TWI887027B - Manufacturing method of electronic device - Google Patents

Abstract

A manufacturing method of an electronic device is provided. The manufacturing method includes the following steps. An electronic component is provided to be electronically connected to a testing device. A forward bias voltage is applied to the electronic component via the testing device, such that the electronic component is determined to be normal or damage based on a light emitted by the electronic component or a thermal characteristic of the electronic component. Alternatively, a reverse bias voltage is applied to the electronic component via the testing device, such that the electronic component is determined to be normal or damage based on a capacitance modulation function of the electronic component. The electronic component determined as normal is transported to a next production site.

Description

Method for manufacturing electronic device

The present invention relates to a device, and in particular to a method for manufacturing an electronic device.

The existing electronic devices including variable capacitors are tested after manufacturing by applying reverse bias to the variable capacitors to test whether the variable capacitors are normal or damaged. The existing variable capacitors are difficult to test after bonding to the substrate. In addition, the existing tests are product function tests performed after multiple variable capacitors have been bonded to the substrate, and cannot locate the damage of a single capacitor.

The present disclosure is directed to a method for manufacturing an electronic device, which can automatically determine whether an electronic component in the electronic device is damaged during the manufacturing process, so as to repair the electronic component determined to be damaged during the manufacturing process.

According to an embodiment of the present disclosure, the manufacturing method of the electronic device of the present disclosure includes the following steps. Provide at least one electronic component to be electrically connected to a test device. Apply a forward bias to at least one electronic component through the test device to determine whether at least one electronic component is normal or damaged based on the light emitted by at least one electronic component or the thermal characteristics of at least one electronic component. Transport at least one electronic component determined to be normal to the next production site. At least one electronic component is driven by a reverse bias to perform a capacitance modulation function of at least one electronic component.

According to another embodiment of the present disclosure, the manufacturing method of the electronic device of the present disclosure includes the following steps. Provide at least one electronic component to be electrically connected to a test device. Apply a reverse bias to at least one electronic component through the test device to determine whether the at least one electronic component is normal or damaged based on the capacitance modulation function of the at least one electronic component. Transport the at least one electronic component determined to be normal to the next production site. At least one electronic component is mainly driven by another reverse bias in the working mode to perform the capacitance modulation function of the at least one electronic component.

The manufacturing method of the electronic device disclosed in the present invention can accurately and conveniently judge whether the electronic component is normal or damaged by applying a forward bias to the electronic component based on the light or heat characteristics emitted by the electronic component, or by applying a reverse bias to the electronic component based on the capacitance modulation function of the electronic component.

In order to make the above features and advantages of the present disclosure more clearly understood, embodiments are specifically cited below and described in detail with reference to the accompanying drawings.

Reference will now be made in detail to exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to represent the same or similar parts.

Certain terms are used throughout this disclosure and in the attached patent claims to refer to specific components. It should be understood by those skilled in the art that electronic device manufacturers may refer to the same component by different names. This document is not intended to distinguish between components that have the same function but different names. In the following description and patent claims, the words "including" and "comprising" are open-ended words and should therefore be interpreted as "including but not limited to..."

In some embodiments of the present disclosure, the terms "joined" and "connected" may refer to two structures being in direct contact, or may refer to two structures not being in direct contact, with other structures disposed between the two structures, unless otherwise specifically defined. Furthermore, the terms "joined" and "connected" may also include situations where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" and "coupled" include any direct and indirect electrical connection means.

The ordinal numbers used in the specification and patent application, such as "first", "second", etc., are used to modify the components, and they themselves do not imply or represent the components, or any previous ordinal numbers of the components, nor do they represent the order of one component to another component, or the order of the manufacturing method. The use of these ordinal numbers is only used to make it possible to clearly distinguish a component with a certain name from another component with the same name. The patent application and the specification may not use the same terms, and accordingly, the first component in the specification may be the second component in the patent application. It should be noted that the following embodiments can replace, reorganize, and mix the features in several different embodiments to complete other embodiments without departing from the spirit of the present disclosure. The features between the embodiments can be mixed and matched as needed as long as they do not violate the spirit of the invention or conflict with each other.

