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TWI887360B - Photosensitive composition, method for producing patterned cured film, and patterned cured film - Google Patents

Photosensitive composition, method for producing patterned cured film, and patterned cured film Download PDF

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TWI887360B
TWI887360B TW110105659A TW110105659A TWI887360B TW I887360 B TWI887360 B TW I887360B TW 110105659 A TW110105659 A TW 110105659A TW 110105659 A TW110105659 A TW 110105659A TW I887360 B TWI887360 B TW I887360B
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photosensitive composition
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TW202140577A (en
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加藤広樹
染谷和也
引田二郎
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日商東京應化工業股份有限公司
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    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Polymers & Plastics (AREA)
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  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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Abstract

本發明有關感光性組合物、經圖案化的固化膜的製造方法及經圖案化的固化膜。提供能形成相對介電常數低的固化物且能夠在具有高低差的基板上形成保形性良好的塗布膜的感光性組合物、該感光性組合物的固化物、及使用該感光性組合物的固化物的製造方法。在包含鹼溶性樹脂(A)、光聚合性化合物(B)及光聚合引發劑(C)的感光性組合物中，使用包含特定量的來自(甲基)丙烯酸多環烷基酯的結構單元(A-1)且重量平均分子量為90,000以上的丙烯酸系樹脂作為鹼溶性樹脂(A)。The present invention relates to a photosensitive composition, a method for producing a patterned cured film, and a patterned cured film. Provided are a photosensitive composition capable of forming a cured product having a low relative dielectric constant and capable of forming a coating film having good conformality on a substrate having a height difference, a cured product of the photosensitive composition, and a method for producing a cured product using the photosensitive composition. In a photosensitive composition comprising an alkali-soluble resin (A), a photopolymerizable compound (B), and a photopolymerization initiator (C), an acrylic resin having a weight average molecular weight of 90,000 or more and containing a specific amount of structural units (A-1) derived from a polycycloalkyl (meth)acrylate is used as the alkali-soluble resin (A).

Description

感光性組合物、經圖案化的固化膜的製造方法及經圖案化的固化膜Photosensitive composition, method for producing patterned cured film, and patterned cured film

本發明有關感光性組合物、該感光性組合物的固化物、及使用該感光性組合物的固化物的製造方法。The present invention relates to a photosensitive composition, a cured product of the photosensitive composition, and a method for producing the cured product using the photosensitive composition.

在液晶顯示裝置這樣的顯示裝置中，絕緣膜這樣的材料需要使從背光源這樣的光源發出的光高效地透過。因此，為了形成絕緣膜，要求能夠形成透明性優異的膜的材料。 這樣的透明絕緣膜通常在基板上被圖案化。作為形成經圖案化的透明絕緣膜的方法，例如，使用包含具有氧雜環丁烷環的鹼溶性樹脂、聚合性多官能化合物、和α-氨基烷基苯酮系光聚合引發劑的負型感光性組合物的方法(參見專利文獻1)是已知的。 另一方面，近年來，隨著液晶顯示器的生產台數增加，濾色器的生產量也增大，從更進一步提高生產率的觀點考慮，期望能夠以低曝光量形成圖案的高敏感度的感光性組合物。 但是，在濾色器中包含的各種功能性膜中含有著色劑，而在感光性組合物含有著色劑的情況下，若使用專利文獻1中記載的α-氨基烷基苯酮系光聚合引發劑，則存在難以獲得足夠高的敏感度的問題。 在這樣的狀況下，作為高敏感度的感光性組合物，本申請的發明人提出了包含特定結構的肟酯化合物作為光聚合引發劑的高敏感度的感光性組合物(參見專利文獻2及3。)。 現有技術文獻 專利文獻 專利文獻1：日本特開2012-173678號公報 專利文獻2：日本特開2012-189996號公報 專利文獻3：日本特開2012-189997號公報In a display device such as a liquid crystal display device, a material such as an insulating film needs to allow light emitted from a light source such as a backlight to pass through efficiently. Therefore, in order to form an insulating film, a material capable of forming a film with excellent transparency is required. Such a transparent insulating film is usually patterned on a substrate. As a method for forming a patterned transparent insulating film, for example, a method using a negative photosensitive composition containing an alkali-soluble resin having an oxycyclobutane ring, a polymerizable multifunctional compound, and an α-aminoalkylphenone-based photopolymerization initiator (see Patent Document 1) is known. On the other hand, in recent years, as the number of liquid crystal displays produced has increased, the production volume of color filters has also increased. From the perspective of further improving productivity, a highly sensitive photosensitive composition capable of forming a pattern with a low exposure is desired. However, various functional films included in the color filter contain a colorant, and when the photosensitive composition contains a colorant, if the α-aminoalkylphenone-based photopolymerization initiator described in Patent Document 1 is used, there is a problem that it is difficult to obtain a sufficiently high sensitivity. Under such circumstances, as a highly sensitive photosensitive composition, the inventors of the present application proposed a highly sensitive photosensitive composition containing an oxime ester compound of a specific structure as a photopolymerization initiator (see Patent Documents 2 and 3.). Prior art documents Patent documents Patent document 1: Japanese Patent Publication No. 2012-173678 Patent document 2: Japanese Patent Publication No. 2012-189996 Patent document 3: Japanese Patent Publication No. 2012-189997

發明要解決的課題 但是，在包含肟酯化合物作為光聚合引發劑的感光性組合物中，雖然敏感度良好，但另一方面，存在難以形成相對介電常數低之固化物的問題。 另外，半導體器件的高集成度化不斷進展，在塗布光刻膠組合物的基板上預先形成圖案等結構物的情況居多。有時該結構物自身也存在高低差。因此，期望即使如此在被塗布面上存在高低差，也可追隨高低差而使塗布膜的膜厚為相同程度。從上述實際情況考慮，期望感光性組合物能夠形成保形膜(conformal film)。 本發明是鑒於上述課題而完成，本發明之目的在於提供能形成相對介電常數低的固化物且能夠在具有高低差的基板上形成保形性良好的塗布膜的感光性組合物、該感光性組合物的固化物、及使用該感光性組合物之固化物的製造方法。 用於解決課題的手段 本申請的發明人發現，通過在包含鹼溶性樹脂(A)、光聚合性化合物(B)、及光聚合引發劑(C)的感光性組合物中，使用包含特定量的來自(甲基)丙烯酸多環烷基酯(polycycloalkyl (meth)acrylate)的結構單元(a-1)、且重量平均分子量為90,000以上的丙烯酸系樹脂作為鹼溶性樹脂(A)，能夠解決上述的課題，從而完成了本發明本發明。更具體而言，本發明提供以下的方案。 本發明的第1方式為感光性組合物，其包含鹼溶性樹脂(A)、光聚合性化合物(B)及光聚合引發劑(C)， 鹼溶性樹脂(A)包含下述丙烯酸系樹脂，前述丙烯酸系樹脂包含相對於全部結構單元的量而言為20質量%以上的來自(甲基)丙烯酸多環烷基酯的結構單元(a-1)， 丙烯酸系樹脂的重量平均分子量為9,000以上。 本發明的第2方式為第1方式有關的感光性組合物的固化物。 本發明的第3方式為固化物的製造方法，其包括下述步驟： 將第1方式有關的感光性組合物根據要形成的固化物的形狀來進行成型的步驟；及 對經成型之感光性組合物進行曝光的步驟。 發明的效果 根據本發明，可以提供能形成相對介電常數低的固化物且能夠在具有高低差的基板上形成保形性良好的塗布膜的感光性組合物、該感光性組合物的固化物、和使用該感光性組合物的固化物的製造方法。Problems to be solved by the invention However, although the sensitivity of the photosensitive composition containing an oxime ester compound as a photopolymerization initiator is good, on the other hand, there is a problem that it is difficult to form a cured product with a relatively low dielectric constant. In addition, as the integration of semiconductor devices continues to advance, there are many cases where structures such as patterns are pre-formed on the substrate on which the photoresist composition is applied. Sometimes the structure itself also has height differences. Therefore, it is expected that even if there are height differences on the coated surface, the thickness of the coated film can be kept to the same level by following the height differences. Considering the above actual situation, it is expected that the photosensitive composition can form a conformal film. The present invention is completed in view of the above-mentioned problems, and the purpose of the present invention is to provide a photosensitive composition that can form a cured product with a low relative dielectric constant and can form a coating film with good conformality on a substrate with a height difference, a cured product of the photosensitive composition, and a method for producing a cured product using the photosensitive composition. Means for solving the problem The inventors of the present application have found that the above-mentioned problems can be solved by using an acrylic resin having a weight average molecular weight of 90,000 or more and containing a specific amount of structural units (a-1) derived from polycycloalkyl (meth)acrylate as the alkali-soluble resin (A) in a photosensitive composition containing an alkali-soluble resin (A), a photopolymerizable compound (B), and a photopolymerization initiator (C), thereby completing the present invention. More specifically, the present invention provides the following scheme. The first aspect of the present invention is a photosensitive composition comprising an alkali-soluble resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), the alkali-soluble resin (A) comprises the following acrylic resin, the acrylic resin comprises a structural unit (a-1) derived from a polycyclic alkyl (meth)acrylate in an amount of 20% by mass or more relative to the amount of all structural units, the weight average molecular weight of the acrylic resin is 9,000 or more. The second aspect of the present invention is a cured product of the photosensitive composition related to the first aspect. The third aspect of the present invention is a method for producing a cured product, which comprises the following steps: The step of molding the photosensitive composition related to the first aspect according to the shape of the cured product to be formed; and The step of exposing the molded photosensitive composition. Effect of the invention According to the present invention, a photosensitive composition that can form a cured product with a low relative dielectric constant and can form a coating film with good conformality on a substrate with a height difference, a cured product of the photosensitive composition, and a method for producing a cured product using the photosensitive composition can be provided.

≪感光性組合物≫ 感光性組合物包含鹼溶性樹脂(A)、光聚合性化合物(B)、及光聚合引發劑(C)。鹼溶性樹脂(A)包含下述丙烯酸系樹脂，所述丙烯酸系樹脂包含20質量%以上之來自(甲基)丙烯酸多環烷基酯的結構單元(A-1)。上述的丙烯酸系樹脂的重量平均分子量為9,000以上。通過使感光性組合物含有上述的鹼溶性樹脂(A)，可得到能形成相對介電常數低的固化物、且能夠在具有高低差的基板上形成保形性良好的塗布膜的感光性組合物。 以下，針對感光性組合物所包含的必需或任選的成分、和感光性組合物的製造方法，依次進行說明。 ＜鹼溶性樹脂(A)＞ 感光性組合物包含鹼溶性樹脂(A)。如前文所述，鹼溶性樹脂(A)包含下述丙烯酸系樹脂，所述丙烯酸系樹脂包含20質量%以上之來自(甲基)丙烯酸多環烷基酯的結構單元(a-1)。上述的丙烯酸系樹脂的重量平均分子量為9,000以上。需要說明的是，本申請的說明書及申請專利範圍中，重量平均分子量為利用凝膠滲透色譜測定的、按照聚苯乙烯換算的重量平均分子量。 此處，本說明書中，所謂鹼溶性樹脂(A)，是指在分子內具備具有鹼溶性的官能團(例如，酚式羥基、羧基、磺酸基等)的樹脂。 鹼溶性樹脂(A)可以在不損害本發明目的的範圍內包含上述的特定丙烯酸系樹脂、以及上述的特定丙烯酸系樹脂以外的其他樹脂。以下，將包含20質量%以上的來自(甲基)丙烯酸多環烷基酯的結構單元(a-1)、且重量平均分子量為9,000以上的丙烯酸系樹脂記載為“丙烯酸系樹脂(a-I)”。 典型地，丙烯酸系樹脂(a-I)的質量相對於鹼溶性樹脂(A)的總質量而言的比率優選為70質量%以上,更優選為80質量%以上，進一步優選為90質量%以上，更進一步優選為95質量%以上，特別優選為100質量%。 作為丙烯酸系樹脂(a-I)，可以使用包含來自(甲基)丙烯酸的結構單元、及/或來自(甲基)丙烯酸酯等其他單體的結構單元的樹脂。(甲基)丙烯酸為丙烯酸、或甲基丙烯酸。作為其他單體，典型地，優選使用下述式(a-I-1)表示的化合物。 上述式(a-I-1)中，RA1 為氫原子或甲基。RA2 為一價有機基團。就該有機基團而言，可以在該有機基團中包含雜原子等除烴基以外的鍵、取代基。另外，該有機基團可以為直鏈狀、支鏈狀、環狀中的任意。RA3 為-O-、或-NRA4 -表示的基團。RA4 為氫原子、或碳原子數1以上且6以下的烷基。 作為RA2 的有機基團中的烴基以外的取代基，只要不損害本發明的效果，就沒有特別限定，可舉出鹵素原子、羥基、巰基、硫醚基、氰基、異氰基、氰酸酯基、異氰酸酯基、硫氰酸酯基、異硫氰酸酯基、甲矽烷基、矽烷醇基、烷氧基、烷氧基羰基、氨基甲醯基、硫代氨基甲醯基、硝基、亞硝基、羧基、羧酸鹽/酯基、醯基、醯基氧基、亞磺基、磺基、磺酸鹽/酯基、膦基、氧膦基、膦醯基、膦酸鹽/酯基、羥基亞氨基、烷基醚基、烷基硫醚基、芳基醚基、芳基硫醚基、氨基(-NH2 、-NHR、-NRR’：R及R’各自獨立地表示烴基)等。上述取代基中包含的氫原子可以被烴基取代。另外，上述取代基中包含的烴基可以為直鏈狀、支鏈狀、及環狀中的任意。 另外，作為RA2 的有機基團可具有丙烯醯基氧基、甲基丙烯醯基氧基、環氧基、氧雜環丁基等反應性的官能團。 丙烯醯基氧基、甲基丙烯醯基氧基等具有不飽和雙鍵等的醯基例如可以通過下述方式製造：使丙烯酸、甲基丙烯酸等不飽和羧酸與包含具有環氧基的結構單元的丙烯酸系樹脂(a-I)中的至少一部分環氧基反應。 也可以在使不飽和羧酸與至少一部分環氧基反應後，使多元酸酐與通過反應生成的基團反應。 作為多元酸酐的具體例，可舉出馬來酸酐、琥珀酸酐、衣康酸酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、偏苯三甲酸酐、均苯四甲酸酐、二苯甲酮四甲酸二酐、3-甲基六氫鄰苯二甲酸酐、4-甲基六氫鄰苯二甲酸酐、3-乙基六氫鄰苯二甲酸酐、4-乙基六氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、3-甲基四氫鄰苯二甲酸酐、4-甲基四氫鄰苯二甲酸酐、3-乙基四氫鄰苯二甲酸酐、及4-乙基四氫鄰苯二甲酸酐等。 作為具體例，使丙烯酸與來自甲基丙烯酸縮水甘油酯的結構單元反應時，生成下述反應式中示出的、具有羥基的結構單元。通過使四氫鄰苯二甲酸等多元酸酐與上述具有羥基的結構單元反應，從而生成具有羧基和不飽和雙鍵的、對樹脂賦予鹼溶性的結構單元。 另外，通過使具有環氧基及不飽和雙鍵的化合物與丙烯酸系樹脂(a-I)所具有的來自丙烯酸、甲基丙烯酸等不飽和羧酸的結構單元反應，從而能夠向丙烯酸系樹脂(a-I)中導入不飽和雙鍵。作為具有環氧基及不飽和雙鍵的化合物，例如，可以使用(甲基)丙烯酸縮水甘油酯、後述的式(a-I-1a)～(a-I-1o)表示的化合物。 作為RA2 ，優選烷基、芳基、環烷基、多環烷基(polycycloalkyl)、環烷基烷基、多環烷基烷基、芳烷基、或雜環基，這些基團可以被鹵素原子、羥基、烷基、或雜環基取代，也可以在這些基團上鍵結氧原子而形成環氧基。另外，這些基團含有亞烷基部分的情況下，亞烷基部分可以被醚鍵、硫醚鍵、酯鍵中斷。 烷基為直鏈狀或支鏈狀的情況下，其碳原子數優選為1以上且20以下，更優選為1以上且15以下，特別優選為1以上且10以下。作為合適的烷基的例子，可舉出甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、異戊基、仲戊基、叔戊基、正己基、正庚基、正辛基、異辛基、仲辛基、叔辛基、正壬基、異壬基、正癸基、異癸基等。 環烷基、多環烷基、環烷基烷基、多環烷基烷基、及這些基團以外的含脂環式基團的基團中，作為這些基團中包含的脂環式基團的優選例，可舉出環戊基、及環己基等單環的脂環式基團、金剛烷基、降冰片基、異冰片基、三環壬基、三環癸基、四環十二烷基、雙環-[2.1.1]-己基、雙環-[2.2.1]-庚基、雙環-[2.2.2]-辛基、雙環-[3.3.0]-辛基、雙環-[4.3.0]-壬基、及雙環-[4.4.0]-癸基等多環烷基。 作為由式(a-I-1)表示、且具有環烷基、多環烷基、環烷基烷基、多環烷基烷基、及這些基團以外之含脂環式基團的基團作為RA2 的化合物的優選例，可舉出下述式(a-I-1a)～(a-I-1h)表示的化合物。這些之中，為了使顯影性適度，優選為下述式(a-I-1c)～(a-I-1h)表示的化合物,更優選為下述式(a-I-1c)、或下述式(a-I-1d)表示的化合物。 上述式中，Ra20 表示氫原子或甲基，Ra21 表示單鍵或者碳原子數1以上且6以下的二價的脂肪族飽和烴基，Ra22 表示氫原子或者碳原子數1以上且5以下的烷基。作為Ra21 ，優選單鍵、直鏈狀或支鏈狀的亞烷基、例如亞甲基、亞乙基、亞丙基、1,4-亞丁基、乙基亞乙基、1,5-亞戊基、1,6-亞己基。作為Ra22 ，例如優選甲基、乙基。 鹼溶性樹脂(A)含有包含來自(甲基)丙烯酸多環烷基酯之結構單元(a-1)的丙烯酸系樹脂。丙烯酸系樹脂中的上述結構單元(a-1)的量相對於全部結構單元的量而言為20質量%以上。由此，可得到能形成相對介電常數低的固化物、且能夠在具有高低差的基板上形成保形性良好的塗布膜的感光性組合物。 即，丙烯酸系樹脂優選包含來自下述化合物的結構單元，所述化合物由上述式(a-I-1c)～(a-I-1h)中的任一者表示、且具有單鍵作為Ra21 。從特別容易形成低介電常數的固化物的方面考慮，丙烯酸系樹脂更優選包含來自下述化合物的結構單元作為結構單元(A-1)，所述化合物由式(a-I-1c)、式(a-I-1d)或式(a-I-1g)表示、且具有單鍵作為Ra21 。 如前文所述，丙烯酸系樹脂中的上述結構單元(A-1)的量相對於全部結構單元的量而言為20質量%以上，更優選為20質量%以上且40質量%以下，進一步優選為22質量%以上且35質量%以下。 關於式(a-I-1)表示的化合物具備具有環氧基的鏈狀基團作為Ra10 時的、式(a-I-1)表示的化合物的具體例，可舉出(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸2-甲基縮水甘油酯、(甲基)丙烯酸3,4-環氧基丁酯、(甲基)丙烯酸6,7-環氧基庚酯等(甲基)丙烯酸環氧基烷基酯類。 另外，式(a-I-1)表示的化合物可以為含脂環式環氧基的(甲基)丙烯酸酯。構成脂環式環氧基的脂環式基團可以為單環也可以為多環。作為單環的脂環式基團，可舉出環戊基、環己基等環烷基。另外，作為多環的脂環式基團，可舉出降冰片基、異冰片基、三環壬基、三環癸基、四環十二烷基等多環烷基。 從容易形成低介電常數的固化物的方面考慮，鹼溶性樹脂(A)優選包含來自含有脂環式環氧基的(甲基)丙烯酸酯的結構單元(A-2)。 作為式(a-I-1)表示的化合物為含有脂環式環氧基的(甲基)丙烯酸酯時的具體例，例如可舉出下述式(a-I-1i)～(a-I-1w)表示的化合物。這些之中，為了使顯影性適度，優選下述式(a-I-1i)～(a-I-1m)表示的化合物,更優選下述式(a-I-1i)～(a-I-1k)表示的化合物。 上述式中，Ra23 表示氫原子或甲基，Ra24 表示碳原子數1以上且6以下的二價的脂肪族飽和烴基，Ra25 表示碳原子數1以上且10以下的二價烴基，t表示0以上且10以下的整數。作為Ra24 ，優選直鏈狀或支鏈狀的亞烷基，例如亞甲基、亞乙基、亞丙基、1,4-亞丁基、乙基亞乙基、1,5-亞戊基、1,6-亞己基。作為Ra25 ，例如優選為亞甲基、亞乙基、亞丙基、1,4-亞丁基、乙基亞乙基、1,5-亞戊基、1,6-亞己基、亞苯基、亞環己基、-CH2 -Ph-CH2 -(Ph表示亞苯基)。 丙烯酸系樹脂(a-I)中之來自含有脂環式環氧基的(甲基)丙烯酸酯的結構單元(A-2)的量在不損害本發明目的之範圍內沒有特別限定，優選為30質量%以上且70質量%以下。使用這樣的樹脂的情況下，可能發生樹脂中包含的羧基、與脂環式環氧基的自身反應。因此，使用包含這樣的樹脂的感光性組合物時，可利用將膜加熱的方法等，使得發生羧基與脂環式環氧基的自身反應，由此提高形成的膜的硬度這樣的機械物性。 另外，丙烯酸系樹脂(a-I)也可以是聚合有(甲基)丙烯酸酯以外的單體而得到的樹脂。作為這樣的單體，可舉出(甲基)丙烯醯胺類、不飽和羧酸類、烯丙基化合物、乙烯基醚類、乙烯基酯類、苯乙烯類等。這些單體可以單獨使用或組合兩種以上而使用。 作為(甲基)丙烯醯胺類，可舉出(甲基)丙烯醯胺、N-烷基(甲基)丙烯醯胺、N-芳基(甲基)丙烯醯胺、N,N-二烷基(甲基)丙烯醯胺、N,N-芳基(甲基)丙烯醯胺、N-甲基-N-苯基(甲基)丙烯醯胺、N-羥基乙基-N-甲基(甲基)丙烯醯胺等。 作為不飽和羧酸類，可舉出巴豆酸等一元羧酸；馬來酸、富馬酸、檸康酸、中康酸、衣康酸等二羧酸；這些二羧酸的酐；等等。 作為烯丙基化合物，可舉出：乙酸烯丙酯、己酸烯丙酯、辛酸烯丙酯、月桂酸烯丙酯、棕櫚酸烯丙酯、硬脂酸烯丙酯、苯甲酸烯丙酯、乙醯乙酸烯丙酯、乳酸烯丙酯等烯丙基酯類；烯丙基氧基乙醇；等等。 作為乙烯基醚類，可舉出：己基乙烯基醚、辛基乙烯基醚、癸基乙烯基醚、乙基己基乙烯基醚、甲氧基乙基乙烯基醚、乙氧基乙基乙烯基醚、氯乙基乙烯基醚、1-甲基-2,2-二甲基丙基乙烯基醚、2-乙基丁基乙烯基醚、羥基乙基乙烯基醚、二乙二醇乙烯基醚、二甲基氨基乙基乙烯基醚、二乙基氨基乙基乙烯基醚、丁基氨基乙基乙烯基醚、苄基乙烯基醚、四氫糠基乙烯基醚等烷基乙烯基醚；乙烯基苯基醚、乙烯基甲苯基醚、乙烯基氯苯基醚、乙烯基-2,4-二氯苯基醚、乙烯基萘基醚、乙烯基蒽基醚等乙烯基芳基醚；等等。 作為乙烯基酯類，可舉出丁酸乙烯酯、異丁酸乙烯酯、三甲基乙酸乙烯酯、二乙基乙酸乙烯酯、戊酸乙烯酯、己酸乙烯酯、氯乙酸乙烯酯、二氯乙酸乙烯酯、甲氧基乙酸乙烯酯、丁氧基乙酸乙烯酯、苯基乙酸乙烯酯、乙醯乙酸乙烯酯、乳酸乙烯酯、β-苯基丁酸乙烯酯、苯甲酸乙烯酯、水楊酸乙烯酯、氯苯甲酸乙烯酯、四氯苯甲酸乙烯酯、萘甲酸乙烯酯等。 作為苯乙烯類，可舉出：苯乙烯；甲基苯乙烯、二甲基苯乙烯、三甲基苯乙烯、乙基苯乙烯、二乙基苯乙烯、異丙基苯乙烯、丁基苯乙烯、己基苯乙烯、環己基苯乙烯、癸基苯乙烯、苄基苯乙烯、氯甲基苯乙烯、三氟甲基苯乙烯、乙氧基甲基苯乙烯、乙醯氧基甲基苯乙烯等烷基苯乙烯；甲氧基苯乙烯、4-甲氧基-3-甲基苯乙烯、二甲氧基苯乙烯等烷氧基苯乙烯；氯苯乙烯、二氯苯乙烯、三氯苯乙烯、四氯苯乙烯、五氯苯乙烯、溴苯乙烯、二溴苯乙烯、碘苯乙烯、氟苯乙烯、三氟苯乙烯、2-溴-4-三氟甲基苯乙烯、4-氟-3-三氟甲基苯乙烯等鹵代苯乙烯；等等。 丙烯酸系樹脂(a-I)中的、來自(甲基)丙烯酸的結構單元的量和來自其他單體的結構單元的量在不損害本發明目的的範圍內沒有特別限定。相對於丙烯酸系樹脂(a-I)的全部結構單元而言，丙烯酸系樹脂(a-I)中的來自(甲基)丙烯酸的結構單元的量優選為5質量%以上且50質量%以下，更優選為10質量%以上且30質量%以下。 丙烯酸系樹脂(a-I)具備具有不飽和雙鍵的結構單元的情況下，相對於丙烯酸系樹脂(a-I)的全部結構單元的莫耳數而言，丙烯酸系樹脂(a-I)中之具有不飽和雙鍵的結構單元的量優選為1質量%以上且50質量%以下，更優選為1質量%以上且30質量%以下，特別優選為1質量%以上且20質量%以下。 通過使丙烯酸系樹脂(a-I)包含上述範圍內的量的具有不飽和雙鍵的結構單元，從而能夠將丙烯酸系樹脂引入抗蝕劑膜內的交聯反應，從而實現均勻化，因此，對於固化膜的耐熱性、機械特性的提高是有效的。 丙烯酸系樹脂(a-I)的重量平均分子量為9000以上，更優選為9000以上且50000以下，進一步優選為9100以上且30000以下，更進一步優選為9200以上且20000以下，特別優選為9500以上且15000以下。通過使用具有上述範圍內的重量平均分子量的丙烯酸系樹脂(a-I)，可得到能形成相對介電常數低的固化物、且能夠在具有高低差的基板上形成保形性良好的塗布膜的感光性組合物 在不損害本發明目的的範圍內，鹼溶性樹脂(A)可以包含不屬於上述的丙烯酸系樹脂(a-I)的丙烯酸系樹脂、丙烯酸系樹脂以外的樹脂。 作為鹼溶性樹脂(A)可包含之合適的樹脂，可舉出具有Cardo結構的樹脂(a-II)(以下，也記載為“Cardo樹脂(a-II)”)。 使用具有Cardo結構的樹脂(a-II)作為鹼溶性樹脂(A)的情況下，容易得到分辨力優異的感光性組合物，容易使用感光性組合物來形成不易因加熱而過度流動的固化膜。因此，容易形成形狀良好的固化膜。 〔具有Cardo結構的樹脂(a-II)〕 作為具有Cardo骨架的樹脂(a-II)，可以使用在其結構中具有Cardo骨架、且具有規定的鹼溶性的樹脂。所謂Cardo骨架，是指在構成第1環狀結構的1個環碳原子上鍵結第2環狀結構和第3環狀結構而形成的骨架。需要說明的是，第2環狀結構與第3環狀結構可以為相同的結構，也可以為不同的結構。 作為Cardo骨架的代表例，可舉出在芴環的9位碳原子上鍵結兩個芳香環(例如苯環)而成的骨架。 作為Cardo樹脂(a-II)，沒有特別限定，可以使用以往已知的樹脂。其中，優選下述式(a-II)表示的樹脂。 式(a-1)中，Xa 表示下述式(a-2)表示的基團。m1表示0以上且20以下的整數。 上述式(a-2)中，Ra1 各自獨立地表示氫原子、碳原子數1以上且6以下的烴基、或鹵素原子，Ra2 各自獨立地表示氫原子或甲基，Ra3 各自獨立地表示直鏈或支鏈的亞烷基(alkylene)，m2表示0或1，Wa 表示下述式(a-3)表示的基團。 式(a-2)中，作為Ra3 ，優選碳原子數1以上且20以下的亞烷基,更優選碳原子數1以上且10以下的亞烷基，特別優選碳原子數1以上且6以下的亞烷基，最優選乙烷-1,2-二基、丙烷-1,2-二基、及丙烷1,3-二基。 式(a-3)中的環A表示可以與芳香族環縮合的可具有取代基的脂肪族環。脂肪族環可以為脂肪族烴環，也可以為脂肪族雜環。 作為脂肪族環，可舉出單環烷烴、雙環烷烴、三環烷烴、四環烷烴等。 具體而言，可舉出環戊烷、環己烷、環庚烷、環辛烷等單環烷烴、金剛烷、降冰片烷、異冰片烷、三環癸烷、四環十二烷。 可與脂肪族環縮合的芳香族環可以為芳香族烴環，也可以為芳香族雜環，優選為芳香族烴環。具體而言，優選為苯環、及萘環。 作為式(a-3)表示的二價基團的優選例，可舉出下述的基團。 式(a-1)中的二價基團Xa 可通過使提供殘基Za 的四羧酸二酐與下式(a-2a)表示的二醇化合物反應從而被導入至Cardo樹脂(a-II)中。 式(a-2a)中，Ra1 、Ra2 、Ra3 、及m2如針對式(a-2)進行說明的那樣。關於式(a-2a)中的環A，如針對式(a-3)進行說明的那樣。 式(a-2a)表示的二醇化合物例如可利用以下的方法製造。 首先，根據需要，按照常規方法，將下述式(a-2b)表示的二醇化合物所具有的酚式羥基中的氫原子替換成-Ra3 -OH表示的基團，然後使用表氯醇等進行縮水甘油基化，得到下述式(a-2c)表示的環氧化合物。 接著，通過使式(a-2c)表示的環氧化合物與丙烯酸或甲基丙烯酸反應，從而得到式(a-2a)表示的二醇化合物。 式(a-2b)及式(a-2c)中，Ra1 、Ra3 、及m2如針對式(a-2)進行說明的那樣。關於式(a-2b)及式(a-2c)中的環A，如針對式(a-3)進行說明的那樣。 需要說明的是，式(a-2a)表示的二醇化合物的製造方法不限於上述的方法。 作為式(a-2b)表示的二醇化合物的優選例，可舉出以下的二醇化合物。 上述式(a-1)中，Ra0 為氫原子或-CO-Ya -COOH表示的基團。此處，Ya 表示從二羧酸酐中除去酸酐基(-CO-O-CO-)而得到的殘基。作為二羧酸酐的例子，可舉出馬來酸酐、琥珀酸酐、衣康酸酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基內亞甲基四氫鄰苯二甲酸酐、氯菌酸酐、甲基四氫鄰苯二甲酸酐、戊二酸酐等。 另外，上述式(a-1)中，Za 表示從四羧酸二酐中除去兩個酸酐基而得到的殘基。作為四羧酸二酐的例子，可舉出下述式(a-4)表示的四羧酸二酐、均苯四甲酸二酐、二苯甲酮四甲酸二酐、聯苯四甲酸二酐、二苯基醚四甲酸二酐等。 另外，上述式(a-1)中，m表示0以上且20以下的整數。 (式(a-4)中，Ra4 、Ra5 、及Ra6 各自獨立地表示選自由氫原子、碳原子數1以上且10以下的烷基及氟原子組成的組中的1種，m3表示0以上且12以下的整數。) 可被選作式(a-4)中的Ra4 的烷基為碳原子數1以上且10以下的烷基。通過將烷基所具有的碳原子數設定在該範圍內，從而能夠進一步提高得到的羧酸酯的耐熱性。Ra4 為烷基時，從容易得到耐熱性優異的Cardo樹脂的方面考慮，其碳原子數優選為1以上且6以下，更優選為1以上且5以下，進一步優選為1以上且4以下，特別優選為1以上且3以下。 Ra4 為烷基時，該烷基可以為直鏈狀，也可以為支鏈狀。 作為式(a-4)中的Ra4 ，從容易得到耐熱性優異的Cardo樹脂的方面考慮，更優選各自獨立地為氫原子或碳原子數1以上且10以下的烷基。式(a-4)中的Ra4 更優選為氫原子、甲基、乙基、正丙基或異丙基，特別優選為氫原子或甲基。 從容易製備高純度的四羧酸二酐的方面考慮，式(a-4)中的多個Ra4 優選為相同的基團。 式(a-4)中的m3表示0以上且12以下的整數。通過使m3的值為12以下，能夠使四羧酸二酐的純化容易。 從四羧酸二酐的純化容易的方面考慮，m3的上限優選為5,更優選為3。 從四羧酸二酐的化學穩定性的方面考慮，m3的下限優選為1,更優選為2。 式(a-4)中的m3特別優選為2或3。 可被選作式(a-4)中的Ra5 及Ra6 的碳原子數1以上且10以下的烷基與可被選作Ra4 的碳原子數1以上且10以下的烷基同樣。 從四羧酸二酐的純化容易的方面考慮，Ra5 、及Ra6 優選為氫原子、或者碳原子數1以上且10以下(優選為1以上且6以下，更優選為1以上且5以下，進一步優選為1以上且4以下，特別優選為1以上且3以下)的烷基,特別優選為氫原子或甲基。 