之組合所形成之無機蒸鍍層。 Examples of inorganic substances include: metals such as aluminum, tin, indium, nickel, titanium, and chromium; metal oxides such as silicon oxide and aluminum oxide; metal nitrides such as silicon nitride; metal nitride oxides such as silicon oxynitride; and metal carbonitrides such as silicon carbonitride. In terms of excellent barrier properties to oxygen or water vapor, an inorganic vapor-deposited layer formed of any one of aluminum, aluminum oxide, silicon oxide, magnesium oxide, and silicon nitride, or a combination of these, is preferred.
無機蒸鍍層的形成方法並無特別限定,例如可列舉出:真空蒸鍍法(例如電阻加熱蒸鍍法、電子束蒸鍍法、分子束磊晶法等)、離子電鍍法、濺鍍法(雙磁控濺鍍法等)等之物理氣相成長法;熱化學氣相成長法(例如觸媒化學氣相成長法)、光化學氣相成長法、電漿化學氣相成長法(例如電容耦合電漿法、感應耦合電漿法、表面波電漿法、電子磁旋共振電漿法等)、原子層沉積法、有機金屬氣相成長法等之化學氣相成長法。 The method for forming the inorganic deposition layer is not particularly limited. For example, physical vapor growth methods such as vacuum deposition (such as resistive heating deposition, electron beam deposition, molecular beam epitaxy, etc.), ion plating, sputtering (double magnetron sputtering, etc.) and the like; chemical vapor growth methods such as thermochemical vapor growth (such as catalytic chemical vapor growth), photochemical vapor growth, plasma chemical vapor growth (such as capacitive coupled plasma, inductively coupled plasma, surface wave plasma, electron gyrotron resonance plasma, etc.), atomic layer deposition, and organic metal vapor growth.
無機蒸鍍層的厚度因構成無機蒸鍍層之成分種類的不同而不同,較佳為0.002μm至0.5μm,尤佳為0.005μm至0.2μm,更佳為0.01μm至0.1μm。於此範圍內,可選擇多層結構體的阻隔性及機械物性變得良好之厚度。無機蒸鍍層的厚度未達0.002μm時,無機蒸鍍層相對於氧及水蒸氣之阻隔性顯現的重現性有降低之傾向,並且會有無機蒸鍍層未顯現出充分的阻隔性之情形。此外,無機蒸鍍層的厚度超過0.5μm時,在拉伸或彎折多層結構體之情形下,無機蒸鍍層的阻隔性有容易降低之傾向。 The thickness of the inorganic vapor-deposited layer varies depending on the type of components that constitute the inorganic vapor-deposited layer, and is preferably 0.002μm to 0.5μm, more preferably 0.005μm to 0.2μm, and even more preferably 0.01μm to 0.1μm. Within this range, a thickness that provides good barrier properties and mechanical properties of the multi-layer structure can be selected. When the thickness of the inorganic vapor-deposited layer is less than 0.002μm, the reproducibility of the barrier properties of the inorganic vapor-deposited layer relative to oxygen and water vapor tends to decrease, and there may be a situation where the inorganic vapor-deposited layer does not exhibit sufficient barrier properties. In addition, when the thickness of the inorganic vapor-deposited layer exceeds 0.5μm, the barrier properties of the inorganic vapor-deposited layer tend to be reduced when the multi-layer structure is stretched or bent.
(金屬箔) (Metal foil)
金屬箔是由延展性優異之金屬所構成之單層或複數層的結構體。金屬箔所含有之金屬例如可列舉出鋁。該金屬箔例如具有鋁箔或鋁帶之型態。 Metal foil is a single-layer or multi-layer structure composed of a metal with excellent ductility. Examples of metals contained in metal foil include aluminum. The metal foil has the form of aluminum foil or aluminum strip, for example.
根據上述具有氧阻隔層之包裝容器,可防止氧的侵入並且涵蓋更長期間來保持所容納之殺菌後的內容物的品質。 According to the packaging container with the oxygen barrier layer, the intrusion of oxygen can be prevented and the quality of the sterilized contents can be maintained for a longer period of time.
本發明之包裝容器並不限定於上述實施型態,在不脫離本發明的主旨之範圍內當然可加入各種變更。例如可將其他實施型態的構成追加於某實施型態的構成,此外,亦可將某實施型態之構成的一部分取代為其他實施型態的構成。再者,亦可刪除某實施型態之構成的一部分。 The packaging container of the present invention is not limited to the above-mentioned embodiments, and various changes can be made without departing from the scope of the present invention. For example, the structure of other embodiments can be added to the structure of a certain embodiment, and part of the structure of a certain embodiment can be replaced by the structure of other embodiments. Furthermore, part of the structure of a certain embodiment can also be deleted.
