TWI887113B - Electronic device and chassis - Google Patents
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- TWI887113B TWI887113B TW113134374A TW113134374A TWI887113B TW I887113 B TWI887113 B TW I887113B TW 113134374 A TW113134374 A TW 113134374A TW 113134374 A TW113134374 A TW 113134374A TW I887113 B TWI887113 B TW I887113B
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Abstract
Description
本發明係關於一種電子裝置與機殼,特別是一種設有卡扣部以及限位彈臂的電子裝置與機殼。The present invention relates to an electronic device and a casing, in particular to an electronic device and a casing provided with a buckle portion and a limit spring arm.
在伺服器中,擴充卡具有多種用途,例如圖像處理、網路介面、外圍設備介面、儲存資料等。使用者可以根據自身需求於伺服器中安裝所需用途的擴充卡,以擴充伺服器的功能。In a server, expansion cards have many uses, such as image processing, network interface, peripheral device interface, data storage, etc. Users can install expansion cards of the required purpose in the server according to their own needs to expand the functions of the server.
擴充卡包含顯示卡、網卡、智慧網卡等。以智慧網卡為例,智慧網卡通常會透過壓鑄而成的框架以及導軌裝設於機殼。其中,導軌通常會透過拉釘或蘑菇頭鉚釘來固定於機殼。然而,壓鑄而成的框架的製造成本高。此外,透過拉釘或蘑菇頭鉚釘來固定導軌亦會提高導軌的組裝成本。因此,如何降低用於擴充卡之框架以及導軌的製造與組裝成本,即為研發人員應解決的問題之一。Expansion cards include display cards, network cards, smart network cards, etc. Taking smart network cards as an example, smart network cards are usually installed in the chassis through die-cast frames and rails. Among them, the rails are usually fixed to the chassis through nails or mushroom-head rivets. However, the manufacturing cost of the die-cast frame is high. In addition, fixing the rails with nails or mushroom-head rivets will also increase the assembly cost of the rails. Therefore, how to reduce the manufacturing and assembly costs of the frame and rails used for expansion cards is one of the problems that researchers should solve.
本發明在於提供一種電子裝置與機殼,藉以降低電子裝置的製造與組裝成本。The present invention provides an electronic device and a casing to reduce the manufacturing and assembly costs of the electronic device.
本發明之一實施例所揭露之電子裝置包含一殼體、一框架件、至少一導軌以及一擴充卡。殼體包含至少一第一卡扣部以及至少一限位槽。框架件可分離地設置於殼體,並包含一容置空間。至少一導軌包含一本體部、至少一第二卡扣部以及至少一限位彈臂。至少一第二卡扣部與至少一限位彈臂連接於本體部。至少一第二卡扣部可分離地設置於相對應的第一卡扣部,並可相對第一卡扣部滑移,以令至少一第二卡扣部卡扣於相對應的第一卡扣部且令至少一限位彈臂可分離地抵頂於相對應的限位槽,使得至少一導軌固定於殼體,或令至少一第二卡扣部與相對應的第一卡扣部相解扣,使得至少一導軌與殼體相分離。擴充卡可移動地設置於本體部,並至少部分位於容置空間。The electronic device disclosed in one embodiment of the present invention comprises a housing, a frame, at least one guide rail and an expansion card. The housing comprises at least one first buckle portion and at least one limit groove. The frame can be detachably arranged on the housing and comprises a containing space. The at least one guide rail comprises a main body, at least one second buckle portion and at least one limit spring arm. The at least one second buckle portion and the at least one limit spring arm are connected to the main body. At least one second buckle part can be detachably arranged on the corresponding first buckle part, and can slide relative to the first buckle part, so that at least one second buckle part is buckled on the corresponding first buckle part and at least one limit spring arm can be detachably pressed against the corresponding limit groove, so that at least one guide rail is fixed to the housing, or at least one second buckle part is unfastened from the corresponding first buckle part, so that at least one guide rail is separated from the housing. The expansion card is movably arranged on the main body, and at least part of it is located in the accommodating space.