FIG. 1 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. Referring to FIG. 1 , FIG. 1 may be a top view of an electronic device 100. The electronic device 100 includes a substrate 101, a plurality of electronic components 110, a driving circuit 120, 130, and a plurality of test pads 140. In the present embodiment, the plurality of electronic components 110 are arranged in an active area 102 of the substrate 101, and the driving circuits 120, 130 and the plurality of test pads 140 are arranged in a peripheral area 103 outside the active area 102. In the present embodiment, the plurality of electronic components 110 are arranged in an array in the active area 102 of the substrate 101, and are electrically connected to the driving circuits 120, 130 and the plurality of test pads 140 through a plurality of traces. In other embodiments, the plurality of electronic components 110 may also be disposed in the active region 102 of the substrate 101 in a randomly arranged and connected manner.

In this embodiment, the driving circuits 120 and 130 may be respectively disposed in the peripheral area of the substrate 101 and close to the adjacent side edges of the substrate 101, but the present disclosure is not limited thereto. In one embodiment, the driving circuits 120 and 130 may also be respectively disposed at the positions of the opposite side edges or the same side edges of the substrate 101. In this embodiment, the plurality of test pads 140 may be disposed in the peripheral area of the substrate 101 and along a position different from a side edge of the driving circuits 120 and 130, but the present disclosure is not limited thereto. In one embodiment, the plurality of test pads 140 may be disposed along two side edges of the substrate 101 different from the driving circuits 120 and 130 or along one or more side edges of the substrate 101 that are the same as the driving circuits 120 and 130 .

In the present embodiment, the electronic device 100 may be a tuning device, such as an antenna device, etc. The antenna device may, for example, include an antenna splicing device, but is not limited thereto. However, the present disclosure is not limited thereto. In one embodiment, the electronic device 100 may be a display device, a sensing device, a touch display device, a curved display device, or a free shape display device, but is not limited thereto. The antenna device may, for example, include an antenna splicing device, but is not limited thereto. In addition, the substrate and carrier described in each embodiment of the present disclosure may be a circuit substrate, a glass substrate, or a flexible substrate, etc.

In the present embodiment, the plurality of electronic components 110 may include a variable capacitance diode (or varicap diode) and/or a light emitting diode. In the present embodiment, the driving circuits 120 and 130 may be a source driving circuit and a gate driving circuit, respectively, and are used to drive the plurality of electronic components 110, but the present disclosure is not limited thereto. In the present embodiment, the plurality of test pads 140 may be used to test whether the plurality of electronic components 110 are normal or damaged (fail) during the manufacturing process of the electronic device 100, so as to repair the damaged electronic components during the manufacturing process of the electronic device 100.

FIG. 2 is a flow chart of a method for manufacturing an electronic device according to an embodiment of the present disclosure. Referring to FIG. 1 and FIG. 2 , the electronic device 100 of FIG. 1 can be manufactured by performing the following steps S210 to 240. In step S210, a substrate 101 is provided. A circuit trace can be formed on the substrate 101 first. In step S220, (at least one) electronic component 110 is bonded to the substrate 101. The location of the electronic component 110 on the substrate 101 can be determined based on the previously formed circuit trace. In this embodiment, the electronic component 110 may include a variable capacitor, and the variable capacitor of the electronic component 110 may be driven mainly by a reverse bias (or reverse current) in the working mode (driven by a signal provided by the driving circuits 120 and 130) to perform a capacitance modulation function through the electron depletion region of the variable capacitor.

In step S230, a forward bias (or forward current) is applied to the electronic component 110 by the test device, and the electronic component 110 is judged to be normal or damaged. The test device can provide a forward bias to the variable capacitor of the electronic component 110 through the test pad 140, so that the variable capacitor can realize a diode function to emit light (electromagnetic wave) with a specific wavelength (e.g., 0.2~1000 microns (um)). In this embodiment, a light detection element can be used to detect whether the electronic component 110 emits light with a specific wavelength to judge whether the variable capacitor of the electronic component 110 is normal or damaged. The light with a specific wavelength is emitted from the variable capacitor. Alternatively, in one embodiment, an infrared imager can be used to detect whether the circuit traces and the variable capacitor of the electronic component 110 have normal thermal characteristics (thermal distribution) to determine whether the variable capacitor of the electronic component 110 is normal or damaged (including determining whether the variable capacitor and the circuit traces are electrically connected normally).