上述實施型態的凸緣最上部33A、33B皆為高度(上下方向上的尺寸)較俯視觀看時的外徑更小之凸部,惟並不限定於此。如圖10及圖11所示,亦可考量於凸緣部3設置有高度與俯視觀看時的外徑為大致相等之第三凸緣最上部33C。第三凸緣最上部33C於俯視觀看時為圓形狀。
The flange
上述實施型態的貫通孔38係藉由將穿孔針穿刺於凸緣部3的貫通區域36(亦即使貫通區域36破裂)來形成,惟並不限定於此。例如可考量貫通孔38藉由衝切凸緣部3的貫通區域36而形成。
The through
如圖12A及圖12B所示,於貫通孔形成工序中藉由衝切凸緣部3的貫通區域36來形成貫通孔38時,貫通區域36係從凸緣部3中被去除。於此構成中,從進行貫通孔形成工序後至進行二次密封區域32的密封為止之間,氣體往貫通孔38之流通不會藉由貫通區域36所妨礙,因此加熱蒸氣S可於貫通孔38中平順地流通。
As shown in FIG. 12A and FIG. 12B, when the through
於上述實施型態之包裝容器1中,凸緣最上部33位於貫通區域36的內側,一次密封區域31位於貫通區域36的外側,亦即凸緣最上部33與一次密封區域31開離,惟凸緣最上部33亦可兼用作為一次密封區域31。由於一次密封區域31必須位於較貫通區域36更外側,所以在此構成中複數個凸緣最
上部33的至少一個係位於貫通區域36的外側。例如可考量凸緣最上部33具有第四凸緣最上部33D,該第四凸緣最上部33D係位於貫通區域36的外側且兼用作為一次密封區域31。
In the
凸緣最上部33亦可為凸條的第四凸緣最上部33D。此外,於凸緣最上部33中,上表面(凸緣最上部上表面330)亦可如第四凸緣最上部33D的上表面般為平坦面(參考圖12B)。於凸緣最上部33為凸條之情形下,例如可在開口緣21的周方向上連續地設置。具體而言,可考量凸緣最上部33為在開口緣21的周方向上連續地設置在全周之凸條。
The flange
於上述實施型態之包裝容器1中,二次密封區域32係設置在凸緣部3的全區域,惟亦可設置在凸緣部3的一部分。於上述凸緣最上部33兼用作為一次密封區域31之構成中(參考圖12A及圖12B),如表示出進行二次密封工序後之狀態之圖13A及圖13B所示,可考量於凸緣下部34中位於較一次密封區域31更內側之區域係兼用作為二次密封區域32。
In the
再者,於上述實施型態之包裝容器1中,於二次密封工序中係進行面密封,惟亦可在開口緣21的周方向上藉由全周地連續之線密封來進行。例如,如圖14A及圖14B所示,可進行線密封。在此情形下,可考量二次密封區域32為往上方突出之凸條。
Furthermore, in the
此外,在此情形下,二次密封區域32的上表面係位於較凸緣最上部上表面330(兼用作為一次密封區域31之第四凸緣最上部33D的上表面)更下方。再者,於蓋構件5與一次密封區域31被密封時,凸緣部3係以於二次密封區域32的上表面與蓋構件5的下表面之間形成有間隙C之方式來構成。藉此,從進行一次密封工序後至進行二次密封工序為止之間,亦即對食品F進行殺菌
時,於被凸緣最上部上表面330支撐之蓋構件5與凸緣下部上表面340之間產生間隙C,第1凸緣上表面230保持此間隙C而確實地維持間隙C不被封閉之狀態,藉此使加熱蒸氣S經由流通路徑R流通於容納部2內。
In addition, in this case, the upper surface of the
於上述實施型態中,於凸緣部3設置有如凸緣最上部33般的凸部,惟亦可設置有往下方凹入之凹部,或是如圖15A及圖15B所示,於凸緣部3設置有槽部39作為凸緣下部34。例如可考量槽部39沿著開口緣21在周方向上呈連續。具體而言,槽部39在開口緣21的周方向上於全周呈連續。
In the above-mentioned embodiment, a convex portion such as the
於如此地在凸緣部3設置有凹部之構成中,可在此凹部設置有貫通區域36。例如可考量於凸緣部3的槽部39設置有貫通區域36。具體而言,可考量在開口緣21的周方向上於全周呈連續之槽部39中,於隔著容納部2而相對向之一對的邊上分別設置有貫通區域36。在此情形下,設置在各邊之貫通區域36例如配置在隔著容納部2之相對向位置上。於此構成中,於進行貫通孔形成工序時,係於凸緣部3的槽部39設置有貫通孔38。
In the structure in which the recess is provided in the
此外,在此情形下,可考量一次密封區域31在開口緣21的周方向上連續地設置在凸緣部3之槽部39的外側(凸緣最上部33)。具體而言,可考量一次密封區域31在開口緣21的周方向上於全周呈連續。
In addition, in this case, it can be considered that the
於上述在凸緣部3的槽部39設置有貫通區域36之構成中(參考圖15A及圖15B),如圖16A及圖16B所示,可考量二次密封區域32沿著開口緣21在周方向上連續地設置在凸緣部3之槽部39的內側。具體而言,可考量二次密封區域32在開口緣21的周方向上於全周呈連續。於上述構成之凸緣部3中,於一次密封區域31的內側配置設置有貫通區域36之槽部39,然後於槽部39的內側配置有二次密封區域32。
In the above-mentioned structure in which the through
此外,貫通區域36亦可僅設置在凸緣部3的複數個角之一部分的角。例如,如圖17A所示,貫通區域36亦可在凸緣部3的角中之隔著容納部2之位置上僅設置一對。在此情形下,如圖17B所示,貫通孔38僅設置在凸緣部3的角中之隔著容納部2之位置的一對角上。
In addition, the through
再者,凸緣最上部33亦可為半球形狀般之小丘形狀的凸部之第五凸緣最上部33E。凸緣最上部33亦可為圓錐狀、圓錐梯狀、圓柱狀、多角柱狀、多角錘狀等其他形狀。
Furthermore, the
上述實施型態之容納部2的底板22係大致呈矩形板狀,惟亦可考量大致呈正方形板狀。底板22除了四角形板狀之外,亦可為其他多角形板狀或圓板狀等。
The
於上述實施型態之包裝容器1中,係於凸緣部3設置有貫通區域36並藉由進行貫通孔形成工序而於凸緣部3設置有貫通孔38,惟亦可不於凸緣部3設置貫通區域36。此構成可考量圖18至圖21的構成等。
In the
例如,如圖18A及圖18B所示,可考量凸緣部3具有與蓋構件5在一次密封工序中被密封之一次密封區域31,並且構成為:於蓋構件5與一次密封區域31被密封時,在其與蓋構件5之間形成有可供氣體於外部與容納部2內之間流通之流通路徑R。於此構成中,凸緣最上部33為在凸緣部3的四個角部上隔著間隔之狀態下,在開口緣21的周方向延伸為長條狀之凸條。此外,凸緣最上部33兼用作為一次密封區域31。再者,亦如圖19A及圖19B所示,於凸緣下部34中在開口緣21的周方向於全周連續地設置之部位,係兼用作為二次密封區域32。
For example, as shown in FIG. 18A and FIG. 18B , it is considered that the
在此情形下,一次密封區域31的上表面(例如凸緣最上部上表面330)於凸緣上表面30中位於最上方,二次密封區域32的上表面(例如於凸緣下部上表面340中在開口緣21的周方向於全周連續地設置之部位)位於較一次密封區域31的上表面(例如凸緣最上部上表面330)更下方。此外,凸緣部3係構成為於蓋構件5與一次密封區域31被密封時,於二次密封區域32的上表面(例如凸緣下部上表面340)與蓋構件5的下表面之間形成有間隙C,並且構成為間隙C成為流通路徑R的一部分。