本發明之另一實施例所揭露之機殼用以供一擴充卡裝設,並包含一殼體、一框架件以及至少一導軌。殼體包含至少一第一卡扣部以及至少一限位槽。框架件可分離地設置於殼體,並包含一容置空間。容置空間用以容置至少部分擴充卡。至少一導軌包含一本體部、至少一第二卡扣部以及一至少一限位彈臂。本體部用以供擴充卡可移動地設置。至少一第二卡扣部與至少一限位彈臂連接於本體部。至少一第二卡扣部可分離地設置於相對應的第一卡扣部,並可相對第一卡扣部滑移,以令至少一第二卡扣部卡扣於相對應的第一卡扣部且令至少一限位彈臂可分離地抵頂於相對應的限位槽,使得至少一導軌固定於殼體,或令至少一第二卡扣部與相對應的第一卡扣部相解扣,使得至少一導軌與殼體相分離。Another embodiment of the present invention discloses a housing for mounting an expansion card, and includes a housing, a frame member, and at least one guide rail. The housing includes at least one first buckle portion and at least one limit groove. The frame member can be detachably disposed on the housing, and includes a storage space. The storage space is used to accommodate at least part of the expansion card. The at least one guide rail includes a main body, at least one second buckle portion, and at least one limit spring arm. The main body is used for movably mounting the expansion card. The at least one second buckle portion and the at least one limit spring arm are connected to the main body. At least one second buckle portion can be detachably arranged on the corresponding first buckle portion and can slide relative to the first buckle portion, so that the at least one second buckle portion is buckled on the corresponding first buckle portion and the at least one limit spring arm can be detachably pressed against the corresponding limit groove, so that the at least one guide rail is fixed to the shell, or the at least one second buckle portion is disengaged from the corresponding first buckle portion, so that the at least one guide rail is separated from the shell.
根據上述實施例之電子裝置與機殼,由於導軌包含第二卡扣部與限位彈臂,使得使用者欲將導軌固定於機殼時,可透過第二卡扣部卡扣於機殼之第一卡扣部,並透過限位彈臂抵靠於限位槽而限位導軌,故無需額外透過其他緊固件來將導軌固定於機殼。如此一來,可降低電子裝置的製造與組裝成本。According to the electronic device and the housing of the above embodiment, since the rail includes the second buckle part and the limit spring arm, when the user wants to fix the rail to the housing, the second buckle part can be buckled to the first buckle part of the housing, and the limit spring arm can be pressed against the limit groove to limit the rail, so there is no need to use other fasteners to fix the rail to the housing. In this way, the manufacturing and assembly costs of the electronic device can be reduced.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.
請參閱圖1至圖4。圖1為根據本發明實施例所述之電子裝置的立體示意圖。圖2為圖1之電子裝置之另一視角的立體示意圖。圖3為圖1之電子裝置的分解示意圖。圖4為圖1之電子裝置的剖視示意圖。Please refer to Figures 1 to 4. Figure 1 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present invention. Figure 2 is a three-dimensional schematic diagram of the electronic device of Figure 1 from another viewing angle. Figure 3 is an exploded schematic diagram of the electronic device of Figure 1. Figure 4 is a cross-sectional schematic diagram of the electronic device of Figure 1.