作為式(a-4)表示的四羧酸二酐，例如，可舉出降冰片烷-2-螺-α-環戊酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐(別名“降冰片烷-2-螺-2’-環戊酮-5’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐”)、甲基降冰片烷-2-螺-α-環戊酮-α’-螺-2’’-(甲基降冰片烷)-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環己酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐(別名“降冰片烷-2-螺-2’-環己酮-6’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐”)、甲基降冰片烷-2-螺-α-環己酮-α’-螺-2’’-(甲基降冰片烷)-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環丙酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環丁酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環庚酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環辛酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環壬酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環癸酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環十一烷酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環十二烷酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環十三烷酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環十四烷酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-環十五烷酮-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-(甲基環戊酮)-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐、降冰片烷-2-螺-α-(甲基環己酮)-α’-螺-2’’-降冰片烷-5,5’’,6,6’’-四甲酸二酐等。 Cardo樹脂(a-II)的重量平均分子量優選為1000以上且40000以下，更優選為1500以上且30000以下，進一步優選為2000以上且10000以下。通過成為上述的範圍，從而能夠獲得良好的顯影性，並且對於使用感光性組合物形成的固化膜而言，能夠獲得充分的耐熱性和機械強度。 〔Novolac樹脂(a-III)〕 從容易形成不易因加熱而過度流動的固化物的方面考慮，還優選鹼溶性樹脂(A)包含Novolac樹脂(a-III)。 作為Novolac樹脂(a-III)，可以使用一直以來配合於感光性組合物中的各種Novolac樹脂。作為Novolac樹脂(a-III)，優選通過在酸催化下使具有酚式羥基的芳香族化合物(以下，簡稱為“酚類”。)與醛類進行加成縮合而得到。 (酚類) 作為製作Novolac樹脂(a-III)時可使用的酚類，例如，可舉出苯酚；鄰甲酚、間甲酚、對甲酚等甲酚類；2,3-二甲苯酚、2,4-二甲苯酚、2,5-二甲苯酚、2,6-二甲苯酚、3,4-二甲苯酚、3,5-二甲苯酚等二甲苯酚類；鄰乙基苯酚、間乙基苯酚、對乙基苯酚等乙基酚類；2-異丙基苯酚、3-異丙基苯酚、4-異丙基苯酚、鄰丁基苯酚、間丁基苯酚、對丁基苯酚、以及對叔丁基苯酚等烷基酚類；2,3,5-三甲基苯酚、及3,4,5-三甲基苯酚等三烷基酚類；間苯二酚、鄰苯二酚、對苯二酚、對苯二酚單甲基醚、連苯三酚、及間苯三酚等多元酚類；烷基間苯二酚、烷基鄰苯二酚、及烷基對苯二酚等烷基多元酚類(所有烷基的碳原子數均為1以上且4以下。)；α-萘酚；β-萘酚；羥基聯苯(hydroxydiphenyl)；以及雙酚A等。這些酚類可以單獨使用，也可組合使用兩種以上。 這些酚類中，優選間甲酚和對甲酚，更優選並用間甲酚和對甲酚。這種情況下，可通過調整兩者的配合比例，來調節使用感光性組合物形成的固化膜的耐熱性等各種特性。 間甲酚與對甲酚的配合比例沒有特別限定，以間甲酚/對甲酚的莫耳比計，優選為3/7以上且8/2以下。通過以上述範圍的比率使用間甲酚及對甲酚，從而容易得到能形成耐熱性優異的固化膜的感光性組合物。 另外，並用間甲酚和2,3,5-三甲基苯酚而製造的Novolac樹脂也是優選的。使用所述Novolac樹脂的情況下，特別容易得到能夠形成耐熱性優異的固化膜的感光性組合物。 間甲酚與2,3,5-三甲基苯酚的配合比例沒有特別限定，以間甲酚/2,3,5-三甲基苯酚的莫耳比計，優選為70/30以上且95/5以下。 (醛類) 作為製作Novolac樹脂(a-III)時可使用的醛類，例如，可舉出甲醛、多聚甲醛、糠醛、苯甲醛、硝基苯甲醛、及乙醛等。這些醛類可以單獨使用，也可以組合兩種以上而使用。 (酸催化劑) 作為製作Novolac樹脂(a-III)時可使用的酸催化劑，例如，可舉出鹽酸、硫酸、硝酸、磷酸、及亞磷酸等無機酸類；甲酸、草酸、乙酸、硫酸二乙酯、及對甲苯磺酸等有機酸類；以及乙酸鋅等金屬鹽類等。這些酸催化劑可以單獨使用，也可以組合兩種以上而使用。 (分子量) 就Novolac樹脂(a-III)的按照聚苯乙烯換算的重量平均分子量(Mw；以下，也簡稱為“重量平均分子量”。)而言，從使用感光性組合物形成的固化膜的耐熱性的觀點考慮，作為下限值，優選為2000,更優選為5000，特別優選為10000，進一步優選為15000，最優選為20000，作為上限值，優選為50000,更優選為45000，進一步優選為40000，最優選為35000。 作為Novolac樹脂(a-III)，可組合至少兩種按照聚苯乙烯換算的重量平均分子量不同的Novolac樹脂來使用。通過將重量平均分子量大小不同的Novolac樹脂進行組合來使用，從而能取得感光性組合物的顯影性、與使用感光性組合物形成的固化膜的耐熱性的均衡性。 〔改性環氧樹脂(a-IV)〕 鹼溶性樹脂(A)可以包含作為環氧化合物(a-3a)與含不飽和基團的羧酸(a-3b)的反應產物的、多元酸酐(a-3c)加成物。關於該加成物，也記載為“改性環氧樹脂(a-3)”。 需要說明的是，本申請的說明書及申請專利範圍中，將符合上述的定義、但不屬於上述的具有Cardo結構的樹脂(a-II)的化合物作為改性環氧樹脂(a-IV)。 以下，對環氧化合物(a-3a)、含不飽和基團的羧酸(a-3b)、及多元酸酐(a-3c)進行說明。 ＜環氧化合物(a-3a)＞ 環氧化合物(a-3a)沒有特別限定，只要是具有環氧基的化合物即可，可以是具有芳香族基團的芳香族環氧化合物，也可以是不包含芳香族基團的脂肪族環氧化合物，優選為具有芳香族基團的芳香族環氧化合物。 環氧化合物(a-3a)可以是單官能環氧化合物，也可以是2官能以上的多官能環氧化合物，優選為多官能環氧化合物。 作為環氧化合物(a-3a)的具體例，可舉出雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、雙酚AD型環氧樹脂、萘型環氧樹脂、及聯苯型環氧樹脂等2官能環氧樹脂；二聚酸縮水甘油酯、及三縮水甘油酯等縮水甘油酯型環氧樹脂；四縮水甘油基氨基二苯基甲烷、三縮水甘油基對氨基苯酚、四縮水甘油基間苯二甲胺、及四縮水甘油基雙氨基甲基環己烷等縮水甘油胺型環氧樹脂；三縮水甘油基異氰脲酸酯等雜環式環氧樹脂；間苯三酚三縮水甘油基醚、三羥基聯苯三縮水甘油基醚、三羥基苯基甲烷三縮水甘油基醚、丙三醇三縮水甘油基醚、2-[4-(2,3-環氧丙氧基)苯基]-2-[4-[1,1-雙[4-(2,3-環氧丙氧基)苯基]乙基]苯基]丙烷、及1,3-雙[4-[1-[4-(2,3-環氧丙氧基)苯基]-1-[4-[1-[4-(2,3-環氧丙氧基)苯基]-1-甲基乙基]苯基]乙基]苯氧基]-2-丙醇等3官能型環氧樹脂；四羥基苯基乙烷四縮水甘油基醚、四縮水甘油基二苯甲酮、雙間苯二酚四縮水甘油基醚、及四環氧丙氧基聯苯等4官能型環氧樹脂。 另外，作為環氧化合物(a-3a)，優選具有聯苯骨架的環氧化合物。 具有聯苯骨架的環氧化合物優選在主鏈中具有至少一個以上的下述式(a-3a-1)表示的聯苯骨架。 具有聯苯骨架的環氧化合物優選為具有兩個以上環氧基的多官能環氧化合物。 通過使用具有聯苯骨架的環氧化合物，容易得到敏感度與顯影性的均衡性優異、且能形成與基板的密合性優異的固化膜的感光性組合物。 (式(a-3a-1)中，Ra7 各自獨立地為氫原子、碳原子數1以上且12以下的烷基、鹵素原子、或者可具有取代基的苯基，j為1以上且4以下的整數。) Ra7 為碳原子數1以上且12以下的烷基時，作為烷基的具體例，可舉出甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、異戊基、仲戊基、叔戊基、正己基、正庚基、正辛基、異辛基、仲辛基、叔辛基、正壬基、異壬基、正癸基、異癸基、正十一烷基、及正十二烷基。 Ra7 為鹵素原子時，作為鹵素原子的具體例，可舉出氟原子、氯原子、溴原子、及碘原子。 Ra7 為可具有取代基的苯基時，苯基上的取代基數目沒有特別限定。苯基上的取代基數目為0以上且5以下，優選為0或1。 作為取代基的例子，可舉出碳原子數1以上且4以下的烷基、碳原子數1以上且4以下的烷氧基、碳原子數2以上且4以下的脂肪族醯基、鹵素原子、氰基、及硝基。 作為具有上述式(a-3a-1)表示的聯苯骨架的環氧化合物(a-3a)，没有特别限定，例如，可舉出下述式(a-3a-2)表示的環氧化合物。 (式(a-3a-2)中，Ra7 及j與式(a-3a-1)同樣，k為括號內的結構單元的平均重複數，為0以上且10以下。) 式(a-3a-2)表示的環氧化合物中，從特别容易得到敏感度與顯影性的均衡性優異的感光性组合物的方面考慮，優選下述式(a-3a-3)表示的化合物。 (式(a-3a-3)中，k與式(a-3a-2)同樣。) (含不飽和基團的羧酸(a-3b)) 在製備改性環氧化合物(a-IV)時，使環氧化合物(a-3a)與含不飽和基團的羧酸(a-3b)反應。 作為含不飽和基團的羧酸(a-3b)，優選為在分子中含有丙烯酸系基團(acryl group)、甲基丙烯酸系基團(methacryl group)等反應性的不飽和雙鍵的一元羧酸。作為這樣的含不飽和基團的羧酸，例如，可舉出丙烯酸、甲基丙烯酸、β-苯乙烯基丙烯酸、β-糠基丙烯酸、α-氰基肉桂酸、肉桂酸等。另外，含不飽和基團的羧酸(a-3b)可以單獨使用或組合兩種以上而使用。 可以利用已知的方法使環氧化合物(a-3a)與含不飽和基團的羧酸(a-3b)反應。作為優選的反應方法，例如，可舉出下述方法：將三乙基胺、苄基乙基胺等叔胺、十二烷基三甲基氯化銨、四甲基氯化銨、四乙基氯化銨、苄基三乙基氯化銨等季銨鹽、吡啶、或三苯基膦等作為催化劑，在有機溶劑中，於50℃以上且150℃以下的反應溫度，使環氧化合物(a-3a)與含不飽和基團的羧酸(a-3b)反應數小時~數十小時的時間。 對於環氧化合物(a-3a)與含不飽和基團的羧酸(a-3b)的反應中的兩者的使用量的比率而言，以環氧化合物(a-3a)的環氧當量與含不飽和基團的羧酸(a-3b)的羧酸當量之比計，通常優選為1：0.5～1：2,更優選為1：0.8～1：1.25，特別優選為1：0.9～1：1.1。 環氧化合物(a-3a)的使用量與含不飽和基團的羧酸(a-3b)的使用量的比率以上述的當量比計為1：0.5～1：2時，有交聯效率提高的傾向，是優選的。 (多元酸酐(a-3c)) 多元酸酐(a-3c)為具有兩個以上羧基的羧酸的酐。 作為多元酸酐(a-3c)，沒有特別限定，例如，可舉出馬來酸酐、琥珀酸酐、衣康酸酐、鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、偏苯三甲酸酐、均苯四甲酸酐、二苯甲酮四甲酸二酐、3-甲基六氫鄰苯二甲酸酐、4-甲基六氫鄰苯二甲酸酐、3-乙基六氫鄰苯二甲酸酐、4-乙基六氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、3-甲基四氫鄰苯二甲酸酐、4-甲基四氫鄰苯二甲酸酐、3-乙基四氫鄰苯二甲酸酐、4-乙基四氫鄰苯二甲酸酐、下述式(a-3c-1)表示的化合物、及下述式(a-3c-2)表示的化合物。另外，多元酸酐(a-3c)可以單獨使用或組合兩種以上而使用。 (式(a-3c-2)中，Ra8 表示碳原子數1以上且10以下的可具有取代基的亞烷基。) 作為多元酸酐(a-3c)，從容易得到敏感度與顯影性的均衡性優異的感光性組合物的方面考慮，優選具有兩個以上的苯環的化合物。另外，多元酸酐(a-3c)更優選包含上述式(a-3c-1)表示的化合物、及上述式(a-3c-2)表示的化合物中的至少一者。 在使環氧化合物(a-3a)與含不飽和基團的羧酸(a-3b)反應後，與多元酸酐(a-3c)反應的方法可以從已知的方法中適當選擇。 另外，對於使用量之比而言，以環氧化合物(a-3a)與含不飽和基團的羧酸(a-3b)的反應後的成分中的OH基的莫耳數、與多元酸酐(a-3c)的酸酐基的當量比計，通常為1:1～1:0.1，優選為1:0.8～1:0.2。通過成為上述範圍，從而容易得到顯影性良好的感光性組合物。 另外，改性環氧樹脂(a-IV)的酸值以樹脂固態成分計優選為10mgKOH/g以上且150mgKOH/g以下，更優選為70mgKOH/g以上且110mgKOH/g以下。通過使樹脂的酸值為10mgKOH/g以上，從而能得到在顯影液中的充分的溶解性，另外，通過使酸值為150mgKOH/g以下，從而能得到充分的固化性，能使表面性良好。 另外，改性環氧樹脂(a-IV)的重量平均分子量優選為1000以上且40000以下，更優選為2000以上且30000以下。通過使重量平均分子量為1000以上，從而容易形成耐熱性和強度優異的固化膜。另外，通過使重量平均分子量為40000以下，從而容易得到呈現在顯影液中的充分的溶解性的感光性組合物。 相對於除了後述的有機溶劑(S)的質量以外的感光性組合物的質量(固態成分整體)而言，鹼溶性樹脂(A)的含量優選為20質量%以上且85質量%以下，更優選為25質量%以上且75質量%以下。通過成為上述的範圍，容易得到顯影性優異的感光性組合物。 ＜光聚合性化合物(B)＞ 作為光聚合性化合物(B)，可優選使用具有烯鍵式不飽和基團的單體。 光聚合性化合物(B)的種類在不損害本發明目的的範圍內沒有特別限定。 從容易形成相對介電常數低的固化物的方面考慮，光聚合性化合物中，作為該具有烯鍵式不飽和基團的單體,優選包含具有3個以上(甲基)丙烯醯基的多官能化合物，更優選包含具有3或4個(甲基)丙烯醯基的多官能化合物。使用上述多官能化合物作為光聚合性化合物(B)時，容易得到能形成相對介電常數低的固化物、且能夠在具有高低差的基板上形成保形性良好的塗布膜的感光性組合物。 具有3個以上(甲基)丙烯醯基的多官能化合物可以與其他光聚合性化合物組合使用。其他光聚合性化合物可以為單官能化合物或2官能化合物。具有3個以上(甲基)丙烯醯基的多官能化合物的質量相對於光聚合性化合物(B)的質量而言的比率優選為80質量%以上，更優選為90質量%以上，進一步優選為95質量%以上，特別優選為100質量%。 作為具有3或4個(甲基)丙烯醯基的多官能化合物的具體例，可舉出三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、及丙三醇三(甲基)丙烯酸酯等。這些多官能單體可以單獨使用或組合兩種以上而使用。 從容易形成低介電常數的固化物的方面考慮，具有3或4個(甲基)丙烯醯基的多官能化合物優選包含具有下述式(B1)表示的部分骨架的化合物。典型地，式(B1)表示的部分骨架來自三羥甲基丙烷。 光聚合性化合物(B)優選包含下述式(B2)表示的化合物作為具有式(B1)表示的部分骨架的多官能化合物。 (式(B2)中，Rb1 各自獨立地為氫原子或甲基，Rb2 為二價連接基團，a1為0或1，a2為0或1。) 式(B2)中，a1為0時，式(B2)表示的化合物為3官能化合物。a1為1時，式(B2)表示的化合物為4官能化合物。 式(B2)中的Rb2 為二價連接基團。該連接基團可以為烴基，也可以為含有雜原子的有機基團。作為連接基團可含有的雜原子，例如，可舉出O、N、S、Se、P、Si、B、及鹵素原子。 作為二價連結基團的優選例，可舉出-CO-、-Rb3 -、 -CO-Rb3 -CO-、-Rb3 -CO-、-Rb4 -O-Rb4 -、-Rb4 -S-Rb4 -、及 -Rb4 -CO-Rb4 -表示的基團。Rb3 為碳原子數1以上且10以下的二價烴基。Rb4 為碳原子數1以上且6以下的二價烴基。 以上說明的基團中，從容易合成、獲得式(B2)表示的化合物等方面考慮，優選-CO-、-Rb3 -、及-CO-Rb3 -CO-。 作為連結基團的優選具體例，可舉出-CO-、-CH2 -、 -CH2 CH2 -、-CH=CH-、-CH2 CH2 CH2 -、-CH2 C(CH3 )H-、 -CO-CH2 -CO-、--CO-CH2 CH2 -CO-、-CO-CH=CH-CO-、 -CO-CH2 CH2 CH2 -CO-、-CO-CH2 CH2 -及下述 結構的基團。 作為具有3或4個(甲基)丙烯醯基的多官能化合物的特別優選的具體例，可舉出下述的化合物。下述式中，Rb1 各自獨立地為氫原子或甲基。 光聚合性化合物(B)包含除了具有3或4個(甲基)丙烯醯基的多官能化合物以外的其他光聚合性化合物的情況下，該其他光聚合性化合物在不損害本發明目的的範圍內沒有特別限定。其他光聚合性化合物可以為單官能化合物，也可以為2官能或5官能以上的多官能化合物。 作為單官能化合物，可舉出(甲基)丙烯醯胺、羥甲基(甲基)丙烯醯胺、甲氧基甲基(甲基)丙烯醯胺、乙氧基甲基(甲基)丙烯醯胺、丙氧基甲基(甲基)丙烯醯胺、丁氧基甲氧基甲基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥基甲基(甲基)丙烯醯胺、(甲基)丙烯酸、富馬酸、馬來酸、馬來酸酐、衣康酸、衣康酸酐、檸康酸、檸康酸酐、巴豆酸、2-丙烯醯胺基-2-甲基丙磺酸、叔丁基丙烯醯胺磺酸、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸2-苯氧基-2-羥基丙酯、鄰苯二甲酸2-(甲基)丙烯醯基氧基-2-羥基丙酯、甘油單(甲基)丙烯酸酯、(甲基)丙烯酸四氫糠基酯、(甲基)丙烯酸二甲基氨基乙酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸2,2,2-三氟乙酯、(甲基)丙烯酸2,2,3,3-四氟丙酯、鄰苯二甲酸衍生物的(甲基)丙烯酸半酯等。這些單官能化合物可以單獨使用或組合兩種以上而使用。 作為二元或五元以上的多官能化合物，可舉出乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、丙三醇二(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、2,2-雙(4-(甲基)丙烯醯氧基二乙氧基苯基)丙烷、2,2-雙(4-(甲基)丙烯醯氧基多乙氧基苯基)丙烷、(甲基)丙烯酸2-羥基-3-(甲基)丙烯醯基氧基丙酯、乙二醇二縮水甘油基醚二(甲基)丙烯酸酯、二乙二醇二縮水甘油基醚二(甲基)丙烯酸酯、鄰苯二甲酸二縮水甘油酯二(甲基)丙烯酸酯、氨基甲酸酯(甲基)丙烯酸酯(即，甲苯二異氰酸酯、三甲基-1,6-己二異氰酸酯、或1,6-己二異氰酸酯等與(甲基)丙烯酸2-羥基乙酯的反應產物)、亞甲基雙(甲基)丙烯醯胺、(甲基)丙烯醯胺亞甲基醚、多元醇與N-羥甲基(甲基)丙烯醯胺的縮合物等多官能化合物、1,3,5-三丙烯醯基六氫-1,3,5-三嗪(triacrylformal)等。這些多官能化合物可以單獨使用或組合兩種以上而使用。 具有3或4個(甲基)丙烯醯基的多官能化合物以外的其他光聚合性化合物中，從存在提高感光性組合物與基板的密合性、感光性組合物在固化後的強度的傾向的方面考慮，優選5官能以上的多官能單體。 相對於除了後述的有機溶劑(S)的質量以外的感光性組合物的質量(固態成分整體)而言，光聚合性化合物(B)在感光性組合物中的含量優選為1質量%以上且50質量%以下，更優選為5質量%以上且40質量%以下。通過成為上述的範圍，有容易獲得敏感度、顯影性、分辨力的均衡性的傾向。 ＜光聚合引發劑(C)＞ 光聚合引發劑(C)只要能夠利用曝光使上述的光聚合性化合物(B)固化即可，沒有特別限定。作為光聚合引發劑(C)，從感光性組合物的敏感度的方面考慮，典型地，可優選使用肟酯化合物。 從容易形成低介電常數的固化物的方面考慮，作為肟酯化合物，優選使用下述式(1)表示的化合物。 (式(1)中，Rc1 為氫原子、硝基或一價有機基團，Rc2 及Rc3 各自為可具有取代基的鏈狀烷基、可具有取代基的環狀有機基團、或氫原子，Rc2 與Rc3 可以彼此鍵結而形成環，Rc4 為一價有機基團，Rc5 為氫原子、可具有取代基的碳原子數1以上且11以下的烷基、或者可具有取代基的芳基，n1為0以上且4以下的整數，n2為0或1。) 式(1)中，Rc1 為氫原子、硝基或一價有機基團。Rc1 在式(1)中的芴環上鍵結於與-(CO)n2 -表示的基團所鍵結的六元芳香環不同的六元芳香環上。式(1)中，Rc1 相對於芴環的鍵結位置沒有特別限定。式(1)表示的化合物具有1個以上的Rc1 的情況下，從容易合成式(1)表示的化合物等方面考慮，優選1個以上的Rc1 中的1個與芴環中的2位鍵結。Rc1 為多個的情況下，多個Rc1 可以相同，也可以不同。 Rc1 為有機基團時，Rc1 在不損害本發明的目的的範圍內沒有特別限定，可從各種有機基團中適當選擇。作為Rc1 為有機基團時的優選例，可舉出烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、飽和脂肪族醯基氧基、烷氧基羰基、可具有取代基的苯基、可具有取代基的苯氧基、可具有取代基的苯甲醯基、可具有取代基的苯氧基羰基、可具有取代基的苯甲醯基氧基、可具有取代基的苯基烷基、可具有取代基的萘基、可具有取代基的萘氧基、可具有取代基的萘甲醯基、可具有取代基的萘氧基羰基、可具有取代基的萘甲醯基氧基、可具有取代基的萘基烷基、可具有取代基的雜環基、可具有取代基的雜環基羰基、被1個或2個有機基團取代的氨基、嗎啉-1-基、及哌嗪(Piperazine)-1-基等。 Rc1 為烷基時，烷基的碳原子數優選為1以上且20以下，更優選為1以上且6以下。另外，Rc1 為烷基時，可以為直鏈，也可以為支鏈。作為Rc1 為烷基時的具體例，可舉出甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、異戊基、仲戊基、叔戊基、正己基、正庚基、正辛基、異辛基、仲辛基、叔辛基、正壬基、異壬基、正癸基、及異癸基等。另外，Rc1 為烷基時，烷基可在碳鏈中包含醚鍵(-O-)。作為在碳鏈中具有醚鍵的烷基的例子，可舉出甲氧基乙基、乙氧基乙基、甲氧基乙氧基乙基、乙氧基乙氧基乙基、丙基氧基乙氧基乙基、及甲氧基丙基等。 Rc1 為烷氧基時，烷氧基的碳原子數優選為1以上且20以下，更優選為1以上且6以下。另外，Rc1 為烷氧基時，可以為直鏈，也可以為支鏈。作為Rc1 為烷氧基時的具體例，可舉出甲氧基、乙氧基、正丙基氧基、異丙基氧基、正丁基氧基、異丁基氧基、仲丁基氧基、叔丁基氧基、正戊基氧基、異戊基氧基、仲戊基氧基、叔戊基氧基、正己基氧基、正庚基氧基、正辛基氧基、異辛基氧基、仲辛基氧基、叔辛基氧基、正壬基氧基、異壬基氧基、正癸基氧基、及異癸基氧基等。另外，Rc1 為烷氧基時，烷氧基可在碳鏈中包含醚鍵(-O-)。作為在碳鏈中具有醚鍵的烷氧基的例子，可舉出甲氧基乙氧基、乙氧基乙氧基、甲氧基乙氧基乙氧基、乙氧基乙氧基乙氧基、丙基氧基乙氧基乙氧基、及甲氧基丙基氧基等。 Rc1 為環烷基或環烷氧基時，環烷基或環烷氧基的碳原子數優選為3以上且10以下，更優選為3以上且6以下。作為Rc1 為環烷基時的具體例，可舉出環丙基、環丁基、環戊基、環己基、環庚基、及環辛基等。作為Rc1 為環烷氧基時的具體例，可舉出環丙基氧基、環丁基氧基、環戊基氧基、環己基氧基、環庚基氧基、及環辛基氧基等。 Rc1 為飽和脂肪族醯基或飽和脂肪族醯基氧基時，飽和脂肪族醯基或飽和脂肪族醯基氧基的碳原子數優選為2以上且21以下，更優選為2以上且7以下。作為Rc1 為飽和脂肪族醯基時的具體例，可舉出乙醯基、丙醯基、正丁醯基、2-甲基丙醯基、正戊醯基、2,2-二甲基丙醯基、正己醯基、正庚醯基、正辛醯基、正壬醯基、正癸醯基、正十一烷醯基、正十二烷醯基、正十三烷醯基、正十四烷醯基、正十五烷醯基、及正十六烷醯基等。作為Rc1 為飽和脂肪族醯基氧基時的具體例，可舉出乙醯基氧基、丙醯基氧基、正丁醯基氧基、2-甲基丙醯基氧基、正戊醯基氧基、2,2-二甲基丙醯基氧基、正己醯基氧基、正庚醯基氧基、正辛醯基氧基、正壬醯基氧基、正癸醯基氧基、正十一烷醯基氧基、正十二烷醯基氧基、正十三烷醯基氧基、正十四烷醯基氧基、正十五烷醯基氧基、及正十六烷醯基氧基等。 Rc1 為烷氧基羰基時，烷氧基羰基的碳原子數優選為2以上且20以下，更優選為2以上且7以下。作為Rc1 為烷氧基羰基時的具體例，可舉出甲氧基羰基、乙氧基羰基、正丙基氧基羰基、異丙基氧基羰基、正丁基氧基羰基、異丁基氧基羰基、仲丁基氧基羰基、叔丁基氧基羰基、正戊基氧基羰基、異戊基氧基羰基、仲戊基氧基羰基、叔戊基氧基羰基、正己基氧基羰基、正庚基氧基羰基、正辛基氧基羰基、異辛基氧基羰基、仲辛基氧基羰基、叔辛基氧基羰基、正壬基氧基羰基、異壬基氧基羰基、正癸基氧基羰基、及異癸基氧基羰基等。 Rc1 為苯基烷基時，苯基烷基的碳原子數優選為7以上且20以下，更優選為7以上且10以下。另外，Rc1 為萘基烷基時，萘基烷基的碳原子數優選為11以上且20以下，更優選為11以上且14以下。作為Rc1 為苯基烷基時的具體例，可舉出苄基、2-苯基乙基、3-苯基丙基、及4-苯基丁基。作為Rc1 為萘基烷基時的具體例，可舉出α-萘基甲基、β-萘基甲基、2-(α-萘基)乙基、及2-(β-萘基)乙基。Rc1 為苯基烷基或萘基烷基時，Rc1 可在苯基或萘基上進一步具有取代基。 Rc1 為雜環基時，雜環基為包含1個以上的N、S、O的五元或六元的單環，或者為所述單環彼此縮合、或所述單環與苯環縮合而成的雜環基。雜環基為稠環時，構成稠環的單環的環數為3以下。雜環基可以為芳香族基團(雜芳基)，也可以為非芳香族基團。作為構成該雜環基的雜環，可舉出呋喃、噻吩、吡咯、噁唑、異噁唑、噻唑、噻二唑、異噻唑、咪唑、吡唑、三唑、吡啶、吡嗪、嘧啶、噠嗪、苯並呋喃、苯並噻吩、吲哚、異吲哚、吲哚嗪、苯並咪唑、苯並三唑、苯並噁唑、苯並噻唑、哢唑、嘌呤、喹啉、異喹啉、喹唑啉、酞嗪、噌啉、喹喔啉、哌啶、哌嗪、嗎啉、哌啶、四氫吡喃、及四氫呋喃等。Rc1 為雜環基時，雜環基可以進一步具有取代基。 Rc1 為雜環基羰基時，雜環基羰基中包含的雜環基與Rc1 為雜環基時同樣。 Rc1 為被1個或2個有機基團取代的氨基時，關於有機基團的優選例，可舉出碳原子數1以上且20以下的烷基、碳原子數3以上且10以下的環烷基、碳原子數2以上且21以下的飽和脂肪族醯基、可具有取代基的苯基、可具有取代基的苯甲醯基、可具有取代基的碳原子數7以上且20以下的苯基烷基、可具有取代基的萘基、可具有取代基的萘甲醯基、可具有取代基的碳原子數11以上且20以下的萘基烷基、及雜環基等。這些優選的有機基團的具體例與Rc1 同樣。作為被1個或2個有機基團取代的氨基的具體例，可舉出甲基氨基、乙基氨基、二乙基氨基、正丙基氨基、二正丙基氨基、異丙基氨基、正丁基氨基、二正丁基氨基、正戊基氨基、正己基氨基、正庚基氨基、正辛基氨基、正壬基氨基、正癸基氨基、苯基氨基、萘基氨基、乙醯基氨基、丙醯基氨基、正丁醯基氨基、正戊醯基氨基、正己醯基氨基、正庚醯基氨基、正辛醯基氨基、正癸醯基氨基、苯甲醯基氨基、α-萘甲醯基氨基、及β-萘甲醯基氨基等。 作為Rc1 中包含的苯基、萘基、及雜環基進一步具有取代基時的取代基，可舉出碳原子數1以上且6以下的烷基、碳原子數1以上且6以下的烷氧基、碳原子數2以上且7以下的飽和脂肪族醯基、碳原子數2以上且7以下的烷氧基羰基、碳原子數2以上且7以下的飽和脂肪族醯基氧基、具有碳原子數1以上且6以下的烷基的單烷基氨基、具有碳原子數1以上且6以下的烷基的二烷基氨基、嗎啉-1-基、哌嗪-1-基、鹵素、硝基、及氰基等。Rc1 中包含的苯基、萘基、及雜環基進一步具有取代基時，該取代基的個數在不妨礙本發明的目的的範圍內沒有限制，優選為1以上且4以下。Rc1 中包含的苯基、萘基、及雜環基具有多個取代基時，多個取代基可以相同也可以不同。 上文中說明的基團中，作為Rc1 ，為硝基或Rc10 -CO-表示的基團時，存在敏感度提高的傾向，是優選的。Rc10 在不妨礙本發明的目的的範圍內沒有特別限制，可以從各種有機基團中選擇。關於優選作為Rc10 的基團的例子，可舉出碳原子數1以上且20以下的烷基、可具有取代基的苯基、可具有取代基的萘基、及可具有取代基的雜環基。這些基團中，作為Rc10 ，特別優選2-甲基苯基、噻吩-2-基、及α-萘基。 另外，Rc1 為氫原子時，存在透明性變得良好的傾向，是優選的。需要說明的是，Rc1 為氫原子且Rc4 為後述的式(1a)或(1b)表示的基團時，存在透明性變得更良好的傾向。 式(1)中，Rc2 和Rc3 各自為可具有取代基的鏈狀烷基、可具有取代基的環狀有機基團、或氫原子。Rc2 與Rc3 可以相互鍵結而形成環。這些基團中，作為Rc2 和Rc3 ，優選可具有取代基的鏈狀烷基。Rc2 和Rc3 為可具有取代基的鏈狀烷基時，鏈狀烷基可以是直鏈烷基，也可以是支鏈烷基。 Rc2 及Rc3 為不具有取代基的鏈狀烷基時，鏈狀烷基的碳原子數優選為1以上且20以下，更優選為1以上且10以下，特別優選為1以上且6以下。作為Rc2 和Rc3 為鏈狀烷基時的具體例，可舉出甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、異戊基、仲戊基、叔戊基、正己基、正庚基、正辛基、異辛基、仲辛基、叔辛基、正壬基、異壬基、正癸基、及異癸基等。另外，Rc2 和Rc3 為烷基時，烷基可在碳鏈中包含醚鍵(-O-)。作為在碳鏈中具有醚鍵的烷基的例子，可舉出甲氧基乙基、乙氧基乙基、甲氧基乙氧基乙基、乙氧基乙氧基乙基、丙基氧基乙氧基乙基、及甲氧基丙基等。 Rc2 及Rc3 為具有取代基的鏈狀烷基時，鏈狀烷基的碳原子數優選為1以上且20以下，更優選為1以上且10以下，特別優選為1以上且6以下。這種情況下，鏈狀烷基的碳原子數不包括取代基的碳原子數。具有取代基的鏈狀烷基優選為直鏈狀。 烷基可以具有的取代基在不妨礙本發明的目的的範圍內沒有特別限制。作為取代基的優選例，可舉出氰基、鹵素原子、環狀有機基團、及烷氧基羰基。作為鹵素原子，可舉出氟原子、氯原子、溴原子、碘原子。這些中，優選氟原子、氯原子、溴原子。作為環狀有機基團，可舉出環烷基、芳香族烴基、雜環基。作為環烷基的具體例，與Rc1 為環烷基時的優選例同樣。作為芳香族烴基的具體例，可舉出苯基、萘基、聯苯基、蒽基、及菲基等。作為雜環基的具體例，與Rc1 為雜環基時的優選例同樣。Rc1 為烷氧基羰基時，烷氧基羰基中包含的烷氧基可以為直鏈狀，也可以為支鏈狀，優選為直鏈狀。烷氧基羰基中包含的烷氧基的碳原子數優選為1以上且10以下，更優選為1以上且6以下。 鏈狀烷基具有取代基時，取代基的個數沒有特別限制。優選的取代基的個數根據鏈狀烷基的碳原子數而發生變化。取代基的個數典型地為1以上且20以下，優選為1以上且10以下，更優選為1以上且6以下。 Rc2 和Rc3 為環狀有機基團時，環狀有機基團可以是脂環式基團，也可以是芳香族基團。作為環狀有機基團，可舉出脂肪族環狀烴基、芳香族烴基、雜環基。Rc2 和Rc3 為環狀有機基團時，環狀有機基團可以具有的取代基與Rc2 和Rc3 為鏈狀烷基時同樣。 Rc2 及Rc3 為芳香族烴基時，芳香族烴基優選為：苯基、或多個苯環介由碳-碳鍵鍵結而形成的基團、或多個苯環縮合而形成的基團。芳香族烴基為苯基、或多個苯環鍵結或縮合而形成的基團時，芳香族烴基中包含的苯環的環數沒有特別限制，優選為3以下，更優選為2以下，特別優選為1。作為芳香族烴基的優選具體例，可舉出苯基、萘基、聯苯基、蒽基、及菲基等。 Rc2 及Rc3 為脂肪族環狀烴基時，脂肪族環狀烴基可以為單環式也可以為多環式。脂肪族環狀烴基的碳原子數沒有特別限制，優選為3以上且20以下，更優選為3以上且10以下。作為單環式的環狀烴基的例子，可舉出環丙基、環丁基、環戊基、環己基、環庚基、環辛基、降冰片基、異冰片基、三環壬基、三環癸基、四環十二烷基、及金剛烷基等。 Rc2 及Rc3 為雜環基時，雜環基為包含1個以上的N、S、O的五元或六元的單環，或者為所述單環彼此縮合、或所述單環與苯環縮合而成的雜環基。雜環基為稠環時，構成稠環的單環的環數為3以下。雜環基可以為芳香族基團(雜芳基)，也可以為非芳香族基團。作為構成該雜環基的雜環，可舉出呋喃、噻吩、吡咯、噁唑、異噁唑、噻唑、噻二唑、異噻唑、咪唑、吡唑、三唑、吡啶、吡嗪、嘧啶、噠嗪、苯並呋喃、苯並噻吩、吲哚、異吲哚、吲哚嗪、苯並咪唑、苯並三唑、苯並噁唑、苯並噻唑、哢唑、嘌呤、喹啉、異喹啉、喹唑啉、酞嗪、噌啉、喹喔啉、哌啶、哌嗪、嗎啉、哌啶、四氫吡喃、及四氫呋喃等。 Rc2 與Rc3 可以相互鍵結而形成環。包含Rc2 與Rc3 形成的環的基團優選為環烷叉基(cycloalkylidene group)。Rc2 與Rc3 鍵結而形成環烷叉基時，構成環烷叉基的環優選為五元環或六元環，更優選為五元環。 Rc2 與Rc3 鍵結而形成的基團為環烷叉基時，環烷叉基可與1個以上的其他環縮合。作為可與環烷叉基縮合的環的例子，可舉出苯環、萘環、環丁烷環、環戊烷環、環己烷環、環庚烷環、環辛烷環、呋喃環、噻吩環、吡咯環、吡啶環、吡嗪環、及嘧啶環等。 上文中說明的Rc2 和Rc3 中，作為優選的基團的例子，可舉出式-A1 -A2 表示的基團。式中，A1 為直鏈亞烷基，A2 為烷氧基、氰基、鹵素原子、鹵代烷基、環狀有機基團、或烷氧基羰基。 A1 的直鏈亞烷基的碳原子數優選為1以上且10以下，更優選為1以上且6以下。A2 為烷氧基時，烷氧基可以為直鏈狀，也可以為支鏈狀，優選為直鏈狀。烷氧基的碳原子數優選為1以上且10以下，更優選為1以上且6以下。A2 為鹵素原子時，優選為氟原子、氯原子、溴原子、碘原子，更優選為氟原子、氯原子、溴原子。A2 為鹵代烷基時，鹵代烷基中包含的鹵素原子優選為氟原子、氯原子、溴原子、碘原子，更優選為氟原子、氯原子、溴原子。鹵代烷基可以為直鏈狀，也可以為支鏈狀，優選為直鏈狀。A2 為環狀有機基團時，環狀有機基團的例子與Rc2 和Rc3 作為取代基而具有的環狀有機基團同樣。A2 為烷氧基羰基時，烷氧基羰基的例子與Rc2 和Rc3 作為取代基而具有的烷氧基羰基同樣。 作為Rc2 及Rc3 的優選具體例，可舉出乙基、正丙基、正丁基、正己基、正庚基、及正辛基等烷基；2-甲氧基乙基、3-甲氧基正丙基、4-甲氧基正丁基、5-甲氧基正戊基、6-甲氧基正己基、7-甲氧基正庚基、8-甲氧基正辛基、2-乙氧基乙基、3-乙氧基正丙基、4-乙氧基正丁基、5-乙氧基正戊基、6-乙氧基正己基、7-乙氧基正庚基、及8-乙氧基正辛基等烷氧基烷基；2-氰基乙基、3-氰基正丙基、4-氰基正丁基、5-氰基正戊基、6-氰基正己基、7-氰基正庚基、及8-氰基正辛基等氰基烷基；2-苯基乙基、3-苯基正丙基、4-苯基正丁基、5-苯基正戊基、6-苯基正己基、7-苯基正庚基、及8-苯基正辛基等苯基烷基；2-環己基乙基、3-環己基正丙基、4-環己基正丁基、5-環己基正戊基、6-環己基正己基、7-環己基正庚基、8-環己基正辛基、2-環戊基乙基、3-環戊基正丙基、4-環戊基正丁基、5-環戊基正戊基、6-環戊基正己基、7-環戊基正庚基、及8-環戊基正辛基等環烷基烷基；2-甲氧基羰基乙基、3-甲氧基羰基正丙基、4-甲氧基羰基正丁基、5-甲氧基羰基正戊基、6-甲氧基羰基正己基、7-甲氧基羰基正庚基、8-甲氧基羰基正辛基、2-乙氧基羰基乙基、3-乙氧基羰基正丙基、4-乙氧基羰基正丁基、5-乙氧基羰基正戊基、6-乙氧基羰基正己基、7-乙氧基羰基正庚基、及8-乙氧基羰基正辛基等烷氧基羰基烷基；2-氯乙基、3-氯正丙基、4-氯正丁基、5-氯正戊基、6-氯正己基、7-氯正庚基、8-氯正辛基、2-溴乙基、3-溴正丙基、4-溴正丁基、5-溴正戊基、6-溴正己基、7-溴正庚基、8-溴正辛基、3,3,3-三氟丙基、及3,3,4,4,5,5,5-七氟正戊基等鹵代烷基。 作為Rc2 和Rc3 ，上述中優選的基團為乙基、正丙基、正丁基、正戊基、2-甲氧基乙基、2-氰基乙基、2-苯基乙基、2-環己基乙基、2-甲氧基羰基乙基、2-氯乙基、2-溴乙基、3,3,3-三氟丙基、及3,3,4,4,5,5,5-七氟正戊基。 作為Rc4 的優選的有機基團的例子，與Rc1 同樣，可舉出烷基、烷氧基、環烷基、環烷氧基、飽和脂肪族醯基、烷氧基羰基、飽和脂肪族醯基氧基、可具有取代基的苯基、可具有取代基的苯氧基、可具有取代基的苯甲醯基、可具有取代基的苯氧基羰基、可具有取代基的苯甲醯基氧基、可具有取代基的苯基烷基、可具有取代基的萘基、可具有取代基的萘氧基、可具有取代基的萘甲醯基、可具有取代基的萘氧基羰基、可具有取代基的萘甲醯基氧基、可具有取代基的萘基烷基、可具有取代基的雜環基、可具有取代基的雜環基羰基、被1個或2個有機基團取代的氨基、嗎啉-1-基、及哌嗪-1-基等。這些基團的具體例與針對Rc1 的說明同樣。另外，作為Rc4 ，還優選環烷基烷基、可在芳香環上具有取代基的苯氧基烷基、可在芳香環上具有取代基的苯基硫基烷基。苯氧基烷基、及苯基硫基烷基可以具有的取代基與Rc1 中包含的苯基可以具有的取代基同樣。 有機基團中，作為Rc4 ，優選烷基、環烷基、可具有取代基的苯基或環烷基烷基、可在芳香環上具有取代基的苯基硫基烷基。作為烷基，優選為碳原子數1以上且20以下的烷基，更優選為碳原子數1以上且8以下的烷基，特別優選為碳原子數1以上且4以下的烷基，最優選為甲基。可具有取代基的苯基中，優選甲基苯基，更優選2-甲基苯基。環烷基烷基中包含的環烷基的碳原子數優選為5以上且10以下，更優選為5以上且8以下，特別優選為5或6。環烷基烷基中包含的亞烷基的碳原子數優選為1以上且8以下，更優選為1以上且4以下，特別優選為2。環烷基烷基中，優選環戊基乙基。可在芳香環上具有取代基的苯基硫基烷基中包含的亞烷基的碳原子數優選為1以上且8以下，更優選為1以上且4以下，特別優選為2。可在芳香環上具有取代基的苯基硫基烷基中，優選2-(4-氯苯基硫基)乙基。 另外，作為Rc4 ，還優選-A3 -CO-O-A4 表示的基團。A3 為二價有機基團，優選為二價烴基，優選為亞烷基。A4 為一價有機基團，優選為一價烴基。 A3 為亞烷基時，亞烷基可以為直鏈狀，也可以為支鏈狀，優選為直鏈狀。A3 為亞烷基時，亞烷基的碳原子數優選為1以上且10以下，更優選為1以上且6以下，特別優選為1以上且4以下。 作為A4 的優選例，可舉出碳原子數1以上且10以下的烷基、碳原子數7以上且20以下的芳烷基、以及碳原子數6以上且20以下的芳香族烴基。作為A4 的優選具體例，可舉出甲基、乙基、正丙基、異丙基、正丁基、異丁基、仲丁基、叔丁基、正戊基、正己基、苯基、萘基、苄基、苯乙基、α-萘基甲基、及β-萘基甲基等。 作為-A3 -CO-O-A4 表示的基團的優選具體例，可舉出2-甲氧基羰基乙基、2-乙氧基羰基乙基、2-正丙基氧基羰基乙基、2-正丁基氧基羰基乙基、2-正戊基氧基羰基乙基、2-正己基氧基羰基乙基、2-苄基氧基羰基乙基、2-苯氧基羰基乙基、3-甲氧基羰基正丙基、3-乙氧基羰基正丙基、3-正丙基氧基羰基正丙基、3-正丁基氧基羰基正丙基、3-正戊基氧基羰基正丙基、3-正己基氧基羰基正丙基、3-苄基氧基羰基正丙基、及3-苯氧基羰基正丙基等。 以上，對Rc4 進行了說明，作為Rc4 ，優選下述式(1a)或下述式(1b)表示的基團。 (式(1a)及式(1b)中，Rc7 及Rc8 各自為有機基團，n3為0以上且4以下的整數，Rc7 及Rc8 存在於苯環上的相鄰位置時，Rc7 與Rc8 可以彼此鍵結而形成環，n4為1以上且8以下的整數，n5為1以上且5以下的整數，n6為0以上且(n5+3)以下的整數，Rc9 為有機基團。) 式(1a)中的Rc7 及Rc8 有關的有機基團的例子與Rc1 同樣。作為Rc7 ，優選烷基或苯基。Rc7 為烷基時，其碳原子數優選為1以上且10以下，更優選為1以上且5以下，特別優選為1以上且3以下，最優選為1。即，Rc7 最優選為甲基。Rc7 與Rc8 鍵結而形成環時，該環可以為芳香族環，也可以為脂肪族環。作為Rc7 與Rc8 形成了環的由式(1a)表示的基團的優選例，可舉出萘-1-基、1,2,3,4-四氫萘-5-基等。上述式(1a)中，n3為0以上且4以下的整數，優選為0或1,更優選為0。 上述式(1b)中，Rc9 為有機基團。作為有機基團，可舉出與針對Rc1 而說明的有機基團同樣的基團。有機基團中，優選烷基。烷基可以為直鏈狀，也可以為支鏈狀。烷基的碳原子數優選為1以上且10以下，更優選為1以上且5以下，特別優選為1以上且3以下。作為Rc9 ，可優選示例甲基、乙基、丙基、異丙基、丁基等，這些之中，更優選甲基。 上述式(1b)中，n5為1以上且5以下的整數，優選為1以上且3以下的整數,更優選為1或2。上述式(1b)中，n6為0以上且(n5+3)以下，優選為0以上且3以下的整數,更優選為0以上且2以下的整數，特別優選為0。上述式(1b)中，n4為1以上且8以下的整數，優選為1以上且5以下的整數,更優選為1以上且3以下的整數，特別優選為1或2。 式(1)中，Rc5 為氫原子、可具有取代基的碳原子數1以上且11以下的烷基、或者可具有取代基的芳基。作為Rc5 為烷基時可具有的取代基，可優選示例苯基、萘基等。另外，作為Rc1 為芳基時可具有的取代基，可優選示例碳原子數1以上且5以下的烷基、烷氧基、鹵素原子等。 式(1)中，作為Rc5 ，可優選示例氫原子、甲基、乙基、正丙基、異丙基、正丁基、苯基、苄基、甲基苯基、萘基等，這些之中，更優選甲基或苯基。 作為式(1)表示的化合物的優選具體例，可舉出以下的PI-1～PI-41。 