In this case, the upper surface of the primary sealing area 31 (e.g., the
於上述實施型態之包裝容器1中,係藉由線密封來進行一次密封工序,惟亦可藉由密封至少一點之點密封來進行。例如,如圖20A及圖20B所示,可考量於凸緣部3設置有複數個凸部作為第六凸緣最上部33F,且第六凸緣最上部33F兼用作為一次密封區域31。凸緣最上部33F的形狀例如為圓台狀。此外,可考量凸緣最上部33F被設置在凸緣部3的四個角部以及凸緣部3之各邊的中央。如此,於複數個一次密封區域31在開口緣21的周方向上隔著間隙而設置之情形下,於進行一次密封工序後,加熱蒸氣S經由此周方向上之一次密封區域31彼此的間隙而流通於容納部2內,所以可使充分量的加熱蒸氣S流通於容納部2內。
In the
例如,如圖21A及圖21B所示,於凸緣部3可設置複數個凹部作為凸緣下部34。凸緣下部34係在開口緣21的周方向上隔著間隙而配置,可考量例如位於凸緣部3的四個角部。在此情形下,凸緣最上部33係位於凸緣部3的各邊。於此構成中,凸緣最上部33係兼用作為一次密封區域31。此外,於此構成中,在進行一次密封工序後,於蓋構件5的下表面與凸緣下部上表面340之
間產生間隙C,此間隙C位於凸緣部3的四個角部,所以加熱蒸氣S從凸緣部3的四個角部流通於容納部2內。
For example, as shown in FIG. 21A and FIG. 21B, a plurality of recesses may be provided on the
於上述實施型態之包裝容器1中,形成於凸緣部3之各貫通孔38的形狀或大小為相同,惟亦可為相異。例如,如圖22A及圖22B所示,可考量於凸緣部3的四個角部中之相鄰接之一對角部設置貫通孔38A,並於凸緣部3的四個角部中之前述相鄰接之一對角部以外的一對角部上,設置與貫通孔38A為不同大小之貫通孔38B。貫通孔38A的直徑大於貫通孔38B的直徑。
In the
此外,凸緣最上部33於俯視觀看時可為U字狀或圓弧狀的凸條。例如可考量位於貫通孔38A的外側之第七凸緣最上部33G為U字狀的凸條。第七凸緣最上部33G係沿著貫通孔38A的外周中之位於外側的部位而設置。於貫通孔38A的內側,沿著開口緣21設置有複數個(例如三個)第五凸緣最上部33E。於此包裝容器1中,一次密封區域31為凸緣部3的外周緣。
In addition, the
如此,於一次密封區域31的內側,由於在貫通孔38A之外側及內側兩者的位置上設置有凸緣最上部33,所以凸緣最上部上表面330在貫通孔38A之外側及內側支撐蓋構件5,故保持於貫通孔38A與蓋構件5之間產生間隙C之狀態,因此可防止貫通孔38A被封閉。
In this way, on the inner side of the
於上述實施型態中,於凸緣部3設置有槽部39作為凹部,惟亦可設置有點狀的凹部39。例如可考量凹部39被設置在凸緣部3的四個角部。此外,於凹部39的底部亦可設置有貫通孔38B。
In the above-mentioned embodiment, a
再者,於進行二次密封工序後,可去除凸緣部3中之包含貫通孔38之一部分。例如於上述在凸緣部3的四個角部設置有貫通孔38之構成中(參考圖22A及圖22B),如圖23A及圖23B所示,可考量於凸緣最上部33E與貫通
孔38之間設置二次密封區域32,於進行二次密封工序後,以貫通孔38與二次密封區域32之間的切斷線L來切斷凸緣部3。在貫通孔38位於一次密封區域31與二次密封區域32之間之構成中,於凸緣部3中水滴容易滯留於貫通孔38的周圍,惟藉由去除凸緣部3中之包含貫通孔38之一部分,可防止水滴對包裝容器1造成影響。
Furthermore, after the secondary sealing process is performed, a portion of the
於圖23中,切斷線L係以切除凸緣部3的四個角部來設置,惟亦能夠以在貫通孔38與二次密封區域32之間延伸,且在開口緣21的周方向於全周連續地切除之方式來設置。亦即,切斷線L亦能夠以切除包含凸緣部3的貫通孔38之外周部之方式來設置。
In FIG. 23 , the cut line L is set by cutting off the four corners of the
上述實施型態之貫通區域36於俯視觀看時為圓形狀,亦可為橢圓形狀等之長條狀等,在此情形下,可考量貫通孔38為狹縫狀等。此外,上述實施型態之貫通孔38係藉由在設置了十字狀的槽部360之貫通區域36上形成裂縫380或是衝切貫通區域而形成,惟亦可藉由其他方法來形成。
The through
此外,如圖24A及圖24B所示,可考量於凸緣部3形成俯視觀看時為U字狀的裂縫380而藉此形成各貫通孔38。於此構成中,凸緣部3係具有第八凸緣最上部33H,該第八凸緣最上部33H係以裂縫380為交界使凸緣部3的一部分(例如貫通區域36)朝向上方變形而形成,且上表面位於該凸緣部3的上表面30中的最上方。此外,藉由第八凸緣最上部33H而在蓋構件5與凸緣部3之間形成有流通路徑R。具體而言,於貫通區域36形成U字狀的裂縫380,並以連結裂縫380的基端部彼此之直線381為交界,使U字狀的裂縫380的內側部分較凸緣部3的其他區域更往上方彎折而形成有貫通孔38,並且形成有第八凸緣最上部33H。此外,於貫通孔38的附近可設置有第二凸緣最上部33B。
In addition, as shown in FIG. 24A and FIG. 24B , it is conceivable to form a
此外,如圖25A及圖25B所示,可考量於凸緣部3上形成一條線狀的裂縫380而藉此形成各貫通孔38。於此構成中,貫通區域36係以從裂縫380的兩端延伸之一對直線381為交界,往較凸緣部3之貫通區域36以外的區域更上方被抬起而形成有貫通孔38,並且形成有第八凸緣最上部33H。
In addition, as shown in FIG. 25A and FIG. 25B, it is conceivable to form a
如此,於藉由貫通區域36往較凸緣部3之貫通區域36以外的區域更上方變形而形成貫通孔38之構成中,加熱蒸氣S從凸緣部3的下方流通於容納部2時,容易藉由加熱蒸氣S保持在貫通區域36被抬起之狀態,所以容易維持開放貫通孔38之狀態。
In this way, in the structure in which the through
此外,如圖26A及圖26B所示,於藉由使貫通區域36位於較凸緣部3之貫通區域36以外的區域更上方而形成貫通孔38,並且形成第八凸緣最上部33H之構成中,可於貫通孔38的附近設置第三凸緣最上部33C。
In addition, as shown in FIG. 26A and FIG. 26B, in the structure in which the through
再者,如圖27A及圖27B所示,在使貫通區域36往上方變形時,較佳係使用輔助具於凸緣部3與貫通區域36之交界382從上部形成凹陷,並以該凹陷為起點使貫通區域36往上方變形。在此情形下,凸緣部3的交界382變得容易彎折,容易保持貫通區域36被抬起之狀態。
Furthermore, as shown in FIG. 27A and FIG. 27B, when deforming the through
根據該構成,藉由使凸緣部3的一部分以裂縫380為交界來變形而形成第八凸緣最上部33H,並藉由第八凸緣最上部33H形成流通路徑R,所以加熱蒸氣S可經由此流通路徑R流通於容納部2內。
According to this structure, the eighth flange