本實施例之電子裝置10包含一殼體11、一框架件12、二導軌13以及一擴充卡14。其中,殼體11、框架件12以及二導軌13共同構成一機殼的一部分。殼體11具有四第一卡扣部111以及二限位槽112。第一卡扣部111例如為卡扣槽。其中,四第一卡扣部111以及二限位槽112例如呈對稱分布。舉例來說,四第一卡扣部111之二者以及二限位槽112之一者與四第一卡扣部111之另二者以及二限位槽112之另一者沿一中線對稱,且中線兩側之限位槽112例如皆位於二第一卡扣部111之間。The
框架件12例如透過鈑金彎折而成。框架件12可分離地設置於殼體11,並具有一容置空間S。詳細來說,框架件12包含一底框121、二側框122以及一頂框123。二側框122之一端分別連接於底框121之相對兩端。二側框122之另一端分別連接於頂框123之相對兩端。底框121可分離地設置於殼體11。舉例來說,底框121可分離地鉚接於殼體11。底框121、二側框122以及頂框123共同圍繞出容置空間S。The
二導軌13例如由塑膠材質所製成。二導軌13例如沿一中線對稱,並可分離地設置於殼體11。由於四第一卡扣部111、二限位槽112以及二導軌13皆相對稱,且每一第一卡扣部111的結構、每一限位槽112的結構以及每一導軌13的結構相同,故以下以其中一側之二第一卡扣部111與一限位槽112以及其中一導軌13來說明。The two
導軌13包含一本體部131、二第二卡扣部132以及二限位彈臂133。二第二卡扣部132與二限位彈臂133連接於本體部131。第二卡扣部132例如為卡扣凸塊。二限位彈臂133之一端相連。二限位彈臂133例如朝相異方向延伸且不平行。The
二第二卡扣部132分別可分離地設置於二第一卡扣部111,並可相對二第一卡扣部111滑移,以令二第二卡扣部132分別卡扣於二第一卡扣部111且令限位彈臂133之一者可分離地抵頂於限位槽112,使得導軌13固定於殼體11以避免導軌13脫落,或令二第二卡扣部132分別與二第一卡扣部111相解扣,使得二導軌13與殼體11相分離。其中,透過設有朝相異方向延伸且不平行的二限位彈臂133,使得二導軌13於不同方向裝設於殼體11時,皆可透過限位彈臂133抵頂於限位槽112。也就是說,二導軌13可在裝設方向上共用。The two
擴充卡14例如為智慧網卡(Smart NIC)。擴充卡14可移動地設置於本體部131,並至少部分位於容置空間S。其中,擴充卡14例如透過螺絲鎖附於框架件12之側框122。此外,底框121具有一凸包結構1211。凸包結構1211朝頂框123凸出。擴充卡14至少部分承靠於凸包結構1211。也就是說,凸包結構1211墊高擴充卡14,以便於擴充卡14與外接線纜的接頭(未繪示)對接。The
在本實施例中,由於導軌13包含第二卡扣部132與限位彈臂133,使得使用者欲將導軌13固定於機殼時,可透過第二卡扣部132卡扣於機殼之第一卡扣部111,並透過限位彈臂133抵靠於限位槽112而限位導軌13,故無需額外透過其他緊固件來將導軌13固定於機殼。如此一來,可降低導軌13的組裝成本。In this embodiment, since the
此外,由於框架件12透過鈑金所構成,而無需額外開設模具來進行壓鑄,故可降低框架件12的製造成本。In addition, since the
在本實施例中,底框121、二側框122以及頂框123之一側例如各設有摺邊,但不以此為限。如此一來,可避免裝設擴充卡14以及插接外接線纜時,鈑金材質之框架件12刮傷擴充卡14與外接線纜。In this embodiment, the
在本實施例中,導軌13的數量為二個,但不以此為限。在其他實施例中,導軌的數量也可以僅為單個或三個以上。In the present embodiment, the number of
在本實施例中,第一卡扣部111為卡扣槽,第二卡扣部132為卡扣凸塊,但不以此為限。在其他實施例中,第一卡扣部與第二卡扣部也可以凹凸對調。也就是說,第一卡扣部也可以為卡扣凸塊,第二卡扣部也可以為卡扣槽。In this embodiment, the
在本實施例中,殼體11中每一側之第一卡扣部111的數量與限位槽112的數量分別為二個與單個,每一導軌13之第二卡扣部132的數量與限位彈臂133的數量分別為二個,但不以此為限。在其他實施例中,殼體中每一側之第一卡扣部的數量也可以僅為單個或三個以上,殼體中每一側之限位槽的數量也可以為多個,每一導軌之第二卡扣部的數量與限位彈臂的數量也可以分別僅為單個或三個以上。In this embodiment, the number of the
在本實施例中,底框121具有凸包結構1211,但不以此為限。在其他實施例中,底框也可以未具有凸包結構。In this embodiment, the
請一併參閱圖5至圖7。圖5為圖1之電子裝置中框架件欲裝設於殼體的剖視示意圖。圖6為圖1之電子裝置中第二卡扣部設置於第一卡扣部且尚未相卡扣的剖視示意圖。圖7為圖1之電子裝置中第二卡扣部卡扣於第一卡扣部的剖視示意圖。Please refer to Figures 5 to 7 together. Figure 5 is a cross-sectional diagram of the frame member in the electronic device of Figure 1 being installed in the housing. Figure 6 is a cross-sectional diagram of the second buckle portion in the electronic device of Figure 1 being arranged on the first buckle portion and not yet buckled. Figure 7 is a cross-sectional diagram of the second buckle portion in the electronic device of Figure 1 being buckled in the first buckle portion.