In step S240, the substrate 101 provided with the electronic components judged to be normal is transported, or the electronic components judged to be damaged are repaired. In this regard, when it is judged that there are damaged electronic components, the manufacturing personnel or manufacturing equipment can be notified to replace or repair the damaged electronic components. When all the electronic components 110 are normal, the next manufacturing process of the electronic device 100 (for example, forming the driving circuits 120, 130) or packaging can be performed, and the present disclosure is not limited thereto. Therefore, the manufacturing method of this embodiment can automatically determine whether the electronic component 110 in the electronic device 100 is damaged during the manufacturing process, so that the electronic component determined to be damaged can be repaired during the manufacturing process, thereby effectively improving the manufacturing yield of the electronic device 100.

FIG3 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. Referring to FIG3 , FIG3 may be a top view of the electronic device 300, and may represent the (product) structure of the electronic device 300 after completing the manufacturing process. In this embodiment, the electronic device 300 includes a substrate 301, a plurality of electronic components 310, a driving circuit 320, 330, and a plurality of test pads 341, 342. In this embodiment, the plurality of electronic components 310 are arranged on the substrate 301 in an array arrangement, and are electrically connected to the driving circuits 320, 330 and the plurality of test pads 341, 342 through a plurality of traces. Compared to FIG. 1 , the plurality of test pads 341, 342 of this embodiment are formed on the substrate 301 at positions different from the two side edges of the driving circuits 320, 330. Moreover, it is worth noting that the driving circuits 320, 330 and the plurality of test pads 341, 342 are formed on the substrate 301. When the electronic device 300 is completed and passes the test of step S230 described in the embodiment of FIG. 2 above, the plurality of test pads 341, 342 can be retained on the substrate 301.

FIG. 4 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. Referring to FIG. 4 , FIG. 4 may be a top view of the electronic device 400, and may represent the (product) structure of the electronic device 400 after completing the manufacturing process. In this embodiment, the electronic device 400 includes a substrate 401, a plurality of electronic components 410, a driving circuit 420, 430, and a plurality of test pads 441, 442. In this embodiment, the plurality of electronic components 410 are arranged on the substrate 401 in an array arrangement, and are electrically connected to the driving circuits 420, 430 and the plurality of test pads 441, 442 through a plurality of traces. Compared to FIG. 3 , based on the requirements of product specifications (i.e., limited by the substrate area requirements), after the electronic device 400 is completed and passes the test of step S230 as described in the embodiment of FIG. 2 , the plurality of test pads 441 and 442 will be removed. In other words, the plurality of test pads 441 and 442 can be formed on the substrate 401 or other substrates before the substrate is cut.

FIG5 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. Referring to FIG5 , FIG5 may be a top view of the electronic device 500, and may represent the (product) structure of the electronic device 500 after the manufacturing process is completed. In this embodiment, the electronic device 500 includes a substrate 501, a plurality of electronic components 510, a driving circuit 520, 530, and a plurality of test pads 541, 542. In this embodiment, the plurality of electronic components 510 are arranged on the substrate 501 in an array arrangement, and are electrically connected to the driving circuits 520, 530 and the plurality of test pads 541, 542 through a plurality of traces. Compared to FIG. 1 , the plurality of test pads 541, 542 of this embodiment are formed on the substrate 501 at the same positions as the two side edges of the driving circuits 520, 530, and are electrically connected to the plurality of electronic components 510 through the driving circuits 520, 530. It is worth noting that the driving circuits 520, 530 and the plurality of test pads 541, 542 are formed on the substrate 501. When the electronic device 500 is completed and passes the test of step S230 described in the embodiment of FIG. 2 above, the plurality of test pads 541, 542 can be retained on the substrate 501.