再者,如圖28A及圖28B所示,在以形成貫通孔38時會成為第八凸緣最上部33H之方式構成的情形,可於凸緣部3僅設置第八凸緣最上部33H作為凸緣最上部33。根據該構成,於凸緣部3中除了第八凸緣最上部33H之外,
即使未另外形成凸緣最上部33,亦僅需於凸緣部3形成裂縫380而形成貫通孔38,即可形成加熱蒸氣S流通之流通路徑R。
Furthermore, as shown in FIG. 28A and FIG. 28B, in the case where the eighth flange
於形成貫通孔38時貫通區域36會成為第八凸緣最上部33H之構成中,例如可藉由下列工序來形成貫通孔38。首先如圖29A所示,進行用以將裂縫380形成於凸緣部3之定位,如圖29B所示,藉由剪斷用的輔助具來形成裂縫380。再者,如圖29C所示,於貫通區域36的交界382敲入形成凹陷之輔助具,如圖29D所示,藉由該衝擊使貫通區域36往上方變形而能夠形成貫通孔38。
When forming the through
如圖30A及圖30B所示,貫通區域36為朝向上方突出之凸部,凸部的上端可構成第八凸緣最上部33H。此外,貫通區域36例如可考量具有朝向上方膨起之彎曲面。於此貫通區域36中,彎曲面的上端構成第八凸緣最上部33H。本實施型態之貫通區域36為碗狀。此貫通區域36之上表面的全區域為彎曲面。此外,貫通區域36的外周緣係具有圓弧狀的部位與直線狀的部位。於本實施型態之貫通區域36的外周緣上,圓弧狀的部位配置在較直線狀的部位更內側處。此外,於此構成中,藉由在貫通區域36之外周緣的一部分(例如圓弧狀的部位)形成裂縫380並將貫通區域36朝向上方變形,如圖30C所示,使貫通區域36成為朝向上方之凸狀的彎曲面。
As shown in FIG. 30A and FIG. 30B , the through-
於貫通區域36為朝向上方突出之凸部之情形下,凸部之上表面的全區域亦可為不彎曲之傾斜面,或是僅有凸部之上表面的一部分為彎曲面。例如,如圖31A及圖31B所示,貫通區域36亦可為上表面的上部朝向上方膨起之彎曲面的凸部,彎曲面的上端構成第八凸緣最上部33H。貫通區域36之上表面的下部為傾斜面。貫通區域36的外周緣為角呈圓緩之矩形狀。此外,於此構成中,藉由在貫通區域36之外周緣的一部分(例如於外周緣中排除位於外側之一邊的部
位,亦即於矩形狀的外周緣中之三邊及一對的角部)形成裂縫380並將貫通區域36朝向上方變形,如圖31C所示,使貫通區域36成為朝向上方膨起之彎曲面。
In the case where the through
如此,於朝向上方變形之凸緣部3的一部分(例如貫通區域36)為朝向上方膨起之彎曲面之構成中,於一次密封區域31與蓋構件5被密封時,藉由在凸緣部3形成裂縫380,朝向上方彎折之凸狀的彎曲面可在不會對蓋構件5造成損傷下穩定地支撐蓋構件5。
In this way, in the configuration in which a portion of the
於上述實施型態中,於圖24至圖31的包裝容器1中,貫通區域36係以裂縫380為交界位於較凸緣部3的其他區域更上方,惟亦可位於下方而形成有貫通孔38。在此情形下,凸緣部3中之貫通區域36以外的部位可構成凸緣最上部33。
In the above-mentioned embodiment, in the
於上述實施型態之包裝容器1中,係於凸緣部3的角部配置有貫通孔38,惟如圖32A所示,亦可於凸緣部3之角部以外的區域配置有貫通孔38。此外,上述實施型態之包裝容器1係具備一個容納部2,惟如圖32B至圖32C所示,亦可具備複數個容納部2。在此情形下,可考量貫通孔38配置在相鄰接之容納部2之間(包夾於容納部2之區域)。
In the
於上述實施型態之包裝容器1中,係於凸緣部3設置有貫通區域36,惟亦可在凸緣部3預先設置有貫通孔38來取代貫通區域36。在此情形下,包裝食品6的製造方法不含貫通孔形成工序,而成為包含食品容納工序、一次密封工序、殺菌工序及二次密封工序之方法。
In the
於上述實施型態之包裝食品的製造方法中,係依序進行食品容納工序、貫通孔形成工序、一次密封工序、殺菌工序及二次密封工序。惟亦可在進行貫通孔形成工序後進行食品容納工序。此外,包裝容器1亦可較佳地使用作為
在將貫通孔38設置在凸緣部3的貫通區域36並將食品F容納於容納部2後,將蓋構件5與凸緣部3的一次密封區域31密封,然後經由流通路徑R使加熱蒸氣S流通於容納部2內而對食品F進行殺菌後,將蓋構件5與凸緣部3的二次密封區域32密封之包裝食品6的包裝容器1。
In the method for manufacturing packaged food of the above-mentioned embodiment, the food containing process, the through hole forming process, the primary sealing process, the sterilization process and the secondary sealing process are sequentially performed. However, the food containing process can also be performed after the through hole forming process. In addition, the
上述實施型態之凸緣部3係設置在開口緣21之周方向的全周,惟亦可在此周方向以中斷之狀態(隔著間隔)來設置。
The
於上述實施型態之包裝容器1中,容納部2與凸緣部3是由單一構件所構成,惟亦可由不同構件所構成。例如可考量容器本體4以不同構件來形成容納部2及凸緣部3,並藉由接著劑來接著容納部2或凸緣部3,藉此使容納部2與凸緣部3連接而構成。
In the
此外,於本發明中,可容納各種內容物作為殺菌對象物。內容物例如為在保存或運輸時不希望接觸到細菌、塵埃等污染物或氧之物品,包含有食品、化妝品、醫藥品、醫藥外用品、醫療用機器、衛生用品、理化用品、生物相關用品等。當中較佳為食品,特佳是在高溫高壓下的蒸氣殺菌中可保持外觀及品質之食品(例如於容納時為固形之食品)。 In addition, in the present invention, various contents can be contained as sterilization objects. The contents are, for example, items that do not want to come into contact with pollutants such as bacteria, dust, or oxygen during storage or transportation, including food, cosmetics, pharmaceuticals, quasi-pharmaceuticals, medical equipment, sanitary products, physical and chemical products, and biological related products. Food is preferred, and food that can maintain its appearance and quality during steam sterilization at high temperature and high pressure is particularly preferred (for example, solid food when contained).