作為光聚合引發劑(C)，也可以使用上述式(1)表示的化合物以外的其他光聚合引發劑。其他光聚合引發劑可以單獨使用，也可以與上述式(1)表示的化合物組合使用。作為其他光聚合引發劑，只要是不屬於上述式(1)表示的化合物的光聚合引發劑即可，沒有特別限定。 作為其他光聚合引發劑的優選例，可示例：2-(苯甲醯基氧基亞氨基)-1-[4-(苯硫基)苯基]-1-辛酮(例如，作為OXE-01(BASF公司製)被市售。)、及O-乙醯基-1-[6-(2-甲基苯甲醯基)-9-乙基-9H-哢唑-3-基]乙酮肟(例如，作為OXE-02(BASF公司製)被市售。)等具有不屬於上述式(C1)的結構的肟酯化合物；2-苄基-2-二甲基氨基-1-(4-嗎啉代苯基)丁烷-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉代丙烷-1-酮、2-苄基-2-二甲基氨基-1-(4-二甲基氨基苯基)丁烷-1-酮、2-(4-甲基苄基)-2-二乙基氨基-1-(4-嗎啉代苯基)丁烷-1-酮、2-甲基-1-苯基-2-嗎啉代丙烷-1-酮、2-甲基-1-[4-(己基)苯基]-2-嗎啉代丙烷-1-酮、2-乙基-2-二甲基氨基-1-(4-嗎啉代苯基)丁烷-1-酮等α-氨基酮系化合物；1-苯基-2-羥基-2-甲基丙烷-1-酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、4-(2-羥基乙氧基)苯基-(2-羥基-2-丙基)酮、1-羥基環己基苯基酮等α-羥基酮系光聚合引發劑；苯偶姻、苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻丙基醚、苄基甲基縮酮等苯偶姻系光聚合引發劑；二苯甲酮、苯甲醯基苯甲酸、苯甲醯基苯甲酸甲酯、4-苯基二苯甲酮、羥基二苯甲酮、丙烯酸化二苯甲酮、4-苯甲醯、4’-甲基二苯基硫醚、4,4’-雙二乙基氨基二苯甲酮等二苯甲酮系光聚合引發劑；噻噸酮、2-氯噻噸酮、2-甲基噻噸酮、異丙基噻噸酮、2,4-二異丙基噻噸酮等噻噸酮系光聚合引發劑；2,4,6-三氯均三嗪、2-苯基-4,6-雙(三氯甲基)均三嗪、2-(對甲氧基苯基)-4,6-雙(三氯甲基)均三嗪、2-(對甲苯基)-4,6-雙(三氯甲基)均三嗪、2-胡椒基(pipenyl)-4,6-雙(三氯甲基)均三嗪、2,4-雙(三氯甲基)-6-苯乙烯基均三嗪、2-(萘-1-基)-4,6-雙(三氯甲基)均三嗪、2-(4-甲氧基-萘-1-基)-4,6-雙(三氯甲基)均三嗪、2,4-三氯甲基-(胡椒基)-6-三嗪、2,4-三氯甲基-(4’-甲氧基苯乙烯基)-6-三嗪、2-[4-(4-甲氧基苯乙烯基)苯基]-4,6-雙(三氯甲基)-1,3,5-三嗪等三嗪系光聚合引發劑；哢唑系光聚合引發劑；2,2’-雙(2-氯苯基)-4,4’,5,5’-四(4-乙氧基羰基苯基)-1,2’-聯咪唑、2,2’-雙(2-溴苯基)-4,4’,5,5’-四(4-乙氧基羰基苯基)-1,2’-聯咪唑、2,2’-雙(2-氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑、2,2’-雙(2,4-二氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑、2,2’-雙(2,4,6-三氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑、2,2’-雙(2-溴苯基)-4,4,5,5’-四苯基-1,2’-聯咪唑、2,2’-雙(2,4-二溴苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑、2,2’-雙(2,4,6-三溴苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑等聯咪唑系光聚合引發劑；下述式表示的這樣的苯並咪唑啉系光聚合引發劑；等等。 作為其他光聚合引發劑的優選具體例，可舉出以下的化合物。 使用上述式(1)表示的化合物作為光聚合引發劑(C)的情況下，上述式(1)表示的化合物的質量相對於光聚合引發劑(C)的質量而言的比率在不損害本發明目的的範圍內沒有特別限定。相對於光聚合引發劑(C)的質量而言的、上述式(1)表示的化合物的比率優選為50質量%以上,更優選為70質量%以上，進一步優選為80質量%以上，更進一步優選為90質量%以上，特別優選為100質量%。 相對於感光性組合物的固態成分整體的質量而言，光聚合引發劑(C)的含量優選為0.1質量%以上且30質量%以下，更優選為0.5質量%以上且20質量%以下。通過使光聚合引發劑(C)的含量成為上述的範圍，能夠得到固化性良好、不易產生圖案形狀不良的感光性組合物。 ＜有機溶劑(S)＞ 典型地，感光性組合物可以出於調節塗布性的目的等而包含有機溶劑(S)。作為有機溶劑(S)，例如可舉出乙二醇單甲基醚、乙二醇單乙基醚、乙二醇正丙基醚、乙二醇單正丁基醚、二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇單正丙基醚、二乙二醇單正丁基醚、三乙二醇單甲基醚、三乙二醇單乙基醚、丙二醇單甲基醚、丙二醇單乙基醚、丙二醇單正丙基醚、丙二醇單正丁基醚、二丙二醇單甲基醚、二丙二醇單乙基醚、二丙二醇單正丙基醚、二丙二醇單正丁基醚、三丙二醇單甲基醚、三丙二醇單乙基醚等(聚)亞烷基二醇單烷基醚類；乙二醇單甲基醚乙酸酯、乙二醇單乙基醚乙酸酯、二乙二醇單甲基醚乙酸酯、二乙二醇單乙基醚乙酸酯、丙二醇單甲基醚乙酸酯、丙二醇單乙基醚乙酸酯等(聚)亞烷基二醇單烷基醚乙酸酯類；二乙二醇二甲基醚、二乙二醇甲基乙基醚、二乙二醇二乙基醚、四氫呋喃等其他醚類；甲基乙基酮、環己酮、2-庚酮、3-庚酮等酮類；2-羥基丙酸甲酯、2-羥基丙酸乙酯等乳酸烷基酯類；2-羥基-2-甲基丙酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、乙氧基乙酸乙酯、羥基乙酸乙酯、2-羥基-3-甲基丁酸甲酯、乙酸3-甲氧基丁酯、乙酸3-甲基-3-甲氧基丁酯、丙酸3-甲基-3-甲氧基丁酯、乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸異丁酯、甲酸正戊酯、乙酸異戊酯、丙酸正丁酯、丁酸乙酯、丁酸正丙酯、丁酸異丙酯、丁酸正丁酯、丙酮酸甲酯、丙酮酸乙酯、丙酮酸正丙酯、乙醯乙酸甲酯、乙醯乙酸乙酯、2-氧代丁酸乙酯等其他酯類；甲苯、二甲苯等芳香族烴類；N-甲基吡咯烷酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺等醯胺類等。這些溶劑可以單獨使用，也可以組合兩種以上而使用。 有機溶劑(S)的使用量可根據感光性組合物的用途而適當確定。作為有機溶劑(S)的使用量，作為一例，可舉出感光性組合物的固態成分濃度為1質量%以上且50質量%以下的範圍的量。 ＜其他成分＞ 感光性組合物中，可根據需要包含除上述以外的其他各種添加劑。具體而言，可示例分散助劑、填充劑、填料、密合促進劑、抗氧化劑、紫外線吸收劑、抗凝集劑、熱阻聚劑、消泡劑、表面活性劑等。 作為感光性組合物中使用的熱阻聚劑，例如，可舉出對苯二酚、對苯二酚單乙基醚等。另外，分別地，作為消泡劑，可示例有機矽系、氟系等的化合物，作為表面活性劑，可示例陰離子系、陽離子系、非離子等的化合物。 ＜感光性組合物的製備方法＞ 感光性組合物可通過將各自所期望量的上述各成分均勻地混合而製備。需要說明的是，製備的感光性組合物不含顏料等不溶性的成分的情況下，可以使用過濾器進行過濾以使感光性組合物變均勻。 ≪固化物的製造方法≫ 典型地，以上說明的感光性組合物通過包括下述步驟的方法而製成固化物： 將感光性組合物根據固化物的形狀來進行成型的步驟；和 對經成型的感光性組合物進行曝光的步驟。 由上述的方法製造的固化物顯示出優選2.86以下、更優選2.84以下、進一步優選2.80以下、特別優選2.77以下的相對介電常數。另外，製造的固化物的透明性高，因此在OLED、有機EL或液晶等顯示裝置的用途中有用，可合適地用於平坦化膜、層間絕緣膜、濾色器用保護膜、用於使液晶顯示裝置中的液晶層的厚度保持恒定的間隔件、或固體攝像元件中的微透鏡等。 將感光性組合物成型的方法沒有特別限定，可根據固化物的形狀進行適當選擇。作為固化物的形狀，可舉出膜形狀、透鏡形狀、線形狀、棱鏡形狀等，但不限於這些。這些形狀中，優選膜形狀。 作為將感光性組合物成型的方法，沒有特別限定。在固化物的形狀為透鏡形狀、棱鏡形狀等的情況下，可以使用刮板等，將感光性組合物填充於與固化物的形狀相符合的鑄模中。 固化物的形狀為線形狀等的情況下，可以根據固化物的形狀將感光性組合物塗布於基材上。作為塗布方法，例如，可舉出噴墨法等印刷法。 作為將感光性組合物塗布為膜形狀的方法，可舉出使用輥塗機、逆向塗布機、棒塗機等接觸轉印型塗布裝置、旋轉器(旋轉式塗布裝置)、幕流式塗布機等非接觸型塗布裝置的方法。另外，也可以利用噴墨法等印刷法將感光性組合物塗布為膜形狀。 使用上述的感光性組合物時，即使基材的被塗布面具有高低差，也能夠追隨高低差而形成膜厚均勻的塗布膜。 作為塗布膜的厚度，沒有特別限定。作為塗布膜的厚度，優選為0.05μm以上,更優選為1μm以上。塗布膜的厚度例如可以為7μm以上，可以為10μm以上。塗布膜的厚度的上限沒有特別限定，例如可以為50μm以下，可以為20μm以下。塗布膜的厚度優選為10μm以下，更優選為5μm以下，進一步優選為2μm以下。 塗布膜的厚度的範圍優選為0.05μm以上且10μm以下，更優選為1μm以上且5μm以下，進一步優選為1μm以上且2μm以下。 接著，根據需要使塗布膜乾燥。乾燥方法沒有特別限定。作為乾燥方法，例如，可舉出：(1)利用加熱板，於80℃以上且120℃以下、優選90℃以上且100℃以下的溫度，乾燥60秒以上且120秒以下的時間的方法；(2)於室溫放置數小時至數天的方法；(3)放入溫風加熱器、紅外線加熱器中數十分鐘至數小時而除去溶劑的方法；等等。 通過對該塗布膜進行曝光，從而可形成固化膜。 曝光中，光源沒有特別限定，例如，可舉出高壓汞燈、超高壓汞燈、氙燈、碳弧燈、LED等。可以使用這樣的光源對塗布膜照射ArF準分子鐳射、KrF準分子鐳射、F2 準分子鐳射、遠紫外線(EUV)、真空紫外線(VUV)、電子束、X射線、軟X射線、g線、i線、h線、j線、k線等放射線、或電磁波，從而對塗布膜進行曝光。 曝光量根據感光性組合物的組成的不同而不同，例如優選為10mJ/cm2 以上且2000mJ/cm2 以下，更優選為100mJ/cm2 以上且1500mJ/cm2 以下，進一步優選為200mJ/cm2 以上且1200mJ/cm2 以下。曝光照度也根據感光性組合物的組成的不同而不同，優選在1mW/cm2 以上且50mW/cm2 以下的範圍內。 可以對通過曝光而固化的固化膜進行加熱。進行加熱時的溫度沒有特別限定，優選為180℃以上且280℃以下，更優選為200℃以上且260℃以下，特別優選為220℃以上且250℃以下。加熱時間典型地優選為1分鐘以上且60分鐘以下，更優選為10分鐘以上且50分鐘以下，特別優選為20分鐘以上且40分鐘以下。 另一方面，可以位置選擇性地對塗布膜進行曝光。該情況下，針對塗布膜，隔著具有與固化膜的圖案形狀相對應的形狀的透光部的負型掩模，位置選擇性地進行曝光。 除了使用負型掩模以外，曝光方法與上述的曝光方法同樣。 接著，利用顯影液將經曝光的塗布膜顯影，由此形成經圖案化的固化膜。顯影方法沒有特別限定，例如，可以使用浸漬法、噴霧法等。作為顯影液，可舉出單乙醇胺、二乙醇胺、三乙醇胺等有機系的顯影液、氫氧化鈉、氫氧化鉀、碳酸鈉、氨、季銨鹽等的水溶液。 針對顯影後得到的經圖案化的固化膜，可以與對上述的經圖案化的塗布膜實施曝光方法的方法同樣地進行加熱。 實施例 以下，利用實施例更詳細地說明本發明，但本發明並不限於這些實施例。 〔實施例1～6、及比較例1～4〕 實施例及比較例中，將下述結構的丙烯酸系樹脂P1～P3、及下述結構的丙烯酸系樹脂P4用作鹼溶性樹脂(A)。樹脂P1之按照聚苯乙烯換算的重量平均分子量為12000。樹脂P2之按照聚苯乙烯換算的重量平均分子量為10000。樹脂P3之按照聚苯乙烯換算的重量平均分子量為8000。樹脂P4之按照聚苯乙烯換算的重量平均分子量為10000。 實施例及比較例中，作為光聚合性化合物(B)，使用以下的B-1～B-3。 B-1：二季戊四醇六丙烯酸酯 B-2：三羥甲基丙烷三丙烯酸酯 B-3：雙三羥甲基丙烷四丙烯酸酯 實施例及比較例中，作為光聚合引發劑(C)，使用以下的C-1。 將表1中記載的種類的鹼溶性樹脂(A)((A)成分)13.73質量份、表1中記載的種類的光聚合性化合物(B)((B)成分)6.8質量份、表1中記載的種類的光聚合性化合物(C) ((C)成分)1.22質量份、二乙二醇甲基乙基醚31.2質量份、丙二醇單甲基醚乙酸酯46.7質量份、3-環氧丙氧基丙基三甲氧基矽烷0.2質量份、表面活性劑(BYK-310，BYK-Chemie公司製)0.05質量份、及抗氧化劑(IR1010，BASF Japan公司製)0.1質量份進行混合，得到各實施例及各比較例的感光性組合物。 使用得到的感光性組合物，按照以下的方法，對相對介電常數及圖案形成性進行評價。將此等之評價結果記載於表1。 ＜相對介電常數測定＞ 作為相對介電常數的測定方法，利用汞探針法。能夠利用汞探針法進行相對介電常數測定的裝置，使用SSM-495(日本Semilab公司製)。通過以下的步驟1)～4)，使用各實施例及比較例的固化性組合物，形成膜厚為1μm的膜狀固化物。然後，針對形成的固化物，測定相對介電常數。 1)在矽晶片上塗布固化組合物而形成塗布膜。 2)於100℃對形成的塗布膜加熱120秒。 3)以1J/cm2 的曝光量對塗布膜進行曝光。 4)以230℃對經曝光的塗布膜加熱20分鐘。 ＜保形性評價＞ 在局部地形成有厚度為5μm(圖1中的W)之構造物的玻璃基板(680×880mm)上，將所製備的非旋轉式塗布用組合物，使用狹縫塗布機(TR-45000；東京應化工業公司製)，以120mm/秒的塗布速度塗布各實施例及各比較例的感光性組合物後，以100℃乾燥100秒，得到塗布膜。接著，使用鏡面投影對準曝光器(製品名：MPA-6000，Canon公司製)，以100mJ/cm2 的曝光量進行整面曝光。接著，將23℃之0.04質量%KOH水溶液噴霧70秒，進行顯影。然後，以230℃進行20分鐘燒成處理(後烘烤)，如圖1的截面圖所示，得到由基板上的最大膜厚(X；包括基板上的構造物的厚度(W))與基板上的構造物的厚度(W)之差(X-W)表示的膜厚為約2.4μm的膜。 針對所得之後烘烤後之膜的截面，如圖1之截面圖所示，測定基板上的最大膜厚(X；包括基板上的構造物的厚度(W))與基板上的最小膜厚(Y)之差(X-Y=Z)。 將塗布速度為120mm/秒時的Z小於2的情況評價為保形性差(×)，將為2以上且2.4以下的情況評價為保形性良好(〇)，將超過2.4的情況評價為保形性特別優異(◎)。 根據表1可知，若為包含下述丙烯酸系樹脂作為鹼溶性樹脂(A)之實施例的感光性組合物時，能夠形成相對介電常數低的固化物，並且能夠在具有高低差的基板上形成保形性良好的塗布膜，前述丙烯酸系樹脂包含相對於全部結構單元的量而言為20質量%以上之來自(甲基)丙烯酸多環烷基酯的結構單元(A-1)，且重量平均分子量為9,000以上。 另一方面，在使用包含下述丙烯酸系樹脂作為鹼溶性樹脂(A)之比較例的感光性組合物的情況，難以同時實現形成相對介電常數低的固化物及形成具有高低差之基板上的保形性良好的塗布膜，前述丙烯酸系樹脂的重量平均分子量小於9,000、或者僅包含小於20質量%(相對於全部結構單元的量而言)之來自(甲基)丙烯酸多環烷基酯的結構單元(A-1)。≪Photosensitive composition≫ The photosensitive composition includes an alkali-soluble resin (A), a photopolymerizable compound (B), and a photopolymerization initiator (C). The alkali-soluble resin (A) includes the following acrylic resin, wherein the acrylic resin includes 20% by mass or more of a structural unit (A-1) derived from a (meth)acrylic acid polycycloalkyl ester. The weight average molecular weight of the above-mentioned acrylic resin is 9,000 or more. By making the photosensitive composition contain the above-mentioned alkali-soluble resin (A), a photosensitive composition can be obtained that can form a cured product with a relatively low dielectric constant and can form a coating film with good conformal properties on a substrate with a height difference. Below, the necessary or optional components contained in the photosensitive composition and the method for producing the photosensitive composition are explained in turn. <Alkali-soluble resin (A)> The photosensitive composition contains an alkali-soluble resin (A). As described above, the alkali-soluble resin (A) contains the following acrylic resin, wherein the acrylic resin contains more than 20% by mass of a structural unit (a-1) derived from a (meth)polycycloalkyl acrylate. The weight average molecular weight of the above-mentioned acrylic resin is more than 9,000. It should be noted that in the specification and patent scope of this application, the weight average molecular weight is the weight average molecular weight converted to polystyrene and measured by gel penetration chromatography. Here, in this specification, the so-called alkali-soluble resin (A) refers to a resin having an alkali-soluble functional group (for example, a phenolic hydroxyl group, a carboxyl group, a sulfonic acid group, etc.) in the molecule. The alkali-soluble resin (A) may contain the above-mentioned specific acrylic resin and other resins other than the above-mentioned specific acrylic resin within the scope that does not impair the purpose of the present invention. Hereinafter, an acrylic resin containing more than 20 mass% of structural units (a-1) derived from polycycloalkyl (meth)acrylate and having a weight average molecular weight of more than 9,000 is recorded as "acrylic resin (aI)". Typically, the ratio of the mass of the acrylic resin (aI) to the total mass of the alkali-soluble resin (A) is preferably 70 mass% or more, more preferably 80 mass% or more, further preferably 90 mass% or more, further preferably 95 mass% or more, and particularly preferably 100 mass%. As the acrylic resin (aI), a resin containing a structural unit derived from (meth)acrylic acid and/or a structural unit derived from other monomers such as (meth)acrylate can be used. (Meth)acrylic acid is acrylic acid or methacrylic acid. As other monomers, typically, a compound represented by the following formula (aI-1) is preferably used. In the above formula (aI-1), RA1 is a hydrogen atom or a methyl group. RA2 is a monovalent organic group. The organic group may contain a bond or a substituent other than a alkyl group such as a heteroatom. In addition, the organic group may be in a linear, branched, or cyclic shape. RA3 is a group represented by -O- or -NR A4 -. RA4 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. The substituent other than the alkyl group in the organic group of RA2 is not particularly limited as long as the effects of the present invention are not impaired, and examples thereof include a halogen atom, a hydroxyl group, a hydroxyl group, a thioether group, a cyano group, an isocyano group, a cyanate group, an isocyanate group, a thiocyanate group, an isothiocyanate group, a silyl group, a silanol group, an alkoxy group, an alkoxycarbonyl group, a carbamoyl group, a thiocarbamoyl group, a nitro group, a nitroso group, a carboxyl group, a carboxylate/ester group, an acyl group, an acyloxy group, a sulfinyl group, a sulfonate/ester group, a phosphine group, a phosphinyl group, a phosphonate/ester group, a hydroxyimino group, an alkyl ether group, an alkyl thioether group, an aryl ether group, an aryl thioether group, an amino group (-NH2 ) , -NHR, -NRR': R and R' each independently represent a alkyl group) and the like. The hydrogen atom contained in the above-mentioned substituent may be substituted by a alkyl group. In addition, the alkyl group contained in the above-mentioned substituent may be any of a linear, branched, and cyclic shape. In addition, the organic group as RA2 may have reactive functional groups such as acryloxy, methacryloxy, epoxy, and cyclobutyl. Acyl groups having unsaturated double bonds such as acryloxy and methacryloxy can be produced, for example, by reacting unsaturated carboxylic acids such as acrylic acid and methacrylic acid with at least a portion of the epoxy groups in an acrylic resin (aI) containing a structural unit having an epoxy group. After the unsaturated carboxylic acid is reacted with at least a part of the epoxy groups, a polybasic acid anhydride may be reacted with the group generated by the reaction. Specific examples of the polybasic acid anhydride include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, 3-methylhexahydrophthalic anhydride, and 1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1,2-dihydro-1 Phthalic anhydride, 4-methylhexahydrophthalic anhydride, 3-ethylhexahydrophthalic anhydride, 4-ethylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, 3-methyltetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, 3-ethyltetrahydrophthalic anhydride, and 4-ethyltetrahydrophthalic anhydride. As a specific example, when acrylic acid and a structural unit derived from glycidyl methacrylate are reacted, a structural unit having a hydroxyl group as shown in the following reaction formula is generated. By reacting a polybasic acid anhydride such as tetrahydrophthalic acid with the structural unit having a hydroxyl group, a structural unit having a carboxyl group and an unsaturated double bond and imparting alkaline solubility to the resin is generated. In addition, by reacting a compound having an epoxy group and an unsaturated double bond with a structural unit derived from an unsaturated carboxylic acid such as acrylic acid or methacrylic acid contained in the acrylic resin (aI), an unsaturated double bond can be introduced into the acrylic resin (aI). As the compound having an epoxy group and an unsaturated double bond, for example, glycidyl (meth)acrylate and compounds represented by formulas (aI-1a) to (aI-1o) described below can be used. As RA2 , an alkyl group, an aryl group, a cycloalkyl group, a polycycloalkyl group, a cycloalkylalkyl group, a polycycloalkylalkyl group, an aralkyl group, or a heterocyclic group is preferred. These groups may be substituted with a halogen atom, a hydroxyl group, an alkyl group, or a heterocyclic group, and may be bonded to an oxygen atom to form an epoxide group. In addition, when these groups contain an alkylene moiety, the alkylene moiety may be interrupted by an ether bond, a thioether bond, or an ester bond. When the alkyl group is linear or branched, the number of carbon atoms is preferably 1 or more and 20 or less, more preferably 1 or more and 15 or less, and particularly preferably 1 or more and 10 or less. Examples of suitable alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, sec-pentyl, tert-pentyl, n-hexyl, n-heptyl, n-octyl, iso-octyl, sec-octyl, tert-octyl, n-nonyl, iso-nonyl, n-decyl, iso-decyl, etc. Examples of suitable alkyl groups include cyclopentyl, monocyclic alicyclic groups such as cyclohexyl, adamantyl, norbornyl, isobornyl, tricyclic nonyl, Polycyclic alkyl groups such as tricyclodecyl, tetracyclododecyl, bicyclo-[2.1.1]-hexyl, bicyclo-[2.2.1]-heptyl, bicyclo-[2.2.2]-octyl, bicyclo-[3.3.0]-octyl, bicyclo-[4.3.0]-nonyl, and bicyclo-[4.4.0]-decyl. Preferred examples of the compound represented by formula (aI-1) and having a cycloalkyl group, a polycycloalkyl group, a cycloalkylalkyl group, a polycycloalkylalkyl group, and a group containing an alicyclic group other than these groups as RA2 include compounds represented by the following formulas (aI-1a) to (aI-1h). Among these, compounds represented by the following formulae (aI-1c) to (aI-1h) are preferred in order to obtain a moderate developing property, and compounds represented by the following formula (aI-1c) or (aI-1d) are more preferred. In the above formula, Ra20 represents a hydrogen atom or a methyl group, Ra21 represents a single bond or a divalent aliphatic saturated alkyl group having 1 to 6 carbon atoms, and Ra22 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. Ra21 is preferably a single bond, a linear or branched alkylene group, such as a methylene group, an ethylene group, a propylene group, a 1,4-butylene group, an ethylethylene group, a 1,5-pentylene group, and a 1,6-hexylene group. Ra22 is preferably a methyl group or an ethyl group. The alkali-soluble resin (A) contains an acrylic resin containing a structural unit (a-1) derived from a polycyclic alkyl (meth)acrylate. The amount of the structural unit (a-1) in the acrylic resin is 20% by mass or more relative to the amount of all structural units. Thus, a photosensitive composition can be obtained that can form a cured product with a relatively low dielectric constant and can form a coating film with good conformality on a substrate with a height difference. That is, the acrylic resin preferably contains a structural unit from the following compound, which is represented by any one of the above formulas (aI-1c) to (aI-1h) and has a single bond as R a21 . From the perspective of being particularly easy to form a cured product with a low dielectric constant, the acrylic resin more preferably contains a structural unit from the following compound as the structural unit (A-1), which is represented by formula (aI-1c), formula (aI-1d) or formula (aI-1g) and has a single bond as R a21 . As described above, the amount of the structural unit (A-1) in the acrylic resin is 20% by mass or more, more preferably 20% by mass or more and 40% by mass or less, and further preferably 22% by mass or more and 35% by mass or less relative to the amount of all structural units. Specific examples of the compound represented by formula (aI-1) when the compound represented by formula (aI-1) has a chain group having an epoxy group as R a10 include (meth)acrylate epoxyalkyl esters such as glycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, and 6,7-epoxyheptyl (meth)acrylate. In addition, the compound represented by formula (aI-1) may be a (meth)acrylate containing an alicyclic epoxy group. The alicyclic group constituting the alicyclic epoxy group may be monocyclic or polycyclic. As the monocyclic alicyclic group, cycloalkyl groups such as cyclopentyl and cyclohexyl can be cited. In addition, as the polycyclic alicyclic group, polycyclic alkyl groups such as norbornyl, isobornyl, tricyclic nonyl, tricyclic decyl, and tetracyclic dodecyl can be cited. From the perspective of easily forming a cured product with a low dielectric constant, the alkali-soluble resin (A) preferably includes a structural unit (A-2) from a (meth) acrylate containing an alicyclic epoxy group. Specific