FIG6 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. Referring to FIG6 , FIG6 may be a top view of the electronic device 600, and may represent the (product) structure of the electronic device 600 after the manufacturing process is completed. In this embodiment, the electronic device 600 includes a substrate 601, a plurality of electronic components 610, a driving circuit 620, 630, and a plurality of test pads 641, 642. In this embodiment, the plurality of electronic components 610 are arranged on the substrate 601 in an array arrangement, and are electrically connected to the driving circuits 620, 630 and the plurality of test pads 641, 642 through a plurality of traces. Compared to FIG. 5 , based on the requirements of product specifications (i.e., limited by the substrate area requirements), after the electronic device 600 is completed and passes the test of step S230 as described in the embodiment of FIG. 2 , the plurality of test pads 641 and 642 will be removed. In other words, the plurality of test pads 641 and 642 can be formed on the substrate 601 or other substrates before the substrate is cut.

FIG7 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. Referring to FIG7 , FIG7 may be a top view of an electronic device 700, and may represent the (product) structure of the electronic device 700 after completing the manufacturing process. In this embodiment, the electronic device 700 includes a substrate 701, a plurality of electronic components 710, and a plurality of test pads 741, 742. In this embodiment, the plurality of electronic components 710 are arranged on the substrate 701 in an array arrangement, and are electrically connected to the plurality of test pads 741, 742 through a plurality of traces. Compared to FIG1 , the plurality of test pads 741, 742 of this embodiment are respectively formed on the substrate 701 and correspond to the positions of the driving circuits. It is worth noting that after the electronic device 700 is completed and passes the test of step S230 as described in the embodiment of FIG. 2 , the plurality of test pads 741 and 742 can be used as bonding pads to remain on the substrate 701, and a driving circuit can be formed on the plurality of test pads 741 and 742. The driving circuit can be electrically connected to the plurality of electronic components 710 through the plurality of test pads 741 and 742. In other words, the bonding pads formed during the manufacturing process of the electronic device 700 for bonding the driving circuit can first be used to test whether the multiple electronic components 710 are normal or damaged, and then used to bond the substrate 701 when the driving circuit is formed on the substrate 701 to electrically connect to the multiple electronic components 710 through corresponding circuit traces.

FIG8 is a circuit diagram of an electronic component of an embodiment of the present disclosure. Referring to FIG8 , the electronic components of the above-mentioned embodiments can be implemented as an electronic component 810 as shown in FIG8 . In this embodiment, the electronic component 810 includes a variable capacitor 811. The test device 801 can be electrically connected to the anode and cathode of the variable capacitor 811 through the test pad, and a forward bias can be applied to the variable capacitor 811 through the test pad so that the variable capacitor 811 can realize a diode function to emit light (electromagnetic waves) with a specific wavelength (e.g., 0.2 to 1000 micrometers (um)). In this embodiment, the electronic component 810 may also include other circuit traces (not shown) to electrically connect to the drive circuit. In this embodiment, a light detection element can be used to detect whether the variable capacitor 811 of the electronic component 810 emits light with a specific wavelength to determine whether the variable capacitor 811 of the electronic component 810 is normal or damaged. The light with a specific wavelength is emitted from the variable capacitor 811. Alternatively, in one embodiment, an infrared imager can be used to detect whether the circuit wiring and the variable capacitor 811 of the electronic component 810 have normal thermal characteristics (thermal distribution) to determine whether the variable capacitor 811 of the electronic component 810 is normal or damaged (including determining whether the variable capacitor 811 and the circuit wiring are normally electrically connected). The test device 801 may be a device that can provide a test voltage and/or a test current, and the test device 801 may apply a forward bias and/or a reverse bias to the electronic component 810 based on the configuration of the wiring. However, the present disclosure does not limit the configuration of the wiring.