此外,本發明所使用之殺菌用氣體於上述實施形態中係使用加熱蒸氣,惟亦可因應內容物來使用臭氧氣體、氧化乙烯、甲醛、乙酸、氧化乙烯、二氧化氯等之其他具有殺菌作用的氣體。 In addition, the sterilizing gas used in the present invention is heated steam in the above-mentioned embodiment, but other sterilizing gases such as ozone gas, ethylene oxide, formaldehyde, acetic acid, ethylene oxide, chlorine dioxide, etc. can also be used according to the contents.
從以上內容來看,根據本發明,可提供一種在對內容物進行殺菌處理時可較佳地使用,並且涵蓋長期間可保持經殺菌後之內容物的品質之包裝容器。 From the above content, according to the present invention, a packaging container can be provided that can be preferably used when sterilizing the contents and can maintain the quality of the sterilized contents for a long period of time.
本發明之包裝容器係一種用以使容納於內部之內容物暴露於殺菌用氣體來進行殺菌,然後封裝該內容物後使其流通之殺菌處理用的包裝容器,係具備容器本體,該容器本體包含:於上方具有開口且容納內容物之容納部,以及從前述容納部的開口緣朝外延伸之凸緣部;前述凸緣部具有:與覆蓋前述開口之蓋構件在一次密封工序中被一次密封之一次密封區域,與前述蓋構件在一次密封後的二次密封工序中被二次密封之二次密封區域,其上表面係位於該凸緣部的上表面中之最上方之凸緣最上部,其上表面位於該凸緣最上部的上表面之下方之凸緣下部,以及位於較前述一次密封區域更內側處且設置有貫通前述凸緣部之貫通孔之至少1個貫通區域;且前述凸緣部構成為:於前述蓋構件與前述一次密封區域被密封後,在藉由前述凸緣最上部所支撐之前述蓋構件與前述凸緣下部之間,形成有可供氣體於外部與前述容納部內之間流通之流通路徑,於前述蓋構件與前述二次密封區域被密封後,前述流通路徑被封閉。 The packaging container of the present invention is a packaging container for sterilization treatment, which exposes the contents contained therein to a sterilizing gas for sterilization, and then seals the contents and allows them to circulate. The packaging container has a container body, which includes: a storage portion having an opening at the top and storing the contents, and a flange portion extending outward from the opening edge of the storage portion; the flange portion includes: a primary sealing area that is sealed with a cover member covering the opening in a primary sealing process, and a secondary sealing area that is secondary sealed with the cover member in a secondary sealing process after the primary sealing, and the upper surface of the flange portion is located at the bottom of the flange portion. The flange uppermost portion is the uppermost portion of the upper surface of the flange, the flange lower portion whose upper surface is located below the upper surface of the flange uppermost portion, and at least one through-hole located inside the primary sealing region and penetrating the flange portion; and the flange portion is configured such that after the cover member and the primary sealing region are sealed, a flow path for gas to flow between the outside and the inside of the accommodating portion is formed between the cover member supported by the flange uppermost portion and the flange lower portion, and after the cover member and the secondary sealing region are sealed, the flow path is closed.
該構成之包裝容器適合作為例如在將內容物容納於容納部並於凸緣部的貫通區域設置貫通孔後,或是於凸緣部的貫通區域設置貫通孔並將食品容納於容納部後,將蓋構件與凸緣部的一次密封區域密封,然後在經由流通路徑使殺菌用氣體流通於容納部內來對內容物進行殺菌後,將蓋構件與凸緣部的二次密封區域密封時所使用之容器。 The packaging container of this structure is suitable as a container used, for example, when the contents are contained in the storage part and a through hole is provided in the through area of the flange, or when a through hole is provided in the through area of the flange and food is contained in the storage part, the lid member is sealed with the primary sealing area of the flange, and then the contents are sterilized by passing a sterilizing gas through the flow path in the storage part, and then the lid member is sealed with the secondary sealing area of the flange.
於此包裝容器中,在較凸緣部的一次密封區域更內側處設置有貫通孔時,此貫通孔係構成流通路徑的一部分。此外,於一次密封區域與蓋構件被密封時,於凸緣部的凸緣下部與蓋構件之間產生間隙,此間隙係構成流通路徑的一部分。因此在對內容物進行殺菌時,殺菌用氣體從凸緣部的下方經由以貫通孔及間隙所構成之流通路徑流通於容納部內,藉此可對容納部內的內容物進行殺菌。 In this packaging container, when a through hole is provided inside the primary sealing area of the flange, the through hole constitutes a part of the flow path. In addition, when the primary sealing area and the lid member are sealed, a gap is generated between the lower part of the flange of the flange and the lid member, and the gap constitutes a part of the flow path. Therefore, when the contents are sterilized, the sterilizing gas flows from the bottom of the flange through the flow path formed by the through hole and the gap into the storage part, thereby sterilizing the contents in the storage part.
尤其於包裝容器中,由於凸緣最上部的上表面位於較凸緣下部的上表面更上方,所以在對內容物進行殺菌時,凸緣最上部支撐蓋構件,因此可在由凸緣最上部確實地維持構成流通路徑之間隙不會被封閉之狀態的狀態下,使殺菌用氣體流通於容納部內。 In particular, in a packaging container, since the upper surface of the uppermost portion of the flange is located above the upper surface of the lower portion of the flange, when the contents are sterilized, the uppermost portion of the flange supports the lid member, so that the sterilizing gas can flow into the container while the gap constituting the flow path is surely maintained by the uppermost portion of the flange and is not closed.
再者,於此包裝容器中,蓋構件位於流通路徑上方,亦即流通路徑未暴露於蓋構件上方,故即使在藉由殺菌用氣體進行殺菌後,落下的細菌亦不易經由流通路徑而混入於容器內。此外,由於是以藉由二次密封區域與蓋構件被密封而使流通路徑被封閉之方式構成,所以藉由與蓋構件之密封,該包裝容器可完全地封裝內容物。 Furthermore, in this packaging container, the cover member is located above the flow path, that is, the flow path is not exposed above the cover member, so even after sterilization by sterilizing gas, it is not easy for fallen bacteria to be mixed into the container through the flow path. In addition, since the flow path is sealed by the secondary sealing area and the cover member, the packaging container can completely seal the contents by sealing with the cover member.
此外,於前述包裝容器中,前述貫通孔亦可藉由在前述貫通區域的一部分上形成裂縫而形成。 In addition, in the aforementioned packaging container, the aforementioned through hole can also be formed by forming a crack on a portion of the aforementioned through area.
根據該構成,於貫通區域上形成貫通孔時不會使凸緣部的一部分破裂,而不會產生凸緣部的碎片。因此可防止凸緣部的碎片混入於容納部內。 According to this structure, when forming a through hole in the through area, a part of the flange portion will not be broken, and no fragments of the flange portion will be generated. Therefore, it is possible to prevent the fragments of the flange portion from mixing into the accommodating portion.