examples of compounds represented by formula (aI-1) when they are (meth)acrylates containing an alicyclic epoxy group include compounds represented by the following formulas (aI-1i) to (aI-1w). Among these, compounds represented by the following formulas (aI-1i) to (aI-1m) are preferred in order to achieve moderate developing properties, and compounds represented by the following formulas (aI-1i) to (aI-1k) are more preferred. In the above formula, Ra23 represents a hydrogen atom or a methyl group, Ra24 represents a divalent aliphatic saturated alkyl group having 1 to 6 carbon atoms, Ra25 represents a divalent alkyl group having 1 to 10 carbon atoms, and t represents an integer of 0 to 10. Ra24 is preferably a linear or branched alkylene group, such as a methylene group, an ethylene group, a propylene group, a 1,4-butylene group, an ethylethylene group, a 1,5-pentylene group, and a 1,6-hexylene group. Ra25 is preferably a methylene group, an ethylene group, a propylene group, a 1,4-butylene group, an ethylethylene group, a 1,5-pentylene group, and a 1,6-hexylene group, a phenylene group, a cyclohexylene group, and -CH2 -Ph -CH2- (Ph represents a phenylene group). The amount of the structural unit (A-2) derived from a (meth)acrylate containing an alicyclic epoxy group in the acrylic resin (aI) is not particularly limited within the range not impairing the purpose of the present invention, and is preferably 30% by mass or more and 70% by mass or less. When such a resin is used, a self-reaction between the carboxyl group contained in the resin and the alicyclic epoxy group may occur. Therefore, when a photosensitive composition containing such a resin is used, a method of heating the film can be used to cause a self-reaction between the carboxyl group and the alicyclic epoxy group, thereby improving the mechanical properties such as the hardness of the formed film. In addition, the acrylic resin (aI) may also be a resin obtained by polymerizing a monomer other than a (meth)acrylate. Examples of such monomers include (meth)acrylamides, unsaturated carboxylic acids, allyl compounds, vinyl ethers, vinyl esters, styrenes, and the like. These monomers may be used alone or in combination of two or more. Examples of (meth)acrylamides include (meth)acrylamides, N-alkyl (meth)acrylamides, N-aryl (meth)acrylamides, N,N-dialkyl (meth)acrylamides, N,N-aryl (meth)acrylamides, N-methyl-N-phenyl (meth)acrylamides, and N-hydroxyethyl-N-methyl (meth)acrylamides. Examples of unsaturated carboxylic acids include monocarboxylic acids such as crotonic acid; dicarboxylic acids such as maleic acid, fumaric acid, citric acid, mesaconic acid, and itaconic acid; anhydrides of these dicarboxylic acids; and the like. As the allyl compound, there can be cited allyl esters such as allyl acetate, allyl caproate, allyl octanoate, allyl laurate, allyl palmitate, allyl stearate, allyl benzoate, allyl acetoacetate, allyl lactate, etc.; allyloxyethanol; and the like. Examples of the vinyl ethers include alkyl vinyl ethers such as hexyl vinyl ether, octyl vinyl ether, decyl vinyl ether, ethylhexyl vinyl ether, methoxyethyl vinyl ether, ethoxyethyl vinyl ether, chloroethyl vinyl ether, 1-methyl-2,2-dimethylpropyl vinyl ether, 2-ethylbutyl vinyl ether, hydroxyethyl vinyl ether, diethylene glycol vinyl ether, dimethylaminoethyl vinyl ether, diethylaminoethyl vinyl ether, butylaminoethyl vinyl ether, benzyl vinyl ether, and tetrahydrofurfuryl vinyl ether; and vinyl aryl ethers such as vinyl phenyl ether, vinyl tolyl ether, vinyl chlorophenyl ether, vinyl-2,4-dichlorophenyl ether, vinyl naphthyl ether, and vinyl anthracenyl ether; and the like. Examples of the vinyl esters include vinyl butyrate, vinyl isobutyrate, vinyl trimethylacetate, vinyl diethylacetate, vinyl valerate, vinyl caproate, vinyl chloroacetate, vinyl dichloroacetate, vinyl methoxyacetate, vinyl butoxyacetate, vinyl phenylacetate, vinyl acetylacetate, vinyl lactate, vinyl β-phenylbutyrate, vinyl benzoate, vinyl salicylate, vinyl chlorobenzoate, vinyl tetrachlorobenzoate, and vinyl naphthoate. Examples of the styrenes include styrene; alkyl styrenes such as methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, isopropyl styrene, butyl styrene, hexyl styrene, cyclohexyl styrene, decyl styrene, benzyl styrene, chloromethyl styrene, trifluoromethyl styrene, ethoxymethyl styrene, and acetyloxymethyl styrene; alkoxy styrenes such as methoxy styrene, 4-methoxy-3-methyl styrene, and dimethoxy styrene; halogenated styrenes such as chlorostyrene, dichlorostyrene, trichlorostyrene, tetrachlorostyrene, pentachlorostyrene, bromostyrene, dibromostyrene, iodostyrene, fluorostyrene, trifluorostyrene, 2-bromo-4-trifluoromethylstyrene, and 4-fluoro-3-trifluoromethylstyrene; and the like. The amount of the structural unit derived from (meth)acrylic acid and the amount of the structural unit derived from other monomers in the acrylic resin (aI) are not particularly limited within the range not impairing the object of the present invention. The amount of the structural unit derived from (meth)acrylic acid in the acrylic resin (aI) is preferably 5% by mass or more and 50% by mass or less, more preferably 10% by mass or more and 30% by mass or less, relative to the total structural units of the acrylic resin (aI). When the acrylic resin (aI) has a structural unit having an unsaturated double bond, the amount of the structural unit having an unsaturated double bond in the acrylic resin (aI) is preferably 1% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 30% by mass or less, and particularly preferably 1% by mass or more and 20% by mass or less, relative to the molar number of the total structural units of the acrylic resin (aI). By making the acrylic resin (aI) contain the structural unit having an unsaturated double bond in an amount within the above range, the acrylic resin can be introduced into the crosslinking reaction in the anti-etching agent film to achieve uniformity, which is effective for improving the heat resistance and mechanical properties of the cured film. The weight average molecular weight of the acrylic resin (aI) is 9000 or more, more preferably 9000 or more and 50000 or less, further preferably 9100 or more and 30000 or less, further preferably 9200 or more and 20000 or less, and particularly preferably 9500 or more and 15000 or less. By using an acrylic resin (aI) having a weight average molecular weight within the above range, a photosensitive composition can be obtained that can form a cured product with a low relative dielectric constant and can form a coating film with good conformality on a substrate having a height difference. The alkali-soluble resin (A) may contain an acrylic resin that does not belong to the above-mentioned acrylic resin (aI) or a resin other than an acrylic resin, within the scope that does not impair the purpose of the present invention. As a suitable resin that can be contained in the alkali-soluble resin (A), a resin having a cardo structure (a-II) (hereinafter, also described as "cardo resin (a-II)") can be cited. When a resin (a-II) having a cardo structure is used as the alkali-soluble resin (A), a photosensitive composition having excellent resolution can be easily obtained, and the photosensitive composition can be easily used to form a cured film that is not prone to excessive flow due to heating. Therefore, a cured film with a good shape can be easily formed. [Resin (a-II) having a cardo structure] As the resin (a-II) having a cardo skeleton, a resin having a cardo skeleton in its structure and having a specified alkali solubility can be used. The so-called cardo skeleton refers to a skeleton formed by bonding the second ring structure and the third ring structure to one ring carbon atom constituting the first ring structure. It should be noted that the second ring structure and the third ring structure may be the same structure or different structures. As a representative example of the cardo skeleton, a skeleton formed by bonding two aromatic rings (e.g., benzene rings) to the carbon atom at position 9 of the fluorene ring can be cited. As the cardo resin (a-II), there is no particular limitation, and conventionally known resins can be used. Among them, the resin represented by the following formula (a-II) is preferred. In the formula (a-1), Xa represents a group represented by the following formula (a-2). m1 represents an integer of 0 or more and 20 or less. In the above formula (a-2), Ra1 each independently represents a hydrogen atom, a alkyl group having 1 to 6 carbon atoms, or a halogen atom, Ra2 each independently represents a hydrogen atom or a methyl group, Ra3 each independently represents a linear or branched alkylene group, m2 represents 0 or 1, and Wa represents a group represented by the following formula (a-3). In formula (a-2), as R a3 , an alkylene group having 1 to 20 carbon atoms is preferred, an alkylene group having 1 to 10 carbon atoms is more preferred, an alkylene group having 1 to 6 carbon atoms is particularly preferred, and ethane-1,2-diyl, propane-1,2-diyl, and propane-1,3-diyl are most preferred. Ring A in formula (a-3) represents an aliphatic ring which may have a substituent and may be condensed with an aromatic ring. The aliphatic ring may be an aliphatic alkyl ring or an aliphatic heterocyclic ring. Examples of the aliphatic ring include monocyclic alkanes, bicyclic alkanes, tricyclic alkanes, tetracyclic alkanes, and the like. Specifically, monocyclic alkanes such as cyclopentane, cyclohexane, cycloheptane, and cyclooctane, adamantane, norbornane, isobornane, tricyclodecane, and tetracyclododecane can be cited. The aromatic ring that can be condensed with the aliphatic ring can be an aromatic hydrocarbon ring or an aromatic heterocyclic ring, and is preferably an aromatic hydrocarbon ring. Specifically, benzene ring and naphthalene ring are preferred. As preferred examples of the divalent group represented by formula (a-3), the following groups can be cited. The divalent group Xa in the formula (a-1) can be introduced into the cardo resin (a-II) by reacting a tetracarboxylic dianhydride which provides a residual group Za with a diol compound represented by the following formula (a-2a). In formula (a-2a), Ra1 , Ra2 , Ra3 , and m2 are as described for formula (a-2). Ring A in formula (a-2a) is as described for formula (a-3). The diol compound represented by formula (a-2a) can be produced, for example, by the following method. First, as needed, the hydrogen atom in the phenolic hydroxyl group of the diol compound represented by the following formula (a-2b) is replaced with a group represented by -Ra3 -OH according to a conventional method, and then glycerylation is performed using epichlorohydrin or the like to obtain an epoxy compound represented by the following formula (a-2c). Then, the epoxy compound represented by formula (a-2c) is reacted with acrylic acid or methacrylic acid to obtain the diol compound represented by formula (a-2a). In formula (a-2b) and formula (a-2c), Ra1 , Ra3 , and m2 are as described for formula (a-2). Ring A in formula (a-2b) and formula (a-2c) is as described for formula (a-3). It should be noted that the method for producing the diol compound represented by formula (a-2a) is not limited to the above method. Preferred examples of the diol compound represented by formula (a-2b) include the following diol compounds. In the above formula (a-1), Ra0 is a hydrogen atom or a group represented by -CO- Ya -COOH. Here, Ya represents a residue obtained by removing anhydride groups (-CO-O-CO-) from dicarboxylic anhydride. Examples of dicarboxylic anhydride include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, chlorendic anhydride, methyltetrahydrophthalic anhydride, glutaric anhydride, and the like. In addition, in the above formula (a-1), Za represents a residue obtained by removing two anhydride groups from tetracarboxylic dianhydride. Examples of tetracarboxylic dianhydride include tetracarboxylic dianhydride represented by the following formula (a-4), pyromellitic dianhydride, benzophenonetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, diphenyl ether tetracarboxylic dianhydride, etc. In the above formula (a-1), m represents an integer of 0 or more and 20 or less. (In formula (a-4), Ra4 , Ra5 , and Ra6 each independently represent one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, and a fluorine atom, and m3 represents an integer of 0 to 12.) The alkyl group that can be selected as Ra4 in formula (a-4) is an alkyl group having 1 to 10 carbon atoms. By setting the number of carbon atoms of the alkyl group within this range, the heat resistance of the obtained carboxylic acid ester can be further improved. When Ra4 is an alkyl group, from the perspective of easily obtaining a cardo resin with excellent heat resistance, the number of carbon atoms is preferably 1 to 6, more preferably 1 to 5, further preferably 1 to 4, and particularly preferably 1 to 3. When Ra4 is an alkyl group, the alkyl group may be a linear chain or a branched chain. As Ra4 in formula (a-4), from the perspective of easily obtaining a cardo resin with excellent heat resistance, it is more preferred that each independently be a hydrogen atom or an alkyl group having 1 or more and 10 or less carbon atoms. Ra4 in formula (a-4) is more preferably a hydrogen atom, a methyl group, an ethyl group, a n-propyl group or an isopropyl group, and is particularly preferably a hydrogen atom or a methyl group. From the perspective of easily preparing high-purity tetracarboxylic dianhydride, multiple Ra4 in formula (a-4) are preferably the same group. m3 in formula (a-4) represents an integer of 0 or more and 12 or less. By making the value of m3 less than 12, the purification of tetracarboxylic dianhydride can be facilitated. From the perspective of the ease of purification of tetracarboxylic dianhydride, the upper limit of m3 is preferably 5, and more preferably 3. From the perspective of the chemical stability of tetracarboxylic dianhydride, the lower limit of m3 is preferably 1, more preferably 2. In formula (a-4), m3 is particularly preferably 2 or 3. The alkyl group having 1 to 10 carbon atoms that can be selected as Ra5 and Ra6 in formula (a-4) is the same as the alkyl group having 1 to 10 carbon atoms that can be selected as Ra4 . From the perspective of easy purification of tetracarboxylic dianhydride, Ra5 and Ra6 are preferably hydrogen atoms, or alkyl groups having 1 to 10 carbon atoms (preferably 1 to 6, more preferably 1 to 5, further preferably 1 to 4, and particularly preferably 1 to 3), and are particularly preferably hydrogen atoms or methyl groups. Examples of the tetracarboxylic dianhydride represented by formula (a-4) include norbornane-2-spiro-α-cyclopentanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride (also known as "norbornane-2-spiro-2'-cyclopentanone-5'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid dianhydride" and "norbornane-2-spiro-2'-cyclopentanone-5'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid dianhydride". Anhydride”), methyl norbornane-2-spiro-α-cyclopentanone-α'-spiro-2''-(methyl norbornane)-5,5'',6,6''-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclohexanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride (also known as "norbornane-2-spiro-2'-cyclohexanone-6'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride"), methyl norbornane-2-spiro-α-cyclohexanone-α'-spiro-2''-(methyl norbornane)-5,5'',6,6''-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclopropanone-α'-spiro-2''-norbornane-5 ,5'',6,6''-tetracarboxylic acid dianhydride, norbornane-2-spiro-α-cyclobutanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid dianhydride, norbornane-2-spiro-α-cycloheptanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid dianhydride, norbornane-2-spiro- α-Cyclooctanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclononanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclodecanone-α'-spiro-2''-norbornane-5,5'', 6,6''-tetracarboxylic acid dianhydride, norbornane-2-spiro-α-cycloundecanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid dianhydride, norbornane-2-spiro-α-cyclododecanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid dianhydride, norbornane-2-spiro-α-cyclododecanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid dianhydride -cyclotridecanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclotetradecanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride, norbornane-2-spiro-α-cyclopentadecanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride, norbornane-2-spiro-α-(methylcyclopentanone)-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride, norbornane-2-spiro-α-(methylcyclohexanone)-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic dianhydride, etc. The weight average molecular weight of the Cardo resin (a-II) is preferably 1000 to 40000, more preferably 1500 to 30000, and further preferably 2000 to 10000. By falling within the above range, good developing properties can be obtained, and sufficient heat resistance and mechanical strength can be obtained for a cured film formed using the photosensitive composition. [Novolac resin (a-III)] From the perspective of easily forming a cured product that is not prone to excessive flow due to heating, it is also preferred that the alkali-soluble resin (A) contains a Novolac resin (a-III). As the Novolac resin (a-III), various Novolac resins that have been used in photosensitive compositions can be used. Novolac resin (a-III) is preferably obtained by addition condensation of an aromatic compound having a phenolic hydroxyl group (hereinafter referred to as "phenol") with an aldehyde under acid catalysis. (Phenols) Examples of phenols that can be used to prepare Novolac resin (a-III) include phenol; cresols such as o-cresol, m-cresol, and p-cresol; xylenols such as 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, and 