當使用者欲將二導軌13組裝於殼體11時,如圖5與圖6所示,以其中一導軌13為例,沿方向A將導軌13裝設於殼體11。此時二第二卡扣部132分別位於二第一卡扣部111,且限位彈臂133抵靠於殼體11而沿方向B壓縮以儲存彈力。接著,如圖7所示,沿方向C移動導軌13,使得二第二卡扣部132分別與二第一卡扣部111相卡扣,且限位彈臂133移動至限位槽112並釋放彈力,而沿方向D復位並抵頂於限位槽112,以避免導軌13沿方向C之反向脫落。如此一來,即可完成二導軌13與殼體11之組裝。When the user wants to assemble the two
反之,當使用者欲將二導軌13自殼體11移除時,以其中一導軌13為例,可透過沿方向D之反向按壓限位彈臂133,使得限位彈臂133與限位槽112相分離,並沿方向C之反向解除二第二卡扣部132分別與二第一卡扣部111之卡扣。接著,沿方向A之反向將導軌13自殼體11移出。如此一來,即可完成二導軌13自殼體11之移除。On the contrary, when the user wants to remove the two
根據上述實施例之電子裝置與機殼,由於導軌包含第二卡扣部與限位彈臂,使得使用者欲將導軌固定於機殼時,可透過第二卡扣部卡扣於機殼之第一卡扣部,並透過限位彈臂抵靠於限位槽而限位導軌,故無需額外透過其他緊固件來將導軌固定於機殼。如此一來,可降低導軌的組裝成本。According to the electronic device and the housing of the above embodiment, since the rail includes the second buckle part and the limit spring arm, when the user wants to fix the rail to the housing, the second buckle part can be buckled to the first buckle part of the housing, and the limit spring arm can be pressed against the limit groove to limit the rail, so there is no need to use other fasteners to fix the rail to the housing. In this way, the assembly cost of the rail can be reduced.
此外,由於框架件透過鈑金所構成,而無需額外開設模具來進行壓鑄,故可降低框架件的製造成本。In addition, since the frame is made of sheet metal, no additional mold is required for die-casting, so the manufacturing cost of the frame can be reduced.
在本實施例中所提供之電子裝置與機殼可應用於例如伺服器主機中,該伺服器主機係可用於人工智慧(Artificial Intelligence,簡稱AI)運算、邊緣運算(edge computing),亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。The electronic device and the housing provided in the present embodiment can be applied to, for example, a server host, which can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, a cloud server, or a vehicle networking server.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone skilled in similar techniques may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.