前述貫通區域亦可具有朝向上方膨起之彎曲面,前述彎曲面的上端亦可構成前述凸緣最上部。 The aforementioned through area may also have a curved surface that bulges upward, and the upper end of the aforementioned curved surface may also constitute the uppermost portion of the aforementioned flange.
根據該構成,於一次密封區域與蓋構件被密封時,前述彎曲面可在不會造成損傷下支撐蓋構件。 According to this structure, when the primary sealing area and the cover member are sealed, the aforementioned curved surface can support the cover member without causing damage.
此外,於前述包裝容器中,前述貫通區域亦可為往下方凹入之凹部,前述裂縫亦可形成於該凹部內。 In addition, in the aforementioned packaging container, the aforementioned through area may also be a concave portion that is concave downward, and the aforementioned crack may also be formed in the concave portion.
根據該構成,在形成貫通孔時從上方將往下方凹入之貫通區域穿孔,藉此使貫通區域之經穿孔的部位容易被保持在朝向較凸緣部的其他區域更下方之狀態,因此可防止貫通孔藉由該部位所封閉。 According to this structure, when forming a through hole, the through area that is recessed downward is perforated from the top, so that the perforated portion of the through area is easily maintained in a state that is lower than other areas of the flange portion, thereby preventing the through hole from being closed by this portion.
此外,於前述包裝容器中,前述凸緣部亦可設置在前述容納部之開口緣的全周,前述貫通區域亦可設置有複數個,並且配置在隔著前述容納部之相對向位置上。 In addition, in the aforementioned packaging container, the aforementioned flange portion may also be provided on the entire circumference of the opening edge of the aforementioned storage portion, and the aforementioned through-area may also be provided in plural numbers and arranged at opposite positions across the aforementioned storage portion.
根據該構成,由於在隔著容納部之相對向位置上配置有貫通區域,於此位置設置貫通孔時,藉由使氣體經由貫通孔從容納部的兩側流通,可抑制食品的加熱不均。 According to this structure, since a through area is arranged at a position opposite to the storage part, when a through hole is set at this position, the gas can flow from both sides of the storage part through the through hole, thereby suppressing uneven heating of the food.
本發明之其他包裝容器係一種用以使容納於內部之內容物暴露於殺菌用氣體來進行殺菌,然後封裝該內容物後使其流通之包裝容器,係具備容器本體,該容器本體包含:於上方具有開口且容納內容物之容納部,以及從前述容納部的開口緣朝外延伸之凸緣部;前述凸緣部具有:與覆蓋前述開口之蓋構件在一次密封工序中被一次密封之一次密封區域,與前述蓋構件在一次密封後的二次密封工序中被二次密封之二次密封區域;且前述凸緣部構成為:於前述蓋構件與前述一次密封區域被密封後,在其與前述蓋構件之間形成有可供氣體於外部與前述容納部內之間流通之流通路徑,於前述蓋構件與前述二次密封區域同被密封後,前述流通路徑被封閉。 Another packaging container of the present invention is a packaging container for exposing the contents contained therein to a sterilizing gas for sterilization, and then sealing the contents to allow them to circulate. The packaging container comprises a container body, the container body comprising: a container portion having an opening at the top and containing the contents, and a flange portion extending outward from the opening edge of the container portion; the flange portion has: a cover member covering the opening is sealed in a single sealing process; The primary sealing area of the secondary seal and the secondary sealing area of the aforementioned cover member that is secondary sealed in the secondary sealing process after the primary sealing; and the aforementioned flange portion is configured such that: after the aforementioned cover member and the aforementioned primary sealing area are sealed, a flow path is formed between it and the aforementioned cover member for gas to flow between the outside and the aforementioned container, and after the aforementioned cover member and the aforementioned secondary sealing area are sealed together, the aforementioned flow path is closed.
該構成之包裝容器可適合使用作為在將內容物容納於容納部並將蓋構件與凸緣部的一次密封區域密封,然後在經由流通路徑使殺菌用氣體流通於容納部內來對內容物進行殺菌後,將蓋構件與凸緣部的二次密封區域密封之容器。 The packaging container of this structure can be used as a container that contains the contents in the storage part and seals the primary sealing area of the cover member and the flange part, and then sterilizes the contents by circulating the sterilizing gas in the storage part through the flow path, and then seals the secondary sealing area of the cover member and the flange part.
於此包裝容器中,於一次密封區域與蓋構件被密封時,在對內容物進行殺菌時,使殺菌用氣體從凸緣部的下方經由流通路徑流通於容納部內,藉此可對容納部內的內容物進行殺菌。 In this packaging container, when the primary sealing area and the lid member are sealed, when the contents are sterilized, the sterilizing gas is allowed to flow from the bottom of the flange through the flow path into the container, thereby sterilizing the contents in the container.
再者,於此包裝容器中,蓋構件位於流通路徑上方,亦即流通路徑未暴露於蓋構件上方,故即使在藉由殺菌用氣體進行殺菌後,落下的細菌亦不易經由流通路徑而混入於容器內。此外,由於是以藉由二次密封區域與蓋構件被密封而使流通路徑被封閉之方式構成,所以藉由與蓋構件之密封,該包裝容器可完全地封裝內容物。 Furthermore, in this packaging container, the cover member is located above the flow path, that is, the flow path is not exposed above the cover member, so even after sterilization by sterilizing gas, it is not easy for fallen bacteria to be mixed into the container through the flow path. In addition, since the flow path is sealed by the secondary sealing area and the cover member, the packaging container can completely seal the contents by sealing with the cover member.
此外,於前述包裝容器的前述凸緣部中,亦可在較前述一次密封區域更內側處設置有貫通前述凸緣部之至少1個貫通孔,前述貫通孔亦能夠以成為前述流通路徑的一部分之方式構成。 In addition, in the aforementioned flange portion of the aforementioned packaging container, at least one through hole penetrating the aforementioned flange portion may be provided at a location further inward than the aforementioned primary sealing area, and the aforementioned through hole may also be configured in a manner that becomes a part of the aforementioned flow path.
根據該構成,於一次密封工序後的狀態下,殺菌用氣體從凸緣部的下方經由成為流通路徑的一部分之前述貫通孔流通於容納部內為止,藉此可對容納部內的食品進行殺菌。 According to this structure, after the first sealing process, the sterilizing gas flows from the bottom of the flange through the aforementioned through hole which becomes a part of the flow path into the storage part, thereby sterilizing the food in the storage part.