FIG. 9 is a circuit diagram of an electronic component of an embodiment of the present disclosure. Referring to FIG. 9 , two adjacent electronic components of the above-mentioned embodiments can be implemented as electronic components 910_1 and 910_2 as shown in FIG. 9 . In the present embodiment, the electronic component 910_1 may include a variable capacitor 911. The electronic component 910_2 may include a light-emitting diode 912. The circuit trace between the electronic component 910_1 and the electronic component 910_2 may further include a circuit component 950. The variable capacitor 911, the light-emitting diode 912, and the circuit component 950 may be electrically connected in series. The circuit component 950 may be composed of related components such as an inductor, a resistor, a transistor, and/or a capacitor, for example, and the present disclosure is not limited thereto. The test device 901 can be electrically connected to the variable capacitor 911 and the anode and cathode of the light-emitting diode 912 through the test pad, and can apply a forward bias to the variable capacitor 911 and the light-emitting diode 912 through the test pad, so that the variable capacitor 911 can realize a diode function to emit light (electromagnetic wave) with a specific wavelength (e.g., 0.2-1000 micrometers (um)), and the light-emitting diode 912 can emit light with another wavelength (e.g., 350-800 micrometers (um)). Alternatively, the test device 901 can apply a reverse bias to the variable capacitor 911 through the test pad to test the capacitance modulation function of the variable capacitor 911. In this embodiment, the electronic component 910_1 may further include other circuit traces (not shown) to electrically connect to the driving circuit.

In this embodiment, a light detection element can be used to detect whether the variable capacitor 911 of the electronic component 910_1 emits light with a specific wavelength, or to detect whether the light emitting diode 912 of the electronic component 910_2 emits light with another wavelength (if the light with a specific wavelength emitted by the variable capacitor 911 is not easy to detect), so as to determine whether the variable capacitor 911 of the electronic component 910_1 is normal or damaged. Alternatively, in one embodiment, an infrared imager can be used to detect whether the circuit wiring and the variable capacitor 911 of the electronic component 910_1 have normal thermal characteristics (heat distribution) to determine whether the variable capacitor 911 of the electronic component 910_1 is normal or damaged (including determining whether the variable capacitor 911 and the circuit wiring are normally electrically connected). The test device 901 can be a device that can provide a test voltage and/or a test current, and the test device 901 can be based on the configuration of the wiring and the circuit element 950 to achieve the application of forward bias and/or reverse bias to the electronic components 910_1 and 910_2. However, the present disclosure does not limit the specific configuration of the wiring and the circuit element 950.

FIG10 is a circuit diagram of an electronic component of an embodiment of the present disclosure. Referring to FIG10 , the electronic components of the above-mentioned embodiments can be implemented as an electronic component 1010 as shown in FIG10 . In this embodiment, the electronic component 1010 may include a variable capacitor 1011 and a light-emitting diode 1012 electrically connected in series to the variable capacitor 1011, and a circuit component 1050 may be further included on the circuit line between the variable capacitor 1011 and the light-emitting diode 1012. The variable capacitor 1011, the light-emitting diode 1012, and the circuit component 1050 may be electrically connected in series. The test device 1001 can be electrically connected to the variable capacitor 1011 and the anode and cathode of the light-emitting diode 1012 through the test pad, and a forward bias can be applied to the variable capacitor 1011 and the light-emitting diode 1012 through the test pad, so that the variable capacitor 1011 can realize a diode function to emit light (electromagnetic wave) with a specific wavelength (e.g., 0.2-1000 micrometers (um)), and the light-emitting diode 1012 can emit light with another wavelength (e.g., 350-800 micrometers (um)). Alternatively, the test device 1001 can apply a reverse bias to the variable capacitor 1011 through the test pad to test the capacitance modulation function of the variable capacitor 1011. In this embodiment, the electronic component 1010 may further include other circuit traces (not shown) to electrically connect to the driving circuit.

In this embodiment, a photodetection element can be used to detect whether the variable capacitor 1011 of the electronic component 1010 emits light with a specific wavelength, or to detect whether the light-emitting diode 1012 of the electronic component 1010 emits light with another wavelength (if the light with a specific wavelength emitted by the variable capacitor 1011 is not easy to detect), so as to determine whether the variable capacitor 1011 of the electronic component 1010 is normal or damaged. Alternatively, in one embodiment, an infrared imager can be used to detect whether the circuit traces and the variable capacitor 1011 of the electronic component 1010 have normal thermal characteristics (heat distribution) to determine whether the variable capacitor 1011 of the electronic component 1010 is normal or damaged (including determining whether the variable capacitor 1011 and the circuit traces are electrically connected normally). The test device 1001 can be a device that can provide a test voltage and/or a test current, and the test device 1001 can be based on the configuration results of the traces and the circuit component 1050 to achieve the application of a forward bias and/or a reverse bias to the electronic component 1010, but the present disclosure does not limit the specific configuration of the traces and the circuit component 1050.