3,5-xylenol; ethylphenols such as o-ethylphenol, m-ethylphenol, and p-ethylphenol; 2-isopropylphenol, 3-isopropylphenol, 4-isopropylphenol, o-butylphenol, m-butylphenol, and p-butylphenol; Phenol, and alkylphenols such as p-tert-butylphenol; trialkylphenols such as 2,3,5-trimethylphenol and 3,4,5-trimethylphenol; polyphenols such as resorcinol, o-catechol, hydroquinone, hydroquinone monomethyl ether, pyrogallol, and pyrogallol; alkylpolyphenols such as alkylresorcinol, alkylo-catechol, and alkylhydroquinone (the number of carbon atoms of all alkyl groups is 1 or more and 4 or less); α-naphthol; β-naphthol; hydroxydiphenyl; and bisphenol A, etc. These phenols can be used alone or in combination of two or more. Among these phenols, meta-cresol and p-cresol are preferred, and meta-cresol and p-cresol are more preferably used together. In this case, various properties such as heat resistance of the cured film formed using the photosensitive composition can be adjusted by adjusting the mixing ratio of the two. The mixing ratio of m-cresol and p-cresol is not particularly limited, and is preferably 3/7 or more and 8/2 or less in terms of the molar ratio of m-cresol/p-cresol. By using m-cresol and p-cresol in the above-mentioned ratio, it is easy to obtain a photosensitive composition that can form a cured film with excellent heat resistance. In addition, Novolac resin produced by using m-cresol and 2,3,5-trimethylphenol is also preferred. When the Novolac resin is used, it is particularly easy to obtain a photosensitive composition that can form a cured film with excellent heat resistance. The mixing ratio of m-cresol and 2,3,5-trimethylphenol is not particularly limited, and is preferably 70/30 or more and 95/5 or less in terms of the molar ratio of m-cresol/2,3,5-trimethylphenol. (Aldehydes) Examples of aldehydes that can be used in the preparation of Novolac resin (a-III) include formaldehyde, paraformaldehyde, furfural, benzaldehyde, nitrobenzaldehyde, and acetaldehyde. These aldehydes can be used alone or in combination of two or more. (Acid catalysts) Examples of acid catalysts that can be used in the preparation of Novolac resin (a-III) include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and phosphorous acid; organic acids such as formic acid, oxalic acid, acetic acid, diethyl sulfate, and p-toluenesulfonic acid; and metal salts such as zinc acetate. These acid catalysts can be used alone or in combination of two or more. (Molecular weight) The weight average molecular weight (Mw; hereinafter also referred to as "weight average molecular weight") of the Novolac resin (a-III) in terms of polystyrene conversion is preferably 2000 as the lower limit, more preferably 5000, particularly preferably 10000, further preferably 15000, and most preferably 20000, and the upper limit is preferably 50000, more preferably 45000, further preferably 40000, and most preferably 35000. As the Novolac resin (a-III), at least two Novolac resins having different weight average molecular weights in terms of polystyrene conversion may be used in combination. By combining Novolac resins having different weight average molecular weights, a balance between the developability of the photosensitive composition and the heat resistance of the cured film formed using the photosensitive composition can be achieved. [Modified Epoxy Resin (a-IV)] The alkali-soluble resin (A) may contain an adduct of a polyacid anhydride (a-3c) which is a reaction product of an epoxy compound (a-3a) and a carboxylic acid (a-3b) containing an unsaturated group. The adduct is also recorded as "modified epoxy resin (a-3)". It should be noted that in the specification and patent scope of this application, compounds that meet the above definition but do not belong to the above-mentioned resin (a-II) having a cardo structure are referred to as modified epoxy resins (a-IV). The following describes the epoxy compound (a-3a), the carboxylic acid containing an unsaturated group (a-3b), and the polyacid anhydride (a-3c). <Epoxy compound (a-3a)> The epoxy compound (a-3a) is not particularly limited, as long as it is a compound having an epoxy group, and may be an aromatic epoxy compound having an aromatic group, or an aliphatic epoxy compound not containing an aromatic group, preferably an aromatic epoxy compound having an aromatic group. The epoxy compound (a-3a) may be a monofunctional epoxy compound, or may be a polyfunctional epoxy compound having two or more functional groups, preferably a polyfunctional epoxy compound. Specific examples of the epoxy compound (a-3a) include bifunctional epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AD type epoxy resins, naphthalene type epoxy resins, and biphenyl type epoxy resins; glycidyl epoxy resins such as dimer acid glycidyl ester and triglycidyl ester; tetraglyceryl ester; Glycerylamine epoxy resins such as triglycidyl aminodiphenylmethane, triglycidyl p-aminophenol, tetraglycidyl m-xylylenediamine, and tetraglycidyl bisaminomethylcyclohexane; miscellaneous cyclic epoxy resins such as triglycidyl isocyanurate; phloroglucinol triglycidyl ether, trihydroxybiphenyl triglycidyl ether, trihydroxybenzene trifunctional epoxy resins such as methyl methane triglycidyl ether, glycerol triglycidyl ether, 2-[4-(2,3-glycidyloxy)phenyl]-2-[4-[1,1-bis[4-(2,3-glycidyloxy)phenyl]ethyl]phenyl]propane, and 1,3-bis[4-[1-[4-(2,3-glycidyloxy)phenyl]-1-[4-[1-[4-(2,3-glycidyloxy)phenyl]-1-methylethyl]phenyl]ethyl]phenoxy]-2-propanol; and quadrifunctional epoxy resins such as tetrahydroxyphenylethane tetraglycidyl ether, tetraglycidyl benzophenone, bisresorcinol tetraglycidyl ether, and tetraglycidyl biphenyl. In addition, as the epoxy compound (a-3a), an epoxy compound having a biphenyl skeleton is preferred. The epoxy compound having a biphenyl skeleton preferably has at least one biphenyl skeleton represented by the following formula (a-3a-1) in the main chain. The epoxy compound having a biphenyl skeleton is preferably a multifunctional epoxy compound having two or more epoxy groups. By using an epoxy compound having a biphenyl skeleton, it is easy to obtain a photosensitive composition that has an excellent balance between sensitivity and developability and can form a cured film with excellent adhesion to a substrate. (In formula (a-3a-1), Ra7 is independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a halogen atom, or a phenyl group which may have a substituent, and j is an integer of 1 to 4.) When Ra7 is an alkyl group having 1 to 12 carbon atoms, specific examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, an n-pentyl group, an iso-pentyl group, a sec-pentyl group, a tert-pentyl group, an n-hexyl group, an n-heptyl group, an n-octyl group, an iso-octyl group, a sec-octyl group, a tert-octyl group, an n-nonyl group, an iso-nonyl group, an n-decyl group, an iso-decyl group, an n-undecyl group, and an n-dodecyl group. When Ra7 is a halogen atom, specific examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. When R a7 is a phenyl group which may have a substituent, the number of substituents on the phenyl group is not particularly limited. The number of substituents on the phenyl group is 0 or more and 5 or less, preferably 0 or 1. Examples of substituents include an alkyl group having 1 or more and 4 or less carbon atoms, an alkoxy group having 1 or more and 4 or less carbon atoms, an aliphatic acyl group having 2 or more and 4 or less carbon atoms, a halogen atom, a cyano group, and a nitro group. The epoxy compound (a-3a) having a biphenyl skeleton represented by the above formula (a-3a-1) is not particularly limited, and for example, an epoxy compound represented by the following formula (a-3a-2) can be cited. (In formula (a-3a-2), Ra7 and j are the same as in formula (a-3a-1), and k is the average number of repetitions of the structural unit in parentheses, which is greater than 0 and less than 10.) Among the epoxy compounds represented by formula (a-3a-2), the compound represented by the following formula (a-3a-3) is preferably selected from the perspective of being particularly easy to obtain a photosensitive composition having an excellent balance between sensitivity and developability. (In formula (a-3a-3), k is the same as that in formula (a-3a-2).) (Carboxylic acid containing an unsaturated group (a-3b)) When preparing the modified epoxy compound (a-IV), the epoxy compound (a-3a) is reacted with the carboxylic acid containing an unsaturated group (a-3b). As the carboxylic acid containing an unsaturated group (a-3b), it is preferred to be a monocarboxylic acid having an unsaturated double bond with a reactive group such as an acryl group or a methacryl group in the molecule. As such an unsaturated group-containing carboxylic acid, for example, acrylic acid, methacrylic acid, β-styryl acrylic acid, β-furfuryl acrylic acid, α-cyanocinnamic acid, cinnamic acid, etc. can be cited. In addition, the unsaturated group-containing carboxylic acid (a-3b) can be used alone or in combination of two or more. The epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b) can be reacted by a known method. As a preferred reaction method, for example, the following method can be cited: using a tertiary amine such as triethylamine, benzylethylamine, a quaternary ammonium salt such as dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethylammonium chloride, benzyltriethylammonium chloride, pyridine, or triphenylphosphine as a catalyst, in an organic solvent, at a reaction temperature of 50°C or more and 150°C or less, the epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b) are reacted for several hours to tens of hours. The ratio of the amount of the epoxy compound (a-3a) to the unsaturated group-containing carboxylic acid (a-3b) used in the reaction is preferably 1:0.5 to 1:2, more preferably 1:0.8 to 1:1.25, and particularly preferably 1:0.9 to 1:1.1, in terms of the epoxy equivalent of the epoxy compound (a-3a) to the carboxylic acid equivalent of the unsaturated group-containing carboxylic acid (a-3b). When the ratio of the amount of the epoxy compound (a-3a) to the amount of the unsaturated group-containing carboxylic acid (a-3b) is 1:0.5 to 1:2 in the above-mentioned equivalent ratio, the crosslinking efficiency tends to be improved, which is preferred. (Polyacid Anhydride (a-3c)) Polyacid anhydride (a-3c) is an anhydride of a carboxylic acid having two or more carboxyl groups. The polyacid anhydride (a-3c) is not particularly limited, and examples thereof include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, Phthalic anhydride, 3-ethylhexahydrophthalic anhydride, 4-ethylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, 3-methyltetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, 3-ethyltetrahydrophthalic anhydride, 4-ethyltetrahydrophthalic anhydride, a compound represented by the following formula (a-3c-1), and a compound represented by the following formula (a-3c-2). In addition, the polyacid anhydride (a-3c) can be used alone or in combination of two or more. (In formula (a-3c-2), Ra8 represents an alkylene group having 1 to 10 carbon atoms which may have a substituent.) As the polyacid anhydride (a-3c), a compound having two or more benzene rings is preferably used from the perspective of easily obtaining a photosensitive composition having an excellent balance between sensitivity and developability. In addition, the polyacid anhydride (a-3c) more preferably comprises at least one of the compound represented by the above formula (a-3c-1) and the compound represented by the above formula (a-3c-2). After reacting the epoxy compound (a-3a) with the unsaturated group-containing carboxylic acid (a-3b), the method for reacting with the polyacid anhydride (a-3c) can be appropriately selected from known methods. In addition, the ratio of the amount used is generally 1:1 to 1:0.1, preferably 1:0.8 to 1:0.2, based on the molar number of OH groups in the component after the reaction of the epoxy compound (a-3a) and the unsaturated group-containing carboxylic acid (a-3b), and the equivalent ratio of the anhydride group of the polyacid anhydride (a-3c). By becoming the above range, a photosensitive composition with good developing properties can be easily obtained. In addition, the acid value of the modified epoxy resin (a-IV) is preferably 10 mgKOH/g or more and 150 mgKOH/g or less, and more preferably 70 mgKOH/g or more and 110 mgKOH/g or less, based on the resin solid content. By making the acid value of the resin above 10 mgKOH/g, sufficient solubility in the developer can be obtained. In addition, by making the acid value below 150 mgKOH/g, sufficient curability can be obtained and the surface property can be good. In addition, the weight average molecular weight of the modified epoxy resin (a-IV) is preferably above 1000 and below 40000, and more preferably above 2000 and below 30000. By making the weight average molecular weight above 1000, it is easy to form a cured film with excellent heat resistance and strength. In addition, by making the weight average molecular weight below 40000, it is easy to obtain a photosensitive composition that is sufficiently soluble in the developer. The content of the alkali-soluble resin (A) is preferably 20% by mass or more and 85% by mass or less, and more preferably 25% by mass or more and 75% by mass or less, relative to the mass of the photosensitive composition excluding the mass of the organic solvent (S) described later (total solid content). By falling within the above range, a photosensitive composition having excellent developing properties can be easily obtained. <Photopolymerizable compound (B)> As the photopolymerizable compound (B), a monomer having an ethylenically unsaturated group can be preferably used. The type of the photopolymerizable compound (B) is not particularly limited within the range that does not impair the purpose of the present invention. From the perspective of easily forming a cured product with a low relative dielectric constant, the photopolymerizable compound preferably includes a polyfunctional compound having 3 or more (meth)acryl groups as the monomer having an ethylenic unsaturated group, and more preferably includes a polyfunctional compound having 3 or 4 (meth)acryl groups. When the above-mentioned polyfunctional compound is used as the photopolymerizable compound (B), it is easy to obtain a photosensitive composition that can form a cured product with a low relative dielectric constant and can form a coating film with good conformality on a substrate with a height difference. The polyfunctional compound having 3 or more (meth)acryl groups can be used in combination with other photopolymerizable compounds. Other photopolymerizable compounds can be monofunctional compounds or bifunctional compounds. The mass ratio of the polyfunctional compound having 3 or more (meth) acryloyl groups to the mass of the photopolymerizable compound (B) is preferably 80% by mass or more, more preferably 90% by mass or more, further preferably 95% by mass or more, and particularly preferably 100% by mass. As specific examples of polyfunctional compounds having 3 or 4 (meth) acryloyl groups, trihydroxymethylpropane tri(meth) acrylate, pentaerythritol tri(meth) acrylate, pentaerythritol tetra(meth) acrylate, and glycerol tri(meth) acrylate can be cited. These polyfunctional monomers can be used alone or in combination of two or more. Considering the ease of forming a cured product with a low dielectric constant, the polyfunctional compound having 3 or 4 (meth) acryloyl groups preferably includes a compound having a partial skeleton represented by the following formula (B1). Typically, the partial skeleton represented by formula (B1) is derived from trihydroxymethylpropane. The photopolymerizable compound (B) preferably contains a compound represented by the following formula (B2) as a polyfunctional compound having a partial skeleton represented by the formula (B1). (In formula (B2), R b1 is each independently a hydrogen atom or a methyl group, R b2 is a divalent linking group, a1 is 0 or 1, and a2 is 0 or 1.) In formula (B2), when a1 is 0, the compound represented by formula (B2) is a trifunctional compound. When a1 is 1, the compound represented by formula (B2) is a tetrafunctional compound. R b2 in formula (B2) is a divalent linking group. The linking group may be a alkyl group or an organic group containing a heteroatom. Examples of heteroatom that may be contained in the linking group include O, N, S, Se, P, Si, B, and halogen atoms. Preferred examples of divalent linking groups include -CO-, -R b3 -, -CO-R b3 -CO-, -R b3 -CO-, -R b4 -OR b4 -, -R b4 -SR b4 -, and -R b4 -CO-R b4 -. R b3 is a divalent hydrocarbon group having 1 to 10 carbon atoms. R b4 is a divalent hydrocarbon group having 1 to 6 carbon atoms. Among the above-described groups, -CO-, -R b3 -, and -CO- R b3 -CO- are preferred from the viewpoints of ease of synthesis and obtaining the compound represented by formula ( B2 ). Preferred specific examples of the linking group include -CO-, -CH2-, -CH2CH2-, -CH=CH-, -CH2CH2CH2- , -CH2C(CH3)H-, -CO - CH2- CO- , -CO- CH2CH2 -CO-, -CO-CH= CH - CO-, -CO- CH2CH2CH2 - CO-, -CO- CH2CH2 - CO-, -CO- CH2CH2- and groups having the following structures. Particularly preferred specific examples of the polyfunctional compound having 3 or 4 (meth)acryloyl groups include the following compounds: In the following formula, each R b1 is independently a hydrogen atom or a methyl group. When the photopolymerizable compound (B) contains other photopolymerizable compounds other than the polyfunctional compound having 3 or 4 (meth)acryloyl groups, the other photopolymerizable compounds are not particularly limited within the scope not impairing the purpose of the present invention. The other photopolymerizable compounds may be monofunctional compounds or may be polyfunctional