再者,於前述包裝容器中,前述貫通孔亦可藉由在前述凸緣部的一部分上形成裂縫而形成。 Furthermore, in the aforementioned packaging container, the aforementioned through hole can also be formed by forming a crack on a portion of the aforementioned flange portion.
根據該構成,於設置貫通孔時不會使凸緣部的一部分破裂,而不會產生凸緣部的碎片。因此可防止凸緣部的碎片混入於容納部內。 According to this structure, when the through hole is set, part of the flange portion will not be broken, and the flange portion will not be generated. Therefore, it is possible to prevent the flange portion from being mixed into the storage portion.
此外,於前述包裝容器中,前述凸緣部亦可具有:以前述裂縫為交界使前述凸緣部的一部分朝向上方變形而形成之凸緣最上部,在藉由該凸緣最上部所支撐之前述蓋構件與前述凸緣部之間亦可形成有前述流通路徑。 In addition, in the aforementioned packaging container, the aforementioned flange portion may also have: a flange uppermost portion formed by deforming a portion of the aforementioned flange portion upward with the aforementioned crack as a boundary, and the aforementioned flow path may also be formed between the aforementioned cover member supported by the aforementioned flange uppermost portion and the aforementioned flange portion.
根據該構成,藉由在凸緣部上形成裂縫,可同時形成貫通孔與凸緣最上部。 According to this structure, by forming a crack on the flange, a through hole and the uppermost part of the flange can be formed at the same time.
再者,於前述包裝容器中,朝向前述上方變形之前述凸緣部的一部分亦可具有朝向上方膨起之彎曲面。 Furthermore, in the aforementioned packaging container, a portion of the aforementioned flange portion deformed toward the aforementioned upward direction may also have a curved surface that bulges toward the upward direction.
根據該構成,於一次密封區域與蓋構件被密封時,前述彎曲面可不對蓋構件造成損傷而支撐蓋構件。 According to this structure, when the primary sealing area and the cover member are sealed, the aforementioned curved surface can support the cover member without causing damage to the cover member.
此外,於前述包裝容器中,前述凸緣部亦可具有:其上表面位於該凸緣部的上表面中之最上方之凸緣最上部,在藉由該凸緣最上部所支撐之前述蓋構件與前述凸緣部之間亦可形成有前述流通路徑。 In addition, in the aforementioned packaging container, the aforementioned flange portion may also have: a flange uppermost portion whose upper surface is located at the top of the upper surface of the flange portion, and the aforementioned flow path may also be formed between the aforementioned cover member supported by the flange uppermost portion and the aforementioned flange portion.
根據該構成,從進行一次密封工序後至進行二次密封工序為止之間,亦即對內容物進行殺菌時,由於蓋構件被前述凸緣最上部支撐,所以可更確實地使殺菌用氣體經由所形成之流通路徑流通於容納部內。 According to this structure, from the time when the primary sealing process is performed to the time when the secondary sealing process is performed, that is, when the contents are sterilized, since the cover member is supported by the uppermost portion of the aforementioned flange, the sterilizing gas can more reliably flow into the storage portion through the formed flow path.
此外,於前述包裝容器中,前述凸緣部亦可設置在前述容納部之開口緣的全周,前述貫通區域亦可設置有複數個,並且配置在隔著前述容納部之對相向位置上。 In addition, in the aforementioned packaging container, the aforementioned flange portion may also be provided on the entire circumference of the opening edge of the aforementioned storage portion, and the aforementioned through-area may also be provided in plural numbers and arranged at opposite positions across the aforementioned storage portion.
根據該構成,藉由使氣體經由隔著容納部而配置之貫通孔從容納部的兩側流通,可抑制食品的加熱不均。 According to this structure, by allowing the gas to flow from both sides of the storage part through the through holes arranged across the storage part, uneven heating of the food can be suppressed.
此外,於前述包裝容器中,亦可構成為前述一次密封區域的上表面位於前述凸緣部的上表面中之最上方,前述二次密封區域的上表面位於較前述一次密封區域的上表面更下方,前述凸緣部係於前述蓋構件與前述一次密封區域被密封後,在前述二次密封區域的上表面與前述蓋構件的下表面之間形成有間隙,前述間隙亦能夠以成為前述流通路徑的一部分之方式構成。 In addition, in the aforementioned packaging container, the upper surface of the aforementioned primary sealing area may be located at the uppermost of the upper surfaces of the aforementioned flange portion, and the upper surface of the aforementioned secondary sealing area may be located below the upper surface of the aforementioned primary sealing area. After the aforementioned lid member and the aforementioned primary sealing area are sealed, the aforementioned flange portion forms a gap between the upper surface of the aforementioned secondary sealing area and the lower surface of the aforementioned lid member. The aforementioned gap may also be configured in a manner that becomes a part of the aforementioned flow path.
根據該構成,從進行一次密封工序後至進行二次密封工序為止之間,亦即對內容物進行殺菌時,由於一次密封區域的上表面位於較前述二次密封區域的上表面更上方,而由一次密封區域保持成為流通路徑的一部分之前述間 隙,所以一次密封區域確實地維持間隙不被封閉之狀態,可使氣體經由貫通孔流通於容納部內。 According to this structure, from the time when the primary sealing process is performed to the time when the secondary sealing process is performed, that is, when the contents are sterilized, since the upper surface of the primary sealing area is located above the upper surface of the secondary sealing area, and the primary sealing area maintains the aforementioned gap as a part of the flow path, the primary sealing area reliably maintains the gap in an unsealed state, allowing the gas to flow into the storage portion through the through hole.
此外,於前述包裝容器中,前述容納部亦可包含載置有內容物之底板,前述底板的上表面亦可具有凹凸形狀。 In addition, in the aforementioned packaging container, the aforementioned storage portion may also include a bottom plate on which the contents are placed, and the upper surface of the aforementioned bottom plate may also have a concave-convex shape.
根據該構成,在將內容物配置在容納部時,於該內容物的下方產生間隙,所以在使殺菌用氣體流通於容納部內時,殺菌用氣體除了流通於內容物的上方之外,亦流通於下方。因此可藉由殺菌用氣體從上方及下方之兩方面對內容物進行殺菌。 According to this structure, when the contents are placed in the storage part, a gap is generated below the contents, so when the sterilizing gas is circulated in the storage part, the sterilizing gas flows not only above the contents but also below. Therefore, the contents can be sterilized from both above and below by the sterilizing gas.
本發明之包裝容器亦可更具備蓋構件,前述容器本體及前述蓋構件亦可由包含至少一層的氣體阻隔層之多層結構體所構成。 The packaging container of the present invention may also be equipped with a cover member, and the aforementioned container body and the aforementioned cover member may also be composed of a multi-layer structure including at least one gas barrier layer.