FIG. 11 is a circuit diagram of an electronic component of an embodiment of the present disclosure. Referring to FIG. 11 , two adjacent electronic components of the above-mentioned embodiments can be implemented as electronic components 1110_1 and 1110_2 as shown in FIG. 11 . In this embodiment, the electronic component 1110_1 can include a variable capacitor 1111. The electronic component 1110_2 can include a light-emitting diode 1112. The circuit trace between the electronic component 1110_1 and the electronic component 1110_2 can also include a circuit component 1150. The variable capacitor 1111, the light-emitting diode 1112, and the circuit component 1150 can be electrically connected in parallel. The test device 1101 can be electrically connected to the variable capacitor 1111 and the anode and cathode of the light-emitting diode 1112 through the test pad, and can apply a forward bias to the variable capacitor 1111 and the light-emitting diode 1112 through the test pad, so that the variable capacitor 1111 can realize a diode function to emit light (electromagnetic wave) with a specific wavelength (e.g., 0.2-1000 micrometers (um)), and can make the light-emitting diode 1112 emit light with another wavelength (e.g., 350-800 micrometers (um)). Alternatively, the test device 1101 can apply a reverse bias to the variable capacitor 1111 through the test pad to test the capacitance modulation function of the variable capacitor 1111. In this embodiment, the electronic component 1110_1 may further include other circuit traces (not shown) to electrically connect to the driving circuit.

In this embodiment, a photodetection element can be used to detect whether the variable capacitor 1111 of the electronic component 1110_1 emits light with a specific wavelength, or to detect whether the light-emitting diode 1112 of the electronic component 1110_2 emits light with another wavelength (if the light with a specific wavelength emitted by the variable capacitor 1111 is not easy to detect), so as to determine whether the variable capacitor 1111 of the electronic component 1110_1 is normal or damaged. Alternatively, in one embodiment, an infrared imager can be used to detect whether the circuit trace and the variable capacitor 1111 of the electronic component 1110_1 have normal thermal characteristics (heat distribution) to determine whether the variable capacitor 1111 of the electronic component 1110_1 is normal or damaged (including determining whether the variable capacitor 1111 and the circuit trace are electrically connected normally). The test device 1101 can be a device that can provide a test voltage and/or a test current, and the test device 1101 can be based on the configuration results of the trace and the circuit component 1150 to achieve the application of a forward bias and/or a reverse bias to the electronic components 1110_1 and 1110_2, but the present disclosure does not limit the specific configuration of the trace and the circuit component 1150.

FIG12 is a circuit diagram of an electronic component of an embodiment of the present disclosure. Referring to FIG12 , the electronic components of the above-mentioned embodiments can be implemented as an electronic component 1210 as shown in FIG12 . In this embodiment, the electronic component 1210 may include a variable capacitor 1211 and a light-emitting diode 1212, and a circuit component 1250 may be further included on the circuit line between the variable capacitor 1211 and the light-emitting diode 1212. The variable capacitor 1211, the light-emitting diode 1212, and the circuit component 1250 may be electrically connected in parallel. The test device 1201 can be electrically connected to the variable capacitor 1211 and the anode and cathode of the light-emitting diode 1212 through the test pad, and a forward bias can be applied to the variable capacitor 1211 and the light-emitting diode 1212 through the test pad, so that the variable capacitor 1211 can realize a diode function to emit light (electromagnetic wave) with a specific wavelength (e.g., 0.2-1000 micrometers (um)), and the light-emitting diode 1212 can emit light with another wavelength (e.g., 350-800 micrometers (um)). Alternatively, the test device 1201 can apply a reverse bias to the variable capacitor 1211 through the test pad to test the capacitance modulation function of the variable capacitor 1211. In this embodiment, the electronic component 1210 may further include other circuit traces (not shown) to electrically connect to the driving circuit.