compounds having two or more functional groups. As the monofunctional compound, there can be mentioned (meth)acrylamide, hydroxymethyl (meth)acrylamide, methoxymethyl (meth)acrylamide, ethoxymethyl (meth)acrylamide, propoxymethyl (meth)acrylamide, butoxymethoxymethyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, (meth)acrylic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, citric acid, citric anhydride, crotonic acid, 2-acrylamido-2-methylpropanesulfonic acid, tert-butylacrylamidesulfonic acid, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, (meth)acrylic acid, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-phenoxy-2-hydroxypropyl (meth)acrylate, 2-(meth)acryloyloxy-2-hydroxypropyl phthalate, glycerol mono(meth)acrylate, tetrahydrofurfuryl (meth)acrylate, dimethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, (meth)acrylic acid half ester of phthalic acid derivative, etc. These monofunctional compounds can be used alone or in combination of two or more. Examples of the divalent or pentavalent or higher polyfunctional compound include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, glycerol di(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, pentaerythritol di(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 2,2-bis(4-(meth)acryloyloxydiethoxyphenyl)propane, 2,2-bis(4-(meth)acryloyloxypoly(meth)acrylate) ethoxyphenyl) propane, 2-hydroxy-3-(meth)acryloyloxypropyl (meth)acrylate, ethylene glycol diglycidyl ether di(meth)acrylate, diethylene glycol diglycidyl ether di(meth)acrylate, phthalic acid diglycidyl di(meth)acrylate, urethane (meth)acrylate (i.e., toluene diisocyanate, trimethyl-1,6-hexanediol isocyanate, or 1,6-hexamethylene diisocyanate and 2-hydroxyethyl (meth)acrylate), methylenebis(meth)acrylamide, (meth)acrylamide methylene ether, condensation product of polyol and N-hydroxymethyl(meth)acrylamide, 1,3,5-triacrylhexahydro-1,3,5-triazine (triacrylformal), etc. These polyfunctional compounds can be used alone or in combination of two or more. Among the other photopolymerizable compounds other than the polyfunctional compounds having 3 or 4 (meth)acryl groups, polyfunctional monomers having 5 or more functions are preferred from the perspective of the tendency to improve the adhesion between the photosensitive composition and the substrate and the strength of the photosensitive composition after curing. The content of the photopolymerizable compound (B) in the photosensitive composition is preferably 1 mass % to 50 mass %, more preferably 5 mass % to 40 mass %, relative to the mass of the photosensitive composition excluding the mass of the organic solvent (S) described later (total solid content), and more preferably 5 mass % to 40 mass %. By falling within the above range, it tends to be easy to obtain a balance among sensitivity, developability, and resolution. <Photopolymerization initiator (C)> The photopolymerization initiator (C) is not particularly limited as long as it can cure the above-mentioned photopolymerizable compound (B) by exposure. As the photopolymerization initiator (C), from the aspect of the sensitivity of the photosensitive composition, typically, an oxime ester compound is preferably used. From the viewpoint of easily forming a cured product having a low dielectric constant, it is preferred to use a compound represented by the following formula (1) as the oxime ester compound. (In formula (1), R c1 is a hydrogen atom, a nitro group or a monovalent organic group, R c2 and R c3 are each a chain alkyl group which may have a substituent, a cyclic organic group which may have a substituent, or a hydrogen atom, R c2 and R c3 may be bonded to each other to form a ring, R c4 is a monovalent organic group, R c5 is a hydrogen atom, an alkyl group having 1 to 11 carbon atoms which may have a substituent, or an aryl group which may have a substituent, n1 is an integer of 0 to 4, and n2 is 0 or 1.) In formula (1), R c1 is a hydrogen atom, a nitro group or a monovalent organic group. R c1 is bonded to a six-membered aromatic ring on the fluorene ring in formula (1) that is different from the six-membered aromatic ring to which the group represented by -(CO) n2 - is bonded. In formula (1), the bonding position of R c1 relative to the fluorene ring is not particularly limited. When the compound represented by formula (1) has one or more R c1 , it is preferred that one of the one or more R c1 is bonded to the 2-position of the fluorene ring from the viewpoint of ease of synthesis of the compound represented by formula (1). When there are multiple R c1s , the multiple R c1s may be the same or different. When R c1 is an organic group, R c1 is not particularly limited within the scope that does not impair the purpose of the present invention, and may be appropriately selected from various organic groups. As R Preferred examples of c1 when it is an organic group include alkyl, alkoxy, cycloalkyl, cycloalkoxy, saturated aliphatic acyl, saturated aliphatic acyloxy, alkoxycarbonyl, phenyl which may have a substituent, phenoxy which may have a substituent, benzyl which may have a substituent, phenoxycarbonyl which may have a substituent, benzyloxy which may have a substituent, phenylalkyl which may have a substituent, naphthyloxy which may have a substituent, naphthyloxy which may have a substituent, naphthylcarbonyl which may have a substituent, naphthyloxy which may have a substituent, naphthylalkyl which may have a substituent, heterocyclic group which may have a substituent, heterocyclic carbonyl which may have a substituent, amino which may be substituted with one or two organic groups, oxolin-1-yl, and piperazine-1-yl. When R c1 is an alkyl group, the number of carbon atoms of the alkyl group is preferably 1 or more and 20 or less, and more preferably 1 or more and 6 or less. In addition, when R c1 is an alkyl group, it may be a straight chain or a branched chain. As specific examples of R c1 being an alkyl group, there can be cited methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, sec-pentyl, tert-pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, sec-octyl, tert-octyl, n-nonyl, isononyl, n-decyl, and isodecyl. In addition, when R c1 is an alkyl group, the alkyl group may contain an ether bond (-O-) in the carbon chain. Examples of the alkyl group having an ether bond in the carbon chain include methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, propyloxyethoxyethyl, and methoxypropyl. When R c1 is an alkoxy group, the number of carbon atoms in the alkoxy group is preferably 1 to 20, more preferably 1 to 6. When R c1 is an alkoxy group, it may be a straight chain or a branched chain. Specific examples of Rc1 when it is an alkoxy group include methoxy, ethoxy, n-propyloxy, isopropyloxy, n-butyloxy, isobutyloxy, sec-butyloxy, tert-butyloxy, n-pentyloxy, isopentyloxy, sec-pentyloxy, tert-pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, isooctyloxy, sec-octyloxy, tert-octyloxy, n-nonyloxy, isononyloxy, n-decyloxy, and isodecyloxy. In addition, when Rc1 is an alkoxy group, the alkoxy group may contain an ether bond (-O-) in the carbon chain. Examples of alkoxy groups having an ether bond in the carbon chain include methoxyethoxy, ethoxyethoxy, methoxyethoxyethoxy, ethoxyethoxyethoxy, propyloxyethoxyethoxy, and methoxypropyloxy. When R c1 is a cycloalkyl group or a cycloalkoxy group, the number of carbon atoms of the cycloalkyl group or the cycloalkoxy group is preferably 3 or more and 10 or less, and more preferably 3 or more and 6 or less. Specific examples of R c1 when it is a cycloalkyl group include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl. Specific examples of R c1 when it is a cycloalkoxy group include cyclopropyloxy, cyclobutyloxy, cyclopentyloxy, cyclohexyloxy, cycloheptyloxy, and cyclooctyloxy. When R c1 is a saturated aliphatic acyl group or a saturated aliphatic acyloxy group, the number of carbon atoms of the saturated aliphatic acyl group or the saturated aliphatic acyloxy group is preferably 2 to 21, and more preferably 2 to 7. Specific examples of R c1 being a saturated aliphatic acyl group include acetyl, propionyl, n-butyryl, 2-methylpropionyl, n-pentyl, 2,2-dimethylpropionyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-tetradecyl, n-pentadecanyl, and n-hexadecyl. Specific examples of R c1 when it is a saturated aliphatic acyloxy group include acetyloxy, propionyloxy, n-butyryloxy, 2-methylpropionyloxy, n-pentyloxy, 2,2-dimethylpropionyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, n-nonyloxy, n-decyloxy, n-undecyloxy, n-dodecyloxy, n-tridecyloxy, n-tetradecyloxy, n-pentadecanyloxy, and n-hexadecyloxy. When R c1 is an alkoxycarbonyl group, the number of carbon atoms in the alkoxycarbonyl group is preferably 2 or more and 20 or less, and more preferably 2 or more and 7 or less. Specific examples of Rc1 when it is an alkoxycarbonyl group include methoxycarbonyl, ethoxycarbonyl, n-propyloxycarbonyl, isopropyloxycarbonyl, n-butyloxycarbonyl, isobutyloxycarbonyl, sec-butyloxycarbonyl, tert-butyloxycarbonyl, n-pentyloxycarbonyl, isopentyloxycarbonyl, sec-pentyloxycarbonyl, tert-pentyloxycarbonyl, n-hexyloxycarbonyl, n-heptyloxycarbonyl, n-octyloxycarbonyl, isooctyloxycarbonyl, sec-octyloxycarbonyl, tert-octyloxycarbonyl, n-nonyloxycarbonyl, isononyloxycarbonyl, n-decyloxycarbonyl, and isodecyloxycarbonyl. When Rc1 is a phenylalkyl group, the number of carbon atoms in the phenylalkyl group is preferably 7 or more and 20 or less, and more preferably 7 or more and 10 or less. In addition, when R c1 is a naphthylalkyl group, the number of carbon atoms of the naphthylalkyl group is preferably 11 or more and 20 or less, and more preferably 11 or more and 14 or less. Specific examples of when R c1 is a phenylalkyl group include benzyl, 2-phenylethyl, 3-phenylpropyl, and 4-phenylbutyl. Specific examples of when R c1 is a naphthylalkyl group include α-naphthylmethyl, β-naphthylmethyl, 2-(α-naphthyl)ethyl, and 2-(β-naphthyl)ethyl. When R c1 is a phenylalkyl group or a naphthylalkyl group, R c1 may further have a substituent on the phenyl group or the naphthyl group. When R c1 is a heterocyclic group, the heterocyclic group is a five-membered or six-membered monocyclic ring containing one or more N, S, or O, or is a heterocyclic group formed by condensation of the monocyclic rings with each other or condensation of the monocyclic ring with a benzene ring. When the heterocyclic group is a condensed ring, the number of rings of the monocyclic ring constituting the condensed ring is not more than 3. The heterocyclic group may be an aromatic group (heteroaryl group) or a non-aromatic group. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrazine, pyrimidine, oxazine, benzofuran, benzothiophene, indole, isoindole, indolizine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, oxazole, purine, quinoline, isoquinoline, quinazoline, phthalazine, cinnoline, quinoxaline, piperidine, piperazine, morpholine, piperidine, tetrahydropyran, and tetrahydrofuran. When R c1 is a heterocyclic group, the heterocyclic group may further have a substituent. When R c1 is a heterocyclic carbonyl group, the heterocyclic group included in the heterocyclic carbonyl group is the same as when R c1 is a heterocyclic group. When R c1 is an amino group substituted with one or two organic groups, preferred examples of the organic group include an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a saturated aliphatic acyl group having 2 to 21 carbon atoms, a phenyl group which may have a substituent, a benzoyl group which may have a substituent, a phenylalkyl group which may have a substituent and has a carbon number of 7 to 20 which may have a substituent, a naphthyl group which may have a substituent, a naphthylalkyl group which may have a substituent, a naphthylalkyl group which may have a substituent and has a carbon number of 11 to 20 which may have a substituent, and a heterocyclic group. Specific examples of these preferred organic groups are the same as for R c1 . Specific examples of the amino group substituted with one or two organic groups include methylamino, ethylamino, diethylamino, n-propylamino, di-n-propylamino, isopropylamino, n-butylamino, di-n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-nonylamino, n-decylamino, phenylamino, naphthylamino, acetylamino, propionylamino, n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-decylamino, benzylamino, α-naphthylamino, and β-naphthylamino. When the phenyl group, naphthyl group, and heterocyclic group included in R c1 further have a substituent, the substituent includes an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a saturated aliphatic acyl group having 2 to 7 carbon atoms, an alkoxycarbonyl group having 2 to 7 carbon atoms, a saturated aliphatic acyloxy group having 2 to 7 carbon atoms, a monoalkylamino group having an alkyl group having 1 to 6 carbon atoms, a dialkylamino group having an alkyl group having 1 to 6 carbon atoms, a morpholin-1-yl group, a piperazin-1-yl group, a halogen, a nitro group, and a cyano group. When the phenyl group, naphthyl group, and heterocyclic group included in R c1 further have a substituent, the number of the substituent is not limited within the range not hindering the purpose of the present invention, but is preferably 1 to 4. When the phenyl, naphthyl, and heterocyclic group included in R c1 have multiple substituents, the multiple substituents may be the same or different. Among the groups described above, when R c1 is a nitro group or a group represented by R c10 -CO-, there is a tendency to improve sensitivity, which is preferred. R c10 is not particularly limited within the scope that does not hinder the purpose of the present invention, and can be selected from various organic groups. As examples of groups preferably used as R c10 , there can be cited an alkyl group having 1 or more and 20 or less carbon atoms, a phenyl group that may have a substituent, a naphthyl group that may have a substituent, and a heterocyclic group that may have a substituent. Among these groups, as R c10 , 2-methylphenyl, thiophene-2-yl, and α-naphthyl are particularly preferred. In addition, when R c1 is a hydrogen atom, there is a tendency to improve transparency, which is preferred. It should be noted that when R c1 is a hydrogen atom and R c4 is a group represented by formula (1a) or (1b) described later, there is a tendency for transparency to become better. In formula (1), R c2 and R c3 are each a chain alkyl group that may have a substituent, a cyclic organic group that may have a substituent, or a hydrogen atom. R c2 and R c3 may be bonded to each other to form a ring. Among these groups, as R c2 and R c3 , a chain alkyl group that may have a substituent is preferred. When R c2 and R c3 are a chain alkyl group that may have a substituent, the chain alkyl group may be a straight chain alkyl group or a branched chain alkyl group. When Rc2 and Rc3 are chain alkyl groups without substituents, the number of carbon atoms in the chain alkyl group is preferably 1 to 20, more preferably 1 to 10, and particularly preferably 1 to 6. Specific examples of Rc2 and Rc3 when they are chain alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, iso-pentyl, sec-pentyl, tert-pentyl, n-hexyl, n-heptyl, n-octyl, iso-octyl, sec-octyl, tert-octyl, n-nonyl, iso-nonyl, n-decyl, and iso-decyl. In addition, when Rc2 and Rc3 are alkyl groups, the alkyl group may contain an ether bond (-O-) in the carbon chain. As examples of alkyl groups having an ether bond in the carbon chain, there can be cited methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, propyloxyethoxyethyl, and methoxypropyl. When Rc2 and Rc3 are chain alkyl groups having substituents, the number of carbon atoms in the chain alkyl group is preferably 1 or more and 20 or less, more preferably 1 or more and 10 or less, and particularly preferably 1 or more and 6 or less. In this case, the number of carbon atoms in the chain alkyl group does not include the number of carbon atoms in the substituent. The chain alkyl group having a substituent is preferably a straight chain. The substituents that the alkyl group may have are not particularly limited within the scope that does not hinder the purpose of the present invention. As preferred examples of substituents, there can be cited cyano, halogen atoms, cyclic organic groups, and alkoxycarbonyl groups. As the halogen atom, a fluorine atom, a chlorine atom, a bromine atom and an iodine atom can be cited. Among these, a fluorine atom, a chlorine atom and a bromine atom are preferred. As the cyclic organic group, a cycloalkyl group, an aromatic alkyl group and a heterocyclic group can be cited. As specific examples of the cycloalkyl group, the same as the preferred examples when R c1 is a cycloalkyl group. As specific examples of the aromatic alkyl group, phenyl, naphthyl, biphenyl, anthracenyl, and phenanthryl can be cited. As specific examples of the heterocyclic group, the same as the preferred examples when R c1 is a heterocyclic group. When R c1 is an alkoxycarbonyl group, the alkoxy group contained in the alkoxycarbonyl group may be a straight chain or a branched chain, preferably a straight chain. The number of carbon atoms of the alkoxy group contained in the alkoxycarbonyl group is preferably 1 to 10, more preferably 1 to 6. When the chain alkyl group has a substituent, the number of the substituent is not particularly limited. The number of preferred substituents varies depending on the number of carbon atoms of the chain alkyl group. The number of substituents is typically 1 to 20, preferably 1 to 10, more preferably 1 to 6. When Rc2 and Rc3 are cyclic organic groups, the cyclic organic group may be an alicyclic group or an aromatic group. Examples of the cyclic organic group include an aliphatic cyclic alkyl group, an aromatic alkyl group, and a heterocyclic group. When R c2 and R c3 are cyclic organic groups, the substituents that the cyclic organic groups may have are the same as when R c2 and R c3 are chain alkyl groups. When R c2 and R c3 are aromatic alkyl groups, the aromatic alkyl groups are preferably phenyl groups, or groups formed by a plurality of benzene rings bonded via carbon-carbon bonds, or groups formed by condensation of a plurality of benzene rings. When the aromatic alkyl group is a phenyl group, or a group formed by a plurality of benzene rings bonded or condensed, the number of rings of the benzene rings contained in the aromatic alkyl group is not particularly limited, and is preferably 3 or less, more preferably 2 or less, and particularly preferably 1. As preferred specific examples of aromatic alkyl groups, phenyl, naphthyl, biphenylyl, anthracenyl, and phenanthryl groups can be cited. When Rc2 and Rc3 are aliphatic cyclic alkyl groups, the aliphatic cyclic alkyl group may be monocyclic or polycyclic. The number of carbon atoms in the aliphatic cyclic alkyl group is not particularly limited, but is preferably 3 or more and 20 or less, and more preferably 3 or more and 10 or less. Examples of monocyclic cyclic alkyl groups include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, norbornyl, isobornyl, tricyclononyl, tricyclodecyl, tetracyclododecyl, and adamantyl. When R c2 and R c3 are heterocyclic groups, the heterocyclic group is a 5-membered or 6-membered monocyclic ring containing one or more N, S, or O, or is a heterocyclic group formed by condensation of the monocyclic rings with each other or condensation of the monocyclic ring with a benzene ring. When the heterocyclic group is a condensed ring, the number of rings of the monocyclic ring constituting the condensed ring is 3 or less. The heterocyclic group may be an aromatic group (heteroaryl group) or a non-aromatic group. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, pyrazine, pyrimidine, oxazine, benzofuran, benzothiophene, indole, isoindole, indolizine, benzimidazole, benzotriazole, benzoxazole, benzothiazole, oxazole, purine, quinoline, isoquinoline, quinazoline, phthalazine, cinnoline, quinoxaline, piperidine, piperazine, morpholine, piperidine, tetrahydropyran, and tetrahydrofuran. R c2 and R c3 may be bonded to each other to form a ring. The group including the ring formed by R c2 and R c3 is preferably a cycloalkylidene group. When Rc2 and Rc3 are bonded to form a cycloalkylidene group, the ring constituting the cycloalkylidene group is preferably a five-membered ring or a six-membered ring, and more preferably a five-membered ring. When the group formed by Rc2 and Rc3 bonding is a cycloalkylidene group, the cycloalkylidene group may be condensed with one or more other rings. Examples of the ring that may be condensed with the cycloalkylidene group include a benzene ring, a naphthalene ring, a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a cyclooctane ring, a furan ring, a thiophene ring, a pyrrole ring, a pyridine ring, a pyrazine ring, and a pyrimidine ring. Among R c2 and R c3 described above, as an example of a preferred group, a group represented by the formula -A 1 -A 2 can be cited. In the formula, A 1 is a straight chain alkylene group, and A 2 is an alkoxy group, a cyano group, a halogen atom, a halogenated alkyl group, a cyclic organic group, or an alkoxycarbonyl group. The number of carbon atoms of the straight chain alkylene group of A 1 is preferably 1 or more and 10 or less, and more preferably 1 or more and 6 or less. When A 2 is an alkoxy group, the alkoxy group may be straight chain or branched chain, and is preferably straight chain. The number of carbon atoms of the alkoxy group is preferably 1 or more and 10 or less, and more preferably 1 or more and 6 or less. When A 2 is a halogen atom, it is preferably a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and more preferably a fluorine atom, a chlorine atom, or a bromine atom. When A2 is a halogenated alkyl group, the halogen atom contained in the halogenated alkyl group is preferably a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and more preferably a fluorine atom, a chlorine atom, or a bromine atom. The halogenated alkyl group may be a linear or branched chain, and preferably a linear chain. When A2 is a cyclic organic group, examples of the cyclic organic group are the same as the cyclic organic group that Rc2 and Rc3 have as substituents. When A2 is an alkoxycarbonyl group, examples of the alkoxycarbonyl group are the same as the alkoxycarbonyl group that Rc2 and Rc3 have as substituents. Preferred specific examples of c3 include alkyl groups such as ethyl, n-propyl, n-butyl, n-hexyl, n-heptyl, and n-octyl; alkoxyalkyl groups such as 2-methoxyethyl, 3-methoxy-n-propyl, 4-methoxy-n-butyl, 5-methoxy-n-pentyl, 6-methoxy-n-hexyl, 7-methoxy-n-heptyl, 8-methoxy-n-octyl, 2-ethoxyethyl, 3-ethoxy-n-propyl, 4-ethoxy-n-butyl, 5-ethoxy-n-pentyl, 6-ethoxy-n-hexyl, 7-ethoxy-n-heptyl, and 8-ethoxy-n-octyl; 2-cyanoethyl, 3- Cyanoalkyl such as cyano-n-propyl, 4-cyano-n-butyl, 5-cyano-n-pentyl, 6-cyano-n-hexyl, 7-cyano-n-heptyl, and 8-cyano-n-octyl; phenylalkyl such as 2-phenylethyl, 3-phenyl-n-propyl, 4-phenyl-n-butyl, 5-phenyl-n-pentyl, 6-phenyl-n-hexyl, 7-phenyl-n-heptyl, and 8-phenyl-n-octyl; 2-cyclohexylethyl, 3-cyclohexyl-n-propyl, 4-cyclohexyl-n-butyl, 5-cyclohexyl-n-pentyl, 6-cyclohexyl-n-hexyl, 7-cyclohexyl-n-heptyl, 8-cyclohexyl-n-octyl, cycloalkylalkyl such as 2-methoxycarbonylethyl, 3-methoxycarbonyl-n-propyl, 4-methoxycarbonyl-n-butyl, 5-methoxycarbonyl-n-pentyl, 6-methoxycarbonyl-n-hexyl, 7-methoxycarbonyl-n-heptyl, and 8-methoxycarbonyl-n-octyl; 2-methoxycarbonylethyl, 3-methoxycarbonyl-n-propyl, 4-methoxycarbonyl-n-butyl, 5-methoxycarbonyl-n-pentyl, 6-methoxycarbonyl-n-hexyl, 7-methoxycarbonyl-n-heptyl, and 8-methoxycarbonyl-n-octyl; 2-ethoxycarbonylethyl, 3-ethoxycarbonyl-n-propyl, 4-ethoxycarbonyl-n-butyl, 5-ethoxycarbonyl-n-pentyl, 6-methoxycarbonyl-n-hexyl, 7-methoxycarbonyl-n-heptyl, and 8-methoxycarbonyl-n-octyl. [0063] The invention also includes alkoxycarbonylalkyl such as 2-chloroethyl, 3-chloro-n-propyl, 4-chloro-n-butyl, 5-chloro-n-pentyl, 6-chloro-n-hexyl, 7-chloro-n-heptyl, and 8-chloro-n-octyl; and halogenated alkyl such as 2-chloroethyl, 3-chloro-n-propyl, 4-chloro-n-butyl, 5-chloro-n-pentyl, 6-chloro-n-hexyl, 7-chloro-n-heptyl, 8-chloro-n-octyl, 2-bromoethyl, 3-bromo-n-propyl, 4-bromo-n-butyl, 5-bromo-n-pentyl, 6-bromo-n-hexyl, 7-bromo-n-heptyl, 8-bromo-n-octyl, 3,3,3-trifluoropropyl, and 3,3,4,4,5,5,5-heptafluoro-n-pentyl. As R c2 and R c3 , among the above, preferred groups are ethyl, n-propyl, n-butyl, n-pentyl, 2-methoxyethyl, 2-cyanoethyl, 2-phenylethyl, 2-cyclohexylethyl, 2-methoxycarbonylethyl, 2-chloroethyl, 2-bromoethyl, 3,3,3-trifluoropropyl, and 3,3,4,4,5,5,5-heptafluoro-n-pentyl. As examples of preferred organic groups for R c4 , Similarly, c1 includes alkyl, alkoxy, cycloalkyl, cycloalkoxy, saturated aliphatic acyl, alkoxycarbonyl, saturated aliphatic acyloxy, phenyl which may have a substituent, phenoxy which may have a substituent, benzyl which may have a substituent, phenoxycarbonyl which may have a substituent, benzyloxy which may have a substituent, phenylalkyl which may have a substituent, naphthyloxy which may have a substituent, naphthyloxy which may have a substituent, naphthyloxy which may have a substituent, naphthyloxycarbonyl which may have a substituent, naphthyloxy which may have a substituent, naphthylalkyl which may have a substituent, heterocyclic group which may have a substituent, heterocyclic carbonyl which may have a substituent, amino which may be substituted with one or two organic groups, oxolin-1-yl, and piperazin-1-yl. Specific examples of these groups are the same as those described for R c1 . In addition, as R c4 , cycloalkylalkyl, phenoxyalkyl which may have a substituent on the aromatic ring, and phenylthioalkyl which may have a substituent on the aromatic ring are also preferred. The substituents that the phenoxyalkyl and phenylthioalkyl may have are the same as the substituents that the phenyl group included in R c1 may have. Among organic groups, as R c4 , alkyl, cycloalkyl, phenyl or cycloalkylalkyl which may have a substituent, and phenylthioalkyl which may have a substituent on the aromatic ring are preferred. As the alkyl group, an alkyl group having 1 to 20 carbon atoms is preferred, an alkyl group having 1 to 8 carbon atoms is more preferred, an alkyl group having 1 to 4 carbon atoms is particularly preferred, and a methyl group is most preferred. Among the phenyl groups that may have a substituent, a methylphenyl group is preferred, and a 2-methylphenyl group is more preferred. The number of carbon atoms of the cycloalkyl group contained in the cycloalkylalkyl group is preferably 5 or more and 10 or less, more preferably 5 or more and 8 or less, and particularly preferably 5 or 6. The number of carbon atoms of the alkylene group contained in the cycloalkylalkyl group is preferably 1 or more and 8 or less, more preferably 1 or more and 4 or less, and particularly preferably 2. Among the cycloalkylalkyl groups, cyclopentylethyl is preferred. The number of carbon atoms of the alkylene group contained in the phenylthioalkyl group which may have a substituent on the aromatic ring is preferably 1 or more and 8 or less, more preferably 1 or more and 4 or less, and particularly preferably 2. Among the phenylthioalkyl groups which may have a substituent on the aromatic ring, 2-(4-chlorophenylthio)ethyl is preferred. In addition, as R c4 , a group represented by -A 3 -CO-OA 4 is also preferred. A 3 is a divalent organic group, preferably a divalent alkyl group, and preferably an alkylene group. A 4 is a monovalent organic group, preferably a monovalent alkyl group. When A 3 is an alkylene group, the alkylene group may be a straight chain or a branched chain, preferably a straight chain. When A 3 is an alkylene group, the number of carbon atoms of the alkylene group is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less, and particularly preferably 1 or more and 4 or less. As preferred examples of A 4 , an alkyl group having a carbon number of 1 or more and 10 or less, an aralkyl group having a carbon number of 7 or more and 20 or less, and an aromatic alkyl group having a carbon number of 6 or more and 20 or less can be cited. As preferred specific examples of A 4 , a methyl group, an ethyl group, an n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a n-pentyl group, a n-hexyl group, a phenyl group, a naphthyl group, a benzyl group, a phenethyl group, an α-naphthylmethyl group, and a β-naphthylmethyl group can be cited. Preferred specific examples of the group represented by -A 3 -CO-OA 4 include 2-methoxycarbonylethyl, 2-ethoxycarbonylethyl, 2-n-propyloxycarbonylethyl, 2-n-butyloxycarbonylethyl, 2-n-pentyloxycarbonylethyl, 2-n-hexyloxycarbonylethyl, 2-benzyloxycarbonylethyl, 2-phenoxycarbonylethyl, 3-methoxycarbonyl-n-propyl, 3-ethoxycarbonyl-n-propyl, 3-n-propyloxycarbonyl-n-propyl, 3-n-butyloxycarbonyl-n-propyl, 3-n-pentyloxycarbonyl-n-propyl, 3-n-hexyloxycarbonyl-n-propyl, 3-benzyloxycarbonyl-n-propyl, and 3-phenoxycarbonyl-n-propyl. R c4 has been described above, and as R c4 , a group represented by the following formula (1a) or the following formula (1b) is preferred. (In formula (1a) and formula (1b), R c7 and R c8 are each an organic group, n3 is an integer of 0 to 4, when R c7 and R c8 are present at adjacent positions on the benzene ring, R c7 and R c8 can bond to each other to form a ring, n4 is an integer of 1 to 8, n5 is an integer of 1 to 5, n6 is an integer of 0 to (n5+3), and R c9 is an organic group.) Examples of organic groups related to R c7 and R c8 in formula (1a) are the same as those for R c1 . As R c7 , an alkyl group or a phenyl group is preferred. When R c7 is an alkyl group, the number of carbon atoms is preferably 1 to 10, more preferably 1 to 5, particularly preferably 1 to 3, and most preferably 1. That is, R c7 is most preferably a methyl group. When R c7 and R c8 are bonded to form a ring, the ring may be an aromatic ring or an aliphatic ring. Preferred examples of the group represented by formula (1a) in which R c7 and R c8 form a ring include naphthalene-1-yl, 1,2,3,4-tetrahydronaphthalene-5-yl, etc. In the above formula (1a), n3 is an integer of 0 to 4, preferably 0 or 1, and more preferably 0. In the above formula (1b), R c9 is an organic group. As the organic group, the same groups as those described for R c1 can be cited. Among the organic groups, an alkyl group is preferred. The alkyl group may be a linear chain or a branched chain. The number of carbon atoms in the alkyl group is preferably 1 to 10, more preferably 1 to 5, and particularly preferably 1 to 3. As R c9 , methyl, ethyl, propyl, isopropyl, butyl, etc. can be preferably exemplified, and among them, methyl is more preferred. In the above formula (1b), n5 is an integer of 1 to 5, preferably an integer of 1 to 3, and more preferably 1 or 2. In the above formula (1b), n6 is 0 to (n5+3), preferably an integer of 0 to 3, more preferably an integer of 0 to 2, and particularly preferably 0. In the above formula (1b), n4 is an integer of 1 to 8, preferably an integer of 1 to 5, more preferably an integer of 1 to 3, and particularly preferably 1 or 2. In formula (1), R c5 is a hydrogen atom, an alkyl group having 1 to 11 carbon atoms which may have a substituent, or an aryl group which may have a substituent. As a substituent which may be present when R c5 is an alkyl group, phenyl, naphthyl, etc. can be preferably exemplified. In addition, as a substituent which may be present when R c1 is an aryl group, alkyl groups having 1 to 5 carbon atoms, alkoxy groups, halogen atoms, etc. can be preferably exemplified. In formula (1), as R c5 , a hydrogen atom, methyl, ethyl, n-propyl, isopropyl, n-butyl, phenyl, benzyl, methylphenyl, naphthyl, etc. can be preferably exemplified, and among these, methyl or phenyl is more preferably exemplified. As preferred specific examples of the compound represented by formula (1), the following PI-1 to PI-41 can be cited. As the photopolymerization initiator (C), other photopolymerization initiators other than the compound represented by the above formula (1) may be used. Other photopolymerization initiators may be used alone or in combination with the compound represented by the above formula (1). As other photopolymerization initiators, any photopolymerization initiator other than the compound represented by the above formula (1) may be used without particular limitation. Preferred examples of other photopolymerization initiators include oxime ester compounds having a structure that does not belong to the above formula (C1), such as 2-(benzoyloxyimino)-1-[4-(phenylthio)phenyl]-1-octanone (for example, commercially available as OXE-01 (manufactured by BASF)), and O-acetyl-1-[6-(2-methylbenzoyl)-9-ethyl-9H-oxazol-3-yl]ethanone oxime (for example, commercially available as OXE-02 (manufactured by BASF)). ; 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1-(4-dimethylaminophenyl)butan-1-one, 2-(4-methylbenzyl)-2-diethylamino-1-(4-morpholinophenyl)butan-1-one, 2-methyl-1-phenyl-2-morpholinopropane-1-one, 2-methyl-1-[4-(hexyl)phenyl]-2-morpholinopropane-1-one α-amino ketone compounds such as 1-phenyl-2-hydroxy-2-methylpropane-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone, and 1-hydroxycyclohexylphenyl ketone; α-hydroxy ketone photopolymerization initiators such as benzoin, benzoin methyl Benzoin-based photopolymerization initiators such as benzoyl ether, benzoyl ethyl ether, benzoyl propyl ether, and benzyl methyl ketal; benzophenone-based photopolymerization initiators such as benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl, 4'-methyldiphenyl sulfide, and 4,4'-bis(diethylamino)benzophenone; thiothiones such as thiothione, 2-chlorothiothione, 2-methylthiothione, isopropylthiothione, and 2,4-diisopropylthiothione Photopolymerization initiator; 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-piperyl-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-phenylvinyl-s-triazine, 2-(naphthalen-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxy-naphthalen-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, 2,4-trichloromethyl-(4'-methoxyphenylvinyl)-6-triazine, 2-[4-(4-methoxyphenylvinyl)phenyl]-4,6-bis(trichloromethyl)-1,3,5-triazine and other triazine-based photopolymerization initiators; oxazole-based photopolymerization initiators; 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(4-ethyl)- 2,2'-Bis(2-bromophenyl)-4,4',5,5'-tetrakis(4-ethoxycarbonylphenyl)-1,2'-biimidazole, 2,2'-Bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-Bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, 2,2'-Bis(2,4,6-trichlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole,2,2'-bis(2-bromophenyl)-4,4,5,5'-tetraphenyl-1,2'-biimidazole,2,2'-bis(2,4-dibromophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole,2,2'-bis(2,4,6-tribromophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole and the like; benzimidazoline-based photopolymerization initiators represented by the following formula; and the like. As preferred specific examples of other photopolymerization initiators, the following compounds can be cited. When the compound represented by the above formula (1) is used as the photopolymerization initiator (C), the ratio of the mass of the compound represented by the above formula (1) to the mass of the photopolymerization initiator (C) is not particularly limited within the scope that does not impair the purpose of the present invention. The ratio of the compound represented by the above formula (1) to the mass of the photopolymerization initiator (C) is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 80% by mass or more, further preferably 90% by mass or more, and particularly preferably 100% by mass. The content of the