根據該構成,藉由使容器本體或蓋構件具備氣體阻隔層,可更長時間地維持包裝容器內的滅菌狀態。 According to this structure, by providing the container body or the cover member with a gas barrier layer, the sterilization state in the packaging container can be maintained for a longer period of time.
[發明之效果][Effect of the invention]
從以上內容來看,根據本發明,可提供一種在對內容物進行殺菌處理時可較佳地使用,並且涵蓋長期間可保持經殺菌後之內容物的品質之包裝容器。 From the above content, according to the present invention, a packaging container can be provided that can be preferably used when sterilizing the contents and can maintain the quality of the sterilized contents for a long period of time.
1:包裝容器 1: Packaging container
2:容納部 2: Storage area
3:凸緣部 3: Flange
4:容器本體 4: Container body
20:開口 20: Open mouth
21:開口緣 21: Opening up
22:底板 22: Base plate
23:側壁 23: Side wall
30:凸緣上表面 30: Upper surface of flange
31:一次密封區域 31: Primary sealing area
32:二次密封區域 32: Secondary sealing area
33:凸緣最上部 33: Uppermost part of flange
33A:第一凸緣最上部 33A: The top of the first flange
33B:第二凸緣最上部 33B: The uppermost part of the second flange
34:凸緣下部 34: Lower flange
36:貫通區域 36: Through area
220:底板上表面 220: Upper surface of the bottom plate
221:底板下表面 221: Bottom surface of the base plate
222:底板突起部 222: Bottom plate protrusion
223:底板傾斜面 223: Bottom plate slope
330:凸緣最上部上表面 330: Upper surface of the uppermost part of the flange
340:凸緣下部上表面 340: Upper surface of the lower flange
360:槽部 360: Groove
361:上表面 361: Upper surface
Claims (14)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-223878 | 2019-12-11 | ||
| JP2019223878 | 2019-12-11 |
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| TW202130282A TW202130282A (en) | 2021-08-16 |
| TWI887315B true TWI887315B (en) | 2025-06-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109143890A TWI887315B (en) | 2019-12-11 | 2020-12-11 | Packaging container for sterilization |
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| Country | Link |
|---|---|
| EP (1) | EP4074623A4 (en) |
| JP (1) | JP7372985B2 (en) |
| KR (1) | KR102877866B1 (en) |
| CN (1) | CN114929593B (en) |
| TW (1) | TWI887315B (en) |
| WO (1) | WO2021117865A1 (en) |
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| WO2022168880A1 (en) * | 2021-02-05 | 2022-08-11 | Nippon Shokubai Co., Ltd. | Systems and methods of storing 1,1-disubstituted alkene compositions |
Citations (1)
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|---|---|---|---|---|
| JP6203340B1 (en) * | 2016-07-26 | 2017-09-27 | フジフーズ株式会社 | Double seal sealing method for food packaging container and food packaging container |
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| JPS60134822A (en) * | 1983-12-22 | 1985-07-18 | 株式会社新日本食研 | Method of heating and sterilizing pack food |
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| FR2698082B1 (en) * | 1992-11-13 | 1994-12-23 | Mat Metallique Elec Const | Gas tight container. |
| JP2683227B2 (en) | 1995-06-26 | 1997-11-26 | 株式会社日阪製作所 | How to sterilize food |
| KR20010112632A (en) * | 2000-06-13 | 2001-12-20 | 다치바나 히로시 | Container |
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| AU2002366767A1 (en) * | 2001-12-20 | 2003-07-09 | Asahi Kasei Life & Living Corporation | Method for producing gas exchange package |
| JP4277475B2 (en) * | 2002-03-04 | 2009-06-10 | 凸版印刷株式会社 | Sealed container |
| NZ520678A (en) * | 2002-08-09 | 2004-12-24 | Vertex Pacific Ltd | Gas control packaging |
| JP4876679B2 (en) * | 2005-04-05 | 2012-02-15 | 東洋製罐株式会社 | Packaging container for microwave oven and manufacturing method thereof |
| JP4607695B2 (en) * | 2005-07-25 | 2011-01-05 | 越後製菓株式会社 | Method for producing container-enclosed food |
| KR20080109902A (en) * | 2006-04-04 | 2008-12-17 | 도요 세이칸 가부시키가이샤 | Microwave packaging container, and manufacturing method thereof |
| KR20090028162A (en) * | 2007-09-14 | 2009-03-18 | 박준명 | Food packaging containers |
| JP5014079B2 (en) * | 2007-11-16 | 2012-08-29 | 株式会社サンエー化研 | Packaging container for microwave oven |
| EP2514684A1 (en) * | 2011-04-20 | 2012-10-24 | Becton Dickinson France | Packaging for medical containers |
| FR2990196B1 (en) * | 2012-05-03 | 2015-05-01 | Technitrans | FOOD RECEPTION, PACKAGING AND PRESERVATION TRAINER |
| KR101391841B1 (en) * | 2013-11-19 | 2014-05-07 | (주)태방파텍 | Food cooking container structure having steam hole |
| KR200480487Y1 (en) * | 2014-12-05 | 2016-05-31 | 신예현 | Storing vessel |
| KR101536268B1 (en) * | 2015-01-22 | 2015-07-13 | 정희국 | Prevent structural collapse of container for food preparation |
| KR102012769B1 (en) * | 2017-11-13 | 2019-08-21 | (주)태방파텍 | Food cooking container structure having steam hole |
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2020
- 2020-12-11 TW TW109143890A patent/TWI887315B/en active
- 2020-12-11 JP JP2021564059A patent/JP7372985B2/en active Active
- 2020-12-11 CN CN202080085307.XA patent/CN114929593B/en active Active
- 2020-12-11 EP EP20899236.2A patent/EP4074623A4/en active Pending
- 2020-12-11 KR KR1020227019670A patent/KR102877866B1/en active Active
- 2020-12-11 WO PCT/JP2020/046262 patent/WO2021117865A1/en not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6203340B1 (en) * | 2016-07-26 | 2017-09-27 | フジフーズ株式会社 | Double seal sealing method for food packaging container and food packaging container |
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| Publication number | Publication date |
|---|---|
| KR20220098779A (en) | 2022-07-12 |
| EP4074623A4 (en) | 2024-01-17 |
| JP7372985B2 (en) | 2023-11-01 |
| JPWO2021117865A1 (en) | 2021-06-17 |
| KR102877866B1 (en) | 2025-10-29 |
| CN114929593B (en) | 2025-01-17 |
| TW202130282A (en) | 2021-08-16 |
| WO2021117865A1 (en) | 2021-06-17 |
| CN114929593A (en) | 2022-08-19 |
| EP4074623A1 (en) | 2022-10-19 |
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