In this embodiment, a photodetection element can be used to detect whether the variable capacitor 1211 of the electronic component 1210 emits light with a specific wavelength, or to detect whether the light-emitting diode 1212 of the electronic component 1210 emits light with another wavelength (if the light with a specific wavelength emitted by the variable capacitor 1211 is not easy to detect), so as to determine whether the variable capacitor 1211 of the electronic component 1210 is normal or damaged. Alternatively, in one embodiment, an infrared imager can be used to detect whether the circuit traces and the variable capacitor 1211 of the electronic component 1210 have normal thermal characteristics (heat distribution) to determine whether the variable capacitor 1211 of the electronic component 1210 is normal or damaged (including determining whether the variable capacitor 1211 and the circuit traces are electrically connected normally). The test device 1201 can be a device that can provide a test voltage and/or a test current, and the test device 1201 can be based on the configuration results of the traces and the circuit component 1250 to achieve the application of a forward bias and/or a reverse bias to the electronic component 1210, but the present disclosure does not limit the specific configuration of the traces and the circuit component 1250.

FIG. 13 is a flow chart of a method for manufacturing an electronic device of another embodiment of the present disclosure. The electronic devices of some of the above-mentioned embodiments can be manufactured by performing the following steps S1301 to S1309. Referring to FIG. 1 and FIG. 13, the electronic device 100 of FIG. 1 is taken as an example. In step S1301, a circuit is formed on a substrate 101. A plurality of circuit traces (metal traces) and the plurality of test pads 140 can be first formed on the substrate 101. In step S1302, an open circuit/short circuit test is performed on the circuit to determine whether the plurality of circuit traces and the plurality of test pads 140 are normally connected. In step S1303, the plurality of electronic components 110 are formed on the substrate 101. The plurality of electronic components 110 are electrically connected to the plurality of test pads 140 through the plurality of circuit traces. In step S1304, a bias is applied through the plurality of test pads 140 to test the plurality of electronic components 110, and determine whether these electronic components 110 pass the test. In this regard, the test details of step S1304 can refer to the relevant test description of applying a forward bias in step S230 of the embodiment of FIG. 2 above, and therefore will not be elaborated on. If at least one of the plurality of electronic components 110 fails the test, step S1305 is executed. In step S1305, the manufacturing personnel or manufacturing equipment can repair the damaged electronic components. If all of the plurality of electronic components 110 pass the test, step S1306 is performed. In step S1306, the driving circuits 120 and 130 are formed on the substrate 101. The driving circuits 120 and 130 are electrically connected to the plurality of electronic components 110 through the plurality of circuit traces.

In step S1307, bias can be applied again through the plurality of test pads 140 to test the plurality of electronic components 110 again and determine whether the electronic components 110 pass the test. In this regard, the test details of step S1304 can refer to the relevant test description of applying forward bias in step S230 of the embodiment of FIG. 2 above, and reverse bias can also be applied to test the capacitance modulation function, so it is not repeated. If at least one of the plurality of electronic components 110 fails the test, step S1308 is executed. In step S1308, the manufacturing personnel or manufacturing equipment can repair the damaged electronic components. If all of the plurality of electronic components 110 pass the test, step S1309 is executed. In step S1309, the electronic device 100 is packaged/transported. Therefore, the manufacturing method of this embodiment can automatically determine whether the electronic component 110 in the electronic device 100 is damaged during the manufacturing process, so that the electronic component determined to be damaged can be repaired during the manufacturing process, thereby effectively improving the manufacturing yield of the electronic device 100.

In some embodiments of the present disclosure, the electronic device can be observed to have a test pad and a light-emitting diode through an image sensing device (such as an optical microscope (OM) or a scanning electron microscope (SEM)), or the variable capacitor can be observed to have a structure with a light-emitting diode.

In summary, the manufacturing method of the electronic device disclosed herein can accurately and conveniently determine whether the variable capacitor is normal or damaged by applying a forward bias to the electronic component and detecting whether the variable capacitor and/or the LED of the electronic component emits light, or detecting whether the electronic component and the wiring have a normal heat distribution. In addition, the manufacturing method of the electronic device disclosed herein can also apply a reverse bias to the variable capacitor of the electronic component to test whether the capacitance modulation function of the variable capacitor is normal.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present disclosure.