photopolymerization initiator (C) is preferably 0.1% by mass or more and 30% by mass or less, and more preferably 0.5% by mass or more and 20% by mass or less relative to the mass of the solid components of the photosensitive composition. By setting the content of the photopolymerization initiator (C) within the above range, a photosensitive composition having good curability and less prone to pattern shape defects can be obtained. <Organic Solvent (S)> Typically, the photosensitive composition may contain an organic solvent (S) for the purpose of adjusting coating properties. Examples of the organic solvent (S) include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, (Poly) alkylene glycol monoalkyl ethers such as propylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether; (Poly) alkylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate; other ethers such as diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran; methyl ethyl Ketones such as methyl ketone, cyclohexanone, 2-heptanone, 3-heptanone; alkyl lactates such as methyl 2-hydroxypropionate and ethyl 2-hydroxypropionate; ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate , ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-amyl formate, isoamyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, n-propyl pyruvate, methyl acetylacetate, ethyl acetylacetate, ethyl 2-oxobutyrate and other esters; aromatic hydrocarbons such as toluene and xylene; amides such as N-methylpyrrolidone, N,N-dimethylformamide, and N,N-dimethylacetamide, etc. These solvents may be used alone or in combination of two or more. The amount of the organic solvent (S) used may be appropriately determined depending on the purpose of the photosensitive composition. As an example of the amount of the organic solvent (S) used, an amount in the range of 1 mass % to 50 mass % of the solid content concentration of the photosensitive composition can be cited. <Other components> The photosensitive composition may contain various additives other than those mentioned above as needed. Specifically, dispersing aids, fillers, fillers, adhesion promoters, antioxidants, ultraviolet absorbers, anti-agglomeration agents, heat retardants, defoaming agents, surfactants, etc. can be cited. As heat retardants used in the photosensitive composition, for example, hydroquinone, hydroquinone monoethyl ether, etc. can be cited. In addition, as defoaming agents, there can be exemplified organic silicon-based, fluorine-based, and other compounds, and as surfactants, there can be exemplified anionic, cationic, and nonionic compounds. <Method for preparing photosensitive composition> The photosensitive composition can be prepared by uniformly mixing the above-mentioned components in the desired amounts. It should be noted that when the prepared photosensitive composition does not contain insoluble components such as pigments, filtering can be performed using a filter to make the photosensitive composition uniform. ≪Method for producing a cured product≫ Typically, the photosensitive composition described above is prepared into a cured product by a method comprising the following steps: a step of molding the photosensitive composition according to the shape of the cured product; and a step of exposing the molded photosensitive composition. The cured product manufactured by the above method shows a relative dielectric constant of preferably less than 2.86, more preferably less than 2.84, further preferably less than 2.80, and particularly preferably less than 2.77. In addition, the manufactured cured product has high transparency, so it is useful in the use of display devices such as OLED, organic EL or liquid crystal, and can be suitably used for planarization films, interlayer insulating films, protective films for color filters, spacers for maintaining a constant thickness of the liquid crystal layer in a liquid crystal display device, or microlenses in solid-state imaging elements. The method of molding the photosensitive composition is not particularly limited, and can be appropriately selected according to the shape of the cured product. As the shape of the cured product, a film shape, a lens shape, a linear shape, a prism shape, etc. can be cited, but are not limited to these. Among these shapes, a film shape is preferred. There is no particular limitation on the method for molding the photosensitive composition. When the shape of the cured product is a lens shape, a prism shape, etc., a scraper or the like can be used to fill the photosensitive composition in a casting mold that matches the shape of the cured product. When the shape of the cured product is a linear shape, etc., the photosensitive composition can be applied to a substrate according to the shape of the cured product. As a coating method, for example, a printing method such as an inkjet method can be cited. As a method for coating the photosensitive composition in a film shape, a method using a contact transfer coating device such as a roller coater, a reverse coater, and a rod coater, a rotator (rotary coating device), a curtain flow coater, and other non-contact coating devices can be cited. In addition, the photosensitive composition can also be applied into a film shape by a printing method such as an inkjet method. When using the above-mentioned photosensitive composition, even if the coated surface of the substrate has a height difference, a coating film with uniform film thickness can be formed by following the height difference. There is no particular limitation on the thickness of the coating film. As for the thickness of the coating film, it is preferably 0.05 μm or more, and more preferably 1 μm or more. The thickness of the coating film can be, for example, 7 μm or more, and can be 10 μm or more. The upper limit of the thickness of the coating film is not particularly limited, for example, it can be 50 μm or less, and can be 20 μm or less. The thickness of the coating film is preferably 10 μm or less, more preferably 5 μm or less, and further preferably 2 μm or less. The thickness of the coating film is preferably in the range of 0.05 μm to 10 μm, more preferably in the range of 1 μm to 5 μm, and further preferably in the range of 1 μm to 2 μm. Then, the coating film is dried as needed. The drying method is not particularly limited. As drying methods, for example, there can be cited: (1) a method of drying for 60 seconds to 120 seconds using a heating plate at a temperature of 80°C to 120°C, preferably 90°C to 100°C; (2) a method of leaving the coating film at room temperature for several hours to several days; (3) a method of removing the solvent by placing the coating film in a warm air heater or an infrared heater for several tens of minutes to several hours; and the like. By exposing the coating film to light, a cured film can be formed. In the exposure, the light source is not particularly limited, and examples thereof include a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a carbon arc lamp, and an LED. Such a light source can be used to irradiate the coating film with radiation such as ArF excimer laser, KrF excimer laser, F2 excimer laser, extreme ultraviolet (EUV), vacuum ultraviolet (VUV), electron beam, X-ray, soft X-ray, g-ray, i-ray, h-ray, j-ray, and k-ray, or electromagnetic waves, thereby exposing the coating film. The exposure amount varies depending on the composition of the photosensitive composition, and is preferably 10 mJ/ cm2 or more and 2000 mJ/ cm2 or less, more preferably 100 mJ/ cm2 or more and 1500 mJ/cm2 or less , and further preferably 200 mJ/ cm2 or more and 1200 mJ/ cm2 or less. The exposure illuminance also varies depending on the composition of the photosensitive composition, and is preferably in the range of 1 mW/ cm2 or more and 50 mW/ cm2 or less. The cured film cured by exposure may be heated. The temperature during heating is not particularly limited, and is preferably 180°C or more and 280°C or less, more preferably 200°C or more and 260°C or less, and particularly preferably 220°C or more and 250°C or less. The heating time is typically preferably from 1 minute to 60 minutes, more preferably from 10 minutes to 50 minutes, and particularly preferably from 20 minutes to 40 minutes. On the other hand, the coating film can be exposed selectively. In this case, the coating film is selectively exposed through a negative mask having a light-transmitting portion having a shape corresponding to the pattern shape of the cured film. The exposure method is the same as the above-mentioned exposure method except that a negative mask is used. Then, the exposed coating film is developed using a developer to form a patterned cured film. The developing method is not particularly limited, and for example, an immersion method, a spray method, etc. can be used. As the developer, there can be mentioned organic developers such as monoethanolamine, diethanolamine, triethanolamine, and aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, quaternary ammonium salts, and the like. The patterned cured film obtained after development can be heated in the same manner as the exposure method applied to the patterned coating film described above. EXAMPLES Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to these examples. [Examples 1 to 6, and Comparative Examples 1 to 4] In the examples and comparative examples, acrylic resins P1 to P3 of the following structures and acrylic resin P4 of the following structure are used as the alkali-soluble resin (A). The weight average molecular weight of resin P1 in terms of polystyrene is 12,000. The weight average molecular weight of resin P2 in terms of polystyrene conversion is 10000. The weight average molecular weight of resin P3 in terms of polystyrene conversion is 8000. The weight average molecular weight of resin P4 in terms of polystyrene conversion is 10000. In the Examples and Comparative Examples, the following B-1 to B-3 were used as the photopolymerizable compound (B). B-1: dipentaerythritol hexaacrylate B-2: trihydroxymethylpropane triacrylate B-3: ditrihydroxymethylpropane tetraacrylate In the Examples and Comparative Examples, the following C-1 was used as the photopolymerization initiator (C). 13.73 parts by mass of the alkali-soluble resin (A) (component (A)) of the type listed in Table 1, 6.8 parts by mass of the photopolymerizable compound (B) (component (B)) of the type listed in Table 1, 1.22 parts by mass of the photopolymerizable compound (C) (component (C)) of the type listed in Table 1, 31.2 parts by mass of diethylene glycol methyl ethyl ether, 46.7 parts by mass of propylene glycol monomethyl ether acetate, 0.2 parts by mass of 3-glycidoxypropyltrimethoxysilane, 0.05 parts by mass of a surfactant (BYK-310, manufactured by BYK-Chemie), and 0.1 parts by mass of an antioxidant (IR1010, manufactured by BASF Japan) were mixed to obtain a photosensitive composition of each Example and each Comparative Example. Using the obtained photosensitive composition, the relative dielectric constant and pattern forming properties were evaluated according to the following method. The evaluation results are recorded in Table 1. <Relative dielectric constant measurement> As a method for measuring the relative dielectric constant, the mercury probe method was used. The device that can measure the relative dielectric constant using the mercury probe method is SSM-495 (manufactured by Japan Semilab Co., Ltd.). Through the following steps 1) to 4), the curable composition of each embodiment and comparative example is used to form a film-like cured product with a film thickness of 1μm. Then, the relative dielectric constant of the formed cured product is measured. 1) The curing composition is applied on a silicon wafer to form a coating film. 2) The formed coating film is heated at 100°C for 120 seconds. 3) The coating film was exposed at an exposure dose of 1 J/cm 2. 4) The exposed coating film was heated at 230°C for 20 minutes. <Evaluation of conformality> The prepared non-rotating coating composition was applied to a glass substrate (680×880 mm) partially formed with a structure having a thickness of 5 μm (W in FIG. 1 ), using a slit coater (TR-45000; manufactured by Tokyo Ohka Industry Co., Ltd.) at a coating speed of 120 mm/sec to apply the photosensitive composition of each embodiment and each comparative example, followed by drying at 100°C for 100 seconds to obtain a coating film. Next, the entire surface was exposed at an exposure dose of 100 mJ/cm 2 using a mirror projection alignment exposure device (product name: MPA-6000, manufactured by Canon). Next, a 0.04 mass% KOH aqueous solution at 23°C was sprayed for 70 seconds for development. Then, a calcination treatment (post-baking) was performed at 230°C for 20 minutes, and as shown in the cross-sectional view of FIG1 , a film having a film thickness of about 2.4 μm was obtained, which was represented by the difference (XW) between the maximum film thickness on the substrate (X; including the thickness of the structure on the substrate (W)) and the thickness of the structure on the substrate (W). For the cross section of the obtained post-baked film, as shown in the cross-sectional view of FIG1 , the difference (XY=Z) between the maximum film thickness on the substrate (X; including the thickness of the structure on the substrate (W)) and the minimum film thickness on the substrate (Y) was measured. When Z was less than 2 at a coating speed of 120 mm/sec, the shape retention was evaluated as poor (×), when it was 2 or more and 2.4 or less, the shape retention was evaluated as good (○), and when it exceeded 2.4, the shape retention was evaluated as particularly excellent (◎). As can be seen from Table 1, the photosensitive composition of the embodiment comprising the following acrylic resin as the alkaline-soluble resin (A) can form a cured product with a low relative dielectric constant and can form a coating film with good conformality on a substrate having a height difference, wherein the acrylic resin comprises a structural unit (A-1) derived from a polycycloalkyl (meth)acrylate in an amount of 20 mass % or more relative to the amount of all structural units and has a weight average molecular weight of 9,000 or more. On the other hand, in the case of using a comparative photosensitive composition containing an acrylic resin having a weight average molecular weight of less than 9,000 or containing less than 20 mass % (relative to the amount of all structural units) of a structural unit (A-1) derived from a polycycloalkyl (meth)acrylate as the alkaline-soluble resin (A), it is difficult to simultaneously achieve the formation of a cured product with a relatively low dielectric constant and the formation of a coating film with good conformality on a substrate having a height difference.

[圖1]是表示在本發明的實施例中評價的保形性的圖。[ Fig. 1 ] is a diagram showing the conformality evaluated in the embodiment of the present invention.

Claims (6)

一種感光性組合物，其包含鹼溶性樹脂(A)、光聚合性化合物(B)，及光聚合引發劑(C)，前述鹼溶性樹脂(A)包含下述丙烯酸系樹脂，前述丙烯酸系樹脂包含相對於全部結構單元的量而言為20質量%以上之來自(甲基)丙烯酸多環烷基酯的結構單元(A-1)，前述丙烯酸系樹脂以相對於全部結構單元的量而言為30質量%以上且70質量%以下的量包含來自含有脂環式環氧基之(甲基)丙烯酸酯的結構單元(A-2)，前述光聚合引發劑(C)包含下述式(1)表示的化合物，
Figure 110105659-A0305-13-0001-1
 式(1)中，Rc1為氫原子、硝基或一價有機基團，Rc2及Rc3各自為可具有取代基的鏈狀烷基、可具有取代基的環狀有機基團、或氫原子，Rc2與Rc3可彼此鍵結而形成環，Rc4為一價有機基團，Rc5為氫原子、可具有取代基之碳原子數1以上且11以下的烷基、或可具有取代基的芳基，n1為0以上且4以下的整數，n2為0或1，前述丙烯酸系樹脂的重量平均分子量為9,000以上。 A photosensitive composition comprises an alkali-soluble resin (A), a photopolymerizable compound (B), and a photopolymerization initiator (C), wherein the alkali-soluble resin (A) comprises an acrylic resin comprising 20% by mass or more of a structural unit (A-1) derived from a polycyclic alkyl (meth)acrylate based on the amount of all structural units, the acrylic resin comprising 30% by mass or more and 70% by mass or less of a structural unit (A-2) derived from a (meth)acrylate containing an alicyclic epoxy group based on the amount of all structural units, and the photopolymerization initiator (C) comprises a compound represented by the following formula (1):
Figure 110105659-A0305-13-0001-1
 In formula (1), Rc1 is a hydrogen atom, a nitro group or a monovalent organic group, Rc2 and Rc3 are each a chain alkyl group which may have a substituent, a cyclic organic group which may have a substituent, or a hydrogen atom, Rc2 and Rc3 may be bonded to each other to form a ring, Rc4 is a monovalent organic group, Rc5 is a hydrogen atom, an alkyl group having 1 to 11 carbon atoms which may have a substituent, or an aryl group which may have a substituent, n1 is an integer of 0 to 4, n2 is 0 or 1, and the weight average molecular weight of the acrylic resin is 9,000 or more. 如請求項1的感光性組合物，其中，前述丙烯酸系樹脂包含相對於全部結構單元的量而言為20質量 %以上且40質量%以下的前述結構單元(A-1)。 The photosensitive composition of claim 1, wherein the acrylic resin contains the structural unit (A-1) in an amount of 20% by mass or more and 40% by mass or less relative to the amount of all structural units. 如請求項1或2之感光性組合物，其中，前述光聚合性化合物(B)包含具有3個以上之(甲基)丙烯醯基的多官能化合物。 The photosensitive composition of claim 1 or 2, wherein the photopolymerizable compound (B) comprises a multifunctional compound having three or more (meth)acryl groups. 如請求項3的感光性組合物，其中，前述光聚合性化合物(B)包含具有3或4個之(甲基)丙烯醯基的多官能化合物。 As in claim 3, the photosensitive composition, wherein the photopolymerizable compound (B) comprises a multifunctional compound having 3 or 4 (meth)acryloyl groups. 一種固化物，其為請求項1~4中任一項之感光性組合物的固化物。 A cured product, which is a cured product of the photosensitive composition of any one of claims 1 to 4. 一種固化物的製造方法，其包括下述步驟：將請求項1~4中任一項之感光性組合物根據形成之固化物的形狀來進行成型的步驟；及對經成型之前述感光性組合物進行曝光的步驟。A method for producing a cured product comprises the following steps: forming the photosensitive composition of any one of claims 1 to 4 according to the shape of the cured product to be formed; and exposing the formed photosensitive composition.
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