10:電子裝置 11:殼體 111:第一卡扣部 112:限位槽 12:框架件 121:底框 1211:凸包結構 122:側框 123:頂框 13:導軌 131:本體部 132:第二卡扣部 133:限位彈臂 14:擴充卡 A~D:方向 S:容置空間10: electronic device 11: housing 111: first buckle part 112: limit groove 12: frame 121: bottom frame 1211: convex structure 122: side frame 123: top frame 13: guide rail 131: main body 132: second buckle part 133: limit spring arm 14: expansion card A~D: direction S: storage space
圖1為根據本發明實施例所述之電子裝置的立體示意圖。 圖2為圖1之電子裝置之另一視角的立體示意圖。 圖3為圖1之電子裝置的分解示意圖。 圖4為圖1之電子裝置的剖視示意圖。 圖5為圖1之電子裝置中框架件欲裝設於殼體的剖視示意圖。 圖6為圖1之電子裝置中第二卡扣部設置於第一卡扣部且尚未相卡扣的剖視示意圖。 圖7為圖1之電子裝置中第二卡扣部卡扣於第一卡扣部的剖視示意圖。 FIG. 1 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of the electronic device of FIG. 1 from another perspective. FIG. 3 is a schematic diagram of an exploded view of the electronic device of FIG. 1. FIG. 4 is a schematic diagram of a cross-sectional view of the electronic device of FIG. 1. FIG. 5 is a schematic diagram of a cross-sectional view of the frame member of the electronic device of FIG. 1 to be installed in the housing. FIG. 6 is a schematic diagram of a cross-sectional view of the electronic device of FIG. 1 in which the second buckle portion is arranged on the first buckle portion and has not yet been buckled. FIG. 7 is a schematic diagram of a cross-sectional view of the electronic device of FIG. 1 in which the second buckle portion is buckled on the first buckle portion.
10:電子裝置 10: Electronic devices
11:殼體 11: Shell
111:第一卡扣部 111: First buckle part
112:限位槽 112: Limiting slot
12:框架件 12: Frame parts
121:底框 121: Bottom frame
1211:凸包結構 1211:convex hull structure
122:側框 122: Side frame
123:頂框 123: Top frame
13:導軌 13:Guide rails
131:本體部 131: Headquarters
132:第二卡扣部 132: Second buckle part
133:限位彈臂 133: Limiting spring arm
14:擴充卡 14: Expansion card
Claims (10)
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| TW113134374A TWI887113B (en) | 2024-09-11 | 2024-09-11 | Electronic device and chassis |
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| TW113134374A TWI887113B (en) | 2024-09-11 | 2024-09-11 | Electronic device and chassis |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994008444A1 (en) * | 1992-09-25 | 1994-04-14 | Berg Technology, Inc. | Card system with retaining latches |
| TWM315947U (en) * | 2007-01-15 | 2007-07-21 | Hon Hai Prec Ind Co Ltd | Locking structure for enclosure and slide |
| US7679933B2 (en) * | 2005-07-15 | 2010-03-16 | Fujitsu Limited | Loadable/unloadable adapter for substrate |
| CN101840251A (en) * | 2009-03-16 | 2010-09-22 | 英业达股份有限公司 | Framework |
| TWM527670U (en) * | 2016-02-05 | 2016-08-21 | Cao Zhi Guang | Hard disk fast disassembly unit and hard disk swap module |
| TW202121958A (en) * | 2019-11-22 | 2021-06-01 | 英業達股份有限公司 | Mount structure for expansion card and circuit assembly |
-
2024
- 2024-09-11 TW TW113134374A patent/TWI887113B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994008444A1 (en) * | 1992-09-25 | 1994-04-14 | Berg Technology, Inc. | Card system with retaining latches |
| US7679933B2 (en) * | 2005-07-15 | 2010-03-16 | Fujitsu Limited | Loadable/unloadable adapter for substrate |
| TWM315947U (en) * | 2007-01-15 | 2007-07-21 | Hon Hai Prec Ind Co Ltd | Locking structure for enclosure and slide |
| CN101840251A (en) * | 2009-03-16 | 2010-09-22 | 英业达股份有限公司 | Framework |
| TWM527670U (en) * | 2016-02-05 | 2016-08-21 | Cao Zhi Guang | Hard disk fast disassembly unit and hard disk swap module |
| TW202121958A (en) * | 2019-11-22 | 2021-06-01 | 英業達股份有限公司 | Mount structure for expansion card and circuit assembly |
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