100, 300, 400, 500, 600, 700: electronic device 101, 301, 401, 501, 601, 701: substrate 102: active area 103: peripheral area 110, 310, 410, 510, 610, 710, 810, 910_1, 910_2, 1010, 1110_1, 1110_2, 1210: electronic components 120, 130, 320, 330, 420, 430, 520, 530, 620, 630: drive circuit 140, 341, 342, 441, 442, 541, 542, 641, 642, 741, 742: test pad 801, 901, 1001, 1101, 1201: test equipment 811, 911, 1011, 1111, 1211: variable capacitor 912, 1012, 1112, 1212: light-emitting diode 950, 1050, 1150, 1250: circuit components S210~S240, S1301~S1309: steps

FIG. 1 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. FIG. 2 is a flow chart of a method for manufacturing an electronic device of an embodiment of the present disclosure. FIG. 3 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. FIG. 4 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. FIG. 5 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. FIG. 6 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. FIG. 7 is a schematic diagram of the structure of an electronic device of an embodiment of the present disclosure. FIG. 8 is a schematic diagram of the circuit of an electronic component of an embodiment of the present disclosure. FIG. 9 is a schematic diagram of the circuit of an electronic component of an embodiment of the present disclosure. FIG. 10 is a schematic diagram of the circuit of an electronic component of an embodiment of the present disclosure. FIG. 11 is a schematic circuit diagram of an electronic component of an embodiment of the present disclosure. FIG. 12 is a schematic circuit diagram of an electronic component of an embodiment of the present disclosure. FIG. 13 is a flow chart of a method for manufacturing an electronic device of another embodiment of the present disclosure.

S210~S240: Steps

Claims (10)

A method for manufacturing an electronic device, comprising: Providing at least one electronic component electrically connected to a test device; Applying a forward bias to the at least one electronic component through the test device to determine whether the at least one electronic component is normal or damaged according to the light emitted by the at least one electronic component or the thermal characteristics of the at least one electronic component; and Transporting the at least one electronic component determined to be normal to the next production site, wherein the at least one electronic component is driven by a reverse bias to perform the capacitance modulation function of the at least one electronic component. A method for manufacturing an electronic device as described in claim 1, wherein the at least one electronic component includes a variable capacitor and a light-emitting diode, and the variable capacitor is electrically connected to the light-emitting diode. The manufacturing method of the electronic device as described in claim 1 further includes: Detecting the light emitted by the at least one electronic component through a detection element to determine whether the at least one electronic component has a specific wavelength. The manufacturing method of the electronic device as described in claim 1 further comprises: Detecting the thermal characteristics of the at least one electronic component through an infrared imaging device to determine whether the electrical connection between the at least one electronic component and a circuit trace is normal. The method for manufacturing an electronic device as described in claim 1 further comprises: Providing a test pad electrically connected to the at least one electronic component and the test device; and Applying the forward bias to the test pad so that the at least one electronic component emits light according to the forward bias. The manufacturing method of the electronic device as described in claim 5 further comprises: Applying another reverse bias to the test pad to test the capacitance modulation function of the at least one electronic component. The manufacturing method of the electronic device as described in claim 5 further comprises: Disposing the at least one electronic component on a substrate; and Disposing a driving circuit and the test pad on the substrate, wherein the driving circuit is electrically connected to the test pad and is used to drive the at least one electronic component. The manufacturing method of the electronic device as described in claim 7 further comprises: After completing the test of whether the at least one electronic component is normal or damaged, retaining or removing the test pad on the substrate. The manufacturing method of the electronic device as described in claim 1 further comprises: Providing at least one electronic component to be electrically connected to another electronic component to be electrically connected to the at least one electronic component; Detecting the light emitted by the other electronic component through a detection component to determine whether the at least one electronic component is normal or damaged. A method for manufacturing an electronic device, comprising: Providing at least one electronic component electrically connected to a test device; Applying a reverse bias to the at least one electronic component through the test device to determine whether the at least one electronic component is normal or damaged according to the capacitance modulation function of the at least one electronic component; and Transporting the at least one electronic component determined to be normal to the next production site, wherein the at least one electronic component is mainly driven by another reverse bias in an operating mode to perform the capacitance modulation function of the at least one electronic component.

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